TWI325495B - Defect repair system and method of repairing defect - Google Patents

Defect repair system and method of repairing defect Download PDF

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Publication number
TWI325495B
TWI325495B TW093111858A TW93111858A TWI325495B TW I325495 B TWI325495 B TW I325495B TW 093111858 A TW093111858 A TW 093111858A TW 93111858 A TW93111858 A TW 93111858A TW I325495 B TWI325495 B TW I325495B
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Taiwan
Prior art keywords
defect
repair
area
priority
irradiation
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TW093111858A
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Chinese (zh)
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TW200506347A (en
Inventor
Horiuchi Kazuhito
Akiyama Shuji
Abe Masahiro
Onishi Takaaki
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Olympus Corp
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136259Repairing; Defects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Description

1325495 五、發明說明(1) 【發明所屬之技術領域】 本發明係關於修正液晶顯示用面板上或半導體面板上缺陷 部分之缺陷修正裝置及其缺陷修正方法。 【先前技術】 一般而言,液晶顯示螢幕用玻璃面板上,形成回路因 子、配線時,經常會因為製造裝置内的環境,例如:微小 粒子、薄膜形成時的析出、或露光不良等等原因而產生缺 陷。 - 以往的缺陷檢出方法,例如:特開平4_31 6346號公· 報、或特開平1 0 - 2 5 3 3 3 2號公報中所刊載的。特開平 ^31 6346號公報的缺陷檢出方法,乃是利用影像感應器 (image censor)讀取周期性配列的模型(pattern),與正 資;!回路模型)比較後,檢查出,的相異處即是 缺陷之處。另外,特開平1〇_25333 2號公報的缺陷 像威ϊ ϋΓ周期性配列的模型(pattern),再利用影 像α應器(lmage censor)讀取第一影像,對於 像,取得延後1周期的第二细 '、’ 後,同時比較第-影像與第二第三影像 三影,,藉此檢查出模型的缺陷。㈣二影像與第 k些缺陷於製品完成時可能會因為電力 而引起操作不I,造成製品不合格。因此 制或斷線 内檢查出這些缺陷,以 應於製造過程 這些眾所周知的缺陷佟古…t的°卩位予以修復。 缺陷修復方法,在對檢查出的缺陷進行修[Technical Field] The present invention relates to a defect correcting device for correcting a defective portion on a liquid crystal display panel or a semiconductor panel, and a defect correcting method thereof. [Prior Art] In general, when a loop factor or wiring is formed on a glass panel for a liquid crystal display screen, it is often caused by an environment inside the manufacturing apparatus, for example, fine particles, precipitation during film formation, or poor exposure. Produce defects. - For the conventional method of detecting defects, for example, it is published in Japanese Unexamined Patent Publication No. 4_31 6346, or published in the Gazette No. 1 0 - 2 5 3 3 3 2 . The defect detection method of Japanese Laid-Open Patent Publication No. Hei No. No. No. 31-316 is to use an image censor to read a pattern of periodic arrangement, and a capital; After the loop model is compared, it is checked that the difference is the defect. In addition, the defect of the Japanese Patent Publication No. 1-2530 No. 2 is like a pattern of the periodic arrangement of the deterrent, and the first image is read by the image alpha device (lmage censor), and the image is delayed by one cycle. After the second thin ', ', the first image and the second third image are compared at the same time, thereby detecting the defect of the model. (4) The second image and the k-th defect may cause operation failure due to power failure when the product is completed, resulting in product failure. Therefore, these defects are detected in the system or in the disconnection, and are repaired in accordance with the well-known defects of the manufacturing process. Defect repair method, repairing the detected defects

第5頁 明說明(2) _ $時,僅對有缺陷的地方進行修復。修理時雷 、陷下侧、或者相接處,常有回路因子、戈配 田 j易隨著缺陷而損壞、或去除掉回路 成新的缺陷出現。 次配線,造 子之查出面板上有缺陷•,為充分掌握與回路因 可之間的關係’避免造成回路因子或配線的損冑 否照射雷射光、並調整照射光量與照射區域。*、、 2間有所限制時,應分別區分”響操作或性 不陷、與可於後面的製造工程中修復的缺陷、或 些::缺陷等,並且依優先順序、有效率地處理這 【發明内容】 本發明之 在回路上發生 與禁止照射區 陷修復方法。 為達成上 置。包括利用 裝置、與檢查 面板上設定禁 止區域設定部 陷是否與前述 禁止區域有關 目的’‘在於檢查出面板上的缺陷,並散缺陷 的位置、缺陷狀態等,設定修復的優先順序 域,任此設定修復缺陷之缺陷修復裝置與缺 述目的,提供具備下述功能之缺陷修復裝 雷射光照射面板上缺陷進行修復的缺陷修復 出前述面板上缺陷之缺陷械出部、與在前述丨 止照射則述雷射光之照射禁止區域的照射禁 、與判別前述缺陷檢出部檢查出來的前述缺 照射禁止區域有關,對於被判定為與該照射 的缺陷’將該照射禁止區域上方以外之缺陷 1325495 五、發明說明(3) 部分設定為雷射光照射區域的修復區域設定部、以及對前 述雷射光照射區域與前述照射禁止區域無關之缺陷設定修 復優先順序之優先度設定部、與依前述優先度以雷射光照 射缺陷並加以修復的缺陷修復部等。 其次是,提供具備下述工程之缺陷修復方法。包括以 ^ 雷射光照射面板上缺陷進行修復的缺陷修復裝置並檢查出 人 前述面板上缺陷的缺陷檢出工程、與在前述面板上設定禁 止照射前述雷射光之照射禁區域的照射禁止區域設定工 程、與判別前述缺陷檢出工程中出現的前述缺陷是否與前 述照射禁止區域有關之照射禁止區域判別工程、與對於在丨| 前述照射禁止區域判別工程中被判定為與前述照射禁止區 域有的缺陷,設定該照射禁止區域上方缺陷部分以外之雷 射光照射區域的修復區域設定工程、以及對前述雷射光照 射區域與前述照射禁止區域為關之缺陷設定修復優先順序 之優先度設定工程、與依前述優先度以雷射光照射缺陷並 加以修復的缺陷修復工程等。 【實施方式】 以下,就有關本發明實施形態,參照圖示進行說明。 首先,依據本發明第一實施形態相關之缺陷修復裝置,設 t 定複數檢出之缺陝之修復優先度,就其缺陷修復方法加以 說明之。圖一,為實現缺陷修復方法之缺陷修復裝置概略 構成實例的塊狀圖。另外,圖二則為修復缺陷之面板實例 示意圖。此外’以下記載的圖像元素(或畫素),包括呈Page 5 Explain (2) _ $, only repair the defective place. At the time of repair, the mine, the sinking side, or the junction, there is often a loop factor, and the land is damaged by the defect, or the circuit is removed to form a new defect. The secondary wiring is defective in the panel of the manufacturer. In order to fully grasp the relationship between the circuit and the circuit, it is necessary to avoid damage to the circuit factor or wiring. Do not illuminate the laser beam and adjust the amount of illumination and the irradiation area. *, and 2 when there are restrictions, should distinguish between "sound operation or sexuality, and defects that can be repaired in the subsequent manufacturing engineering, or some: defects, etc., and handle this efficiently and in order of priority SUMMARY OF THE INVENTION The present invention relates to a method for repairing a non-irradiation zone in a loop. In order to achieve an upper position, the use of the device and the setting of the forbidden region setting portion on the inspection panel are related to the prohibited region. Defects on the panel, the position of the defect, the defect status, etc., set the priority field of the repair, and set the defect repairing device and the purpose of the defect to repair the defect, and provide the defect repairing laser light irradiation panel with the following functions. A defect in which the defect is repaired is repaired by the defective mechanical portion of the defect on the panel, and the irradiation prohibition region in which the laser light is prohibited in the irradiation of the stop light, and the aforementioned defective irradiation prohibited region detected by the defect detecting portion is discriminated Regarding the defect determined to be the defect with the irradiation, the defect other than the irradiation prohibited area is 132549 (5) The repair area setting unit set as the laser light irradiation area, and the priority setting unit for setting the repair priority order for the defect irrespective of the irradiation light irradiation area and the irradiation prohibition area, and the priority A defect repairing portion that irradiates a defect with laser light and repairs it, etc. Next, a defect repairing method having the following engineering is provided, including a defect repairing device that repairs a defect on the panel by laser light and detects the panel on the aforementioned panel a defective defect detection project, an irradiation prohibition region setting process for setting a prohibited area for prohibiting the irradiation of the laser light on the panel, and determining whether the defect occurring in the defect detection project is related to the irradiation prohibited region The area discrimination project and the repair area setting process for setting the laser light irradiation area other than the defect portion above the irradiation prohibition area, and the defect determined to be in the irradiation prohibition area in the irradiation prohibited area discrimination process, and Irradiating the aforementioned laser light with The irradiation prohibition region sets a priority setting process for the repair priority of the defect, and a defect repair process for irradiating the defect with the laser light according to the priority, and repairing the defect. [Embodiment] Hereinafter, with respect to the embodiment of the present invention, First, according to the defect repairing device according to the first embodiment of the present invention, the repair priority of the missing Shaanxi is determined, and the defect repairing method is described. Figure 1 shows the defect. The defect repairing device of the repair method is a block diagram of a schematic example. In addition, FIG. 2 is a schematic diagram of a panel for repairing a defect. In addition, the image elements (or pixels) described below include

1325495 I、發明說明(4) 矩陣狀配置於面板上、反覆成形於液晶顯示螢幕(LCD ) 破璃面板、周圍由配線所包圍的發光部分而為模型的最小 單位。另外,此之缺陷修復的對象缺陷,係指在藉由無線 電測距護罩(radio distance mask)模仿圖形曝光的影像 平版印刷(photo- 1 i thography )工程中,使用於液晶顧示 螢幕(LCD)的玻璃面板(以下簡稱為面板)上所產生的 缺陷。 此之面板,如圖二所示,由掃瞄線21、與信號(資料 )線22垂直相交形成,由這些配線包圍的部分,則設有 TFT等回路因子23。另外,為利於說明,如圖二所示,此 面板上存在著缺陷24a、24b、24c。圖三所示,即是由掃 猫線2 1與資料線(信號線)22包圍四跑形成1個圖像元素 的構造,此之圖像元素為呈矩陣狀反覆配置的模型,形' 所讀的反覆模型。 · 战 圖一所示為缺陷修復裝置1 ’大致上由修復部2、與 制部3、修復區域設定部4所構成。 、上 修復部2 ’發出雷射光’藉以修復缺陷。此之修復部2 , 依缺陷大小等任意發射出雷射光的能量密度(光強度)°、 與照射區域(面積)與照射面形狀。控制部3,接&托 制修復部2與修復區域設定部4。 枝 修復區域設定部4,由攝影部6、記憶體8、缺陷 部7、特徵抽取部9與優先度設定部5所構成。中 = 6,亦可以是CCD等攝影因子呈線狀配列的線型攝影部 攝影因子呈2次it配置的區域型攝影部。再纟,攝影則=1325495 I. DESCRIPTION OF THE INVENTION (4) The smallest unit of the model is placed in a matrix on a panel and overlaid on a liquid crystal display (LCD) glass panel and a light-emitting portion surrounded by wiring. In addition, the defect of the defect repair refers to the use of the LCD screen (LCD) in the image lithography process which simulates the image exposure by the radio distance mask. Defects generated on the glass panel (hereinafter referred to as the panel). As shown in FIG. 2, the panel is formed by the scanning line 21 and the signal (data) line 22 perpendicularly intersecting each other, and the portion surrounded by the wiring is provided with a loop factor 23 such as a TFT. In addition, for the sake of explanation, as shown in Fig. 2, defects 24a, 24b, and 24c exist on the panel. As shown in FIG. 3, it is a structure in which four image elements are surrounded by a sweeping cat line 2 1 and a data line (signal line) 22, and the image elements are arranged in a matrix form, and the shape is Read the repeated model. In the first drawing, the defect repairing device 1' is substantially constituted by the repairing portion 2, the engaging portion 3, and the repairing region setting portion 4. The upper repairing portion 2' emits laser light to repair the defect. The repairing portion 2 arbitrarily emits the energy density (light intensity) ° of the laser light, the irradiation region (area), and the shape of the irradiation surface depending on the size of the defect. The control unit 3 connects the & repair repair unit 2 and the repair area setting unit 4. The branch repair region setting unit 4 is composed of the imaging unit 6, the memory 8, the defect unit 7, the feature extraction unit 9, and the priority setting unit 5. Medium = 6, may be a linear imaging unit in which the photographic factors such as CCD are linearly arranged. The photographic factor is a regional type imaging unit in which the photo factor is arranged twice. Again, photography is =

五、發明說明(5) = 一樣的影像,則可依-轴方向掃晦面板 得的影像衫像。另夕卜,攝影部6與記憶體8接續,攝 付刃办彳夺則儲存於記憶體8中。 缺陷檢出部7,+ 開单乃藉由特開平4-31 6346號公報、特 從影像資料中眾所周知的缺陷檢出方法’ 儲存的Λi買取攝影部6攝得的影像資料,並依預先 差I的1斷基準影像(參考影像)模型進行比較,有 8中、。品即判定為缺陷,並將該缺陷資料儲存於記憶體 另外,缺陷不僅存在於丨個圖像元素中,也有可能同 ::缺Λ同時跨越數個圖像元素的。這種情況下’缺陷檢 :W將相鄰的缺陷畫素群畫分成4。此之被晝分的缺 ,從各晝素(缺陷晝素)的位置資訊與攝影獲得亮度值 貢訊,並構成缺陷資料而儲存於記憶8中❶特徵抽取部9, 自記憶體8中讀取缺陷資料,分別抽取出各自的缺陷特 微^此之缺陷特徵,可從缺陷的大小、形狀、攝影等分別 獲得亮度值與缺陷的位置資訊、或綜合資訊。 優先度設定5,包括缺陷判別部10與優先順位設定部 11° 缺陷判別部10,首先進行原始設定。也就是預先設定 判定時良劣判別基準。缺陷判別部1 〇 ’依據此判別基準, 以雷射光照射檢查出的缺陷’藉此判別是否必須要進行修 復《判別基準,至少是缺陷大小、形狀、位置與亮度值的V. INSTRUCTIONS (5) = For the same image, the image of the image can be swept in the direction of the axis. In addition, the photographing unit 6 is connected to the memory 8, and the photographing blade is stored in the memory 8. The defect detecting unit 7 and the opening of the image data obtained by the photographing unit 6 are prepared by the Λi stored in the "Failure Detection Method" which is known from the Japanese Patent Application Laid-Open No. Hei 4-31 6346. I's 1 off-reference image (reference image) model for comparison, there are 8 medium. The product is judged as a defect, and the defect data is stored in the memory. In addition, the defect exists not only in one image element, but also may intersect several image elements simultaneously with the absence of . In this case, the defect detection: W divides the adjacent defective pixel group into four. This is the lack of points, the brightness information is obtained from the position information and photography of each element (defective element), and the defect data is formed and stored in the memory 8 feature extraction unit 9, read from the memory 8 Defect data is taken, and the defect characteristics of each defect are extracted, and the position information of the brightness value and the defect, or comprehensive information can be obtained from the size, shape, and photography of the defect, respectively. The priority setting 5 includes the defect discriminating unit 10 and the priority order setting unit 11° defect determining unit 10, and the original setting is first performed. That is, the discrimination criterion for judgment is set in advance. The defect discriminating unit 1 〇 'detects whether or not the detected defect is irradiated with laser light based on the discrimination criterion, thereby judging whether or not it is necessary to perform the discrimination criterion, at least the defect size, shape, position, and luminance value.

第9頁 1325495 五、發明說明(6) 其中之一。此之判別基準,可由使用者任意設定,例如: 可依後述之微粒子(particle),設定缺陷亮度值、無必要 修復的缺陷大小、模型所在位置資訊等之判別水準(門捏 值)〇 此之判別’若未利用雷射光進行缺陷修復,完成的製 將因操作不良而成為不合格製品。或者有微粒子附著, 於後來的工程中,例如:可在洗淨工程去除、或者即使不 修復也不會發生問題的缺陷。另外,利用雷射光照射無法 修復的缺陷,例如:模型變形、模型脫落、或者缺陷^復 的部分過大、或過多等。修復部分過大、或過多時,雖然 希望能夠修復所有的缺陷,但慮及修復所需要的時間,若 無法在使用者規定的時間内修復完成時,則視為無法修 復,而歸類為重新製造處理的對象。對於這些缺陷,應返 回前一階段工程重新製造處远。此之重新製造處理,包括 將有缺陷的模型本身視為不良部分的處理、與再次實施無 線電測距(radio distance)塗布並進行圖像模仿 (patterning)處理等。Page 9 1325495 V. Description of invention (6) One of them. The discrimination criterion can be arbitrarily set by the user. For example, the discrimination level (gate pinch value) such as the defect brightness value, the defect size that is not necessary to be repaired, and the position information of the model can be set according to the particle described later. Judging 'If the defect is not repaired by laser light, the finished system will become a defective product due to poor operation. Or there may be microparticles attached, which may be removed in a later project, for example, if it can be removed in the cleaning process, or if it is not repaired. In addition, the use of laser light to illuminate defects that cannot be repaired, such as deformation of the model, loss of the model, or excessive or excessive defects. When the repair part is too large or too much, although it is hoped that all the defects can be repaired, but the time required for the repair is considered, if it cannot be repaired within the time specified by the user, it is regarded as unrepairable and classified as remanufacturing. The object being processed. For these defects, return to the previous stage of engineering remanufacturing. This remanufacturing process includes treating the defective model itself as a defective portion, and performing radio distance coating and image patterning processing again.

另外’存有複數以上之缺陷時,應核對此之優先區域 後,設定修復順序的優先度,也就是優先順位。此外,使 用者可設定修復部位的數量、考量修復所需花費的時間後 限制修復數、或者依優先度限制修復數。 缺陷判定部10 ,依上述判別結果,將無必要修復的微 粒子(particle)等缺陷自修復對象中剔除,僅將必需要修 復的缺陷資料視為修復對象缺陷資料,儲存於記憶8中。In addition, when there are more than one defects, the priority of the repair order should be set, that is, the priority order is given. In addition, the user can set the number of repair sites, limit the number of repairs required after repairing, or limit the number of fixes by priority. The defect determination unit 10 removes defects such as particles that are not necessary to be repaired from the repair target, and treats only the defect data that must be repaired as the repair target defect data, and stores it in the memory 8.

1325495 δ·、發明說明(7) 另外’判別後的缺陷被視為重新製造處理對象時,於 判別處理完成的當時,面板立即返回前階段工程β再者, 修復對象缺陷資料’亦可不需儲存於記憶體8内而直接輪 送至優先順位設定部Π。另外,缺陷判定部1 〇,使用者可 設定修復部位的數量,並考量修復所需花費的時間後限 修復數。 其次,優先順位設定部11,對缺陷重新設定(優先度 «又疋),從重要的缺陷開始進行修復。優先順位設定部· 11,於判別處理結束後,自記憶體8取得修復對象缺陷資 料,對各修復對象缺陷,設定雷射光照射修復順序的優先 度。具體而言,優先順位設定部u,從記憶體8的影像 料中取得1個模型(pattern)的影像資料(模型影像),依 Ϊϊΐΐί模型影像内的回路因+、配線,設定優先實施 : 當然,此之優先區域亦可由,使用者來預 ’至少要設定1個’若設定複數以上的優先 區域時’應決定各優先區域的優先順位。 另外,存在著複數以上之缺陷時,應 Γ而順…外,使用者可依優先度限= Ϊ定U K:限制’可藉由缺陷判定部1〇與優先順位 像礤 此在依優先度順序進行修復的所需時間内完成 修復的缺陷,判定為修復對象。 ]内兀成 優先度較高區域的決定方法,能 =的操…計的製品壽命)為判2準見長== …右疋液晶顯示螢幕’對於畫素電晶體等驅動回路因 第11頁 1325495 五、發明說明(8) 子23之形成造成障磁μ认 要的缺陷修復。^ =陷、或無法驅動的缺陷,是最重 造成的電力短路缺;:與配線、電極等電力通路 始齡始从地^ 則疋重要的缺陷修復。接著是使配 線斷線的缺陷、發伞 9>tel ^ ^ ^ ±發先。卩上的相關缺陷等。另外,缺陷跨越 優先區域時,以優先度較高區域為判別基準。 址政ί Γ來,就有關上述構造之缺陷修復裝置1之面板上 缺陷取侍操作的工程順序,說明如下。 【影像取得工程】 胃缺~修復裂置1 ’由攝影部6或面板掃瞄移動,並將攝 侍的面板影像資料儲存於記憶體8中。 【缺陷檢出工程】 影像緊得工程結束後,接著進行缺陷檢出工程。此之 美陷檢出工程中’由缺陷檢出部7比較影像資料與預設的 =準影像(參考影像),檢查出缺陷的部位並作成修復對 象缺陷資料,儲存於記憶體8中。 【特徵抽取工程】 * ·特徵抽取部9,從記憶體8中讀取缺陷資料,並從各缺 =資料中抽取出缺陷的大小、形狀、全體的亮度與缺陷位 f缺陷特徵。特徵抽取部9,進一步找出這些被抽取的 、^特徵與缺陷資料的關連,並儲存於記憶體8中。 【缺陷判別工程】 由缺陷判定部1 0判別各缺陷是否有修復的必要。具體 而言’缺陷判定部1 〇從缺陷判定部〗0各缺陷資料,依判別 基準判斷這些缺陷是否必須以前.述之雷射光照射進行修1325495 δ·, invention description (7) In addition, when the defect after the discrimination is regarded as the object of remanufacturing, the panel immediately returns to the previous stage of the project at the time of the completion of the discrimination process, and the defect data of the repair object may not be stored. It is directly transferred to the priority order setting unit 记忆 in the memory 8. Further, the defect judging unit 1 〇, the user can set the number of repaired parts, and consider the time required for repairing the number of repairs. Next, the priority order setting unit 11 resets the defect (priority «against) and repairs it from an important defect. The priority order setting unit 11 obtains the repair target defect data from the memory 8 after the discrimination processing is completed, and sets the priority of the laser light irradiation repair order for each repair target defect. Specifically, the priority order setting unit u acquires image data (model image) of one pattern from the image material of the memory 8, and performs priority setting according to the circuit + and wiring in the model image: The priority area may also be determined by the user, and at least one of the priority areas should be set. If the priority area is set to be more than one, the priority order of each priority area should be determined. In addition, when there are more than a plurality of defects, the user should be able to use the priority limit = Ϊ UK UK: limit ' can be determined by the defect determination unit 1 优先 with the priority order 礤 in priority order The defect that has been repaired within the required time for repair is determined as the repair target. ] The method of determining the higher priority area, the life of the product can be judged as 2] The right side of the liquid crystal display screen for the driving circuit of the pixel transistor, etc. Page 11 1325495 V. INSTRUCTIONS (8) The formation of sub-23 causes the defect repair of the magnetic barrier. ^ = trapped, or undriven defects, is the most serious short circuit of power;: power lines with wiring, electrodes, etc., starting from the ground, then important defects are repaired. Then, the defect of the wiring disconnection and the hairpin 9>tel ^ ^ ^ ± are issued first. Related defects on the raft. In addition, when the defect crosses the priority area, the higher priority area is used as a criterion. The order of the defect handling operations on the panel of the defect repairing device 1 of the above configuration is explained below. [Image acquisition project] The stomach defect ~ repair split 1 ' is moved by the photographing unit 6 or the panel scan, and the panel image data of the photographer is stored in the memory 8. [Defect Detection Project] After the image is tight, the defect detection project is carried out. In the beauty detection project, the defect detection unit 7 compares the image data with the preset = quasi-image (reference image), examines the defect portion, and creates the repair object defect data, and stores it in the memory 8. [Feature Extraction Engineering] * The feature extraction unit 9 reads the defect data from the memory 8, and extracts the size, shape, overall brightness, and defect level f defect characteristics of each defect from the data. The feature extraction unit 9 further finds the association between the extracted features and the defect data, and stores them in the memory 8. [Defect Identification Project] The defect determination unit 10 determines whether or not each defect is necessary for repair. Specifically, the defect determination unit 1 determines whether or not these defects must be repaired by the laser light irradiation described above based on the defect data of the defect determination unit.

第12頁 1325495 五、發明說明(9) 復。 在此之缺陷判別工程中,與必須修復的缺陷資料相關 的缺陷影像資料,則當成修復對象缺陷資料而儲存於記憶 體8中。 【優先區域設定工程】 對於前述之修復對象缺陷資料’設定修復的優先區 域。Page 12 1325495 V. Description of invention (9) In the defect discrimination project, the defective image data related to the defect data that must be repaired is stored in the memory 8 as the repair target defect data. [Priority area setting project] Set the priority area of the repair to the above-mentioned repair target defect data.

在本實施形態中’如圖三所示,兹說明設定優先區域 的3個實例。在本實例中,依優先度的高低順序,分別是 包括回路因子23與部分配線21、22區域的第一優先區域 A1、配線21、22區域的第二優先區域A2、由配線21、22包 圍之發光部區域的第三優先區域A3。 【優先度設定工程】 莫次設定修復對象資料的優先度丨此之優先度,在於 設定缺陷晝素位置適用於第一、2、3優先區域Al、Α2、A3 的哪一個區域,並設定優先度(優先順位)。 例如:對於圖四所示之3個各修復對象缺陷資料24a、In the present embodiment, as shown in Fig. 3, three examples of setting the priority area will be described. In the present example, in the order of priority, the first priority area A1 including the loop factor 23 and the partial priority area A1 of the partial wiring 21, 22 area, and the second priority area A2 of the wiring 21, 22 area are surrounded by the wirings 21, 22, respectively. The third priority area A3 of the light-emitting portion region. [Priority setting project] The priority of setting the data of the repair target is set to the priority of the first, 2, 3 priority areas A1, Α2, A3, and the priority is set. Degree (priority order). For example, for each of the three repair object defect data 24a shown in FIG.

24b、24c設定優先度的實例中,如圖五所示,修復對象缺 陷資料24a適用於第一優先區域A1 ’修復對象缺陷資料24b 適用於第二優先區域A2,修復對象缺陷資料2 4c適用於第 三優先區域A3。因此,優先度第一順位是24a、第二順位 是2 4b、第二順位是24c。設定的優先度,對應各修復對象 缺陷資料,分別儲存於記憶體8中。 【缺陷修復工程】In the example in which the priority is set in 24b and 24c, as shown in FIG. 5, the repair target defect data 24a is applied to the first priority area A1. The repair target defect data 24b is applied to the second priority area A2, and the repair target defect data 2 4c is applied to Third priority area A3. Therefore, the first priority order is 24a, the second order is 2 4b, and the second order is 24c. The set priority is stored in the memory 8 corresponding to each repair target defect data. [Defect repair project]

I325495 五、發明說明(ίο) 接下來,依本實施形態缺陷修復裝置1,說明缺陷修 復如下。 前述之缺陷抽取完成後,控制部3依優先度順位,從 記憶體8中讀取修復對象缺陷資料。控制部3,對此之修復 對象缺陷資料,由修復部2對該面板上缺陷照射雷射光, 並依設定的優先度順位依序修復必要的修復對象缺陷資 料。優先順位的設定,可從優先度較高的缺陷設定至任意 順位。另外’優先度順位也可依缺陷種類、類型而任意設 定。此之修復中,修復部2依據修復對象缺陷資料中的特 徵’找出面板上特定的缺陷位置、大小與形狀,由控制部 3限制光強度(能量密度)與照射範圍的雷射光,接著照 射缺陷並完成修復。此之照射範圍,如後文所述,使遮光 板等移動並加以調整之。. ^ 此外’本實施形態的缺陷修復方法,包括以下乏作用 效果。 〇 首先’依據判別基準,判別有無修復的必要,例如: 可藉由洗淨去除等無修復必要的缺陷,則摒除备 之外,能使修復更加有效率。 设對象 ’可調 也可 此 變更判別基準,利用修復次數、缺陷水平程度 有無修復的必要性。而且設定優先度時,模型 pattern)影像内全部區域,皆可設定成優先區域, =將模型(pattern)影像的一部分設定為優先區域。此 先區域内的缺陷’設定的修復優先度較高,而非優 先£域内的缺陷’設定的修復優先度則較低,#此即可: 1325495 五、發明說明(11) 先修復重要的 另外,雖 於此,亦可利 言,對於每一 板(template) 内所有缺陷, 誠如上述 藉由攝影取得 更進一步判別 修復則施以重 設定修復優先 缺陷,且可依 化、減輕作業 * 接下來, 加以說明。說 為雷射光修復 六,為有關第 圖。圖七,為 顯示螢幕所使 擴大圖,由資 23的構造圖。 的雷射光修復 圖四相同機能 此之缺陷 缺陷。 然每一缺陷資料皆有設定優先度,但不僅限 用每一模型(pattern)影像資料。具體而 模型(pattern)影像,在影像上重疊拍攝模 的影像,對於由差分求得的模型(pattern) 可一次設定其優先度順位。 之說明,本實施形態的缺陷修正方法,乃是 的影像資料檢查出缺陷,作成缺陷資料,且 有無修復的必要。判定的結果,若缺陷無法 新製造處理,若可修復則依預設的優先區域 度。若依本實施形態,可確實檢查出重要的 優先度進行修復,進而實現修復時間的縮短 人員的負擔。 就有關本發明第二賛施形態的缺陷修復裝置 明本實施形態中’對於檢出的缺陷,在設定 禁止區域之修補區域内的缺陷修復方法。圖 二實施形態之缺陷修復裝置的概略構造塊狀 修復對象面板中,晝素形成於矩陣狀之液晶 用的玻璃面板。圖八,為圖七中一個畫素的 訊線與掃瞄線等配線包圍的區域内回路因子 圖九與圖一0,為圖八所示之區域與配線上 禁止區域(虚線)示意圖。圖八上具備有與 的部位,則附上相同的參考符號。 修復裝置30,大致上由修復部31、與資訊產I325495 V. INSTRUCTION DESCRIPTION (ίο) Next, the defect repairing apparatus 1 according to the present embodiment will be described as follows. After the above-described defect extraction is completed, the control unit 3 reads the repair target defect data from the memory 8 in accordance with the priority order. The control unit 3 irradiates the laser beam with defects on the panel by the repairing unit 2, and sequentially repairs the necessary defect information of the repair target according to the set priority. The priority order can be set from a higher priority defect to an arbitrary order. In addition, the priority order can be arbitrarily set depending on the type and type of defect. In the repair, the repairing portion 2 finds the specific defect position, size and shape on the panel based on the feature 'in the repair target defect data', and the control unit 3 limits the light intensity (energy density) and the irradiation range of the laser light, and then irradiates Defects and complete the repair. The irradiation range is such that the visor or the like is moved and adjusted as will be described later. Further, the defect repairing method of the present embodiment includes the following effects. 〇 Firstly, it is necessary to determine whether or not there is a repair based on the criterion. For example, it is possible to remove the necessary defects such as cleaning and removal, and it is possible to make the repair more efficient. It is also possible to change the discrimination criterion by using the object ', and use the number of repairs and the level of the defect level for the necessity of repair. When the priority is set, all regions in the image pattern can be set as the priority region, and a part of the pattern image is set as the priority region. Defects in this prior area are set with higher priority for repair, and defects in the non-preferred domain are set to lower the priority of repair, # this can be: 1325495 V. Invention description (11) First fix important additional However, it is also useful to say that for all the defects in each template, as described above, by using photography to obtain further discriminative repair, the resetting and repairing priority defects are applied, and the operation can be reduced and the operation can be reduced*. Let's explain it. Said to repair the laser light six, for the relevant figure. Figure 7 is a structural diagram of the enlarged view of the screen. Laser light repair Figure 4 identical function This defect is defective. However, each defect data has a priority, but not only each pattern image. Specifically, the pattern image overlaps the image of the shooting mode on the image, and the priority order can be set once for the pattern obtained by the difference. In the description of the defect correction method of the present embodiment, the image data is checked for defects, and the defect data is created, and there is a need for repair. As a result of the judgment, if the defect cannot be newly manufactured, if it can be repaired, it depends on the preset priority area. According to this embodiment, it is possible to surely check the important priority for repair, thereby realizing the burden of shortening the repair time. In the defect repairing apparatus according to the second embodiment of the present invention, in the embodiment, the defect repairing method in the repairing area of the prohibited area is set for the detected defect. Fig. 2 is a schematic view of a defect repairing device of the embodiment. In the panel to be repaired, a halogen is formed on a glass panel for liquid crystal in a matrix. Figure 8 is the loop factor in the area surrounded by the wiring of the picture line and the scan line of one pixel in Figure 7. Figure 9 and Figure 0 show the area and wiring prohibited area (dashed line) in Figure 8. If there are parts with and on Figure 8, the same reference symbols are attached. The repairing device 30 is substantially composed of the repairing unit 31 and the information product

第15頁 1325495Page 15 1325495

生部32、ΧΥ表(table)33、控制部34所構成。首先, 修復部31。 況月 修復部31,由放射出修復缺罕的雷射光雷射因子35、 與驅動控制雷射因子35的雷射控制部36、以及可任意變更 雷射光照射區域(範圍)與照射面形狀的照射區域調整部 37所構成。另外,此之雷射因子35,若是可修復的缺陷, 則雷射光的種類與波長等並無特別的限定。 照射區域調整部37,由相同於照相光圈裝置的數片光 圈翼(無圖示)、或遮光板構成。此之照射區域調整部 37 ’配置於雷射因子35的出射側,藉由移動調節光圈翼、 或遮光板’製造出開叉狀的開口部使雷射光束通過,藉此 可變更雷射光照射區域的大小與形狀。當然,如果也能另 外形成其他開叉狀開口部,亦可使用眾所周知的構造。 接下來’就有βΐ資訊產生部加以說明。此之資飯產生 部32,由攝影部6、與基本資訊設定部38所構成。其中, 攝影部6 ’藉由後述之驅動控制部43的控制,具備有圖示 中未標示的CCD等半導體攝影因子與可變更倍率的光學系 統、影像處理回路,並且拍攝修復對象面板。利用此之攝 影部6 ’可依希望的倍率拍攝修復處理前後的影像。攝得 的影像則當成影像資料輸送到基本資訊設定部3 8。 基本資訊設定部3 8,利用攝影部6保存攝得的影像資 料。另外’與修復對象面板上形成的回路模型一樣,將無 缺陷的基準模型(pat tern)當成參考影像(基準影像)予 以保存。此之參考影像,是檢查缺陷時的比較對象,例The raw part 32, the table 33, and the control unit 34 are comprised. First, the repair unit 31. The month-recovery unit 31 includes a laser light-receiving factor 35 that emits a defect, a laser control unit 36 that controls the laser factor 35, and a laser light-irradiation area (range) and an irradiation surface shape that can be arbitrarily changed. The irradiation area adjustment unit 37 is configured. Further, if the laser factor 35 is a repairable defect, the type and wavelength of the laser light are not particularly limited. The irradiation area adjustment unit 37 is composed of a plurality of aperture wings (not shown) similar to the photo aperture device or a light shielding plate. The irradiation area adjustment unit 37' is disposed on the exit side of the laser factor 35, and the iris beam is opened by moving the adjustment aperture wing or the light shielding plate to pass the laser beam, thereby changing the laser light irradiation. The size and shape of the area. Of course, if other slit-shaped openings can be formed separately, a well-known structure can also be used. Next, there will be a description of the βΐ information generation department. The meal generating unit 32 is composed of a photographing unit 6 and a basic information setting unit 38. In addition, the imaging unit 6' includes a semiconductor imaging factor such as a CCD (not shown), an optical system that can change the magnification, and an image processing circuit, and the image pickup circuit is imaged by the control unit 43. With this, the camera 6' can take images before and after the repair process at a desired magnification. The captured image is sent to the basic information setting unit 38 as image data. The basic information setting unit 3 8 stores the captured image data by the imaging unit 6. In addition, as with the loop model formed on the repair target panel, the defect-free reference model (pat tern) is saved as a reference image (reference image). This reference image is a comparison object when checking for defects.

第16頁 1325495 五、發明說明(13) 如.由圖八所示個書 參考影像。此外,iS a一供士破小早位反覆形成模型構圖的 面板上的所有回路模:複數之參考影像,彳覆蓋形成 像也同時儲存著面板上必僅限於1種。另外,參考影 之用。再者:此,亦可作為模板 用的參考影像、亦考影像的製作,可製作專 利用處理對象面板上盈缺:二;'攝得的影像資料、或可 用。 取上無缺陷的模型部分作為參考影像之 39。ΪίίΚ:設定部38,包括設定的禁止區域設定部 與資m線22椹Γ ^第二參考影像所示,形成掃瞄線21 =訊線22構成之配線與回路因子23的因子形成區域 =所=之虛線範圍),設定為雷射修復禁止區域ka。當 ^的^只是其中-例,雷射修復禁示區域ΚΑ,是可任意設 在此之影像處理中,亦可利用拍攝經圖像模仿 (pat tern ing)處理的面板時,配線與回路因子、及其他以 外郤为之間產生的亮度值差異,進而自動設定圖九虛線所 示之雷射修復禁止區域KA。例如:利用階調差產生的2值 化、形態(morphology)等,在配線與回路因子上設定雷射 修復禁止區域KA » 觀察此之抽取結果的同時,亦可藉由使用者的操作設定雷 射修復禁止區域KA,使用者也可使用一般的繪圖工具進行 修補。 ^ 接下來,將說明XY表(table)33 °XY表(table)33上載Page 16 1325495 V. Description of Invention (13) For example, the book shown in Figure 8 refers to the image. In addition, iS a is used to break through all the circuit modes on the panel of the model composition: the reference image of the complex number, and the cover image is also limited to one type. In addition, the reference shadow is used. Furthermore, this can also be used as a reference image for the template, as well as for the production of the test image. It can be used to make use of the image on the panel to be processed: 2; 'Photographed imagery, or available. Take the defect-free model part as the reference image 39.设定 Κ Κ 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定= the dotted line range), set to the laser repair prohibition area ka. When ^ is only a part of the example, the laser repairs the forbidden area ΚΑ, which can be arbitrarily set in the image processing, and can also use the panel processed by image pat ing, wiring and loop factor And the difference in luminance values generated between the other and the other, and the laser repair prohibition area KA shown by the dotted line in FIG. For example, using the binarization, morphology, etc. generated by the step difference, the laser repair prohibition area KA is set on the wiring and the loop factor. ➢ Observing the result of the extraction, the lightning can also be set by the user's operation. The shot repair prohibition area KA can be repaired by the user using a general drawing tool. ^ Next, the XY table (table) 33 °XY table (table) 33 will be uploaded.

第17頁 1325495 五、發明說明(14) 置著C復對象面板,攝影部6的攝 =分別依垂直相交的W方攝向 === *不之驅動裝置而移動、掃瞄等。另外,Χγ Β (二Μ:”3的載置面上有多數開口小孔,冑由吸氣而吸附 疋t復對象面板、或者藉由喷出空氣而擁有面板上機 ΐ依Λ者’不僅是XY Wtable)33 ’攝影部6與修復㈣亦 了依2-人兀方向、或χ、γ之任一方向而移動與掃瞄。 4Π、ί Ϊ,說明控制部34。此之控制部34由資訊記憶部 動批釗出部41、修復(禁止修復)區域設定部42與驅 動控制部4 3所構成。 部40 ’包括參考資訊記憶部術與修復對象資訊 記憶邛40b。其中參考資訊記憶部4〇,是修復處理缺陷時 $要的參考資訊,從基本資訊設定部38中取得並儲存參考 像。 · 另一方面,修復對象資訊記憶部4〇b中所儲存的,是 由圖十所示之一個模型(pattern)形成構圖的修復對象面 板上’圖像模仿(patterning)處理後的影像。 缺陷檢出部41,藉由比較參考影像與圖像模仿 (patterning)處理後影像,檢查出缺陷。並且將有關檢出 的缺陷位置與大小等缺陷資訊,輸入修復(禁止修復)區 域設定部42。此之修復(禁止修復)區域設定部42,乃是 用以判別從缺陷檢出部41的缺陷資訊取得的各缺陷,是否 包含在禁止區域設定部39所設定的雷射修復禁止區域内。 此之判別結果’包括雷射修復禁止區域内缺陷與非區 1325495 五、發明說明(15) 域内缺陷的判別資訊、以及各個缺陷的大小與位置等,皆 傳送到驅動控制部43。驅動控制部43,依據判定結果控^ 修復部2與XY表(table)33,修復位於處理對象面板上的缺 陷。 、Page 17 1325495 V. INSTRUCTIONS (14) The C complex object panel is placed, and the photographing unit 6 takes a picture of the W side of the vertical intersecting === *moving, scanning, etc., without the driving device. In addition, Χγ Β (2:3) has a large number of open small holes on the mounting surface, and the 对象t is applied to the target panel by inhalation, or the panel is mounted by the air. It is XY Wtable) 33 'The photographing unit 6 and the repairing (4) also move and scan in either the 2-person direction, or the χ, γ direction. 4Π, Ϊ Ϊ, the control unit 34. The control unit 34 The information storage unit is configured to execute the portion 41, the repair (prohibition repair) area setting unit 42 and the drive control unit 43. The portion 40' includes the reference information memory portion and the repair target information memory 40b. In the fourth section, the reference information for repairing the defect is acquired, and the reference image is acquired and stored from the basic information setting unit 38. On the other hand, the information stored in the repair target information storage unit 4〇b is shown in FIG. One of the illustrated patterns forms an image after the image processing on the repaired object panel of the composition. The defect detecting unit 41 checks the processed image by comparing the reference image with the image. Defects and will be related The defect repair information (prohibition repair) area setting unit 42 is used to determine the defect information such as the defect position and size. The repair (prohibition repair) area setting unit 42 is for identifying each defect obtained from the defect information of the defect detecting unit 41. Whether or not it is included in the laser repair prohibition area set by the prohibited area setting unit 39. The result of the determination 'includes the defect and the non-area 1325495 in the laser repair prohibition area, the invention information (15), the identification information of the defect in the domain, and The size, position, and the like of each defect are transmitted to the drive control unit 43. The drive control unit 43 controls the repair unit 2 and the XY table 33 in accordance with the determination result to repair the defect located on the processing target panel.

接下來,就有關前述之缺陷修復裝置之缺陷修復, 明其作業工程順序。 " M 【準備工程】 首先,啟動缺陷修復裝置!,進行各構成部位的初始 化。XY表(table)33上,載置著處理對象面板。此之處^ 對象面板上,如圖七所示,無線電測距護罩(radi〇 distance mask)在圖像模仿(patterning)的狀態下, 橫設置的掃瞄線21與資訊線22構成的配線、與^配線 並形成回路®子23的t素等構成的影像晝素(簡稱為槿 (pattern)),則呈矩陣狀複數配置。 . 、土 【參考資訊輸入工程】 產生部32的基本資訊設定部38,取得用以檢出 η 3 (複數之模型(pattern)削個模型構; 像)。減如則文所述,此之參考影像,也可藉由拍攝用 ”準面板而取得,也可拍攝修復對象面板内 (pattern)而取得。另外,若有預先準備參考影^ 曰盔了咋热Γ貢抖應於啟動時的始化完成前輸入。而 且為了忐夠對應修復對象面板上形成的複數模型 (pattern) ’亦可準備複數之參考影像。 另外參考影像若能夠與攝影部6攝得的修復對面影 1325495 發明說明(16) 像成對比當,最好,也可以是256階調的彩色影像資料。 再者’如果是單純的模’亦可實施丨6階調等低階調的影像 資料’影像的形式並無特別的限制。 【禁止區域設定工程】 在此工程中’可藉由禁止區域設定部39設定雷射修復 不止區域KA。本實施形態中,使用圖八所示之1個擴大的 模型構圖而成的影像’如圖九虛線所示,將掃瞄線2〗與資 訊線22、回路因子23的上方,設定為雷射修復禁止區域 此外’雷射修復禁止區域KA ’如前述之第一實施形態| $的缺陷抽取一樣’利用亮度值資訊,可從亮度差自動設 =雷射修復禁止區域KA,也可利用繪圖工具以手動方式設 疋。此之雷射修復禁止區域Μ,被當作禁止區域資訊而儲 存於禁止區域設定部。另外,也可另於資訊記憶部4〇中設. 置憶部予以儲存。 【缺陷檢出工程】Next, regarding the defect repair of the aforementioned defect repairing device, the order of the work is explained. " M [Preparation Engineering] First, start the defect repair device! Initialization of each component is performed. On the XY table 33, a processing target panel is placed. In this case, on the object panel, as shown in FIG. 7, the radio distance mask (radiation distance mask) is arranged in the state of image patterning, and the wiring line 21 and the information line 22 are arranged horizontally. The image pixels (abbreviated as patterns) formed by the wiring of the loops and the like are formed in a matrix. [Current Information Input Project] The basic information setting unit 38 of the generating unit 32 acquires η 3 (pattern of a complex model). As described in the text, the reference image can also be obtained by shooting the "quasi-panel" or by capturing the pattern of the repair target panel. In addition, if there is a reference shadow in advance, the helmet is hot. Γ 抖 抖 输入 输入 输入 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖 抖The repair of the face to the shadow 1325495 Description of the invention (16) Like the contrast, the best, it can also be 256-tone color image data. In addition, 'if it is a simple model' can also implement a low-order tone such as 丨6 tone There is no particular limitation on the format of the image data. [Prohibited area setting project] In this project, the laser repairing area KA can be set by the prohibited area setting unit 39. In the present embodiment, the image shown in Fig. 8 is used. The image of one enlarged model is shown in the dotted line in Figure 9. The scanning line 2 and the information line 22 and the loop factor 23 are set as the laser repair prohibition area. The stop area KA' is the same as the first embodiment of the foregoing | $ is the same as the defect extraction. The brightness value information can be automatically set from the brightness difference = the laser repair prohibition area KA, or can be manually set by using a drawing tool. The laser repair prohibition area is stored in the prohibited area setting unit as prohibited area information. Alternatively, the information storage unit 4 can be stored in the memory unit. [Defect detection project]

接著進行缺陷檢出。此之缺陷檢出,如前文所述,可 從參考資訊記憶部40a中讀取參考影像、從修復對象資訊 s己憶部40b中讀取圖像模仿(pa11erning)處理後影像,比 較這些影像後找出有差異的部分即是缺陷,接著再檢查出 該缺陷在處理對象面上的所在位置資訊、大小等。然後, 再將缺陷大小及其位置資訊傳送到修復(禁止修復)區域 設定部42。 另外’缺陷檢出部41 ’利用亮度差自動抽取時,可由Then the defect detection is performed. The defect detection is as described above, and the reference image can be read from the reference information storage unit 40a, and the image-imaging (pa11erning) processed image can be read from the repaired object information s. Finding the difference is the defect, and then checking the location information, size, etc. of the defect on the processing object surface. Then, the defect size and its position information are transmitted to the repair (prohibition repair) area setting unit 42. Further, when the defect detecting portion 41' is automatically extracted by the difference in luminance,

第20頁 1325495Page 20 1325495

象面 使用者目視觀察抽取結果,使抽取後的缺陷與修復對 板的攝影影像重疊,與位置資訊同時顯示在的螢幕上 【修復區域設定工程】 修復(禁止修復)區域設定部42,從禁止區域設定部 39中讀取圖九所示之設定的雷射修復禁止區域.ka,從缺陷 檢出部41中讀取缺陷的位置資訊,並將這些資訊加以整 合。藉由這樣的整合,如圖十所示,可判別在雷射修復禁 止區域ΚΑ的掃瞄線上,有無缺陷25a的存在《另外,可判 別缺陷25b是否存在於與回路因子23無關的畫素區域内。The image-side user visually observes the result of the extraction, so that the extracted defect overlaps with the photographic image of the repaired plate, and is displayed on the screen simultaneously with the position information. [Repair area setting project] Repair (prohibition repair) area setting unit 42 is prohibited. The area setting unit 39 reads the laser repair prohibition area .ka set as shown in FIG. 9, reads the position information of the defect from the defect detecting unit 41, and integrates the information. With such integration, as shown in FIG. 10, it is possible to discriminate whether or not the presence of the defect 25a is present on the scanning line of the laser repair prohibition region 《 "In addition, it is possible to discriminate whether or not the defect 25b exists in the pixel region which is not related to the loop factor 23. Inside.

因此’修復(禁止修復)區域設定部42,即產生無需 修復缺陷2 5 a、僅修復缺陷2 5 b的修復指示資訊,並傳送到 驅動控制部43。此之修復資訊,僅由應修復的缺陷大小資 訊與位置資訊所構成。因此’禁止修復的缺陷,即非修復 對象。 · 【缺陷修復工程】 驅動控制部43,依據來自修復(禁止修復)區域設定 部42的修復資訊中缺陷的位置資訊,使χγ表(table)33與 修正部31移動,修復部2的雷射光瞄準缺陷25b的中心,並 使之移動。其次是驅動控制部43,將修復資訊傳往雷射控 制部36。雷射控制部36 ’依修復資訊的缺陷25b的大小資 訊,如圖十所示’設定雷射光的照射區域(照射範圍) 26 ’並設定雷射光的光強度。然後,以雷射光照射去除掉 缺陷2 5b。這樣的修復’於存在著不包含於雷射修復禁止 區域KA内的複數缺陷時,XY表(table)33與修正部31的移Therefore, the repair (prohibition repair) area setting unit 42 generates repair instruction information that does not require repair of the defect 25a and only repairs the defect 2 5 b, and transmits it to the drive control unit 43. This repair information consists only of the defect size information and location information that should be fixed. Therefore, the defect of repair is prohibited, that is, the non-repaired object. [Defect Repair Project] The drive control unit 43 moves the χγ table 33 and the correction unit 31 based on the position information of the defect in the repair information from the repair (prohibition repair) area setting unit 42, and the laser light of the repair unit 2 Aim at the center of the defect 25b and move it. Next, the drive control unit 43 transmits the repair information to the laser control unit 36. The laser control unit 36' sets the irradiation area (irradiation range) 26 of the laser light and sets the light intensity of the laser light according to the size information of the defect 25b of the repair information. Then, the defect 25b is removed by irradiation with laser light. Such a repair 'shifts the XY table 33 and the correction portion 31 when there are plural defects not included in the laser repair inhibiting region KA

第21頁 1325495 五、發明說明(18) 動距離較短,也希望缺陷的修復能在短時間内完成。 且1Λ陷Λ修復,&強度以不損壞修復對象面板為限,而 人Λ Λ缺陷變化(去除量)最好要大。另外,缺陷 ίί'ίϊΐ:缺陷,且以照射區域調整部37遮蔽的形狀無 掩盍缺陷時,可分數次進行修復。另外,缺陷大、且以 雷射光強度去除而恐有損壞其他部位之虞時,可降低光強 ,私t數次以雷射光照射。但是,數次照射所需的處理時 間較長,必須實施最適化。 如以上說明’本實施形態的缺陷修復裝置,將修復檢 。=缺1½時對正常部位(例如:配線、回路因子等)造成 才貝壞的缺陷抽取出來,並且對此以外的缺陷進行修復即 可防止對正常部位的損壞。 另外’也可再度拍攝修復完成後的修補對象面板,再 、取出與參考影像比較的缺陷,並針對雷射修復禁止區域 以外修復但未處理的缺陷進行再修復。 &接下來,依本發明第三實施形態說明缺陷修復裝置。 ^,第二實施形態中,禁止以雷射光照射修復的缺陷甚 疋雷射修復禁止區域以外的相關缺陷部分,也不實施任 Ζ ί復°相對於此’本實施形態中’削除並修復與雷射修 4 π止區域無關的缺陷部分,並且對修復的缺陷設定修復 順序的優先度。 圖十一’為第三實形態相關的缺陷修復裝置概略構成 狀圖。圖十二,為修復對象面板上雷射修復禁止區域 虛線)的示意圖。圖十三所示為配線與回路因子的相關Page 21 1325495 V. INSTRUCTIONS (18) The moving distance is short, and it is hoped that the repair of defects can be completed in a short time. And 1 Λ Λ repair, & intensity is not limited to damage the repair object panel, and the Λ Λ defect change (removal amount) is preferably larger. Further, the defect ίί'ίϊΐ is defective, and when the shape masked by the irradiation area adjusting portion 37 has no masking defect, the repair can be performed in fractions. In addition, when the defect is large and the intensity of the laser light is removed and the other parts are damaged, the light intensity can be reduced, and the private light can be irradiated with laser light several times. However, the processing time required for several irradiations is long and must be optimized. As described above, the defect repairing apparatus of the present embodiment will be repaired. = When the absence is 11⁄2, the defects that cause the bad parts of the normal parts (such as wiring, loop factor, etc.) are extracted, and the defects other than this are repaired to prevent damage to the normal parts. In addition, it is possible to re-shoot the repaired panel after the repair is completed, remove the defects compared with the reference image, and repair the defects that have been repaired but not processed outside the laser repair prohibited area. & Next, a defect repairing apparatus will be described in accordance with a third embodiment of the present invention. ^ In the second embodiment, it is prohibited to use the laser light to repair the defect of the repair or the related defect portion other than the laser repair prohibition region, and does not implement the "removal and repair" in this embodiment. The laser repairs the defect portion of the region that is not related to the region, and sets the priority of the repair sequence for the repaired defect. Fig. 11' is a schematic configuration diagram of a defect repairing device relating to the third real form. Figure 12 is a schematic diagram of the dashed line of the laser repair prohibition area on the repaired object panel. Figure 13 shows the wiring and loop factor correlation.

第22頁Page 22

II 1325495 五、發明說明(19) 缺陷’圖十四所示是去除缺陷的修復實施狀態。另外,圖 十一〜圖十四所示之構成部位上,與前述第二實施形態中 圖六〜圖十所示之構成部位相同者,附上相同的參考符 號。 此之第三實施形態,除了前述第二實施形態缺陷修復 裝置30的構成部位外,基本資訊設定部38上尚有修復區域-設定部53、與控制部54上的修復區域設定部44與優先度設 定部5。另外,優先度設定部5,與前述第一實施形態相同 者,本文省略詳細說明。 、 禁止區域設定部39,如圖十二所示之虛線,在電力式4 分離的各掃瞄線21與資訊線22與回路因子23配置的部分, 分別設定雷射修復禁止區域KA1〜KA5。另外,禁止區域設 定部39 ’於設定的雷射修復禁止區域KA1〜KA5上,又設定 了可識別的識‘別符號。也就是,缺陷跨越數個雷射修復禁 止區域KA時,可推測禁止區域間是短路的,並能提高修復 的優先度。例如:如圖十三所示,跨越掃猫線21與回路因 子23的缺陷27 ’即跨越來自禁止區域設定部39的雷射修復 禁止區域KA3、KA4,故判別是使之短路的缺陷。 修復區域設定部44,依據從缺陷檢出部41輸入的缺陷 大小及其位置資訊、與禁止區域設定部39設定的雷射修復· 禁止區域KA1〜KA5、與來自修復區域設定部53的雷射照射 區域資訊等,對圖十三所示之缺陷27設定雷射照射區域 AA。 其次,說明本實施形態中,有關去除與雷射修復禁止II 1325495 V. INSTRUCTIONS (19) Defects Figure 14 shows the state of repair of the defect removal. Incidentally, the constituent parts shown in Figs. 11 to 14 are the same as those shown in Figs. 6 to 10 in the second embodiment, and the same reference numerals are attached. According to the third embodiment, in addition to the components of the defect repairing device 30 of the second embodiment, the basic information setting unit 38 has the repair region setting unit 53 and the repair region setting unit 44 on the control unit 54 and the priority. Degree setting unit 5. The priority setting unit 5 is the same as the first embodiment, and a detailed description thereof will be omitted. The prohibition area setting unit 39 sets the laser repair prohibition areas KA1 to KA5 in the portions where the respective scan lines 21 separated from the electric power type 4 and the information lines 22 and the circuit factor 23 are arranged as shown by the dotted line in Fig. 12, respectively. Further, the prohibited area setting unit 39' sets an identifiable identification symbol on the set laser repair prohibition areas KA1 to KA5. That is, when the defect spans several laser repair prohibition areas KA, it can be inferred that the prohibited areas are short-circuited and the priority of repair can be improved. For example, as shown in Fig. 13, the defect 27' across the sweeping cat line 21 and the loop factor 23, that is, the laser repair prohibiting regions KA3 and KA4 from the prohibited region setting portion 39, is determined to be a defect that is short-circuited. The repair area setting unit 44 is based on the size of the defect input from the defect detecting unit 41 and its position information, the laser repair/prohibition areas KA1 to KA5 set by the prohibited area setting unit 39, and the laser from the repair area setting unit 53. The laser irradiation area AA is set for the defect 27 shown in FIG. Next, in the present embodiment, the removal and laser repair prohibition are described.

第23頁 1325495 五、發明說明(20) 區域無關之缺陷部分的缺陷修復。本文以圖十三所示之模 型(pat tern)p2上的缺陷為例。 本實施形態的缺陷修復裝置,與第二實施形態一樣,於完 成參考資訊輸入工程後’即進行修復區域設定工程。 【禁止區域設定工程】 禁止區域設定部39,如前述一樣,透過參考影像於模 型(pattern )上設定複數之雷射修復禁止區域ΚΑι〜KA5, 以保存禁止區域資訊。此時,修復區域設定部53,也將參 考衫像模型上的雷射照射區域,當成修復區域資訊予以保 存。 【優先區域設定工程】 的傷己ϊ部叫的參考影像模型,設定修復 乂德'之议疋,於禁止區域設定工程的同時、或 刖後時期進行。優先區域設定 兄 同。 杈又疋,與前述第一實施形態相 【缺陷檢出工程】 接著進行與前述第二實施 取得檢出缺陷的大小資訊Page 23 1325495 V. INSTRUCTIONS (20) Defect repair of defective parts of the area. This article takes the defect on the model pat tern p2 shown in Figure 13 as an example. In the defect repairing apparatus of the present embodiment, as in the second embodiment, the repair area setting project is performed after the completion of the reference information input project. [Prohibited Area Setting Project] The prohibited area setting unit 39 sets the plurality of laser repair prohibiting areas ΚΑι to KA5 on the pattern by referring to the image to store the prohibited area information. At this time, the repair area setting unit 53 also stores the laser irradiation area on the reference shirt image model as the repair area information. [Priority Area Setting Project] The reference image model called the injury ϊ , , , 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 设定 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Priority area setting Brother.杈 疋 疋 与 与 【 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷 缺陷

此之缺陷檢出,先從參考資訊相同的缺陷檢出工程。 影像、從修復對象資訊記憶部5 ^^部4〇&中讀取第—參考 (patterning)處理後的第—參忠讀取圖像模仿 亮度差有差異的部分即是缺陷号影像,比較這些影像找出 板上該缺陷所在的位置資訊。接著再檢查出處理對象面 出部41,將讀取第二參考影俊,此之位置資訊,缺陷檢 府传认,,…丨一 ·.- 然:、第二攝影影像並比較之, 、乂後’再將缺陷的大小及其位 1325495 五、發明說明(21) 置資訊傳送至修復區域設定部44。 【修復區域設定工程】 修復區域設定部44中,有來自缺陷檢出部41的缺陷27 大小及其位置資訊。接著再從禁止區域設定部39中讀取禁 止區域資訊’並使缺陷位置與雷射修復禁止區域KA1〜KA5 ' 疊合,如圖十三所示’即可判別出缺陷2 7跨越雷射修復禁·. 止區域K A3與KA4。也就是,缺陷27能使掃瞄線21與回路因 子2 3短路,故判斷是優先度高的缺陷。 再者’從修復區域設定部53讀取的修復區域資訊,在缺陷 2 7且可修復的部分設定雷射照射區域aa。此之雷射照射區| 域A Α與缺陷2 7的大小及其位置資訊,將當成修復資訊傳送 到驅動控制部4 3。 【優先度設定工程】 接著對所有應修復的缺陷,也就是與雷射修復禁止區· 域無關的缺陷、與擁有前置工程中設定的修復區域(雷射 照射區域AA )之缺陷,設定其修復的優先順序。此之優先 度的設定’與第一實施形態中說明的設定程序相同。 【缺陷修復工程】 與前述第一、第二實施形態一樣,驅動控制部43先使 XY表(table)33與修復部31移動,再依優先度,以修復部 31的雷射光睹準缺陷或修復區域的中心照射,並使之移 動。 例如:與缺陷27相關的雷射照射區域AA,優先度最高 時’由修復部2的雷射光瞄準雷射照射區域A A照射並使之The defect is detected, and the project is first detected from the same defect as the reference information. The image, the portion of the image-reading image read from the image processing unit 5^^4& is the defect number image, and the difference is the image of the defect number. These images identify the location information of the defect on the board. Then, the processing object surface portion 41 is checked again, and the second reference image is read, and the location information, the defect inspection is recognized, ... 丨一·.- 然:, the second photographic image is compared, Then, the size of the defect and its bit 1325495 are transmitted to the repair area setting unit 44. [Repair Area Setting Project] The repair area setting unit 44 has the size of the defect 27 from the defect detecting unit 41 and its position information. Then, the forbidden area information is read from the forbidden area setting unit 39 and the defect position is superimposed on the laser repair prohibition areas KA1 to KA5', as shown in FIG. Forbidden. Stop zone K A3 and KA4. That is, the defect 27 can cause the scan line 21 to be short-circuited with the loop factor 23, so that it is judged to be a defect with high priority. Further, the repair area information read from the repair area setting unit 53 sets the laser irradiation area aa in the repairable portion of the defect 27. The laser irradiation area | the size of the field A and the defect 27 and the position information thereof are transmitted as the repair information to the drive control unit 43. [Priority setting project] Next, set all the defects to be repaired, that is, defects not related to the laser repair prohibition area and the repair area (the laser irradiation area AA) set in the pre-engineering. The priority of the fix. The setting of the priority is the same as the setting procedure described in the first embodiment. [Defect Repairing Project] As in the first and second embodiments, the drive control unit 43 first moves the XY table 33 and the repairing unit 31, and prioritizes the laser light of the repairing portion 31 to the defect or Repair the center of the area and move it. For example, when the laser irradiation area AA associated with the defect 27 has the highest priority, the laser light of the repairing unit 2 is aimed at the laser irradiation area A A and is irradiated thereto.

第25頁 1325495Page 25 1325495

移動。其次是驅動控制部43,將修復資訊傳送到雷射控制 部36。雷射控制部36 ’依據修復資訊中缺陷27 (雷射照射 區域AA )的大小資訊’設定雷射光的光強度。然後,如圖 十四所示,照射雷射光將雷射照射區域^相關的缺陷27部 分予以去除》接著,依優先度,移動其他缺陷並以修復部二 2的雷射光瞄準,以計算求得的光強度雷射光照射,並且 依序去除。 誠如以上說明,跨越數個雷射修復禁止區域以的缺 陷,恐有造成電力短路之虞,所以,藉由部分去除存在於 雷射修復禁止區域KA以外晝素區域的缺陷,可防止掃猫 ^ 線、資訊線與回路因子之間的電力短路。 其次,說明本發明第四實施形態之缺陷修復裝置。 本實施形態之缺陷修復裝置’與前述第三實施形態之缺陷 修復裝置的結構一樣’僅修復區域設定部5 3不同。, 此之修復區域设定部53 ’圖十五所示,將掃晦線21、 資訊線22與回路因子23設定於雷射修復禁止區域ΚΑι〜 KA5,再於畫素區域的回路因子23周圍設定為雷射照射區 域AA。例如:圖十五之配置例中,掃瞄線21與資訊線23形 成的配線與回路因子23之間是狹窄的,特別是資訊線22與 回路因子23的部分較窄。如圖十六所示,回路因子23上出· 現缺陷28 ’但缺陷28的一端接近資訊線22,故有發生電力 短路之虞。 因此’將雷射照射區域A A設定於回路因子23周圍,藉 此可優先去除並修復可能造成短路的缺陷。如此一來,本mobile. Next, the drive control unit 43 transmits the repair information to the laser control unit 36. The laser control unit 36' sets the light intensity of the laser light based on the size information 'in the defect 27 (the laser irradiation area AA) in the repair information. Then, as shown in FIG. 14, the laser beam is irradiated to remove the portion of the defect 27 associated with the laser irradiation region. Then, according to the priority, other defects are moved and aimed at the laser light of the repairing portion 2, and calculated. The light intensity is illuminated by laser light and is removed sequentially. As explained above, the defect of the laser-prohibited area across several lasers may cause a short circuit of the power. Therefore, it is possible to prevent the sweeping of the cat by partially removing the defects existing in the area other than the laser repair prohibited area KA. ^ Short circuit between power line, information line and loop factor. Next, a defect repairing apparatus according to a fourth embodiment of the present invention will be described. The defect repairing apparatus of the present embodiment is the same as the configuration of the defect repairing apparatus of the third embodiment. Only the repairing region setting unit 53 is different. The repair area setting unit 53' shown in FIG. 15 sets the broom line 21, the information line 22, and the loop factor 23 to the laser repair prohibition areas ΚΑι to KA5, and then around the loop factor 23 of the pixel area. Set to the laser irradiation area AA. For example, in the configuration example of Fig. 15, the wiring formed by the scan line 21 and the information line 23 is narrow between the wiring factor and the loop factor 23, and in particular, the information line 22 and the loop factor 23 are narrow. As shown in Fig. 16, the loop factor 23 is on the current defect 28' but one end of the defect 28 is close to the information line 22, so that there is a power shortage. Therefore, the laser irradiation area A A is set around the loop factor 23, whereby the defects which may cause a short circuit can be preferentially removed and repaired. In this way, Ben

第26頁 1325495 五、發明說明(23) 實施形態之缺陷修復裝置,即可確實修復構成部位未跨越 區域、但接近某區域且造成電力短路的缺陷。另外,在本 實施形態中,雷射照射區域AA,可設定為跨越回路因子23 周圍全區、亦可僅設定一部分。 另外’雷射照射區域AA,可利用影像處理自動設定於 回路因子23周圍、亦可利用繪圖工具等以手動設定。 另外’前述雷射照射區域A A,雖設定於回路因子23周 圍’但在模型(pattern)中,彼此相鄰的配線與/或回路 因子之間’可設定於靠近的區域上。此外,前述第--第 四實施形態中’以使用於液晶顯示螢幕的面板為例,形成· 晶體管(transistor)等驅回路因子、配線與電極的無線電 測距護罩(radio distance mask),將其所構成的1個晝素 反覆配置在矩陣狀上’即稱為模型(pattern)。當然,不 僅限於此,也可利用使用於·半導體設計的矽質面板。 · 前述各實施形態,雖參考圖示具體加以說明,但本發 明不僅限於前述各實施形態中的記載事項,只要在不違背 本發明主旨的範圍内,當然都可以進行各種改良與變更。Page 26 1325495 V. INSTRUCTION OF THE INVENTION (23) In the defect repairing device of the embodiment, it is possible to reliably repair a defect in which the constituent portion does not cross the region but is close to a certain region and causes a short circuit of electric power. Further, in the present embodiment, the laser irradiation area AA may be set to span the entire area around the loop factor 23, or only a part thereof may be set. Further, the laser irradiation area AA can be automatically set around the loop factor 23 by image processing, or can be manually set by using a drawing tool or the like. Further, the aforementioned laser irradiation area A A is set to be around the loop factor of 23, but in the pattern, the line between the wiring and/or the loop factor adjacent to each other can be set in the vicinity. Further, in the above-described fourth-fourth embodiment, a panel for use in a liquid crystal display screen is used as an example, and a radio distance mask such as a drive circuit, a wiring, and an electrode is formed. The one element that is formed is repeatedly arranged in a matrix form, which is called a pattern. Of course, it is not limited to this, and a enamel panel used for semiconductor design can also be used. The present invention is not limited to the above-described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the invention.

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【圖式之簡單說明:】 圖一係本發明缺陷修正裝置第一實施例的方塊圖。 圖二係表示修與對象概略的上視圖。 圖二係本發明優先領域的概略圖。 圖四係圖三中基板上的模型概略圖。 圖五係表示圖四模型上缺陷相對優先領域的位置概略圖。 圖六係第一實施例中具有缺陷檢出機能的缺陷修正裝置的 概略方塊圖。 圖七係基板的概略表示圖。 圖八係圖七中無缺陷模型的概略圖。 圖九係設有雷射光修復禁止區域的參照圖像的概略圖。 圖十係表示合有缺陷的模型的概略圖。 圖十一係本發明缺陷修正裝置第二實施例的方塊圖。 圖十二係設有複數雷射光修復禁止區域的參照圖像的概略 圖。 圖十二係表不有缺陷及設定處理領域的模型概略圖。 圖十四係圖十三中缺陷部修正一的模型概略圖。 圖十五係已設定處理領域的模型概略圖Q 圖十六係表示有缺陷模型的概略圖。 【符號說明】 1 ........................缺陷修復裝置 2 .......................修復部 3 ............................控制部BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a block diagram showing a first embodiment of the defect correction device of the present invention. Figure 2 is a top view showing the outline of the repaired object. Figure 2 is a schematic diagram of the priority areas of the present invention. Figure 4 is a schematic diagram of the model on the substrate in Figure 3. Figure 5 is a schematic diagram showing the position of the defect relative priority area on the model of Figure 4. Fig. 6 is a schematic block diagram of a defect correcting device having a defect detecting function in the first embodiment. Fig. 7 is a schematic representation of a substrate. Figure 8 is a schematic diagram of the defect-free model in Figure 7. Fig. 9 is a schematic view showing a reference image in which a laser light repair prohibition region is provided. Figure 10 is a schematic diagram showing a model with defects. Figure 11 is a block diagram showing a second embodiment of the defect correction device of the present invention. Fig. 12 is a schematic view showing a reference image of a plurality of laser light repair prohibition regions. Figure 12 is a schematic diagram of the model with no defects and set processing areas. Figure 14 is a schematic diagram of the model of the defect portion 1 in Figure 13. Fig. 15 is a schematic diagram of a model in which a processing area has been set. Fig. 16 is a schematic diagram showing a defective model. [Description of Symbols] 1 ........................ Defect Repair Device 2 ................. ...Repair 3 ............................Control

第28頁 1325495 圖式簡單說明 4 ..........................修復區域設定部 5 ..........................優先度設定部 6 ........................ 攝影部 7 .........................缺陷檢出部 、 8 .........................記憶體 9 .........................特徵抽取部 ' 10 .......................缺陷判別部 11 ........................優先順位設定部 21 ........................ 掃瞄線 22 .........................信號(資料)線 钃[ 23 .........................回路因子 24a.........................缺陷 24b.........................缺陷 24c....................·· ·.' 缺陷 ' 25a .........................缺陷 25b.........................缺陷 26 .........................照射區域 27 .........................缺陷 28 .........................缺陷 _ 30 .......................·.缺陷修復部 31 ........................ 修復部 32 .......................資訊產生部 33 ........................ XY 表 34 ........................ 控制部Page 28 1325495 Schematic description of the diagram 4 .......................... Repair area setting section 5 .......... ................Priority setting section 6........................ Photographic department 7 .. ....................... Defect detection department, 8 ..................... ....Memory 9 .........................Feature Extraction Department ' 10 ............. .......... defect determination unit 11........................Priority order setting unit 21...... ................. Scanning line 22........................ Signal (data)钃 [ 23 .........................loop factor 24a.................. .......Defect 24b......................... Defect 24c.............. ......···.' Defects 25a .........................Defect 25b......... ................ Defect 26 ......................... Irradiation area 27 .... ..................... Defect 28 ......................... Defect _ 30 ........................ Defect Repair Section 31 ......................... .... Repair section 32 .......................Information generation section 33 ................ ........ XY Table 34 ................. ....... Control Department

第29頁 1325495 圖式簡單說明 35 .........................雷射因子 36 .........................雷射控制部 37 .........................照射區域調整部 38 .........................基本資訊設定部 39 .........................禁止區域設定部 40 .........................資訊記憶部 ' 40a.........................參考資訊記憶部 40b.........................修復對象資訊記憶部 41 .........................缺陷檢出部 42……..................區域設定部 < 43 .........................驅動控制部 44 .........................修復區域設定部 53 .........................修復區域設定部 54 .........:...............控制部 ‘ A1 .........................第一優先區域 A2.........................第二優先區域 A3.........................第三優先區域 KA......................... 雷射修復禁止區域 A A........................·.雷射照射區域 應Page 29 1325495 Schematic description 35.........................Laser factor 36 ............ .............the laser control unit 37.........................the illumination area adjustment unit 38.. .......................Basic information setting section 39 ..................... ...prohibited area setting unit 40.........................Information memory unit '40a............ .............Reference information storage unit 40b......................... Repair target information storage unit 41. ........................ defect detection unit 42........................ area Setting section < 43 ......................... drive control section 44 ................ .........Repair area setting unit 53.........................Repair area setting unit 54... ...:...............Control Department 'A1 .........................First Priority area A2.........................Second priority area A3................. ........The third priority area KA......................... Laser repair prohibited area A A..... ...................·.The laser irradiation area should

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Claims (1)

ί'""....._ |丨|_ ---- k年π月々修 L---申請案號.· 93 111 858 第93111858號申請專利範圍修正本 98鹰 1. -種缺_正裝置’其係糊雷射光照射修復面板上缺 陷的缺陷修復裝置,其具備有: 檢查前述面板上缺陷的缺陷檢出部丨與 對前述缺陷檢出部檢出之前述缺陷,設定修復順序優先 度的優先度設定部;與 依前述優先度,以前述雷射光照射缺陷進行修復的修復 部等元件為其特徵者。 2. 如申請專利範圍第丨項所述之缺陷修正裝置,其令前述 缺修復裝置巾,擁有從前述缺陷巾抽取特徵量的特徵 量抽取部,前述優先度設定部,則擁有依據前述特徵量 判斷各缺陷是否為修復對象的缺陷判別部為其特徵者。 3. 如申請專利範圍第2項所述之缺陷修正裝置,其中前述 缺陷修復裝置中’前述優先度設定部,將設置於前述面 板之驅動回路因子上方與配線上方所形成的模型 (pattern)區域設定為修復優先區域為其特徵者。 1325495 申請案號:93111858 4.如申请專利範圍第3項所述之缺陷修正裝置,其中前述 缺陷修復裝置中,前述缺陷檢出部,拍攝複數之模型 (pattern)形成的面板,製作包含缺陷的影像資訊,前述 優先度設定部’依據前述複數模型(pattern),將前述 優先區域设定為模板(template),並利用前述模型調整 前述模板的位置、且與前述影像資訊進行疊合,利用設 於前述模板上的優先區域,對包含於影像資訊中的缺 1¾,5变疋修復順序的優先度為其特徵者。 5.如申請專利細幻項所述之缺陷修正襄置,其中前述 缺陷修復裝置中,前述優先度設定部,第一、對驅動回路 因子的形成造成障礙的缺陷、或無法驅動的缺陷;第 二、其他回路與配線與電極等電力通路造成的電力短路 缺陷;第三、使配線斷線的缺陷,依前述以外之缺陷順 位’配置设定優先度的優先區域為其特徵者。 6.如申請專利範圍第5項所述之缺陷修正裝置,其中前述 缺陷修復裝置中,前述攝影部,拍攝修復處理後之前述面 板,並將攝得的影像資訊傳送到前述缺陷檢出部 2 1325495 申請案號:93111858 祕出部,比較_處輯雜#賴料處理前影像資 訊’藉此於雷射修復處理後檢查出前述缺陷為其特徵者。 7· -種缺祕正裝置’其係彻雷射光照祕復面板上缺 陷的缺陷修復裝置,其具備有: 檢查前述面板上缺陷的缺陷檢出部;與 將禁止前述雷射光照射的照射禁止區域設定於前述 面板上之照射禁止區域設定部;與 判別刚述缺陷檢出部檢出之前述缺陷是否與前述照射禁 止區域有關,並且設定修復區域的修復區域設定部;與 對刖述修復區域設定部判定與前述照射禁止區域有關的 缺陷以外之複數缺陷,設定修復順度的優先度,且設定 修復部位數的優先度設定部等為其特徵者。 8. —種缺陷修正裝置,其係利用雷射光照射修復面板上缺 陷的缺陷修復裝置,其具備有: 檢查前述面板上缺陷的缺陷檢出部;與 在前述面板上設定禁止修復的禁止區域之禁止區域設定 部;與 3 申請案號:93111858 判別前述缺陷檢出部檢出之前述缺陷是否與前述禁 止區域有關’並且對與禁止區域有關的缺陷設定禁止修 復的修復區域設定部;叙 對前述修龍域奴料禁錄復之雜,㈣述雷射光 照射後進行修復的修復部等元件為其特徵者。 9.如申請專利範圍第8項所述之缺陷修正裝置,其中前述 缺陷修復裝置中,將設置於前述面板之驅動回路因子上 方與配線上方所形成的模型(pattern)區域’設定為前 述禁止區域為其特徵者。 10·如申請專利範圍第8項所述之缺陷修正裝置,其中前述 缺陷修復裝置中,前述修復區域設定部,將前述面板上 之别述禁止區域以外的區域,設定為處理區域為其特徵 者。 11. 一種缺陷修正裝置,其係利用雷射光照射修復面板上 缺陷的缺陷修復裝置,其具備有: 檢查前述面板上缺陷的缺陷檢出部;與 脑林丄 申請案號:93111858 -别核射光照射_難止區域奴於前述面 板上之照射禁止區域設定部;與 彻削述缺陷檢出部檢出之前述缺陷是否與前述照射禁 止區域有關,並且將前述騎禁止區域内驅動回路因子 周圍設定為雷射光照射區域的修復區域設定部;與 對前述雷射絲射輯__陷,提高修復順序優先 度的優先度設定部;與 依則述優度’以前述雷射光騎缺陷進行修復的缺陷修 復部等元件為其特徵者。 .種缺陷修正裝置,其係彻雷射光照射修復面板上 缺陷的缺陷修復裝置,其具備有: 檢查前述面板上缺陷的缺陷檢出部;與 將禁止前述雷射光照射的照射禁止區域設定於前述面板 上之照射禁止區域設定部;與 判別前述缺陷檢出部檢出之前述缺陷是否與前述照射 禁止區域有關,相對於與該照射禁止區域有關的缺 陷,將該照射禁止區域上方以外的缺陷部分設定為雷 射光照射區域的修復區域設定部;與 灼年。丨月於日修正雜頁丨 ~~-__| 申請案號:93111858 對則述雷射光照射區域、與前述照射禁止區域無關的缺 陷,設定修復順序優先度的優先度設定部;與 依前述優度,以前述雷射光照射缺陷進行修復的缺陷 修復部等元件為其特徵者。 13.-種缺_正方法’其係觀雷射光照雜復面板上缺 陷的缺陷修復方法,其乃指檢查前述面板上缺陷,並對 檢出的前述缺陷’設定修復順序優先度與修復部位數, 再依前述優先度,以前述雷射光照射缺陷進行修復等為 特徵者。 14· -種缺陷修正方法,其利用雷射光照射修復面板上缺 陷的缺陷修復方法,用含與回路模式相同之無缺陷之基 準模式的參考f彡像,其乃指觸檢讀述面板上缺關 缺陷檢出工程;與 禁止照射前述雷祕之照難止區域設定於前述面板上 的照射禁止區域設定工程;與 判別前述缺陷檢出工程中查出的前述缺陷是否與前述 照射禁止區域有關的照射禁止區域判別工程與 、 ~ 申請案號:93111858 對前述照射禁止區域判別工程中,判定為與前述照射 禁止區域有_缺陷以外之複數缺陷,設定修復順序 的優先度、設定修復部位數的優先度奴工程;與 依前述優先度’以前述雷射光照雜陷進行修復之缺 陷修復工程等為其特徵者。 15. -種缺陷修正方法’其细雷射光·修復面板上缺 陷的缺陷修復展置,其乃指具備檢查前述面板上缺陷 的缺陷檢出工程;與 禁止照射則述雷射光之照射禁止區域設定於前述面板上 的照射禁止區域設定工程;與 判別前述缺陷檢出工程中查出的前述缺陷是否與前述照 射禁止區域有關的照射禁止區域判別工程;與 對前述照射禁止區域判別工程中,判定為與前述照射禁 止區域有關的缺陷’在該照射標止區域上方以外之缺陷 部分,設定雷射光照射區域的修復區域設定工程;與 對前述雷射光照射區域、與前述照射禁止區域無關之缺 陷,設定修復順序優先度、設定修復部位數的優先度設 定工程;與 7 1325495_, 1- I n和I月私日修正替換頁i - 1 申請案號:93111858 依前述優先度,以前述雷射光照射缺陷進行修復之缺陷 , 修復工程等為其特徵。ί'""....._ |丨|_ ---- k-year 々月々修 L---application number.· 93 111 858 No. 93111858 patent application scope amendment Ben 98 Eagle 1. A defect repairing device for repairing a defect on a repair panel is provided with: a defect detecting portion 检查 for detecting a defect on the panel and the aforementioned defect detected by the defect detecting portion, setting A priority setting unit for repairing the priority of the sequence; and an element such as a repairing portion that repairs the defect by the laser light irradiation according to the priority described above. 2. The defect correction device according to the invention of claim 2, wherein the missing repair device towel has a feature amount extracting portion that extracts a feature amount from the defective towel, and the priority setting portion has a feature amount according to the feature amount It is determined whether or not each defect is a feature of the defect determination unit to be repaired. 3. The defect correction device according to claim 2, wherein the priority setting unit in the defect repairing device sets a pattern region formed above the driving loop factor of the panel and above the wiring. Set to fix the priority area as its feature. The defect correction device according to claim 3, wherein in the defect repairing device, the defect detecting portion captures a pattern formed by a plurality of patterns, and the defect is formed. In the video information, the priority setting unit sets the priority area as a template according to the complex pattern, and adjusts the position of the template by using the model, and superimposes the image information, and uses the image. The priority area on the template is characterized by the priority of the repair order included in the image information. 5. The defect correction device according to the above-mentioned defect repairing device, wherein the priority setting unit is first, a defect that causes an obstacle to the formation of a driving circuit factor, or a defect that cannot be driven; Second, other circuit and wiring and electrode and other power path caused by power short-circuit defects; Third, the wire breakage defects, in accordance with the above-mentioned defects in the 'location priority priority area is characterized. 6. The defect correction device according to claim 5, wherein in the defect repairing device, the photographing unit photographs the panel after the repair processing, and transmits the captured image information to the defect detecting portion 2 1325495 Application No.: 93111858 Secret Department, compare _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ 7·-------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- The irradiation prohibited area setting unit set in the panel; the determination of whether or not the defect detected by the defect detecting unit is related to the irradiation prohibited area, and the repair area setting unit of the repair area; and the repair area The setting unit determines the plurality of defects other than the defects related to the irradiation prohibition region, sets the priority of the repair smoothness, and sets the priority setting unit of the number of repaired portions or the like as a feature. 8. A defect correction device for irradiating a defect repairing device for repairing a defect on a panel by using laser light, comprising: a defect detecting portion for inspecting a defect on the panel; and a prohibiting region for prohibiting repair on the panel The forbidden area setting unit; and the third application number: 93111858, determining whether the defect detected by the defect detecting unit is related to the forbidden area, and setting a repair area setting unit for prohibiting repair of the defect related to the prohibited area; The repaired dragon domain is forbidden to record the confession, and (4) the components such as the repairing part that is repaired after the laser light is irradiated. 9. The defect correction device according to claim 8, wherein the defect repairing device sets a pattern region formed above a driving loop factor of the panel and over a wiring to the prohibited region. Characterized by it. The defect correction device according to claim 8, wherein the repair area setting unit sets an area other than the prohibited area on the panel as a processing area. . A defect correction device for repairing a defect on a repair panel by using laser light, comprising: a defect detection portion for inspecting a defect on the panel; and a brain forest application number: 93111858 - a nuclear light The irradiation-difficult area is excluded from the irradiation prohibited area setting unit on the panel; whether the defect detected by the defect detecting unit is related to the irradiation prohibited area, and the driving circuit factor in the riding prohibited area is set around a repair area setting unit for the laser light irradiation area; a priority setting unit for increasing the priority of the repair order for the laser shots; and a repairing of the laser light by the aforementioned Components such as defect repairing parts are characteristic. a defect repairing device for repairing a defect on a repair panel by laser light, comprising: a defect detecting portion for inspecting a defect on the panel; and an irradiation prohibiting region for prohibiting the laser light from being irradiated An irradiation prohibition region setting unit on the panel; and determining whether the defect detected by the defect detecting unit is related to the irradiation prohibition region, and the defect portion other than the upper portion of the irradiation prohibition region with respect to the defect related to the irradiation prohibited region Set to the repair area setting section of the laser light irradiation area;丨月于日改杂丨丨~~-__| Application No.: 93111858 For the laser light irradiation area, the defect that is not related to the above-mentioned irradiation prohibited area, set the priority setting part of the repair order priority; The components such as the defect repairing portion repaired by the aforementioned laser light irradiation defect are characterized. 13.--------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- The number is further characterized by the aforementioned priority, the repair by the aforementioned laser light irradiation defect. 14. A defect correction method for repairing defects on a repair panel by using laser light, using a reference f-image containing a defect-free reference pattern identical to the loop mode, which refers to a missing on the touch panel a defect detection project; an illumination prohibition area setting project set on the aforementioned panel in a prohibited area where the irradiation of the aforementioned ray is prohibited; and determining whether the aforementioned defect detected in the defect detection project is related to the aforementioned irradiation prohibited area In the above-mentioned irradiation prohibited area discrimination project, it is determined that there is a plurality of defects other than the defect in the irradiation prohibited area, and the priority of the repair order and the number of the repaired parts are set as the priority. The slavery project is characterized by a defect repairing project based on the aforementioned priority 'repaired by the aforementioned laser illumination traps. 15. - Defective correction method 'The defect detection and repairing of the defects on the fine laser light and repair panel, which means that the defect detection project for inspecting the defects on the panel is included; and the irradiation prohibition area setting for the laser light is prohibited. An irradiation prohibition region setting project on the panel; and an illumination prohibition region discrimination process for determining whether the defect detected in the defect detection project is related to the irradiation prohibition region; and in the discrimination prohibition region discrimination project, it is determined as The defect related to the irradiation prohibition region' is set in the defect portion other than the irradiation target region, and the repair region setting project of the laser light irradiation region is set; and the defect related to the laser light irradiation region and the irradiation prohibition region is set. Fix the priority of the order, set the priority setting of the number of repair parts; and 7 1325495_, 1- I n and I month private day correction replacement page i - 1 Application No.: 93111858 According to the above priority, the aforementioned laser light is used to illuminate the defect The defects of repair, repair engineering, etc. are characteristic.
TW093111858A 2003-05-09 2004-04-28 Defect repair system and method of repairing defect TWI325495B (en)

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