JP5813556B2 - Exposure drawing apparatus, program, and exposure drawing method - Google Patents

Description

  The present invention relates to an exposure drawing apparatus, a program, and an exposure drawing method, and more particularly to an exposure drawing apparatus that draws an image on a substrate, a program executed by the exposure drawing apparatus, and an image drawn on the substrate. The present invention relates to an exposure drawing method.

  An alignment mark is formed on the substrate to be exposed in order to adjust the drawing position of the circuit pattern to be drawn when performing exposure processing on the substrate to be exposed using the exposure drawing apparatus. In the exposure drawing apparatus, the position of the alignment mark is detected by photographing the substrate to be exposed by a photographing unit such as a camera, and the drawing region is aligned based on the detected position.

  As a technique related to this, Patent Document 1 discloses an exposure drawing apparatus that can shorten the time required to detect the position of an alignment mark. In the exposure drawing apparatus, when there is no alignment mark in the image range obtained by the photographing unit, the search mark existing in the image range and the alignment mark and the search mark stored in advance The coordinates of the alignment mark are calculated on the basis of the positional relationship, and the photographing unit is moved based on the calculated coordinates. With this configuration, the time required for detecting the position of the alignment mark can be shortened without reducing the accuracy of detecting the position of the alignment mark.

  Also, a method for forming an identification mark for identifying each substrate to be exposed when an exposure process is performed on the substrate to be exposed using an exposure drawing apparatus has been proposed. For example, Patent Document 2 discloses a method of providing a plurality of identification marks aligned along a predetermined promise along one edge of a substrate to be exposed. In this method, an identification mark is formed by providing a groove on one edge of the substrate to be exposed.

JP 2011-227363 A JP-A-4-82650

  In order to prevent a defective product from being generated by drawing an incorrect circuit pattern on an exposed substrate or drawing a circuit pattern under an incorrect exposure condition when drawing a circuit pattern on the exposed substrate, It has been desired that each substrate to be exposed can be identified during the exposure process.

  In the exposure drawing apparatus disclosed in Patent Document 2, each substrate to be exposed can be identified. However, separately from the configuration necessary for performing the exposure process, an identification mark is formed. There was a problem that a dedicated device was required. It is desirable that each substrate to be exposed can be identified using a configuration provided in the exposure drawing apparatus, for example, an alignment mark disclosed in Patent Document 1 above.

  The present invention has been made in view of the above problems, and an object thereof is to provide an exposure drawing apparatus, a program, and an exposure drawing method that can easily identify each substrate to be exposed when performing an exposure process.

  In order to achieve the above object, an exposure drawing apparatus according to claim 1, comprising an exposure means for drawing a circuit pattern by exposing a substrate to be exposed having a first surface and a second surface opposite to the first surface. Forming a first mark as a reference for an exposure position at a predetermined position of the substrate to be exposed, and making the relative position with respect to the first mark different for each of the substrates to be exposed by the relative position. A mark forming means for forming a second mark representing identification information for identifying the exposure substrate, a control means for controlling the exposure means so that a circuit pattern is drawn on the substrate to be exposed, and a relative position. Storage means for storing information relating to the exposure in correspondence with the identification information.

  According to the exposure drawing apparatus of the first aspect, the circuit pattern is drawn by exposing the exposed substrate having the first surface and the second surface opposite to the first surface by the exposure means.

  Here, in the present invention, the mark forming means forms a first mark as a reference for the exposure position at a predetermined position on the second surface of the substrate to be exposed, and a relative position with respect to the first mark. The second mark representing the identification information for identifying the substrate to be exposed is formed by the relative position by differentiating each substrate to be exposed, and a circuit pattern is drawn on the substrate to be exposed by the control means. The exposure unit is controlled, and the storage unit stores information related to the exposure in association with the identification information represented by the relative position.

  Thus, according to the exposure drawing apparatus according to claim 1, the first mark and the second mark are formed on the substrate to be exposed on which the circuit pattern is drawn on the first surface and the second surface, and the exposure is performed. By using the relative position of the second mark with respect to the first mark as the identification information of the substrate, each substrate to be exposed can be easily identified when performing the exposure process.

  According to the present invention, as in the invention described in claim 2, the detection means for detecting the positions of the first mark and the second mark formed by the mark forming means, and the detection means detects the position. Derivation means for deriving a relative position of the second mark with respect to the first mark based on the position, and the control means controls the exposure means so that a circuit pattern is drawn on the first surface. At the same time, information on the exposure of the first surface corresponding to the identification information represented by the relative position derived by the deriving unit is acquired from the storage unit, and the information is normally exposed on the first surface. The circuit pattern is drawn on the second surface based on the exposure position of the second surface determined based on the position of the first mark detected by the detecting means. It may be controlled to the exposure means. As a result, when the second surface is exposed, the exposure condition can be determined based on the information related to the exposure of the first surface. As a result, it is possible to prevent the defective product from being exposed under an incorrect exposure condition.

  According to a third aspect of the present invention, as in the third aspect of the present invention, detection means for detecting positions of the first mark and the second mark formed by the mark forming means, and detection by the detection means Derivation means for deriving a relative position of the second mark with respect to the first mark based on the position, and the control means controls the exposure means so that a circuit pattern is drawn on the first surface. At the same time, information on the exposure of the first surface corresponding to the identification information represented by the relative position derived by the deriving unit is acquired from the storage unit, and the information is normally exposed on the first surface. The exposure means may be controlled so that a circuit pattern is not drawn on the second surface when it indicates that there is no such pattern. This prevents the second surface from being exposed without noticing that the first surface is not normally exposed.

  Further, according to the present invention, as in the invention according to claim 4, the information relating to the exposure includes information indicating whether or not the exposure of the first surface has been normally performed, and information relating to the exposure of the first surface. It may include at least one of information on the magnification, information indicating a circuit pattern drawn on the first surface, and information indicating an exposure order of the substrate to be exposed. As a result, the exposure condition for the first surface and the exposure condition for the second surface can be made to correspond to each other, so that the generation of defective products can be prevented.

  In the present invention, the first mark and the second mark may have the same shape as in the invention described in claim 5. Accordingly, the first mark and the second mark can be formed using an apparatus for forming the first mark or an apparatus having the same configuration as the apparatus for forming the first mark.

  Further, according to the present invention, as in the invention described in claim 6, the detection means is configured to detect the first mark and the second mark based on an image obtained by photographing the first mark and the second mark. The position of the mark may be detected. Thereby, the positions of the first mark and the second mark can be easily detected.

  According to the present invention, as in the invention described in claim 7, the mark forming means forms the first mark and the second mark by irradiating the substrate to be exposed with an ultraviolet beam. Also good. Thereby, the first mark and the second mark can be easily formed.

  In the present invention, as in the invention described in claim 8, the mark forming means may form a plurality of the second marks at different positions. Thereby, the number which can identify the to-be-exposed board | substrate can be increased.

  In order to achieve the above object, an exposure drawing apparatus according to claim 9, wherein at least one of the first surface and the second surface opposite to the first surface has a first mark as a reference for the exposure position. Is formed at a predetermined position, and a second mark representing identification information for identifying the substrate to be exposed is formed by making the relative position with respect to the first mark different for each substrate to be exposed. An exposure means for drawing a circuit pattern by exposing a substrate to be exposed, a detection means for detecting positions of the first mark and the second mark formed by the mark formation means, and a detection means detected by the detection means Deriving means for deriving a relative position of the second mark with respect to the first mark based on the position, and a position based on the position of the first mark detected by the detecting means. Based on the exposure position of the first surface, the exposure means is controlled so that a circuit pattern is drawn on the first surface, and is associated with the identification information represented by the relative position derived by the derivation means. Information on the exposure of the first surface is stored in a storage unit, and information on the exposure of the first surface corresponding to the identification information represented by the relative position derived from the storage unit by the deriving unit is acquired, An exposure condition is determined based on the information, and a circuit pattern is drawn on the second surface based on the exposure position of the second surface determined based on the position of the first mark detected by the detecting means. Control means for controlling the exposure means.

  According to the exposure drawing apparatus according to claim 9, when the second surface is exposed, the exposure condition can be determined based on the information related to the exposure of the first surface. It is possible to prevent the occurrence of defective products.

  On the other hand, in order to achieve the above object, the program according to claim 10 includes an exposure unit that draws a circuit pattern by exposing a substrate to be exposed having a first surface and a second surface opposite to the first surface. A program executed in an exposure drawing apparatus comprising: a computer for forming a first mark as a reference for an exposure position at a predetermined position of the substrate to be exposed; and a relative position with respect to the first mark Differently for each substrate to be exposed, a mark forming means for forming a second mark representing identification information for identifying the substrate to be exposed by the relative position, and a circuit pattern is drawn on the substrate to be exposed A control means for controlling the exposure means; and a storage means for storing information relating to the exposure in correspondence with the identification information represented by the relative position. Make.

  Therefore, according to the program according to the tenth aspect, the computer can be operated in the same manner as the invention according to the first aspect. The exposed substrate can be easily identified.

  According to a tenth aspect of the present invention, as in the eleventh aspect of the present invention, the computer includes a detecting unit that detects the positions of the first mark and the second mark formed by the mark forming unit. And a derivation means for deriving a relative position of the second mark with respect to the first mark based on the position detected by the detection means, and the control means has a circuit pattern on the first surface. The exposure unit is controlled so as to be drawn, the mark forming unit is controlled to form the first mark and the second mark on the second surface, and derived from the storage unit by the deriving unit Information relating to the exposure of the first surface corresponding to the identification information represented by the relative position is acquired, exposure conditions are determined based on the information, and the detection means detects The circuit pattern on the second surface on the basis of the exposure position of the second surface which is determined based on the position of the first mark may control the exposure means to be drawn. Thus, similarly to the second aspect of the invention, it is possible to prevent the defective product from being exposed under the wrong exposure conditions.

  On the other hand, in order to achieve the above object, an exposure drawing method according to claim 12 draws a circuit pattern by exposing a substrate to be exposed having a first surface and a second surface opposite to the first surface. An exposure drawing method in an exposure drawing apparatus including an exposure unit, wherein a first mark serving as a reference for an exposure position is formed at a predetermined position on the second surface of the substrate to be exposed, and the first mark A mark forming step for forming a second mark representing identification information for identifying the substrate to be exposed by the relative position by making the relative position with respect to the substrate to be exposed differ from each other on the first surface of the substrate to be exposed A first control step for controlling the exposure means so that a circuit pattern is drawn; and storing information relating to exposure of the first surface in correspondence with identification information represented by the relative position. And a, a storage step of storing the.

  Therefore, according to the exposure drawing method of the twelfth aspect of the invention, since it operates in the same manner as the invention of the first aspect of the invention, each exposure object is exposed when performing the exposure process, similarly to the invention of the first aspect. The substrate can be easily identified.

  According to a twelfth aspect of the invention, as in the thirteenth aspect of the invention, the detection step of detecting the positions of the first mark and the second mark formed by the mark formation step, and the detection Corresponding to a deriving step for deriving a relative position of the second mark with respect to the first mark based on the position detected by the step, and identification information represented by the relative position derived by the deriving unit from the storage unit Information on the exposure of the first surface is determined, exposure conditions are determined based on the information, and the exposure position of the second surface is determined based on the position of the first mark detected by the detection step. And a second control step of controlling the exposure unit so that a circuit pattern is drawn on the second surface. Thus, similarly to the second aspect of the invention, it is possible to prevent the defective product from being exposed under the wrong exposure conditions.

  According to the present invention, it is possible to easily identify each substrate to be exposed when performing an exposure process.

It is a block diagram which shows the whole structure of the exposure drawing system which concerns on embodiment. It is a block diagram which shows the function of the exposure drawing system which concerns on embodiment. (A) is a front view which shows an example of the said surface at the time of exposing to the surface of the to-be-exposed board | substrate of the exposure drawing system which concerns on 1st Embodiment, (B) is the to-be-photographed object which concerns on 1st Embodiment. It is a front view which shows an example of the said back surface at the time of exposing to the back surface of an exposure board | substrate. It is a perspective view which shows the structure of the 1st exposure drawing apparatus and 2nd drawing exposure drawing apparatus which concern on embodiment. It is an expanded sectional view for demonstrating the ultraviolet light source of the 1st exposure drawing apparatus which concerns on embodiment, and a 2nd exposure drawing apparatus. It is a schematic front view showing the configuration of a reversing mechanism in the reversing device of the exposure drawing system according to the embodiment. It is a block diagram which shows the electric system of the 1st exposure drawing apparatus and 2nd exposure drawing apparatus which concern on embodiment. It is a figure which shows the relationship between the moving direction of a stage and the moving direction of an imaging | photography part in the exposure drawing system which concerns on embodiment. It is a block diagram which shows the structure of the electric system of the control apparatus of the exposure drawing system which concerns on embodiment. It is the schematic for demonstrating the exposure process by the exposure drawing system which concerns on 1st Embodiment. It is a flowchart which shows the flow of a process of the pre-exposure processing program which concerns on 1st Embodiment. It is a schematic front view for demonstrating the pre-exposure process which concerns on 1st Embodiment. It is a flowchart which shows the flow of a process of the 1st exposure processing program which concerns on 1st Embodiment. It is a schematic front view for demonstrating the 1st exposure process which concerns on 1st Embodiment. It is a schematic diagram which shows an example of the exposure state information in the exposure drawing system which concerns on 1st Embodiment. It is a flowchart which shows the flow of a process of the 2nd exposure processing program which concerns on 1st Embodiment. It is a schematic front view for demonstrating the 2nd exposure process which concerns on 1st Embodiment. It is a figure which shows an example of the relative position of the mark for alignment in the exposure drawing system which concerns on 1st Embodiment, and the mark for identification. It is a figure which shows an example of the relative position of the mark for alignment in the exposure drawing system which concerns on 1st Embodiment, and the mark for identification. It is a figure which shows an example of the relative position of the mark for alignment (mark for identification) in the exposure drawing system which concerns on 1st Embodiment. (A) is a front view which shows an example of the said surface at the time of exposing to the surface of the to-be-exposed board | substrate of the exposure drawing system which concerns on 2nd Embodiment, (B) is the to-be-photographed object which concerns on 2nd Embodiment. It is a front view which shows an example of the said back surface at the time of exposing to the back surface of an exposure board | substrate. It is the schematic for demonstrating the exposure process by the exposure drawing system which concerns on 2nd Embodiment. It is a flowchart which shows the flow of a process of the 1st exposure processing program which concerns on 2nd Embodiment. It is a flowchart which shows the flow of a process of the 2nd exposure processing program which concerns on 2nd Embodiment.

[First Embodiment]
Hereinafter, the exposure drawing system according to the present embodiment will be described in detail with reference to the accompanying drawings. In the present embodiment, as the exposure drawing system 1, a flat substrate such as a printed wiring board and a glass substrate for a flat panel display is used as a substrate to be exposed (exposed substrate C described later), which is the main surface of the substrate C to be exposed. Exposure drawing is performed on both the first surface (hereinafter also referred to as “front surface”) C1 and the second surface (hereinafter also referred to as “back surface”) C2, which is the main surface facing the first surface C1. A system will be described as an example.

  FIG. 1 is a configuration diagram showing the overall configuration of an exposure drawing system 1 according to the present embodiment. FIG. 2 is a block diagram showing functions of the exposure drawing system 1 according to the present embodiment. As shown in FIGS. 1 and 2, the exposure drawing system 1 performs exposure on the first surface C1 of the substrate C to be exposed and marks on the second surface C2 of the substrate C to be exposed (an alignment mark described later). M1 and identification mark M2) for forming the first exposure drawing device 2, reversing device 3 for inverting the front and back of the substrate C to be exposed, and second exposure drawing for exposing the second surface C2 of the substrate C to be exposed. The apparatus 4, the 1st conveyance part 5 which conveys the to-be-exposed substrate C to the 1st exposure drawing apparatus 2, The 2nd conveyance part 6 which conveys the to-be-exposed substrate C from the 1st exposure drawing apparatus 2 to the inversion apparatus 3, The to-be-exposed board | substrate A third transport unit 7 that transports C from the reversing device 3 to the second exposure drawing apparatus 4, a fourth transport unit 8 that transports the exposed substrate C from the second exposure drawing apparatus 4, and the first of the exposed substrate C. Control device for controlling exposure of surface C1 and second surface C2 to correspond to each other It is equipped with a.

  3A is a front view showing an example of the first surface C1 when the first surface C1 of the substrate C to be exposed is exposed in the exposure drawing system 1 according to the first embodiment. (B) is a front view showing an example of the second surface C2 when the second surface C2 of the substrate C to be exposed is exposed in the exposure drawing system 1 according to the first embodiment.

  As shown in FIG. 3A, a first exposure drawing apparatus 2 draws a front image (in the present embodiment, an image having the shape of “F”) P1 on the first surface C1 of the substrate C to be exposed. The Further, as shown in FIG. 3 (B), the second exposure drawing device 4 applies the back surface image (in this embodiment, “F” on the first surface C1) to the second surface C2 of the substrate C to be exposed. A rectangular frame shape image P2 surrounding the area of the second surface C2 corresponding to the shape image) P2 is a coordinate system in which the surface image P1 of the first surface C1 is drawn (hereinafter referred to as “image coordinate system”). .) Is drawn in the image coordinate system.

  Further, on the second surface C2 of the substrate C to be exposed, a plurality (two in the present embodiment) of alignment marks M1 are formed by the first exposure drawing device 2 on the upper center side of the front view and the lower center side of the front view. Are drawn at different positions. The alignment mark M1 is a mark for making the position of the front image P1 and the position of the back image P2 drawn on the first surface C1 and the second surface C2 of the substrate C to be exposed correspond to each other. is there. On the substrate C to be exposed, two or more alignment marks M1 are drawn in order to specify the position.

  Further, a plurality of (two in the present embodiment) identification marks M2 are different on the second surface C2 by the first exposure drawing device 2 on the center side on the left side of the front view and on the center side of the right part of the front view. It is drawn at the position. The identification mark M2 is a mark representing identification information for identifying the exposed substrate C by the relative position by making the relative position with respect to the alignment mark M1 different for each exposed substrate C. On the substrate C to be exposed, one or more identification marks M2 are drawn in order to identify the substrate to be exposed.

  In the exposure drawing system 1 according to the present embodiment, a first exposure drawing apparatus 2 is provided on the upstream side in the transport direction of the substrate C to be exposed. When the unexposed substrate C to be exposed conveyed by the first conveyance unit 5 is carried into the apparatus, the first exposure drawing apparatus 2 applies to the first surface C1 of the substrate C to be exposed as described above. Exposure is performed to draw the surface image P1, and an alignment mark M1 and an identification mark M2 are formed on the second surface C2 of the substrate C to be exposed.

  In the exposure drawing system 1 according to the present embodiment, the alignment mark M1 and the identification mark M2 are drawn in the same shape, specifically, a circle of about φ0.5 mm to φ1 mm. The size is not limited as long as the size does not overlap with the drawing of the front image P1 and the back image P2, and the shape may be arbitrarily set, such as a cross shape or a rectangular shape.

  Further, the alignment mark M1 and the identification mark M2 do not have to be the same size and shape, but the same configuration (in the present embodiment, the ultraviolet light source 24) can be obtained by using the same size and shape. It is possible to simply draw each of the alignment mark M1 and the identification mark M2. Further, by making the alignment mark M1 and the identification mark M2 have the same size and the same shape, the position can be detected by the same method (in this embodiment, the method of photographing by the photographing unit 23).

  Further, the first exposure drawing apparatus 2 measures the positions of the alignment mark M1 and the identification mark M2 based on the position of the ultraviolet light source 24, and the relative position of the identification mark M2 with respect to the alignment mark M1 and the first position. The information is stored in the storage device (storage unit 41 described later) of the control device 9 in association with the information related to the exposure of the first surface C1.

  A reversing device 3 for reversing the front and back of the exposed substrate C is provided on the downstream side of the first exposure drawing apparatus 2 in the transport direction of the exposed substrate C. When the exposure substrate C on which the first surface C1 is exposed by the first exposure drawing device 2 and the alignment mark M1 and the identification mark M2 are drawn is loaded, the reversing device 3 is subjected to the following process. In order to expose the second surface C2 of the exposure substrate C, the front and back of the substrate C to be exposed are reversed.

  A second exposure drawing device 4 that performs exposure on the second surface C2 of the substrate C to be exposed is provided on the downstream side of the reversing device 3 in the transport direction of the substrate C to be exposed. When the exposed substrate C reversed by the reversing device 3 is carried into the apparatus, the second exposure drawing device 4 exposes the second surface C2 of the exposed substrate C and draws the back surface image P2. . At this time, the second exposure drawing apparatus 4 aligns using the alignment mark M1 drawn on the exposed substrate C by the first exposure drawing apparatus 2 and then exposes the second surface C2. Do. Further, the second exposure drawing apparatus 4 detects the positions of the alignment mark M1 and the identification mark M2, and associates them with the relative position of the identification mark M2 with respect to the alignment mark M1 from the control apparatus 9. Information on exposure of the obtained first surface is acquired, exposure conditions are determined based on the acquired information, and exposure of the second surface C2 is performed.

  The exposure drawing system 1 according to the present embodiment also includes a first transfer device 5 and a first exposure drawing device 2 that transfer the substrate C to be exposed to the first exposure drawing device 2 and carry it into the first exposure drawing device 2. The substrate C discharged from the substrate 2 is transported to the reversing device 3 and carried into the reversing device 3, and the substrate C discharged from the reversing device 3 is transported to the second exposure drawing device 4. A third transport device 7 for transporting to the second exposure drawing device 4 and a fourth transport device 8 for transporting the substrate C to be exposed discharged from the second exposure drawing device 4 are provided.

  Each of the above conveying devices has a plurality of rotating rollers and a drive motor that rotates the rotating rollers. A plurality of rotating rollers are laid in parallel, and a sprocket or pulley that receives a rotational force transmitted by a belt or a wire is attached to one end of the rotating roller. As a means for transmitting the rotational force of the drive motor that rotates the rotating roller, a transmission method using a cylindrical magnet can be employed in addition to the belt or the wire.

  The exposure drawing system 1 includes a control device 9 that controls the exposure of the first surface C1 by the first exposure drawing device 2 and the exposure of the second surface C2 by the second exposure drawing device 4 respectively. Is provided.

  In the present embodiment, in order to increase the throughput (production amount per hour) of the substrate C to be exposed, the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 are used for the first exposure drawing apparatus. The exposure drawing device 2 exposes the first surface C1 of the substrate C to be exposed and the second exposure drawing device 4 exposes the second surface C2 of the substrate C to be exposed. It is also possible to draw both surfaces of the substrate to be exposed C only by the first exposure drawing device 2 using the reversing device 3 that reverses from the first surface C1 to the second surface C2.

  Next, the structure of the 1st exposure drawing apparatus 2 and the 2nd exposure drawing apparatus 4 is demonstrated.

  FIG. 4 is a perspective view showing the configuration of the first exposure drawing apparatus 2 and the second drawing exposure drawing apparatus 4 according to this embodiment. Here, the configuration of the first exposure drawing apparatus 2 will be described. Regarding the configuration of the second exposure drawing apparatus 4, the description of the configuration common to the first exposure drawing apparatus 2 will be omitted, and the first exposure drawing apparatus 2 will be described. Only the differences will be described. In the following, the direction in which the stage 10 moves is defined as the Y direction, the direction orthogonal to the Y direction in the horizontal plane is defined as the X direction, and the direction orthogonal to the Y direction in the vertical plane is defined as the Z direction. Further, the rotation direction that rotates clockwise around the Z axis is defined as the θ direction.

  As shown in FIG. 4, the first exposure drawing apparatus 2 includes a flat stage 10 for fixing the substrate C to be exposed. The stage 10 is configured to be movable, and the exposure target substrate C fixed to the stage 10 moves the exposure target substrate C to the exposure position in accordance with the movement of the stage 10, and the exposure unit 16, which will be described later, emits a light beam. Irradiated, an image such as a circuit pattern is drawn.

  The stage 10 is supported by a flat base 12 that is movably provided on the upper surface of a table-like base 11. In addition, a moving mechanism unit 13 having a moving drive mechanism (not shown) configured by a motor or the like is provided between the base 12 and the stage 10, and the stage 10 is moved by the moving mechanism unit 13. On the other hand, it moves in parallel in the height direction (Z direction) of the substrate C to be exposed placed on the stage 10.

  One or a plurality of (in this embodiment, two) guide rails 14 are provided on the upper surface of the base 11. The base 12 is supported by a guard rail 14 so as to be reciprocally movable, and is moved by a stage driving unit (stage driving unit 71 described later) constituted by a motor or the like. The stage 10 is moved along the guide rail 14 by being supported on the upper surface of the movable base 12.

  A gate-type gate 15 is erected on the upper surface of the base 11 so as to straddle the guide rail 14, and an exposure unit 16 is attached to the gate 15. The exposure unit 16 is composed of a plurality (16 in the present embodiment) of exposure heads 16 a and is fixedly arranged on the moving path of the stage 10. An optical fiber 18 drawn from the light source unit 17 and a signal cable 20 drawn from the image processing unit 19 are connected to the exposure unit 16.

  Each exposure head 17 has a digital micromirror device (DMD) as a reflective spatial light modulation element, and controls the DMD based on image data input from the image processing unit 19 to emit light from the light source unit 17. The first exposure drawing apparatus 2 performs exposure by modulating the beam and irradiating the substrate C with this light beam. Note that a transmissive spatial light modulator such as liquid crystal may be used as the spatial light modulator.

  A gate 22 is provided on the upper surface of the base 11 so as to straddle the guide rail 14. One or a plurality (three in this embodiment) of image pickup units 23 for photographing the substrate C to be exposed placed on the stage 10 are attached to the gate 22. The photographing unit 23 is a CCD camera or the like having a built-in strobe with a very short light emission time. Each photographing unit 23 is installed to be movable in a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 in a horizontal plane.

  The first exposure drawing apparatus 2 detects the position of the alignment mark M1 based on the photographed image by the photographing unit 23, and adjusts the exposure position of the front image P1 with respect to the first surface C1 based on the detected position.

  On the other hand, the second exposure drawing device 4 detects the position of the alignment mark M1 based on the image taken by the photographing unit 23, and adjusts the exposure position of the back surface image P2 with respect to the second surface C2 based on the detected position. To do. Further, the second exposure drawing apparatus 4 detects the positions of the alignment mark M1 and the identification mark M2 from the image obtained by photographing the identification mark M2 by the photographing unit 23, and for identifying the alignment mark M1. The relative position of the mark M2 is derived, and each exposed substrate C is identified based on the derived relative position.

  The number of imaging units 23 is ideally provided in accordance with the total number of alignment marks M1 and identification marks M2, but the present invention is not limited to this, and one imaging unit 23 is provided. The plurality of alignment marks M1 and identification marks M2 may be continuously photographed by moving the photographing unit 23.

  FIG. 5 is an enlarged cross-sectional view for explaining the ultraviolet light source 24 of the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 according to the present embodiment. As shown in FIG. 5, a plurality (four in the present embodiment) ultraviolet light source 24 for drawing the alignment mark M <b> 1 and the identification mark M <b> 2 on the substrate C to be exposed on the moving mechanism unit 13. Is provided. The plurality of ultraviolet light sources 24 have a moving mechanism 24a configured by a motor or the like that moves in parallel on a horizontal plane, and is moved in parallel on the horizontal plane by the moving mechanism 24a.

  On the other hand, the stage 10 is provided with slit-like insertion holes 25 extending from the outer peripheral side toward the inner peripheral side on each side. The ultraviolet beam UV generated from the ultraviolet light source 24 passes through the insertion hole 25 and is irradiated to the substrate C to be exposed. Thus, the alignment mark M1 and the identification mark M2 are drawn on the surface of the substrate C to be exposed that is in contact with the stage 10. The irradiation time of the ultraviolet beam UV is preferably set to an optimum time according to the photosensitive material applied to the substrate C to be exposed.

  In addition, although the 1st exposure drawing apparatus 2 is provided with the several ultraviolet light source 24, the 2nd exposure drawing apparatus 4 does not necessarily need to be provided with the ultraviolet light source 24. FIG. In addition, the first exposure drawing apparatus 2 is provided with a plurality of ultraviolet light sources 24, but is not limited thereto, and is provided with one ultraviolet light source 24, and this single ultraviolet light source 24 is moved throughout the moving mechanism 13. By making it possible, all the marks including both the alignment mark M1 and the identification mark M2 may be drawn by using a single ultraviolet light source 24.

  Since the first exposure drawing apparatus 2 can draw both the alignment mark M1 and the identification mark M2 using the ultraviolet light source 24 having the same configuration as described above, a new configuration is not added. The exposed substrate C can be identified.

  The first exposure drawing apparatus 2 includes an auto carrier hand (hereinafter referred to as AC hand) 26 that carries the substrate C to be exposed, which has been transferred by the first transfer apparatus 5, into the first exposure drawing apparatus 2. The AC hand 26 is formed in a flat plate shape, and is provided so as to be movable in the horizontal direction and the vertical direction in parallel with the horizontal plane. Further, on the lower surface of the AC hand 26, a suction mechanism having a suction portion 27 that sucks and holds the substrate C to be exposed by vacuum suction by sucking air, and a vertically movable member that presses the substrate C to be exposed downward are freely movable. A pressing mechanism having a pressing portion 28 is provided. The AC hand 26 lifts the unexposed substrate C placed on the first transport device 5 upward by sucking and holding it by a suction mechanism, and the lifted exposed substrate C is predetermined on the upper surface of the stage 10. Place it at a different position. When the exposed substrate C is placed, the suction by the suction portion 63 is released while pressing the exposed substrate C against the stage 10 by the pressing mechanism, whereby the vacuum suction of the stage 10 works, and the exposed substrate C becomes the stage. 10 is firmly fixed.

  In addition, the AC hand 26 lifts the exposed substrate C, which has been exposed, placed on the upper surface of the stage 10 by suction and holds it by a suction mechanism, and holds the lifted exposed substrate C by suction. The substrate C to be exposed is moved to the second transfer device 6 by moving to the transfer device 6 and then releasing the suction by the suction mechanism.

  FIG. 6 is a schematic front view showing the configuration of the reversing mechanism in the reversing device 3 of the exposure drawing system 1 according to the present embodiment. As shown in FIG. 6, the reversing device 3 includes a roller unit 3 b having a plurality of rollers 3 a that sandwich the substrate C to be exposed. The roller unit 3b is supported by a support bar 4c, and rotates around a rotation shaft 3d provided at the center of the roller unit 3b while being lifted by the support bar 4c when the substrate C to be exposed is sandwiched. To do. After the roller unit 3b rotates 180 degrees, the exposed substrate C is released from the roller unit 3b, so that the front and back of the exposed substrate C are reversed. The configuration of the reversing mechanism is not limited to the above-described configuration, and a method of reversing the front and back of the exposed substrate C by lifting one end of the exposed substrate C and rotating the exposed substrate C 180 degrees, and other conventionally known methods. The method may be used.

  FIG. 7 is a configuration diagram showing an electrical system of the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 according to the present embodiment.

  As shown in FIG. 7, the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 are provided with a system control unit 30 that is electrically connected to each part of the apparatus. Are in control. The system control unit 30 controls the AC hand 26 to perform the operation for carrying in and discharging the substrate C to be exposed to the stage 10. Further, the system control unit 30 controls the stage driving unit 31 to move the stage 10 and drives the movement of the ultraviolet light source 24 to drive the alignment mark M1 and the identification mark M2 on the substrate C to be exposed. Or the movement of the photographing unit 23 is performed to photograph the alignment mark M1 and the identification mark M2, and the light source unit 17 and the image processing unit 19 are controlled to perform exposure processing on the exposure head 16a. Let it be done.

  The operation device 32 includes a display unit that displays information under the control of the system control unit 30 and an input unit that inputs information received through user operation to the system control unit 30.

  The movement control unit 33 controls the system control unit 30 so that each of the plurality of alignment marks M1 and identification marks M2 drawn on the exposed substrate C when the stage 10 is moved is The movement drive of the photographing unit 23 is controlled so as to pass through the center of each photographing region. Further, the movement control unit 33 drives the movement mechanism 24 a under the control of the system control unit 30 to position each ultraviolet light source 24 to a position designated by the system control unit 30.

  FIG. 8 is a diagram showing the relationship between the moving direction of the stage 10 and the moving direction of the imaging unit 23 in the exposure drawing system 1 according to the present embodiment. As shown in FIG. 8, the moving direction of the imaging unit 23 is a direction (Y direction) perpendicular to the moving direction (X direction) of the stage 10 in the horizontal plane. When the alignment mark M1 and the identification mark M2 drawn on the substrate C to be exposed are imaged by the imaging unit 23, the position in the X direction is adjusted by moving the stage 10, and the imaging unit 23 is moved. By adjusting the position in the Y direction, the relative positions of the stage 10 and the imaging unit 23 are controlled so that the alignment mark M1 and the identification mark M2 are included in the imaging region of the imaging unit 23.

  FIG. 9 is a block diagram showing the configuration of the electrical system of the control device 9 of the exposure drawing system 1 according to the first embodiment. As shown in FIG. 9, the control device 9 includes a control unit 40 that controls exposure processing in the exposure drawing system 1, an exposure processing program necessary for exposure processing by the control unit 40, and a ROM and HDD that store various data. Storage unit 41, display unit 42 such as a display for displaying data based on control of control unit 40, input unit 43 such as a keyboard for inputting data by user operation, and first exposure based on control of control unit 40 A communication interface 44 for transmitting and receiving data to and from the drawing apparatus 2 and the second exposure drawing apparatus 4 is provided.

  Here, in the exposure drawing system 1 according to the first embodiment, when the second surface C2 is exposed after being exposed to the first surface C1 of the substrate C to be exposed, the exposure state at the time of exposure of the first surface C1 is set. Correspondingly, the second surface C2 is exposed.

  FIG. 10 is a schematic diagram for explaining exposure processing by the exposure drawing system 1 according to the first embodiment. As shown in FIG. 10, the exposure drawing system 1 forms the alignment mark M1 and the identification mark M2 on the second surface C2 and exposes the surface on the first surface C1 during the exposure process on the first surface C1. The image P1 is drawn. Further, the exposure drawing system 1 associates the relative position of the identification mark M2 with the alignment mark M1 used as the identification information of the substrate C to be exposed, and the information related to the exposure of the first surface C1, respectively. 9 storage units 41.

  Next, during the exposure process for the second surface C2, the exposure drawing system 1 detects the positions of the alignment mark M1 and the identification mark M2 formed on the second surface C2, and identifies the alignment mark M1. Information relating to the exposure of the first surface C1 corresponding to the relative position of the mark M2 is obtained. The exposure drawing system 1 determines the drawing position based on the position of the alignment mark M1 so that the position corresponds to the surface image P1 drawn on the first surface C1, and the first surface An exposure condition is determined based on information relating to the exposure of C1, and the back surface image P2 is drawn on the second surface C2.

  Here, the flow of processing by the exposure drawing system 1 according to the present embodiment will be described separately for pre-exposure processing, first exposure processing for the first surface C1, and second exposure processing for the second surface C2.

  FIG. 11 is a flowchart showing the flow of processing of the pre-exposure processing program according to the present embodiment, and the program is stored in a predetermined area of a ROM which is a recording medium provided in the system control unit 30 of the first exposure drawing apparatus 2. Stored in advance. FIG. 12 is a schematic front view for explaining pre-exposure processing according to the present embodiment.

  The system control unit 30 of the first exposure drawing apparatus 2 executes the pre-exposure processing program at a predetermined timing (in this embodiment, the timing at which the substrate C to be exposed is placed on the stage 10).

  When the substrate to be exposed C is placed on the stage 10, the system control unit 30 sets each position of the ultraviolet light source 24 in step S <b> 101. As shown in FIG. 12, in the present embodiment, the ultraviolet light source 24 that forms the alignment mark M1 forms the identification mark M2 at the end of the first surface C1 of the substrate C to be exposed in the vertical direction when viewed from the front. The ultraviolet light source 24 to be set is positioned so as to be positioned at an end portion of the first surface C1 in the left-right direction in front view. At this time, since the relative position of the identification mark M2 with respect to the alignment mark M1 is used as identification information of the exposed substrate C, the movement accuracy of the ultraviolet light source 24, the movement accuracy of the imaging unit 23, and the imaging accuracy are increased. Each position of the ultraviolet light source 24 is set so that the relative position becomes unique for each substrate C to be exposed in consideration.

  In step S103, the system control unit 30 moves each of the ultraviolet light sources 24 to the position set in step S101. In step S <b> 105, the system control unit 30 moves the stage 10 to a shooting position by the shooting unit 23. At this time, the system control unit 30 moves the stage 10 in the Y direction along the guide rail 14, and moves the stage 10 to a position where the ultraviolet light source 24 is included in the imaging region by the imaging unit 23 and stops.

  In step S <b> 107, the system control unit 30 measures the position of the ultraviolet light source 24. At this time, the system control unit 30 moves the photographing unit 23 to a position where each of the ultraviolet light sources 24 is included in each photographing region of the photographing unit 23 to photograph the first surface C1 of the substrate C to be exposed. A photographed image is acquired from 23. The system control unit 30 measures each position of the photographing unit 23 from the acquired photographed image, and ends the pre-exposure processing program. As shown in FIG. 13, in the stage of pre-exposure processing, each ultraviolet light source 24 is arranged at a predetermined position in the stage coordinate system.

  The system control unit 30 of the first exposure drawing apparatus 2 executes the first exposure process at the timing when the pre-exposure process is completed. FIG. 13 is a flowchart showing a flow of processing of the first exposure processing program according to the present embodiment, and the program is a predetermined area of a ROM that is a recording medium provided in the system control unit 30 of the first exposure drawing apparatus 2. Is stored in advance. FIG. 14 is a schematic front view for explaining the first exposure process according to the present embodiment.

  In step S <b> 201, the system control unit 30 moves the stage 10 to the exposure position for the substrate C to be exposed. At this time, the system control unit 30 moves the stage 10 in the Y direction along the guide rail 14, and the exposure target position by the exposure head 16 a is the start position when the surface image P <b> 1 is drawn on the substrate C to be exposed. The stage 10 is moved to a position coinciding with and stopped.

  In step S203, the system control unit 30 starts exposure by each exposure head 16a, and draws the surface image P1 on the first surface C1 of the substrate C to be exposed. In step S205, the system control unit 20 generates an ultraviolet beam UV from the ultraviolet light source 24 and draws an alignment mark M1 and an identification mark M2 on the second surface C2 of the substrate C to be exposed. Note that the process for the first surface C1 of the substrate C to be exposed in step 203 and the process for the second surface C2 of the substrate C to be exposed in step S205 do not interfere with each other and can be performed in parallel. Therefore, the process of step S203 and step S205 may be performed simultaneously, or the process of step S205 may be performed before the process of step S203. As shown in FIG. 14, the surface image P1 is drawn on the first surface C1 of the substrate C to be exposed, and the alignment mark M1 and the identification mark M2 are drawn on the second surface C2.

  Thus, when the surface image P1 is drawn on the first surface C1 of the substrate C to be exposed, the alignment mark M1 and the identification mark M2 are drawn on the second surface C2, thereby aligning the alignment mark. There is no need to separately perform the process of drawing M1 and the identification mark M2. This ensures a long holding time for the printing of the alignment mark M1 and the identification mark M2 without affecting the cycle time of the exposure drawing process, thereby ensuring the alignment mark M1 and the identification mark in the photographed image. The contrast of the mark M2 can be improved.

  The alignment mark M1 and the identification mark M2 are displayed on the exposed substrate C by being baked by being irradiated with the ultraviolet beam UV. The position and shape can be confirmed immediately afterwards.

  In step S207, the system control unit 30 stores the positional relationship between the position of the ultraviolet light source 24 measured in step S107 and the drawing position of the surface image P1 in step S203 in the storage unit 41 of the control device 9.

  In step S209, the relative position of the identification mark M2 with respect to the alignment mark M1 is derived from the positional relationship of the ultraviolet light source 24 measured in step S107, and this relative position is used as identification information of the substrate C to be exposed. Information relating to exposure of the first surface C1 at the time of drawing in step S203 is associated with identification information and stored in the storage unit 41 of the control device 9 as exposure state information 50.

  FIG. 15 is a schematic diagram showing an example of the exposure state information 50 in the exposure drawing system 1 according to the first embodiment. As shown in FIG. 15, in the present embodiment, an image exposed on the first surface C1 with respect to the identification information 51 indicating the relative position of the identification mark M2 with respect to the alignment mark M1 in the exposure state information 50. , Image information 51 indicating the magnification of the image exposed on the first surface C1, magnification information 52 indicating the magnification of the image exposed on the first surface C1, result information 53 indicating whether the exposure of the first surface C1 was successful, and the exposure order of the substrate C to be exposed The number information 54 indicating the number indicating the number is associated with the information. The exposure state information 50 is referred to when the second surface C2 is exposed. The relative position of the identification mark M2 with respect to the alignment mark M1 is represented by a position vector of the identification mark M2 with respect to the alignment mark M1.

  In step S211, the system control unit 30 moves the stage 10 to the placement position of the substrate C to be exposed, and ends the first exposure processing program. When the stage 10 moves to the placement position of the substrate C to be exposed, the substrate C to be exposed moves to the second transport device 6 by being sucked and held by the AC hand 26, and the reversing device 3 is moved by the second transport device 6. After being reversed, the front and back are reversed by the reversing device 3, and then conveyed to the second exposure drawing device 4 by the third conveying device 7.

  The system control unit 30 of the second exposure drawing apparatus 4 executes the second exposure processing program at a predetermined timing (in this embodiment, the timing at which the substrate C to be exposed is placed on the stage 10).

  FIG. 16 is a flowchart showing a flow of processing of the second exposure processing program according to the present embodiment, and the program is a predetermined area of a ROM that is a recording medium provided in the system control unit 30 of the second exposure drawing apparatus 4. Is stored in advance. FIG. 17 is a schematic front view for explaining the second exposure process according to the present embodiment.

  In step S301, the system control unit 30 sets the stage 10 on which the substrate C to be exposed is placed, the alignment mark M1 and the identification mark M2 drawn in step S207 to each of the imaging devices 23. Move to a position included in the imaging area. At this time, the system control unit 30 moves the stage 10 along the guide rail 14 in the Y direction and stops it. Note that the imaging region by the imaging unit 23 includes an installation error of the exposure substrate C in a size that includes all of the alignment mark M1 and the identification mark M2 drawn on the second surface C2 of the exposure substrate C. It shall be larger than the area. Thereby, even if the installation position of the substrate C to be exposed is deviated from the installation position set in advance, the entire alignment mark M1 and identification mark M2 are captured in the imaging region of the region imaging unit 23. The positions of the alignment mark M1 and the identification mark M2 can be measured.

  In step S303, the system control unit 30 measures the positions of the alignment mark M1 and the identification mark M2 from the captured image in which the alignment mark M1 and the identification mark M2 are captured by the imaging unit 23. . In step S305, the system control unit 30 derives the relative position of the identification mark M2 with respect to the alignment mark M1 from the positions of the alignment mark M1 and the identification mark M2 measured in step S303. .

  In step S307, the system control unit 30 compares the position of the alignment mark M1 measured in step S303 and the positional relationship between the position of the ultraviolet light source 24 stored in step S207 and the drawing position of the surface image P1. Based on this, an image coordinate system for determining the position where the back surface image P2 is drawn on the second surface C2 of the substrate C to be exposed is set. As shown in FIG. 17, at the stage of the second exposure process, the image coordinate system is set based on the position of the alignment mark M1 drawn on the second surface C2 when the first surface C1 is exposed. Therefore, the relative position between the stage coordinate system and the image coordinate system may be different from the stage of the first exposure process.

  In step S309, the system control unit 30 moves the stage 10 to the exposure position for the substrate C to be exposed based on the image coordinate system set in step S307. At this time, the system control unit 30 moves the stage 10 in the Y direction along the guide rail 14, and the exposure target position by the exposure head 16a is the start position when the back surface image P2 is drawn on the substrate C to be exposed. The stage 10 is moved to a position coinciding with and stopped.

  In step S311, the system control unit 30 acquires, from the exposure state information 50, information related to the exposure of the first surface C1 corresponding to the relative position of the identification mark M2 with respect to the alignment mark M1 derived in step S305. .

  In step S313, the system control unit 30 starts exposure by each exposure head 16a so as to correspond to the information related to the exposure of the first surface C1 acquired in step S311 and the second surface C2 of the substrate C to be exposed. The back image P2 is drawn. As shown in FIG. 17, the back surface image P2 is drawn on the second surface C2 of the substrate C to be exposed based on the image coordinate system. At this time, based on the information relating to the exposure of the first surface C1, it is determined that the exposure order is not incorrect, the exposure of the first surface C1 is successful, etc. The magnification of the circuit pattern to be performed is determined. Information indicating the exposure order included in the information related to the exposure of the first surface C1 may be drawn on the substrate C to be exposed. Further, when the exposure order is incorrect, the system control unit 30 may perform warning processing such as displaying the fact on the display unit 42 of the control device 9. Further, when the exposure of the first surface C1 fails, the exposed substrate C may be discharged outside the second exposure drawing apparatus 4 without performing the exposure of the second surface C2.

  In step S315, the system control unit 30 moves the stage 10 to the placement position of the substrate C to be exposed, and ends the second exposure processing program. When the stage 10 moves to the placement position of the exposed substrate C, the exposed substrate C on which images such as circuit patterns are drawn on both the first surface C1 and the second surface C2 is sucked and held by the AC hand 26. As a result, it moves to the fourth transport device 8 and is transported by the fourth transport device 8.

  As described above, in the exposure drawing system 1 according to the present embodiment, when performing the exposure process, the ultraviolet light source 24 that is the same as the ultraviolet light source 24 that forms the alignment mark M1 or the ultraviolet light source 24 having the same configuration. Is used to easily form an identification mark M2 for identifying each of the exposed substrates C, and the relative position of the identification mark M2 with respect to the alignment mark M1 is used as identification information. Each of the exposure substrates C can be easily identified.

  In the exposure drawing system 1 according to the first embodiment, the relative position of the identification mark M2 with respect to the alignment mark M1 is used as the position vector of the identification mark M2 with respect to the alignment mark M1. It is not limited.

  FIG. 18 is a diagram showing an example of the relative position of the identification mark M2 with respect to the alignment mark M1 in the exposure drawing system 1 according to the first embodiment. As shown in FIG. 18, the mutual distance between the alignment mark M1 and the identification mark M2 may be derived, and the derived mutual distance may be used as a relative position.

  In the exposure drawing system 1 according to the first embodiment, two identification marks M2 are drawn. However, the present invention is not limited to this, and a single identification mark M2 may be drawn, or 3 One or more identification marks M2 may be drawn. As the number of identification marks M2 to be drawn increases, the types of relative distances with respect to the alignment marks M1 increase, so that the number of exposure target substrates C that can be identified can be increased.

  FIG. 19 is a diagram showing an example of the relative position of the identification mark M2 with respect to the alignment mark M1 in the exposure drawing system 1 according to the first embodiment. As shown in FIG. 19, the mutual distance from each alignment mark M1 to a single identification mark M2 or the position vector of the identification mark M2 with respect to each alignment mark M1 is derived. The relative position may be used.

  In the exposure drawing system 1 according to the first embodiment, the identification mark M2 is drawn separately from the alignment mark M1, but the present invention is not limited to this, without drawing the identification mark M2. The alignment mark M1 may be used for both alignment and identification. In this case, any of the alignment marks M1 functions as the identification mark M2. When changing the position of the alignment mark M1, the position of an image such as a circuit pattern to be drawn is not changed (for example, a line connecting a plurality of alignment marks M1 is on the same line and Change so that the points are the same).

  FIG. 20 is a diagram showing an example of the relative position of the alignment mark M1 (identification mark) in the exposure drawing system 1 according to the first embodiment. As shown in FIG. 20, in addition to using the alignment mark M1 for the alignment of the first surface C1 and the second surface C2, the mutual distance between a plurality of alignment marks M1 is derived, The distance may be a relative position. In this case, the process of drawing the identification mark M2 can be omitted.

[Second Embodiment]
Hereinafter, the exposure drawing system 1 according to the second embodiment will be described in detail with reference to the accompanying drawings. The exposure drawing system 1 according to the second embodiment has the configuration shown in FIGS. 1 and 4 to 9 as in the exposure drawing system 1 according to the first embodiment. In addition, the same code | symbol is attached | subjected to the structure same as 1st Embodiment, and the overlapping description is abbreviate | omitted.

  In the exposure drawing system 1 according to the second embodiment, as in the first embodiment, when the second surface C2 is exposed after the first surface C1 of the substrate C to be exposed is exposed, the exposure of the first surface C1 is performed. A function of exposing the second surface C2 in correspondence with the exposure state at the time.

  FIG. 21A is a front view showing an example of the first surface C1 when the first surface C1 of the substrate C to be exposed is exposed in the exposure drawing system 1 according to the second embodiment. (B) is a front view showing an example of the second surface C2 when the second surface C2 of the substrate C to be exposed is exposed in the exposure drawing system 1 according to the second embodiment.

  As shown in FIG. 21A, the surface image P1 is drawn on the first surface C1 of the substrate C to be exposed by the first exposure drawing device 2. Further, as shown in FIG. 21B, the back exposure image P2 is drawn on the second surface C2 of the substrate C to be exposed by the second exposure drawing device 4, and the front image P1 of the first surface C1 is drawn. Drawing is performed in an image coordinate system corresponding to a coordinate system (hereinafter referred to as “image coordinate system”). Further, a plurality of (two in the present embodiment) are provided on the first surface C1 and the second surface C2 of the substrate C to be exposed by the first exposure drawing device 2 on the upper center side of the front view and the lower center side of the front view. The alignment mark M1 is drawn in advance, and a plurality of (this embodiment) is provided on the first surface C1 and the second surface C2 by the first exposure drawing device 2 on the center side on the left side and the center on the right side in the front view. In the embodiment, two identification marks M2 are drawn in advance.

  FIG. 22 is a schematic diagram for explaining exposure processing by the exposure drawing system 1 according to the second embodiment. As shown in FIG. 22, the exposure drawing system 1 detects and detects the positions of the alignment mark M1 and the identification mark M2 formed on the first surface C1 during the exposure process on the first surface C1. After performing alignment based on the position, the surface image P1 is drawn on the first surface C1. Further, the exposure drawing system 1 associates the relative position of the identification mark M2 with respect to the alignment mark M1, which is the identification information of the substrate C to be exposed, with the exposure state during the exposure process of the first surface C1. And stored in the storage unit 41 of the control device 9.

  Next, during the exposure process for the second surface C2, the exposure drawing system 1 detects the positions of the alignment mark M1 and the identification mark M2 formed on the second surface C2, and identifies the alignment mark M1. Information on exposure of the first surface C2 corresponding to the relative position of the mark M2 for use is acquired. Further, the exposure drawing system 1 determines the drawing position based on the position of the alignment mark M1 so as to correspond to the drawing position of the surface image P1 drawn on the first surface C1, and also the first surface C1. The exposure condition for the second surface C2 is determined based on the information relating to the exposure, and the back surface image P2 is drawn on the second surface C2.

  Here, the flow of exposure processing by the exposure drawing system 1 according to the second embodiment will be described.

  The system control unit 30 of the first exposure drawing apparatus 2 executes the exposure process at a predetermined timing (in this embodiment, the timing at which the substrate C to be exposed is placed on the stage 10). FIG. 23 is a flowchart showing a flow of processing of the exposure processing program according to the present embodiment. The program is preliminarily stored in a predetermined area of a ROM that is a recording medium provided in the system control unit 30 of the first exposure drawing apparatus 2. It is remembered.

  In step S401, the system control unit 30 sets each of the alignment mark M1 and the identification mark M2 drawn in advance on the first surface C1 of the substrate C to be exposed on the stage 10 on which the substrate C to be exposed is placed. Is moved to a position included in each imaging region of the imaging device 23. At this time, the system control unit 30 moves the stage 10 along the guide rail 14 in the Y direction and stops it.

  In step S403, the system control unit 30 measures the positions of the alignment mark M1 and the identification mark M2 from the captured image in which the alignment mark M1 and the identification mark M2 are captured by the imaging unit 23. . In step S405, the system control unit 30 derives the relative position of the identification mark M2 with respect to the alignment mark M1 from the positions of the alignment mark M1 and the identification mark M2 measured in step S403. .

  In step S407, the system control unit 30 determines a position for drawing the surface image P1 on the first surface C1 of the substrate C to be exposed based on the position of the alignment mark M1 measured in step S403. Set the image coordinate system.

  In step S409, the system control unit 30 moves the stage 10 to the exposure position for the substrate C to be exposed based on the image coordinate system set in step S407. At this time, the system control unit 30 moves the stage 10 in the Y direction along the guide rail 14, and the exposure target position by the exposure head 16a is the start position when the back surface image P2 is drawn on the substrate C to be exposed. The stage 10 is moved to a position coinciding with and stopped.

  In step S411, the system control unit 30 starts exposure by each exposure head 16a, and draws the surface image P1 on the first surface C1 of the substrate C to be exposed.

  In step S413, the relative position of the identification mark M2 with respect to the alignment mark M1 derived in step S405 is used as identification information of the substrate C to be exposed, and the exposure state at the time of drawing in step S411 corresponds to the identification information. In addition, the exposure state information 50 is stored in the storage unit 41.

  In step S415, the system control unit 30 moves the stage 10 to the position where the substrate C to be exposed is placed, and ends the first exposure processing program. When the stage 10 moves to the position where the substrate to be exposed C is placed, the substrate C to be exposed moves to the second transport device 6 by being sucked and held by the AC hand 26, and is reversed by the second transport device 6. 3, the front and the back are reversed by the reversing device 3, and then conveyed to the second exposure drawing device 4 by the third conveying device 7.

  The system control unit 30 of the second exposure drawing apparatus 4 executes the second exposure processing program at a predetermined timing (in this embodiment, the timing at which the substrate C to be exposed is placed on the stage 10).

  FIG. 24 is a flowchart showing a flow of processing of the second exposure processing program according to the present embodiment, and the program is a predetermined area of a ROM which is a recording medium provided in the system control unit 30 of the second exposure drawing apparatus 4. Is stored in advance.

  In step S501, the system control unit 30 sets the alignment mark M1 and the identification mark M2 drawn in advance on the second surface C2 of the substrate C to be exposed on the stage 10 on which the substrate C to be exposed is placed. Each moves to a position included in each imaging region of the imaging device 23. At this time, the system control unit 30 moves the stage 10 along the guide rail 14 in the Y direction and stops it.

  In step S503, the system control unit 30 measures the positions of the alignment mark M1 and the identification mark M2 from the captured image in which the alignment mark M1 and the identification mark M2 are captured by the imaging unit 23. . In step S505, the system control unit 30 derives the relative position of the identification mark M2 with respect to the alignment mark M1 from the positions of the alignment mark M1 and the identification mark M2 measured in step S503. .

  In step S507, the system control unit 30 determines the second surface of the substrate C to be exposed based on the position of the alignment mark M1 measured in step S503 and the position of the alignment mark M1 measured in step S503. An image coordinate system for determining the position where the back surface image P2 is drawn is set for C2.

  In step S509, the system control unit 30 moves the stage 10 to the exposure position based on the image coordinate system set in step S507. At this time, the system control unit 30 moves the stage 10 in the Y direction along the guide rail 14, and the exposure target position of the stage 10 by the exposure head 16a draws the back surface image P2 on the substrate C to be exposed. The stage 10 is moved to a position that coincides with the starting position of the position and stopped.

  In step S511, the system control unit 30 acquires the exposure state of the first surface C1 corresponding to the relative position of the identification mark M2 with respect to the alignment mark M1 derived in step S505 from the exposure state information 50.

  In step S513, the system control unit 30 starts exposure by each exposure head 16a so as to correspond to the exposure state of the first surface C1 acquired in step S511, and the back surface is exposed to the second surface C2 of the substrate C to be exposed. The work image P2 is drawn.

  In step S515, the system control unit 30 moves the stage 10 to the position where the substrate C to be exposed is placed, and ends the second exposure processing program. When the stage 10 moves to the position where the exposed substrate C is placed, the exposed substrate C on which images are drawn on both the first surface C1 and the second surface C2 is attracted and held by the AC hand 26. It moves to the fourth transport device 8 and is transported by the fourth transport device 8.

  As described above, in the exposure drawing system 1 according to the second embodiment, when performing the exposure process, the exposure substrate C on which the identification mark M2 for identifying each of the exposure substrates C is formed in advance is used. By referring to the information on the exposure of the first surface C1 with the relative position of the identification mark M2 relative to the alignment mark M1 as identification information at the time of exposure of the second surface C2, the first surface C1 and the first The exposure conditions with the two surfaces C2 can be made to correspond.

  In addition, the method of measuring the position of the ultraviolet light source 24 in step S107 is not limited to the method of using the photographed image by the photographing unit 23, and is measured by the moving mechanism 24a of the ultraviolet light source 24 using, for example, a stepping motor pulse or a rotary encoder. May be. Alternatively, the position of the ultraviolet light source 24 may be measured by an optical distance sensor or a distance sensor using ultrasonic waves.

  In the exposure drawing system 1 according to the first and second embodiments, the alignment mark M1 and the identification mark M2 are drawn on the substrate C to be exposed using the ultraviolet light source 24. However, the present invention is not limited to this. Instead, the image may be drawn by spraying or transferring ink.

  In the exposure drawing system 1 according to the first embodiment and the second embodiment, the processes of the flowcharts shown in FIGS. 11, 13, and 23 are performed under the control of the system control unit 30 of the first exposure drawing apparatus 2. The processes of the flowcharts shown in FIGS. 16 and 24 are performed under the control of the system control unit 30 of the second exposure drawing apparatus 4, but the present invention is not limited to this, and the series of processes of the flowcharts described above is It may be performed by control.

  In the exposure drawing system 1 according to the second embodiment, the alignment mark M1 and the identification mark M2 are drawn on both the first surface C1 and the second surface C2, but the present invention is not limited thereto. An alignment mark M1 and an identification mark M2 may be drawn on any one surface. In this case, in the first exposure drawing apparatus 2 or the second exposure drawing apparatus 4, the upper surface of the substrate C to be exposed placed on the stage 10, for example, the photographing unit 23 is also provided below the stage 10. In addition, the positions of the alignment mark M1 and the identification mark M2 on both the lower surface and the lower surface can be detected.

  DESCRIPTION OF SYMBOLS 1 ... Exposure drawing system, 2 ... 1st exposure drawing apparatus, 3 ... Inversion apparatus, 4 ... 2nd exposure drawing apparatus, 5 ... 1st conveying apparatus, 6 ... 2nd conveying apparatus, 7 ... 3rd conveying apparatus, 8 ... 4th conveying device, 9 ... control device, 10 ... stage, 11 ... base, 12 ... base, 13 ... moving mechanism part, 14 ... guide rail, 15 ... gate, 16 ... exposure part, 16a ... exposure head, 17 ... Light source unit, 18 ... optical fiber, 19 ... image processing unit, 20 ... signal cable, 22 ... gate, 23 ... photographing unit, 24 ... ultraviolet light source, 24a ... moving mechanism, 30 ... system control unit, 31 ... stage drive unit, 32 ... Operation device, 33 ... Movement drive unit, 40 ... Control unit, 41 ... Storage unit, 42 ... Display unit, 43 ... Input unit, 44 ... Communication interface, C ... Substrate to be exposed, C1 ... Front side, C2 ... Back side, M1 ... Mark for alignment M2 ... marks for identification, P1 ... surface image, P2 ... rear surface image, UV ... UV beam.

Claims (13)

Exposure means for drawing a circuit pattern by exposing a substrate to be exposed having a first surface and a second surface opposite to the first surface;
A first mark as a reference for an exposure position is formed at a predetermined position on the second surface of the substrate to be exposed, and the relative position with respect to the first mark is made different for each substrate to be exposed. Mark forming means for forming a second mark representing identification information for identifying the substrate to be exposed by position;
Control means for controlling the exposure means so that a circuit pattern is drawn on the substrate to be exposed;
Storage means for storing information relating to the exposure in correspondence with identification information represented by the relative position;
An exposure drawing apparatus comprising: Detecting means for detecting positions of the first mark and the second mark formed by the mark forming means;
Deriving means for deriving a relative position of the second mark with respect to the first mark based on the position detected by the detecting means;
The control means controls the exposure means so that a circuit pattern is drawn on the first surface, and also corresponds to the identification information represented by the relative position derived from the storage means by the derivation means. When information on the exposure of one surface is acquired and the information indicates that the exposure of the first surface has been performed normally, the information is determined based on the position of the first mark detected by the detection means. The exposure drawing apparatus according to claim 1, wherein the exposure unit is controlled so that a circuit pattern is drawn on the second surface based on an exposure position of the second surface. Detecting means for detecting positions of the first mark and the second mark formed by the mark forming means;
Deriving means for deriving a relative position of the second mark with respect to the first mark based on the position detected by the detecting means;
The control means controls the exposure means so that a circuit pattern is drawn on the first surface, and also corresponds to the identification information represented by the relative position derived from the storage means by the derivation means. When the information about the exposure of one surface is acquired and the information indicates that the exposure of the first surface has not been performed normally, the exposure means is arranged so that a circuit pattern is not drawn on the second surface. The exposure drawing apparatus according to claim 1 to be controlled. The information on the exposure indicates information indicating whether or not the exposure of the first surface has been normally performed, information on the magnification on the information on the exposure of the first surface, and a circuit pattern drawn on the first surface. The exposure drawing apparatus according to claim 1, comprising at least one of information and information indicating an exposure order of the substrate to be exposed. The exposure drawing apparatus according to claim 1, wherein the first mark and the second mark have the same shape. The said detection means detects the position of the said 1st mark and the said 2nd mark based on the image obtained by image | photographing the said 1st mark and the said 2nd mark. Exposure drawing equipment. The exposure drawing apparatus according to any one of claims 1 to 6, wherein the mark forming unit forms the first mark and the second mark by irradiating the substrate to be exposed with an ultraviolet beam. The exposure drawing apparatus according to claim 1, wherein the mark forming unit forms a plurality of the second marks at different positions. A first mark as a reference for an exposure position is formed at a predetermined position on at least one of the first surface and the second surface opposite to the first surface, and the relative position with respect to the first mark is set to the target surface. Exposure means for drawing a circuit pattern by exposing a substrate to be exposed on which a second mark representing identification information for identifying the substrate to be exposed is identified according to the relative position by making the exposure substrate different.
Detecting means for detecting positions of the first mark and the second mark formed by the mark forming means;
Derivation means for deriving a relative position of the second mark with respect to the first mark based on the position detected by the detection means;
The derivation is performed by controlling the exposure means so that a circuit pattern is drawn on the first surface based on the exposure position of the first surface determined based on the position of the first mark detected by the detection means. Information related to the exposure of the first surface is stored in the storage means in correspondence with the identification information expressed by the relative position derived by the means, and expressed by the relative position derived by the derivation means from the storage means The second surface determined based on the position of the first mark detected by the detecting means by acquiring information relating to the exposure of the first surface corresponding to the identification information, determining an exposure condition based on the information. Control means for controlling the exposure means so that a circuit pattern is drawn on the second surface based on the exposure position;
An exposure drawing apparatus comprising: A program executed in an exposure drawing apparatus including an exposure unit that draws a circuit pattern by exposing a substrate to be exposed having a first surface and a second surface opposite to the first surface,
Computer
A first mark as a reference for an exposure position is formed at a predetermined position on the second surface of the substrate to be exposed, and the relative position with respect to the first mark is made different for each substrate to be exposed. Mark forming means for forming a second mark representing identification information for identifying the substrate to be exposed by position;
Control means for controlling the exposure means so that a circuit pattern is drawn on the substrate to be exposed;
Storage means for storing information relating to the exposure in correspondence with identification information represented by the relative position;
Program to function as. Computer
Detecting means for detecting positions of the first mark and the second mark formed by the mark forming means;
Further functioning as derivation means for deriving a relative position of the second mark with respect to the first mark based on the position detected by the detection means;
The control means controls the exposure means so that a circuit pattern is drawn on the first surface, and also corresponds to the identification information represented by the relative position derived from the storage means by the derivation means. Obtaining information related to exposure of one surface, determining an exposure condition based on the information, and based on the exposure position of the second surface determined based on the position of the first mark detected by the detecting means The program according to claim 10, wherein the exposure unit is controlled so that a circuit pattern is drawn on the second surface. An exposure drawing method in an exposure drawing apparatus provided with an exposure means for drawing a circuit pattern by exposing a substrate to be exposed having a first surface and a second surface facing the first surface,
A first mark as a reference for an exposure position is formed at a predetermined position on the second surface of the substrate to be exposed, and the relative position with respect to the first mark is made different for each substrate to be exposed. A mark forming step of forming a second mark representing identification information for identifying the substrate to be exposed according to a position;
A first control step of controlling the exposure means so that a circuit pattern is drawn on the first surface of the substrate to be exposed;
A storage step of storing in the storage means information relating to the exposure of the first surface in correspondence with the identification information represented by the relative position;
Exposure drawing method to perform. A detecting step for detecting positions of the first mark and the second mark formed by the mark forming step;
A derivation step for deriving a relative position of the second mark with respect to the first mark based on the position detected by the detection step;
Obtaining information relating to the exposure of the first surface corresponding to the identification information represented by the relative position derived by the deriving means from the storage means, determining an exposure condition based on the information, and performing the detection step A second control step for controlling the exposure means so that a circuit pattern is drawn on the second surface based on the exposure position of the second surface determined based on the detected position of the first mark;
The exposure drawing method according to claim 12, further performed.