KR20150003161A - Exposure writing device and exposure writing method - Google Patents

Exposure writing device and exposure writing method Download PDF

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Publication number
KR20150003161A
KR20150003161A KR1020147025492A KR20147025492A KR20150003161A KR 20150003161 A KR20150003161 A KR 20150003161A KR 1020147025492 A KR1020147025492 A KR 1020147025492A KR 20147025492 A KR20147025492 A KR 20147025492A KR 20150003161 A KR20150003161 A KR 20150003161A
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South Korea
Prior art keywords
substrate
exposure
mark forming
stage
forming means
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KR1020147025492A
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Korean (ko)
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KR102024617B1 (en
Inventor
아키히로 하시구치
히로아키 키쿠치
히로노리 츠루이
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가부시키가이샤 아도테크 엔지니어링
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

A first exposure means for drawing a circuit pattern on the first surface by exposing a first surface of the printed wiring board mounted on the stage; a second exposure means provided on the first surface of the printed wiring board so as to be movable relative to the stage, A mark formation means for forming a plurality of predetermined marks on a second surface opposite to the first surface during the rendering process of the surface pattern, a measurement means for measuring the position of the mark formation means, a plurality of marks A second exposure for drawing a circuit pattern on the second surface by exposing the second surface of the printed wiring board based on the position of the measured mark forming means and the position of the detected plurality of marks, Means.

Figure P1020147025492

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus and an exposure method,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus and an exposure method, and more particularly to an exposure apparatus and an exposure method for imaging an image on a substrate.

In recent years, as an exposure apparatus for forming a circuit pattern using a flat substrate as a substrate to be exposed, an exposure apparatus has been developed for irradiating the substrate with the drawing light directly without using a transfer mask to draw a circuit pattern. However, in the case of drawing a circuit pattern on a substrate requiring high resolution, the dust adhered to the hole during the hole forming process and the dust adhering to the hole in the process of moving may fall on another substrate, The periphery may be deformed. In this case, the relative positions of the circuit pattern drawn on the first surface of the substrate and the circuit pattern drawn on the second surface are shifted.

Therefore, an exposure apparatus for drawing an alignment mark necessary for drawing a circuit pattern on the first and second surfaces of the substrate has been proposed. Japanese Unexamined Patent Publication No. 2008-292915 discloses an exposure apparatus for drawing first and second alignment marks on the first surface and the second surface of a substrate to be exposed, respectively. This exposure apparatus draws a circuit pattern on the first and second surfaces of the substrate based on the first and second alignment marks. In the specification of U.S. Patent No. 6,701,192 B2, a fixed ultraviolet light source in a positional relationship between a stage and a substrate is used to form a mark for alignment on the second surface simultaneously with the exposure of the first surface of the substrate to be exposed An exposure apparatus is disclosed.

In the exposure apparatus disclosed in Japanese Patent Application Laid-Open No. 2008-292915, it is necessary to form an alignment mark before rendering processing. Therefore, there is a problem that the cycle time is affected by the firing time. Further, there is a problem that it is necessary to correct the positional difference between the alignment marks for alignment between the first surface and the second surface. Further, there has been a problem that a device configuration for forming alignment marks on both the first and second surfaces is required.

Further, in the exposure apparatus disclosed in the specification of U.S. Patent No. 6,701,192 B2, the position for drawing the alignment mark on the substrate to be exposed is fixed. Therefore, when exposure is performed for each of a plurality of substrates having different sizes, the alignment mark can not be drawn at an optimum position corresponding to the size of the substrate to be exposed. As a result, there has been a problem that the alignment accuracy may decrease depending on the size of the substrate.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems and provides an exposure apparatus and an exposure method capable of improving alignment accuracy on the front and back sides of a substrate to be imaged without depending on the size of the substrate.

An exposure apparatus according to the present invention comprises first exposure means for drawing a circuit pattern on a first surface of a printed wiring board mounted on a stage to expose a first surface of the printed wiring board, A mark forming means for forming a plurality of predetermined marks on a second surface opposite to the first surface during the drawing process of the circuit pattern for a first surface on the first surface of the printed wiring board; Detecting means for detecting a position of a plurality of marks formed on the second surface of the printed wiring board by the mark forming means; and a position detecting means for detecting a position of the mark forming means measured by the measuring means, And exposing the second surface of the printed wiring board with reference to the positions of the plurality of marks detected by the means And a second exposure means for drawing a circuit pattern on the second side group.

According to this exposure apparatus, the circuit pattern is drawn on the first surface by exposing the first surface of the printed wiring board mounted on the stage by the first exposure means. Further, according to this exposure apparatus, by the mark forming means provided so as to be relatively movable with respect to the stage, on the first surface of the printed wiring board, A plurality of predetermined marks are formed on two surfaces. Further, according to this exposure apparatus, the position of the mark forming means is measured by the measuring means. Further, according to this exposure apparatus, the position of a plurality of marks formed on the second surface of the printed wiring board is detected by the mark formation means by the detection means.

Here, in the present invention, by the second exposure means, the position of the mark formation means measured by the measurement means and the position of the plurality of marks detected by the detection means are referred to as the second Expose the surface. As a result, the circuit pattern is drawn on the second surface.

That is, in the present embodiment, the positions of the mark forming means are measured, and a plurality of marks are formed by the mark forming means at the position of the second surface in a known relationship with the exposure position of the circuit pattern for the first surface. Further, when the circuit pattern for the second surface is exposed on the second surface, the circuit pattern for the second surface is drawn based on the position of the mark forming means and the positions of the plurality of marks. Thus, the positions of the circuit patterns to be drawn on the first and second surfaces can be matched. The " drawing process " refers to a series of processes from the time when the printed wiring board is loaded on the stage to the time when the drawing of the circuit pattern is completed and the printed wiring board is discharged.

As described above, according to the exposure apparatus of the present invention, the position of the circuit pattern drawn on the second surface is referred to as the first surface, with reference to the positions of the plurality of marks in the known positional relationship with the circuit pattern drawn on the first surface, To the position of the circuit pattern to be imaged. As a result, the accuracy of alignment on the front and back surfaces of the substrate can be improved without depending on the size of the substrate.

Further, in the present invention, the mark forming means may be provided so as to be movable with respect to at least one of a predetermined direction and a direction crossing the predetermined direction with reference to any one side of the printed wiring boards stacked on the stage . This makes it possible to adjust the positions at which a plurality of marks are formed at appropriate positions.

Further, in the present invention, the mark forming means may be arranged in a range in which the mark can be formed on a plurality of types of printed wiring boards whose movable range is different in size. This makes it possible to form a plurality of marks at appropriate positions without depending on the size of the substrate.

Further, the present invention may further comprise specifying means for specifying the size of the printed wiring board, and the mark forming means may form each of the plurality of marks according to the size specified by the specifying means. As a result, a plurality of marks can be formed at appropriate positions according to the size of the substrate.

Further, in the present invention, the measuring means may include photographing means for photographing the mark forming means, and the position of each of the mark forming means may be measured by using the photographed image by the photographing means. Thus, the position of the mark forming means can be easily measured.

In the present invention, the mark forming means is formed at a position where the calibration mark at a known relative position with respect to the mark forming means can be photographed by the measuring means even though the printed wiring board is loaded on the stage , The measuring means may include photographing means for photographing the mark forming means so that each of the calibration marks is photographed, and the position of each of the mark forming means may be measured using the photographed image by the photographing means. This makes it possible to measure the position of the mark forming means even when the mark forming means can not be photographed.

Further, in the present invention, a plurality of photographing means may be provided, and each of the photographing means may photograph one or more of the mark forming means. Thus, the position of the mark forming means can be easily measured.

Further, in the present invention, the photographing means may have a known relationship with a position at which the circuit pattern is drawn, and may be provided movably relative to the stage. This makes it possible to measure the position of the mark forming means without depending on the position of the mark forming means.

Further, in the present invention, the mark forming means may form the mark by exposing the second surface of the printed wiring board with light having a short wavelength. As a result, a plurality of marks can be formed at appropriate positions and with high accuracy.

Further, in the present invention, the mark forming means may form the plurality of marks by attaching ink to the second surface of the printed wiring board. As a result, a plurality of marks can be formed simply.

The exposure method according to the present invention comprises first exposure means for drawing a circuit pattern on the first surface by exposing a first surface of a printed wiring board mounted on a stage, A mark forming means for forming a plurality of predetermined marks on a second surface opposite to the first surface; a measuring means for measuring a position of the mark forming means; Detecting means for detecting a position of a plurality of marks formed on a surface of the printed wiring board and second exposure means for drawing a circuit pattern on the second surface by exposing the second surface of the printed wiring board, A step of controlling the measuring means so that the position of the mark forming means is measured; A step of drawing a first circuit pattern on the first surface of the printed wiring board and a second circuit pattern on the second surface in correspondence with the first circuit pattern during drawing of the circuit pattern; A step of controlling the exposure means and the mark forming means so as to form a mark of the mark formed on the basis of the position of the mark forming means measured by the measuring means and the position of the plurality of marks detected by the detecting means And controlling the second exposure means so that the second surface circuit pattern is drawn on the second surface.

Since the exposure method according to the present invention operates in the same manner as the exposure apparatus according to the present invention, the alignment accuracy in the front and the back of the substrate can be improved without depending on the size of the substrate, Can be improved.

[Effects of the Invention]

According to the present invention, it is possible to improve the alignment accuracy on the front and back sides of the substrate to be imaged independently of the size of the substrate to be exposed.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a configuration diagram showing the entire configuration of an exposure system according to an embodiment. FIG.
2 is a block diagram showing the functions of the exposure system according to the embodiment.
FIG. 3A is a front view showing an example of the surface when the surface of the substrate to be exposed is exposed in the exposure system according to the embodiment. FIG.
Fig. 3B is a front view showing an example of the back surface when the back surface of the substrate to be exposed is exposed in the exposure system according to the embodiment. Fig.
4 is a perspective view showing a configuration of a first exposure apparatus and a second imaging apparatus according to the embodiment;
5 is an exploded perspective view of the substrate clamp mechanism portion of the first exposure apparatus and the second exposure apparatus according to the embodiment.
6 is an enlarged cross-sectional view for explaining the functions of the photosensors of the first and second exposure apparatus according to the embodiment.
FIG. 7A is an enlarged cross-sectional view of essential parts for explaining a mark forming unit of the first and second exposure apparatuses according to the embodiment. FIG.
Fig. 7B is a partially enlarged top view for explaining the mark forming unit of the first and second exposure apparatuses according to the embodiment; Fig.
8 is a schematic measurement side view showing the configuration of the reversing mechanism in the reversal apparatus of the exposure system according to the embodiment.
9 is a configuration diagram showing an electrical system of the first exposure apparatus and the second exposure apparatus according to the embodiment.
10 is a view showing the relationship between the moving direction of the stage and the moving direction of the photographing portion in the exposure system according to the embodiment.
11 is a view showing the range of movement of the ultraviolet light source of the exposure imaging system according to the embodiment.
12 is a flowchart showing the flow of processing of the exposure preprocessing program according to the embodiment.
Fig. 13 is a schematic front view provided in the explanation of the exposure pre-treatment according to the embodiment; Fig.
14 is a flowchart showing the flow of processing of the first exposure processing program according to the embodiment.
15 is a schematic front view provided for explanation of the first exposure process according to the embodiment.
16 is a flowchart showing the flow of processing of the second exposure processing program according to the embodiment.
17 is a schematic front view provided for explanation of the second exposure process according to the embodiment.
18 is a schematic front view showing the relationship between the size of the substrate to be exposed and the drawing position of the alignment mark in the exposure system according to the embodiment.

Hereinafter, the exposure drawing system according to the present embodiment will be described in detail with reference to the accompanying drawings. In this embodiment, a flat board substrate such as a printed wiring board, a printed board and a glass substrate for a flat panel display is used as the exposure substrate 1 as the exposure imaging system 1, and a first surface (hereinafter referred to as " (Hereinafter also referred to as " back surface ") and a second surface (hereinafter also referred to as " back surface ").

Fig. 1 is a configuration diagram showing the entire configuration of the exposure and drawing system 1 according to the present embodiment. 2 is a block diagram showing the functions of the exposure and drawing system 1 according to the present embodiment. As shown in Figs. 1 and 2, the exposure system 1 includes a first exposure apparatus 2 for performing exposure on the surface of the substrate to be exposed and for forming alignment marks on the back surface of the substrate to be exposed Respectively. Further, the first exposure apparatus 2 measures the position of the ultraviolet light source 51, which will be described later, before forming the alignment mark. The exposure imaging system 1 also includes an inversion device 3 for inverting the front and back of the substrate. The exposure imaging system 1 also includes a second exposure apparatus 4 for performing exposure on the back surface of the substrate to be exposed. The exposure system 1 also includes a first transfer section 5 for transferring the substrate from the outside to the first exposure apparatus 2 and a second transfer section 5 for transferring the substrate from the first exposure apparatus 2 to the inversion And a second conveying unit 6 for conveying the image to the apparatus 3. The exposure system 1 also includes a third transfer section 7 for transferring the substrate to be inspected from the inverting apparatus 3 to the second exposure apparatus 4 and a second transfer section 7 for transferring the substrate to the second exposure apparatus 4 To the outside of the apparatus.

3A is a front view showing an example of the surface C1 when the surface C1 of the substrate C is exposed and FIG. Fig. 2 is a front view showing an example of the back side (C2) in the case where the back side is made.

As shown in Fig. 3A, the surface exposure image P1 is drawn by the first exposure apparatus 2 on the surface C1 of the substrate C to be exposed. 3B, on the back surface C2 of the substrate C, the back surface image P2 is formed by the second exposure apparatus 4 so that the surface image P1 of the surface C1 is drawn (Hereinafter, referred to as " image coordinate system "). In the present embodiment, the image P1 for the surface is an image of the " F " shape. In the present embodiment, the backside image P2 is a rectangular frame-shaped image surrounding the area of the back surface C2 corresponding to the image of the "F" shape on the surface C1. The rear surface C2 of the substrate C is provided with a plurality of (two in this embodiment) (for example, two in the present embodiment) An alignment mark M is drawn. The alignment mark M is used for aligning the position of the image P1 for the surface and the position of the image P2 for the rear surface which are respectively drawn on the surface C1 and the back surface C2 of the substrate C Mark.

In the exposure system 1 according to the present embodiment, the first exposure apparatus 2 is provided on the upstream side in the carrying direction of the substrate C to be exposed. The first exposure apparatus 2 exposes the surface C1 of the substrate C to the surface to form a surface image P1 on the surface as described above when the unexposed substrate C is brought into the apparatus, . The first exposure apparatus 2 also forms an alignment mark M on the back surface C2 of the substrate C. [

In the exposure imaging system 1 according to the present embodiment, the alignment mark M is drawn in a circular shape of about 0.5 mm to 1 mm. However, the size or shape is not limited to this. For example, the size may be any size as long as it does not overlap with the drawing of the image P1 for the front side and the image P2 for the rear side, and the shape may be arbitrarily set, such as a cross shape or a rectangular shape.

An inverting device 3 for inverting the front and back surfaces of the substrate C is provided downstream of the first exposure apparatus 2 in the carrying direction of the substrate C to be exposed. When the surface C1 is exposed by the first exposure apparatus 2 and the substrate C on which the alignment mark M is drawn is carried in the inverting apparatus 3, C of the substrate C in order to perform exposure on the back surface C2 of the substrate C.

A second exposure apparatus 4 for exposing the back surface C2 of the substrate C to the exposure is provided on the downstream side of the substrate 3 in the transport direction of the substrate C. [ The second exposure apparatus 4 exposes the back surface C2 of the substrate C to be exposed when the substrate C inverted by the inverting apparatus 3 is carried into the apparatus to form the back surface image P2 ). At this time, the second exposure apparatus 4 is aligned with the alignment mark M drawn on the substrate C by the first exposure apparatus 2, Exposure is performed.

The first conveying device 5, the second conveying device 6, the third conveying device 7 and the fourth conveying device 8 each have a plurality of rotating rollers and a driving motor for rotating the rotating rollers. A plurality of rotating rollers are installed in parallel, and one end of the rotating roller is equipped with a sprocket or a pulley receiving a rotational force transmitted by a belt or a wire. As a means for transmitting the rotational force of the driving motor for rotating the rotating roller, a method of transmitting by a cylindrical magnet other than a belt or a wire may be adopted.

In this embodiment, in order to increase the throughput (production amount per hour) of the substrate to be exposed (C), two exposure apparatus (2) and a second exposure apparatus (4) C and the back surface C2 of the photoreceptor drum C are exposed. However, the number of exposure apparatuses is not limited to two, and the two surfaces of the substrate C to be exposed are reversed while the substrate C is reversed from the surface C1 to the backside C2 with one exposure apparatus It is also possible to do.

Next, the configurations of the first and second exposure apparatus 2 and 4 will be described.

4 is a perspective view showing the configurations of the first and second exposure apparatus 2 and 4 according to the present embodiment. Hereinafter, the direction in which the stage 10 is moved is defined as the Y direction, the direction orthogonal to the Y direction is defined as the X direction, the direction perpendicular to the Y direction is defined as the Z direction, The rotation direction as the center is defined as the? Direction.

As shown in Fig. 4, the first exposure apparatus 2 includes a stage 10 in the form of a flat plate for fixing the substrate C to be exposed. The stage 10 is movable so that the substrate C fixed on the stage 10 moves the substrate C to the exposure position in accordance with the movement of the stage 10, A light beam is irradiated onto the surface of the substrate C to form the image C1 for the surface.

The stage 10 is supported by a flat plate-like base 12 movably provided on the surface of the base 11 in the form of a table. A moving mechanism 13 having a moving driving mechanism (not shown) configured by a motor or the like is provided between the base 12 and the stage 10. The stage 10 is rotated by the moving mechanism 13 in the direction of? With the vertical line at the center of the stage 10 as the central axis with respect to the base 12.

On the upper surface of the base 11, one or a plurality (two in this embodiment) of the guide rails 14 are provided. The base 12 is supported by the guide rail 14 so as to be capable of reciprocating movement, and is moved by a stage driving section (a stage driving section 71 described later) constituted by a motor or the like. Then, the stage 10 moves along the guide rail 14 by being supported on the upper surface of the movable base 12.

A gate 15 is provided on the upper surface of the substrate 11 so as to extend over the guide rail 14. An exposure section 16 is mounted on the gate 15. The exposure section 16 is composed of a plurality of (16 in this embodiment) exposure heads 16a, and is fixedly arranged on the movement path of the stage 10. [ The optical fiber 18 drawn out from the light source unit 17 and the signal cable 20 drawn out from the image processing unit 19 are connected to the exposure unit 16, respectively.

Each of the exposure heads 16 has a digital micromirror device (DMD) as a reflective spatial light modulation element. Each of the exposure heads 17 controls the DMD based on the image data input from the image processing unit 19 to modulate the light beam from the light source unit 17. [ Each exposure head 16 irradiates the light beam onto the substrate C mounted on the stage 10 to perform exposure by the first exposure apparatus 2. Also, a transmission type spatial light modulation device such as a liquid crystal may be used as the spatial light modulation device.

A gate 22 is further provided on the upper surface of the base 11 so as to extend over the guide rail 14. One or a plurality of (two in this embodiment) imaging units 23 for imaging the substrate C mounted on the stage 10 are mounted on the gate 22. The photographing section 23 is a CCD camera or the like incorporating a strobe having a very short light emitting time. The photographing section 23 is provided for photographing an alignment mark M drawn on a mark forming section 52 and a substrate C to be described later. The gate 22 is provided with a guide portion 23a for guiding the movement of the photographing portion 23 in the X direction. Then, each photographing section 23 is guided to the guide section 23 and moves in the X direction. The relative position of the photographing section 23 with respect to the stage 10 is measured in accordance with the movement of the stage 10 or the photographing section 23 and stored in the memory means of the system control section 70. [ When the ultraviolet light source 51 of the mark forming unit 52 is to be photographed, the ultraviolet light source 51 is photographed without the substrate C being loaded on the stage 10.

The first exposure apparatus 2 derives the position of the ultraviolet light source 51 on the substrate C from the image photographed by the mark forming section 52 by the photographing section 23. [ The second exposure apparatus 4 compares the position of the ultraviolet light source 51 in the first exposure apparatus 2 with the position of the image of the alignment mark M photographed by the photographing section 23 And detects the position difference amount (the difference amount in the X, Y, and θ directions). The information of the positional difference amount of the alignment mark M is the position of the image P1 for the surface to be imaged on the surface C1 of the substrate C and the image P2 for the back surface to be imaged on the back surface C2 .

It is ideal that the photographing section 23 is provided in a number corresponding to the number of the mark forming sections 52 (or the number of alignment marks M) described later. However, the present invention is not limited to this, and a plurality of mark forming sections 52 or a plurality of alignment marks M may be photographed by providing one photographing section 23 and moving the photographing section 23. [

On the upper surface of the stage 10, a substrate clamp mechanism for fixing the end portion of the substrate C to the stage 10 is provided.

5 is an exploded perspective view of the substrate clamp mechanism unit 30 of the first exposure apparatus 2 and the second exposure apparatus 4 according to the present embodiment. As shown in Fig. 5, the substrate clamp mechanism unit 30 has a pair of clamp bars 31a and 31b for clamping the end portion of the substrate C from the upper side so as to sandwich the opposite side of the substrate. The substrate clamp mechanism unit 30 has a pair of clamp bars 31c and 31d for clamping the end portion of the substrate C from the upper side so as to sandwich the other side in the horizontal plane of the substrate C. [ Further, the substrate clamp mechanism unit 30 has moving units 32a to 32d for moving the clamp bars 31a to 31d in parallel in the horizontal direction, respectively. The clamping bars 31a to 31d are respectively disposed on the upper surface of the stage 10 and the moving units 32a to 32d are disposed below the stage 10. [

In the present embodiment, the clamping bars 31a and 31b are elongated in the Y direction and opposed to each other in the X direction, and the clamping bars 31c and 31d are long in the X direction and oppose each other in the Y direction. The clamping bars 31a and 31b are formed so as to be shorter than the clamping bars 31c and 31d and do not interfere with each other even when the size of the substrate C is small.

In the present embodiment, the clamp bar 31a has a clamp holder 33 made of metal (for example, aluminum). The clamp bar 31a is fixed to the inner side area of the lower surface of the clamp holder 33 (the center side area of the stage 10) and is made of a resin clamp blade 34). The clamp bar 31a has two support pillars 35 provided in the outer region of the lower surface of the clamp holder 33 (the outer region of the stage 10). The stage 10 is provided with insertion holes 37 extending in the Y direction or the X direction so as to penetrate in the front and back direction from the end of the stage 10 to the center, Three in each side (a total of 12)] are formed in the embodiment. Further, the two support posts 35 of the clamp bar 31a are inserted into the two insertion holes 37 of the three insertion holes 37 at the respective sides. The clamp bars 31b to 31d have the same configuration as the clamp bar 31a.

The moving unit 32a has a support plate 40 for supporting two support columns 35 and an air cylinder 41 for slidingly moving the support plate 40 in the Z direction. The tip end of the piston rod (42) of the air cylinder (41) is fixed to the lower surface of the support plate (40). The air cylinder 41 lowers and raises the piston rod 42 by a driving unit constituted by a motor or the like. The range of movement of the piston rod 42 is limited and stops at a predetermined position even when the piston rod 42 is lowered or raised.

When the piston rod 42 descends, the clamp bar 43a is lowered together with the piston rod 42, and the clamp bar 31a is pressed against the stage 10. [ Here, when the substrate 10 is mounted on the stage 10, the substrate C is clamped by the clamp bar 31a. On the other hand, when the piston rod 42 rises, the clamp bar 31a rises together with the piston rod 42, and the clamp bar 31a moves away from the stage 10 in the Z direction. The distance that the clamp bar 31a is away from the stage 10 is larger than the thickness of the substrate C to be exposed. The state of the clamp bar 31a when the clamp bar 31a is pressed against the stage 10 is referred to as a closed state (closed position), and the state of the clamp bar 31a when the clamp bar 31a is moved away from the stage 10 State (open position).

The moving unit 32a includes a drive pulley 44 and a driven pulley 45 arranged in the X direction, a timing belt 46 wound around the pulleys 44 and 45, And further has a belt drive motor 47. The belt drive motor 47 is capable of forward rotation and reverse rotation. The air cylinder 41 is mounted on the timing belt 46 through the mounting portion 48. When the timing belt 46 is driven, the air cylinder 41 and the support plate 40 move in the X direction, The bar 31a moves in the X direction. The clamp bar 31a slides while moving the support column 35 along the insertion hole 37 so that the support bar 35 is retreated from the retreated position located at the outer end of the insertion hole 37, Is located between the center position located at the inner end of the insertion hole 37. The position of the clamp bar 31a (any position between the retracted position and the center position) when the clamp bar 31a clamps the peripheral portion of the substrate C is referred to as a clamping position.

The mobile units 32b, 32c, and 32d have the same configuration as the mobile unit 32a. The moving unit 32b moves the clamp bar 31b in the Z direction and the X direction while the moving unit 32c moves the clamp bar 31c in the Z direction and the Y direction, The clamp bar 31d is moved in the Z and Y directions.

6 is an enlarged cross-sectional view for explaining the functions of the photosensors 49 of the first and second exposure apparatus 2 and 4 according to the present embodiment. 5 and 6, a reflection type photo sensor (substrate edge sensor) 49 for detecting the presence or absence of the substrate C is provided on the support plate 40 of the movable unit 32a . The photosensor 49 is attached to the support plate 40 and is located at a position corresponding to the insertion hole 37 in the X direction and Y direction, (Exposed). The photosensor 49 has a light projecting portion for emitting inspection light upward and a light receiving portion for receiving the inspection light reflected on the back surface C2 of the substrate C so that when the light receiving portion receives the inspection light, Signal and outputs a substrate-free signal when the light-receiving unit does not receive the inspection light.

A clamp blade 34 of the clamp bar 31a is positioned above the photosensor 49. [ However, in order to prevent the inspection light from the photosensor 49 from being reflected by the clamp blade 34 and returning to the photosensor 49, a portion corresponding to the insertion hole 37 of the clamp blade 34 An inclined surface 50 is formed. A photosensor 49 similar to the moving unit 32a is also provided on the support plate 40 of each of the mobile units 32b, 32c and 32d.

Each of the support plates 40 is provided with a mark forming portion 52 for forming an alignment mark M on the substrate C mounted on the stage 10. FIG. 7A is an enlarged cross-sectional view of essential parts for explaining the first and second exposure apparatus 2 and the mark forming section 52 of the second exposure apparatus 4 according to the present embodiment. 7B is an enlarged top view of the main parts for explaining the first and second exposure apparatus 2 and the mark forming unit 52 of the second exposure apparatus 4 according to the present embodiment. In Fig. 7B, the substrate C is omitted for explaining the structure of the ultraviolet light source 51. Fig.

As shown in Figs. 5, 7A and 7B, each of the mark forming portions 52 corresponds to the insertion hole 37 formed at the center among the plurality of insertion holes 37 formed at each side, And is formed in a plate shape extending in the direction along the through hole 37. [ An ultraviolet light source 51 for generating an ultraviolet beam (light beam of short wavelength) (UV) toward the stage 10 is provided at the center of the stage 10 in the mark forming portion 52. The ultraviolet light beam UV generated by the ultraviolet light source 51 is irradiated to the substrate C while passing through the insertion hole 37 to contact the second surface of the substrate C The alignment mark M is drawn on the surface on the side where the alignment mark is located.

A plurality of (two in this embodiment) calibration marks 53 are formed on the end side of the stage 10 on the same plane that can be visually confirmed from above the stage 10 Is installed. These calibration marks 53 are formed on the stage 10 so as not to be covered by the substrate C in the state in which the substrate C is mounted on the stage 10 and fixed to the substrate clamping mechanism 30, And is formed at a position that can be visually recognized from the outside through the opening 37. Therefore, each of the calibration marks 53 can be recognized as a captured image obtained by the photographing section 23. [

Each of the mark forming portions 52 moves in conjunction with the movement of the mobile units 32a to 32d. The insertion holes 37 corresponding to the respective mark forming portions 52 are formed in the region including the movement path of each mark forming portion 25. [ The ultraviolet light source 51 is also provided with an insertion hole 37 in which the support column 35 is not inserted while the exposure is performed on the surface C1 of the substrate C by the exposure unit 16, The ultraviolet beam (UV) In addition, the irradiation time of the ultraviolet beam (UV) may be set to an optimal time according to the photosensitive material applied to the substrate (C).

The ultraviolet light source 51 and the calibration mark 53 are provided so as to be in a known positional relationship with each other in the respective mark forming portions 52. In addition, Is stored in the storage means. The ultraviolet light source 51 may not be able to be photographed by the photographing section 23 when the ultraviolet light source 51 is located on the rear side of the substrate C to be exposed. Even in this case, the positions are measured by photographing the respective calibration marks 53, and the position of each of the calibration marks 53 measured and the positional relationship between the stored ultraviolet light sources 51 and the calibration marks 53 The position of the ultraviolet light source 51 can be derived.

Although the first exposure apparatus 2 includes a plurality of ultraviolet light sources 51, the second exposure apparatus 4 does not necessarily have a plurality of ultraviolet light sources 51. A plurality of alignment marks M may be drawn by moving a plurality of ultraviolet light sources and moving the ultraviolet light source in the first exposure apparatus 2.

The first exposure apparatus 2 includes an auto carrier hand (hereinafter referred to as an AC hand) for carrying the substrate C, which has been transported by the first transport apparatus 5, into the first exposure apparatus 2, (Not shown). The AC hand 62 is formed in a flat plate shape and is movable in the horizontal direction and the vertical direction in parallel with the horizontal plane. A suction mechanism having a suction portion 63 for sucking and holding the substrate C by vacuum suction by sucking air is provided on the lower surface of the AC hand 62. The sucking mechanism 63 presses the substrate C downward A pressing mechanism having a pressing portion 64 capable of moving up and down is provided.

The AC hand 62 lifts the substrate P by lifting the unexposed substrate C by a suction mechanism to hold the lifted substrate C on the stage 10, In a predetermined position on the upper surface of the wafer W. When the substrate 10 to be exposed is placed on the stage 10, the substrate 10 is pressed against the stage 10 by a pressing mechanism to release the suction by the suction unit 63, The optical substrate C is firmly fixed to the stage 10. [

Further, the AC hand 62 lifts up the exposed substrate C, which is placed on the upper surface of the stage 10, by suction by a suction mechanism. The AC hand 62 is moved to the second transfer device 6 in a state in which the lifted substrate C is attracted and held, and then the attraction by the attraction mechanism is released, And moves it to the transfer device 6.

The substrate clamp mechanism unit 30 of the exposure imaging system 1 according to the present embodiment can reliably clamp the periphery of the substrate to be corrected to correct warping and deformation of the substrate. The substrate clamp mechanism unit 30 is configured to move the ultraviolet light source 51 and the photosensor 59 together with the clamp bars 31a to 31d. Therefore, since the moving mechanism for the ultraviolet light source 51 and the photosensor 59 is not required, the manufacturing cost of the substrate clamp mechanism unit 30 can be suppressed.

8 is a schematic measurement side view showing the configuration of the reversing mechanism in the reversing device 4 of the exposure and drawing system 1 according to the present embodiment. As shown in Fig. 8, the reversing device 4 has a roller unit 4b having a plurality of rollers 4a arranged in two rows and sandwiching the substrate C between each row. The roller unit 4b is supported by a support rod 4c and is rotated by a rotation shaft 4d provided at the center of the roller unit 4b in a state of being lifted up by a support rod 4c when the substrate C is inserted, As shown in FIG. After the roller unit 4b has rotated 180 degrees, the substrate C is released from the roller unit 4b, so that the front and back surfaces of the substrate C are reversed. The configuration of the inversion mechanism is not limited to the above-described configuration, and a method of lifting one end of the substrate C and rotating the substrate C by 180 degrees to invert the front and back of the substrate C, Other conventional methods may be used.

9 is a configuration diagram showing electrical systems of the first and second exposure apparatus 2 and 4 according to the present embodiment.

As shown in Fig. 9, a system control unit 70 electrically connected to each unit of the apparatus is provided in the first exposure apparatus 2, and the system control unit 70 controls each unit in a general manner. The system control unit 70 controls the AC hand 62 to perform the carrying-in and discharging operations of the substrate 10 to the stage 10. The system control unit 70 controls the stage driving unit 71 to move the stage 10 while shooting the alignment mark M by the photographing unit 23 to adjust the image drawing position. The system control unit 70 controls the light source unit 17 and the image processing unit 19 to perform exposure processing on the exposure head 16a. The operation device 73 has a display portion and an input portion and is operated, for example, when inputting the external size of the substrate C to be exposed.

The substrate stacking position determining section 72 determines the stacking position of the substrate C with respect to the stage 10 at an appropriate placement position (hereinafter referred to as a "proper stacking position"). Further, in the Y direction, the alignment mark M can be positioned at the center of the photographing area by adjusting the imaging timing of the photographing section 23. [ For this reason, the proper loading position in the Y direction may be set at any position on the stage 10. In the present embodiment, the proper mounting position in the X direction is set to a position where the center of the substrate 10 is aligned with the center of the stage 10.

The substrate stacking position determining section 72 determines the optimum stacking position of the substrate in the X direction (the alignment mark M (for alignment)) on the basis of the information obtained by the preparation operation performed before the exposure operation on the substrate C is performed )] Is calculated. In this preparatory operation, the system control unit 70 performs control for photographing the alignment mark M by the photographing unit 23 after loading the substrate C in the proper position on the stage 10 in the X direction I do. In the Y direction, the center of the substrate 10 is aligned with the center of the stage 10 so that the opposing sides of one side of the stage 10 and the opposite sides of the substrate C are parallel to each other . Further, the system control unit 70 calculates the difference amount between the center position of the photographing area in the X direction and the position of the alignment mark M. [ Then, the system control unit 70 calculates the proper placement position of the substrate in the X direction on the basis of this difference amount. In the preparation operation, since this process is performed for a plurality of substrates (for example, five substrates), an appropriate stacking position can be obtained more accurately. In this preparatory operation, the photographing timing of the photographing section 23 is also determined. The calculated loading position information and photographing timing information of the substrate are sent to the system control unit 70 and stored in the storage means of the system control unit 70.

The movement control section 74 controls the movement of the photographing section 23 based on an instruction from the system control section 70. [ The movement control section 74 controls the plurality of mark forming sections 52 or the plurality of alignment marks M drawn on the substrate C to move to the plurality of photographing sections 23 And controls the movement of the photographing section 23 so as to pass through the respective photographing regions.

The movement control section 74 controls the drive of the mobile units 32a to 32d based on an instruction from the system control section 70, respectively. The movement control section 74 monitors signals (substrate presence signal or substrate absence signal) from the photosensors 49 of the mobile units 32a to 32d. The movement control section 74 controls the driving of the air cylinder 41 and the belt drive motor 47 of the mobile units 32a to 32d based on this signal to perform a clamping operation on the clamp bars 31a to 31d do.

The movement control section 74 controls the movement of the substrate C in the region on the stage 10 based on the substrate size information input from the operation device 73 and the appropriate placement position information of the substrate calculated by the preparatory operation Guess the area. Further, the movement control section 74 switches the movement speed of the clamp bars 31a to 31d between high speed and low speed on the basis of the estimated area. More specifically, a high-speed movement is set on the stage 10 outside the position (see FIG. 6) away from the periphery of the substrate C by a distance L1 (for example, 40 mm) Speed moving is set. This makes it possible to reliably detect the substrate C because the detection of the substrate C is performed during low-speed movement. A position away from the peripheral edge of the substrate C by a distance L1 is referred to as a deceleration position (switching point). The clamping bars 31a to 31d stop at a clamping position that is a predetermined distance (for example, 5 mm) from the position where the substrate C is detected to the inside thereof, and clamping is performed at the clamping position. This clamping position is a position where the support pillars 35 of the clamping bars 31a to 31d do not contact the end edge of the substrate C to be exposed.

When the substrate C is detected when the clamp bars 31a to 31d are moving at a high speed, the movement control unit 74 determines that the actual substrate size is larger than the inputted substrate size. In this case, the movement control section 74 stops the movement of the clamp bars 31a to 31d and outputs an abnormal signal to the system control section 70. [ The system control unit 70 receives an abnormal signal and causes the display unit of the operation device 73 to display error information indicating that the substrate size is large. Instead of displaying the error information, a warning sound may be generated.

When the clamp bars 31a to 31d move at a low speed and the substrate C is not detected and the low-speed movement is continued for a predetermined time, the movement control unit 74 determines that the actual substrate size is smaller than the inputted substrate size It is determined that the substrate is not loaded. In this case, the movement control section 74 stops the movement of the clamp bars 31a to 31d and outputs an abnormal signal to the system control section 70. [ The system control unit 70 receives an abnormal signal and displays error information indicating that the substrate size is small or that the substrate C is not loaded on the display unit of the operation device 73. [

10 is a diagram showing the relationship between the moving direction of the stage 10 and the moving direction of the photographing section 23 in the exposure and drawing system 1 according to the present embodiment. As shown in Fig. 10, the moving direction of the photographing section 23 is a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 in the horizontal direction. In the exposure system 1, when the imaging unit 23 photographs the alignment marks M drawn on the plurality of ultraviolet light sources 51 or the substrate C, the stage 10 is moved so that the position in the Y direction . Further, in the exposure imaging system 1, the position in the X direction is controlled by moving the photographing section 23. [ Thereby, the respective relative positions are controlled so that the plurality of mark forming portions 52 or the alignment marks M are included in the photographing region of the photographing section 23. Further, the moving direction of the photographing section 23 is not limited to the X direction. That is, it is only necessary to be able to photograph the alignment mark M drawn on the mark forming portion 52 or the substrate C for the alignment. Therefore, the moving direction of the photographing section 23 may be movable in both the X direction and the Y direction, or may be movable in other directions than the X direction and the Y direction.

11 is a view showing the movable range R of the ultraviolet light source 51 of the exposure and drawing system 1 according to the present embodiment. As shown in Fig. 11, the ultraviolet light source 51 is configured to move linearly from the end of the stage 10 (the central portion of the side of the stage 10 in this embodiment) toward the center by a predetermined distance. When the ultraviolet light source 51 images the alignment mark M on the substrate C to be aligned, the ultraviolet light source 51 irradiates the ultraviolet light beam 51 in the state that the substrate 10 is loaded on the stage 10 UV). At this time, the ultraviolet light source 51 moves to the position where the alignment mark M is drawn at the end of the substrate C to be exposed. The movable range R of the ultraviolet light source 51 is not limited to this but includes the position from the position where the alignment mark M can be drawn to the position of the end face of the maximum size substrate with respect to the minimum size substrate to be exposed . It is desirable that the alignment mark M is a minimum range in which the alignment mark M can be drawn for all the substrates of all sizes to be exposed.

Next, the operation of the present embodiment will be described.

12 is a flowchart showing the processing flow of the exposure preprocessing program according to the present embodiment. The program is stored in advance in a predetermined area of the ROM serving as the recording medium provided in the system control section 70 of the first exposure apparatus 2 It is remembered. 13 is a schematic front view provided in the description of the exposure pre-treatment according to the present embodiment.

The system control unit 70 of the first exposure apparatus 2 executes the exposure preprocessing program at a predetermined timing (in this embodiment, the timing at which the substrate C is loaded on the stage 10).

When the substrate C is mounted on the stage 10, the system control unit 70 moves the position of the ultraviolet light source 51 to the substrate C in step S101. In the present embodiment, the ultraviolet light source 51 moves in conjunction with the movement of the mobile units 32a to 32d of the substrate clamp mechanism unit 30. [ The system controller 70 controls the moving unit 32a to start the movement of the clamp bars 31a to 31d in the open state from the end portion of the stage 10 to the central portion so that the position of the ultraviolet light source 51 . When receiving the substrate presence signal from the photosensor 49, the system control unit 70 shifts the clamp bars 31a to 31d to the open state at a position where they are received or immediately after they are received and moved by a predetermined distance . As a result, the clamping bars 31a to 31d are fixed in a state where the substrate 10 is sandwiched with the substrate 10, and the position of the ultraviolet light source 51 is also fixed.

When the non-exposure substrate C is not sandwiched by the clamp bars 31a to 31d or when the ultraviolet light source 51 is moved by a moving mechanism different from the clamp bars 31a to 31d, The substrate C is moved to a predetermined position before being loaded on the stage 10.

In step S103, the system control section 70 photographs each of the calibration marks 53 corresponding to the plurality of ultraviolet light sources 51 by the photographing section 23 and acquires from the photographed image the ultraviolet light source 51 ). When the ultraviolet light source 51 can be photographed by the photographing section 23 before the substrate 10 is mounted on the stage 10, the ultraviolet light source 51 is not limited to the above- Or a method of photographing the light source 51 and measuring the position of the ultraviolet light source 51 from the captured image.

In step S105, the system control unit 70 sets a corresponding coordinate system (hereinafter, referred to as a "stage coordinate system") on the stage 10 and ends the exposure preprocessing program. As shown in Fig. 13, in the stage of exposure pre-processing, the respective ultraviolet light sources 51 are arranged at known positions in the stage coordinate system.

The system control unit 70 of the first exposure apparatus 2 executes the first exposure processing after the exposure preprocessing is completed and the substrate C is loaded on the stage 10. [ 14 is a flowchart showing the flow of processing of the first exposure processing program according to the present embodiment. The program is stored in a predetermined area of the ROM, which is the recording medium provided in the system control section 70 of the first exposure apparatus 2, As shown in Fig. 15 is a schematic front view provided for explanation of the first exposure process according to the present embodiment.

In step S201, the system controller 70 sets an image coordinate system, which is a coordinate system for drawing the surface image P1, on the substrate C based on the position of the ultraviolet light source 51 measured in step S103 do. As shown in Fig. 15, in the first exposure processing step, an image coordinate system is set according to the position of the ultraviolet light source 51 with respect to the stage coordinate system. The position of the ultraviolet light source 51 may be introduced into an arbitrary image coordinate system.

In step S203, the system control unit 70 moves the stage 10 to the exposure position based on the image coordinate system set in step S201. At this time, the system control unit 70 moves the stage 10 along the guide rail 14 in the Y direction. The system control unit 70 controls the stage 10 so that the position to be exposed by the exposure head 16a coincides with the start position at which the image P1 for the surface is drawn on the substrate C The stage 10 is moved.

In step S205, the system control unit 70 starts exposure by each of the exposure heads 16a and performs exposure on the surface C1 of the substrate C at a position based on the image coordinate system set in step S201 The image P1 is drawn. In step S207, the system control unit 20 generates an ultraviolet beam UV from the ultraviolet light source 51 to draw the alignment mark M on the back surface C2 of the substrate C. [ The processing of the surface C1 of the substrate C in step 205 and the processing of the back surface C2 of the substrate C in step S207 do not interfere with each other. That is, since the first exposure apparatus 2 can perform the above-described processes simultaneously, it is also possible to carry out the processes of steps S205 and S207 at the same time. Alternatively, the first exposure apparatus 2 may perform the process of step S207 before the process of step S205. The image P1 for the surface is drawn on the surface C1 of the substrate C on the basis of the image coordinate system and the alignment mark M is drawn on the back surface C2 as shown in Fig.

As described above, the process of rendering the alignment mark M by drawing the alignment mark M on the back side C2 during the drawing process of the image P1 for the surface with respect to the surface C1 of the substrate C It is not necessary to separately perform the operation. Therefore, the holding time of the firing of the alignment mark M can be secured for a long time without affecting the cycle time of the exposure drawing process. As a result, the contrast of the photographed image of the alignment mark M in the rendering process for the back side C2 can be improved, so that the recognition difference of the alignment mark M can be suppressed.

Since the alignment mark M is displayed after being irradiated with the ultraviolet beam UV and baked so as to be visually recognizable on the substrate C, the position and shape of the alignment mark M are photographed by the photographing section 23 .

In step S209, the system control unit 70 moves the stage 10 to the position where the substrate C is loaded, and ends the first exposure processing program. When the stage 10 moves to the loading position of the substrate C, the substrate C is attracted to and held by the AC hand 62 and moves to the second carrying device 6. The substrate to be exposed C is transferred to the reversing device 3 by the second transport device 6 and inverted by the reversing device 3 before the second exposure by the third transport device 7 And is transported to the painting apparatus 4.

The system control unit 70 of the second exposure apparatus 4 executes the exposure preprocessing program at a predetermined timing (in this embodiment, the timing at which the substrate C is loaded on the stage 10).

16 is a flowchart showing the flow of processing of the second exposure processing program according to the present embodiment. The program is stored in a predetermined area of the ROM, which is a recording medium provided in the system control section 70 of the second exposure apparatus 4, As shown in Fig. 17 is a schematic front view provided for explanation of the second exposure process according to the present embodiment.

In step S301, the system control unit 70 determines whether or not the entire alignment mark M drawn in step S207 is included in the image picked up by the image pickup device 23, on the stage 10 on which the substrate C is mounted Position. At this time, the system controller 70 moves the stage 10 along the guide rail 14 in the Y direction and detects the position where the photographing part 23 is provided and the position where the alignment mark M is formed The stage 10 is moved to a position substantially coinciding with the Y direction.

The photographing area by the photographing section 23 is an area in which the alignment mark M is formed on the back surface C2 of the substrate to be subjected to the exposure and includes an area including an installation error of the substrate C . Thus, even when the mounting position of the substrate C is deviated from the previously set mounting position, if the center of the alignment mark M is photographed with the center set as the center, the area photographing unit 23 As shown in Fig.

In step S303, the system control unit 70 measures the position of the alignment mark M from the picked-up image in which the alignment mark M is picked up by the image pickup unit 23. In step S305, the system controller 70 draws the back side image P2 on the back side C2 of the substrate C based on the position of the alignment mark M measured in step S303 An image coordinate system for determining the position is set. At this time, the image coordinate system is set to correspond to the image coordinate system set in step S201. That is, the relative position between the position of the ultraviolet light source 51 measured in step S103 and the position of drawing the image C1 for the surface, the position of the alignment mark M and the position of the image for the backside image C2 Are set to correspond to each other. 17, since the image coordinate system is set based on the position of the alignment mark M in the second exposure processing step, the relative position between the stage coordinate system and the image coordinate system is different from the first exposure processing step There is also the case.

In step S307, the system controller 70 moves the stage 10 to the exposure position based on the image coordinate system set in step S305. At this time, the system control unit 70 moves the stage 10 along the guide rail 14 in the Y direction. The system control unit 70 controls the stage 10 so that the position to be exposed by the exposure head 16a corresponds to the position at which the backside image P2 is drawn on the substrate C The stage 10 is moved.

In step S309, the system control unit 70 starts exposure by each of the exposure heads 16a and draws the back side image P2 on the back side C2 of the substrate C to be exposed. The back side image P2 is drawn on the back side C2 of the substrate C based on the image coordinate system as shown in Fig.

In step S311, the system control unit 70 moves the stage 10 to the position where the substrate C is loaded, and ends the second exposure processing program. When the stage 10 is moved to the loading position of the substrate C, the substrate C on which the image is drawn on both surfaces C1 and C2 is attracted and held by the AC hand 62, And is conveyed by the fourth conveying device 8.

18 is a schematic front view showing the relationship between the size of the substrate to be exposed (C) and the drawing position of the alignment mark (M) in the exposure system (1) according to the present embodiment. In this embodiment, when the clamping bars 31a to 31d are moved by the moving units 32a to 32d of the substrate clamp mechanism unit 30, the ultraviolet light source 51 moves in conjunction with the movement thereof. 18, the photosensor 49 detects the end portion of the substrate C to be fixed, and the clamping bars 31a to 31d fix the end portion of the substrate to be the object C automatically to the ultraviolet light source 51 are fixed to the end of the substrate C to be irradiated with the ultraviolet beam UV. In addition, the positions of the clamp bars 31a to 31d and the positional relationship of the ultraviolet light source 51 can be freely designed. Therefore, in the present embodiment, the alignment mark M can be drawn at a predetermined position on the substrate C without depending on the size of the substrate C to be aligned.

The method of measuring the position of the ultraviolet light source 51 in step S103 depends on the required measurement precision and the moving units 32a to 32d of the substrate clamp mechanism unit 30 include stepping motors, Or the like. Alternatively, the mobile units 32a to 32d are provided with rotary encoders, and the positions may be measured by the pulses of the rotary encoders. Alternatively, an optical distance sensor or a distance sensor using ultrasonic waves may be provided at any one of the first and second exposure apparatus 2, and the position may be measured by these distance sensors.

In the present embodiment, two or more circular calibration marks 53 are formed, and the position of the ultraviolet light source 51 is determined by the positional relationship between the two or more calibration marks 53 and the ultraviolet light source 51 . However, the shape and the number of the calibration marks 53 are not limited to this, and the shape of the calibration marks can be arbitrarily set. When the shape of the calibration mark 53 is a mark indicating the position of the arrow mark or the like and a mark indicating the direction of the ultraviolet light source 51, even if only one calibration mark 53 is formed, the calibration mark 53 The position of the ultraviolet light source 51 can be derived from the position and direction of the ultraviolet light source 51. [

When the position of the ultraviolet light source 51 is measured by a difference amount from the theoretical value of the position of the ultraviolet light source 51 in the photographed image, the ultraviolet light source 51 is within the depth of focus of the imaging section 23 desirable. However, when the ultraviolet light source 51 is not within the depth of focus of the imaging unit 23, the height of the stage 10 (the position in the Z direction (the position in the Z direction) so that the ultraviolet light source 51 is positioned within the depth- ).

Although two alignment marks M are drawn in the present embodiment, the number of alignment marks M is not limited to two, and may be arbitrarily set if there are two or more alignment marks M. As the number of the alignment marks M increases, the alignment accuracy on the front and back sides of the substrate C can be improved.

In this embodiment, the alignment mark M is drawn on the substrate C using the ultraviolet light source 51, but the present invention is not limited to this, and it may be drawn by jetting or transferring the ink.

In this embodiment, the ultraviolet light source 51 is provided so as to be movable in the X direction or the Y direction. However, the ultraviolet light source 51 is not limited to this, and an ultraviolet light source movable in an arbitrary direction may be used. The path of movement of the ultraviolet light source may be a path traversing the central portion of the substrate C or a path traversing an arbitrary position of the substrate C. [

In the present embodiment, the ultraviolet light source 51 is moved in association with the moving units 32a to 2d of the clamp mechanism unit 30. However, the ultraviolet light source 51 is not limited to this, Or may be moved alone. In this case, the size of the substrate C and the loading position in the stage 10 are stored in advance, and the ultraviolet light source 51 may be set to move to a predetermined position according to the stored size and loading position.

If it is determined in step S205 that rendering of the image for the surface P1 is failed, the process in step S207 (rendering process of the alignment mark M) is not performed and the process proceeds to step S209. In this case, the alignment mark M is not drawn on the substrate C that has failed to draw the image P1 for the surface. Therefore, it is possible to determine whether or not the user has succeeded in drawing the surface image P1 by confirming the presence or absence of the alignment mark M with respect to each of the substrate C to be subjected to the exposure.

Claims (11)

First exposure means for imaging a circuit pattern on the first surface by exposing a first surface of the printed wiring board mounted on the stage,
A plurality of marks formed on the first surface of the printed wiring board so as to be movable relative to the stage and formed on the second surface opposite to the first surface during the drawing process of the first surface circuit pattern, Forming means,
Measuring means for measuring the position of the mark forming means,
Detecting means for detecting a position of a plurality of marks formed on the second surface of the printed wiring board by the mark forming means;
The second surface of the printed wiring board is exposed on the basis of the position of the mark forming means measured by the measuring means and the position of the plurality of marks detected by the detecting means, And a second exposure means for imaging the pattern on the substrate. The method according to claim 1,
Wherein the mark forming means is provided so as to be movable in at least one of a predetermined direction and a direction intersecting with the predetermined direction with reference to any one side of the printed wiring boards mounted on the stage Exposure apparatus. The method according to claim 1,
Wherein the mark forming means has a range in which the marks can be formed with respect to a plurality of types of printed wiring boards having movable ranges of different sizes. The method according to claim 1,
Further comprising specifying means for specifying a size of the printed wiring board,
Wherein the mark forming means forms each of the plurality of marks according to a size specified by the specifying means. The method according to claim 1,
Wherein said measuring means has a photographing means for photographing said mark forming means and measures the position of each of said mark forming means using a photographed image by said photographing means. The method according to claim 1,
Wherein the mark forming means is formed at a position at which the marking means is capable of being photographed by the measuring means even if a calibration mark at a known relative position with respect to the mark forming means is loaded on the stage,
Characterized in that said measuring means comprises photographing means for photographing said mark forming means so that each of said calibration marks is photographed and position of each of said mark forming means is measured using photographed image by said photographing means Device. 6. The method of claim 5,
Wherein a plurality of photographing means are provided and each of said photographing means photographs one or more of said mark forming means. 6. The method of claim 5,
Wherein the photographing means is in a known relationship with a position at which a circuit pattern is drawn and is provided movably with respect to the stage. The method according to claim 1,
Wherein the mark forming means forms the mark by exposing the second surface of the printed wiring board with light having a short wavelength. The method according to claim 1,
Wherein the mark forming means forms the plurality of marks by attaching ink to the second surface of the printed wiring board. A first exposure means for drawing a circuit pattern on the first surface by exposing a first surface of the printed wiring board mounted on the stage, a second exposure means provided on the stage for moving a circuit pattern relative to the first surface, A marking means for measuring a position of the mark forming means and a position detecting means for detecting a position of a plurality of marks formed on the second surface of the printed wiring board by the mark forming means, And a second exposure means for drawing a circuit pattern on the second surface by exposing the second surface of the printed wiring board, the exposure method comprising:
Controlling the measuring means so that the position of the mark forming means is measured;
A step of moving the mark forming means to a predetermined position,
The circuit pattern for the first surface is drawn on the first surface of the printed wiring board and the plurality of marks are formed on the second surface in correspondence with the circuit pattern for the first surface during the drawing process of the circuit pattern, And controlling the mark forming means,
The second surface of the second surface is exposed on the second surface with reference to the position of the mark forming means measured by the measuring means and the position of the plurality of marks detected by the detecting means, And a step of controlling the exposure step.
KR1020147025492A 2012-03-30 2013-01-09 Exposure writing device and exposure writing method KR102024617B1 (en)

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JPJP-P-2012-082561 2012-03-30
JP2012082561A JP5961429B2 (en) 2012-03-30 2012-03-30 Exposure drawing apparatus and exposure drawing method
PCT/JP2013/050242 WO2013145798A1 (en) 2012-03-30 2013-01-09 Exposure writing device and exposure writing method

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JP2013213852A (en) 2013-10-17
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CN104185817B (en) 2016-05-18
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WO2013145798A1 (en) 2013-10-03
TWI570519B (en) 2017-02-11

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