TW201339767A - Exposure lithography device and exposure lithography method - Google Patents

Abstract

An exposure lithography device is provided, which includes: a first exposure mechanism which lithographs a circuit pattern on a first surface of a printed circuit board by exposing the first surface of the printed circuit board disposed at a stage; a mark forming mechanism which is movably disposed relative to the stage, and the mark forming mechanism forms a plurality of pre-determined marks on a second surface opposite to the first surface during a lithography process of the circuit pattern for the first surface on the first surface of the printed circuit board; a measuring mechanism which measures the position of the mark forming mechanism; testing mechanism which tests the position of the plurality of marks forming mechanism on the second surface; and a second exposure mechanism which lithographs the circuit pattern on the second surface by exposing the second surface of the printed circuit board based on the measured position of the mark forming mechanism and the measured position of the plurality of marks.

Description

Exposure lithography imaging device and exposure lithography imaging method

The present invention relates to an exposure lithography apparatus and an exposure lithography method, and more particularly to an exposure lithography apparatus and an exposure lithography method for lithographically imaging an image on a substrate.

In recent years, as an exposure lithography apparatus in which a planar substrate is used as an exposed substrate to form a circuit pattern, an exposure lithography in which a lithographic light is directly irradiated onto a substrate without using a transfer mask to lithographically pattern the circuit pattern has been developed. Device. However, in the case where the circuit pattern is lithographically applied to a substrate requiring high resolution, there is a case where dust adhering to the hole processing and dust adhering to the hole during the movement may fall onto other substrates, or Heating of the processing such as resist coating causes deformation of the periphery of the hole. In this case, the relative position of the circuit pattern on the first surface of the substrate and the circuit pattern on the second surface is shifted.

On the other hand, there has been proposed an exposure lithography apparatus in which a mark for alignment required for lithography of a circuit pattern is lithographically incident on the first surface and the second surface of the substrate to be exposed. As a technique for the exposure lithography apparatus, in Japanese Patent Laid-Open No. 2008-292915 Japanese Laid-Open discloses an exposure lithography apparatus that lithographically marks a first alignment mark and a second alignment mark on a first surface and a second surface of an exposed substrate. The exposure lithography apparatus microscopically patterns the circuit pattern on the first surface and the second surface of the substrate in accordance with the first and second alignment marks. Further, in the specification of US Pat. No. 6,701,197 B2, an exposure lithography apparatus is disclosed which uses a fixed ultraviolet light source in a known positional relationship with a stage to be exposed to the first side of the substrate to be exposed. At the same time, marks for alignment are formed on the second surface.

In the exposure lithography apparatus disclosed in Japanese Laid-Open Patent Publication No. 2008-292915, it is necessary to form a mark for alignment before lithography. Therefore, there is a problem that the cycle time is affected by the baking time. Further, there is a problem in that it is necessary to correct the positional deviation of the mark measurement for alignment between the first surface and the second surface. Further, there is a problem in that it is necessary to have a device configuration in which the markings for alignment are formed on both the first surface and the second surface.

Further, in the exposure lithography apparatus disclosed in the specification of U.S. Patent No. 6,701,197 B2, the position at which the mark for alignment is lithographically fixed to the substrate to be exposed is fixed. Therefore, in the case of exposing each of a plurality of substrates having different sizes, it is impossible to lithographically mark the alignment at an optimum position corresponding to the size of the substrate to be exposed. As a result, there is a problem that the alignment accuracy may be lowered due to the size of the substrate.

The present invention has been made in view of the above problems, and provides an exposure microscopic which can improve the alignment accuracy of the front and back of an exposed substrate without depending on the size of the substrate to be exposed. Shadow device and exposure lithography method.

The exposure lithography apparatus of the present invention includes: a first exposure mechanism that performs lithography on the first facing circuit pattern by exposing a first surface of a printed wiring board (PCB) placed on a stage The mark forming mechanism is provided so as to be relatively movable on the platform, and in the lithography of the circuit pattern for the first surface of the first surface of the printed wiring board, the second surface opposite to the first surface Forming a plurality of predetermined marks; measuring means for measuring a position of the mark forming means; and detecting means for detecting a position of the plurality of marks formed on the second surface of the printed wiring board by the mark forming means And a second exposure mechanism that uses the position of the mark forming mechanism measured by the measuring means and the position of the plurality of marks detected by the detecting means as a reference to the second surface of the printed wiring board Exposure is performed to perform lithography on the second facing circuit pattern.

According to the exposure lithography apparatus, the first surface of the printed wiring board placed on the stage is exposed by the first exposure mechanism, and the first facing circuit pattern is subjected to lithography. Further, according to the exposure lithography apparatus, the lithography process for the circuit pattern for the first surface of the first surface of the printed wiring board is performed by a mark forming mechanism that is relatively movable with respect to the stage. A predetermined plurality of marks are formed on the second surface opposite to the first surface. Further, according to the exposure lithography apparatus, the position of the mark forming mechanism is measured by a measuring mechanism. Further, according to the exposure lithography apparatus, the detecting means is used for the mark forming mechanism The position of the plurality of marks formed on the second surface of the printed wiring board is detected.

Here, in the second exposure mechanism, the position of the mark forming mechanism measured by the measuring means and the position of the plurality of marks detected by the detecting means are used as a reference for the printed wiring board. The second surface is exposed. Thereby, lithography is performed on the second facing circuit pattern.

In other words, in the present embodiment, the position of the mark forming mechanism is measured, and the position of the second surface having a known relationship with the exposure position of the circuit pattern for the first surface is formed in advance by the mark forming mechanism. Marks. Further, when the circuit pattern for the second surface is exposed on the second surface, the circuit pattern for the second surface is lithographically based on the position of the mark forming mechanism and the position of the plurality of marks. Thereby, the position of the circuit pattern on the first surface and the second surface can be made to correspond. In addition, the above-mentioned "micro-shadow processing" refers to a series of processes from when the printed wiring board is placed on the stage, until the lithography of the circuit pattern is completed, and the printed wiring board is discharged.

As described above, according to the exposure lithography apparatus of the present invention, the position of the circuit pattern on the second surface can be made to correspond to the position of the circuit pattern on the first surface of the second surface, wherein the circuit pattern of the second surface is The lithography is performed on the first surface of the circuit pattern at a position of a plurality of marks having a known positional relationship as a reference for lithography. As a result, the alignment accuracy of the front and back of the substrate to be exposed can be improved without depending on the size of the substrate to be exposed.

Further, in the invention, the mark forming mechanism may be movably provided with respect to at least one of two directions, wherein the two directions are placed The predetermined direction of the printed wiring board on the platform is a predetermined direction and a direction intersecting the predetermined direction. Thereby, the position at which a plurality of marks are formed at an appropriate position can be adjusted.

Further, in the present invention, the mark forming means may have a movable range as a range in which the mark can be formed with respect to a plurality of types of printed wiring boards having different sizes. Thereby, a plurality of marks can be formed at appropriate positions without depending on the size of the substrate.

Furthermore, the present invention may further include a predetermined mechanism that defines a size of the printed wiring board, and the mark forming means forms each of the plurality of marks in accordance with a size defined by the predetermined mechanism. Thereby, a plurality of marks can be formed at appropriate positions corresponding to the size of the substrate.

Further, in the invention, the measuring means may include an image capturing means for photographing the mark forming means, and the respective positions of the mark forming means are measured using the captured image obtained by the image forming means. Thereby, the position of the mark forming mechanism can be simply measured.

Further, in the invention, the mark forming means forms the correction mark at a known relative position with respect to the mark forming means at a position so that the printed wiring board can be placed in the state of the stage, The measuring means includes a photographing means for photographing the position at which the photographing means performs photographing, wherein the photographing means photographs the mark forming means so that the respective calibration marks are photographed, and the measuring means uses the photographing means The photographic image measures the respective positions of the mark forming mechanisms described above. Thereby, even in the case where the marking forming mechanism cannot be photographed, the marking forming mechanism can be measured. s position.

Further, in the invention, a plurality of the photographing means may be provided, and each of the photographing means photographs one or more of the mark forming means. Thereby, the position of the mark forming mechanism can be simply measured.

Further, in the present invention, the photographing mechanism may be in a known relationship with the position where the circuit pattern has been micro-shadowed, and is movably provided with respect to the platform. Thereby, the position of the mark forming mechanism can be measured without depending on the position of the mark forming mechanism.

Further, in the invention, the mark forming means may form the mark by exposing the second surface of the printed wiring board to light of a short wavelength. Thereby, a plurality of marks can be formed at an appropriate position with high precision.

Further, in the invention, the mark forming means may form the plurality of marks by adhering ink to the second surface of the printed wiring board. Thereby, a plurality of marks can be formed simply.

The exposure lithography method of the present invention is an exposure lithography method of an exposure lithography apparatus, and the exposure lithography apparatus includes: a first exposure mechanism that exposes a first surface of a printed wiring board placed on a stage The first surface is lithographically facing the circuit pattern; the mark forming mechanism is relatively movable with respect to the stage, and a predetermined plurality of marks are formed on the second surface opposite to the first surface; and the measuring means forms the mark The position of the mechanism is measured; the detecting means detects a position of the plurality of marks formed on the second surface of the printed wiring board by the mark forming means; and the second exposure means comprises the printed wiring board Exposing the second surface to the second facing circuit pattern by lithography, the exposure lithography method comprising the steps of: controlling the position of the mark forming mechanism to control the measuring mechanism; The mark forming mechanism moves to a predetermined position; the circuit pattern for the first surface facing the first surface of the printed wiring board is lithographically formed, and the lithography of the circuit pattern is used for the first surface Correspondingly, a plurality of marks are formed on the second surface to control the exposure mechanism and the mark forming mechanism; and the position of the mark forming mechanism measured by the measuring mechanism and detected by the detecting mechanism The position of the plurality of marks is used as a reference, and the second exposure means is controlled such that the second second surface facing the second surface is lithographically patterned.

According to the exposure lithography method of the present invention, since the exposure lithography method functions in the same manner as the exposure lithography apparatus of the present invention, the exposed substrate can be improved without depending on the size of the substrate to be exposed. The alignment accuracy of the back of the watch.

According to the present invention, the alignment accuracy of the front and back of the substrate to be exposed can be improved without depending on the size of the substrate to be exposed.

1‧‧‧Exposure lithography system

2‧‧‧1st exposure lithography device

3‧‧‧Reversal device

4‧‧‧2nd exposure lithography device

4a‧‧‧Roller

4b‧‧‧Roller unit

4c‧‧‧Support bar

4d‧‧‧Rotary axis

5‧‧‧1st transport department

6‧‧‧Second Transport Department

7‧‧‧3rd Transport Department

8‧‧‧4th Transport Department

10‧‧‧ platform

11‧‧‧ base

12‧‧‧Abutment

13‧‧‧Mobile Agency

14‧‧‧ rails

15, 22‧‧ ‧ gate

16‧‧‧Exposure Department

16a‧‧‧Exposure head

17‧‧‧Light source unit

18‧‧‧Fiber

19‧‧‧Image Processing Unit

20‧‧‧Signal cable

23‧‧‧Photography Department

23a‧‧‧Guide

30‧‧‧Substrate clamping mechanism

31a~31d‧‧‧Pinch

32a~32d‧‧‧Mobile unit

33‧‧‧Clamps

34‧‧‧knife

35‧‧‧Support column

37‧‧‧ inserted through hole

40‧‧‧Support board

41‧‧‧Air cylinder

42‧‧‧ piston rod

44‧‧‧ drive pulley

45‧‧‧driven pulley

46‧‧‧ Timing belt

47‧‧‧Belt drive motor

48‧‧‧Installation Department

49‧‧‧Photosensor (substrate edge sensor)

50‧‧‧ sloped surface

51‧‧‧UV light source

52‧‧‧Marking Department

53‧‧‧ calibration mark

62‧‧‧AC palm

63‧‧‧Adsorption Department

64‧‧‧Extrusion Department

70‧‧‧System Control Department

71‧‧‧ Platform Drive Department

72‧‧‧Substrate placement position determination unit

73‧‧‧Operating device

74‧‧‧Mobile Control Department

C‧‧‧ exposed substrate

C1‧‧‧ Surface of exposed substrate C

C2‧‧‧Back of the exposed substrate C

L1‧‧‧ distance

M‧‧‧marks for alignment

P1‧‧‧ Surface image

P2‧‧‧Back image

R‧‧‧ movable range of ultraviolet light source 51

S101~S105, S201~S209, S301~S311‧‧‧ steps

UV‧‧‧UV

X, Y, Z, θ‧‧‧ directions

Fig. 1 is a configuration diagram showing an overall configuration of an exposure lithography system according to an embodiment.

Fig. 2 is a block diagram showing the function of the exposure lithography system of the embodiment.

3A is a front elevational view showing an example of the surface when the surface of the substrate to be exposed is exposed by the exposure lithography system of the embodiment.

3B is a front view showing an example of the back surface in the case where the back surface of the substrate to be exposed is exposed by the exposure lithography system of the embodiment.

4 is a perspective view showing a configuration of a first exposure lithography apparatus and a second exposure lithography apparatus according to the embodiment.

Fig. 5 is an exploded perspective view showing a substrate clamping mechanism portion of the first exposure lithography apparatus and the second exposure lithography apparatus according to the embodiment.

Fig. 6 is an enlarged cross-sectional view showing the function of the photosensor of the first exposure lithography apparatus and the second exposure lithography apparatus according to the embodiment.

Fig. 7A is an enlarged cross-sectional view showing main parts of a mark forming unit of the first exposure lithography apparatus and the second exposure lithography apparatus according to the embodiment.

FIG. 7B is an enlarged plan view of a main part for explaining a mark forming portion of the first exposure lithography apparatus and the second exposure lithography apparatus according to the embodiment.

8 is a schematic side elevational view showing the configuration of an inversion mechanism in the inversion device of the exposure lithography system according to the embodiment.

9 is a configuration diagram showing an electrical system of a first exposure lithography apparatus and a second exposure lithography apparatus according to the embodiment.

Fig. 10 is a view showing a relationship between a moving direction of a stage and a moving direction of a photographing unit in the exposure lithography system according to the embodiment;

Fig. 11 is a view showing a movable range of an ultraviolet light source of the exposure lithography system of the embodiment.

Fig. 12 is a flow chart showing the flow of processing of the pre-exposure processing program of the embodiment.

Fig. 13 is a schematic front view for explaining pre-exposure processing in the embodiment.

Fig. 14 is a flowchart showing the flow of processing of the first exposure processing program in the embodiment.

Fig. 15 is a schematic front view for explaining a first exposure process in the embodiment.

Fig. 16 is a flowchart showing the flow of processing of the second exposure processing program in the embodiment.

Fig. 17 is a schematic front view for explaining a second exposure process in the embodiment.

Fig. 18 is a schematic front elevational view showing the relationship between the size of the substrate to be exposed and the lithography position of the mark for alignment in the exposure lithography system of the embodiment.

Hereinafter, the exposure lithography system of the present embodiment will be described in detail using the drawings. In the present embodiment, the exposure lithography system 1 is described as an example in which a flat substrate such as a printed wiring board, a printed circuit board, or a flat glass substrate for a flat panel is used as an exposed substrate, and the first substrate to be exposed is used. Exposure lithography is performed on both the surface (hereinafter also referred to as "surface") and the second surface (hereinafter also referred to as "back surface").

Fig. 1 is a configuration diagram showing an overall configuration of an exposure lithography system 1 of the present embodiment. 2 is a block diagram showing the function of the exposure lithography system 1 of the embodiment. As shown in FIGS. 1 and 2, the exposure lithography system 1 includes a first exposure lithography apparatus 2 that exposes the surface of the substrate to be exposed and forms alignment on the back surface of the substrate to be exposed. mark. Further, the first exposure lithography apparatus 2 has a position on the ultraviolet light source 51 to be described later before forming the mark for alignment. Set to take measurements. Moreover, the exposure lithography system 1 includes an inversion device 3 that inverts the front and back of the substrate to be exposed. Further, the exposure lithography system 1 includes a second exposure lithography apparatus 4 that exposes the back surface of the substrate to be exposed. Further, the exposure lithography system 1 includes the first transfer unit 5 that transports the substrate to be exposed from the outside of the device to the first exposure lithography device 2, and the substrate to be exposed from the first exposure lithography device 2 to the reversing device. The second transport unit 6 of 3. Further, the exposure lithography system 1 includes a third transport unit 7 that transports the substrate to be exposed from the inverting device 3 to the second exposure lithography device 4, and transports the substrate to be exposed from the second exposure lithography device 4 to the device. The fourth fourth transport unit 8 is external.

3A is a front view showing an example of the surface C1 when the surface C1 of the substrate C to be exposed is exposed, and FIG. 3B is an example of the back surface C2 when the back surface C2 of the substrate C to be exposed is exposed. Front view.

As shown in FIG. 3A, on the surface C1 of the substrate C to be exposed, the surface image P1 is lithographically imaged by the first exposure lithography apparatus 2. Further, as shown in FIG. 3B, on the back surface C2 of the substrate C to be exposed, the second exposure lithography apparatus 4 and the coordinate system which is lithographic with the surface image P1 of the surface C1 (hereinafter referred to as "picture" The image coordinate system corresponding to the coordinate system ") causes the image P2 on the back side to be lithographic. Further, in the present embodiment, the surface image P1 is an image of the "F" shape. Further, in the present embodiment, the back surface image P2 is an image of a rectangular frame shape surrounding a region of the back surface C2 corresponding to the image of the "F" shape of the surface C1. Further, on the back surface C2 of the substrate C to be exposed, the upper center side and the front side are viewed as the lower center side as viewed from the front, and a plurality of (two in the present embodiment) alignment marks M are used by the first exposure lithography apparatus. 2 was lithographed. The alignment mark M is used to lithographically respectively on the exposed substrate C. The surface of the surface C1 and the back surface C2 corresponds to the position of the image P1 and the position of the back surface image P2.

In the exposure lithography system 1 of the present embodiment, the first exposure lithography apparatus 2 is provided on the upstream side in the transport direction of the substrate C to be exposed. When the unexposed substrate C to be exposed is carried into the apparatus, the first exposure lithography apparatus 2 exposes the surface C1 of the substrate C to be exposed and lithographically forms the surface image P1 on the surface as described above. Further, the first exposure lithography apparatus 2 forms an alignment mark M on the back surface C2 of the substrate C to be exposed.

In the exposure lithography system 1 of the present embodiment, the alignment mark M is lithographically formed in a circular shape of about φ 0.5 mm to φ 1 mm. However, the size or shape is not limited to this. For example, the size may be any size that does not overlap with the lithography of the surface image P1 and the back surface image P2, and the shape may be arbitrarily set to a cross shape or a rectangular shape.

On the downstream side in the transport direction of the substrate C to be exposed of the first exposure lithography apparatus 2, an inversion device 3 that reverses the front and back of the substrate C to be exposed is provided. When the exposed substrate C on which the surface C1 is exposed and the lithography is aligned by the first exposure lithography apparatus 2 is carried in, in order to expose the back surface C2 of the substrate C to be exposed in the next process, The rotating device 3 reverses the front and back of the substrate C to be exposed.

On the downstream side in the transport direction of the substrate C to be exposed of the inverting device 3, a second exposure lithography apparatus 4 that exposes the back surface C2 of the substrate C to be exposed is provided. When the exposed substrate C that has been inverted by the inversion device 3 is carried into the device, the second exposure lithography device 4 exposes the back surface C2 of the substrate C to be exposed to the back surface. Image P2 is lithographic. At this time, the second exposure lithography apparatus 4 performs alignment by using the mark M for lithography which is lithographically incident on the substrate C to be exposed by the first exposure lithography apparatus 2, and then exposes the back surface C2.

Each of the first conveying device 5, the second conveying device 6, the third conveying device 7, and the fourth conveying device 8 has a plurality of rotating rollers and a driving motor that rotates the rotating rollers. A plurality of rotating rollers are laid in parallel, and a sprocket or a pulley that receives a rotational force transmitted by a belt or a wire is attached to one end of the rotating roller. As a mechanism for transmitting the rotational force of the drive motor that rotates the rotary roller, a transfer method by a cylindrical magnet may be employed in addition to the belt or the wire.

Further, in the present embodiment, in order to increase the throughput (production amount per unit time) of the substrate C to be exposed, two exposure lithography apparatuses such as the first exposure lithography apparatus 2 and the second exposure lithography apparatus 4 are used. The surface C1 and the back surface C2 of the substrate C to be exposed are exposed. However, the number of the exposure lithography apparatuses is not limited to two, and one exposure lithography apparatus may be used to invert the exposed substrate C from both the surface C1 to the back surface C2 while microscopically exposing both sides of the exposed substrate C. Shadow.

Next, the configuration of the first exposure lithography apparatus 2 and the second exposure lithography apparatus 4 will be described.

4 is a perspective view showing a configuration of the first exposure lithography apparatus 2 and the second exposure lithography apparatus 4 of the embodiment. Hereinafter, the direction in which the stage 10 moves is defined as the Y direction, the direction orthogonal to the horizontal plane in the Y direction is defined as the X direction, and the direction orthogonal to the vertical direction in the Y direction is defined as the Z direction, and further Z axis is The direction of rotation of the center is defined as the θ direction.

As shown in FIG. 4, the first exposure lithography apparatus 2 includes a flat plate 10 for fixing the substrate C to be exposed. The stage 10 is movably configured, and the exposed substrate C fixed to the stage 10 moves the exposed substrate C to the exposure position with the movement of the stage 10, and the exposed portion 16 is irradiated with a light beam to be exposed on the surface of the exposed substrate C. The lithography is performed using the image C1.

The platform 10 is supported by a flat base 12 which is movably disposed on the upper surface of the table-shaped base 11. Further, a moving mechanism portion 13 having a movement driving mechanism (not shown) including a motor or the like is provided between the base 12 and the stage 10. The platform 10 is rotationally moved in the θ direction with respect to the base 12 with the vertical line of the center portion of the platform 10 as a central axis by the moving mechanism portion 13.

One or a plurality of (two in the present embodiment) guide rails 14 are provided on the upper surface of the base 11. The base 12 is movably supported by the guide rail 14, and is moved by a platform drive unit (a platform drive unit 71 to be described later) including a motor or the like. Moreover, the platform 10 is moved along the guide rail 14 by being supported on the upper surface of the movable base 12.

On the upper surface of the base 11, a gate type gate 15 is erected so as to straddle the guide rail 14, and the exposure portion 16 is attached to the gate 15. The exposure unit 16 includes a plurality of (sixteen in the present embodiment) exposure heads 16a, and is fixedly disposed on the movement path of the stage 10. An optical fiber 18 drawn from the light source unit 17 and a signal cable 20 drawn from the image processing unit 19 are connected to the exposure unit 16, respectively.

Each of the exposure heads 16 has a digital position as a reflective spatial light modulation mechanism Digital micromirror device (DMD). Further, each of the exposure heads 17 controls the DMD based on the image data input from the image processing unit 19, thereby modulating the light beam from the light source unit 17. Each of the exposure heads 16 is exposed by the first exposure lithography apparatus 2 by irradiating the light beam onto the substrate C to be exposed placed on the stage 10. Further, a transmissive spatial light modulation mechanism such as a liquid crystal may be used as the spatial light modulation mechanism.

On the upper surface of the base 11, the gate 22 is further provided so as to straddle the guide rail 14. One or a plurality of (two in the present embodiment) imaging units 23 for photographing the substrate C to be exposed placed on the stage 10 are attached to the gate electrode 22. The photographing unit 23 is a charge coupled device (CCD) camera or the like that incorporates a strobo having a very short lighting time. The photographing unit 23 is provided to photograph the mark M for alignment, and the mark M for alignment is lithographically formed on the mark forming portion 52 and the substrate C to be exposed, which will be described later. Further, a guide portion 23a for guiding the movement of the imaging unit 23 in the X direction is provided on the gate 22. Further, each of the image capturing units 23 is guided by the guiding portion 23 to move in the X direction. Further, the relative position of the photographing unit 23 with respect to the stage 10 is measured based on the movement of the stage 10 or the photographing unit 23, and is stored in the memory mechanism of the system control unit 70. In the case where the ultraviolet light source 51 in the mark forming portion 52 is imaged, the ultraviolet light source 51 is imaged while the exposed substrate C is not placed on the stage 10.

The first exposure lithography apparatus 2 derives the position of the exposed substrate C of the ultraviolet light source 51 based on the image obtained by imaging the marker forming unit 52 by the imaging unit 23. In addition, the second exposure lithography apparatus 4 is aligned in accordance with the photographing section 23 The image obtained by the use of the mark M is compared with the position of the ultraviolet light source 51 of the first exposure lithography apparatus 2, and the position shift amount (the amount of shift in the X direction, the Y direction, and the θ direction) is detected. The information on the positional shift amount of the mark M for alignment is used for the correction of the position of the surface image P1 on the surface C1 of the substrate C to be exposed and the image P2 on the back surface of the back surface C2.

In addition, it is preferable to provide the imaging unit 23 in a number corresponding to the number of the marker forming portions 52 (or the number of the alignment markers M) to be described later. However, the present invention is not limited thereto, and one imaging unit 23 may be provided, and the plurality of mark forming portions 52 or the plurality of alignment marks M may be imaged by moving the imaging portion 23.

Further, on the upper surface of the stage 10, a substrate clamping mechanism portion for fixing the end portion of the substrate C to be exposed to the stage 10 is provided.

FIG. 5 is an exploded perspective view of the substrate clamping mechanism unit 30 of the first exposure lithography apparatus 2 and the second exposure lithography apparatus 4 of the embodiment. As shown in FIG. 5, the substrate clamping mechanism portion 30 includes a pair of clamp bars 31a, 31b which are sandwiched from above by sandwiching one of the opposite sides of the substrate C to be exposed. Tight end. Further, the substrate clamping mechanism portion 30 includes a pair of clamping bars 31c and 31d that clamp the end portions from above on the horizontal surface of the exposed substrate C so as to sandwich the other opposite side. Further, the substrate clamping mechanism unit 30 includes moving units 32a to 32d that move the clips 31a to 31d in parallel in the horizontal direction. The clamp levers 31a to 31d are respectively disposed on the upper surface of the stage 10, and the moving units 32a to 32d are disposed below the platform 10.

In the present embodiment, the clamp bars 31a and 31b are elongated in the Y direction and The clamp levers 31c and 31d are elongated in the X direction and opposed to each other in the Y direction, respectively, in the X direction. The clamp levers 31a and 31b are configured to have a length shorter than the lengths of the clamp lever 31c and the clamp lever 31d, and do not interfere with each other even when the size of the exposed substrate C is small.

In the present embodiment, the clamp lever 31a includes a clamp holder 33 made of metal (for example, made of aluminum). Further, the clamp bar 31a includes a resin blade 34 that is fixed to an inner region (a center side region of the stage 10) of the lower surface of the gripper 33 and that is in contact with the surface C1 of the substrate C to be exposed. Further, the clamp lever 31a includes two support posts 35 provided on an outer region (outer region of the stage 10) of the lower surface of the gripper 33. One or more of the sides of the platform 10 are formed at predetermined intervals on each side so as to penetrate the front and back directions of the platform 10 (in this embodiment, three (12 in total) are formed on each side. An insertion hole 37 extending in the Y direction or the X direction. Further, the two support posts 35 of the clamp lever 31a are inserted into the two insertion holes 37 of the three insertion holes 37 on the respective sides. The clamp lever 31b to the clamp lever 31d also have the same configuration as the clamp lever 31a.

The moving unit 32a includes a support plate 40 that supports the two support columns 35, and an air cylinder 41 that slides the support plate 40 in the Z direction. The front end of the piston rod 42 of the air cylinder 41 is fixed to the lower surface of the support plate 40. The air cylinder 41 lowers and raises the piston rod 42 by a drive unit including a motor or the like. The movable range of the piston rod 42 is limited, and stops at a predetermined position when rising when descending.

When the piston rod 42 is lowered, the clamp rod 43a is lowered together with the piston rod 42, and the clamp rod 31a is pressed to the stage 10. Here, the exposed substrate is placed on the platform 10 In the case of C, the substrate C to be exposed is clamped by the chuck 31a. On the other hand, when the piston rod 42 is raised, the clamp lever 31a rises together with the piston rod 42, and the clamp lever 31a is spaced apart from the stage 10 in the Z direction. The distance between the clamp bar 31a and the stage 10 is larger than the thickness of the substrate C to be exposed. A state in which the clamp lever 31a when the clamp lever 31a is pressed to the stage 10 is referred to as a closed state (closed position), and a state in which the clamp lever 31a is separated from the stage 10 is referred to as an open state (open position).

The moving unit 32a further includes a driving pulley 44 and a driven pulley 45 arranged in the X direction, a timing belt 46 that is mounted on the pulleys 44 and the pulleys 45, and a belt driving motor 47 that rotates the driving pulleys 44. . The belt drive motor 47 can perform forward rotation and reverse rotation. The air cylinder 41 is attached to the timing belt 46 via the mounting portion 48. When the timing belt 46 is driven, the air cylinder 41 and the support plate 40 are moved in the X direction, whereby the clamp lever 31a moves in the X direction. The clamp lever 31a slides the support post 35 along the insertion hole 37 while the retracted position of the support post 35 at the outer end of the insertion hole 37 and the end of the support post 35 located inside the insertion hole 37. Move between the central positions. In addition, the position of the clamp lever 31a (any position between the retracted position and the center position) when the clamp lever 31a is clamped to the peripheral edge portion of the substrate C to be exposed is referred to as a clamp position.

The moving unit 32b, the moving unit 32c, and the moving unit 32d have the same configuration as the moving unit 32a. Here, the moving unit 32b moves the clamp lever 31b in the Z direction and the X direction, the moving unit 32c moves the clamp lever 31c in the Z direction and the Y direction, and the moving unit 32d moves the clamp lever 31d in the Z direction and the Y direction.

Fig. 6 is a view for explaining the first exposure lithography apparatus 2 and the first embodiment of the embodiment; 2 An enlarged cross-sectional view showing the function of the photo sensor 49 of the lithography apparatus 4. As shown in FIGS. 5 and 6, a reflection type photosensor (substrate edge sensor) 49 for detecting the presence or absence of the substrate C to be exposed is provided on the support plate 40 of the moving unit 32a. The photo sensor 49 is mounted on the support plate 40 and disposed at a position corresponding to the insertion hole 37 in the X direction and the Y direction, that is, the photo sensor 49 is exposed from the insertion hole 37 as viewed from above. s position. The photo sensor 49 includes a light projecting portion that emits inspection light toward the upper side and a light receiving portion that receives the inspection light that is reflected on the back surface C2 of the substrate C to be exposed. When the light receiving unit receives the inspection light, the substrate signal is output. When the light receiving unit does not receive the inspection light, the substrateless signal is output.

The nip 34 of the clamping lever 31a is located above the photo sensor 49. However, in order to prevent the inspection light from the photo sensor 49 from being reflected back to the chuck 34 and being folded back toward the photo sensor 49, an inclined surface 50 is formed at a portion of the chuck 34 corresponding to the insertion hole 37. The same photosensor 49 as the moving unit 32a is also provided on the support plate 40 of each of the moving unit 32b, the moving unit 32c, and the moving unit 32d.

Further, in each of the support plates 40, a mark forming portion 52 for forming an alignment mark M for the substrate C to be exposed placed on the stage 10 is provided. FIG. 7A is an enlarged cross-sectional view showing the main part of the first exposure lithography apparatus 2 and the second exposure lithography apparatus 4 of the present embodiment. In addition, FIG. 7B is an enlarged plan view showing a main part of the mark forming unit 52 of the first exposure lithography apparatus 2 and the second exposure lithography apparatus 4 of the present embodiment. In addition, in FIG. 7B, in order to explain the structure of the ultraviolet light source 51, the to-be-exposed board|substrate is ab

As shown in FIG. 5, FIG. 7A and FIG. 7B, each of the mark forming portions 52 is A plate shape extending in the direction of the insertion hole 37 is formed so as to correspond to the insertion hole 37 provided at the center among the plurality of insertion holes 37 provided on each side. In the mark forming portion 52, on the side of the center of the stage 10, an ultraviolet light source 51 that generates an ultraviolet light beam (short-wavelength light beam) ultraviolet rays (UV) toward the stage 10 is provided. The ultraviolet light beam UV generated by the ultraviolet light source 51 is irradiated onto the substrate C to be exposed through the insertion hole 37, whereby the second surface (the surface on the side in contact with the stage 10) C2 of the substrate C to be exposed is paired The quasi-use mark M is used for lithography.

Further, in the mark forming portion 52, on the side of the end portion of the stage 10, a plurality of (two in the present embodiment) correction marks 53 are provided on the same surface that can be visually confirmed from above the stage 10. Further, the correction marks 53 are placed on the stage 10 and fixed to the substrate clamping mechanism 30, and are formed so as not to be blocked by the exposed substrate C, and can be inserted. The hole 37 is visually confirmed from the outside. Thereby, each of the correction marks 53 can be identified in the photographic image obtained by the photographing unit 23.

Each of the marker forming portions 52 moves in conjunction with the movement of the moving unit 32a to the moving unit 32d. The insertion holes 37 corresponding to the respective mark forming portions 52 are provided in a region including the movement path of each of the mark forming portions 25. Further, while the ultraviolet light source 51 is exposing the surface C1 of the substrate C to be exposed by the exposure unit 16, the ultraviolet light beam UV may be generated so as to penetrate through the insertion hole 37 of the support post 35. Further, the irradiation time of the ultraviolet light beam UV can be set optimally according to the photosensitive materials applied to the substrate C to be exposed, respectively.

Further, in each of the mark forming portions 52, the ultraviolet light source 51 is used to calibrate The markers 53 are set so as to have a known positional relationship with each other, and the respective positional relationships are measured in advance and memorized in the memory mechanism of the system control unit 70. When the ultraviolet light source 51 is located on the back of the substrate C to be exposed, the ultraviolet light source 51 may not be imaged by the imaging unit 23. Even in this case, the position can be measured by photographing each of the correction marks 53 and based on the positional relationship between the measured position of each of the correction marks 53 and the stored ultraviolet light source 51 and the correction mark 53. The position of the ultraviolet light source 51 is derived.

Further, the first exposure lithography apparatus 2 includes a plurality of ultraviolet light sources 51, but the second exposure lithography apparatus 4 does not have to include a plurality of ultraviolet light sources 51. A plurality of ultraviolet light sources may be provided in the first exposure lithography apparatus 2, and a plurality of alignment marks M may be lithographically moved by moving the ultraviolet light source.

The first exposure lithography apparatus 2 includes an auto carrier hand (hereinafter, AC palm) 62 that carries the exposed substrate C transported by the first transport device 5 to the first The inside of the lithography apparatus 2 is exposed. The AC palm 62 is formed in a flat plate shape and is movable in the horizontal direction and the vertical direction in parallel with the horizontal plane. Further, on the lower surface of the AC palm 62, there is provided an adsorption mechanism having an adsorption portion 63 that adsorbs and holds the exposed substrate C by vacuum suction by sucking air; and has a pressing portion 64. In the pressing mechanism, the pressing portion 64 presses the exposed substrate C downward and moves up and down.

The AC palm 62 is sucked and held by the adsorption mechanism by the unexposed substrate C placed on the first transfer device 5, and is lifted upward, and the lifted exposed substrate C is placed on the upper surface of the stage 10. The intended location. When the exposed base is placed In the case of the plate C, the adsorption of the adsorption portion 63 is released by pressing the substrate C to be exposed to the stage 10 by the pressing mechanism, whereby the vacuum suction of the stage 10 acts, and the exposed substrate C is firmly fixed to the stage 10.

Further, the AC palm 62 is lifted up by suction holding the exposed substrate C that has been exposed on the upper surface of the stage 10 by the suction mechanism. In addition, the AC palm 62 moves to the second transfer device 6 while sucking and holding the exposed substrate C, and then the adsorption of the suction mechanism is released, thereby moving the substrate C to be exposed to the second transfer device 6.

According to the substrate clamping mechanism unit 30 of the exposure lithography system 1 of the present embodiment, the peripheral portion of the substrate C to be exposed can be surely clamped, and the warpage and strain of the substrate C to be exposed can be corrected. Further, the substrate clamping mechanism unit 30 has a configuration in which the ultraviolet light source 51 and the photo sensor 59 are moved together with the clamp lever 31a to the clamp lever 31d. Therefore, since it is not necessary to use the moving mechanism of the ultraviolet light source 51 and the photo sensor 59, the manufacturing cost of the substrate clamping mechanism portion 30 can be suppressed.

FIG. 8 is a schematic side elevational view showing the configuration of the reversing mechanism of the reversing device 4 of the exposure lithography system 1 of the embodiment. As shown in FIG. 8, the inverting device 4 is arranged in two rows, and each of the rows is provided with a roller unit 4b having a plurality of rollers 4a sandwiching the substrate C to be exposed. The roller unit 4b is supported by the support rod 4c. When the substrate C is sandwiched, the roller unit 4b is lifted by the support rod 4c, and the rotation shaft 4d provided at the central portion of the roller unit 4b is The center rotates. After the roller unit 4b is rotated by 180 degrees, the exposed substrate C is released from the roller unit 4b, whereby the front and back of the exposed substrate C are reversed. In addition, the composition of the reversing mechanism is not limited to the above In the above configuration, a method of reversing the front and back of the substrate C to be exposed by rotating one end of the substrate C to be exposed and rotating the substrate C to be exposed may be used, or another conventionally known method.

FIG. 9 is a view showing the configuration of an electrical system of the first exposure lithography apparatus 2 and the second exposure lithography apparatus 4 of the embodiment.

As shown in FIG. 9, in the first exposure lithography apparatus 2, a system control unit 70 that is electrically connected to each unit of the apparatus is provided, and the system control unit 70 collectively controls each unit. The system control unit 70 controls the AC palm 62 to perform a loading operation and a discharging operation of the exposed substrate C toward the stage 10. Further, the system control unit 70 controls the movement of the stage 10 while controlling the stage driving unit 71, and the imaging unit 23 performs imaging of the alignment mark M to adjust the lithographic position of the image. Further, the system control unit 70 controls the light source unit 17 and the image processing unit 19 to cause the exposure head 16a to perform exposure processing. The operation device 73 has a display portion and an input portion, and operates, for example, when an external size of the substrate C to be exposed is input.

The substrate placement position determining unit 72 determines the placement position of the substrate C to be exposed with respect to the stage 10 as an appropriate arrangement position (hereinafter referred to as "appropriate placement position"). Further, the alignment mark M is placed at the center of the imaging area by adjusting the imaging timing of the imaging unit 23 in the Y direction. Therefore, an appropriate placement position in the Y direction can also be placed at any position on the platform 10. Further, in the present embodiment, an appropriate placement position in the X direction is set at a position where the center of the exposed substrate C coincides with the center of the stage 10.

The substrate placement position determining unit 72 is based on the substrate C to be exposed The information obtained by the preparatory operation performed before the exposure operation is calculated, and the appropriate placement position of the substrate in the X direction (the appropriate position of the alignment mark M) is calculated. In the preparation operation, the system control unit 70 controls the imaging unit C to image the alignment mark M after the exposure substrate C is placed at an appropriate position on the stage 10 in the X direction. Further, the center of the substrate C to be exposed is aligned with the center of the stage 10 in the Y direction, and one of the opposing sides of the stage 10 and the opposite side of the substrate C to be exposed are placed in parallel. Further, the system control unit 70 calculates the amount of shift between the center position of the photographing region in the X direction and the position of the mark M for alignment. Then, the system control unit 70 calculates an appropriate placement position of the substrate in the X direction based on the offset amount. In the preparation operation, by performing this processing on a plurality of (for example, five) substrates, it is possible to more accurately obtain an appropriate placement position. Further, in this preparation operation, the imaging timing of the imaging unit 23 is also determined. The calculated appropriate placement position information of the substrate and the imaging timing information are sent to the system control unit 70 and stored in the memory mechanism of the system control unit 70.

The movement control unit 74 controls the movement drive of the imaging unit 23 in accordance with an instruction from the system control unit 70. In the present embodiment, the movement control unit 74 passes through the respective imaging regions of the plurality of imaging units 23 by the plurality of alignment marks M that are lithographically formed on the plurality of mark forming portions 52 or the exposed substrate C during the movement of the stage 10. In the manner, the movement drive of the photographing unit 23 is controlled.

The movement control unit 74 controls the driving of the moving unit 32a to the moving unit 32d in accordance with an instruction from the system control unit 70. The movement control unit 74 monitors signals from the light sensor 49 of the moving unit 32a to the moving unit 32d (with a substrate) Signal or no substrate signal). Further, the movement control unit 74 controls the driving of the air cylinder 41 and the belt drive motor 47 of the moving unit 32a to the moving unit 32d based on the signal, and causes the clamping lever 31a to the clamping lever 31d to perform the clamping operation.

The movement control unit 74 estimates the area on which the substrate C to be exposed is placed in the region on the stage 10 based on the substrate size information input from the operation device 73 and the appropriate placement position information of the substrate calculated by the preparatory operation. . Further, the movement control unit 74 switches the moving speed of the clamp lever 31a to the clamp lever 31d between the high speed and the low speed based on the estimated area. Specifically, the stage 10 is set to be moved at a high speed outside the position (see FIG. 6 ) at a distance L1 (for example, 40 mm) from the periphery of the substrate C to be exposed, and is set to be inside the position. Move at low speed. Thereby, since the detection of the substrate C to be exposed is performed at the time of low speed movement, the substrate C to be exposed can be reliably detected. Further, a position separated from the periphery of the substrate C to be exposed by a distance L1 is referred to as a deceleration position (switching point). The clamp lever 31a to the clamp lever 31d are stopped at a clamp position that has penetrated a predetermined distance (for example, 5 mm) from the position where the substrate C to be exposed is detected, and is clamped at the clamp position. This clamp position is a position at which the support post 35 of the clamp lever 31a to the clamp lever 31d does not abut against the edge of the substrate C to be exposed.

When the exposure substrate C is detected when the clamp lever 31a to the clamp lever 31d move at a high speed, the movement control unit 74 determines that the actual substrate size is larger than the input substrate size. In this case, the movement control unit 74 stops the movement of the clamp lever 31a to the clamp lever 31d and outputs an abnormality signal to the system control unit 70. The system control unit 70 receives the abnormality signal, and causes the display unit of the operation device 73 to display the error information having a large substrate size. In addition, a warning tone can be issued instead of displaying an error message.

Further, when the clamp lever 31a to the clamp lever 31d move at a low speed and the substrate C is not detected and the low speed is moved for a predetermined period of time, the movement control unit 74 determines that the actual substrate size is smaller than the input substrate size or The substrate is not placed. In this case, the movement control unit 74 stops the movement of the clamp lever 31a to the clamp lever 31d and outputs an abnormality signal to the system control unit 70. The system control unit 70 receives the abnormality signal, and causes the display unit of the operation device 73 to display the error information that the substrate size is small or the substrate C to be exposed is not placed.

FIG. 10 is a view showing a relationship between the moving direction of the stage 10 and the moving direction of the imaging unit 23 in the exposure lithography system 1 of the embodiment. As shown in FIG. 10, the moving direction of the photographing portion 23 is a direction (X direction) perpendicular to the moving direction (Y direction) of the stage 10 in the horizontal direction. In the exposure lithography system 1, when the photographic image is photographed by the imaging unit 23 for aligning the plurality of ultraviolet light sources 51 or the exposed substrate C, the position in the Y direction is controlled by moving the stage 10. Further, in the exposure lithography system 1, the position in the X direction is controlled by moving the imaging unit 23. By this, the respective relative positions are controlled such that the plurality of mark forming portions 52 or the markings M for alignment are included in the imaging region of the imaging portion 23. Further, the moving direction of the imaging unit 23 is not limited to the X direction. In other words, it is only necessary to photograph the mark M for alignment of the lithography on the mark forming portion 52 or the exposed substrate C. Therefore, the moving direction of the imaging unit 23 can be moved in both the X direction and the Y direction, or can be moved in other directions than the X direction and the Y direction.

Fig. 11 is a view showing a movable range R of the ultraviolet light source 51 of the exposure lithography system 1 of the embodiment. As shown in FIG. 11, the ultraviolet light source 51 is as follows The configuration can be moved linearly from the end of the platform 10 (in the present embodiment, from the central portion of the side portion of the platform 10) toward the central portion by a predetermined distance. When the ultraviolet light source 51 lithographically marks the alignment mark M on the substrate C to be exposed, the ultraviolet light source 51 generates the ultraviolet light beam UV in a state where the exposed substrate C is placed on the stage 10. At this time, the ultraviolet light source 51 is moved to a position at which the mark M for alignment is lithographically formed at the end of the substrate C to be exposed. The movable range R of the ultraviolet light source 51 is not limited thereto, and may be a position including a position where the alignment mark M is lithographically applied to the end surface of the substrate having the smallest size from the substrate of the smallest size to be exposed. The scope. It is desirable to align the alignment mark M with the smallest range of the lithography to the substrates of all sizes as the exposure target.

Next, the action of this embodiment will be described.

FIG. 12 is a flowchart showing the flow of processing of the pre-exposure processing program of the first embodiment, and the program is stored in advance in the read-only memory as a recording medium provided in the system control unit 70 of the first exposure lithography apparatus 2 ( Read only memory, ROM) specified area. FIG. 13 is a schematic front view for explaining pre-exposure processing in the present embodiment.

The system control unit 70 of the first exposure lithography apparatus 2 executes the pre-exposure processing program at a predetermined timing (in the present embodiment, the timing at which the substrate C to be exposed is placed on the stage 10).

When the substrate C to be exposed is placed on the stage 10, the system control unit 70 moves the position of the ultraviolet light source 51 with respect to the substrate C to be exposed in step S101. In the present embodiment, the movement of the ultraviolet light source 51 and the substrate clamping mechanism unit 30 The movement of the unit 32a to the movement unit 32d moves in conjunction with each other. Therefore, the system control unit 70 controls the movement of the moving unit 32a to start the movement of the end portion of the stage 10 of the clamp lever 31a to the clamp lever 31d from the open state toward the center portion, thereby moving the position of the ultraviolet light source 51. Further, when the substrate sensor receives the substrate signal from the photo sensor 49, the system control unit 70 shifts the clamp lever 31a to the clamp lever 31d to the closed state only after the received position or the position after the predetermined distance has been moved. As a result, the clamp lever 31a to the clamp lever 31d are fixed in a state in which the exposed substrate C is sandwiched between the clamp lever 31a and the stage 10, and the position of the ultraviolet light source 51 is also fixed.

In the case where the non-exposed substrate C is sandwiched by the clamp lever 31a to the clamp lever 31d, or when the ultraviolet light source 51 is moved by a movement mechanism different from the clamp lever 31a to the clamp lever 31d, The exposure substrate C is moved to a predetermined position before being placed on the stage 10.

In step S103, the system control unit 70 captures each of the calibration marks 53 corresponding to the plurality of ultraviolet light sources 51 by the imaging unit 23, and derives the position of the ultraviolet light source 51 from the captured image by the above method. Further, the method of measuring the position is not limited to the above method, and may be a method in which the ultraviolet light source 51 is photographed by the photographing unit 23 before the substrate C to be exposed is placed on the stage 10, and the ultraviolet light source is used. The photographing is performed 51, and the position of the ultraviolet light source 51 is measured based on the photographed image.

Further, in step S105, the system control unit 70 sets a corresponding coordinate system (hereinafter referred to as "platform coordinate system") on the platform 10, and ends the pre-exposure processing program. As shown in Figure 13, in the stage of pre-exposure processing, in the platform coordinate system Each of the ultraviolet light sources 51 is disposed at a known position.

The system control unit 70 of the first exposure lithography apparatus 2 performs the first exposure processing after the pre-exposure processing is completed and the exposed substrate C is placed on the stage 10. FIG. 14 is a flowchart showing a flow of processing of the first exposure processing program of the first embodiment, and the program is stored in advance in a predetermined area of the ROM as a recording medium provided in the system control unit 70 of the first exposure lithography apparatus 2. . Fig. 15 is a schematic front view for explaining the first exposure process of the embodiment.

In step S201, the system control unit 70 sets an image coordinate system which is a coordinate system for the image P1 for the lithographic surface of the substrate C to be exposed, based on the position of the ultraviolet light source 51 measured in step S103. As shown in FIG. 15, at the stage of the first exposure processing, the image coordinate system is set in accordance with the position of the ultraviolet light source 51 with respect to the platform coordinate system. The position of the ultraviolet light source 51 can also be introduced to any image coordinate system.

In step S203, the system control unit 70 moves the stage 10 to the exposure position based on the image coordinate system set in step S201. At this time, the system control unit 70 moves the stage 10 in the Y direction along the guide rail 14. Further, the system control unit 70 moves the stage 10 to the position where the exposure target position of the exposure head 16a coincides with the start position at which the surface image P1 is lithographically reflected on the substrate C to be exposed.

In step S205, the system control unit 70 starts exposure by each exposure head 16a, and lithographically images the surface image P1 on the surface C1 of the substrate C to be exposed based on the position of the image coordinate system set in step S201. Further, in step S207, the system control unit 20 causes the ultraviolet light source 51 to generate the ultraviolet light beam UV, and lithographically marks the alignment mark M on the back surface C2 of the substrate C to be exposed. In addition, step 205 The processing of the surface C1 of the substrate C to be exposed and the processing of the back surface C2 of the substrate C to be exposed in step S207 are not mutually exclusive. In other words, the first exposure lithography apparatus 2 can simultaneously perform the above-described respective processes in parallel, and thus the processes of steps S205 and S207 can be simultaneously performed. Alternatively, the first exposure lithography apparatus 2 may perform the processing of step S207 before the processing of step S205. As shown in FIG. 15, according to the image coordinate system, the surface image P1 is lithographically formed on the surface C1 of the substrate C to be exposed, and the alignment mark M is lithographically formed on the back surface C2.

As described above, in the process of lithographically patterning the surface image P1 on the surface C1 of the substrate C to be exposed, the alignment mark M is lithographically formed on the back surface C2, thereby eliminating the need for additionally performing the mark M for lithography alignment. deal with. Therefore, the cycle time of the exposure lithography process is not affected, and the holding time of the baking of the mark M for alignment can be ensured to be long. As a result, the contrast of the photographic image of the mark M for alignment in the lithography processing of the back surface C2 can be improved, so that the recognition deviation of the mark M for alignment can be suppressed.

In addition, since the mark M for alignment is baked by the ultraviolet light beam UV and is baked, the display can be visually confirmed on the substrate C to be exposed. Therefore, the image can be confirmed by the image capturing unit 23, and the position or shape can be confirmed. .

In step S209, the system control unit 70 moves the stage 10 to the position where the substrate C to be exposed is placed, and ends the first exposure processing program. When the stage 10 is moved to the placement position of the substrate C to be exposed, the exposed substrate C is moved to the second transfer device 6 by being held by the AC palm 62 by suction. Further, the exposed substrate C is transported to the inverting device 3 by the second transfer device 6, and is represented by the inverting device 3 After the back-reversal, the third transfer device 7 is transported to the second exposure lithography apparatus 4.

The system control unit 70 of the second exposure lithography apparatus 4 executes the pre-exposure processing program at a predetermined timing (in the present embodiment, the timing at which the substrate C to be exposed is placed on the stage 10).

FIG. 16 is a flowchart showing a flow of processing of the second exposure processing program of the second embodiment of the present invention. The program is stored in advance in a predetermined area of the ROM as a recording medium provided in the system control unit 70 of the second exposure lithography apparatus 4. . Fig. 17 is a schematic front view for explaining a second exposure process of the embodiment.

In step S301, the system control unit 70 moves the stage 10 on which the substrate C to be exposed is placed to a position in which the entire mark M for alignment of the lithography is included in the captured image of the image pickup device 23 in step S207. position. At this time, the system control unit 70 moves the stage 10 along the guide rail 14 in the Y direction, and moves the stage 10 to a position where the position of the photographing portion 23 and the position of the mark M for alignment are set at Y. The position is roughly the same in the direction.

In addition, the imaging area of the imaging unit 23 is a region in which the alignment mark M is provided on the back surface C2 of the substrate C to be exposed, and is larger than a region including the installation error of the substrate C to be exposed. In this case, even if the installation position of the substrate C to be exposed is shifted from the preset installation position, the image capturing unit is included in the area where the center portion of the mark M for alignment is set. 23 photography area.

In step S303, the system control unit 70 measures the position of the marker M for alignment based on the captured image of the marker M for imaging by the imaging unit 23. and In step S305, the system control unit 70 sets the position for determining the lithography of the back surface image P2 with respect to the back surface C2 of the substrate C to be exposed, based on the position of the alignment mark M measured in step S303. Image coordinate system. At this time, the image coordinates are set in a manner corresponding to the image coordinate system set in step S201. That is, it is set in such a manner that the position of the ultraviolet light source 51 measured in step S103 and the position of the lithography position of the surface image C1, and the position of the mark M for alignment and the image for back surface C2 are set. The relative positions of the lithographic positions correspond to each other. As shown in FIG. 17, at the stage of the second exposure processing, the image coordinate system is set according to the position of the alignment mark M. Therefore, there is also a case where the relative position of the platform coordinate system and the image coordinate system and the first exposure are as follows. The stages of processing are different.

In step S307, the system control unit 70 moves the stage 10 to the exposure position based on the image coordinate system set in step S305. At this time, the system control unit 70 moves the stage 10 in the Y direction along the guide rail 14. Further, the system control unit 70 moves the stage 10 to a position where the exposure target position of the exposure head 16a coincides with the start position at which the back surface image P2 is lithographically reflected in the substrate C to be exposed.

In step S309, the system control unit 70 starts exposure by the exposure heads 16a, and lithographically images the back surface image P2 on the back surface C2 of the substrate C to be exposed. As shown in FIG. 17, the back surface image P2 is lithographically formed on the back surface C2 of the substrate C to be exposed according to the image coordinate system.

In step S311, the system control unit 70 moves the stage 10 to the position where the substrate C to be exposed is placed, and ends the second exposure processing program. When the stage 10 is moved to the placement position of the substrate C to be exposed, the image is subjected to the surface C1 and the back surface. The exposed substrate C on both sides of the C2 is moved to the fourth transfer device 8 by suction and holding on the AC palm 62, and is transported by the fourth transfer device 8.

FIG. 18 is a schematic front view showing the relationship between the size of the substrate C to be exposed and the lithography position of the mark M for alignment in the exposure lithography system 1 of the embodiment. In the present embodiment, when the clamp lever 31a to the clamp lever 31d are moved by the moving unit 32a to the moving unit 32d of the substrate clamping mechanism unit 30, the ultraviolet light source 51 moves in conjunction with the movement. Therefore, as shown in FIG. 18, the photo sensor 49 detects the end of the substrate C to be exposed, and the clips 31a to 31d fix the end portion of the exposed substrate C, whereby the ultraviolet light source 51 is automatically fixed to the pair. The end of the substrate C to be exposed is irradiated with the ultraviolet light beam UV. Further, the positional relationship between the positions of the clamp bars 31a to 31d and the ultraviolet light source 51 can be freely designed. Thereby, in the present embodiment, the alignment mark M can be lithographically formed at a predetermined position of the substrate C to be exposed without depending on the size of the substrate C to be exposed.

Further, the method of measuring the position of the ultraviolet light source 51 in step S103 differs depending on the obtained measurement accuracy, and the moving unit 32a to the moving unit 32d of the substrate clamping mechanism unit 30 may also include a stepping motor (stepping motor). The measurement is performed by the pulse of the stepping motor. Alternatively, the mobile unit 32a to the mobile unit 32d may also include a rotary encoder that measures the position by rotating the pulses of the encoder. Alternatively, an optical distance sensor or a distance sensor using ultrasonic waves may be provided in any part of the first exposure lithography apparatus 2 in advance, and the position may be measured by the distance sensors.

Further, in the present embodiment, the circular correction mark 53 is provided with 2 The position of the ultraviolet light source 51 is derived based on the positional relationship between the two or more correction marks 53 and the ultraviolet light source 51. However, the shape or the number of the correction marks 53 is not limited thereto, and the shape of the correction marks can be arbitrarily set. In the case where the shape of the correction mark 53 indicates the position of the arrow type mark or the like and the direction of the ultraviolet light source 51, even if the correction mark 53 is provided, the correction mark 53 can be used. The position and direction of the ultraviolet light source 51 are derived.

Further, in the case where the position of the ultraviolet light source 51 is measured based on the amount of deviation of the theoretical value of the position of the ultraviolet light source 51 in the self-photographed image, it is preferable that the ultraviolet light source 51 is located within the depth of focus of the imaging unit 23. However, when the ultraviolet light source 51 is not located within the focal depth of the imaging unit 23, the height (the position in the Z direction) of the stage 10 can be changed so that the ultraviolet light source 51 can be positioned within the depth of focus of the imaging unit 23.

Further, in the present embodiment, the two marks M for alignment are lithographically. However, the number of the marks M for alignment is not limited thereto, and the number of the marks M for alignment can be arbitrarily set. The larger the number of the marks M for alignment, the more the alignment accuracy of the front and back of the substrate C to be exposed can be improved.

Further, in the present embodiment, the alignment mark M is lithographically formed on the substrate C to be exposed by the ultraviolet light source 51. However, the present invention is not limited thereto, and lithography may be performed by spraying ink or transfer ink.

Further, in the present embodiment, the ultraviolet light source 51 is movably provided in the X direction or in the Y direction, but the present invention is not limited thereto and may be used in any direction. A movable UV light source. Further, the moving path of the ultraviolet light source may be a path that crosses the central portion of the substrate C to be exposed, or may be a path that crosses an arbitrary position of the substrate C to be exposed.

In the present embodiment, the ultraviolet light source 51 is moved in conjunction with the moving unit 32a to the moving unit 32d of the clamp mechanism unit 30. However, the present invention is not limited thereto, and the ultraviolet light source 51 may be separately provided by a moving mechanism including a motor or the like. Move on the ground. In this case, the size of the substrate C to be exposed and the placement position of the stage 10 are memorized in advance, and the ultraviolet light source 51 can be set to move to a predetermined position in accordance with the stored size and the placement position.

When the lithography of the surface image P1 has failed in step S205, the process of step S207 (the lithography process of the mark M for alignment) may not be performed, and the process proceeds to step S209. In this case, the mark M for alignment is not micro-imaged on the substrate C to be exposed on which the lithography of the surface image P1 has failed. Therefore, the user can determine the success or failure of the lithography of the surface image P1 by confirming the presence or absence of the mark M for the respective exposed substrates C.

2‧‧‧1st exposure lithography device

3‧‧‧Reversal device

4‧‧‧2nd exposure lithography device

Claims (11)

An exposure lithography apparatus comprising: a first exposure mechanism that performs lithography on the first facing circuit pattern by exposing a first surface of a printed wiring substrate placed on a stage; and a mark forming mechanism for the platform a lithography process for the circuit pattern for the first surface of the first surface of the printed wiring board, wherein a predetermined plurality of marks are formed on a second surface opposite to the first surface; a measuring unit that measures a position of the mark forming mechanism, and a detecting unit that detects a position of the plurality of marks formed on the second surface of the printed wiring board by the mark forming mechanism; and a second exposure mechanism And using the position of the mark forming mechanism measured by the measuring means and the position of the plurality of marks detected by the detecting means as a reference, and exposing the second surface of the printed wiring board to the The second is to perform lithography on the circuit pattern. The exposure lithography apparatus according to claim 1, wherein the mark forming mechanism is movably disposed with respect to at least one of two directions, wherein the two directions are the above-described loading on the platform A predetermined direction of the printed wiring board as a reference and a direction intersecting the predetermined direction. The exposure lithography apparatus according to claim 1, wherein the mark forming means sets the movable range to a range in which the plurality of printed wiring boards are different in size to form the mark. The exposure lithography apparatus described in claim 1 of the patent application further includes a regulation In the mechanism, the predetermined mechanism defines a size of the printed wiring board, and the mark forming means forms each of the plurality of marks in accordance with a size defined by the predetermined mechanism. The exposure lithography apparatus according to claim 1, wherein the measuring means includes an imaging means for photographing the mark forming means, and the position of each of the mark forming means is measured using a photographic image obtained by the photographic means. The exposure lithography apparatus according to claim 1, wherein the mark forming mechanism forms a correction mark at a known relative position with respect to the mark forming mechanism at a position such that the printed wiring substrate is placed thereon. In the state of the platform, the photographing mechanism may be photographed by the measuring mechanism, and the measuring mechanism includes a photographing mechanism that photographs the mark forming mechanism such that each of the calibration marks is photographed, and the measuring mechanism The position of each of the mark forming mechanisms is measured using a photographic image obtained by the above-described photographing mechanism. The exposure lithography apparatus according to claim 5, wherein the plurality of imaging mechanisms are provided, and each of the imaging mechanisms photographs one or more of the marker forming mechanisms. The exposure lithography apparatus of claim 5, wherein the photographic mechanism is in a known relationship with the position of the lithographic circuit pattern and is movably disposed relative to the platform. The exposure lithography apparatus according to claim 1, wherein the mark forming mechanism uses short-wavelength light on the second surface of the printed wiring board Exposure is performed to form the above marks. The exposure lithography apparatus according to claim 1, wherein the mark forming means forms the plurality of marks by adhering ink to the second surface of the printed wiring board. An exposure lithography method is an exposure lithography method of an exposure lithography apparatus, wherein the exposure lithography apparatus includes: a first exposure mechanism that exposes a first surface of a printed wiring substrate placed on a stage 1 lithography facing the circuit pattern; the mark forming mechanism is configured to be relatively movable with respect to the stage, forming a predetermined plurality of marks on the second surface opposite to the first surface; and measuring means for positioning the mark forming mechanism Performing measurement; detecting means for detecting a position of the plurality of marks formed on the second surface of the printed wiring board by the mark forming means; and the second exposure means by the above-mentioned printed wiring board Exposing the second surface to lithography on the second facing circuit pattern, the exposure lithography method comprising the steps of: controlling the position of the mark forming mechanism to control the measuring mechanism; forming the mark The mechanism moves to a predetermined position; and the lithography is performed on the circuit pattern for the first surface facing the first surface of the printed wiring board. In a lithography process of the circuit pattern, a circuit pattern to the first surface is formed with a corresponding plurality of marks in the above embodiment the second surface, Controlling the first exposure mechanism and the mark forming mechanism; and determining, by using the position of the mark forming mechanism measured by the measuring means and the position of the plurality of marks detected by the detecting means, as the reference The second exposure mechanism is controlled so as to perform lithography on the circuit pattern for the second surface.