JP5961429B2 - Exposure drawing apparatus and exposure drawing method - Google Patents

Description

  The present invention relates to an exposure drawing apparatus and an exposure drawing method, and more particularly to an exposure drawing apparatus and an exposure drawing method for drawing an image on a substrate.

  2. Description of the Related Art In recent years, an exposure drawing apparatus that draws a circuit pattern by directly irradiating a drawing light onto a substrate without using a transfer mask has been developed as an exposure drawing apparatus that forms a circuit pattern using a planar substrate as an exposed substrate. However, when drawing a circuit pattern on a substrate that requires high resolution, the dust adhering to the hole processing and the dust adhering to the hole during the movement process may drop to another substrate or resist processing, etc. The hole periphery may be deformed by heating. In this case, there is a problem that the relative positions of the circuit pattern drawn on the first surface of the substrate and the circuit pattern drawn on the second surface are shifted.

  In view of this, there has been proposed an exposure drawing apparatus that draws alignment marks necessary for drawing a circuit pattern on a first surface and a second surface of a substrate to be exposed. As a technique related to this, Patent Document 1 describes the first and second alignment marks on the first surface and the second surface of the substrate to be exposed, respectively, and based on the first and second alignment marks. An exposure drawing apparatus for drawing a circuit pattern on a first surface and a second surface of a substrate is disclosed. Further, Patent Document 2 discloses drawing exposure in which an alignment mark is formed on the second surface simultaneously with the exposure of the first surface of the substrate to be exposed using a fixed ultraviolet light source having a known positional relationship with the stage. An apparatus is disclosed.

JP 2008-292915 A US Pat. No. 6,701,197 B2 specification

  In the exposure drawing apparatus disclosed in Patent Document 1, since it is necessary to form alignment marks before the drawing process, the printing time affects the cycle time, the first surface, and the second surface. There is a problem that it is necessary to correct the misalignment of the alignment mark measurement between them, and that an apparatus configuration for forming alignment marks on both the first surface and the second surface is necessary.

  Further, in the exposure drawing apparatus disclosed in Patent Document 2, since the position for drawing the alignment mark is fixed on the substrate to be exposed, each of a plurality of substrates having different sizes is exposed. In this case, there is a problem that the alignment mark cannot be drawn at an optimum position according to the size of the substrate to be exposed, and the alignment accuracy may be lowered depending on the size of the substrate.

  The present invention has been made in view of the above problems, and provides an exposure drawing apparatus and an exposure drawing method capable of improving the alignment accuracy on the front and back of the substrate to be exposed without depending on the size of the substrate to be exposed. With the goal.

  In order to achieve the above object, an exposure drawing apparatus according to the present invention comprises: a first exposure means for drawing a circuit pattern on the first surface by exposing a first surface of a printed wiring board placed on a stage; The second surface opposite to the first surface is provided in advance during the drawing process of the circuit pattern for the first surface on the first surface of the printed wiring board. Mark forming means for forming a plurality of marks formed thereon, measuring means for measuring the positions of the mark forming means, and positions of the plurality of marks formed on the second surface of the printed wiring board by the mark forming means. Detecting the detecting means, and the positions of the mark forming means measured by the measuring means and the positions of the plurality of marks detected by the detecting means as a reference. And a, a second exposure means for drawing a circuit pattern on the second surface by exposing the two surfaces.

  According to this exposure drawing apparatus, the first exposure means exposes the first surface of the printed wiring board placed on the stage, whereby the circuit pattern is drawn on the first surface, and is relative to the stage. And a plurality of predetermined predetermined surfaces on the second surface opposite to the first surface during the drawing process of the circuit pattern for the first surface on the first surface of the printed wiring board. Marks are formed, the position of the mark forming means is measured by the measuring means, and the positions of the plurality of marks formed on the second surface of the printed wiring board are detected by the detecting means by the detecting means. The

  Here, in the present invention, the second exposure unit uses the position of the mark forming unit measured by the measuring unit and the position of the plurality of marks detected by the detecting unit as a reference. A circuit pattern is drawn on the second surface by exposing two surfaces.

  That is, the position of the mark forming unit is measured, and a plurality of marks are formed by the mark forming unit at the position of the second surface having a known relationship with the exposure position of the circuit pattern for the first surface. When the circuit pattern for the second surface is exposed, the circuit pattern for the second surface is drawn on the basis of the position of the mark forming means and the positions of the plurality of marks, thereby being drawn on the first surface and the second surface. The position of the circuit pattern can be made to correspond. The “drawing process” refers to a series of processes from when the printed wiring board is placed on the stage to when the drawing of the circuit pattern is completed and the printed wiring board is discharged.

  Thus, according to the exposure drawing apparatus according to the present invention, the position of the circuit pattern drawn on the second surface with reference to the positions of a plurality of marks having a known positional relationship with the circuit pattern drawn on the first surface. As a result, the alignment accuracy on the front and back of the substrate to be exposed can be improved without depending on the size of the substrate to be exposed.

  In the present invention, the mark forming means includes at least a direction predetermined with respect to any one side of the printed wiring board placed on the stage and a direction intersecting the predetermined direction. It may be provided so as to be movable in one direction. Thereby, the position which forms a some mark in an appropriate position can be adjusted.

  In the present invention, the mark forming means may be configured such that the movable range is a range in which the mark can be formed on a plurality of types of printed wiring boards having different sizes. Thus, a plurality of marks can be formed at appropriate positions without depending on the size of the substrate.

  Further, in the present invention, further comprising a specifying unit that specifies a size of the printed wiring board, wherein the mark forming unit forms each of the plurality of marks according to the size specified by the specifying unit. Also good. Thereby, a plurality of marks can be formed at appropriate positions according to the size of the substrate.

  In the present invention, the measuring unit may include a photographing unit that photographs the mark forming unit, and may measure each position of the mark forming unit using an image captured by the photographing unit. Thereby, the position of the mark forming means can be easily measured.

In the present invention, the mark forming means may be photographed by the measuring means even when a calibration mark at a known relative position with respect to the mark forming means is in a state where a printed wiring board is placed on the stage. The measurement unit includes a photographing unit that photographs the mark forming unit so that each of the calibration marks is photographed, and the mark formation is performed using an image captured by the photographing unit. You may make it measure each position of a means. In the present invention, the mark forming means may include the measuring means even when a plurality of calibration marks at known relative positions with respect to the mark forming means are in a state where a printed wiring board is placed on the stage. The measurement unit includes a photographing unit that photographs the mark forming unit so that each of the plurality of calibration marks is photographed, and uses a photographed image by the photographing unit. Then, each position of the mark forming means may be measured. Thereby, even when the mark forming unit cannot be photographed, the position of the mark forming unit can be measured.

  In the present invention, a plurality of the photographing means may be provided, and each of the photographing means may photograph one or more of the mark forming means. Thereby, the position of the mark forming means can be easily measured.

  In the present invention, the photographing unit may have a known relationship with a position where a circuit pattern is drawn, and may be provided so as to be movable with respect to the stage. Thereby, the position of the mark forming means can be measured without depending on the position of the mark forming means.

  In the present invention, the mark forming unit may form the mark by exposing the second surface of the printed wiring board with light having a short wavelength. Thereby, a plurality of marks can be accurately formed at appropriate positions.

  In the present invention, the mark forming means may form the plurality of marks by attaching ink to the second surface of the printed wiring board. Thereby, a plurality of marks can be easily formed.

  On the other hand, in order to achieve the above object, an exposure drawing method according to the present invention provides a first exposure for drawing a circuit pattern on the first surface by exposing a first surface of a printed wiring board placed on a stage. Means, a mark forming means provided so as to be movable relative to the stage, and forming a plurality of predetermined marks on a second surface opposite to the first surface, and a position of the mark forming means. Measuring means for measuring; detecting means for detecting positions of a plurality of marks formed on the second surface of the printed wiring board by the mark forming means; and exposing the second surface of the printed wiring board. An exposure drawing method in an exposure drawing apparatus comprising a second exposure means for drawing a circuit pattern on the second surface, wherein the measuring means is controlled so that the position of the mark forming means is measured A first step of moving the mark forming means to a predetermined position; a circuit pattern for the first surface is drawn on the first surface of the printed wiring board; and A third step of controlling the exposure unit and the mark forming unit so that a plurality of marks are formed on the second surface in correspondence with the circuit pattern for the first surface during the drawing process; and the measuring unit The circuit pattern for the second surface is drawn on the second surface on the basis of the position of the mark forming unit measured by the above and the positions of the plurality of marks detected by the detecting unit. And a fourth step of controlling the exposure means.

  Therefore, according to this exposure drawing method, since it acts in the same manner as the exposure drawing apparatus according to the present invention, the exposure drawing apparatus is independent of the size of the exposed substrate as in the exposure drawing apparatus according to the present invention. The alignment accuracy on the front and back sides can be improved.

  According to the present invention, it is possible to improve the alignment accuracy on the front and back of the substrate to be exposed without depending on the size of the substrate to be exposed.

It is a block diagram which shows the whole structure of the exposure drawing system which concerns on embodiment. It is a block diagram which shows the function of the exposure drawing system which concerns on embodiment. (A) is a front view which shows an example of the said surface at the time of exposing to the surface of the to-be-exposed board | substrate of the exposure drawing system which concerns on embodiment, (B) is the back surface of the to-be-exposed board | substrate which concerns on embodiment. It is a front view which shows an example of the said back surface at the time of performing exposure. It is a perspective view which shows the structure of the 1st exposure drawing apparatus and 2nd drawing exposure drawing apparatus which concern on embodiment. It is a disassembled perspective view of the board | substrate clamp mechanism part of the 1st exposure drawing apparatus which concerns on embodiment, and a 2nd exposure drawing apparatus. It is an expanded sectional view for demonstrating the function of the photosensor of the 1st exposure drawing apparatus which concerns on embodiment, and a 2nd exposure drawing apparatus. (A) is a principal part expanded sectional view for demonstrating the mark formation part of the 1st exposure drawing apparatus and 2nd exposure drawing apparatus which concern on embodiment, (B) is 1st exposure drawing which concerns on embodiment. It is a principal part enlarged top view for demonstrating the mark formation part of an apparatus and a 2nd exposure drawing apparatus. It is a schematic front view showing the configuration of a reversing mechanism in the reversing device of the exposure drawing system according to the embodiment. It is a block diagram which shows the electric system of the 1st exposure drawing apparatus and 2nd exposure drawing apparatus which concern on embodiment. It is a figure which shows the relationship between the moving direction of a stage and the moving direction of an imaging | photography part in the exposure drawing system which concerns on embodiment. It is a figure which shows the movable range of the ultraviolet light source of the exposure drawing system which concerns on embodiment. It is a flowchart which shows the flow of a process of the pre-exposure processing program which concerns on embodiment. It is a schematic front view with which it uses for description of the pre-exposure process which concerns on embodiment. It is a flowchart which shows the flow of a process of the 1st exposure processing program which concerns on embodiment. It is a schematic front view with which it uses for description of the 1st exposure process which concerns on embodiment. It is a flowchart which shows the flow of a process of the 2nd exposure processing program which concerns on embodiment. It is a schematic front view with which it uses for description of the 2nd exposure process which concerns on embodiment. In the exposure drawing system which concerns on embodiment, it is a schematic front view which shows the relationship between the size of a to-be-exposed board | substrate, and the drawing position of the mark for alignment.

  Hereinafter, the exposure drawing system according to the present embodiment will be described in detail with reference to the accompanying drawings. In the present embodiment, as the exposure drawing system 1, a flat substrate such as a printed wiring board, a printed board and a glass substrate for a flat panel display is used as the exposure substrate C, and the first surface (hereinafter referred to as “surface”). A system that performs exposure drawing on both C1 and the second surface (hereinafter also referred to as “back surface”) C2 will be described as an example.

  FIG. 1 is a configuration diagram showing the overall configuration of an exposure drawing system 1 according to the present embodiment. FIG. 2 is a block diagram showing functions of the exposure drawing system 1 according to the present embodiment. As shown in FIGS. 1 and 2, the exposure drawing system 1 measures the position of an ultraviolet light source 51 to be described later, and then exposes the surface C1 of the substrate C to be exposed and applies it to the back surface C2 of the substrate C to be exposed. A first exposure drawing apparatus 2 for forming an alignment mark M, a reversing apparatus 3 for inverting the front and back of the substrate C to be exposed, a second exposure drawing apparatus 4 for exposing the back surface C2 of the substrate C to be exposed, and the exposure A first transport unit 5 that transports the substrate C to the first exposure drawing apparatus 2; a second transport unit 6 that transports the substrate C to be exposed from the first exposure drawing apparatus 2 to the reversing device 3; From the second exposure drawing apparatus 4 to the second exposure drawing apparatus 4, and a third transfer section 8 for transferring the substrate C to be exposed from the second exposure drawing apparatus 4.

  3A is a front view showing an example of the surface C1 when the surface C1 of the substrate C to be exposed is exposed, and FIG. 3B shows that the back surface C2 of the substrate C to be exposed is exposed. It is a front view which shows an example of the said back surface C2 at the time of performing.

  As shown in FIG. 3A, a surface image (in the present embodiment, an image having the shape of “F”) P1 is drawn on the surface C1 of the substrate C to be exposed by the first exposure drawing device 2. Further, as shown in FIG. 3B, the back exposure image is formed on the back surface C2 of the substrate C to be exposed by the second exposure drawing device 4 (in this embodiment, the image having the shape of “F” on the front surface C1). An image coordinate system corresponding to a coordinate system (hereinafter referred to as “image coordinate system”) on which the front image P1 of the front surface C1 is drawn is a rectangular frame shape image P2 surrounding the corresponding back surface C2 region. It is drawn with. Further, on the back surface C2 of the substrate C to be exposed, a plurality of (two in this embodiment) alignment marks M are drawn by the first exposure drawing device 2 on the upper center side of the front view and the lower center side of the front view. Is done. The alignment mark M is a mark for making the position of the front image P1 and the position of the back image P2 drawn on the front surface C1 and the back surface C2 of the substrate C to be exposed correspond to each other.

  In the exposure drawing system 1 according to the present embodiment, a first exposure drawing apparatus 2 is provided on the upstream side in the transport direction of the substrate C to be exposed. As described above, the first exposure drawing apparatus 2 exposes the surface C1 of the exposed substrate C when the unexposed exposed substrate C transported by the first transport unit 5 is carried into the apparatus. Then, a front image P1 is drawn on the front surface, and an alignment mark M is formed on the back surface C2 of the substrate C to be exposed.

  In the exposure drawing system 1 according to the present embodiment, the alignment mark M is drawn in a circle of about φ0.5 mm to φ1 mm, but the size and shape are not limited to this, and the size is not limited to the surface image P1 and The size may be any size as long as it does not overlap with the drawing of the back surface image P2, and the shape may be arbitrarily set, such as a cross shape or a rectangular shape.

  A reversing device 3 for reversing the front and back of the substrate C to be exposed is provided on the downstream side of the first exposure drawing apparatus 2 in the transport direction of the substrate C to be exposed. When the exposure substrate C on which the front surface C1 is exposed and the alignment mark M is drawn is carried in by the first exposure drawing device 2, the reversing device 3 exposes the back surface C2 of the exposure substrate C in the following process. In order to perform the above, the front and back of the substrate C to be exposed are reversed.

  A second exposure drawing device 4 that performs exposure on the back surface C2 of the substrate C to be exposed is provided on the downstream side of the reversing device 3 in the transport direction of the substrate C to be exposed. When the exposed substrate C reversed by the reversing device 3 is carried into the apparatus, the second exposure drawing device 4 exposes the back surface C2 of the exposed substrate C and draws the back surface image P2. At this time, the second exposure drawing apparatus 4 performs alignment on the back surface C2 after performing alignment using the alignment mark M drawn on the substrate C to be exposed by the first exposure drawing apparatus 2.

  The exposure drawing system 1 according to the present embodiment also includes a first transfer device 5 and a first exposure drawing device 2 that transfer the substrate C to be exposed to the first exposure drawing device 2 and carry it into the first exposure drawing device 2. The substrate C discharged from the substrate 2 is transported to the reversing device 3 and carried into the reversing device 3, and the substrate C discharged from the reversing device 3 is transported to the second exposure drawing device 4. A third transport device 7 for transporting to the second exposure drawing device 4 and a fourth transport device 8 for transporting the substrate C to be exposed discharged from the second exposure drawing device 4 are provided.

  Each of the above conveying devices has a plurality of rotating rollers and a drive motor that rotates the rotating rollers. A plurality of rotating rollers are laid in parallel, and a sprocket or pulley that receives a rotational force transmitted by a belt or a wire is attached to one end of the rotating roller. As a means for transmitting the rotational force of the drive motor that rotates the rotating roller, a transmission method using a cylindrical magnet can be employed in addition to the belt or the wire.

  In the present embodiment, in order to increase the throughput (production amount per hour) of the substrate C to be exposed, the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 are used for the first exposure drawing apparatus. The exposure drawing device 2 exposes the front surface C1 of the substrate C to be exposed and the second exposure drawing device 4 exposes the back surface C2 of the substrate C to be exposed. However, the present invention is not limited to this. It is also possible to draw the both surfaces of the substrate C to be exposed only by the first exposure drawing apparatus 2.

  Next, the structure of the 1st exposure drawing apparatus 2 and the 2nd exposure drawing apparatus 4 is demonstrated.

  FIG. 4 is a perspective view showing the configuration of the first exposure drawing apparatus 2 and the second drawing exposure drawing apparatus 4 according to this embodiment. In the following, the direction in which the stage 10 moves is defined as the Y direction, the direction perpendicular to the Y direction in the horizontal plane is defined as the X direction, the direction perpendicular to the Y direction in the vertical plane is defined as the Z direction, and the Z axis The direction of rotation centered on is defined as the θ direction.

  As shown in FIG. 4, the first exposure drawing apparatus 2 includes a flat stage 10 for fixing the substrate C to be exposed. The stage 10 is configured to be movable, and the exposure target substrate C fixed to the stage 10 moves the exposure target substrate C to the exposure position in accordance with the movement of the stage 10, and the exposure unit 16, which will be described later, emits a light beam. The surface image C1 is drawn on the substrate C to be exposed.

  The stage 10 is supported by a flat base 12 that is movably provided on the upper surface of a table-like base 11. In addition, a moving mechanism unit 13 having a moving drive mechanism (not shown) configured by a motor or the like is provided between the base 12 and the stage 10, and the stage 10 is moved by the moving mechanism unit 13. On the other hand, it rotates and moves in the θ direction with the perpendicular at the center of the stage 10 as the central axis.

  One or a plurality of (in this embodiment, two) guide rails 14 are provided on the upper surface of the base 11. The base 12 is supported by a guard rail 14 so as to be reciprocally movable, and is moved by a stage driving unit (stage driving unit 71 described later) constituted by a motor or the like. The stage 10 is moved along the guide rail 14 by being supported on the upper surface of the movable base 12.

  A gate-type gate 15 is erected on the upper surface of the base 11 so as to straddle the guide rail 14, and an exposure unit 16 is attached to the gate 15. The exposure unit 16 is composed of a plurality (16 in the present embodiment) of exposure heads 16 a and is fixedly arranged on the moving path of the stage 10. An optical fiber 18 drawn from the light source unit 17 and a signal cable 20 drawn from the image processing unit 19 are connected to the exposure unit 16.

  Each exposure head 17 has a digital micromirror device (DMD) as a reflective spatial light modulation element, and controls the DMD based on image data input from the image processing unit 19 to emit light from the light source unit 17. The first exposure drawing apparatus 2 performs exposure by modulating the beam and irradiating the substrate to be exposed C placed on the stage 10 with this light beam. Note that a transmissive spatial light modulator such as liquid crystal may be used as the spatial light modulator.

  A gate 22 is provided on the upper surface of the base 11 so as to straddle the guide rail 14. One or a plurality of (two in this embodiment) image pickup units 23 for photographing the substrate C to be exposed placed on the stage 10 are attached to the gate 22. The photographing unit 23 is a CCD camera or the like having a built-in strobe with a very short light emission time. Each photographing unit 23 is installed so as to be movable in a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 on a horizontal plane, and is provided on a mark forming unit 52 and a substrate C to be exposed which will be described later. It is installed to photograph the drawn alignment mark M. Further, the relative position of the photographing unit 23 with respect to the stage 10 is measured in accordance with the movement of the stage 10 or the photographing unit 23 and stored in a storage unit included in the system control unit 70. Note that when the ultraviolet light source 51 in the mark forming unit 52 is photographed, the exposure target substrate C is not placed.

  The first exposure drawing apparatus 2 derives the position of the ultraviolet light source 51 on the exposed substrate C from the image obtained by photographing the mark forming unit 52 by the photographing unit 23. The second exposure drawing apparatus 4 compares the position deviation amount (X, Y) with respect to the position of the ultraviolet light source 51 in the first exposure drawing apparatus 2 from the image in which the alignment mark M is taken by the photographing unit 23. , Θ direction deviation amount) is detected. Information on the amount of positional deviation of the alignment mark M is used to correct the positions of the front image P1 drawn on the front surface C1 of the substrate C to be exposed and the back image P2 drawn on the back surface C2.

  It is ideal that the number of imaging units 23 be provided in accordance with the number of mark forming units 52 (or the number of alignment marks M), but the present invention is not limited to this. In addition to being provided, a plurality of mark forming portions 52 or a plurality of alignment marks M may be photographed by moving the photographing portion 23.

  A substrate clamp mechanism 30 for fixing the end of the substrate C to be exposed to the stage 10 is provided on the upper surface of the stage 10.

  FIG. 5 is an exploded perspective view of the substrate clamping mechanism 30 of the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 according to the present embodiment. As shown in FIG. 5, the substrate clamping mechanism 30 includes a pair of clamp bars 31a and 31b that clamp both ends in one direction of the substrate C to be exposed from above, and the horizontal direction of the substrate C to be exposed in the one direction. And a pair of clamp bars 31c and 31d for clamping both ends in the vertical direction from above, and moving units 32a to 32d for translating these clamp bars 31a to 31d in the horizontal direction, respectively. The clamp bars 31 a to 31 d are respectively disposed on the upper surface of the stage 10, and the moving units 32 a to 32 d are disposed below the stage 10.

  The clamp bars 31a and 31b are long in the Y direction and face each other in the X direction, and the clamp bars 31c and 31d are long in the X direction and face each other in the Y direction. The clamp bars 31a and 31b are formed to be shorter than the clamp bars 31c and 31d, and are configured not to interfere with each other even when the size of the exposed substrate C is small.

  The clamp bar 31a is fixed to a metal (for example, aluminum) clamp holder 33 and an inner region (a region on the center side of the stage 10) on the lower surface of the clamp holder 33, and is made of a resin that contacts the surface C1 of the substrate C to be exposed. The clamp blade 34 and two support pillars 35 provided in the outer region (outer region of the stage 10) on the lower surface of the clamp holder 33. One or a plurality of insertion holes 37 penetrating in the front and back direction and extending in the Y direction or the X direction from the end of the stage 10 toward the center are provided at predetermined intervals on each side (this embodiment). Then, three (12 in total) are formed on each side, and the two support pillars 35 of the clamp bar 31a are inserted into the two insertion holes 37 among the three insertion holes 37 on each side. . The clamp bars 31b to 31d have the same configuration as the clamp bar 31a.

  The moving unit 32a includes a support plate 40 that supports two support columns 35, and an air cylinder 41 that slides the support plate 40 in the Z direction. The tip of the piston rod 42 of the air cylinder 41 is fixed to the lower surface of the support plate 40. The air cylinder 41 lowers and raises the piston rod 42 by a drive unit configured by a motor or the like. The movable range of the piston rod 42 is limited and stops at a predetermined position when the piston rod 42 is lowered and raised.

  When the piston rod 42 is lowered, the clamp bar 43a is lowered together with the piston rod 42, and the clamp bar 31a is pressed against the stage 10. Here, when the substrate to be exposed C is placed on the stage 10, the substrate to be exposed C is clamped by the clamp bar 31a. On the other hand, when the piston rod 42 rises, the clamp bar 31a rises together with the piston rod 42, and the clamp bar 31a moves away from the stage 10 in the Z direction. The distance that the clamp bar 31a is separated from the stage 10 is larger than the thickness of the substrate C to be exposed. The state of the clamp bar 31a when the clamp bar 31a is pressed against the stage 10 is referred to as a closed state (closed position), and the state of the clamp bar 31a when it is separated from the stage 10 is referred to as an open state (open position).

  The moving unit 32a further includes a drive pulley 44 and a driven pulley 45 arranged in the X direction, a timing belt 46 stretched over these pulleys 44, 45, and a belt drive motor 47 that rotates the drive pulley 44. Have. The belt drive motor 47 can rotate forward and backward. An air cylinder 41 is attached to the timing belt 46 via an attachment portion 48. When the timing belt 46 is driven, the air cylinder 41 and the support plate 40 move in the X direction, whereby the clamp bar 31a moves in the X direction. Moving. The clamp bar 31 a slides along the support column 35 along the insertion hole 37, the retracted position where the support column 35 is located at the outer end of the insertion hole 37, and the support column 35 is the end inside the insertion hole 37. It moves between the center position located in the part. Note that the position of the clamp bar 31a when the clamp bar 31a clamps the peripheral edge of the substrate C to be exposed (any position between the retracted position and the center position) is referred to as a clamp position.

  The moving units 32b, 32c, and 32d have the same configuration as the moving unit 32a. However, the moving unit 32b moves the clamp bar 31b in the Z direction and the X direction, the moving unit 32c moves the clamp bar 31c in the Z direction and the Y direction, and the moving unit 32d moves the clamp bar 31d in the Z direction and Move in Y direction.

  FIG. 6 is an enlarged cross-sectional view for explaining the function of the photosensor 49 of the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 according to the present embodiment. As shown in FIGS. 5 and 6, the support plate 40 of the moving unit 32a is provided with a reflective photosensor (substrate edge sensor) 49 for detecting the presence or absence of the substrate C to be exposed. The photo sensor 49 is attached to the support plate 40 and is provided at a position corresponding to the insertion hole 37, that is, a position where the photo sensor 49 is exposed from the insertion hole 37 when viewed from above. The photo sensor 49 has a light projecting unit that emits inspection light upward and a light receiving unit that receives the inspection light reflected on the back surface C2 of the substrate C to be exposed. When the light receiving unit receives the inspection light, Outputs a substrate presence signal, and outputs a substrate absence signal when the light receiving unit does not receive the inspection light.

  The clamp blade 34 of the clamp bar 31a is positioned above the photo sensor 49. In order to prevent the inspection light from the photo sensor 49 from being reflected by the clamp blade 34 and returning to the photo sensor 49, the clamp blade 34 An inclined surface 50 is formed at a portion corresponding to the insertion hole 37. A photo sensor 49 similar to the moving unit 32a is also provided on the support plate 40 of each moving unit 32b, 32c, 32d.

  In addition, each support plate 40 is provided with a mark forming portion 52 for forming an alignment mark M on the substrate C to be exposed placed on the stage 10. FIG. 7A is an enlarged cross-sectional view of a main part for explaining the mark forming unit 52 of the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 according to the present embodiment, and FIG. It is a principal part enlarged top view for demonstrating the mark formation part 52 of the 1st exposure drawing apparatus 2 and the 2nd exposure drawing apparatus 4 which concern on this embodiment. In FIG. 7B, the substrate to be exposed C is omitted in order to explain the configuration of the ultraviolet light source 51.

  As shown in FIGS. 5, 7 </ b> A, and 7 </ b> B, each mark forming portion 52 corresponds to the insertion hole 37 provided at the center of the plurality of insertion holes 37 provided on each side. Thus, it is formed in a plate shape extending in the direction along the insertion hole 37. The mark forming part 52 is provided with an ultraviolet light source 51 for generating an ultraviolet beam (short wavelength light beam) UV toward the stage 10 on the center side of the stage 10. By irradiating the exposed substrate C with the ultraviolet beam UV generated by the ultraviolet light source 51 while passing through the insertion hole 37, the second surface (surface on the side in contact with the stage 10) C2 of the exposed substrate C is used for alignment. The mark M is drawn.

  In the mark forming part 52, a plurality (two in the present embodiment) of calibration marks 53 are provided on the same surface that is visible from above the stage 10 on the end side of the stage 10. . These calibration marks 53 are visible from the outside through the insertion hole 37 without being blocked by the exposed substrate C when the exposed substrate C is placed on the stage 10 and fixed to the substrate clamping mechanism 30. It is formed in a possible position. Therefore, each calibration mark 53 can be recognized in the photographed image obtained by the photographing unit 23.

  Each of the mark forming portions 52 moves in conjunction with the movement of the moving units 32a to 32d. The insertion holes 37 corresponding to the respective mark forming portions 52 are provided in regions including the movement paths of the respective mark forming portions 25, and the ultraviolet light source 51 exposes the surface C 1 of the substrate C to be exposed by the exposure portion 16. During the operation, the ultraviolet beam UV can be generated so as to penetrate the insertion hole 37 through which the support column 35 is not inserted. The irradiation time of the ultraviolet beam UV is preferably set to an optimum time according to the photosensitive material applied to the substrate C to be exposed.

  Further, in each mark forming unit 52, the ultraviolet light source 51 and the calibration mark 53 are provided so as to have a known positional relationship with each other, and each positional relationship is measured in advance and stored in the system control unit 70. Stored in the means. Thereby, even when the ultraviolet light source 51 cannot be photographed by the photographing unit 23 when the ultraviolet light source 51 is located behind the substrate C to be exposed, the position is obtained by photographing each calibration mark 53. And the position of the ultraviolet light source 51 can be derived from the measured position of each calibration mark 53 and the stored positional relationship between the ultraviolet light source 51 and the calibration mark 53.

  Although the first exposure drawing apparatus 2 includes a plurality of ultraviolet light sources 51, the second exposure drawing apparatus 4 does not necessarily include the plurality of ultraviolet light sources 51. The first exposure drawing apparatus 2 may be provided with a plurality of ultraviolet light sources and may draw a plurality of alignment marks M by moving the ultraviolet light sources.

  The first exposure drawing apparatus 2 includes an auto carrier hand (hereinafter referred to as AC hand) 62 that carries the substrate C to be exposed, which has been transferred by the first transfer apparatus 5, into the first exposure drawing apparatus 2. The AC hand 62 is formed in a flat plate shape, and is provided so as to be movable in the horizontal direction and the vertical direction in parallel with the horizontal plane. Further, on the lower surface of the AC hand 62, a suction mechanism having a suction part 63 that sucks and holds the substrate C to be exposed by vacuum suction by sucking air, and a vertically movable member that presses the substrate C to be exposed downward are freely movable. A pressing mechanism having a pressing portion 64 is provided.

  The AC hand 62 lifts the unexposed substrate C placed on the first transport device 5 upward by sucking and holding it with a suction mechanism, and the lifted exposed substrate C is predetermined on the upper surface of the stage 10. Place it at a different position. When the exposed substrate C is placed, the suction by the suction portion 63 is released while pressing the exposed substrate C against the stage 10 by the pressing mechanism, whereby the vacuum suction of the stage 10 works, and the exposed substrate C becomes the stage. 10 is firmly fixed.

  The AC hand 62 lifts the exposed substrate C, which has been exposed, placed on the upper surface of the stage 10 by suction and holds it by a suction mechanism, and holds the lifted exposed substrate C by suction. The substrate C to be exposed is moved to the second transfer device 6 by moving to the transfer device 6 and then releasing the suction by the suction mechanism.

  According to the substrate clamping mechanism unit 30 of the exposure drawing system 1 according to the present embodiment, the peripheral portion of the substrate C to be exposed can be reliably clamped to correct the warpage and distortion of the substrate C to be exposed, and the ultraviolet ray. In this configuration, the light source 51 and the photo sensor 59 are moved together with the clamp bars 31a to 31d, and the moving mechanism for the ultraviolet light source 51 and the photo sensor 59 is not necessary, so that the manufacturing cost of the substrate clamp mechanism 30 can be reduced.

  FIG. 8 is a schematic front view showing the configuration of the reversing mechanism in the reversing device 4 of the exposure drawing system 1 according to the present embodiment. As shown in FIG. 7, the reversing device 4 includes a roller unit 4b having a plurality of rollers 4a that sandwich the substrate C to be exposed. The roller unit 4b is supported by a support bar 4c, and rotates around a rotation shaft 5d provided at the center of the roller unit 4b while being lifted by the support bar 4c when the substrate C to be exposed is sandwiched. To do. After the roller unit 4b rotates 180 degrees, the exposed substrate C is released from the roller unit 4b, so that the front and back of the exposed substrate C are reversed. The configuration of the reversing mechanism is not limited to the above-described configuration, and a method of reversing the front and back of the exposed substrate C by lifting one end of the exposed substrate C and rotating the exposed substrate C 180 degrees, and other conventionally known methods. The method may be used.

  FIG. 9 is a configuration diagram showing an electrical system of the first exposure drawing apparatus 2 and the second exposure drawing apparatus 4 according to the present embodiment.

  As shown in FIG. 9, the first exposure drawing apparatus 2 is provided with a system control unit 70 that is electrically connected to each part of the apparatus. The system control unit 70 controls each part in an integrated manner. Yes. The system control unit 70 controls the AC hand 62 to perform a carry-in operation and a discharge operation of the substrate C to be exposed to the stage 10. Further, the system control unit 70 controls the stage driving unit 71 to move the stage 10 and adjusts the image drawing position by shooting the alignment mark M using the shooting unit 23, and the light source unit. 17 and the image processing unit 19 are controlled to cause the exposure head 16a to perform an exposure process. The operation device 73 includes a display unit and an input unit, and is operated, for example, when inputting the outer size of the substrate C to be exposed.

  The substrate placement position determination unit 72 determines the placement position of the substrate C to be exposed with respect to the stage 10 (this placement position is referred to as an appropriate placement position). In the Y direction, the alignment mark M can be positioned at the center of the imaging region by adjusting the imaging timing of the imaging unit 23, and therefore the proper placement position in the Y direction is any position on the stage 10. In this embodiment, the appropriate placement position in the X direction is set to a position where the center of the substrate C to be exposed and the center of the stage 10 coincide.

  In the substrate placement position determination unit 72, based on the information obtained by the preparatory operation performed before performing the exposure operation on the substrate C to be exposed, the proper placement position of the substrate in the X direction (appropriate alignment mark M Position). In this preparatory operation, the substrate C to be exposed is placed at an appropriate position on the stage 10 in the X direction (the center of the substrate C to be exposed coincides with the center of the stage 10 in the Y direction, and one stage 10 is opposed to the other. And the alignment mark M is photographed by the photographing unit 23 and aligned with the central position of the photographing region in the X direction. The amount of deviation from the position of the mark M is calculated, and the proper placement position of the substrate in the X direction is calculated based on this amount of deviation. In the preparation operation, an appropriate placement position can be obtained more accurately by performing this process on a plurality of (for example, five) substrates. In this preparation operation, the photographing timing of the photographing unit 23 is also determined. The calculated proper placement position information and imaging timing information of the substrate are sent to the system control unit 70 and stored in the storage means of the system control unit 70.

  Based on an instruction from the system control unit 70, the movement control unit 74 captures a plurality of alignment marks M drawn on the plurality of mark forming units 52 or the exposed substrate C when the stage 10 is moved. The movement drive of the imaging unit 23 is controlled so as to pass through each imaging region of the unit 23.

  The movement control unit 74 controls the driving of the movement units 32 a to 32 d based on instructions from the system control unit 70. The movement control unit 74 monitors a signal (substrate presence signal or substrate absence signal) from the photosensor 49 of the movement units 32a to 32d, and based on this signal, the air cylinder 41 and belt drive of the movement units 32a to 32d. The drive of the motor 75 is controlled to cause the clamp bars 31a to 31d to perform a clamp operation.

  In the movement control unit 74, the exposed substrate C is placed in the region on the stage 10 based on the substrate size information input from the operation device 73 and the proper placement position information of the substrate calculated by the preparation operation. And the moving speed of the clamp bars 31a to 31d is switched between high speed / low speed based on the estimated area. Specifically, on the stage 10, a high-speed movement is set outside a position (see FIG. 6) that is a distance L1 (for example, 40 mm) away from the periphery of the substrate C to be exposed, and a low-speed movement is set inside that position. It is set. Thereby, since the substrate C to be exposed is detected during the low-speed movement, the substrate C to be exposed can be reliably detected. Note that a position away from the periphery of the substrate C to be exposed by a distance L1 is referred to as a deceleration position (switching point). The clamp bars 31a to 31d stop at a clamp position that enters a predetermined distance (for example, 5 mm) from the position where the substrate C to be exposed is detected, and perform clamping at the clamp position. This clamping position is a position where the support columns 35 of the clamp bars 31a to 31d do not come into contact with the edge of the substrate C to be exposed.

  When the exposure substrate C is detected when the clamp bars 31a to 31d are moving at high speed, the movement control unit 74 determines that the actual substrate size is larger than the input substrate size, and clamps The movement of the bars 31a to 31d is immediately stopped and an abnormal signal is output to the system control unit 70. Upon receiving the abnormality signal, the system control unit 70 causes the display unit of the operation device 73 to display error information indicating that the substrate size is large. Instead of displaying error information, a warning sound may be generated.

  In addition, the movement control unit 74 moves the actual size of the substrate rather than the input substrate size when the clamp bars 31a to 31d move at a low speed and the low-speed movement is continued for a predetermined time without detecting the substrate C to be exposed. And the movement of the clamp bars 31a to 31d is immediately stopped and an abnormal signal is output to the system control unit 70. Upon receiving the abnormal signal, the system control unit 70 causes the display unit of the operation device 73 to display error information indicating that the substrate size is small or the substrate C to be exposed is not placed.

  FIG. 10 is a diagram showing the relationship between the moving direction of the stage 10 and the moving direction of the photographing unit 23 in the exposure / drawing system 1 according to the present embodiment. As shown in FIG. 10, the moving direction of the photographing unit 23 is a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 in the horizontal direction. When photographing the alignment mark M drawn on the plurality of ultraviolet light sources 51 or the exposed substrate C by the photographing unit 23, the position in the Y direction is controlled by moving the stage 10, and the photographing unit 23 is moved. Thus, by controlling the position in the X direction, the relative positions of the plurality of mark forming portions 52 or the alignment marks M are controlled so that they are included in the imaging region of the imaging unit 23. Note that the moving direction of the photographing unit 23 is not limited to the X direction, and it is sufficient that the alignment mark M drawn on the mark forming unit 52 or the substrate C to be exposed can be photographed, in both the X direction and the Y direction. It may be movable, or may be movable in directions other than the X direction and the Y direction.

  FIG. 11 is a diagram showing a movable range R of the ultraviolet light source 51 of the exposure drawing system 1 according to the present embodiment. As shown in FIG. 11, the ultraviolet light source 51 is configured to move linearly from the end of the stage 10 (in this embodiment, the center of the side of the stage 10) toward the center by a predetermined distance. ing. When the ultraviolet light source 51 draws the alignment mark M on the substrate C to be exposed, when the ultraviolet light source 51 generates the ultraviolet beam UV in a state where the substrate C to be exposed is placed on the stage 10, The ultraviolet light source 51 moves to a position where the alignment mark M is drawn on the end of the substrate C to be exposed. The movable range R of the ultraviolet light source 51 is not limited to this, but includes a range from the position where the alignment mark M can be drawn on the minimum size substrate to be exposed to the position of the end surface of the maximum size substrate. And good. It is desirable that the minimum range in which the alignment mark M can be drawn on the substrates of all sizes to be exposed.

  Next, the operation of this embodiment will be described.

  FIG. 12 is a flowchart showing the flow of processing of the pre-exposure processing program according to the present embodiment, and the program is stored in a predetermined area of a ROM that is a recording medium provided in the system control unit 70 of the first exposure drawing apparatus 2. Stored in advance. FIG. 13 is a schematic front view for explaining the pre-exposure processing according to the present embodiment.

  The system control unit 70 of the first exposure drawing apparatus 2 executes the pre-exposure processing program at a predetermined timing (in this embodiment, the timing at which the substrate C to be exposed is placed on the stage 10).

  When the substrate C to be exposed is placed on the stage 10, the system control unit 70 moves the position of the ultraviolet light source 51 with respect to the substrate C to be exposed in step S <b> 101. In the present embodiment, the ultraviolet light source 51 moves in conjunction with the movement of the movement units 32 a to 32 d of the substrate clamp mechanism 30. Therefore, the system control unit 70 controls the moving unit 32a to start the movement of the clamp bars 31a to 31d in the open state from the end portion of the stage 10 to the center portion and move the position of the ultraviolet light source 51. When the substrate presence signal is received from the photosensor 49, the clamp bars 31a to 31d are moved to the closed state at the received position or the position moved by a predetermined distance as received. Accordingly, the clamp bars 31a to 31d are fixed in a state where the substrate to be exposed C is sandwiched between the clamp bars 31a to 31d, and the position of the ultraviolet light source 51 is fixed accordingly.

  When the non-exposed substrate C is not sandwiched by the clamp bars 31a to 31d, or when the ultraviolet light source 51 is moved by a moving mechanism different from the clamp bars 31a to 31d, the non-exposed substrate C is placed on the stage 10. It is moved to a predetermined position before being placed.

  In step S103, the system control unit 70 images each of the calibration marks 53 corresponding to the plurality of ultraviolet light sources 51 by the imaging unit 23, and derives the position of the ultraviolet light source 51 from the captured image by the method described above. Note that the method for measuring the position is not limited to the above-described method. When the ultraviolet light source 51 can be photographed by the photographing unit 23, for example, before the exposed substrate C is placed on the stage 10, the ultraviolet light source 51 is photographed. And the method of measuring the position of the ultraviolet light source 51 from the picked-up image may be used.

  In step S105, the system control unit 70 sets a corresponding coordinate system on the stage 10 (hereinafter referred to as “stage coordinate system”), and ends the pre-exposure processing program. As shown in FIG. 13, at the stage of pre-exposure processing, each ultraviolet light source 51 is arranged at a known position in the stage coordinate system.

  The system controller 70 of the first exposure drawing apparatus 2 executes the first exposure process after the pre-exposure processing is completed and the substrate C to be exposed is placed on the stage 10. FIG. 14 is a flowchart showing a flow of processing of the first exposure processing program according to the present embodiment, and the program is a predetermined area of a ROM that is a recording medium provided in the system control unit 70 of the first exposure drawing apparatus 2. Is stored in advance. FIG. 15 is a schematic front view for explaining the first exposure process according to the present embodiment.

  In step S201, the system control unit 70 sets an image coordinate system that is a coordinate system for drawing the surface image P1 on the exposed substrate C based on the position of the ultraviolet light source 51 measured in step S103. To do. As shown in FIG. 15, at the stage of the first exposure process, the image coordinate system is set according to the position of the ultraviolet light source 51 with respect to the stage coordinate system. The position of the ultraviolet light source 51 may be introduced into an arbitrary image coordinate system.

  In step S203, the system control unit 70 moves the stage 10 to the exposure position based on the image coordinate system set in step S201. At this time, the system control unit 70 moves the stage 10 in the Y direction along the guide rail 14, and the exposure target position of the stage 10 by the exposure head 16a draws the surface image P1 on the substrate C to be exposed. The stage 10 is moved to a position that coincides with the start position of the first stage.

  In step S205, the system control unit 70 starts exposure by each exposure head 16a and draws the surface image P1 on the surface C1 of the substrate C to be exposed at a position based on the image coordinate system set in step S201. . In step S207, the system control unit 20 generates an ultraviolet beam UV from the ultraviolet light source 51, and draws the alignment mark M on the back surface C2 of the substrate C to be exposed. Note that the process for the front surface C1 of the substrate C to be exposed in step 205 and the process for the back surface C2 of the substrate C to be exposed in step S207 do not interfere with each other and can be performed in parallel. And the process of step S207 may be performed simultaneously, or the process of step S207 may be performed before the process of step S205. As shown in FIG. 15, based on the image coordinate system, the front image P1 is drawn on the front surface C1 of the substrate C to be exposed, and the alignment mark M is drawn on the back surface C2.

  In this way, by drawing the alignment mark M on the back surface C2 during the drawing process of the front surface image P1 on the front surface C1 of the substrate C to be exposed, there is no need to separately perform the processing of drawing the alignment mark M. Therefore, it is possible to secure a long holding time for printing out the alignment mark M without affecting the cycle time of the exposure drawing process, and to improve the contrast of the photographed image of the alignment mark M in the drawing process on the back surface C2. Therefore, the recognition deviation of the alignment mark M can be suppressed.

  The alignment mark M is displayed on the exposed substrate C by being baked out after being irradiated with the ultraviolet beam UV, so that the position and shape of the alignment mark M can be confirmed by photographing with the photographing unit 23. can do.

  In step S209, the system control unit 70 moves the stage 10 to the position where the substrate C to be exposed is placed, and ends the first exposure processing program. When the stage 10 moves to the placement position of the substrate C to be exposed, the substrate C to be exposed moves to the second transport device 6 by being sucked and held by the AC hand 62, and the reversing device 3 is moved by the second transport device 6. After being reversed, the front and back are reversed by the reversing device 3, and then conveyed to the second exposure drawing device 4 by the third conveying device 7.

  The system control unit 70 of the second exposure drawing apparatus 4 executes the pre-exposure processing program at a predetermined timing (in this embodiment, the timing at which the substrate C to be exposed is placed on the stage 10).

  FIG. 16 is a flowchart showing a flow of processing of the second exposure processing program according to the present embodiment, and the program is a predetermined area of a ROM that is a recording medium provided in the system control unit 70 of the second exposure drawing apparatus 4. Is stored in advance. FIG. 17 is a schematic front view for explaining the second exposure process according to the present embodiment.

  In step S301, the system control unit 70 moves the stage 10 on which the substrate C to be exposed is placed to a position where the entire alignment mark M drawn in step S207 is included in the image captured by the imaging device 23. Let At this time, the system control unit 70 moves the stage 10 along the guide rail 14 in the Y direction, and the position where the imaging unit 23 is provided and the position where the alignment mark M is provided are in the Y direction. The stage 10 is moved to a position that substantially matches at.

  Note that the imaging region by the imaging unit 23 is a region where the alignment mark M is provided on the back surface C2 of the substrate C to be exposed, and is larger than the region including the installation error of the substrate C to be exposed. As a result, even when the installation position of the substrate to be exposed C is deviated from the preset installation position, the center of the alignment mark M is photographed around the set position. If included, it is included in the imaging area of the area imaging unit 23.

  In step S <b> 303, the system control unit 70 measures the position of the alignment mark M from the captured image in which the alignment mark M is captured by the imaging unit 23. In step S305, the system control unit 70 determines a position for drawing the back surface image P2 on the back surface C2 of the substrate C to be exposed based on the position of the alignment mark M measured in step S303. Set the image coordinate system. At this time, the image coordinate system corresponds to the image coordinate system set in step S201, that is, the relative position between the position of the ultraviolet light source 51 measured in step S103 and the drawing position of the surface image C1, and the alignment. The relative position between the position of the mark M for use and the drawing position of the back image C2 is set so as to correspond to each other. As shown in FIG. 17, since the image coordinate system is set based on the position of the alignment mark M at the stage of the second exposure process, the relative position between the stage coordinate system and the image coordinate system is the first exposure. It may be different from the processing stage.

  In step S307, the system control unit 70 moves the stage 10 to the exposure position based on the image coordinate system set in step S305. At this time, the system control unit 70 moves the stage 10 in the Y direction along the guide rail 14, and the exposure target position of the stage 10 by the exposure head 16a draws the back image P2 on the substrate C to be exposed. The stage 10 is moved to a position that coincides with the start position of the first stage.

  In step S309, the system control unit 70 starts exposure by each exposure head 16a and draws the back surface image P2 on the back surface C2 of the substrate C to be exposed. As shown in FIG. 17, the back surface image P <b> 2 is drawn on the back surface C <b> 2 of the substrate C to be exposed based on the image coordinate system.

  In step S311, the system control unit 70 moves the stage 10 to a position where the substrate to be exposed C is placed, and ends the second exposure processing program. When the stage 10 moves to the placement position of the exposed substrate C, the exposed substrate C on which images are drawn on both the front surface C1 and the back surface C2 is attracted and held by the AC hand 62 to the fourth transport device 8. It moves and is transported by the fourth transport device 8.

  FIG. 18 is a schematic front view showing the relationship between the size of the substrate C to be exposed and the drawing position of the alignment mark M in the exposure drawing system 1 according to the present embodiment. In the present embodiment, when the clamp bars 31a to 31d are moved by the moving units 32a to 32d of the substrate clamping mechanism section 30, the ultraviolet light source 51 is moved in conjunction with the movement. Therefore, as shown in FIG. 18, the photosensor 49 detects the end of the substrate C to be exposed and the clamp bars 31a to 31d fix the ends of the substrate C to be exposed, so that the ultraviolet light source 51 is automatically provided. Is fixed to a position where the end of the substrate C to be exposed is irradiated with the ultraviolet beam UV. Further, the positional relationship between the positions of the clamp bars 31a to 31d and the ultraviolet light source 51 can be freely designed. Therefore, in the present embodiment, the alignment mark M can be drawn at a predetermined position on the substrate C to be exposed without depending on the size of the substrate C to be exposed.

  Note that the method of measuring the position of the ultraviolet light source 51 in step S103 differs depending on the required measurement accuracy, and the moving units 32a to 32d of the substrate clamp mechanism unit 30 are provided with stepping motors, which are measured by the pulses of the stepping motor. Also good. Alternatively, the moving units 32a to 32d may include a rotary encoder, and the position may be measured by a pulse of the rotary encoder. Alternatively, an optical distance sensor or a distance sensor using ultrasonic waves may be provided in any part of the first exposure drawing apparatus 2, and the position may be measured by these distance sensors.

  In this embodiment, two or more circular calibration marks 53 are provided, and the position of the ultraviolet light source 51 is derived from the positional relationship between the two or more calibration marks 53 and the ultraviolet light source 51. The shape and number of the calibration marks 53 are not limited to this, and the shape of the calibration marks can be arbitrarily set. Further, when the shape of the calibration mark 53 is a mark indicating the position of an arrow mark or the like and the direction of the ultraviolet light source 51, the calibration mark 53 is provided even if only one calibration mark 53 is provided. The position of the ultraviolet light source 51 can be derived from the position and direction of the mark 53.

  Further, when the position of the ultraviolet light source 51 is measured by the amount of deviation from the theoretical value of the position of the ultraviolet light source 51 in the captured image, it is preferable that the ultraviolet light source 51 is within the focal depth of the imaging unit 23. If not within the focal depth of the imaging unit 23, the height of the stage 10 (position in the Z direction) may be changed so that the ultraviolet light source 51 is located within the focal depth of the imaging unit 23.

  In this embodiment, two alignment marks M are drawn. However, the present invention is not limited to this, and the number of alignment marks M may be arbitrarily set as long as it is two or more. As the number of alignment marks M increases, the alignment accuracy on the front and back of the substrate C to be exposed can be improved.

  In this embodiment, the alignment mark M is drawn on the substrate C to be exposed using the ultraviolet light source 51. However, the present invention is not limited to this, and the drawing may be performed by spraying or transferring ink.

  In the present embodiment, the ultraviolet light source 51 is provided so as to be movable in the X direction or the Y direction. However, the present invention is not limited to this, and an ultraviolet light source that can move in any direction may be used. Further, the moving path of the ultraviolet light source may be a path crossing the central portion of the substrate C to be exposed or a path crossing an arbitrary position of the substrate C to be exposed.

  In the present embodiment, the ultraviolet light source 51 is moved in conjunction with the moving units 32a to 32d of the clamp mechanism unit 30, but the present invention is not limited to this, and the ultraviolet light source 51 is individually moved by a moving mechanism constituted by a motor or the like. You may let them. In this case, the size of the substrate C to be exposed and the placement position on the stage 10 are stored in advance, and the ultraviolet light source 51 moves to a predetermined position according to the stored size and placement position. It is good to be set as follows.

  If the drawing of the front surface image P1 fails in step S205, the processing in step S209 is preferably performed without performing the processing in step S207 (drawing processing of the alignment mark M). In this case, since the alignment mark M is not drawn on the exposed substrate C for which the drawing of the front image P1 has failed, the user confirms the presence or absence of the alignment mark M for each exposed substrate C. By doing so, it is possible to determine whether the drawing of the front image P1 has succeeded or failed.

  DESCRIPTION OF SYMBOLS 1 ... Exposure drawing system, 2 ... 1st exposure drawing apparatus, 3 ... Inversion apparatus, 4 ... 2nd exposure drawing apparatus, 5 ... 1st conveying apparatus, 6 ... 2nd conveying apparatus, 7 ... 3rd conveying apparatus, 8 ... 4th conveying apparatus, 10 ... stage, 23 ... imaging | photography part, 30 ... board | substrate clamp mechanism part, 31a thru | or 31d ... clamp bar, 32a thru | or 32d ... moving unit, 51 ... ultraviolet light source, 52 ... mark formation part, 53 ... for calibration Mark 70... System control unit 74. Movement drive unit C C. Substrate to be exposed C 1. Front surface C 2 Back surface M alignment mark P 1 Front image P 2 Back image UV UV beam.

Claims (12)

First exposure means for drawing a circuit pattern on the first surface by exposing a first surface of a printed wiring board placed on a stage;
It is provided so as to be movable relative to the stage, and is predetermined on a second surface opposite to the first surface during the drawing process of the circuit pattern for the first surface on the first surface of the printed wiring board. Mark forming means for forming a plurality of marks;
Measuring means for measuring the position of the mark forming means;
Detecting means for detecting positions of a plurality of marks formed on the second surface of the printed wiring board by the mark forming means;
The second surface of the printed circuit board is exposed to the second surface by using the position of the mark forming unit measured by the measuring unit and the position of the plurality of marks detected by the detecting unit as a reference. A second exposure means for drawing a circuit pattern;
An exposure drawing apparatus comprising: The mark forming means is configured to be in a predetermined direction with respect to any one side of the printed wiring board placed on the stage and at least one direction intersecting the predetermined direction. The exposure drawing apparatus according to claim 1, wherein the exposure drawing apparatus is movably provided. The exposure drawing apparatus according to claim 1, wherein the mark forming unit has a movable range within which the mark can be formed on a plurality of types of printed wiring boards having different sizes. Further comprising a specifying means for specifying the size of the printed wiring board;
The exposure drawing apparatus according to any one of claims 1 to 3, wherein the mark forming unit forms each of the plurality of marks according to a size specified by the specifying unit. 5. The exposure according to claim 1, wherein the measuring unit includes a photographing unit that photographs the mark forming unit, and measures each position of the mark forming unit using an image captured by the photographing unit. Drawing device. The mark forming means is formed at a position where a calibration mark at a known relative position with respect to the mark forming means can be photographed by the measuring means even when the printed wiring board is placed on the stage. And
The measuring unit includes an imaging unit that images the mark forming unit so that each of the calibration marks is captured, and measures the position of each of the mark forming units using an image captured by the imaging unit. Item 5. The exposure drawing apparatus according to any one of Items 1 to 4.   The mark forming means is a position where a plurality of calibration marks at known relative positions with respect to the mark forming means can be photographed by the measuring means even when the printed wiring board is placed on the stage. Formed,
  The measuring means includes a photographing means for photographing the mark forming means so that each of the plurality of calibration marks is photographed, and measures each position of the mark forming means using a photographed image by the photographing means. Do
  The exposure drawing apparatus according to any one of claims 1 to 4. The exposure drawing apparatus according to any one of claims 5 to 7 , wherein a plurality of the photographing units are provided, and each of the photographing units photographs one or more of the mark forming units. The imaging means is at a position a known relationship with a circuit pattern is drawn, the exposure drawing device according to any one of claims 5 to 8 is provided to be movable relative to the stage. The exposure drawing apparatus according to any one of claims 1 to 9 , wherein the mark forming unit forms the mark by exposing the second surface of the printed wiring board with light having a short wavelength. The mark forming means, exposure drawing device according to any one of claims 1 to 10 to form a plurality of marks by the deposition of ink on the second surface of the printed wiring board. A first exposure unit configured to draw a circuit pattern on the first surface by exposing a first surface of a printed wiring board placed on the stage; and a first exposure unit configured to be movable relative to the stage. Mark forming means for forming a plurality of predetermined marks on a second surface opposite to the first surface; measuring means for measuring the position of the mark forming means; and the second of the printed wiring board by the mark forming means. An exposure device comprising: detection means for detecting positions of a plurality of marks formed on the surface; and second exposure means for drawing a circuit pattern on the second surface by exposing the second surface of the printed wiring board. An exposure drawing method in a drawing apparatus,
A first step of controlling the measuring means so that the position of the mark forming means is measured;
A second step of moving the mark forming means to a predetermined position;
A circuit pattern for the first surface is drawn on the first surface of the printed wiring board, and a plurality of patterns are formed on the second surface in correspondence with the circuit pattern for the first surface during the drawing process of the circuit pattern. A third step of controlling the first exposure means and the mark formation means so that a mark is formed;
The circuit pattern for the second surface is drawn on the second surface based on the position of the mark forming unit measured by the measuring unit and the position of the plurality of marks detected by the detecting unit. A fourth step of controlling the second exposure means;
An exposure drawing method comprising:

Images