CN115754670B - Repairing and rechecking method and device for short circuit defect of PCB - Google Patents

Abstract

The invention discloses a repairing and reinspection method and equipment for short circuit defects of a PCB (printed Circuit Board), wherein the repairing and reinspection equipment comprises a high-definition imaging device and a repairing device, the high-definition imaging device and the repairing device are relatively static, and the repairing device comprises a laser repairing assembly and an optical imaging assembly; the repairing and rechecking method realizes the accurate positioning of the detection position and the repairing position in the repairing and rechecking equipment in a mode of image comparison, realizes the accurate repairing of the repairing device, greatly improves the repairing accuracy and the repairing speed of the short circuit defect of the PCB, and has simple method and strong operability. The repairing and reinspection equipment realizes the high integration of the existing automatic repairing machine and the existing automatic laser repairing machine through the double-station imaging system, thereby not only reducing the volume of the repairing and reinspection equipment, but also reducing the production and use cost of the repairing and reinspection equipment.

Description

Repairing and rechecking method and device for short circuit defect of PCB

Technical Field

The invention relates to the field of PCB circuit board repair, in particular to a repair and rechecking method and device for a short circuit defect of a PCB circuit board.

Background

The Printed Circuit Board (PCB) is a carrier for electric interconnection of electronic components and mainly comprises an insulating bottom plate, connecting wires and a bonding pad, has the dual functions of a conductive line and the insulating bottom plate, can replace complex wiring to realize electric connection of the components in the circuit, simplify the assembly, the welding and other works, greatly improve the integration level of equipment and reduce the volume of the equipment.

The manufacturing process of the PCB circuit board comprises main processes of exposure, development, electroplating, etching and the like, and the produced PCB circuit board may have defects of short circuit, open circuit and the like due to the yield problem of each manufacturing process. In the production process of the PCB circuit board, the defect detection is mainly performed by an Automatic Optical Inspection (AOI) device, and the detection process of the automatic optical inspection device generally includes the following steps: the method comprises the steps of automatically scanning a PCB product through a camera and collecting images, comparing the images of the PCB product to be detected with image parameters of qualified products in a database, checking out defects of the PCB product to be detected through image processing, and displaying or marking the defects through a display or automatic marking for inspection personnel to review and repair by maintenance personnel. The defective PCB circuit board is repaired and reused, so that the production cost of enterprises can be effectively saved, and the yield of the PCB circuit board is improved.

At present, when the short circuit defect of the PCB is required to be repaired, the defect position of the PCB is generally read through a repairing device, then the repairing device is used for repairing, and the PCB is required to be rechecked after the repairing, so that the defect of the PCB is ensured to be effectively repaired.

The existing method for rechecking the short-circuit repaired PCB mainly comprises the following two steps:

firstly, manually rechecking; the existing method for realizing manual rechecking mainly comprises the following two methods: firstly, imaging by a repairing device and then performing manual rechecking; because of the need for repair procedures, existing repair devices are typically equipped with corresponding optical imaging systems to aid in the proper performance of the repair procedure. However, since the optical imaging system of the existing repairing device is generally configured with an optical filter for preventing the laser from damaging the imaging chip, the optical filter can cause color distortion of the image, and false detection is very easy to be caused when the image obtained by using the optical imaging system of the repairing device is subjected to manual re-detection. Furthermore, due to the requirement of volume and laser sharing, the optical imaging system of the conventional repairing device is generally only configured with a fixed visual magnification, and when the optical imaging system of the repairing device is used for rechecking, the defects with various sizes cannot be flexibly and effectively rechecked by adjusting the visual magnification. Secondly, imaging by independently arranged rechecking equipment and then performing manual rechecking; however, if the manual rechecking is performed on a separate rechecking device, the procedures of secondary transfer, fixing and the like of the PCB circuit board are involved, which is time-consuming and labor-consuming.

Secondly, rechecking by automatic optical detection equipment; as the production defects of the PCB are mainly detected by the automatic optical detection equipment, as shown in the 'circuit board repairing method and system' of the Chinese patent with the publication number of CN109936927A, the defects of the PCB can be detected again by the automatic optical detection equipment after repairing, but if the two steps of defect repairing and rechecking of the PCB are respectively completed by the two sets of equipment, the equipment cost of enterprises is easily increased, the PCB needs to go back and forth between a repairing device and the automatic optical detection equipment, and the production efficiency of the PCB is also easily reduced greatly.

Therefore, there is a need for a short circuit repair and rechecking method and apparatus that can not only improve the production efficiency of the PCB circuit board, but also ensure the repair accuracy of the PCB circuit board, so as to overcome the shortcomings of the prior art.

Disclosure of Invention

The invention aims to provide a repairing and rechecking method for the short circuit defect of a PCB (printed Circuit Board), which not only can improve the production efficiency of the PCB, but also can ensure the repairing accuracy of the PCB, and has the advantages of simplicity and strong operability.

The invention further aims to provide repair and recheck equipment for the short-circuit defects of the PCB, which integrates the high-definition imaging device and the repair device, and is matched with a repair and recheck method to enable the PCB to rapidly and accurately move between the high-definition imaging device and the repair device, so that the repair efficiency and the accuracy of the repair and recheck equipment for the short-circuit defects of the PCB are greatly improved, and the defects in the prior art are overcome.

To achieve the purpose, the invention adopts the following technical scheme:

the repairing and rechecking method is suitable for repairing and rechecking equipment, wherein the repairing and rechecking equipment comprises a high-definition imaging device and a repairing device, the high-definition imaging device and the repairing device are relatively static, and the repairing device comprises a laser repairing component and an optical imaging component;

the repairing and rechecking method comprises the following steps:

step S1, obtaining defect information of a PCB to be repaired and current position information of repair reinspection equipment, and obtaining repair sequence and moving path of each defect area in the PCB to be repaired according to the defect information and the position information;

step S2, according to the moving path, enabling the high-definition imaging device to correspond to a defect area in the current repairing sequence, and acquiring and storing a first high-definition detection image of the defect area by the high-definition imaging device;

s3, comparing the first high-definition detection image with a pre-stored qualified image of a standard PCB, determining the defect type of the defect area and judging whether the defect type needs to be repaired or not;

if not, according to the moving path, enabling the high-definition imaging device to correspond to the defect area of the next repairing sequence, and repeating the step S2;

If so, the patching device generates patching information according to the first high-definition detection image and the qualified image;

s4, according to a flexible acceleration and deceleration control algorithm, enabling a repairing device to correspond to the defect area, acquiring a gray level positioning image of the defect area by an optical imaging assembly, comparing the first high-definition detection image with the gray level positioning image, enabling the optical imaging assembly to be aligned with the defect area, and repairing the defect area by the repairing device according to the repairing information;

step S5, according to a flexible acceleration and deceleration control algorithm, enabling the high-definition imaging device to correspond to the repaired defect area, obtaining a second high-definition detection image of the repaired defect area by the high-definition imaging device, comparing the second high-definition detection image with the first high-definition detection image, and enabling the high-definition imaging device to be aligned with the repaired defect area;

s6, comparing the second high-definition detection image with the qualified image, determining the defect type of the repaired defect area, and judging whether the defect type needs to be repaired again or not;

if not, according to the moving path, enabling the high-definition imaging device to correspond to the defect area of the next repairing sequence, and repeating the step S2;

If yes, the high-definition imaging device covers the first high-definition detection image into the second high-definition detection image, the patching device generates patching information according to the second high-definition detection image and the qualified image, and the step S4 is repeated.

Preferably, the first high-definition detection image, the qualified image and the second high-definition detection image all comprise a color two-dimensional image and a three-dimensional reconstruction image, and the gray scale positioning image is a gray scale two-dimensional image;

in step S3, comparing the color two-dimensional image of the first high-definition detection image with the color two-dimensional image of the pre-stored qualified image of the standard PCB, determining the defect type of the defect area, and judging whether the defect type needs to be repaired;

the patching device generates patching information according to the three-dimensional reconstruction image of the first high-definition detection image and the three-dimensional reconstruction image of the qualified image;

in step S4, comparing the color two-dimensional image of the first high-definition detection image with the gray scale positioning image, so as to align the optical imaging component with the defect area;

in step S5, comparing the color two-dimensional image of the second high-definition detection image with the color two-dimensional image of the first high-definition detection image, so that the high-definition imaging device is aligned with the repaired defect area;

In step S6, comparing the color two-dimensional image of the second high-definition detection image with the color two-dimensional image of the qualified image, and judging whether the PCB circuit board needs to be repaired again;

and the patching device generates patching information according to the three-dimensional reconstruction image of the second high-definition detection image and the three-dimensional reconstruction image of the qualified image.

Preferably, in step S3 and step S6, the defect types include repairable defects, unrerepairable defects and defects that do not need to be repaired;

when the defect type is a repairable defect, the defect type needs to be repaired;

when the defect type is a non-repairable defect or does not require repair of a defect, the defect type does not require repair.

Preferably, in step S3 and step S6, the repair information includes a laser parameter and a scanning parameter of a repair laser beam emitted by the laser repair assembly;

wherein the laser parameters comprise the power, focal length and spot diameter focused on the defect area of the repair laser beam, and the scanning parameters comprise the scanning range and the scanning path of the repair laser beam.

Preferably, in step S2, the high-definition imaging device acquires and stores a first high-definition detection image of the required visual magnification of the defect area;

In step S5, the high-definition imaging device acquires a second high-definition detection image of the repaired defect region, and the visual magnification of the first high-definition detection image is the same as that of the second high-definition detection image.

Preferably, in step S1, the specific steps for obtaining defect information of the PCB to be repaired are as follows:

the automatic optical detection equipment detects the defects of the PCB and obtains the defect information of the PCB to be repaired,

the repair rechecking device receives the defect information of the PCB to be repaired from the automatic optical detection device;

or alternatively, the first and second heat exchangers may be,

and the high-definition imaging device performs linear scanning on the PCB to be repaired to obtain defect information of the PCB to be repaired.

Preferably, in step S1, the defect information includes the number of defect areas to be repaired in the PCB to be repaired and the relative positions of the defect areas on the PCB to be repaired;

the moving path comprises a linear moving path where the shortest distance between the current position information of the repairing and rechecking equipment and the defect area in the current repairing sequence is located, and a linear moving path where the shortest distance between the defect area in the current repairing sequence and the defect area in the next repairing sequence is located.

Preferably, in step S3, a two-channel feature comparison model based on depth separable convolution is used to compare the color two-dimensional image of the first high-definition detection image with the color two-dimensional image of the pre-stored qualified image of the standard PCB, determine the defect type of the defect area, and determine whether the defect type needs to be repaired;

in step S6, the color two-dimensional image of the second high-definition detection image is compared with the color two-dimensional image of the qualified image by using a dual-channel feature comparison model based on depth separable convolution, and whether the PCB circuit board needs to be repaired again is judged.

The repairing and rechecking equipment for the short circuit defects of the PCB comprises the high-definition imaging device, the repairing device and a moving platform, wherein the high-definition imaging device and the repairing device are relatively static, and the moving platform is used for moving the high-definition imaging device and the repairing device or is used for moving the PCB;

the repairing device comprises the laser repairing component and the optical imaging component, wherein the optical imaging component comprises a repairing camera, a repairing imaging lens, an optical filter, a dichroic mirror, a repairing objective lens and a repairing light source;

The laser repair assembly is arranged close to the dichroic mirror, the laser repair assembly is used for emitting repair laser beams to the dichroic mirror, the dichroic mirror is used for reflecting the repair laser beams to the repair objective lens, and the repair objective lens is used for focusing the repair laser beams.

Preferably, the high-definition imaging device comprises a high-definition imaging assembly and a light source assembly;

the high-definition imaging assembly comprises a high-definition camera, a high-definition imaging lens and a high-definition objective lens;

the light source assembly comprises a coaxial light source, a reflecting mirror, a light splitting sheet and a paraxial light source, wherein the coaxial light source, the reflecting mirror and the light splitting sheet are sequentially arranged, and the paraxial light source is arranged close to the high-definition objective; the light splitting sheet is positioned between the high-definition imaging lens and the high-definition objective lens, and the high-definition camera, the high-definition imaging lens, the light splitting sheet and the high-definition objective lens are sequentially arranged on the same vertical line from top to bottom;

the coaxial light source is used for emitting illumination light beams to the reflecting mirror, the reflecting mirror is used for reflecting the illumination light beams to the light splitting sheet, the light splitting sheet is used for partially reflecting the illumination light beams to the high-definition objective, and the high-definition objective is used for focusing the illumination light beams.

The technical scheme provided by the embodiment of the application can comprise the following beneficial effects:

1. through the mode of image comparison, the accurate positioning of the detection position and the repair position in the repair rechecking device during switching is realized, meanwhile, the accurate repair of the repair device is realized, the repair accuracy and the repair rate of the short circuit defect of the PCB are greatly improved, and the method is simple and has strong operability.

2. The high integration of the existing automatic overhauling machine and the existing automatic laser repairing machine is realized through the double-station imaging system, so that the size of the repairing and reinspecting equipment is reduced, and the production and use cost of the repairing and reinspecting equipment is reduced.

3. The first high-definition detection image obtained through the high-definition imaging device is compared with a pre-stored qualified image of a standard PCB, the defect type is judged through the characteristic difference of the two images, and whether the PCB is repaired or not is judged according to the defect type, so that on one hand, the repair work for the defects which are not required to be repaired can be effectively omitted, and on the other hand, the error repair for the defects which are not required to be repaired can be effectively prevented.

4. In the process of aligning the repairing device with the defect area, the flexible acceleration and deceleration control algorithm is firstly used for enabling the repairing device to correspond to the defect area, namely the repairing device is enabled to be close to the defect area, and then the first high-definition detection image and the gray level positioning image are used for comparing, so that the optical imaging assembly is aligned with the defect area, and the optical imaging assembly can be aligned with the defect area rapidly, accurately and stably.

Drawings

Fig. 1 is a schematic flow chart of a method for repairing and rechecking short circuit defects of a PCB circuit board according to the present invention.

Fig. 2 is a color two-dimensional image (after a color removal process) before repairing in an embodiment of a method for repairing and rechecking a short circuit defect of a PCB circuit board according to the present invention.

Fig. 3 is a gray-scale two-dimensional image before repairing in an embodiment of a repairing and rechecking method for a short-circuit defect of a PCB circuit board according to the present invention.

Fig. 4 is a two-dimensional image of repaired gray scale in one embodiment of a method for repairing and rechecking short circuit defects of a PCB circuit board according to the present invention.

Fig. 5 is a color two-dimensional image (after the color removal process) after repairing in an embodiment of a method for repairing and rechecking a short circuit defect of a PCB circuit board according to the present invention.

Fig. 6 is a schematic structural diagram of a repairing and rechecking device for short circuit defects of a PCB circuit board according to the present invention.

Wherein: the high-definition imaging device 1, the high-definition imaging assembly 11, the high-definition camera 111, the high-definition imaging lens 112, the high-definition objective 113, the light source assembly 12, the coaxial light source 121, the reflecting mirror 122, the light splitting sheet 123 and the paraxial light source 124;

repair device 2, laser repair assembly 21, optical imaging assembly 22, repair camera 221, repair imaging lens 222, optical filter 223, dichroic mirror 224, repair objective 225, repair light source 226;

A mobile platform 3 and a PCB circuit board 4.

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.

The technical scheme provides a repairing and rechecking method for short-circuit defects of a PCB (printed Circuit Board), which is suitable for repairing and rechecking equipment, wherein the repairing and rechecking equipment comprises a high-definition imaging device 1 and a repairing device 2, the high-definition imaging device 1 and the repairing device 2 are relatively static, and the repairing device 2 comprises a laser repairing component 21 and an optical imaging component 22;

the repairing and rechecking method comprises the following steps:

step S1, obtaining defect information of a PCB to be repaired and current position information of repair reinspection equipment, and obtaining repair sequence and moving path of each defect area in the PCB to be repaired according to the defect information and the position information;

step S2, according to the moving path, enabling the high-definition imaging device 1 to correspond to a defect area in the current repairing sequence, and acquiring and storing a first high-definition detection image of the defect area by the high-definition imaging device 1;

S3, comparing the first high-definition detection image with a pre-stored qualified image of a standard PCB, determining the defect type of the defect area and judging whether the defect type needs to be repaired or not;

if not, according to the moving path, making the high-definition imaging device 1 correspond to the defect area of the next repairing sequence, and repeating the step S2;

if so, the patching device 2 generates patching information according to the first high-definition detection image and the qualified image;

step S4, according to a flexible acceleration and deceleration control algorithm, enabling the repairing device 2 to correspond to the defect area, enabling the optical imaging assembly 22 to acquire a gray level positioning image of the defect area, comparing the first high-definition detection image with the gray level positioning image, enabling the optical imaging assembly 22 to be aligned with the defect area, and enabling the repairing device 2 to repair the defect area according to the repairing information;

step S5, according to a flexible acceleration and deceleration control algorithm, enabling the high-definition imaging device 1 to correspond to the repaired defect area, enabling the high-definition imaging device 1 to acquire a second high-definition detection image of the repaired defect area, and comparing the second high-definition detection image with the first high-definition detection image to enable the high-definition imaging device 1 to be aligned with the repaired defect area;

S6, comparing the second high-definition detection image with the qualified image, determining the defect type of the repaired defect area, and judging whether the defect type needs to be repaired again or not;

if not, according to the moving path, making the high-definition imaging device 1 correspond to the defect area of the next repairing sequence, and repeating the step S2;

if yes, the high-definition imaging device 1 covers the first high-definition detection image as the second high-definition detection image, the patching device 2 generates patching information according to the second high-definition detection image and the qualified image, and the step S4 is repeated.

In order to improve the production efficiency of a PCB circuit board and ensure the repair accuracy of the PCB circuit board, the technical scheme provides a repair and rechecking method for the short circuit defect of the PCB circuit board, which is suitable for repair and rechecking equipment for organically combining a high-definition imaging device 1 and a repair device 2, realizes the high integration of the existing automatic repair machine and the existing automatic laser repair machine through a double-station imaging system, reduces the volume of the repair and rechecking equipment, and reduces the production and use cost of the repair and rechecking equipment.

When the method is used for carrying out laser repair on the PCB circuit board containing the short-circuit defects, firstly, the first high-definition detection image obtained by the high-definition imaging device 1 is compared with the pre-stored qualified image of the standard PCB circuit board, the defect type is judged through the characteristic difference of the two images, and whether the PCB circuit board is repaired or not is judged according to the defect type, so that on one hand, the repair work of the defects (such as paint, dirt and the like) which are not required to be repaired (such as the PCB circuit board is stuck with the paint) can be effectively omitted, and on the other hand, the error repair of the defects which are not required to be repaired (such as the circuit breaking of the PCB circuit board) can be effectively prevented. After the defect area is determined to be repaired, repair information is generated, and the repair device 2 is aligned with the defect area by combining a flexible acceleration and deceleration control algorithm with image matching, so that the repair device 2 performs laser scanning on the defect area according to the repair information, and the purpose of ablation repair is achieved.

Specifically, since the repair rechecking device suitable for the method includes the high-definition imaging device 1 and the repair device 2, in the process of aligning the repair device 2 with the defect area, the flexible acceleration and deceleration control algorithm is firstly used in the scheme to enable the repair device 2 to correspond to the defect area, namely the repair device 2 and the defect area are mutually close, and then the first high-definition detection image and the gray level positioning image are used for comparison to enable the optical imaging assembly 22 to align with the defect area, so that the optical imaging assembly 22 can be aligned with the defect area quickly, accurately and stably. It should be noted that, the core of the flexible acceleration and deceleration control algorithm used in the scheme is one of the conventional motion track control key technologies in the field of digital control machinery, which is to pursue the optimal fusion of efficiency and flexibility, so that the motion efficiency can be improved on the premise of ensuring the motion precision of the system, and meanwhile, the problems of impact, step-out, overtravel, oscillation and the like generated in the motion process are reduced as much as possible, so that the purpose of rapid, accurate and stable movement is achieved. The object to be moved according to the flexible acceleration/deceleration control algorithm may be a repair inspection device or a PCB, and is not limited thereto, as long as the moved repair device 2 is brought into correspondence with (i.e., close to) the defective area.

More specifically, in order to further improve the positioning accuracy of the repairing device 2 and the defective area, so as to facilitate the repairing accuracy of the repairing device 2 to the PCB circuit board, the method further compares the first high-definition detected image before and after the movement with the gray level positioning image, and corrects and aligns the optical imaging assembly 22 and the defective area through the existing image coupling algorithm. In this scheme, the gray scale positioning image obtained by the optical imaging assembly 22 is only used for aligning the optical imaging assembly 22 with the defect area, so that the requirements on the color, resolution and the like of the gray scale positioning image are not high, and the correction of the positioning position can be realized by the existing image coupling algorithm only by obtaining the circuit texture and trend of the PCB circuit board from the gray scale positioning image.

After repair is finished, the method combines a flexible acceleration and deceleration control algorithm with image matching to align the high-definition imaging device with the repaired defect area, so that the first high-definition detection image and the second high-definition detection image before and after repair are effectively ensured to be overlapped, then the second high-definition detection image is compared with the qualified image, the defect type of the repaired defect area is determined, whether the defect type needs to be repaired again is judged, and until all short-circuit defects in the PCB to be repaired are completely repaired. According to the scheme, through the mode of image comparison, accurate positioning of the detection position (namely the position of the high-definition imaging device 1) and the repair position (namely the position of the repair device 2) in the repair rechecking equipment during switching is realized, meanwhile, accurate repair of the repair device 2 is realized, the repair accuracy and repair rate of the short-circuit defects of the PCB are greatly improved, and the method is simple and high in operability.

It should be noted that, in step S1 of the present embodiment, the defect information of the PCB to be repaired includes, but is not limited to, the number of defect areas to be repaired in the PCB to be repaired, and the relative positions of the defect areas on the PCB to be repaired. Further, the repair order of each defective area in the PCB to be repaired may be a repair order determined by a technician, or may be a repair order in which the repair and review device arranges from near to far according to a distance between each defective area and a current position of the repair and review device, or may be a repair order in which the repair and review device uses a defective area closest to the current position of the repair and review device as a first repair order, then uses a next defective area closest to the defective area of the first repair order as a second repair order, and uses a next defective area closest to the defective area of the second repair order as a third repair order … …, and so on as to be a repair order of each defective area in the PCB to be repaired. Further, the moving path of each defect area in the PCB to be repaired may be a straight moving path of the shortest distance between the defect areas between two adjacent repair orders (i.e. the two sharp angles in the right triangle with the line segment x and y as the right angle sides and the defect area between two adjacent repair orders as the right angle triangle with the line segment z as the right angle side, then the straight moving path of the shortest distance is the line segment z), or a grid moving path of the shortest distance between the defect areas between two adjacent repair orders (i.e. the two sharp angles in the right triangle with the line segment x and y as the right angle side and the defect area between two adjacent repair orders as the two sharp angles in the right angle triangle with the line segment z as the right angle side).

In step S2 of the present embodiment, the first high-definition detected image may be a two-dimensional high-definition photograph, a color two-dimensional high-definition photograph, and/or a high-definition three-dimensional reconstructed image of the defect area, which are not limited herein, so long as the repair review method can determine the defect type of the defect area through the existing algorithm and can generate repair information when the first high-definition detected image is compared with the qualified image. And the second high-definition detection image in the step S5 is the same.

In step S3 of the present embodiment, the step of comparing the corresponding images may be performed by manual identification, or may be performed by an existing feature comparison model, which is not limited herein; the defect types of the defect area in the scheme mainly comprise two main types, namely a repair type, such as a short-circuit defect, and an unrepaired type, such as a broken-circuit defect or paint, stain and the like. The defect type determination step in step S6 is the same; in step S6, if the PCB is determined to be repaired again after the recheck of the high-definition imaging device 1, the first high-definition detection image is covered with the second high-definition detection image, and the second high-definition detection image is used as the pre-repair image in the re-repair process, so as to be beneficial to more accurately determining whether the PCB is actually repaired.

In step S4 of the present embodiment, the gray scale positioning image may be a gray scale image of the defect area, and since the gray scale positioning image obtained by the optical imaging assembly 22 in the present embodiment is only used for aligning the optical imaging assembly 22 with the defect area, the requirements on color and resolution of the gray scale positioning image are not high, and the correction of the positioning position can be achieved by the existing image coupling algorithm only by obtaining the circuit texture and trend of the PCB circuit board from the gray scale positioning image.

Further stated, the first high definition inspection image, the qualified image and the second high definition inspection image each comprise a color two-dimensional image and a three-dimensional reconstructed image, and the gray scale positioning image is a gray scale two-dimensional image;

in step S3, comparing the color two-dimensional image of the first high-definition detection image with the color two-dimensional image of the pre-stored qualified image of the standard PCB, determining the defect type of the defect area, and judging whether the defect type needs to be repaired;

the patching device 2 generates patching information according to the three-dimensional reconstruction image of the first high-definition detection image and the three-dimensional reconstruction image of the qualified image;

in step S4, comparing the color two-dimensional image of the first high-definition detection image with the gray scale positioning image to align the optical imaging assembly 22 with the defect region;

In step S5, comparing the color two-dimensional image of the second high-definition detection image with the color two-dimensional image of the first high-definition detection image, so that the high-definition imaging device 1 is aligned with the repaired defect area;

in step S6, comparing the color two-dimensional image of the second high-definition detection image with the color two-dimensional image of the qualified image, and judging whether the PCB circuit board needs to be repaired again;

the patching device 2 generates patching information according to the three-dimensional reconstruction image of the second high-definition detection image and the three-dimensional reconstruction image of the qualified image.

Because the scheme realizes the accurate positioning of the detection position and the repair position switching in the repair rechecking device in an image comparison mode, and simultaneously realizes the accurate repair of the repair device 2, the scheme also optimizes the image characteristics obtained in the repair rechecking method in order to further improve the accuracy of mobile positioning and the accuracy of repair.

In a preferred embodiment of the present disclosure, the first high-definition detection image, the qualified image, and the second high-definition detection image each include a color two-dimensional image and a three-dimensional reconstructed image, and the gray-scale positioning image is a gray-scale two-dimensional image.

For example, in one embodiment of the present disclosure, in step S2, the color two-dimensional image in the first high-definition detected image of the defect area in the current repair sequence acquired by the high-definition imaging device 1 is as shown in fig. 2 (after the color removal process), and besides the normal line and the open hole, the defect area has both ink contamination and short circuit, and the defect type of the defect area can be accurately determined by the color two-dimensional image. After the movement, the gray level two-dimensional image of the defect area obtained by the optical imaging assembly 22 in step S4 is shown in fig. 3, it can be seen that only the short circuit condition of the PCB circuit board is clearly displayed in fig. 3, the defect type of ink pollution is hidden, and meanwhile, the gray level map also makes the defect size and the outline information of the defect area clearer, so that the position correction by the existing image coupling algorithm is more convenient. As shown in fig. 4, the optical imaging assembly 22 is used to take an in-situ gray level two-dimensional image of the repaired defect area, and although it can be seen that the short circuit defect of the PCB is removed, it is difficult to clearly determine the repair quality of the PCB. After the movement again, the color two-dimensional image in the first high-definition detected image of the repaired defect area obtained by the high-definition imaging device 1 in step S5 is as shown in fig. 5 (after the color removal processing), it can be clearly seen that the short-circuit part is completely broken from the color two-dimensional image, and the broken part has no circuit residue, and the repair of the short-circuit defect of the PCB circuit board is completed.

Therefore, the method and the device utilize the color two-dimensional image to detect and recheck the PCB, are favorable for accurately determining the defect type before repairing, and can effectively improve the recheck quality of the repaired PCB. And the correction alignment after the movement of the repairing and rechecking equipment is carried out by combining the gray level two-dimensional image with the existing image coupling algorithm, so that the positioning accuracy is improved on the premise of saving the equipment cost.

Moreover, because the short circuit defects of different PCB circuit boards are different in the depth degree of the defect area, in order to further improve the repair quality and avoid the occurrence of the conditions that the PCB circuit boards are burnt through and the like, the scheme generates repair information based on the three-dimensional reconstruction images in the first high-definition detection image and the second high-definition detection image, and the depth degree of the defect area can be obtained through the three-dimensional reconstruction images so as to adjust the repair information according to the actual defects, so that the repaired PCB circuit boards are overlapped with the standard PCB circuit boards in height.

Further, in step S3 and step S6, the defect types include repairable defects, unrerepairable defects, and non-repairable defects;

when the defect type is a repairable defect, the defect type needs to be repaired;

When the defect type is a non-repairable defect or does not require repair of a defect, the defect type does not require repair.

In another preferred embodiment of the present disclosure, the defect type is further marked with three types of repairable defects (such as short-circuit defects), non-repairable defects (such as open-circuit defects) and non-repairable defects (such as paint, stains, etc.), and in the subsequent production process of the PCB circuit board, the open-circuit repairing device can be used to perform the next repair operation on the PCB circuit board marked with the non-repairable defects, thereby being more beneficial to improving the yield of the PCB circuit board and accelerating the production efficiency thereof.

Further describing, in step S3 and step S6, the repairing information includes laser parameters and scanning parameters of the repairing laser beam emitted by the laser repairing assembly 21;

wherein the laser parameters comprise the power, focal length and spot diameter focused on the defect area of the repair laser beam, and the scanning parameters comprise the scanning range and the scanning path of the repair laser beam.

It should be noted that, in steps S3 and S6 of the present embodiment, the repair information includes the laser parameters and the scanning parameters of the repair laser beam emitted by the laser repair assembly 21. The laser parameters comprise the power and focal length of the repair laser beam and the diameter of a light spot focused on the defect area, and the laser parameters are limited according to the defect condition of the actual defect area, so that the repair laser beam is prevented from breaking through a circuit board, and other non-defect areas are prevented from being repaired by mistake; the scanning parameters comprise a scanning range and a scanning path of the repairing laser beam, wherein the scanning range refers to the area of a defect area where the repairing laser beam is subjected to laser ablation, the scanning path refers to a moving path where the repairing laser beam is subjected to scanning on the defect area, and the two scanning parameters are determined, so that on one hand, the repairing laser beam can be further prevented from breaking down a circuit board and other non-defect areas from being mistakenly repaired, and on the other hand, the operation parameters of corresponding mechanical movement are controlled by controlling the scanning parameters of the repairing laser beam in a replacement manner in the laser process, and the repairing precision and the repairing efficiency of the repairing laser beam can be effectively improved.

Further describing, in step S2, the high-definition imaging device 1 acquires and stores a first high-definition detection image of a required visual magnification of the defective area;

in step S5, the high-definition imaging device 1 acquires a second high-definition detection image of the repaired defect region, and the visual magnification of the first high-definition detection image is the same as the visual magnification of the second high-definition detection image.

In the scheme, the visual multiplying power of the first high-definition detection image and the second high-definition detection image can be adjusted according to the size of the actual defect area, so that the accuracy of the PCB image is further improved, and the misjudgment phenomenon is avoided.

Further describing, in step S1, the specific steps for obtaining the defect information of the PCB to be repaired are as follows:

the automatic optical detection equipment detects defects of the PCB and obtains defect information of the PCB to be repaired;

the repair rechecking device receives the defect information of the PCB to be repaired from the automatic optical detection device;

or alternatively, the first and second heat exchangers may be,

the high-definition imaging device 1 performs linear scanning on the PCB to be repaired to obtain defect information of the PCB to be repaired.

Further, in step S1 of the present embodiment, defect information of the PCB to be repaired may be detected and obtained by an automatic optical inspection device (AOI) before the repair process, or may be obtained by linear scanning of the PCB to be repaired by the high-definition imaging device 1 before the repair process, which is not limited herein.

Further described, in step S1, the defect information includes the number of defect areas to be repaired in the PCB to be repaired and the relative positions of the defect areas on the PCB to be repaired;

the moving path comprises a linear moving path where the shortest distance between the current position information of the repairing and rechecking equipment and the defect area in the current repairing sequence is located, and a linear moving path where the shortest distance between the defect area in the current repairing sequence and the defect area in the next repairing sequence is located.

Further, in step S1 of the present embodiment, the moving path is further prioritized to be the straight-line moving path where the shortest distance between the defect areas between two adjacent repair orders is located (i.e. in a right triangle with line segment x and y as right-angle sides and line segment z as oblique sides, the defect areas between two adjacent repair orders are respectively two acute angles in the right triangle, and then the straight-line moving path where the shortest distance is located is the line segment z), so as to be more beneficial to improving the moving efficiency of the repair review device in the position moving and correction alignment process.

In step S3, the color two-dimensional image of the first high-definition detection image is compared with the color two-dimensional image of the pre-stored qualified image of the standard PCB by using the dual-channel feature comparison model based on the depth separable convolution, so as to determine the defect type of the defect area and determine whether the defect type needs to be repaired;

In step S6, the color two-dimensional image of the second high-definition detection image is compared with the color two-dimensional image of the qualified image by using a dual-channel feature comparison model based on depth separable convolution, and whether the PCB circuit board needs to be repaired again is judged.

In a preferred embodiment of the technical scheme, the corresponding images can be compared by utilizing the double-channel feature comparison model based on the depth separable convolution, so that the PCB image with false defects can be identified, the identification accuracy of the defects of the PCB is effectively improved, and the determination accuracy of the defect types is improved.

It should be noted that, in the scheme, the dual-channel feature comparison model based on the depth separable convolution is an existing feature comparison model, and the dual-channel feature comparison model is trained by constructing the dual-channel feature comparison model based on the depth separable convolution and utilizing a part of defect PCB images and corresponding standard PCB images, so that another part of defect PCB images and corresponding standard PCB images can be subjected to feature comparison through the trained dual-channel feature comparison model, and false defect PCB images can be identified from the defect PCB images according to feature comparison results, so that the identification accuracy of the defects of the PCB is improved.

The repairing and rechecking equipment for the short-circuit defects of the PCB comprises the high-definition imaging device 1, the repairing device 2 and a moving platform 3, wherein the high-definition imaging device 1 and the repairing device 2 are relatively static, and the moving platform 3 is used for moving the high-definition imaging device 1 and the repairing device 2 or the moving platform 3 is used for moving the PCB 4;

the repairing device 2 comprises the laser repairing assembly 21 and the optical imaging assembly 22, wherein the optical imaging assembly 22 comprises a repairing camera 221, a repairing imaging lens 222, a filter 223, a dichroic mirror 224, a repairing objective 225 and a repairing light source 226; preferably, the repair camera 221, the repair imaging lens 222, the optical filter 223, the dichroic mirror 224 and the repair objective lens 225 are sequentially arranged on the same vertical line from top to bottom, and the repair light source 226 is arranged close to the repair objective lens 225;

the laser repair assembly 21 is disposed near the dichroic mirror 224, the laser repair assembly 21 is configured to emit a repair laser beam toward the dichroic mirror 224, the dichroic mirror 224 is configured to reflect the repair laser beam toward the repair objective lens 225, and the repair objective lens 225 is configured to focus the repair laser beam.

The scheme also provides repair and rechecking equipment for the short-circuit defects of the PCB, which integrates the high-definition imaging device and the repair device, and can be matched with the repair and rechecking method to enable the PCB to rapidly and accurately move between the high-definition imaging device and the repair device, so that the repair efficiency and the accuracy of the repair and rechecking equipment for the short-circuit defects of the PCB are greatly improved, and the defects in the prior art are overcome.

Specifically, the repair review device of the present embodiment further includes a moving platform 3 for associating the high-definition imaging device 1 with a defective area in a current repair sequence according to a moving path, for associating the high-definition imaging device 1 and the repair device 2 with the defective area respectively according to a flexible acceleration/deceleration control algorithm, for aligning the optical imaging assembly 22 with the defective area, and for aligning the high-definition imaging device 1 with the repaired defective area. It should be noted that, the mobile platform 3 in this embodiment is used for carrying and moving the high-definition imaging device 1 and the repairing device 2 (as shown in fig. 6), or the mobile platform 3 is used for carrying and moving the PCB 4, which is not limited herein; the movement realized by the moving platform 3 at least comprises a horizontal movement and a vertical movement, wherein the horizontal movement is used for positioning the position, and the vertical movement is used for assisting the rapid focusing imaging.

Further, the optical imaging assembly 22 of the present solution includes a repair camera 221, a repair imaging lens 222, a filter 223, a dichroic mirror 224, a repair objective 225, and a repair light source 226. The repair camera 221 is used for imaging the gray scale positioning image, and may be a CCD camera or a CMOS camera, and since the imaging requirement of the scheme on the gray scale positioning image is not high, the repair camera 221 may use a large-sized chip, such as a 1-inch chip, so as to reduce the equipment cost of the repair review equipment. The repair imaging lens 222 is used for realizing imaging in cooperation with the repair camera 221 and the repair objective lens 225, and according to practical requirements, the repair imaging lens 222 of the present disclosure may be a lens group with a fixed magnification, such as a single-magnification lens group or a double-magnification lens group, so that stability of the repair device 2 can be ensured to the greatest extent, and repair accuracy is ensured. The filter 223 is used to filter out light having the same wavelength as the repair laser beam, and the repair light source 226 is used to provide a light source at the time of imaging.

Further, compared with the existing repairing device, the repairing review device provided by the present solution has the laser repairing component 21 disposed near the dichroic mirror 224 and emitting the repairing laser beam to the dichroic mirror 224, and the dichroic mirror 224 is used for reflecting the repairing laser beam to the repairing objective lens 225 except for allowing light with other wavelengths to pass through during the imaging process, and the repairing objective lens 225 is used for focusing the repairing laser beam except for matching with the imaging process. In this scheme, the structural design of the laser repairing assembly 21, the dichroic mirror 224 and the repairing objective 225 is favorable for realizing coaxial imaging and repairing of the repairing device 2, and further improves the repairing precision.

Further describing, the high definition imaging device 1 includes a high definition imaging assembly 11 and a light source assembly 12;

the high-definition imaging assembly 11 is sequentially arranged on the same vertical line from top to bottom and comprises a high-definition camera 111, a high-definition imaging lens 112 and a high-definition objective 113;

the light source assembly 12 includes a coaxial light source 121, a reflecting mirror 122, a beam splitter 123 and a paraxial light source 124, preferably, the coaxial light source 121, the reflecting mirror 122 and the beam splitter 123 are sequentially disposed on the same horizontal line, and the paraxial light source 124 is disposed near the high-definition objective 113; the beam splitter 123 is located between the high-definition imaging lens 112 and the high-definition objective 113, and the high-definition camera 111, the high-definition imaging lens 112, the beam splitter 123 and the high-definition objective 113 are sequentially arranged on the same vertical line from top to bottom;

the coaxial light source 121 is configured to emit an illumination beam to the reflecting mirror 122, the reflecting mirror 122 is configured to reflect the illumination beam to the beam splitter 123, the beam splitter 123 is configured to partially reflect the illumination beam to the high-definition objective 113, and the high-definition objective 113 is configured to focus the illumination beam.

In a preferred embodiment of the present technical solution, the high-definition imaging device 1 includes a high-definition imaging assembly 11 and a light source assembly 12.

The high-definition imaging assembly 11 is sequentially arranged on the same vertical line from top to bottom, the high-definition camera 111, the high-definition imaging lens 112 and the high-definition objective 113, the high-definition camera 111 is used for imaging a first high-definition detection image and a second high-definition detection image and can be a CCD camera or a CMOS camera, and because the imaging requirements of the scheme on the first high-definition detection image and the second high-definition detection image are higher, the high-definition camera 111 can use a small-size chip, such as a 1/2 inch chip, so that the equipment cost of repairing the reinspection equipment is reduced. The high-definition imaging lens 112 is used for realizing imaging by matching with the high-definition camera 111 and the high-definition objective 113, and according to actual requirements, the high-definition imaging lens 112 can be a lens group with variable multiplying power, and the imaging multiplying power is changed according to the size of a defect area, so that the detection and re-detection quality is improved more easily.

In order to further improve the imaging definition of the first high-definition detection image and the second high-definition detection image, the light source assembly 12 is added in the high-definition imaging device 1, so that sufficient light source conditions are provided for an imaging area. On the one hand, the light source assembly 12 of the present embodiment includes a coaxial light source 121, a reflector 122 and a beam splitter 123, where the coaxial light source 121 is configured to emit an illumination beam to the reflector 122, the reflector 122 is configured to reflect the illumination beam to the beam splitter 123, the beam splitter 123 is configured to partially reflect the illumination beam to the high-definition objective 113, and the high-definition objective 113 is configured to focus the illumination beam in addition to realizing imaging, so that the illumination beam formed by the coaxial light source 121 is coaxial with the high-definition imaging assembly 11, which is beneficial to vertically illuminating a defective area, and avoids edge shadows and other phenomena. On the other hand, the light source assembly 12 of the present embodiment further includes a paraxial light source 124, which is disposed close to the high-definition objective 113, for achieving uniform paraxial illumination, and the paraxial light source used in the present embodiment may be a polychromatic illumination light source, so as to achieve polychromatic multi-angle illumination.

Preferably, the high-definition imaging device 1 in the present embodiment further includes a laser generator (not shown in the figure), when the laser generator emits the dot-shaped laser, the focal position can be assisted to be rapidly determined under different multiplying factors according to the size or the position of the light spot in the high-definition camera 111 in the high-definition imaging device 1, so as to accelerate the high-definition imaging speed; when the laser generator emits the linear laser, the three-dimensional reconstruction of the defect area can be realized by scanning the linear laser on the PCB to be repaired, and a three-dimensional reconstruction image is obtained.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

In the description of the present invention, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present invention; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present invention.

It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or described herein.

The technical principle of the present invention is described above in connection with the specific embodiments. The description is made for the purpose of illustrating the general principles of the invention and should not be taken in any way as limiting the scope of the invention. Other embodiments of the invention will be apparent to those skilled in the art from consideration of this specification without undue burden.

Claims (10)

1. The repairing and rechecking method for the short circuit defect of the PCB circuit board is characterized by being suitable for repairing and rechecking equipment, wherein the repairing and rechecking equipment comprises a high-definition imaging device and a repairing device, the high-definition imaging device and the repairing device are relatively static, and the repairing device comprises a laser repairing component and an optical imaging component;

the optical imaging assembly comprises a repairing camera, a repairing imaging lens, an optical filter, a dichroic mirror, a repairing objective lens and a repairing light source; the laser repairing component is arranged close to the dichroic mirror, the laser repairing component is used for emitting repairing laser beams to the dichroic mirror, the dichroic mirror is used for reflecting the repairing laser beams to the repairing objective lens, and the repairing objective lens is used for focusing the repairing laser beams;

the high-definition imaging device comprises a high-definition imaging assembly, wherein the high-definition imaging assembly comprises a high-definition camera, a high-definition imaging lens and a high-definition objective lens;

the repairing and rechecking method comprises the following steps:

step S1, obtaining defect information of a PCB to be repaired and current position information of repair reinspection equipment, and obtaining repair sequence and moving path of each defect area in the PCB to be repaired according to the defect information and the position information;

Step S2, according to the moving path, enabling the high-definition imaging device to correspond to a defect area in the current repairing sequence, and acquiring and storing a first high-definition detection image of the defect area by the high-definition imaging device;

s3, comparing the first high-definition detection image with a pre-stored qualified image of a standard PCB, determining the defect type of the defect area and judging whether the defect type needs to be repaired or not;

if not, according to the moving path, enabling the high-definition imaging device to correspond to the defect area of the next repairing sequence, and repeating the step S2;

if so, the patching device generates patching information according to the first high-definition detection image and the qualified image;

s4, according to a flexible acceleration and deceleration control algorithm, enabling a repairing device to correspond to the defect area, acquiring a gray level positioning image of the defect area by an optical imaging assembly, comparing the first high-definition detection image with the gray level positioning image, enabling the optical imaging assembly to be aligned with the defect area, and repairing the defect area by the repairing device according to the repairing information;

step S5, according to a flexible acceleration and deceleration control algorithm, enabling the high-definition imaging device to correspond to the repaired defect area, obtaining a second high-definition detection image of the repaired defect area by the high-definition imaging device, comparing the second high-definition detection image with the first high-definition detection image, and enabling the high-definition imaging device to be aligned with the repaired defect area;

S6, comparing the second high-definition detection image with the qualified image, determining the defect type of the repaired defect area, and judging whether the defect type needs to be repaired again or not;

if not, according to the moving path, enabling the high-definition imaging device to correspond to the defect area of the next repairing sequence, and repeating the step S2;

if yes, the high-definition imaging device covers the first high-definition detection image into the second high-definition detection image, the patching device generates patching information according to the second high-definition detection image and the qualified image, and the step S4 is repeated.

2. The method for repairing and rechecking short circuit defects of a PCB (printed Circuit Board) according to claim 1, wherein the first high-definition detection image, the qualified image and the second high-definition detection image comprise a color two-dimensional image and a three-dimensional reconstruction image, and the gray level positioning image is a gray level two-dimensional image;

in step S3, comparing the color two-dimensional image of the first high-definition detection image with the color two-dimensional image of the pre-stored qualified image of the standard PCB, determining the defect type of the defect area, and judging whether the defect type needs to be repaired;

The patching device generates patching information according to the three-dimensional reconstruction image of the first high-definition detection image and the three-dimensional reconstruction image of the qualified image;

in step S4, comparing the color two-dimensional image of the first high-definition detection image with the gray scale positioning image, so as to align the optical imaging component with the defect area;

in step S5, comparing the color two-dimensional image of the second high-definition detection image with the color two-dimensional image of the first high-definition detection image, so that the high-definition imaging device is aligned with the repaired defect area;

in step S6, comparing the color two-dimensional image of the second high-definition detection image with the color two-dimensional image of the qualified image, and judging whether the PCB circuit board needs to be repaired again;

and the patching device generates patching information according to the three-dimensional reconstruction image of the second high-definition detection image and the three-dimensional reconstruction image of the qualified image.

3. The method according to claim 1, wherein in step S3 and step S6, the defect types include repairable defects, unrerepairable defects and non-repairable defects;

When the defect type is a repairable defect, the defect type needs to be repaired;

when the defect type is a non-repairable defect or does not require repair of a defect, the defect type does not require repair.

4. The method for repairing and rechecking short circuit defects of a PCB according to claim 1, wherein in the step S3 and the step S6, the repairing information comprises laser parameters and scanning parameters of the repairing laser beam emitted by the laser repairing component;

wherein the laser parameters comprise the power, focal length and spot diameter focused on the defect area of the repair laser beam, and the scanning parameters comprise the scanning range and the scanning path of the repair laser beam.

5. The method for repairing and rechecking short circuit defects of a PCB (printed Circuit Board) according to claim 1, wherein in the step S2, a high-definition imaging device acquires and stores a first high-definition detection image of a required visual magnification of the defective region;

in step S5, the high-definition imaging device acquires a second high-definition detection image of the repaired defect region, and the visual magnification of the first high-definition detection image is the same as that of the second high-definition detection image.

6. The method for repairing and rechecking short circuit defects of a PCB according to claim 1, wherein in the step S1, the specific steps of obtaining defect information of the PCB to be repaired are as follows:

the automatic optical detection equipment detects the defects of the PCB and obtains the defect information of the PCB to be repaired,

the repair rechecking device receives the defect information of the PCB to be repaired from the automatic optical detection device;

or alternatively, the first and second heat exchangers may be,

and the high-definition imaging device performs linear scanning on the PCB to be repaired to obtain defect information of the PCB to be repaired.

7. The method for repairing and rechecking short circuit defects of a PCB according to claim 1, wherein in step S1, the defect information includes the number of defect areas to be repaired in the PCB to be repaired and the relative positions of the defect areas on the PCB to be repaired;

the moving path comprises a linear moving path where the shortest distance between the current position information of the repairing and rechecking equipment and the defect area in the current repairing sequence is located, and a linear moving path where the shortest distance between the defect area in the current repairing sequence and the defect area in the next repairing sequence is located.

8. The method for repairing and rechecking short circuit defects of a PCB circuit board according to claim 2, wherein in the step S3, a two-channel feature comparison model based on depth separable convolution is utilized to compare a color two-dimensional image of the first high-definition detection image with a color two-dimensional image of a pre-stored qualified image of a standard PCB circuit board, the defect type of the defect area is determined, and whether the defect type needs repairing or not is judged;

in step S6, the color two-dimensional image of the second high-definition detection image is compared with the color two-dimensional image of the qualified image by using a dual-channel feature comparison model based on depth separable convolution, and whether the PCB circuit board needs to be repaired again is judged.

9. The repairing and rechecking device for the short circuit defect of the PCB circuit board is characterized by being applied to the repairing and rechecking method for the short circuit defect of the PCB circuit board according to any one of claims 1 to 8, and comprising the high-definition imaging device, the repairing device and a moving platform, wherein the high-definition imaging device and the repairing device are relatively static, and the moving platform is used for moving the high-definition imaging device and the repairing device or is used for moving the PCB circuit board.

10. The device for repairing and rechecking short-circuit defects of a PCB (printed Circuit Board) according to claim 9, wherein the high-definition imaging device comprises a light source assembly;

the light source assembly comprises a coaxial light source, a reflecting mirror, a light splitting sheet and a paraxial light source, wherein the coaxial light source, the reflecting mirror and the light splitting sheet are sequentially arranged, and the paraxial light source is arranged close to the high-definition objective; the light splitting sheet is positioned between the high-definition imaging lens and the high-definition objective lens, and the high-definition camera, the high-definition imaging lens, the light splitting sheet and the high-definition objective lens are sequentially arranged on the same vertical line from top to bottom;

the coaxial light source is used for emitting illumination light beams to the reflecting mirror, the reflecting mirror is used for reflecting the illumination light beams to the light splitting sheet, the light splitting sheet is used for partially reflecting the illumination light beams to the high-definition objective, and the high-definition objective is used for focusing the illumination light beams.