CN113686900A - Integrated method and device for detecting and repairing appearance defects of PCB - Google Patents
Integrated method and device for detecting and repairing appearance defects of PCB Download PDFInfo
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- CN113686900A CN113686900A CN202111013329.8A CN202111013329A CN113686900A CN 113686900 A CN113686900 A CN 113686900A CN 202111013329 A CN202111013329 A CN 202111013329A CN 113686900 A CN113686900 A CN 113686900A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Abstract
The invention provides a method and a device for detecting and repairing appearance defects of a PCB (printed circuit board), wherein the method comprises the following steps: the method comprises the following steps: moving the PCB to be detected to a designated position; step two: cleaning the periphery of a bonding pad on the PCB; step three: detecting whether solder resist ink is lacked around the cleaned bonding pad; step four: if the solder mask ink is detected to be lack around the bonding pad in the second step, ink is jetted to the position where the solder mask ink is lack; step five: curing the area where the ink jetting has been completed; step six: detecting whether redundant solder resist ink is sputtered on the bonding pad or not in the area where the curing is finished; step seven: if the excessive printing ink exists, removing the excessive solder resist printing ink; step eight: when all areas on the PCB to be detected are subjected to the second step and the seventh step, moving the detected PCB out of the designated position; wherein, the step two-the step seven are synchronously carried out. The method can synchronously realize the surface cleaning, detection, ink jetting, curing and repair of the PCB, integrates the components corresponding to the method, can realize the processing of a plurality of procedures of the PCB by one device, and has high processing efficiency.
Description
Technical Field
The invention belongs to the field of production of PCB boards, and particularly relates to an appearance defect detection and repair integrated method and device for a PCB board.
Background
Pcb (printed circuit board), i.e. printed wiring board, printed circuit board for short, is one of the important parts in the electronics industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. However, due to various reasons such as process flow, operation technology and the like, the edge of the pad of the PCB is very easy to have an insulating layer which is not in place, so that the connecting wire is exposed or the edge of the pad is exposed, or the insulating layer is sputtered to cover the upper surface of the pad, these defects are collectively called appearance defects, and the existence of the appearance defects seriously affects the performance of the PCB and even causes the rejection of the PCB.
The patent CN109041439A discloses a solder resist pattern transfer and forming process of a laser photoetching PCB, which improves the matching precision of a large process pattern and a circuit pattern of a solder resist pattern by the methods of processing a process board surface, coating photosensitive ink, drying the ink, photoetching the solder resist pattern, developing the solder resist pattern and solidifying the solder resist ink, the precision is controlled to be +/-0.05 MM, and the smoothness of subsequent process processing and the consistency of product precision are reduced. The patent CN108990299A discloses a laser correction PCB defect method based on image detection, the method obtains a PCB image through an image acquisition system, carries out the coordinate and area detection of PCB residual copper on the obtained PCB image through a residual copper detection system, and divides the area to be corrected of the residual copper; and correcting residual copper in the area to be corrected by the laser ablation system, so that the defects of the PCB are corrected by laser. Patent CN111867268A discloses a method for repairing a PCB with laser, which detects a defect on the PCB and repairs the defect by using a laser galvanometer technique. However, the above patents and prior arts do not relate to a technique for detecting defects of a PCB exterior panel and performing glue filling and correction, and further do not relate to a device for combining multiple techniques.
Disclosure of Invention
The invention mainly aims to provide an appearance defect detection and repair integrated method and device for a PCB, which integrate detection and repair parts into one device, reduce the use cost on one hand, and realize detection and repair on the other hand when the PCB is at the same position.
In order to achieve the above purposes, the technical scheme adopted by the invention is as follows: a method for detecting and repairing appearance defects of a PCB comprises the following steps:
the method comprises the following steps: moving the PCB to be detected to a designated position;
step two: cleaning the periphery of a bonding pad on the PCB;
step three: detecting whether solder resist ink is lacked around the cleaned bonding pad;
step four: if the solder mask ink is detected to be lack around the bonding pad in the second step, ink is jetted to the position where the solder mask ink is lack;
step five: curing the area where the ink jetting has been completed;
step six: detecting whether redundant solder resist ink is sputtered on the bonding pad or not in the area where the curing is finished;
step seven: if the excessive printing ink exists, removing the excessive solder resist printing ink;
step eight: when all areas on the PCB to be detected are subjected to the second step and the seventh step, moving the detected PCB out of the designated position;
wherein, the step two-the step seven are synchronously carried out.
The invention also provides a device for detecting and repairing the appearance defects of the PCB, which comprises a workbench and a detection device, wherein the workbench is provided with an objective table, and the objective table is used for placing the PCB to be detected;
an integration module supported on the worktable and located directly above the objective table, the integration module being capable of moving in a plane parallel to a PCB board located on the objective table, the integration module including:
the ion cleaning component is used for cleaning the periphery of the bonding pad on the PCB;
a defect detecting part for detecting whether solder resist ink is lacked around the cleaned bonding pad;
an ink-jet section for jetting ink to a location where the solder resist ink is absent;
a curing member for performing curing treatment on the inkjet-treated region;
and the laser repairing component is used for detecting the area after ink jetting and curing and removing the redundant solder resist ink according to the detection result.
Preferably, the defect detection part comprises a defect detection CCD camera arranged on the lower mounting plate and electrically connected with the control module, the defect detection CCD camera shoots downwards, the control module can judge whether a defect exists according to an image shot by the defect detection CCD camera and acquire the outline and the defect coordinate of the defect when the defect exists, and the lower mounting plate is positioned right above the workbench and can move within the range of the object stage at least when overlooking and observing.
Preferably, the ink jet part comprises an ink jet mechanism arranged on the lower mounting plate and electrically connected with the control module, the ink jet mechanism consists of a plurality of micro nozzles arranged in a close-packed manner in an array, the nozzles jet ink downwards, the control module can control the nozzles to jet ink according to the outline of the defect and the defect coordinate, the ink jet mechanism and the defect detection CCD camera are arranged along a first arrangement direction, the size of the ink jet mechanism is equal to or slightly larger than the shooting range of the defect detection CCD camera in a second direction, and the second direction is a horizontal direction perpendicular to the first arrangement direction.
Preferably, the ion cleaning component comprises a plasma generator electrically connected with the control module, the plasma generator is arranged on the lower mounting plate, an emitting end of the plasma generator emits plasma downwards, the size of the emitting end of the plasma generator is equal to or slightly larger than the shooting range of the defect detection CCD camera in the second direction, and the plasma generator, the ink jet mechanism and the defect detection CCD camera are sequentially arranged along the first arrangement direction.
Preferably, the curing part includes the UV light source that sets up on the lower mounting panel with the control module electricity is connected, the UV light source can send ultraviolet light, shines downwards in the second direction, the size of shining of UV light source on the PCB board equals or slightly is greater than the size of ink jet mechanism, plasma generator defect detection CCD camera, ink jet mechanism, UV light source follow first direction of arranging is arranged in proper order.
Preferably, the laser repair part includes:
the laser is used for emitting laser and is electrically connected with the control module;
the repaired CCD camera is used for shooting an image of the PCB and is electrically connected with the control module;
and beam combiner, galvanometer X, galvanometer Y and field lens that arrange in proper order along the light path of laser instrument, the shooting direction orientation of repairing the CCD camera the beam combiner just is perpendicular with the transmission direction of laser instrument, galvanometer X is including being located the scanning mirror X on the light path, galvanometer Y includes scanning mirror Y, scanning mirror X and scanning mirror Y are located in the light path, scanning mirror X and scanning mirror Y can rotate round horizontal axis and vertical axis respectively, the field lens sets up on the mounting panel down, and arranges from top to bottom, and its lower extreme runs through the mounting panel down, plasma generator, defect detection CCD camera, printing ink jet mechanism, UV light source, field lens arrange into one row in proper order under be provided with the mounting panel directly over the mounting panel down, scanning mirror X, scanning mirror Y arrange from top to bottom and all are located directly over the field lens, mirror X shakes, beam combiner and the laser instrument sets up go up the upper surface of mounting panel, the light that the laser instrument sent passes through beam combiner shines on scanning mirror Y, it supports through the support frame to repair the CCD camera go up on the mounting panel and be located beam combiner directly over, repair the CCD camera and can shoot the image that corresponds position department through beam combiner, mirror X shakes, mirror Y shakes and field lens.
Preferably, the lower mounting plate and the upper mounting plate are connected by a connecting frame at two sides of the first arrangement direction, an installation space is formed between the lower installation plate and the upper installation plate, the connecting frame is of a hollow structure, a piston and a piston rod penetrating through the piston along the up-down direction are arranged in the hollow structure, the upper end and the lower end of the piston rod respectively penetrate through the connecting frame and are fixed on the mounting frame, the piston rod can slide up and down relative to the connecting frame, magnetorheological fluid is filled in the hollow structure, a coil is arranged on the piston, the mounting rack is arranged on the cross beam, the crossbeam is supported on the workbench, the mounting rack can move back and forth relative to the crossbeam along one of the X direction or the Y direction, the beam is movable back and forth in the other of the X-direction or the Y-direction relative to the table.
Preferably, the PCB detection device further comprises a conveying belt arranged on one side of the workbench and used for conveying a PCB and a manipulator arranged on the workbench, wherein the manipulator is used for moving the PCB to be detected on the conveying belt to the objective table and moving the PCB detected or repaired on the objective table to the conveying belt, a sucker assembly is arranged at the free end of the manipulator and comprises a plurality of suckers, the working ends of the suckers face downwards, a connecting pipe is arranged at the upper end of each sucker and is installed on the same guide plate, the upper end of each connecting pipe is arranged on the fixed plate, an electromagnetic valve and a sensor are arranged on each connecting pipe, the sensors and the electromagnetic valves are connected with the control module, the control module can detect whether the sucker contacts the PCB through the actuator and when the sucker contacts the PCB, the solenoid valve is controlled to open.
Compared with the prior art, the invention has the following beneficial effects: .
1) The method can synchronously clean the surface of the PCB, detect the defects around the bonding pad, jet ink on the defect position, solidify the area after ink jet, detect the solidified area and remove the redundant solder resist ink, and can quickly realize the detection and repair of the PCB;
2) the integrated device integrates a cleaning component, a defect detection component, an ink jet component, a curing component and a laser repairing component, integrates a plurality of functional components into one device, and reduces the production cost; when different working procedures are finished, the PCB does not need to be moved, so that the error and the required time caused by moving the PCB are reduced, and the processing precision and the processing efficiency are improved; and the components are integrated on the same mounting plate, and when the integrated module works, the components synchronously work and sequentially pass through the same area on the PCB, and after the integrated module passes through a certain defect area, all processing operations can be completed, so that the high efficiency is very high.
Drawings
FIG. 1 is a schematic diagram of an integrated apparatus for detecting and repairing appearance defects of a PCB board according to the present invention;
FIG. 2 is a general assembly diagram of the integrated apparatus for detecting and repairing the appearance defects of the PCB board according to the present invention;
FIG. 3 is a cross-sectional view of an integrated device of the present invention;
FIG. 4 is a three-dimensional block diagram of the chuck assembly of the present invention;
FIG. 5 is an external view of the PCB board of the present invention before repairing the bonding pad;
FIG. 6 is a diagram illustrating the effect of the pads of the PCB after ink-jetting.
FIG. 7 is an effect diagram of the PCB board after pad ablation;
FIG. 8 is a flowchart of a second embodiment of the present invention;
FIG. 9 is a flowchart of a third embodiment of the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art.
Example one
The embodiment provides an appearance defect detecting and repairing integrated device for a PCB, which comprises a workbench 22 with an object stage 21 and an integrated module 27, wherein the object stage 21 is used for placing the PCB 20 to be detected and fixing the PCB 20 on the object stage, the integrated module 27 is supported on the workbench 22 and is positioned right above the object stage 21, and the integrated module 27 can move along a horizontal plane and at least within the range corresponding to the object stage 21 so as to detect the PCB 20 on the object stage 21 and repair the defective position. The integrated device also includes a control module 24 supported on the table 22 by a support 23.
The integrated module 27 includes a defect detecting part for detecting whether solder resist ink is absent around the pads 1 on the PCB board 20 and an ink jetting part for jetting ink to a location where solder resist ink is absent, by which ink is jetted toward the defective location to repair the PCB board. Specifically, the defect detection component includes a defect detection CCD camera 16 electrically connected to the control module 24, the defect detection CCD camera 16 is disposed on the lower mounting plate 39 and shoots downward for acquiring an image of the PCB positioned on the stage 21, and the control module 24 can determine whether the corresponding pad 12 lacks solder resist ink, that is, whether there is a defect, by the image. The ink jet unit comprises an ink jet mechanism 14 arranged on the lower mounting plate 39, the ink jet mechanism 14 is electrically connected with the control module 24, and when a defect exists at a corresponding position, the control module 24 can control the ink jet mechanism 14 to jet ink to the defect position for repairing. The ink jet mechanism 14 is composed of miniature nozzles arranged in a dense array, minimum 35um ink spraying can be realized by nozzle ink spraying points, and ink spraying is carried out by area nozzles precisely controlled according to area coordinates lacking solder resist ink. Defect detection CCD camera 16 and ink jet mechanism 14 are in arrange along first alignment direction on the lower mounting panel 39, first alignment direction is on a parallel with X direction or Y direction, the PCB board is in length direction or width direction on the objective table 21 are on a parallel with X direction or Y direction, lower mounting panel 39 can follow X direction and Y direction remove, and then can be located on objective table 21 all pads of PCB board 20 detect. In actual use, the movement direction of the integrated module 27 during operation is parallel to the first arrangement direction, the defect detection CCD camera 16 is located in front of the ink ejection mechanism 14 along the movement direction of the integrated module 27 during operation, and when the defect detection CCD camera 16 detects that a certain area lacks ink, the ink ejection mechanism 14 ejects ink while following the movement of the integrated module 27 to the area. The control module may control whether each nozzle is operated, that is, only the nozzle corresponding to the ink lacking area is caused to eject ink, according to the size of the ink lacking area acquired by the defect detecting CCD camera 16. In a second direction perpendicular to the first alignment direction, the size of the ink ejection mechanism 14 is equal to or slightly larger than the shooting range of the defect detection CCD camera 16, so as to ensure that the range that the defect detection CCD camera 16 can shoot can be ejected. After the inspection or repair from one side to the other side of the PCB is completed along the first arrangement direction, the integrated module 27 moves a distance along a direction perpendicular to the first arrangement direction and returns to the one side of the PCB, and the inspection and repair is continued until the entire PCB is inspected and repaired.
The integrated module 27 further includes an ion cleaning component for rapidly cleaning the surface of the PCB before performing the inspection to ensure the accuracy of the inspection. The ion cleaning component comprises a plasma generator 18 arranged on a lower mounting plate 39 and electrically connected with the control module 24, the emission end of the plasma generator 18 emits downwards, and the generated plasma can clean the upper surface of the PCB. The plasma generator 18, the defect detection CCD camera 16, and the ink jet mechanism 14 are arranged in this order along a first arrangement direction. The size of the emission head of the plasma generator 18 in the second direction is equal to or slightly larger than the shooting range of the defect detection CCD camera 16, so as to ensure that cleaning can be completed within the shooting range of the defect CCD camera 16.
The integrated module 27 also includes a curing component for accelerating the curing of the ink after the ink ejection mechanism 14 ejects the ink. The curing component includes a UV light source 12 disposed on the lower mounting plate 39, the UV light source 12 is capable of emitting ultraviolet light that shines downward when the control module controls the ink ejection mechanism 14 to begin ejecting ink while the UV light source 12 is turned on. The plasma generator 18, the defect detection CCD camera 16, the ink jet mechanism 14, and the UV light source 12 are sequentially arranged in a row. In the second direction, the irradiation range of the UV light source 12 on the PCB is equal to or slightly larger than the size of the ink ejection mechanism 14.
The integrated module 27 further includes a laser repairing part for detecting whether the pad 1 after ink jetting has been splashed with excess ink and cleaning the excess ink. The laser repairing component comprises a laser 4, a repairing CCD camera 3, a beam combiner 5, a galvanometer X6, a galvanometer Y8 and a field lens 10 which are sequentially arranged along a light path of the laser 4, the shooting direction of the repairing CCD camera 3 faces the beam combiner 5 and is vertical to the emission direction of the laser 4, the laser 4 and the repairing CCD camera 3 share a part of the light path, the galvanometer X6 comprises a scanning mirror X7 positioned on the light path, the galvanometer Y8 comprises a scanning mirror Y9, the scanning mirror X7 and the scanning mirror Y9 are positioned in the light path, the scanning mirror X7 and the scanning mirror Y9 can respectively rotate around a horizontal axis and a vertical axis to enable the repairing CCD camera 3 to shoot images at different positions of the PCB 20 and enable light emitted by the laser 4 to irradiate different positions of the PCB 20, and photos obtained by the repairing CCD camera 3 can judge that ink can be sputtered on the pad 1, the light emitted by the laser 4 can ablate the ink sputtered on the pad 1 to remove excess ink. The repairing CCD camera 3 and the laser 4 are electrically connected with the control module 24.
Specifically, the field lens 10 is vertically arranged on the lower mounting plate 39, the lower end of the field lens extends downwards out of the lower mounting plate 39, and the ultraviolet laser 11 emitted by the laser 4 finally irradiates on the bonding pad 1 through the field lens 10. The scanning mirror X7 and the scanning mirror Y9 are arranged up and down and are positioned right above the field lens 10. Preferably, an upper mounting plate 40 is provided directly above the lower mounting plate 39, and the galvanometer X6 is mounted on the upper surface of the upper mounting plate 40. The beam combining mirror 5 and the laser 4 are arranged on the upper surface of the upper mounting plate 40, and light emitted by the laser 4 is irradiated onto the scanning mirror Y7 through the beam combining mirror 5. The repairing CCD camera 3 is supported by the supporting frame 38 on the upper mounting plate 40 and is located right above the beam combiner 5, and the repairing CCD camera 3 can shoot images at corresponding positions through the beam combiner 5, the galvanometer X6, the galvanometer Y8 and the field lens 10. The plasma generator 18, the defect detection CCD camera 16, the ink jet mechanism 14, the UV light source 12, and the field lens 10 are sequentially arranged in a row.
The lower mounting plate 39 and the upper mounting plate 40 are connected by a connecting frame 47 on two sides of the first arrangement direction, and a mounting space is formed between the lower mounting plate 39 and the upper mounting plate 40. The connecting frame 47 is a hollow structure, a piston 43 and a piston rod 41 penetrating through the piston 43 along the vertical direction are arranged in the hollow structure, the upper end and the lower end of the piston rod 41 respectively penetrate through the connecting frame 47 and are fixed on the mounting frame 46, and the piston rod 41 can slide up and down relative to the connecting frame 47 so as to move the piston 43 up and down in the hollow structure.
Magnetorheological fluid is filled in the hollow structure, the piston 43 is provided with the coil 44, and the magnetism of the coil 44 can be controlled by electrifying the coil 44 so as to change the state of the magnetorheological fluid and play a role in damping. In order to facilitate the flow of the magnetorheological fluid, the piston 43 has a gap between the side wall of the hollow structure of the connecting frame 47 in the radial direction thereof.
The mounting bracket 46 is disposed on the cross beam 28, the cross beam 28 is supported on the worktable 22, the mounting bracket 46 is capable of moving back and forth along one of the X direction or the Y direction relative to the cross beam 28, and the cross beam 28 is capable of moving back and forth along the other of the X direction or the Y direction relative to the worktable 22.
The integrated device further comprises a conveyer belt 31 arranged on one side of the workbench 22 and used for conveying the PCB 20 and a manipulator 29 arranged on the workbench 22, wherein the manipulator 29 is used for moving the PCB 20 to be detected on the conveyer belt 31 to the object stage 21 and moving the PCB 20 detected or repaired on the object stage 21 to the conveyer belt 31.
The sensor 34 may be a micro switch 34, the connection tube 311 may move up and down within a certain range relative to the guide plate 38, the micro switch 34 may be triggered when the guide plate 38 and the connection tube 311 move relatively, and if the control module 24 receives a state change signal of the micro switch 34, it indicates that the connection tube 311 moves relatively to the guide plate 38.
Further, the fixing plate 39 is connected to a mounting plate 310, the mounting plate 310 is fixed to a free end of the robot 29, an air pipe 33 is disposed on the mounting plate 310, one end of the air pipe 33 is connected to each of the connection pipes 311 through a pipe, and the other end of the air pipe 33 is connected to an air pump (not shown).
Example two
The embodiment is a use method of the integrated device in the first embodiment, and specifically includes the following steps:
step S1: the robot 29 moves the PCB board on the conveyor 31 onto the stage 21;
step S2: the integrated module 27 moves within the range of the PCB 20, and the surface of the PCB 20 is cleaned by the plasma generator 18;
step S3: detecting whether the cleaned area lacks assembly welding ink by a defect detection CCD camera;
step S4: when detecting that the solder mask ink is lacked, acquiring the outline of the area lacking the solder mask ink and the position coordinates of the defects;
step S5: the ink jetting mechanism 14 jets ink according to the acquired outline of the defect and the position coordinates of the defect;
step S6: the UV light source 12 heats and cures the area which has jetted ink according to the outline of the defect and the position coordinate of the defect;
step S7: the repaired CCD camera 3 shoots an ink-jet area which is heated and cured, and whether ink is splashed to the surface of the bonding pad 1 is judged according to the shot image;
step S8: when detecting that the ink is splashed on the surface of the bonding pad 1, acquiring an ink area with the ink sputtered on the bonding pad 1 and acquiring coordinates of the ink area;
step S9: the laser 4 emits laser, and the ink on the surface of the bonding pad 1 is ablated and cleaned according to the acquired coordinates of the ink area;
step S10: the robot 29 transfers the PCB 20 on the stage 21 to the conveyer 31;
step S11: the robot 29 moves the next PCB board 20 to be inspected on the conveyor 31 to the stage 21 and performs steps S2-S10 until all PCB boards 20 are inspected and repaired.
The above steps S2-S9 can be performed simultaneously.
EXAMPLE III
This embodiment is also a method for using the integrated device in the first embodiment, and unlike the second embodiment, the PCB board in this embodiment is already inspected by an OEM inspection machine before being delivered to the integrated device, that is, whether there is a defect on the PCB board 20 and the coordinates of the defect are acquired. The use method of the embodiment specifically comprises the following steps:
step S1: the robot 29 transfers the PCB 20 having the defect on the conveyer belt 31 to the stage 12;
step S2: the integrated module 27 moves within the range of the PCB 20, and the surface of the PCB 20 is cleaned by the plasma generator 18;
step S3: the integrated module 27 moves to the coordinates of the acquired defects, detects whether the PCB 20 has defects through the defect detection CCD camera 16 to confirm the defects, moves to the coordinates of the next defect if the defects at the corresponding coordinates do not exist, and acquires the outline of the corresponding defects if the defects at the corresponding coordinates are confirmed;
step S4: the ink jetting mechanism 14 jets ink according to the acquired outline of the defect and the coordinates of the defect;
step S5: the UV light source 12 heats and cures the area where ink jetting is completed according to the outline of the defect and the position coordinate of the defect;
step S6: the repairing CCD camera 3 shoots the area which is heated and cured, and whether the ink is splashed to the surface of the bonding pad 1 is judged according to the shot image;
step S7: when detecting that the ink is splashed on the surface of the bonding pad 1, acquiring an ink area with the ink sputtered on the bonding pad 1 and acquiring coordinates of the ink area;
step S8: the laser 4 emits laser, and the ink on the surface of the bonding pad 1 is ablated and cleaned according to the acquired coordinates of the ink area;
step S9: the robot 29 transfers the PCB 20 on the stage 21 to the conveyer 31;
step S10: the robot 29 moves the next PCB board 20 to be inspected on the conveyor 31 to the stage 21 and performs steps S1-S9 until all PCB boards 20 are inspected and repaired.
The above steps S2-S8 can be performed simultaneously.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are merely illustrative of the principles of the invention, but that various changes and modifications may be made without departing from the spirit and scope of the invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. A method for detecting and repairing appearance defects of a PCB is characterized by comprising the following steps:
the method comprises the following steps: moving the PCB to be detected to a designated position;
step two: cleaning the periphery of a bonding pad on the PCB;
step three: detecting whether solder resist ink is lacked around the cleaned bonding pad;
step four: if the solder mask ink is detected to be lack around the bonding pad in the second step, ink is jetted to the position where the solder mask ink is lack;
step five: curing the area where the ink jetting has been completed;
step six: detecting whether redundant solder resist ink is sputtered on the bonding pad or not in the area where the curing is finished;
step seven: if the excessive printing ink exists, removing the excessive solder resist printing ink;
step eight: when all areas on the PCB to be detected are subjected to the second step and the seventh step, moving the detected PCB out of the designated position;
wherein, the step two-the step seven are synchronously carried out.
2. The utility model provides an appearance defect of PCB board detects, restores integrated device, includes:
the workbench is provided with an object stage, and the object stage is used for placing the PCB to be detected;
an integration module supported on the worktable and located directly above the objective table, the integration module being capable of moving in a plane parallel to a PCB board located on the objective table, the integration module including:
the ion cleaning component is used for cleaning the periphery of the bonding pad on the PCB;
a defect detecting part for detecting whether solder resist ink is lacked around the cleaned bonding pad;
an ink-jet section for jetting ink to a location where the solder resist ink is absent;
a curing member for performing curing treatment on the inkjet-treated region;
and the laser repairing component is used for detecting the area after ink jetting and curing and removing the redundant solder resist ink according to the detection result.
3. The integrated apparatus for detecting and repairing the appearance defect of the PCB of claim 2, wherein the defect detecting component comprises a defect detecting CCD camera which is arranged on the lower mounting plate and electrically connected with the control module, the defect detecting CCD camera shoots downwards, the control module can judge whether the defect exists according to the image shot by the defect detecting CCD camera and obtains the outline and the defect coordinate of the defect when the defect exists, and the lower mounting plate is positioned right above the workbench and can move at least within the range of the object stage when viewed from top.
4. The integrated apparatus for detecting and repairing the appearance defects of the PCB of claim 3, wherein the ink jet unit comprises an ink jet mechanism disposed on the lower mounting plate and electrically connected to the control module, the ink jet mechanism comprises a plurality of micro nozzles arranged in a close-packed array, the nozzles jet ink downwards, the control module can control the nozzles to jet ink according to the contours and the defect coordinates of the defects, the ink jet mechanism and the defect detection CCD camera are arranged along a first arrangement direction, the size of the ink jet mechanism is equal to or slightly larger than the shooting range of the defect detection CCD camera in a second direction, and the second direction is a horizontal direction perpendicular to the first arrangement direction.
5. The integrated apparatus for detecting and repairing the appearance defects of the PCB of claim 4, wherein the ion cleaning component comprises a plasma generator electrically connected with the control module, the plasma generator is arranged on the lower mounting plate, the emitting end of the plasma generator emits plasma downwards, the size of the emitting end of the plasma generator in the second direction is equal to or slightly larger than the shooting range of the defect detection CCD camera, and the plasma generator, the ink jet mechanism and the defect detection CCD camera are sequentially arranged along the first arrangement direction.
6. The integrated apparatus for detecting and repairing the appearance defects of the PCB of claim 5, wherein the curing component comprises a UV light source electrically connected with the control module and arranged on the lower mounting plate, the UV light source can emit ultraviolet light to irradiate downwards, the irradiation size of the UV light source on the PCB in the second direction is equal to or slightly larger than that of the ink jet mechanism, and the plasma generator, the defect detecting CCD camera, the ink jet mechanism and the UV light source are sequentially arranged along the first arrangement direction.
7. The integrated apparatus for detecting and repairing the appearance defects of the PCB of claim 6, wherein the laser repairing component comprises:
the laser is used for emitting laser and is electrically connected with the control module;
the repaired CCD camera is used for shooting an image of the PCB and is electrically connected with the control module;
and beam combiner, galvanometer X, galvanometer Y and field lens that arrange in proper order along the light path of laser instrument, the shooting direction orientation of repairing the CCD camera the beam combiner just is perpendicular with the transmission direction of laser instrument, galvanometer X is including being located the scanning mirror X on the light path, galvanometer Y includes scanning mirror Y, scanning mirror X and scanning mirror Y are located in the light path, scanning mirror X and scanning mirror Y can rotate round horizontal axis and vertical axis respectively, the field lens sets up on the mounting panel down, and arranges from top to bottom, and its lower extreme runs through the mounting panel down, plasma generator, defect detection CCD camera, printing ink jet mechanism, UV light source, field lens arrange into one row in proper order under be provided with the mounting panel directly over the mounting panel down, scanning mirror X, scanning mirror Y arrange from top to bottom and all are located directly over the field lens, mirror X shakes, beam combiner and the laser instrument sets up go up the upper surface of mounting panel, the light that the laser instrument sent passes through beam combiner shines on scanning mirror Y, it supports through the support frame to repair the CCD camera go up on the mounting panel and be located beam combiner directly over, repair the CCD camera and can shoot the image that corresponds position department through beam combiner, mirror X shakes, mirror Y shakes and field lens.
8. The PCB appearance defect detecting and repairing integrated device according to claim 2, wherein the lower mounting plate and the upper mounting plate are connected by a connecting frame at two sides of the first arrangement direction, a mounting space is formed between the lower mounting plate and the upper mounting plate, the connecting frame is a hollow structure, a piston and a piston rod penetrating through the piston along the vertical direction are arranged in the hollow structure, the upper end and the lower end of the piston rod respectively penetrate through the connecting frame and are fixed on the mounting frame, the piston rod can slide up and down relative to the connecting frame, magnetorheological fluid is filled in the hollow structure, a coil is arranged on the piston, the mounting frame is arranged on the cross beam, the cross beam is supported on the workbench, and the mounting frame can move back and forth relative to the cross beam along one direction of the X direction or the Y direction, the beam is movable back and forth in the other of the X-direction or the Y-direction relative to the table.
9. The integrated apparatus for detecting and repairing the appearance defects of the PCB board as claimed in claim 2, further comprising a conveyor belt for conveying the PCB board disposed at one side of the worktable and a manipulator disposed on the worktable, wherein the manipulator is used for moving the PCB board to be detected on the conveyor belt onto the objective table and moving the PCB board to be detected or repaired on the objective table onto the conveyor belt, a suction cup assembly is disposed at a free end of the manipulator, the suction cup assembly comprises a plurality of suction cups, working ends of the suction cups face downward, an upper end of each suction cup is provided with a connecting pipe, the connecting pipes are mounted on a same guide plate, an upper end of each connecting pipe is disposed on the fixing plate, the connecting pipes are provided with an electromagnetic valve and a sensor, and the sensor and the electromagnetic valve are connected with the control module, the control module can detect whether the sucker contacts the PCB or not through the actuator and control the electromagnetic valve to be opened when detecting that the sucker contacts the PCB.
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| CN202111013329.8A CN113686900A (en) | 2021-08-31 | 2021-08-31 | Integrated method and device for detecting and repairing appearance defects of PCB |
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| CN202111013329.8A CN113686900A (en) | 2021-08-31 | 2021-08-31 | Integrated method and device for detecting and repairing appearance defects of PCB |
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| CN115754670A (en) * | 2022-11-15 | 2023-03-07 | 广东炬森智能装备有限公司 | Repair and reinspection method and equipment for short-circuit defects of PCB (printed circuit board) |
| CN116234179A (en) * | 2023-05-09 | 2023-06-06 | 深圳宏芯宇电子股份有限公司 | Apparatus and method for removing faulty electronic component |
| CN116493731A (en) * | 2023-06-29 | 2023-07-28 | 麦禹科技(河北)有限公司 | Welding device and welding method for cavity electronic components |
| CN116500050A (en) * | 2023-06-28 | 2023-07-28 | 四川托璞勒科技有限公司 | PCB visual inspection system |
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