JP5495875B2 - Laser processing method and laser processing apparatus - Google Patents

Description

  The present invention relates to a laser processing method and a laser processing apparatus for correcting defects generated on a substrate such as a substrate used in a liquid crystal display (LCD) or other flat panel display (FPD), a semiconductor wafer, and a printed substrate with a laser beam.

  Conventionally, when a pattern such as a circuit element or wiring is formed on a glass substrate used for a flat panel display (FPD), for example, presence of particles, other environment in a manufacturing apparatus, deposition during thin film formation, exposure failure For example, defects may occur on the glass substrate. For this reason, after each patterning process, whether or not there is a defect such as a short circuit, connection failure, disconnection, or pattern failure of the wiring is sequentially inspected by the appearance inspection apparatus.

  For the defects on the glass substrate detected by such an appearance inspection, laser processing (repair processing) for correcting the defects by irradiating laser light is performed. As a laser processing method, for example, an ultraviolet laser beam outputted from an ultraviolet laser transmitter is made incident on a variable rectangular aperture, and the variable rectangular aperture is opened and closed by moving each knife edge, so that the cross-sectional shape of the ultraviolet laser beam is desired. A method of irradiating the defect after shaping it into a rectangle of the size of is used.

  Further, a laser processing method by shaping a laser beam using a spatial modulation element such as DMD: Digital Mirror Device (registered trademark of Texas Instruments) is known (for example, see Patent Document 1). By shaping the laser beam using the spatial modulation element in this way, high-precision laser processing can be performed.

  There is also known a laser processing method in which a pattern region is set as a laser repair prohibition region and a laser beam is irradiated to a defect located in a region other than the laser repair prohibition region (see, for example, Patent Document 2). . In this laser processing method, one pixel constituting one unit of a repetitive pattern is extracted from an image obtained by imaging a substrate, and the pattern region for one pixel is set as a laser repair prohibited region.

JP 2007-29983 A International Publication No. 2004/099866 Pamphlet

  By the way, the above-mentioned defect generated in the substrate may exist with a fine defect around it. Such fine defects are often difficult to detect by AOI (Automatic Optical Inspection) such as scanning.

  Further, when a defect is corrected by laser light, a defect residue caused by laser processing may be scattered around. Therefore, even if the defect can be corrected, a residue obtained by laser processing may become a new defect.

An object of the present invention is to provide a laser processing method and a laser processing apparatus capable of reliably correcting a defect in view of the above-described conventional situation.

A laser processing method according to an embodiment of the present invention is a laser processing method for correcting a defect on a substrate with a laser beam, a defect position information acquiring step for acquiring position information of the defect, and a laser for irradiating the laser beam. An irradiation unit relative movement step of moving the light irradiation unit relative to the substrate based on the position information so that the defect is positioned in the irradiation possible region, and an irradiation region set in the non-pattern region of the substrate A laser light irradiation step of collectively irradiating the laser light to the irradiation region in the entire region or substantially the entire region by the laser light irradiation unit.

A laser processing apparatus according to an embodiment of the present invention is a laser processing apparatus that corrects a defect on a substrate with laser light, a laser light irradiation unit that irradiates laser light, and the laser light irradiation unit relative to the substrate. An irradiation unit relative driving unit that moves the laser beam to the irradiation region, and the laser beam irradiation unit collectively applies the laser beam to the irradiation region in the entire irradiation region set in the non-pattern region of the substrate. It is characterized by that.

  In the present invention, the laser beam is irradiated to the irradiation region set in the non-pattern region of the substrate regardless of the position of the defect. Therefore, when correcting a defect that exists with a fine defect around it, the fine defect can be corrected at the same time. In addition, it is possible to prevent a defect residue caused by laser processing from becoming a new defect. Therefore, according to this invention, a defect can be corrected reliably.

It is a principal part perspective view which shows the laser processing apparatus which concerns on one embodiment of this invention. It is a top view which shows the laser processing apparatus which concerns on one embodiment of this invention. It is a schematic block diagram which shows the laser processing apparatus which concerns on one embodiment of this invention. It is a flowchart for demonstrating the laser processing method which concerns on one embodiment of this invention. It is explanatory drawing (the 1) for demonstrating preparation of the reference image in one embodiment of this invention. It is explanatory drawing (the 2) for demonstrating preparation of the reference image in one embodiment of this invention. It is explanatory drawing (the 3) for demonstrating preparation of the reference image in one embodiment of this invention. It is explanatory drawing (the 4) for demonstrating preparation of the reference image in one embodiment of this invention. It is explanatory drawing (the 1) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing (the 2) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing (the 3) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing (the 4) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing (the 5) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing (the 6) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing (the 7) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing (the 8) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing (the 9) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing (the 10) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing (the 11) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing (the 12) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing (the 13) for demonstrating the setting of the irradiation area | region in one embodiment of this invention. It is explanatory drawing for demonstrating determination of the necessity for correction in one embodiment of this invention. It is explanatory drawing (the 1) for demonstrating control of the spatial modulation element in one embodiment of this invention. It is explanatory drawing (the 2) for demonstrating control of the spatial modulation element in one embodiment of this invention. It is explanatory drawing (the 3) for demonstrating control of the spatial modulation element in one embodiment of this invention. It is explanatory drawing (the 4) for demonstrating control of the spatial modulation element in one embodiment of this invention. It is explanatory drawing (the 5) for demonstrating control of the spatial modulation element in one embodiment of this invention.

Hereinafter, a laser processing method and a laser processing apparatus according to an embodiment of the present invention will be described with reference to the drawings.
1 to 3 are a perspective view, a plan view, and a schematic configuration diagram showing a main part of a laser processing apparatus 10 according to an embodiment of the present invention.

  As shown in FIGS. 1 to 3, the laser processing apparatus 1 includes a microscope unit 10, a laser light source unit 20, a control unit 30, a stage unit 40, a gantry unit 50, two gantry base units 60, 60, a monitor 70, and an input unit 80. In the present embodiment, the laser processing apparatus 1 is used for repair processing or the like for correcting defects on the substrate 100 which is an array substrate of an LCD by laser light.

  As shown in FIG. 3, a microscope unit 10 as a laser beam irradiation unit includes a spatial modulation element 11 that is a DMD (Digital Mirror Device), for example, as a beam shaping unit that shapes a beam section of a laser beam into a desired shape, and an objective. The lens switching unit 12, the imaging unit 13, and the dichroic mirror 14 are included.

The spatial modulation element 11 spatially modulates (shapes) the laser light oscillated by the laser light source unit 20. In the spatial modulation element 11, for example, a plurality of micromirrors that can be controlled to swing independently in an on state and an off state are two-dimensionally arranged in a rectangular modulation region.
In this configuration, a spatial modulation element such as DMD is used as the light beam shaping means, but other devices such as a liquid crystal slit can be used instead. That is, the light beam shaping means includes any configuration as long as it is a means for shaping the beam cross section of the laser light into a desired shape.

The objective lens switching unit 12 includes a correction necessity determination objective lens (for example, 5 times) 12a and a laser light irradiation objective lens (for example, 20 times) 12b having a higher magnification than the correction necessity determination objective lens 12a. A plurality of objective lenses are held so as to be switchable by objective lens switching means such as a revolver mechanism or a slider mechanism (not shown).

  In the optical path between the spatial modulation element 11 and the objective lens switching unit 12, a dichroic mirror 14 that reflects laser light vertically downward toward the objective lenses 12a and 12b is disposed. The dichroic mirror 14 transmits illumination light reflected by the substrate 100 from an illumination unit (not shown) vertically upward.

  An imaging lens (not shown) is disposed between the spatial modulation element 11 and the dichroic mirror 14. By dividing the focal length of the imaging lens by the focal length of the objective lenses 12a and 12b, the magnification of the objective lenses 12a and 12b is determined.

  The imaging unit 13 includes an imaging element such as a CCD, for example, and images the substrate 100 by guiding the illumination light reflected by the substrate 100 and transmitted through the dichroic mirror 14 to the imaging element. The captured image is subjected to image processing by the control unit 30 and displayed on the monitor 70.

  As shown in FIG. 3, the laser light source unit 20 includes a laser light source 21 that oscillates laser light. The laser light oscillated by the laser light source 21 is guided to the spatial modulation element 11 of the microscope unit 10 through the imaging lens 22, the optical fiber 23, and the like. The laser light source 21 oscillates laser light based on predetermined oscillation conditions (light output, wavelength, oscillation pulse width, etc.).

  The control unit 30 controls the micro mirror of the spatial modulation element 11 to swing independently in the on state and the off state, and causes the spatial modulation element 11 to spatially modulate (shape) the laser light into a desired shape. Further, the control unit 30 performs an objective lens switching operation of the objective lens switching unit 12 and operation control of the laser light source unit 20, the stage unit 40, the gantry unit 50, the gantry base unit 60, and the monitor 70, and the like.

  In this embodiment, the control unit 30 is illustrated on the gantry 50 as the control unit in FIGS. 1 and 2, but the setting of a laser light irradiation area, which will be described later, and an image captured by the imaging unit 13 are illustrated. The image processing may be performed by a control unit different from the control unit 30 on the gantry 50, and the control unit 30 may acquire the information.

  The control unit 30 includes a computer having a very standard configuration, that is, a CPU that controls each component by executing a control program, a ROM, a RAM, a magnetic recording medium, and the like. Various data is presented to the storage of the control program to be controlled, the storage unit used as a work area when the CPU executes the control program or the storage area of various data, and the monitor (display unit) 70 shown in FIG. Thus, an information processing terminal including an output unit that notifies the user and an I / F unit that provides an interface function for data exchange with other devices can be used. The control unit 30 is connected to the input unit 80 and the monitor 70 shown in FIG. 3 from which various types of data corresponding to user operations are acquired.

  In order to cause the control unit 30 to perform the laser processing shown in FIG. 4 to be described later, for example, a control program for causing the control unit 30 to perform the procedure shown in FIG. 4 can be created and read by a computer. For example, the control program may be read from the recording medium to the control unit 30 and executed.

  As a recording medium from which the recorded control program can be read by the control unit 30, a portable recording medium can be used. However, the recording medium is connected to the control unit 30 via a line as a program server. It may be a functioning storage device. In this case, a transmission signal obtained by modulating a carrier wave with a data signal representing a control program is transmitted from the program server through a line as a transmission medium, and the control unit 30 demodulates the received transmission signal. The control program can be executed by reproducing the control program.

  As shown in FIG. 1, the stage unit 40 includes a base unit 41 having a vibration isolation structure, a floating plate 42 disposed on the base unit 41, a substrate holding unit (not shown) that holds the substrate 100, and the substrate 100. And a positioning mechanism (not shown) that performs positioning.

For example, the floating plate 42 is formed by arranging rectangular tile-shaped plates (not shown) in a matrix, and discharges air from the upper surface of each plate. The glass substrate 100 is held by the substrate holding unit in a state of being floated by air discharge. The substrate holding part may have any configuration as long as it is a means for fixing or supporting the substrate 100. For example, a configuration in which the substrate 100 is fixed by a clamp mechanism or a chucking mechanism, or a configuration in which the glass substrate 100 is supported by a plurality of pins may be used.
In addition, you may abbreviate | omit said floating plate 42 from the structure of this invention. Further, a stage unit using a roller mechanism may be used instead of the floating plate 42.

As shown in FIG. 2, the gantry unit 50 includes a gantry 51 having a portal shape straddling the stage portion 40, a front side X direction guide portion 52, and an upper surface side X direction guide portion 53.
As shown in FIG. 1, the gantry 51 includes a horizontal beam 51a and a total of two leg portions 51b (only one is shown in FIG. 1) for supporting both ends of the horizontal beam 51a. As will be described in detail later, the gantry 51 moves in the Y direction (vertical direction in the plane of FIG. 2) along the gantry base portions 60 and 60.

  The front-side X-direction guide portion 52 moves in the X direction (the left-right direction in the drawing of FIG. 2) along a pair of two guide rails 52a provided in front of the horizontal beam 51a of the gantry 51. A rectangular plate-like slider 52b, and a microscope support 52c that is fixed to the slider 52b and supports the microscope unit 10.

  The guide rail 52a moves the microscope unit 10 in the X direction via a slider 52b by, for example, a linear motor. Thus, the front side X direction guide part 52 functions as an irradiation part relative drive part that moves the position of the microscope unit 10 relative to the substrate 100 together with the Y direction guide part 62 described later.

  In this embodiment, the configuration in which the microscope unit 10 is moved can be realized with a simpler configuration than the configuration in which the substrate 100 is moved. However, as the irradiation unit relative drive unit, the gantry 51 as described above is used in the Y direction. Instead of moving the substrate 100, the substrate 100 may be moved in the Y direction, or the substrate 100 may be moved in the XY direction. The position of the microscope unit 10 is moved relative to the substrate 100. Any configuration can be used.

  The upper surface side X-direction guide portion 53 includes a pair of guide rails 53a provided on the upper surface of the horizontal beam 51a of the gantry 51, and a rectangular plate-shaped slider 53b that moves along the guide rails 53a.

The guide rail 53a moves the laser light source unit 20 and the control unit 30 installed on the slider 53b by, for example, a linear motor.
Since the laser light source unit 20 disposed on the front-side X-direction guide 52 is connected to the microscope unit 10 disposed on the top-side X-direction guide 53 by the optical fiber 23, the front-side X-direction guide The slider 52b of 52 and the slider 53b of the upper surface side X-direction guide portion 53 move synchronously.

  As shown in FIG. 2, the gantry base portions 60 and 60 are arranged so as to face each other with the stage portion 40 interposed therebetween. Each gantry base portion 60 includes a base 61 and a Y-direction guide portion 62.

  The Y-direction guide part 62 includes a pair of guide rails 62 a provided on the upper surface of the base part 61. The guide rail 62a moves the microscope unit 10 in the Y direction via the gantry unit 50 by, for example, a linear motor. As described above, the Y-direction guide unit 62 functions as an irradiation unit relative drive unit that relatively moves the position of the microscope unit 10 with respect to the substrate 100, similarly to the front-side X-direction guide unit 52 described above.

Hereinafter, after the creation of the reference image and the setting of the irradiation area will be described, the flowchart of the laser processing shown in FIG. 4 will be described.
<Create reference image>

5 to 8 are explanatory diagrams for explaining the creation of the reference image in the present embodiment.
The user can create a reference image on a setting screen (not shown) while checking the image display window 300 shown in FIG. 5 displayed on the monitor 70 shown in FIG.

  First, the user sets the size of the captured image 311 displayed on the image display unit 310 of the image display window 300. This captured image 311 is a pattern image of the substrate 100 for selecting the reference image 312 shown in FIG. As will be described in detail later, the reference image 312 is referred to in setting a laser light irradiation region and determining whether or not a defect needs to be corrected.

  The size of the captured image 311 is larger than the repetitive pattern 200 when the reference image 312 shown in FIG. 7 is a periodic repetitive pattern 200 (shown by a two-dot chain line in FIG. 5). The X direction and the Y direction may be set to be about 1.5 times the size of the repeated pattern 200. Note that the repetitive pattern 200 includes, for example, three RGB pixels each including a scanning line 210, a data line 220, and a circuit element 230.

  The microscope unit 10 illustrated in FIG. 3 repeats imaging with a field size and movement in the X direction and the Y direction in order to create the above-described captured image 311. The images thus captured are pasted together by the control unit 30 to form a captured image 311 and stored in the storage unit of the control unit 30. Note that when the reference image 312 is created using the already-captured captured image 311, the captured image 311 is read from the storage unit of the control unit 30.

  Next, the user displays, for example, a thick frame C displayed in the captured image 312 as shown in FIG. 6 (a frame actually displayed in the image display window 300, unlike the two-dot chain line indicating the repeated pattern 200). Is adjusted to one cycle of the repetitive pattern with the mouse of the input unit 80 shown in FIG. As a result, the region selected by the thick frame C is newly registered as the reference image 312 shown in FIG.

As shown in FIG. 8, the reference image 312 (illustrated by a two-dot chain line) is created by continuously pasting vertically and horizontally as a stitched image 313, and the laser processing flow shown in FIG. It can be used in the pattern matching of S4) and the setting of the irradiation area described later. The bonded image 313 is displayed by being superimposed on the image of the substrate 100 captured by a low-magnification objective lens such as the correction necessity determination objective lens 12a of the microscope unit 10, thereby confirming whether there is a creation error. be able to.

<Irradiation area setting>
FIGS. 9-21 is explanatory drawing for demonstrating the setting of the irradiation area | region in this Embodiment.
As will be described in detail later, the irradiation region is a region where the substrate 100 is irradiated with laser light, and is set to all or a part of the non-pattern region regardless of the position of the defect. The non-pattern area is an area excluding the scanning lines 210, the data lines 220, and the circuit elements 230, which are pattern areas shown in FIG.

  For example, the pattern region including the scanning line 210, the data line 220, and the circuit element 230 includes a first region R1 including the scanning line 210 and the data line 220 provided so as to intersect with each other as illustrated in FIG. As shown in FIG. 10, the region can be divided into the second region R2 including the circuit element 230. This area division is for expanding the pattern area as a prohibited area or setting an important area with an expansion amount set for each area.

  Here, the important area is an area for which importance is set. As will be described later, for example, when determining the defect correction, the importance is corrected unconditionally if there is a defect in a certain area or more. It is used as such.

  Note that the first region R1 and the second region R2 that are pattern regions are obtained from the reference image 312 displayed on the image display unit 310 of the image display window 300, for example, as shown in FIGS. 3 can manually select a pattern to be set as an area with the mouse of the input unit 80 in FIG. 3, but can also be automatically set using a difference in luminance value between a pattern area and a non-pattern area. Is possible.

  As shown in FIG. 11, the user can expand the first area R1 which is the pattern area and set it as a prohibited area (expanded first area R1 ′). Further, as shown in FIG. The second region R2 can be expanded and set as a prohibited region (expanded second region R2 ′).

  The first region R1 ′ and the second region R2 ′ are expanded in all the upper, lower, left, and right directions of the image display window 300. For example, the first region R1 ′ and the second region R2 ′ may be expanded in one of four directions. Alternatively, only the portion selected by the user may be inflated.

  Note that the pattern region is expanded with a different expansion amount (for example, an expansion width, an expansion rate based on the pre-expansion, etc.) for each specified range such as the first region R1 and the second region R2, and set as a prohibited region. It is also possible. In the example shown in FIGS. 11 and 12, the expansion amount of the first region R1 and the second region R2 is a constant expansion width.

  In the example of FIG. 13, the second region R2 is inflated with an expansion amount larger than the expansion amount of the first region R1 and set as a prohibited region (second region R2 ″). The expansion amount may be automatically determined based on the importance.

  When there is a missing part R2a or a protruding part R2b with respect to the actual pattern area as in the second area R2 shown in FIG. 14, the area addition frame R2c or area deletion frame having a predetermined shape indicated by a dotted line in FIG. The region can be changed as appropriate, for example, by the user selecting R2d and placing it on the image display window 300.

  As shown in FIG. 16, the irradiation region R3 is set to all or a part of a non-pattern region that is a portion excluding the scanning line 210, the data line 220, and the circuit element 230 that are pattern regions. The irradiation region R3 shown in FIG. 16 is a region other than the first region R1 and the second region R2 described above.

  In order to set the irradiation area, it is also possible to automatically set using the difference in luminance value generated between the pattern areas R1 and R2 and the other non-pattern areas. For example, binarization based on a gradation difference, morphology, etc. can be used.

  When the first region R1 and the second region R2 are inflated as described above (R1 ′, R2 ′, R2 ″), the irradiation region R3 ′ is inflated as shown in FIG. It can be set to a portion excluding the first region R1 ′ and the second regions R2 ′ and R2 ″ which are regions.

  As shown in FIG. 18, when there is an anomaly pattern 240 that is different from the other repeating patterns 200, one in a plurality of periods (three periods in FIG. 18) of the repeating pattern 200 of the substrate 100, all repetitions are performed as shown in FIG. 19. Assuming that there is an irregular pattern 240 for the pattern 200 (virtual pattern 240 ′), the irradiation region R3 ′ excluding the virtual pattern 240 ′ may be determined as shown in FIG.

By setting the virtual pattern 240 ′ in this way, the setting of the irradiation area can be simplified.
As shown in FIG. 21, the irradiation condition of the irradiation region R3 ′ can be changed for each of the regions R3′-1, R3′-2, and R3′-3 included therein. Examples of irradiation conditions include the number of times of laser light irradiation, light output, wavelength, and oscillation pulse width.

  Note that the irradiation condition is changed by, for example, changing a part of the irradiation region without turning on all the micromirrors arranged in the irradiation region R3 ′ among the micromirrors arranged in the spatial modulation element 11 shown in FIG. Alternatively, it may be changed by thinning out the OFF state as long as the optical resolution can be secured.

<Laser processing>
As illustrated in the flowchart of FIG. 4, the control unit 30 illustrated in FIG. 3 or the like acquires positional information on the extracted defect of the substrate 100 from, for example, an inspection apparatus independent of the laser processing apparatus 10 (S1: defect position). Information acquisition process). This inspection apparatus is an apparatus located on the upstream side of the transport path of the substrate 100, for example. Note that the inspection apparatus and the laser processing apparatus do not need to be independent of each other, and may be configured as a composite apparatus having both a defect inspection function and a laser processing function.

  Then, the control unit 30 positions the defect so that the defect is positioned in the observation region (see the observation region F1 in FIG. 23) when the correction necessity determination objective lens 12a having a magnification of 5 times is mounted, for example. Based on the above, the microscope unit 10 is moved relative to the substrate 100 by being moved by the front-side X-direction guide portion 52 and the Y-direction guide portion 62 shown in FIGS. 1 and 2 (S2: first irradiation portion) Relative movement process).

  After moving the microscope unit 10, the control unit 30 performs autofocus by an autofocus mechanism (not shown) (S3). And the control part 30 judges whether the correction of a defect is required based on the observation image obtained by the microscope unit 10 (S4).

In this defect correction determination (S4), the control unit 30 performs pattern matching (reference comparison) between the combined image 313 formed by combining the reference image 312 shown in FIG.
Alternatively, a defect is detected by performing comparison (adjacent comparison) between adjacent repeated patterns extracted from the observation image.

  Then, for example, as illustrated in FIG. 22, the control unit 30 determines that the defect 401 located across the data line 220 (first region R1) and the circuit element 230 (second region R2) is the second Since the importance of the region R2 is equal to or greater than a certain value, it is determined that “correction” is caused as causing a short circuit.

  Further, the control unit 30 determines that the defect 402 that contacts the circuit element 230 is “corrected” unconditionally, for example, because the importance of the second region R2 including the circuit element 230 is a certain value or more.

  In addition, for example, when the importance of the first region R1 including the scanning line 210 is less than a certain value or the importance is not set, the control unit 30 touches the defect 403 that contacts only the scanning line 210. Is determined not to be modified.

  For example, the control unit 30 determines that the defect 404 that is not in contact with any pattern is “not corrected”. Such a determination is automatically performed by the control unit 30 under predetermined conditions.

  If the defect does not require correction, the control unit 30 determines whether there is another defect that has not been corrected (S13), and if there is no defect that has not been corrected, the laser processing ends. Further, when there is a defect that has not been corrected, the control unit 30 restarts the process from the first irradiation unit relative movement step (S2) as shown in FIG.

  Although not shown in the flow of FIG. 4, when it is not necessary to move the microscope unit 10 or when it is not necessary to perform autofocus (S3), these steps (S2, S3) may be omitted. Is possible.

  When correcting the defect, the control unit 30 captures an image of the defect captured by the imaging unit 13 of the microscope unit 10 (S5) and stores it in the storage unit. This image can be used in step S12 when determining whether or not the defect can be corrected by comparing with a corrected defect image (S11) described later.

  After the imaging unit 13 captures an image of a defect, the control unit 30 switches the correction necessity determination objective lens 12a to, for example, a laser light irradiation objective lens 12b having a magnification of 20 (S6). Thereby, as shown in FIG. 23, the observation region F1 of the microscope unit 10 becomes the observation region F2.

  Next, the control unit 30 performs autofocus again by an autofocus mechanism (not shown) (S7). Then, the control unit 30 moves the microscope unit 10 to the front side X-direction guide unit 52 and the front side X-direction guide unit 52 shown in FIGS. 1 and 2 so that the defect is located in the irradiable region F3 when the laser light irradiation objective lens 12b is mounted. By moving by the Y-direction guide part 62, the defect 401 is moved relative to the substrate 100, and the defect 401 is centered within the irradiable area F3 (S8: second irradiation part relative movement process).

  In addition, when the above-mentioned microscope movement (S2: 1st irradiation part relative movement process) is performed with high precision etc., it is abbreviate | omitted when it is not necessary to perform centering (S8: 2nd irradiation part relative movement process). It is also possible.

As shown in FIG. 16, the control unit 30 controls the irradiation region R3, which is a non-pattern region,
As shown in FIG. 7, the irradiation region R3 ′, which is a portion excluding the correction prohibition region (the first region R1 ′ and the second region R2 ′ obtained by expanding the pattern region) in the non-pattern region, is irradiated with the laser beam. (S9, S10: laser light irradiation step).

  Specifically, as shown in FIG. 24, the control unit 30 turns on the minute mirror of the spatial modulation element 11 corresponding to the irradiation region R3 in the irradiation possible region F3 of the microscope unit 10, and sets the pattern region R1. , R2 to control the minute mirror of the spatial modulation element 11 so that the minute mirror of the spatial modulation element 11 in the OFF state is turned off (S9).

  Note that how the irradiation region R3 corresponds to the irradiation region F3 is based on the position of the microscope unit 10 (irradiation region F3) obtained from the captured image (S5) or the like, for example. The irradiation region R3 of the irradiation possible region F3 may be trimmed from the composite image 313 of the reference image 312 shown in FIG.

  Next, the control unit 30 irradiates the spatial modulation element 11 that controls the micromirror as described above with laser light from the laser light source unit 20 to process (correct) the defect 401 (S10).

As described above, the control unit 30 changes the irradiation condition for each of the regions R3′-1, R3′-2, R3′-3 of the irradiation region R3 ′ shown in FIG. You may let them.
After processing the defect 401, the control unit 30 captures the image of the defect captured in the imaging unit 13 of the microscope unit 10 (S11). The control unit 30 determines whether or not the defect can be corrected by pattern matching with the above-described defect image (S5) before correction or the reference image 312 shown in FIG. 7 (S12).

If the defect correction has not been completed, the control unit 30 resumes the processing from the laser processing (S10).
Moreover, if the defect correction is completed, the control unit 30 determines whether there is another defect that has not been corrected (S12), and if there is no defect that has not been corrected, the laser processing ends.

  When there is a defect that has not been corrected, the control unit 30 resumes the process from the first irradiation unit relative movement step (S2) as shown in FIG. 4, but in that case, the flow of FIG. Although not shown, it is necessary to switch the laser light irradiation objective lens 12b to the correction necessity objective lens 12a. If the microscope unit 10 does not need to be moved, the microscope moving step (S2) can be omitted.

  As described above, the defect correction process ends. For example, when the linear defect 405 does not fit in the irradiable area F3 as shown in FIG. 25, the control unit 30 appropriately performs the above-described centering (S8). While performing, the laser beam irradiation step (S9, S10) is repeated a plurality of times.

  In this case, as shown in FIG. 26, since the irradiable region F3 is circular, an overlapping portion F3-O (shown by hatching) occurs between the irradiation regions F3 adjacent to each other. Therefore, the control unit 30 does not make the irradiation region R3 the entire non-pattern region of the irradiable region F3, but reduces the irradiation region R3 adjacent to each other by, for example, half of the overlapping portion F3-O, thereby overlapping portion F3. -O can be eliminated. Further, as shown in FIG. 27, the overlapping portion F3-O of the irradiable region F3 may be eliminated by reducing the irradiation region R3 into a rectangular shape.

In the present embodiment described above, the laser beam is irradiated to the irradiation region R3 set in the non-pattern region of the substrate 100 regardless of the position of the defect. Therefore, when correcting a defect that exists with a fine defect around it, the fine defect can be corrected at the same time. In addition, by irradiating a laser beam over a wide range including a defect, it is possible to prevent the laser beam from being left behind (residual defect). Furthermore, it is possible to prevent a problem that a scattered residue that can be generated when only a defect is irradiated with laser light becomes a new defect. Therefore, according to the present embodiment, it is possible to reliably correct the defect. Furthermore, since the control of the spatial modulation element 11 according to the defect shape or the like can be omitted, the control of the laser processing can be simplified.

  Moreover, in this Embodiment, the control part 30 is a laser beam irradiation process (S9, S10), as shown in FIG. 21, several area | region R3'-1, R3'-2 contained in irradiation area | region R3 '. , R3′-3, the irradiation condition is changed to irradiate the laser beam. Therefore, the defect can be reliably corrected under conditions suitable for the substrate 100.

  In the present embodiment, the control unit 30 collectively irradiates the irradiation region R3 in the entire irradiation region F3 (or substantially the entire region) shown in FIG. 24 and the like in the laser beam irradiation step (S9, S10). In this case, the defect can be corrected quickly.

  Further, in the present embodiment, the control unit 30 in the laser light irradiation process, as shown in FIG. 21, the correction prohibited area R1 ′ in which the pattern areas (210, 220, 230) of the non-pattern areas are expanded. , R2 ′ is irradiated with the laser beam to the irradiation region R3 ′. Therefore, even if there is a manufacturing variation in the pattern region or vibration occurs in the laser processing apparatus 10, it is possible to prevent an influence such as destruction of a normal pattern. Further, the influence of heat on the normal pattern can be reduced.

  In the present embodiment, in the laser light irradiation process, as shown in FIG. 13, the control unit 30 prohibits the correction by expanding the pattern area among the non-pattern areas by the expansion amount set for each specified range. The laser beam is irradiated to the irradiation region except the region (region R1 ′ having a small expansion amount, region R2 ″ having a large expansion rate). Therefore, it is possible to more effectively prevent the normal pattern from being destroyed and the influence of heat.

  Further, in the present embodiment, the control unit 30 places the microscope unit 10 that is a laser beam irradiation unit on the substrate 100 so that the defect is positioned in the observation region F1 when the correction necessity determination objective lens 12a is mounted. The first irradiation unit relative movement step (S2) for relatively moving, and the microscope unit 10 with the substrate 100 so that the defect is centered in the irradiable region F3 when the objective lens 12b for laser beam irradiation is mounted. A second irradiation unit relative movement step (S8) for relative movement is performed. Therefore, the fine defect located around the defect can be corrected in a wide range, and therefore the defect can be corrected more reliably.

  In the present embodiment, the control unit 30 performs a correction necessity determination step (S4) for determining whether or not the defect needs to be corrected. In this correction necessity determination step, as shown in FIG. Based on the importance set for each of the plurality of regions (R1, R2) included in the pattern region, for example, when the defect 402 is located in the region R2 where the importance is a certain value or more, it is determined that correction is necessary, It is determined whether or not the defect needs to be corrected. Therefore, the defect can be corrected more reliably.

  Further, in the present embodiment, the control unit 30 performs a correction necessity determination step (S4) for determining whether or not a defect needs to be corrected. In this correction necessity determination step, an image of whether or not a defect needs to be corrected is captured. Irradiation region set based on the reference image 312 in the laser light irradiation step (S9, S10) by performing pattern matching by comparing the image of the defect and the reference image 312 which is a comparison image. R3 is irradiated with a laser beam. Therefore, the irradiation region R3 can be set with simple control.

  Moreover, in this Embodiment, as shown in FIGS. 25-27, the control part 30 repeats a laser beam irradiation process (S9, S10) several times with respect to the defect 405 which does not fit in the irradiation possible area | region F3, and multiple times The overlapping portion F3-O of the irradiable region F3 in the single laser light irradiation step is eliminated by reducing the irradiation region R3. Therefore, unnecessary laser light irradiation can be suppressed.

In this embodiment, the substrate 100 is described as an array substrate of a liquid crystal display (LCD). However, in addition to the liquid crystal display (LCD), a PDP (Plasma Display Panel), an organic EL (ElectroLuminescence) display, and a surface electric method are used. The present embodiment may be applied to a substrate used for other flat panel displays (FPD) such as an electron-emitting device display (SED), a semiconductor wafer, a printed circuit board, and the like. Is possible.
Moreover, the said embodiment and its modification are only examples for implementing this invention, and this invention is not limited uniquely by description of these embodiment. For example, it is within the scope of the present invention to variously modify various configurations in the detailed description of the invention by replacing them with configurations that can be replaced within the scope apparent to those skilled in the art.

DESCRIPTION OF SYMBOLS 1 Laser processing apparatus 10 Microscope unit 11 Spatial modulation element 12 Objective lens switching part 12a, 12b Objective lens 13 Imaging part 14 Dichroic mirror 20 Laser light source unit 21 Laser light source 22 Imaging lens 23 Optical fiber 30 Control part 40 Stage part 41 Base part 42 Floating plate 50 Gantry unit 51 Gantry 51a Horizontal beam 51b Leg part 52 Front side X direction guide part 52a Guide rail 52b Slider 52c Microscope support part 53 Upper surface side X direction guide part 53a Guide rail 53b Slider 60 Gantry base part 61 Base 62 Y direction guide part 62a Guide rail 70 Monitor 80 Input part 100 Substrate 200 Repeat pattern 210 Scan line 220 Data line 230 Circuit element 300 Image display window 310 Image display unit 311 Captured image 312 Reference image 313 Composite image 401 to 405 Defect

Claims (9)

In a laser processing method for correcting defects on a substrate with laser light,
A defect position information acquisition step of acquiring position information of the defect;
An irradiation unit relative movement step of moving the laser beam irradiation unit that irradiates the laser beam relative to the substrate based on the position information so that the defect is located in the irradiable region;
A laser beam irradiation step of collectively irradiating the laser beam by the laser beam irradiation unit to the irradiation region in the whole or substantially the whole irradiation region set in the non-pattern region of the substrate;
A laser processing method comprising:  A correction necessity determination step for determining whether or not the defect needs to be corrected;
In the correction necessity determination step, whether the defect needs to be corrected is determined by pattern matching by comparing the image of the imaged defect with a comparison image,
 In the laser beam irradiation step, the laser beam is irradiated to an irradiation region set based on the comparative image.
 The laser processing method according to claim 1. The setting of the irradiation area is controlled by a micro mirror of a spatial modulation element corresponding to the irradiation area and a micro mirror of the spatial modulation element corresponding to the pattern area. Laser processing method. In the laser beam irradiation step, the of the non-pattern region, wherein the claim 1, characterized by irradiating the laser beam on the irradiation area is a portion excluding the modified prohibition region inflated the pattern area Item 4. The laser processing method according to any one of Items 3 to 3.  In the laser beam irradiation step, the laser beam is applied to the irradiation region which is a portion excluding the correction prohibition region obtained by expanding the pattern region by an expansion amount set for each specified range in the non-pattern region. The laser processing method according to claim 4, wherein irradiation is performed. The irradiation unit relative movement step includes:
A first irradiation unit relative movement step of moving the laser beam irradiation unit relative to the substrate based on the position information so that the defect is positioned in an observation region when the correction necessity determination objective lens is mounted. When,
A second irradiation unit relative movement step of moving the laser beam irradiation unit relative to the substrate so that the defect is centered in the irradiable region when the objective lens for laser beam irradiation is mounted; Have
The laser processing method includes:
A correction necessity determination step for determining whether or not the defect located in the observation region needs to be corrected after the first irradiation unit relative movement step;
The laser processing method according to any one of claims 1 to 5, wherein the laser processing method is provided. A correction necessity determination step for determining whether or not the defect needs to be corrected;
In the correction necessity determination step, the necessity of correction of the defect is determined based on the importance set for each of a plurality of areas included in the pattern area of the substrate.
The laser processing method according to any one of claims 1 to 5, wherein the laser processing method is provided. Repeating the laser beam irradiation process multiple times for the defects that do not fit in the irradiable area,
The overlapping part of the irradiable area in the laser light irradiation process of the plurality of times is eliminated by reducing the irradiation area,
Laser processing method according to any one of claims 1 to 7, characterized in that. In a laser processing apparatus for correcting defects on a substrate with laser light,
A laser beam irradiation unit for irradiating the laser beam;
An irradiation unit relative drive unit that moves the laser beam irradiation unit relative to the substrate;
With
The laser light irradiation unit collectively irradiates the laser light to the irradiation region in the entire irradiation region or substantially the entire irradiation region set in the non-pattern region of the substrate ,
The laser processing apparatus characterized by the above-mentioned.