JP2005166750A - Method and apparatus for repairing wiring - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize repairing of the disconnected part of the wiring of an electronic circuit substrate by bringing the disconnected part of the wiring into coincidence with the size and the shape of the wiring into coincidence accurately. <P>SOLUTION: A method of repairing the wiring for connecting the disconnected part of the wiring includes a step of applying a masking reagent 16 over a region larger than the disconnected part 15c of the wiring part 15a of the wiring 15 formed on the electronic circuit substrate (work) W as seen in plane and irradiating with a laser beam L, a step of removing the masking reagent 16 of the wiring region 17 including the disconnected part 15c, then a step of coating the wiring region 17 from which the masking reagent 16 is removed with a metal colloid, etc. 19, a step of depositing the metal thin film 20 by irradiating the metal colloid, etc. 19 with the laser beam L to heat the metal colloid, etc. 19, and a step of connecting the disconnected part 15c. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a wiring repair method and a wiring repair apparatus for repairing a disconnection of a wiring formed on an electronic circuit board such as a liquid crystal panel, a semiconductor substrate, and a printed wiring board.

Conventionally, as a wiring repair method of this type, a metal complex solution containing one or more metals of palladium, gold, silver, and platinum is applied to the disconnection portion of the wiring on the electronic circuit board by an injector, and then applied to the application portion. By irradiating laser spot light, evaporating the solvent in the metal complex solution and precipitating the metal thin film on the disconnection part, the wires on both ends of the disconnection part are connected and connected by the metal thin film. The method of making it known is known (for example, refer patent document 1).
In addition, while moving the glass pipette over the wiring having the disconnection part on the electronic circuit board over the disconnection part and the wiring part on both ends thereof, the metal complex solution is discharged from the tip of the glass pipette to thereby disconnect the disconnection part. And coating the wiring portions at both ends thereof, the coating portion is irradiated with laser light and heated to evaporate the solvent in the metal complex solution, and at the same time, the metal complex remaining in the coating portion is thermally decomposed to There is known a method of repairing a disconnected portion of a wiring by forming a metal conductive thin film (see, for example, Patent Document 2).
JP-A-7-29982 JP-A-9-133504

In the above conventional wiring repair method, the metal complex solution applied to the disconnection part of the wiring from the injector or glass pipette is applied not only to the disconnection part but also to the upper side of the wiring part on both ends thereof, or adjacent electrodes. In such a case, the thickness and width of the conductor including the conductive thin film formed in the wiring repair portion and the peripheral portion thereof are equal to the other portions of the wiring. In other words, the resistance value of the wiring having the wiring repairing portion is different from the resistance value of the wiring not having the wiring repairing portion, and the electric capacity of the wiring pattern of the electronic circuit board does not match the design value.
In addition, the metal complex solution applied to the disconnection part of the wiring may be applied not only to the disconnection part but also to the adjacent electrode and the wiring side. Since the wiring having the repaired portion is short-circuited to the adjacent wiring by the conductor including the conductive thin film to be formed, the short-circuited portion is separated by irradiating laser light, or the short-circuited portion in the adjacent wiring A certain area on the connection part side must be processed by laser light irradiation to perform additional processing such as separating the short-circuited part from the adjacent wiring. As a result, the electric resistance of the wiring pattern of the electronic circuit board does not match the design value.

  The present invention has been made in view of the above circumstances, and a wiring repair method and a wiring repair apparatus capable of repairing a broken portion of a wiring of an electronic circuit board by accurately matching the size and shape of the wiring. The purpose is to provide.

The present invention is characterized by the following points in order to solve the above problems.
That is, the wiring repair method according to claim 1 and the wiring repair device according to claim 6 apply a masking agent to a broken portion of the wiring formed on the electronic circuit board over a wider area in plan view. Then, after irradiating the laser beam and removing the masking agent in the wiring region including the disconnection portion, a solution containing a conductive substance is applied to the wiring region from which the masking agent has been removed, and the conductive A solution containing a certain substance is irradiated with a laser beam and heated to deposit a thin film of a conductive substance to connect the disconnected portion.

  In this wiring repair method, when the disconnection portion of the wiring of the electronic circuit board is detected by the inspection device, the masking agent is applied to the wider area including the disconnection portion in plan view by the first coating device. Thereafter, the masking agent is irradiated with laser light by a laser irradiation device, and the masking agent in a predetermined wiring region including the disconnected portion is removed. Next, a solution containing a conductive substance (for example, a noble metal) is applied to the region from which the masking agent has been removed by the second coating apparatus, and the solution containing the applied conductive substance is applied. When the laser irradiation device is irradiated with laser light and the solution containing the conductive substance is heated, the solvent in the solution containing the conductive substance evaporates and becomes conductive. A thin film of material is deposited, and the disconnected portion is connected and repaired by the deposited thin film of conductive material.

  The wiring repair method according to claim 2 is the wiring repair method according to claim 1, wherein the masking agent and the conductive material remaining on the electronic circuit board after irradiating the solution containing the conductive substance with laser light. It is characterized in that a solution containing a certain substance is removed by washing.

  The wiring repair method according to claim 3 is the wiring repair method according to claim 1 or 2, wherein the solution containing the conductive substance matches the shape of the wiring region including the disconnection portion in plan view. It is characterized by irradiating a laser beam shaped into a quadrilateral shape.

  A wiring repair method according to claim 4 is the wiring repair method according to any one of claims 1 to 3, wherein a solution containing the masking agent and a conductive substance is applied by an ink jet apparatus. .

  The wiring repair method according to claim 5 is characterized in that, in the wiring repair method according to any one of claims 1 to 3, a solution containing the masking agent and a conductive substance is applied by a dispenser device. .

The present invention has the following excellent effects.
According to the wiring repair method according to claim 1 and the wiring repair device according to claim 6, a solution containing a conductive substance is applied to a wiring region including a limited disconnection portion surrounded by a masking agent. The disconnection portion is connected by a thin film of the conductive material formed by being deposited from the solution containing the conductive substance, so that the shape of the connection portion of the disconnection is the shape of the wiring on the electronic circuit board. Therefore, the wiring can be repaired accurately in accordance with its shape.

  According to the wiring repair method according to claim 2, a solution containing a masking agent remaining on the electronic circuit board and a conductive substance that has not been used for repairing the disconnection after the repair of the disconnection portion of the wiring is completed. Therefore, it is possible to keep the electronic circuit board whose wire breakage has been repaired clean.

According to the wiring repair method according to claim 3, it is possible to deposit a thin film of a conductive substance in a shape matched with the shape of the wiring region including the wiring disconnection portion, and to connect the disconnection portion. Can be performed more accurately.
According to the wiring repair method of the fourth aspect, an appropriate amount and a smooth solution of the masking agent and the conductive substance containing the conductive material can be applied to the predetermined areas without waste using the inkjet apparatus.

  According to the wiring repair method according to the fifth aspect, it is possible to spread a high-viscosity masking agent and a high-concentration conductive paste to a predetermined region and other areas around the other by a dispenser device. It can be applied accurately with less.

Hereinafter, a wiring repair method and a wiring repair apparatus according to an embodiment of the present invention will be described with reference to the accompanying drawings.
First, a wiring repair device according to an embodiment of the present invention will be described. In FIG. 1, 1 is a wiring repair device. This wiring repair device 1 includes a table 3 that is horizontally supported via a gantry 2 disposed at four corners, and a pair of legs 4a and 4a that are erected at both ends of the table 3 in the X-axis direction x. An X-axis beam frame 4b directed in the X-axis direction x is connected to the upper end, and a gate-shaped X-axis frame provided so as to straddle a flat plate-like electronic circuit board (work) W placed on the table 4 and an X-axis slider 5 supported by the X-axis beam portion 4b of the X-axis frame 4 so as to be movable in the X-axis direction x. The X-axis frame 4 and the X-axis slider 5 constitute a support frame that can move relative to the table 3 in the X-axis direction and the Y-axis direction perpendicular thereto.

  The X-axis frame 4 has leg portions 4a, 4a supported by guide rails 6, 6 arranged at both ends in the X-axis direction x of the table 3 along the Y-axis direction y. It is moved in the Y-axis direction y by a Y-axis drive device (not shown) such as a feed screw mechanism that is operated by rotation of a linear motor or a servo motor disposed between the lower end of 5a and the guide rails 6 and 6. It has become. The X-axis slider 5 has upper and lower end portions in the Z-axis direction z on a pair of guide rails 7 and 7 provided along the X-axis direction x on the upper and lower end portions in the Z-axis direction z of the X-axis beam portion 4b. A ball nut (not shown) that is supported and fixed to the rear surface (rear surface) is screwed to a ball screw 8 disposed along the X-axis direction x between the guide rails 7, 7. By being rotated by an X-axis drive motor 9 fixed to one end portion (right end portion in FIG. 1) of the axial beam portion 4b, the axial beam portion 4b moves in the X-axis direction x. The ball nut (not shown), the ball screw 8, the X-axis drive motor 9 and the like constitute an X-axis drive device that moves the X-axis slider 5 in the X-axis direction x. Not limited to this, a linear motor or the like can be used.

  On the front surface of the X-axis slider 5, a laser irradiation device 10 that irradiates laser light toward the surface of the workpiece W, and a nozzle 11 a that is perpendicular to the surface of the workpiece W (Z-axis direction z), the nozzle 11 a A first ink jet device (first coating device) 11 for dropping a masking agent on the workpiece W and directing the nozzle 12a perpendicularly to the surface of the workpiece W (Z-axis direction z). A second inkjet device 12 that drops and applies a solution containing a certain substance to the workpiece W, and a nozzle 13a is directed vertically (Z-axis direction z) to the surface of the workpiece W so that the nozzle (second coating device) The masking agent discharged from 13a and adhering to the surface of the workpiece W and the cleaning device 13 for removing the solution containing the conductive substance are disposed at a predetermined distance in the X-axis direction x, It It is possible to individually adjust the movement in the Z-axis direction z via first, second, third, and fourth Z-axis driving means (Z-axis driving device) comprising a screw mechanism and a servo motor (not shown). It is supported by the shaft slider 5. As each Z-axis driving means, a linear motor or the like can be used instead of a screw mechanism and a servomotor.

  The laser irradiation apparatus 10 is provided with the optical axis of an optical system 10b having an objective lens 10a at the lower end oriented perpendicularly to the surface of the workpiece W (Z-axis direction z). An aperture mechanism 10d for shaping the shape of the laser beam generated from the vessel 10c is provided. Although not shown, the aperture mechanism 10d includes a slit mechanism in which the width of the slit is made variable by making a pair of slit plates face each other perpendicular to the optical axis and adjusting the mutual distance between the slit plates. A pair of upper and lower positions are shifted in the axial direction, and the pair of slit mechanisms are individually swiveled around the optical axis, and the slits in the pair of slit mechanisms are overlapped and formed. The laser beam passes through the opening of a quadrilateral having an arbitrary size including a regular quadrangle, a rectangle, and a parallelogram so that the surface of the workpiece W is irradiated with the planar laser beam determined by the opening. It has become.

Further, the laser irradiation apparatus 10 is provided with a CCD camera 14 for imaging the surface of the workpiece W through an optical system 14a sharing a part of the optical system 10b including the objective lens 10a.
In the first and second ink jet devices 11 and 12, the solution cartridge is filled with a solution containing a masking agent and a conductive substance, and the solution cartridge is controlled by the control device. A solution containing a predetermined amount of a masking agent and a conductive substance that can be adjusted stepwise in a range of, for example, 30 pl to 300 pl from the nozzles 11a and 12a. Is dripped onto the workpiece W, which is well known in the art.

  Although not shown, the wiring repair device 1 includes the laser irradiation device 10, the first ink jet device 11, the second ink jet device 12, the cleaning device 13, the CCD camera 14, and the X axis drive motor 9, Y. A control device for controlling the operation of the axis drive device and the Z-axis drive means is provided, and the X-axis drive motor 9, the Y-axis drive device, and the Z-axis drive means are controlled by an operation command based on an operation program of the control device. The laser irradiation device 10 (CCD camera 14), the first inkjet device 11, the second inkjet device 12 and the cleaning device 13 are moved relative to the workpiece W on the table 3 by operating in a predetermined order. After being positioned at a predetermined position, a predetermined processing operation is performed on each workpiece W.

Next, a wiring repair method according to an embodiment of the present invention for repairing a disconnected portion of the wiring of the electronic circuit board (workpiece) W by the wiring repair device 1 having the above-described configuration will be described with reference to FIG.
For example, as shown in FIG. 2, the work W to be subjected to wiring repair is a wiring in which a plurality of wirings 15 are formed parallel to each other with a minute interval on the substrate and oblique to the side of the substrate. One of the wiring portions is a wiring portion 15a having a disconnection portion 15c, and the other is a normal wiring portion 15b having no disconnection portion 15c. In FIG. 2, the upper diagram shows a plan view, and the lower diagram shows an enlarged cross section of the broken portion 15 c of the wiring portion 15 a.
First, when the control device of the wiring repair device 1 operates, the X-axis drive motor 9 and the Y-axis drive device are operated, and the X-axis slider 5 and the X-axis frame 4 are moved in the X and Y axis directions x, The position of the objective lens 10a of the laser irradiation apparatus 10 (CCD camera 14) is moved to the position of the disconnection portion 15c of the wiring portion 15a in the wiring 15 of the workpiece W previously discovered by the inspection apparatus by being moved relative to y. Then, the laser irradiation device 10 is moved up and down by the first Z-axis driving means so that the CCD camera 14 is focused on the wiring portion 15a, and the position of the disconnection portion 15c is determined based on the image obtained by the CCD camera 14. The size and shape are recognized (see FIG. 2A).

  Next, after the X-axis drive motor 9 is operated and the first inkjet device 11 moves the nozzle 11a to a position above the disconnection portion 15c of the wiring portion 15a recognized by the CCD camera 14, A masking agent 16 is dropped from the nozzle 11a onto the disconnection portion 15c and applied to a wider area including the disconnection portion 15c (see FIG. 2B). As the masking agent, a sublimable mask resin that sublimes in a subsequent baking furnace, for example, one obtained by dissolving paradichlorobenzene in an organic solvent such as alcohol or ether can be used. Thereafter, the X-axis drive motor 9 is operated to move the objective lens 10a of the laser irradiation apparatus 10 to a position above the disconnection portion 15c, and then the laser light L from the laser transmitter 10c is applied to the masking agent 16. Irradiate the film part. At that time, in consideration of the size and shape of the disconnection portion 15c recognized by the CCD camera, the irradiation surface shape of the laser light L by the aperture mechanism 10d in advance includes the disconnection portion 15c and surrounds a wider wiring region 17. Since the shaped laser beam L is shaped into a rectangle over the range and the coating film portion of the masking agent 16 is irradiated, the masking agent in the heated portion evaporates by heating with the laser beam L, so that the shape of the irradiated surface is obtained. Correspondingly, a rectangular opening 18 is formed in the masking agent 16 (see FIG. 2C).

Next, after the X-axis drive device 9 is operated to move the nozzle 12a of the second inkjet device 12 to a position above the disconnection portion 15c, the nozzle 12a is formed on the disconnection portion 15c. A solution 19 containing a conductive substance is dropped and applied to the opening 18 of the masking agent 16 (see FIG. 2D). The solution 19 containing the conductive substance contains a colloidal solution in which metal particles composed of metals such as precious metals, copper, and chromium, and their compounds are uniformly dispersed in the solution, and those substances. Conventionally known pastes and the like (hereinafter simply referred to as “metal colloids”).
Next, the X-axis drive motor 9 is operated to move the objective lens 10a of the laser irradiation apparatus 10 to a position above the disconnected portion 15c, and then the laser light L from the laser transmitter 10c is transferred to the metal colloid 19 or the like. Irradiate towards the coating part. At that time, the shape of the irradiation surface of the laser light L is shaped in advance by the aperture mechanism 10d into a parallelogram that includes the broken portion 15c and matches the wiring region 17 wider than that, and the shaped laser light L is transformed into the metal Since the coating film portion of the colloid 19 is irradiated, the solvent in the metal colloid 19 evaporates in the heated portion by the laser beam L, and the metal in the metal colloid 19 is irradiated with the laser beam L. Matching the shape and depositing into a parallelogram in plan view, the deposited metal thin film 20 connects the wiring portions 15a on both sides of the disconnection portion 15c and restores its conduction state (see FIG. 2 (e)). .

Thereafter, the nozzle 13a of the cleaning device 13 is moved to a position above the metal thin film 20 by operating the X-axis driving device 9, and then the nozzle 13a is sufficiently overflowed from the nozzle 13a onto the metal thin film 20. A predetermined amount of the cleaning agent is dropped. As a result, the masking agent remaining around the metal thin film 20 and the metal colloid 19 that has not been irradiated with the laser L light are washed away to clean the surface of the workpiece W (see FIG. 2F). As the cleaning agent, warm pure water or the like can be used.
In addition, by attaching a drying device to the cleaning device 13, after the cleaning, if necessary, air or the like may be blown onto the workpiece W to promote evaporation and drying of the cleaning liquid. Further, without providing the cleaning device 13 on the X-axis slider 5, the wiring repair device 1 performs the conduction and repair process of the disconnected portion 15c in the wiring portion 15a, and then the workpiece W is removed by a cleaning process which is a subsequent process. It is possible to remove the masking agent, metal colloid 19 and the like remaining on the workpiece W by washing.
The laser irradiation device 10, the first and second ink jet devices 11, 12 and the cleaning device 13 are respectively irradiated with the laser beam L, when the masking agent 16 and the metal colloid 19 are dropped, and when the cleaning liquid is discharged. The position of the objective lens 10a and the nozzles 11a, 12a, and 13a in the Z-axis direction z with respect to the surface of the workpiece W can be appropriately determined by individually operating the first, second, third, and fourth Z-axis driving means. Needless to say, you can adjust it.

  As described above, according to the wiring repair method according to the embodiment, the disconnection portion 15c of the wiring portion 15a of the wiring 15 formed on the electronic circuit board (work) W is more than the disconnection portion 15c in plan view. After applying the masking agent 16 over a wide area and irradiating the laser beam L to remove the masking agent 16 from the wiring region 17 including the disconnection portion 15c, the wiring region 17 from which the masking agent 16 has been removed is subjected to a metal colloid or the like. 19 is applied, and the metal colloid or the like 19 is irradiated with a laser beam L and heated to deposit the metal thin film 20 to connect the disconnected portion 15c. A metal colloid 19 or the like is applied to the wiring region 17 (opening 18 of the masking agent 16) including the disconnected portion 15c and deposited from the metal colloid 19 or the like. The disconnection portion 15c is connected by the metal thin film 20 formed in this manner, and the shape of the connection portion after the disconnection portion 15 is connected to the shape of the wiring 15 on the electronic circuit board W is thereby made to match. Thus, the repair of the wiring 15 can be accurately performed in accordance with the wiring shape without causing any adverse effect that causes a short circuit on the adjacent normal wiring portion 15b.

Further, the masking agent 16 and the metal colloid 19 remaining on the electronic circuit board W after the laser beam L is irradiated to the metal colloid 19 and the like are cleaned and removed. After the repair of the disconnection portion 15c is completed, the masking agent remaining on the electronic circuit board W and the metal colloid 19 that has not been used for the repair of the disconnection portion 15c can be easily removed. The circuit board can be kept clean.
Further, since the laser beam L shaped into a quadrilateral shape in plan view that matches the shape of the wiring region 17 including the disconnection portion 15 c is irradiated to the metal colloid 19 or the like, the wiring portion 15 a in the wiring 15 is irradiated. The metal thin film 20 can be deposited in a shape matched with the shape of the wiring region 17 including the disconnection portion 15c, and the disconnection portion 15c can be connected, and the wiring 15 can be repaired more accurately. For this reason, the electric resistance of each wiring 15 in the wiring pattern of the electronic circuit board W becomes uniform, and the electric capacity can be matched with the design value.
Further, since the masking agent 16 and the metal colloid 19 are applied by the ink jet devices 11 and 12, the masking agent 16 and the metal colloid 19 and the like can be applied to the predetermined areas without waste by the ink jet devices 11 and 12, respectively. Can be applied smoothly.

  In the wiring repair method according to the embodiment, when the masking agent 16 is irradiated with the laser light L, in the wiring region 17 including the disconnection portion 15c of the wiring portion 15a, the bottom portion (thickness of the wiring portion 15a). The wiring portion 15a is removed by applying the energy of the laser beam to the entire direction), and a metal colloid 19 or the like is applied to the entire removed portion (wiring region 17) to form the metal thin film 20 thereon. However, the present invention is not limited to this, and the energy of the laser beam L is applied to the surface of the wiring part 15a or a part in the thickness direction thereof, so that the wiring part 15a is not removed or is partly processed in the thickness direction. Alternatively, the metal colloid 19 or the like may be applied to the gap between the removed portion and the disconnection portion 15c, and repair may be performed to connect the disconnection portion 15a of the wiring 15.

Further, in the wiring repair method according to the embodiment, an example applied to repairing the wiring 15 arranged in parallel with an inclination with respect to the side of the board in the wiring pattern of the electronic circuit board W. Although described, the present invention is not limited to this, and the present invention can also be applied to the repair of wirings arranged in parallel or perpendicular to the side of the substrate, wirings arranged in other shapes, and electrodes.
Furthermore, in the wiring correction method according to the embodiment, the masking agent 16 and the metal colloid 19 are set to the required area of the work W by the ink jet devices 11 and 12, but instead, Conventionally known dispenser devices can be used. According to the dispenser device, it is possible to accurately apply the masking agent 16 having a high viscosity and the conductive paste having a high concentration to a predetermined region. In addition to the metal, carbon or the like can be used as the conductive material such as the metal colloid 19, and the metal can be any material that can be deposited by heating with laser light. It is not limited to the metals shown.

  In the wiring repair device according to the embodiment, the table 3 is fixed to the gantry 2, and the X-axis frame 4 and the X-axis slider 5 are respectively connected to the Y-axis drive device and the X-axis drive motor 9 in the Y and X axes. The laser irradiation device 10 (CCD camera 14), the first ink jet device 11, the second ink jet device 12, and the cleaning device 13 are moved in the Y and X-axis directions y, However, the present invention is not limited to this, and the X-axis slider 5 is fixed, and the table 3 is mounted on the base provided on the gantry 2 in the X and Y-axis directions x and y. The devices 10, 11, 12, and 13 are moved in the X and Y axis directions with respect to the workpiece W by moving the table by X and Y axis driving devices that are supported movably and installed on the table and base side. Relative transfer to x and y It may be allowed to.

It is a perspective view which shows an example of the wiring repair apparatus which concerns on one embodiment of this invention. It is explanatory drawing which shows the procedure of the wiring repair method which concerns on one embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wiring repair apparatus 3 Table 4 X-axis frame 5 X-axis slider 9 X-axis drive motor (X-axis drive device)
DESCRIPTION OF SYMBOLS 10 Laser irradiation apparatus 10d Aperture mechanism 11, 12 1st, 2nd inkjet apparatus (1st, 2nd coating device)
DESCRIPTION OF SYMBOLS 13 Cleaning apparatus 14 CCD camera 15 Wiring 15a, 15b Wiring part 15c Disconnection part 16 Masking agent 17 Wiring area 18 Opening 19 Metal colloid etc. 20 Metal thin film L Laser light W Electronic circuit board (workpiece)

Claims (6)

  In a plan view, the masking agent was applied to the disconnection portion of the wiring formed on the electronic circuit board over a region wider than the disconnection portion and irradiated with laser light, and the masking agent in the wiring region including the disconnection portion was removed. After that, a solution containing a conductive substance is applied to the wiring region from which the masking agent has been removed, and the conductive substance is heated by irradiating the solution containing the conductive substance with laser light. A wiring repairing method comprising depositing a thin film of a certain substance and connecting the disconnected portion.   2. The solution containing the masking agent and the conductive substance remaining on the electronic circuit board after the solution containing the conductive substance is irradiated with laser light is removed by washing. Wiring repair method described in 1.   The laser light shaped into a quadrilateral shape in a plan view that matches the shape of the wiring region including the disconnection portion is irradiated to the solution containing the conductive substance. Wiring repair method described.   The wiring repair method according to claim 1, wherein a solution containing the masking agent and a conductive substance is applied by an ink jet apparatus.   The wiring repair method according to claim 1, wherein a solution containing the masking agent and a conductive substance is applied by a dispenser device. In a plan view, the masking agent was applied to the disconnection portion of the wiring formed on the electronic circuit board over a region wider than the disconnection portion and irradiated with laser light, and the masking agent in the wiring region including the disconnection portion was removed. After that, a solution containing a conductive substance is applied to the wiring region from which the masking agent has been removed, and the conductive substance is heated by irradiating the solution containing the conductive substance with laser light. A wiring repair device characterized in that a thin film of a certain substance is deposited to connect the disconnected portion.

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