CN114289858A

CN114289858A - Debugging and monitoring method, device, equipment and computer readable storage medium

Info

Publication number: CN114289858A
Application number: CN202111367930.7A
Authority: CN
Inventors: 黎延垠; 温正新; 吴迪
Original assignee: Shenzhenshi Yuzhan Precision Technology Co Ltd
Current assignee: Shenzhenshi Yuzhan Precision Technology Co Ltd
Priority date: 2021-11-18
Filing date: 2021-11-18
Publication date: 2022-04-08
Anticipated expiration: 2041-11-18
Also published as: CN114289858B

Abstract

The application provides a debugging and monitoring method for a laser system. The debugging and monitoring method comprises the following steps: performing a first debugging to complete the debugging of the camera component; executing second debugging to enable the galvanometer component to complete debugging; performing third debugging to enable the focal length of the laser source to finish debugging; controlling a laser source to perform a first process; acquiring a first laser parameter of first processing; and judging whether the first laser parameter exceeds a laser threshold value or not so as to realize the monitoring of the laser system. By the debugging and monitoring method, the laser system can be monitored in real time, defective products formed by machining of the laser system can be found in time, the production yield of machining of the laser system can be improved, and the production cost can be reduced. The application also provides a debugging and monitoring device, equipment and a computer readable storage medium for the laser system.

Description

Debugging and monitoring method, device, equipment and computer readable storage medium

Technical Field

The present application relates to the field of laser processing technologies, and in particular, to a method, an apparatus, a device, and a computer-readable storage medium for debugging and monitoring a laser system.

Background

Laser processing belongs to non-contact processing, has the advantages of high efficiency, high precision, high stability, low loss and the like, and is widely applied to the processing fields of cutting, welding, marking, drilling and the like. Before the laser system is used, the focal lengths of a camera assembly, a galvanometer assembly and a laser source in the laser system need to be adjusted. The debugging mode adopted at present is to manually complete the debugging of the mirror-vibrating assembly, then debug the camera assembly by taking the debugging result of the mirror-vibrating assembly as a reference, and then debug the focal length of the laser source.

However, the debugging precision of the camera component is affected by the debugging precision of the galvanometer component, and in the debugging process of the galvanometer component, the time required by manual measurement by adopting a ruler is long, the precision is low, and deviation exists, so that the debugging errors of the galvanometer component and the camera component are large; in addition, once the focal points of the camera component, the galvanometer component and the laser source are debugged, the laser system is processed, light spots formed by the laser source have no monitoring measures and cannot be adjusted in real time, and when an operator finds defective products, the laser system processes more defective products, so that the production yield is reduced, and the production cost is increased.

Disclosure of Invention

In view of the foregoing, there is a need for a method, an apparatus, a device and a computer readable storage medium for debugging and monitoring a laser system, so as to implement debugging and real-time monitoring of the laser system, improve the yield of production and reduce the production cost.

A first aspect of the present application provides a debugging and monitoring method for a laser system, the laser system including a laser source, a camera assembly, a galvanometer assembly, a processing platform, and a focal length adjustment assembly for adjusting a focal length of the laser source, the debugging and monitoring method including: performing a first debugging to complete the debugging of the camera component; ending the executing of the first debug; after the execution of the first debugging is finished, executing second debugging so as to finish the debugging of the galvanometer component; ending the executing of the second debugging; after the execution of the second debugging is finished, executing third debugging so as to finish the debugging of the focal length of the laser source; the performing a third debug comprising: sending a first adjusting parameter to the focal length adjusting component; controlling the laser source to cooperate with the movement of the focal length adjusting assembly to form a plurality of first debugging patterns on a test medium, wherein the plurality of first debugging patterns are distributed at different test positions of the test medium; judging that a first characteristic of the first debugging pattern accords with a preset focal length threshold; determining a second adjustment parameter based on the first characteristic meeting the preset focal length threshold; sending the second adjustment parameter to the focal length adjustment component; controlling the laser source to cooperate with the movement of the focal length adjustment assembly to form a plurality of second debugging patterns on the test medium, wherein the plurality of second debugging patterns are distributed at different test positions of the test medium; judging that a second feature of the second debugging pattern accords with the preset focal length threshold; determining a focal length of the laser source based on the second characteristic meeting the preset focal length threshold; ending the executing of the third debugging; after the third debugging is finished, controlling the laser source to execute first processing; acquiring a first laser parameter of the first processing; and judging whether the first laser parameter exceeds a laser threshold value or not so as to realize the monitoring of the laser system.

In this way, the debugging and monitoring method for the laser system is to complete the debugging of the coordinates of the camera component by first performing the first debugging; then executing second debugging to enable the coordinates of the galvanometer component to complete debugging; then, executing third debugging to enable the focal length of the laser source to finish debugging; by executing the first debugging and the second debugging in sequence, the vibrating mirror assembly is prevented from generating deviation in the debugging process to influence the debugging precision of the camera assembly, and the debugging precision of the camera assembly is improved; the method comprises the steps of judging whether a first laser parameter exceeds a laser threshold value or not by obtaining the first laser parameter of a laser source for executing first processing so as to realize monitoring of a laser system. By the debugging and monitoring method, the laser system can be monitored in real time, defective products formed by machining of the laser system can be found in time, the production yield of machining of the laser system can be improved, and the production cost can be reduced.

A second aspect of the present application provides a debugging and monitoring device for a laser system, the laser system includes a laser source, a camera assembly, a galvanometer assembly, a processing platform and a focal length adjusting assembly for adjusting a focal length of the laser source, the debugging and monitoring device includes: the first debugging module is used for executing first debugging so as to enable the camera assembly to finish debugging; the second debugging module is used for executing second debugging so as to enable the galvanometer component to complete debugging; the third debugging module is used for executing third debugging so as to enable the focal length of the laser source to finish debugging; a processing module for controlling the laser source to perform a first process; the first acquisition module is used for acquiring first laser parameters of the first processing; and the first judging module is used for judging whether the first laser parameter exceeds a laser threshold value so as to realize the monitoring of the laser system.

Thus, the debugging and monitoring device for the laser system executes the first debugging through the first debugging module so as to debug the coordinates of the camera component; then, executing second debugging through a second debugging module so as to complete the debugging of the coordinates of the galvanometer component; then, third debugging is executed through a third debugging module so that the focal length of the laser source is debugged; by executing the first debugging and the second debugging in sequence, the vibrating mirror assembly is prevented from generating deviation in the debugging process to influence the debugging precision of the camera assembly, and the debugging precision of the camera assembly is improved; the first laser parameter of the laser source for executing the first processing is obtained through the first obtaining module and the first judging module, and whether the first laser parameter exceeds a laser threshold value is judged so as to realize the monitoring of the laser system. Through the debugging and monitoring device, the laser system can be monitored in real time, defective products formed by machining of the laser system can be found in time, the production yield of machining of the laser system can be improved, and the production cost is reduced.

A third aspect of the present application provides a commissioning and monitoring device for a laser system comprising: a processor, a memory and a debugging and monitoring program for the laser system stored on the memory and executable on the processor, the debugging and monitoring program being configured to implement the steps of the debugging and monitoring method as described above.

In this way, the debugging and monitoring device for the laser system can debug and monitor the laser system by executing the debugging and monitoring method for the laser system as described above. Debugging the coordinates of the camera component by first executing a first debugging; then executing second debugging to enable the coordinates of the galvanometer component to complete debugging; then, executing third debugging to enable the focal length of the laser source to finish debugging; by executing the first debugging and the second debugging in sequence, the vibrating mirror assembly is prevented from generating deviation in the debugging process to influence the debugging precision of the camera assembly, and the debugging precision of the camera assembly is improved; the method comprises the steps of judging whether a first laser parameter exceeds a laser threshold value or not by obtaining the first laser parameter of a laser source for executing first processing so as to realize monitoring of a laser system. By the debugging and monitoring method, the laser system can be monitored in real time, defective products formed by machining of the laser system can be found in time, the production yield of machining of the laser system can be improved, and the production cost can be reduced.

A fourth aspect of the present application provides a computer-readable storage medium having stored thereon a debugging and monitoring program for a laser system, which when executed by a processor implements the debugging and monitoring method as described above.

Thus, the computer-readable storage medium can debug and monitor the laser system by performing the debugging and monitoring method for the laser system as described above. Debugging the coordinates of the camera component by first executing a first debugging; then executing second debugging to enable the coordinates of the galvanometer component to complete debugging; then, executing third debugging to enable the focal length of the laser source to finish debugging; by executing the first debugging and the second debugging in sequence, the vibrating mirror assembly is prevented from generating deviation in the debugging process to influence the debugging precision of the camera assembly, and the debugging precision of the camera assembly is improved; the method comprises the steps of judging whether a first laser parameter exceeds a laser threshold value or not by obtaining the first laser parameter of a laser source for executing first processing so as to realize monitoring of a laser system. By the debugging and monitoring method, the laser system can be monitored in real time, defective products formed by machining of the laser system can be found in time, the production yield of machining of the laser system can be improved, and the production cost can be reduced.

Drawings

FIG. 1 is a flow diagram of a debugging and monitoring method of some embodiments of the present application.

Fig. 2 is a schematic method flow diagram of some embodiments of S600 shown in fig. 1.

Fig. 3 is a flowchart illustrating a method of some embodiments of S600 shown in fig. 1.

Fig. 4 is a flowchart illustrating a method of some embodiments of S600 shown in fig. 1.

Fig. 5 is a schematic method flow diagram of some embodiments of S10 shown in fig. 1.

Fig. 6 is a method flow diagram of some embodiments of S22 shown in fig. 5.

Fig. 7 is a schematic flow chart of a method of some embodiments of S100 shown in fig. 1.

Fig. 8 is a schematic method flow diagram of some embodiments of S200 shown in fig. 1.

Fig. 9 is a schematic flow chart of a method of some embodiments of S300 shown in fig. 1.

Fig. 10 is a schematic method flow diagram of some embodiments of S40 shown in fig. 1.

FIG. 11 is a hardware architecture diagram of a debugging and monitoring device of some embodiments of the present application.

FIG. 12 is a functional block diagram of a debug and monitor device according to some embodiments of the present application.

FIG. 13 is a functional block diagram of some embodiments of the first debug module shown in FIG. 12.

FIG. 14 is a functional block diagram of some embodiments of the second debug module shown in FIG. 12.

FIG. 15 is a functional block diagram of some embodiments of the third debug module shown in FIG. 12.

Fig. 16 is a functional block diagram of some embodiments of the laser parameter selection module of fig. 12.

FIG. 17 is a functional block diagram of some embodiments of the fourth debug module shown in FIG. 12.

Description of the main elements

Commissioning and monitoring device 700

Communication interface 702

Processor 704

Memory 706

Communication bus 708

Debug and monitor program 710

Debugging and monitoring device 800

First debug module 802

First sending module 8021

First forming module 8022

Grabbing module 8023

First computing module 8024

First verification module 8025

First end module 8026

Second debug module 804

Second forming module 8041

Second computing module 8042

Second judging module 8043

Second verification module 8044

Second end module 8045

First compensation module 8046

Third debug Module 806

Second transmission module 8061

Third forming module 8062

Third judging module 8063

First determination module 8064

Third end module 8065

Processing module 808

First obtaining module 810

First judgment module 812

First execution module 814

Laser parameter selection module 816

Second obtaining module 8161

Analysis module 8162

Fourth judging module 8163

Second execution module 8164

Adjusting module 8165

Fourth debug module 818

Third obtaining module 8181

Second determination module 8182

Capture module 8183

Second compensation module 8184

Detailed Description

For a clearer understanding of the objects, features and advantages of the present application, reference is made to the following detailed description of the present application along with the accompanying drawings and specific examples. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application and are not intended to be a complete embodiment.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Some embodiments of the present application provide a commissioning and monitoring method for a laser system comprising a laser source, a camera assembly, a galvanometer assembly, a machining platform, and a focal length adjustment assembly for adjusting a focal length of the laser source, the commissioning and monitoring method comprising: executing a first debugging to enable the camera assembly to complete the debugging; ending the executing of the first debugging; after the execution of the first debugging is finished, executing second debugging so as to finish the debugging of the galvanometer component; ending the executing of the second debugging; after the execution of the second debugging is finished, executing third debugging so as to finish the debugging of the focal length of the laser source; the performing a third debug includes: sending a first adjusting parameter to the focal length adjusting component; controlling the laser source to cooperate with the movement of the focal length adjusting assembly to form a plurality of first debugging patterns on a test medium, wherein the plurality of first debugging patterns are distributed at different test positions of the test medium; judging that a first characteristic of the first debugging pattern accords with a preset focal length threshold; determining a second adjustment parameter based on the first characteristic meeting the preset focal length threshold; sending the second adjustment parameter to the focus adjustment component; controlling the laser source to cooperate with the movement of the focal length adjusting assembly to form a plurality of second debugging patterns on the test medium, wherein the plurality of second debugging patterns are distributed at different test positions of the test medium; judging that a second feature of the second debugging pattern conforms to the preset focal length threshold; determining a focal length of the laser source based on the second characteristic meeting the preset focal length threshold; ending the executing of the third debugging; after the execution of the third debugging is finished, controlling the laser source to execute first processing; acquiring a first laser parameter of the first processing; and judging whether the first laser parameter exceeds a laser threshold value or not so as to realize the monitoring of the laser system.

Some embodiments of the present application provide a debugging and monitoring apparatus for a laser system simultaneously, the laser system including a laser source, a camera assembly, a galvanometer assembly, a processing platform and a focal length adjusting assembly for adjusting a focal length of the laser source, the debugging and monitoring apparatus including: the first debugging module is used for executing first debugging so as to enable the camera component to finish debugging; the second debugging module is used for executing second debugging so as to enable the galvanometer component to complete debugging; the third debugging module is used for executing third debugging so as to enable the focal length of the laser source to finish debugging; a processing module for controlling the laser source to perform a first process; the first acquisition module is used for acquiring first laser parameters of the first processing; and the first judging module is used for judging whether the first laser parameter exceeds a laser threshold value so as to realize the monitoring of the laser system.

Some embodiments of the present application also provide a commissioning and monitoring device for a laser system, comprising: a processor, a memory and a debugging and monitoring program for the laser system stored on the memory and executable on the processor, the debugging and monitoring program being configured to implement the steps of the debugging and monitoring method as described above.

Some embodiments of the present application also provide a computer-readable storage medium having stored thereon a commissioning and monitoring program for a laser system, which when executed by a processor implements the commissioning and monitoring method as described above.

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings.

In the related art, a laser system includes a laser source, a camera assembly, a galvanometer assembly, a processing platform, and a focal length adjustment assembly for adjusting a focal length of the laser source. The laser source is used for emitting laser to process the workpiece to be processed by laser such as welding, marking and the like. The camera assembly is used for obtaining processing parameters, positioning processing position information of the workpiece according to the processing parameters and sending the processing position information of the workpiece to the laser control system, and the laser control system controls the galvanometer assembly to change a light path of laser so that the focus of the laser performs laser processing on the workpiece to be processed at the processing position of the workpiece to be processed. In some processing, the galvanometer component controls the laser focus to move in a small amplitude, and when a workpiece to be processed needs to move in a large range, the laser control system controls the processing platform to move according to processing position information fed back by the camera component so as to realize laser processing of the large-size workpiece. The focal length adjusting assembly is used for adjusting the focal length of the laser source, and exemplarily comprises a voice coil motor, and the focal length of the laser source is adjusted by adjusting the relative position of each lens sheet through which the laser passes, so that the laser emitted by the laser source is focused, and the laser processing is performed on the workpiece to be processed by concentrated energy.

The debugging and monitoring method is used for debugging the focal lengths of the camera assembly, the galvanometer assembly and the laser source in the laser system and monitoring the laser system in real time. For a laser system which needs to be debugged and monitored, the debugging and monitoring functions provided by the debugging and monitoring method of the application can be directly integrated on the laser system, or a client used for realizing the debugging and monitoring method of the application is installed. For another example, the debugging and monitoring method provided by the present application may also be run on the laser system in the form of a Software Development Kit (SDK), an interface for debugging and monitoring functions is provided in the form of an SDK, and a processor or other devices may implement the debugging and monitoring functions through the provided interface.

Referring to fig. 1, some embodiments of the present application provide a method for debugging and monitoring a laser system. The debugging and monitoring method comprises the following steps.

S100, executing first debugging.

Specifically, the first debugging is executed, so that the camera assembly is debugged before the galvanometer assembly, and the problem that the galvanometer assembly generates errors in the debugging process to influence the debugging precision of the camera assembly when the galvanometer assembly is debugged before the camera assembly is debugged is avoided.

After step S100 is performed, the following step S200 is performed.

And S200, executing second debugging.

Specifically, in the case where the camera module has already been debugged, the debugging and monitoring method makes the galvanometer module complete the debugging by performing the second debugging.

After step S200 is performed, the following step S300 is performed.

And S300, executing third debugging.

Specifically, in the case where the camera assembly and the galvanometer assembly have already been debugged, the debugging is completed by performing the third debugging so that the focal length of the laser light source is adjusted.

After executing step S300, the debugging and monitoring method executes the following steps S400 to S600.

And S400, controlling the laser source to execute first processing.

Specifically, after the debugging and monitoring method executes the steps S100 to S300, the focal lengths of the camera assembly, the galvanometer assembly and the laser source of the laser system are debugged, and the laser system meets the processing condition. The first process may be a laser process such as welding, marking, etc. In the present application, marking is taken as an example, and the first process may also be understood as marking on a workpiece to form a pattern.

S500, acquiring first laser parameters of first processing.

Specifically, a first laser parameter of a pattern formed by the first processing is acquired. The first laser parameter comprises a first laser spot position, a first laser focal length position and a first power value. The first laser spot position and the first laser focal length position can be acquired by a camera assembly, and the first power value can be acquired by a power device and other assemblies in the laser system.

S600, judging whether the first laser parameter exceeds a laser threshold value or not so as to realize monitoring of the laser system.

Specifically, the first laser parameter is compared with a laser threshold value to judge whether the first laser parameter exceeds the laser threshold value, so that the debugged laser system is monitored.

Thus, through the steps S100-S600, the focal lengths of the camera assembly, the galvanometer assembly and the laser source are debugged in sequence, so that debugging errors caused by debugging the galvanometer assembly first and then the camera assembly are avoided; whether the first laser parameter exceeds the laser threshold value or not is judged, so that the monitoring of the laser system is realized, the automation of debugging and monitoring of the laser system is realized, defective products formed by machining of the laser system can be found in time, the improvement of the production yield of the machining of the laser system is facilitated, and the production cost is reduced.

In some embodiments, in order to ensure that the laser processed pattern has better quality when the focal lengths of the camera assembly, the galvanometer assembly and the laser source are adjusted, and improve the adjustment precision of the laser system, the adjusting and monitoring method may further perform step S10 before performing step S100.

And S10, laser parameter selection is executed.

In particular, by performing the step of selecting laser parameters to select the laser parameters of the laser source, the pattern processed by the laser is guaranteed to have better quality. Wherein the laser parameters include at least one of marking speed, marking power, and filling pitch.

It is understood that the laser system may also verify the laser light emitted by the laser source before starting to select the laser parameters of the laser source. If the verified result is qualified, the step S10 may be optionally not executed. As such, step S10 may be omitted. If the verified result is not qualified, step S10 can be optionally performed to ensure that the pattern processed by the laser has good quality and to ensure the debugging accuracy of the focal lengths of the camera assembly, the galvanometer assembly and the laser source.

In some embodiments, after the step S300 is executed, the step S40 may be executed first, and then the steps S400 to S600 are executed, so as to ensure the debugging accuracy of the laser system.

S40, a fourth debug is performed.

Specifically, the fourth debugging is performed, so that the exposure parameters of the camera assembly are debugged, the camera assembly can better capture the characteristics of the pattern formed by the laser, and the debugging precision of the focal length of the laser source of the laser system is favorably ensured.

It is understood that in other embodiments, step S40 may also be performed after step S10, step S100, or step S200 to ensure the debugging accuracy of the laser system. Before the laser system starts to perform the fourth debugging, the exposure parameters of the camera component can be verified. If the verified result is qualified, the step S40 may be optionally not executed. As such, step S40 may be omitted. If the verified result is not qualified, step S40 can be optionally performed to ensure the debugging accuracy of the laser system.

Referring to fig. 2, in some embodiments, the step S600 may specifically include the following steps S602 to S606.

S602, judging whether the first laser spot position exceeds a spot position threshold value.

Specifically, the laser spot position may reflect whether the galvanometer component of the laser system is offset. If judge that first laser facula position surpasss when facula position threshold value, it takes place to squint to show laser system's mirror assembly that shakes, then need debug the mirror assembly that shakes again, and shake the mirror assembly and debug the back again, the focus of laser source also can follow and change, still need debug the focus of laser source again promptly. If the determination result in the step S602 is yes, step S200 is executed to execute a second debugging, so that the galvanometer component completes a new debugging; and step S300 is executed to execute a third commissioning so that the focal length of the laser source completes the new commissioning. If the determination result in step S602 is negative, it indicates that the mirror assembly of the laser system is not shifted, and the laser system does not need to be debugged repeatedly. That is, if the determination result in step S602 is "no", step S400 is executed to control the laser light source to execute the first processing.

S604: and judging whether the first laser focal length position exceeds a focal length position threshold value.

Specifically, the laser focal length position may reflect whether the focal length of the laser source of the laser system is shifted. If the first laser focal length position is judged to exceed the focal length position threshold value, which indicates that the focal length of the laser source of the laser system deviates, the focal length of the laser source needs to be debugged again. That is, if the determination result in step S604 is yes, step S300 is executed to execute a third adjustment so that the focal length of the laser source is adjusted to a new adjustment. If the determination result in step S604 is negative, it indicates that the focal length of the laser source of the laser system has not shifted, and it is not necessary to repeatedly adjust the focal length of the laser source of the laser system. That is, if the determination result in step S604 is no, step S400 is executed to control the laser light source to execute the first processing.

It is understood that step S602 and step S604 may be performed separately or simultaneously. When the steps S602 and S604 are performed simultaneously, if the determination results of the steps S602 and S604 are both yes, the step S602 is performed with higher priority than the step S604, so that the steps S200 and S300 are performed to re-adjust the focal lengths of the laser source and the galvanometer assembly of the laser system, wherein the step S602 is performed with the yes determination result. If the determination result in step S602 is yes and the determination result in step S604 is no, step S200 and step S300 are executed. If the determination result in step S602 is no and the determination result in step S604 is yes, step S300 is executed. If the determination results in step S602 and step S604 are both negative, step S400 is executed.

S606: it is determined whether the first power value exceeds a power threshold.

In particular, the power value may reflect whether the power of the laser source of the laser system is too large or too small, which may affect the processing of the laser system. And if the first power value exceeds the power threshold value, the power of the laser source is over-high or under-high, and an operator is required to check the laser system. If the determination result in step S606 is yes, step S608 is executed to execute an early warning command. The early warning instruction can be an acousto-optic instruction, an image instruction and the like for reminding an operator, can also be an instruction for stopping and the like, and can be specifically set according to the actual condition. If the judgment result of the step S606 is NO, the step S400 is executed.

Thus, through the steps S602 to S608, the real-time monitoring of the laser system is realized, and the laser system can be debugged in real time according to the real-time monitoring result, so that the production yield of the laser system processing is improved, and the production cost is reduced.

It is understood that, after the step S500 is executed, the debugging and monitoring method may execute any one of the steps S602 to S606, and specifically, the first laser spot position, the first laser focal length position and the first power value may correspond to each other according to the first laser parameter. Step S602 to step S606 may be performed simultaneously or sequentially.

It should be noted that fig. 2 further includes step S500, and step S600 does not include step S500 only for convenience of describing some embodiments of step S600.

Referring to fig. 3, in some embodiments, after the debugging and monitoring method re-debugs the laser system through steps S602 to S608, step S600 may further include steps S610 to S616.

And S610, controlling the laser source to execute second processing.

Specifically, through any one of steps S602 to S608, after the focal lengths of the laser source and the galvanometer assembly of the laser system are debugged again, the laser source is controlled again to perform the second processing. It can also be understood that after the galvanometer component of the laser system and the focal length of the laser source are debugged again, the laser processing of the laser system is continuously monitored.

And S612, acquiring second laser parameters of second processing.

Specifically, the second laser parameters of the pattern formed by the new second processing are acquired by a camera assembly or the like of the laser system. The second laser parameter comprises a second laser spot position, a second laser focal length position and a second power value. It should be noted that the second laser parameters should be the same as the first laser parameters.

And S614, judging whether the position of the second laser spot exceeds a spot position threshold value.

Specifically, it is substantially similar to step S602. If the judgment result of step S614 is YES, step S200 and step S300 are executed. If the judgment result of the step S614 is NO, the step S610 is executed.

S616, judging whether the second laser focal length position exceeds the focal length position threshold value.

Specifically, it is substantially similar to step S604. If the judgment result of the step S616 is YES, the step S300 is executed. If the judgment result of the step S616 is no, step S610 is performed.

It is understood that step S614 and step S616 may be performed separately or simultaneously.

S618, it is determined whether the second power value exceeds the power threshold.

Specifically, it is substantially similar to step S618. If the judgment result of the step S618 is yes, step S608 is executed. If the judgment result of the step S618 is no, step S610 is executed.

Thus, through steps S610 to S618, the verification and real-time monitoring of the laser system are realized, and the laser system can be debugged again in real time according to the real-time monitoring result, so that the production yield of the laser system processing is improved, and the production cost is reduced.

Referring to fig. 4, in some embodiments, after the debugging and monitoring method re-debugs the laser system through steps S610 to S618, step S600 may further include steps S620 to S628.

And S620, controlling the laser source to execute third processing.

Specifically, in any of steps S610 to S618, after the focal lengths of the laser source and the galvanometer assembly of the laser system are readjusted, the laser source is controlled again to perform the third processing. It can also be understood that after the third adjustment of the focal length of the laser source and the galvanometer component of the laser system, the laser processing of the laser system is continuously monitored.

S622, a third laser parameter of the third process is obtained.

Specifically, the third laser parameters of the pattern formed by the new third processing are acquired by a camera assembly or the like of the laser system. The third laser parameter comprises a third laser spot position, a third laser focal length position and a third power value. It should be noted that the third laser parameter should be the same as the second laser parameter and the first laser parameter.

And S624, judging whether the third laser spot position exceeds the spot position threshold value.

And S626, judging whether the third laser focal length position exceeds the focal length position threshold value.

S628, determining whether the third power value exceeds the power threshold.

Specifically, similar to the steps S602 to S606 and the steps S614 to S618, the difference is that in this embodiment, when any one of the determination results in the steps S614 to S618 is yes, the step S608 is executed to remind the operator that the machining system may have a major problem and needs to be checked by the operator.

Referring to fig. 5, the step S10 may specifically include the following steps S12-S22.

And S12, obtaining laser marking parameters, and controlling the laser source to perform first marking on a test medium to form a first marking pattern.

Specifically, the laser system controls the laser source to perform first marking on the test medium according to the set laser marking parameters so as to form a first marking pattern. Wherein the laser marking parameters include at least one of marking speed, marking power and filling distance. The laser marking parameters in this embodiment include marking speed.

It will be appreciated that in other embodiments, the laser marking parameters may include marking speed and marking power, or the laser marking parameters may include marking speed and filling pitch, or the laser marking parameters may include marking speed, marking power and filling pitch, or the laser marking parameters may include marking power, or the laser marking parameters may include filling pitch. It should be noted that when the laser marking parameters include at least two of the marking speed, the marking power and the filling distance, the laser marking parameters may be initially selected according to experience, so that the patterns formed by marking are within a reasonable range, and the increase of the selection time and the generation of large deviation caused by the random parameter selection are avoided.

And S14, controlling the camera assembly to acquire the first marking parameter of the first marking pattern.

Specifically, the first marking parameter may be at least one of sharpness and gray scale, both of which are capable of reflecting the quality of the first marked pattern, specifically, sharpness represents an indicator of the sharpness of the pattern or the sharpness of the image edge; the gray scale represents an index of the shade of the pattern black. And the camera assembly evaluates the first marking pattern by using the first marking parameter after acquiring the first marking parameter. In this embodiment, the first marking parameter includes sharpness.

It is to be appreciated that in other embodiments, the first marking parameter may also include a gray scale, or the first marking parameter may also include a sharpness and a gray scale.

And S16, analyzing the first marking parameter and the target marking parameter to obtain a first difference value.

Specifically, the acquired first marking parameter is analyzed and compared with the target parameter to obtain a first difference value. That is, in the present embodiment, the target parameter is the target sharpness, and the first difference is the first sharpness difference.

And S18, judging that the first difference exceeds the parameter threshold.

Specifically, the acquired first difference is compared with a parameter threshold, and if the first difference is determined to exceed the parameter threshold, that is, the first sharpness difference exceeds the parameter threshold, step S22 is executed.

And S20, judging that the first difference value does not exceed the parameter threshold value, and ending the laser parameter selection.

Specifically, if the acquired first difference does not exceed the parameter threshold, the first marking pattern meets the requirement, the laser marking parameter meets the requirement, and the laser parameter selection is finished.

It should be noted that the target parameter and the parameter threshold are values selected according to the test medium and the laser parameter, and under the target parameter, the pattern display effect is good, so that the camera can clearly grab the pattern boundary, the positioning accuracy of the camera is improved, and the calibration accuracy is improved.

S22, a parameter adjustment step is performed.

Referring to fig. 6, the step S22 may specifically include the following steps S24-S32.

And S24, adjusting the laser marking parameters, and controlling the laser source to carry out second marking on the test medium to form a second marking pattern.

Specifically, the laser marking parameters are adjusted, and the laser source performs second marking on the test medium by using the adjusted parameters to form a second marking pattern. For example, the marking speed of the laser source is adjusted, and the test medium is secondarily marked by the laser source with the adjusted marking speed.

And S26, controlling the camera assembly to acquire a second marking parameter of the second marking pattern.

Specifically, a second marking parameter of a second marking pattern, i.e., a second sharpness parameter of the second marking pattern, is obtained by the camera assembly.

And S28, analyzing the second marking parameter and the target marking parameter to obtain a second difference value.

Specifically, the obtained second marking parameter is analyzed and compared with the target marking parameter to obtain a second difference value, namely a second sharpness difference value.

And S30, if the second difference value is judged to exceed the parameter threshold value, repeating the second marking until the second difference value does not exceed the parameter threshold value.

Specifically, when the second difference is judged to exceed the parameter threshold, the second marking is repeated until the second difference does not exceed the parameter threshold, namely, the marking speed of the laser source is continuously adjusted until the second difference acquired by the camera does not exceed the parameter threshold, and at this time, the laser marking parameters meet the requirements.

And S32, judging that the second difference value does not exceed the parameter threshold value, and ending the laser parameter selection.

Specifically, if the obtained second difference does not exceed the parameter threshold, the second marking pattern meets the requirement, the adjusted laser marking parameter meets the requirement, and the laser parameter selection is finished.

It will be appreciated that in other embodiments, the laser marking parameters may include marking speed and marking power. The laser marking parameters may be selected as: the marking speed of the laser is selected, that is, the steps S12 to S22 and S24 to S32 are performed on the marking speed of the laser. After the marking speed of the laser is selected, the steps S12 to S22 and S24 to S32 are performed when the marking power of the laser is selected. In this manner, laser marking parameters may be selected. Of course, the order of the above-described selection of marking speed and marking power may be varied.

It will be appreciated that in other embodiments, the laser marking parameters may include marking speed, marking power, and fill pitch. The laser marking parameters may be selected as: the marking speed of the laser is selected, that is, the steps S12 to S22 and S24 to S32 are performed on the marking speed of the laser. After the marking speed of the laser is selected, the marking power of the laser is selected, that is, the steps S12 to S22 and the steps S24 to S32 are performed on the marking power of the laser. After the marking speed and the marking power of the laser are selected, the filling interval of the laser is selected, that is, the filling interval of the laser is subjected to steps S12 to S22 and steps S24 to S32. In this manner, laser marking parameters may be selected. Of course, the selected order of the marking speed, marking power and fill pitch described above may be varied.

Referring to fig. 7, step S100 may specifically include the following steps S102 to S114.

S102, sending a motion parameter to the processing platform.

Specifically, the machining platform is used for placing a workpiece to be marked. In this embodiment, the processing platform may be configured to place a test medium thereon. After receiving the motion parameters, the processing platform can drive the test medium to move together according to the motion information/track carried by the motion parameters, so that the moving distance of the test medium can be obtained. The physical coordinate information can be generated when the processing platform moves, and the physical coordinate information can reflect the information of the movement of the processing platform and the test medium. The workpiece to be marked is positioned on the processing platform, and the processing platform moves to drive the workpiece to be marked to move so as to mark patterns with specific shapes and specific intervals on the workpiece to be marked by matching with laser.

It should be noted that the test medium may be a material capable of being marked with a pattern, such as paper or a metal plate, and the test medium may be in a sheet or block shape, which is not limited herein.

And S104, sending a galvanometer marking parameter to the galvanometer component.

Specifically, the galvanometer component can be fixed at a specific position after receiving the galvanometer marking parameters, and can also swing according to a preset angle, so that the light path of the laser after passing through the galvanometer component is not changed, or the laser after passing through the galvanometer component is transmitted according to a preset light path. The galvanometer marking parameter can be understood as a parameter which enables the galvanometer component to be fixed at a specific position, and the parameter enables a servo motor of the galvanometer component to move by a specific angle or to be fixed at a specific angle.

In some embodiments, the mark is marked at the center of the galvanometer, so that the distortion error of the galvanometer component can be prevented from influencing the calibration of the camera component, and the calibration precision of the camera component is improved.

And S106, controlling the galvanometer component to cooperate with the motion of the processing platform to form a third debugging pattern and a fourth debugging pattern on a test medium, and obtaining physical coordinate information of a third feature of the third debugging pattern and physical coordinate information of a fourth feature of the fourth debugging pattern based on the physical coordinate information of the processing platform.

Specifically, after passing through the galvanometer component, the laser marks on the test medium through the movement of the processing platform. For example, at a first time, the processing platform is located at a first position, and the laser marks the first position on the test medium after passing through the oscillator component to form a third debugging pattern; and at the second time, the processing platform moves to a second position according to the motion parameters, and the laser marks the second position on the test medium after passing through the vibrating mirror assembly to form a fourth debugging pattern. The third and fourth commissioning patterns may be the same pattern, the third commissioning pattern having a third feature, the fourth commissioning pattern having a fourth feature, the third and fourth features being the same feature. In this embodiment, the third and fourth debugging patterns are both "cross" words, and the third and fourth features are both central points of the "cross" words.

It is understood that, in other embodiments, the third and fourth patterns may also be circular, regular polygonal, or other shaped patterns, and the third and fourth features may be center points of the patterns, or feature information such as intersection points, which is specific on the patterns.

And acquiring physical coordinate information of the third feature and physical coordinate information of the fourth feature based on the physical coordinate information of the processing platform and the predicted motion parameters, wherein the physical coordinate information of the third feature and the physical coordinate information of the fourth feature are coordinates based on the physical coordinate information of the processing platform.

And S108, controlling the camera assembly to capture the third feature and the fourth feature, and acquiring pixel coordinate information of the third feature and pixel coordinate information of the fourth feature.

Specifically, a third debugging pattern and a fourth debugging pattern are obtained through the camera assembly, and the camera assembly captures a third feature and a fourth feature according to the third debugging pattern and the fourth debugging pattern. The camera component has pixel coordinate information, the pixel coordinate information of the camera component can be understood as basic coordinates of the camera component, and after the camera component acquires the third feature and the fourth feature, pixel coordinate information is formed in the camera component based on the pixel coordinate information of the camera component, namely the pixel coordinate information of the third feature and the pixel coordinate information of the fourth feature are formed. Note that the pixel coordinate information is not equivalent to the physical coordinate information.

And S110, calculating the conversion relationship between the pixel coordinate information of the third feature and the pixel coordinate information of the fourth feature and the physical coordinate information of the third feature and the physical coordinate information of the fourth feature, so that the coordinate information of the camera assembly converted through the conversion relationship is consistent with the physical coordinate information of the processing platform.

Specifically, the conversion relationship between the pixel coordinate information and the physical coordinate information is obtained through calculation according to the acquired pixel coordinate information of the third feature and the acquired pixel coordinate information of the fourth feature, and the acquired physical coordinate information of the third feature and the acquired physical coordinate information of the fourth feature. Therefore, the coordinate information of the pixel coordinate information of the camera assembly after being converted through the conversion relation is consistent with the physical coordinate information of the processing platform.

It should be noted that, the first debugging is to calibrate the camera assembly, and since the physical coordinate information of the processing platform can reflect the real distance information, calibrating the camera assembly is based on the physical coordinate information of the processing platform. Therefore, accurate pixel coordinate information of the camera assembly can be obtained through the physical coordinate information and the conversion relation, and debugging of the camera assembly is completed.

S114, the first debug is ended.

Specifically, after the calibration of the camera assembly is completed, the first debugging is ended. Thus, debugging of the camera assembly is achieved.

In some embodiments, the performing the first debugging further includes a process of verifying the debugged camera component, that is, after step S110, the performing the first debugging further includes step S112.

S112, executing first verification debugging.

Specifically, the first verification debugging is substantially similar to the flow from step S102 to step S110, and may continue to use the motion parameters, or may use new verification motion parameters. In this embodiment, the first verification debugging may form verification physical coordinate information, and when the difference between the verification physical coordinate information and the actual physical coordinate information is set within an error range, the verification physical coordinate information is considered to be consistent with the actual physical coordinate information. For example, the error range is the percentage difference of less than or equal to 0.05%, the percentage difference is the difference between the verified physical coordinate information and the actual physical coordinate information divided by the average of the verified physical coordinate information and the actual physical coordinate information, and the percentage difference is displayed in percentage. Therefore, whether the verified physical coordinate information is consistent with the actual physical coordinate information can be intuitively judged through data.

Referring to fig. 8, step S200 may specifically include the following steps S202 to S210.

S202, controlling the vibrating mirror assembly to form a fifth debugging pattern and a sixth debugging pattern on a test medium.

Specifically, under the condition that the camera component is calibrated, a parameter is sent to the galvanometer component, the galvanometer component forms a fifth debugging pattern and a sixth debugging pattern on the test medium according to the parameter, and the fifth debugging pattern and the sixth debugging pattern are also in a cross shape. When the galvanometer component is controlled to form the fifth debugging pattern and the sixth debugging pattern, the galvanometer component also forms galvanometer coordinate information of the fifth debugging pattern and galvanometer coordinate information of the sixth debugging pattern.

It is to be understood that the fifth and sixth commissioning patterns may also be circular, regular polygonal, or other shaped patterns.

And S204, controlling the camera assembly to capture a fifth feature of the fifth debugging pattern and a sixth feature of the sixth debugging pattern, obtaining pixel coordinate information of the fifth feature and pixel coordinate information of the sixth feature, and calculating physical coordinate information of the fifth feature and physical coordinate information of the sixth feature according to the conversion relation.

Specifically, a fifth debugging pattern and a sixth debugging pattern are obtained through the camera assembly, the camera assembly captures a fifth feature and a sixth feature according to the fifth debugging pattern and the sixth debugging pattern, and after the camera assembly obtains the fifth feature and the sixth feature, pixel coordinate information is formed in the camera assembly based on pixel coordinate information of the camera assembly, namely pixel coordinate information of the fifth feature and pixel coordinate information of the sixth feature are formed. And converts the pixel coordinate information of the fifth feature and the pixel coordinate information of the sixth feature into physical coordinate information of the fifth feature and physical coordinate information of the sixth feature according to the conversion relationship acquired in step S100. It should be noted that the galvanometer coordinate information of the fifth debugging pattern and the galvanometer coordinate information of the sixth debugging pattern are the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature.

And S206, judging whether the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature are consistent with the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature.

Specifically, the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature obtained by the conversion relationship are compared with the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature.

In this embodiment, the percentage difference between the physical coordinate information and the galvanometer coordinate information is set to be less than or equal to 0.05%, and it is determined whether the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature are consistent with the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature.

And S208, if not, compensating the galvanometer component so that the galvanometer coordinate information of the fifth characteristic and the galvanometer coordinate information of the sixth characteristic are consistent with the physical coordinate information of the fifth characteristic and the physical coordinate information of the sixth characteristic.

Specifically, if the comparison result is inconsistent, the galvanometer component is compensated, so that the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature are consistent with the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature. The process of compensating the galvanometer component is approximately the step of forming the "conversion relation" in step S100, so that the coordinate information of the galvanometer component is consistent with the coordinate information of the camera component or the processing platform after conversion.

If the comparison result is consistent, the compensation for the galvanometer component is not required, and step S212 may be executed.

Step S212, the execution of the second debugging is ended.

Specifically, after the calibration of the vibrating mirror assembly is completed, the second debugging is finished. Therefore, the debugging of the galvanometer component is realized.

In some embodiments, performing the second commissioning further includes a process of verifying the commissioned galvanometer component, i.e., after step S208, performing the first commissioning further includes step S210.

And S210, executing second verification debugging.

Specifically, the second proof debug is substantially similar to the flow of step S202 to step S208.

Referring to fig. 9, the step S300 may specifically include the following steps S302 to S318.

S302, the first adjusting parameter is sent to the focal length adjusting assembly.

Specifically, the focus adjustment assembly may include a voice coil motor that moves each lens. The first adjustment parameter may be understood as a parameter of the voice coil motor driving each lens to move, and the first adjustment parameter may be obtained empirically or experimentally. The focal length of the laser emitted by the laser source is changed through the movement of each lens, so that the marking quality of the laser is different. Illustratively, the first adjustment parameter may be 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, that is, the distance moved by each time the focus adjustment assembly moves each lens is 0.1 mm. It should be understood that the drawings are for purposes of illustrating embodiments of the application and are not to be construed as limiting the embodiments of the application.

S304, the laser source is controlled to cooperate with the movement of the focal length adjusting assembly to form a plurality of first debugging patterns on a testing medium, and the plurality of first debugging patterns are distributed at different testing positions of the testing medium.

Specifically, the laser source emits laser light to match with the movement of the focal length adjustment assembly, a plurality of first debugging patterns are formed on the test medium, and the first debugging patterns are distributed at different test positions of the test medium. Illustratively, the first debugging patterns are lines, the number of the first debugging patterns is 9, and a plurality of the first debugging patterns are arranged on the test medium at intervals. In this manner, the camera assembly is facilitated to clearly acquire images of the plurality of first commissioning patterns to analyze the acquired images.

S306, it is determined that the first feature of the first debug pattern meets the predetermined focus threshold.

Specifically, first features of each first debugging pattern are respectively obtained through the camera assembly, and the first features comprise at least one of line thickness, burning area and burning edge size of the first debugging pattern. The present embodiment is described by taking the first feature as an example of the line thickness, and it is obvious that this is not a limitation to the embodiments of the present application. According to the obtained multiple first features, one of the 9 first features with the thinnest line is selected, for example, the fifth line is the thinnest line.

S308, determining a second adjusting parameter based on the first characteristic meeting the preset focal length threshold.

Specifically, based on the fifth line being the thinnest, that is, the fifth line meeting the preset focal length threshold, the second adjustment parameters are determined to be 0.46mm, 0.47mm, 0.48mm, 0.49mm, 0.5mm, 0.51mm, 0.52mm, 0.53mm, and 0.54mm, that is, to be shifted up and down on the basis of 0.5 mm.

S310, sending the second adjusting parameter to the focal length adjusting component.

And S312, controlling the laser source to cooperate with the movement of the focal length adjustment assembly to form a plurality of second debugging patterns on the test medium, wherein the plurality of second debugging patterns are distributed at different test positions of the test medium.

S314, judging that the second characteristic of a second debugging pattern is in accordance with the preset focal length threshold value.

And S316, determining the focal length of the laser source based on the second characteristic meeting the preset focal length threshold value.

Specifically, the flow of steps S310 to S316 is substantially similar to the flow of steps S302 to S308, and the second characteristic should be the same as the first characteristic. Therefore, the second adjusting parameter which accords with the preset focal length threshold value is determined through the first adjusting parameter, and then the focal length of the laser source is determined through the second adjusting parameter, so that the debugging precision of the focal length of the laser source is improved.

S318, ending the third debugging.

Referring to fig. 10, the step S40 may specifically include the following steps S42-S60.

And S42, controlling the camera assembly to perform a first shooting debugging and obtain a plurality of corresponding seventh debugging patterns according to the preset first exposure parameters.

Specifically, the first exposure parameter includes a gain value and an exposure value. The present embodiment is described by taking an example that the first exposure parameter includes a gain value, and obviously, this is not a limitation to the embodiments of the present application. The first exposure parameters are 1EV, 2EV, 3EV, 4EV, 5EV, 6EV, 7EV, 8EV, and 9EV, that is, the camera module respectively performs the first shooting debugging under the exposure parameters and acquires 9 corresponding seventh debugging patterns.

S44, determining that a seventh feature of a seventh debug pattern meets the predetermined exposure threshold.

In particular, the seventh feature may be a target feature profile of the seventh debug pattern, and the target feature may be a feature such as a solder joint, a stud to be soldered, or the like. And selecting one seventh feature with the target feature profile which best meets the preset exposure threshold from the acquired 9 seventh features. It can also be understood that the one that meets the preset exposure threshold is the sharpest one of the target feature profiles.

And S46, determining a second exposure parameter based on the seventh feature meeting the preset exposure threshold.

Specifically, the second exposure parameter is determined based on the seventh feature meeting a preset exposure threshold. Illustratively, the seventh debug pattern and the seventh feature corresponding to the first exposure parameter 5EV meet the preset exposure threshold, and the second exposure parameters are determined to be 4.5EV, 4.6EV, 4.7EV, 4.8EV, 4.9EV, 5EV, 5.1EV, 5.2EV, 5.3EV, 5.4EV, and 5.5EV according to the exposure parameter 5 EV.

And S48, controlling the camera assembly to carry out second shooting debugging and obtain a plurality of corresponding eighth debugging patterns according to the second exposure parameters.

S50, determining that the eighth feature of an eighth debug pattern meets the predetermined exposure threshold.

And S52, determining the target exposure parameter based on the eighth feature meeting the preset exposure threshold.

Specifically, the flow of steps S48-S52 is substantially similar to the flow of steps S42-S46. In this manner, target exposure parameters for the camera assembly are determined.

S54, capturing the target feature in the shot object based on the target exposure parameter.

Specifically, based on the target exposure parameter, the target feature in the eighth debug pattern corresponding to the target exposure parameter is captured.

And S56, determining whether the target feature is consistent with the preset exposure feature.

Specifically, the acquired target feature is compared with a preset exposure feature. The preset exposure features may be understood as pre-stored target features.

If the result of step S56 is negative, step S58 is executed to compensate the camera assembly so that the target feature is consistent with the preset exposure feature.

Specifically, if the target feature is consistent with the predetermined exposure feature, the camera assembly needs to be compensated. Illustratively, if the gray scale of the target feature is smaller than the preset exposure feature, the exposure value of the camera component is correspondingly increased according to the gray scale difference value of the target feature and the preset exposure feature so as to compensate the camera component.

If the result of step S56 is yes, step S60 is executed to end the fourth debugging. In this way, the fourth debugging is performed, so that the exposure parameters of the camera component are debugged.

It will be appreciated that in other embodiments, where the exposure parameters include an exposure value and a gain value, the step of determining the target exposure parameter may be: the target exposure parameter of the exposure value of the camera component is determined, i.e., steps S42-S52 are performed on the exposure value of the camera component. After the target exposure parameter of the exposure value of the camera component is determined, the steps S42-S52 are performed on the gain value of the camera component after the target exposure parameter of the gain value of the camera component is determined. In this manner, target exposure parameters for the camera assembly may be determined. Of course, the order of the above-described determinations of the target exposure parameters of the camera assembly may vary.

Fig. 1 to 10 illustrate the debugging and monitoring method of the present application in detail. In the debugging and monitoring method of the embodiment, the first debugging is executed firstly, so that the coordinates of the camera component are debugged; then executing second debugging to enable the coordinates of the galvanometer component to complete debugging; then, executing third debugging to enable the focal length of the laser source to finish debugging; then executing fourth debugging to enable the exposure parameters of the camera component to be debugged; before the first commissioning is performed, the selection of laser parameters is also performed so that the pattern processed by the laser source has a better quality. By executing the first debugging and the second debugging in sequence, the vibrating mirror assembly is prevented from generating deviation in the debugging process to influence the debugging precision of the camera assembly, and the debugging precision of the camera assembly is improved; the method comprises the steps of judging whether a first laser parameter exceeds a laser threshold value or not by obtaining the first laser parameter of a laser source for executing first processing so as to realize real-time monitoring on a laser system; the laser system can be monitored in real time to debug the focal lengths of the galvanometer assembly and the camera assembly of the laser system in real time, defective products formed by machining of the laser system can be found in time, the laser system can be debugged on line in time, the production yield of machining of the laser system can be improved, and production cost is reduced.

The hardware architecture of the debugging and monitoring device 700 for implementing the debugging and monitoring functions is described below with reference to fig. 11. It should be understood that the embodiments of the present application are illustrative only and are not intended to be limiting in any way within the scope of the present application.

Referring to fig. 11, fig. 11 is a diagram illustrating a hardware architecture of a debugging and monitoring device 700 according to some embodiments of the present application. The debugging and monitoring device 700 is used for debugging the focal lengths of the camera assembly, the galvanometer assembly and the laser source in the laser system, and monitoring and debugging the laser system in real time. The debugging and monitoring device 700 includes a communication interface 702, a processor 704, a memory 706, and a communication bus 708. The communication interface 702, the memory 706 are coupled to the processor 704 by a communication bus 708.

Communication interface 702 is configured to receive and transmit data messages, which may be sent to communication interface 702 by processor 704 or sent to communication interface 702 by other input devices. The communication interface 702 is also used to couple various portions of the laser system for sending information between the various portions.

The Processor 704 may be a Central Processing Unit (CPU), and may include other general purpose processors, Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components, and the like. The general purpose processor may be a microprocessor or the general purpose processor may be any conventional processor or the like, and the processor 704 is the control center for the laser system and connects the various parts of the overall laser system using various interfaces and lines.

The memory 706 is used to store various types of data in the laser system, such as various databases, program code, and the like. In this embodiment, the Memory may include, but is not limited to, a Read-Only Memory (ROM), a Random Access Memory (RAM), a Programmable Read-Only Memory (PROM), an Erasable Programmable Read-Only Memory (EPROM), an Electrically Erasable Programmable Read-Only Memory (EEPROM), a Compact Disc Read-Only Memory (CD-ROM), or any other optical Disc Memory, magnetic disk Memory, tape Memory, or any other medium readable by a computer that can be used to carry or store data.

The memory 706 has stored therein a commissioning and monitoring program 710 for the laser system, the commissioning and monitoring program 710 being configured to implement the steps of the commissioning and monitoring method for the laser system as described above.

Illustratively, the debugging and monitoring program 710 may be partitioned into one or more modules/units that are stored in the memory 706 and executed by the processor 704 to implement the debugging and monitoring functions of the present application. One or more modules/units may be a series of computer program instruction segments capable of performing specific functions, the instruction segments describing the execution process of the debugging and monitoring program 710 in the debugging and monitoring device 700.

The debugging and monitoring apparatus 700 for a laser system of the present application can debug and monitor the laser system by performing the debugging and monitoring method for a laser system as described above. Debugging the coordinates of the camera component by first executing a first debugging; then executing second debugging to enable the coordinates of the galvanometer component to complete debugging; then, executing third debugging to enable the focal length of the laser source to finish debugging; then executing fourth debugging to enable the exposure parameters of the camera component to be debugged; before the first commissioning is performed, the selection of laser parameters is also performed so that the pattern processed by the laser source has a better quality. By executing the first debugging and the second debugging in sequence, the vibrating mirror assembly is prevented from generating deviation in the debugging process to influence the debugging precision of the camera assembly, and the debugging precision of the camera assembly is improved; the method comprises the steps of judging whether a first laser parameter exceeds a laser threshold value or not by obtaining the first laser parameter of a laser source for executing first processing so as to realize real-time monitoring on a laser system; the laser system can be monitored in real time to debug the focal lengths of the galvanometer assembly and the camera assembly of the laser system in real time, defective products formed by machining of the laser system can be found in time, the laser system can be debugged on line in time, the production yield of machining of the laser system can be improved, and production cost is reduced.

Referring to fig. 12, fig. 12 is a functional block diagram of a debugging and monitoring apparatus 800 of a laser system according to some embodiments of the present application. The debugging and monitoring device 800 can be applied to a laser system for debugging and monitoring the focal lengths of a camera component, a galvanometer component and a laser source in the laser system, and can also debug laser parameters and exposure parameters of a camera.

In some embodiments, the debugging and monitoring apparatus 800 may include a plurality of functional modules composed of program code segments. Program code for the various program segments in the commissioning and monitoring apparatus 800 may be stored in one or more memories 706 and executed by the respective at least one processor 704 to implement the commissioning and monitoring functions for the laser system.

Referring to fig. 12, in some embodiments, the debugging and monitoring apparatus 800 may be divided into a plurality of functional modules according to the functions performed by the debugging and monitoring apparatus, and each functional module is configured to perform each step in the corresponding embodiments of fig. 1 to 10, so as to implement the debugging and monitoring functions of the debugging and monitoring apparatus 800 of the laser system. In this embodiment, the functional modules of the debugging and monitoring apparatus 800 include a first debugging module 802, a second debugging module 804, a third debugging module 806, a processing module 808, a first obtaining module 810, a first determining module 812, and a first executing module 814.

The first debugging module 802 is used for performing a first debugging to complete the debugging of the camera component.

The second debugging module 804 is used for executing second debugging so that the galvanometer component is debugged.

The third commissioning module 806 is configured to perform a third commissioning to complete the commissioning of the focal length of the laser source.

The process module 808 is configured to control the laser source to perform a first process.

The first obtaining module 810 is configured to obtain a first laser parameter of a first process.

The first determining module 812 is configured to determine whether the first laser parameter exceeds a laser threshold, so as to monitor the laser system.

In some embodiments, the first determination module 812 is further configured to determine whether the first laser spot position exceeds a spot position threshold.

The first determining module 812 is further configured to determine whether the first laser focal length position exceeds a focal length position threshold.

The first determining module 812 is further configured to determine whether the first power value exceeds a power threshold.

The first executing module 814 is configured to repeatedly execute the second debugging to complete new debugging of the galvanometer component and repeatedly execute the third debugging to complete new debugging of the focal length of the laser source when it is determined that the first laser spot position exceeds the spot position threshold.

The first executing module 814 is further configured to repeatedly execute the third debugging when it is determined that the first laser focal length position exceeds the focal length position threshold, so that the focal length of the laser source completes a new debugging.

The first executing module 814 is further configured to repeatedly execute the second debugging when the first laser spot position is determined to exceed the spot position threshold and when the first laser focal length position is determined to exceed the focal length position threshold, so that the mirror-vibrating assembly completes a new debugging, and repeatedly execute the third debugging, so that the focal length of the laser source completes a new debugging.

The first executing module 814 is further configured to execute an early warning instruction when the first power value is determined to exceed the power threshold.

In some embodiments, processing module 808 is configured to control the laser source to perform a second process.

The first obtaining module 810 is further configured to obtain a second laser parameter for a second process.

The first determining module 812 is further configured to determine whether the second laser spot position exceeds the spot position threshold.

The first determining module 812 is further configured to determine whether the second laser focal length position exceeds a focal length position threshold.

The first determining module 812 is further configured to determine whether the second power value exceeds a power threshold.

The first executing module 814 is further configured to repeatedly execute the second debugging when it is determined that the second laser spot position exceeds the spot position threshold, so that the galvanometer component completes new debugging, and repeatedly execute the third debugging, so that the focal length of the laser source completes new debugging.

The first executing module 814 is further configured to repeatedly execute the third debugging when it is determined that the second laser focal length position exceeds the focal length position threshold, so that the focal length of the laser source completes a new debugging.

The first executing module 814 is further configured to repeatedly execute the second debugging when it is determined that the second laser spot position exceeds the spot position threshold and when it is determined that the second laser focal length position exceeds the focal length position threshold, so as to complete a new debugging of the mirror-vibrating assembly, and repeatedly execute the third debugging, so as to complete a new debugging of the focal length of the laser source.

The first executing module 814 is further configured to execute the warning instruction when it is determined that the second power value exceeds the power threshold.

In some embodiments, processing module 808 is further configured to control the laser source to perform a third process.

The first obtaining module 810 is further configured to obtain a third laser parameter for a third process.

The first determining module 812 is further configured to determine whether the third laser spot position exceeds the spot position threshold.

The first determining module 812 is further configured to determine whether the third laser focal length position exceeds the focal length position threshold.

The first determining module 812 is further configured to determine whether the third power value exceeds the power threshold.

The first executing module 814 is further configured to execute the early warning instruction when at least one of the third laser spot position is judged to exceed the spot position threshold, the third laser focal length position is judged to exceed the focal length position threshold, and the third power value is judged to exceed the power threshold occurs.

In some embodiments, the commissioning and monitoring device 800 further comprises a laser parameter selection module 816 and a fourth commissioning module 818.

The laser parameter selection module 816 is configured to perform laser parameter selection to select laser parameters of the laser source.

The fourth debugging module 818 is used for executing the fourth debugging so as to complete the debugging of the exposure parameters of the camera component.

Referring to fig. 13, in some embodiments, the first debugging module 802 may include a first sending module 8021, a first forming module 8022, a grabbing module 8023, a first calculating module 8024, a first verifying module 8025, and a first ending module 8026.

The first sending module 8021 is configured to send a motion parameter to the processing platform.

The first sending module 8021 is further configured to send a galvanometer marking parameter to the galvanometer component.

The first forming module 8022 is configured to control the galvanometer component to cooperate with the motion of the processing platform to form a third debugging pattern and a fourth debugging pattern on a test medium, and obtain physical coordinate information of a third feature of the third debugging pattern and physical coordinate information of a fourth feature of the fourth debugging pattern based on the physical coordinate information of the processing platform.

The grabbing module 8023 is configured to control the camera assembly to grab the third feature and the fourth feature, and acquire pixel coordinate information of the third feature and pixel coordinate information of the fourth feature.

The first calculating module 8024 is configured to calculate a conversion relationship between the pixel coordinate information of the third feature and the pixel coordinate information of the fourth feature and the physical coordinate information of the third feature and the physical coordinate information of the fourth feature, so that the coordinate information of the camera assembly after the conversion relationship conversion is consistent with the physical coordinate information of the processing platform.

The first verification module 8025 is configured to perform a first verification debugging for verifying the transformation relationship acquired by the camera component.

The first end module 8026 is used to end the first debug.

Referring to fig. 14, in some embodiments, the second debugging module 804 may include a second forming module 8041, a second calculating module 8042, a second determining module 8043, a second verifying module 8044, a second ending module 8045, and a first compensating module 8046.

The second forming module 8041 is used to control the galvanometer assembly to form a fifth debugging pattern and a sixth debugging pattern on a test medium.

The second calculating module 8042 is configured to control the camera component to capture a fifth feature of the fifth debugging pattern and a sixth feature of the sixth debugging pattern, obtain pixel coordinate information of the fifth feature and pixel coordinate information of the sixth feature, and calculate physical coordinate information of the fifth feature and physical coordinate information of the sixth feature according to the conversion relationship.

The second determination module 8043 is configured to determine whether the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature are consistent with the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature.

If the determination result of the second determining module 8043 is negative, the first compensating module 8046 is configured to compensate the galvanometer component, so that the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature are consistent with the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature.

If the determination result of the second determining module 8043 is yes, the second ending module 8045 is configured to end the second debugging.

The second verification module 8044 is configured to perform a second verification debugging, and is configured to verify the compensated galvanometer component.

Referring to fig. 15, in some embodiments, the third debugging module 806 may include a second sending module 8061, a third forming module 8062, a third determining module 8063, a first determining module 8064, and a third ending module 8065.

The second sending module 8061 is configured to send the first adjustment parameter to the focal length adjustment assembly.

The third forming module 8062 is configured to control the laser source to cooperate with the movement of the focal length adjustment assembly to form a plurality of first debugging patterns on a testing medium, where the plurality of first debugging patterns are distributed at different testing positions of the testing medium.

The third determining module 8063 is configured to determine that a first feature of a first debugging pattern meets a preset focus threshold.

The first determining module 8064 is configured to determine a second adjustment parameter based on the first characteristic meeting a preset focus threshold.

The second sending module 8061 is further configured to send the second adjustment parameter to the focal length adjustment assembly.

The third forming module 8062 is further configured to control the laser source to cooperate with the movement of the focal length adjustment assembly to form a plurality of second debugging patterns on the test medium, where the plurality of second debugging patterns are distributed at different testing positions of the test medium.

The third determining module 8063 is further configured to determine that a second feature of a second debugging pattern meets the preset focal length threshold.

The first determining module 8064 is further configured to determine the focal length of the laser source based on the second characteristic meeting a preset focal length threshold.

The third end module 8065 is used to end execution of the third debug.

Referring to fig. 16, in some embodiments, the laser parameter selection module 816 may include a second obtaining module 8161, an analysis module 8162, a fourth determination module 8163, a second execution module 8164, and an adjustment module 8165.

The second obtaining module 8161 is used for obtaining laser marking parameters and controlling the laser source to perform first marking on a test medium to form a first marking pattern.

The second acquisition module 8161 is also configured to control the camera assembly to acquire the first marking parameters of the first marking pattern.

The analysis module 8162 is configured to analyze the first marking parameter and the target marking parameter to obtain a first difference.

The fourth determining module 8163 is configured to determine that the first difference exceeds the parameter threshold.

A second execution module 8164 is configured to execute the parameter adjustment step.

The adjusting module 8165 is used for adjusting the laser marking parameters and controlling the laser source to perform a second marking on the test medium to form a second marking pattern.

The second acquisition module 8161 is also configured to control the camera assembly to acquire a second marking parameter of the second marking pattern.

The analysis module 8162 is further configured to analyze the second marking parameter and the target marking parameter to obtain a second difference.

The fourth determination module 8163 is further configured to determine that the second difference exceeds the parameter threshold, and repeat the second marking until the second difference does not exceed the parameter threshold.

Referring to fig. 17, in some embodiments, the fourth debugging module 818 may include a third obtaining module 8181, a second determining module 8182, a capturing module 8183, and a second compensating module 8184.

The third obtaining module 8181 is configured to control the camera component to perform the first shooting debugging and obtain a plurality of corresponding seventh debugging patterns according to the preset first exposure parameter.

The second determining module 8182 is configured to determine that a seventh feature of a seventh debug pattern meets the preset exposure threshold.

The second determining module 8182 is further configured to determine a second exposure parameter based on the seventh feature meeting the preset exposure threshold.

The third obtaining module 8181 is further configured to control the camera component to perform second shooting debugging and obtain a plurality of corresponding eighth debugging patterns according to the second exposure parameter.

The second determining module 8182 is further configured to determine that an eighth feature of an eighth debug pattern meets the preset exposure threshold.

The second determining module 8182 is further configured to determine the target exposure parameter based on the eighth feature meeting the preset exposure threshold.

The capture module 8183 is configured to capture a target feature in the captured object based on the target exposure parameter.

The second determination module 8182 is also configured to determine whether the target feature is consistent with the pre-set exposure feature.

If the second determining module 8182 determines that the target feature and the preset exposure feature are not the same, the second compensating module 8184 is configured to compensate the camera component, so that the target feature is consistent with the preset exposure feature.

A computer-readable storage medium is also provided in some embodiments of the present application. The computer readable storage medium has stored thereon a debug and monitor program 710 for a laser system, the debug and monitor program 710, when executed by the processor 704, implementing the debug and monitor method as described above.

As such, the debug and monitor program 710 in the computer readable storage medium can debug and monitor the laser system by being executed by the processor 704 to implement the debug and monitor method as described above. Debugging the coordinates of the camera component by first executing a first debugging; then executing second debugging to enable the coordinates of the galvanometer component to complete debugging; then, executing third debugging to enable the focal length of the laser source to finish debugging; then executing fourth debugging to enable the exposure parameters of the camera component to be debugged; before the first commissioning is performed, the selection of laser parameters is also performed so that the pattern processed by the laser source has a better quality. By executing the first debugging and the second debugging in sequence, the vibrating mirror assembly is prevented from generating deviation in the debugging process to influence the debugging precision of the camera assembly, and the debugging precision of the camera assembly is improved; the method comprises the steps of judging whether a first laser parameter exceeds a laser threshold value or not by obtaining the first laser parameter of a laser source for executing first processing so as to realize real-time monitoring on a laser system; the laser system can be monitored in real time to debug the focal lengths of the galvanometer assembly and the camera assembly of the laser system in real time, defective products formed by machining of the laser system can be found in time, the laser system can be debugged on line in time, the production yield of machining of the laser system can be improved, and production cost is reduced.

It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present application without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A commissioning and monitoring method for a laser system comprising a laser source, a camera assembly, a galvanometer assembly, a machining platform, and a focal length adjustment assembly for adjusting a focal length of the laser source, the commissioning and monitoring method comprising:

performing a first debugging to complete the debugging of the camera component;

ending the executing of the first debug;

after the execution of the first debugging is finished, executing second debugging so as to finish the debugging of the galvanometer component;

ending the executing of the second debugging;

after the execution of the second debugging is finished, executing third debugging so as to finish the debugging of the focal length of the laser source;

the performing a third debug comprising:

sending a first adjusting parameter to the focal length adjusting component;

controlling the laser source to cooperate with the movement of the focal length adjusting assembly to form a plurality of first debugging patterns on a test medium, wherein the plurality of first debugging patterns are distributed at different test positions of the test medium;

judging that a first characteristic of the first debugging pattern accords with a preset focal length threshold;

determining a second adjustment parameter based on the first characteristic meeting the preset focal length threshold;

sending the second adjustment parameter to the focal length adjustment component;

controlling the laser source to cooperate with the movement of the focal length adjustment assembly to form a plurality of second debugging patterns on the test medium, wherein the plurality of second debugging patterns are distributed at different test positions of the test medium;

judging that a second feature of the second debugging pattern accords with the preset focal length threshold;

determining a focal length of the laser source based on the second characteristic meeting the preset focal length threshold;

ending the executing of the third debugging;

after the third debugging is finished, controlling the laser source to execute first processing;

acquiring a first laser parameter of the first processing;

and judging whether the first laser parameter exceeds a laser threshold value or not so as to realize the monitoring of the laser system.

2. A debugging and monitoring method in accordance with claim 1,

the step of performing a first debug comprises:

sending a motion parameter to the processing platform;

sending a galvanometer marking parameter to the galvanometer component;

controlling the galvanometer component to cooperate with the motion of the processing platform to form a third debugging pattern and a fourth debugging pattern on a test medium, and obtaining physical coordinate information of a third feature of the third debugging pattern and physical coordinate information of a fourth feature of the fourth debugging pattern based on the physical coordinate information of the processing platform;

controlling the camera assembly to capture the third feature and the fourth feature, and acquiring pixel coordinate information of the third feature and pixel coordinate information of the fourth feature;

and calculating the conversion relationship between the pixel coordinate information of the third feature and the pixel coordinate information of the fourth feature and the physical coordinate information of the third feature and the physical coordinate information of the fourth feature, so that the coordinate information of the camera assembly converted through the conversion relationship is consistent with the physical coordinate information of the processing platform.

3. A debugging and monitoring method in accordance with claim 2,

the step of performing a second debug comprises:

controlling the galvanometer component to form a fifth debugging pattern and a sixth debugging pattern on a test medium;

controlling the camera assembly to capture a fifth feature of the fifth debugging pattern and a sixth feature of the sixth debugging pattern, obtaining pixel coordinate information of the fifth feature and pixel coordinate information of the sixth feature, and calculating physical coordinate information of the fifth feature and physical coordinate information of the sixth feature according to the conversion relation;

judging whether the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature are consistent with the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature;

and if not, compensating the galvanometer component to enable the galvanometer coordinate information of the fifth characteristic and the galvanometer coordinate information of the sixth characteristic to be consistent with the physical coordinate information of the fifth characteristic and the physical coordinate information of the sixth characteristic.

4. A debugging and monitoring method in accordance with claim 3,

the first laser parameter comprises a first laser spot position, a first laser focal length position and a first power value, and the laser threshold comprises a spot position threshold, a focal length position threshold and a power threshold;

the step of judging whether the first laser parameter exceeds a laser threshold value to realize monitoring of the laser system comprises the following steps:

judging whether the first laser spot position exceeds the spot position threshold value;

judging whether the first laser focal length position exceeds the focal length position threshold value;

judging whether the first power value exceeds the power threshold value;

when the first laser spot position is judged to exceed the spot position threshold value, the second debugging is repeatedly executed so that the galvanometer component completes new debugging, and the third debugging is repeatedly executed so that the focal length of the laser source completes new debugging;

when the first laser focal length position is judged to exceed the focal length position threshold value, the third debugging is repeatedly executed, so that the focal length of the laser source is newly debugged;

when the first laser spot position is judged to exceed the spot position threshold value and the first laser focal length position is judged to exceed the focal length position threshold value, the second debugging is repeatedly executed so that the mirror-vibrating assembly completes new debugging, and the third debugging is repeatedly executed so that the focal length of the laser source completes new debugging;

and executing an early warning instruction when the first power value is judged to exceed the power threshold.

5. A debugging and monitoring method in accordance with claim 4,

the step of judging whether the first laser parameter exceeds a laser threshold value to realize monitoring of the laser system further includes:

controlling the laser source to perform a second process;

acquiring a second laser parameter of the second processing, wherein the second laser parameter comprises a second laser spot position, a second laser focal length position and a second power value;

judging whether the second laser spot position exceeds the spot position threshold value;

judging whether the second laser focal length position exceeds the focal length position threshold value;

determining whether the second power value exceeds the power threshold;

when the second laser spot position is judged to exceed the spot position threshold value, the second debugging is repeatedly executed so that the galvanometer component completes new debugging, and the third debugging is repeatedly executed so that the focal length of the laser source completes new debugging;

when the second laser focal length position is judged to exceed the focal length position threshold value, the third debugging is repeatedly executed, so that the focal length of the laser source is newly debugged;

when the second laser spot position is judged to exceed the spot position threshold value and the second laser focal length position is judged to exceed the focal length position threshold value, the second debugging is repeatedly executed so that the mirror-vibrating assembly completes new debugging, and the third debugging is repeatedly executed so that the focal length of the laser source completes new debugging;

and executing the early warning instruction when the second power value is judged to exceed the power threshold value.

6. A debugging and monitoring method in accordance with claim 5,

controlling the laser source to perform a third process;

acquiring a third laser parameter of the third processing, wherein the third laser parameter comprises a third laser spot position, a third laser focal length position and a third power value;

judging whether the third laser spot position exceeds the spot position threshold value;

judging whether the third laser focal length position exceeds the focal length position threshold value;

determining whether the third power value exceeds the power threshold;

and executing the early warning instruction when at least one of the conditions that the third laser spot position exceeds the spot position threshold value, the third laser focal length position exceeds the focal length position threshold value and the third power value exceeds the power threshold value occurs.

7. A debugging and monitoring method in accordance with claim 3,

after the step of calculating the conversion relationship between the pixel coordinate information of the third feature and the pixel coordinate information of the fourth feature and the physical coordinate information of the third feature and the physical coordinate information of the fourth feature, the step of performing the first debugging further includes:

executing a first verification debugging for verifying the conversion relation acquired by the camera assembly;

after the step of compensating the galvanometer component to make the galvanometer coordinate information of the fifth feature and the galvanometer coordinate information of the sixth feature consistent with the physical coordinate information of the fifth feature and the physical coordinate information of the sixth feature, the step of executing a second debugging further includes:

and executing second verification debugging for verifying the compensated galvanometer component.

8. A debugging and monitoring method in accordance with claim 1,

the first feature comprises at least one of line thickness, burning area and edge burning size of the first debugging pattern;

the second feature includes at least one of a line thickness, a burning area, and a burning edge size of the second debug pattern.

9. A debugging and monitoring method in accordance with claim 1,

after the third debugging is finished, the debugging and monitoring method further includes:

executing fourth debugging to enable the exposure parameters of the camera assembly to be debugged;

the performing a fourth debug comprising:

controlling the camera assembly to carry out first shooting debugging and obtain a plurality of corresponding seventh debugging patterns according to a preset first exposure parameter;

determining that a seventh feature of the seventh debug pattern meets a preset exposure threshold;

determining a second exposure parameter based on the seventh feature meeting the preset exposure threshold;

controlling the camera assembly to carry out second shooting debugging and obtain a plurality of corresponding eighth debugging patterns according to the second exposure parameters;

determining that an eighth feature of the eighth debug pattern meets the preset exposure threshold;

determining a target exposure parameter based on the eighth feature meeting the preset exposure threshold;

capturing target features in the photographed object based on the target exposure parameters;

determining whether the target feature is consistent with a preset exposure feature;

and if not, compensating the camera assembly to enable the target feature to be consistent with the preset exposure feature.

10. A debugging and monitoring method in accordance with claim 9,

the first exposure parameter includes a gain value and an exposure value, and the second exposure parameter includes a gain value and an exposure value.

11. A debugging and monitoring method in accordance with claim 1,

before the step of performing the first debugging, the debugging and monitoring method further includes:

performing laser parameter selection to select laser parameters of the laser source;

the performing laser parameter selection includes:

obtaining laser marking parameters, and controlling the laser source to perform first marking on a test medium to form a first marking pattern;

controlling the camera assembly to acquire a first marking parameter of the first marking pattern;

analyzing the first marking parameter and the target marking parameter to obtain a first difference value;

judging that the first difference value exceeds a parameter threshold value;

performing a parameter adjustment step, the performing the parameter adjustment step comprising:

adjusting the laser marking parameters, and controlling the laser source to carry out second marking on the test medium to form a second marking pattern;

controlling the camera assembly to acquire a second marking parameter of the second marking pattern;

analyzing the second marking parameter and the target marking parameter to obtain a second difference value;

if the second difference value is judged to exceed the parameter threshold value, repeating the second marking until the second difference value does not exceed the parameter threshold value;

the laser marking parameters include at least one of marking speed, marking power, and filling pitch.

12. A commissioning and monitoring apparatus for a laser system, the laser system comprising a laser source, a camera assembly, a galvanometer assembly, a machining platform, and a focal length adjustment assembly for adjusting a focal length of the laser source, the commissioning and monitoring apparatus comprising:

the first debugging module is used for executing first debugging so as to enable the camera assembly to finish debugging;

the second debugging module is used for executing second debugging so as to enable the galvanometer component to complete debugging;

the third debugging module is used for executing third debugging so as to enable the focal length of the laser source to finish debugging;

a processing module for controlling the laser source to perform a first process;

the first acquisition module is used for acquiring first laser parameters of the first processing;

and the first judging module is used for judging whether the first laser parameter exceeds a laser threshold value so as to realize the monitoring of the laser system.

13. The debugging and monitoring device according to claim 12,

the debugging and monitoring device further comprises:

and the fourth debugging module is used for executing fourth debugging so as to enable the exposure parameters of the camera component to be debugged.

14. The debugging and monitoring device according to claim 12,

the debugging and monitoring device further comprises:

and the laser parameter selection module is used for executing laser parameter selection so as to select the laser parameters of the laser source.

15. A commissioning and monitoring device for a laser system comprising:

a processor, a memory and a debugging and monitoring program for the laser system stored on the memory and executable on the processor, the debugging and monitoring program being configured to implement the steps of the debugging and monitoring method according to any of claims 1-11.

16. A computer readable storage medium having stored thereon a commissioning and monitoring program for a laser system, which commissioning and monitoring program when executed by a processor implements the commissioning and monitoring method according to any one of claims 1-11.