WO2013145798A1

WO2013145798A1 - Exposure writing device and exposure writing method

Info

Publication number: WO2013145798A1
Application number: PCT/JP2013/050242
Authority: WO
Inventors: 橋口　昭浩; 浩明菊池; 弘則鶴井
Original assignee: 富士フイルム株式会社
Priority date: 2012-03-30
Filing date: 2013-01-09
Publication date: 2013-10-03
Also published as: CN104185817B; TWI570519B; KR20150003161A; KR102024617B1; CN104185817A; TW201339767A; JP2013213852A; JP5961429B2

Abstract

An exposure writing device is provided with: a first exposure means for writing a circuit pattern on a first face by exposure of the first face of a printed wiring board arranged on a stage; a mark forming means, arranged in a manner so as to be movable with respect to the stage, for forming a plurality of predetermined marks on a second face opposite to the first face during writing of the circuit pattern of the first face on the first face of the printed wiring board; a measurement means for measuring the position of the mark forming means; a detection means for detecting the position of a plurality of marks formed on the second face; and a second exposure means for writing a circuit pattern on the second face by exposure of the second face of the printed wiring board, using as a reference the measured position of the mark forming means and the positions of the plurality of marks that were thus detected.

Description

Exposure drawing apparatus and exposure drawing method

The present invention relates to an exposure drawing apparatus and an exposure drawing method, and more particularly to an exposure drawing apparatus and an exposure drawing method for drawing an image on a substrate.

Recently, as an exposure drawing apparatus for forming a circuit pattern using a planar substrate as an exposure substrate, an exposure drawing apparatus for drawing a circuit pattern by directly irradiating the substrate with drawing light without using a transfer mask has been developed. However, when drawing a circuit pattern on a substrate that requires high resolution, the dust adhering to the hole processing and the dust adhering to the hole during the movement process may drop to another substrate or resist processing, etc. The hole periphery may be deformed by heating. In this case, the relative position between the circuit pattern drawn on the first surface of the substrate and the circuit pattern drawn on the second surface is shifted.

Therefore, there has been proposed an exposure drawing apparatus that draws alignment marks necessary for drawing a circuit pattern on the first surface and the second surface of the substrate to be exposed. As a technique related to this, Japanese Patent Application Laid-Open No. 2008-292915 discloses an exposure drawing apparatus that draws first and second alignment marks on a first surface and a second surface of a substrate to be exposed, respectively. . The exposure drawing apparatus draws a circuit pattern on the first surface and the second surface of the substrate based on the first and second alignment marks. In addition, US Pat. No. 6,701,197 B2 uses a fixed ultraviolet light source in a known positional relationship with the stage to align the second surface simultaneously with the exposure of the first surface of the substrate to be exposed. A drawing exposure apparatus for forming a mark for use is disclosed.

In the exposure drawing apparatus disclosed in Japanese Patent Laid-Open No. 2008-292915, it is necessary to form alignment marks before the drawing process. Therefore, there is a problem that the cycle time is affected by the baking time. In addition, there is a problem that it is necessary to correct a positional deviation in mark measurement for alignment between the first surface and the second surface. Further, there is a problem that an apparatus configuration for forming alignment marks on both the first surface and the second surface is necessary.

In the exposure drawing apparatus disclosed in US Pat. No. 6,701,197 B2, the position for drawing the alignment mark on the substrate to be exposed is fixed. For this reason, when exposing each of a plurality of substrates having different sizes, it is not possible to draw an alignment mark at an optimum position according to the size of the substrate to be exposed. As a result, there is a problem that the alignment accuracy may be lowered depending on the size of the substrate.

The present invention has been made in view of the above problems, and provides an exposure drawing apparatus and an exposure drawing method capable of improving the alignment accuracy on the front and back of the substrate to be exposed without depending on the size of the substrate to be exposed. .

An exposure drawing apparatus according to the present invention includes a first exposure unit that draws a circuit pattern on the first surface by exposing a first surface of a printed wiring board placed on a stage, and a relative to the stage. A plurality of predetermined marks are formed on the second surface opposite to the first surface during the drawing process of the circuit pattern for the first surface on the first surface of the printed wiring board. Mark forming means; measuring means for measuring positions of the mark forming means; detecting means for detecting positions of a plurality of marks formed on the second surface of the printed wiring board by the mark forming means; By exposing the second surface of the printed circuit board with reference to the positions of the mark forming means measured by the means and the positions of the plurality of marks detected by the detecting means. And a, a second exposure means for drawing a circuit pattern on the second surface.

According to this exposure drawing apparatus, a circuit pattern is drawn on the first surface by exposing the first surface of the printed wiring board placed on the stage by the first exposure means. Further, according to the exposure drawing apparatus, the circuit pattern for the first surface is being drawn on the first surface of the printed wiring board by the mark forming means provided to be movable relative to the stage. A plurality of predetermined marks are formed on the second surface opposite to the first surface. Further, according to the exposure drawing apparatus, the position of the mark forming unit is measured by the measuring unit. Further, according to the exposure drawing apparatus, the detection unit detects the positions of the plurality of marks formed on the second surface of the printed wiring board by the mark forming unit.

Here, in the present invention, the second exposure unit uses the position of the mark forming unit measured by the measuring unit and the position of the plurality of marks detected by the detecting unit as a reference. Two sides are exposed. As a result, a circuit pattern is drawn on the second surface.

That is, in this embodiment, the position of the mark forming unit is measured, and a plurality of marks are formed by the mark forming unit at the position of the second surface that has a known relationship with the exposure position of the circuit pattern for the first surface. . Further, when the circuit pattern for the second surface is exposed on the second surface, the circuit pattern for the second surface is drawn on the basis of the position of the mark forming means and the positions of the plurality of marks. Thereby, the position of the circuit pattern drawn on the 1st surface and the 2nd surface can be matched. The “drawing process” refers to a series of processes from when the printed wiring board is placed on the stage to when the drawing of the circuit pattern is completed and the printed wiring board is discharged.

Thus, according to the exposure drawing apparatus according to the present invention, the position of the circuit pattern drawn on the second surface with reference to the positions of a plurality of marks having a known positional relationship with the circuit pattern drawn on the first surface. Can correspond to the position of the circuit pattern drawn on the first surface. As a result, the alignment accuracy on the front and back of the substrate to be exposed can be improved without depending on the size of the substrate to be exposed.

In the present invention, the mark forming means includes at least a direction predetermined with respect to any one side of the printed wiring board placed on the stage and a direction intersecting the predetermined direction. It may be provided so as to be movable in one direction. Thereby, the position which forms a some mark in an appropriate position can be adjusted.

In the present invention, the mark forming means may be configured such that the movable range is a range in which the mark can be formed on a plurality of types of printed wiring boards having different sizes. Thus, a plurality of marks can be formed at appropriate positions without depending on the size of the substrate.

Further, in the present invention, further comprising a specifying unit that specifies a size of the printed wiring board, wherein the mark forming unit forms each of the plurality of marks according to the size specified by the specifying unit. Also good. Thereby, a plurality of marks can be formed at appropriate positions according to the size of the substrate.

In the present invention, the measuring unit may include a photographing unit that photographs the mark forming unit, and may measure each position of the mark forming unit using an image captured by the photographing unit. Thereby, the position of the mark forming means can be easily measured.

In the present invention, the mark forming means may be photographed by the measuring means even when a calibration mark at a known relative position with respect to the mark forming means is in a state where a printed wiring board is placed on the stage. The measurement unit includes a photographing unit that photographs the mark forming unit so that each of the calibration marks is photographed, and the mark formation is performed using an image captured by the photographing unit. You may make it measure each position of a means. Thereby, even when the mark forming unit cannot be photographed, the position of the mark forming unit can be measured.

In the present invention, a plurality of the photographing means may be provided, and each of the photographing means may photograph one or more of the mark forming means. Thereby, the position of the mark forming means can be easily measured.

In the present invention, the photographing means may have a known relationship with a position where a circuit pattern is drawn, and may be provided so as to be movable with respect to the stage. Thereby, the position of the mark forming means can be measured without depending on the position of the mark forming means.

In the present invention, the mark forming means may form the mark by exposing the second surface of the printed wiring board with light having a short wavelength. Thereby, a plurality of marks can be accurately formed at appropriate positions.

In the present invention, the mark forming means may form the plurality of marks by attaching ink to the second surface of the printed wiring board. Thereby, a plurality of marks can be easily formed.

An exposure drawing method according to the present invention includes a first exposure unit that draws a circuit pattern on the first surface by exposing a first surface of a printed wiring board placed on a stage, and a relative to the stage. A mark forming means for forming a plurality of predetermined marks on a second surface opposite to the first surface, a measuring means for measuring the position of the mark forming means, and the mark forming means And a detection means for detecting positions of a plurality of marks formed on the second surface of the printed wiring board, and a circuit pattern is drawn on the second surface by exposing the second surface of the printed wiring board. An exposure drawing method in an exposure drawing apparatus comprising a second exposure means, the step of controlling the measuring means so that the position of the mark forming means is measured, and the mark formation A step of moving the step to a predetermined position; a circuit pattern for the first surface is drawn on the first surface of the printed wiring board; and during the drawing process of the circuit pattern, Controlling the exposure means and the mark forming means so that a plurality of marks are formed on the second surface in correspondence with a circuit pattern; and the position and detection of the mark forming means measured by the measuring means. Controlling the second exposure means so that the circuit pattern for the second surface is drawn on the second surface with reference to the positions of the plurality of marks detected by the device. .

According to the exposure drawing method according to the present invention, since it operates in the same manner as the exposure drawing apparatus according to the present invention, the substrate to be exposed does not depend on the size of the substrate to be exposed, similarly to the exposure drawing apparatus according to the present invention. It is possible to improve the alignment accuracy on both sides.

According to the present invention, the alignment accuracy on the front and back of the substrate to be exposed can be improved without depending on the size of the substrate to be exposed.

It is a block diagram which shows the whole structure of the exposure drawing system which concerns on embodiment. It is a block diagram which shows the function of the exposure drawing system which concerns on embodiment. It is a front view which shows an example of the said surface at the time of exposing to the surface of a to-be-exposed board | substrate with the exposure drawing system which concerns on embodiment. It is a front view which shows an example of the said back surface at the time of exposing to the back surface of a to-be-exposed board | substrate with the exposure drawing system which concerns on embodiment. It is a perspective view which shows the structure of the 1st exposure drawing apparatus and 2nd drawing exposure drawing apparatus which concern on embodiment. It is a disassembled perspective view of the board | substrate clamp mechanism part of the 1st exposure drawing apparatus which concerns on embodiment, and a 2nd exposure drawing apparatus. It is an expanded sectional view for demonstrating the function of the photosensor of the 1st exposure drawing apparatus which concerns on embodiment, and a 2nd exposure drawing apparatus. It is a principal part expanded sectional view for demonstrating the mark formation part of the 1st exposure drawing apparatus which concerns on embodiment, and a 2nd exposure drawing apparatus. It is a principal part enlarged top view for demonstrating the mark formation part of the 1st exposure drawing apparatus which concerns on embodiment, and a 2nd exposure drawing apparatus. It is a schematic front view showing the configuration of a reversing mechanism in the reversing device of the exposure drawing system according to the embodiment. It is a block diagram which shows the electric system of the 1st exposure drawing apparatus and 2nd exposure drawing apparatus which concern on embodiment. It is a figure which shows the relationship between the moving direction of a stage and the moving direction of an imaging | photography part in the exposure drawing system which concerns on embodiment. It is a figure which shows the movable range of the ultraviolet light source of the exposure drawing system which concerns on embodiment. It is a flowchart which shows the flow of a process of the pre-exposure processing program which concerns on embodiment. It is a schematic front view with which it uses for description of the pre-exposure process which concerns on embodiment. It is a flowchart which shows the flow of a process of the 1st exposure processing program which concerns on embodiment. It is a schematic front view with which it uses for description of the 1st exposure process which concerns on embodiment. It is a flowchart which shows the flow of a process of the 2nd exposure processing program which concerns on embodiment. It is a schematic front view with which it uses for description of the 2nd exposure process which concerns on embodiment. In the exposure drawing system which concerns on embodiment, it is a schematic front view which shows the relationship between the size of a to-be-exposed board | substrate, and the drawing position of the mark for alignment.

Hereinafter, the exposure drawing system according to the present embodiment will be described in detail with reference to the accompanying drawings. In the present embodiment, the exposure drawing system 1 uses a flat substrate such as a printed wiring board, a printed board, and a glass substrate for a flat panel display as an exposed substrate, and is also referred to as a first surface (hereinafter referred to as “surface”). And a second surface (hereinafter also referred to as “back surface”) as an example.

FIG. 1 is a configuration diagram showing the overall configuration of an exposure drawing system 1 according to the present embodiment. FIG. 2 is a block diagram showing functions of the exposure drawing system 1 according to the present embodiment. As shown in FIGS. 1 and 2, the exposure drawing system 1 includes a first exposure drawing apparatus 2 that performs exposure on the surface of the substrate to be exposed and forms alignment marks on the back surface of the substrate to be exposed. Yes. Note that the first exposure drawing apparatus 2 measures the position of an ultraviolet light source 51 described later before forming the alignment mark. Further, the exposure drawing system 1 includes a reversing device 3 that reverses the front and back of the substrate to be exposed. Further, the exposure drawing system 1 includes a second exposure drawing apparatus 4 that performs exposure on the back surface of the substrate to be exposed. The exposure drawing system 1 also includes a first transfer unit 5 that transfers the substrate to be exposed from the outside of the apparatus to the first exposure drawing apparatus 2, and a second that transfers the substrate to be exposed from the first exposure drawing apparatus 2 to the reversing device 3. A transport unit 6 is provided. The exposure drawing system 1 also includes a third transfer unit 7 that transfers the substrate to be exposed from the reversing device 3 to the second exposure drawing device 4 and a second transfer that transfers the substrate to be exposed from the second exposure drawing device 4 to the outside of the apparatus. 4 transport section 8 is provided.

3A is a front view showing an example of the front surface C1 when the surface C1 of the substrate C to be exposed is exposed, and FIG. 3B shows the back surface when the back surface C2 of the substrate C to be exposed is exposed. It is a front view which shows an example of C2.

As shown in FIG. 3A, a surface image P1 is drawn by the first exposure drawing device 2 on the surface C1 of the substrate C to be exposed. Further, as shown in FIG. 3B, on the back surface C2 of the substrate C to be exposed, the back exposure image P2 is drawn on the back surface C2 by the second exposure drawing device 4, and the coordinate system (hereinafter referred to as “image”) is drawn. It is drawn in an image coordinate system corresponding to “coordinate system”. In the present embodiment, the surface image P1 is an image having a shape of “F”. In the present embodiment, the back-side image P2 is an image having a rectangular frame shape surrounding an area of the back surface C2 corresponding to the “F” -shaped image on the front surface C1. Further, a plurality (two in the present embodiment) of alignment marks M are drawn on the back surface C2 of the substrate C to be exposed by the first exposure drawing device 2 on the upper center side of the front view and the lower center side of the front view. Is done. The alignment mark M is a mark for making the position of the front image P1 and the position of the back image P2 drawn on the front surface C1 and the back surface C2 of the substrate C to be exposed correspond to each other.

In the exposure drawing system 1 according to the present embodiment, a first exposure drawing apparatus 2 is provided on the upstream side in the transport direction of the substrate C to be exposed. When the unexposed exposed substrate C is carried into the apparatus, the first exposure drawing apparatus 2 exposes the surface C1 of the exposed substrate C and draws the surface image P1 on the surface as described above. To do. The first exposure drawing apparatus 2 forms an alignment mark M on the back surface C2 of the substrate C to be exposed.

In the exposure drawing system 1 according to the present embodiment, the alignment mark M is drawn in a circle of about φ0.5 mm to φ1 mm. However, the size and shape are not limited to this. For example, the size may be a size that does not overlap with the drawing of the front image P1 and the back image P2, and the shape may be arbitrarily set such as a cross shape or a rectangular shape.

A reversing device 3 for reversing the front and back of the substrate C to be exposed is provided downstream of the first exposure drawing apparatus 2 in the transport direction of the substrate C to be exposed. When the exposure substrate C on which the front surface C1 is exposed and the alignment mark M is drawn is carried in by the first exposure drawing device 2, the reversing device 3 exposes the back surface C2 of the exposure substrate C in the following process. In order to perform the above, the front and back of the substrate C to be exposed are reversed.

A second exposure drawing device 4 that performs exposure on the back surface C2 of the substrate C to be exposed is provided downstream of the reversing device 3 in the transport direction of the substrate C to be exposed. When the exposed substrate C reversed by the reversing device 3 is carried into the apparatus, the second exposure drawing device 4 exposes the back surface C2 of the exposed substrate C and draws the back surface image P2. At this time, the second exposure drawing apparatus 4 performs alignment on the back surface C2 after performing alignment using the alignment mark M drawn on the substrate C to be exposed by the first exposure drawing apparatus 2.

The first transport device 5, the second transport device 6, the third transport device 7, and the fourth transport device 8 each have a plurality of rotating rollers and a drive motor that rotates the rotating rollers. A plurality of rotating rollers are laid in parallel, and a sprocket or pulley that receives a rotational force transmitted by a belt or a wire is attached to one end of the rotating roller. As a means for transmitting the rotational force of the drive motor that rotates the rotating roller, a transmission method using a cylindrical magnet can be employed in addition to the belt or the wire.

In the present embodiment, in order to increase the throughput (production amount per hour) of the substrate C to be exposed, exposure is performed using two exposure drawing apparatuses, the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4. The front surface C1 and the back surface C2 of the substrate C are exposed. However, the number of exposure drawing apparatuses is not limited to two, and it is possible to draw both surfaces of the exposed substrate C while inverting the exposed substrate C from the front surface C1 to the back surface C2 with a single exposure drawing device. It is.

Next, the configuration of the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 will be described.

FIG. 4 is a perspective view showing configurations of the first exposure drawing apparatus 2 and the second drawing exposure drawing apparatus 4 according to the present embodiment. In the following, the direction in which the stage 10 moves is defined as the Y direction, the direction perpendicular to the Y direction in the horizontal plane is defined as the X direction, the direction perpendicular to the Y direction in the vertical plane is defined as the Z direction, and the Z axis The direction of rotation centered on is defined as the θ direction.

As shown in FIG. 4, the first exposure drawing apparatus 2 includes a flat stage 10 for fixing the substrate C to be exposed. The stage 10 is configured to be movable, and the exposure target substrate C fixed to the stage 10 moves the exposure target substrate C to the exposure position in accordance with the movement of the stage 10, and the exposure unit 16, which will be described later, emits a light beam. The surface image C1 is drawn on the substrate C to be exposed.

The stage 10 is supported by a flat base 12 that is movably provided on the upper surface of a table-like base 11. Further, a movement mechanism unit 13 having a movement drive mechanism (not shown) constituted by a motor or the like is provided between the base 12 and the stage 10. The stage 10 is rotationally moved in the θ direction by the moving mechanism 13 with respect to the base 12 with the perpendicular at the center of the stage 10 as the central axis.

One or a plurality of (in this embodiment, two) guide rails 14 are provided on the upper surface of the base body 11. The base 12 is supported by a guard rail 14 so as to be reciprocally movable, and is moved by a stage driving unit (stage driving unit 71 described later) constituted by a motor or the like. The stage 10 is moved along the guide rail 14 by being supported on the upper surface of the movable base 12.

A gate-type gate 15 is erected on the upper surface of the base 11 so as to straddle the guide rail 14, and an exposure unit 16 is attached to the gate 15. The exposure unit 16 is composed of a plurality (16 in the present embodiment) of exposure heads 16 a and is fixedly arranged on the moving path of the stage 10. An optical fiber 18 drawn from the light source unit 17 and a signal cable 20 drawn from the image processing unit 19 are connected to the exposure unit 16.

Each exposure head 16 has a digital micromirror device (DMD) as a reflective spatial light modulation element. Each exposure head 17 modulates the light beam from the light source unit 17 by controlling the DMD based on the image data input from the image processing unit 19. Each exposure head 16 irradiates the exposure target substrate C placed on the stage 10 with this light beam, whereby exposure by the first exposure drawing apparatus 2 is performed. Note that a transmissive spatial light modulator such as liquid crystal may be used as the spatial light modulator.

A gate 22 is provided on the upper surface of the base 11 so as to straddle the guide rail 14. One or a plurality of (two in this embodiment) image pickup units 23 for photographing the substrate C to be exposed placed on the stage 10 are attached to the gate 22. The photographing unit 23 is a CCD camera or the like having a built-in strobe with a very short light emission time. The photographing unit 23 is installed to photograph a mark forming unit 52 described later and an alignment mark M drawn on the substrate C to be exposed. In addition, the gate 22 is provided with a guide unit 23 a that guides the movement of the photographing unit 23 in the X direction. Each photographing unit 23 is guided by the guide unit 23 and moves in the X direction. Further, the relative position of the photographing unit 23 with respect to the stage 10 is measured in accordance with the movement of the stage 10 or the photographing unit 23 and stored in a storage unit included in the system control unit 70. When the ultraviolet light source 51 in the mark forming unit 52 is photographed, the ultraviolet light source 51 is photographed in a state where the substrate C to be exposed is not placed on the stage 10.

The first exposure drawing apparatus 2 derives the position of the ultraviolet light source 51 on the exposed substrate C from the image obtained by photographing the mark forming unit 52 by the photographing unit 23. The second exposure drawing apparatus 4 compares the position deviation amount (X, Y) with respect to the position of the ultraviolet light source 51 in the first exposure drawing apparatus 2 from the image in which the alignment mark M is taken by the photographing unit 23. , Θ direction deviation amount) is detected. Information on the amount of positional deviation of the alignment mark M is used to correct the positions of the front image P1 drawn on the front surface C1 of the substrate C to be exposed and the back image P2 drawn on the back surface C2.

It should be noted that the number of imaging units 23 is ideally provided according to the number of mark forming units 52 (or the number of alignment marks M) described later. However, the present invention is not limited to this, and a single photographing unit 23 may be provided, and a plurality of mark forming units 52 or a plurality of alignment marks M may be photographed by moving the photographing unit 23.

Further, on the upper surface of the stage 10, a substrate clamping mechanism for fixing the end of the substrate C to be exposed to the stage 10 is provided.

FIG. 5 is an exploded perspective view of the substrate clamping mechanism 30 of the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 according to the present embodiment. As shown in FIG. 5, the substrate clamp mechanism 30 has a pair of clamp bars 31 a and 31 b that clamp the end from above so as to sandwich one opposite side of the substrate C to be exposed. Further, the substrate clamp mechanism 30 has a pair of clamp bars 31c and 31d that clamp the end from above so as to sandwich the other opposite side in the horizontal plane of the substrate C to be exposed. In addition, the substrate clamping mechanism 30 includes moving units 32a to 32d that translate these clamp bars 31a to 31d in the horizontal direction. The clamp bars 31 a to 31 d are respectively disposed on the upper surface of the stage 10, and the moving units 32 a to 32 d are disposed below the stage 10.

In the present embodiment, the clamp bars 31a and 31b are long in the Y direction and face each other in the X direction, and the clamp bars 31c and 31d are long in the X direction and face each other in the Y direction. ing. The clamp bars 31a and 31b are formed to be shorter than the clamp bars 31c and 31d, and are configured not to interfere with each other even when the size of the exposed substrate C is small.

In this embodiment, the clamp bar 31a has a clamp holder 33 made of metal (for example, aluminum). The clamp bar 31a has a resin-made clamp blade 34 that is fixed to the inner region (the central region of the stage 10) on the lower surface of the clamp holder 33 and that contacts the surface C1 of the substrate C to be exposed. In addition, the clamp bar 31 a has two support columns 35 provided in an outer region (outer region of the stage 10) on the lower surface of the clamp holder 33. One or a plurality of insertion holes 37 penetrating in the front and back direction and extending in the Y direction or the X direction from the end of the stage 10 toward the center are provided at predetermined intervals on each side (this embodiment). Then, three (12 in total) are formed on each side. Further, the two support columns 35 of the clamp bar 31a are inserted into two insertion holes 37 among the three insertion holes 37 on each side. The clamp bars 31b to 31d have the same configuration as the clamp bar 31a.

The moving unit 32a includes a support plate 40 that supports the two support columns 35, and an air cylinder 41 that slides the support plate 40 in the Z direction. The tip of the piston rod 42 of the air cylinder 41 is fixed to the lower surface of the support plate 40. The air cylinder 41 lowers and raises the piston rod 42 by a drive unit configured by a motor or the like. The movable range of the piston rod 42 is limited and stops at a predetermined position when the piston rod 42 is lowered and raised.

When the piston rod 42 is lowered, the clamp bar 43a is lowered together with the piston rod 42, and the clamp bar 31a is pressed against the stage 10. Here, when the substrate to be exposed C is placed on the stage 10, the substrate to be exposed C is clamped by the clamp bar 31a. On the other hand, when the piston rod 42 rises, the clamp bar 31a rises together with the piston rod 42, and the clamp bar 31a moves away from the stage 10 in the Z direction. The distance that the clamp bar 31a is separated from the stage 10 is larger than the thickness of the substrate C to be exposed. The state of the clamp bar 31a when the clamp bar 31a is pressed against the stage 10 is referred to as a closed state (closed position), and the state of the clamp bar 31a when it is separated from the stage 10 is referred to as an open state (open position).

The moving unit 32a further includes a drive pulley 44 and a driven pulley 45 arranged in the X direction, a timing belt 46 stretched over these

pulleys

44, 45, and a belt drive motor 47 that rotates the drive pulley 44. Have. The belt drive motor 47 can rotate forward and backward. An air cylinder 41 is attached to the timing belt 46 via an attachment portion 48. When the timing belt 46 is driven, the air cylinder 41 and the support plate 40 move in the X direction, whereby the clamp bar 31a moves in the X direction. Moving. The clamp bar 31 a slides along the support column 35 along the insertion hole 37, the retracted position where the support column 35 is located at the outer end of the insertion hole 37, and the support column 35 is the end inside the insertion hole 37. It moves between the center position located in the part. Note that the position of the clamp bar 31a when the clamp bar 31a clamps the peripheral edge of the substrate C to be exposed (any position between the retracted position and the center position) is referred to as a clamp position.

The moving

units

32b, 32c, and 32d have the same configuration as the moving unit 32a. However, the moving unit 32b moves the clamp bar 31b in the Z direction and the X direction, the moving unit 32c moves the clamp bar 31c in the Z direction and the Y direction, and the moving unit 32d moves the clamp bar 31d in the Z direction and Move in Y direction.

FIG. 6 is an enlarged cross-sectional view for explaining the function of the photosensor 49 of the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 according to the present embodiment. As shown in FIGS. 5 and 6, the support plate 40 of the moving unit 32a is provided with a reflective photosensor (substrate edge sensor) 49 for detecting the presence or absence of the substrate C to be exposed. The photo sensor 49 is attached to the support plate 40 and is provided at a position corresponding to the insertion hole 37 in the X direction and the Y direction, that is, a position where the photo sensor 49 is exposed from the insertion hole 37 when viewed from above. . The photo sensor 49 has a light projecting unit that emits inspection light upward and a light receiving unit that receives the inspection light reflected on the back surface C2 of the substrate C to be exposed. When the light receiving unit receives the inspection light, Outputs a substrate presence signal, and outputs a substrate absence signal when the light receiving unit does not receive the inspection light.

The clamp blade 34 of the clamp bar 31a is located above the photo sensor 49. However, in order to prevent the inspection light from the photosensor 49 from being reflected by the clamp blade 34 and returning to the photosensor 49, an inclined surface 50 is formed at a portion corresponding to the insertion hole 37 of the clamp blade 34. . A photo sensor 49 similar to the moving unit 32a is also provided on the support plate 40 of each moving

unit

32b, 32c, 32d.

Further, each support plate 40 is provided with a mark forming portion 52 for forming an alignment mark M on the substrate C to be exposed placed on the stage 10. FIG. 7A is an enlarged cross-sectional view of a main part for explaining the mark forming unit 52 of the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 according to the present embodiment. FIG. 7B is an enlarged top view of a main part for explaining the mark forming part 52 of the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 according to the present embodiment. In FIG. 7B, the substrate to be exposed C is omitted in order to explain the configuration of the ultraviolet light source 51.

As shown in FIG. 5, FIG. 7A and FIG. 7B, each mark forming portion 52 is inserted so as to correspond to the insertion hole 37 provided at the center of the plurality of insertion holes 37 provided on each side. It is formed in a plate shape extending in the direction along the hole 37. The mark forming part 52 is provided with an ultraviolet light source 51 for generating an ultraviolet beam (short wavelength light beam) UV toward the stage 10 on the center side of the stage 10. By irradiating the exposed substrate C with the ultraviolet beam UV generated by the ultraviolet light source 51 while passing through the insertion hole 37, the second surface (surface on the side in contact with the stage 10) C2 of the exposed substrate C is used for alignment. The mark M is drawn.

In the mark forming part 52, a plurality (two in the present embodiment) of calibration marks 53 are provided on the same surface that is visible from above the stage 10 on the end side of the stage 10. . These calibration marks 53 are visible from the outside through the insertion hole 37 without being blocked by the exposed substrate C when the exposed substrate C is placed on the stage 10 and fixed to the substrate clamping mechanism 30. It is formed in a possible position. Therefore, each calibration mark 53 can be recognized in the photographed image obtained by the photographing unit 23.

Each mark forming section 52 moves in conjunction with the movement of the moving units 32a to 32d. The insertion hole 37 corresponding to each mark forming portion 52 is provided in a region including the movement path of each mark forming portion 25. Further, the ultraviolet light source 51 generates an ultraviolet beam UV so as to pass through the insertion hole 37 through which the support column 35 is not inserted even while the surface C1 of the substrate C to be exposed is exposed by the exposure unit 16. Can be made. The irradiation time of the ultraviolet beam UV is preferably set to an optimum time according to the photosensitive material applied to the substrate C to be exposed.

Further, in each mark forming unit 52, the ultraviolet light source 51 and the calibration mark 53 are provided so as to have a known positional relationship with each other, and each positional relationship is measured in advance and stored in the system control unit 70. Stored in the means. When the ultraviolet light source 51 is positioned behind the substrate C to be exposed, the ultraviolet light source 51 may not be photographed by the photographing unit 23. Even in this case, the position is measured by photographing each calibration mark 53, the position of each measured calibration mark 53, and the positional relationship between the stored ultraviolet light source 51 and calibration mark 53. From the above, the position of the ultraviolet light source 51 can be derived.

In addition, although the 1st exposure drawing apparatus 2 is provided with the some ultraviolet light source 51, the 2nd exposure drawing apparatus 4 does not necessarily need to be provided with the some ultraviolet light source 51. FIG. The first exposure drawing apparatus 2 may be provided with a plurality of ultraviolet light sources and may draw a plurality of alignment marks M by moving the ultraviolet light sources.

The first exposure drawing apparatus 2 includes an auto carrier hand (hereinafter referred to as an AC hand) 62 that carries the substrate C to be exposed, which has been transferred by the first transfer apparatus 5, into the first exposure drawing apparatus 2. The AC hand 62 is formed in a flat plate shape, and is provided so as to be movable in the horizontal direction and the vertical direction in parallel with the horizontal plane. Further, on the lower surface of the AC hand 62, a suction mechanism having a suction part 63 that sucks and holds the substrate C to be exposed by vacuum suction by sucking air, and a vertically movable member that presses the substrate C to be exposed downward are freely movable. A pressing mechanism having a pressing portion 64 is provided.

The AC hand 62 lifts the unexposed substrate C placed on the first transport device 5 upward by sucking and holding it with a suction mechanism, and the lifted exposed substrate C is predetermined on the upper surface of the stage 10. Place it at a different position. When the exposed substrate C is placed, the suction by the suction portion 63 is released while pressing the exposed substrate C against the stage 10 by the pressing mechanism, whereby the vacuum suction of the stage 10 works, and the exposed substrate C becomes the stage. 10 is firmly fixed.

Further, the AC hand 62 lifts upward by sucking and holding the exposed substrate C placed on the upper surface of the stage 10 by a suction mechanism. Further, the AC hand 62 moves the exposed substrate C that has been lifted to the second transport device 6 in a state of being sucked and held, and then releases the suction by the suction mechanism, whereby the exposed substrate C is moved to the second transport device. Move to 6.

According to the substrate clamping mechanism 30 of the exposure drawing system 1 according to the present embodiment, the peripheral edge of the substrate to be exposed C can be reliably clamped, and the warpage and distortion of the substrate to be exposed C can be corrected. The substrate clamp mechanism 30 is configured to move the ultraviolet light source 51 and the photo sensor 59 together with the clamp bars 31a to 31d. Therefore, since the moving mechanism for the ultraviolet light source 51 and the photosensor 59 is not necessary, the manufacturing cost of the substrate clamp mechanism 30 can be suppressed.

FIG. 8 is a schematic front view showing a configuration of a reversing mechanism in the reversing device 4 of the exposure drawing system 1 according to the present embodiment. As shown in FIG. 8, the reversing device 4 includes a roller unit 4b that is arranged in two rows and includes a plurality of rollers 4a that sandwich the exposed substrate C between the rows. The roller unit 4b is supported by a support bar 4c, and rotates around a rotating shaft 4d provided at the center of the roller unit 4b while being lifted by the support bar 4c when the substrate C to be exposed is sandwiched. To do. After the roller unit 4b rotates 180 degrees, the exposed substrate C is released from the roller unit 4b, so that the front and back of the exposed substrate C are reversed. The configuration of the reversing mechanism is not limited to the above-described configuration, and a method of reversing the front and back of the exposed substrate C by lifting one end of the exposed substrate C and rotating the exposed substrate C 180 degrees, and other conventionally known methods. The method may be used.

FIG. 9 is a configuration diagram showing an electrical system of the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 according to the present embodiment.

As shown in FIG. 9, the first exposure drawing apparatus 2 is provided with a system control unit 70 that is electrically connected to each part of the apparatus. The system control unit 70 controls each part in an integrated manner. Yes. The system control unit 70 controls the AC hand 62 to perform a carry-in operation and a discharge operation of the substrate C to be exposed to the stage 10. Further, the system control unit 70 controls the stage driving unit 71 to move the stage 10 and adjusts the image drawing position by shooting the alignment mark M using the shooting unit 23. Further, the system control unit 70 controls the light source unit 17 and the image processing unit 19 to cause the exposure head 16a to perform exposure processing. The operation device 73 includes a display unit and an input unit, and is operated, for example, when inputting the outer size of the substrate C to be exposed.

The substrate placement position determination unit 72 determines the placement position of the substrate C to be exposed with respect to the stage 10 to an appropriate placement position (hereinafter referred to as “appropriate placement position”). In the Y direction, the alignment mark M can be positioned at the center of the imaging region by adjusting the imaging timing of the imaging unit 23. Therefore, the proper placement position in the Y direction may be set at any position on the stage 10. In this embodiment, the proper placement position in the X direction is set to a position where the center of the substrate C to be exposed and the center of the stage 10 coincide.

In the substrate placement position determination unit 72, based on the information obtained by the preparatory operation performed before performing the exposure operation on the substrate C to be exposed, the proper placement position of the substrate in the X direction (appropriate alignment mark M Position). In this preparatory operation, the system control unit 70 controls the imaging unit 23 to image the alignment mark M after placing the substrate C to be exposed in an appropriate position on the stage 10 in the X direction. In the Y direction, the center of the substrate C to be exposed is aligned with the center of the stage 10 so that one opposing side of the stage 10 and one opposing side of the substrate C to be exposed are parallel to each other. Put. In addition, the system control unit 70 calculates a deviation amount between the center position of the imaging region in the X direction and the position of the alignment mark M. Then, the system control unit 70 calculates an appropriate placement position of the substrate in the X direction based on the deviation amount. In the preparation operation, an appropriate placement position can be obtained more accurately by performing this process on a plurality of (for example, five) substrates. In this preparation operation, the photographing timing of the photographing unit 23 is also determined. The calculated proper placement position information and imaging timing information of the substrate are sent to the system control unit 70 and stored in the storage means of the system control unit 70.

The movement control unit 74 controls the movement drive of the photographing unit 23 based on an instruction from the system control unit 70. In the present embodiment, the movement control unit 74 includes a plurality of mark forming units 52 or a plurality of alignment marks M drawn on the exposed substrate C when the stage 10 is moved. The movement drive of the photographing unit 23 is controlled so as to pass through the photographing region.

The movement control unit 74 controls the driving of the movement units 32a to 32d based on instructions from the system control unit 70, respectively. The movement control unit 74 monitors a signal (substrate presence signal or substrate absence signal) from the photosensor 49 of the movement units 32a to 32d. The movement control unit 74 controls the driving of the air cylinder 41 and the belt drive motor 47 of the movement units 32a to 32d based on this signal, and causes the clamp bars 31a to 31d to perform the clamping operation.

In the movement control unit 74, the exposed substrate C is placed in the region on the stage 10 based on the substrate size information input from the operation device 73 and the proper placement position information of the substrate calculated by the preparation operation. Guess where the area is. Further, the movement control unit 74 switches the movement speed of the clamp bars 31a to 31d between high speed / low speed based on the estimated area. Specifically, on the stage 10, a high-speed movement is set outside a position (see FIG. 6) that is a distance L1 (for example, 40 mm) away from the periphery of the substrate C to be exposed, and a low-speed movement is set inside that position. It is set. Thereby, since the substrate C to be exposed is detected during the low-speed movement, the substrate C to be exposed can be reliably detected. Note that a position away from the periphery of the substrate C to be exposed by a distance L1 is referred to as a deceleration position (switching point). The clamp bars 31a to 31d stop at a clamp position that enters a predetermined distance (for example, 5 mm) from the position where the substrate C to be exposed is detected, and perform clamping at the clamp position. This clamping position is a position where the support columns 35 of the clamp bars 31a to 31d do not come into contact with the edge of the substrate C to be exposed.

The movement control unit 74 determines that the actual substrate size is larger than the input substrate size when the exposed substrate C is detected while the clamp bars 31a to 31d are moving at high speed. In this case, the movement control unit 74 stops the movement of the clamp bars 31 a to 31 d and outputs an abnormal signal to the system control unit 70. Upon receiving the abnormality signal, the system control unit 70 causes the display unit of the operation device 73 to display error information indicating that the substrate size is large. Instead of displaying error information, a warning sound may be generated.

In addition, the movement control unit 74 moves the actual size of the substrate rather than the input substrate size when the clamp bars 31a to 31d move at a low speed and the low-speed movement is continued for a predetermined time without detecting the substrate C to be exposed. Is small, or it is determined that the substrate is not placed. In this case, the movement control unit 74 stops the movement of the clamp bars 31 a to 31 d and outputs an abnormal signal to the system control unit 70. Upon receiving the abnormal signal, the system control unit 70 causes the display unit of the operation device 73 to display error information indicating that the substrate size is small or the substrate C to be exposed is not placed.

FIG. 10 is a diagram showing a relationship between the moving direction of the stage 10 and the moving direction of the photographing unit 23 in the exposure drawing system 1 according to the present embodiment. As shown in FIG. 10, the moving direction of the photographing unit 23 is a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 in the horizontal direction. In the exposure drawing system 1, the position in the Y direction is controlled by moving the stage 10 when photographing the alignment mark M drawn on the plurality of ultraviolet light sources 51 or the exposed substrate C by the photographing unit 23. In the exposure drawing system 1, the position in the X direction is controlled by moving the photographing unit 23. Accordingly, the relative positions of the plurality of mark forming units 52 or the alignment marks M are controlled so that they are included in the imaging region of the imaging unit 23. Note that the moving direction of the photographing unit 23 is not limited to the X direction. That is, it is only necessary that the alignment mark M drawn on the mark forming portion 52 or the substrate C to be exposed can be photographed. Therefore, the moving direction of the photographing unit 23 may be movable in both the X direction and the Y direction, or may be movable in a direction other than the X direction and the Y direction.

FIG. 11 is a diagram showing a movable range R of the ultraviolet light source 51 of the exposure drawing system 1 according to the present embodiment. As shown in FIG. 11, the ultraviolet light source 51 is configured to move linearly from the end of the stage 10 (in this embodiment, the center of the side of the stage 10) toward the center by a predetermined distance. ing. When the ultraviolet light source 51 draws the alignment mark M on the substrate to be exposed C, the ultraviolet light source 51 generates the ultraviolet beam UV in a state where the substrate to be exposed C is placed on the stage 10. At that time, the ultraviolet light source 51 moves to a position where the alignment mark M is drawn on the end of the substrate C to be exposed. The movable range R of the ultraviolet light source 51 is not limited to this, but includes a range from the position where the alignment mark M can be drawn on the minimum size substrate to be exposed to the position of the end surface of the maximum size substrate. And good. It is desirable that the minimum range in which the alignment mark M can be drawn on the substrates of all sizes to be exposed.

Next, the operation of this embodiment will be described.

FIG. 12 is a flowchart showing the flow of processing of the pre-exposure processing program according to the present embodiment, and the program is stored in a predetermined area of a ROM that is a recording medium provided in the system control unit 70 of the first exposure drawing apparatus 2. Stored in advance. FIG. 13 is a schematic front view for explaining the pre-exposure processing according to the present embodiment.

The system control unit 70 of the first exposure drawing apparatus 2 executes the pre-exposure processing program at a predetermined timing (in this embodiment, the timing at which the substrate C to be exposed is placed on the stage 10).

When the substrate C to be exposed is placed on the stage 10, the system control unit 70 moves the position of the ultraviolet light source 51 relative to the substrate C to be exposed in step S101. In the present embodiment, the ultraviolet light source 51 moves in conjunction with the movement of the movement units 32 a to 32 d of the substrate clamp mechanism 30. Therefore, the system control unit 70 controls the moving unit 32a to start the movement of the clamp bars 31a to 31d in the open state from the end portion of the stage 10 to the center portion and move the position of the ultraviolet light source 51. Further, when the system control unit 70 receives the substrate presence signal from the photosensor 49, the system control unit 70 shifts the clamp bars 31a to 31d to the closed state at the received position or the position moved by a predetermined distance as received. Accordingly, the clamp bars 31a to 31d are fixed in a state where the substrate to be exposed C is sandwiched between the clamp bars 31a to 31d, and the position of the ultraviolet light source 51 is fixed accordingly.

When the non-exposed substrate C is not sandwiched by the clamp bars 31a to 31d, or when the ultraviolet light source 51 is moved by a moving mechanism different from the clamp bars 31a to 31d, the non-exposed substrate C is placed on the stage 10. It is moved to a predetermined position before being placed.

In step S103, the system control unit 70 images each of the calibration marks 53 corresponding to the plurality of ultraviolet light sources 51 by the imaging unit 23, and derives the position of the ultraviolet light source 51 from the captured image by the method described above. Note that the method for measuring the position is not limited to the above-described method. When the ultraviolet light source 51 can be photographed by the photographing unit 23, for example, before the exposed substrate C is placed on the stage 10, the ultraviolet light source 51 is photographed. And the method of measuring the position of the ultraviolet light source 51 from the picked-up image may be used.

In step S105, the system control unit 70 sets a corresponding coordinate system on the stage 10 (hereinafter referred to as “stage coordinate system”), and ends the pre-exposure processing program. As shown in FIG. 13, at the stage of pre-exposure processing, each ultraviolet light source 51 is arranged at a known position in the stage coordinate system.

The system control unit 70 of the first exposure drawing apparatus 2 executes the first exposure process after the pre-exposure processing is completed and the substrate C to be exposed is placed on the stage 10. FIG. 14 is a flowchart showing a flow of processing of the first exposure processing program according to the present embodiment, and the program is a predetermined area of a ROM that is a recording medium provided in the system control unit 70 of the first exposure drawing apparatus 2. Is stored in advance. FIG. 15 is a schematic front view for explaining the first exposure process according to the present embodiment.

In step S201, the system control unit 70 sets an image coordinate system that is a coordinate system for drawing the surface image P1 on the exposed substrate C based on the position of the ultraviolet light source 51 measured in step S103. To do. As shown in FIG. 15, at the stage of the first exposure process, the image coordinate system is set according to the position of the ultraviolet light source 51 with respect to the stage coordinate system. The position of the ultraviolet light source 51 may be introduced into an arbitrary image coordinate system.

In step S203, the system control unit 70 moves the stage 10 to the exposure position based on the image coordinate system set in step S201. At this time, the system control unit 70 moves the stage 10 along the guide rail 14 in the Y direction. In addition, the system control unit 70 moves the stage 10 to a position where an exposure target position by the exposure head 16a coincides with a start position when the surface image P1 is drawn on the substrate C to be exposed.

In step S205, the system control unit 70 starts exposure by each exposure head 16a and draws the surface image P1 on the surface C1 of the substrate C to be exposed at a position based on the image coordinate system set in step S201. . In step S207, the system control unit 20 generates an ultraviolet beam UV from the ultraviolet light source 51, and draws the alignment mark M on the back surface C2 of the substrate C to be exposed. Note that the process for the front surface C1 of the substrate C to be exposed in step 205 and the process for the back surface C2 of the substrate C to be exposed in step S207 do not interfere with each other. That is, since the first exposure / drawing apparatus 2 can perform the processes described above in parallel, the processes of Step S205 and Step S207 may be performed simultaneously. Or the 1st exposure drawing apparatus 2 may perform the process of step S207 before the process of step S205. As shown in FIG. 15, based on the image coordinate system, the front image P1 is drawn on the front surface C1 of the substrate C to be exposed, and the alignment mark M is drawn on the back surface C2.

In this way, by drawing the alignment mark M on the back surface C2 during the drawing process of the front surface image P1 on the front surface C1 of the substrate C to be exposed, there is no need to separately perform the processing of drawing the alignment mark M. . Therefore, it is possible to secure a long holding time for printing out the alignment mark M without affecting the cycle time of the exposure drawing process. As a result, the contrast of the photographed image of the alignment mark M in the drawing process on the back surface C2 can be improved, and therefore the recognition deviation of the alignment mark M can be suppressed.

The alignment mark M is displayed on the exposed substrate C by being baked out after being irradiated with the ultraviolet beam UV, so that the position and shape of the alignment mark M can be confirmed by photographing with the photographing unit 23. can do.

In step S209, the system control unit 70 moves the stage 10 to the position where the substrate to be exposed C is placed, and ends the first exposure processing program. When the stage 10 moves to the placement position of the substrate C to be exposed, the substrate C to be exposed moves to the second transport device 6 by being sucked and held by the AC hand 62. The exposed substrate C is transported to the reversing device 3 by the second transport device 6, and the front and back are reversed by the reversing device 3, and then transported to the second exposure drawing device 4 by the third transport device 7.

The system control unit 70 of the second exposure drawing apparatus 4 executes the pre-exposure processing program at a predetermined timing (in this embodiment, the timing at which the substrate C to be exposed is placed on the stage 10).

FIG. 16 is a flowchart showing a flow of processing of the second exposure processing program according to the present embodiment, and the program is a predetermined area of a ROM that is a recording medium provided in the system control unit 70 of the second exposure drawing apparatus 4. Is stored in advance. FIG. 17 is a schematic front view for explaining the second exposure process according to the present embodiment.

In step S301, the system control unit 70 moves the stage 10 on which the substrate C to be exposed is placed to a position where the entire alignment mark M drawn in step S207 is included in the image captured by the imaging device 23. Let At this time, the system control unit 70 moves the stage 10 along the guide rail 14 in the Y direction, and the position where the imaging unit 23 is provided and the position where the alignment mark M is provided are in the Y direction. The stage 10 is moved to a position that substantially matches at.

The imaging area by the imaging unit 23 is an area where the alignment mark M is provided on the back surface C2 of the substrate C to be exposed, and is larger than an area including an installation error of the substrate C to be exposed. As a result, even when the installation position of the substrate to be exposed C is deviated from the preset installation position, the center of the alignment mark M is photographed around the set position. If included, it is included in the imaging area of the area imaging unit 23.

In step S303, the system control unit 70 measures the position of the alignment mark M from the captured image in which the alignment mark M is captured by the imaging unit 23. In step S305, the system control unit 70 determines a position for drawing the back surface image P2 on the back surface C2 of the substrate C to be exposed based on the position of the alignment mark M measured in step S303. Set the image coordinate system. At this time, the image coordinate system is set so as to correspond to the image coordinate system set in step S201. That is, the relative position between the position of the ultraviolet light source 51 measured in step S103 and the drawing position of the front image C1, and the relative position of the alignment mark M and the drawing position of the back image C2 are mutually. Set to correspond. As shown in FIG. 17, since the image coordinate system is set based on the position of the alignment mark M at the stage of the second exposure process, the relative position between the stage coordinate system and the image coordinate system is the first exposure. It may be different from the processing stage.

In step S307, the system control unit 70 moves the stage 10 to the exposure position based on the image coordinate system set in step S305. At this time, the system control unit 70 moves the stage 10 along the guide rail 14 in the Y direction. Further, the system control unit 70 moves the stage 10 to a position where an exposure target position by the exposure head 16a coincides with a start position when the back surface image P2 is drawn on the substrate C to be exposed.

In step S309, the system control unit 70 starts exposure by each exposure head 16a and draws the back surface image P2 on the back surface C2 of the substrate C to be exposed. As shown in FIG. 17, the back surface image P <b> 2 is drawn on the back surface C <b> 2 of the substrate C to be exposed based on the image coordinate system.

In step S311, the system control unit 70 moves the stage 10 to the position where the substrate C to be exposed is placed, and ends the second exposure processing program. When the stage 10 moves to the placement position of the exposed substrate C, the exposed substrate C on which images are drawn on both the front surface C1 and the back surface C2 is attracted and held by the AC hand 62 to the fourth transport device 8. It moves and is transported by the fourth transport device 8.

FIG. 18 is a schematic front view showing the relationship between the size of the substrate C to be exposed and the drawing position of the alignment mark M in the exposure drawing system 1 according to the present embodiment. In the present embodiment, when the clamp bars 31a to 31d are moved by the moving units 32a to 32d of the substrate clamping mechanism section 30, the ultraviolet light source 51 is moved in conjunction with the movement. Therefore, as shown in FIG. 18, the photosensor 49 detects the end of the substrate C to be exposed and the clamp bars 31a to 31d fix the ends of the substrate C to be exposed, so that the ultraviolet light source 51 is automatically provided. Is fixed to a position where the end of the substrate C to be exposed is irradiated with the ultraviolet beam UV. Further, the positional relationship between the positions of the clamp bars 31a to 31d and the ultraviolet light source 51 can be freely designed. Therefore, in the present embodiment, the alignment mark M can be drawn at a predetermined position on the substrate C to be exposed without depending on the size of the substrate C to be exposed.

Note that the method of measuring the position of the ultraviolet light source 51 in step S103 differs depending on the required measurement accuracy, and the moving units 32a to 32d of the substrate clamp mechanism unit 30 are provided with stepping motors, which are measured by the pulses of the stepping motors. Also good. Alternatively, the moving units 32a to 32d may include a rotary encoder, and the position may be measured by a pulse of the rotary encoder. Alternatively, an optical distance sensor or a distance sensor using ultrasonic waves may be provided in any part of the first exposure drawing apparatus 2, and the position may be measured by these distance sensors.

In this embodiment, two or more circular calibration marks 53 are provided, and the position of the ultraviolet light source 51 is derived from the positional relationship between the two or more calibration marks 53 and the ultraviolet light source 51. However, the shape and number of the calibration marks 53 are not limited to this, and the shape of the calibration marks can be arbitrarily set. Further, when the shape of the calibration mark 53 is a mark indicating the position of an arrow mark or the like and the direction of the ultraviolet light source 51, the calibration mark 53 is provided even if only one calibration mark 53 is provided. The position of the ultraviolet light source 51 can be derived from the position and direction of the mark 53.

Further, when the position of the ultraviolet light source 51 is measured by a deviation amount from the theoretical value of the position of the ultraviolet light source 51 in the photographed image, the ultraviolet light source 51 is preferably within the depth of focus of the imaging unit 23. However, when the ultraviolet light source 51 is not within the depth of focus of the imaging unit 23, the height (position in the Z direction) of the stage 10 may be changed so that the ultraviolet light source 51 is located within the focal depth of the imaging unit 23. .

In this embodiment, two alignment marks M are drawn. However, the present invention is not limited to this, and the number of alignment marks M may be arbitrarily set as long as it is two or more. As the number of alignment marks M increases, the alignment accuracy on the front and back of the substrate C to be exposed can be improved.

In this embodiment, the alignment mark M is drawn on the substrate C to be exposed using the ultraviolet light source 51. However, the present invention is not limited to this, and the drawing may be performed by spraying or transferring ink.

In the present embodiment, the ultraviolet light source 51 is provided so as to be movable in the X direction or the Y direction, but the present invention is not limited to this, and an ultraviolet light source capable of moving in any direction may be used. Further, the moving path of the ultraviolet light source may be a path crossing the central portion of the substrate C to be exposed or a path crossing an arbitrary position of the substrate C to be exposed.

In the present embodiment, the ultraviolet light source 51 is moved in conjunction with the moving units 32a to 32d of the clamp mechanism unit 30, but the present invention is not limited to this, and the ultraviolet light source 51 is individually moved by a moving mechanism constituted by a motor or the like. You may let them. In this case, the size of the substrate C to be exposed and the placement position on the stage 10 are stored in advance, and the ultraviolet light source 51 moves to a predetermined position according to the stored size and placement position. It is good to be set as follows.

If the drawing of the front image P1 has failed in step S205, the process may proceed to step S209 without performing the process of step S207 (drawing process of the alignment mark M). In this case, the alignment mark M is not drawn on the exposed substrate C that has failed to draw the surface image P1. Therefore, the user can determine whether the drawing of the surface image P1 is successful or unsuccessful by confirming the presence or absence of the alignment mark M for each substrate C to be exposed.

Claims

First exposure means for drawing a circuit pattern on the first surface by exposing a first surface of a printed wiring board placed on a stage;
It is provided so as to be movable relative to the stage, and is predetermined on a second surface opposite to the first surface during the drawing process of the circuit pattern for the first surface on the first surface of the printed wiring board. Mark forming means for forming a plurality of marks;
Measuring means for measuring the position of the mark forming means;
Detecting means for detecting positions of a plurality of marks formed on the second surface of the printed wiring board by the mark forming means;
The second surface of the printed circuit board is exposed to the second surface by using the position of the mark forming unit measured by the measuring unit and the position of the plurality of marks detected by the detecting unit as a reference. A second exposure means for drawing a circuit pattern;
An exposure drawing apparatus comprising:
The mark forming unit is configured to perform at least one of a predetermined direction based on any one side of the printed wiring board placed on the stage and a direction intersecting the predetermined direction. The exposure drawing apparatus according to claim 1, wherein the exposure drawing apparatus is movably provided.
The exposure drawing apparatus according to claim 1, wherein the mark forming unit has a movable range within which the mark can be formed on a plurality of types of printed wiring boards having different sizes.
Further comprising a specifying means for specifying the size of the printed wiring board;
The exposure drawing apparatus according to claim 1, wherein the mark forming unit forms each of the plurality of marks according to a size specified by the specifying unit.
The exposure drawing apparatus according to claim 1, wherein the measuring unit includes a photographing unit that photographs the mark forming unit, and measures each position of the mark forming unit using an image captured by the photographing unit.
The mark forming means is formed at a position where a calibration mark at a known relative position with respect to the mark forming means can be photographed by the measuring means even when the printed wiring board is placed on the stage. And
The measuring unit includes an imaging unit that images the mark forming unit so that each of the calibration marks is captured, and measures the position of each of the mark forming units using an image captured by the imaging unit. Item 2. The exposure drawing apparatus according to Item 1.
The exposure drawing apparatus according to claim 5, wherein a plurality of the photographing units are provided, and each of the photographing units photographs one or more of the mark forming units.
The exposure drawing apparatus according to claim 5, wherein the photographing unit has a known relationship with a position where a circuit pattern is drawn, and is movable with respect to the stage.
The exposure drawing apparatus according to claim 1, wherein the mark forming unit forms the mark by exposing the second surface of the printed wiring board with light having a short wavelength.
The exposure drawing apparatus according to claim 1, wherein the mark forming unit forms the plurality of marks by attaching ink to a second surface of the printed wiring board.
A first exposure unit configured to draw a circuit pattern on the first surface by exposing a first surface of a printed wiring board placed on the stage; and a first exposure unit configured to be movable relative to the stage. Mark forming means for forming a plurality of predetermined marks on a second surface opposite to the first surface; measuring means for measuring the position of the mark forming means; and the second of the printed wiring board by the mark forming means. An exposure device comprising: detection means for detecting positions of a plurality of marks formed on the surface; and second exposure means for drawing a circuit pattern on the second surface by exposing the second surface of the printed wiring board. An exposure drawing method in a drawing apparatus,
Controlling the measuring means such that the position of the mark forming means is measured;
Moving the mark forming means to a predetermined position;
A circuit pattern for the first surface is drawn on the first surface of the printed wiring board, and a plurality of patterns are formed on the second surface in correspondence with the circuit pattern for the first surface during the drawing process of the circuit pattern. Controlling the first exposure means and the mark forming means so that a mark is formed;
The circuit pattern for the second surface is drawn on the second surface based on the position of the mark forming unit measured by the measuring unit and the position of the plurality of marks detected by the detecting unit. Controlling the second exposure means;
An exposure drawing method comprising: