JP2007048877A - Method and device for repairing wiring pattern of electronic circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for repairing the wiring pattern of an electronic circuit board and a device for repairing wiring by an electroplating being capable of easily repairing the disconnection of complicated thin wiring formed on the electronic circuit board, and being capable of sufficiently thickening a thin-film metal in repairing sections while reducing an effect on sections excepting the repairing sections. <P>SOLUTION: A specified range containing the disconnection M of the wiring pattern of the electronic circuit board generating the disconnection or the like is supplied with an ultraviolet photo-setting resin, and the ultraviolet photo-setting resin is cured. A part of the photo-setting resin is removed on a place to be repaired, the section of the removed resin is supplied with an electrolyte through a dispenser nozzle 15 with a built-in anode 14, and a voltage is applied between the end face of the disconnection M and the anode 14. Consequently, the electroplating is conducted between the end face of the disconnection M and the anode 14. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a wiring pattern repairing method and a wiring pattern repairing apparatus for repairing disconnection of wiring of an electronic circuit such as a TFT substrate by electrolytic plating.

Conventionally, in an apparatus for repairing disconnection of wiring of an electronic circuit such as a TFT substrate, as shown in Patent Document 1 and Patent Document 2, a metal complex or an organometallic compound is dissolved in an organic solvent in the disconnected portion. After applying a solution in which a solution or metal particles are dispersed in an organic solvent, the application portion is irradiated with laser light, the organic solvent in the solution is evaporated, and a metal thin film is deposited on the disconnection portion. There is known a device for connecting and conducting wiring at both ends of a part.
Japanese Patent Laid-Open No. 2-19838 JP-A-7-29982

However, in the above-described conventional wiring repair device, since the laser light is irradiated to the application portion of the solution, a part of the solution containing the metal is scattered around the laser light irradiation portion by the energy of the laser light, In addition to the problem that the thickness of the metal thin film deposited on the disconnected portion is not sufficiently formed and the wiring is not sufficiently repaired, and the substrate is locally heated by laser light, the conventional apparatus is complicated. In the case of wiring repair, there is a problem that a process such as a continuity test after the repair work is required as to whether or not the repair has been normally performed.

The present invention has been made in view of the above circumstances, has a simple structure, can make the thickness of a thin film metal at a repaired portion sufficient, has little influence on other than the repaired portion, and is repaired. An object of the present invention is to provide a wiring pattern repair method and a wiring pattern repair device for an electronic circuit board that can be wired while confirming continuity during work.

In order to solve the above-described problem, in the method according to claim 1, the ultraviolet light curable resin is supplied to a predetermined range including the disconnected portion of the wiring pattern of the electronic circuit board in which the disconnection or the like has occurred, and then the ultraviolet light is cured. After the photocurable resin is cured, a part of the cured resin above the predetermined range is removed, and then the electrolytic solution is supplied through a dispenser nozzle having an anode built in the removed resin part. After supplying, by applying a voltage between the end face of the disconnected portion and the anode, electrolytic plating is performed between the end face of the disconnected portion and the anode to repair the wiring pattern. Yes.

3. The apparatus according to claim 2, wherein means for supplying an ultraviolet curable resin to a predetermined range including the disconnected portion of the wiring pattern of the electronic circuit board in which disconnection or the like has occurred, and the disconnection of the wiring pattern of the electronic circuit board. A means for curing the ultraviolet light curable resin supplied to a predetermined range including the portion; a removing means for removing a part of the resin cured by the ultraviolet light; and an anode on the portion removed by the removing means. An electrolyte supply means for supplying an electrolyte solution through a built-in nozzle; an arrangement means for disposing a gap between a tip of the nozzle and an end face of the disconnection portion in a predetermined gap; the anode and the disconnection portion; And an applying means for applying a voltage between the end faces.

According to the wiring pattern repairing method and wiring pattern repairing apparatus of the electronic circuit board of the present invention, since the electrolytic solution is held only at the repaired part, there is no influence on the part other than the repaired part, and the electrolytic plating is appropriately performed. Is called.
Further, since the electrolytic plating solution does not scatter, the thickness of the thin film metal at the repaired portion can be made sufficient.
And since it can be repaired while confirming the electrical continuity between the anode for electrolytic plating built in the microdispenser nozzle and the end face of the disconnected portion, there is no need to conduct a continuity test of the repaired part after the repair work, It has an excellent effect that it can be shortened.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a conceptual diagram showing an embodiment of an electronic circuit wiring pattern repairing apparatus according to the present invention. An electronic circuit wiring pattern repairing apparatus 1 is an XY circuit board (hereinafter simply referred to as “workpiece”) 6 that is an electronic circuit board such as an integrated circuit or a liquid crystal display device and has a repaired portion. A table unit 4 that can move in the direction (perpendicular to the plane of FIG. 1), an optical system unit 3, a wiring repair unit 2, and a control unit 5 that controls these units are provided.

The table unit 4 includes a mounting table 4A for mounting and holding the workpiece 6, a table 4B, and a table driving device 4C. The optical system unit 3 and the wiring repair unit 2 are moved relative to the mounting table 4A by the table driving device 4C. It is possible.

The optical system unit 3 includes an objective lens 11 facing the workpiece 6, an imaging lens 13 arranged coaxially with the optical axis L of the objective lens 11, a half mirror 12A, a half mirror 12B, a variable slit 8, In addition to a laser irradiator 9 having a built-in open / close switch (not shown), a deflection mirror 12C disposed on the optical axis of the optical axis L1 branched from the optical axis L by a half mirror 12B; The CCD camera 10 is provided on the optical axis L2 deflected from the optical axis L1 by the deflecting mirror 12C.

Further, the optical system unit 3 is disposed on the optical axis L3 branched from the optical axis L by the half mirror 12A, and is branched from the optical axis L3 by the half mirror 12D that branches a part of the optical axis L3 and the half mirror 12D. An illuminating means 9A for irradiating a predetermined area including the intersection point A between the optical axis L and the workpiece 6 and an optical axis L3 transmitted through the half mirror 12D. An ultraviolet irradiator 9 </ b> B is provided which is disposed above and incorporates an opening / closing shutter (not shown) for irradiating ultraviolet light curable resin 7 described later with ultraviolet rays.

The CCD camera 10 is electrically connected to the display device 11 so that an image captured by the CCD camera 10 can be displayed on the display device 11.
As shown in FIG. 2, the variable slit 8 has slit plates 8A, 8B, 8C, and 8D. These slit plates 8A, 8B, 8C, and 8D are electrically connected to the controller 5A of the control unit 5. In addition to being able to move independently in the direction of arrow B in FIG. 2 by the slit driving means (not shown), the entire variable slit 8 is rotatable in the direction of arrow C in FIG. By adjusting the shape of the portion 8E and the center position and rotation of the opening 8E, the shape and position of the laser light emitted from the laser irradiator 9 to the workpiece 6 can be adjusted.

The wiring repair unit 2 includes a first dispenser nozzle 13 and a second dispenser nozzle 15 having a built-in anode 14.
The first dispenser nozzle 13 can be moved back and forth in the direction of the arrow β with respect to the position A by the first dispenser nozzle moving means 13A, and an ultraviolet light curable resin supply device 13B is provided in the first dispenser nozzle 13. The ultraviolet light curable resin 7 is connected so that it can be supplied from the tip of the first dispenser nozzle 13 to a predetermined range including the disconnected portion M of the workpiece 6.

The second dispenser nozzle 15 can be moved toward and away from the position A along the arrow α direction by the second dispenser nozzle moving means 15A.
Then, an electrolytic plating solution supply device 15B of an electrolytic plating solution 18 made of Cu salt is connected to the opening 15b on the opposite side of the tapered tip 15a of the second dispenser nozzle 15, and the electrolytic solution 23 is used as the second dispenser. It can supply to the repair location of the workpiece | work 2 from the front-end | tip port 15a of the nozzle 15. FIG.

When supplying the electrolytic plating solution 18 from the tip port 15a of the dispenser nozzle 15 to the repaired portion of the workpiece 2, the electrolytic plating solution 18 is supplied after the tip port 15a is brought into contact with the end face of the disconnection portion M, thereby causing the electrolytic plating. Since the liquid 18 does not form a droplet (FIG. 5D) on the outer peripheral surface of the tip port 15 a, the electrolytic plating solution 18 can be supplied to the end surface of the disconnected portion M with high accuracy.

The anode 14 has an axial shape, and can be advanced and retracted in the axial direction by the anode advancing / retreating means 14A. The distance between the tip of the anode 14 and the end face of the disconnection portion M (FIG. 3A) is adjusted to the electrolytic plating conditions. Can be set.

A power supply device 14B for applying a voltage for electrolytic plating is connected to the anode 14 and the end of the wire M of the disconnected portion M of the work 6, and the power supply device 14B displays current and voltage during electrolytic plating. The end of the anode 14 is connected to the positive electrode of the power supply device 14B for electroplating via the connection cord 16. The negative electrode of the power supply device 14 </ b> B is connected to the wire of the disconnected portion M via the connection cord 16 to form the cathode 17.

The control unit 5 includes a control device 5A and an external input device 5B. The control device 5A includes a table moving means 4, a slit driving means for the variable slit 8, an open / close switch for the laser irradiator 9A, a CCD camera 10, and an illumination means 9C. The ultraviolet light irradiator 9B, the dispenser nozzle moving means 13A, the dispenser nozzle moving means 15A, the anode advance / retreat means 14A, the power supply device 14B, and the external input device 5A are electrically connected, and the external input device 5A The shape and center position of the opening 8E can be freely set.
The control device 17 moves the workpiece 6 at a speed corresponding to the deposition rate of Cu in the disconnected portion M of the wiring pattern by electroplating. The table moving means 4 can be controlled so that the interval can be maintained at a predetermined distance.

Next, the wiring pattern repairing method according to the present invention by the wiring pattern repairing apparatus 1 of the above embodiment will be described with reference to FIGS.
First, after confirming that the open / close switch of the laser light irradiator 9A and the open / close shutter of the ultraviolet light irradiator 9B are closed, the work 6 is mounted on the mounting table 4A, and then the illumination means 9C is activated. After that, the workpiece 6 is moved using the external input device 5 </ b> B through the control device 5 so that the disconnected portion M (FIG. 3A) of the workpiece 6 is positioned directly below the objective lens 11. (Step 1)
Subsequently, the disconnection portion M is photographed by the CCD camera 10, the photographed image is displayed on the display 11, and the variable slit driving means is operated in accordance with the image, and the shape of the opening 8E of the variable slit 8 is changed. adjust. (Step 2)

Next, the first dispenser nozzle moving means 13A moves the tip of the first dispenser 13 close to the vicinity of the disconnected portion M, operates the ultraviolet light curable resin supply device 13B, and includes a predetermined portion including the disconnected portion M. After supplying the ultraviolet curable resin 7 so as to cover the range (FIG. 3B), the first dispenser nozzle moving means 13A is operated to irradiate the tip of the first dispenser 13 with ultraviolet light. Retreat to a position where it is not performed (hereinafter referred to as “the origin position of the dispenser 13”). (Step 3)

Thereafter, the open / close shutter of the ultraviolet light irradiator 9B is opened to cure the ultraviolet light curable resin 7, and then the open / close shutter of the ultraviolet light irradiator 9B is closed. (Step 4)
Thereafter, the open / close switch of the laser irradiator 9A is opened, and a predetermined portion of the ultraviolet light cured resin is irradiated with laser (FIG. 3C), and the resin in the portion is removed. As shown in (d), an enclosure N in which the broken portion M is surrounded by the ultraviolet light curable resin 7 is formed. (Step 5)

Thereafter, as shown in FIG. 3 (e), the second dispenser nozzle 15 is moved closer to the enclosure N by the second dispenser nozzle moving means 15A, and then the electroplating solution supply device 15A is moved to the enclosure N. By actuating, an electrolytic plating solution 18 made of a predetermined amount of Cu salt is supplied from the second dispenser nozzle 15 to the vicinity of the end face of the disconnected portion M in the enclosure N. (Step 6)

Further, while maintaining the position of the second dispenser nozzle 15, the anode 14 is positioned so that the gap between the end face of the broken portion M and the tip of the anode 14 is within a predetermined range by operating the anode advance / retreat means 14A. Hold.
Next, the power supply device 14B is operated, and a voltage is applied between the anode 14 and the cathode 17 to deposit Cu on the end face of the disconnected portion M. (Step 7)

At this time, because the Cu deposited on the end face of the disconnection portion M reduces the gap between the end face of the disconnection portion M and the tip of the anode 14 from the initial setting value, the gap between the end face of the disconnection portion M and the tip of the anode 14 is reduced. Electrolytic plating is performed while moving the workpiece W in the direction of the arrow D in FIG. (Step 8)
Then, after Cu is deposited in the disconnection portion M and the wiring pattern is repaired and connected, the voltage application from the power supply device 14B is stopped, and then the anode 14 is operated by the anode advancing / retreating means 14A. At the same time, the second dispenser nozzle moving means 15A is operated to move the second dispenser nozzle 15 to a predetermined position (the tip port 15a of the second dispenser nozzle 15 has a laser beam from the laser irradiator 9 and Retreat to the position where the ultraviolet light from the ultraviolet light irradiator 9B is not exposed. (Step 9)
Thereafter, the open / close switch of the laser irradiator 9A is opened, the slit driving means of the variable slit 8 is activated to increase the area of the slit opening 8E, and the entire enclosure N as shown in FIGS. Are removed by laser irradiation. (Step 10)
If there is a disconnection portion of another wiring pattern, the above operation is repeated at the disconnection portion, and if there is no repair portion, the repair is terminated.

As described above, according to the wiring pattern repairing method and the wiring pattern repairing apparatus of the present embodiment, the complicated wiring can be obtained by forming the resin enclosure N filled with the electrolytic plating solution 18 in accordance with the wiring pattern of the disconnected portion M. Even in the case of disconnection, since the electrolytic plating solution 18 can be filled and maintained only in the repaired portion, the repair can be performed without affecting the peripheral portion.
Further, after the repair, the excess electrolytic plating solution 18 is evaporated with laser light, and the enclosure N can be removed with the laser light, so that post-processing can be easily performed.

Furthermore, since Cu having the same composition as the wiring pattern is deposited and repaired, the finished state after the repair is difficult to distinguish from the wiring pattern, and the appearance of the wiring pattern can be improved.
In addition, since the work 6 is moved according to the Cu deposition rate during electrolytic plating, the distance between the anode 14 and the Cu deposition surface of the disconnected portion M becomes constant, so that the electrolytic plating can be performed efficiently. Can do.

Further, the CCD camera 10 can correct the wiring pattern while confirming the progress of the wiring pattern repairing operation. Further, by monitoring the current value of the power supply device 14B during the electrolytic plating, It is possible to confirm whether or not the electrical conductivity is repaired.

It should be noted that the present invention is not limited to the above embodiments, and may be as follows without departing from the spirit of the present invention.
That is, in the above embodiment, the work 6 is placed on the mounting table 4A and moved by the table moving means 4C. Conversely, the wiring pattern repair unit 2 and the optical unit 3 are moved. May be.

Further, the amount of Cu deposited during the electroplating of the wiring pattern may be measured by measuring the electrical resistance of the wiring pattern, and the moving speed of the workpiece 6 may be controlled by the control unit based on the measured value.
Furthermore, in the above-described embodiment, Cu is deposited in the moving direction of the workpiece 6 in the disconnection portion M while supplying the minimum necessary amount of the electrolytic plating solution 18 along the outer surface of the anode 14 in accordance with the movement of the workpiece 6. However, the work 6 may be moved after the enclosure N is filled with the electrolytic plating solution 18 first.

In addition, as shown in FIGS. 5A to 5C, the tip of the anode 14 may be made to enter and exit from the tip port 15a of the second dispenser nozzle 15 by the anode advance / retreat means 14A.
In this case, the tip port 15 a functions as a guide for the advance and retreat of the anode 14, and the electroplating solution 18 in the gap between the inner surface of the tip port 15 a and the outer surface of the anode 14 slides between the inner surface of the tip port 15 a and the outer surface of the anode 14. Also acts as a lubricant when moving.

Then, while the anode 14 is exposed from the tip end 15a, the electrolytic plating solution 18 is supplied to the disconnected portion M of the workpiece 6 along the outer surface of the anode 14 as shown in FIG. The supply amount of the electrolytic plating solution 18 to the portion M can be adjusted with higher accuracy.
Thus, even when the electrolytic plating solution 18 is supplied without bringing the tip end 15a into contact with the end face of the broken portion M, the electrolytic plating solution 18 forms droplets on the outer peripheral surface of the tip end 15a as shown in FIG. The minimum discharge amount can be achieved.

Furthermore, the axial anode 14 is built in the second dispenser 15, and the anode 14 is advanced and retracted in the axial direction by the anode advance / retreat means 14A. As shown in FIG. The anode 14 may be plated or deposited on the inner wall of the dispenser 15. In this embodiment, the anode 14 is moved integrally with the second dispenser nozzle 15 by the dispenser nozzle moving means 15A in the direction of the arrow α in FIG. It adjusts with the space | interval of the dispenser nozzle 15 and the disconnection part M. FIG.
In the above embodiment, the anode 14 made of Cu—P is used. Alternatively, the anode 14 made of insoluble Pt may be used.

It is a conceptual diagram which shows one Embodiment of the wiring pattern repair apparatus of the electronic circuit which concerns on this invention. It is a conceptual diagram which shows a variable slit. It is a schematic explanatory drawing which shows the wiring pattern repair method of the electronic circuit which concerns on this invention. It is a figure which shows the process of the wiring pattern repair method of the electronic circuit which concerns on this invention. It is explanatory drawing in the case of making an anode enter / exit from a dispenser nozzle front-end | tip opening | mouth in the wiring pattern repair apparatus of the electronic circuit which concerns on this invention. It is a conceptual diagram at the time of forming an anode in the inner wall of the dispenser nozzle in the wiring pattern repair device for an electronic circuit according to the present invention.

Explanation of symbols

1 Electronic circuit wiring pattern repair device 2 Wiring repair unit 3 Optical system unit 4 Table unit 5 Control unit 6 Work 7 Ultraviolet light curable resin 8 Variable slit 9 Laser irradiator 9B Ultraviolet light irradiator 10 CCD camera 11 Display 13 1 dispenser nozzle 14 anode 15 second dispenser nozzle

Claims (2)

After supplying the ultraviolet curable resin to a predetermined range including the disconnected portion of the wiring pattern of the electronic circuit board in which disconnection or the like has occurred, the ultraviolet curable resin is cured,
Then, after removing a part of the cured resin on the predetermined range, after supplying an electrolytic solution through a dispenser nozzle incorporating an anode to the removed resin part,
An electronic circuit wiring pattern repair method for repairing a wiring pattern by applying a voltage between an end surface of the disconnection portion and the anode, thereby performing electrolytic plating between the end surface of the disconnection portion and the anode. Means for supplying an ultraviolet curable resin to a predetermined range including the disconnected portion of the wiring pattern of the electronic circuit board in which disconnection or the like has occurred;
Means for curing the ultraviolet light curable resin supplied to a predetermined range including the disconnected portion of the wiring pattern of the electronic circuit board;
Removing means for removing a part of the resin cured by the ultraviolet light;
An electrolytic solution supply means for supplying an electrolytic solution through a nozzle having a built-in anode to the portion removed by the removing means;
Disposing means for disposing a gap between the tip of the nozzle and the end face of the disconnection part within a predetermined gap; and applying means for applying a voltage between the anode and the end face of the disconnection part;
An apparatus for repairing wiring of an electronic circuit board, comprising: