CN112557417A

CN112557417A - PCB laser repairing method and device based on image detection

Info

Publication number: CN112557417A
Application number: CN202110222075.4A
Authority: CN
Inventors: 陈胜鹏
Original assignee: SHENZHEN YIMEIZHI TECHNOLOGY CO LTD
Current assignee: SHENZHEN YIMEIZHI TECHNOLOGY CO LTD
Priority date: 2021-02-28
Filing date: 2021-02-28
Publication date: 2021-03-26
Anticipated expiration: 2041-02-28
Also published as: CN112557417B

Abstract

The invention provides a PCB laser repairing method and device based on image detection, wherein the method comprises the following steps: shooting a binary image of the PCB plate by a detection camera under the irradiation of a white light detection light source; acquiring a standard image of the PCB, and determining the position of the multi-copper short circuit defect of the PCB by comparing the binary image of the PCB with the standard image; acquiring a first line size of a PCB line in a first line area in a non-first line area in the binary image, and acquiring a second line size of the PCB line in a second line area in the non-second line area in the binary image; determining a first boundary between the first line area and the short-circuit area, and determining a second boundary between the second line area and the short-circuit area; and removing the metal copper in the short circuit area by using a repair laser based on the first boundary and the second boundary.

Description

PCB laser repairing method and device based on image detection

Technical Field

The invention relates to the field of image detection, in particular to a PCB laser repairing method and PCB laser repairing equipment based on image detection.

Background

The laser repairing equipment has the main function that the PCB with the defects of the multiple copper short circuits detected by the optical detection machine is repaired into the PCB without the defects in a laser ablation mode. The laser repairing equipment needs to align, analyze and process PCB wiring patterns in the operation process, so that the rejection rate is reduced, and the quality of a PCB is improved.

The laser repairing process of the existing laser repairing equipment mainly comprises the following steps:

firstly, shooting a defect image of a PCB with defects;

comparing the defect image with the original image to obtain a laser repairing area on the defect image;

and thirdly, carrying out ablation operation on the redundant copper in the laser repairing area by using the ablation laser in the laser repairing equipment, thereby completing the laser repairing operation on the PCB.

However, the existing laser repairing equipment can only estimate the repairing progress of the PCB with defects, and cannot control the repairing amount well, which may cause the phenomena of excessive ablation or insufficient ablation.

Therefore, it is desirable to provide a PCB laser repairing method and a PCB laser repairing apparatus based on image detection to solve the above technical problems.

Disclosure of Invention

The invention provides a PCB laser repairing method and a PCB laser repairing device based on image detection, which can effectively detect the multi-copper short circuit defect of a PCB plate; the technical problem that the existing PCB laser repairing method and PCB laser repairing equipment cannot effectively detect and repair the multi-copper short circuit defect is solved.

The embodiment of the invention provides a PCB laser repairing method based on image detection, which is arranged on corresponding PCB plate detection equipment and is used for repairing the multi-copper short-circuit defect on the PCB plate; wherein PCB panel check out test set includes:

a transmission platform comprising a detection repair bit;

the repairing laser is arranged right above the detection repairing position and used for providing repairing laser;

a white light detection light source located above the detection repair position and used for providing detection white light;

the detection camera is positioned above the side of the detection repairing position and used for detecting the repairing condition of the corresponding PCB; and

the image processing module is connected with the detection camera and is used for detecting the multi-copper short circuit defects;

the PCB laser repairing method comprises the following steps:

step S1, under the irradiation of the white light detection light source, the image processing module shoots the binary image of the PCB plate through the detection camera;

step S2, the image processing module acquires a standard image of the PCB, and determines the position of the multi-copper short circuit defect of the PCB by comparing the binary image of the PCB with the standard image; wherein the multi-copper short defect location comprises a first line region, a second line region, and a short region for connecting the first line region and the second line region;

step S3, the image processing module obtains a first line size of the PCB line in the first line region in a non-first line region in the binarized image, and obtains a second line size of the PCB line in the second line region in a non-second line region in the binarized image;

step S4, determining a first boundary between the first line region and the short-circuit region according to the first line size, and determining a second boundary between the second line region and the short-circuit region according to the second line size;

and step S5, removing the metal copper in the short circuit area by using the repair laser based on the first boundary and the second boundary so as to repair the multi-copper short circuit defect.

In the PCB laser repairing method based on image detection of the present invention, the step S3 specifically includes:

determining a line type of the PCB line in the first line area; wherein the first line area includes all connection possible areas of the first end of the short circuit area;

if the line type is a ring, determining the first line size based on the size of a first ring judgment line of the ring line in a non-first line area; if the line type is a line type, determining the first line size based on the size of a first line type judgment line of the line type line in a non-first line area;

determining a line type of the PCB line in the second line region; wherein the second line area includes all connection possible areas of the second end of the short circuit area;

if the line type is a ring, determining the second line size based on the size of a second ring judgment line of the ring line in a non-second line area; if the line type is a line type, the second line size is determined based on a second line type determination line size of a line type line in a non-second line region.

In the image detection-based laser repair method for the PCB, the distance between the first annular judgment circuit and the PCB circuit in the short-circuit area is greater than the distance between the other circuit of the annular circuit in the non-first circuit area and the PCB circuit in the short-circuit area;

the distance between the first linear judgment line and the PCB line of the short-circuit area is greater than the distance between the other lines of the linear line in the non-first line area and the PCB line of the short-circuit area;

the distance between the second ring judgment line and the PCB line of the short-circuit area is greater than the distance between the other lines of the ring line in the non-second line area and the PCB line of the short-circuit area;

the second linear judgment line is spaced from the PCB line of the short-circuited area by a distance greater than distances from other ones of the linear lines in the non-second line area to the PCB line of the short-circuited area.

In the image detection-based PCB laser repairing method, the PCB board detection equipment further comprises a blue-violet light detection light source arranged above the side of the detection repairing position and used for providing blue-violet light for detection, and a blue light filter arranged on the detection camera;

the step S5 specifically includes:

removing the metal copper in the short circuit area by using the repairing laser;

and under the irradiation of the blue-violet light detection light source, shooting the short circuit area by using the detection camera so as to determine that the metal copper in the short circuit area is completely removed.

In the image detection-based PCB laser repairing method, under the irradiation of the blue-violet light detection light source, the metal copper shot by the detection camera is black, and the base material of the PCB board shot by the detection camera is white.

In the image detection-based PCB laser repairing method, the PCB plate detection equipment further comprises a reflecting convex mirror which is arranged right above the detection repairing position and used for sending a detection image to a detection camera; the reflecting convex mirror is movably arranged right above the detection and repair position.

In the image detection-based PCB laser repairing method, the PCB plate detection equipment further comprises a reflecting convex mirror which is arranged right above the detection repairing position and used for sending a detection image to a detection camera; and a through hole for the repair laser to pass through is formed in the middle of the reflecting convex mirror.

The embodiment of the invention also provides a PCB laser repairing device based on graph detection, which is arranged on the corresponding PCB plate detecting device and is used for repairing the multi-copper short circuit defect on the PCB plate; the PCB laser repairing equipment comprises a rack, a transmission platform arranged on the rack and a multi-copper short-circuit defect detection assembly;

the transmission platform comprises a board inlet position and a detection and repair position, wherein the multi-copper short circuit defect detection assembly is arranged above the detection and repair position;

wherein the multi-copper short defect detection assembly comprises:

wherein the image processing module is specifically configured to:

In the PCB laser repairing device based on graph detection, the multi-copper short-circuit defect detection assembly further comprises a reflecting convex mirror which is arranged right above the detection repairing position and used for sending a detection image to a detection camera; the reflecting convex mirror is movably arranged right above the detection repairing position; or

The multi-copper short-circuit defect detection assembly also comprises a reflecting convex mirror which is arranged right above the detection and repair position and used for sending a detection image to a detection camera; and a through hole for the repair laser to pass through is formed in the middle of the reflecting convex mirror.

In the laser repair equipment for the PCB based on the graph detection, the drilling defect detection equipment further comprises a roller pressing strip which is arranged on the board inlet position and used for flattening the PCB on the board inlet position;

the roller pressing strip comprises a plurality of mutually connected roller assemblies, each roller assembly comprises a wheel shaft and a roller connected to the wheel shaft, and the plurality of roller assemblies are connected through elastic assemblies, so that the adjacent roller assemblies can elastically move.

In the PCB laser repairing device based on graph detection, the elastic component comprises a connecting piece and an elastic piece, a female head and a male head are respectively arranged at two ends of the wheel shaft, and a connecting hole is formed in the female head;

the connecting piece is of a rod-shaped structure, a first spherical connecting end and a second spherical connecting end are arranged at two ends of the connecting piece respectively, the first connecting end is used for being movably connected with the female head, the second connecting end is used for being movably connected with the male head, the elastic piece is of an annular structure, the elastic piece is arranged in the connecting hole, and the elastic piece is sleeved on the connecting piece.

In the laser repair device for the PCB based on the graph detection, the elastic assembly comprises an elastic part, a female head and a male head are respectively arranged at two ends of the wheel shaft, a connecting hole is formed in the female head, a first connecting part is arranged on the outer peripheral side of the female head, a connecting column and a second connecting part are arranged on the male head, the second connecting part is movably connected with the male head, the elastic part is of an annular structure, the elastic part is arranged in the connecting hole, the elastic part is sleeved on the connecting column, and the second connecting part is connected with the first connecting part.

In the laser repair equipment for the PCB based on the graph detection, the elastic component comprises a connecting piece and an elastic piece, two ends of the wheel shaft are respectively a female head and a male head, a connecting hole is formed in the female head, the elastic piece is fixedly arranged in the connecting hole, and the elastic piece comprises an annular elastic piece and a mandrel connected to the inner side of the annular elastic piece;

the elastic assembly further comprises two clamping blocks, the two clamping blocks are respectively located at two ends of the fixing groove, and the two clamping blocks are used for clamping the clamping strips in the fixing groove.

In the laser repair device for the PCB based on the graph detection, the elastic component further comprises a connecting rod and a second spring, the mandrel comprises a first setting hole and a second setting hole, and the second setting hole is communicated between the two first setting holes;

the two clamping blocks are arranged in the two first arrangement holes in a sliding mode in a one-to-one correspondence mode, the two connecting rods are arranged in the third arrangement holes in a sliding mode, the two ends of each connecting rod are connected with one clamping block respectively, the second spring is arranged at one end of the inner side of each clamping block, one end of the outer side of each clamping block is used for clamping and fixing the corresponding clamping strip, and when one clamping block is extruded by the male head to be far away from the corresponding clamping strip, the other clamping block can be extruded by the connecting rods to be far away from the corresponding clamping strip.

In the laser repair device for the PCB based on the graph detection, the elastic part is made of an elastic material and comprises an inner ring body, an outer ring body and a connecting body, the inner ring body and the outer ring body are concentrically arranged, the connecting body is connected between the inner ring body and the outer ring body, and the connecting body is of a hollow structure.

In the PCB laser repairing device based on graph detection, the connecting body is of an annular structure, and the cross section of the connecting body is of a wavy structure; or the connecting body is a plurality of connecting monomers which are annularly distributed on the periphery of the inner ring body, and the cross section structure of each connecting monomer is in a cross shape or an arc strip shape.

In the PCB laser repairing device based on the graph detection, the elastic component comprises an elastic piece, and the elastic piece comprises an annular frame, a first spring and a contact; the outer periphery of the annular frame is provided with a sliding hole, the contact is arranged in the sliding hole in a sliding mode, the first spring is connected between the inner end of the contact and the bottom wall of the sliding hole, and the outer end of the contact extends out of the sliding hole.

In the laser repair device for the PCB based on the graph detection, the elastic assembly comprises an elastic part, the elastic part comprises an annular main body and an elastic body, the elastic body is annularly distributed on the outer peripheral side of the annular main body, the elastic body comprises an arc-shaped elastic sheet and a reinforcing sheet, and the reinforcing sheet is connected between the arc-shaped elastic sheet and the annular main body.

Compared with the prior art, the invention has the beneficial effects that: the PCB laser repairing method based on the graph detection determines a first boundary between a first circuit area and a short circuit area based on the first circuit size of a PCB circuit, and determines a second boundary between a second circuit area and the short circuit area based on the second circuit size of the PCB circuit, so that the determined short circuit area is more accurate, and the effective detection and repair of the multi-copper short circuit defect can be realized; the technical problem that the existing PCB laser repairing method and PCB laser repairing equipment cannot effectively detect and repair the multi-copper short circuit defects is effectively solved.

Further, the white detection light source and the blue-violet detection light source are used, so that the detection efficiency of the metal copper in the short-circuit area can be improved, and the repair efficiency of the multi-copper short-circuit defect is further improved.

Furthermore, the arrangement of the roller pressing strip on the board inlet position enables the PCB to be closer to the detection position, so that the defect detection and repair operation is more accurate and efficient, and the roller pressing strip can be compatible with the PCB with different sizes and different heights.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required in the embodiments are briefly introduced below, and the drawings in the following description are only corresponding to some embodiments of the present invention.

FIGS. 1a and 1b are schematic structural views of an embodiment of an image detection-based PCB laser repairing apparatus according to the present invention;

FIG. 2 is a flow chart of an embodiment of the PCB laser repairing method based on image detection of the present invention;

FIGS. 3a and 3b are schematic diagrams of a decision circuit of the PCB laser repairing method based on image detection according to the present invention;

FIG. 4 is a schematic diagram of a PCB circuit shot by a detection camera of the PCB laser repairing method based on image detection of the present invention;

FIG. 5 is a first embodiment of the connection between the roller assemblies via the elastic assembly;

FIG. 6 shows a first embodiment of the elastic member;

FIG. 7 is a second embodiment of the resilient member;

FIG. 8 is a third embodiment of the elastic member;

FIG. 9 is a fourth embodiment of the resilient member;

FIG. 10 is a fifth embodiment of the elastic member;

FIG. 11 is a second embodiment of the connection between the roller assemblies by the elastic assembly;

FIG. 12 is a third embodiment of the connection between the roller assemblies via the elastic assembly;

FIG. 13 is a cross-sectional view of the mandrel of the elastomeric member corresponding to the third embodiment of the elastomeric component attachment;

FIG. 14 is a schematic structural view illustrating the male portion of the axle connected to the elastic member and pressing the latch of FIG. 13;

FIG. 15 is a front view of the mandrel of the elastic member corresponding to the third embodiment of the elastic member attachment;

FIG. 16 is a schematic view of the male portion of the axle corresponding to the third embodiment of the resilient member connection;

fig. 17 is a schematic view of the connection structure of two latches and two connecting rods corresponding to the third embodiment of the connection of the elastic component.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Ordinal words such as "first," "second," "third," etc., in the terms of the invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance, nor as limitations on the order in which they are presented;

in addition, the terms "connected" and "disposed" in the terms of the present invention should be interpreted broadly, and may be directly connected to or directly disposed on another element, indirectly connected to or indirectly disposed on another element, fixedly connected to or fixedly disposed on another element, detachably connected to or detachably disposed on another element, and the like, and those skilled in the art may understand the specific meanings of the above terms in the present invention according to specific situations.

Referring to fig. 1a and 1b, fig. 1a is a schematic three-dimensional structure diagram of an embodiment of a PCB laser repairing apparatus based on image detection according to the present invention. Fig. 1b is a schematic two-dimensional structure diagram of an embodiment of the PCB laser repairing apparatus based on image detection of the present invention. In order to clearly show the components, the dimensional proportion relation of the components in the figures is adjusted correspondingly.

The PCB laser repair apparatus 10 of the present embodiment includes a rack 11, a transport platform 12 disposed on the rack 11, and a multi-copper short defect detection assembly 13. The PCB laser repairing device 10 is used for detecting and repairing multi-copper short-circuit defects on a PCB plate 14.

The transfer platform 12 includes a board feeding position 121 and a detection repair position 122, wherein the multi-copper short defect detection assembly 13 is disposed above the detection repair position 122.

The multi-copper short circuit defect detecting assembly 13 includes a repairing laser 131, a white light detecting light source 132, a detecting camera 133, a blue-violet light detecting light source 134 and an image processing module 135.

The repairing laser 131 is arranged right above the detection repairing position and used for providing repairing laser; a white light detection light source 132 is located laterally above the detection repair site for providing detection white light; the detection camera 133 is positioned above the side of the detection repairing position 122 and is used for detecting the repairing condition of the corresponding PCB 14, and a blue filter 1331 is arranged on the detection camera 133; a blue-violet light detection light source 134 is disposed laterally above the detection repair site 122 for providing detected blue-violet light; the image processing module 135 is connected to the inspection camera 133 for performing multi-copper short defect inspection.

Thus, the image processing module 135 can detect and repair the multi-copper short circuit defect on the PCB board 14 by using the repairing laser 131 based on the detection image captured by the detection camera 133.

Referring to fig. 2, fig. 2 is a flowchart illustrating an embodiment of a PCB laser repairing method based on image detection according to the present invention. The laser repairing method for the PCB of the embodiment specifically comprises the following steps:

step S201, under the irradiation of a white light detection light source, an image processing module shoots a binary image of a PCB plate through a detection camera;

step S202, an image processing module acquires a standard image of the PCB, and determines the position of the multi-copper short circuit defect of the PCB by comparing the binarized image of the PCB with the standard image; the multi-copper short circuit defect position comprises a first circuit area, a second circuit area and a short circuit area for connecting the first circuit area and the second circuit area;

step S203, the image processing module acquires the first line size of the PCB line in the first line area in the non-first line area in the binary image, and acquires the second line size of the PCB line in the second line area in the non-second line area in the binary image;

step S204, the image processing module determines a first boundary between the first line area and the short circuit area according to the first line size; determining a second boundary between the second line region and the short circuit region according to the second line size;

in step S205, the image processing module removes the metal copper in the short-circuited area by using a repair laser according to the first boundary and the second boundary, so as to repair the multi-copper short-circuited defect.

The specific detection and repair process of the laser repair method for the PCB of the present embodiment is described in detail below.

In step S201, when the PCB is located at the detection and repair position of the transmission platform, the white light detection light source may be turned on to irradiate the PCB, so that the image processing module may shoot RGB images of the PCB through the detection camera.

And then, the image processing module carries out binarization operation on the RGB image so as to obtain a binarization image of the PCB plate, wherein colors of the PCB circuit with metal copper and the PCB base material without metal copper in the binarization image are completely different. For example, the PCB traces with metallic copper are yellow, the PCB substrate without copper is black, etc.

In step S202, the image processing module obtains a standard image of the PCB board, where the standard image is a Gerber standard image of the PCB board, and the PCB lines on the PCB board are set according to the Gerber standard image.

And then the image processing module compares the binary image of the PCB plate with the standard image, and determines the difference area of the binary image and the standard image as the position of the multi-copper short circuit defect of the PCB plate. Wherein the binarized image is shown in fig. 3a and the standard image is shown in fig. 3 b.

Since the multi-copper short-circuit defect location generally refers to the short-circuit connection of two PCB circuits that should not be connected to each other, the multi-copper short-circuit defect location should include a first circuit area having the PCB circuit, a second circuit area having the PCB circuit, and a short-circuit area for connecting the first circuit area and the second circuit area. The short circuit area includes a first end connected with the first line area and a second end connected with the second line area; the first circuit area includes all connection possible areas at the first end of the short circuit area, that is, all circuit areas in the PCB circuit that may include the first end of the short circuit area; the second line area here includes all connection possible areas of the second end of the short-circuit area, i.e. all line areas of the PCB line which may include the second end of the short-circuit area. The first line region may be a region a in fig. 3a, the second line region may be a region b in fig. 3a, and the short circuit region may be a region c in fig. 3 a.

In step S203, since the first line region, the short-circuit region and the second line region are smoothly connected, and no boundary exists between the first line region and the short-circuit region and between the second line region and the short-circuit region, before the copper metal of the short-circuit region is removed, a first boundary between the first line region and the short-circuit region and a second boundary between the second line region and the short-circuit region are determined.

Therefore, in this step, the image processing module may obtain a first line size of the non-first line region of the PCB line in the first line region in the binarized image; and simultaneously acquiring a second line size of the PCB line in the second line area in the non-second line area of the binarized image.

Because the difficulty that the first boundary cannot be accurately determined directly through the PCB circuit in the first circuit area is that the size of the PCB circuit is unknown, the image processing module obtains the circuit size of the PCB circuit in the non-first circuit area in the binary image, and sets the size as the first circuit size, and the first circuit size can accurately reflect the circuit size of the PCB circuit in the first circuit area. In the same way, the second line size can accurately reflect the line size of the PCB line in the second line area.

Specifically, the image processing module determines the first line size and the second line size in different manners based on the line type of the PCB line.

If the line type of the PCB line is a ring, determining a first line size based on the size of a first ring judgment line of the ring line in a non-first line area. As shown in fig. 3a, the first line size is determined based on the size of the first loop determination line a in fig. 3 a.

If the line type of the PCB line is a line type, determining the size of the first line based on the size of the first line type judgment line of the line type line in the non-first line area. As shown in fig. 3a, the first line size is determined based on the size of the first line type decision line B in the image 3 a.

Further, here, in order to improve the accuracy of the first line size acquisition, the distance between the first loop judgment line and the PCB line in the short-circuit area is greater than the distance between the other lines than the loop line in the first line area and the PCB line in the short-circuit area, as shown by the first loop judgment line a in fig. 3a, which is located at one end of the loop line away from the short-circuit area.

Similarly, the distance between the first linear judgment line and the PCB line in the short-circuit area is greater than the distance between the other lines than the linear line in the first line area and the PCB line in the short-circuit area, as shown in the first linear judgment line B in fig. 3a, which is as far away from the short-circuit area as possible.

Simultaneously setting the distance between the second annular judgment circuit and the PCB circuit in the short-circuit area to be larger than the distance between other circuits of the annular circuit in the non-second circuit area and the PCB circuit in the short-circuit area; the second line type decision line is spaced from the PCB line of the short-circuited region by a distance greater than distances from other lines than the line type line in the second line region to the PCB line of the short-circuited region.

Similarly, the image processing module may determine the second line size based on the size of the second loop judgment line of the loop line in the non-second line region, and may determine the second line size based on the size of the second line type judgment line of the new line type in the non-second line region.

In step S204, the image processing module determines a first boundary between the first line region and the short-circuited region according to the first line size acquired in step S203, and determines a second boundary between the second line region and the short-circuited region according to the second line size acquired in step S203. I.e. the area between the first and second boundary is a short-circuit area.

In step S205, the image processing module removes the metallic copper in the short-circuited area using a repair laser based on the first boundary and the second boundary acquired in step S204 to repair the multi-copper short-circuit defect.

Specifically, the image processing module can directly use the repair laser to remove the metal copper in the short circuit area. And then under the irradiation of a blue-violet light detection light source, the metal copper in the short circuit area reflects blue-violet light, and the PCB substrate in the short circuit area reflects fluorescence and blue light. Thus, under the action of the blue filter, the metal copper of the shot short-circuit area is black, and the PCB substrate of the shot short-circuit area is white. As shown in fig. 4. Thus, the short-circuit area is shot by using the detection camera, and whether the metal copper in the short-circuit area is completely removed or not can be judged based on black and white areas in a shot picture.

If the metal copper is not completely removed, the repair laser can be continuously used for removing the metal copper in the short-circuit area until the short-circuit area shot by the detection camera is white.

Further, in order to enable both the repairing laser and the inspection camera to work normally, the PCB laser repairing apparatus 10 includes a reflective convex mirror 15 disposed right above the inspection repairing position 122 for sending the inspection image to the inspection camera 133. The reflective convex mirror 15 can be movably disposed right above the detection and repair position 122, when the repair laser 131 works, the reflective convex mirror 15 can be far away from the position right above the detection and repair position 122, and when the detection camera 133 works, the reflective convex mirror 15 can be located right above the detection and repair position 122.

Of course, in order to perform defect detection while performing laser repair, the convex reflecting mirror 15 may be fixedly disposed right above the detection repair position 122, but a through hole 151 for passing repair laser is provided in the middle of the convex reflecting mirror 15. Since the reflective convex mirror 15 has a certain wide viewing angle, the through hole in the middle of the reflective convex mirror 15 does not cause the image captured by the detection camera 133 to be lost, and the image processing module 135 can obtain the RGB image corresponding to the PCB board 14 only by performing certain image brightness processing on the detection image.

Thus, the defect detection and repair process of the PCB board of the PCB laser repair method of the embodiment is completed.

The method for repairing the PCB based on the graph detection determines a first boundary between a first circuit area and a short circuit area based on the size of the first circuit of the PCB, and determines a second boundary between a second circuit area and the short circuit area based on the size of the second circuit of the PCB, so that the determined short circuit area is more accurate, and the effective detection and repair of the multi-copper short circuit defect can be realized; furthermore, the use of the white detection light source and the blue-violet detection light source can improve the detection efficiency of the metal copper in the short-circuit area, thereby further improving the repair efficiency of the multi-copper short-circuit defect.

In order to further improve the defect detection efficiency of the PCB laser repairing equipment. Referring to fig. 1b, the PCB laser repairing apparatus 10 of the present embodiment further includes a roller pressing bar 16 disposed on the board entering position 121 of the conveying platform 12 for pressing the PCB board 14 on the board entering position 121.

The roller strip 16 comprises a plurality of interconnected roller assemblies, each roller assembly comprises a wheel shaft 161 and a roller 162 connected to the wheel shaft, and the plurality of roller assemblies are connected through elastic assemblies, so that adjacent roller assemblies can elastically move.

The arrangement of the roller component can enable the PCB to be closer to the detection position, so that the defect detection result is more accurate. Because the adjacent roller assemblies can elastically move, the roller pressing strip 16 can be compatible with PCB boards with different sizes and different heights.

Referring to fig. 5, in the present embodiment, the elastic assembly 51 may include a connecting member 511 and an elastic member 512, two ends of the axle 161 are respectively a female head and a male head, the female head of one group of roller assemblies may be connected to the male head of the other group of roller assemblies through the elastic assembly 51, as shown in fig. 5, the axle 161 at the left end is a female head, the axle 161 at the right end is a male head, and the female head is provided with a connecting hole.

In this embodiment, the connecting member 511 is a rod-shaped structure, two ends of the connecting member 511 are respectively a spherical first connecting end and a spherical second connecting end, the left end in fig. 5 is the first connecting end, the first connecting end is used for being movably connected with the female end, the right end in fig. 5 is the second connecting end, the second connecting end is used for being movably connected with the male end, the elastic member 512 is an annular structure, the elastic member 512 is disposed in the connecting hole, the elastic member 512 is sleeved on the connecting member 511, so that the two wheel shafts 161 can move relatively, and the plurality of wheel assemblies are flexibly connected with each other, so that the misaligned wheel assemblies can be used for specifically and highly accurately fastening PCB boards with different thickness specifications.

Wherein because the second link is higher with public first dismouting frequency, like figure 5, can set up the fluting on the second link for the second link has better elastic deformation volume, is convenient for be connected or separate with public head.

In the present invention, the elastic member includes an elastic member having various implementation structures.

Referring to fig. 6, the elastic member 62 is made of an elastic material, the elastic member 62 includes an inner ring 621, an outer ring 622, and a connecting body 623 having a cross-shaped cross-sectional structure, the inner ring 621 and the outer ring 622 are concentrically disposed, the connecting body 623 is connected between the inner ring 621 and the outer ring 622, and the connecting body 623 is a hollow structure and has a good elastic deformation performance.

Referring to fig. 7, the elastic element 72 includes an inner ring 721, an outer ring 722 and a connector 723, wherein the connector 723 is a wavy annular structure, and the connector 723 has a simple structure and a low manufacturing cost.

Referring to fig. 8, the elastic element 82 includes an inner ring 821, an outer ring 822 and a connector 823, wherein the connector 823 is an arc-shaped strip structure, and the connector 823 has a simple structure and a low manufacturing cost.

Referring to fig. 9, the elastic member 92 includes a ring frame 921, a first spring 922 and a contact 923. The periphery side of the annular frame 921 is provided with the slide opening, and contact 923 slides and sets up in the slide opening, and first spring 922 is connected between the inner of contact 923 and the diapire of slide opening, and the outer end of contact 923 extends to the slide opening outside in order to contact with the inner wall elastic contact of the connecting hole of female head.

Referring to fig. 10, the elastic member 102 of the present invention may also be configured as the structure shown in fig. 10, the elastic member 102 includes an annular main body 1021 and an elastic body, the elastic body is annularly distributed on the outer peripheral side of the annular main body 1021, the elastic body includes an arc-shaped elastic piece 1022 and a reinforcing piece 1023, the reinforcing piece 1023 is connected between the arc-shaped elastic piece 1022 and the annular main body 1021, as shown in fig. 10, the arc-shaped elastic piece 1022 and the reinforcing piece 1023 are both arc-shaped pieces, and the concave sides of the arc-shaped elastic piece 1022 and the reinforcing piece 1023 are located on the same side.

On the other hand, a plurality of roller assemblies can also adopt the following connection mode through elastic components.

Referring to fig. 11, a female head of a wheel axle 161 is provided with a connecting hole, an outer peripheral side of the female head is provided with a first connecting portion, a male head is provided with a connecting post 111 and a second connecting portion 112, the second connecting portion 112 is movably connected with the male head, that is, the second connecting portion 112 is movable relative to the wheel axle 161, the elastic member 113 is of an annular structure, the elastic member 113 is arranged in the connecting hole, the elastic member 113 is sleeved on the connecting post 111, the second connecting portion 112 is connected with the first connecting portion, connection of the two wheel axles 161 is achieved, and meanwhile, a set moving space is provided between the two wheel axles 161.

Wherein, it can be understood that first connecting portion can be designed to the external screw thread, and second connecting portion 112 is the nut cover, and the nut cover has the internal thread that matches with the external screw thread, and first connecting portion still can set up to the draw-in groove, and second connecting portion 112 is the cutting ferrule, and the cutting ferrule has the fixture block that matches with the fixed slot.

Referring to fig. 12, the plurality of roller assemblies may be connected to each other by the elastic assembly as follows.

In this connection, the elastic member is fixedly disposed in the connection hole of the female head, and the elastic member includes an annular elastic member 18 and a mandrel 1B connected to the inside of the annular elastic member 18.

Be provided with card strip 1611 on public head, be provided with the fixed slot 1B3 that matches with card strip 1611 on the terminal surface of dabber 1B, the both ends of fixed slot 1B3 link up, and elastic component still includes fixture block 1B4, and two fixture blocks 1B4 are located the both ends of fixed slot 1B3 respectively, and two fixture blocks 1B4 are used for blocking card strip 1611 in fixed slot 1B3 to realize being connected between two roller components.

Referring to fig. 13 to 17, further, the elastic assembly further includes a link 1B6 and a second spring 1B5, the core shaft 1B includes a first setting hole 1B1 and a second setting hole 1B2, and the second setting hole 1B2 is communicated between the two first setting holes 1B 1;

two fixture blocks 1B4 are slidably disposed in two first disposition holes 1B1 in a one-to-one correspondence manner, two connecting rods 1B6 are slidably disposed in a third disposition hole, two ends of the connecting rod 1B6 are respectively connected with one fixture block 1B4, a second spring 1B5 is disposed at one end of the inner side of the fixture block 1B4, one end of the outer side of the fixture block 1B4 is used for clamping and fixing the fixture strip 1611, and when one fixture block 1B4 is pressed by a male head to be away from the fixture strip 1611, the other fixture block 1B4 can be pressed by the connecting rod 1B6 to be away from the fixture strip 1611.

Specifically, the outer end of the fixture block 1B4 is provided with a first inclined surface 1B41 for extruding the male head of the wheel shaft 161, the inner end of the fixture block 1B4 is provided with a second inclined surface 1B43 and a clearance hole 1B42, a third inclined surface is arranged in the clearance hole 1B42, when one fixture block 1B4 slides inwards, the second inclined surface 1B43 extrudes the connecting rod 1B6, and the connecting rod 1B6 extrudes the third inclined surface in the clearance hole 1B42, so that the other fixture block 1B4 slides inwards, the sliding conduction force is large, and the linkage effect of the two fixture blocks 1B4 is good.

Wherein both ends of the link 1B6 may be provided with a slope or rounded surface corresponding to the second slope 1B43 and the third slope.

In addition, when wheel axle 161 dismouting changes roller assembly, only need to extrude first inclined plane 1B41 with the public head of wheel axle 161, simultaneously through the linkage of connecting rod 1B6, can make two fixture block 1B4 inwards slide simultaneously, and the wheel axle only needs to extrude the entering from one side of female head, can accomplish the unblock to two fixture block 1B4, simultaneously when card strip 1611 corresponds fixed slot 1B3 joint and targets in place, two fixture block 1B4 outwards slide, in order to block card strip 1611 in fixed slot 1B3, thereby realize the connection between two roller assembly.

The PCB laser repairing method and the PCB laser repairing device based on the graph detection determine a first boundary between a first circuit area and a short circuit area based on the first circuit size of a PCB circuit, and determine a second boundary between a second circuit area and the short circuit area based on the second circuit size of the PCB circuit, so that the determined short circuit area is more accurate, and the effective detection and repair of the multi-copper short circuit defect can be realized; the technical problem that the existing PCB laser repairing method and PCB laser repairing equipment cannot effectively detect and repair the multi-copper short circuit defects is effectively solved.

In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.

Claims

1. A PCB laser repairing method based on image detection is arranged on corresponding PCB plate detection equipment and used for repairing multi-copper short-circuit defects on a PCB plate; its characterized in that, PCB panel check out test set includes:

a transmission platform comprising a detection repair bit;

the PCB laser repairing method comprises the following steps:

2. The PCB laser repairing method based on image detection as claimed in claim 1, wherein the step S3 is specifically as follows:

3. The PCB laser repair method based on image detection as claimed in claim 2,

the distance between the first annular judgment line and the PCB line of the short-circuit area is greater than the distance between the other lines of the annular line in the non-first line area and the PCB line of the short-circuit area;

4. The PCB laser repairing method based on image detection as claimed in claim 1, wherein the PCB board detecting device further comprises a blue-violet light detecting light source arranged above the side of the detection repairing position for providing a blue-violet light to be detected, and a blue light filter arranged on the detection camera;

the step S5 specifically includes:

5. The PCB laser repairing method based on image detection as claimed in claim 4, wherein under the irradiation of the blue-violet light detection light source, the metal copper shot by the detection camera is black, and the base material of the PCB board shot by the detection camera is white.

6. The PCB laser repairing method based on image detection of claim 1, wherein the PCB plate detecting device further comprises a reflective convex mirror arranged right above the detection repairing position and used for sending a detection image to a detection camera; the reflecting convex mirror is movably arranged right above the detection and repair position.

7. The PCB laser repairing method based on image detection of claim 1, wherein the PCB plate detecting device further comprises a reflective convex mirror arranged right above the detection repairing position and used for sending a detection image to a detection camera; and a through hole for the repair laser to pass through is formed in the middle of the reflecting convex mirror.

8. A PCB laser repairing device based on image detection is arranged on a corresponding PCB detection device and is used for repairing multi-copper short-circuit defects on a PCB; the laser repairing device is characterized by comprising a rack, a transmission platform arranged on the rack and a multi-copper short-circuit defect detection assembly;

wherein the multi-copper short defect detection assembly comprises:

wherein the image processing module is specifically configured to:

9. The PCB laser repair device based on image detection of claim 8, wherein the multi-copper short circuit defect detection assembly further comprises a reflective convex mirror arranged right above the detection repair position for sending a detection image to a detection camera; the reflecting convex mirror is movably arranged right above the detection repairing position; or

10. The PCB laser repairing device based on image detection as claimed in claim 8, further comprising a roller pressing bar arranged on the board entering position for flattening the PCB board on the board entering position;