1270755 九、發明說明： 【發明所屬之技術領域】 本發明是關於一種基板定位機構，基板定位方法，基板搬 送裝置及影像形成裝置，更詳細地說，係關於將印刷線路基 板等之基板定位於預定位置的基板定位機構及基板定位方 法，及具備該基板定位機構的基板搬送裝置，及具備該基板 搬送裝置並藉著根據影像資訊而調變的光束使印刷線路基 板等之描繪領域曝光而形成影像之影像形成裝置。 【先前技術】 習知上，在例如印刷線路基板（以下有僅稱「基板」之 情形）等上形成配線圖型的影像形成裝置上，雷射曝光裝置 係爲周知者。該雷射曝光裝置上具備有載置作爲影像曝光對 象的印刷線路基板（承載）之平台構件，並使該平台構件沿著 預定之搬送通路而移動。 在平台上，因爲有將基板正確地定位於既定之位置而加 以支持的需要’例如根據來自於檢測裝置之檢測信號及事先 輸入的尺寸資料訊號，用以控制移動機構部，以進行預備定 位的預備定位機構係爲周知者（參照日本特許文献1)。 但是’在將基板定位之時，使基板碰觸一些構件而定位 的話’雖然以簡單的構成可進行定位，但是單純地使基板碰 觸時，會使基板受到變形或損傷。 〔特許文献1〕日本特開2003-229470號公報 〔發明欲解決的課題〕 本發明考慮上述事實，而以獲得：使用簡單的構成，可 1270755 ' 防止基板之變形或損傷而定位的基板定位機構及基板定位 方法，具備該基板定位機構的基板搬送裝置，及具備該基板 搬送裝置之影像記錄裝置’作爲課題。 【發明內容】 〔解決課題之裝置〕 申請專利範圍第1項之發明中，是關於一種基板定位機 構，其特徵爲：具有：使沿著既定之搬入方向而搬入的基板 之前端受到碰觸.的碰觸構件、及使該碰觸構件在比基板之搬 # 入速度更慢的速度下與搬入的方向相同地移動之移動裝置。 該基板定位機構，例如可使用申請專利範圍第5項之基 板定位方法而將基板定位。 即，相對於沿著既定之搬入方向而搬入的基板，藉著移 動裝置使雖觸構件在比基板之搬入速度更慢的速度下與搬 _ 入的方向相同地移動，並使基板之前端碰觸到碰觸構件。因 而’與碰觸構件爲靜止的情況比較，基板相對於碰觸時之碰 觸構件的速度較小，因此可防止基、板之變形或損傷而將基板 ® 定位。僅藉著移動裝置使碰觸構件移動，因此是爲簡單的構 成。 在申請專利範圍第1項之發明中，如申請專利範圍第2 項所記載者，可作成，在移動中之上述碰觸構件上具有：在 基板碰觸的時序驅動上述移動裝置的驅動裝置之構成。 在申請專利範圍第2項之基板定位機構中，可使用例如 申請專利範圍第6項之基板定位方法將基板定位。 即’驅動裝置在基板對碰觸構件之碰觸之後，停止碰觸 1270755 構件之移動。依此方式而停止碰觸構件之移動時，可使基板 確實地定位。 在申請專利範圍第3項之發明，是針對申請專利範圍第 1或2項之發明，其中上述碰觸構件是作成相對於基板在寬 度方向上之至少2個部位上，可接觸於基板之搬入方向端邊。 該基板定位機構，可使用例如申請專利範圍第7項之基 板定位方法將基板定位。 即，使基板的前端碰觸到碰觸構件上之時，相對於基板 • 在寬度方向上之至少2個部位上，使基板接觸於搬入方向端 邊而碰觸。因而，可矯正基板的傾斜。 並且，在申請專利範圍第7項之基板定位方法中，如申 請專利範圍第8項所記載，在碰觸構件之停止後，使碰觸構 件作成在與基板搬入的相反方向上移動預定距離的話，藉著 '該碰觸構件朝相反方向之移動，可更確實地矯正基板的傾 斜。 申請專利範圍第4項之發明，是針對申請專利範圍第3 ® 項之發明，其中具有：在搬入方向上設置於比該碰觸構件更 上游側且用以檢測基板的檢測裝置、及藉著該檢測裝置檢測 該基板之後，控制移動裝置而使碰觸構件移動之控制裝置。 該基板定位機構，可使用例如申請專利範圍第9項所記 載之基板定位方法將基板定位。 即，藉著檢測裝置而檢測到基板的存在之後，利用移動 裝置而開始碰觸構件之移動。當基板不存在之時，碰觸構件 亦不移動，因此可有效地將基板定位。 1270755 申請專利範圍第1 0項之發明中，其特徵爲：具有：申 請專利範圍第1〜4項中任一項所記載之基板定位機構、及藉 著該基板定位機構而將定位後之基板吸住並搬送到平台部 之吸住單元。 申請專利範圍第1〜4項之任一項中具備有板定位機 構’因此以簡單的構成可防止基板的變形而將基板定位。 接著’可將該定位後之基板使用吸住單元加以吸住，並 搬送到平台部。 ® 申請專利範圍第Η項之發明中，其特徵爲：具有申請 專利範圍第10項之基板搬送裝置、及將載置於該平台部上 的基板之描繪領域曝光，以及在該描繪領域上形成影像的曝 光裝置。 構成該影像形成裝置的申請專利範圍第1 〇項之基板搬 送置’具備有如申g靑專利範圍第1〜4項之任一項的基板 定位機構，因此以簡單的構成可防止基板的變形損傷，而將 基板定位。 ^ 然後，可藉著曝光裝置對已定位且搬送到平台部的基 板，在基板之描繪領域上形成所要的影像。 申請專利範圍第1 2項之發明，是針對申請專利範圔第 1 1項之發明，其中具有使該平台部沿著既定之搬送通路而移 動的移動機構，該曝光裝置藉著根據影像資訊而調變後的光 束，使載置於該平台部上的基板之描繪領域曝光，以在該描 繪領域上形成影像。 從而，藉著移動機構使平台部移動，並且利用曝光裝置 1270755 對與平台部一起移動的基板照射光束，以在該描繪領域上形 成影像。 本發明作成上述之構成，因此以簡單的構成可防止基板 的變形或損傷而將基板定位。 【實施方式】 第1圖及第2圖顯示本發明之一個實施形態之影像形成 裝置100。影像形成裝置100是由雷射曝光裝置126、及基 板搬送裝置1 0所構成。雷射曝光裝置1 26是藉著利用影像 資訊而調變後的光束，使由印刷電路基板（亦可爲液晶顯示 器用之基板等）之材料構成的薄板狀之基板材料200曝光， 而對應於印刷電路基板之配線圖型的影像（潛像）者。並且， 基板搬送裝置10是使從未圖示之前處理製程搬入的基板材 料2 0 0被搬送到雷射曝光裝置126，且從雷射曝光裝置126 將已完成曝光的基板材料200送出。 而，在本實施形態中’從前處理製程朝向基板搬送裝置 10的搬入方向，是與從基板搬送裝置10向雷射曝光裝置126 的搬入方向爲一致，因此其等之「搬送方向」以下並無任何 區別。 如第3圖所示，基板材料200的曝光面（上面）202上， 預先設定有形成對應於配線圖型之潛像的複數個描繪領域 (圖示省略），該些複數個描繪領域上形成有分別對應之複數 組對位記號（圖示省略）。而，下面將平台構件1 1 0之移動方 向作爲副掃猫方向（第4圖中以箭頭S表示），與其直交之方 向作爲主掃瞄方向（第4圖中以箭頭μ表示）。 1270755 如第3圖所示，在雷射曝光裝置丨26上設置有形成既定 厚度的支持基台1 02。支持基台1 〇2其上面形狀係作成將對 基板材料200的副掃瞄方向作爲長度方向的大致長方形，並 經由防振橡膠1 04等而水平地設置在地板上以隔離振動。 並且，在支持基台102的上面部，有一對導軌1〇6設置 成與副掃瞄方向平行，在該導軌1 〇 6上配置有可移動的基板 載置用之平台構件1 1 0。平台構件i 1 〇其上面形狀係作成將 對基板材料2 0 0的副掃瞄方向作爲長度方向的大致長方形， • 其下面及四隅上安裝有分別沿著副掃瞄方向成直線地延伸 之剖面視大致爲反「凹」字狀的引導構件108。接著，引導 構件1 〇 8在導軌1 0 6上可滑動地嵌合著。 並且，在一對導軌1 06之間，球螺桿1 1 2經由固定於支 持基台102上的軸承等（圖示省略）而沿著副掃瞄方向（與導 軌106平行）設置。球螺桿丨12之一端設置有將球螺桿n2 轉動的驅動馬達1 1 4。然後，在平台構件1 1 〇之下面中央， 沿著副掃瞄方向設置有該球螺桿11 2所螺合的筒狀構件（圖 ® 示省略）。從而，平台構件1 1 〇藉著由驅動馬達1 1 4使球螺 桿1 1 2朝正反轉方向轉動，而經由筒狀構件沿著一對導軌 106可進退（往復）地移動。 並且，在支持基台1 0 2之副掃瞄方向大致中央，作成使 平台構件1 1 0成跨騎的方式，而立設有正面檢視爲大致反 「凹」字狀的支持閘1 1 6。該支持閘1 1 6之既定位置上，設 置有讀取設在基板材料200上之複數組對位記號用的複數座 (例如4座）C CD攝影機1 18。各CCD攝影機1 1 8內藏有1次 -10- 1270755 ， Ή 之發光時間極短的閃光燈以作爲攝影時之光源，僅在該閃光 燈之發光時可攝影的方式，而調整其感光度。 從而，各CCD攝影機118，在平台構件110通過位於其 光軸上的攝影位置之時，藉著在既定時序上使閃光燈發光， 可使基板材料200中包含對位記號在內之攝影範圍分別被攝 影。而，各CCD攝影機1 18，沿著基板材料200之寬度方向 (主掃瞄方向）將分別不同的領域作爲攝影範圍，因應於形成 在成爲攝影對象的基板材料200上之複數組對位記號的位 # 置，而事先配置於既定之位置上。 並且，在安裝該CCD攝影機1 18之支持閘1 16的副掃 瞄方向下游側上，配置有支持複數個曝光頭1 2 0之曝光部 124。曝光頭120,在基板材料200通過其正下方之曝光位置 時，將根據影像資訊調變的複數條雷射光束照射在基板材料 β 200之曝光面202上’而在曝光面202上形成對應於印刷電 路基板之配線圖型的影像（潛像）。 各曝光頭120，沿著支持基台102之寬度方向（主掃瞄方 • 向）排列成m行η列（例如2行4列）的大致矩陣狀，如第4 (Β) 圖所示，1個曝光頭1 2 0相當之曝光區域1 2 2，是將副掃瞄 方向作爲短邊的矩形，且對副掃瞄方向傾斜既定之傾斜角。 並且，在該雷射曝光裝置126上，於不妨礙平台構件裝 置1 1 0之移動的地點（例如在第1圖中是從門9 2算起最深側） 上，配置有光源組（圖示省略）。該光源組收容有雷射產生裝 置，使從該雷射產生裝置射出的雷射光經由光纖而引導至各 曝光頭1 2 0。 -11- 1270755 各曝光頭120，將經由光纖而引導射入的雷射光，藉著 未圖示之所謂空間調變元件之數位微反射鏡裝置（以下稱爲 ^ DMD」）’而以點（dc)t)爲單位進行控制，因而對基板材料 200使點圖型曝光。使用該複數個點圖型而表現1個畫素之 濃度。 從而’如第4(A)圖所示，雖然隨著平台構件11〇之移 動，在基板材料200上，於各曝光頭120上形成帶狀之已曝 光領域204，但是藉著使二次元配置之點圖型對副掃瞄方向 鲁傾斜’而使朝副掃瞄方向排列的各點，通過朝與副掃瞄方向 交叉的方向排列之點間。因此，可使實質的點間距離變成狹 小，因而實現高解析度化。 在此，將說明該雷射曝光裝置1 26的作用。首先，當待 機於承載/卸下位置的平台構件1 1 0上載置基板材料200之 時，藉著驅動馬達1 1 4之驅動使球螺桿1 1 2旋轉，而使平台 構件1 1 0朝向副掃瞄方向移動。然後，藉著C C D攝影機1 1 8 將對位記號攝影。根據被攝影後之對位記號的位置資訊，分 ® 別判斷對應於1個描繪領域而設置的複數個對位記號之位 置，從該些對位記號的位置而分別判斷沿著描繪領域之副掃 瞄方向及主掃瞄方向（寬度方向）之位置及對描繪領域之副 掃瞄方向的傾斜量。 接著，根據基板材料200中描繪領域之主掃瞄方向（寬 度方向）的位置及對副掃瞄方向的傾斜量，而實行對影像資 訊（配線圖型）的變換處理，將變換處理後的影像資訊儲存在 圖框δ己憶體內，該影像貝δΛ疋以2値（點記錄之有無）表不構 -12- Ϊ270755 成影像之各畫素的濃度之資料。 而’變換處理的內容方面，是包含有：以座標原點爲中 心將影像資訊轉動的座標變換處理、沿著副掃瞄方向之影像 的轉動處理、沿著對應於主掃瞄方向（寬度方向）的座標軸將 影像資訊平行移動的座標變換處理。又，因應於需要，對應 於沿著描繪領域之主掃瞄方向（寬度方向）及副掃瞄方向的 伸長量及縮短量，而實行將影像資訊伸長或縮短的變形校正 處理。 其後’平台構件1 1 0移動，基板材料200中之描繪領域 的前端與到達曝光頭120正下方的曝光位置之時序同步，而 陸續地以依序地讀出記憶於圖框記憶體中的複數條線部分 之影像資訊，各DMD根據該影像資訊作ON · OFF控制。接 著’雷射光照射在該DMD上之時，DMD在ON狀態時所反 射的雷射光，經由未圖示的透鏡系而成像於基板材料2 0 0之 曝光面202上。 於是，藉著從光源單元射出的雷射光在每個畫素上 ON · OFF，基板材料200之描繪領域以和DMD之使用畫素 數量大致相同數的畫素單位（曝光區域122)曝光。亦即，藉 著平台構件1 1 〇以一定的掃瞄速度移動，基板材料2〇〇朝向 與該平台構件1 1 0的移動方向爲相反的方向使用複數條雷射 光束掃瞄曝光，而在各曝光頭1 20上形成帶狀的已曝光領域 2〇4 (參照第5(A)圖）。 其次，將說明如上述般將基板材料200朝向雷射曝光裝 置126搬入，且從雷射曝光裝置126將完成曝光的基板材料 1270755 2〇〇排出的基板搬送裝置10。如第2圖所示，與雷射曝光裝 置126之平台構件110的移動之副掃瞄方向直交的左右兩 側’且平台構件1 1 〇的移動方向始端側（裝載.卸下位置）上， 相鄰地配置有個別的搬入部1 2及排出部1 4。第2圖中，假 定基板材料200從右方（以箭頭R表示）搬入，從左方（以箭 頭L表示）排出之時，右側爲搬入部1 2，左側爲排出部1 4。 該搬入部1 2具有本發明之基板定位機構1 3，係將搬入的基 板材料200定位，且輸送到平台構件1 1〇。 在搬入部1 2、平台構件1 1 0、排出部1 4之上方，一對 未圖示之導軌26朝向與該平台構件1 10之移動方向（副掃瞄 方向）爲直交之方向（主掃瞄方向）架設著，1或複數個（第2 圖爲2個）走動體3 0可移動地支持在該導軌上。 導軌26之鄰近，有球螺桿27架設成平行於導軌26，且 螺合到走動體30之螺孔（圖示省略）中。從而，走動體30藉 著驅動馬達3 8使球螺桿27朝正反方向旋轉時，而沿著導軌 26向主掃瞄方向往復地移動。 吸住單元4 0昇降自如地安裝在走動體3 0上，吸住單元 40上設置著複數個搬送用吸盤48，空氣吸引用之未圖示的 管子連接到各搬送用吸盤4 8上。接著，空氣經由各管子從 ‘搬送用吸盤48的前端被吸引，因而可使基板材料200被搬 送用吸盤48吸住。 吸住單元40可藉昇降機構56而昇降移動。從而，可柔 軟地對應於基板材料200的厚度變化。 如第5(B)圖所示，搬入部12(基板定位機構13)具有位 -14- 1270755 於比基板材料200的搬送路更下方的保持件22。球螺桿23 螺合到保持件22，藉著寬度移動方向馬達24使球螺桿23 轉動時’使基板材料200朝其寬度方向（箭頭w方向）移動。 藉者此移動’如後述般，可使基板材料2 〇 〇之寬度方向的中 心’與基板搬送裝置1 〇中搬送中心C 1 一致。 如第5(A)圖所示，保持件22具有沿著搬入方向以一定 間隔相隔而配置的複數個搬送支持滾輪1 6、以及設置於比搬 送支持滾輪1 6在搬送方向更上游側之導入滾輪1 8。搬送支 ® 持滾輪1 6及導入滾輪1 Μ系作成同一直徑及長度，受到搬送 馬達2 0之旋轉驅動力而旋轉。從而，以搬送支持滾輪1 6及 導入滾輪1 8支持基板材料2 0 0而旋轉時，而可將基板材料 200搬送。 又在保持件2 2上配置有藉由未圖示的支持構件而昇降 的大致平板狀的昇降平台2 8。球螺桿2 9螺合到昇降平台2 8 上’藉著平台昇降馬達32的驅動，而在靠近支持於搬送支 持滾輪16的基板材料200之靠近位置（例如參照如第5(Β) ^ 圖）、及從基板材料2〇〇離間的離間位置（例如參照如第14(B) 圖）之間昇降。並且，挾持基板材料2 0 0，昇降平台2 8爲對 搬送用吸盤48成對向。從而，如後述般，在靠近位置由搬 送用吸盤4 8押壓的基板材料2 0 0產生撓曲時，該撓曲的基 板接觸於昇降平台2 8而限制其撓曲。並且，在離間位置， 不產生妨礙基板材料200的搬送而搬送通路退避。昇降平台 2 8的昇降量係由昇降量感測器3 1而檢測。 而，在昇降平台28上形成有不與搬送支持滾輪16及後 -15- 1270755 、 述的固定用吸盤3 4干涉而用以迴避該等的孔部。 在保持件22上設置有位於搬送支持滾輪1 6之間的固定 用吸盤34。如第6圖所示，泵44及消音器46經由過濾器 36及閥42而選擇地連接在固定用吸盤34上（泵44亦連接到 消音器46)。藉著閥42之切換而作成與泵44之接觸狀態的 話，可被吸引到固定用吸盤3 4內，因而可將支持於搬送支 持滾輪1 6的基板材料2 0 0暫時地吸住固定。並且’將與栗 44之接觸予以解除的話，亦可解除基板材料200的吸住固 定。 在搬送支持滾輪16之間（第5(B)圖中，從搬送方向下游 側爲第2個搬送支持滾輪1 6與第3個搬送支持滾輪1 6)，設 置有檢測基板之有無的上游側感測器5 8，可用以檢測基板材 料2 0 0之有無。 並且，設置於保持件22上的中心位置感測器66，檢測 昇降平台28的感測器夾具68(SenS〇r dog)，因而可檢測昇降 平台28的寬度方向上之位置。 ^ 在比搬送支持滾輪1 6更在搬送方向的下游側，配置有 前端定位單元50。前端定位單元50具有：朝寬度方向以〜 定間隔配置的複數個（本實施形態爲7個）感測器夾具52、及 一體地保持該些感測器夾具52的保持塊54，以該些複數個 感測器夾具52及保持塊54而構成本發明的碰觸構件。球螺 桿5 9螺合於形成在保持塊54上的螺孔中，藉著前端定位馬 達60使球螺桿5 9旋轉，可使前端定位單元5 0全體向搬送 方向的下游側以既定之移動速度而移動。 -16- Ϊ270755 v 如第7圖詳細顯示，感測器夾具5 2係形成朝向昇降平 台28開放的橫U字狀，定位用感測器62成對向地安裝在其 上部52A及下部52C上，可用來檢測基板材料200之有無。 定位用感測器62之開口，在與被搬送的基板材料200 平行之平面看時爲形成圓形，使檢測感度不產生方向性。從 而’例如在搬送方向或在寬度方向均可使用同一感度檢測基 板材料200之有無。 感測器夾具52，中間部52B係沿著基板材料200之寬 ® 度方向成直線狀並列的方式而進行位置調整，以安裝於保持 塊5 4上。從而，例如基板材料2 0 0即使對搬送方向傾斜之 時’亦可藉著前端定位單元5 0將基板材料2 0 0之前端邊的 .複數個地點（至少2處）押壓，而矯正該傾斜而使搬送方向不 傾斜。 在前端定位單元50之下方配置有下游側感測器70，藉 由該下游側感測器7 0而檢測在該位置之基板材料2 0 0及前 端定位單元50之有無。在此處，事先使用未圖示之直角治 ^ 具’從藉著下游側感測器7 〇所檢測之基板材料2 0 0的本源 位置到該直角治具的脈衝數，而測定對複數個感測器夾具5 2 之寬度方向之傾斜（傾斜基準値）。 而，將本實施形態中7個感測器夾具52之中的1個配 置在寬度方向的中心，將5個配置在搬送方向之右側（圖面 中下側），其餘1個配置在其相反側。於是，藉著配置感測 器夾具5 2，即定位用感測器6 2之時，不必設置需要以上之 多數個定位用感測器62，可對應各種寬度之基板材料200 -17- 1270755 而檢測其有無。 如第8圖所示，上游側感測器5 8、定位用感測器62、 下游側感測器7 0、搬送馬達2 0、平台昇降馬達3 2、前端定 位馬達60、及吸住單元40，係連接到控制裝置64。控制裝 置64係根據上游側感測器58、定位用感測器62中之基板材 料200的有無資訊而控制搬送馬達20、平台昇降馬達32、 前端定位馬達60、及吸住單元40。並且，控制裝置64係藉 著一定間隔之脈衝而以所要的時序控制搬送馬達20、平台昇 • 降馬達32、及前端定位馬達60。 其次，將參照第9圖所示之流程圖而說明藉著本實施形 態之基板搬送裝置1 0將基板定位搬送的製程。而，被搬送 之基板材料200的尺寸，係藉著作業者之輸入操作或藉著未 圖示之感測器的檢測，事先輸入到控制裝置64中。並且， ‘例如藉由基準板等事先將從各定位用感測器62之搬送中心 C 1偏移的量作爲固定參數而記憶在控制裝置64中。 首先，基板材料200在搬入基板搬送裝置10之前，於 ^ 步驟3 02中，事先使昇降平台28朝向離間位置降下（參照第 5(A)及（B)圖）。又，在步驟3 04中，事先使前端定位單元50 朝向搬送方向上游側移動（前進）。 其次，在步驟3 0 6中將搬送馬達2 0驅動而使搬送支持 滾輪1 6旋轉。使被搬入的基板材料200由搬送支持滾輪1 6 支持且搬送。昇降平台2 8係位於離間位置，因此不會使被 搬入的基板材料2 0 0意外地接觸昇降平台2 8，而順利地搬 入。此時之搬送速度，如第10圖所示，例如係作成1〇〇mm/ -18- l27〇755 秒〜2 5 0 m m /秒。 在步驟3 Ο 8中，以上游側感測器5 8判斷是否檢測到基 板材料200之前端，在檢測到之時（參照第1 1(A)及（Β)圖）， 在步驟3 1 0中，從檢測僅經過預定時間（例如脈衝數a)之後， 開始降低搬送支持滾輪1 6之旋轉速度。於是，基板材料200 之搬送速度亦減速到20mm/秒〜60 mm/秒。 其次，在步驟3 1 2中又以任何一個定位用感測器62(例 如寬度方向中央之定位用感測器62)判斷是否檢測到基板材 • 料200之前端，在檢測到之時（參照第12(A)及（B)圖），在步 驟3 14中，將前端定位馬達60驅動，使前端定位單元50向 搬送方向下游側後退。其後退速度，如第1 0圖所示，係作 成例如1 0 m m /秒。 接著，在預定時間經過之後（例如脈衝數b)，在步驟3 1 6 中，使前端定位單元5 0停止在預定位置上。此時之前端定 位單元5 0的後退速度係比基板材料200之搬送速度更慢， 且從後退開始到停止之間，使基板材料2 0 0之前端作成接觸 ® 前端定位單元5 0的速度（例如1 0 m m /秒）。於是，藉著使前端 定位單元5 0後退且接觸基板材料2 0 0之前端，與停止前端 定位單元50之狀態下接觸的構成比較，基板材料200對前 端定位單元5 0之相對速度變成更小。因而，可緩和接觸時 之接觸壓，而防止基板材料200之變形或損傷（參照第13(A) 及（B)圖）。 其次，在步驟3 1 8中，從前端定位單元5 0之後退停止 經過預定時間之後（例如α秒），停止搬送馬達2 0而停止搬 -19- 1270755 送支持滾輪1 6之旋轉，因而亦停止基板材料200之搬送。 在步驟3 2 0中，將閥4 2切換到栗4 4並將泵4 4驅動， 使用固定用吸盤3 4將基板材料2 〇 〇吸住固定。但是，該固 定是只要可將基板材料200形成一體的話即夠充分，即所謂 半固定即可。 又’在步驟322中將平台昇降馬達32驅動，以使昇降 平台28上昇（參照第14(A)及（B)圖）。昇降平台28之上面係 與複數個搬送支持滾輪1 6之外周面之中位於上端的部分大 Φ 致爲同一面。從而，昇降平台28之上面接觸於基板材料200 上，或者以極微小的間隙而成對向。 其次’在步驟324中，將前端定位馬達6〇驅動（正轉）， 以使前端定位單元5 0朝向搬送方向上游側僅前進預定距離 (參照第15(A)及（B)圖中以2點鏈線表示的前端定位單元 5 0)。於是’基板材料200其前端邊接觸於前端定位單元5〇(保 持塊54或感測器夾具52之中間部52B)的狀態下被推押向搬 送方向上游側，而被定位於預定位置。從而，在此階段完成 ^ 在搬送方向的基板材料200之位置對準（位置矯正）。並且， 基板材料2 0 0對搬送方向傾斜之情形，可矯正該傾斜。 又’在步驟3 2 6中將則端定位馬達6 0反轉，使前端定 位單元50向搬送方向下游側後退預定距離（參照第ι5(Α)及 (B )圖中以實線表示的前端定位單元5 〇)。其後退量係比步驟 3 2 4中之前端定位單元5 0的前進量更長爲較佳。於是，感測 器夾具52之中間部52B從基板材料200產生間隔。但是在 該狀態中定位用感測器6 2亦以可檢測基板材料2 0 0之前端 -20-1270755 IX. Technical Field of the Invention The present invention relates to a substrate positioning mechanism, a substrate positioning method, a substrate transfer device, and an image forming device, and more particularly, to positioning a substrate such as a printed circuit board. a substrate positioning mechanism and a substrate positioning method at a predetermined position, and a substrate transfer device including the substrate positioning mechanism, and a substrate carrying device that exposes a drawing region such as a printed circuit board by a light beam modulated according to image information Image forming device for images. [Prior Art] Conventionally, a laser exposure apparatus is known to those skilled in the art of forming a wiring pattern on, for example, a printed wiring board (hereinafter referred to as a "substrate"). The laser exposure apparatus is provided with a stage member on which a printed circuit board (loading) as an image exposure object is placed, and the stage member is moved along a predetermined conveyance path. On the platform, the need to support the substrate to be correctly positioned at a predetermined position is used to control the moving mechanism portion for preliminary positioning, for example, based on a detection signal from the detecting device and a previously input size data signal. The preliminary positioning mechanism is a well-known person (refer to Japanese Patent Literature 1). However, when the substrate is positioned, the substrate is brought into contact with some members to be positioned, and the positioning can be performed with a simple configuration. However, when the substrate is simply touched, the substrate is deformed or damaged. [Problem to be Solved by the Invention] The present invention takes into consideration the above facts to obtain a substrate positioning mechanism that can be positioned to prevent deformation or damage of a substrate by using a simple configuration. The substrate positioning method, the substrate transfer device including the substrate positioning mechanism, and the image recording device having the substrate transfer device have been proposed. [Problem to solve the problem] In the invention of claim 1, the substrate positioning mechanism is characterized in that the front end of the substrate carried in along the predetermined loading direction is touched. The contact member and the moving device that move the contact member in the same direction as the loading direction at a speed slower than the substrate moving speed. The substrate positioning mechanism can be positioned, for example, by using the substrate positioning method of the fifth application of the patent application. In other words, with respect to the substrate carried in along the predetermined loading direction, the moving member moves the contact member at the speed slower than the loading speed of the substrate, and moves the front end of the substrate. Touch the touch member. Therefore, the speed of the substrate relative to the contact member at the time of contact is small as compared with the case where the contact member is stationary, so that the substrate ® can be prevented from being deformed or damaged by the base or the plate. The contact member is moved only by the moving means, and thus is simple. In the invention according to the first aspect of the invention, as described in the second aspect of the patent application, the touch member that is moving has a driving device that drives the mobile device at a timing when the substrate touches Composition. In the substrate positioning mechanism of claim 2, the substrate positioning method can be positioned using, for example, the substrate positioning method of claim 6 of the patent application. That is, the drive device stops touching the movement of the 1270755 member after the substrate touches the contact member. When the movement of the contact member is stopped in this manner, the substrate can be reliably positioned. The invention of claim 3 is directed to the invention of claim 1 or 2, wherein the contact member is formed to be in contact with the substrate at least two locations in the width direction with respect to the substrate. The end of the direction. The substrate positioning mechanism can position the substrate using, for example, a substrate positioning method of the seventh application of the patent application. In other words, when the tip end of the substrate is brought into contact with the contact member, the substrate is brought into contact with the end in the loading direction with respect to the substrate at least two locations in the width direction. Thus, the tilt of the substrate can be corrected. Further, in the substrate positioning method of the seventh aspect of the patent application, as described in the eighth aspect of the patent application, after the contact member is stopped, the contact member is made to move by a predetermined distance in the opposite direction to the substrate loading. By tilting the contact member in the opposite direction, the tilt of the substrate can be corrected more surely. The invention of claim 4 is directed to the invention of claim 3, which has a detection device for detecting a substrate on the upstream side of the contact member in the loading direction, and After the detecting device detects the substrate, the control device controls the moving device to move the contact member. The substrate positioning mechanism can be used to position the substrate using, for example, the substrate positioning method described in the ninth application. That is, after the presence of the substrate is detected by the detecting means, the movement of the contact member is started by the moving means. When the substrate is not present, the contact member does not move, so that the substrate can be effectively positioned. In the invention of claim 10, the substrate positioning mechanism according to any one of claims 1 to 4, and the substrate after positioning by the substrate positioning mechanism Suction and transport to the suction unit of the platform. In any one of the first to fourth aspects of the patent application, the board positioning mechanism is provided. Therefore, the substrate can be positioned to prevent deformation of the substrate with a simple configuration. Then, the positioned substrate can be sucked by the suction unit and transported to the platform portion. The invention of claim </ RTI> wherein the invention has the following features: a substrate transfer device having a patent application scope 10, and a field of drawing of a substrate placed on the platform portion, and forming in the field of drawing Image exposure device. The substrate transfer mechanism of the first aspect of the invention is the substrate positioning mechanism of any one of the first to fourth aspects of the invention. Therefore, the deformation of the substrate can be prevented with a simple configuration. And position the substrate. Then, the desired image can be formed on the substrate drawing area by the exposure device to the substrate that has been positioned and transported to the platform portion. The invention of claim 12 is directed to the invention of claim 11 which has a moving mechanism for moving the platform portion along a predetermined transport path, the exposure device being based on image information. The modulated beam is exposed to a field of depiction of the substrate placed on the platform portion to form an image on the field of depiction. Thereby, the platform portion is moved by the moving mechanism, and the substrate moving together with the platform portion is irradiated with light by the exposure device 1270755 to form an image on the drawing field. Since the present invention has the above-described configuration, the substrate can be positioned by preventing deformation or damage of the substrate with a simple configuration. [Embodiment] Figs. 1 and 2 show an image forming apparatus 100 according to an embodiment of the present invention. The image forming apparatus 100 is composed of a laser exposure apparatus 126 and a substrate transport apparatus 10. The laser exposure device 1 26 exposes a thin-plate-shaped substrate material 200 made of a material of a printed circuit board (which may be a substrate for a liquid crystal display) by a light beam modulated by image information, and corresponds to The image (latent image) of the wiring pattern of the printed circuit board. Further, the substrate transfer device 10 transports the base material material 200 that has been carried in from the pre-processing process (not shown) to the laser exposure device 126, and feeds the substrate material 200 that has been exposed from the laser exposure device 126. In the present embodiment, the direction in which the pre-processing process is moved toward the substrate transfer device 10 is the same as the direction in which the substrate transfer device 10 is moved to the laser exposure device 126. Therefore, the "transport direction" is not included. Any difference. As shown in FIG. 3, a plurality of drawing fields (not shown) for forming a latent image corresponding to the wiring pattern are set in advance on the exposure surface (upper surface) 202 of the substrate material 200, and these plurality of drawing fields are formed. There are corresponding complex array alignment marks (not shown). On the other hand, the moving direction of the platform member 110 is hereinafter referred to as the sub-sweeping direction (indicated by an arrow S in Fig. 4), and the direction orthogonal thereto is the main scanning direction (indicated by an arrow μ in Fig. 4). 1270755 As shown in Fig. 3, a support base 102 for forming a predetermined thickness is provided on the laser exposure device 丨26. The support base 1 〇 2 has a shape in which the sub-scanning direction of the substrate material 200 is a substantially rectangular shape in the longitudinal direction, and is horizontally provided on the floor via the vibration-proof rubber 408 or the like to isolate the vibration. Further, on the upper surface of the support base 102, a pair of guide rails 1A6 are disposed in parallel with the sub-scanning direction, and a movable substrate member 1110 for mounting the substrate is disposed on the guide rails 1?. The upper surface of the platform member i 1 is formed such that the sub-scanning direction of the substrate material 200 is a substantially rectangular shape in the longitudinal direction, and a cross section extending linearly along the sub-scanning direction is mounted on the lower surface and the four sides. The guide member 108 is substantially inverted and has a concave shape. Next, the guiding member 1 〇 8 is slidably fitted over the guide rail 106. Further, between the pair of guide rails 106, the ball screw 1 1 2 is disposed along the sub-scanning direction (parallel to the guide rail 106) via a bearing or the like (not shown) fixed to the support base 102. One end of the ball screw 12 is provided with a drive motor 1 1 4 for rotating the ball screw n2. Then, at the center of the lower surface of the platform member 1 1 ,, a cylindrical member to which the ball screw 11 2 is screwed is provided along the sub-scanning direction (not shown). Therefore, the platform member 1 1 is moved forward and backward (reciprocally) along the pair of guide rails 106 via the cylindrical member by the drive screw 1 1 4 rotating the ball screw 11 2 in the forward and reverse directions. Further, in the sub-scanning direction of the support base 102, the center of the sub-scanning direction is formed so that the platform member 110 is straddle, and the support gate 1 16 which is regarded as a substantially inverted "concave" shape is provided. At a predetermined position of the support gate 116, a plurality of C-cameras 1 18 for reading a complex array alignment mark provided on the substrate material 200 are provided. Each of the CCD cameras 1 1 8 contains a -10- 1270755, and the flash lamp with a very short lighting time is used as a light source for photographing, and the sensitivity is adjusted only when the flash lamp is illuminated. Therefore, each of the CCD cameras 118 can cause the flash to emit light at a predetermined timing when the stage member 110 passes the photographing position on the optical axis thereof, so that the photographing range including the alignment mark in the substrate material 200 can be respectively photography. Further, each of the CCD cameras 1 18 has a different area as a photographing range along the width direction (main scanning direction) of the substrate material 200, in response to the complex array alignment mark formed on the substrate material 200 to be photographed. Bit # is set, and is configured in advance at a predetermined position. Further, on the downstream side in the sub-scanning direction in which the support gates 1 16 of the CCD camera 1 18 are mounted, an exposure portion 124 that supports a plurality of exposure heads 120 is disposed. The exposure head 120, when the substrate material 200 passes the exposure position directly under the substrate material 200, irradiates a plurality of laser beams modulated according to the image information on the exposure surface 202 of the substrate material β 200 to form a corresponding surface on the exposure surface 202 An image (latent image) of a wiring pattern of a printed circuit board. Each of the exposure heads 120 is arranged in a matrix of m rows and n columns (for example, two rows and four columns) along the width direction of the support base 102 (main scanning direction), as shown in the fourth (Β) diagram. The exposure area 1 2 2 corresponding to one exposure head 1 2 0 is a rectangle having the sub-scanning direction as a short side, and is inclined at a predetermined inclination angle to the sub-scanning direction. Further, in the laser exposure device 126, a light source group is disposed on a place where the movement of the table member device 110 is not hindered (for example, the deepest side from the door 9 2 in Fig. 1). Omitted). The light source unit houses a laser generating device, and the laser light emitted from the laser generating device is guided to the respective exposure heads 120 by optical fibers. -11- 1270755 Each of the exposure heads 120 emits laser light guided through an optical fiber by a digital micromirror device (hereinafter referred to as "DMD") of a so-called spatial modulation element (not shown). Dc) t) is controlled in units, thereby exposing the dot pattern to the substrate material 200. The concentration of one pixel is expressed using the plurality of dot patterns. Thus, as shown in Fig. 4(A), although the strip-shaped exposed area 204 is formed on each of the exposure heads 120 on the substrate material 200 as the stage member 11 is moved, the second element is configured by The dot pattern is inclined obliquely to the sub-scanning direction, and the points arranged in the sub-scanning direction are arranged between the points arranged in the direction crossing the sub-scanning direction. Therefore, the substantial inter-point distance can be made narrow, thereby achieving high resolution. Here, the action of the laser exposure device 126 will be explained. First, when the substrate member 110 that is standing in the carrying/unloading position is placed on the substrate material 200, the ball screw 1 12 is rotated by the driving of the driving motor 1 14 to make the platform member 1 1 0 toward the vice The scanning direction moves. Then, the registration mark is photographed by the C C D camera 1 1 8 . According to the position information of the alignment mark after the photographing, the position of the plurality of alignment marks corresponding to one drawing field is determined, and the position along the drawing field is judged from the positions of the alignment marks respectively. The scanning direction and the position of the main scanning direction (width direction) and the amount of tilt to the sub scanning direction of the drawing area. Then, based on the position of the main scanning direction (width direction) of the field in the substrate material 200 and the amount of tilt in the sub-scanning direction, the image information (wiring pattern) is converted and the image after the conversion processing is performed. The information is stored in the frame δ recall, and the image Λ疋 Λ疋 Λ疋 値 値 点 点 -12 -12 -12 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 755 The content of the 'transformation processing' includes the coordinate transformation processing for rotating the image information centering on the coordinate origin, the rotation processing of the image along the sub-scanning direction, and the direction corresponding to the main scanning direction (width direction) The coordinate axis of the coordinate transformation of the image information in parallel. Further, in response to the necessity, the distortion correction processing for extending or shortening the image information is performed in accordance with the amount of elongation and the amount of shortening in the main scanning direction (width direction) and the sub-scanning direction along the drawing area. Thereafter, the 'platform member 110 moves, the front end of the drawing field in the substrate material 200 is synchronized with the timing of reaching the exposure position directly below the exposure head 120, and sequentially read and memorized in the frame memory. The image information of the plurality of lines is controlled by the DMD according to the image information. When the laser light is irradiated onto the DMD, the laser light reflected by the DMD in the ON state is imaged on the exposure surface 202 of the substrate material 2000 via a lens system (not shown). Then, by the laser light emitted from the light source unit ON/OFF on each pixel, the drawing area of the substrate material 200 is exposed by a pixel unit (exposure area 122) which is substantially the same as the number of pixels used by the DMD. That is, by moving the platform member 1 1 〇 at a certain scanning speed, the substrate material 2 扫 is scanned with a plurality of laser beams in a direction opposite to the moving direction of the platform member 1 1 0, and A strip-shaped exposed area 2〇4 is formed on each of the exposure heads 1 20 (refer to Fig. 5(A)). Next, the substrate transfer apparatus 10 which carries the substrate material 200 toward the laser exposure apparatus 126 as described above and discharges the exposed substrate material 1270755 2 from the laser exposure apparatus 126 will be described. As shown in FIG. 2, on the left and right sides of the moving direction of the sub-scanning direction of the platform member 110 of the laser exposure device 126, and the starting direction side (loading and unloading position) of the moving direction of the platform member 1 1 ,, The individual carry-in unit 1 2 and the discharge unit 14 are disposed adjacent to each other. In Fig. 2, when the substrate material 200 is assumed to be carried from the right (indicated by the arrow R) and discharged from the left (indicated by the arrow L), the right side is the carry-in portion 1 2 and the left side is the discharge portion 14 . The loading unit 1 2 has the substrate positioning mechanism 13 of the present invention, and the substrate material 200 carried in is positioned and transported to the platform member 1 1〇. Above the loading unit 1 2, the platform member 110 and the discharge unit 14, a pair of guide rails 26 (not shown) are oriented in a direction orthogonal to the moving direction (sub-scanning direction) of the platform member 10 (main scanning) The aiming direction is erected, and one or a plurality of (2 in FIG. 2) moving bodies 30 are movably supported on the guide rail. Adjacent to the guide rail 26, a ball screw 27 is mounted parallel to the guide rail 26 and screwed into a screw hole (not shown) of the movable body 30. Therefore, when the traveling body 30 rotates the ball screw 27 in the forward and reverse directions by the drive motor 38, it moves back and forth along the guide rail 26 in the main scanning direction. The suction unit 40 is detachably attached to the moving body 30, and the suction unit 40 is provided with a plurality of transfer suction cups 48, and a tube (not shown) for air suction is connected to each of the transfer suction cups 48. Then, air is sucked from the front end of the "transporting suction cup 48" via the respective tubes, so that the substrate material 200 can be sucked by the suction suction cup 48. The suction unit 40 can be moved up and down by the lifting mechanism 56. Thereby, it is soft to correspond to the thickness variation of the substrate material 200. As shown in Fig. 5(B), the loading unit 12 (substrate positioning mechanism 13) has a holder 22 having a position of -14 - 1270755 below the conveyance path of the substrate material 200. The ball screw 23 is screwed to the holder 22, and the substrate material 200 is moved in the width direction (arrow w direction) when the ball screw 23 is rotated by the width moving direction motor 24. By this movement, as described later, the center of the width direction of the substrate material 2 can be made to coincide with the center C 1 of the substrate transport apparatus 1 . As shown in the fifth (A), the holder 22 has a plurality of conveyance support rollers 16 disposed at regular intervals along the loading direction, and an introduction provided on the upstream side of the conveyance support roller 16 in the conveyance direction. Roller 1 8. The transporting support ® holding roller 16 and the introduction roller 1 are made of the same diameter and length, and are rotated by the rotational driving force of the transport motor 20. Therefore, when the transfer support roller 16 and the introduction roller 18 support the substrate material 200 and rotate, the substrate material 200 can be transported. Further, a substantially flat lifting platform 28 that is raised and lowered by a support member (not shown) is disposed on the holder 2 2 . The ball screw 2 9 is screwed onto the lifting platform 28 and is driven by the platform lifting motor 32 to be close to the substrate material 200 supported by the supporting roller 16 (see, for example, Fig. 5(Β)^图) And moving up and down from the separation position of the substrate material 2 (for example, refer to FIG. 14(B)). Further, the substrate material 200 is held, and the lifting platform 28 is opposed to the transporting suction cup 48. Therefore, as will be described later, when the substrate material 200 that is pressed by the transfer chuck 48 is deflected at a position close to the position, the deflected substrate contacts the lifting platform 28 to restrict the deflection. Further, at the separation position, the conveyance path is prevented from being retracted without hindering the conveyance of the substrate material 200. The amount of lifting of the lifting platform 28 is detected by the lifting amount sensor 31. On the lifting platform 28, a hole portion that does not interfere with the conveying support roller 16 and the rear -15-1270755 and the fixing suction cup 34 described above is formed to avoid the hole portion. A fixing suction cup 34 located between the conveying support rollers 16 is provided on the holder 22. As shown in Fig. 6, the pump 44 and the muffler 46 are selectively coupled to the fixed suction cup 34 via the filter 36 and the valve 42 (the pump 44 is also connected to the muffler 46). When the valve 42 is brought into contact with the pump 44, it can be sucked into the fixing suction cup 34, so that the substrate material 200 supported by the conveying roller 16 can be temporarily sucked and fixed. Further, when the contact with the pump 44 is released, the suction and fixation of the substrate material 200 can be released. Between the transport support rollers 16 (the fifth transport support roller 16 and the third transport support roller 16 from the downstream side in the transport direction), the upstream side of the detection substrate is provided. The sensor 5 8 can be used to detect the presence or absence of the substrate material 200. Further, the center position sensor 66 provided on the holder 22 detects the sensor holder 68 of the lifting platform 28, so that the position of the lifting platform 28 in the width direction can be detected. The front end positioning unit 50 is disposed on the downstream side of the transport support roller 16 in the transport direction. The front end positioning unit 50 has a plurality of (seven in the present embodiment) sensor holders 52 arranged at a predetermined interval in the width direction, and a holding block 54 that integrally holds the sensor holders 52, and the like. A plurality of sensor fixtures 52 and holding blocks 54 constitute the contact members of the present invention. The ball screw 59 is screwed into the screw hole formed in the holding block 54, and the ball screw 59 is rotated by the front end positioning motor 60, so that the entire front end positioning unit 50 can be moved to the downstream side in the conveying direction at a predetermined moving speed. And move. -16- Ϊ270755 v As shown in detail in Fig. 7, the sensor holder 52 forms a horizontal U-shape opening toward the lifting platform 28, and the positioning sensors 62 are mounted oppositely on the upper portion 52A and the lower portion 52C thereof. It can be used to detect the presence or absence of the substrate material 200. The opening of the sensor 62 for the positioning is formed in a circular shape when viewed in a plane parallel to the substrate material 200 to be conveyed, so that the detection sensitivity does not cause directivity. Thus, the presence or absence of the substrate material 200 can be detected using the same sensitivity, for example, in the transport direction or in the width direction. The sensor jig 52 and the intermediate portion 52B are positionally adjusted in a line-like manner along the width ® direction of the substrate material 200 to be attached to the holding block 54. Therefore, for example, when the substrate material 200 is inclined to the transport direction, the front end positioning unit 50 can press the plurality of points (at least two places) of the front side of the substrate material 2000 to correct the Tilt so that the transport direction is not tilted. A downstream side sensor 70 is disposed below the front end positioning unit 50, and the presence or absence of the substrate material 200 and the front end positioning unit 50 at the position is detected by the downstream side sensor 70. Here, the right angle control tool (not shown) is used in advance to measure the number of pulses from the source position of the substrate material 200 detected by the downstream side sensor 7 to the right angle jig. The inclination of the sensor jig 5 2 in the width direction (inclination reference 値). In the present embodiment, one of the seven sensor jigs 52 is disposed at the center in the width direction, and five of them are disposed on the right side of the transport direction (the lower side in the drawing), and the other one is disposed on the opposite side. side. Therefore, by arranging the sensor fixture 52, that is, the positioning sensor 62, it is not necessary to provide a plurality of positioning sensors 62, which can be used for various widths of the substrate material 200-17-1270755. Check for the presence or absence of it. As shown in FIG. 8, the upstream side sensor 58, the positioning sensor 62, the downstream side sensor 70, the transport motor 20, the platform lift motor 3, the front end positioning motor 60, and the suction unit are shown. 40 is connected to the control device 64. The control unit 64 controls the transport motor 20, the platform lift motor 32, the front end positioning motor 60, and the suction unit 40 based on the presence or absence of information on the base material material 200 in the upstream side sensor 58 and the positioning sensor 62. Further, the control unit 64 controls the transport motor 20, the platform lift motor 32, and the front end positioning motor 60 at a desired timing by pulses of a predetermined interval. Next, a process of positioning and transporting the substrate by the substrate transfer apparatus 10 of the present embodiment will be described with reference to a flowchart shown in Fig. 9. The size of the substrate material 200 to be transported is previously input to the control device 64 by an input operation by a manufacturer or by detection of a sensor (not shown). Further, the amount of the shift from the transport center C 1 of each of the positioning sensors 62 is previously stored in the control device 64 as a fixed parameter by, for example, a reference plate or the like. First, before the substrate material 200 is carried into the substrate transfer apparatus 10, the lift platform 28 is lowered toward the separation position in advance (steps 5(A) and (B)). Moreover, in step 3, the front end positioning unit 50 is moved (advanced) toward the upstream side in the conveyance direction. Next, in step 306, the transport motor 20 is driven to rotate the transport support roller 16. The substrate material 200 to be carried in is supported by the transport support roller 16 and transported. Since the lifting platform 28 is located at the separation position, the substrate material 200 that has been carried in is not accidentally brought into contact with the lifting platform 2, and is smoothly carried. The conveying speed at this time, as shown in Fig. 10, is, for example, 1 〇〇 mm / -18 - l27 〇 755 sec to 2 5 0 m m / sec. In step 3 Ο 8, it is judged by the upstream side sensor 58 whether or not the front end of the substrate material 200 is detected, and when detected (refer to the 1st (1) and (Β) map), in step 3 1 0 In the middle, after the predetermined time (for example, the number of pulses a) has elapsed, the rotation speed of the conveyance support roller 16 is started to decrease. Thus, the conveying speed of the substrate material 200 is also reduced to 20 mm/sec to 60 mm/sec. Next, in step 312, any one of the positioning sensors 62 (for example, the positioning sensor 62 in the center in the width direction) determines whether or not the front end of the base material 200 is detected, when it is detected (refer to In the step (14), the front end positioning motor 60 is driven to retract the front end positioning unit 50 toward the downstream side in the conveyance direction. The retreating speed, as shown in Fig. 10, is, for example, 10 m m / sec. Next, after the predetermined time elapses (e.g., the number of pulses b), in step 3 16, the front end positioning unit 50 is stopped at the predetermined position. At this time, the retreating speed of the front end positioning unit 50 is slower than the conveying speed of the substrate material 200, and the front end of the substrate material 200 is made to contact the speed of the front end positioning unit 50 from the start to the stop ( For example, 10 mm / sec). Then, by causing the front end positioning unit 50 to retreat and contact the front end of the substrate material 2000, the relative speed of the substrate material 200 to the front end positioning unit 50 becomes smaller as compared with the configuration in which the front end positioning unit 50 is stopped. . Therefore, the contact pressure at the time of contact can be alleviated, and deformation or damage of the substrate material 200 can be prevented (refer to Figs. 13(A) and (B)). Next, in step 3 18, after the predetermined time has elapsed since the front end positioning unit 50 has stopped backward (for example, α seconds), the transport of the motor 20 is stopped, and the rotation of the support roller 1 6 is stopped, and thus the rotation of the support roller 16 is stopped. The transfer of the substrate material 200 is stopped. In step 3200, the valve 4 2 is switched to the pump 4 4 and the pump 4 4 is driven, and the substrate material 2 is sucked and fixed by the fixing suction cup 34. However, this fixing is sufficient as long as the substrate material 200 can be integrated, that is, it is semi-fixed. Further, in step 322, the platform lift motor 32 is driven to raise the lift platform 28 (refer to Figs. 14(A) and (B)). The upper surface of the lifting platform 28 is larger than the portion of the outer peripheral surface of the plurality of conveying support rollers 16 which is located at the upper end. Thereby, the upper surface of the lifting platform 28 is in contact with the substrate material 200, or is opposed by a very small gap. Next, in step 324, the front end positioning motor 6 is driven (forward rotation) so that the front end positioning unit 50 is advanced by a predetermined distance toward the upstream side in the conveyance direction (refer to Figs. 15(A) and (B) for 2 The front end positioning unit 5 0) indicated by the dotted line. Then, the front end side of the substrate material 200 is pushed toward the upstream side in the conveyance direction while being in contact with the front end positioning unit 5 (the intermediate portion 52B of the holding block 54 or the sensor jig 52), and is positioned at a predetermined position. Thereby, the alignment (position correction) of the substrate material 200 in the transport direction is completed at this stage. Further, when the substrate material 200 is inclined in the transport direction, the tilt can be corrected. Further, in step 3 26, the end positioning motor 60 is reversed, and the front end positioning unit 50 is moved backward by a predetermined distance toward the downstream side in the conveyance direction (refer to the front end indicated by the solid line in the drawings (1) and (B). Positioning unit 5 〇). The amount of retreat is preferably longer than the amount of advancement of the front end positioning unit 50 in step 324. Thus, the intermediate portion 52B of the sensor holder 52 creates a space from the substrate material 200. However, in this state, the positioning sensor 62 also detects the substrate material before the end of the substrate -20-
1270755 I 邊附近的方式而決定後退量之上限。 其次，在步驟3 2 8中，將寬度方向移動馬達24驅動， 以使昇降平台28向寬度方向移動（參照第16(A)及（B)圖）。 其移動量，由於事先知道基板材料200之尺寸，因此從該尺 寸資訊計算出預定的移動量。 在步驟330中，藉著向該寬度方向之移動，任何一個定 位用感測器62中在檢測到從基板材料200之檢測狀態之變 化爲止，係繼續地向該寬度方向的移動。即，藉著向該寬度 ® 方向之移動，任何一個定位用感測器62係從未檢測基板材 料2 0 0的狀態變化到檢測後之狀態，因此只要有如此件（狀 態之變化的話，停止向寬度方向的移動。從該移動所需要的 .時間（脈衝數）及移動速度可求出朝向寬度方向的移動距離 (實測値）。 在此處，從各定位用感測器6 2之搬送中心c 1偏移的量 係作爲固定參數而記憶在控制裝置6 4中。在步驟3 3 2中， 根據事先求出的基板材料2 0 0之寬度、及在步驟3 3所取得 ® 的基板材料2 0 0之朝向寬度方向的移動距離（檢測脈衝數）， 而演算從昇降平台28之寬度方向的本源位置（以中心位置感 測器6 6檢測）的偏移量。 在步驟3 3 4中，根據該演算後之偏移量將寬度方向移動 馬達2 4僅驅動預定時間’以將基板材料2 〇 〇僅移動偏移量 的1/2’使寬度方向之中心與搬送中心ci 一致（參照第17(A) 及（B)圖）。 在步驟3 3 6中，將前端定位馬達6 0反轉，使前端定位 -21 - 1270755 單元50向搬送方向下游側後退（參照第18(A)及（B)圖）。在 前端定位單元5 0之後退時，在步驟3 3 8中，演算對基板材 料200之搬送方向的傾斜量。即，在後退中以定位用感測器 62監視基板材料200之檢測狀態。在此處，例如對基板材料 200之搬送方向爲傾斜之時，定位用感測器62中基板材料 2 00之檢測狀態變化的時序（使定位用感測器62爲OFF之脈 衝數）會產生差異。接著，根據該時間差與事先使用未圖示 之直角治具測定的前述傾斜基準値比較，可求出基板材料 # 200之傾斜量。 在步驟3 40中，判斷演算後之基板材料2〇0的傾斜量是 否超過臨界値，當超過之時，在步驟342中藉著未圖示之報 知裝置將其要點報知，而，亦可再度嘗試矯正基板材料200 的傾斜量、或者進行將基板材料2 0 0排出到基板材料2 0 0的 傾斜量之外部的處理，以取代利用報知裝置的報知。 當基板材料200的傾斜量並未超過臨界値之時，在步驟 3 4 4中，停止前端定位馬達6 〇的驅動，以停止前端定位單元 ^ 50的後退。其後退量係作成基板材料200從感測器夾具52 之上部5 2 A與下部5 2 C之間完全抽出的後退量。從而，在後 製程中將基板材料2 0 0上昇之時，基板材料2 〇 〇並不接觸感 測器夾具5 2。 接著，在步驟3 4 6中，將吸住單元4 0驅動，以使搬送 用吸盤4 8接觸而吸引到基板材料2 0 0。與此之同時，將泵 4 4之驅動予以停止，同時將閥4 2連接到消音器4 6，利用基 板材料2 0 0之固定用吸盤3 4將假固定予以解除（參照第 -22 - 1270755 2〇(A)及（B)圖）。 搬达用吸盤48接觸基板材料2〇〇之時，基板材料2〇〇 局部地被押壓而撓曲。但是，昇降平台28位於挾持基板材 料2 0 0且與搬送用吸盤4 8成對向的位置上，因此限制該撓 曲，以使基板材料200維持於大致平面狀。因此，而維持搬 送用吸盤48與基板材料2〇〇之密接狀態，因而可確實地吸 住。依此方式吸住之狀態，吸住單元4 〇從昇降平台2 8將基 板材料200移動到平台構件丨1〇上（參照第21 (A)及（B)圖）。 從上述’在本實施形態之基板搬送裝置1 〇中，完成使1 片基板材料2 0 0定位且搬送的一系列製程。 由上述說明可瞭解，本實施形態中，將基板材料2〇〇搬 入並以前端定位單元50定位之時，係使前端定位單元5〇邊 後退邊使基板材料200接觸。因此，與停止前端定位單元5〇 的狀態下接觸基板材料200的構成比較，可防止基板材料 2 0 0的則靖（朝向則端定位單兀5 0之接觸部分）之變形或損 傷。僅使前端定位單元50後退，故使用簡單的構成即可。· 而，亦可使用例如複數個碰觸銷沿著寬度方向配置的構 成，以取代上述前端定位單元5 0。 【圖式簡單說明】 第1圖是顯示本發明之第1實施形態的影像形成裝置之 立體圖； 第2圖係顯示本發明之第1實施形態的影像形成裝置中 之基板搬送裝置在內部露出狀態下的t體圖； 第3圖是顯示本發明之第1實施形態的影像形成裝置之 -23 - 1270755 雷射曝光裝置在內部露出狀態下的立體圖； 第4圖（A)是顯示本發明之第1實施形態的雷射曝光裝 置之曝光領域的說明圖，（B)係顯示該雷射曝光裝置之配置 圖型的平面圖； 第5圖係顯示本發明之第1實施形態的基板搬送裝置之 槪略構成的平面圖； 第6圖係顯示本發明之第1實施形態的基板搬送裝置之 基板半固定機構的槪略方塊圖； ί 第7圖係顯示安裝有本發明之第1實施形態的基板搬送 裝置之定位用感測器的感測器夾具之立體圖； 第8圖係顯示本發明之第1實施形態的基板搬送裝置之 控制方塊的說明圖； 第9圖係顯示本發明之第1實施形態的基板搬送裝置之 基板定位·搬送順序之流程圖； 第1 0圖係顯示本發明之第1實施形態的基板搬送裝置 之基板與前端定位單元之速度的時序圖； ® 第1 1圖係顯示本發明之第1實施形態的基板搬送裝置 中將基板定位且搬送之製程的平面圖； 第1 2圖係顯示本發明之第1實施形態的基板搬送裝置 中將基板定位且搬送之製程的平面圖； 第1 3圖係顯示本發明之第〗實施形態的基板搬送裝置 中將基板定位且搬送之製程的平面圖； 第1 4圖係顯示本發明之第1實施形態的基板搬送裝置 中將基板定位且搬送之製程的平面圖； -24- 1270755 …， 第1 5圖係顯示本發明之第1實施形態的基板搬送裝置 中將基板定位且搬送之製程的平面圖； 第1 6圖係顯示本發明之第1實施形態的基板搬送裝置 中將基板定位且搬送之製程的平面圖； 第1 7圖係顯示本發明之第1實施形態的基板搬送裝置 中將基板定位且搬送之製程的平面圖； 第1 8圖係顯示本發明之第1實施形態的基板搬送裝置 中將基板定位且搬送之製程的平面圖； • 第1 9圖係顯示本發明之第1實施形態的基板搬送裝置 中將基板定位且搬送之製程的平面圖； 第20圖係顯示本發明之第1實施形態的基板搬送裝置 中將基板定位且搬送之製程的平面圖； 第2 1圖係顯示本發明之第丨實施形態的基板搬送裝置 中將基板定位且搬送之製程的平面圖。 【元件符號說明】 1〇…基板搬送裝置 ® 12…搬入部 1 3…基板定位機構 14…排出部 1 6…搬送支持滾輪 1 8…導入滾輪 2 〇…搬送馬達 22...保持件 24…寬度方向移動馬達 -25- 1270755 2 6...導軌 2 8 ...昇降平台 30.. .走動體 32.. .平台昇降馬達 34…固定用吸盤 3 6 ...過濾器 38.. .驅動馬達 40…吸住單元 • 42…閥 44…泵 46.. .消音器 48.. .搬送用吸盤 50.. .前端定位單元 5 2...感測器夾具 52A…上部 5 2B ...中間部 ⑩52C…下部 5 4 ...保持塊 5 6...昇降機構 5 8 ...上游側感測器 60.. .前端定位馬達 62 ...定位用感測器（檢測裝置） 64.. .控制裝置 66.. .中心位置感測器 -26 1270755 68…感測器夾具（sensor dog) 7 0...下游側感測器 92.··門 100.. .影像形成裝置 102…支持基台 104…防振橡膠 1 0 6 ...導軌 1 0 8 ...引導構件 ® 110…平台構件 1 1 4 ...驅動馬達 1 16...支持閘 1 1 8 ... CCD攝影機 120…曝光頭 1 22…曝光區域 124.. .曝光部 126.. .雷射曝光裝置 β 200...基板材料 2 02 ...曝光面 204.. .已曝光領域 F...搬送方向 W...寬度方向1270755 I The method near the side determines the upper limit of the amount of retreat. Next, in step 3 28, the width direction moving motor 24 is driven to move the lifting platform 28 in the width direction (refer to Figs. 16(A) and (B)). The amount of movement is determined by the size information of the substrate material 200 in advance, and a predetermined amount of movement is calculated from the size information. In step 330, by any movement in the width direction, any one of the positioning sensors 62 continues to move in the width direction until a change in the detection state of the substrate material 200 is detected. That is, by moving in the direction of the width ®, any one of the positioning sensors 62 changes from the state of the undetected substrate material 200 to the state after the detection, so as long as there is such a condition (the state changes, the stop Movement in the width direction. The movement distance (measured 値) in the width direction can be obtained from the time (pulse number) and the movement speed required for the movement. Here, the movement is performed from each positioning sensor 62. The amount of center c 1 offset is stored as a fixed parameter in the control device 64. In step 3 3 2, the substrate obtained according to the width of the substrate material 2000 obtained in advance and the step obtained in step 3 3 The moving distance of the material 200 in the width direction (the number of detected pulses) is calculated as the offset from the source position (detected by the center position sensor 66) in the width direction of the lifting platform 28. In step 3 3 4 According to the shift amount after the calculation, the width direction moving motor 24 is driven only for a predetermined time 'to move the substrate material 2 〇〇 only by 1/2' of the offset amount so that the center of the width direction coincides with the transport center ci ( Refer to Article 17(A) (B) Fig.) In step 3 36, the front end positioning motor 60 is reversed, and the front end positioning -21 - 1270755 unit 50 is retracted toward the downstream side in the conveying direction (refer to Figs. 18(A) and (B)). When the front end positioning unit 50 moves backward, the amount of inclination to the conveyance direction of the substrate material 200 is calculated in step 339. That is, the detection state of the substrate material 200 is monitored by the positioning sensor 62 in the backward movement. Here, for example, when the conveyance direction of the substrate material 200 is inclined, the timing at which the detection state of the substrate material 200 in the positioning sensor 62 changes (the number of pulses for which the positioning sensor 62 is OFF) is generated. Then, based on the time difference, the tilt amount of the substrate material #200 can be obtained by comparison with the tilt reference 测定 previously measured using a right angle jig (not shown). In step 340, the substrate material after the calculation is determined. If the amount of tilt of 0 exceeds the critical threshold, if it is exceeded, the highlight is notified by the notifying device (not shown) in step 342, and the amount of tilt of the substrate material 200 may be corrected again, or the substrate material may be corrected. 2 0 0 discharge The processing outside the tilt amount of the substrate material 200 is replaced by the notification by the notification device. When the tilt amount of the substrate material 200 does not exceed the critical value, in step 344, the front end positioning motor 6 is stopped. The driving is performed to stop the retreat of the front end positioning unit 50. The retreat amount is the amount of retreat that the substrate material 200 is completely withdrawn from between the upper portion 52 A and the lower portion 5 2 C of the sensor jig 52. Thus, in the post process When the substrate material 2000 is raised, the substrate material 2 〇〇 does not contact the sensor jig 52. Next, in step 346, the suction unit 40 is driven to bring the transfer suction cup 48 into contact. And attracted to the substrate material 2000. At the same time, the driving of the pump 44 is stopped, and the valve 4 2 is connected to the muffler 4 6, and the dummy fixing is released by the fixing suction cup 34 of the substrate material 2000 (refer to -22 - 1270755). 2〇(A) and (B)图). When the transfer suction pad 48 contacts the substrate material 2, the substrate material 2 is locally pressed and deflected. However, since the lifting platform 28 is located at a position facing the holding base material 200 and facing the conveying suction cup 48, the deflection is restricted so that the substrate material 200 is maintained in a substantially planar shape. Therefore, the suction chuck 48 and the substrate material 2 are kept in close contact with each other, so that they can be reliably sucked. In the state of being sucked in this manner, the suction unit 4 moves the substrate material 200 from the lifting platform 28 to the platform member 丨1 (refer to Figs. 21(A) and (B)). From the above-described substrate transfer apparatus 1 of the present embodiment, a series of processes for positioning and transporting one substrate material 200 are completed. As apparent from the above description, in the present embodiment, when the substrate material 2 is moved and positioned by the front end positioning unit 50, the front end positioning unit 5 is retracted while the substrate material 200 is brought into contact with each other. Therefore, compared with the configuration in which the substrate material 200 is contacted in a state where the front end positioning unit 5 is stopped, deformation or damage of the substrate material 200 (the contact portion toward the end positioning unit 50) can be prevented. Since only the front end positioning unit 50 is retracted, a simple configuration can be used. Further, instead of the above-described front end positioning unit 50, for example, a configuration in which a plurality of contact pins are arranged in the width direction may be used. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a video forming apparatus according to a first embodiment of the present invention. FIG. 2 is a view showing an inside of a substrate transporting apparatus in an image forming apparatus according to a first embodiment of the present invention. FIG. 3 is a perspective view showing the -23 - 1270755 laser exposure apparatus of the image forming apparatus according to the first embodiment of the present invention in an exposed state; FIG. 4(A) is a view showing the present invention. (B) is a plan view showing a layout of the laser exposure apparatus, and FIG. 5 is a plan view showing a substrate transfer apparatus according to the first embodiment of the present invention. FIG. 6 is a schematic block diagram showing a substrate half-fixing mechanism of the substrate transfer device according to the first embodiment of the present invention; FIG. 7 is a view showing a substrate on which the first embodiment of the present invention is mounted. FIG. 8 is a perspective view showing a control block of the substrate transfer device according to the first embodiment of the present invention; FIG. 9 is a view showing a control block of the sensor transfer device of the first embodiment of the present invention; The flowchart of the substrate positioning and transporting procedure of the substrate transfer apparatus according to the first embodiment of the present invention; FIG. 1 is a timing chart showing the speed of the substrate and the front end positioning unit of the substrate transfer apparatus according to the first embodiment of the present invention; 1 is a plan view showing a process of positioning and transporting a substrate in the substrate transfer apparatus according to the first embodiment of the present invention; and FIG. 2 is a view showing the substrate transfer device in the substrate transfer device according to the first embodiment of the present invention; FIG. 1 is a plan view showing a process of positioning and transporting a substrate in a substrate transfer apparatus according to a first embodiment of the present invention; and FIG. 4 is a view showing a substrate transfer according to the first embodiment of the present invention. A plan view of a process for positioning and transporting a substrate in a device; -24- 1270755 ..., Fig. 15 is a plan view showing a process of positioning and transporting a substrate in the substrate transfer device according to the first embodiment of the present invention; A plan view showing a process of positioning and transporting a substrate in the substrate transfer apparatus according to the first embodiment of the present invention; and FIG. 7 is a view showing the first embodiment of the present invention. A plan view of a process for positioning and transporting a substrate in a substrate transfer apparatus of the embodiment; FIG. 8 is a plan view showing a process of positioning and transporting a substrate in the substrate transfer apparatus according to the first embodiment of the present invention; A plan view showing a process of positioning and transporting a substrate in the substrate transfer apparatus according to the first embodiment of the present invention; and FIG. 20 is a plan view showing a process of positioning and transporting the substrate in the substrate transfer device according to the first embodiment of the present invention; Fig. 2 is a plan view showing a process of positioning and transporting a substrate in the substrate transfer apparatus according to the embodiment of the present invention. [Explanation of the component symbols] 1 〇 ... substrate transfer device ® 12 ... loading unit 1 3 ... substrate positioning mechanism 14 ... discharge unit 1 6 ... transport support roller 1 8 ... introduction roller 2 〇 ... transport motor 22 ... holder 24 ... Width-direction moving motor-25- 1270755 2 6... Guide rail 2 8 ... Lifting platform 30.. Moving body 32.. Platform lifting motor 34... Fixing suction cup 3 6 ... Filter 38.. Drive motor 40... Suction unit • 42... Valve 44... Pump 46.. Silencer 48.. Transfer suction cup 50.. Front end positioning unit 5 2... Sensor fixture 52A... Upper 5 2B .. Intermediate portion 1052C... lower portion 5 4 ... holding block 5 6 ... lifting mechanism 5 8 ... upstream side sensor 60.. front end positioning motor 62 ... positioning sensor (detecting device) 64.. Control device 66.. Center position sensor -26 1270755 68... Sensor dog 7 0... Downstream side sensor 92. · Door 100.. Image forming device 102...Support base 104...Anti-vibration rubber 1 0 6 ... Guide rail 1 0 8 ... Guide member ® 110... Platform member 1 1 4 ... Drive motor 1 16... Support gate 1 1 8 .. CCD camera 120...exposure head 1 2 2...exposure area 124.. exposure section 126.. laser exposure apparatus β 200...substrate material 2 02 ...exposure surface 204.. exposed area F...transport direction W...width direction