CN114551286A - Repair device and method - Google Patents

Repair device and method Download PDF

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Publication number
CN114551286A
CN114551286A CN202111383184.0A CN202111383184A CN114551286A CN 114551286 A CN114551286 A CN 114551286A CN 202111383184 A CN202111383184 A CN 202111383184A CN 114551286 A CN114551286 A CN 114551286A
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CN
China
Prior art keywords
light
unit
ink
white light
prosthetic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111383184.0A
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Chinese (zh)
Inventor
郑卿训
金东俊
权愚赫
薛捧浩
黄建雅
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Chamu Technology Co ltd
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Chamu Technology Co ltd
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Filing date
Publication date
Application filed by Chamu Technology Co ltd filed Critical Chamu Technology Co ltd
Publication of CN114551286A publication Critical patent/CN114551286A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0015—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
    • B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
    • B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]

Abstract

The present invention provides a repair apparatus and a repair method using the same, which can shorten the time for repairing a defective portion on a substrate and improve the quality of a film formed on the defective portion, wherein the repair apparatus includes: a stage formed in such a manner that a substrate can be placed; an ink supply section disposed on an upper side of the table so as to be capable of ejecting conductive ink; and a light supply unit disposed above the table so as to be capable of emitting white light for sintering the conductive ink.

Description

Repair device and method
Technical Field
The present invention relates to a repairing apparatus and method, and more particularly, to a repairing apparatus and method capable of shortening a time for repairing a defective portion on a substrate and improving quality of a film formed on the defective portion.
Background
Semiconductors, FPDs (Flat Panel displays), PCBs (Printed Circuit boards), and the like can be repaired by a repair device capable of ejecting conductive ink as fine droplets onto a substrate and forming a pattern in a line shape with a width of several μm.
In a conventional repair apparatus, a conductive ink film is coated on a defective portion of a substrate, and then the conductive ink film is sintered by irradiating Continuous Wave Laser (CWL). Therefore, the conventional techniques have problems that it is necessary to sinter the conductive ink film at a low temperature for a long time and that it is difficult to reduce the electrical resistance of the sintered film to a desired level. Further, since the conventional repair apparatus needs to be provided with an optical system for guiding the laser beam from the laser light source to the substrate, the apparatus configuration becomes complicated, and there is a problem that the apparatus load increases.
The following patent documents disclose techniques that are background to the present invention.
(Prior art document)
(patent document)
(patent document 1) KR10-2016-0144152A
Disclosure of Invention
Technical problem to be solved
The invention provides a repairing device and a repairing method, which can shorten the time for repairing the defect position on the substrate and improve the quality of the film formed at the defect position.
Means for solving the problems
The repair apparatus according to an embodiment of the present invention includes: a Stage (Stage) formed so as to be capable of mounting a substrate; an ink supply section disposed above the table so as to be capable of ejecting conductive ink; and a light supply unit disposed above the table so as to be capable of emitting white light for sintering the conductive ink.
The light supplying part may include: a lamp unit that generates the white light; and a reflection unit accommodating the lamp unit and having one side opened so as to be capable of guiding the white light from the lamp unit to the work table.
The light supplying part may include: a capacitor connected to the lamp unit so as to be capable of applying a voltage in a pulse form to the lamp unit; and a capacitor controller that controls an application condition of a voltage applied from the capacitor to the lamp unit.
The width of the open portion of the reflection unit may be 10mm or more and less than 1000 mm.
The ink supply portion may include: a nozzle unit formed in such a manner as to be capable of ejecting the ink using electro-hydrodynamics; a power supply unit connected to the nozzle unit so as to be capable of forming a potential difference between the stage and the nozzle unit; and a storage unit connected to the nozzle unit so as to be capable of supplying the ink.
The method can comprise the following steps: a moving unit configured to move the ink supply unit and the light supply unit relative to the table, respectively; and an observation portion supported by the moving portion so as to be able to observe the ink ejected from the ink supply portion.
The moving part may include: a first moving unit that supports the ink supply section and the observation section; and a second moving unit supporting the light supplying part.
The white light includes at least one of near ultraviolet rays, visible rays and infrared rays, and may be irradiated to the defect portion on the substrate on the upper portion of the table in any one of a surface light shape and a line light shape.
The conductive ink includes silver (Ag) particles.
The method can comprise the following steps: and a reflective optical section disposed between the light supply section and the stage so as to be capable of refracting light of an edge area of the white light irradiated from the light supply section toward a center area.
The reflective optics may include: a plate disposed between the light supply unit and the stage, and having a center opened from the light supply unit toward the stage; a reflecting surface formed on one surface of the plate so as to face the light supplying portion; a first mirror that is disposed on a path of reflected light reflected from the reflecting surface, spaced upward from the edge of the plate, and reflects the reflected light to an outer side of the edge of the plate; and a second mirror disposed on a path of the reflected light reflected from the first mirror so as to collect the reflected light reflected from the first mirror to a lower side of the opening of the plate.
The width of the opening of the plate may be 1 μm or more and less than 100 μm.
The repairing method according to the embodiment of the invention comprises the following steps: confirming a defective portion on the substrate; a step of forming an ink film by ejecting conductive ink to the defective portion; and a step of irradiating the defect portion with white light to sinter the ink film.
The process of forming the ink film includes: a process of jetting the conductive ink using electrohydrodynamics, the process of sintering the ink film comprising: a process of generating white light of the same intensity (intensity) in a pulse form; and a step of irradiating the white light in a pulse form to the defect portion in a surface light shape.
The process of irradiating the pulsed white light in any one of a surface light shape and a line light shape may include: and a step of heating the ink film to a temperature of 100 ℃ to 1000 ℃ by irradiating the white light in the form of pulses to the defective portion for 1 second to 50 seconds.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the embodiment of the present invention, the ink film of the conductive ink applied to the defective portion on the substrate can be rapidly heated at a higher temperature than before by using white light to perform sintering. This shortens the time required to repair a defective portion on the substrate and improves the quality of the ink film formed on the defective portion.
In addition, since the ink film is sintered by white light, the laser optical system structure can be removed from the apparatus. Thereby, the structure of the apparatus can be simplified and the weight of the apparatus can be reduced.
Drawings
Fig. 1 is a schematic view of a prosthetic device according to an embodiment of the present invention.
Fig. 2 is a process diagram for explaining a repairing method according to an embodiment of the present invention.
Fig. 3 is a diagram for explaining a repairing method according to an embodiment of the present invention.
Fig. 4 to 9 are graphs for illustrating the results of the repair process according to the embodiment of the present invention in comparison with comparative examples.
Fig. 10 is a partially enlarged view of a prosthetic device according to a modification of the present invention.
(description of reference numerals)
10: substrate
100: working table
200: ink supply unit
210: nozzle unit
300: light supply unit
310: lamp unit
320: reflection unit
330: capacitor with a capacitor element
400: moving part
500: observation part
600: process control section
700: reflective optic
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be embodied in various forms different from each other. Rather, embodiments of the invention are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. For the purpose of illustrating embodiments of the present invention, the drawings may be exaggerated, parts irrelevant to the description may be omitted from the drawings, and the same reference numerals on the drawings denote the same elements.
The repair apparatus according to the embodiment of the present invention may be applied to a repair apparatus for repairing a defective portion on various substrates used for manufacturing semiconductors, FPDs, PCBs, and the like using electro-hydrodynamics (EHD).
Of course, the repairing apparatus according to the embodiment of the present invention may also be applied to various patterning apparatuses that form and correct a pattern of a predetermined shape on a substrate using a conductive ink (electrical connection ink).
Fig. 1 is a schematic view of a prosthetic device according to an embodiment of the present invention.
Referring to fig. 1, a repair apparatus according to an embodiment of the present invention includes: a stage 100, the stage 100 being formed in such a manner that a substrate 10 can be placed; an ink supply part 200, the ink supply part 200 being disposed on an upper side of the table 100 so as to be capable of ejecting conductive ink; and a light supply unit 300, wherein the light supply unit 300 is disposed above the table 100 so as to be capable of emitting white light for sintering the conductive ink.
In addition, a repair apparatus according to an embodiment of the present invention may include: a moving unit 400, the moving unit 400 being formed so as to be able to move the ink supply unit 200 and the light supply unit 300 relative to the table 100; an observation portion 500 supported by the moving portion 400 so as to be able to observe the ink ejected from the ink supply portion 200; and a process control part 600, the process control part 600 controlling the overall operation of the repairing apparatus.
The stage 100 may include an upper surface of a predetermined area so that the substrate 10 can be seated. The table 100 may be in the shape of a plate. The work table 100 may be fixedly provided on a predetermined table (not shown) or movably provided. The structure and shape of the table 100 may be varied.
The ink supply unit 200 ejects conductive ink onto defective portions, such as an opening defective portion and a short-circuit defective portion, on the substrate 10, thereby forming an ink film. The ink supply unit 200 can eject the conductive ink onto the defective portion of the substrate 10 by utilizing the electro-hydrodynamic phenomenon.
That is, the ink supply portion 200 may include: a nozzle unit 210, the nozzle unit 210 being formed in such a manner that it can eject conductive ink using electro-hydrodynamics; a power supply unit 220, the power supply unit 220 being connected to the nozzle unit 210 so as to be able to form a potential difference between the stage 100 and the nozzle unit 210; and a storage unit 230, the storage unit 230 being connected to the nozzle unit 210 so as to be capable of supplying the conductive ink.
The nozzle unit 210 may be formed in a hollow shape and may be obliquely disposed. The nozzle unit 210 may form an injection port at a lower end. The nozzle unit 210 may include at least one of glass and sapphire materials having good workability so that the size of the ejection opening can be formed to be small to a desired extent. The nozzle unit 210 may have an electrode pin disposed therein or an electrode film coated on an outer surface thereof. The nozzle unit 210 may be supported by the moving part 400. Of course, the material and structure of the nozzle unit 210 may be various.
The power supply unit 220 may be electrically connected to the nozzle unit 210. The power supply unit 220 may apply a predetermined voltage to the electrode pins and the electrode films provided in the nozzle unit 210, and may form a predetermined potential difference between the nozzle unit 210 and the substrate 10.
Due to the potential difference, the conductive ink can be ejected in the form of fine droplets from the ejection opening downward. At this time, the operation of the power supply unit 220 may be controlled by the process control part 600. For example, the power supply unit 220 adjusts the voltage intensity, current frequency, and electric quantity applied to the nozzle unit 210 according to the control of the process control part 600, thereby variously adjusting the ejection amount and ejection form of the fine droplets of the conductive ink. On the other hand, the process control unit 600 may control the operation of the power supply unit 220 in various ways.
The storage unit 230 may store conductive ink inside and supply the conductive ink to the inside of the nozzle unit 210 at a predetermined pressure. The storage unit 230 may be disposed spaced apart from the nozzle unit 210 and connected to the nozzle unit 210 through a predetermined supply pipe. The structure of such a memory cell 230 may be various.
The conductive ink may include silver (Ag) particles. Therefore, after the conductive ink is ejected to the defective portion on the substrate 10 to form an ink film, the defective portion on the substrate 10 can be repaired by electrically connecting the wiring of the defective portion. Of course, the constituent components of the conductive ink may be various.
On the one hand, the ink supply section 200 according to the embodiment of the present invention may not include the storage unit 230. In this case, the nozzle unit 210 may perform the repair in a state in which a predetermined amount of conductive ink is stored therein to the extent of the stored amount of ink. Then, the nozzle unit 210 may be charged or the nozzle unit 210 provided in the ink supply unit 200 may be replaced with a new nozzle unit 210.
The light supply unit 300 irradiates white light to the ink film formed on the substrate 10, thereby functioning to sinter the ink film. The light supply unit 300 is disposed above the table 100 and may be supported by the moving unit 400.
The light supplier 300 may include: a lamp unit 310, the lamp unit 310 generating white light, such as intense pulsed light (intense pulsed light); a reflection unit 320, the reflection unit 320 accommodating the lamp unit and having one side opened so as to be able to guide white light from the lamp unit 310 to the work table 100; a capacitor 330, the capacitor 330 being connected to the lamp unit 310 so as to be able to apply a voltage in a pulse form to the lamp unit 310; and a capacitor controller 340, the capacitor controller 340 controlling an application condition of the voltage applied from the capacitor 330 to the lamp unit 310.
The lamp unit 310 may include a xenon flash lamp (xenon flash lamp) so as to be capable of generating light of a wavelength of at least any one of near ultraviolet rays, visible rays, and infrared rays. The xenon flash lamp can be manufactured by injecting xenon gas into a cylindrical quartz tube provided with electrodes inside. The lamp unit 310 may receive a voltage in the form of a pulse applied at a predetermined ampere from the capacitor 330, thereby instantaneously forming plasma inside to generate white light with strong intensity. Of course, the kinds of the lamp unit 310 may be various.
Such a lamp unit 310 may be disposed inside the reflecting unit 320 in a linear lamp structure. In this case, the structure of the lamp unit 310 may be various, including a bulb structure.
The inside of the reflection unit 320 may be open downward and the inner surface may be formed to be concave upward. The reflection unit 320 may have a reflection plate on an inner surface. The reflective plate may reflect the white light generated from the lamp unit 310 to a defective portion of the substrate 10 mounted on the table 100. Of course, the reflecting unit 320 may be formed of at least a material whose inner surface can reflect white light. Such a reflecting unit 320 may be supported by the moving part 400.
The open portion, e.g., the lower opening, of the reflection unit 320 may have a square or rectangular shape. Accordingly, the white light irradiated to the defective portion on the substrate 10 through the lower opening of the reflection unit 320 may be in a square or rectangular surface light shape.
In this case, the surface light means that the width and length of light are formed in a similar size, so that the shape of light irradiated on the substrate 10 is not a line shape and a dot shape, but a surface shape having a predetermined area.
The width of the lower opening of the reflection unit 320 may be 10mm or more and less than 1000 mm. The width of the lower opening may be the width in the width direction and the length direction or the width in the diagonal direction. When the width of the lower opening of the reflection unit 320 is less than 10mm, the size of the lamp unit 310 becomes too small, so that the fabrication of the lamp unit 310 is difficult, and it is difficult to generate white light of a desired intensity from the lamp unit 310. When the width of the lower opening of the reflection unit 320 is 1000mm or more, the irradiation area of the white light is excessively larger than the defective portion on the substrate 10, and energy may be wasted.
The capacitor 330 may receive a supplied current from a predetermined power source (not shown) and may be electrically connected with the lamp unit 310. The capacitor 330 may apply a voltage in a pulse form to the lamp unit 310. The capacitor 330 may apply a voltage in a pulse form to the lamp unit 310 by repeating a process of discharging the stored charge to the lamp unit 310 after internally charging a predetermined charge.
The capacitor controller 340 is connected to the capacitor 330 and can control the operation of the capacitor 330 so as to adjust the application conditions of the voltage applied from the capacitor 330 to the lamp unit 310, such as the voltage magnitude, the pulse width, the pulse gap, the number of pulses, and the like.
The moving unit 400 is connected to the ink supply unit 200 and the light supply unit 300, and functions to move them while being supported. The moving unit 400 can move relative to the table 100. Such a moving part 400 may include: a first moving unit 410, the first moving unit 410 supporting the ink supply unit 200 and the observation unit 500; and a second moving unit 420, the second moving unit 420 supporting the light supplier 300. The operations of the first and second moving units 410 and 420 may be controlled by the process control part 600.
The first mobile unit 410 and the second mobile unit 420 may operate independently. The first mobile unit 410 and the second mobile unit 420 may include, for example, a rack (gantry) structure. That is, the first mobile unit 410 and the second mobile unit 420 may respectively include: a plurality of rails provided on a table (not shown) supporting the work table 100; and a plurality of travel blocks provided so as to be capable of traveling in a horizontal direction on the plurality of rails. The first moving unit 410 and the second moving unit 420 may include a plurality of vertically movable elevating blocks, and the ink supply unit 200, the light supply unit 300, and the observation unit 500 may be provided in each elevating block.
Of course, the moving part 400 may include a plurality of vertical rods and horizontal rods coupled to each other, and the plurality of vertical rods and horizontal rods may be fixedly disposed on the table. In this case, the table 100 may be provided so as to be movable in the horizontal direction and the vertical direction on the table.
The observation portion 500 functions to photograph a defective portion on the substrate 10, an ink film to be ejected to the defective portion, and an ejection port of the nozzle unit 210 to eject the conductive ink. Such an observation portion 500 may be provided spaced apart from the ejection port upper side of the nozzle unit 210, and may move in the same direction and at the same speed as the nozzle unit 210. Of course, the observation part 500 may move differently from the nozzle unit 210.
The process control unit 600 may be connected to the stage 100, the ink supply unit 200, the light supply unit 300, the moving unit 400, and the observation unit 500. The process control unit 600 may repair the defective portion of the substrate 10 by controlling the operations of the table 100, the ink supply unit 200, the light supply unit 300, the moving unit 400, and the observation unit 500 according to a preset process schedule.
Due to the repair apparatus according to the embodiment of the present invention formed as described above, the ink film can be rapidly sintered at a high temperature using white light, and thus the repair process can be rapidly finished as compared to, for example, slowly sintering the ink film at a low temperature using a continuous wave laser.
Fig. 2 is a process diagram for explaining a repairing method according to an embodiment of the present invention. Fig. 3 is a diagram for explaining a repairing method according to an embodiment of the present invention. In this case, the horizontal axis of the graph of fig. 3 represents the time during which sintering proceeds, the vertical axis represents the magnitude of the pulse voltage, and the bar graph represents the pulse voltage applied from the capacitor to the lamp unit.
Referring to fig. 1 to 3, a repairing method according to an embodiment of the present invention is described in detail.
The repairing method comprises the following steps: a process of identifying a defective portion D on the substrate 10; a process of forming an ink film F by ejecting the conductive ink L to the defective portion D; and a step of irradiating the defect portion D with white Light (IPL, Intense Pulsed Light) to sinter the ink film F.
Referring to fig. 2(a), a defective portion D on the substrate 10 is confirmed. That is, the open defect and the short defect formed on the substrate 10 can be checked by a predetermined inspection apparatus (not shown). When the defective portion D is confirmed, the following procedure is performed to repair it.
Referring to fig. 2(b), the conductive ink L is ejected to the defective portion D on the substrate 10 to form an ink film F. That is, the nozzle unit 210 is moved by the moving unit 400 so that the nozzle unit 210 is positioned above the defective portion D. Then, a predetermined voltage is applied from the power supply unit 220 to the nozzle unit 210, and the droplets of the conductive ink L accommodated in the nozzle unit 210 are ejected to the defective portion D, thereby forming the ink film F at the defective portion D. That is, the conductive ink L may be ejected from the nozzle unit 210 using the electro-fluid dynamics, thereby forming the ink film F in the defective portion D. In this case, the pattern P on the substrate 10 may be electrically connected by the ink film F.
Referring to fig. 2(c), white light (IPL) is irradiated to the defective portion D to sinter the ink film F. That is, the lamp unit 310 and the reflection unit 320 are moved to the upper side of the ink film F by the movement unit 400, and a voltage in a pulse form is applied from the capacitor 330 to the lamp unit 310 to generate white light. Further, white light is guided by the reflection means 320 and is irradiated to the ink film F formed on the defective portion D of the substrate 10 with white light (IPL).
In detail, as shown in fig. 3, by supplying pulse voltages of the same magnitude to the lamp unit 310 at predetermined intervals for a predetermined time, white light of the same intensity (intensity) can be generated in a pulse form.
As described above, when the white light is generated in the pulse form, the pulse-form white light (ILP) is irradiated to the defect portion D on the substrate 10 in any one of the surface light shape and the line light shape. In this case, the process of irradiating the pulsed white light in a planar light shape may include: and a step of irradiating the defect site D1 to 50 seconds with pulsed white light to heat the ink film to a temperature of 100 to 1000 ℃.
Accordingly, the resistivity of the ink film F 'after firing can be controlled to be in the range of 8.7 to 15 μ Ω -cm, and the silver (Ag) particles contained in the ink film F' after firing can grow to a size exceeding 100nm and 300nm or less. Thus, a high-quality correction pattern can be formed in the defective portion D.
On the one hand, when the white light in the pulse form is irradiated for less than 1 second and the temperature of the ink film F is heated to a temperature of less than 100 ℃, it may be difficult to control the resistivity of the ink film F' after sintering to 8.7 μ Ω -cm or more, and it may be difficult to grow the silver (Ag) particles in the ink film F to be more than 100 nm.
When the white light in the form of pulses is irradiated to the defective portion D50 seconds or less and the temperature of the ink film is heated to a temperature of 100 to 1000 ℃, a desired specific resistance and a desired silver (Ag) particle size can be obtained from the ink film F' after the sintering, and therefore, when the sintering process is performed so that the irradiation time of the white light and the heating temperature of the ink film exceed the above ranges, the process time may be increased and energy may be unnecessarily wasted.
The process of irradiating the pulsed white light in a planar light shape may include: mixing at a rate of 10J/cm2To 180J/cm2And a process of irradiating the defective portion D on the substrate 10 with a pulse duration in a range of 1000 to 17000. mu.s at a white light intensity in the range. When the intensity of the white light is less than 10J/cm2There is a problem that it is difficult to supply sufficient energy to the ink film and to sinter the ink film. When the pulse duration of the white light is more than 17000. mu.s, the incident energy per unit time is reduced, and thus the sintering efficiency may be lowered. When the intensity of the white light is more than 180J/cm2The ground is excessively applied to the lamp unit, so that the life of the lamp unit may be shortened. When the pulse duration of the white light is less than 1000 μ s, the number of pulses needs to be increased and the pulse gap needs to be decreased in order to supply sufficient energy to the ink film, and thus the pulse is excessively applied to the lamp unit, which may shorten the life of the lamp unit.
When the concentration is 10J/cm2To 180J/cm2When the defective portion D on the substrate 10 is irradiated with the white light intensity in the range and the pulse duration in the range of 1000 μ s to 17000 μ s, sufficient energy can be stably supplied to the ink film in the defective portion without excessively applying the light to the lamp unit.
Fig. 4 to 9 are graphs for illustrating the results of the repair process according to the embodiment of the present invention in comparison with comparative examples.
At this time, according to the repairing process of the embodiment of the present invention, the above-described repairing apparatus and repairing method are applied to form the ink film of the conductive ink with a line width of 5 μm and a length of 100 μm on the substrate, and the white light is irradiated to sinter the ink film.
In addition, according to the repair process of the comparative example of the present invention, the ink film of the conductive ink was formed on the substrate with a line width of 5 μm and a length of 100 μm, and then the conventional laser was irradiated to sinter the ink film.
Hereinafter, the repairing process according to the embodiment of the present invention is simply referred to as an embodiment, and the repairing process according to the comparative example is simply referred to as a comparative example.
Fig. 4 is a table showing the intensity of light applied to the ink films in examples and comparative examples and the temperature of the ink films according to the intensity.
Referring to FIG. 4, in the examples, white light was confirmed to be 1.2kW/cm2The above intensities are generated rapidly. However, in the comparative example, it was confirmed that the laser light was from 75W/cm2To 680W/cm2Is grown in a stepwise manner.
As described above, in the examples, it was confirmed that since strong white light was generated almost from the beginning to irradiate the defective portion, the temperature of the ink film applied to the defective portion can be raised quickly between 0ms and 4ms, and can be raised to a high temperature of about 800 ℃.
However, in the comparative example, it was confirmed that since the laser irradiation defect portion was generated stepwise from weak intensity, the temperature of the ink film applied to the defect portion was also increased stepwise from a temperature of less than 100 ℃ to a low temperature of about 300 ℃ over a long period of time from 0s to 30 s.
That is, it was confirmed that the examples can heat the ink film to a high temperature in a relatively short time, whereas the comparative examples cannot heat the ink film to a high temperature like the examples even if the ink film is heated for a long time.
Fig. 5 and 6 are graphs showing the resistance value per unit distance and the specific resistance value of the ink films sintered in the examples and comparative examples in comparison.
Referring to fig. 5, in the examples, it was confirmed that the resistance value per unit distance of the sintered ink film was 0.5 Ω/μm when the ink film was sintered for 4.8 seconds, and the performance was excellent. In addition, in the examples, it was confirmed that when the ink film was sintered for 15 seconds, the resistance value per unit distance of the sintered ink film was 0.29 Ω/μm, and the performance was more excellent. Among them, the smaller the resistance value per unit distance, the better the conductivity of the ink film. That is, the smaller the resistance value per unit distance, the higher the repair quality.
However, in the comparative example, it was confirmed that the resistance value per unit distance was 0.8. omega./μm, which was relatively high, even if the ink film was sintered for 30 seconds. In the comparative example, it was confirmed that the ink film required sintering for a relatively long time of 60 seconds to 90 seconds, and the resistance value per unit distance equivalent to that of the ink film of the example could be obtained.
Referring to fig. 6, the resistivity of the sintered ink films in examples and comparative examples was measured, and the results thereof are graphically shown. From the graph, it was confirmed that, in the comparative example, the sintered resistivity value was 24 μ Ω -cm even if the ink film was sintered for 30 seconds, but in the example, the sintered resistivity value was 15 μ Ω -cm even if only the ink film was sintered for 4.8 seconds, and the performance was excellent. Further, it was confirmed that, in the case where the sintering time was extended to 15 seconds in the example, the resistivity value of the sintered ink film was 8.7 μ Ω -cm. It was confirmed that this corresponds to the specific resistance value of the ink film when a separate heat treatment process was added after the comparative example.
It was confirmed that, in the embodiment, even if a separate heat treatment process was not further performed, the resistivity value of the ink film was excellent compared to the resistivity value at the time of the additional heat treatment in the process of the comparative example.
Fig. 7 is a table showing sectional photographs of the ink films manufactured in examples and comparative examples.
Referring to fig. 7, in the example, it can be confirmed that the size of the silver particles in the formed ink film is greater than 100 nm. That is, in the embodiment, since white light is irradiated to the ink film, the silver particles in the ink film can be smoothly grown, and thus the surface of the ink film can be formed flexibly.
However, in the comparative example, it was confirmed that a large number of silver particles having a size of less than 100nm were formed in the ink film. As described above, when a large number of silver particles having a size of less than 100nm are formed, there is a problem that the surface of the ink film becomes rough and the density of the film is reduced.
As described above, it was confirmed that in the examples, the fine tissue in the ink film was cultured into the large tissue and removed, whereas in the comparative examples, the fine tissue in the ink film was not removed, and thus the surface thereof was rougher and the film density was low.
In fig. 8, the sintering according to the examples and comparative examples was performed with increasing the width of the ink film, and the resistance of the sintered ink film was measured and shown in the graph. Referring to fig. 8, it can be confirmed that the resistance of the ink film is greatly improved in the examples compared to the comparative example. In this case, it was confirmed that the larger the width of the ink film, the larger the difference in resistance between the ink films of the example and the comparative example.
In addition, referring to fig. 9, it can be confirmed that the effective line width of the ink film of the example is larger than that of the ink film of the comparative example. Here, the effective line width means a line width having connectivity that affects the resistance of an actual ink film.
That is, in the examples and comparative examples, when the ink films were uniformly sprayed at 2.3 μm and then fired with white light and continuous wave laser light, respectively, it was confirmed that the effective line width of the ink film fired in the examples was 2.0 μm, which is excellent, and in contrast, the effective line width of the ink film fired in the comparative example was 1.38 μm, which is somewhat insufficient. This is because, in the examples, since the ink film was sintered using white light, the ink film could be sintered so as to spread in the horizontal direction at the defective portion faster than the ink film.
Fig. 10 is a partially enlarged view of a prosthetic device according to a modification of the present invention.
In the repair apparatus according to the modification of the present invention, in addition to the structure of the embodiment, it may further include: and a reflective optical section 700, the reflective optical section 700 being disposed between the light supplying section 300 and the table 100 so as to be capable of refracting light in an edge region of the white light irradiated from the light supplying section 300 toward a center region of the white light.
The reflective optic 700 may include: a plate 710, the plate 710 being disposed between the light supplying unit 300 and the stage 100, and having a center opened from the light supplying unit 300 toward the stage 100; a reflection surface formed on one surface, i.e., an upper surface, of the plate 710 so as to face the lamp unit 310 of the light supplier 300; a first reflecting mirror 720, which is spaced upward from the edge of the plate 710, is arranged on the path of the reflected light reflected from the reflecting surface around the opening H of the plate 710, and reflects the reflected light to the outside of the edge of the plate 710; and a second mirror 730, wherein the second mirror 730 is disposed on a path of the reflected light reflected from the first mirror 720 so as to collect the reflected light reflected from the first mirror 720 to a lower side of the opening of the plate 710. At this time, the width of the opening H of the plate 610 may be 1 μm or more and less than 100 μm. When the width of the opening H is less than 1 μm, it is difficult to pass white light so as to cover the defective portion of the substrate 10. On the other hand, when the width of the opening H is within 100 μm, white light can be irradiated to the defective portion of the substrate 10 in a sufficient area, and therefore, it is not necessary to increase the size of the opening H to a size larger than that.
The plate 610 may guide white light to the defective portion of the substrate 10 through the opening H, and may reflect the white light at a remaining area except for the opening H. The reflected light reflected from the plate 610 is obliquely guided to the defective portion of the substrate 10 by the first reflecting mirror 620 and the second reflecting mirror 630, and can be used for sintering the ink film.
For this, various patterns may be formed on the first and second reflecting mirrors 620 and 630, and at least a portion of the first and second reflecting mirrors 620 and 630 may have a predetermined curved surface so as to be able to collect reflected light. In addition, the first and second reflecting mirrors 620 and 630 may be supported by a predetermined driving unit (not shown) to be rotatable at a predetermined angle and movable by a predetermined distance. On the other hand, the plate 610, the first reflecting mirror 620, and the second reflecting mirror 630 may be supported by the moving part 400 and may move together with the light supplying part 300. The driving unit is connected to the process control part 600 and can be controlled by the process control part 600.
For example, since the light supply unit 300 is configured to generate white light using the lamp unit 310 and reflect the white light to the lower side by the reflection unit 320, it is difficult to make the size D1 smaller than mm.
However, since the size D2 of the defective portion on the substrate 10 is in μm units, most of the white light generated from the lamp unit 310 is irradiated to the periphery of the defective portion, and the contribution to the sintering ink film is small.
In the modification of the present invention, the portion of the white light contributing to the sintered ink film can be increased by refracting the light of the edge region of the white light irradiated from the light supply unit 300 toward the center region of the white light.
The above-described embodiments of the present invention are intended to be illustrative of the present invention and are not intended to be limiting of the present invention. It should be noted that the configurations and modes disclosed in the above embodiments of the present invention may be combined and modified in various forms by being combined with or crossed with each other, and such modified examples may also be regarded as the scope of the present invention. That is, the present invention is embodied in various forms different from each other within the scope of claims and the scope of technical ideas equivalent thereto, and those skilled in the art to which the present invention pertains will understand that various embodiments can be implemented within the scope of the technical ideas of the present invention.

Claims (15)

1. A prosthetic device, comprising:
a stage formed in such a manner that a substrate can be placed;
an ink supply section disposed above the table so as to be capable of ejecting conductive ink; and
a light supply unit disposed above the table so as to be capable of emitting white light for sintering the conductive ink.
2. The prosthetic device of claim 1,
the light supply unit includes:
a lamp unit that generates the white light; and
a reflection unit accommodating the lamp unit and having one side opened so as to be able to guide the white light from the lamp unit to the work table.
3. The prosthetic device of claim 2,
the light supply unit includes:
a capacitor connected to the lamp unit so as to be capable of applying a voltage in a pulse form to the lamp unit; and
a capacitor controller that controls an application condition of a voltage applied from the capacitor to the lamp unit.
4. The prosthetic device of claim 2,
the width of the open part of the reflection unit is more than 10mm and less than 1000 mm.
5. The prosthetic device of claim 1,
the ink supply section includes:
a nozzle unit formed in such a manner as to be capable of ejecting the ink using electro-hydrodynamics;
a power supply unit connected to the nozzle unit so as to be capable of forming a potential difference between the stage and the nozzle unit; and
a storage unit connected to the nozzle unit so as to be capable of supplying the ink.
6. The prosthetic device of claim 1, comprising:
a moving unit configured to move the ink supply unit and the light supply unit relative to the table, respectively; and
an observation portion supported by the moving portion so as to be able to observe the ink ejected from the ink supply portion.
7. The prosthetic device of claim 6,
the moving part includes:
a first moving unit that supports the ink supply section and the observation section; and
a second moving unit supporting the light supplying part.
8. The prosthetic device of claim 1,
the white light includes at least one of near ultraviolet rays, visible light rays, and infrared rays, and is irradiated to the defect portion on the substrate on the upper portion of the table in any one of a surface light shape and a line light shape.
9. The prosthetic device of claim 1,
the conductive ink includes silver particles.
10. The prosthetic device of claim 1, comprising:
and a reflective optical section disposed between the light supply section and the stage so as to be capable of refracting light of an edge area of the white light irradiated from the light supply section toward a center area.
11. The prosthetic device of claim 10,
the reflective optical section includes:
a plate disposed between the light supply unit and the stage, and having a center opened from the light supply unit toward the stage;
a reflecting surface formed on one surface of the plate so as to face the light supplying portion;
a first mirror that is disposed on a path of reflected light reflected from the reflecting surface, spaced upward from the edge of the plate, and reflects the reflected light to an outer side of the edge of the plate; and
a second mirror disposed on a path of the reflected light reflected from the first mirror so as to condense the reflected light reflected from the first mirror to a lower side of the opening of the plate.
12. The prosthetic device of claim 11,
the width of the opening of the plate is 1 μm or more and less than 100 μm.
13. A method of repair, comprising:
confirming a defective portion on the substrate;
a step of forming an ink film by ejecting conductive ink to the defective portion; and
and a step of irradiating the defect portion with white light to sinter the ink film.
14. The repair method according to claim 13,
the process of forming the ink film includes:
the process of jetting the conductive ink using electrohydrodynamic forces,
the process of sintering the ink film includes:
a process of generating white light of the same intensity in a pulse form; and
and a step of irradiating the white light in a pulse form to the defect portion in a surface light shape.
15. The repair method according to claim 14,
the process of irradiating the pulsed white light in any one of a surface light shape and a line light shape includes:
and a step of heating the ink film to a temperature of 100 ℃ to 1000 ℃ by irradiating the white light in the form of pulses to the defective portion for 1 second to 50 seconds.
CN202111383184.0A 2020-11-24 2021-11-22 Repair device and method Pending CN114551286A (en)

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KR101055507B1 (en) * 2009-04-09 2011-08-08 삼성전기주식회사 Repair structure and repair method of pattern part
JP4822471B1 (en) * 2010-11-30 2011-11-24 レーザーテック株式会社 EUV mask inspection apparatus and EUV mask inspection method
JP2013055286A (en) * 2011-09-06 2013-03-21 Ntn Corp Liquid application device, pattern correction device, fine pattern drawing device and liquid application method
KR101526937B1 (en) * 2013-12-11 2015-06-10 (주)유니버셜스탠다드테크놀러지 The apparatus for lighting white light
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KR101738982B1 (en) 2015-06-08 2017-05-26 참엔지니어링(주) Apparatus and Method for Repairing Substrate
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CN116810184A (en) * 2023-08-30 2023-09-29 苏州科韵激光科技有限公司 Micro-fine line laser repairing device
CN116810184B (en) * 2023-08-30 2024-02-02 苏州科韵激光科技有限公司 Micro-fine line laser repairing device

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