CN116810184B - Micro-fine line laser repairing device - Google Patents

Micro-fine line laser repairing device Download PDF

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Publication number
CN116810184B
CN116810184B CN202311100013.1A CN202311100013A CN116810184B CN 116810184 B CN116810184 B CN 116810184B CN 202311100013 A CN202311100013 A CN 202311100013A CN 116810184 B CN116810184 B CN 116810184B
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China
Prior art keywords
laser
module
optical
optical path
reflector
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Active
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CN202311100013.1A
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Chinese (zh)
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CN116810184A (en
Inventor
张敬禹
黄阳
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Suzhou Keyun Laser Technology Co Ltd
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Suzhou Keyun Laser Technology Co Ltd
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Priority to CN202311100013.1A priority Critical patent/CN116810184B/en
Publication of CN116810184A publication Critical patent/CN116810184A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B16/00—Spray booths
    • B05B16/20—Arrangements for spraying in combination with other operations, e.g. drying; Arrangements enabling a combination of spraying operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/16—Arrangements for supplying liquids or other fluent material
    • B05B5/1608—Arrangements for supplying liquids or other fluent material the liquid or other fluent material being electrically conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/48—Laser speckle optics
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention discloses a micro-circuit laser repairing device, and relates to the field of precision repairing of micro-circuit ink spraying laser. The laser repairing device comprises: an upper optical module, the upper optical module comprising: a first optical module and a second optical module; the first optical module at least comprises a first laser and a first optical path module, and the laser emitted by the first laser is emitted through the first optical path module; the second optical module at least comprises a second laser and a second optical path module, wherein the second laser emits laser to pass through the second optical path module and then is connected into the first optical path module through a first movable lens in the first optical path module; the lower optical module receives the laser emitted by the upper optical module and emits the laser to the area to be repaired; and the ink spraying module is used for spraying ink on the area to be repaired based on the electric field environment. The invention can accurately cut the repairing position and improve the product quality.

Description

Micro-fine line laser repairing device
Technical Field
The invention relates to the technical field of laser precise repair, in particular to a micro-line laser repair device.
Background
In the front-end process of the display panel, at least five times of processes such as illumination, etching and developing are required to be repeated to form a TFT (thin film transistor) laminated circuit with a minimum of five layers, including a gate metal layer, an active organic layer, a Source/Drain metal layer, a PVX nonmetallic isolation layer, an ITO pixel region conductive layer and the like, which are laminated in sequence from bottom to top. Various defects such as broken lines, short circuits or broken lines can occur after each process is performed or in the process, and aiming at the situation, laser cutting repair is needed for the broken lines and the short circuit defects, and processes such as ink spraying repair and the like are needed for repairing the broken lines so as to repair various defects and ensure the yield of the display panel.
Aiming at the defect situation, the existing repairing device generally breaks through all laminated structures no matter which layer the defect is bad, and then repairs the defects positioned in the middle layer, especially the defects of the gate metal layer and the Source/Drain metal layer, cannot be accurately repaired pertinently, has larger repairing limitation and influences the product quality; on the other hand, aiming at the defects of broken wires, broken wires and short circuits in the section of the manufacturing process, the integrated repair is not possible; further, the isolation from the ink metal line cannot be achieved for the surface layer ITO conductive film without the TFT region. Obviously, the prior art can only be maintained for part of defect types, and has great limitation.
Disclosure of Invention
Aiming at the technical problems in the background technology, the invention provides a micro-fine line laser repairing device.
The invention provides the following scheme:
a micro-wiring laser repairing apparatus, comprising:
an upper optical module, the upper optical module comprising: a first optical module and a second optical module;
the first optical module at least comprises a first laser and a first optical path module, and the laser emitted by the first laser is emitted through the first optical path module;
the second optical module at least comprises a second laser and a second optical path module, wherein the second laser emits laser to pass through the second optical path module and then is connected into the first optical path module through a first movable lens in the first optical path module;
the lower optical module receives the laser emitted by the upper optical module and emits the laser to the area to be repaired;
and the ink spraying module is used for spraying ink on the area to be repaired based on the electric field environment.
The first optical module is used for emitting laser and can be used for realizing stub and short-circuit cutting repair of a laminated circuit to be repaired and forming an ink filling channel layer by layer on the laminated circuit in an ink spraying repair process aiming at short-circuit defects.
Optionally, the first laser is a multi-wavelength laser, which can emit N paths of lasers with different wavelengths, wherein N is greater than or equal to 2.
Optionally, the first optical path module further comprises at least N-1 movable mirrors, and the first optical path module is based on the movement of the movable mirrors to emit the required single laser light and output from an outlet of the first optical path module.
Optionally, the first laser is a three wavelength femtosecond laser, and the three wavelength femtosecond laser includes three laser exits.
Optionally, the number of movable lenses of the first optical path module is at least 3.
Optionally, the first light path module further includes a light shielding plate and a laser attenuator, which are the same as the first laser outlets in number and in one-to-one correspondence, and the light shielding plate and the laser attenuator are disposed below the corresponding first laser outlets.
Optionally, the laser generated by the second light path module is used for realizing laser curing of the conductive ink and the protective ink;
the second light path module comprises a light shielding plate, a laser attenuator and a beam expander.
Optionally, the second laser is a green laser.
Optionally, the upper optical module further comprises a third optical module for removing the ITO conductive film on the surface layer of the TFT-free region to be isolated from the ink metal line; on the other hand, the cutting and removing of the redundant circuits can also be realized.
The third optical module at least comprises a third laser and a third optical path module, and the third laser emits laser to pass through the third optical path module and then is connected into the first optical path module through a second movable lens in the first optical path module.
Optionally, the third laser is a four-wavelength nanosecond laser, and the third light path module comprises a light shielding plate, a beam expander and a four-wavelength selector; the four-wavelength nanosecond laser is configured to emit four-wavelength lasers simultaneously, and the four-wavelength selector is used for controllably selecting one wavelength of the four-wavelength lasers to pass through according to the processing information of the product to be repaired.
Optionally, the lower optical module further includes a fourth optical path module, and the fourth optical path module is provided with along an optical path transmission direction: slit device, quick reflector module, objective module.
Optionally, the lower optical module further comprises an illumination module and/or a vision module, and the illumination module and/or the vision module is/are connected to the fourth optical path module through the third lens.
Optionally, the device further comprises a control module, wherein the control module controls the driving module to drive the corresponding movable lens to move according to the information of the product to be repaired, so that the first optical module outputs laser processing parameters corresponding to each lamination of the product to be repaired.
Optionally, the product information to be repaired at least comprises material information, light absorption characteristics of the material and thickness information of each lamination; the control module determines the optimal laser processing wavelength according to the material information and the corresponding light absorption characteristics; the control module controls the laser to adjust the laser energy and frequency and the scanning speed of the quick reflector module according to the thickness information.
Optionally, the control module calculates the channel shape required by each lamination according to the product information to be repaired, and adjusts the slit device to control the light spot shape.
Optionally, the ink spraying module sprays a proper ink spraying amount according to the depth and the diameter of the channels and the information of the distance and the line width of the needed connecting line between the two channels.
Optionally, the ink spraying module further comprises a nozzle device; the nozzle device is arranged as at least one.
Optionally, the number of the nozzle devices is two, and the two nozzle devices are used for spraying the conductive ink, so that the efficiency of spraying the conductive ink can be improved.
Alternatively, on the other hand, for both nozzle arrangements, it is possible to provide that one of the nozzle arrangements sprays a conductive ink, such as a nano-silver paste, and the other nozzle arrangement sprays a protective ink, such as a PTC material. And the conductive ink circuit is covered with a protective ink layer, so that the insulating covering and protecting effects of the conductive ink circuit are realized.
Optionally, the spraying of the ink spraying system adopts continuous spraying layer by layer and curing layer by layer, wherein the spraying and curing times are at least twice respectively.
The to-be-repaired area can be an area for repairing the stub and the short-circuit defect of the display panel Array process by laser, or an area for repairing the broken line defect of the display panel Array process, or an area for repairing all the defects at the same time, including a defect area, a laser action area, an ink spraying coverage area and the like; for laser repair of stub and short-circuit defect, optionally, based on the obtained layer number information of the laminated fine circuit where the stub and short-circuit defect is located, and the material, thickness and light absorption characteristics of the layer, the appropriate wavelength and energy are correspondingly controlled to select, and the fast reflector of the lower optical module controls the scanning speed, so that accurate adaptive cutting repair of stub and short-circuit defect is realized.
On the other hand, for repairing broken line defects, optionally, based on the obtained layer number information of the laminated fine circuit where the broken line defects are located and the obtained information of materials, thicknesses, light absorption characteristics and the like of the laminated fine circuit where the broken line defects are located and each laminated layer above, the first optical module emits laser light with different wavelengths and energies corresponding to each laminated layer by layer according to the sequence from top to bottom of the laminated circuit, the slit device of the lower optical module adjusts the shape and the size of a light spot, the fast reflector controls the speed of laser scanning, after 2 channels are formed, the ink spraying device sprays conductive ink, and connection of positions of two layers to be repaired is realized based on the conductive ink metal wires of the two channels, so that accurate adaptive ink spraying repair of the broken line defects is realized.
According to a specific embodiment provided by the invention, the invention discloses at least the following technical effects:
according to the micro-fine line laser repairing device provided by the invention, the laser light paths with various parameters in the upper light path module are alternatively emitted to the lower light path module, so that the adaptive processing repairing of different layers of the laminated micro-fine line of a product to be repaired is realized. Specifically, when the process of forming the ink filling channel by stub, short-circuit cutting and broken line repair is performed, lasers with various wavelengths can be emitted, according to the information of the material, thickness, light absorption characteristics and the like of the layers to be repaired and the layers above the layers to be repaired, the optimal processing lasers corresponding to different parameters of different layers are emitted through the change of the driving mechanism to the light path structure, so that the adaptive optimal processing of the different layers is realized, and the laser accurate stub, short-circuit cutting repair and the laser layer-by-layer forming of the ink filling channel can be realized, and the product quality is improved. Further, the scheme of this application still includes the lower optical module that receives last optical module outgoing laser, corresponds to be provided with slit device, quick reflector, objective module etc. can adjust the size and the shape of facula to and the scanning speed of laser at corresponding processing layer, thereby promote processingquality and efficiency.
Further, for broken line repair technology, in the scheme of punching all layer structures of the laminated circuit in the prior art, only the cutting edge is exposed at the broken line position, the contact between the ink repair liquid and the broken line position is also only the cutting edge connection, and the contact surface is smaller.
The device realizes repair of the residual wire and short circuit defect of the display panel, can optimally realize accurate cutting repair of 1um micro circuit, and can realize the line width of the sprayed conductive ink metal wire reaching 2um for ink jet repair of the broken wire defect of the Array section of the display panel. On the other hand, the device can also be used for repairing the semiconductor micro circuit and repairing the circuit of the PCB.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the operation of an upper optical module of a fine line laser repairing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating the operation of an upper optical module of a fine line laser repairing apparatus according to another embodiment of the present invention;
fig. 3 is a schematic diagram illustrating the operation of a lower optical module of the fine line laser repairing apparatus according to an embodiment of the present invention.
The reference numerals illustrate a 1-first Laser, 2-mask, 3-Laser attenuator, 4-Laser attenuator, 5-first mirror, 6-second movable mirror, 7-third movable mirror, 8-second mirror, 9-mask, 10-mask, 11-Laser attenuator, 12-first movable mirror, 13-beam expander, 14-third mirror, 15-fourth movable mirror, 16-third Laser, 17-mask, 18-beam expander, 19-Laser wavelength selector, 20-fourth mirror, 21-fifth mirror, 22-second Laser, 23-mask, 24-Laser attenuator, 25-beam expander, 26-sixth mirror, 27-seventh mirror, 28-Laser spot slit device, 29-eighth mirror, 30-LED, 31-mirror, 32-Laser A/F, 33-mirror, 34-mirror, 35-cylinder, 36-CCD, 37-39-fast mirror, and 42-fast mirror, and a nine-mirrors.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the invention, fall within the scope of protection of the invention.
It should be noted that, the descriptions of the directions of "left", "right", "upper", "lower", "top", "bottom", and the like of the present invention are defined based on the relation of orientations or positions shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the structures must be constructed and operated in a specific orientation, and thus, the present invention should not be construed as being limited thereto. In the description of the present invention, the meaning of "plurality" is two or more unless specifically defined otherwise.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Example 1
The invention provides a micro-fine line laser repairing device, which specifically comprises: an upper optical module, the upper optical module further comprising: a first optical module and a second optical module; and a lower optical module. The first optical module at least comprises a first laser 1 and a first optical path module, and the first laser 1 emits laser to exit through the first optical path module; the second optical module at least comprises a second laser and a second optical path module 22, and the second laser 22 emits laser to pass through the second optical path module and then is connected into the first optical path module through a movable lens in the first optical path module; the lower optical module receives the laser emitted by the upper optical module and emits the laser to the area to be repaired; and the ink spraying module is used for spraying ink on the to-be-repaired area based on the electric field environment to reach the specific repair area.
Fig. 1 is a schematic diagram illustrating the operation of an upper optical module of a fine line laser repairing apparatus according to an embodiment of the present invention.
In this embodiment, a structural composition of an upper optical module is provided, where the first optical module includes at least a first laser 1 and a first optical path module, the laser light emitted by the first laser 1 exits through the first optical path module, the second optical module includes at least a second laser 22 and a second optical path module, and the laser light emitted by the second laser 22 enters the first optical path module through a fourth movable lens 15 in the first optical path module after passing through the second optical path module.
Specifically, the first laser 1 in the first optical module is a three-wavelength femtosecond laser, and the three-wavelength femtosecond laser includes three laser outlets, and the three wavelengths are respectively: 515nm, 1030nm and 257nm, wherein the three laser outlets are respectively and correspondingly provided with a light shielding plate 2, a light shielding plate 9 and a light shielding plate 10, and a laser attenuator 4, a laser attenuator 3 and a laser attenuator 11, wherein the light shielding plates are used for being in an open state when the laser corresponding to the opening is emitted, and are in a closed state when the laser corresponding to the opening is not required to be emitted, so that unnecessary influence of unnecessary laser on equipment and personnel is prevented; the laser attenuator is used for adjusting the energy of each wavelength; the 257nm laser is also provided with a beam expander 13, wherein the beam expander 13 is used for amplifying the laser spot, and in the embodiment of the invention, the amplification can be preferably performed to 2-8 times; furthermore, a plurality of mirrors 5, 8, 14 and 21 and movable mirrors 12, 7 and 15 are provided, wherein the movable mirrors are mirrors. And, as actuating mechanism, can be equipped with driven cylinder respectively for every movable lens, every cylinder control corresponding movable lens removes, and wherein No. 1 cylinder is through flexible drive first movable lens 12 removal, and No. 3 cylinder is through flexible drive third movable lens 7 removal, and No. 4 cylinder is through flexible drive fourth movable lens 15 removal for play the effect of selecting or dodging light path etc..
In this embodiment, the second laser 22 in the second optical module is a solid continuous laser 22, and the laser exit is sequentially provided with a light shielding plate 23, a laser attenuator 24, a beam expander 25, and a sixth mirror 26 and a seventh mirror 27. The second optical module is connected to the first optical path module through the fourth movable lens 15, and is used for realizing the solidification of conductive ink nano silver and protective ink PTC.
The lower optical module receives the laser emitted by the upper optical module and emits the laser to the area to be repaired; and the ink spraying module is used for spraying ink on the to-be-repaired area to reach the specific area based on the electric field environment.
The working process of the embodiment specifically comprises the following steps:
when 515nm laser wavelength emission in the first laser 1 is selected, the light shielding plate 2 is opened, energy adjustment is carried out through the laser attenuator 4, an optical path is emitted to the first reflecting mirror 5, then the optical path is downwards reflected to the second reflecting mirror 8 through the first movable lens 12, then the optical path is emitted to the right through the second reflecting mirror 8 and is reflected to the fifth reflecting mirror 21, wherein the first movable lens 12 is in a left working position by the cylinder 1, the third movable lens 7 is prevented from being downwards emitted from the first movable lens 12 by the cylinder 3, and the optical path is prevented from being downwards emitted from the second reflecting mirror 8 by the cylinder 4.
When 1030nm laser wavelength emission in the first laser 1 is selected, the light shielding plate 9 is opened, energy adjustment is performed through the laser attenuator 3, an optical path is directly emitted into the second reflecting mirror 8, the optical path is emitted through the second reflecting mirror 8 to the right and reflected into the fifth reflecting mirror 21, wherein the optical path emission is completed, the first movable lens 12 is in a right working position by the No. 1 cylinder, the third movable lens 7 is in a left working position by the No. 3 cylinder, and accordingly an optical path emitted downwards from the first laser 1 is avoided, and the optical path emitted from the second reflecting mirror 8 is avoided by the fourth movable lens 15 by the No. 4 cylinder.
When 257nm laser wavelength emission in the first laser 1 is selected, the light shielding plate 10 is opened, energy adjustment is performed through the laser attenuator 11, an optical path is directly emitted to the third reflecting mirror 14 through the beam expanding mirror 13, reflected to the third movable mirror 7 through the third reflecting mirror 14, and further reflected to the fifth reflecting mirror 21 through the second reflecting mirror 8, and optical path emission is completed, wherein the fourth movable mirror 15 is prevented from the optical path from the second reflecting mirror 8 by the cylinder No. 4.
In the second optical module, the laser light emitted from the solid-state continuous laser 22 is reflected by the light shielding plate 23, the laser attenuator 24, the beam expander 25, the sixth mirror 26, and the seventh mirror 27 in this order into the fourth movable mirror 15 in the first optical module, and then reflected rightward into the fifth mirror 21.
In this embodiment, as shown in fig. 3, a structural composition of a lower optical module is provided, where the lower optical module includes at least a laser spot slit device 28, an eighth reflecting mirror 29, an illumination module, reflecting transmission mirrors 31, 33 and 34, a laser a/F32, a laser barrel 35, a quick reflecting mirror 36, a vision module, a filter 38, a ninth reflecting mirror 39, a beam expander 40, a tenth reflecting mirror 41, and an objective lens module, where the laser spot slit device 28 can set the size and shape of the slit, the quick reflecting mirror 36 can quickly change the laser reflection angle, and adjust the laser scanning speed, and the illumination module is particularly preferably an LED30, and the vision module is particularly preferably a CCD37. And the visual module is used for collecting images of the area to be repaired, and the illumination module is used for increasing the brightness of the area to be repaired.
Example 2
The implementation is based on embodiment 1, further include a third optical module, as shown in fig. 2, where the third optical module includes a third laser 16 and a third optical path module, where the third laser 16 selects a four-wavelength nanosecond laser, laser light emitted by the third laser passes through a light shielding plate 17 and a beam expanding lens 18 sequentially, a laser wavelength selector 19 enters a fourth reflecting mirror 20, and a second movable lens 6 is correspondingly disposed in the first optical module, and controls translation of the second movable lens through expansion and contraction of a No. 2 cylinder, and further reflects an optical path to the second movable lens 6 through the fourth reflecting mirror 20, and downward to the second reflecting mirror 8, and further reflects the optical path to a fifth reflecting mirror 21 through the second reflecting mirror 8, so as to complete light path emission, where No. 3 cylinder and No. 4 cylinder work so that the third movable lens 7 and the fourth movable lens 15 avoid light paths from corresponding optical paths.
Alternatively, when the number 2 cylinder and the second movable lens 6 are provided, the corresponding first laser emits 515nm and 1030nm laser light, and the first laser performs avoidance according to the light path outgoing path thereof.
The laser wavelength selector 19 is mainly used for selecting a transmission laser wavelength, for example, selecting one wavelength for transmission, and the other three wavelengths are absorbed, specifically, is used for controllably selecting a laser with one wavelength from four wavelengths according to the processing information of the product to be repaired for transmission.
In a preferred embodiment of the invention, the mirrors 14, 8, 26 and 21 may also be provided with air cylinders, which allow a corresponding telescopic operation, so that each mirror is translated.
Fig. 3 is a schematic diagram illustrating the operation of a lower optical module of the fine line laser repairing apparatus according to an embodiment of the present invention.
In the present embodiment, a structural composition of a lower optical module is provided, wherein the lower optical module at least comprises a laser spot slit device 28, an eighth reflecting mirror 29, an illumination module, reflecting and transmitting mirrors 31, 33 and 34, a laser a/F32, a laser barrel 35, a quick reflecting mirror 36, a vision module, a filter 38, a ninth reflecting mirror 39, a beam expander 40, a tenth reflecting mirror 41 and an objective lens module, wherein the laser spot slit device 28 can set the size and shape of the slit, the quick reflecting mirror 36 can quickly change the laser reflection angle and adjust the laser scanning speed, the illumination module is particularly preferably an LED30, and the vision module is particularly preferably a CCD37.
The working process of the embodiment specifically comprises the following steps:
the light path emitted from the upper optical module sequentially passes through the laser spot slit 28, the eighth reflecting mirror 29, the laser barrel mirror 35, the fast reflecting mirror 36, the beam expander 40, the tenth reflecting mirror 41 and the reflecting and transmitting mirror 34, and then enters the objective lens module 42; LED30 and Laser A/F32 enter objective module 42 sequentially through reflective and transmissive mirrors 31, 33 and 34; the CCD37 enters the objective module 42 through the filter 38, the ninth mirror 39, the reflecting transmission mirror 33, and the reflecting transmission mirror 34 in this order.
Alternatively, for the objective lens module 42, there may be selected objective lenses having different magnifications, and preferably, there may be six sets of objective lenses having different magnifications.
In a preferred embodiment of the invention, the device further comprises an ink spraying module for spraying ink on the area to be repaired based on the electric field environment.
In a preferred embodiment of the present invention, the apparatus further includes a control module, wherein the control module controls the driving module to drive the cylinder according to the information of the product to be repaired so that the movable reflection lens moves, and the first optical module outputs laser processing parameters corresponding to each lamination of the product to be repaired.
Preferably, the product information to be repaired includes at least material information, light absorption characteristics of the material, and thickness information of each laminate; the control module determines the optimal laser processing wavelength according to the material information and the corresponding light absorption characteristics; the control module controls the laser to adjust the laser energy and frequency and the scanning speed of the quick reflector module according to the thickness information.
The control module may also calculate the channel shape required by each stack according to the product information to be repaired, and adjust the slit device to control the light spot shape.
In a preferred embodiment of the present invention, the ink spraying module further comprises an ink spraying module for spraying ink on the area to be repaired based on the electric field environment, wherein the protection ink is PTC.
Illustratively, the ink spraying module sprays a suitable ink jet amount according to the depth and diameter of the channels, and the distance and line width information of the required connection between the two channels.
Optionally, the ink spraying module further comprises a nozzle arrangement; the nozzle means is provided as one.
Optionally, two nozzle devices are provided, and the two nozzle devices are used for spraying conductive ink;
alternatively, for two nozzle arrangements, one of which sprays conductive ink, such as nano silver paste, and the other of which sprays protective ink, such as PTC material, a protective film covering of the conductive ink is achieved.
More preferably, the ink spraying system is sprayed by successive spraying and curing layer by layer, wherein the spraying and curing times are at least 2.
The above description of the technical solution provided by the present invention has been provided in detail, and specific examples are applied to illustrate the structure and implementation of the present invention, and the above examples are only used to help understand the method and core idea of the present invention; also, it is within the scope of the present invention to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the invention.

Claims (15)

1. A micro-wiring laser repairing apparatus, comprising:
an upper optical module, the upper optical module comprising: a first optical module and a second optical module;
the first optical module at least comprises a first laser and a first optical path module, and the laser emitted by the first laser is emitted through the first optical path module;
the second optical module at least comprises a second laser and a second optical path module, wherein the second laser emits laser to pass through the second optical path module and then is connected into the first optical path module through a first movable lens in the first optical path module;
the first laser selects a three-wavelength femtosecond laser, the three-wavelength femtosecond laser comprises three laser outlets, and three wavelengths are respectively: 515nm, 1030nm and 257nm;
when 515nm laser wavelength in the first laser is selected for emission, the light path is emitted to the first reflector, then the light path is downwards reflected to the second reflector through the first movable lens, and then the light path is emitted to the fifth reflector through the second reflector, wherein the first movable lens is positioned at a left working position by a No. 1 cylinder, the third movable lens avoids the light path downwards emitted from the first movable lens by a No. 3 cylinder, and the light path from the second reflector is avoided by a fourth movable lens by a No. 4 cylinder;
when 1030nm laser wavelength in the first laser is selected for emission, directly emitting a light path to a second reflecting mirror, and reflecting the light path to the right to a fifth reflecting mirror through the second reflecting mirror to complete light path emission, wherein a No. 1 air cylinder enables a first movable lens to be in a right working position, a No. 3 air cylinder enables a third movable lens to be in a left working position, so that a light path emitted downwards from the first laser is avoided, and a No. 4 air cylinder enables a fourth movable lens to avoid the light path from the second reflecting mirror;
when 257nm laser wavelength emission in the first laser is selected, the light path is directly emitted to a third reflector, reflected to a third movable lens through the third reflector, and further reflected to a fifth reflector through a second reflector, and light path emission is completed, wherein a No. 4 cylinder enables a fourth movable lens to avoid the light path from the second reflector;
in the second optical module, the emergent laser is reflected to a fourth movable lens in the first optical module through a sixth reflector and a seventh reflector, and then reflected to the right to a fifth reflector;
each of the movable lenses is a mirror;
the lower optical module receives the laser emitted by the upper optical module and emits the laser to the area to be repaired;
and the ink spraying module is used for spraying ink on the area to be repaired based on the electric field environment.
2. The fine line laser repair apparatus according to claim 1, wherein the first optical path module further includes a light shielding plate and a laser attenuator, which are the same in number and in one-to-one correspondence with the first laser outlets, and are disposed below the corresponding first laser outlets.
3. The fine line laser repairing apparatus according to claim 1, wherein the second optical path module includes a light shielding plate, a laser attenuator, and a beam expander.
4. A fine line laser repairing apparatus according to claim 1 or 3, wherein the second laser is a green laser.
5. The fine line laser repairing apparatus according to claim 1, wherein the upper optical module further comprises a third optical module, the third optical module at least comprises a third laser and a third optical path module, and the third laser emits laser light to pass through the third optical path module and then to access the first optical path module through a second movable lens in the first optical path module.
6. The fine line laser repairing apparatus according to claim 5, wherein the third laser is a four-wavelength nanosecond laser, and the third optical path module comprises a light shielding plate, a beam expander and a four-wavelength selector; the four-wavelength nanosecond laser is configured to emit four-wavelength lasers simultaneously, and the four-wavelength selector is used for controllably selecting one wavelength of the four-wavelength lasers to pass through according to the processing information of the product to be repaired.
7. The fine line laser repairing apparatus according to claim 1, wherein the lower optical module further comprises a fourth optical path module provided with, in an optical path transmission direction: slit device, quick reflector module, objective module.
8. The fine line laser repair apparatus of claim 7, the lower optical module further comprising an illumination module and/or a vision module, the illumination module and/or vision module accessing a fourth optical path module through a third lens.
9. The fine line laser repairing apparatus according to claim 7, further comprising a control module, wherein the control module controls the driving module to drive the corresponding movable lens to move according to the product information to be repaired, so that the first optical module outputs laser processing parameters corresponding to each lamination of the product to be repaired.
10. The fine line laser repairing apparatus according to claim 9, wherein the product information to be repaired includes at least material information, light absorption characteristics of the material, and thickness information of each laminate; the control module determines the optimal laser processing wavelength according to the material information and the corresponding light absorption characteristics; the control module controls the laser to adjust the laser energy and frequency and the scanning speed of the quick reflector module according to the thickness information.
11. The fine line laser repairing apparatus according to claim 10, wherein the control module calculates a channel shape required for each stack according to the product information to be repaired, and adjusts the slit device to control the spot shape.
12. The fine line laser repairing apparatus according to claim 1, wherein the ink spraying module sprays a proper amount of ink according to the depth and diameter of the channels, and the distance and line width information of the lines required between the two channels.
13. The fine line laser repair apparatus of claim 1 wherein the ink spraying module comprises a nozzle arrangement, the nozzle arrangement being provided as at least one.
14. The fine line laser repairing apparatus according to claim 13, wherein the number of the nozzle devices is two, and both of the nozzle devices spray the conductive ink; or one of the nozzle arrangements sprays conductive ink and the other nozzle arrangement sprays protective ink.
15. The fine line laser repair apparatus according to any one of claims 12 to 14, wherein the spraying of the ink spraying module employs successive spraying layer by layer and laser curing layer by layer, wherein the number of spraying and laser curing is at least 2, respectively.
CN202311100013.1A 2023-08-30 2023-08-30 Micro-fine line laser repairing device Active CN116810184B (en)

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CN203265909U (en) * 2012-04-26 2013-11-06 奥林巴斯株式会社 Repairing device
KR102194831B1 (en) * 2020-07-21 2020-12-23 주식회사 에이치비테크놀러지 Laser Repair Apparatus for Adjusting and Monitoring the Polarization of the Beam
KR20210100228A (en) * 2020-01-28 2021-08-17 주식회사 코윈디에스티 Method for repairing display panel and structure of display panel using thereof
CN113628989A (en) * 2020-05-08 2021-11-09 株式会社考恩斯特 Ink jet nozzle module with added rotary motion and repairing device of substrate comprising same
CN114551286A (en) * 2020-11-24 2022-05-27 查目科技股份有限公司 Repair device and method
CN115138988A (en) * 2022-07-05 2022-10-04 深圳泰德激光技术股份有限公司 Laser cutting method, system, device and computer readable storage medium
CN219443822U (en) * 2022-12-21 2023-08-01 武汉帝尔激光科技股份有限公司 OLED repairing device
CN116652372A (en) * 2023-07-28 2023-08-29 苏州科韵激光科技有限公司 Laser repairing method and device for laminated circuit

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203265909U (en) * 2012-04-26 2013-11-06 奥林巴斯株式会社 Repairing device
KR20210100228A (en) * 2020-01-28 2021-08-17 주식회사 코윈디에스티 Method for repairing display panel and structure of display panel using thereof
CN113628989A (en) * 2020-05-08 2021-11-09 株式会社考恩斯特 Ink jet nozzle module with added rotary motion and repairing device of substrate comprising same
KR102194831B1 (en) * 2020-07-21 2020-12-23 주식회사 에이치비테크놀러지 Laser Repair Apparatus for Adjusting and Monitoring the Polarization of the Beam
CN114551286A (en) * 2020-11-24 2022-05-27 查目科技股份有限公司 Repair device and method
CN115138988A (en) * 2022-07-05 2022-10-04 深圳泰德激光技术股份有限公司 Laser cutting method, system, device and computer readable storage medium
CN219443822U (en) * 2022-12-21 2023-08-01 武汉帝尔激光科技股份有限公司 OLED repairing device
CN116652372A (en) * 2023-07-28 2023-08-29 苏州科韵激光科技有限公司 Laser repairing method and device for laminated circuit

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