KR101728981B1 - Apparatus for intense pulsed light sintering - Google Patents

Abstract

An intense pulsed light apparatus is provided. The intense pulsed light apparatus includes a first main curved part which is disposed on the left upper side of a position where a first light emitting unit is prepared and has an upwardly convex shape to reflect light emitted from the first light emitting unit toward the substrate on which an object to be processed is formed, a second main curved part which is disposed on the right upper side of the position where the first light emitting unit is prepared and has an upwardly convex shape to reflect the light emitted from the first light emitting unit toward the substrate on which the object to be processed is formed, and an optical filter which is located to be separated from the upper surface of the object to be processed and configured to pass the light emitted from the first light emitting unit therethrough while having different transmittance depending on the thickness of the object to be processed. Accordingly, the present invention can improve the uniformity of light.

Description

[0001] APPARATUS FOR INTENSE PULSED LIGHT SINTERING [0002]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light sintering apparatus, and more particularly, to an optical filter considering a thickness of a material to be processed or a light sintering apparatus that provides improved light uniformity.

Recently, various electronic devices such as smart devices, OLEDs, and solar cells are being developed as electronic and information communication technologies are developed. Printing electronic technology is utilized to produce electronic devices for use in such electronic devices.

Printed electronics technology is a technology to produce functional electronic devices with desired functions by printing functional ink with conductivity, insulation and semiconductivity on plastic, film, paper, glass and substrate through industrial printing process technique. Such printing electronic technology can be applied to various materials by printing, and it enables mass production, large area and simplification of processes through the manufacturing process different from the existing electronic industry.

The process of printing electronic technology consists of three steps: printing, drying and sintering. At this time, the sintering process has a great influence on the performance of the product. Sintering is a process that has significant value in the next generation of technology by making nanoparticles dissolve to form functional thin films in solid form. Typical sintering processes are heat sintering, microwave sintering, laser sintering and so on. Since the conventional heat sintering process is carried out in a high-temperature vacuum chamber environment, it is difficult to apply to a flexible substrate susceptible to heat, and other sintering methods require a long process time and complicated steps, .

In order to solve such a problem, a light sintering technique has been developed as disclosed in the patent documents of the following prior art documents. The optical sintering technique can dissolve the nanoparticles by propagating the white light generated from the xenon lamp, so that the functional thin film can be produced much faster and in a larger quantity than the conventional method using heat.

However, the conventional photo-sintering equipment is only capable of local sintering, resulting in poor uniformity of sintering and difficulty in application to a large-area substrate. Further, the conventional light sintering apparatus has a problem that the number of times of sintering must be increased according to the thickness of the object to be treated.

Accordingly, there is an urgent need for a solution to the problems of the conventional optical sintering equipment.

Korean Patent Publication No. 2014-0094789

SUMMARY OF THE INVENTION It is an object of the present invention to provide a light sintering apparatus with improved light uniformity.

It is another object of the present invention to provide a light sintering apparatus capable of controlling light irradiation amount according to the thickness of an object to be processed.

It is another object of the present invention to provide a light sintering apparatus which performs drying and sintering together.

The technical problem to be solved by the present invention is not limited to the above.

In order to solve the above technical problems, the present invention provides a light sintering apparatus.

A light sintering apparatus according to an embodiment of the present invention includes a first light emitting unit and a second light emitting unit. The light sintering apparatus includes a first light emitting unit and a second light emitting unit. A first main bend portion that reflects light emitted from the first light emitting portion and a second main bend portion that is disposed on an upper right side of a position where the first light emitting portion is provided and is convex upward, And an optical filter which is located apart from the upper surface of the object to be processed and through which the light emitted from the first light emitting portion is transmitted and whose transmittance is different according to the thickness of the object to be processed, And the left end of the second main bent portion forms a contact point, and a line extending from the contact point in the longitudinal direction of the first light emitting portion extends in the With respect to the treatment water may be vertical.

The optical filter according to the embodiment can have a high transmittance in a thick region in comparison with a thin region of the object to be processed.

The optical filter according to an exemplary embodiment may include a reflection plate that reflects light from the first, second, and third light emitting units to the upper side.

The optical filter according to an embodiment is characterized in that the optical uniformity of the light emitted from the first light emitting portion is reflected on the first main curved portion and the second curved portion and irradiated onto the top surface of the substrate, The permeability can be improved.

The light sintering apparatus according to an embodiment of the present invention includes a light emitting unit arranged on an upper side of a position where a second light emitting unit is provided and extending from a left end of the first curve unit and convex upward, And a third light emitting portion that is disposed on an upper side of a position where the first auxiliary curved portion and the third light emitting portion are reflected and which extends from the right end of the second curved portion and convex upward, And a second auxiliary curved part that reflects to the substrate on which the water is formed.

The optical filter according to an embodiment is characterized in that light emitted from the second and third light emitting portions is reflected by the first sub-curvature portion and the second sub-curvature portion and irradiated onto the upper surface of the substrate, The light transmittance can be improved to improve the light uniformity.

The optical filter according to an embodiment may include a high transmittance region when the light emitted from the first light emitting portion is irradiated to the substrate on which the object to be processed is irradiated and a high transmittance region when the light emitted from the second and third light emitting portions The overlapped region of the high transmittance region when the light is irradiated onto the substrate on which the object to be processed is irradiated may be a low transmittance region.

At least one of the first, second, and third light emitting units may include a xenon lamp.

A light sintering apparatus according to an embodiment of the present invention includes a first light emitting unit and a second light emitting unit. The light sintering apparatus includes a first light emitting unit and a second light emitting unit. A first main bend portion disposed on the upper right side of the position where the first light emitting portion is provided and having a convex upward shape and reflecting the light emitted from the first light emitting portion toward the substrate on which the object to be processed is formed; And an optical filter which is positioned apart from the upper surface of the object to be processed and has different degrees of transmittance depending on the thickness of the object to be processed.

According to an embodiment of the present invention, uniform light can be irradiated to the substrate because it is disposed at the first and second curved portions which are convex upward toward the upper side of the first light emitting portion.

According to an embodiment of the present invention, an optical filter having different transmittances according to the thickness of the object to be treated is included, so that it can be processed in one light sintering process regardless of the thickness of the object to be processed.

1 is an exploded perspective view of a light sintering apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line A-A 'of FIG. 1 for illustrating a light sintering apparatus according to an embodiment of the present invention.
FIG. 3 is a graph showing the intensity of the first light-emitting unit light source reaching the object to be processed in the application of the reflector described with reference to FIG.
FIG. 4 is a graph illustrating the intensity of light sources of the second and third light emitting units reaching the object to be processed in the application of the reflection shadows described with reference to FIG. 2. FIG.
5 is a view for explaining an optical filter according to the first embodiment of the present invention.
6 is a view for explaining an optical filter according to a second embodiment of the present invention.
7 is a view for explaining an optical filter according to a third embodiment of the present invention.
8 is a flowchart illustrating a method of forming a conductive film using a light sintering apparatus according to embodiments of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the technical spirit of the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

In this specification, when an element is referred to as being on another element, it may be directly formed on another element, or a third element may be interposed therebetween. Further, in the drawings, the shapes and thicknesses of regions are exaggerated for an effective description of the technical content.

Also, while the terms first, second, third, etc. in the various embodiments of the present disclosure are used to describe various components, these components should not be limited by these terms. These terms have only been used to distinguish one component from another. Thus, what is referred to as a first component in any one embodiment may be referred to as a second component in another embodiment. Each embodiment described and exemplified herein also includes its complementary embodiment. Also, in this specification, 'and / or' are used to include at least one of the front and rear components.

The singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. It is also to be understood that the terms such as " comprises "or" having "are intended to specify the presence of stated features, integers, Should not be understood to exclude the presence or addition of one or more other elements, elements, or combinations thereof. Also, in this specification, the term "connection " is used to include both indirectly connecting and directly connecting a plurality of components.

Also, in this specification, the expression "same, vertical, and symmetric" is a concept including not only completely identical, vertically, symmetric but also substantially the same, vertical, and symmetrical case. In this specification, the expression "same, vertical, and symmetric" includes not only the case where the design values are the same, the vertical and the symmetry but also the case where the design is the same, vertical and symmetrical on the product.

In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

1 is an exploded perspective view of a light sintering apparatus according to an embodiment of the present invention.

1, a light sintering apparatus according to an embodiment of the present invention includes light emitting units 10, 20 and 22 for reflecting light emitted from a first light emitting unit 10, (30) and a reflective wall (40).

Further, the light sintering apparatus according to an embodiment of the present invention may include a housing 70 positioned outside the reflection gutter 30 and the reflection wall 40.

The material 1 to be processed according to an embodiment of the present invention may be a material to be photo-sintered, such as fine metal particles and precursors patterned on a plastic film, a paper, a glass, a substrate S or the like. For example, the object 1 to be processed may contain not only metals such as copper, iron, molybdenum, nickel, aluminum, gold and platinum, but also ceramics such as titanium oxide, lithium cobalt oxide and silicon oxide. The object 1 to be treated may be nano- or micro-sized, in which case the surface area ratio of the particles becomes large, and high light absorption can be provided. In addition, for example, the object 1 to be processed is a metal nano ink printed on a substrate S, and may be formed as an electrode of an electronic device such as a solar cell, a semiconductor, a display, etc. through a drying and sintering step. However, the object to be treated 1 is not limited to the metal nano ink forming the electrodes.

At this time, the light sintering apparatus according to an embodiment of the present invention may further include a fixing unit 50 for fixing the substrate S on which the article 1 is printed. The fixing unit 50 fixes the object 1 and fixes the object 1 so as to be spaced downward by a predetermined distance from the lower end of the reflecting wall 40, Can be disposed. For example, the fixing unit 50 may be fixed while the object 1 is being sintered, and the object 1 may be roll-to-roll It can function as a movable fixing part to be sintered while moving.

The first to third light emitting units 10, 20 and 22 can be positioned at the upper end of the object 1 to emit light toward the upper surface of the substrate on which the object 1 is formed .

The first, second, and third light emitting units 10, 20, and 22 may be a xenon lamp, an infrared lamp, or an ultraviolet lamp. The Xenon lamp is a lamp which emits light by discharge occurring in the xenon gas, and can generate the extreme ultraviolet light having the light spectrum of a wide wavelength band of 60 nm to 2.5 mm, thereby sintering the object 1 to be processed. When the object to be treated is a metal nano ink, the infrared lamp can improve the efficiency of sintering because ultraviolet light cuts off the linkage linking the polymer contained in the ink. The infrared lamp can also function to dry the object to be treated.

According to an embodiment, the light sources constituting the first light emitting portion 10, the second light emitting portion 20, and the third light emitting portion 22 may be combined in various ways. For example, the first light emitting unit 10 may be a xenon lamp, and the second light emitting unit 20 and the third light emitting unit 22 may be an infrared lamp or an ultraviolet lamp. Hereinafter, for convenience of explanation, it is assumed that the first light emitting unit 10 is a xenon lamp and the second and third light emitting units 20 and 22 are infrared lamps.

The housing 70 may cover at least one of the reflector 30 and the reflective wall 40. The housing 70 surrounds the upper surface of the reflector 30 and the outer surface of the reflective wall 40 to protect the reflector 30 and the reflective wall 40 from external impacts.

The light sintering apparatus according to an embodiment of the present invention may further include an optical filter 60 for controlling light directed toward the article 1 to be processed. The optical filter 60 may be provided between the first, second, and third light emitting units 10, 20, 22 and the upper surface of the object 1 to be processed.

At this time, the optical filter 60 can be fixed by the reflecting wall 40. For example, a sliding groove is formed on the inner surface of each of the pair of reflecting walls 40 so that the optical filter 60 slides , ≪ / RTI > However, the optical filter 60 does not necessarily have to be fixed to the reflection wall 40, or slidably attached to or detached from the reflection wall 40.

The optical filter 60 may be a filter or quartz that selectively transmits a specific spectrum. The configuration of the optical filter 60 will be described in detail below.

The light sintering apparatus according to an embodiment of the present invention has been described above. Hereinafter, a light sintering apparatus according to an embodiment of the present invention will be described in detail with reference to FIG.

FIG. 2 is a cross-sectional view taken along line A-A 'of FIG. 1 for illustrating a light sintering apparatus according to an embodiment of the present invention. In FIG. 2, the optical filter 60 is omitted for convenience of explanation.

Referring to FIG. 2, the reflector 30 and the reflecting wall 40 of the light sintering apparatus according to the embodiment of the present invention are arranged such that light emitted from the first to third light emitting portions 10, 20, It is possible to provide the reflecting surface so as to be uniformly reflected on the upper surface of the object 1 to be treated.

For this, the reflector 30 may include a first main bent portion 33 and a second main bent portion 34.

The first main bent part 33 is disposed on the left upper side of the position where the first light emitting part 10 that emits light to the substrate S on which the article to be processed 1a is formed and the upward convex shape + y Direction) so that the light emitted from the first light emitting portion 10 can be reflected toward the top surface of the object to be processed. The first main flexion portion 33 may be symmetrical with respect to the center a2 of the first main flexion portion 33.

The second main bent portion 34 is disposed on the upper right side of the position where the first light emitting portion 10 that emits light as the object to be processed is provided and has a convex upward shape (+ y direction) The light emitted from the light source 10 can be reflected toward the top surface of the object to be processed. The second main curve portion 34 may be symmetrical with respect to the center b2 of the second curve portion 34a.

At this time, the string a1 of the first main bend portion 33 and the string b1 of the second upper main bend portion 34 may be on the same line.

The right end of the first main bend portion 33 and the left end of the second main bend portion 34 form a contact point and extend in the longitudinal direction of the first light emitting portion 10 Line (c, hereinafter referred to as a center line) may be perpendicular to the substrate on which the object to be processed is formed.

According to an embodiment, the first light emitting portion 10 may be disposed at a distance below a predetermined distance from a contact between the right end of the first main bent portion 33 and the left end of the second main folded portion 34 have.

The reflector 30 including the first main curved portion 33 and the second main curved portion 34 is arranged such that the light emitted from the first light emitting portion 10 is incident on the substrate S, It is possible to provide the reflecting surface so as to reach uniform intensity on the surface.

In the case where the light emitting portion is disposed under the reflector having a single circular arc shape, unlike the reflector according to the embodiment of the present invention, light emitted from the light emitting portion directly to the surface of the object to be processed, The light emitted to the surface of the processed material is superimposed. Accordingly, in the prior art, there is a problem that the intensity of light at the central portion of the object appears higher than the peripheral portion of the object to be processed.

However, as in the embodiment of the present invention, the first light emitting portion 10 is located below the contact point where the first main folding portion 33 and the second main folding portion 34 are in contact with each other, The intensity of the light reflected on the surface of the object can be reduced. Thus, according to an embodiment of the present invention, it is possible to provide an effect that the intensity of light at the central portion of the object to be processed and the intensity of light at the peripheral portion of the object to be processed become uniform.

The reflector 30 according to an embodiment of the present invention may further include a first auxiliary curved portion 35 and a second auxiliary curved portion 36 to improve the uniformity of the light directed toward the object to be processed.

The auxiliary curved portions 35 and 36 are concavely recessed upwardly from the lower surface of the reflector 30 and formed into a curved shape like the main curved portions 33 and 34. Each curved portion has curved portions 33 and 34 And the other end thereof. More specifically, the first sub-curve 35 extends upward from the left end of the first main curve 35, and the second sub-curve 36 extends to the right of the second main curve 34, It can be extended upwardly at the end portion.

The first main bending portion 33 and the first auxiliary bending portion 35 are positioned at the center of the second main bending portion 34 and the second auxiliary bending portion 36 with respect to the center line c, Symmetry can be achieved.

The second light emitting portion 20 and the third light emitting portion 22 may be positioned below the first auxiliary curved portion 35 and the second auxiliary curved portion 36, respectively. At this time, the first auxiliary curved portion 35 is positioned to surround at least a part of the second light emitting portion 20, and the second auxiliary curved portion 36 surrounds at least a part of the third light emitting portion 22 Can be located.

The second light emitting portion 20 and the third light emitting portion 22 located below the first auxiliary curved portion 35 and the second auxiliary curved portion 36 are symmetrical with respect to the center line c, .

According to an embodiment, the second light emitting portion 20 and the third light emitting portion 22 may be located at the upper end in the + y direction from the first light emitting portion 10.

The reflector 30 may be manufactured by mixing any one or two or more of various metals such as gold, silver, aluminum, and iron, and non-metallic materials such as ceramics and alumina. At this time, the reflector 30 itself is not necessarily made of such a material, and a mixture of any one or more of these materials may be coated on the lower surface of the reflector 30.

Meanwhile, the light sintering apparatus according to an embodiment of the present invention may further include a reflection wall 40 for reflecting the light emitted from the first to third light emitting units 10, 20, and 22 to the surface of the object to be processed .

The reflective wall 40 may also be formed by mixing any one or two or more of various metals such as gold, silver, aluminum, and iron, and non-metallic materials such as ceramic and alumina. At this time, the reflecting wall 40 itself is not necessarily made of such a material, and a mixture of any one or more of these materials may be coated on the lower surface of the reflecting wall 40. [

The reflector and the reflecting wall have been described with reference to Fig. Hereinafter, the performance of the reflector and the reflecting wall according to the embodiment of the present invention will be described with reference to FIGS. 3 and 4. FIG.

FIG. 3 is a graph showing the intensity of the first light-emitting portion light source reaching the object during application of the reflector described with reference to FIG. 2. FIG. 4 is a graph showing the intensity 2 and the intensity of the third light emitting portion light source.

As shown in FIG. 3, the intensity of the light emitted from the first light emitting unit according to an exemplary embodiment of the present invention is uniformly distributed on the surface of the substrate. 3 (a) is a three-dimensional graph showing the intensity of the light emitted from the first light emitting unit, and FIG. 3 (b) is two-dimensional data viewed in the y-axis direction. Was uniform.

Referring to FIG. 4, it can be seen that the intensity of the light emitted from the second and third light emitting units according to the embodiment of the present invention is uniformly distributed on the surface of the substrate. 4 (a) shows the intensity of the light sources of the second and third light emitting units in a three-dimensional graph, and FIG. 4 (b) shows two-dimensional data viewed in the y-axis direction.

That is, according to the structural features of the reflector 30 and the upper reflecting wall 40 according to an embodiment of the present invention, the light sintering apparatus according to an embodiment of the present invention can have a uniform intensity Light. ≪ / RTI >

Hereinafter, an optical filter applied to a light sintering apparatus will be described with reference to Figs. 5 to 7. Fig.

5 is a view for explaining an optical filter according to an embodiment of the present invention.

5, an optical filter 60 according to an embodiment of the present invention is configured such that light emitted from the first to third light emitting units 10, 20, and 22 is incident on a substrate S As shown in FIG. In other words, the optical filter 60 is disposed on the lower side (-y direction) of the first to third light emitting units (! 0, 20, 22) and the upward direction (+ y direction) As shown in FIG.

According to one embodiment, the workpiece 1 formed on the substrate S may have different thicknesses depending on the region. For example, as shown in FIG. 5, the thickness of the object 1 to be processed is an S1 region having a thickness of D1 formed in a via hole, a S2 region having a thickness of D2 which is thinner than the thickness of D1, And an S3 region where the water 1 is not formed.

At this time, the optical filter 60 may be made to have a different degree of transmittance depending on the thickness of the object 1 to be processed. For example, since the to-be-processed object 1 can be irradiated with a strong intensity light in the thick S1 region, the portion 60a corresponding to the S1 region can have a high transmittance. In addition, since light of a lower intensity than that of S1 can be irradiated to the S2 region where the object 1 is thinner than S1 region, the portion 60b corresponding to the S2 region can have a lower transmittance.

Furthermore, the portion 60c corresponding to the region S3 in which the object 1 is not formed can have the lowest transmittance. Alternatively, the portion 60c corresponding to the region S3 in which the article 1 is not formed may be formed of a reflecting plate. For example, the upper surface of the portion 60c corresponding to the S3 region may be coated with a reflector. This is because light sintering is not required for the area S3 in which the article 1 to be treated is not formed and therefore the light directed to the part 60c corresponding to the area S3 in which the article 1 is not formed is reflected again from the top surface , S1 and / or S2 regions.

The optical filter 60 may be implemented in various ways to have a transmittance corresponding to the thickness of the object 1 to be processed. For example, the optical filter 60 may further include a quartz top surface and / or a light film attached to the bottom surface. At this time, the optical film may have a transmittance corresponding to the thickness of the object 1, and may be made of a resin having a low transmittance, for example, in a low transmittance region. In this case, the optical film may function as a photo mask. Alternatively, the optical filter 60 may be configured such that the quartz itself has a transmittance corresponding to the thickness of the article 1 to be processed. For example, the optical filter 60 may be thin in the region where the transmittance is high, and thick in the region where the transmittance should be low. The optical filter 60 may be implemented by a combination of the optical film and the quartz described above.

According to an embodiment of the present invention, the optical filter may have different transmittances depending on the thickness of the object to be processed. Accordingly, a light sintering process independent of the thickness of the material to be processed 60 can be performed.

If the optical filter 60 according to an embodiment of the present invention is not provided, the light sintering process should be performed a plurality of times according to the thickness of the material to be processed. For example, a photo-sintering process with a weak intensity is performed for a thin region of a material to be processed, and then a photo-sintering process with a strong intensity for a thick region is performed. This is because, even when the thickness of the object to be processed is small, light sintering with a high strength results in defects in the material to be treated. That is, in order to perform photo-sintering of a material to be processed having a plurality of thicknesses printed on a single substrate, a plurality of photo-sintering processes must be performed.

However, as in the embodiment of the present invention, since the optical filter 60 has different transmittances depending on the thickness of the object to be processed, even when the object to be processed having a plurality of thicknesses printed on a single substrate is sintered, It is possible to provide an effect that light sintering is possible.

On the other hand, in the description of this embodiment, it is assumed that the thickness of the article to be processed is two, but this is not limitative.

 The optical filter according to the first embodiment of the present invention has been described above. Hereinafter, an optical filter according to a second embodiment of the present invention will be described with reference to FIG.

6 is a view for explaining an optical filter according to a second embodiment of the present invention. Specifically, FIG. 6 (a) is a simplified representation of the intensity of the light source described with reference to FIG. 3, and FIG. 6 (b) is a diagram showing an example of the optical filter according to the second embodiment.

As described above with reference to FIG. 3, the reflector according to one embodiment of the present invention can guide the light source such that the light source of the first light emitting portion is irradiated to the upper surface of the substrate having the object to be processed at a uniform intensity. However, as shown in FIG. 3, light of a stronger intensity than the average may be irradiated to some localized regions. Therefore, the optical filter according to the second embodiment of the present invention can be configured to filter light in a region where light of a locally strong intensity is irradiated.

Referring to FIG. 6A, the intensity of the light source described with reference to FIG. 3 is a region T1 in which the intensity of the light source is locally strongly irradiated and a region T2 in which the intensity of the light source is irradiated by the intensity of the average light source It can be conceptually distinguished.

Accordingly, the optical filter 60 according to the second embodiment of the present invention can filter light so that the light intensity of the T1 region is balanced with the light intensity of the T2 region. The optical filter 60 includes a low transmittance region TF1 and a high transmittance region TF2 for transmitting light in the T2 region so as to at least partially block the light in the T1 region. can do.

The optical filter 60 may be implemented by a light film on which a black resin is formed in a corresponding region to lower the transmittance of the low transmittance region TF1.

Thus, the optical filter according to the second embodiment of the present invention can provide an effect of correcting non-uniformity of light generated partially by the reflector reflecting the light emitted from the center portion. This improves the uniformity of the area of the light to be irradiated on the upper surface of the object to be processed, so that the reliability of the optical element can be secured.

In other words, the light emitted from the first light emitting portion 10 made of a xenon lamp can be primarily improved in uniformity by the reflector and secondarily improved by the optical filter. Therefore, the object to be processed can be irradiated with uniform xenon lamp light over the xz plane, so that the reliability of photo-sintering is improved.

Hereinafter, an optical filter according to a third embodiment of the present invention will be described with reference to FIG.

7 is a view for explaining an optical filter according to a third embodiment of the present invention. FIG. 7A is a simplified representation of the intensity of the light source described with reference to FIG. 4, and FIG. 7B is a diagram showing an example of the optical filter according to the third embodiment.

As described above with reference to FIG. 4, the reflector according to an exemplary embodiment of the present invention can guide the direction of light so that the light sources of the second and third light emitting units are irradiated uniformly on the surface of the substrate on which the object is formed . However, as shown in FIG. 4, light having a stronger intensity than that of the average may be irradiated to some local regions. Therefore, the optical filter according to the third embodiment of the present invention can be configured to filter light in a region where light of locally strong intensity is irradiated.

Referring to FIG. 7A, the intensity of the light source described with reference to FIG. 4 is a region T3 in which the intensity of the light source is strongly irradiated and a region T4 in which the intensity of the light source is irradiated by the intensity of the average light source Can be distinguished.

Thus, the optical filter 60 according to the second embodiment of the present invention can filter light so that the light intensity in the T3 region is balanced with the light intensity in the T4 region. The optical filter 60 includes a low transmittance region TF3 and a high transmittance region TF4 so as to transmit light in the low transmittance region TF3 and the T4 region so as to at least partially block the light in the T3 region. can do.

The optical filter 60 may be realized by a light film having an infrared filter function in a corresponding region so as to lower the transmittance of the low transmittance region TF3.

Thus, the optical filter according to the third embodiment of the present invention can also provide an effect of correcting non-uniformity of light generated partially by the reflector reflecting the light emitted from the center portion. This improves the uniformity of the area of the light irradiated onto the upper surface of the object to be processed, so that the reliability of the light sintering process can be secured.

In other words, the light emitted from the second and third light emitting units 20 and 22 made of infrared lamps can be primarily improved in uniformity by the reflection gates and can be improved secondarily by the optical filter. Therefore, the object to be processed can be irradiated with uniform infrared lamp light over the xz plane, thereby improving light drying reliability.

The optical filter according to the embodiments of the present invention has been described with reference to FIGS. It is needless to say that the optical filters according to the first to third embodiments described above can be implemented individually or in combination. For example, the optical filter described with reference to FIG. 5 may be combined with the optical filter described with reference to FIG. 6 and / or the optical filter described with reference to FIG. At this time, the optical filter described with reference to FIG. 5 selectively has a low transmission region only in a region where the high transmission region of the optical filter explained with reference to FIG. 6 and the high transmission region of the optical filter described with reference to FIG. .

8 is a flowchart illustrating a method of forming a conductive film using a light sintering apparatus according to embodiments of the present invention.

A method of forming a conductive film according to an embodiment of the present invention includes a step S100 of printing a metal nano ink to be processed, a step S200 of drying the metal nano ink, and a step S300 of sintering the metal nano ink, . ≪ / RTI >

More specifically, in the step of printing the metal nano ink, the metal nano ink may be printed on the substrate and patterned. For example, the substrate may be plastic, film, paper, glass, or the like. When the metal nano ink is printed, a step of drying the metal nano ink may be performed. In this case, the object to be treated on the substrate can be dried by irradiating infrared rays or ultraviolet rays. The metal nioink ink sintering step may be performed simultaneously with the metal nano ink drying step or after the metal nano ink drying step. Sintering through the irradiation of white light emitted from a xenon lamp can be performed by a short pulse sintering method which irradiates one pulse, a multi-pulse sintering method which irradiates the energy of white light by a plurality of pulses, Step (2 step) sintering. In addition, in the sintering step of the metal nano ink, the linkage of the polymer contained in the metal nano ink can be broken by emitting ultraviolet rays.

In the embodiment described with reference to Figs. 5 to 7, the substrate on which the object to be processed is printed is irradiated with the infrared light by the second and third light emitting portions 20 and 22, whereby the object to be processed is dried . In addition, the dried material to be irradiated is irradiated to the xenon lamp light by the first light emitting portion 10, whereby the object to be sintered is sintered. Therefore, the productivity of the process can be improved since the process for drying the object to be treated and the sintering process can be performed together in a single chamber. Also, since drying and sintering can be performed together in a single chamber, it is possible to minimize warpage caused by cooling of the substrate before the sintering process after the drying process.

In particular, according to the embodiment described with reference to FIG. 5, the optical filter has the transmittance corresponding to the thickness of the object to be processed, so that the infrared lamp light and the xenon lamp light corresponding to the thickness of the object to be processed can be supplied. Accordingly, since sintering is possible regardless of the thickness of the object to be processed, the productivity and reliability of the light sintering process can be improved.

According to the embodiments described with reference to FIGS. 6 and 7, the uniformity of the light emitted from the light emitting portions is improved primarily in the reflector so that the uniformity of the optical filter is improved secondarily, so that the drying reliability and the sintering reliability Can be improved.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the scope of the present invention is not limited to the disclosed exemplary embodiments. It will also be appreciated that many modifications and variations will be apparent to those skilled in the art without departing from the scope of the invention.

1: object to be processed 10:
20: second light emitting portion 22: third light emitting portion
30: reflector 33: first main bend
34: 2nd main bend section 35: 1st auxiliary bend section
36: second auxiliary curved portion 40: reflective wall
60: optical filter S: substrate
C: Center line

Claims (8)

A first main bend portion disposed at a left upper side of a position where the first light emitting portion is provided and having a convex upward shape and reflecting the light emitted from the first light emitting portion toward a substrate on which a material to be processed is formed;
A second main bend portion disposed on an upper right side of a position where the first light emitting portion is provided and having a convex upward shape and reflecting the light emitted from the first light emitting portion toward the substrate on which the object to be processed is formed; And
And an optical filter positioned apart from an upper surface of the object to be processed and transmitting light emitted from the first light emitting portion and having different transmittances depending on a thickness of the object to be processed,
Wherein a line extending from a center of the first light emitting part in a longitudinal direction of the first light emitting part is perpendicular to a direction perpendicular to the object to be processed, / RTI > The method according to claim 1,
Wherein the optical filter has a high transmittance in a thick region in comparison with a thin region of the object to be processed. The method according to claim 1,
Wherein the light filter includes a reflection plate that reflects light from the first light emitting portion, the second light emitting portion, and the third light emitting portion upward, in a region where the object to be processed is not formed. The method according to claim 1,
Wherein the optical filter has a transmittance such that the light uniformity is improved based on the light uniformity when the light emitted from the first light emitting portion is reflected by the first main bent portion and the second main bent portion and irradiated onto the upper surface of the substrate, . The method according to claim 1,
And a second auxiliary light source that is disposed on an upper side of a position where the second light emitting unit is provided and extends from a left end of the first main curved portion and convex upward and reflects the light emitted from the second light emitting unit to the substrate on which the object to be processed is formed bend; And
A second auxiliary part disposed on the upper side of the position where the third light emitting part is provided and extending from the right end of the second main bent part and projecting upward and reflecting the light emitted from the third light emitting part to the substrate on which the object to be processed is formed And a curved portion. 6. The method of claim 5,
Wherein the optical filter has the light uniformity based on the light uniformity when the light emitted from the second and third light emitting portions is reflected by the first auxiliary curved portion and the second auxiliary curved portion and irradiated onto the upper surface of the substrate So as to improve the light transmittance. 6. The method of claim 5,
Wherein the optical filter includes a high transmittance region when the light emitted from the first light emitting portion is irradiated to the substrate on which the object to be processed is irradiated and light emitted from the second and third light emitting portions, Wherein the overlap region of the high transmittance region when irradiated onto the water-formed substrate comprises a low transmittance region. 6. The method of claim 5,
Wherein at least one of the first light emitting portion, the second light emitting portion, and the third light emitting portion comprises a xenon lamp.

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