CN217638766U

CN217638766U - Welding spot detection assembly and AOI detection equipment

Info

Publication number: CN217638766U
Application number: CN202221129255.4U
Authority: CN
Inventors: 袁国凯; 马力
Original assignee: Shenzhen Liqi Precision Technology Co ltd
Current assignee: Shenzhen Liqi Precision Technology Co ltd
Priority date: 2022-05-12
Filing date: 2022-05-12
Publication date: 2022-10-21
Anticipated expiration: 2032-05-12

Abstract

The utility model discloses a solder joint determine module and AOI check out test set, this solder joint determine module are used for detecting the target solder joint on the base plate, and this solder joint determine module includes: the base is provided with a first guide part; wherein, the first guide part is a guide groove or a guide bulge; the camera is connected in the first guide part in a sliding manner, and a lens of the camera faces the to-be-measured plane of the substrate; in the process that the camera slides along the first guide part and is close to the plane to be measured, the included angle between the shooting direction of the lens and the plane to be measured is gradually reduced. The utility model discloses a solder joint determine module can solve present solder joint detection mode and be difficult to fully discern each characteristic, causes the lower technical problem of testing result accuracy.

Description

Welding spot detection assembly and AOI detection equipment

Technical Field

The utility model belongs to the technical field of the circuit board detects, concretely relates to solder joint determine module and AOI check out test set.

Background

SMT (Surface Mounted Technology) refers to a series of process flows for performing Surface mounting processing based on a circuit board, and detection of soldering points of various Mounted components is an important flow in a production process, and is used for timely finding various welding defects and screening out defective products, so that product quality is guaranteed.

In the SMT industry, solder joint detection comprises two methods, namely 2D detection and 3D detection. The 2D detection adopts a downward-looking camera to obtain welding spot images on the circuit board, and due to the fact that shielding exists in the height direction, many features cannot be obtained, especially the root of a welding pad right below a component. For 3D detection, known manufacturers internationally engaged in 3D measurement such as Koh yong, omron, armi and the like adopt a digital grating with a large inclination angle to match with a projector structure for detection, the compression of the dimension in the height direction is obvious, the measured value has large deviation with the true value, and a series of problems of unclear images at the root parts of bonding pads, difficult identification of rosin joint characteristics and the like exist.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above shortcoming of prior art, the utility model aims to provide a solder joint determine module aims at solving present solder joint detection mode and is difficult to fully discern each characteristic, causes the lower technical problem of testing result accuracy.

The utility model discloses a reach its purpose, the technical scheme who adopts as follows:

a solder joint inspection assembly for inspecting a target solder joint on a substrate, the solder joint inspection assembly comprising:

the base is provided with a first guide part; wherein, the first guide part is a guide groove or a guide bulge;

at least one camera, the camera is connected in the first guide part in a sliding mode, and a lens of the camera faces to a plane to be measured of the substrate;

the camera slides along the first guide part and is close to the in-process of the plane to be measured, the shooting direction of the lens and the included angle between the planes to be measured are gradually reduced.

Furthermore, the number of the cameras is two, and the two cameras are arranged in a V shape.

Furthermore, the welding spot detection assembly further comprises at least one first sliding part, the first guide part is arranged on the first sliding part, and the first sliding part is connected to the base in a sliding manner along a direction parallel to the plane to be detected.

Furthermore, the welding spot detection assembly further comprises a first driving device, the first driving device is connected with the first sliding part, and the first driving device is used for driving the first sliding part to slide on the base along a direction parallel to the plane to be detected.

Further, the welding point detecting assembly further comprises at least one second sliding part, the second sliding part is slidably connected in the first guiding part, and at least one camera is slidably connected to the corresponding second sliding part;

in the process that any one or two cameras linearly slide on the corresponding second sliding parts and approach the plane to be measured, the two cameras approach each other.

Furthermore, the welding spot detection assembly further comprises an RGB light source device, the RGB light source device is connected in the first guide part in a sliding mode, the RGB light source device surrounds the lens, and the light emitting direction of the RGB light source device faces the plane to be detected.

Furthermore, the welding spot detection assembly further comprises two RGB light source devices, the RGB light source devices are slidably connected in the first guide part, the RGB light source devices and the cameras are arranged in one-to-one correspondence, each of the RGB light source devices surrounds the corresponding lens, and the light emitting directions of the RGB light source devices face the plane to be detected;

the base is provided with a partition board, the partition board is positioned between the two RGB light source devices, and the partition board is used for separating the two RGB light source devices.

Correspondingly, the utility model also provides an AOI check out test set, AOI check out test set includes like aforementioned solder joint determine module.

Further, the AOI detection equipment further comprises a hood, a substrate transmission device and a three-coordinate driving device; wherein:

the substrate transmission device and the three-coordinate driving device are arranged in the hood, the substrate transmission device is used for placing the substrate, and the base is connected to the three-coordinate driving device;

the three-coordinate driving device is used for driving the base to move along three coordinate directions relative to the substrate.

Further, the AOI detection equipment further comprises a second driving device, the second driving device is connected to the three-coordinate driving device, and the base is connected to the second driving device;

the second driving device is used for driving the base to rotate by taking the direction vertical to the plane to be measured as an axis.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model provides a solder joint determine module, set up first guide part on the base, make camera slidable connect in first guide part and the camera lens of camera towards the plane of awaiting measuring of base plate, slide and be close to the planar in-process that awaits measuring along first guide part when the camera, the shooting direction of camera lens and the contained angle between the plane of awaiting measuring reduce gradually, so then the regulation at camera inclination has been realized, when the camera slides to the minimum along first guide part, the minimum inclination of camera can reach 32.5, the camera lens can not shelter from this moment, maximize ground is to await measuring on the plane components and parts pin bottom, the target solder joint side and the root of pad root department are shot, the defect that all kinds of rosin joints (if float, the fracture) and local few tin etc. are difficult to judge through conventional detection means is discerned, and because the inclination is less, can restore true direction of height size betterly, thereby the accuracy of target solder joint testing result has been improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic view of a first angle structure of an embodiment of the welding spot detecting assembly of the present invention;

FIG. 2 is a schematic diagram of a second angle structure of an embodiment of the welding spot detecting assembly of the present invention;

FIG. 3 is a schematic view of an exploded structure of an embodiment of the solder joint inspection assembly of the present invention;

fig. 4 is a schematic structural view of the solder joint detection assembly according to an embodiment of the present invention, which includes a light shield;

fig. 5 is a schematic view of an appearance structure of an embodiment of the AOI detection apparatus of the present invention;

fig. 6 is a schematic diagram of an internal structure of an embodiment of the AOI detection apparatus of the present invention.

The reference numbers illustrate:

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if the present invention relates to a directional indication (such as up, down, left, right, front, back, 8230 \8230;, 8230;), the directional indication is only used to explain the relative position relationship between the components in a specific posture, the motion situation, etc., and if the specific posture is changed, the directional indication is changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, if the meaning of "and/or" and/or "appears throughout, the meaning includes three parallel schemes, for example," A and/or B "includes scheme A, or scheme B, or a scheme satisfying both schemes A and B. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Referring to fig. 1 to 6, an embodiment of the present invention provides a solder joint detection assembly for detecting a target solder joint on a substrate 10, where the solder joint detection assembly includes:

the device comprises a base 1, wherein a first guide part 11 is arranged on the base 1; wherein, the first guide part 11 is a guide groove or a guide projection;

at least one camera 2, the camera 2 is slidably connected in the first guiding part 11, and a lens 21 of the camera 2 faces to a plane to be measured of the substrate 10;

in the process that the camera 2 slides along the first guide part 11 and approaches the plane to be measured, the included angle between the shooting direction of the lens 21 and the plane to be measured is gradually reduced.

In this embodiment, the substrate 10 may be a printed circuit board or a flexible circuit board, a plurality of components (such as a packaged Chip, a semiconductor component, a Chip component, etc.) are mounted on a plane to be measured, and the target solder joints are located at the connection positions of the components and the substrate 10.

Illustratively, the base 1 may be a whole base portion having a plurality of components and located behind the camera 2, and the base 1 may specifically refer to a sealing plate as shown in fig. 1 and 2, or may refer to a seat body connected to a surface of the sealing plate as shown in fig. 3, and is not limited herein. The first guide part 11 can be a guide groove directly opened on the surface of the part, or a guide groove formed between two parts arranged at intervals, or a guide projection forming a guide rail; the first guiding portion 11 may be directly disposed on the base 1 or indirectly disposed on the base 1 through a connecting member. Correspondingly, the camera 2 may include a protrusion slidably fitted in the guide groove, or a snap-fit portion slidably fitted on the guide protrusion; the camera 2 may be directly slidably connected to the first guiding portion 11, or may be indirectly slidably connected to the first guiding portion 11 through a connecting member. When there are more than one camera 2 (for example, two cameras), the first guiding portion 11 may still be a continuous one, or may be divided into two cameras so that each camera 2 is connected to the corresponding first guiding portion 11. After the camera 2 slides to a proper position on the first guide portion 11, the camera 2 and the first guide portion 11 may be fixed by a long-strip-shaped waist-shaped hole and a threaded fastener, or the camera 2 may be pushed to a corresponding position by a fastener such as a pin or a set screw, or the camera 2 may be directly driven by a driving device such as a motor to slide on the first guide portion 11, which is not listed here.

The camera 2 may include a video camera and a data processing module at the rear end, and the lens 21 is a lens portion of the video camera, and transmits a captured image of the plane to be detected to the data processing module, so as to perform calculation processing on the image data through a visual algorithm, thereby obtaining a detection result of a target welding spot on the plane to be detected.

In practical applications, taking the substrate 10 laid on a horizontal plane and the upper surface of the substrate 10 as a plane to be measured as an example, the base 1 is located above the substrate 10, so that the plane where the first guide portion 11 is located is vertical relative to the plane to be measured, the direction of the first guide portion 11 (i.e., the sliding track of the camera 2 on the first guide portion 11) can be an arc with a downward concave portion, and the lens 21 points to the inner side of the arc track (i.e., the shooting direction of the lens 21 is downward inclined). Thus, as the camera 2 slides downwards on the first guide part 11, the inclination angle of the camera 2 (i.e. the included angle between the shooting direction of the lens 21 and the plane to be detected) gradually decreases, and when the camera 2 slides to the lowest point, the minimum inclination angle of the camera 2 can reach 32.5 °, at this time, the lens 21 can shoot the images of the bottoms of the pins of the components and the root of the pad of the substrate 10 without shielding, and because the inclination angle is smaller, the real height direction size can be better restored, so that the accuracy of the target solder joint detection result is improved. It is understood that the first guiding portion 11 may have an irregular shape of a combination of a straight line and a curved line.

Therefore, in the solder joint detection assembly provided by the embodiment, the first guide part 11 is arranged on the base 1, the camera 2 is slidably connected in the first guide part 11, the lens 21 of the camera 2 faces the to-be-detected plane of the substrate 10, and when the camera 2 slides along the first guide part 11 and approaches the to-be-detected plane, an included angle between the shooting direction of the lens 21 and the to-be-detected plane is gradually reduced, so that the adjustment of the tilt angle of the camera 2 is realized, when the camera 2 slides to the lowest point along the first guide part 11, the minimum tilt angle of the camera 2 can reach 32.5 °, at this time, the lens 21 can shoot the bottom of a pin of a component on the to-be-detected plane and the side surface and the root of a target solder joint at the root of the solder joint to the maximum extent without shielding, so as to identify defects that various false solders (such as floating and cracking) and local tin are difficult to judge by conventional detection means, and because the tilt angle is small, the real height direction size can be well restored, thereby the accuracy of the target solder joint detection result is improved.

Further, referring to fig. 1 to 3, in an exemplary embodiment, there are two cameras 2, and the two cameras 2 are arranged in a V-shape.

In the present embodiment, the first guiding portions 11 may be disposed in two corresponding cameras 2 and distributed on the left and right sides of the base 1 as shown in fig. 1 and 2, and each camera 2 is slidably fitted in the corresponding first guiding portion 11. Through setting up two cameras 2, can detect two pads on the plane that awaits measuring simultaneously to detection efficiency has been improved.

Further, referring to fig. 1 to 3, in an exemplary embodiment, the welding spot detecting assembly further includes at least one first sliding member 3, the first guiding portion 11 is disposed on the first sliding member 3, and the first sliding member 3 is slidably connected to the base 1 along a direction parallel to the plane to be measured.

In this embodiment, the first slider 3 may be slidably engaged with the base 1 by a rail slider assembly. Wherein, first slider 3 can set up to two corresponding camera 2, and each camera 2 is connected respectively on a first slider 3, so can remove arbitrary camera 2 alone or remove two cameras 2 simultaneously, has increased camera 2's position control degree of freedom, can adjust two camera lens 21 relative distance on the horizontal direction in a flexible way to realized the adjustment of shooting area, adaptable distribution condition that the pad is different on the plane that awaits measuring, improved solder joint detection component's suitability and detection accuracy.

Specifically, referring to fig. 1 to 3, the welding spot detecting assembly further includes a first driving device 4, the first driving device 4 is connected to the first sliding member 3, and the first driving device 4 is configured to drive the first sliding member 3 to slide on the base 1 along a direction parallel to the plane to be measured.

The first driving device 4 can adopt a cylinder driving mode shown in the figure, in the practical application process, linear driving can be achieved through a mode that a motor is matched with a screw rod and the like, the camera 2 can be moved and fixed at any time by arranging the first driving device 4, the first sliding part 3 does not need to be moved in a mode of manually disassembling and assembling, and the adjustment convenience is improved.

Further, referring to fig. 1 to 3, in an exemplary embodiment, the welding point detecting assembly further includes at least one second slider 5, the second slider 5 is slidably connected in the first guide 11, and the at least one camera 2 is slidably connected to the corresponding second slider 5;

in the process that any one or two cameras 2 linearly slide on the corresponding second sliding parts 5 and approach the plane to be measured, the two cameras 2 approach each other.

In this embodiment, the cameras 2 may be slidably engaged with the second sliding member 5 through the guide rail sliding member assemblies, wherein the second sliding member 5 may be provided with two corresponding cameras 2, each camera 2 is connected to one second sliding member 5, so that any one of the cameras 2 may be moved independently or two cameras 2 may be moved simultaneously, the degree of freedom of position adjustment of the cameras 2 is increased, and the relative distance of the two lenses 21 in the horizontal direction may be adjusted while the relative distance between the lenses 21 and the plane to be measured is adjusted, thereby achieving adjustment of the shooting area, adapting to different distribution conditions of the pads on the plane to be measured, and further improving the applicability and detection accuracy of the welding point detection assembly.

It will be understood that the first slide 3 and the second slide 5 can be provided simultaneously, in particular the first slide 3 being fitted slidingly on the base 1 in a direction parallel to the plane to be measured, the second slide 5 being fitted slidingly in the first guides 11 on the first slide 3 and the camera 2 being fitted slidingly on the second slide 5.

Further, referring to fig. 1 to 3, in an exemplary embodiment, the welding spot detecting assembly further includes an RGB light source device 6, the RGB light source device 6 is slidably connected in the first guiding portion 11, the RGB light source device 6 surrounds the lens 21, and a light emitting direction of the RGB light source device 6 faces the plane to be measured.

In this embodiment, the RGB light source device 6 may be intermittently turned on (i.e., stroboscopic) at each detection node to emit red, green, and blue lights that can illuminate the target welding spot region, so that the display definition of the shot image of the target welding spot region can be improved, the defect of the target welding spot can be easily identified, and the detection accuracy can be improved. Specifically, the light emitting portion of the RGB light source device 6 may be in a ring shape as shown and surround the lens 21, and the RGB light source device 6 may be slidably fitted on the second sliding member 5 independently of the camera 2, so that the relative positions of the RGB light source device 6 and the lens 21 may be adjusted to facilitate adjustment of the illumination condition.

When the RGB light source device 6 is disposed, as shown in fig. 4, a light shielding cover 13 may be covered on the base 1, the light shielding cover 13 may cover all components in the solder joint detection assembly, a light outlet is disposed at a lower portion of the light shielding cover 13, the light shielding cover 13 may play a role of shielding three color lights emitted by the RGB light source device 6, so that the three color lights emitted by the RGB light source device 6 can only be projected onto a plane to be measured below through the light outlet.

Further, referring to fig. 1 to 3, in an exemplary embodiment, the welding spot detecting assembly further includes two RGB light source devices 6, the RGB light source devices 6 are slidably connected in the first guiding portion 11, the RGB light source devices 6 are disposed in one-to-one correspondence with the cameras 2, each RGB light source device 6 surrounds a corresponding lens 21, and the light emitting direction of the RGB light source device 6 faces the plane to be detected;

a partition plate 12 is arranged on the base 1, the partition plate 12 is located between the two RGB light source devices 6, and the partition plate 12 is used for separating the two RGB light source devices 6.

In the present embodiment, for the detailed description of the RGB light source device 6, reference is made to the previous embodiment, and details are not repeated herein. The partition 12 may be used to prevent the left and right RGB light source devices 6 from interfering with each other.

Correspondingly, referring to fig. 5 and 6, an embodiment of the present invention further provides an AOI detection apparatus, which includes the solder joint detection assembly in any of the above embodiments.

In the present embodiment, the AOI inspection apparatus, i.e., the optical automatic inspection apparatus, is an inspection tool and a process quality control tool used in the electronic manufacturing industry for ensuring product quality. With regard to the specific structure of the solder joint inspection assembly, reference is made to the above-described embodiments. Since the AOI detection device adopts all technical solutions of all the embodiments, at least all beneficial effects brought by the technical solutions of the embodiments are achieved, and details are not repeated herein.

Further, referring to fig. 1 to 6, in an exemplary embodiment, the AOI inspection apparatus further includes a housing 7, a substrate transfer device 71, and a three-coordinate driving device 8; wherein:

the substrate transmission device 71 and the three-coordinate driving device 8 are arranged in the hood 7, the substrate transmission device 71 is used for placing the substrate 10, and the base 1 is connected to the three-coordinate driving device 8;

the three-coordinate driving device 8 is used for driving the base 1 to move along three coordinate directions relative to the substrate 10.

Specifically, referring to fig. 1 to 6, the aoi inspection apparatus further includes a second driving device 9, the second driving device 9 is connected to the three-coordinate driving device 8, and the base 1 is connected to the second driving device 9;

the second driving device 9 is used for driving the base 1 to rotate by taking the direction vertical to the plane to be measured as an axis.

In this embodiment, the three-coordinate driving device 8 includes three guide rails arranged along the rectangular coordinate direction and a motor, a lead screw, a slider, etc. matched with the three guide rails, and the second driving device 9 may be a rotating motor. Under the driving of the three-coordinate driving device 8 and the second driving device 9, the welding spot detection assembly can integrally and linearly move and rotate above the substrate 10 according to a preset track, so that the welding spot detection assembly can sequentially move to each target welding spot to perform detection work, and under the condition that the welding spot detection assembly comprises two cameras 2, if an included angle exists between a connecting line between two welding spots on a plane to be detected and the standard coordinate direction, the welding spot detection assembly can also adapt to the distribution condition of the welding spots by rotating the welding spot detection assembly along the vertical axial direction. Through the structure, the detection applicability, the detection efficiency and the detection accuracy of the AOI detection equipment can be improved.

It should be noted that the present invention discloses a solder joint detection assembly and AOI detection apparatus, other contents of which can be referred to in the prior art and are not described herein again.

Above only be the utility model discloses an optional embodiment to not consequently restrict the utility model discloses a patent range, all be in the utility model discloses a under the design, utilize the equivalent structure transform of doing of the contents of description and the attached drawing, or direct/indirect application all is included in other relevant technical field the utility model discloses a patent protection within range.

Claims

1. A solder joint detection assembly for detecting a target solder joint on a substrate, the solder joint detection assembly comprising:

2. The solder joint inspection assembly of claim 1, wherein there are two cameras, and the two cameras are arranged in a V-shape.

3. The solder joint inspection assembly of claim 2, further comprising at least one first slider, wherein the first guide is disposed on the first slider, and the first slider is slidably coupled to the base along a direction parallel to the plane to be inspected.

4. The solder joint inspection assembly of claim 3, further comprising a first driving device coupled to the first sliding member, wherein the first driving device is configured to drive the first sliding member to slide on the base along a direction parallel to the plane to be inspected.

5. The solder joint inspection assembly of claim 2, further comprising at least one second slide slidably coupled in the first guide, at least one of the cameras slidably coupled to the corresponding second slide;

6. The solder joint inspection assembly of claim 1, further comprising an RGB light source device slidably connected to the first guide portion, the RGB light source device surrounding the lens, and the light emitting direction of the RGB light source device facing the plane to be inspected.

7. The solder joint inspection assembly of claim 2, further comprising two RGB light source devices slidably connected to the first guiding portion, wherein the RGB light source devices are disposed corresponding to the cameras one to one, each of the RGB light source devices surrounds the corresponding lens, and light emitting directions of the RGB light source devices face the plane to be inspected;

8. An AOI inspection apparatus, comprising the solder joint inspection assembly of any of claims 1 to 7.

9. The AOI detection apparatus according to claim 8, further comprising a hood, a substrate transport device, and a three coordinate drive device; wherein:

10. The AOI inspection apparatus of claim 9, further comprising a second drive device, the second drive device coupled to the three coordinate drive device, the base coupled to the second drive device;