JP2005317802A - Method and apparatus for correcting defect in pattern substrate and manufacturing method of pattern substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for correcting a defect in a pattern substrate capable of stably correcting the defect and a manufacturing method of a pattern substrate. <P>SOLUTION: The defect correcting apparatus comprises: a film 5 provided oppositely to a substrate 6; a pulse laser light source 1 for emitting laser light to provide an opening in the film 5; a pressing unit 30 for applying a defect correcting solution on the defect portion of the substrate 6 via the opening and pressing it to the substrate 6 to squeeze the solution applied on the substrate 6 via the opening into the defect; and a squeegee 31 provided movably in the direction nearly parallel to the substrate 6 and provided above the opening for removing the solution. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a defect correction method, a defect correction apparatus, and a pattern substrate manufacturing method for correcting a defect of a pattern substrate.

  In the manufacturing process of color filters for liquid crystal displays, defects in the color filter substrate are corrected in order to improve the yield. As this defect correction method, there is a method of correcting by attaching a resist to the tip of the needle and hanging it on the defective portion. However, in this method, since the dropping amount changes depending on the viscosity of the resist, it is difficult to control the dropping amount and the correction accuracy, and it is difficult to correct stably.

  A pattern correction method using two kinds of materials is disclosed (Patent Document 1). In this method, the substrate is covered with either a water-soluble material or an oil-soluble material as a protective film. Then, the protective film is removed to expose the defective part. After the exposed portion is filled with a correction material using the other material, the protective film is removed and correction is performed. In this method, since two types of materials are used, the process may be complicated. Furthermore, the material attached to the substrate surface may not be completely removed.

  Furthermore, another method for correcting defects is disclosed (Patent Document 2). In this defect correction method, the color material for one pixel is removed, and a mask having a hole corresponding to one pixel is put on the defective pixel. Then, a color material is applied by a dispenser, and the color material is adhered to a defective pixel by a scraper. In this method, excess color material can be removed by the scraper.

  In the above-described defect correction method, the time for aligning the mask becomes long, so the productivity is low. Furthermore, since the sponge is used for the scraper, there is a possibility that the color material adhering to the defective portion cannot be made constant. In this case, the thickness of the color material adhering to the substrate surface varies. Furthermore, the resin may enter between the mask and the substrate, and the solution may adhere other than the defective portion. Therefore, this defect correction method has a problem that the defect cannot be corrected stably.

  When the solution is applied and the defect is corrected as described above, it is desirable to use a solution having a high viscosity. That is, when a solution having a low viscosity is used, the solution spreads around a region where the solution is applied and adheres to portions other than defective portions. When the solution is applied to a portion other than the defective portion, the portion may become a new defect, and the defect cannot be corrected stably. On the other hand, when a solution having a high viscosity is used, the solution may not enter the defective portion and may not adhere to the substrate. Therefore, the corrected part may be peeled off from the substrate. In addition, the amount of solution applied to the defective part may vary. This is prominent in a correction hole having a high aspect ratio. For this reason, when a high-viscosity solution is used in the conventional defect correction method, for example, the solution may not sufficiently enter a small defect, and the corrected portion may be peeled off. Thus, in the conventional correction method, a solution having a high viscosity cannot be used, and the defect cannot be corrected stably.

  In general, a solution for correction is obtained by dissolving a resin containing a coloring material in a solvent. And after apply | coating a solution to a defective part, it is made to dry and a solvent is evaporated. As a result, only the resin containing the colorant remains on the substrate. When a solvent having a low viscosity is used, the thickness of the resin that can be attached at a time is reduced. When sufficient resin cannot be adhered at once, it is necessary to repeat the coating process and the drying process. Therefore, productivity is reduced, and the thickness of the corrected portion is increased by repeatedly performing the coating process and the drying process. The conventional defect correction method has a problem that the defect cannot be corrected stably.

Japanese Patent Laid-Open No. 2-282083 Japanese Unexamined Patent Publication No. 64-31186

As described above, the conventional defect correction method has a problem that defects on the pattern substrate cannot be corrected stably.
The present invention has been made in view of such problems, and an object of the present invention is to provide a defect correction apparatus, a defect correction method, and a pattern substrate manufacturing method capable of stably correcting defects.

  A defect correction apparatus according to a first aspect of the present invention is a defect correction apparatus that corrects a defect of a patterned substrate (for example, the substrate 6 in the embodiment of the present invention), facing the substrate. A provided film (for example, the film 5 in the embodiment of the present invention) and a laser light source (for example, a pulse laser in the embodiment of the present invention) that emits a laser that irradiates the film and provides an opening in the film. Light source 1), application means for applying a defect correcting solution to the defective portion of the substrate through the opening (for example, the pressing portion 30 in the embodiment of the present invention), and pressing against the substrate And a pressing means (for example, the pressing portion 30 in the embodiment of the present invention) for pressing the solution applied to the substrate into the defective portion through the opening. It is intended. Thereby, a defect can be corrected stably. In particular, even when a highly viscous solution is used, the solution can be stably attached to the substrate. Furthermore, since the opening and the defect can be easily aligned, the defect can be corrected efficiently.

  A defect correction apparatus according to a second aspect of the present invention is the above-described defect correction apparatus, which is provided so as to be movable in a direction substantially parallel to the substrate, and removes the solution provided on the opening. Removing means (for example, the squeegee 31 in Embodiment 1 of the present invention), and adjusting the height of the solution provided on the opening by moving the removing means across the opening. It is characterized by this. Thereby, the application quantity of a solution can be controlled easily and a defect can be corrected stably.

  A defect correction apparatus according to a third aspect of the present invention is the above-described defect correction apparatus, wherein the removing means has a squeegee capable of pressing the film against the substrate, and is provided on the opening. The obtained solution is scraped off and removed. Thereby, the application quantity of a solution can be controlled easily and a defect can be corrected stably.

  A defect correction apparatus according to a fourth aspect of the present invention is the above-described defect correction apparatus, wherein the pressing means is moved to the outside of the opening, and the film is pressed against the substrate by the pressing means. In the state, the solution provided on the opening is removed by the removing means. Thereby, stable defect correction becomes possible without the opening of the film being displaced from the defect position.

  A defect correction apparatus according to a fifth aspect of the present invention is the above-described defect correction apparatus, wherein the removal portion is a recess provided on the bottom surface of the pressing means (for example, the recess 34 in Embodiment 2 of the present invention). And the pressing means is moved in a direction substantially parallel to the substrate while being pressed against the substrate, and the solution provided on the opening is removed by the recess. Then it is what you want.

  A defect correction apparatus according to a sixth aspect of the present invention is the defect correction apparatus described above, wherein the pressing means is rotatably provided so as to move across the opening (for example, implementation of the present invention). And the height of the solution provided on the opening is adjusted by rotating the roller to remove the solution provided on the opening. It is characterized by doing. Thereby, a defect can be corrected stably with a simple configuration.

  The defect correction apparatus according to the seventh aspect of the present invention is the defect correction apparatus described above, and is a protective film provided between the roller and the film (for example, the protective film 33 according to the fourth embodiment of the present invention). ), And the solution provided on the opening is removed through the protective film. Accordingly, it is possible to provide a defect correcting device that can prevent the solution from adhering to the roller, can be easily maintained, and can stably correct the defect.

A defect correction apparatus according to an eighth aspect of the present invention is the defect correction apparatus described above, wherein the laser light source is a pulse laser light source, and the pulse laser light source emits a pulse laser to thereby open the opening of the film. The defect of the substrate is removed via the substrate, and the solution is applied to the portion where the defect is removed. Thereby, the pattern removed together with the defect can be corrected stably.
In the above-described defect correction apparatus, the coating unit, the pressing unit, and the removing unit do not need to be configured by separate members, and may be configured by the same member.

  A defect correction method according to a ninth aspect of the present invention is a defect correction method for correcting a defect of a patterned substrate, the step of detecting a defect on the substrate, and the step of making a film face the substrate. Irradiating the film with pulsed laser light to provide an opening corresponding to the defect; applying a defect correcting solution to the defective portion of the substrate through the opening; and the opening. A step of pushing the solution applied to the substrate through a section into a defective portion, and a step of removing the film from the substrate. Thereby, a defect can be corrected stably. In particular, even when a highly viscous solution is used, the solution can be stably attached to the substrate. Furthermore, since the opening and the defect can be easily aligned, the defect can be corrected efficiently.

  A defect correcting method according to a tenth aspect of the present invention is the above-described defect correcting method, wherein after the step of applying the solution, the solution provided on the opening is removed, and the solution The method further includes a step of adjusting the height. Thereby, the application quantity of a solution can be controlled easily and a defect can be corrected stably.

  A defect correction method according to an eleventh aspect of the present invention is the above-described defect correction method, wherein the step of removing the solution is provided on the opening while the film is in close contact with the substrate. The solution is scraped off to remove the solution. As a result, the defect can be corrected stably without the opening being displaced from the defect position.

  A pattern substrate manufacturing method according to a twelfth aspect of the present invention includes a step of forming a pattern on a substrate, a step of detecting a defect in the pattern on the substrate, a step of making a film face the substrate, and the film Irradiating a laser beam with a pulse laser beam to provide an opening corresponding to the defect, applying a defect correcting solution to the defective portion of the substrate through the opening, and through the opening A step of pushing the solution applied to the substrate into a defective portion; and a step of removing the film from the substrate. Thereby, a defect can be corrected stably. In particular, even when a highly viscous solution is used, the solution can be stably attached to the substrate. Furthermore, since the opening is provided in the defective portion, the pattern substrate can be manufactured with high productivity.

  A pattern substrate manufacturing method according to a thirteenth aspect of the present invention is the above-described pattern substrate manufacturing method, wherein after the step of applying the solution, the solution provided on the opening is removed. And a step of adjusting the height of the solution. Thereby, the application quantity of a solution can be controlled easily and a defect can be corrected stably.

A pattern substrate manufacturing method according to a fourteenth aspect of the present invention is the above-described pattern substrate manufacturing method, wherein in the step of removing the solution, the film is in close contact with the substrate, and The solution provided above is scraped off to remove the solution. As a result, the defect can be corrected stably without the opening being displaced from the defect position.
In the above-described defect correction method and pattern substrate manufacturing method, the steps may not be processed in the order described unless otherwise specified.

  The present invention can provide a defect correction method, a defect correction apparatus, and a pattern substrate manufacturing method capable of stably correcting defects with a simple configuration.

Embodiments of the present invention will be described below with reference to the drawings. The following description shows preferred examples of the present invention, and the scope of the present invention is not limited to the following examples. In the following description, the same reference numerals denote the same contents.
Embodiment 1 of the Invention

  A pattern substrate defect correcting apparatus according to the present embodiment will be described with reference to FIG. FIG. 1 is a diagram showing the configuration of the defect correction apparatus. 1 is a short pulse laser light source, 2 is a beam shaping mechanism, 3 is a half mirror, 4 is an objective lens, 5 is a film, 6 is a substrate, 7 is a stage, 8 is a film reel, 9 is a lamp light source, 10 is a filter, 11 Is a half mirror, 12 is a CCD camera, 13 is an air jetting means, and 14 is a film reel rotating means.

  In the present embodiment, the substrate 6 to be corrected for defects is a color filter substrate used for a liquid crystal panel of a liquid crystal display device. This color filter substrate 6 is usually provided with a colored layer and a black matrix on a transparent glass substrate. The substrate 6 is placed horizontally on the stage 7, and it is determined whether or not each pixel and black matrix of the color filter substrate are defective. Irradiate the laser to correct the defective pixel. The stage 7 is an XY stage including an XY drive mechanism (not shown), and can move the substrate 6 to an arbitrary position. The defect correction apparatus of the present embodiment includes a defect detection mechanism for detecting a defect on the substrate 6 and a defect correction mechanism for correcting the detected defect. Specifically, after the defect detection mechanism grasps the position of the defect, the defect detection mechanism corrects the defect by irradiating the defective portion of the substrate 6 with a laser. The configuration of the optical system and the like of the defect detection mechanism and the defect correction mechanism shown in the figure is an example, and other optical parts such as a filter, a lens, and a mirror may be provided.

  First, the defect detection mechanism will be described. Detection is performed using a lamp light source 9 as an observation light source. The lamp light source 9 emits white light for illuminating the surface of the substrate 6. The observation light emitted from the lamp light source 9 passes through the filter 10 and enters the half mirror 11. The filter 10 is a wavelength tunable filter and can shield only a predetermined wavelength. Here, the filter 10 may correct the wavelength in accordance with the transmittance of the film 5 so that the detected light becomes white light. The light incident on the half mirror 11 is reflected in the direction of the substrate 6. This light is reflected by the half mirror 3 and enters the objective lens 4. A film 5 made of polyimide having a thickness of about 10 μm is provided between the objective lens 4 and the substrate 6 so as to face the substrate 6. Then, the light condensed by the objective lens 4 passes through the film 5 and enters the surface of the substrate 6 to illuminate a part of the substrate. The light reflected by the substrate 6 passes through the film 5, the objective lens 4, the half mirror 3 and the half mirror 11 and enters the CCD camera 12. The CCD camera 12 detects an image based on the reflected light on the surface of the substrate 6. The CCD camera 12 is connected to an information processing apparatus such as a personal computer (PC), and determines the presence or absence of a defect in the substrate 6 based on the detected image. For example, a die-to-die method for comparing with a detected reference die can be used. If the detected image is different from the reference die, it is determined as a defective portion. With this defect detection mechanism, an opaque black defect and a transparent white defect can be distinguished and detected. Further, the PC is connected to the XY drive mechanism of the stage 7, the detection location is specified from the position of the stage 7 at the time of defect detection, and the coordinates of the defective pixel on the substrate are detected. Of course, the defect detection mechanism is not limited to the illustrated configuration, and a defect detection mechanism having a configuration other than this may be used. About this defect detection mechanism, the structure similar to the conventional defect detection apparatus can be used. By moving the stage 7, the relative position of the light from the substrate 6 and the lamp light source 9 is changed to detect defects on the entire surface of the substrate 6.

  The defect detected by the above-described defect detection mechanism is corrected by the defect correction mechanism. In this embodiment mode, foreign matter attached to the substrate is removed by a pulse laser. And a resin solution is apply | coated with respect to the colored layer of the location from which the foreign material was removed, and a colored layer is corrected.

  A defect correction mechanism for removing foreign matter will be described below. The short pulse laser light source 1 is a Q-switched YAG laser and can emit short pulse light of 10 nsec or less. The short pulse laser beam emitted from the short pulse laser light source 1 enters the beam shaping mechanism 2. The beam shaping mechanism 2 includes an aperture, a slit, a lens, or the like, and can form a short pulse light spot into a beam spot having an appropriate shape. For example, the beam spot of the short pulse light on the substrate is formed into a rectangular shape substantially the same as the pixel of the color filter. Or you may make it shape | mold in the shape substantially the same as the shape of a defect. The half mirror 3 reflects short pulse light in the direction of the substrate 6. Here, the respective optical components are arranged so that the light from the short pulse laser light source 1 and the lamp light source 9 are coaxial. The short pulse light reflected by the half mirror 3 is applied to the film 5.

  The film 5 is wound around two film reels 8 connected to the film reel rotating means 14. The film reel rotating means 14 includes a motor or the like, and can rotate each of the film reels 8. By rotating the two film reels 8, the film 5 is continuously fed in the Y direction. Before the defect is corrected, the film reel rotating means 14 is driven so that the film 5 is bent, and one of the film reels 8 is rotated. Here, the film reel 8 is to bend so as not to contact the substrate 6. The air ejecting means 13 includes an air tank, piping, an ionizer, a filter, and the like, and can eject ionized air from above the film 5. For example, a cylinder having an open bottom on the substrate side is provided under the objective lens 4. This cylinder is tapered and the substrate side is narrowed. A pipe is connected to the side surface so that air can flow into the cylinder. And by flowing air, the internal pressure in a cylinder becomes high and air spouts to the film side. At the time of defect correction, air is blown to bring the film 5 closer to the substrate side, and the film 5 and the substrate 6 are brought close to each other. By bringing the film 5 and the substrate 6 close to each other, a minute gap is provided between the substrate 6 and the film 5 in the defective portion. In this case, the protruding portion other than the defective portion of the substrate 6 and the film 5 may be in contact with each other. The distance between the film 5 and the substrate 6 is adjusted by the ejection amount of the air ejection means 13 or the like. Alternatively, the deflection and tension of the film 5 may be adjusted by the film reel rotating means 14. Further, the interval may be adjusted by providing a mechanism for moving the stage 7 in the Z direction. By bringing the film 5 and the substrate 6 closer to each other by the air ejection means 13, it is not necessary to make the film 5 adhere to the substrate. Thereby, stable correction can be performed and the influence on the pattern of the substrate 6 can be reduced.

  The structure of this film 5 and the board | substrate 6 is demonstrated using FIG. FIG. 2 is an enlarged cross-sectional view showing the configuration of the corrected portion. FIG. 2A shows the structure of the film and the substrate that are being irradiated with the short pulse light. FIG. 2B shows the configuration of the substrate from which foreign matter has been removed. 61 is a red (R) colored layer, 62 is a green (G) colored layer, 63 is a blue (B) colored layer, and 64 is a black matrix (BM). These are provided on the substrate 6. First, a general method for manufacturing a color filter substrate will be described. On the color filter substrate 6, a chromium film serving as a light-shielding film is formed on a transparent glass substrate or the like by sputtering deposition or the like, and is patterned by exposure and development processes. Thereby, the chromium film becomes BM64 formed in a matrix. From this, a photosensitive resin in which a pigment corresponding to the color of the colored layer is dispersed is applied and patterned by exposure and development processes. By repeating this process, the R colored layer 61, the G colored layer 62, and the B colored layer 63 are provided in order between the BM 64. A protective film and a pixel electrode are formed from above. Here, it is assumed that the foreign matter 65 adheres to the R colored layer 61 as shown in FIG. A pixel to which such a foreign matter 65 is attached is detected as a black defect that does not transmit light by the defect detection mechanism. The film 5 is substantially in contact with the substrate 6.

  The pixel to which the foreign matter 65 is attached is irradiated with short pulse light of 10 nsec or less from the short pulse laser light source 1. The short pulse light condensed by the objective lens 4 is incident on the film 5 adjacent to the substrate 6 by the air ejection means. The power of this short pulse light is adjusted so as to partially open the film 5 by laser ablation. In this embodiment, since a polyimide film is used, if 355 nm of the third harmonic of the YAG short pulse laser light source 1 or 266 nm of the fourth harmonic is used, the short pulse light is absorbed, so that the film 5 can be easily formed. An opening can be provided. Further, since the polyimide film is substantially transparent without absorption in the visible light region, observation is easy, and the defect can be detected using the lamp light source 9. The film 5 is not limited to polyimide, but may be made of a material that is opened by light irradiation by chemical decomposition, thermal decomposition, sublimation, ablation, or the like. Since the laser light is shaped by the beam shaping mechanism 2 so as to have a defect shape or a pixel shape, the shape of the opening of the film 5 should be approximately the same as the defect shape or the shape of the R pixel. it can. The foreign matter 65 and a part of the film can be removed almost simultaneously by laser ablation. The removed foreign matter 65 is detached from the substrate through the opening of the film 5. Further, since the periphery of the correction portion is covered with a film, the foreign matter 65 does not adhere to the periphery of the correction portion and create a new defect. Thus, the film and defects can be removed almost simultaneously by laser ablation. Although the removed foreign matter 65 is a single piece, it may become a large number of debris and land on the film. The power of the short pulse laser light source 1 may be adjusted so that the film 5 is gradually perforated, or may be adjusted so that the film is perforated and the foreign matter is removed simultaneously. When the film 5 is gradually perforated, the film 5 is thinned by irradiating with a pulse laser, and further, the foreign object is removed by irradiating the portion where the film 5 is thin with short pulse laser light. To do. When the size of the opening is small, the opening may be provided while the film is being sent out. Since the film 5 is chemically decomposed by using far ultraviolet rays, if film residues remain on the substrate surface after removing foreign matter, the film residues can be removed by irradiating far ultraviolet rays.

  When the foreign matter 65 is transparent, laser ablation does not occur even if the foreign matter is irradiated with short pulse light because no light is absorbed. On the other hand, when a film such as polyimide that absorbs light is used as the film 5 and a short pulse laser beam is irradiated in a state where the absorbing film is substantially in contact with the upper part of the foreign material, the film opens simultaneously by laser ablation. A foreign substance is momentarily pressed against the substrate by the gas or debris that has come forward, and can be detached from the substrate by a subsequent recoil.

  Since the colored layer 61 is removed together with the foreign matter 65 on the substrate by the above processing, the black defect becomes a white defect 66 that transmits light. In order to correct the white defect 66, the pressing portion 30 is disposed on the defect position as shown in FIG. A squeegee 31 is disposed beside the pressing unit 30. That is, the squeegee 31 is arranged adjacent to the defect position. At this time, the film 5 provided with the opening is fixed without moving. Thereby, the position of the defective part and the opening part of the film 5 can be matched. The pressing unit 30 and the squeegee 31 are provided so as to be movable in the vertical direction (Z direction) by a motor (not shown) or the like. Further, the pressing unit 30 and the squeegee 31 are provided so as to be movable in the horizontal direction (Y direction) by a motor (not shown) or the like.

  A configuration in which the defect correcting solution is applied to the white defect 66 by the pressing unit 30 will be described with reference to FIGS. 4 to 6 are side cross-sectional views showing the structure around the defective portion in the defect correcting step. First, the resin solution 17 is provided at the lower end of the pressing unit 30 on the substrate side. The pressing part 30 is provided by an elastic body such as a metal such as stainless steel or rubber, for example. The pressing part 30 has a columnar or prismatic shape, for example, the lower end is a flat surface. The lower end of the pressing portion 30 may be a curved surface such as a spherical surface. The lower surface of the pressing part 30 is formed sufficiently wider than the opening. By attaching the pressing portion 30 to a container in which the resin solution 17 is stored, the resin solution 17 is provided at the tip of the pressing portion 30. A resin solution having a high viscosity is used. And the press part 30 with which the resin solution 17 was provided in the front-end | tip is moved to a defect position. At the defect position, an opening corresponding to the defect is provided in the film 5. A squeegee 31 is provided beside the pressing portion 30. The resin solution 17 is provided at the lower end of the pressing part 30, and the configuration shown in FIG.

  The pressing part 30 is moved downward and brought into close contact with the film 5. As a result, the configuration shown in FIG. At this time, the pressing portion 30 is pressed against the substrate 6 so that the resin solution 17 enters the defective portion. Since the film 5 having an opening corresponding to the defective portion is disposed on the substrate, the resin solution 17 adheres to the substrate 6 through the opening. Thereby, the resin solution 17 is attached only to the defective portion, and the resin solution 17 is not attached to the peripheral portion of the defect. Therefore, the resin can be accurately applied to the defective portion, and the defect can be corrected stably. The pressing part 30 is provided sufficiently larger than the defect, and the entire opening of the film 5 is covered with the pressing part 30. Thereby, the resin solution 17 can be apply | coated with respect to the whole defect part.

  The pressing of the pressing portion 30 against the substrate 6 is set to a suitable pressure according to the defect aspect ratio (ratio of the height and width of the dent of the correction hole) and the viscosity of the resin solution 17. Thereby, even when a resin solution having a high viscosity is used, the resin solution 17 can be pushed into a defect having a high aspect ratio. Further, since the film 5 is a 10 μm polyimide film, it is thin and soft. For this reason, the film 5 deform | transforms according to the level | step difference of the substrate surface produced by a colored layer and BM64. Thereby, the film 5 and the board | substrate 6 closely_contact | adhere, and it becomes easy to push the resin solution 17 into a defect part. Even when a resin solution having a high viscosity is used, the resin solution 17 is embedded in the defective portion, and the resin solution 17 can be easily attached to the substrate 6. Thereby, stable defect correction can be performed.

  Furthermore, in order to push the resin solution 17 into the defective portion, it is preferable to use an elastic body such as rubber for the pressing portion 30. When an elastic body such as rubber is used for the pressing portion 30, the pressing portion 30 is deformed according to the level difference on the substrate surface. Thereby, the pressing part 30 can be easily adhered to the film 5. Moreover, since it is not necessary to make the end surface of a press part exactly parallel with respect to the surface of the board | substrate 6, handling becomes easy. Furthermore, for example, even when there is dust scattered when the opening is provided on the upper surface of the film 5, the lower end of the pressing portion 30 can be easily adhered to the upper surface of the film 5. In this way, by pressing the elastic pressing portion 30 against the substrate 6 from above the soft film 5, the substrate 6 having a step and the film 5 are brought into close contact with each other. Thereby, it is possible to prevent the resin solution 17 from entering between the substrate 6 and the film 5. Thereby, the resin solution 17 adheres only to the opening part of the film 5, and it can prevent that the resin solution 17 adheres other than a defect part. Therefore, even when the resin solution 17 having a high viscosity is used, the defect can be corrected stably.

  With the pressing part 30 pressed against the substrate, the squeegee 31 is moved downward. Thereby, the lower end of the squeegee 31 and the film 5 are brought into close contact with each other, and the configuration shown in FIG. At this time, the tip of the squeegee 31 is disposed in the vicinity of the opening, outside the opening. The squeegee 31 is provided sufficiently wider than the size of the opening. That is, when the squeegee 31 moves over the opening, both ends of the squeegee 31 are disposed outside the opening. Then, the squeegee 31 is slid in the horizontal direction to scrape off the excess resin solution 17 applied on the opening. That is, the squeegee 31 passes over the defective portion, and the excess resin solution 17 applied to the opening is moved onto the film 5.

  At this time, the squeegee 31 is moved in the lateral direction while the pressing portion 30 is pressed against the substrate. Thereby, since the film 5 does not move, there is no deviation between the opening and the defect position. Thereby, a solution can be correctly applied to a defect position. And the press part 30 and the squeegee 31 are moved to a horizontal direction in the state which pressed the press part 30 against the board | substrate 6. FIG. The tip of the squeegee 31 crosses the opening and scrapes out the resin solution 17 over the entire opening. At this time, the height of the resin solution 17 attached to the substrate 6 can be adjusted by changing the pressure for pressing the squeegee 31 against the substrate 6. That is, by increasing the pressure of the squeegee 31 against the substrate 6, it is possible to reduce the coating thickness of the resin solution 17, and by decreasing the pressure of the squeegee 31 against the substrate 6, the coating thickness of the resin solution 17 is increased. be able to.

  The squeegee 31 may be fixed to the pressing portion 30 and moved in the vertical direction and the lateral direction in conjunction with the pressing portion 30. Thereby, the structure of the motor etc. for moving a squeegee and the press part 30 can be simplified. Or you may make it move the squeegee 31 and the press part 30 separately. In this case, since the press of the squeegee 31 and the press of the press part 30 can be adjusted independently, a defect can be corrected more stably.

  When the resin solution 17 is scraped from the opening, the configuration shown in FIG. 5B is obtained. A resin solution 17 is applied on the opening with substantially the same thickness as the film 5. When the resin solution 17 is scraped out by the squeegee 31, the application height of the resin solution 17 in the opening can be made substantially constant by keeping the pressing and moving speed of the squeegee 31 constant.

  Then, the film 5 provided with the opening is moved upward and removed from the substrate 6. As a result, the configuration shown in FIG. In this embodiment, since the resin solution 17 having a high viscosity is used, the resin solution 17 does not spread laterally. Therefore, it is possible to prevent the resin solution 17 from adhering around the defective portion. The resin solution 17 is provided at a substantially constant height from the substrate surface.

  The resin solution 17 is dried to evaporate the solvent in the resin solution. As a result, only the resin 18 dissolved in the solvent remains on the surface of the substrate 6. At this time, the thickness decreases by the amount of the solvent. As a result, the configuration shown in FIG. In the present embodiment, since the resin solution 17 having a high viscosity is used, the amount of decrease in thickness due to evaporation of the solvent can be reduced. Therefore, the resin 18 that can be deposited in a single coating process can be made sufficiently high with respect to the defect to be corrected. Therefore, it is not necessary to repeat the coating process and the drying process, and defects can be corrected stably with high productivity.

  In the present invention, the thickness of the resin 18 attached to the corrected portion can be adjusted by changing the ratio of the resin and the solvent in the resin solution 17. Further, the thickness of the resin 18 attached to the corrected portion can be adjusted by changing the thickness of the film 5. Furthermore, the thickness of the resin 18 attached to the corrected portion can be adjusted by changing the pressure of the squeegee 31. Thereby, resin of desired thickness can be made to adhere to a defect, and a defect can be corrected stably. Further, by correcting the defect with the above three conditions as the same condition, the defect can be corrected with good reproducibility. Thereby, stable defect correction becomes possible.

  In the conventional defect correction method, it is difficult to supply a stable resin solution at pl (picoliter) or less due to changes in the properties of the resin solution over time, such as solvent evaporation. In defect correction of a color filter, it is necessary to supply a resin solution stably at pl or less. By this correction method, the instability of the time change of the resin solution can be minimized, and control for stably correcting the resin film thickness in units of 1 μm can be performed. Thereby, stable defect correction can be performed.

  As described above, in the present invention, since the resin solution 17 is pushed into the defective portion by the pressing portion 30, the resin solution 17 having a high viscosity can be used. Conventionally, a resin solution 17 having a viscosity of about 30 cp has been used, but in the present invention, for example, a resin solution 17 having a viscosity of 200 cp or more can be used. Specifically, the defect could be corrected by using the resin solution 17 having a viscosity of 300 cp by the above-described method. Furthermore, by using the resin solution 17 having a high viscosity, it is possible to reduce a change in the amount of the resin adhered due to the evaporation of the solvent. As a result, correction can be performed with high reproducibility, and stable defect correction can be performed.

  In the above-described method, the resin solution 17 is applied to the tip of the pressing portion 30 made of metal or an elastic body, and the tip is pressed against the defective portion to apply the resin solution to the defective portion. It is also possible to use and apply. For example, there is a method of applying a resin solution to a defective portion with a dispenser. Alternatively, there are a method of spraying and applying the resin solution with a nozzle, and a method of applying the resin solution by attaching the resin solution to the tip of the needle. Furthermore, in addition to the method of dropping the resin solution 17 by one drop, there is a method of spraying micron order fine particles using a spray nozzle. Moreover, if a porous material is used for the pressing part 30, the resin solution 17 can be supplied from the upper surface. And the resin solution 17 supplied from the upper surface reaches | attains the lower surface of the press part 30 through many holes. Thereby, the resin solution 17 can be apply | coated to a defective part. For example, the pressing portion 30 can be made of porous rubber or porous ceramic. After applying the resin solution 17 to the defective portion by any method, the resin solution 17 can be pushed into the defective portion by pressing with the pressing portion 30.

  The squeegee 31 described above is provided by a metal such as stainless steel or an elastic body such as rubber. When the squeegee 31 is formed of an elastic body, the resin solution 17 embedded in the film 5 can be scraped out by increasing the pressure. Thereby, the height of the resin solution 17 to be formed is slightly lower than the upper surface of the film 5.

  The squeegee 31 is bent halfway, and the tip portion is provided to be inclined with respect to the substrate surface. That is, the squeegee 31 is provided in the vertical direction from the upper end to the middle and is in contact with the side surface of the pressing portion 30. And it inclines in the middle and is distanced from the side surface of the press part 30, so that it approaches a lower end. Thereby, a gap is formed between the pressing portion 30 and the squeegee 31. The resin solution scraped into the gap enters. Further, since the squeegee 31 is bent, it is easy to control the pressing, and the edge of the squeegee 31 can be pressed against the substrate. That is, even when there is a step on the surface of the substrate 6, the edge of the squeegee 31 can be easily adhered to the film 5.

  As the resin solution 17 for defect correction, a resin colored according to the defect to be corrected is used. That is, when correcting the R colored layer, the resin is colored red, and when correcting the G and B colored layers, the resin is colored green and blue, respectively. At this time, the thickness of the resin 18 to be attached is adjusted so that the optical characteristics of the non-defective pixel and the corrected pixel are the same according to the resin or colorant used. As a result, the optical characteristics such as the transmittance of the corrected pixel can be made the same as those of the pixel that is not defective. Accordingly, stable defect correction can be performed. Further, when the BM is corrected, it is corrected to black.

  In the above description, the color filter substrate for a liquid crystal display device has been described. However, the present invention can also be used for a color filter substrate for a solid-state imaging device such as a CCD camera. Of course, it can be used for pattern substrates other than the color filter substrate. For example, it can be used to correct a phosphor such as a PDP or a cathode ray tube. In the above description, the foreign material 65 is an opaque material that becomes a black defect. However, the foreign material 65 may be a transparent material. Furthermore, a colored layer or the like that is not provided with high accuracy may be removed. These foreign matters that must be removed are called defects. By removing this defect, the defect can be corrected.

Embodiment 2 of the Invention
The defect correction apparatus according to the present embodiment is an apparatus having a configuration similar to that of the first embodiment. And the structure of the press part 30 and the squeegee 31 differs. The description of the same configuration as that in Embodiment 1 is omitted. The structure of the press part 30 concerning this Embodiment is demonstrated using FIG. FIG. 7 is a side cross-sectional view showing the configuration of the periphery of the defect.

  In the same manner as in the first embodiment, the position corresponding to the defective portion is irradiated with a pulse laser to provide an opening of the film. And the press part 30 is arrange | positioned in the vicinity of a defective part. As a result, the configuration shown in FIG. 7 is obtained.

  The bottom surface of the pressing part 30 is provided flat, and a recess 34 is formed in a part thereof. For example, two recesses 34 are provided on the bottom surface. In addition, you may provide one or more dent provided in the bottom face of the press part 30. FIG. The recess 34 is provided on the side surface side from the center of the bottom surface. The recess 34 has the same function as a squeegee that scrapes off the excess resin solution 17. First, as in the first embodiment, the resin solution 17 is pressed at the flat portion of the bottom surface, and the resin solution 17 is embedded in the defective portion. As a result, the resin solution 17 penetrates to the back of the defective portion and adheres to the entire surface of the substrate 6. At this time, the bottom surface of the pressing portion 30 is sufficiently wide with respect to the defect area, and the recess 34 is disposed outside the defect position.

  And the press part 30 is moved to a horizontal direction in the state which pressed the press part 30 with respect to the board | substrate 6. FIG. The bottom surface of the pressing part 30 and the ridge line of the recess 34 become edges, and the excess resin solution 17 above the film 5 is scraped from above the defect position. That is, the line where the bottom surface of the pressing portion 30 and the recess 34 intersect moves in the lateral direction, and the resin solution 17 is scraped out in the same manner as the tip of the squeegee 31.

  The recess 34 is formed up to the side surface of the pressing portion 30. That is, each recess 34 is formed from one side surface of the pressing portion 30 to the opposite side surface. The resin solution 17 scraped out is discharged from the side surface of the pressing portion 30. Similar to the first embodiment, the upper surface of the resin solution 17 applied to the defective portion becomes flat. The film 5 is removed and the solvent is evaporated as in the first embodiment. As a result, the configuration shown in FIG. 6B is obtained as in the first embodiment. Since the resin solution is scraped out by the dent 34, the height of the resin solution 17 is uniform. Thereby, the height of the resin 18 attached to the defective portion can be made uniform.

  In the present embodiment, the amount of the resin 18 attached to the defective portion can be easily controlled as in the first embodiment. That is, the coating amount of the resin solution 17 is controlled by the thickness of the film 5 and the pressing of the pressing portion 30. Further, the thickness of the resin 18 remaining in the defective portion is controlled by the ratio of the resin and the solvent in the resin solution 17. By adjusting these, the adhesion amount of the resin 18 can be easily controlled, and stable defect correction becomes possible.

Embodiment 3 of the Invention
The configuration of the defect correction apparatus according to this embodiment will be described with reference to FIG. FIG. 8 is a diagram showing the configuration of the defect correction apparatus. In the present embodiment, the thickness of the resin solution is controlled using a roller 32 instead of the pressing unit 30 and the squeegee 31. That is, the roller 32 has the same function as the pressing unit 30 and the squeegee 31. The description of the same configuration as in the first and second embodiments is omitted.

  As in the first embodiment, the film 5 is irradiated with a pulse laser at a position corresponding to the defective portion to provide an opening. And the resin solution 17 is apply | coated to the position of an opening part. For example, the resin solution is dropped by a dispenser and applied to the defective portion. Alternatively, it may be applied by any of the methods shown in the first embodiment. The roller 32 is moved in the vicinity of the defective portion. And the roller 32 arrange | positioned in the defect vicinity is connected to the roller rotation means 35 which has a motor etc., for example. As a result, the configuration shown in FIG. 8 is obtained. Alternatively, the roller 32 may be rotated by the frictional force between the film 5 and the roller 32 by moving the roller 32 against the substrate. When the roller 32 is rotated by the roller rotating means 35, the roller 32 moves in the Y direction. The roller 32 is provided so as to be movable in the vertical direction (Z direction) by a motor (not shown) or the like. The roller 32 is moved in the Z direction to push the resin solution into the substrate 6, and the roller is rotated and moved in the Y direction to remove the resin solution provided on the opening.

  The thickness adjustment of the resin solution 17 by the roller 32 will be described with reference to FIG. FIG. 9 is a cross-sectional view showing the structure of the defective portion. The roller 32 has a cylindrical configuration and is rotatably provided so as to cross over the opening. The roller 32 has the same functions as the pressing unit 30 and the squeegee 31 described in the first embodiment. While the resin solution 17 is applied, the roller 32 is pressed against the substrate 6 and rotated in the direction of the arrow. The rotation of the roller 32 is controlled by a roller rotating means 35. The roller 32 moves so as to cross the defective portion. The roller 32 is provided sufficiently wider than the size of the opening. That is, both ends of the roller 32 are disposed outside the opening.

  When the roller 32 is rotated while being pressed against the substrate, the excess resin solution 17 applied on the opening is removed. That is, the resin solution 17 between the film 5 and the roller 32 is pushed out in the traveling direction of the roller 32. Thereby, the resin solution 17 can be apply | coated flatly. Further, since the roller 32 is pressed against the substrate 6, the resin solution 17 enters the pressed defective portion when passing over the opening. As a result, the resin solution 17 is embedded in the defective portion and can be attached to the substrate 6.

  By removing the excess resin solution 17 with the roller 32, the resin solution 17 can be applied to the defective portion with a uniform thickness. Thereby, the upper surface of the resin solution 17 applied to the defective portion becomes flat as in the first embodiment. The film 5 is removed and the solvent is evaporated as in the first embodiment. As a result, the configuration shown in FIG. 6B is obtained as in the first embodiment. Since the resin solution 17 is removed by the roller 32, the height of the resin solution 17 is uniform. Thereby, the height of the resin 18 adhering to the defective portion can be made uniform.

  In the present embodiment, the amount of the resin 18 attached to the defective portion can be easily controlled as in the first embodiment. That is, the application amount of the resin solution 17 is controlled by the rotation speed of the roller 32, the thickness of the film 5, and the pressing of the pressing portion 30. Furthermore, the thickness of the resin remaining in the defective portion is controlled by the ratio of the resin and the solvent in the resin solution 17. By adjusting these, the adhesion amount of the resin 18 can be easily controlled, and stable defect correction becomes possible.

  The roller 32 is preferably made of a material having low wettability with respect to the resin solution 17. In other words, it is preferable to use a material that does not easily adhere to the resin solution 17 for the roller 32. As the roller 32, for example, a roller whose surface is coated with Teflon (registered trademark) can be used. Thereby, the resin solution 17 does not adhere to the roller 32, and the height of the resin solution can be easily adjusted. That is, if the resin solution 17 adheres to the roller 32 after the defect correction, the solvent evaporates with time. Then, the resin 18 remains on the roller 32. If the next defect is corrected using the roller 32 with the resin 18 remaining on the surface, the height of the resin solution applied to the defective portion may not be uniform.

  In the present invention, by using a material with low wettability for the roller 32, stable defect correction can be performed. Further, when the resin 18 remains on the roller 32, it is preferable to wash the roller 32 and remove the remaining resin.

Embodiment 4 of the Invention
The defect correction apparatus according to the present embodiment will be described with reference to FIG. FIG. 10 is a diagram schematically showing the configuration of the defect correction apparatus. In the present embodiment, the resin solution 17 is applied to the defective portion of the substrate using the roller 32 as in the third embodiment. Further, in the present embodiment, a protective film 33 is provided between the roller 32 and the film 5. The protective film 33 is provided to prevent the resin solution 17 from adhering to the roller 32. The description of the same configuration as in the first to third embodiments is omitted.

  As in the first embodiment, the film is irradiated with a pulse laser at a position corresponding to the defective portion to provide an opening. And the resin solution 17 is apply | coated to the position of an opening part. For example, the resin solution is dropped by a dispenser and applied to the defective portion. Alternatively, it may be applied by any of the methods shown in the first embodiment. A roller 32 is disposed in the vicinity of the defective portion. The roller 32 is connected to roller rotation means 35 having a motor or the like. By rotating the roller 32 by the roller rotating means 35, the roller 32 moves in the Y direction. Further, the protective film 33 is moved between the roller 32 and the film 5. That is, the protective film 33 is disposed on the film 5. A roller 32 is disposed on the protective film 33.

  The protective film 33 is wound around the film reel 19 like the film 5. The film reels 19 are connected to film rotation means (not shown), and each of the film reels 19 can be rotated. By rotating the two film reels 19, the protective film 33 is continuously sent out in the Y direction. The protective film 33 and the film reel 19 are provided so as to be movable in a horizontal direction perpendicular to the Y direction. After providing the opening by laser irradiation, the protective film 33 can be disposed at a position corresponding to the position corresponding to the defect position. Thereby, the opening provided in the film 5 is configured to be covered with the protective film 33.

  The configuration around the defective portion at this time is as shown in FIG. FIG. 11 is a cross-sectional view showing the configuration around the defective portion. A resin solution 17 is applied to the opening of the film 5. And the protective film 33 is arrange | positioned on it. Further, a roller 32 is disposed on the protective film 33. The roller 32 is disposed in the vicinity of the opening.

  As in the third embodiment, the roller 32 is rotated while being pressed against the substrate 6. Thereby, the protective film 33 and the film 5 adhere. Then, the resin solution 17 between the film 5 and the protective film 33 is pushed out in the traveling direction of the roller 32. Thereby, the excess resin solution 17 applied on the opening can be removed. Further, since the roller 32 is pressed against the substrate 6, the resin solution 17 enters the defective portion pressed. As a result, the resin solution 17 is embedded in the defective portion and can be attached to the substrate 6.

  By removing the excess resin solution 17 with the roller 32, the resin solution 17 can be applied to the defective portion with a constant thickness. Thereby, the upper surface of the resin solution 17 applied to the defective portion becomes flat as in the first embodiment. As in Embodiment 1, the film 5 and the protective film 33 are removed and the solvent is evaporated. As a result, the configuration shown in FIG. 6B is obtained as in the first embodiment. Since the resin solution 17 is removed by the roller 32, the height of the resin solution 17 is uniform. Thereby, the height of the resin 18 adhering to the defective portion can be made uniform.

  In the present embodiment, the amount of the resin 18 attached to the defective portion can be easily controlled as in the first embodiment. That is, the application amount of the resin solution 17 is controlled by the rotation speed of the roller 32, the thickness of the film 5, and the pressing of the pressing portion 30. Furthermore, the thickness of the resin remaining in the defective portion is controlled by the ratio of the resin and the solvent in the resin solution 17. By adjusting these, the adhesion amount of the resin 18 can be easily controlled, and stable defect correction becomes possible.

  The protective film 33 is formed of the resin solution 17 and a material having low wettability. That is, it is preferable to use a material that the resin solution 17 is difficult to adhere to for the protective film 33. As the protective film 33, for example, a film whose surface is coated with Teflon (registered trademark) can be used. Since the protective film is disposed between the roller 32 and the resin solution 17, the roller 32 and the resin solution 17 do not come into contact with each other. Therefore, it is possible to completely prevent the resin solution 17 from adhering to the roller 32. Thereby, the washing process for removing the resin solution 17 adhering to the roller 32 can be omitted. Maintenance can be performed more easily than in the third embodiment.

  Furthermore, since the protective film 33 can be sent out by the film reel 19, a portion of the protective film 33 to which the resin solution 17 is not attached can be used. In other words, the part where the resin solution 17 is adhered after being used once is sent out, and a new part of the protective film 33 can always be used. Thereby, the protective film 33 which is unused and to which the resin solution 17 is not attached is disposed at a position facing the defective portion. Therefore, the height of the resin solution 17 applied to the defective portion can be made uniform, and stable defect correction can be performed.

It is a figure which shows the structure of the defect correction apparatus concerning Example 1 of this invention. It is an expanded sectional view which shows the structure of the defect part of the defect correction apparatus concerning Example 1 of this invention. It is a figure which shows the structure of the defect correction apparatus concerning Example 1 of this invention. It is an expanded sectional view which shows the structure of the defect part of the defect correction apparatus concerning Example 1 of this invention. It is an expanded sectional view which shows the structure of the defect part of the defect correction apparatus concerning Example 1 of this invention. It is an expanded sectional view which shows the structure of the defect part of the defect correction apparatus concerning Example 1 of this invention. It is an expanded sectional view which shows the structure of the defect part of the defect correction apparatus concerning Example 2 of this invention. It is a figure which shows the structure of the defect correction apparatus concerning Example 3 of this invention. It is an expanded sectional view which shows the structure of the defect part of the defect correction apparatus concerning Example 3 of this invention. It is a figure which shows the structure of the defect correction apparatus concerning Example 4 of this invention. It is an expanded sectional view which shows the structure of the defect part of the defect correction apparatus concerning Example 4 of this invention.

Explanation of symbols

1 short pulse laser light source, 2 beam shaping mechanism, 3 half mirror, 4 objective lens,
5 film, 6 substrate, 7 stage, 8 film reel, 9 lamp light source,
10 wavelength tunable filter, 11 half mirror, 12 CCD camera,
13 air ejection means, 14 film reel rotation means,
17 resin solution, 18 resin, 19 film reel,
30 pressing parts, 31 squeegees, 32 rollers, 33 protective films,
34 Depression, 35 Roller rotating means 61 Red colored layer, 62 Green colored layer, 63 Blue colored layer,
64 black matrix, 65 foreign matter, 66 defective part,

Claims (14)

A defect correction device for correcting defects in a patterned substrate,
A film provided facing the substrate;
A laser light source that emits a laser that irradiates the film and provides an opening in the film;
Application means for applying a defect correcting solution to the defective portion of the substrate through the opening;
A defect correcting apparatus comprising: pressing means for pressing the solution applied to the substrate through the opening into the defective portion by pressing against the substrate. Further provided with a removing means provided to be movable in a direction substantially parallel to the substrate and removing the solution provided on the opening;
The defect correction apparatus according to claim 1, wherein the height of a solution provided on the opening is adjusted by moving the removing unit so as to cross the opening.   3. The defect correction apparatus according to claim 2, wherein the removing means has a squeegee capable of pressing the film against the substrate, and scrapes and removes the solution provided on the opening.   The pressing means is moved to the outside of the opening, and the solution provided on the opening is removed by the removing means in a state where the film is pressed against the substrate by the pressing means. The defect correction apparatus according to claim 2 or 3, characterized in that: The removal portion is constituted by a recess provided on the bottom surface of the pressing means,
The said pressing means is moved in a direction substantially parallel to the substrate while being pressed against the substrate, and the solution provided on the opening is removed by the recess. Defect correction equipment. The pressing means includes a roller rotatably provided to move across the opening;
2. The height of the solution provided on the opening is adjusted by removing the solution provided on the opening by rotating the roller. Defect correction device. A protective film provided between the roller and the film;
The defect correction apparatus according to claim 6, wherein the solution provided on the opening is removed via the protective film. The laser light source is a pulsed laser light source,
The defect of the substrate is removed by irradiating a pulse laser from the pulse laser light source through the opening of the film, and the solution is applied to a portion where the defect is removed. The defect correction apparatus in any one of 1 thru | or 7. A defect correction method for correcting defects in a patterned substrate,
Detecting defects on the substrate;
Facing the film to the substrate;
Irradiating the film with pulsed laser light to provide an opening corresponding to the defect; and
Applying a defect correcting solution to a defective portion of the substrate through the opening;
Pushing the solution applied to the substrate through the opening into a defective portion;
Removing the film from the substrate.   The defect correction method according to claim 9, further comprising the step of adjusting the height of the solution by removing the solution provided on the opening after the step of applying the solution.   11. The defect according to claim 10, wherein in the step of removing the solution, the solution is removed by scraping the solution provided on the opening while the film is in close contact with the substrate. How to fix. Forming a pattern on the substrate;
Detecting defects in the pattern on the substrate;
Facing the film to the substrate;
Irradiating the film with pulsed laser light to provide an opening corresponding to the defect; and
Applying a defect correcting solution to a defective portion of the substrate through the opening;
Pushing the solution applied to the substrate through the opening into a defective portion;
Removing the film from the substrate.   The pattern substrate manufacturing method according to claim 12, further comprising a step of adjusting the height of the solution by removing the solution provided on the opening after the step of applying the solution.   14. The pattern according to claim 13, wherein, in the step of removing the solution, the solution provided on the opening is scraped off in a state where the film is in close contact with the substrate. A method for manufacturing a substrate.

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