CN116500050B - PCB visual inspection system - Google Patents
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- CN116500050B CN116500050B CN202310769860.0A CN202310769860A CN116500050B CN 116500050 B CN116500050 B CN 116500050B CN 202310769860 A CN202310769860 A CN 202310769860A CN 116500050 B CN116500050 B CN 116500050B
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- 238000011179 visual inspection Methods 0.000 title claims abstract description 15
- 238000001514 detection method Methods 0.000 claims abstract description 35
- 238000009826 distribution Methods 0.000 claims abstract description 4
- 238000001179 sorption measurement Methods 0.000 claims description 40
- 230000005540 biological transmission Effects 0.000 claims description 24
- 238000012546 transfer Methods 0.000 claims description 16
- 238000007689 inspection Methods 0.000 claims description 9
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- 230000003287 optical effect Effects 0.000 claims description 4
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- 238000000034 method Methods 0.000 abstract description 37
- 230000008569 process Effects 0.000 abstract description 29
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000012937 correction Methods 0.000 abstract description 5
- 230000000007 visual effect Effects 0.000 abstract description 4
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/01—Arrangements or apparatus for facilitating the optical investigation
- G01N21/13—Moving of cuvettes or solid samples to or from the investigating station
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
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- Pathology (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
The invention discloses a PCB visual inspection system, which relates to the technical field of PCB production and comprises a grabbing recognition device, a feeding table, a PCB carrier and a calibration table, wherein the feeding table, the PCB carrier and the calibration table are sequentially arranged; the grabbing recognition device comprises a first conveying unit, an image recognition unit and a second conveying unit which are sequentially arranged, wherein the first conveying unit, the image recognition unit and the second conveying unit are movably arranged on the distribution paths of the feeding table, the PCB carrier and the calibration table; the first conveying unit is configured to convey the PCB on the feeding table to the PCB carrier, the image recognition unit is configured to recognize the two sides of the PCB on the PCB carrier, and the second conveying unit is configured to convey the PCB on the PCB carrier to the calibration table. According to the invention, the PCB can be conveyed by the reciprocating movement of the grabbing recognition device, and the visual detection and the position correction during the output of the two side surfaces of the PCB are performed on line, so that the quality of the PCB is ensured, the process flow is simplified, and the production efficiency of the PCB is improved.
Description
Technical Field
The invention relates to the technical field of PCB production, in particular to a PCB visual inspection system.
Background
The PCB board is also called a printed circuit board, is a provider of electric connection of electronic elements, and can obviously reduce wiring and assembly errors, improve productivity and automation level, and the technical level is still continuously developed until now. The production of the PCB board involves multiple procedures such as inner layer graphic processing, pressing, drilling, outer layer graphic processing, outer layer graphic electroplating and the like, wherein each procedure and the final finished product have corresponding requirements on the surface of the PCB board, so that the detection on the surface of the PCB board is very necessary in the production process of the PCB board.
At present, for the detection on the surface of the PCB, the PCB is generally conveyed to an independent detection device, and then conveyed to the next process after the detection device completes detection, the process is more complicated, the overall efficiency including the conveying process is lower, and therefore the cost of producing the PCB is improved, and the output speed of the PCB is reduced.
Disclosure of Invention
The invention discloses a PCB visual inspection system, which aims to solve the technical problem that the surface inspection of a PCB in the related art affects the production efficiency.
In order to solve the problems, the invention adopts the following technical scheme:
the application provides a PCB visual inspection system, which comprises a feeding table, a PCB carrier, a calibration table and a grabbing recognition device, wherein the feeding table, the PCB carrier and the calibration table are sequentially arranged; the grabbing recognition device comprises a first conveying unit, an image recognition unit and a second conveying unit which are sequentially arranged, wherein the first conveying unit, the image recognition unit and the second conveying unit are movably arranged on the distribution paths of the feeding table, the PCB carrier and the calibration table; the first conveying unit is configured to convey the PCB on the feeding table to the PCB carrier, the image recognition unit is configured to recognize the two sides of the PCB on the PCB carrier, and the second conveying unit is configured to convey the PCB on the PCB carrier to the calibration table.
Optionally, the PCB carrier has an exposed portion, and the image recognition unit includes an upper recognition component distributed over the exposed portion and a lower recognition component distributed under the exposed portion; the exposure part is an optical carrier plate or a view finding opening.
Optionally, the upper identification component and/or the lower identification component comprises a scanning lens and a scanning matching part; the scanning matching part is provided with a light transmission gap, the length direction of the light transmission gap is perpendicular to the moving path of the image recognition unit, and the scanning lens can scan the PCB on the PCB carrier through the light transmission gap; the scanning matching part is provided with a light-gathering opening at one side of the light-transmitting gap facing the scanning lens, and the light-gathering opening is communicated with the light-transmitting gap.
Optionally, the first conveying unit and/or the second conveying unit comprise a lifting component and a negative pressure grabbing component; the lifting component is used for driving the negative pressure grabbing component to lift; the negative pressure grabbing assembly comprises two adsorption groups arranged at intervals, each adsorption group comprises a plurality of adsorption heads arranged in parallel, and the included angle between the adsorption heads of each adsorption group is adjustable.
Optionally, the negative pressure grabbing component at least has a first grabbing state and a second grabbing state; in the first grabbing state, the adsorption heads of the two adsorption groups are arranged in parallel and are perpendicular to the board surface of the PCB in a flat state; under the second snatchs the state, one of them the absorption head of absorption group with another the absorption head of absorption group is along the slope of opposite directions setting, and the face when perpendicular to PCB board is the arc state.
Optionally, the negative pressure grabbing assembly further comprises a first mounting seat, the adsorption group further comprises a second mounting seat, and the second mounting seat is provided with an adsorption head of the adsorption group; the second mounting seat is hinged with the first mounting seat, a telescopic driving piece is further arranged between the second mounting seat and the first mounting seat, and two ends of the telescopic driving piece are respectively hinged with the first mounting seat and the second mounting seat; the telescopic driving piece is configured to drive the second mounting seat to rotate along the opposite or reverse direction of the other adsorption group.
Optionally, the negative pressure grabbing assembly further comprises a reciprocating vibrator, and the reciprocating vibrator is connected with the second mounting seat and used for driving the second mounting seat to vibrate in a reciprocating manner.
Optionally, the adsorption heads of each adsorption group are inclined towards a direction away from the other adsorption group, and the inclination angle of the adsorption heads is adapted to the surface of the adsorbed PCB.
Optionally, the calibration table comprises a calibration table body, a plate thickness detection device, an image acquisition device and a calibration device; the calibration table body is provided with a calibration table surface for placing a PCB; the plate thickness detection device is arranged on the calibration table body and is used for measuring the plate thickness of the PCB on the calibration table surface; the image acquisition direction of the image acquisition device points to the calibration table top and is used for acquiring the position information of the PCB on the calibration table top; the calibration device is in signal connection with the image acquisition device and in transmission connection with the calibration table body, and is used for driving the calibration table body to move.
Optionally, the feeding platform comprises a feeding platform body and a plurality of side baffles; the feeding table body is provided with a feeding table surface for placing the PCB; the side baffles are arranged on the feeding table top and are matched with the feeding table top to form a containing cavity, and the containing cavity can be used for containing a plurality of overlapped Printed Circuit Boards (PCB); and among the side baffles, at least one side baffle is provided with an air outlet channel and an air outlet opening communicated with the air outlet channel, and the air outlet opening faces the accommodating cavity.
Optionally, the material loading platform includes first baffle group, first baffle group includes two side baffles of relative setting, two side baffles of first baffle group are along perpendicular to the direction distribution of first conveying unit travel path, and two the interval of side baffle is adjustable.
The technical scheme adopted by the invention can achieve the following beneficial effects:
according to the PCB visual detection system provided by the invention, the PCB can be conveyed through the reciprocating movement of the grabbing recognition device, and the visual detection and the position correction during the output of the two side surfaces of the PCB are performed on line, so that the quality of the PCB is ensured, the process flow is simplified, and the production efficiency of the PCB is improved; in addition, the first conveying unit, the image recognition unit and the second conveying unit are all arranged on the grabbing recognition device, the grabbing recognition device is driven to move through the grabbing recognition device, at the moment, the grabbing recognition device is driven to move along the conveying path through one driving device, the three can move along the conveying path, and the cost of independently arranging the driving devices for the three to move is saved.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a visual inspection system according to an embodiment of the present application in a first movement state;
FIG. 2 is a top view of a visual inspection system of an embodiment of the present application in a first movement state;
FIG. 3 is a schematic view of a visual inspection system according to an embodiment of the present application in a second mobile state;
FIG. 4 is a top view of a visual inspection system according to an embodiment of the present application in a second movement state;
FIG. 5 is a schematic diagram of an image recognition unit according to an embodiment of the present application;
FIG. 6 is a front cross-sectional view of an embodiment of the present application showing an image recognition unit mated with a PCB carrier;
FIG. 7 is a partial detail view of an embodiment of the present application showing the engagement of an image recognition unit with a PCB carrier;
fig. 8 is a schematic structural diagram of a PCB carrier according to an embodiment of the present application;
fig. 9 is a schematic structural view of the first conveying unit or the second conveying unit according to the embodiment of the present application;
fig. 10 is a schematic diagram illustrating the cooperation between the first or second transmission unit and the PCB board in the embodiment of the present application;
FIG. 11 is a schematic structural view of a calibration stand according to an embodiment of the present application;
FIG. 12 is a side view of a calibration rig according to an embodiment of the present application;
FIG. 13 is a side view of a plate thickness detection device according to an embodiment of the present application;
FIG. 14 is a schematic illustration of the connection of a base to a calibration device according to an embodiment of the present application;
FIG. 15 is a schematic structural view of a loading table according to an embodiment of the present application;
FIG. 16 is a front view of a loading station according to an embodiment of the present application;
fig. 17 is a schematic diagram of an internal structure of a feeding table body according to an embodiment of the present application.
In the figure:
100-base, 200-loading table, 210-loading table body, 211-loading table top, 212-first through hole, 213-guide rail, 220-side baffle, 221-air outlet opening, 222-positioning plate, 223-limiting plate, 230-ventilation pipe, 231-air inlet, 240-positioning driving member, 251-gear, 252-rack, 300-PCB carrier, 310-exposure part, 400-calibration table, 410-calibration table body, 420-calibration table top, 421-avoidance channel, 422-exposure area, 423-second through hole, 424-second gap, 430-plate thickness detection device, 431-upper abutting member, 432-lower abutting member, 433-first gap, 434-stroke detection element, 435-first lifting driving member, 436-avoidance driving member, 437-sheet thickness detection seat, 440-image acquisition device, 441-camera, 450-calibration device, 451-UVW platform, 500-first transfer unit, 600-second transfer unit, 710-lifting assembly, 711-second lifting driving member, 720-negative pressure gripping assembly, 721-suction head, 722-flexible joint, 723-first mount, 724-second mount, 725-telescoping driving member, 726-reciprocating vibrator, 800-image recognition unit, 810-upper recognition assembly, 820-lower recognition assembly, 830-detection gap, 840-scanning lens, 850-scanning fitting portion, 851-scanning fitting block, 852-light transmission gap, 853-light condensing opening, 854-light source, 900-PCB.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, based on the examples herein, which are within the scope of the invention as defined by the claims, will be within the scope of the invention as defined by the claims.
The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type and not limited to the number of objects, e.g., the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.
The following describes in detail a PCB board visual inspection system provided in the embodiments of the present application through specific embodiments and application scenarios thereof with reference to fig. 1 to 17.
The embodiment of the application provides a PCB board vision detection system for carry PCB board 900 and to the detection of PCB board 900 both sides surface in step, with this reduction spends the time of detecting on PCB board 900 surface, and then improves the efficiency of PCB board 900 production.
As shown in fig. 1 to 4, the PCB board vision inspection system provided in the embodiments of the present application includes a base 100, a feeding table 200, a PCB carrier 300, a calibration table 400 and a grabbing recognition device, where the base 100 is a base member of a PCB board vision inspection apparatus, and can provide an installation basis for the feeding table 200, the PCB carrier 300, the calibration table 400 and the grabbing recognition device, the feeding table 200, the PCB carrier 300 and the calibration table 400 are installed on the base 100, and the grabbing recognition device is movably disposed on the base 100 and can reciprocate along an output path of the system under the driving of a driving apparatus (not shown in the drawing).
The grip recognition apparatus includes a first transfer unit 500, an image recognition unit 800, and a second transfer unit 600. Wherein the loading table 200, the PCB carrier 300, and the calibration table 400 are sequentially disposed on the base 100 along a conveying path of the system; the first conveying unit 500, the image recognition unit 800 and the second conveying unit 600 are sequentially disposed along a conveying path of the system, and the first conveying unit 500, the image recognition unit 800 and the second conveying unit 600 can move synchronously along the conveying path along with the movement of the grabbing recognition device;
The first conveying unit 500 is configured to convey the PCB 900 on the feeding stage 200 to the PCB carrier 300, the image identifying unit 800 is configured to identify the two sides of the PCB 900 on the PCB carrier 300, and the second conveying unit 600 is configured to convey the PCB 900 on the PCB carrier 300 to the calibration stage 400.
The specific embodiment comprises the following steps: outputting the PCB 900 produced in the previous step to the feeding table 200, and in the process that the grabbing recognition device moves along the output direction of the output path, grabbing the PCB 900 on the PCB carrier 300 by the second transmission unit and transmitting the PCB 900 to the calibration table 400, grabbing a new PCB 900 on the feeding table 200 by the first transmission unit 500 and transmitting the new PCB 900 to the PCB carrier 300; the position correction of the PCB 900 transferred thereto is performed by the calibration stand 400; in the process of reversely resetting the grabbing recognition apparatus along the output path, the image recognition unit 800 approaches the PCB carrier 300 and performs visual inspection on both side surfaces of a new PCB 900 thereon.
Therefore, through the reciprocating movement of the grabbing recognition device, the PCB 900 can be conveyed, and the visual detection and the position correction during the output of the two side surfaces of the PCB 900 are performed on line, so that the quality of the PCB 900 is ensured, the process flow is simplified, and the production efficiency of the PCB 900 is improved; in addition, the first conveying unit 500, the image recognition unit 800 and the second conveying unit 600 are all arranged on the grabbing recognition device, and the grabbing recognition device is driven to synchronously move, so that the grabbing recognition device is driven to move along the conveying path only by one driving device, the three can move along the conveying path, and the cost of independently arranging the driving devices for the three to move is saved.
It will be appreciated that during the process of taking and placing the PCB 900 by the first transfer unit 500 or the second transfer unit 600, the gripping recognition device needs to be stopped to ensure that the process is performed. In order to minimize the time of the gripping process stop, in one or more examples, the spacing between the loading station 200, the PCB carrier 300, the calibration station 400 may be matched to the spacing between the first transfer unit 500 and the second transfer unit such that the gripping recognition device need only be stopped in two states. Specifically, in the first moving state, as shown in fig. 1 to 2, the first conveying unit 500 is aligned with the loading table 200, so as to be capable of grabbing the PCB 900 on the loading table 200, and simultaneously, the second conveying unit 600 is aligned with the PCB carrier 300, so as to be capable of grabbing the PCB 900 on the PCB carrier 300; in the second moving state, as shown in fig. 3 to 4, the first transfer unit 500 is aligned with the PCB carrier 300, and is capable of lowering the gripped PCB 900 onto the PCB carrier 300, and at the same time, the second transfer unit 600 is aligned with the calibration stage 400, and is capable of lowering the gripped PCB 900 onto the calibration stage 400; when the grabbing recognition device moves from the second moving state to the first moving state, the image recognition unit 800 can approach the PCB carrier 300 and complete the detection of the PCB 900 on the PCB carrier 300 during the movement.
Therefore, through limiting the intervals among the feeding table 200, the PCB carrier 300, the calibration table 400 and the intervals among the first transmission unit 500 and the second transmission unit, the number of pauses involved in taking and placing the PCB 900 in the whole system operation process can be reduced, so that corresponding time expenditure is reduced, and the production efficiency of the PCB 900 is further improved.
In one or more embodiments, as shown in fig. 5 to 7, the image recognition unit 800 includes an upper recognition component 810 distributed over the exposure part 310 and a lower recognition component 820 distributed under the exposure part 310, the upper and lower recognition components 810 and 820 being fixedly disposed on the grip recognition device, respectively, a detection gap 830 is formed between the upper and lower recognition components 810 and 820 at an interval, and the PCB carrier 300 can pass through the detection gap 830; the PCB carrier 300 has an exposed portion 310, the exposed portion 310 being configured to enable the lower recognition component 820 to scan and detect the PCB board 900 through the PCB carrier 300. Thus, for the PCB 900 on the PCB carrier 300, an upper surface image of the PCB 900 may be acquired by the upper recognition assembly 810 and a lower surface image of the PCB 900 may be acquired by the lower recognition assembly 820 through the exposure portion 310 in a process in which the PCB carrier 300 can pass through the inspection gap 830.
The exposure portion 310 is shown in fig. 8, on the basis that the exposure portion 310 may be an optical carrier board disposed on the PCB carrier 300, which is made of a transparent material, so that the lower recognition component 820 obtains a lower surface image of the PCB 900 through the exposure portion 310 and supports the PCB 900 at the same time; the exposure portion 310 may also be a view-finding opening disposed on the PCB carrier 300, and expose a surface portion of the PCB 900 facing the PCB carrier 300 through the view-finding opening, so that the lower recognition component 820 can directly obtain an image, at this time, optical interference including refraction caused by the transparent board when the transparent board is disposed between the lower recognition component 820 and the PCB 900 can be avoided, image recognition accuracy of the lower recognition component 820 is improved, and meanwhile, negative pressure or static electricity generated by lamination between the PCB 900 and a table top of the PCB carrier 300 can be avoided, which causes the PCB 900 to be adsorbed on the PCB carrier 300 under the influence of the negative pressure or static electricity, and interference is caused to grabbing of the second conveying unit 600.
It should be noted that, when the exposure portion 310 is a view opening provided on the PCB carrier 300, at least a portion of the edge of the PCB 900 is supported on the PCB carrier 300 around a portion of the surface forming the exposure portion 310, it is understood that, in order to ensure the capturing range of the lower surface image of the PCB 900 by the lower recognition unit, the range of the edge of the portion of the PCB 900 that can participate in the supporting is smaller, and if the position of the PCB 900 when placed on the PCB carrier 300 is shifted, the PCB 900 may fall from the view opening. Here, for the position of the PCB 900 in the conveying direction, the deviation correction may be achieved by the movement of the first conveying unit 500 itself, and for the deviation of the PCB 900 in the moving path perpendicular to the first conveying unit 500, in one or more embodiments of the present application, the deviation is adjusted by the first baffle group, wherein the structure of the first baffle group is described in detail below.
In one or more embodiments, the upper and/or lower recognition assemblies 810, 820 include a scanning lens 840 and a scanning mating portion 850, the scanning lens 840 and the scanning mating portion 850 being fixedly disposed on the grasping recognition device. Wherein the scan lens 840 faces the PCB carrier 300; the scan matching part 850 is disposed between the scan lens 840 and the scan table, the scan matching part 850 has two scan matching blocks 851, a light transmission gap 852 is formed between opposite surfaces of the two scan matching blocks 851 at intervals, the light transmission gap 852 has a light transmission gap 852, the length direction of the light transmission gap 852 is perpendicular to the moving path of the image recognition unit 800, and the scan lens 840 can scan the PCB 900 on the PCB carrier 300 through the light transmission gap 852.
The scanning lens 840 needs to scan the PCB 900 on the PCB carrier 300 through the light-transmitting gap 852, so that the scanning range of the scanning lens 840 to the PCB 900 on the PCB carrier 300 is limited, the fixed amount of images acquired by the scanning lens 840 in unit time is ensured, the mutual interference between images is reduced, and the quality of the finished product of the images is improved.
On the other hand, the scanning mating portion 850 has a light-condensing opening 853 on a side of the light-transmitting gap 852 facing the scanning lens 840, and the light-condensing opening 853 communicates with the light-transmitting gap 852. The light-condensing opening 853 may be disposed in a V shape, wherein a side opening of the light-condensing opening 853 having a larger width faces the scan lens 840 and a side opening of the light-condensing opening 853 having a smaller width faces the PCB carrier 300.
By setting the light-condensing opening 853, the CCD laser emitted by the scanning lens 840 can be condensed, so that a beam of light is formed and then passes through the light-transmitting gap 852 to scan the PCB 900, at this time, the intensity of the CCD laser is higher, the phenomenon of light interference is not easy to occur, and the scanning accuracy of the scanning lens 840 is ensured.
In one or more embodiments, two light sources 854 are disposed on the scanning mating portion 850, the two light sources 854 are respectively located on two sides of the light transmission gap 852, and the illumination range of the two light sources 854 on the PCB 900 on the PCB carrier 300 covers the scanning range of the scanning lens 840 on the PCB 900 on the PCB carrier 300.
Thus, the two light sources 854 irradiate the scanning range from the two sides of the light transmission gap 852, so that the sufficient illumination of the detection range can be ensured, and the scanning quality of the scanning lens 840 can be improved; meanwhile, two light sources 854 are respectively positioned at two sides of the light transmission gap 852, so that the generation of backlight shadows can be reduced, and further, the scanning lens 840 can comprehensively and clearly acquire the image content of the scanning range. The backlight shadow refers to a reflection formed by blocking the illumination emitted from the single-side light source 854 when the impurities exist on the PCB 900.
In one or more embodiments, as shown in fig. 9, the first and/or second transfer units 500 and 600 each include a lifting assembly 710 and a negative pressure grasping assembly 720; the lifting assembly 710 includes a second lifting driving member 711, where a main structure of the second lifting driving member 711 is disposed on the grabbing recognition device, and an output portion of the second lifting driving member 711 is connected to the negative pressure grabbing assembly 720 through a first mounting seat 723, and is used to drive the negative pressure grabbing assembly 720 to lift; the negative pressure grabbing assembly 720 has a plurality of suction heads 721, and the suction heads 721 can be connected with an exhaust fan (not shown in the figure), and air is extracted through the exhaust fan to generate negative pressure for contacting with the surface of the PCB 900 and sucking the PCB 900.
The manner of grabbing the PCB 900 by negative pressure can reduce damage to the PCB 900; the second elevating driving member 711 drives the elevation of the negative pressure grabbing assembly 720, so that the negative pressure grabbing assembly 720 can be ensured to contact the surface of the PCB 900.
For the loading table 200, it should be noted that the first conveying unit 500 is mainly used for receiving the PCB 900 produced in the previous process, and for the process with relatively fast production efficiency, the inventor finds that, in the research process, when the first conveying unit 500 grabs the multiple PCBs 900 that are stacked together one by one, the adjacent PCBs 900 are prone to generate an adsorption force due to static electricity or negative pressure, so that the first conveying unit 500 has a possibility of carrying extra PCBs 900 when grabbing the PCBs 900, and at this time, the image recognition unit 800 cannot complete double-sided recognition of the PCBs 900.
Based on this, in one or more embodiments, the negative pressure gripping module 720 is made to include two suction groups including a plurality of suction heads 721 arranged in parallel, the suction heads 721 of the two suction groups being arranged in parallel; the two adsorption groups are arranged at intervals and are used for respectively adsorbing the two opposite side edges of the PCB 900, at this time, as shown in fig. 10, under the influence of gravity, the uppermost PCB 900 is easy to deform and is in an arc state, so that gaps are formed between the grabbed PCB 900 and the two side edges of the adjacent PCB 900 below, the adsorption force between the adjacent PCBs 900 is reduced, and the separation of the two PCBs 900 is promoted.
On this basis, the deformation amplitude of the PCB 900 is affected by various factors such as the thickness, the material, the structure, etc. of the PCB 900, so, in order to adapt to different deformation amplitudes of the PCB 900, the included angle between the suction heads 721 of the two suction groups may be adjusted, so as to adapt to different deformation amplitudes of the PCB 900.
Specifically, the negative pressure grabbing component 720 may have at least a first grabbing state and a second grabbing state for the adjustable included angle between the adsorption heads 721 of the two adsorption groups;
in the first grabbing state, the adsorption heads 721 of the two adsorption groups are arranged in parallel and perpendicular to the plate surface when the PCB 900 is in a flat state, wherein the flat state of the PCB 900 means that the PCB 900 does not deform and mainly aims at a part of the PCB 900 with high rigidity;
In the second grabbing state, the suction heads 721 of one suction set and the suction heads 721 of the other suction set are obliquely arranged along opposite directions and are perpendicular to the board surface of the PCB 900 in an arc state.
This ensures that the suction head 721 can be reliably brought into contact with the surface of the PCB 900, and improves the connection reliability between the suction head 721 and the PCB 900.
For a specific structure with an adjustable included angle between the suction heads 721 of the two suction groups, in one or more embodiments, the negative pressure grabbing assembly 720 further includes a first mounting seat 723, where the first mounting seat 723 is connected to an output portion of the second lifting driving member 711 to drive the whole negative pressure grabbing assembly 720 to lift; the suction set further includes a second mounting seat 724, and all suction heads 721 corresponding to the suction set are disposed on the second mounting seat 724, and when the second mounting seat 724 rotates, all suction heads 721 thereon rotate synchronously.
The second mounting seat 724 and the first mounting seat 723 are hinged to each other, and a telescopic driving member 725 is further arranged between the second mounting seat 724 and the first mounting seat 723, two ends of the telescopic driving member 725 are hinged to the first mounting seat 723 and the second mounting seat 724 respectively, driving force can be applied along with the second mounting seat 724 through telescopic driving member 725 telescopic, so that the corresponding second mounting seat 724 rotates along the opposite or opposite direction of the other adsorption group, and the included angle between the adsorption heads 721 of the two adsorption groups is adjusted to adapt to the PCB 900 with different deformation amplitudes.
In addition, the negative pressure grabbing component 720 further includes two reciprocating vibrators 726, which are respectively connected with the two second mounting seats 724 and used for driving the second mounting seats 724 to vibrate reciprocally, so that each adsorption head 721 vibrates, and when the PCB 900 is grabbed, the extra carried redundant PCB 900 falls off under the action of vibration.
Specifically, in one or more embodiments, as shown in fig. 9 and 10, the reciprocating vibrator 726 has a telescopic function, one end of the reciprocating vibrator is hinged to the first mounting seat 723, the other end of the reciprocating vibrator is connected to the second mounting seat 724, and the second mounting seat 724 is driven to shake up and down by the telescopic action of the reciprocating vibrator 726, so as to achieve the purpose of Cheng Wangfu vibration.
In one or more embodiments, a flexible joint 722 may be provided on the suction head 721. When the second elevating driving member 711 drives the negative pressure grabbing assembly 720 to descend, the adsorption head 721 contacts the PCB 900 through the flexible joint 722, and the flexible joint 722 can be compressed in the central axis direction or bent and deformed in the radial direction under the action of pressure. Therefore, when the surface of the PCB 900 is grabbed by the negative pressure grabbing component 720, through the arrangement of the flexible joint 722, the descending height of the negative pressure grabbing component 720 needs to be in a section, when the descending height of the negative pressure grabbing component 720 is located in the section, the contact between the flexible joint 722 and the surface of the PCB 900 can be completed, so that the negative pressure grabbing component 720 is adsorbed, the situation that the negative pressure grabbing component 720 is not contacted with the PCB 900 due to unsuitable descending height in the grabbing process, the PCB 900 cannot be grabbed, or the PCB 900 is extruded, and the PCB 900 is damaged is avoided. Meanwhile, through the arrangement of the flexible joint 722, deformation of the PCB 900 which may exist in the grabbing process is adapted.
For the calibration stand 400, in one or more embodiments, as shown in fig. 11 to 14, the calibration stand 400 includes a calibration stand body 410, a plate thickness detection device 430, an image acquisition device 440, and a calibration device 450;
wherein the calibration table 410 has a calibration table 420 for placing the PCB 900; the board thickness detection device 430 is arranged on the calibration table body 410 and is used for measuring the board thickness of the PCB 900 on the calibration table 420; the image acquisition direction of the image acquisition device 440 points to the calibration table 420 and is used for acquiring the position information of the PCB 900 on the calibration table 420; the calibration device 450 is in signal connection with the image acquisition device 440 and is in transmission connection with the calibration table 410 for driving the calibration table 410 to move.
Specifically, the system has a preset station adapted to the next process in the calibration table 400, and the PCB 900 located on the preset station can be conveyed to the next process in a track or an angle adapted to the next process, so that the smoothness of the PCB 900 in the conveying process and the accuracy of the operation of the next process are improved.
Based on this, after the PCB 900 is transferred onto the calibration table 420 of the calibration table 410 by the second transfer unit 600, the thickness of the PCB 900 is detected by the plate thickness detecting device 430, after the thickness detection is completed, the position information of the PCB 900 on the table is obtained by the image obtaining device 440, based on the position information, it can be determined whether the position of the PCB 900 on the table is offset compared with the preset station, and when the offset occurs, the calibration table 410 is driven to move by the calibration device 450, so as to drive the PCB 900 on the calibration table 420 to move to the preset station.
From this, this application acquires the thickness information of PCB 900 through board thickness detection device 430 acquisition PCB 900 to correct through the cooperation of image acquisition device 440 and calibrating device 450 to the position of PCB 900, make PCB 900 be in with the default station of next process adaptation after accomplishing the calibration, in order to improve the smoothness of PCB 900 transportation in-process and the precision of follow-up process operation.
When a plurality of PCBs 900 are stacked on the feeding table 200, the thickness information of the PCBs 900 obtained by the board thickness detection device 430 can provide a reference for the height of the first moving state where the second lifting driving member 711 in the first conveying unit 500 drives the negative pressure grabbing component 720 to descend, thereby ensuring that the negative pressure grabbing component 720 can still grab the PCBs 900 when the number of PCBs 900 on the feeding table 200 is reduced.
In one or more embodiments, as shown in fig. 12 to 13, the board thickness detecting device 430 includes an upper abutment 431 and a lower abutment 432, a first gap 433 for placing the PCB board 900 can be formed between the upper abutment 431 and the lower abutment 432 at intervals;
one of the upper and lower abutments 431 and 432 is connected with a stroke detecting element 434 and a first elevating driver 435, the first elevating driver 435 is used to drive the upper and lower abutments 431 and 432 to approach or separate from each other, and the stroke detecting element 434 is used to obtain the width of the first gap 433.
It should be noted that how the stroke detecting element 434 obtains the width of the first gap 433 may be to make the stroke detecting element 434 detect the stroke of the upper abutment 431 or the lower abutment 432 connected thereto in the vertical direction, when the upper abutment 431 or the lower abutment 432 contacts each other, the stroke detecting element 434 is zeroed, and then the stroke amount detected by the stroke detecting element 434 is the width of the first gap 433.
When the thickness of the PCB 900 is detected, the upper contact 431 and the lower contact 432 are separated from each other to form a first gap 433, the PCB 900 is placed in the first gap 433 between the upper contact 431 and the lower contact 432, the upper contact 431 or the lower contact 432 connected to the upper contact 431 is driven to move in a direction toward each other by the first lift driving member 435, so that the upper contact 431 abuts against the upper surface of the PCB 900, the lower contact 432 abuts against the lower surface of the PCB 900, and at this time, the width of the first gap 433, that is, the thickness of the PCB 900 is obtained by the stroke detecting member 434.
In one or more embodiments, in order to enable the upper abutment 431 to abut against the upper board surface of the PCB 900, the upper abutment 431 may be exposed outside the calibration mesa 420 and form a second gap 424 with the calibration mesa 420 for placing the PCB 900; at this time, the entire board thickness detecting device 430 has only the upper abutment 431 exposed outside the calibration mesa 420, i.e., the upper abutment 431 is above the calibration mesa 420, in order to avoid interference of the upper abutment 431 during placement of the PCB board 900 on the calibration mesa 420.
The plate thickness detection device 430 further includes a back-out driving member 436, the back-out driving member 436 being configured to drive the upper abutment member 431 toward or away from the center portion of the calibration table 420.
At this time, the entire plate thickness detecting device 430 is exposed outside the calibration mesa 420 only by the upper abutment 431, i.e., the upper abutment 431 is above the calibration mesa 420. By driving the upper abutment 431 away from the center of the calibration table 420 by the escape driving member 436, it is possible to facilitate avoiding the upper abutment 431 from interfering with the process when the second transfer unit 600 places the PCB 900 on the calibration table 420. The upper contact 431 can also be moved to the upper side of the PCB 900 by the escape driving member 436 based on the position of the PCB 900 recognized by the image acquisition device 440, and the thickness detection can be performed, thereby ensuring the performance of the thickness detection.
In one or more examples, the travel sensing element 434 and the first lift drive 435 can be connected to the upper abutment 431, at which point the calibration table 420 can be considered the lower abutment 432 and the second gap 424 can be considered the first gap 433. Thus, when the PCB 900 is in the second gap 424 between the abutment and the calibration mesa 420, the plate thickness of the PCB 900 can be detected and obtained by the first elevating driver 435 driving the upper abutment 431 to descend and abut against the upper plate surface of the PCB 900.
In one or more additional examples, the calibration table 410 may also have a relief channel 421 located on the calibration table 420; the lower abutment 432 connects the stroke detecting member 434 and the first elevating driving member 435, and the lower abutment 432 can pass through the escape passage 421 and approach the upper abutment 431. Therefore, when the PCB 900 is in the second gap 424 between the upper abutment 431 and the calibration mesa 420, the lower abutment 432 is driven by the first lifting driving member 435 to rise to above the calibration mesa 420 through the avoidance channel 421, and the lower abutment 432 drives the PCB 900 thereon to rise until the upper abutment 431 abuts against the upper board surface of the PCB 900, thereby detecting and obtaining the board thickness of the PCB 900.
The avoidance channel 421 may be provided at the edge of the calibration table 410, and the upper abutment 431 may be movable in the avoidance channel 421, so that the movable ranges of the upper abutment 431 and the lower abutment 432 may be widened, and further, the plate thickness detection may be ensured.
In addition, a plate thickness detection seat 437 may be provided at the output portion of the escape driver 436, and the upper and lower abutments 431 and 432 may be provided at the plate thickness detection seat 437 to cause the upper and lower abutments 431 and 432 to move synchronously, thereby ensuring engagement of the upper and lower abutments 431 and 432.
In one or more embodiments, the calibration device 450 may be a UVW platform 451, and the position of the calibration table body 410 is adjusted by the UVW platform 451 based on the position information of the PCB board 900 acquired by the image acquiring device 440, so that the PCB board 900 on the calibration table body 410 moves to a preset station.
In one or more embodiments, as shown in fig. 14, the image acquisition device 440 includes a camera 441, the camera 441 is fixed on the base 100, and the image acquisition direction of the camera 441 is directed toward the calibration tabletop 420;
as shown in fig. 11, the calibration mesa 420 is provided with an exposure area 422, and the exposure area 422 is used to enable the camera 441 to obtain positional information of the PCB 900 on the calibration mesa 420 through the calibration mesa 420.
At this time, the camera 441 performs image acquisition on the PCB 900 from bottom to top through the exposed area 422, and since the camera 441 is disposed on the base 100, when the calibration table 410 moves, the camera 441 remains fixed, so as to ensure objective and reliable position information of the PCB 900 acquired by the image acquisition device 440.
In one or more embodiments, the number of exposed areas 422 is at least two, and the two exposed areas 422 are disposed on the calibration mesa 420 corresponding to the areas of two opposite corners of the PCB 900;
The image acquisition device 440 includes at least two cameras 441, wherein the image acquisition directions of the two cameras 441 are respectively directed to the two exposed areas 422, and the position information of the two exposed areas 422 relative to the two corners of the PCB 900 is respectively acquired by the two cameras 441. Thus, the area range of the camera 441 required to acquire the image is reduced, so that the camera 441 can acquire a higher-precision image for a smaller area, thereby improving the precision of the position information of the PCB 900.
Wherein, because the face of PCB board 900 is the rectangle, two opposite corners of PCB board 900 refer to two corners that set up along the diagonal on the PCB board 900, based on the positional information of two corners, not only can be comparatively accurate obtain the position of PCB board 900, can also obtain the interval of two opposite corners of PCB board 900, and then can obtain the face area of PCB board 900.
In one or more embodiments, as shown in fig. 11, the calibration mesa 420 is spread with a plurality of second through holes 423, and through the arrangement of the plurality of second through holes 423, air can enter between the PCB 900 and the calibration mesa 420, so that negative pressure is prevented from being formed between the PCB 900 and the calibration mesa 420, and the PCB 900 is prevented from being offset again due to the adsorption force formed by the negative pressure when the PCB 900 is subsequently conveyed.
For the feeding table 200, in one or more embodiments, as shown in fig. 15 to 17, the feeding table 200 includes a feeding table body 210 and a plurality of side baffles 220, the feeding table body 210 has a feeding table 211 for placing the PCB boards 900, and the plurality of side baffles 220 are disposed on the feeding table 211 and cooperate with the feeding table 211 to form a receiving cavity, where the receiving cavity can place a plurality of overlapped PCB boards 900; among the plurality of side baffles 220, at least one side baffle 220 is provided with an air outlet channel and an air outlet opening 221 communicated with the air outlet channel, and the air outlet opening 221 faces the accommodating cavity.
Wind power is output through the air outlet opening 221 on the side baffle 220, the wind power can enter between the two PCB boards 900 from the edge gap of the two adjacent PCB boards 900, at the moment, the wind power can apply thrust for enabling the two PCB boards 900 to be far away from each other to the opposite surfaces forming the edge gap on the two PCB boards 900, the two PCB boards 900 are promoted to be separated, meanwhile, the wind power can remove static electricity carried on the PCB boards 900, and negative pressure between the two PCB boards 900 is filled with air, so that the possibility that the two PCB boards 900 are still adsorbed together is reduced.
Since there may be a difference between the edge gaps between the adjacent PCB boards 900, it is preferable that each side baffle 220 is provided with an air outlet channel and an air outlet opening 221 communicating with the air outlet channel, so as to ensure that wind force can act on the edge gaps.
In one or more embodiments, as shown in fig. 15, the air outlet opening 221 is disposed on a side of the side shield 220 facing the accommodating chamber, the air outlet opening 221 is elongated, and the air outlet opening 221 is disposed to extend in a height direction, one end of the air outlet opening 221 is adjacent to a top of the side shield 220, and the other end of the air outlet opening 221 is adjacent to a bottom of the side shield 220.
Through limiting the positions of two ends of the air outlet opening 221, the wind power input from the air outlet opening 221 can be ensured to spread over different depths of the accommodating cavity, so that the wind power can apply wind power to two adjacent PCBs 900 with different depths in the accommodating cavity, the two PCBs 900 are separated as soon as possible, the lower PCBs 900 are prevented from being separated when being carried to the top of the accommodating cavity by the upper adjacent PCBs 900, one side edge of the lower PCBs 900 is abutted against the side baffle 220 in the falling process, the PCBs 900 are finally caused to fall into the accommodating cavity in an inclined posture, and the PCBs 900 in the inclined posture are difficult to grasp by the subsequent first conveying unit 500.
Meanwhile, by limiting the width of the air outlet opening 221, the air outlet opening 221 is in a strip-shaped structure on the side surface of the side baffle 220 facing the accommodating cavity, so that the wind power output by the air outlet opening 221 is concentrated, the thrust exerted on the PCB 900 by the wind power is stronger, and the capability of separating the two PCBs 900 by the wind power is further improved.
On this basis, the width of the air outlet opening 221 may be made smaller than 10mm.
Further, to ensure that the wind force output from the wind outlet openings 221 extends over the entire receiving cavity, in one or more embodiments, the number of wind outlet openings 221 may be plural, and the plurality of wind outlet openings 221 extend over the side of the side barrier 220 facing the receiving cavity.
In one or more embodiments, the PCB panel 900 loading table 200 includes a first baffle group and a second baffle group, the first baffle group includes two opposite side baffles 220, the two side baffles 220 of the first baffle group are distributed along a direction perpendicular to a moving path of the first conveying unit 500, and a distance between the two side baffles 220 is adjustable; the second barrier group includes two opposite side barriers 220, the two side barriers 220 of the second barrier group are distributed along the direction of the moving path of the first transfer unit 500, and the two side barriers 220 are fixedly disposed.
Wherein, for convenience of explanation, the side baffles 220 in the first baffle group are defined as positioning plates 222, and the side baffles 220 in the second baffle group are defined as positioning plates 223.
For the first baffle group, as shown in fig. 17, the loading table 200 further includes a positioning driving member 240, a gear 251, and a rack 252; the two racks 252 are respectively connected with the two positioning plates 222, the two racks 252 are meshed with two sides of the gear 251, and the positioning driving piece 240 is connected with the gear 251 and is used for driving the gear 251 to rotate so as to enable the two positioning plates 222 to synchronously move in opposite directions, thereby adjusting the distance between the two positioning plates 222.
Through the transmission structure of the cooperation of the gear 251 and the two racks 252, the moving directions of the two positioning plates 222 can be opposite and the moving speeds are consistent, so that the centering of the PCB 900 can be ensured when the PCB 900 is received and clamped and positioned by the positioning plates 222.
On this basis, the cross-sectional area of the accommodating cavity can be enlarged by the mutual separation of the two positioning plates 222, so that the PCB 900 is easier to be placed into the accommodating cavity.
Through the mutual approaching of the two positioning plates 222, the corresponding two sides of the plurality of PCB plates 900 in the accommodating cavity can be extruded through the plate faces of the two positioning plates 222, so that the plurality of PCB plates 900 are flush at the corresponding two sides, and therefore the PCB plates 900 are positioned along the direction perpendicular to the moving path of the first conveying unit 500, the PCB plates 900 are positioned in the grabbing area of the first conveying unit 500, and the first conveying unit 500 can grab the PCB plates 900 accurately; meanwhile, the PCB 900 can be output at a fixed angle, wherein the fixed angle refers to an included angle between the length direction of the PCB 900 and a system conveying path, so that the image recognition unit 800 is convenient for acquiring the surface image of the PCB 900.
Moreover, at this time, the positioning plate 222 is always in contact with each PCB 900 in the accommodating cavity, and has a friction force, and when a certain PCB 900 is grabbed by the first conveying unit 500, the friction force can block the movement of the adjacent PCB 900 below the certain PCB, so as to further reduce the possibility that two PCBs 900 are adsorbed together.
Moreover, when the exposure portion 310 is a view finding opening disposed on the PCB carrier 300, by matching the two positioning plates 222, the deviation of the PCB 900 along the moving path perpendicular to the first conveying unit 500 can be corrected, so that the position of the PCB 900 when placed on the PCB carrier 300 can be supported by a portion of the surface of the PCB carrier 300 surrounding the exposure portion 310.
For the connection structure between the positioning plate 222 and the feeding table 211, in this case, in one or more embodiments, as shown in fig. 17, a guide rail 213 is disposed on the feeding table 210, the positioning plate 222 is slidably connected with the guide rail 213, and the guide rail 213 is used for guiding the two positioning plates 222 to move along the direction approaching or separating from each other, thereby ensuring the stable movement of the positioning plate 222.
For the second baffle group, two limiting plates 223 are disposed on two sides of the PCB 900, for limiting the position between the two corresponding sides of the PCB 900 when the PCB is placed on the loading table 200.
The distance between the two limiting plates 223 is slightly larger than the length of the PCB 900 along the corresponding two sides, so that the PCB 900 is conveniently placed into the accommodating cavity, meanwhile, the displacement of the PCB 900 along the corresponding two sides is limited by the limiting plates 223 and cannot excessively move, and excessive dislocation of the PCB 900 overlapped together along the directions of the corresponding two sides is avoided. By the arrangement of the limiting plate 223, the arrangement of the positioning driving piece 240, the gear 251 and the rack 252 can be reduced, and the corresponding cost is reduced.
For the source of wind power of the wind outlet 221, a plurality of fans with low power are respectively arranged in the wind outlet channel of the side baffle 220; alternatively, a high-power fan may be disposed outside the side baffle 220, and the air outlets of the high-power fans and the air outlet channels of all the side baffles 220 may be connected through the ventilation pipeline 230. Where low power and high power are relatively speaking.
Based on this, in one or more embodiments, as shown in fig. 16 to 17, a structure is selected in which the air outlets of the fans with high power and the air outlet passages of all the side baffles 220 are communicated through the ventilation duct 230, at this time, the ventilation duct 230 is disposed at a side of the loading table body 210 away from the loading table 211, and the ventilation duct 230 is provided with an air inlet 231 for communicating with the air outlets of the fans, and the wind power output from the fans is transmitted to each air outlet passage through the ventilation duct 230.
On this basis, the pipeline in the ventilation pipeline 230, which is communicated with the positioning plate 222, is a flexible pipe and is used for adapting to the movement of the positioning plate 222; the conduit in the ventilation pipeline 230 communicating with the limiting plate 223 may be a flexible pipe or a rigid pipe.
In one or more embodiments, as shown in fig. 15, a plurality of first through holes 212 are distributed over the feeding table top 211, and through the arrangement of the plurality of first through holes 212, air can enter between the PCB 900 and the feeding table top 211, so that negative pressure is prevented from being formed between the PCB 900 at the bottommost part of the accommodating cavity and the feeding table top 211, and the PCB 900 is prevented from being inconvenient to grasp due to the adsorption force formed by the negative pressure when the PCB 900 is grasped later.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Furthermore, it should be noted that the scope of the methods and apparatus in the embodiments of the present application is not limited to performing the functions in the order shown or discussed, but may also include performing the functions in a substantially simultaneous manner or in an opposite order depending on the functions involved, e.g., the described methods may be performed in an order different from that described, and various steps may also be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention.
Claims (10)
1. The PCB visual inspection system is characterized by comprising a feeding table (200), a PCB carrier (300), a calibration table (400) and a grabbing recognition device, wherein the feeding table (200), the PCB carrier (300) and the calibration table (400) are sequentially arranged;
the grabbing recognition device comprises a first conveying unit (500), an image recognition unit (800) and a second conveying unit (600) which are sequentially arranged, wherein the first conveying unit (500), the image recognition unit (800) and the second conveying unit (600) are movably arranged on the distribution paths of the feeding table (200), the PCB carrier (300) and the calibration table (400);
the first conveying unit (500), the image recognition unit (800) and the second conveying unit (600) synchronously move, the second conveying unit (600) is configured to convey the detected PCB (900) on the PCB carrier (300) to the calibration table (400), the first conveying unit (500) is configured to convey the undetected PCB (900) on the feeding table (200) to the PCB carrier (300), and the image recognition unit (800) is configured to perform double-sided recognition on the undetected PCB (900) on the PCB carrier (300).
2. The PCB board visual inspection system of claim 1, wherein the PCB carrier (300) has an exposed portion (310), the image recognition unit (800) including an upper recognition component (810) distributed over the exposed portion (310) and a lower recognition component (820) distributed under the exposed portion (310); the exposure part (310) is an optical carrier plate, or the exposure part (310) is a view finding opening.
3. The PCB board visual inspection system of claim 2, wherein the upper (810) and/or lower (820) identification components include a scanning lens (840) and a scanning mating portion (850);
the scanning matching part (850) is provided with a light transmission gap (852), the length direction of the light transmission gap (852) is perpendicular to the moving path of the image recognition unit (800), and the scanning lens (840) can scan the PCB (900) on the PCB carrier (300) through the light transmission gap (852);
the scanning mating portion (850) has a light-condensing opening (853) on a side of the light-transmitting gap (852) facing the scanning lens (840), and the light-condensing opening (853) communicates with the light-transmitting gap (852).
4. The PCB board vision inspection system of claim 1, wherein the first transfer unit (500) and/or the second transfer unit (600) includes a lifting assembly (710) and a negative pressure grabbing assembly (720);
the lifting assembly (710) is used for driving the negative pressure grabbing assembly (720) to lift;
the negative pressure grabbing component (720) comprises two adsorption groups which are arranged at intervals, each adsorption group comprises a plurality of adsorption heads (721) which are arranged in parallel, and an included angle between the adsorption heads (721) of each adsorption group is adjustable.
5. The PCB board vision inspection system of claim 4, wherein the negative pressure gripping assembly (720) has at least a first gripping state and a second gripping state;
in the first grabbing state, the adsorption heads (721) of the two adsorption groups are arranged in parallel and are perpendicular to the plate surface of the PCB (900) in a flat state;
in the second grabbing state, the adsorption heads (721) of one adsorption group and the adsorption heads (721) of the other adsorption group are obliquely arranged along opposite directions and are perpendicular to the plate surface of the PCB (900) in an arc state.
6. The PCB board vision inspection system of claim 4 or 5, wherein the negative pressure gripping assembly (720) further comprises a first mounting base (723), the suction group further comprises a second mounting base (724), and the suction head (721) of the suction group is disposed on the second mounting base (724);
The second mounting seat (724) is hinged with the first mounting seat (723), a telescopic driving piece (725) is further arranged between the second mounting seat (724) and the first mounting seat (723), and two ends of the telescopic driving piece (725) are respectively hinged with the first mounting seat (723) and the second mounting seat (724);
the telescoping drive (725) is configured to drive the second mount (724) to rotate in opposite or opposite directions along the other suction set.
7. The PCB board vision inspection system of claim 6, wherein the negative pressure gripping assembly (720) further includes a reciprocating vibrator (726), the reciprocating vibrator (726) being coupled to the second mount (724) for driving the second mount (724) to vibrate reciprocally.
8. The system according to claim 1, wherein the calibration table (400) comprises a calibration table body (410), a plate thickness detection device (430), an image acquisition device (440), and a calibration device (450);
the calibration table body (410) is provided with a calibration table surface (420) for placing a PCB (900);
The plate thickness detection device (430) is arranged on the calibration table body (410) and is used for measuring the plate thickness of the PCB (900) on the calibration table surface (420);
the image acquisition direction of the image acquisition device (440) points to the calibration table top (420) and is used for acquiring the position information of the PCB (900) on the calibration table top (420);
the calibration device (450) is in signal connection with the image acquisition device (440) and is in transmission connection with the calibration table body (410) and is used for driving the calibration table body (410) to move.
9. The PCB board vision inspection system of claim 1, wherein the loading station (200) includes a loading station body (210) and a plurality of side baffles (220);
the feeding table body (210) is provided with a feeding table surface (211) for placing a PCB (900);
the side baffles (220) are arranged on the feeding table top (211) and are matched with the feeding table top (211) to form a containing cavity, and the containing cavity can be used for containing a plurality of overlapped PCB (900);
among the side baffles (220), at least one side baffle (220) is provided with an air outlet channel and an air outlet opening (221) communicated with the air outlet channel, and the air outlet opening (221) faces the accommodating cavity.
10. The system according to claim 9, wherein the loading table (200) comprises a first baffle group, the first baffle group comprises two opposite side baffles (220), the two side baffles (220) of the first baffle group are distributed along a direction perpendicular to a moving path of the first conveying unit (500), and a distance between the two side baffles (220) is adjustable.
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