CN203265909U - Repairing device - Google Patents
Repairing device Download PDFInfo
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- CN203265909U CN203265909U CN2013202208645U CN201320220864U CN203265909U CN 203265909 U CN203265909 U CN 203265909U CN 2013202208645 U CN2013202208645 U CN 2013202208645U CN 201320220864 U CN201320220864 U CN 201320220864U CN 203265909 U CN203265909 U CN 203265909U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Abstract
Provided is a repairing device. According to the repairing device, the most suitable machine method in a plurality of machining methods and machining conditions can be set according to the varieties of defects to overcome the defects of a substrate. The repairing device comprises a laser light source, an observation optical system, two laser radiation optical systems, a light path switching part, a shooting part, a defect detection part, a setting part and a control part. The laser light source can emit lasers of multiple wave lengths, the observation optical system is used for observing the substrate, the light path switching part is used for switching a laser incident light path to one of the two laser radiation optical systems, the shooting part is used for receiving light from the observation optical system to shoot the substrate, the defect detection part is used for detecting the defect parts of the substrate according to images shot by the shooting part, the setting part is used for setting machining methods and machining conditions according to machining areas of the defect parts, and the control part is used for controlling the laser light source and the light path switching part, and therefore the machining methods and the machining conditions set according to the machining areas are used for machining the substrate.
Description
Technical field
The utility model relates to a kind of prosthetic device, particularly relates to a kind of prosthetic device that utilizes laser that the defective of substrate is revised.
Background technology
In the past, there was a kind of prosthetic device that utilizes laser that the defective of substrate is revised.Prosthetic device is used in the defect correction etc. of pattern of the various substrates that produce by manufacturing process.The substrate that is corrected is so-called flat-panel monitor (FPD:Flat Panel Display) substrate, semiconductor crystal wafer, printed circuit board (PCB) etc.In so-called flat-panel monitor (FPD) substrate such as having liquid crystal display (LCD:Liquid Crystal Display) substrate, plasma display panel (PDP:Plasma Display Panel) substrate, organic EL (Electroluminescence: electroluminescent) display base plate etc.
Exist the pattern that has carried out resist pattern, etched pattern etc. to form the defectives such as poor short circuit of the wiring pattern after processing in the defective of utilizing prosthetic device to revise.Prosthetic device can cutting-off of short-circuit part by irradiation laser.
In addition, exist in prosthetic device the slit projecting mode, make laser convergence arrive the prosthetic device of the various processing modes such as mode of a bit.For example, there is the prosthetic device of following a kind of processing mode: in order to cut off unnecessary resist film, by irradiation has laser with the corresponding cross sectional shape of shape of cut-off parts to retouch, can be with shape corrective pitting arbitrarily.
In the prosthetic device of this processing mode, have following a kind of prosthetic device: consistent with the shape of cut-off parts for the cross sectional shape that makes laser, this prosthetic device uses the spatial optical modulation element of DMD (Digital Mirror Device: the be designated hereinafter simply as DMD) unit that forms with a plurality of micro mirrors of rectangular arrangement etc.By after the angle of controlling a part of micro mirror in a plurality of micro mirrors to the DMD irradiation laser from LASER Light Source, the cross sectional shape of laser can be shaped as the shape of expectation.The prosthetic device of face processing mode shines laser with the face shape, therefore is used in the situation of removing or cutting off the material of resisting laser damage ability.
In addition, also there is the prosthetic device of following a kind of focal point processing mode: in the situation that remove the strong foreign matters such as metal of resisting laser damage ability, in order to shine high-energy, can corrective pitting to retouch irradiation laser with focal point.
Defective comprises the defective that the prosthetic device that can utilize the focal point processing mode of the foreign matters such as defective that the prosthetic device that can utilize the face processing mode of the resist part of the pattern form that exceeds regulation etc. is revised and metal is revised.In the past, in each device of the prosthetic device of the prosthetic device of face processing mode and focal point processing mode, the examiner observed the state of defect part and revised.
As the technology relevant to this prosthetic device, for example there is the technology of following a kind of defect correction: as disclosed in TOHKEMY 2007-109981 communique, make monitor display defect part cause operator judge whether to carry out defect correction, the operator sets processing conditions etc. for being judged as the defective that need to revise.
In addition, following a kind of technology is disclosed in TOHKEMY 2011-85821 communique: detect defective according to the area information of the difference information of the defect image that gets for the pattern on substrate and reference picture and registration in advance, decide modification method based on detected defective.
But, as the prosthetic device of the prosthetic device of above-mentioned processing mode and focal point processing mode, the different prosthetic device of processing mode is independently to install, in the past, the examiner makes monitor display defect position and judges defective, correspondingly be transported to each device with this defective and carry out defect correction, therefore have the elongated problem of productive temp (Takt time) of manufacturing process.
In above-mentioned TOHKEMY 2007-109981 communique and the disclosed device of TOHKEMY 2011-85821 communique, each processing mode that can carry out of device is restricted to a kind of, and each device can not be carried out by the optimal processing mode of selection from as above processing mode and the such a plurality of processing modes of focal point processing mode.Thereby, utilize the kind of the defective that each prosthetic device can revise to be restricted, cause the productive temp of manufacturing process elongated.
The utility model is completed in view of the above problems, its purpose is to provide a kind of following prosthetic device: can set the optimal processing mode in a plurality of processing modes and set processing conditions according to the kind of defective, substrate is carried out defect correction.
The utility model content
According to the first mode of the present utility model, a kind of prosthetic device is provided, it is characterized in that possessing: laser light-source device, it penetrates the laser of a plurality of wavelength; Viewing optical system, it is used for observation and utilizes above-mentioned laser to carry out the substrate of defect correction; At least two Ear Mucosa Treated by He Ne Laser Irradiation optical systems; Laser optical path switching part, its light path with above-mentioned laser incident switch to some in above-mentioned at least two Ear Mucosa Treated by He Ne Laser Irradiation optical systems; Image pickup part, its reception is taken aforesaid substrate from the light of above-mentioned viewing optical system; Defects detection section, it is processed from take the defect part of the image detection aforesaid substrate that obtains by above-mentioned image pickup part by image; The processing conditions configuration part, its each machining area for the defects part is set processing mode and processing conditions; And control part, it controls above-mentioned laser light-source device and above-mentioned laser optical path switching part, makes based on above-mentioned processing mode and the above-mentioned processing conditions set for each above-mentioned machining area aforesaid substrate is processed.
The second mode of the present utility model is characterised in that, in above-mentioned the first mode, also possesses the processing mode determination section, this processing mode determination section is processed by the image that the image of defects part is analyzed, come to determine above-mentioned processing mode for each above-mentioned machining area, above-mentioned processing conditions is set with for each above-mentioned machining area the above-mentioned processing mode that is determined by above-mentioned processing mode determination section in the configuration part.
Third Way of the present utility model is characterised in that, in above-mentioned the second mode, above-mentioned processing mode determination section is processed by the image that the image of defects part is analyzed, above-mentioned machining area is categorized as the first machining area and the second machining area, determine respectively above-mentioned processing mode for above-mentioned the first machining area and above-mentioned the second machining area thus, wherein, above-mentioned the first machining area is the zone that utilizes the first energy of above-mentioned laser to process, above-mentioned the second machining area is the zone that utilizes second energy higher than above-mentioned the first energy of above-mentioned laser to process.
Cubic formula of the present utility model is characterised in that, in above-mentioned Third Way, above-mentioned the first machining area is the zone that processes by the face processing mode, and above-mentioned the second machining area is the zone that processes by the focal point processing mode.
The 5th mode of the present utility model is characterised in that, in above-mentioned cubic formula, above-mentioned control part is processed by above-mentioned processing mode after processing by above-mentioned focal point processing mode.
The 6th mode of the present utility model is characterised in that, in above-mentioned the 5th mode, carries out with two-dimensional space modulator, mask pattern or slit by the processing that above-mentioned processing mode carries out.
The 7th mode of the present utility model is characterised in that in above-mentioned cubic formula, also to possess the GUI display part, and this GUI display part generates and is used for inputting the graphical user interface in the zone that processes by above-mentioned focal point processing mode and being presented at display part.
All directions of the present utility model formula is characterised in that, in above-mentioned the 7th mode, specifies starting point and the terminal point of the above-mentioned laser of irradiation in the graphical user interface of above-mentioned GUI display part.
The 9th mode of the present utility model is characterised in that, in above-mentioned cubic formula, also possesses the GUI display part, this GUI display part generates the first graphical user interface and second graph user interface and is presented in display part, wherein, the first graphical user interface is used for the zone that input is processed by above-mentioned focal point processing mode, and the second graph user interface is used for the zone that input is processed by above-mentioned processing mode.
The tenth mode of the present utility model is characterised in that, in above-mentioned the 9th mode, specifies the zone of the above-mentioned laser of irradiation in the second graph user interface of above-mentioned GUI display part.
The 11 mode of the present utility model is characterised in that, in any mode in above-mentioned the first～the tenth mode, the difference by obtaining the image that photographed by above-mentioned image pickup part and reference picture detects the defect part of aforesaid substrate.
The 12 mode of the present utility model is characterised in that, in any mode in above-mentioned the first～the tenth mode, aforesaid substrate is flat display substrate, semiconductor crystal wafer or printed circuit board (PCB).
Description of drawings
Fig. 1 is the structure chart of the related prosthetic device of embodiment of the present utility model.
Fig. 2 means the figure of example of the partial enlarged drawing picture of the substrate that comprises defect part 11 that embodiment of the present utility model is related.
Fig. 3 means the figure of the example of the reference image R I corresponding with the image of Fig. 2.
Fig. 4 means the flow chart of example of the processing of the related control part of embodiment of the present utility model 51.
Fig. 5 means the flow chart of example of the processing of the related control part of embodiment of the present utility model 51.
Fig. 6 is for to related the extracting defect part from defect image and begin until set the figure that the step of the face machining area of defect part and focal point machining area describes of embodiment of the present utility model.
Fig. 7 means the figure of the example of the processing mode that is set in configuration part 51a that embodiment of the present utility model is related and processing conditions.
Fig. 8 means the flow chart of example of the processing of the control part 51 that the variation 1 of embodiment of the present utility model is related.
Fig. 9 means the flow chart of example of the processing of the control part 51 that the variation 1 of embodiment of the present utility model is related.
Figure 10 means the figure of the example of the focal point machining area input GUI that variation 1 is related.
Figure 11 means the flow chart of example of the processing of the control part 51 that the variation 2 of embodiment of the present utility model is related.
Figure 12 means the flow chart of example of the processing of the control part 51 that the variation 2 of embodiment of the present utility model is related.
Figure 13 means the figure of the example of the face machining area input GUI that variation 2 is related.
The specific embodiment
Below, with reference to accompanying drawing, embodiment of the present utility model is described.
(overall structure)
Fig. 1 is the structure chart of the related prosthetic device of present embodiment.
Control device 24 is devices with central processing unit (CPU) and storage arrangement of controlling above-mentioned LASER Light Source 14, light path switching part 17 etc., is for example personal computer.About the structure of control device 24, hereinafter narration.
At this, are so-called flat-panel monitor (FPD) substrates as liquid crystal display substrate as the substrate 11 of repairing object.Form resist pattern, etched pattern etc. by exposure process, etching work procedure etc. on substrate 11.
XY platform 12 be under the control of control device 24 on the XY direction substrate mobile device of moving substrate 11.By not shown testing fixture, substrate 11 is carried out defect inspection, the positional information of defective existing position is offered control device 24.XY platform 12 makes substrate 11 move under the control of control device 24.
Be equipped with object lens switch unit 31 above XY platform 12.Object lens switch unit 31 has a plurality of (being two at this) object lens 32, select under the control of control device 24 will with object lens 32 make laser incide substrate 11.
Image pickup part 13 is the solid-state imagers such as CCD, receives via the 5th optical system 23 that comprises dichronic mirror (dichroic mirror) 33,34 and imaging len 35 light from substrate 11 that passes through object lens 32.The 5th optical system 23 is to utilize laser to carry out the viewing optical system of the substrate of defect correction for observation.Image pickup part 13 is to receive the image pickup part of taking substrate 11 from the light of viewing optical system.
Illumination light from lighting source 21 is directed to substrate 11 via the 4th optical system 22 that comprises collector lens (collector lens) 36, dichronic mirror 33 and object lens 32, and substrate 11 is thrown light on.Be used to form the optical image of substrate 11 from the reverberation of the substrate 11 of illuminated this illumination light on the shooting face of image pickup part 13.That is, illumination light is directed to substrate 11 by being reflected by dichronic mirror 33, and the reverberation of substrate 11 sees through dichronic mirror 33,34, is directed to image pickup part 13 by imaging len 35.
LASER Light Source 14 is the multiple wavelength laser light source devices that comprise the YAG laser oscillator and can generate and penetrate the laser of a plurality of wavelength.At this, LASER Light Source 14 optionally penetrates a kind of laser of wavelength from these four wavelength of wavelength 266nm, wavelength 355nm, wavelength 532nm and wavelength 1064nm under the control of control device 24.LASER Light Source 14 penetrates laser with the wavelength of selecting according to the kind of defective or processing mode and set, power etc.
The first optical system 15 is the Ear Mucosa Treated by He Ne Laser Irradiation optical systems of shining for the laser of the defect correction of carrying out the face processing mode, and the defect correction of this face processing mode is as one man defective to be revised with the shape of rejected region.The first optical system 15 comprises lens 41, optical fiber 42, lens 43, speculum 44 and two-dimensional space modulator 18.
The second optical system 16 is the Ear Mucosa Treated by He Ne Laser Irradiation optical systems of shining for the laser of the defect correction of carrying out the focal point processing mode, and the defect correction of this focal point processing mode is with point mode, rejected region to be revised.The second optical system 16 comprises lens 45 and optical fiber 46.
The first light path switching part 17 is the speculum sliding parts that comprise the speculum 47 that can slide.The first light path switching part 17 consists of the laser optical path switching mechanism, this laser optical path switching mechanism switches under the control of control device 24, makes the laser from LASER Light Source 14 penetrate to the some optical systems in the first optical system 15 and the second optical system 16.That is, the first light path switching part 17 consists of the laser optical path switching parts, and this laser optical path switching part switches to some at least two Ear Mucosa Treated by He Ne Laser Irradiation optical systems 15,16 with the light path of laser incident.
As shown in the solid line in Fig. 1, when speculum 47 that can reflector laser moved in the mode on the light path of leaving the laser that penetrates from LASER Light Source 14, laser straight penetrated to the first optical system 15 with advancing.In addition, as shown in the dotted line in Fig. 1, when speculum 47 moved on the light path of the laser that penetrates from LASER Light Source 14, laser reflect on speculum 47 and to the second optical system 16 ejaculations.In addition, also can be made as follows: when with the mode mobile mirror 47 on the light path of leaving laser, laser penetrates to the second optical system 16, and when on the light path that speculum 47 is moved to laser, laser penetrates to the first optical system 15.
Incide an end face of optical fiber 42 to the laser scioptics 41 of the first optical system 15 ejaculations.Laser acts on the interior transmission of optical fiber 42 by optical fiber 42, and penetrates from another end face of optical fiber 42, is reflected mirror 44 and reflects scioptics 43 after.
Scioptics 43 will and inject to speculum 44 from the laser amplifier of another end face of optical fiber 42.Therefore, another end face of optical fiber 42 becomes scioptics 43 and speculum 44 and laser power profile becomes uniform area source.
Laser from speculum 44 incides two-dimensional space modulator 18.Two-dimensional space modulator 18 is configured in the focal position, front side of imaging len 50 described later.
DMD) and the DMD unit that forms two-dimensional space modulator 18 is spatial optical modulation elements, is to arrange a plurality of DMD that possess the micro mirror that can change angle (Digital Micromirror Device: with two-dimensional-matrix-like at this.DMD for example possesses and the angle numeral can be controlled to be ± 10 degree and 0 micro mirror of spending (level) driving top with memory cell.
DMD by by at each micro mirror and the caused electrostatic attraction of voltage difference that works in driving with the gap between memory cell angle is switched at high speed ± 10 degree and 0 spend (level), DMD is for example disclosed by TOHKEMY 2000-28937 communique.For example by retainer, the rotation of this micro mirror is restricted to angle ± 10 degree, this micro mirror rotates to angle ± 10 degree under driving with the starting state of memory cell, and to revert to level angle be 0 to spend to this micro mirror under driving with the closed condition of memory cell.In addition, this micro mirror is for example to utilize semiconductor fabrication to form the micro mirror of the rectangular shape of a few μ m～tens μ m levels, consists of the DMD unit by arranging two-dimensionally on driving with memory cell.
The second light path switching part 19 is the speculum sliding parts that comprise the speculum 48 that can slide.The second light path switching part 19 consists of the laser optical path switching mechanism, this laser optical path switching mechanism switches under the control of control device 24, makes the laser from the some optical systems in the first optical system 15 and the second optical system 16 is penetrated to the 3rd optical system 20.As shown in the solid line in Fig. 1, when speculum 48 that can reflector laser moves from the mode on the light path of the laser of two-dimensional space modulator 18 to leave, penetrate to the 3rd optical system 20 from the laser of two-dimensional space modulator 18.In addition, as shown in the dotted line in Fig. 1, in the time of on speculum 48 moves to from the light path of the laser of two-dimensional space modulator 18, be reflected mirror 48 from the laser of two-dimensional space modulator 18 and block, be reflected mirror 48 reflections and penetrate to the 3rd optical system 20 from the laser of the second optical system 16.
The 3rd optical system 20 comprises speculum 49, imaging len 50, dichronic mirror 34 and object lens 32.
Configure as follows the first optical system 15, the second light path switching part 19 and the 3rd optical system 20: when laser incides the benchmark reflecting surface (angle of each DMD is the reflecting surface of 0 degree) of above-mentioned DMD unit, laser does not incide speculum 49, and when each micro mirror starting state had a down dip angle ± 10 when spending laser incide speculum 49.In addition, preferably the DMD unit is installed on the supporting station that can adjust the inclination angle of benchmark reflecting surface.
In addition, incide as the laser of the two-dimensional space modulator 18 of DMD unit and for example incide speculum 49 when being starting state with memory cell driving, via imaging len 50, dichronic mirror 33,34 and object lens 32 carry out reduced projection on substrate 11.And, be closed condition if make driving with memory cell, the laser from two-dimensional space modulator 18 does not incide speculum 49, thereby does not shine substrate 11.
Therefore, in the situation that carry out defect correction by the face processing mode, the laser straight that forms the cross sectional shape of expectation by two-dimensional space modulator 18 incides imaging len 50 via being reflected mirror 49 reflections after the second light path switching part 19 with advancing.The laser that penetrates from imaging len 50 is reflected by dichronic mirror 34, and makes the reflecting surface of two-dimensional space modulator 18 carry out reduced projection on substrate by object lens 32, with the shape of expectation, substrate 11 is revised and is processed thus.
In addition, configure as follows the second optical system 16, the second light path switching part 19 and the 3rd optical system 20: when the laser from the second optical system 16 is reflected mirror 48 reflex times, laser incides speculum 49.
Therefore, in the situation that carry out defect correction by the focal point processing mode, laser incides an end face of optical fiber 46 via lens 45.On another end face of optical fiber 46, laser becomes the uniform area source of laser power profile.And another end face of optical fiber 46 is provided in the focal position, front side of imaging len 50.The laser that penetrates from another end face of optical fiber 46 is reflected mirror 48 and speculum 49 reflections and incides imaging len 50.The laser that penetrates from imaging len 50 is reflected by dichronic mirror 34, converges on substrate 11 by object lens 32, thereby with the shape of point, substrate 11 is revised and processed.
In addition, also pin hole (pinhole) device can be set on another end face of the optical fiber 46 of the second optical system 16, make the laser of the pinhole diameter with this pinhole device carry out reduced projection on substrate 11.And the pinhole diameter that also can be made as pinhole device is variable.According to such structure, the processing dimension of focal point processing mode depends on this pinhole diameter, therefore by utilizing control part 51 to control pinhole diameter, the processing dimension of focal point processing mode is become and the corresponding processing dimension of defective.
And, can replace in addition the optical fiber 46 of the second optical system 16 and the configuration concavees lens, make the parallel rays of the laser that penetrates from LASER Light Source 14 incide imaging len 50 with the state with numerical aperture NA by these concavees lens.The laser that again becomes parallel rays by imaging len 50 converges on substrate 11 by object lens 32.In this case, also can adjust the focal length of these concavees lens, make the focal position converge to substrate 11 fronts, thereby make laser have to a certain degree size on substrate 11, can also at the place, focal position of the front of imaging len 50 side configuration pin aperture apparatus, make the laser of the pinhole diameter with this pinhole device carry out reduced projection on substrate 11.The utilization of concavees lens has advantages of the optical fiber that also can not use as running stores.
A part as the 5th optical system 23 of viewing optical system is overlapping by dichronic mirror 34 and the 3rd optical system 20.That is, viewing optical system is positioned on identical optical axis with the part of the 3rd optical system 20.Reverberation from substrate 11 images in by imaging len 35 on the shooting face of image pickup part 13, and image pickup part 13 is taken substrate 11 thus.The fact of display base plate 11 (live) image in display part 59.
In addition, in above-mentioned processing mode, use two-dimensional space modulator 18, but also can use mask pattern or the slit (slit) of the regulation shape of the position that is configured in two-dimensional space modulator 18.For example, make the laser amplifier that penetrates from LASER Light Source 14 and incide mask pattern or slit by beam expander (beam expander).Laser is irradiated on substrate 11 with the state that has with the corresponding cross sectional shape of shape of mask pattern or slit.In this case, also can by coming the beam diameter of expansion of laser light to mask pattern or slit from the laser projection of the end face of optical fiber, replace utilizing the beam diameter of beam expander expansion of laser light.
(structure of control device)
Control device 24 comprises: control part 51, processing procedure (レ シ ピ) preservation section 52, platform control part 53, image processing part 54, object lens switch control portion 55, sliding part control part 56, laser shape control unit 57, card for laser control unit 58, display part 59 and input unit 60 that LASER Light Source 14 is controlled.
Control part 51 comprises central processing unit (CPU) and storage arrangement.From the testing fixture of outside, control part 51 is inputted the defective locations information relevant with the substrate 11 that will carry out defect correction.
Control part 51 comprises the configuration part 51a that sets machining area and processing conditions.Configuration part 51a consists of the processing conditions configuration part of setting processing mode and processing conditions for each machining area of defect part.
Control part 51 utilizes the various information of preserving in processing procedure preservation section 52 to set machining area and processing conditions to configuration part 51a, carries out the processing that platform control part 53, image processing part 54, object lens switch control portion 55, sliding part control part 56, laser shape control unit 57 and card for laser control unit 58 are controlled.That is, control part 51 is controlled LASER Light Source 14 and the first light path switching part 17, makes based on processing mode and the processing conditions set for each machining area substrate 11 is processed.
Processing procedure preservation section 52 is storage arrangements of preserving the various information of using when carrying out defect correction.Various information comprise information required when the reference image information relevant with the substrate of conduct reparation object, processing prohibited area information, retrofit area information, processing mode area information, Laser output set information, object lens set information etc. are carried out each processing mode.
Reference image information is that the substrate 11 that does not have defect part is taken and the image information of photographic images of obtaining etc. is the image information of the reference image R I of reference when carrying out the detection of defect part.
The information in processing prohibited area information is that in substrate 11, no thoroughfare the zone that all or part of processing mode processes.
The retrofit area information is the information in the zone of carrying out retrofit in substrate 11.
The processing mode area information is the information of having set the zone of processing mode, for example in the situation that automatic processing described later, be the information of the information of the face machining area processed by the face processing mode and the focal point machining area processed by the focal point processing mode.
The Laser output set information is the information such as wavelength, frequency and irradiation (shot) number of the laser that penetrates from LASER Light Source 14 when carrying out each processing mode.
The object lens set information is the information of the object lens that use of every kind of processing mode and the object lens that use when retrofit.
Except above-mentioned information, also that various information are pre-stored in processing procedure preservation section 52.
Platform control part 53 control XY platforms 12 make the position irradiation laser to the defective of substrate 11.From 51 pairs of platform control parts of control part, 53 input position information, platform control part 53 is controlled XY platform 12 based on the positional information of inputting, and makes by image pickup part 13 take defect part and be presented in display part 59.
Image processing part 54 comprises the defects detection 54a of section, will be for the image signal output of the image of display base plate 11 to display part 59, this defects detection 54a of section is transfused to the picture signal from image pickup part 13, processes by image the defect part as the substrate 11 of repairing object is detected.The 54a of defects detection section processes from take the defect part of the image detection substrate 11 that obtains by image pickup part 13 by image.
Object lens switch control portion 55 is controlled object lens switch units 31, according to processing mode etc. or switch object lens 32 from examiner's indication.
Sliding part control part 56 is controlled the first light path switching part 17 and the second light path switching parts 19, makes change speculum 47,48 position.
Laser shape control unit 57 is based on controlling two-dimensional space modulator 18 from the information of control part 51, makes the reverberation with the laser consistent with the shape in the shape of the defect part that will revise or Ear Mucosa Treated by He Ne Laser Irradiation zone inject to speculum 49.
Card for laser control unit 58 is controlled the wavelength etc. of the laser of the output of laser and output by controlling LASER Light Source 14.
Display part 59 provides the live image of display base plate 11 and is used for input or sets the graphical user interface (being designated hereinafter simply as GUI) of modification region etc.Generate the image that will be presented at the GUI in display part 59 by control part 51, comprise at the image of shown GUI the image of being taken the substrate 11 that obtains by image pickup part 13.
Input unit 60 is to operators such as the keyboard of the various indications of control part 51 input, mouses for the examiner.
(repair process)
Then, the repair process of prosthetic device 1 described.
To the defective locations information of prosthetic device 1 input from not shown testing fixture, prosthetic device 1 is based on this defective locations information and executing repair process.Not shown testing fixture is for example with lower device: utilize camera head to take substrate 11, process to detect defective by image, generate the positional information of detected defective on the substrate line output of going forward side by side.
Below, utilize the example of substrate image that the action of control part 51 is described, at first the example of substrate image is described.
Fig. 2 means the figure of example of the partial enlarged drawing picture of the substrate 11 that comprises defect part.At this, the image of Fig. 2 is the image of the substrate 11 after exposure process.As shown in Figure 2, be included in the image of a plurality of wiring patterns 101 that form on the surface of substrate 11 and the image of defect part 102 in partial enlarged drawing picture (hereinafter referred to as the defect image) DI of the substrate 11 that comprises defect part.Defect part 102 is the resist films 104 that comprise the foreign matters 103 such as metal.In addition, also be formed with conducting portion 105 between wiring pattern on substrate 11.
Fig. 3 means the figure of the example of the reference image R I corresponding with the image of Fig. 2.As mentioned above, reference image R I is stored in processing procedure preservation section 52.Can detect defect part 102 according to the difference image of reference image R I and defect image DI.
In addition, as hereinafter described, in Fig. 3, the regional FRA between four conducting portions 105 is the retrofit zone.
Fig. 4 and Fig. 5 mean the flow chart of example of the processing of control part 51.Below, the repair process of prosthetic device 1 is described by Fig. 4 and Fig. 5.In addition, Fig. 6 extracts defect part and sets the face machining area of defect part and the figure till the focal point machining area from defect image for explanation.
Preserve never one or more defective locations information of the substrate 11 of illustrated testing fixture input in storage arrangement in control part 51, control part 51 is read defective locations information one by one from this storage arrangement, the image pickup scope that makes image pickup part 13 based on the defective locations information of reading to this defective locations, comprise that namely the scope of the position corresponding with this defective locations information moves (step (being designated hereinafter simply as S) 1).More particularly, control part 51 comes console control part 53 based on this defective locations information, makes thereby drive XY platform 12 defective locations that utilizes image pickup part 13 to take substrate 11.
Control part 51 is controlled image processing part 54 will be taken into image processing part 54 from the picture signal of image pickup part 13 outputs, take thus substrate 11 (S2).Obtain defect image DI by the processing of S2.
Then, control part 51 detects defect part 102 (S3) by the defects detection 54a of section in image processing part 54 from defect image DI.As shown in Figure 6, extract defect part image DDI from defect image DI.
Can carry out the detection of defect part 102 by the difference of obtaining between defect image DI and reference image R I.For example, carry out pattern match based on as shown in Figure 2 defect image DI and reference image R I as shown in Figure 3, extract thus defect part 102, thereby detect defective.In addition, about the extraction of defect part 102, except pattern match, can also utilize adjacent image relatively to wait image processing techniques to carry out.
The defective locations information that defect image DI is based on from the outside obtains, but also has following situation: according to checking precision, be not defective by the detected defective of testing fixture.Therefore, control part 51 also can't detect defective sometimes in S3.
Therefore, control part 51 judges whether to exist defect part, namely defective whether detected, in the situation that there is not defect part (S4: "No"), process being transferred to S20 described later in defect image.
(S4: "Yes"), control part 51 determines the processing mode (S5) of detected defect part in the situation that there is defect part in defect image.The processing of S5 consists of by the image that the image of defect part 102 is analyzed processes the processing mode determination section that determines processing mode for each machining area.The processing mode for each machining area that determines in S5 is set in configuration part 51a.At this, in S5, process by the image that the image of defect part 102 is analyzed, machining area is categorized as the focal point machining area that the low-yield face machining area of processing that utilizes laser and the high-energy that utilizes laser are processed, determines respectively processing mode for face machining area and focal point machining area thus.
The information that obtains according to the image from the defect part 102 that detects or the various information of relevant image decide processing mode.The image of 51 pairs of defect parts that detect 102 of control part is analyzed, judge the kind of defective according to the brightness of defect part 102, brightness dispersion, color, shape, area etc., further decide the processing mode of defect part 102 according to the information in defect part existing zone.
In the example of Fig. 6, generate the defect part image DDI1 and the defect part image DDI2 that comprises the image of resist film 104 of the image that comprises foreign matter 103 according to the defect part image DDI that comprises the defect part 102 that extracts by S3.In the situation that defect part image DDI1 and the DDI2 of Fig. 6, for example the brightness value of the pixel of foreign matter 103 parts is below setting in defect image DI, so foreign matter 103 parts (the slightly dense dash area of the circle in defect part image DDI1) are classified as the part that will utilize high-energy to process.
Similarly, for example the brightness value of the pixel of resist film 104 parts is more than setting in defect image DI, so resist film 104 parts (the shallow dash area of the ring-type in defect part image DDI2) are classified as and will utilize low-yield part of processing.
At this, utilize the part (hereinafter referred to as the high-energy processing part) that high-energy is processed is for example the zone of black defective, processes by the focal point processing mode.Utilizing low-yield part of processing (hereinafter referred to as low-yield processing part) is for example the zone of resist film defective, processes by the face processing mode.
In above-mentioned example, decide processing mode based on the brightness of the view data of defect image DI, but be not only brightness, can also judge processing mode according to the positional information of above-mentioned brightness dispersion, color, shape, area, defect part etc.
In addition, at this, defect part 102 is categorized as high-energy processing part and these two parts of low-yield processing part, does not need the part (hereinafter referred to as need not the processing part) of processing but also can be categorized as under defined terms.For example, can will deceive classification of defects for need not the processing part.
Control part 51 is after the processing mode that has determined defect part 102, and whether judgement exists high-energy processing part (S6) in defect image DI.In the example of Fig. 6, the foreign matter 103 of defect part image DDI1 is high-energy processing parts, therefore is judged as the part that existence will utilize the focal point processing mode to process.
In addition, in the situation that there is not high-energy processing part (S6: "No"), process being transferred to S10.
(S6: "Yes"), control part 51 will utilize the information setting in the zone (hereinafter referred to as the focal point machining area) that the focal point processing mode processes to configuration part 51a (S7) in the situation that there is the high-energy processing part.The focal point machining area is decided to be the track (being moving range) of focal point.
As shown in Figure 6, focal point machining area image RA1 determines according to reference image R I and defect part image DDI1.In focal point machining area image RA1, the indicate focal point machining area processed by the focal point processing mode of blank parts (white part).That is, the focal point machining area is to remove wiring pattern 101 parts and the zone that obtains in foreign matter 103 parts.Therefore, in S7, the track of the blank parts of scintigram 6 is set to the focal point machining area.
Then, control part 51 is set to configuration part 51a (S8) with laser irradiation condition.Laser irradiation condition is laser processing condition, is wavelength, frequency and the irradiation number etc. of the laser in the focal point processing mode.Control part 51 is read the pre-stored laser irradiation condition corresponding with the focal point processing mode in processing procedure preservation section 52, and is set to configuration part 51a.
Fig. 7 means the figure of the example of the processing mode that is set in configuration part 51a and processing conditions.Each machining area for each defect part is set the processing conditions information such as processing mode, machining area information, wavelength, frequency, irradiation number, power, light path.Fig. 7 shows in the defect part that is numbered " 1 " at defective locations, is numbered the machining area of " 1-1 " for defect area, and processing mode is " high-energy processing mode ", its machining area be " (Xa; Ya), (Xb, Yb) ... ", wavelength is " 266nm " etc.
Then, processing mode, machining area and the various processing conditions set in the 51a of configuration part based on the machining area that is numbered " 1-1 " for defect area of control part 51 carried out focal point processing (S9).Specifically, also console control part 53, object lens switch control portion 55, sliding part control part 56, card for laser control unit 58 are carried out the correction based on the focal point processing mode to control part 51 by driving.
In the situation that the focal point processing mode, control part 51 is controlled sliding part control part 56 the first light path switching part 17 and the second light path switching part 19 is switched, and makes laser pass through the second optical system 16 and arrives speculum 49.Control part 51 is controlled object lens switch control portion 55, makes by object lens switch control portion 55 and selects the object lens corresponding with the focal point processing mode.
In addition, control part 51 comes console control part 53 based on the information of the focal point machining area that is set in configuration part 15a (track of focal point), thereby drives XY platform 12.
And control part 51 is controlled card for laser control unit 58 based on the laser processing condition that is set in configuration part 15a, thereby the wavelength that driving laser light source 14 makes to set, frequency and irradiation number etc. penetrate laser.
Then, whether control part 51 judgements exist low-yield processing part (S10) in defect image DI.(S10: "Yes"), control part 51 judges whether to exist retrofit part (S11) in the situation that there is low-yield processing part as shown in the defect part image DDI2 of Fig. 6.In addition, in the situation that there is not low-yield processing part (S10: "No"), process being transferred to S20.
The information in the position of retrofit part and zone as the retrofit area information, be that retrofit area image FRI is stored in processing procedure preservation section 52.Therefore, control part 51 can by reading retrofit area image FRI from processing procedure preservation section 52, judge whether comprise the retrofit zone in defect part image DDI2.
At this, the criss-cross regional FRA of Fig. 3 is the retrofit zone.Therefore, in the situation that low-yield processing part comprises the retrofit zone, control part 51 is set focal point machining areas (S12).This focal point machining area decides according to retrofit area image FRI and defect part image DDI1, in focal point machining area image RA2, the focal point machining area that blank parts (part of white) expression is processed by the focal point processing mode.That is, the focal point machining area is the zone of the retrofit part in resist film 104 parts.
Therefore, in the situation that exist retrofit part (S11: "Yes"), the focal point machining area (S12) that control part 51 is set as shown in the focal point machining area image RA2 of Fig. 6.The processing of S12 is identical with the processing of above-mentioned S7.In addition, in the situation that there is not low-yield processing part (S11: "No"), process being transferred to S15.
Then, control part 51 setting laser illuminate conditions (S13).The processing of S13 is identical with the processing of above-mentioned S8.
As shown in Figure 7, be numbered at defective locations in the defect part of " 1 ", the processing mode that is numbered the machining area setting of " 1-2 " for defect area is " high-energy processing mode ".And the machining area that is numbered " 1-2 " for defect area is also set the processing conditions such as machining area, wavelength.
Then, processing mode, machining area and the processing conditions set in the 51a of configuration part based on the machining area that is numbered " 1-2 " for defect area of control part 51 carried out focal point processing (S14).The processing of S14 is identical with the processing of above-mentioned S9.
Then, whether control part 51 judgements exist face processing part (S15) in defect image DI.In the example of Fig. 6, the resist film 104 of defect part image DDI2 is low-yield processing parts, therefore is judged as to have the part of utilizing the face processing mode to process.
In addition, in the situation that there is not face processing part (S15: "No"), process being transferred to S20.
(S15: "Yes"), control part 51 is set and is utilized zone (hereinafter referred to as the face machining area) that the face processing mode processes (S16) in the situation that there is the face processing part.The face machining area is based on by the shape of the detected defect part of S3 and position and decides and set.In addition, in the situation that there is not face processing part (S15: "No"), process being transferred to S20.
The face machining area decides according to reference image R I and defect part image DDI2, if but have processing prohibited area information in the face processing mode, will process prohibited area information and also take into account and decide the face machining area.For example, when the rectangle part that comprises above-mentioned retrofit zone FRA was set to the processing prohibited area information in the face processing mode and be stored in processing procedure preservation section 52, control part 51 decided the face machining area and is set to configuration part 51a according to reference image R I, defect part image DDI2 and processing prohibited area information.In Fig. 6, the face machining area decides according to reference image R I, defect part image DDI2 and processing prohibited area information, in face machining area image RA3, the indicate face machining area processed by the face processing mode of blank parts (white part).
Then, 51 pairs of two-dimensional space modulators 18 of control part are set, and make the only face machining area irradiation laser (S17) to setting.Its result, the angle of each DMD are controlled so as to the only face machining area irradiation laser of opposite machining area image RA3.
Then, control part 51 setting laser illuminate conditions (S18).Laser irradiation condition is wavelength, frequency and the irradiation number etc. of the laser in the face processing mode.Control part 51 is read corresponding with the face processing mode laser irradiation condition that is stored in advance in processing procedure preservation section 52, and this laser irradiation condition is set to configuration part 51a.
As shown in Figure 7, be numbered at defective locations in the defect part of " 1 ", the processing mode that is numbered the machining area setting of " 1-3 " for defect area is " low-yield processing mode ".And the machining area that is numbered " 1-3 " for defect area is also set the processing conditions such as machining area, wavelength.
Then, processing mode, machining area and the processing conditions set in the 51a of configuration part based on the machining area that is numbered " 1-3 " for defect area of control part 51 comes execution face processing (S19).Specifically, control part 51 is by driving and console control part 53, object lens switch control portion 55, sliding part control part 56 and card for laser control unit 58 are carried out correction based on the face processing mode.
In the situation that the face processing mode, control part 51 switches the first light path switching part 17 and the second light path switching part 19 by controlling sliding part control part 56, makes laser pass through the first optical system 15 and arrives speculum 49.Control part 51 is controlled object lens switch control portion 55, makes by object lens switch control portion 55 and selects the object lens corresponding with the face processing mode.
And control part 51 is controlled card for laser control unit 58 based on the laser processing condition that is set in configuration part 15a, thereby the wavelength that driving laser light source 14 makes to set, frequency and irradiation number etc. penetrate laser.
By more than, carries out defect correction for the defect image based on a defective locations information acquisition and process, so control part 51 judges whether also to exist untreated defective locations information (S20).Control part 51 is for the relevant above-mentioned processing of whole defective locations information and executing of the substrate 11 of inputting to carry out defect correction, if there is untreated defective locations information (S20: "Yes"), control part 51 makes to process and is transferred to S1, read untreated defective locations information, and based on this defective locations information of reading, image pickup scope is moved to next defective locations.
If (S20: "No"), processing finishes all to have carried out above-mentioned processing for the relevant whole defective locations information of the substrate 11 of inputting to carry out defect correction.
In addition, in above-mentioned example, utilize the focal point processing mode to carry out defect correction and the retrofit defect correction partly of high-energy processing part, but also can carry out above-mentioned correction by the face processing mode under high magnification.In this case, control part 51 is controlled object lens switch control portion 55 powerful object lens is disposed at the 3rd optical system 20, control sliding part control part 56 the first light path switching part 17 and the second light path switching part 19 are switched, make the laser of substrate 11 irradiations by the first optical system 15.
In addition, in above-mentioned example, based on being judged whether to exist the retrofit part by the retrofit area image FRI of pre-save in processing procedure preservation section 52, but also can judge based on information such as the area of defect area, width.
And, in above-mentioned example, in the focal point processing mode, drive XY platform 12 substrate 11 is moved, carry out wire processing along the machining locus that sets, but also can move to carry out wire processing by making the speculum 49 in processing head or the 3rd optical system 20.
As mentioned above, according to above-mentioned embodiment, can be achieved as follows a kind of prosthetic device: can according to optimal processing mode and the processing conditions in a plurality of processing modes of kind setting of defective, carry out defect correction.
(variation 1)
In the above example, control part 51 is controlled various control parts etc., make the defect part that to detect be categorized as with the corresponding machining area of processing mode and process, but in the prosthetic device of this variation 1, make as operator's examiner machining area is set in the high-energy processing part.
Fig. 8 and Fig. 9 mean the flow chart of example of the processing of the related control part of this variation 1 51.In Fig. 8 and Fig. 9, for the processing identical with Fig. 4, Fig. 5, also description thereof is omitted for Reference numeral additional identical in explanation.In addition, omit the processing of retrofit part at this.
(S4: "Yes"), control part 51 judges whether to exist face processing part (S15), in the situation that there is the face processing part, carries out the processing from above-mentioned S16 to S19 in the situation that there is defect part after the processing from S1 to S5.
"No") or carrying out face processing mode (S19) afterwards (S15:, control part 51 shows that the GUI that is used for making the examiner input the focal point machining area is focal point machining area input GUI (S31) in the situation that there is not the face processing part.Therefore, control part 51 consists of the GUI display part, and this GUI display part generates and is used for inputting the GUI in the zone that processes by the focal point processing mode and being presented at display part 59.
Figure 10 means the figure of the example of focal point machining area input GUI.GUI shown in Figure 10 generates and is displayed on the picture of display part 59 by control part 5.The examiner inputs the focal point machining area with next the inputs at the shown focal point machining area of display part 59 such as mouse of input unit 60 on GUI.
Focal point machining area input GUI comprises substrate image display part 111, content of operation display part 112, processing conditions input part 113, " determining (OK) " button 114 and " cancellation " button 115 of the live image that shows the substrate 11 that is obtained by image pickup part 13.
Show the live image of the substrate 11 that is obtained by image pickup part 13 in substrate image display part 111.Show that in content of operation display part 112 the urgency examiner carries out the message for the setting operation of focal point processing.Show the laser irradiation condition corresponding with the focal point processing mode be kept in processing procedure preservation section 52 in processing conditions input part 113, if necessary, the examiner can change laser irradiation condition.
For example, as shown in figure 10, specify starting point Sp and the terminal point Ep of irradiation laser on the image of examiner's substrate 11 in being presented at substrate image display part 111 with input unit 60.For example, press the left button of the mouse of input unit 60 and specify starting point Sp, press right button and specify terminal point Ep.
In addition, examiner in the situation that want changes the shown laser irradiation condition of condition entry section 113, selects the condition that will change and inputs the change value with the keyboard of input unit 60.In the situation that do not need to change laser irradiation condition, do not change the condition value of condition entry section 113.
When the change of the appointment of focal point machining area and required laser irradiation condition finished, the examiner utilized mouse to click to be used to indicate and specifies i.e. " determining " button 114 of the button that finishes.In addition, add man-hour when not carrying out focal point, the button that the examiner utilizes mouse to click and is used to indicate cancellation is " cancellation " button 115.
Control part 51 judges whether to have inputted focal point machining area (S32).If clicked " determining " button 114, control part 51 is judged as and has inputted the focal point machining area, if clicked " cancellation " button 115, control part 51 is judged as and does not input the focal point machining area.
If clicked " determining " button 114 (S32: "Yes"), control part 51 with the information of focal point machining area, be that the positional information of starting point Sp and terminal point Ep is set to configuration part 51a (S7).And control part 51 is preserved section 52 laser irradiation condition that preserve or that generation is changed with processing procedure and is set to configuration part 51a (S8).Then, control part 51 is carried out specified focal point processing (S9).Therefore, to shine laser between the position of laser irradiation condition to starting point Sp and terminal point Ep that sets.As shown in figure 10, utilize the focal point processing of laser along the machining locus LR1 that represents with the dotted line between the position of starting point Sp and terminal point Ep.
As mentioned above, according to the prosthetic device of this variation 1, can set machining area to the high-energy processing part as operator's examiner and carry out high-energy processing.
(variation 2)
In the prosthetic device of above-mentioned variation 1, make as operator's examiner machining area is set in the high-energy processing part, but in the prosthetic device of this variation 2, make that the two sets machining area to low-yield processing part and high-energy processing part as operator's examiner.
Figure 11 and Figure 12 mean the flow chart of example of the processing of the related control part of this variation 2 51.In Figure 11 and Figure 12, for the processing identical with Fig. 4, Fig. 5, also description thereof is omitted for Reference numeral additional identical in explanation.In addition, omit the processing of retrofit part at this.
(S4: "Yes"), control part 51 shows that being used for making the GUI of examiner's input face machining area is face machining area input GUI (S33) in the situation that there is defect part after the processing from S1 to S5.
Figure 13 means the figure of the example of face machining area input GUI.GUI shown in Figure 13 generates and is presented on the picture of display part 59 by control part 51.The mouse of examiner's use input unit 60 etc. comes input face machining area on the shown face machining area input GUI of display part 59.
Face machining area input GUI comprises substrate image display part 121, content of operation display part 122, processing conditions input part 123, " determining " button 124, " cancellation " button 125 and the order specifying part 126 of the live image that shows the substrate 11 that is obtained by image pickup part 13.
Show the live image of the substrate 11 that is obtained by image pickup part 13 in substrate image display part 121.Show that in content of operation display part 122 the urgency examiner carries out the message for the setting operation of face processing.Show the laser irradiation condition corresponding with the face processing mode be kept in processing procedure preservation section 52 in processing conditions input part 123, if necessary, the examiner can change laser irradiation condition.
The icon that shows a plurality of orders that are used for graphing that can use in order specifying part 126 when the given side zone.For example, when the examiner utilizes mouse to specify from the icon that comprises the characters such as circle, ellipse, quadrangle to go forward side by side the fixed operation input of professional etiquette with the corresponding icon of figure of expectation, can make substrate image display part 121 at figures such as position draw circles, ellipse arbitrarily, so the examiner can utilize these icons to come the given side zone.
For example, as shown in figure 13, the mouse of examiner's input device 60 utilizes order specifying part 126 to come given side regional, will be appointed as the face machining area with resist film 104 parts of shallow shadow representation.
In addition, examiner in the situation that want changes the shown laser irradiation condition of condition entry section 123, selects the condition that will change and inputs the change value with the keyboard of input unit 60.In the situation that do not need to change laser irradiation condition, do not change the condition value of condition entry section 123.
When the change of the appointment of machining area face to face and required laser irradiation condition finished, the examiner utilized mouse to click to be used to indicate and specifies i.e. " determining " button 124 of the button that finishes.In addition, in the situation that do not carry out focal point processing, the button that the examiner utilizes mouse to click and is used to indicate cancellation is " cancellation " button 125.
Control part 51 judges whether to have inputted face machining area (S34).If clicked " determining " button 124, control part 51 is judged as and has inputted the face machining area, if clicked " cancellation " button 125, control part 51 is judged as does not have the input face machining area.
If clicked " determining " button 124 (S34: "Yes"), control part 51 with the information of face machining area, namely shine the information setting in zone of face of laser to configuration part 51a (S16).Then, 51 pairs of two-dimensional space modulators 18 of control part are set, and make the only face machining area irradiation laser (S17) to setting.
And control part 51 is preserved section 52 laser irradiation condition that preserve or that generation is changed with processing procedure and is set to configuration part 51a (S18).Then, control part 51 is carried out specified face processing (S19).Therefore, with the laser irradiation condition that sets, specified face machining area is shone laser.As shown in figure 13, utilize laser countermeasure (s) erosion agent film 104 parts to carry out face processing.After the processing of S19, control part 51 is carried out the processing of S31～S9.Therefore, control part 51 formation GUI display parts, this GUI display part generates and is used for inputting the GUI in the zone that processes by the face processing mode and is used for inputting the GUI in the zone that processes by the focal point processing mode and being presented at display part 59.
As mentioned above, according to the prosthetic device of this variation 2, can set respectively processing mode and machining area to high-energy processing part and low-yield processing department as operator's examiner, carry out high-energy processing and low-yield processing.
As mentioned above, according to above-mentioned embodiment and each variation thereof, can be achieved as follows a kind of prosthetic device: can according to optimal processing mode and the processing conditions in a plurality of processing modes of kind setting of defective, carry out the defect correction of substrate.
There are various defectives in defective on the substrate of repairing object, need to process with optimal processing mode and processing conditions in the correction of various defectives, according to above-mentioned embodiment and each variation thereof, set optimal processing mode and processing conditions uses a table apparatus just can realize the defect correction of substrate according to the kind of defective.
In addition, in above-mentioned embodiment and each variation thereof, set a different processing mode for each machining area.This is owing to there being following situation: such as when utilizing the face processing mode to utilize the focal point mode to shine laser after to the whole resist defective region irradiation laser that comprises metal etc. to remove remaining metal, produce resist in the problem of dispersing of defect part on every side.
But the condition of repairing object according to the material of substrate, foreign matter, anticorrosive additive material etc. utilizes a plurality of processing modes to process also no problem situation even also exist to identical machining area.Therefore, also can be made as and to set or to specify a plurality of processing modes to a machining area.
In addition, in above-mentioned example, be flat display substrate as the substrate of Laser Processing object, but also can be semiconductor crystal wafer, printed circuit board (PCB) etc.
Each " section " in this specification is the conceptual parts corresponding with each function of embodiment, might not be corresponding one by one with specific hardware, software and routine.Thereby in this manual, the virtual circuit module (section) that has each function of embodiment below by supposition is illustrated embodiment.In addition, about each step of each process in present embodiment, only otherwise violate its character, can change execution sequence, carry out a plurality of steps or carry out with different orders simultaneously when each the execution.
The utility model is not limited to above-mentioned embodiment, can carry out various changes, change etc. in the scope that does not change aim of the present utility model.
Claims (12)
1. prosthetic device is characterized in that possessing:
Laser light-source device, it penetrates the laser of a plurality of wavelength;
Viewing optical system, it is used for observation and utilizes above-mentioned laser to carry out the substrate of defect correction;
At least two Ear Mucosa Treated by He Ne Laser Irradiation optical systems;
Laser optical path switching part, its light path with above-mentioned laser incident switch to some in above-mentioned at least two Ear Mucosa Treated by He Ne Laser Irradiation optical systems;
Image pickup part, its reception is taken aforesaid substrate from the light of above-mentioned viewing optical system;
Defects detection section, it is processed from take the defect part of the image detection aforesaid substrate that obtains by above-mentioned image pickup part by image;
The processing conditions configuration part, its each machining area for the defects part is set processing mode and processing conditions; And
Control part, it controls above-mentioned laser light-source device and above-mentioned laser optical path switching part, makes based on above-mentioned processing mode and the above-mentioned processing conditions set for each above-mentioned machining area aforesaid substrate is processed.
2. prosthetic device according to claim 1, is characterized in that,
Also possess the processing mode determination section, this processing mode determination section is processed by the image that the image of defects part is analyzed, come to determine above-mentioned processing mode for each above-mentioned machining area,
Be set with for each above-mentioned machining area the above-mentioned processing mode that is determined by above-mentioned processing mode determination section in above-mentioned processing conditions configuration part.
3. prosthetic device according to claim 2, is characterized in that,
Above-mentioned processing mode determination section is processed by the image that the image of defects part is analyzed, above-mentioned machining area is categorized as the first machining area and the second machining area, determine respectively above-mentioned processing mode for above-mentioned the first machining area and above-mentioned the second machining area thus, wherein, above-mentioned the first machining area is the zone that utilizes the first energy of above-mentioned laser to process, and above-mentioned the second machining area is the zone that utilizes second energy higher than above-mentioned the first energy of above-mentioned laser to process.
4. prosthetic device according to claim 3, is characterized in that,
Above-mentioned the first machining area is the zone that processes by the face processing mode, and above-mentioned the second machining area is the zone that processes by the focal point processing mode.
5. prosthetic device according to claim 4, is characterized in that,
Above-mentioned control part is processed by above-mentioned processing mode after processing by above-mentioned focal point processing mode.
6. prosthetic device according to claim 5, is characterized in that,
Carry out with two-dimensional space modulator, mask pattern or slit by the processing that above-mentioned processing mode carries out.
7. prosthetic device according to claim 4, is characterized in that,
Also possess the GUI display part, this GUI display part generates and is used for inputting the graphical user interface in the zone that processes by above-mentioned focal point processing mode and being presented at display part.
8. prosthetic device according to claim 7, is characterized in that,
Specify starting point and the terminal point of the above-mentioned laser of irradiation in the graphical user interface of above-mentioned GUI display part.
9. prosthetic device according to claim 4, is characterized in that,
Also possesses the GUI display part, this GUI display part generates the first graphical user interface and second graph user interface and is presented in display part, wherein, the first graphical user interface is used for the zone that input is processed by above-mentioned focal point processing mode, and the second graph user interface is used for the zone that input is processed by above-mentioned processing mode.
10. prosthetic device according to claim 9, is characterized in that,
Specify the zone of the above-mentioned laser of irradiation in the second graph user interface of above-mentioned GUI display part.
11. the described prosthetic device of any one according to claim 1 to 10 is characterized in that,
Difference by obtaining the image that photographed by above-mentioned image pickup part and reference picture detects the defect part of aforesaid substrate.
12. the described prosthetic device of any one according to claim 1 to 10 is characterized in that,
Aforesaid substrate is flat display substrate, semiconductor crystal wafer or printed circuit board (PCB).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012101545A JP2013226588A (en) | 2012-04-26 | 2012-04-26 | Repairing apparatus and repairing method |
| JP2012-101545 | 2012-04-26 |
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| CN203265909U true CN203265909U (en) | 2013-11-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013202208645U Expired - Fee Related CN203265909U (en) | 2012-04-26 | 2013-04-26 | Repairing device |
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| Country | Link |
|---|---|
| JP (1) | JP2013226588A (en) |
| KR (1) | KR101368167B1 (en) |
| CN (1) | CN203265909U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105014245A (en) * | 2014-04-30 | 2015-11-04 | 灿美工程股份有限公司 | Laser Processing Apparatus and Laser Processing Method |
| CN105911725A (en) * | 2016-06-12 | 2016-08-31 | 昆山精讯电子技术有限公司 | Display panel repairing device |
| CN107092166A (en) * | 2016-02-18 | 2017-08-25 | 上海微电子装备有限公司 | Exposure system, exposure device and exposure method |
| TWI683718B (en) * | 2014-09-12 | 2020-02-01 | 日商迪思科股份有限公司 | Laser processing device |
| CN112099251A (en) * | 2020-09-16 | 2020-12-18 | 中山大学 | Liquid crystal panel repairing system adopting deep ultraviolet laser |
| CN113518682A (en) * | 2019-03-11 | 2021-10-19 | 株式会社V技术 | Laser repair method and laser repair device |
| CN114746208A (en) * | 2019-12-06 | 2022-07-12 | 松下知识产权经营株式会社 | Repair welding equipment and repair welding method |
| CN116810184A (en) * | 2023-08-30 | 2023-09-29 | 苏州科韵激光科技有限公司 | Micro-fine line laser repairing device |
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| JP3521805B2 (en) * | 1998-09-11 | 2004-04-26 | 株式会社村田製作所 | Dielectric filter, composite dielectric filter, antenna duplexer, and communication device |
| WO2015195272A1 (en) * | 2014-06-20 | 2015-12-23 | Applied Materials, Inc. | Methods for reducing semiconductor substrate strain variation |
| WO2022181301A1 (en) * | 2021-02-25 | 2022-09-01 | 富士フイルム株式会社 | Defect removal device, defect removal method, pattern formation method, and electronic device production method |
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|---|---|---|---|---|
| KR100716472B1 (en) * | 2005-07-20 | 2007-05-10 | (주)미래컴퍼니 | Device and method for correcting faults of panel |
| JP5331421B2 (en) * | 2008-09-12 | 2013-10-30 | オリンパス株式会社 | Laser repair device and laser repair method |
| JP5250395B2 (en) | 2008-11-19 | 2013-07-31 | 株式会社日立ハイテクノロジーズ | Inspection device |
| JP5437287B2 (en) | 2011-02-07 | 2014-03-12 | オリンパス株式会社 | Laser repair device |
-
2012
- 2012-04-26 JP JP2012101545A patent/JP2013226588A/en active Pending
- 2012-11-08 KR KR1020120125900A patent/KR101368167B1/en not_active IP Right Cessation
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2013
- 2013-04-26 CN CN2013202208645U patent/CN203265909U/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105014245A (en) * | 2014-04-30 | 2015-11-04 | 灿美工程股份有限公司 | Laser Processing Apparatus and Laser Processing Method |
| TWI683718B (en) * | 2014-09-12 | 2020-02-01 | 日商迪思科股份有限公司 | Laser processing device |
| US10942458B2 (en) | 2016-02-18 | 2021-03-09 | Shanghai Micro Electronics Equipment (Group) Co., Ltd. | Exposure system, exposure device and exposure method |
| CN107092166B (en) * | 2016-02-18 | 2019-01-29 | 上海微电子装备（集团）股份有限公司 | Exposure system, exposure device and exposure method |
| CN107092166A (en) * | 2016-02-18 | 2017-08-25 | 上海微电子装备有限公司 | Exposure system, exposure device and exposure method |
| CN105911725A (en) * | 2016-06-12 | 2016-08-31 | 昆山精讯电子技术有限公司 | Display panel repairing device |
| CN113518682A (en) * | 2019-03-11 | 2021-10-19 | 株式会社V技术 | Laser repair method and laser repair device |
| CN113518682B (en) * | 2019-03-11 | 2024-03-01 | 株式会社V技术 | Laser repairing method and laser repairing device |
| CN114746208A (en) * | 2019-12-06 | 2022-07-12 | 松下知识产权经营株式会社 | Repair welding equipment and repair welding method |
| CN114746208B (en) * | 2019-12-06 | 2024-04-02 | 松下知识产权经营株式会社 | Repair welding equipment and repair welding method |
| CN112099251A (en) * | 2020-09-16 | 2020-12-18 | 中山大学 | Liquid crystal panel repairing system adopting deep ultraviolet laser |
| CN116810184A (en) * | 2023-08-30 | 2023-09-29 | 苏州科韵激光科技有限公司 | Micro-fine line laser repairing device |
| CN116810184B (en) * | 2023-08-30 | 2024-02-02 | 苏州科韵激光科技有限公司 | Micro-fine line laser repairing device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101368167B1 (en) | 2014-02-27 |
| JP2013226588A (en) | 2013-11-07 |
| KR20130120975A (en) | 2013-11-05 |
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