JP2007334213A - Defective pattern correcting apparatus and defective pattern correcting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a defective pattern correcting apparatus and a defective pattern correcting method for accurately and efficiently correcting a defective pattern. <P>SOLUTION: The defective pattern correcting apparatus is equipped with: an applying mechanism 52 to apply a correcting material onto a defective part of a pattern formed on a substrate; a photographing part 51 to photograph the applying mechanism 52; an image processing part 3 to detect the position of the applying mechanism 52 based on the photographed image of the applying mechanism 52; a positional deviation detecting part 1 to compare the detected position of the applying mechanism 52 and the reference position of the applying mechanism 52 to thereby detect the positional deviation of the applying mechanism 52 based on the result of the comparison; and transfer mechanisms 2, 4, 5, 8 to transfer the applying mechanism 52 based on the positional deviation, wherein after transferred based on the positional deviation, the applying mechanism 52 applies the correcting material onto the defective part of the pattern at the transferred position. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a pattern defect correction apparatus and a pattern defect correction method, and more particularly, to a pattern defect correction apparatus and a pattern defect correction method for correcting a defect part by applying a correction material to a defect part of a fine pattern formed on a substrate. .

  FIG. 14A is a plan view showing a fine pattern formed on the substrate. FIG. 14B is a cross-sectional view showing a fine pattern formed on the substrate. FIG. 15A is a plan view showing a disconnection defect generated in the substrate. FIG. 15B is a cross-sectional view showing a disconnection defect generated in the substrate. Fig.16 (a) is a top view which shows the state in which the correction material was apply | coated to the disconnection defect part. FIG.16 (b) is a top view which shows the state in which the correction material was apply | coated to the disconnection defect part.

  Referring to FIG. 16, the pattern defect correction device corrects the disconnection defect by applying a correction material to the disconnection defect portion.

As a pattern defect correction apparatus for applying a correction material to a substrate such as a color filter, for example, Patent Document 1 discloses the following pattern defect correction apparatus. That is, an image processing means for recognizing a defective portion of the color filter, a laser irradiation means for emitting a laser beam to remove the defect, and an ink applying means including a needle for applying ink to the defective portion of the color filter And a curing unit including a light source that emits light for curing the ink applied by the ink application unit and a lens that collects the light.
Japanese Patent Laid-Open No. 9-61296

  By the way, in order for the pattern defect correction device to apply the correction material to the pattern defect portion such as the disconnection defect portion of the pattern with high accuracy, it is necessary to position the application mechanism for applying the correction material with high accuracy when applying the correction material. is there. Here, in a general pattern defect correction apparatus such as the pattern defect correction apparatus described in Patent Document 1, an indirect position of the coating mechanism is specified to position the coating mechanism. For example, the position of the table on which the coating mechanism is mounted is measured with a scale or the like, and the position of the coating mechanism is specified from the measured table position.

  However, various parts including the table itself are arranged between the table and the application mechanism, and these parts expand or contract under the influence of temperature change, etc., so the position of the application mechanism over time. Will shift. For this reason, it is necessary to apply the correction material on a trial basis each time the pattern defect portion is corrected, and to adjust the position of the coating mechanism based on the application result, so that the correction operation cannot be performed efficiently. There was a problem.

  SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a pattern defect correction apparatus and a pattern defect correction method capable of performing pattern defect correction accurately and efficiently.

  In order to solve the above problems, a pattern defect correction apparatus according to an aspect of the present invention includes an application mechanism that applies a correction material to a defective portion of a pattern formed on a substrate, an imaging unit that images the application mechanism, The image processing unit that detects the position of the coating mechanism based on the photographed image of the coating mechanism is compared with the detected position of the coating mechanism and the reference position of the coating mechanism, and the positional deviation of the coating mechanism is based on the comparison result. A displacement detection unit that detects the amount and a moving mechanism that moves the application mechanism based on the displacement amount, and the application mechanism applies the correction material at the position after the movement based on the displacement amount.

  According to still another aspect of the present invention, there is provided a pattern defect correcting apparatus comprising: an application mechanism that applies a correction material to a defective portion of a pattern formed on a substrate; an observation member coupled to the application mechanism; and an application mechanism. A moving mechanism to be mounted, an imaging unit that images the observed member, an image processing unit that detects the position of the coating mechanism based on the captured image of the observed member, the position of the detected coating mechanism, and the coating mechanism A positional deviation detection unit that compares the reference position and detects the positional deviation amount of the coating mechanism based on the comparison result, the moving mechanism moves the coating mechanism based on the positional deviation amount, and the coating mechanism The correction material is applied at the position after movement based on the amount of deviation.

  Preferably, the pattern defect correction device further includes a storage unit that stores the reference position of the coating mechanism, and the misregistration detection unit compares the detected position of the coating mechanism with the stored reference position, and compares the result. The amount of positional deviation of the coating mechanism is detected based on the above.

  In order to solve the above-mentioned problem, a pattern defect correction method according to an aspect of the present invention is a pattern defect correction method in a pattern defect correction apparatus including a coating mechanism that applies a correction material to a defect portion of a pattern formed on a substrate. The step of photographing the coating mechanism, the step of detecting the position of the coating mechanism based on the photographed image of the coating mechanism, the detected position of the coating mechanism and the reference position of the coating mechanism are compared, Using the application mechanism at the position after the movement based on the positional deviation amount, the step of moving the application mechanism based on the positional deviation amount, the position deviation detection step of detecting the positional deviation amount of the application mechanism based on the comparison result, Applying a correction material to a defective portion of a pattern formed on the substrate.

  A pattern defect correction method according to still another aspect of the present invention is a pattern defect correction method in a pattern defect correction apparatus including a coating mechanism that applies a correction material to a defect portion of a pattern formed on a substrate. A step of photographing the observation member coupled to the mechanism, a step of detecting the position of the coating mechanism based on the photographed image of the observation member, and the detected position of the coating mechanism and the reference position of the coating mechanism. The positional deviation detection step of comparing and detecting the positional deviation amount of the coating mechanism based on the comparison result, the step of moving the coating mechanism based on the positional deviation amount, and the application mechanism at the position after the movement based on the positional deviation amount And applying a correction material to the defective portion of the pattern formed on the substrate.

  Preferably, the pattern defect correction method further includes a step of storing a reference position of the coating mechanism, and in the misalignment detection step, the detected position of the coating mechanism is compared with the stored reference position, and a comparison result is obtained. The amount of positional deviation of the coating mechanism is detected based on the above.

  According to the present invention, pattern defect correction can be performed accurately and efficiently.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

<First Embodiment>
[Configuration and basic operation]
FIG. 1 is an external view showing a configuration of a pattern defect correction apparatus according to the first embodiment of the present invention.

  Referring to FIG. 1, this pattern defect correcting apparatus includes a host computer (position shift detection unit) 1, a control computer 2 (movement mechanism), an image processing unit 3, a Z table (movement mechanism) 4, An XY table (moving mechanism) 5, a chuck base 6, a laser irradiation unit 23, a slit unit 24, a monitor 10, an observation optical mechanism (imaging unit) 51, and a coating mechanism 52 are provided. The observation optical mechanism 51 includes an objective lens 21 and a CCD (Charge Coupled Devices) camera 22.

The host computer 1 controls the entire pattern defect correction apparatus.
The control computer 2 controls each unit mounted on the pattern defect correction apparatus.

  The observation optical mechanism 51 is for observing a fine pattern on the substrate, and images the substrate through the objective lens 21 with the CCD camera 22.

  The image processing unit 3 captures an image of the substrate taken by the observation optical mechanism 51 and performs image processing.

  The Z table 4 moves to change the height of the laser irradiation unit 23, the slit unit 24, the observation optical mechanism 51, and the coating mechanism 52 with respect to the XY table 5. The XY table 5 changes the position of the substrate in the horizontal direction and the vertical direction. That is, the XY table 5 changes the positions of the observation optical mechanism 51 and the coating mechanism 52 in the horizontal direction and the vertical direction with respect to the substrate.

The chuck table 6 is a table on which a substrate to be corrected is placed and fixed.
The laser irradiation unit 23 irradiates the substrate with laser light through a slit formed by the slit unit 24.

The application mechanism 52 applies a correction material for correcting defects to the substrate.
The monitor 10 displays an image of the substrate taken by the image processing unit 3.

  Although the observation optical mechanism 51 is shown in a simplified manner in FIG. 1, in reality, a path for the CCD camera is branched from the middle of the path between the objective lens 21 and the slit portion 24. A CCD camera 22 is arranged at the end point of the path for the CCD camera. A dichroic mirror is disposed near the branch point of both paths in order to allow the substrate to be irradiated with laser light and to capture the substrate. In addition, when the path for the CCD camera is not a straight line, a mirror for refracting light is appropriately disposed. Similarly, the configuration of the observation optical mechanism 51 will be described and illustrated in a simplified manner.

  FIG. 2 is a diagram showing in detail a portion that performs correction processing in the pattern defect correction apparatus according to the first embodiment of the present invention.

  With reference to FIG. 2, an observation optical mechanism 51 and a coating mechanism 52 are mounted on the Z table 4.

  The procedure for correcting the pattern defect portion is as follows. First, the control computer 2 controls the XY table 5 and the Z table 4 to move the observation optical mechanism 51 to a position where the observation optical mechanism 51 can observe the pattern defect portion.

  The image processing unit 3 acquires a fine pattern image on the substrate taken by the CCD camera 22 in the observation optical mechanism 51, and specifies an accurate position of the pattern defect portion based on the acquired fine pattern image.

  The control computer 2 controls the XY table 5 and the Z table 4 to move the coating mechanism 52 to the position of the pattern defect portion specified by the image processing unit 3. Then, the control computer 2 controls the application mechanism 52 to apply the correction material to the pattern defect portion.

FIG. 3 shows the observation optical mechanism 51 and the coating mechanism 52 in detail.
The observation optical mechanism 51 includes the objective lens 21 and the CCD camera 22. The coating mechanism 52 includes a coating unit 7 and a coating unit moving mechanism 8.

  The application part moving mechanism 8 mounts the application part 7 and changes the position of the application part 7 by moving.

[Operation]
4A to 4C are diagrams illustrating an operation for calculating the positional deviation amount of the coating mechanism 52. FIG.

  The application part moving mechanism 8 moves the application part 7 in the height direction from the initial position (FIG. 4A) (FIG. 4B) and moves it horizontally to be positioned at the focal point of the observation optical mechanism 51. (FIG. 4C).

The observation optical mechanism 51 images the application unit 7 with the CCD camera 22.
The image processing unit 3 captures the captured image of the coating unit 7 and detects the position of the coating mechanism 52 based on the captured image.

  The host computer 1 includes a storage unit (not shown) that stores the reference position of the coating mechanism 52. The reference position of the coating mechanism 52 is, for example, a position where the position of the coating mechanism 52 is not shifted, that is, when the coating mechanism 52 has applied the correction material to the substrate, the application material that can accurately apply the correction material to the target location. This is the position of the mechanism 52.

  The host computer 1 compares the position of the coating mechanism 52 detected by the image processing unit 3 with the reference position of the coating mechanism 52 stored in a storage unit (not shown), and calculates the positional deviation amount of the coating mechanism 52 based on the comparison result. To detect. For example, the host computer 1 determines the difference between the detected position of the coating mechanism 52 and the reference position of the coating mechanism 52 as the positional deviation amount of the coating mechanism 52. Then, the host computer 1 notifies the control computer 2 of the displacement amount of the coating mechanism 52.

FIGS. 5A to 5C are diagrams illustrating an operation for correcting a pattern defect portion.
Referring to FIGS. 5A to 5C, first, the control computer 2 controls the XY table 5 and the Z table 4 to move the coating mechanism 52 to the position of the pattern defect portion specified by the image processing unit 3. Is moved (FIG. 5A).

  Then, the control computer 2 controls the application part moving mechanism 8 to move the application part 7 above the correction material application position. At this time, the control computer 2 controls the application unit moving mechanism 8 to move the application unit 7 based on the amount of positional deviation notified from the host computer 1. The control computer 2 may further be configured to move the entire coating mechanism 52 by controlling the XY table 5 and the Z table 4 based on the amount of positional deviation (FIG. 5B). .

  Then, the control computer 2 controls the application part moving mechanism 8 to move the application part 7 downward to the correction material application position. The application mechanism 52 applies the correction material to the pattern defect portion after the correction, that is, the position after the movement based on the positional deviation amount (FIG. 5C).

  FIG. 6A is a diagram illustrating an image of the application unit 7 at the reference position of the application mechanism 52. (B) is a figure which shows the image of the application part 7 before position correction at the time of apply | coating correction material.

  FIG. 6A shows a corner portion A of the application unit 7 photographed by the CCD camera 22. FIG. 6B shows a corner portion B of the coating unit 7 photographed by the CCD camera 22.

FIG. 7 is a diagram showing a positional shift of the application unit 7.
Referring to FIG. 7, corner portion B is offset from corner portion A by KX in the X direction, and is offset by KY in the Y direction. That is, the coating mechanism 52 before position correction when the correction material is applied is shifted by KX in the X direction with respect to the reference position of the coating mechanism 52 and is shifted by KY in the Y direction. The shift amount of the corner portion B can be detected, for example, based on how many pixels the corner portion B is shifted from the corner portion A on the image in each of the X direction and the Y direction.

FIG. 8 is a diagram illustrating a shift in the application position of the correction material.
Referring to FIG. 8, the actual application position D is shifted from the target application position C due to the position shift of the application mechanism 52.

  FIG. 9 is a plan view showing a state of the substrate on which the correction material is applied without performing position correction when the application mechanism 52 is displaced.

  Referring to FIG. 9, the correction material is not accurately applied to the disconnection defect portion of the pattern due to the displacement of the application mechanism 52.

FIG. 10 is a diagram showing how the correction material application position is corrected.
Referring to FIG. 10, control computer 2 controls application portion moving mechanism 8 to correct the position of application mechanism 52 by KX in the X direction and by KY in the Y direction. Thereby, the application position of the correction material approaches the target application position C from D.

  FIG. 11 is a plan view showing a state in which the correction material is applied to the substrate after the position of the application mechanism 52 is corrected.

  Referring to FIG. 11, the correction material is accurately applied to the broken portion of the pattern by correcting the position of the application mechanism 52.

  By the way, in a general pattern defect correction apparatus such as the pattern defect correction apparatus described in Patent Document 1, the position of the coating mechanism shifts with time, so that it is corrected on a trial basis every time the pattern defect portion is corrected. There has been a problem that the material must be applied and the position of the application mechanism must be adjusted based on the application result, so that the correction work cannot be performed efficiently. However, in the pattern defect correction apparatus according to the first embodiment of the present invention, the observation optical mechanism 51 captures an image of the coating mechanism 52. The image processing unit 3 detects the position of the coating mechanism 52 based on the captured image of the coating mechanism 52. The host computer 1 compares the detected position of the coating mechanism 52 with the reference position of the coating mechanism 52, and calculates the amount of displacement of the coating mechanism 52 based on the comparison result. The control computer 2 corrects the position of the coating mechanism 52 by controlling the coating unit moving mechanism 8, the XY table 5, and the Z table 4 based on the calculated displacement amount. Then, the application mechanism 52 applies the correction material at the corrected position. With such a configuration, the position of the application mechanism 52 can be corrected without performing a trial application of the correction material, so that the pattern defect can be corrected accurately and efficiently.

  Further, since the spread of the applied correction material varies, the conventional method of applying the correction material on a trial basis and adjusting the position of the application mechanism as in the past involves applying the correction material several times, for example. It is necessary to average the application position. However, in the pattern defect correction apparatus according to the first embodiment of the present invention, the position of the coating mechanism only needs to be measured once when the correction material is applied, and the correction work can be performed efficiently.

  Further, since it is not necessary to perform trial application of the correction material, the correction material is not wasted and the correction cost can be reduced.

  Further, since the shape of the coating material changes with time, the correction method of the position of the coating mechanism can be stably performed in the conventional method of applying the correction material on a trial basis and adjusting the position of the coating mechanism. Have difficulty. However, since the pattern defect correction apparatus according to the first embodiment of the present invention corrects the position of the coating mechanism based on the image of the coating mechanism, the position correction of the coating mechanism can be performed stably.

  Next, another embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

<Second Embodiment>
The present embodiment relates to a pattern defect correction apparatus in which the position detection method of the coating mechanism 52 is changed with respect to the pattern defect correction apparatus according to the first embodiment.

  FIG. 12 is a diagram showing a configuration of a pattern defect correction apparatus according to the second embodiment of the present invention.

With reference to FIG. 12, the pattern defect correcting apparatus further includes an observed member 9.
The member to be observed 9 is coupled to the application unit 7.

  The application unit moving mechanism 8 moves the member 9 to be observed and positions it at the focal point of the observation optical mechanism 51.

The observation optical mechanism 51 images the member 9 to be observed with the CCD camera 22.
The image processing unit 3 captures the captured image of the observed member 9 and detects the position of the coating mechanism 52 based on the captured image.

  Other configurations and operations are the same as those of the pattern defect correction apparatus according to the first embodiment. Therefore, in the pattern defect correction apparatus according to the second embodiment of the present invention, the pattern defect correction can be accurately and efficiently performed as in the pattern defect correction apparatus according to the first embodiment.

  Further, in the pattern defect correction apparatus according to the second embodiment of the present invention, the position of the coating mechanism 52 is detected based on the image of the member 9 to be observed. With such a configuration, it is not necessary to extend the stroke of the coating mechanism 52 in order to position the tip portion of the coating unit 7 at the focal point of the observation optical mechanism 51, and it is possible to prevent the structure of the coating mechanism 52 from being restricted. .

  Next, another embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and description thereof will not be repeated.

<Third Embodiment>
The present embodiment relates to a pattern defect correction apparatus in which the configuration for photographing an application mechanism is changed with respect to the pattern defect correction apparatus according to the first embodiment.

  FIG. 13 is a diagram showing a configuration of a pattern defect correction apparatus according to the third embodiment of the present invention.

  Referring to FIG. 13, the pattern defect correcting device further includes an observation optical mechanism 61 and a coating mechanism 62 instead of the coating mechanism 52. The application mechanism 62 does not include the application part moving mechanism 8.

  The observation optical mechanism 61 includes a CCD camera (not shown), and images the coating unit 7 with the CCD camera.

  The image processing unit 3 captures the captured image of the coating unit 7 and detects the position of the coating mechanism 62 based on the captured image.

  Other configurations and operations are the same as those of the pattern defect correction apparatus according to the first embodiment. Therefore, in the pattern defect correction apparatus according to the third embodiment of the present invention, the pattern defect correction can be accurately and efficiently performed as in the pattern defect correction apparatus according to the first embodiment.

  In addition, the pattern defect correction apparatus according to the third embodiment of the present invention further includes an observation optical mechanism 61 that images the application unit 7. With such a configuration, it is not necessary to move the coating unit 7 to the focal position of the observation optical mechanism 51, and it is possible to prevent the structure of the coating mechanism 52 from being restricted.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is an external view which shows the structure of the pattern defect correction apparatus which concerns on the 1st Embodiment of this invention. It is a figure which shows in detail the part which performs a correction process in the pattern defect correction apparatus which concerns on the 1st Embodiment of this invention. It is a figure which shows the observation optical mechanism 51 and the application | coating mechanism 52 in detail. (A)-(c) is a figure which shows the operation | movement which calculates the positional offset amount of the application | coating mechanism 52. FIG. (A)-(c) is a figure which shows the operation | movement which corrects a pattern defect part. (A) is a figure which shows the image of the application part 7 in the reference position of the application | coating mechanism 52. FIG. (B) is a figure which shows the image of the application part 7 before position correction at the time of apply | coating correction material. It is a figure which shows the position shift of the application part. It is a figure which shows the shift | offset | difference of the application position of correction material. It is a top view which shows the state of the board | substrate which apply | coated correction material, without performing position correction, when position shift has arisen in the application | coating mechanism 52. FIG. It is a figure which shows a mode that the application position of correction material is correct | amended. It is a top view which shows the state which apply | coated correction material to the board | substrate after correct | amending the position of the application | coating mechanism 52. FIG. It is a figure which shows the structure of the pattern defect correction apparatus which concerns on the 2nd Embodiment of this invention. It is a figure which shows the structure of the pattern defect correction apparatus which concerns on the 3rd Embodiment of this invention. (A) is a top view which shows the fine pattern formed on the board | substrate. (B) is sectional drawing which shows the fine pattern formed on the board | substrate. (A) is a top view which shows the disconnection defect which generate | occur | produced in the board | substrate. (B) is sectional drawing which shows the disconnection defect which generate | occur | produced in the board | substrate. (A) is a top view which shows the state by which correction material was apply | coated to the disconnection defect part. (B) is a top view which shows the state in which the correction material was apply | coated to the disconnection defect part.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Host computer (position shift detection part), 2 Control computer (movement mechanism), 3 Image processing part, 4 Z table (movement mechanism), 5 XY table (movement mechanism), 6 Chuck base, 7 Application | coating part, 8 Application | coating Part moving mechanism, 9 member to be observed, 10 monitor, 21 objective lens, 22 CCD camera, 23 laser irradiation part, 24 application part moving mechanism, 51, 61 observation optical mechanism (imaging part), 52, 62 application mechanism.

Claims (6)

An application mechanism for applying a correction material to a defective portion of a pattern formed on a substrate;
An imaging unit for imaging the application mechanism;
An image processing unit for detecting the position of the coating mechanism based on the photographed image of the coating mechanism;
A displacement detection unit that compares the detected position of the application mechanism with a reference position of the application mechanism, and detects the amount of displacement of the application mechanism based on the comparison result;
A moving mechanism that moves the coating mechanism based on the amount of displacement,
The coating mechanism is a pattern defect correction device that applies the correction material at a position after movement based on the positional deviation amount. An application mechanism for applying a correction material to a defective portion of a pattern formed on a substrate;
An observation member coupled to the coating mechanism;
A moving mechanism on which the coating mechanism is mounted;
An imaging unit for imaging the observed member;
An image processing unit that detects the position of the coating mechanism based on the photographed image of the observed member;
A positional deviation detection unit that compares the detected position of the coating mechanism with a reference position of the coating mechanism and detects a positional deviation amount of the coating mechanism based on the comparison result;
The moving mechanism moves the coating mechanism based on the positional deviation amount,
The coating mechanism is a pattern defect correction device that applies the correction material at a position after movement based on the positional deviation amount. The pattern defect correction device further includes a storage unit that stores a reference position of the coating mechanism,
The position deviation detection unit compares the detected position of the coating mechanism with the stored reference position, and detects a position deviation amount of the coating mechanism based on the comparison result. Pattern defect repair device. A pattern defect correction method in a pattern defect correction apparatus comprising an application mechanism for applying a correction material to a defect portion of a pattern formed on a substrate,
Photographing the application mechanism;
Detecting the position of the coating mechanism based on the photographed image of the coating mechanism;
A displacement detection step of comparing the detected position of the application mechanism with a reference position of the application mechanism, and detecting a displacement amount of the application mechanism based on the comparison result;
Moving the coating mechanism based on the displacement amount;
Applying a correction material to a defect portion of a pattern formed on the substrate using the coating mechanism at a position after movement based on the displacement amount. A pattern defect correction method in a pattern defect correction apparatus comprising an application mechanism for applying a correction material to a defect portion of a pattern formed on a substrate,
Photographing a member to be observed coupled to the coating mechanism;
Detecting the position of the application mechanism based on the photographed image of the observed member;
A displacement detection step of comparing the detected position of the application mechanism with a reference position of the application mechanism, and detecting a displacement amount of the application mechanism based on the comparison result;
Moving the coating mechanism based on the displacement amount;
Applying a correction material to a defect portion of a pattern formed on the substrate using the coating mechanism at a position after movement based on the displacement amount. The pattern defect correction method further includes a step of storing a reference position of the coating mechanism,
6. In the positional deviation detection step, the detected position of the coating mechanism is compared with the stored reference position, and the positional deviation amount of the coating mechanism is detected based on the comparison result. The pattern defect correction method as described.

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