JP2000049442A - Pattern correction device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pattern correction device of such a structure that a film thickness when a conductive paste or defect correction ink is applied on a defect part in a substrate can be varied freely. SOLUTION: A voltage is applied between a coating needle of an ink coating mechanism 9 and a chuck base 7 to generate an electric field, the point of a conductive paste coated on the point of the needle is formed in such a way that the point is formed into a pointed shape, and a very small amount of the paste is continued to flow as it is. As a result, this pattern correction device is contrived so that the paste is splitted into a fog shape from the point of the above coating needle and is coated on a defect part in a substrate and a coating of a thick film can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern correcting apparatus, and more particularly, to a method of applying a conductive paste or a correction ink to a defect such as a flat display such as an LCD or a PDP or a pattern of a printed circuit board which lacks a pattern. The present invention relates to a simple pattern correction device.

[0002]

2. Description of the Related Art Flat displays such as LCDs and PDPs have been increasing in size, but since the electrode patterns are fine, when the patterns are etched, some of them are missing and defects may occur. Even with such a defect, it is often possible to endure practical use by correcting the pattern. For this reason, a pattern correction apparatus has been conventionally used.

[0003] A pattern correction apparatus is intended to apply a conductive paste or a correction ink to the tip of a coating needle, move a defective portion of the substrate to below the coating needle by an XY table, lower the coating needle as it is, and correct it. Apply a conductive paste to the location. Such a pattern correction device is known, for example, from Japanese Patent Application Laid-Open No. 9-307217.

[0004]

In the above-described pattern correcting apparatus, since the conductive paste is applied using an application needle, the diameter of the applied paste depends on the application needle, and the diameter of the paste is 30 μm or less. It is difficult to do. In addition, it is necessary to replace the application needle depending on the size of the correction portion, and if the diameter is reduced, the film thickness becomes thin, and it becomes difficult to apply a thick film.

SUMMARY OF THE INVENTION Accordingly, it is a primary object of the present invention to provide a pattern correcting apparatus capable of freely changing a film thickness when applying a conductive paste or a defect correcting ink.

[0006]

The invention according to claim 1 is
In a pattern correction apparatus for correcting a defective portion of a patterned substrate, a coating mechanism including a needle or a dispenser for applying a conductive paste or a defect correction ink to the defective portion of the substrate, and a needle or a dispenser of the coating mechanism and the substrate. And an electric field applying means for applying an electric field to generate an electric field to apply a conductive paste or a defect correction ink droplet at the tip of the needle by the electric field.

According to the second aspect of the present invention, the coating is further performed by controlling one of a time for applying a voltage between the needle and the substrate, a magnitude of the applied voltage, and a distance between the needle and the substrate. The thickness of the conductive paste or the defect correction ink to be used is varied.

Further, in the invention according to the third aspect, the table is driven and either the needle or the substrate is scanned in the line direction of the pattern on the substrate to perform the coating.

[0009]

FIG. 1 is a diagram showing an entire configuration of an embodiment of the present invention. In FIG. 1, the pattern correction apparatus is roughly classified into a laser irradiation mechanism 5 including a laser and its optical system, an ink application mechanism 9 including a defect correction ink or a needle for applying conductive paste or ink, and a defect recognition apparatus. And an XY table 6 on which a work is mounted, and an XY table 6 on which a work is mounted.
A chuck table 7 for holding a work on an XY table 6,
A Z-axis table 4 for driving a laser irradiation mechanism 5 up and down;
A transmitted light 10 for illuminating the work, a monitor 8 and the like are provided.

FIG. 2 is a diagram showing a specific example of the laser irradiation mechanism shown in FIG. In FIG. 2, a YAG laser is generally used as a laser 501. A laser beam from the laser 501 is expanded by a beam expanding mechanism 502, and then a filter 503, a beam splitter 504, a slit mechanism 505, a beam splitter 506, and an imaging lens. 507,
After passing through the beam splitter 508 and the objective lens 509,
Irradiated on the work. The beam expanding mechanism 502 is provided for correcting a large-area defect with a sufficient laser beam diameter and a uniform energy intensity distribution. The laser beam diameter is usually about 2 mm, and is expanded about 3 to 5 times by the beam expanding mechanism 502. Further, by enlarging the laser beam, the energy difference between the center and the periphery of the beam is reduced, thereby fulfilling the above-mentioned role. A CCD camera 511 is provided in association with the beam splitter 506, and the reflected light from the work is imaged.

FIG. 3 is a diagram showing a specific example of the ink application mechanism shown in FIG. In FIG. 3, the ink application mechanism includes:
A needle 901 for ink application and a positioning actuator 902 for driving the needle 901 in the vertical direction are included. The needle 901 is provided at the distal end of the drive shaft 903 of the actuator 902 via the holding member 904. further,
The ink application mechanism 9 includes a rotary table 9 provided horizontally.
10 and a plurality of ink tanks 913 to 916, which are sequentially arranged in the circumferential direction on the rotary table 910, and the cleaning device 91.
7 and an air purge device 918. A rotary shaft 911 is provided at the center of the rotary table 910. The rotary table 910 is formed with a notch 912 through which the needle 901 passes when ink is applied. The ink tanks 913 to 916 are appropriately filled with RGB and black inks and a solvent for preventing the ink from being fixed.

The cleaning device 917 is for cleaning the conductive paste or the like attached to the needle 901. The air purge device 918 blows off a cleaning liquid or the like attached to the needle 901.

Further, an index motor 921 for rotating the rotary shaft 911 of the rotary table 910, an index plate 922 that rotates with the rotary shaft 911, and a rotary table 910 via the index plate 922 are provided to the ink application mechanism 9. And an origin return sensor 924 for detecting that the rotational position of the turntable 910 has returned to the origin via the index plate 922.
The motor 921 is controlled based on the outputs of the sensors 923 and 924, and rotates the rotary table 910 to cut out the cutout portions 912, the ink tanks 913 to 916, and the cleaning device 917.
And one of the air purging devices 918 with the needle 90
1 below.

FIG. 4 is a diagram for explaining the operation of the embodiment of the present invention. First, as shown in FIG. 4A, using a dispenser 100 (metallic tube-shaped needle) instead of the application needle 901, a small amount of conductive paste is flowed to the tip of the paste until it becomes a droplet. Here, the dispenser 10
An electric field is generated by applying a voltage of several kV between 0 and the chuck 7. As a result, the conductive paste in the form of drops is obtained as shown in FIG.
As shown in (1), the shape becomes a tailor cone type with a sharp point. If a small amount of the conductive paste continues to flow as it is, the fine drop-shaped paste is split from the tip of the conductive paste and applied to the correction portion below. This enables fine coating.

When the same operation is performed by the application needle 901 instead of the dispenser 100, finer application becomes possible. Furthermore, by continuing to apply over time,
It is also possible to apply a thick film. Further, the film thickness can be controlled not only by controlling the time for applying the applied voltage but also by controlling the magnitude of the applied voltage itself.

Further, the XY table 6 may be driven to scan one of the coating needles 901 and the substrate in the line direction of the pattern on the substrate for coating. Further, the distance between the coating needle 901 and the substrate may be made variable, and the control may be performed while monitoring the current value.

[0017]

As described above, according to the present invention, a voltage is applied between the needle or dispenser of the coating mechanism and the substrate to generate an electric field, and the conductive paste or the defect correcting ink at the tip of the needle is formed. Drops are applied to defective parts of the substrate by an electric field, so fine coating is possible, replacement of the coating needle is required, and application to film thickness is also possible by repeating coating over time. .

[Brief description of the drawings]

FIG. 1 is a diagram showing an overall configuration of an embodiment of the present invention.

FIG. 2 is a diagram showing a specific example of the laser irradiation mechanism shown in FIG.

FIG. 3 is a diagram showing a specific example of the ink application mechanism shown in FIG. 1;

FIG. 4 is a diagram for explaining the operation of the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Host computer 2 Image processing mechanism 3 Control computer 4 Z-axis table 5 Laser irradiation mechanism 6 XY table 7 Chuck table 8 Monitor 9 Ink coating mechanism 501 Laser 509 Objective lens 511 CCD camera 901 Coating needle 913-916 Ink tank

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (Reference) G09F 9/30 306 G09F 9/30 306 H01S 3/00 H01S 3/00 FF Term (Reference) 2G051 AA65 AA73 AA90 AB20 BA01 BA10 CA03 CA04 CB01 DA07 2H092 MA10 MA30 MA46 MA52 NA30 PA06 5C094 AA03 AA32 AA41 AA42 AA43 AA44 BA31 BA43 CA01 DA13 DB08 DB10 GB10 5E343 BB72 DD12 DD20 ER51 FF05 FF30 GG08 5F072 AB01 FF09 JJ20

Claims (3)

[Claims] 1. A pattern correcting apparatus for correcting a defective portion of a patterned substrate, wherein the coating mechanism includes a needle or a dispenser for applying a conductive paste or a defect correcting ink to the defective portion of the substrate, and the coating mechanism. An electric field generating means for applying a voltage between the needle and the substrate to generate an electric field, and applying a conductive paste or a defect correction ink droplet at the tip of the needle or the dispenser by the electric field,
Pattern correction device. 2. The method according to claim 1, further comprising controlling a time for applying a voltage between the needle and the substrate, a magnitude of the applied voltage, and a distance between the needle and the substrate. 2. The pattern correction apparatus according to claim 1, wherein the thickness of the conductive paste or the defect correction ink is varied. 3. The method according to claim 1, further comprising: driving the table to scan either the needle or the substrate in a line direction of a pattern on the substrate to perform coating. Pattern correction device.