JP2001168600A - Method and apparatus for confirmation of mounting of component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To detect the mounting defect of a component with good accuracy and by a low-cost constitution. SOLUTION: A camera 21 and an illumination device 22 are mounted on the head unit of a surface mounting machine. The component which is sucked is imaged by the camera 21. The camera 21 is attached to the head unit so as to be directed to the tip of a head for component suction mounted on the head unit. A camera control part 31 which controls the camera 21 and the illumination device 22 is installed so that the tip (component suction part) of the head is imaged before the component is sucked, and after a head raising and lowering operation in order to mount the component. An image processing part 32 and a main computing part 30 which detect the mounting defect of the component on the basis of an image imaged by the camera 21 are installed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting confirmation method applied to a surface mounting machine which mounts an electronic component on a substrate such as a printed circuit board by sucking an electronic component by a component mounting head, and to an apparatus therefor. .

[0002]

2. Description of the Related Art Conventionally, a head for moving a component is mounted on a head unit movable between a component supply unit and a printed circuit board positioned at a predetermined working position so as to be able to move up and down and rotate, and the above-mentioned head is used to mount electronic components. A surface mounter that sucks and mounts a component at a predetermined position on a substrate is generally known.

In this type of surface mounter, for example, a component may remain at the tip of the head for some reason and may not be mounted on a substrate, and it is required to detect such a mounting failure of the component. Therefore, recently, a camera for mounting component imaging is mounted on the head unit, and after the head elevating operation for component mounting, the component mounting position on the printed circuit board is imaged, so that the component mounting based on the image is performed. It is considered to check whether or not.

[0004]

However, in the above-mentioned method, the imaging of the component mounting position is performed until the head unit starts moving after the head elevating operation for component mounting, for example, to pick up the next component. Must be done in a very short time. Therefore, there is a problem that it is difficult to obtain an image sufficient to accurately detect a mounting failure.

In particular, in recent years, there has been a demand for an increase in mounting speed, and it has become increasingly difficult to detect a mounting failure by the above-described method. In addition, in order to ensure the accuracy of the mounting defect detection, it is essential to use a high-speed and expensive device as a camera or its image processing device, which is one factor in increasing the cost of the mounting machine.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and a first object of the present invention is to provide a component mounting confirmation method capable of detecting a component mounting defect accurately and at a low cost. It is a second object of the present invention to provide a component mounting confirmation device that performs the component mounting confirmation method.

[0007]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a method of picking up a component by a component mounting head mounted on a movable head unit, and moving the component onto a substrate by moving the head unit. A component mounting inspection method for a surface mounting machine configured to mount a component on a substrate as the head is moved up and down by irradiating light to a component suction portion at a tip end of the head, and the component. A light receiving means capable of receiving light from the suction part is provided in the head unit, and after the head is moved up and down for mounting components, light is emitted from the irradiating means, and the light receiving state of the light receiving means at that time is changed. By checking, it is determined whether or not the component is mounted on the board (claim 1).

In this method, a state in which a component adsorbed on the head for some reason is not mounted on the substrate but remains on the head is detected, and by detecting such a state, a component mounting defect is detected. Is detected indirectly.
According to this method, since the irradiation unit and the light receiving unit are provided in the head unit, a mounting failure can be detected even while the head unit is moving. In the claims, “light from the component suction portion” means reflected light or transmitted light of a component or the like due to light emitted from the irradiation unit toward the component suction portion.

In the above method, an image pickup device capable of picking up an image of the head end portion is used as the light receiving means, while an illuminating device for providing illumination at the time of image pickup by the image pickup device is used as the irradiating means. It may be determined whether or not a component is mounted on the board based on an image captured by the device (claim 2). In this case, an image is taken in advance by the image pickup means using either the state in which the component is adsorbed by the head or the state in which the component is not adsorbed as a reference state. If it is determined whether or not the component is mounted on the board based on the difference image from the image taken by the imaging means (claim 3), the presence or absence of the component at the tip of the head can be checked accurately. Thereby, the accuracy of the determination is increased.

On the other hand, the component mounting confirmation device according to the present invention
The components are sucked by the component mounting head mounted on the movable head unit, the components are moved onto the board by the movement of the head unit, and the components are mounted on the board as the head moves up and down. A component mounting confirmation device for a surface mounter, comprising: an irradiating means for irradiating light to a component suction portion at a tip of a head, a light receiving device capable of receiving light from the component suction portion, and a head elevating operation for component mounting. Control means for controlling the irradiation means so as to irradiate the light from the irradiation means and controlling the light receiving means to be able to receive light; and determining whether or not the component is mounted on the board based on the light receiving state of the light receiving means. A discriminating means, wherein the irradiating means and the light receiving means are mounted on a head unit.

According to this device, after the head is moved up and down for component mounting, irradiation of light by the irradiating means, light receiving by the light receiving means, and determination as to whether or not the component is mounted on the substrate are automatically performed.

In the above device, the light receiving means is constituted by an image pickup device capable of picking up an image of the head end portion,
The illuminating unit is configured by an illumination device that provides illumination for imaging by an imaging device, and further determines whether a component is mounted on a board based on an image captured by the imaging device in a light receiving state. The determining means can be constituted (claim 5). In this case, before the head elevating operation for mounting the components, the imaging device and the illumination device are used to image the state based on either the state in which the components are adsorbed on the head or the state in which the components are not adsorbed. The control means is configured to perform control, and it is determined whether or not the component is mounted on the board based on a difference image between the image in the reference state and the image captured by the imaging means after the head elevating operation for mounting the component. The determination means may be configured as described above (claim 6).

In the apparatus according to the fourth aspect, the irradiating means and the light receiving means are arranged opposite to each other with a space for elevating and lowering the head, and the irradiating means is configured to irradiate the parallel light beams toward the light receiving means. On the other hand, the light receiving means may have an elongated light receiving portion so as to be able to receive the parallel light rays.

According to this configuration, it is possible to determine whether or not the component is mounted on the board by determining whether or not the component at the head end is present based on the detection of the projection width of the component suction portion after the component mounting operation. it can.

[0015]

Embodiments of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 schematically show a surface mounter to which a component mounting confirmation apparatus according to the present invention is applied.
As shown in the figure, a surface mounter (hereinafter abbreviated as a mounter)
A conveyor 2 for transporting a printed circuit board is arranged on the base 1, and the printed circuit board 3 is transported on the conveyor 2 and stopped at a predetermined mounting work position.
A component supply unit 4 is arranged on the side of the conveyor 2. The component supply unit 4 includes a component supply feeder, for example, a multi-row tape feeder 4a.

Above the base 1, a head unit 5 for mounting components is provided. The head unit 5 is movable between the component supply unit 4 and the component mounting unit where the printed circuit board 3 is located. In the present embodiment, the head unit 5 is moved in the X-axis direction (the direction of the conveyor 2) and the Y-axis direction (the X-axis direction on the horizontal plane). (In a direction perpendicular to the axis).

That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 rotated and driven by a Y-axis servomotor 9 are disposed on the base 1, and a head unit is mounted on the fixed rail 7. A support member 11 is provided, and a nut portion 12 provided on the support member 11 is screwed to the ball screw shaft 8. The support member 11 has X
An axial guide member 13 and a ball screw shaft 14 driven by an X-axis servo motor 15 are provided, and the head unit 5 is movably held by the guide member 13,
A nut (not shown) provided on the head unit 5 is screwed to the ball screw shaft 14. And
By the operation of the Y-axis servo motor 9, the support member 11
The head unit 5 moves in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15 while moving in the axial direction.

The head unit 5 is provided with a component suction head 20. The head 20 can move up and down with respect to the frame of the head unit 5 and rotate around the center axis of the head, and is driven by an elevation drive mechanism and a rotation drive mechanism (not shown). A nozzle is provided at the tip of the head 20, and a component can be sucked by supplying a negative pressure to the nozzle.

The head unit 5 includes a head 20.
A camera 21 (light receiving means; image pickup device) for picking up an image of the component adsorbed on the camera and an illumination device 22 (light irradiating means) are mounted. The camera 21 includes a CCD area sensor, and converts an image signal into an image processing unit 3 of a controller described later.
2 is output. The lighting device 22 includes a white LED or a fluorescent lamp, and is configured to provide illumination for imaging by the camera 21.

As shown in FIG. 2, the camera 21 and the illuminating device 22 are arranged side by side in the Y-axis direction on the side of the head 20, and are positioned at a predetermined standby position, for example, a rising end position in a lifting stroke. Is set (see FIGS. 5 and 6), the camera 21 and the lighting device 22
Are attached to the head unit 5 so as to be directed obliquely to the head end portion.

The above-mentioned mounting machine has a controller for controlling the whole apparatus. The controller includes a well-known CPU that executes a logical operation, a ROM that previously stores various programs for controlling the CPU, a RAM that temporarily stores various data during operation of the apparatus, and the like. The servo motors 9 and 15 are electrically connected to the controller. The driving of each servo motor 9 and the like is controlled by the controller according to a program stored in advance, so that a mounting operation described later is executed.

FIG. 3 shows a part of the control system included in the controller. In the mounting operation, it is determined whether or not a component is sucked by the head 20 to detect a suction failure. FIG. 3 shows a portion for detecting whether or not a component is mounted incorrectly by determining whether or not the component is mounted on the printed circuit board 3. That is, a portion corresponding to the component mounting confirmation device of the present invention is shown.

The control system shown in FIG. 1 includes a main processing unit 30, a camera control unit 31, an image processing unit 32, a storage unit 33, a display unit 34, and an input unit 35.

The main processing unit 30 controls the whole process for detecting a defective component suction and mounting operation.
1 outputs a control signal to the camera control unit 31 so as to capture an image of the head end portion (component suction portion) before and after the component suction operation and after the component mounting operation, and an image processing unit 32.
Based on the image data output from
It is determined whether or not a component is sucked by the head 20 to detect a suction failure. At the time of mounting a component, it is determined whether or not a component is mounted on the printed circuit board 3 from the head 20 to detect a mounting failure. It is configured. That is, in the present embodiment, the main processing unit 30 and the image processing unit 3
2 constitutes the control means and the determination means of the present invention.

The camera controller 31 controls the camera 21 and the lighting device 22 based on a control signal from the main processor 30.
It is configured to control the operation of.

The image processing section 32 performs a predetermined process on the image signal output from the camera 21 to extract a predetermined image such as a component image from the captured image,
The image data is output to the main processing unit 30.

The storage section 33 previously stores information necessary for detecting a defective suction and mounting of a component.
Data such as a reference value for the area of the component image, which will be described later, is stored in the storage unit 33.

The display unit 34 and the input unit 35
Input unit 3 consisting of RT display and keyboard
5 is configured to input component data, a program, and the like, while the display unit 34 is configured to perform display when inputting component data and display when a mounting failure occurs.

Here, a process for detecting a component suction failure performed by the control system shown in FIG. 3 will be described together with a mounting operation with reference to a flowchart of FIG.

First, the head unit 5 is moved to the component supply unit 4 for component suction, and as a preparation process, during this movement, the nozzle tip of the head 20 in the component non-sucking state (reference state) is moved to the camera. An image is taken by the camera 21 (step S1). Thus, an image of the nozzle tip portion as shown in FIG. 7A is captured, and this image data is output to the image processing unit 32. This image data is stored in the storage unit 33 of the main processing unit 30.

Then, the head unit 5 is connected to the component supply unit 4.
Is set above, the head 20 is driven up and down,
As a result, the component is picked up while being sucked to the head end (step S2).

When the suction of the components is completed, the head 20 is set to the standby position with the components Ch sucked as shown in FIG. 5, and the head unit 5 moves toward a predetermined component mounting position on the printed circuit board. The camera 2 is started at the timing when the head 20 is set to the standby position.
1, the tip of the nozzle of the head 20 is imaged (step S3).

Next, processing for obtaining a difference image of the images obtained in steps S1 and S2 is performed (steps S4 and S5). Specifically, each image is converted into a multi-tone image by A / D conversion. Then, after the gradation of each corresponding pixel in the image before component suction is subtracted from the gradation of each pixel in the image after component suction operation, the absolute value of the gradation of each pixel is obtained. Is converted to a binary image based on a predetermined threshold.

Here, when the component is sucked by the head 20, an image of the head end portion including the component Ch as shown in FIG. 7B is taken in step S3, and thus the image is obtained in step S5. The difference image shown in FIG.
As shown in (c), a pixel corresponding to the component Ch remains as, for example, a black pixel. This allows the part C
An image corresponding to h is extracted. On the other hand, if no component is adsorbed on the head 20, the process proceeds to step S
Since the images obtained in Step 1 and Step S2 are the same image, in the difference image obtained in Step S5, for example, almost all pixels of the image are white pixels as shown in FIG. 7D.

Then, in step S6, the data of the difference image is output to the main processing unit 30, where the component C
The area of the image corresponding to h is obtained (the number of black pixels is counted), and the reference value of the image area (the reference value of the number of pixels) is read out from the storage unit 33, and both values are compared. And the area difference is a predetermined set value (error value)
It is determined whether it is within the range (step S7).

Here, the reference value is the area of the component image when the component Ch is appropriately attracted to the head 20, and is set, for example, for each type of component Ch. The set value is set to a value sufficiently smaller than the area difference from the reference value when the area of the image corresponding to the component Ch is “0”. That is, when the component Ch is not attracted to the head 20, almost all the pixels of the image become white pixels and the area difference becomes large. It is determined whether or not Ch is adsorbed.

If it is determined in step S7 that the value is within the set value, that is, if it is determined that the component Ch is attracted to the head 20 and no defective suction occurs, the head 20 is driven up and down to move the component Ch. Is mounted at a predetermined component mounting position on the printed circuit board 3 (step S8). At this time, if the head unit 5 has not yet reached the position above the component mounting position of the printed circuit board 3, the head unit 5
Is reached, the head 20 is driven up and down.

On the other hand, if it is determined in step S7 that the value exceeds the set value, that is, if it is determined that a suction failure has occurred because the component Ch is not suctioned to the head 20, for example, the mounting operation is stopped. At the same time, a predetermined component suction NG determination process of displaying that fact on the display unit 34 is executed, and the flowchart ends.

When the mounting of the component Ch is completed in step S8 and the head 20 is set at the standby position as shown in FIG. 6, the head unit is then moved to the component supply unit 4 to suck the next component Ch. 5 starts, and the camera 21 captures an image of the head end portion (step S9).

Next, the image data obtained in step S1 is read from the storage unit 33 to the image processing unit 32, and a process of obtaining a difference image between this image and the image obtained in step S9 is performed (steps S10 and S11). ). Specifically, as in the processing in steps S4 and S5 described above, both images are
After being D-converted and converted into multi-gradation images, the gradation of each corresponding pixel in the image before component suction is subtracted from the gradation of each pixel in the image after the component mounting operation, and then the gradation of each pixel is calculated. The absolute value of the key is obtained, and the difference image is converted into a binary image based on a predetermined threshold.

Here, when the component Ch is mounted, the image obtained in step S9 and the image obtained in step S1 are the same image, so the difference image obtained in step S10 is As shown in FIG. 7D, almost all pixels of the image are white pixels, for example. On the other hand, when the component Ch remains in the head 20 for some reason and is not mounted on the printed circuit board 3,
Pixels corresponding to the component Ch remain as, for example, black pixels.

Next, in step S12, the data of the difference image is output to the main processing unit 30, where the area of the image corresponding to the component Ch is obtained (the number of black pixels is counted). The reference value of the image area (the reference value of the number of pixels) is read from the storage unit 33, and the two values are compared to determine whether the area difference is within a predetermined set value (error value) (step S13). ).

Here, the reference value is the area of the component image when the component Ch is attracted to the printed circuit board 3, that is, "0". Further, the set value is set to a value slightly larger than the area difference when the area of the component Ch is “0”. That is, if the component Ch is not mounted on the printed circuit board 3 and remains at the tip of the head, the component Ch
Since a large number of black pixel portions corresponding to the above remain, the area difference from the reference value increases. Therefore, whether or not the component Ch is mounted on the printed circuit board 3 is determined by checking whether or not the value is within the set value.

If it is determined in step S13 that the value is within the set value, that is, if it is determined that the component Ch of the head 20 has been mounted on the printed circuit board 3, for example, the component mounting OK indicating that fact is displayed on the display unit 34. After the determination process has been performed (step S14), this flowchart ends.

On the other hand, if it is determined in step S13 that the value exceeds the set value, that is,
When it is determined that a mounting failure has occurred due to the remaining of the display unit 3, for example, the mounting operation is stopped and the fact is indicated by the display unit 3.
The predetermined component suction NG determination process displayed in step 4 is executed, and this flowchart ends.

As described above, in the above mounting machine, the camera 21 for imaging the head end portion is mounted on the head unit 5, and the head end portion before picking up components and the head end portion after component mounting operation are controlled by the camera 21. Since the occurrence of a mounting failure is detected by imaging and obtaining a difference image between the two images, it is possible to obtain an image necessary for detecting the mounting failure regardless of whether the head unit 5 is stopped or moving. it can. That is, there is little restriction on the imaging time of the camera 21. Therefore, it is possible to secure a sufficient imaging time as compared with the conventional device that needs to capture an image in a very short time until the head unit starts to move after the component mounting operation, and accordingly, it is possible to detect a mounting defect correspondingly. It is possible to stably obtain a high-quality image suitable for.

Therefore, according to the apparatus of the above embodiment,
Since the mounting failure of the component is detected based on such a high-quality image, the mounting failure of the component can be detected more accurately than in the conventional apparatus. In addition, since there is little restriction on the imaging time of the camera 21, there is no need to use an expensive high-speed camera or lighting device, and therefore, there is an effect that an inexpensive configuration can be used to accurately detect a mounting defect.

The mounting machine described above is an embodiment of an example of a mounting machine equipped with the component mounting confirmation device according to the present invention. The configuration can be appropriately changed without departing from the gist of the present invention.

For example, in the mounting machine described above, a camera 21 and an illuminating device 22 are provided so as to pick up an image of the head end from obliquely above the head 20 set at the standby position as shown in FIG. As shown in FIG. 8, a camera 21 and an illuminating device 22 may be provided in the head unit 5 so as to capture an image of the head end portion from a substantially horizontal direction.

As shown in FIG. 9, a camera 21 and an illuminating device 22 are arranged opposite to each other with a space for ascending and descending the head 20 therebetween, so as to capture an image of a projection of a head end portion, a component Ch and the like. You may.

Further, as the irradiating means and the light receiving means of the present invention, the camera 21 and the illuminating device 2 as in the above embodiment are used.
Instead of using, for example, as shown in FIG. 10, the head is configured such that the irradiating unit 40 (irradiating unit) of the parallel light beam 42 and the light receiving unit 41 (light receiving unit) face each other with the space for elevating the head 20 therebetween. The presence / absence of a component at the head end is determined by examining the projection width of the parallel light beam 42 received by the light receiving unit 41 provided in the unit 5, and a component suction failure or a component placement failure is detected based on this. You may do so.

Although not shown, as a simpler configuration of the example shown in FIG. 10, for example, an irradiating section (irradiating means) for irradiating a spot light and a light receiving section (light receiving means) are provided opposite to each other. The photoelectric sensor provided in the head unit 5 is provided, and the presence or absence of a component at the head end is determined by examining the light receiving state of the spot light in the light receiving unit. Based on the determination, a component suction failure or a component mounting failure is detected. You may do so.

In the above embodiment, the image of the head end portion before picking up the component (the image obtained in step S1 of the flowchart shown in FIG. 4) is used as the reference state image.
It is determined whether or not the component Ch is mounted on the printed circuit board 3 based on a difference image between this image and the image of the head end portion after the head lifting operation for component mounting (the image obtained in step S9). However, for example, an image of the head end portion after component suction (the image obtained in step S3) is used as the image in the reference state, and the above-described determination is performed based on a difference image from this image. Is also good.

Further, by obtaining the difference image as described above,
In addition to determining whether or not h is mounted on the printed circuit board 3, for example, the camera 21 may be configured to capture an image of the tip of the head with the portion of the head 20 masked in advance, or By applying a window to the portion of the head 20 in advance and performing processing, the presence or absence of a component at the tip of the head can be checked without obtaining the difference image as described above. This eliminates the need to obtain a difference image as described above, thereby simplifying image processing.

[0056]

As described above, according to the present invention, the head unit is provided with the light irradiating means and the light receiving means, and the light is radiated from the irradiating means and the light receiving state by the light receiving means at that time is changed. The presence or absence of a component at the tip of the head is checked based on this, and a component mounting defect is detected based on this. Therefore, whether the head unit is stopped or moving, the light receiving state of the light receiving unit is checked to mount the component. Defects can be detected. Therefore, for example, after mounting components
Compared to conventional devices that require processing to be completed in a very short time before the head unit starts to move, there are fewer restrictions on the time required for processing, and high-speed processing devices etc. Can be detected without depending on. Therefore, there is an effect that a mounting failure can be detected accurately with an inexpensive configuration.

[Brief description of the drawings]

FIG. 1 is a plan view showing a surface mounter to which a component mounting confirmation device according to the present invention is applied.

FIG. 2 is a front view showing a surface mounter to which the component mounting confirmation device according to the present invention is applied.

FIG. 3 is a block diagram showing a part of a control system of the surface mounter corresponding to a component mounting confirmation device according to the present invention.

FIG. 4 is a flowchart illustrating a process (including a mounting operation) for detecting a component mounting defect.

FIG. 5 is a schematic diagram illustrating an imaging operation of a head tip by a camera (before mounting components).

FIG. 6 is a diagram illustrating an image pickup operation of the head end by the camera (after component mounting).

FIG. 7 is a schematic diagram illustrating a process for detecting a component mounting failure.

FIG. 8 is a schematic diagram showing another example of arrangement of a camera and a lighting device in a head unit.

FIG. 9 is a schematic diagram illustrating another example of arrangement of a camera and a lighting device in a head unit.

FIG. 10 is a schematic diagram for explaining another example of the component mounting confirmation device according to the present invention.

[Explanation of symbols]

 3 Printed Circuit Board 5 Head Unit 20 Head 21 Camera (Light Receiving Unit) 22 Illumination Device (Irradiating Unit) 30 Main Operation Unit (Control Unit, Discriminating Unit) 31 Camera Control Unit 32 Image Processing Unit (Control Unit, Discriminating Unit) 33 Storage Unit 34 Display unit 35 Input unit Ch parts

Claims (7)

[Claims] 1. A component mounting head mounted on a movable head unit sucks a component, moves the component onto a substrate by moving the head unit, and mounts the component on the substrate as the head moves up and down. A component mounting inspection method for a surface mounter configured to perform irradiation with light to a component suction portion at the tip of a head and light receiving means capable of receiving light from the component suction portion. Provided in the unit, after the head elevating operation for component mounting,
A component mounting confirmation method comprising: irradiating light from the irradiating unit; and examining a light receiving state of the light receiving unit at that time to determine whether a component is mounted on the board. 2. An image pickup device capable of picking up an image of the tip of the head is used as the light receiving means, and an illuminating device for providing illumination at the time of image pickup by the image pickup device is used as the irradiating means. The method according to claim 1, wherein it is determined whether or not the component is mounted on the board based on an image captured by the device. 3. An image is taken in advance by the image pickup means with a state in which a component is sucked or a state in which the component is not sucked by the head as a reference state. 3. The component mounting confirmation method according to claim 2, wherein it is determined whether or not the component is mounted on the board based on a difference image from an image captured by the imaging unit after the operation. 4. A component is adsorbed by a component mounting head mounted on a movable head unit, and the component is moved onto the substrate by moving the head unit, and the component is mounted on the substrate as the head moves up and down. A component mounting confirmation device for a surface mounter configured to perform, a light irradiating means for irradiating light to a component suction part at the tip of the head, and a light receiving means capable of receiving light from the component suction part, Control means for controlling the irradiating means so as to irradiate light from the irradiating means after the head elevating operation for component mounting, and controlling the light receiving means to be able to receive light; and a component based on a light receiving state of the light by the light receiving means. Determining means for determining whether or not the light source is mounted on the substrate, wherein the irradiating means and the light receiving means are mounted on the head unit. Recognition device. 5. The light receiving means comprises an imaging device capable of capturing an image of the head end portion, while the irradiating means comprises an illuminating device for providing illumination for imaging by the imaging device. 5. The component mounting confirmation device according to claim 4, wherein the component mounting checking device is configured to determine whether a component is mounted on the board based on an image captured by the imaging device as a light receiving state. 6. The image pickup apparatus and the illumination device, wherein the control unit is configured to cause the head to pick up an image of a state in which a component is sucked or a state in which the component is not sucked as a reference state before a head elevating operation for mounting a component. The determination means is configured to determine whether a component is mounted based on a difference image between the image in the reference state and the image captured by the imaging unit after the head elevating operation for mounting the component. 6. The component mounting confirmation device according to claim 5, wherein the device is configured to determine. 7. The irradiation means and the light receiving means are arranged opposite to each other with a space for elevating the head, and the irradiation means is configured to irradiate a parallel light beam toward the light receiving means. 5. The device according to claim 4, wherein said light receiving means has an elongated light receiving portion so as to receive said parallel light beam.