JPH10187937A - Projection and exposure apparatus for band-shaped work - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a projection and exposure apparatus which can apply the exposure processing with high accuracy to the band-shaped works via the alignment of their rear sides and without cutting the works in every sheet. SOLUTION: The work adsorption mechanisms 8 and 8' adsorb a band-shaped work Wb, and the movement mechanisms 9 and 9' move the mechanisms 8 and 8' and the rollers R1 to R3 and R1' to R3' in the direction orthogonal to the carrying direction of the work Wb. Thus, the work Wb is moved out of an exposure area, a partial illumination system 5 irradiates the light on a mask M, and the alignment units 4 and 4' detect and store the position of a mask alignment mark MAM. Then the wok Wb is set again in the exposure area, and the position of a work alignment mark WAM described on the rear side of the work Wb is detected. The alignment is adjusted to secure the coincidence of positions between both marks MAM and WAM. Then a light irradiation device 1 irradiates the exposure light to expose a mask pattern over the work Wb.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION In order to form a plurality of electronic elements on a thin work piece such as a stainless steel sheet, a roll-shaped work piece is pulled out from a reel, and is conveyed and stopped for each predetermined pattern area. Then, after aligning the mask with each exposure area of the strip-shaped workpiece, an exposure step of exposing the mask pattern onto the workpiece is performed. The present invention relates to a projection exposure apparatus for a strip-shaped work used in the above-described exposure step and the like, and in particular, the present invention relates to aligning an alignment mark of a mask with an alignment mark written on the back surface of the strip-shaped work. The present invention relates to a projection exposure apparatus for a strip-shaped workpiece, which is provided with the position alignment mechanism.

[0002]

2. Description of the Related Art In manufacturing various electronic devices, micromachines, and printed circuit boards, it is important to accurately expose a mask pattern to a predetermined position on a work. This alignment is usually performed by overlapping the alignment marks of the mask and the work. In a certain manufacturing process, a pattern may be printed on both surfaces of a work. In this case, it is necessary to accurately match the position of the pattern on the front surface with respect to the pattern on the rear surface.
That is, when the work on which the pattern is formed on the front surface is turned over and the back surface is exposed, alignment of the alignment mark written on the pattern-formed surface (the back surface is obtained by turning over) and the pattern on the front surface is performed. (Hereinafter, such alignment is referred to as backside alignment).

FIG. 8 is a diagram for explaining a conventional back surface alignment method. In the figure, 1 is a light irradiation device, M is a mask, and the mask M has a mask alignment mark M.
AM is written. Reference numeral 2 is a projection lens, and 3 is a work stage. The work stage 3 holds the work W by suction, for example, by a vacuum suction mechanism (not shown). Also,
The work stage 3 has an observation hole 3a for observing the alignment mark WAM marked on the back surface of the work W. Reference numerals 4 and 4 ′ are alignment units for aligning the mask M with the work W, and the alignment units 4 and 4 ′ emit alignment light irradiation devices 4a and 4a ′ and lenses 4b, 4c and 4 respectively.
b ', 4c', half mirrors 4d, 4d ', and image receiving element 4
e, 4e '.

Then, when the work W is not placed on the work stage 3, the mask alignment mark MAM image projected by the projection lens 2 and imaged on the mask pattern projection surface is observed through the observation holes 3a, 3a ', the lens 4b, and the lens 4b. 4
b ', image receiving element 4 via half mirrors 4d, 4d'
The image is received at e, 4e '. Further, when the work W is placed on the work stage 3, the alignment light emitted from the alignment light irradiators 4 a and 4 a ′ is reflected by the lens 4.
c, 4c ', half mirrors 4d, 4d', lens 4b,
4b ', and irradiates the work alignment mark WAM on the back surface of the work W with the work alignment mark W
The AM image is taken from the lenses 4b and 4b 'and the half mirrors 4d and 4
The image is received by the image receiving elements 4e and 4e 'via d'. An image processing unit 21 performs image processing on the alignment mark images received by the image receiving elements 4e and 4e '.

Next, a conventional backside alignment procedure will be described with reference to FIG. (1) The mask M is set at a predetermined position. (2) The exposure light is applied to the mask M from the light irradiation device 1 in a state where the work W is not on the work stage 3. (3) The image of the mask alignment mark MAM is received by the image receiving elements 4e and 4e 'of the alignment units 4 and 4' and sent to the image processing unit 21. The image processing section 21 detects and stores the position of the mask alignment mark MAM image. (4) The irradiation of the exposure light from the light irradiation device 1 to the mask M is stopped. (5) The work W is set on the work stage 3.

(6) Alignment light irradiation devices 4a, 4
Emit light from a '. The light is irradiated on the back surface of the work W through the observation holes 3a and 3a 'of the work stage 3, and the images of the alignment marks WAM on the back surface of the work W are received by the image receiving elements 4e and 4e'. The image of the work alignment mark WAM received by the image receiving elements 4e and 4e 'is sent to the image processing unit 21, and the position of the image of the alignment mark WAM of the work W is detected. Then, the work stage 3 is moved and aligned so that the alignment mark MAM of the mask M that has been detected and stored and the alignment mark WAM of the back surface of the work W overlap. (7) Exposure light is irradiated onto the mask M from the light irradiation device 1,
The mask W is projected on the work W to expose the work W. (8) The exposed work W is carried out.

After the exposure as described above, when performing the next exposure, the unexposed work W is placed on the work stage 3 and the above procedures (6) to (8) are repeated. . After the exposure is performed a plurality of times, the steps (1) to (5) are periodically performed to prevent a displacement of the exposure. That is, the position of the detected and stored mask alignment mark MAM and the work alignment mark WA
Even if the positions of the mask M, the position of the mask M, the projection lens 2, and the alignment units 4 and 4'change due to changes in the ambient temperature, etc. Since the position differs from the position of the stored mask alignment mark MAM image, the exposure position of the mask pattern is shifted. Therefore, the above steps (1) to (5) are periodically performed to detect and detect the position of the mask alignment mark MAM.
By storing the information, it is necessary to prevent the displacement of the exposure position due to a temperature change or the like.

[0008]

By the way, in a projection exposure apparatus in which a strip-shaped work wound in a roll is pulled out from a reel, conveyed onto a work stage, and a mask pattern is exposed on the strip-shaped work, the strip-shaped work is once used. Is set, the strip-shaped work cannot be easily removed, and the steps (1) to (5) for detecting and storing the position of the mask alignment mark cannot be performed by the conventional projection exposure apparatus. For this reason, conventionally, when performing exposure processing by backside alignment, the strip-shaped work was cut one by one for each pattern area, and the exposure processing was performed by the method described with reference to FIG.

The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a strip-shaped workpiece that can be exposed by back surface alignment without cutting the strip-shaped workpieces one by one. A projection exposure apparatus is provided.

[0010]

The present invention solves the above problems as follows. (1) A light irradiation device that irradiates exposure light, a mask on which a mask pattern and a mask alignment mark are written, a projection lens that projects the mask pattern and the mask alignment mark, and a work alignment mark on the back surface side. A strip-shaped work, a work stage on which the strip-shaped work is mounted, and an observation hole for observing the work alignment mark of the mounted strip-shaped work, and the strip-shaped work on the work stage at a predetermined feed amount. And a transfer mechanism that holds the strip-shaped work so as to allow the movement of the strip-shaped work on the work stage, and the position of the mask alignment mark and the work alignment mark through the observation hole provided in the work stage. Of a strip-shaped workpiece with an alignment system that detects and aligns the two. In the shadow exposure device, the strip-shaped workpiece, is retracted from the area where the mask pattern and mask alignment marks on the work stage is projected, also provided an insertion-retraction mechanism for inserting the strip-shaped workpiece in the region.
Then, the belt-shaped work is retracted from the area by the insertion / retreat mechanism, and the position of the mask alignment mark is detected and stored by the alignment system. Next, the band-shaped work is inserted into the above area by the insertion / retraction mechanism to detect the position of the work alignment mark, and the mask alignment is performed based on the detected / stored position of the mask alignment mark and the position of the work alignment mark. Align the mark and the band-shaped work.

(2) In the above (1), the insertion / retraction mechanism is provided with a work suction means for sucking the strip-shaped work and moving the strip-shaped work in a direction substantially perpendicular to the transport direction. Since the inventions of claims 1 and 2 of the present invention are configured as described in (1) and (2) above, it is possible to perform high-precision exposure processing by backside alignment without cutting the strip-shaped work one by one. . Further, since it is possible to detect and store the position of the mask alignment mark by retracting the belt-shaped work at any time, it is possible to prevent the exposure position from being displaced due to the change in ambient temperature.

[0012]

1 is a diagram showing the overall construction of a projection exposure apparatus according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a light irradiation device for irradiating exposure light, M denotes a mask, and a mask M is provided with a mask alignment mark MAM. Further, between the light irradiation device 1 and the mask M, an insertion
Partial illumination systems 11 and 11 'that are attached so as to be retractable are provided, and the partial illumination systems 11 and 11' are shown in the same figure when detecting and storing the position of the mask alignment mark MAM, as described later. Partial lighting system 1
Irradiate the mask alignment mark MAM with 1, 11 '. 2 is a projection lens, 3 is a work stage,
The work stage 3 has a vacuum suction mechanism (not shown), and sucks and holds the strip-shaped work Wb by the vacuum suction mechanism. Further, the work stage 3 has observation holes 3a and 3a 'for observing the alignment mark WAM printed on the back surface of the work W. Reference numeral 5 denotes an XYZθ stage, which drives the work stage 3 in the XYZθ direction (X is the left-right direction in the figure, Y is the front-rear direction in the drawing, Z is the direction orthogonal to the XY axis, and θ is the center of the Z axis. Rotation).

Numerals 4 and 4'indicate alignment units for aligning the mask M with the strip-shaped workpiece Wb.
The alignment units 4 and 4'have the same structure as that shown in FIG. Reference numeral 6 denotes a delivery reel on which the strip-shaped work Wb is wound in a roll shape, and reference numeral 7 denotes a take-up reel for winding the exposed strip-shaped work Wb. The strip-shaped work Wb sent from the delivery reel 6 is a guide roller R.
3. The sheet is conveyed onto the work stage 3 via conveying rollers R1 and R2, and is positioned within the exposure area of the projection lens 2. After the alignment is performed, an exposure process is performed, and the exposed strip-shaped workpiece Wb is transferred to the transport rollers R1 ′,
Take-up reel 7 through R2 'and guide roller R3'
It is wound up.

A slack portion is provided on the strip-shaped work Wb between the feed reel 6 and the roller R3 and between the roller R3 'and the take-up reel 7, and the slack portion conveys and positions the strip-shaped work. A movement allowance at the time of alignment is ensured, and a predetermined stress or more is prevented from being applied to the belt-shaped work Wb. Reference numeral 8, 8 'denotes a work suction mechanism. The work suction mechanism 8, 8' includes a vacuum supply pipe 8a, as shown in FIG. Can be adsorbed.

The work suction mechanisms 8, 8 'and rollers R1 to R3, R1' to R3 'are mounted on moving mechanisms 9, 9' which engage rails mounted on the floor. By 9 and 9 ', these are integrally configured to be movable in the front-back direction on the paper surface of the figure, and by moving them, the strip-shaped work Wb can be retracted / inserted from the exposure area of the projection lens 2. . Further, the rollers R1 and R1 'are configured to be movable in the vertical direction as indicated by the arrows in the figure. When the belt-shaped work Wb is transported, the rollers R1 and R1' are moved downward and the belt-shaped work W
b is sandwiched between the rollers R1 and R2 and the rollers R1 'and R2'.

FIG. 2 is a view for explaining the retreating / inserting operation of the band-shaped work described above. FIG. 2 is a diagram viewed from the direction A in FIG. 1, and FIG. 2 (a) shows the band-shaped work Wb. The state at the time of conveyance, the same figure (b) is the mask alignment mark MAM
Shows a state when the belt-shaped work Wb is retracted in order to detect and store. At the time of transport, alignment, and exposure of the strip-shaped work Wb, no vacuum is supplied to the vacuum supply pipe 8a of the work suction mechanisms 8, 8 ', and the strip-shaped work W
2b and the work suction mechanism 8, 8 ', etc. are at the positions shown in FIG. 2 (a). When the belt-shaped workpiece Wb is transported, the rollers R1,
R1 'is falling. On the other hand, when detecting and storing the position of the mask alignment mark MAM, the strip-shaped work Wb is retracted as shown in FIG.

That is, a vacuum is supplied to the vacuum supply pipe 8a of the work suction mechanisms 8, 8 'to vacuum-suck the strip-shaped work Wb to the work suction mechanisms 8, 8'. And roller R
1 and R1 'are lifted and the rollers R2, R2' and the rollers R3, R3 'are shown in FIG.
Move down. Thereby, the band-shaped work Wb moves downward in the figure as shown in FIG. Here, as described above, since the strip-shaped workpiece Wb between the delivery reel 6 and the roller R3 and between the roller R3 ′ and the take-up reel 7 is provided with the slack portion, the above-mentioned FIG. As shown, the force applied to the band-shaped work Wb when the band-shaped work Wb is moved is absorbed by the slack portion,
It is possible to prevent stress above a predetermined level from being applied to the strip-shaped work Wb.

The width W of the slack portion, the length L of the slack portion, and the bending radius R shown in FIG. 3 are experimentally determined so as to satisfy conditions such as stress applied to the band-shaped work Wb, alignment, exposure performance and the like. The length L of the slack portion is controlled by a slack control mechanism (not shown).

FIG. 4 is a diagram showing a configuration of a control device of the projection exposure apparatus of the present embodiment. 8, reference numerals 4, 4 'denote the above-described alignment units. The alignment units 4, 4' have the same configuration as the alignment unit shown in FIG. Image receiving elements 4e and 4e 'for receiving the mark WAM image are provided. The alignment mark images received by the image receiving elements 4e and 4e 'are sent to the image processing unit 21, where the image processing unit 21 performs image processing and detects the position. Reference numeral 22 denotes a monitor on which images received by the image receiving elements 4e and 4e 'are displayed. Reference numeral 31 denotes a work transfer control mechanism for controlling transfer of the band-shaped work, and reference numeral 32 denotes a work retreat control mechanism for retreating the band-shaped work Wb in a direction orthogonal to the traveling direction as described in FIG. The mechanism 32 drives the work suction mechanisms 8, 8 ', the rollers R1 to R3, and R1' to R3 'as described above.

Reference numeral 33 denotes a partial illumination system drive mechanism for controlling retreat / insertion of the partial illumination systems 11, 11 '; 34, a mask drive mechanism for driving the mask M; 35, a stage drive mechanism for driving the work stage 3; This is an alignment unit driving mechanism for controlling the positions of the alignment units 4 and 4 '. Reference numeral 20 denotes a control unit, and the control unit 20 conveys the strip-shaped workpiece Wb via the various control mechanisms and drive mechanisms described above.
The image processing unit 2 controls the positioning and retracting operations.
1 the mask alignment mark MA detected
M, alignment of the mask M and each pattern area of the strip-shaped work Wb is performed based on the position of the work alignment mark WAM, and exposure processing of the strip-shaped work Wb is performed.

FIG. 5 is a diagram showing the configuration of an alignment system in this embodiment. The alignment system of this embodiment is basically the same as that of FIG. 8 except that partial illumination systems 11 and 11 'are added. Is the same as that shown in. Partial lighting system 1
1, 11 'are lenses 11a, 11a' and mirror 11b,
Exposure light emitted from a light irradiator (not shown) is introduced through optical fibers 11c and 11c ', and irradiates the exposure light near the mask alignment mark MAM. 2B, the exposure light emitted from the partial illumination systems 11 and 11 ′ is applied only to the vicinity of the observation holes 3a and 3a ′ on the work stage 3, and the strip-shaped work Wb is at the retracted position. The exposure light is prevented from being irradiated onto the strip-shaped work Wb during the time. Further, the alignment units 4 and 4'include the alignment light irradiation devices 4a and 4a 'that emit alignment light, the lenses 4b, 4c, 4b' and 4c ', and the half mirror 4d, as described above.
4d 'and image receiving elements 4e and 4e'.

Then, the strip-shaped work Wb is the same as that shown in FIG.
When the mask alignment mark MAM image projected by the projection lens 2 and formed on the mask pattern projection surface is in the retracted position shown in FIG.
Image receiving element 4 through 4b 'and half mirrors 4d, 4d'
e, 4e '. When the band-shaped work Wb is at the position shown in FIG.
The alignment light emitted from a and 4a ′ is reflected by the lens 4
c, 4c ', half mirrors 4d, 4d', lens 4b,
The work alignment mark WAM on the back surface of the band-shaped work Wb is irradiated through the work alignment mark WAM via the lenses 4b and 4b 'and the half mirror 4
The image is received by the image receiving elements 4e and 4e 'via d and 4d'.
The images received by the image receiving elements 4e and 4e 'are sent to the image processing unit 21 and subjected to image processing, and the positions of the work alignment mark WAM and the mask alignment mark MAM are detected.

Here, the alignment units 4, 4 '
Is usually adjusted to the focus position of the mask pattern. That is, the adjustment is performed so that the mask alignment mark MAM image is formed on the image receiving elements 4e and 4e '. Note that the image forming position of the mask pattern is the band-shaped work W
It is set so as to coincide with the exposure surface of b. For this reason, the work alignment marks WA provided on the back surface of the band-shaped work Wb by the alignment units 4 and 4 '.
When receiving the image of M, the work stage 3 is raised by the thickness of the strip-shaped workpiece Wb, and the strip-shaped workpiece Wb
When exposing the upper mask pattern, the work stage 3 is lowered by the thickness of the strip-shaped work Wb.

The focus of the alignment units 4, 4'is adjusted to the surface position of the work stage 3, and the image of the work alignment mark WAM on the surface position of the work stage 3 is formed on the light receiving elements 4e, 4e '. The position of the mask M and the projection lens 2
May be set so that the mask pattern forms an image on the exposure surface of the band-shaped work Wb (a position above the surface position of the work stage 3 by the thickness of the band-shaped work Wb).

In that case, the alignment unit 4,
According to 4 ′, when the mask alignment mark MAM image is received, the mask alignment mark MAM image is formed on the image receiving elements 4e and 4e ′ of the alignment units 4 and 4 ′ by any of the following methods. Need to adjust. The positions of the alignment units 4, 4 ′ and the work stage 3 are not adjusted, the mask M is moved downward, and the mask pattern and the mask alignment mark MAM image show the surface position of the work stage 3 (the focus of the alignment units 4, 4 ′). Position). The alignment units 4 and 4'are moved upward by the thickness of the strip-shaped workpiece Wb so that the surface position of the strip-shaped workpiece Wb is in focus.

FIG. 6 is a flowchart showing the exposure processing of the strip-shaped work Wb by the projection exposure apparatus of the present embodiment. The present embodiment will be described with reference to FIG. (1) Mask alignment mark MAM detection / storing process (process [1] in FIG. 6) (a) Vacuum is supplied to the vacuum supply conduit 8a of the workpiece suction mechanism 8, 8'to suck the workpiece Wb. The suction is performed by the mechanisms 8, 8 ', and the rollers R1, R1' are moved upward to put the strip-shaped work Wb in a free state. Then, the strip-shaped work Wb is retracted as shown in FIG. 2B (step S1 in FIG. 6). When the band-shaped work Wb is retracted as described above, air is ejected from the work stage 3 so that the band-shaped work Wb is floated from the surface of the work stage 3 so that the band-shaped work Wb comes into contact with the work stage 3. Scratching can be prevented. When retracting the band-shaped work Wb, the work stage 3 may be slightly lowered.

(B) The partial illumination systems 11 and 11 'are inserted into the positions shown in FIG. 1, and the exposure light is applied to the mask alignment mark MAM from the partial illumination systems 11 and 11' (step S2). The light emitted from the partial illumination systems 11, 11 'forms a mask alignment mark MAM image on the mask pattern projection surface. (c) The alignment units 4 and 4 ′ receive the mask alignment mark MAM image and send it to the image processing unit 21. The image processing section 21 performs image processing to detect and store the position of the mask alignment mark MAM image (step S3). (d) The control unit 20 sets the counter value n to n = 0. Further, the emission of the exposure light from the partial illumination systems 11 and 11 'is stopped (step S4). (e) Work suction mechanism 8, 8 ', rollers R2, R3, R
2 ', R3', etc. are returned to the positions shown in FIG. Then, the band-shaped work Wb is held by the vacuum suction mechanism of the work stage 3 and the supply of vacuum to the work suction mechanisms 8 and 8'is stopped (step S5).

(2) Alignment and exposure process of the band-shaped work Wb (process [2] in FIG. 6) (a) Alignment light irradiation device 4a of the alignment units 4 and 4 ',
The alignment light is irradiated from 4a '. The alignment light is applied to the work alignment mark WAM provided on the back surface of the strip-shaped work Wb via the lenses 4c and 4c ', the half mirrors 4d and 4d', and the lenses 4b and 4b '.
An image processing unit 21 receives a work alignment mark WAM image of the band-shaped work Wb by the image receiving elements 4e, 4e 'via the lenses 4b, 4b' and the half mirrors 4d, 4d '.
To send to. The image processing section 21 performs image processing to detect the position of the work alignment mark WAM image (Step S6 in FIG. 6). (b) The work stage 3 is driven in the XYθ directions for alignment so that the position of the mask alignment mark MAM detected and stored in step S3 and the position of the work alignment mark WAM match (step S).
7).

(C) It is checked whether the difference between the position of the mask alignment mark MAM and the position of the work alignment mark WAM is within the tolerance, and if it is not within the tolerance, the process returns to step S6 and the above process is repeated (step S8). (d) When the difference between the position of the mask alignment mark MAM and the position of the work alignment mark WAM falls within the tolerance, the alignment light irradiated from the alignment light irradiation devices 4a and 4a 'is turned off, and the work stage 3 is moved in the Z direction. To make the surface (exposure surface) of the strip-shaped work Wb coincide with the image forming position of the mask pattern, and perform exposure processing (step S9). That is, exposure light is emitted from the light irradiation device 1, the mask pattern of the mask M is projected onto the strip-shaped work Wb via the projection lens 2, and the mask pattern is exposed on the strip-shaped work Wb.

(E) The rollers R1 and R1 'are lowered, and the feed reel 6, the take-up reel 7, and the rollers R1 to R2.
The belt-shaped work Wb is transported by driving R1 ′ and R2 ′, and is positioned so that the next pattern area of the belt-shaped work Wb enters the exposure area (step S10). In this case,
By blowing air from the work stage 3 and the work suction mechanisms 8, 8 'to float the band-shaped work Wb, the band-shaped work Wb is moved to the work stage 3, the work suction mechanism 8, 8'.
It can be conveyed without contacting. (f) After the exposure processing, the count value n of the counter of the control unit 20
Is set to n = n + 1 (step S11). (g) The steps S6 to S11 are repeated until n = N, and when n = N, the process returns to step S1 to perform the above-described process [1] (the process of detecting and storing the mask alignment mark MAM). Then, after detecting and storing the position of the mask alignment mark MAM, the process (2) (alignment and exposure process of the strip-shaped work) is performed.

In the above embodiment, the partial illumination system 11,
When the position of the mask alignment mark MAM is detected and stored, the exposure light from the partial illumination systems 11 and 11 ′ is irradiated only to the vicinity of the observation hole of the work stage 3. Exposure light is irradiated from the light irradiation device 1 without providing the mask alignment mark M
The position of AM may be detected and stored. In this case, in order to prevent the exposure light from being irradiated onto the strip-shaped work Wb, it is necessary to increase the retreat amount of the strip-shaped work Wb as shown in FIG. Further, in the above-described embodiment, the work suction mechanisms 8, 8 'are provided, and the strip-shaped work Wb is sucked by the work suction mechanisms 8, 8' to retract the strip-shaped work Wb. Alternatively, the belt-like work Wb may be sandwiched between the rollers R1 and R2, and the rollers R1 ′ and R2 ′ so as to be retracted.

[0032]

As described above, according to the present invention, the strip-shaped work is retracted from the area on the work stage where the mask pattern and the mask alignment mark are projected, and the strip-shaped work is inserted into the area. Since a retracting mechanism is provided and the band-shaped workpiece is retracted from the above area by the inserting / retracting mechanism to detect and store the position of the mask alignment mark, it is possible to prevent the exposure position from being displaced due to a change in ambient temperature. This makes it possible to perform high-precision exposure processing by backside alignment without cutting the strip-shaped workpiece one by one.

[Brief description of the drawings]

FIG. 1 is a diagram showing an overall configuration of a projection exposure apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram for explaining the retracting / inserting operation of the band-shaped work in FIG.

FIG. 3 is a view showing a slack portion of a band-shaped work.

FIG. 4 is a diagram showing a configuration of a control device of the projection exposure apparatus of the embodiment of the present invention.

FIG. 5 is a diagram showing a configuration of an alignment system in an example of the present invention.

FIG. 6 is a flowchart illustrating an exposure process for a strip-shaped work according to the embodiment of the present invention.

FIG. 7 is a diagram illustrating a retreat amount of a strip-shaped work when detecting and storing a position of a mask alignment mark by exposure light irradiated by a light irradiation device.

FIG. 8 is a diagram illustrating a conventional backside alignment method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Light irradiation device 2 Projection lens 3 Work stage 3a, 3a 'Observation hole 4, 4' Alignment unit 4a, 4a 'Alignment light irradiation device 4b, 4c lens, 4b', 4c 'lens 4d, 4d' Half mirror 4e, 4e 'Image receiving element 5 XYθZ stage 6 Send-out reel 7 Take-up reel 8,8' Work suction mechanism 8a Vacuum supply line 9,9 'Moving mechanism 11, 11' Partial illumination system 20 Control unit 21 Image processing unit 22 Monitor 31 Work Transport control mechanism 32 Work retraction control mechanism 33 Partial illumination system drive mechanism 34 Mask drive mechanism 35 Stage drive mechanism 36 Alignment unit drive mechanism M Mask MAM Mask alignment mark WAM Work alignment mark R1 to R3 Roller R1 'to R3' Roller Wb Band work

Claims (2)

[Claims] 1. A light irradiation device for irradiating exposure light, a mask having a mask pattern and a mask alignment mark, a projection lens for projecting the mask pattern and the mask alignment mark, and a work alignment mark on the back surface side. A strip-shaped workpiece, a workpiece stage on which the strip-shaped workpiece is mounted, and an observation hole for observing the workpiece alignment mark of the mounted strip-shaped workpiece, and the strip-shaped workpiece at a predetermined feed amount. A transport mechanism that holds the strip-shaped work while allowing it to be transported onto the stage and allows the strip-shaped workpiece to move on the work stage, and a mask alignment mark and a work alignment mark through the observation hole provided on the work stage. A belt with an alignment system that detects the position and aligns the two In the work projection exposure apparatus, the strip-shaped work is retracted from the area where the mask pattern and the mask alignment mark on the work stage are projected, and an insertion / retraction mechanism for inserting the strip-shaped work into the area is provided. The band-shaped work is retracted from the area by the mechanism, the position of the mask alignment mark is detected and stored by the alignment system, and the band-shaped work is inserted into the area by the insertion / retraction mechanism to detect the position of the work alignment mark. A projection exposure apparatus for a strip-shaped workpiece, wherein the mask alignment mark and the strip-shaped workpiece are aligned based on the position of the detected and stored mask alignment mark and the position of the workpiece alignment mark. 2. The strip-shaped workpiece according to claim 1, wherein the insertion / retraction mechanism includes a workpiece suction means for sucking the strip-shaped workpiece and moving the strip-shaped workpiece in a direction substantially orthogonal to the conveying direction. Projection exposure equipment.