JP2010075979A - Laser beam machining apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus which is readily responded even when any serious defective machining not to be repaired occurs during the machining of a product. <P>SOLUTION: A control device 31 reads the product data on a machined product stored in a machining data storage unit 39, and controls the action of each part so as to machine the product out of a workpiece. When machining the product, presence/absence of any defective machining is detected by a detector 28. According to the result of detection by the detector 28, the data on the product in which any defective machining occurs are stored in a defective machining data storage unit 40. The data on the product stored in the defective machining data storage unit 40 are displayed on a display unit 33. Any defectively machined product is re-machined out of another workpiece by the control of the control device 31 based on the instruction from a manually operating unit 32. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing machine that irradiates a workpiece with laser light and cuts a product having a predetermined shape, and in particular, a laser processing machine that can cope with a processing defect that occurs during processing of a product. It is about.

Conventionally, as this type of laser processing machine, for example, a configuration disclosed in Patent Document 1 has been proposed. In this conventional configuration, when a processing defect is detected by the detector during the processing of the product, the processing is interrupted, and the rest during the processing is skipped to proceed to the next processing. The skipped machining start position and machining program pointer are stored in the storage unit. In accordance with the correction processing command, positioning is performed at the stored processing start position, and based on the processing program and the stored pointer, the skipped processing is performed to correct the processing defect portion.
JP 2004-306073 A

  In this conventional laser processing machine, a processing defect occurs during processing of a product, and processing of the defective portion is skipped. Then, based on the subsequent correction processing command, the skipped processing is performed to correct the processing defect portion. For this reason, there has been a problem that it is impossible to cope with a severe processing failure that cannot be corrected.

  The present invention has been made paying attention to such problems existing in the prior art. An object of the present invention is to provide a laser processing machine that can easily cope with a case where a severe processing defect that cannot be corrected during processing of a product occurs.

  In order to achieve the above-mentioned object, the present invention provides a storage means for storing product data relating to a processed product, and reads out the product data stored in the storage means, and cuts the product from the workpiece and processes each part. In a laser processing machine having a control means for controlling the operation, data relating to a product in which a processing defect has occurred according to a detection means for detecting the presence or absence of a processing defect at the time of processing the product, and a detection result by the detection means The defective product data storage means for storing the product, the display means for displaying the data related to the product stored in the defective product data storage means, and the processing of the defective product based on an instruction from the manual operation unit And a reworking means.

  Therefore, in the present invention, when a processing failure is detected by the detection means while processing a product from a workpiece, data relating to the product in which the processing failure has occurred is stored in the defective product data storage means. At the same time, after the processing of the product is finished, data relating to the product stored in the defective product data storage means is displayed on the display means. Then, when reworking is instructed from the manual operation unit based on the display on the display means, the reworked means reworkes the work-defective product from another workpiece. Therefore, even when a severe processing failure that cannot be corrected during the processing of the product occurs, it can be easily handled in a corresponding manner.

  Further, in the above-described configuration, the defective product data storage unit includes correction processing unit that stores data related to the processing defect portion and corrects the processing defect portion based on an instruction from a manual operation unit, and It is preferable to provide a selection means for selecting one of the reworking means and the correction processing means. In the case of such a configuration, after the processing of the product is completed, the reprocessing of the defective product and the correction processing of the defective processing portion can be selected by the selection unit based on the display on the display unit. Therefore, it is possible to appropriately deal with the processing failure state.

When a processing failure is detected by the detection means, the control means may repeat processing of the processing failure portion.
In addition, even if the processing of the processing defect location is repeated a specified number of times, if the processing failure is not resolved, the data regarding the product in which the processing failure has occurred is stored in the defective product data storage unit together with the data regarding the processing failure location The control means may be configured to skip the processing of a processing defect portion after storing the data.

  As described above, according to the present invention, it is possible to easily cope with a case where a severe processing failure that cannot be corrected during processing of a product occurs.

An embodiment of the present invention will be described below with reference to the drawings.
As shown in FIGS. 1 and 2, in the laser processing machine of this embodiment, a table 22 is fixedly disposed on a floor surface 21. On the table 22, workpieces W1, W2, W3 made of a plurality of metal plates or the like are set. Further, a spare work W4 made of a metal plate or the like is set on the table 22.

  A pair of rail bases 23 are fixedly disposed on the floor surface 21 so as to be positioned close to both sides of the table 22. A guide rail 24 is laid on each rail base 23 so as to extend in the X-axis direction within a horizontal plane. On both guide rails 24, a frontal columnar column 25 is supported so as to be movable in the X-axis direction. A machining head 26 is supported by the column 25 so as to be movable in a Y-axis direction perpendicular to the X-axis direction and a Z-axis direction extending in the vertical direction in a horizontal plane. A laser nozzle 27 is provided at the lower end of the processing head 26 for irradiating the workpieces W1 to W4 with a laser beam to cut out a product.

  As shown in FIGS. 1 and 2, a processing failure detector 28 including, for example, three optical sensors is provided inside the processing head 26. The processing defect detector 28 detects the light intensity of the laser processing portion of the workpiece and outputs a detection signal corresponding to the light intensity. For example, when a flame is generated due to a processing failure due to the presence of foreign matter, a signal according to the brightness of the flame is output. Therefore, the processing failure detector 28 constitutes a detecting means for detecting the presence or absence of processing failure when processing the product of the workpiece processing portion. A workpiece edge detector 29 made of a laser displacement sensor is disposed on the side surface of the lower end portion of the machining head 26. The workpiece edge detector 29 detects the edge positions of the workpieces W1 to W4 when setting the origin of the workpieces W1 to W4 prior to processing the product.

  As shown in FIGS. 1 and 2, a laser oscillator 30 for generating laser light from a laser nozzle 27 is mounted on the left side of the column 25 in the figure. A control device 31 is mounted on the right side of the column 25 in the figure. This control device 31 constitutes a control means for controlling the operation of each part of the laser processing machine, a reworking means for reworking a machined defective product, and a corrective machining means for correcting a defective machining part. ing.

  On the control device 31, there is disposed an operation unit 32 including an operation panel for manually inputting product data, an instruction for reworking a defective product, an instruction for correcting a defective processing part, and the like. On the operation unit 32, a display unit 33 is disposed as a display unit including a display for displaying product data related to a processed product, data related to a product in which a processing defect has occurred, and the like. This display unit 33 constitutes a selection means for selecting one of the operations of reworking a process failure product and correcting a process failure location. That is, as shown in FIG. 7, the correction processing mode A or the reprocessing mode B is selected with the touch panel method in the state where the data display screen I relating to the product in which the processing defect has occurred is displayed on the display unit 33. It is supposed to be.

Next, the electric circuit configuration of the laser beam machine configured as described above will be described.
As shown in FIG. 3, a storage device 36 is connected to the control device 31. The storage device 36 is provided with a program storage unit 37, an NC program storage unit 38, a machining data storage unit 39, and a machining defect data storage unit 40. The program storage unit 37 stores a program for controlling the operation of the entire laser beam machine. The NC program storage unit 38 stores various machining programs for machining products. The machining data storage unit 39 constitutes storage means for storing product data related to the processed product read from the NC program storage unit 38 prior to product machining. The processing defect data storage unit 40 stores defective product data that stores data relating to a product in which the processing failure has occurred, together with data relating to the processing failure location, when the processing failure is detected by the processing failure detector 28 during processing of the product. Means.

  As shown in FIG. 3, various operation signals are input from the operation unit 32 to the control device 31, and detection signals are input from the processing defect detector 28 and the workpiece edge detector 29. Further, the control device 31 outputs an operation stop signal to the laser oscillator 30 and the laser nozzle moving mechanism 41 and outputs display signals of various data to the display unit 33. The laser nozzle moving mechanism 41 includes a servo motor or the like for moving the column 25 in the X-axis direction and moving the machining head 26 in the Y-axis direction and the Z-axis direction to change the position of the laser nozzle 27. Has been.

  In this embodiment, the control device 31 controls the machine product data (hereinafter referred to as product data) read from the NC program storage unit 38 and stored in the machining data storage unit 39. For example, the rectangular first products M1a to M1g and the ring-shaped second products M2a and M2b as shown in FIG. 4 are sequentially cut on the workpieces W1 to W3.

Next, the operation of the laser beam machine configured as described above will be described.
First, in this laser beam machine, according to a predetermined program stored in the NC program storage unit 38 of the storage device 36, the workpieces W1 to W3 on the table 22 are cut and processed to obtain a plurality of first products M1a to M1g. And the schedule driving | operation operation | movement which manufactures 2nd products M2a and M2b is demonstrated. Now, at the time of this scheduled operation, when the machining operation is started with a plurality of workpieces W1 to W3 set on the table 22, each step shown in the flowchart of FIG. The operation of S) is executed in order.

  First, in S1, the origin of the workpiece W1 to be machined with the first machining schedule is set. In this case, the workpiece edge detector 29 attached to the machining head 26 is used to automatically detect the origin position and tilt angle of the workpiece W1, and the origin movement and coordinate rotation of the workpiece W1 are performed based on the detection result. Done. That is, as indicated by an arrow S1 in FIG. 6, the laser nozzle 27 is moved by the laser nozzle moving mechanism 41 to a predetermined angle teaching point Pq designated in advance. Further, as indicated by an arrow S2 in the figure, the laser nozzle 27 is moved in the Y-axis direction from the angle teaching point Pq, and the workpiece edge detector 29 scans the first workpiece edge position P1.

  Next, as indicated by an arrow S3 in FIG. 6, the laser nozzle 27 moves from the angle teaching point Pq to the separation position P2 on the workpiece W1 separated in the X-axis direction by a predetermined scanning distance L specified in advance. It is moved from one workpiece edge position P1. Further, as indicated by an arrow S4 in the figure, the laser nozzle 27 is moved in the Y-axis direction from the separation position P2, and the second workpiece edge position P3 is scanned by the workpiece edge detector 29. Subsequently, as indicated by an arrow S5 in the drawing, the laser nozzle 27 is moved from the second workpiece edge position P3 to the angle teaching point Pq.

  Next, as indicated by an arrow S6 in FIG. 6, the laser nozzle 27 is moved in the X-axis direction from the angle teaching point Pq, and the third workpiece edge position P4 is scanned by the workpiece edge detector 29. Then, the control device 31 calculates the tilt angle θ of the workpiece W1 and the position of the origin Pp from the coordinates of the first workpiece edge position P1, the second workpiece edge position P3, and the third workpiece edge position P4. Thereafter, as indicated by an arrow in FIG. S7, the coordinates of the workpiece W1 are adjusted so that the laser nozzle 27 is moved from the third workpiece edge position P4 to the origin Pp and the position data of the workpiece W1 becomes the inclination angle θ. The data is rotated.

  Further, the automatic detection of the origin position and inclination angle of the workpiece W1 and the movement of the workpiece W1 based on the detection result and the coordinate rotation are similarly performed at the start of machining of the workpieces W2 to W4 described later. Executed.

  Next, in S <b> 2 of the schedule operation shown in FIG. 5, the machining program related to the workpiece W <b> 1 is read from the NC program storage unit 38 and stored in the machining data storage unit 39. In S3, the product number of the first product M1a shown in FIG. 4, for example, the product to be processed first in the processing program stored in the processing data storage unit 39 is stored. In S4, the coordinates of each processing part relating to the first product M1a are set. In S5, the machining start position of the first machining part among the machining parts of the first product M1a is stored.

  Subsequently, in S6, the laser nozzle 27 is moved in the X-axis direction and the Y-axis direction by the laser nozzle moving mechanism 41, and laser light is irradiated from the laser nozzle 27 onto the work W1, and the first product M1a. The cutting process of the first processed part is started. In S7, the machining location is optically detected by the machining defect detector 28, and it is determined whether an abnormality such as a machining defect has occurred based on the detection result. Then, in the case where the processing of the first processing portion has progressed without causing any abnormality in the determination of S7, the processing of the processing portion is finished in S8.

  On the other hand, if an abnormality such as a processing failure occurs in the determination of S7, an operation (retry operation) for repeating processing of the processing failure portion is executed in S9. In S10, it is determined by the detection of the processing defect detector 28 whether or not the abnormality of the processing defect remains. If it is determined in S10 that there is no abnormality in the processing defective portion, the process proceeds to S8, and the processing of the first processing portion is completed. On the other hand, in the determination of S10, if there is an abnormality in the machining defect portion, it is determined in S11 whether or not the retry operation has reached the specified number of times (2 to 3 times) specified in advance. The

  Then, if the retry operation has not reached the specified number of times, the process returns to S9, and the processing of the defective portion is repeated until the specified number of times is reached. On the other hand, in the determination of S11, when the retry operation reaches the specified number of times, that is, when the processing failure is not eliminated even if the processing of the processing failure portion is repeatedly performed, the processing failure is performed in S12. The data relating to the first product M1a in which the occurrence is generated is stored in the machining defect data storage unit 40 together with the data relating to the machining defect location. After saving the data, the processing of the defective processing portion is skipped, the process proceeds to S8, and the processing of the first processing portion is completed.

  Next, in S13, in the processing of the first product M1a, it is determined whether or not the next processing portion exists. If it is determined in S13 that the next processing portion exists, the process returns to S5, and the operations in S5 to S12 are repeated. Therefore, for example, when the first product M1a shown in FIG. 4 is cut, the circular and square holes in the product are cut and the rectangular product outer shape is cut in order. On the other hand, in the determination of S13, when the processing of each processing part of the first product M1a is completed and there is no next processing part, the process proceeds to S14.

  In S14, it is determined whether or not the next processed product exists. If it is determined in S14 that there is a next processed product, the process returns to S3 and the operations in S3 to S13 are repeated. Therefore, for example, when the workpiece W1 shown in FIG. 4 is processed, the first products M1a to M1g and the second products M2a and M2b are sequentially cut. On the other hand, in the determination of S14, when the processing of each product for one workpiece W1 is completed and there is no next processed product, the process proceeds to S15 and the processing completion processing for the workpiece W1 is performed. Is done.

  Thereafter, in S16, it is determined whether or not there is a workpiece to be machined with the next machining schedule. If it is determined in S16 that there is a workpiece with the next machining schedule, the process returns to S1 and the operations of S1 to S15 are repeated. Therefore, for example, as shown in FIG. 2, when a plurality of workpieces W1 to W3 are set on the table 22, the workpieces W2 and W2 are processed following the processing of the products M1a to M1g, M2a, and M2b on the workpiece W1. The same processing for W3 is sequentially performed. On the other hand, in the determination of S16, when the machining for each of the workpieces W1 to W3 is finished and there are no workpieces of the next machining schedule, all the schedule operation operations are finished.

  And after completion | finish of this schedule driving | operation operation | movement, the data regarding the process defect product and process defect location memorize | stored in the said process defect data storage part 40 are displayed on the display part 33 as a display screen I as shown, for example in FIG. Is done. In this display screen I, for each occurrence of processing failure, the processing schedule number when processing failure occurs, the processing program number when processing failure occurs, the number of the product that has generated processing failure, The number of the machining start position in the product, the coordinates of the machining failure occurrence location in the X-axis direction and the Y-axis direction, the date when the machining failure occurred, and the time when the machining failure occurred are displayed.

  In addition, as shown in FIG. 7, the display screen I includes a correction processing mode A for correcting the processing failure location Ng corresponding to the display of each processing failure occurrence location, and reprocessing of the processing failure product. The touch button It1 for selecting any one of the reprocessing mode B for performing is displayed. Further, on the display screen I, a touch button It2 for setting whether or not to execute the operation of the correction processing mode A or the reprocessing mode B is displayed corresponding to the display of each processing defect occurrence location.

  For example, as shown by x in FIG. 4, when processing defects occur during processing of the first products M1b, M1c, M1e and the second product M2b on one workpiece W1, the display unit 33 is displayed. A display screen I as shown in FIG. 7 is displayed. Therefore, based on the display screen I, the operator confirms the processing failure location Ng of each product M1b, M1c, M1e, M2b, and re-applies the correction processing mode A with the touch button It1 according to the processing failure status. While selecting with the process mode B, operation execution of a selection mode can be set with the touch button It2.

  In this case, the correction processing mode A and the reprocessing mode B are alternately selected by repeatedly operating the touch button It1. Further, by repeatedly operating the touch button It2, the operation execution on state and the operation non-execution off state are alternately set.

  Next, an operation operation when correcting or reworking the defective product will be described. Now, in this machining operation, when the machining operation is started in a state where the spare workpiece W4 is set side by side with the workpieces W1 to W3 that have been machined on the table 22, the control of the control device 31 causes the flowchart of FIG. The operations of the steps shown (hereinafter simply referred to as S) are executed in order.

  First, in S21, it is determined whether or not the correction processing mode A is selected for the processing of the first processing defective product set to the ON state on the display screen I. When the correction machining mode A is selected in the determination of S21, the process proceeds to S22 and S23, and the work origin setting and machining program are set as in S1 and S2 in the flowchart of FIG. A call is made. In the next S24, a jump to the designated product is performed. That is, as shown in FIG. 8, when the machining defect location Ng generated in the first product M1b on the workpiece W1 is corrected, the first first product M1a is jumped to the second first product. M1b is set. In FIG. 8, in order to clearly show the correction processing portion, a portion that has been processed normally is indicated by a chain line, and a processing defect portion Ng that requires correction processing is indicated by a solid line.

  Subsequently, in S25, as in the case of S4 in the flowchart of FIG. 5 described above, the coordinates (local coordinates) of each processing unit relating to the first product M1b are set. In S26, a jump to the machining start position displayed on the display screen I is performed, and the laser nozzle 27 is moved to the machining start position. In S27, while the laser nozzle 27 is moved in the X-axis direction and the Y-axis direction, a laser beam is irradiated from the laser nozzle 27 to the processing defect portion Ng of the first product M1b, and the processing defect portion Ng is corrected. Processing starts. Thereafter, in S28, the correction processing of the processing defect portion Ng is completed.

  Further, after the correction process is completed, it is determined in S29 whether or not there is a process for the next defective process product set to the ON state on the display screen I. If it is determined in S29 that there is a next defective processing product, the process returns to S21, and the operations in S21 to S28 are repeated. On the other hand, in the determination of S29, when there is no processing of the next defective processing product, the operation for correcting processing or reprocessing of the processing defective product ends.

  On the other hand, if it is determined in S21 that the rework mode B has been selected for the processing of the defective product, the process proceeds to S30 and S31. In S30 and S31, as in the case of S1 and S2 in the flowchart of FIG. 5, the work origin setting and the machining program are called. In this case, the workpiece origin setting is performed in the spare workpiece W4 shown in FIG. In the next S32 and S33, the jump to the designated product and the setting of the coordinates (local coordinates) are performed as in the case of S24 and S25.

  Thereafter, in S34, the laser nozzle 27 is moved in the X-axis direction and the Y-axis direction, and the laser beam is irradiated onto the workpiece W4 from the laser nozzle 27, and the first processing related product with the rework mode B selected. Cutting processing of the processed portion is started. Thereafter, in S35, the reworking of the first machined part related to the defective product is finished. In the next S36, it is determined whether or not the next processed portion exists in the reprocessed product.

  If it is determined in S36 that the next processing portion exists, the process returns to S34, and the operations in S34 and S35 are repeated. On the other hand, in the determination of S36, when the processing of each processing part of the reprocessed product is finished and there is no next processing part, the process proceeds to S29 to process the next processing defective product. An operation for determining whether or not exists is performed.

  Therefore, for example, as indicated by a cross in FIG. 4, it is determined that the machining failure location Ng of each of the first products M1b and M1c on the workpiece W1 cannot be corrected, and the rework mode B is selected for those machining failures. When set, as shown in FIG. 9, the first products M1b and M1c are reworked using the spare workpiece W4.

  As described above, in the laser processing machine according to the present invention, when a processing defect occurs during processing of the products M1a to M1g, M2a, and M2b from the workpieces W1 to W3, based on the reprocessing instruction from the operation unit by the operator. Thus, the machined product can be reworked from another work W1. Therefore, even when a severe processing failure that cannot be corrected during the processing of the product occurs, it can be easily handled in a corresponding manner.

  Furthermore, in the laser processing machine of this embodiment, it is possible to confirm a processing defect occurrence location after the processing of the product is finished, and to selectively set the correction processing mode A for the processing failure location Ng and the rework mode B for the processing failure product. It has become. Therefore, it is possible to determine whether each processing failure point Ng is correctable or not correctable and appropriately take a countermeasure according to the processing failure state.

(Example of change)
In addition, this embodiment can also be changed and embodied as follows.
-When a processing defect is detected by the processing defect detector 28, a means for blowing air for removing impurities on the surfaces of the workpieces W1 to W3 is provided.

  -Use the camera which images the upper surface of the workpiece | work W1-W3 as the process defect detector 28. FIG.

The front view which shows the laser beam machine of one Embodiment. The top view which shrinks and shows the laser processing machine of FIG. The block diagram which shows the circuit structure of the laser beam machine. The enlarged plan view of the workpiece | work which illustrates the product processed with the laser processing machine. The flowchart which shows the schedule driving | operation operation | movement of the laser beam machine. Explanatory drawing which shows the workpiece | work position detection operation at the time of the workpiece | work origin setting in the schedule driving | operation operation | movement of FIG. The figure which shows the display screen of the data regarding the product which produced the process defect in the same schedule driving | operation operation | movement. The top view of the workpiece | work explaining the correction process of the process defect location of a process defect product. The top view of the workpiece | work explaining the rework of a processing defect product. The flowchart which shows the driving | operation operation | movement of correction processing or reprocessing of a processing defect product.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 22 ... Table, 26 ... Processing head, 27 ... Laser nozzle, 28 ... Processing defect detector, 31 ... Control apparatus which comprises control means, reworking means, and correction processing means, 32 ... Operation part, 33 ... Display means and selection Display unit constituting means, 36 ... storage device, 38 ... NC program storage unit, 39 ... machining data storage unit as storage unit, 40 ... machining defect data storage unit as defective product data storage unit, W1-W3 ... work , W4 ... spare work, M1a to M1g ... first product, M2a, M2b ... second product, I ... display screen, It1, It2 ... touch button, Ng ... machining defect location.

Claims (4)

Laser processing machine comprising storage means for storing product data relating to a processed product, and control means for reading the product data stored in the storage means and controlling the operation of each part so as to cut out the product from the workpiece In
Detecting means for detecting the presence or absence of processing defects during processing of the product;
In accordance with the detection result by the detection means, defective product data storage means for storing data on the product in which the processing defect has occurred,
Display means for displaying data relating to the product stored in the defective product data storage means;
A laser processing machine comprising reprocessing means for processing a defective product again based on an instruction from a manual operation unit. The defective product data storage means stores data related to processing defects,
A correction processing means for correcting a processing defect location based on an instruction from a manual operation unit is provided,
2. The laser beam machine according to claim 1, further comprising a selection unit for selecting one of the re-processing unit and the correction processing unit. 3. The laser processing machine according to claim 1, wherein, when a processing defect is detected by the detection unit, the control unit repeats the processing of the processing defect portion. 4. If the processing failure is not resolved even if the processing of the processing failure location is repeated a specified number of times, data on the product in which the processing failure has occurred is stored in the defective product data storage unit together with data on the processing failure location, and the control 4. The laser processing machine according to claim 3, wherein the means skips processing of a processing defect portion after storing the data.

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