JP2011025316A - Defect correction device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a defect correction device where a defect on a substrate is detected, in accordance with the position and defect conditions on a circuit at which the defect has been generated, an emission inhibit area where correction is not performed is set, and, in accordance with the setting, the defect is corrected. <P>SOLUTION: The defect correction device includes: a defect detection section for detecting a defect generated on a substrate by comparison with a reference image; an inhibit area setting section for setting an inhibit area (KA) of correction for a defect on a drive circuit element and wires; a correction area setting section for setting a defective portion related to the inhibit area (KA) as a non-correction area and setting a defect not related to the inhibit area (KA) as a correction area; and a correction section for correcting only the correction area. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a defect correcting apparatus for correcting a defective portion on a liquid crystal display substrate or a semiconductor substrate.

  Generally, when a circuit element or wiring is formed on a glass substrate used for a liquid crystal display, a defect may occur due to an environment in the manufacturing apparatus such as particles, deposition during thin film formation, or exposure failure.

  Conventional defect detection methods are disclosed in, for example, Patent Document 1 or Patent Document 2, respectively. In the defect detection method of Patent Document 1, a periodically arranged pattern is read as image data by an image sensor, and compared with normal image data (circuit pattern), a different portion is detected as a defect. In addition, the defect detection method disclosed in Patent Document 2 scans a periodically arranged pattern, reads it as a first image with an image sensor, and delays the first image by one cycle. And obtaining a third image delayed by two cycles, and detecting a pattern defect by comparing the first image and the second image at the same time and comparing the second image and the third image. ing.

JP-A-4-316346 Kaihei 10-253332

  These defects may cause a malfunction due to an electrical short circuit or disconnection when the product is completed as a finished product, and may cause the product to be defective. For this reason, defect detection / correction is performed in which those defects are detected in the manufacturing process, and the defective portion is irradiated with a laser beam to be repaired.

  These well-known defect correction methods are methods in which, when a detected defect is corrected, it is simply corrected if there is a defect. If a circuit element or wiring is present under or in contact with a defect that is irradiated with laser light for repair, the circuit element or wiring may be damaged or removed together with the defect to create a new defect. There is sex.

  Therefore, when a defect is detected on the substrate, in order to grasp the positional relationship with the circuit element and prevent damage to the circuit element and the wiring, it is determined whether the laser light can be irradiated, the irradiation light amount and It is desirable to adjust the irradiation area.

  In addition, when there is a limit on the time required for correction, it is classified into a serious defect that affects the operation and performance, a defect that can be corrected in a later manufacturing process, or a defect that does not affect the performance. It is desirable to efficiently process the data by assigning priority rankings.

  An object of the present invention is to detect a defect on a substrate, set an irradiation prohibited area that is not corrected according to the position on the circuit where the defect has occurred and the defect state, and correct the defect according to this setting. It is to provide a defect correction apparatus.

    In order to achieve the above object, a defect correction apparatus for correcting a defect on a substrate by irradiating a laser beam, the defect detection unit for detecting a defect existing on the substrate, and a prohibited region for prohibiting the correction, A prohibited area setting unit that is set on the substrate, and a correction area setting unit that determines whether or not the defect detected by the defect detection unit relates to the prohibited region, and sets correction prohibition for the defect related to the prohibited region And a correction unit that corrects the defect except for the defect whose correction is prohibited by the correction region setting unit by irradiating the laser beam on the defect.

  According to the defect correction apparatus of the present invention, it is possible to reliably correct important defects that must be corrected. Moreover, it is possible to reduce or prevent damage to circuit elements and wirings by setting prohibited areas that are not corrected.

FIG. 1 is a schematic block diagram showing a defect correction apparatus according to a first embodiment of the present invention. FIG. 2 is a schematic top view showing a substrate to be corrected. FIG. 3 is a schematic diagram showing priority areas. FIG. 4 is a schematic view showing a pattern on the substrate in FIG. FIG. 5 is a schematic diagram showing priority areas aligned with defects on the pattern in FIG. FIG. 6 is a block diagram schematically showing a defect correction apparatus having a defect detection function according to the first embodiment. FIG. 7 is a schematic view showing a substrate. FIG. 8 is a schematic diagram showing a defect-free pattern in the substrate in FIG. FIG. 9 is a schematic diagram illustrating a reference image in which a laser repair prohibition area is set. FIG. 10 is a schematic view showing a pattern including a defect. FIG. 11 is a block diagram schematically showing a defect correcting apparatus according to the second embodiment. FIG. 12 is a schematic diagram showing a reference image in which a plurality of laser repair prohibition areas are set. FIG. 13 is a schematic view showing a pattern having a defect and a processing area set. FIG. 14 is a schematic diagram showing a pattern after the defect portion in FIG. 13 is corrected. FIG. 15 is a schematic diagram illustrating a pattern in which a processing area is set. FIG. 16 is a schematic view showing a pattern having a defect.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
First, a description will be given of a defect correction method in which correction priority is provided to a plurality of detected defects by the defect correction apparatus according to the first embodiment of the present invention. FIG. 1 is a block diagram showing a schematic configuration example of a defect correction apparatus for realizing this defect correction method. FIG. 2 is a diagram illustrating an example of a substrate for correcting a defect.

  Note that the picture elements (or pixels) described below are arranged on a substrate in a matrix shape, and include, for example, a light-emitting portion in which a periphery formed on a glass substrate of a liquid crystal display (LCD) is surrounded by wiring or the like. The minimum unit of the pattern is shown. In addition, defects to be subjected to this defect correction are defects generated in a photolithography process in which patterning is exposed with a resist mask on a glass substrate (hereinafter simply referred to as a substrate) used in a liquid crystal display (LCD). Take an example.

  As shown in FIG. 2, the substrate is formed so that the scanning line 21 and the signal (data) line 22 are orthogonal to each other, and a circuit element 23 such as a TFT is provided in a portion surrounded by these wirings. For the sake of explanation, as shown in FIG. 2, it is assumed that defects 24a, 24b, and 24c exist on the substrate. FIG. 3 shows a structure of one picture element composed of a scanning line 21 and a data line (signal line) 22 surrounding the periphery, and a pattern in which this picture element is repeatedly arranged in a matrix form, a so-called repetitive pattern. ing.

The defect correction apparatus 1 shown in FIG. 1 is roughly composed of a correction unit 2, a control unit 3, and a correction area setting unit 4.
The correction unit 2 corrects the defect by outputting a laser beam for correcting the defect. The correction unit 2 can arbitrarily change the energy density (light intensity) of the laser beam output, the irradiation region (area), and the irradiation surface shape according to the size of the defect. The control unit 3 is connected to the correction unit 2 and the correction area setting unit 4 and controls them.

  The correction area setting unit 4 includes an imaging unit 6, a memory 8, a defect detection unit 7, a feature extraction unit 9, and a priority setting unit 5. Among these, the imaging unit 6 may be a line type imaging unit in which imaging elements such as CCDs are arranged in a line, or may be an area type imaging unit in which imaging elements are two-dimensionally arranged. Further, the imaging unit 6 is configured to be movable in the X and Y directions, and can perform imaging on the entire substrate. In addition, if the imaging part 6 can image the width dimension of a board | substrate, it can also image the whole board | substrate by scanning a board | substrate in a uniaxial direction. The imaging unit 6 is connected to the memory 8, and the captured image data is stored in the memory 8.

  The defect detection unit 7 acquires a defect on the substrate from the image data by a known defect detection method described in Patent Document 1 and Patent Document 2. Specifically, the defect detection unit 7 reads the image data captured by the imaging unit 6 from the memory 8 and compares the difference with a reference image (reference image) pattern that is stored in advance as a criterion for quality determination. The determined area is determined as a defect, and the defect data is stored in the memory 8.

  In addition, a defect may constitute not only one picture element but one defect across a plurality of picture elements. In such a case, the defect detection unit 7 labels the adjacent defective pixel groups as one group. The labeled defect is stored in the memory 8 as defect data including position information of each pixel (defective pixel) and luminance value information obtained by imaging. The feature extraction unit 9 reads defect data from the memory 8 and extracts each defect feature. This defect feature depends on one or a combination of the defect size, shape, luminance value obtained by imaging, and defect position information.

The priority setting unit 5 includes a defect determination unit 10 and a priority order setting unit 11.
First, the defect determination unit 10 performs initial setting. That is, when making the determination, a determination criterion used for determination of availability is set in advance. The defect determination unit 10 determines whether or not the detected defect needs to be corrected by laser light irradiation based on this determination criterion. The determination criterion is at least one of the size, shape, position, and luminance value of the defect. This discrimination criterion can be arbitrarily set by the user. For example, the brightness value of a defect caused by particles, the size of a defect that does not need to be corrected, position information in a pattern, and the like are used as a discrimination level (threshold) Is set.

  This determination is a serious defect in which the completed product becomes a defective product due to malfunction if the defect is not corrected by laser light, or can be removed in a later process, such as a particle cleaning process, or corrected. It is determined whether the defect does not cause a problem even if it is not. In addition, examples of defects that cannot be corrected by laser light irradiation include, for example, a pattern shift, a missing pattern, or a large number of defect correction points. If there are a large number of correction points, it is desirable to correct all defects. However, if the correction is not completed within the time set by the user in consideration of the time required for correction, it is determined that the correction cannot be made and is subject to rework processing. Shall. For these defects, rework processing is performed by returning to the previous step. This rework process includes a process of processing a defective pattern itself as a defective portion, a process of applying a resist again and patterning.

  When there are a plurality of defects, the priority of the correction order, that is, the priority order is set by collating with this priority area. Note that the user can set the number of correction points, and limit the number of corrections in consideration of the time required for correction, or limit the number of corrections according to priority.

  In accordance with the determination result, the defect determination unit 10 excludes defects such as particles that do not need to be corrected from defects to be corrected, and stores only defect data that needs correction in the memory 8 as correction target defect data. When the determined defect becomes a rework process target, the determination process is terminated at that time, and the substrate is returned to the previous step. Further, the defect data to be corrected may be sent directly to the priority setting unit 11 without being stored in the memory 8. Further, the defect determination unit 10 can set the number of correction points by the user, and can limit the number of corrections in consideration of the time required for correction.

  Next, the priority order setting unit 11 performs weighting (priority setting) on the defects so as to correct important defects. The priority order setting unit 11 acquires correction target defect data from the memory 8 after the completion of the discrimination process, and sets priority for each correction target defect in the order of correction by laser light irradiation. Specifically, the priority order setting unit 11 acquires image data (pattern image) of one pattern from the image data in the memory 8 and prioritizes according to circuit elements and wirings arranged in the pattern image. The priority area to be corrected is set. Of course, this priority area may be preset by the user. At least one priority area is set. When a plurality of priority areas are set, the priority order is determined for each priority area.

  Further, when there are a plurality of defects, the priority is set by collating with this priority area. Note that the user can limit the number of corrections according to the priority. The limitation on the number of corrections may be determined by the defect determination unit 10 and the priority order setting unit 11 as defects to be corrected up to the order in which corrections are completed within a predetermined time when corrections are made in order of priority. .

  As a method for determining a region having a high priority, for example, it is a determination criterion that a normal operation and a stable operation are realized over a long period of time (product life in design). As an example of priority, for example, in the case of a liquid crystal display, it is most important to correct a defect that causes a failure in the formation of the drive circuit element 23 such as a pixel transistor or a defect that disables driving. Next, it is important to correct electrical short-circuit defects from other circuits and electrical paths such as wiring and electrodes. Subsequently, the defect is the order of the defect that breaks the wiring, the defect on the light emitting portion, and the like. In addition, when a defect covers two priority areas, the higher priority area is determined as a reference.

Next, the operation of acquiring defects on the substrate in the defect correcting apparatus 1 configured as described above will be described in the order of steps.
[Image acquisition process]
The defect correction apparatus 1 stores image data of the substrate imaged by the imaging unit 6 or the substrate by scanning and moving in the memory 8.

[Defect detection process]
After the image acquisition process is completed, a defect detection process is subsequently performed. In this defect detection step, the defect detection unit 7 detects a defect portion by comparing the image data with a reference image (reference image) provided in advance, generates defect data to be corrected, and stores it in the memory 8.

[Feature extraction process]
The feature extraction unit 9 reads defect data from the memory 8 and extracts the defect size, shape, overall luminance, and defect position as defect features from each defect data. The feature extraction unit 9 stores the extracted defect feature in the memory 8 in association with the defect data.

[Defect determination process]
The defect determination unit 10 determines whether it is necessary to correct each defect. Specifically, the defect determination unit 10 reads the defect feature in each defect data from the memory 8 and determines whether or not the defect needs to be corrected by laser light irradiation based on the determination criterion as described above. Is determined.
In this defect determination step, defect image data related to defect data that needs to be corrected is stored in the memory 8 as correction target defect data.

[Priority area setting process]
A priority area for correction is set for the correction target defect data.
In the present embodiment, an example in which three priority areas are set will be described as shown in FIG. In this example, in order of priority, the first priority area A1 includes the circuit element 23 and a part of the wirings 21 and 22, the second priority area A2 includes the wirings 21 and 22, and the third priority area. The area A3 has three priority areas, which are the light-emitting portions surrounded by the wirings 21 and 22.

[Priority setting process]
Next, priority is set for the defect data to be corrected. The priority (priority order) is set by applying the priority to one of the first, second, and third priority areas A1, A2, and A3 described above.

  For example, in the example in which the priority is set for each of the three correction target defect data 24a, 24b, and 24c shown in FIG. 4, the correction target defect data 24a includes the first priority area A1, as shown in FIG. The correction target defect data 24b corresponds to the second priority area A2, and the correction target defect data 24a corresponds to the third priority area A3. Accordingly, the priority order is set in the order of 24a for the first, 24b for the second, and 24c for the third. The set priority is stored in the memory 8 corresponding to each defect data to be corrected.

[Defect correction process]
Next, defect correction by the defect correction apparatus 1 of the present embodiment will be described.
After the above-described defect extraction is completed, the control unit 3 reads correction target defect data from the memory 8 in order of priority. The control unit 3 irradiates the correction target defect data with laser light from the correction unit 2 to the corresponding defect on the substrate, and corrects the correction target defect data up to the set priority order. Priorities can be set in any order from the highest priority. Also, the priority order can be arbitrarily set according to the type and pattern of defects. In this correction, the correction unit 2 specifies the position, size, and shape of the defect on the substrate based on the feature in the correction target defect data, and the light intensity (energy density) and irradiation range are controlled by the control unit 3. Correction is completed by irradiating the defect with the laser beam. This irradiation range is adjusted by moving a light shielding plate or the like as will be described later.

In addition, the defect correction method of this embodiment includes the following effects.
First, based on the determination criteria, the presence or absence of correction is determined, and defects that do not need to be corrected, for example, can be removed by cleaning, are excluded from the correction target, so that the correction can be made more efficient.

  In addition, by changing the discrimination criterion, it is possible to adjust the number of corrections and the presence or absence of correction based on the defect level. Furthermore, when setting the priority, the priority area may be set for all areas in the pattern image, or the priority area may be set for only a part of the pattern. In this case, priority is given to important defects by setting high priority for correction for defects included in priority areas and low priority for defects for non-priority areas. Can be corrected.

  Moreover, although the priority is set for each defect data, the present invention is not limited to this, and it is also possible to use image data for each pattern. Specifically, with respect to the image data for each pattern, it is possible to set the priority order at a time for all the defects in the pattern obtained from the difference by superimposing the image on the template.

  As described above, the defect correction method according to the present embodiment detects defects from captured image data, generates defect data, and further determines whether or not correction is possible. If the defect cannot be corrected as a result of the determination as to whether or not the defect can be corrected, rework processing is performed. If the defect can be corrected, a correction priority is set based on a predetermined priority area. According to the present embodiment as described above, it is possible to reliably detect an important defect and reduce the time and labor required for the operator while realizing a shortening of the correction time by the correction based on the priority.

Next, a defect correction apparatus according to the second embodiment of the present invention will be described.
In the present embodiment, a defect correction method for a correction area in which a laser repair prohibition area by laser light is provided for a detected defect will be described. FIG. 6 is a block diagram illustrating a schematic configuration of a defect correction apparatus according to the second embodiment. FIG. 7 is a diagram illustrating, as an example, a glass substrate used for a liquid crystal display in which pixels are formed in a matrix as a correction target substrate. FIG. 8 is an enlarged view of one picture element in FIG. 7 and shows a configuration in which the circuit element 23 is formed in a region surrounded by the wiring by the data lines and the scanning lines. 9 and 10 are diagrams showing laser repair prohibition regions (dotted lines) in the regions and wirings shown in FIG. 8, parts having the same functions as those in FIG. 4 are given the same reference numerals.

The defect correcting device 30 is roughly composed of a correcting unit 31, an information generating unit 32, an XY table 33, and a control unit 34. First, the correction unit 31 will be described.
The correction unit 31 includes a known laser element 35 that outputs a laser beam for correcting a defect, a laser control unit 36 that drives and controls the laser element 35, an irradiation region (range) of the laser beam, and an irradiation surface shape. It is comprised with the irradiation area adjustment part 37 changed to. The laser element 35 is not particularly limited in the type and wavelength of the laser beam as long as the defect can be corrected.

  The irradiation region adjustment unit 37 is configured by, for example, a plurality of diaphragm blades (not shown) or a light shielding plate similar to the diaphragm mechanism of the camera. The irradiation region adjusting unit 37 is disposed on the emission side of the laser element 35, and adjusts the movement of the diaphragm blades or the light shielding plate, thereby creating a slit-shaped opening and allowing the laser beam to pass therethrough. The size and shape of the irradiation area can be changed. Of course, other known structures may be used as long as other slit-like openings can be formed.

  Next, the information generation unit 32 will be described. The information generation unit 32 includes an imaging unit 6 and a basic information setting unit 38. Among these, the imaging unit 6 includes a semiconductor imaging element such as a CCD (not shown), an optical system whose magnification can be changed, and an image processing circuit under the control of the drive control unit 43 described later, and images the correction target substrate. The imaging unit 6 captures images before and after the correction process at a desired magnification. The captured image is sent to the basic information setting unit 38 as image data.

  The basic information setting unit 38 holds the image data picked up by the image pickup unit 6, and holds a reference pattern that is the same as the circuit pattern formed on the correction target substrate and has no defect as a reference image (reference image). . This reference image is a comparison target when detecting a defect. For example, there is a reference image having a composition of a repeating pattern of a minimum unit of one picture element shown in FIG. Note that a plurality of reference images may be prepared so as to cover all circuit patterns formed on the substrate, and is not necessarily one type. Further, the reference image is stored together with position information on the substrate, and can be used as a template. Furthermore, this reference image may be created exclusively, or a pattern portion having no defect on the processing target substrate may be used as a reference image using image data from the imaging unit 6.

  The basic information setting section 38 has a prohibited area setting section 39 for setting a laser repair prohibited area KA that prohibits laser light irradiation as shown in FIG. In the present embodiment, the element formation region (the range of the dotted line shown in FIG. 9) for forming the circuit element 23 and the wiring composed of the scanning line 21 and the data line 22 as shown in the second reference image is the laser repair prohibition region KA. Set as. Of course, this is an example, and the laser repair prohibition area KA can be set arbitrarily.

In this image processing, when the patterned substrate is imaged and used, the laser repair prohibition area KA indicated by the dotted line in FIG. 9 is used by utilizing the difference in luminance value generated between the wiring and circuit elements and the other portions. It is also possible to set automatically. For example, the laser repair prohibition area KA is set in the wiring and the circuit element by using binarization based on a gradation difference, morphology, or the like.
While viewing this extraction result, the laser repair prohibition area KA may be set by the user's operation, or the user may correct it using a drawing tool that is generally used.

  Next, the XY table 33 will be described. The XY table 33 mounts a correction target substrate, and is moved and scanned by a driving mechanism (not shown) in two-dimensional directions of X and Y directions orthogonal to the optical axis of the imaging lens of the imaging unit 6 and the optical axis of the correction unit 31, respectively. It is configured to be possible. In addition, many holes are opened in the mounting surface of the XY table 33, and it has the function of the board | substrate float by the adsorption holding holding | maintenance by the inhalation | air-intake of air, or the ejection of air. Furthermore, not only the XY table 33 but also the imaging unit 6 and the correction unit 31 may be configured to be able to move and scan in the two-dimensional direction or one of X and Y.

Further, the control unit 34 will be described. The control unit 34 includes an information storage unit 40, a defect detection unit 41, a correction (repair prohibition) region setting unit 42, and a drive control unit 43.
The information storage unit 40 includes a reference information storage unit 40a and a correction target information storage unit 40b. Among these, the reference information storage unit 40a acquires a reference image from the basic information setting unit 38 and stores it as reference information necessary for performing defect correction processing.
On the other hand, the correction target information storage unit 40b stores a patterning-processed image of a correction target substrate having a composition composed of one pattern as shown in FIG.

  The defect detection unit 41 detects a defect by comparing the reference image and the post-patterning image. Further, the defect detection unit 41 sends defect information regarding the position and size of the detected defect to the correction (repair prohibition) region setting unit 42. The correction (repair prohibition) area setting unit 42 determines whether each defect based on the defect information from the defect detection unit 41 is included in the laser repair prohibition area set by the prohibition area setting unit 39. The determination result is sent to the drive control unit 43 as a determination result including defect determination information included in the laser repair prohibited area and defect not included, and the size and position of each defect. The drive control unit 43 controls the correction unit 2 and the XY table 33 based on the determination result, and corrects the defect in the processing target substrate.

Next, the correction of defects by the above-described defect correction apparatus will be described in the order of work steps.
[Preparation process]
First, the defect correction apparatus 1 is activated to initialize each component part. A processing target substrate is placed on the XY table 33. As shown in FIG. 7, for example, a resist mask is patterned on the substrate to be processed. The circuit element 23 is surrounded by wiring composed of scanning lines 21 and data lines 22 provided vertically and horizontally, and surrounded by the wiring. A plurality of pixels (referred to as patterns) composed of picture elements provided with a pixel are arranged in a matrix.

[Reference information input process]
The basic information setting unit 38 of the information generating unit 32 acquires a reference image (an image based on a plurality of patterns and a composition of one pattern) used for defect detection. As described above, the reference image may be obtained by imaging a standard substrate created exclusively, or may be used by imaging a pattern having no defect in the correction target substrate. When a reference image is prepared as image data in advance, the image data is input before initialization at the start is completed. Further, when a reference image is created from the correction target substrate, if it has a defect, the defect-free reference image may be created by removing the defect by known image processing. Note that a plurality of reference images may be prepared so as to correspond to a plurality of patterns formed on the correction target substrate.

  The reference image only needs to be compared with the image of the correction target substrate imaged by the imaging unit 6, and may be image data of 256 gradations or a color image. In addition, a simple pattern can be implemented with low gradation image data such as 16 gradations, and the image format is not particularly limited.

[Prohibited area setting process]
In this step, the laser repair prohibition area KA is set by the prohibition area setting unit 39. In the present embodiment, laser repair is performed on the upper surfaces of the scanning lines 21, the data lines 22, and the circuit elements 23, as shown by the dotted lines in FIG. 9, using the image of the composition with one enlarged pattern shown in FIG. 8. The prohibited area KA is set.

  Further, the laser repair prohibition area KA can be automatically set from the brightness difference using the brightness value information as in the defect extraction in the first embodiment described above. It is also possible to manually set with a drawing tool. This laser repair prohibited area KA is held in the prohibited area setting unit as prohibited area information. Further, a separate storage unit may be provided in the information storage unit 40 and held.

[Defect detection process]
Next, the defect is detected. As described above, the defect detection is performed by reading a reference image from the reference information storage unit 40a, reading a captured image that is a patterning-processed image from the correction target information storage unit 40b, and comparing these images with a difference in luminance. The detected portion is detected as a defect, and the position information on the processing target substrate and the size of the detected defect are detected. Thereafter, the defect size and its position information are sent to the correction (repair prohibited) area setting unit 42.

  In addition, when the defect detection unit 41 automatically extracts using the luminance difference, the defect detection unit 41 superimposes the extracted defect on the photographed image of the correction target substrate so that the user can visually recognize the extraction result, together with the position information. You may display on a monitor.

[Correction area setting process]
The correction (repair prohibition) region setting unit 42 reads the laser repair prohibition region KA as shown in FIG. 9 set from the prohibition region setting unit 39, reads the defect position information from the defect detection unit 41, and stores these information. Overlapping. As a result of this superposition, as shown in FIG. 10, it can be seen that the defect 25a exists on the scanning line 21 which is the laser repair prohibited area KA. It can also be seen that the defect 25b exists on a picture element region not related to the circuit element 23. Accordingly, the correction (repair prohibition) area setting unit 42 generates correction information instructing correction of the defect 25 b without correcting the defect 25 a, and sends the correction information to the drive control unit 43. This correction information is composed only of the size information and position information of the defect to be corrected. As a result, defects whose correction is prohibited are not subject to correction.

[Defect correction process]
The drive control unit 43 moves the XY table 33 and the correction unit 31 based on the defect position information in the correction information from the correction (repair prohibition) region setting unit 42 so that the laser beam of the correction unit 2 is centered on the defect 25b. Move to aim. Next, the drive control unit 43 sends correction information to the laser control unit 36. Based on the size information of the defect 25b in the correction information, the laser control unit 36 sets a laser light irradiation area (irradiation range) 26 as shown in FIG. 10 and sets the light intensity of the laser light. Thereafter, the laser beam is irradiated to remove the defect 25b. Such a correction is performed so that when there are a plurality of defects not included in the laser repair prohibition area KA, the movement distance of the XY table 33 and the correction unit 31 is short, and the correction of the defect is completed in as short a time as possible. It is desirable.

  The defect should be corrected with a light intensity that does not damage the substrate to be corrected and a larger amount of change (removed amount) of the defect by one irradiation. In addition, for example, when the defect is linear and long, and the shape by masking of the irradiation region adjustment unit 37 cannot cover the defect, the defect may be corrected in a plurality of times. In addition, if the defect is large and the light intensity of the laser light for removing this may damage other adjacent parts, the light intensity may be reduced and the laser light may be irradiated multiple times. Good. However, it is necessary to optimize the number of times of irradiation because the processing time becomes longer.

  As described above, the defect correction apparatus according to the present embodiment extracts defects that damage normal parts (for example, wiring, circuit elements, etc.) when the detected defects are corrected. It is possible to prevent damage to a normal part by correcting the defect. It is also possible to image the correction target substrate that has been corrected again, re-extract the defect in comparison with the reference image, and re-correct the defect that has not been corrected outside the laser repair prohibited area. is there.

Next, a defect correcting apparatus according to the third embodiment of the present invention will be described.
In the above-described second embodiment, no correction is performed on the defect portion that is prohibited from being repaired by laser light irradiation, even on the defect portion that is located outside the laser repair prohibited region. On the other hand, in this embodiment, a part that does not enter the laser repair prohibition area due to a defect is deleted and corrected, and the priority of the correction order is set for the defect to be corrected.

  FIG. 11 is a block diagram illustrating a schematic configuration of a defect correction apparatus according to the third embodiment. FIG. 12 is a diagram showing a laser repair prohibition region (dashed line) on the correction target substrate, FIG. 13 is a diagram showing defects on the wiring and circuit elements, and FIG. 14 is a diagram for performing correction to remove the defects. It is a figure which shows the state which carried out. In addition, in the components shown in FIGS. 11 to 14, the same components as those shown in FIGS. 6 to 10 in the second embodiment are denoted by the same reference numerals.

  The defect correcting device 51 of the third embodiment includes a repair area setting unit 53 and a control unit 54 in the basic information setting unit 38 in addition to the components of the defect correcting device 30 of the second embodiment described above. Has a correction area setting unit 44 and a priority setting unit 5. The priority setting unit 5 is the same as that in the first embodiment described above, and a detailed description thereof is omitted here.

  The prohibition area setting unit 39 sets the laser repair prohibition areas KA1 to KA5 for each portion where the electrically separated scanning lines 21, data lines 22, and circuit elements 23 are arranged by dotted lines shown in FIG. The prohibited area setting unit 39 sets identification marks in the set laser repair prohibited areas KA1 to KA5 so that they can be identified. That is, when a defect extends over a plurality of laser repair prohibition areas KA, it can be estimated that the prohibition areas are short-circuited, and the correction priority is increased. For example, as shown in FIG. 13, when there is a defect 27 extending over the scanning line 21 and the circuit element 23, the defect is applied over the laser repair prohibition areas KA3 and KA4 from the prohibition area setting unit 39, thereby causing a short circuit. It is determined that the defect is defective.

  The correction area setting unit 44 includes the size and position information of the defect input from the defect detection unit 41, laser repair prohibited areas KA1 to KA5 by the prohibited area setting unit 39, and laser irradiation area information by the repair area setting unit 53. Based on the above, a laser irradiation area AA is set for the defect 27 as shown in FIG.

Next, defect correction for removing a defective portion that does not enter the laser repair prohibited area in the present embodiment will be described. Here, an example in which a defect exists in the pattern P2 shown in FIG. 13 is used.
In the defect correction apparatus of this embodiment, the correction area setting process is performed after the reference information input process is completed as in the second embodiment.

[Prohibited area setting process]
The prohibition area setting unit 39 sets a plurality of laser repair prohibition areas KA1 to KA5 in the pattern based on the reference image as described above, and holds them as prohibition area information. At this time, the repair area setting unit 53 also holds the laser irradiation area in the pattern of the reference image as repair area information.

[Priority area setting process]
Based on the pattern based on the reference image from the reference information storage unit 40a, a priority area for correction is set. This setting is performed at the same time as or before and after the prohibited area setting step. The setting of the priority area is equivalent to that in the first embodiment described above.

[Defect detection process]
Subsequently, the same defect detection as in the second embodiment described above is performed. In this defect detection, the first reference image is read from the reference information storage unit 40a, read from the correction target information storage unit 40b with the first captured image that is the image after patterning processing, and these images are compared and the difference in luminance is different. The detected portion is detected as a defect, and the position information where the defect is located on the substrate to be processed is further detected. Using this position information, the defect detection unit 41 reads and compares the second reference image and the second captured image, and detects the size of the detected defect. Thereafter, the defect size and its position information are sent to the correction area setting unit 44.

[Correction area setting process]
The size and position information of the defect 27 input from the defect detection unit 41 are input to the correction area setting unit 44. Further, the prohibited area information is read from the prohibited area setting unit 39, and the defect 27 extends over the laser repair prohibited areas KA3 and KA4 as shown in FIG. 13 by superimposing the defect position and the laser repair prohibited areas KA1 to KA5. It can be seen that it exists. That is, since the defect 27 acts to short-circuit the scanning line 21 and the circuit element 23, it is determined that the defect has a high priority.

  Further, the repair area information is read from the repair area setting unit 53, and the laser irradiation area AA is set in a portion that can be corrected by the defect 27. The laser irradiation area AA and the size and position information of the defect 27 are sent to the drive control unit 43 as correction information.

[Priority setting process]
Next, all the defects to be corrected, that is, the defects not related to the laser repair prohibition area and the defects having the correction area (laser irradiation area AA) set in the previous process are corrected in the priority order (priority). Order). This priority setting is equivalent to the setting procedure described in the first embodiment.

[Defect correction process]
Similarly to the first and second embodiments described above, the drive control unit 43 moves the XY table 33 and the correction unit 31 so that the laser beam of the correction unit 31 is centered on the defect or the correction region according to the priority. Move to aim.

  For example, when the laser irradiation area AA applied to the defect 27 has the highest priority, the laser light of the correction unit 2 is moved so as to be aimed at the laser irradiation area AA. Next, the drive control unit 43 sends correction information to the laser control unit 36. The laser control unit 36 sets the light intensity of the laser light based on the size information of the defect 27 (laser irradiation area AA) in the correction information. Then, as shown in FIG. 14, the defect 27 part applied to the laser irradiation area AA is removed by irradiating the laser beam. Thereafter, other defects are also moved according to the priority, aiming at the laser beam of the correction unit 2, irradiating the laser beam with the calculated light intensity, and sequentially removing it.

  As described above, defects that extend over a plurality of laser repair forbidden areas KA exist in picture element areas other than the laser repair forbidden area KA because there is a possibility that the defects may be electrically short-circuited. By partially removing the defect, an electrical short circuit between the scan line, the data line, and the circuit element can be prevented.

Next, a defect correcting apparatus according to the fourth embodiment of the present invention will be described.
The defect correction apparatus according to the present embodiment has the same configuration as the defect correction apparatus according to the third embodiment described above, but the repair area setting unit 53 is different.

  As shown in FIG. 15, in the repair area setting unit 53, the scanning line 21, the data line 22, and the circuit element 23 are set in the laser repair prohibited areas KA1 to KA5, and further, around the circuit element 23 in the picture element area. A laser irradiation area AA is set. For example, in the arrangement example of FIG. 15, the space between the wiring composed of the scanning line 21 and the data line 22 and the circuit element 23 is narrow, and in particular, the data line 22 and a part of the circuit element 23 are narrow. For example, as shown in FIG. 16, the defect 28 is generated in the circuit element 23, but since the end portion of the defect 28 is close to the data line 22, there is a risk of electrical short circuit.

Therefore, by setting the laser irradiation area AA around the circuit element 23, defects that may cause a short circuit are preferentially removed and corrected. Thereby, even if the defect correction apparatus of this embodiment does not straddle a structure part, it can correct | amend the defect which is short-circuited closely and closely. In the present embodiment, the laser irradiation area AA is provided over the entire periphery of the circuit element 23, but it may be set only in a part.
Further, the laser irradiation area AA can be automatically set around the circuit element 23 by image processing, or can be manually set by a drawing tool or the like.

  Further, the laser irradiation area AA is set around the circuit element 23. However, in the pattern, the adjacent wiring and / or circuit element may be set in an adjacent area. In the first to fourth embodiments described above, a glass substrate used for a liquid crystal display is taken as an example of a substrate, and a pattern is made of a resist for forming a drive circuit element such as a transistor, wiring, and electrodes. In the description, one picture element arranged in a matrix is referred to as a repeated pattern. Of course, the present invention is not limited to this, and a silicon substrate used for a semiconductor device may be used.

  Each embodiment described above has been specifically described with reference to the drawings. However, the present invention is not limited to the description of each embodiment described above, and various improvements can be made without departing from the gist of the present invention. Of course, changes may be made.

  DESCRIPTION OF SYMBOLS 1 ... Defect correction apparatus, 2 ... Correction part, 3 ... Control part, 4 ... Correction area setting part, 5 ... Priority setting part, 6 ... Imaging part, 7 ... Defect detection part, 8 ... Memory, 9 ... Feature extraction part DESCRIPTION OF SYMBOLS 10 ... Defect determination part, 21 ... Scanning line, 22 ... Signal (data) line, 23 ... Circuit element, 24a, 24b, 24c ... Defect.

Claims (9)

A defect correction apparatus for correcting defects on a substrate by laser light irradiation,
A defect detection unit for detecting defects present on the substrate;
A prohibited area setting unit for setting a prohibited area for prohibiting correction on the substrate;
A correction region setting unit that determines whether the defect detected by the defect detection unit relates to the prohibited region, and sets a correction prohibition for the defect related to the prohibited region;
A correction unit that corrects the defect outside the prohibited region by irradiating the laser beam; and
A defect correction apparatus comprising: In the defect correction apparatus,
2. The defect correction apparatus according to claim 1, wherein an area of a pattern formed above a drive circuit element provided on the substrate and above a wiring is set as the prohibited area. The correction area setting unit sets a correction prohibition on a defect related to the prohibited area,
The defect correction apparatus according to claim 1, wherein the correction unit irradiates a defect with a laser beam except for the defect whose correction is prohibited. In the defect correction apparatus,
The defect correction apparatus according to claim 1, wherein the correction area setting unit sets a correction prohibition for a defect portion related to the prohibition area. In the defect correction apparatus,
The defect correction apparatus according to claim 1, wherein the correction area setting unit sets a correction area for irradiating a laser beam to an area other than the prohibited area on the substrate. The prohibited area setting unit stores in advance prohibited area information in which a prohibited area is set for the reference image,
The defect correction apparatus according to claim 5, wherein the correction area setting unit sets a correction area based on an inspection image including the defect and the prohibited area information. The defect correction apparatus according to claim 1, wherein the prohibited area setting unit automatically sets the prohibited area based on luminance information of an inspection image. A defect correction apparatus for correcting defects on a substrate by laser light irradiation,
A defect detection unit that images a region to be inspected on the substrate to obtain an inspection image, and detects a defect on the substrate by comparison with a reference image;
A prohibited area setting unit that sets a prohibited area for prohibiting correction in the reference image and stores the prohibited area as prohibited area information;
Based on the prohibited area information and the inspection image, a correction area setting unit that sets a correction area for irradiating the laser beam to an area outside the prohibited area;
A correction unit for irradiating the correction region with the laser beam;
A defect correction apparatus comprising: A defect correction method for correcting a defect on a substrate by laser irradiation,
A defect detection step of capturing an inspection image on the substrate to obtain an inspection image, and detecting a defect on the substrate by comparison with a reference image;
A prohibited area setting step for setting a prohibited area for prohibiting correction in the reference image and storing the prohibited area as prohibited area information;
Based on the prohibited area information and the inspection image, a correction area setting step for setting a correction area for irradiating the laser beam to an area outside the prohibited area;
A correction step of correcting defects by irradiating the correction region with the laser beam;
A defect correction method comprising:

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