KR101993950B1 - Position determining device, position determining method, lithographic apparatus, and method for manufacturing object - Google Patents

Position determining device, position determining method, lithographic apparatus, and method for manufacturing object Download PDF

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KR101993950B1
KR101993950B1 KR1020150167023A KR20150167023A KR101993950B1 KR 101993950 B1 KR101993950 B1 KR 101993950B1 KR 1020150167023 A KR1020150167023 A KR 1020150167023A KR 20150167023 A KR20150167023 A KR 20150167023A KR 101993950 B1 KR101993950 B1 KR 101993950B1
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substrate
light
mark
light receiving
unit
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KR1020150167023A
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Korean (ko)
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KR20160065019A (en
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코이치 타무라
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

The positioning apparatus includes a first light transmitting unit configured to irradiate light to an edge portion of a rotating substrate and a second light transmitting unit configured to irradiate light onto at least one mark on the surface of the substrate. The position aligning device is disposed on the side corresponding to the surface of the substrate and receives light passing through the substrate outside region after being irradiated from the first light projecting unit and receiving light reflected from the one or more marks after being irradiated from the second light projecting unit And a light receiving unit configured to receive the light. The position of the substrate is determined based on the light receiving result by the light receiving unit.

Description

[0001] POSITION DETERMINING DEVICE, POSITION DETERMINING METHOD, LITHOGRAPHIC APPARATUS, AND METHOD FOR MANUFACTURING OBJECT [0002]

The present invention relates to a positioning apparatus, a positioning method, a lithographic apparatus, and a method of manufacturing an article.

An exposure apparatus for transferring a pattern, such as a circuit pattern, to a substrate aligns the substrate before transfer to transport the substrate to a predetermined exposure position. An example of the exposure apparatus forms a V-shaped cutout portion called a notch on a substrate, determines the position of the substrate by detecting the position of the notch, and aligns the substrate to correct the positional deviation from the predetermined position.

However, due to the asymmetry of the substrate with the leakage or notch of the resist to the notch, defective performance of the semiconductor device tends to occur in the region around the notch in the step including the exposure step and the film formation step. In order to solve this problem and to prevent deterioration of yield, a technique for aligning a substrate having no notch is required.

Japanese Patent Laying-Open No. 2007-5794 relates to a positioning apparatus having a mechanism for determining the position of a substrate using a mark on a back surface of the substrate. A sensor for detecting the edge of the substrate and a sensor for detecting marks on the back side are used to determine the position of the substrate.

Japanese Patent Application Laid-Open No. 9-139342 discloses a positioning apparatus having a mechanism for determining the position of a substrate using marks on the back surface of the substrate. The position of the substrate is determined by receiving light reflected from a shot array formed on the front surface of the substrate and light reflected from a mark on the back surface of the substrate by one imaging element.

In the alignment apparatus disclosed in Japanese Patent Application Laid-Open No. 2007-5794, sensors for detecting edges and sensors for detecting marks are spaced from each other. Therefore, it is necessary to measure the relative positions of the two sensors in advance. If the ambient temperature change is large, it may be necessary to frequently measure the relative position.

The alignment apparatus disclosed in Japanese Patent Application Laid-Open No. 9-139342 does not include a unit configured to detect an edge. Therefore, when edge exposure processing for exposing an edge portion along an edge is required in order to remove unnecessary resist on a substrate, it is necessary to newly detect an edge.

The present invention provides a positioning apparatus, a positioning method, and a lithographic apparatus capable of detecting edges and marks of a substrate using a common sensor and determining the position of the substrate.

A positioning apparatus according to an embodiment of the present invention includes a first light projecting unit configured to irradiate an edge portion of a substrate with light, a second light projecting unit configured to irradiate light onto at least one mark on the surface of the substrate, A light receiving unit configured to receive light passing through the substrate outer region after being irradiated from the first light projecting unit and receiving light reflected from the one or more marks after being irradiated from the second light projecting unit, And a determination unit configured to determine the position of the substrate based on the light reception result by the light reception unit.

Further aspects of the present invention will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings.

1 is a front view of the alignment apparatus according to the first embodiment;
2 is a flow chart showing the alignment method according to the first embodiment;
3 is a light reception waveform diagram for an edge portion of a substrate according to the first embodiment;
4 is a positional waveform diagram for an edge according to the first embodiment;
5 is a top view showing the alignment device according to the first embodiment.
6 is a light reception waveform diagram for an edge portion of a substrate according to the second embodiment;
7 is a positional waveform diagram for an edge according to a second embodiment;
8 is a flow chart illustrating an alignment method according to a fifth embodiment;
9 is a positional waveform diagram for an aligned edge according to a fifth embodiment.
10 is a diagram of a lithographic apparatus including a position detector.

First Embodiment

1 is a front view of a positioning apparatus (positioning apparatus) 100 according to a first embodiment of the present invention. Fig. 1 shows a state in which the substrate 10 is transported on the stage 120. Fig. The alignment apparatus 100 detects the position of the substrate 10 and controls the position of the substrate 10 based on the detection result to a predetermined standby position . Hereinafter, the alignment refers to aligning the substrate 10 in a predetermined position with respect to the translation direction and the rotation direction.

The stage 120 includes a rotation stage 121 (rotation unit) for rotating the substrate 10 using the z axis direction as the rotation axis, an XY stage 122 for translating the substrate 10 in the XY plane, And a support 123 for supporting the base 10.

A substrate having no cutout portion such as a reference flat portion or a notch is used as the substrate 10. In this embodiment, a substrate having a diameter of 300 mm is used as the substrate 10. The diameter of the substrate 10 may also be less than 300 mm, in the range of 300 mm to 450 mm, or greater than 450 mm.

A mark 11 is formed on the back surface of the substrate 10 conveyed to the stage 120 in the vicinity of the edge 12. An example of the mark 11 is a mark having a concavo-convex structure formed by laser-marking or another process. Examples of the pattern of the mark may include a pattern in which a plurality of hemispherical concave portions are aligned in one column or two dimensions, a line-end-space pattern, and a rectangular pattern.

Hereinafter, the front surface of the substrate 10 represents the surface to be treated (the upper surface in the vertical direction in this embodiment) of the substrate 10, and the back surface of the substrate 10 is the opposite surface , The lower surface in the vertical direction). The side on which the surface to be processed is positioned in the direction perpendicular to the substrate 10 is the front side and the side on which the opposite surface of the side to be treated is positioned in the direction perpendicular to the substrate 10 is the back side.

The first light source (first light projecting unit) 111 is arranged on the surface side with respect to the substrate 10. The second light source (second light projecting unit) 112 is disposed on the back surface side with respect to the substrate 10. The optical system 113 and the light receiving element (light receiving unit, photodetector) 110 are disposed under the vertical direction of the first light source 111 and on the rear surface side with respect to the substrate 10. The first light source 111 and the second light source 112 are light sources that emit light from the side corresponding to the different side of the substrate 10 and are light emitting diode (LED) light sources that emit light having the same wavelength. The light receiving element 110 is an image pickup element such as a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS).

The light receiving element 110 is disposed on the same side as the second light source 112 with respect to the substrate 10 so as to face the first light source 111. [ That is, the optical element that polarizes the light flux irradiated from the light source to bend the optical path is an optical path from the first light source 111 to the light receiving element 110 or an optical path from the second light source 112 to the light receiving element 110 . By reducing the number of optical elements in the alignment apparatus 100, a space saving in the periphery of the rotation stage 121 can be achieved.

The first light source 111 irradiates the edge (edge portion) 12 of the substrate 10 with light. In particular, the first light source 111 irradiates light downward in the vertical direction so as to include at least an edge (edge portion) 12, whose boundary is a boundary between the substrate 10 and the space outside the substrate 10. The second light source 112 irradiates light at an angle to be dark-field illumination with respect to the mark 11.

The light receiving element 110 receives light (light passing through the substrate outside region) that is emitted from the first light source 111 and passes through a space outside the outer side of the edge 12, (At least one of the reflected diffracted light and the reflected scattered light) from the light source 11 through the optical system 113. That is, the light receiving element 110 is common to the light from the first light source 111 and the light from the second light source 112, that is, light passing through the area outside the substrate 10 and light reflected from the mark 11 Is common to the emitted light.

The first light source 111 emits light by bright-field illumination. Even when the substrate 10 has the chamfered portion 13 in which the corner portion is removed in the vicinity of the edge 12 when the first light source 111 is not the dark field illumination but the bright- Can be prevented from being lowered due to the influence of the light reflected by the chamfered portion 13. As shown in Fig. 1, the second light source 112 can emit light from the inside, corresponding to the center of the substrate, in the outward direction. Further, light is irradiated at an angle to the surface of the substrate on which the mark 11 is provided. This can prevent the accuracy of detecting the mark 11 or the edge 12 from being lowered due to the influence of the light reflected from the chamfered portion 13.

The control unit 130 (decision unit) is connected to the light receiving element 110. The control unit 130 detects the mark 11 and the edge 12 from the light receiving result by the light receiving element 110 and determines the position of the substrate 10. [ The control unit 131 is connected to the first light source 111 and adjusts the light of the first light source 111. [ The control unit 132 is connected to the second light source 112 and adjusts the light of the second light source 112. The control unit 133 is connected to the stage 120 and controls the driving of the rotation stage 121 and the XY stage 122.

Each of the control units 130 to 133 includes a central processing unit (CPU) not shown. The control units 130 to 133 can exchange information with each other. For example, the control unit 133 can align the substrate 10 by driving the stage 120 so that the deviation of the substrate 10 determined by the control unit 130 is corrected.

The information required for the positioning operation is stored in the memory 134 by the control units 130-133. Examples of the stored information may include the position of the substrate 10 (including the position in the rotational direction) determined by the control unit 130 and the light amount of each of the first light source 111 and the second light source 112 have. Another example may be the threshold value of the signal used for the detection of the mark 11 and the detection of the edge 12. [ The control units 130 to 133 and the memory 134 may be arranged on one control board or a different control board as long as their functions are not impaired.

2 to 5, a method in which the position of the mark 11, the position of the edge 12, and the position of the substrate 10 are determined by the control unit 130 will be described.

Fig. 2 is a flowchart showing a method of positioning alignment of the substrate 10 using the alignment apparatus 100. Fig. Before the substrate 10 is transferred to the alignment apparatus 100, the control unit 131 adjusts the light of the first light source 111 (S301). The light amount from the first light source 111 is measured by the light receiving element 110 and the light amount of the first light source 111 is adjusted so that the signal intensity indicated by the light amount is equal to the optimum value. The light of the first light source 111 can be adjusted when there is no substrate 10 that can be an obstacle. When the light is adjusted after the substrate is conveyed, the amount of light at the portion where light is blocked by the substrate 10 can not be confirmed. In this case, the signal strength may exceed the allowable value during the rotation operation of the substrate 10. [

Subsequently, the substrate 10 is moved to the alignment apparatus 100 by a loading robot (not shown) (S302). The transferred substrate 10 is supported by a vacuum adsorption mechanism (not shown) of the support 123. At this time, where the substrate 10 is moved, the substrate is not yet aligned, and is typically deviated from the target position in the translational direction and the rotational direction.

Subsequently, the control unit 132 adjusts the light of the second light source 112 (S303). Since the light reflected from the mark 11 needs to be received, the light of the second light source 112 is adjusted using this value when the value of the light amount is used in the previous alignment.

The control unit 133 rotates the substrate 10 using the rotation stage 121 (S304). The light receiving element 110 is irradiated with the light emitted from the first light source 111 and the light emitted from the second light source 112 and then emitted from the back surface of the substrate 10 while the rotation stage 121 rotates the substrate 10 And receives the reflected light. When the second light source 112 irradiates the light so that its illumination range includes the mark 11, the light receiving element 110 also receives the light reflected from the mark 11. The light receiving element 110 receives light from each of the first light source 111 and the second light source 112 while rotating the substrate 10 and rotates the position information about the edge 12 of the substrate 10 in the rotation direction .

The control unit 130 sequentially captures the received light signal (S305), and detects the position of the mark 11 and the position of the edge 12 of the substrate 10 using the captured signal (S306). When the rotation stage 121 rotates the substrate 10 by an amount required for alignment (360 DEG when one mark is used), the control unit 133 stops the rotation operation (S307).

Step S306 will be described with reference to FIG. 3 shows the relationship between the detection signal waveform (hereinafter referred to as a received-light waveform) 140 corresponding to the light-receiving result and the substrate 10 when the mark 11 is present in the field of view of the light- do. The abscissa represents the position R in the radial direction of the substrate 10, and the ordinate represents the amount of light. The light receiving waveform 140 shows a state in which the amount of light is large in a region outside the substrate 10 and a region inside thereof. The amount of light in the region outside the substrate 10 corresponds to the light that is irradiated from the first light source 111 and passes through the portion not blocked by the substrate 10. [ The amount of light in a part of the inside of the substrate 10 corresponds to the light reflected from the mark 11.

The control unit 130 determines in the light receiving waveform 140 that the position 142 where the amount of light initially drops below the predetermined threshold value 141 while the scan moves from the outermost region toward the center of the substrate 10 is the edge 12). Similarly, the control unit 130 determines that the central portion between the positions 143 and 144, where the amount of light exceeds the predetermined threshold 145 while the scan is moving from the position 142 toward the center side, As shown in FIG. Thresholds 141 and 145 may be the same value. When the amount of light from the first light source 111 and the amount of light reflected from the mark 11 are different, the thresholds 141 and 145 may be different.

Referring to FIG. 2, the control unit 130 determines whether the mark 11 is detected (S308). If it is determined that the mark 11 is not detected (NO), the process returns to step S303, and the light amount of the second light source 112 is readjusted. If it is determined in step S308 that the mark 11 is detected (YES), the control unit 130 stores the light amount of the second light source 112 at this time in the memory 134 (S309). The control unit 130 can use the obtained signal strength corresponding to the mark 11 to determine the amount of light at which the optimum signal strength can be obtained and store it in the memory 134. [

The control unit 130 determines the position of the substrate 10 using the position of the mark 11 and the position of the edge 12 obtained in steps S305 and S306. The control unit 130 obtains the position waveform 80 corresponding to the edge 12 shown in Fig. 4 from the light receiving waveform 140 for each rotation angle. The abscissa represents the rotational angle? And the ordinate represents the position R of the substrate 10 in the radial direction. The mark signal 81 is detected when the rotation angle? =? Mark .

The position waveform 80 is represented by the following equation (1).

Figure 112015115918937-pat00001

5, when the center 60 of the substrate 10 is eccentric from the center 125 of the stage 120, r represents the magnitude of the eccentric vector 21 (X, Y), and θ Represents the angle of rotation between S304 and S307 and alpha represents the angle formed between the eccentric vector 21 and the straight line connecting the center 125 and the light receiving element 110 and L represents the radius of the substrate 10 Θ mark represents an angle between a straight line connecting the center 125 and the mark 11 and a straight line connecting the center 125 and the light receiving element 110.

The controller 130 determines the horizontal position of the substrate 10 with respect to the stage 120 using the position waveform 80 and determines the position of the rotation direction using the θ mark .

The control unit 133 drives the stage 120 in the translational direction and the rotational direction using the positional information on the substrate 10 determined by the control unit 130 and sets the substrate 10 at a predetermined position (S311) . Alternatively, the loading robot may use the positional information regarding the substrate 10 to rearrange the substrate 10 at a predetermined position on the stage 120. By performing the positional alignment in this manner, it is possible to prevent the processing accuracy caused by the displacement of the substrate 10 during the subsequent transport operation or the processing operation from being lowered.

Finally, the substrate 10 is unloaded from the alignment apparatus 100 (S312). Since the edge 12 is also detected, the edge exposure process can be executed using the detection result before the removal at S312.

According to the present embodiment, even if the substrate 10 does not have a cut-out portion, the position of the substrate can be precisely determined. Therefore, reduction in the yield of the chip due to the reduction in precision in the polishing and other processing near the notch, which frequently occurs in the prior art, can be prevented.

Since the common light receiving element 110 receives both the light from the first light source 111 and the light from the second light source 112 and the phase based on all of the received light at the same time is used, The edges 12 can be collectively detected.

The mounting load on the aligning apparatus 100 can be reduced, and further, the alignment of the light source is not required, as compared with the case where the light receiving elements corresponding to the respective light sources are arranged. This can reduce the deterioration factor of the detection accuracy of the mark 11 and the edge 12, which can lead to precise positioning of the substrate 10.

Second Embodiment

The distance from the edge 12 to the mark 11 or the distance from the edge 12 to the mark 11 in the alignment apparatus 100 according to the second embodiment, And the corresponding signal width is stored in the memory 134. The rest of the configuration is substantially the same as the alignment apparatus 100 according to the first embodiment.

6 shows the relationship between the light receiving waveform 140 and the substrate 10 when the mark 11 is present in the field of view of the light receiving element 110. Fig. When the foreign substance 20 adheres to the back surface of the substrate 10, the light reflected from the foreign substance 20 is also displayed on the received light waveform 140. When the signal intensity corresponding to the reflected light from the foreign substance 20 exceeds the threshold value 145, the control unit 130 may misinterpret it as the light reflected from the mark 11. [ This embodiment is an effective method in this case.

The control unit 130 detects the edge 12 of the substrate 10 using the light receiving waveform 140. [ The control unit 130 uses the distance from the edge 12 stored in the memory 134 to the mark 11 to determine whether the position R detection range used for specifying the position of the mark 11 is a position 83 and 84, respectively. If there is a signal in the range between positions 83 and 84 that exceeds the threshold value 145, the controller 130 determines that the mark 11 is present and specifies the position of the mark 11. Thus, as in the first embodiment, the mark 11 and the edge 12 can be detected with a simple configuration, and the substrate 10 can be aligned.

The use of a part of the light receiving result in the radial direction and the distance from the edge 12 to the mark 11 for each rotation angle makes it possible to prevent the mark 11 generated by the light reflected from the foreign matter 20 from being inaccurate Detection can be prevented (see Fig. 7). The narrowed detection range can lead to a shortening of the time required for the position detection of the mark 11. Alternatively, by analyzing the received light waveform 140 in the narrowed detection range in detail, the position detection accuracy of the mark 11 can be improved.

Third Embodiment

When the light receiving element 110 performs imaging in a state in which the first light source 111 and the second light source 112 maintain the illumination state while the substrate 10 is rotated, Or a blur may occur on the edge 12. The waveform of the portion corresponding to the edge 12 can be wavy and the half width of the peak waveform corresponding to the mark 11 can be increased in the light receiving waveform 140, Similar phenomena can occur. This can reduce the accuracy of detecting the position of the edge 12 or the mark 11.

In order to solve this problem, in the alignment apparatus 100 according to the third embodiment, the control unit 131 sets the illumination interval of the first light source 111, the control unit 132 controls the second light source 112, Lt; / RTI > The other configuration is substantially the same as that of the alignment apparatus 100 of the first embodiment, and the substrates 10 are aligned by substantially the same technique.

That is, during the rotation of the substrate 10, the first light source 111 and the second light source 112 emit blinking light repeating on and off states at short intervals. This can lead to reduction of the image blur, and the influence on the detection accuracy of the mark 11 and the edge 12 can be reduced.

The phase fluctuation is large in the rotational direction. Accordingly, the time for which the second light source 112 illuminates may be shorter than the first light source 111. [ Therefore, since the light amount of the first light source 111 entering the light receiving element 110 increases, a light source having a smaller light amount (luminance) than the second light source 112 can be selected as the first light source 111 have.

Fourth Embodiment

The configuration of the alignment apparatus 100 according to the fourth embodiment is substantially the same as that of the first embodiment. Three marks (a plurality of marks) 11 are arranged concentrically with respect to the center 60 of the substrate 10 and spaced apart from each other such that the center angles thereof are respectively 120 DEG .

In this case, the rotation angle when the control unit 130 rotates the substrate 10 between S304 and S307 is only 120 degrees. This is because one or more marks 11 can be detected by rotation of 120 degrees. In this manner, the time required for the detection of the mark 11 and the edge 12 can be reduced by adjusting the light receiving range in the rotational direction in accordance with the number of the marks 11. [

If the mark 11 can not be detected by a rotation of 120 degrees, the light-emitting condition of the second light source 112 can be changed. An example of the light-emitting condition may include the amount of light and the angle of incidence of the light with respect to the mark 11. [

The improvement of the S / N ratio of the signal intensity by increasing the signal intensity by increasing the light amount or changing the projection angle improves the possibility of detecting the mark. An example of the method of changing the angle of projection angle is a method of arranging the second light source 112 at various angles and switching the illumination elements and arranging a plurality of paths for guiding light from the second light source 112, And < / RTI > The second light source 112 can be moved by a driving mechanism (not shown).

When a combination with the third embodiment is used, the illumination time can also be included in the light emission condition. The mark 11 can be detected in a short time by changing the light-emitting condition according to the number of the marks 11 on the back surface and the rotation angle of the substrate 10 (rotation direction position of the substrate).

Another case in which a plurality of marks are two or more kinds of marks 11 is explained. If the line widths or space widths are different, the light from each mark 11 can be distinguished from the distribution of signal intensities. In this case, the control unit 130 specifies the position of the substrate 10 based on the position and type of the plurality of marks (information on a plurality of marks) and the result of light reception. The substrate 10 is rotated by 360 degrees and a plurality of marks 11 are detected and the actual distance of the position of the mark 11 on the substrate 10 in the rotational direction and the distance in the rotational direction of the detected mark 11 are . The influence of the measurement error can be reduced, and the positioning accuracy of the substrate 10 can also be improved.

Fifth Embodiment

In the alignment apparatus 100 according to the fifth embodiment, three kinds of different marks 11 (three kinds of marks 11 corresponding to three kinds of marks 11 as shown in Fig. 9) Mark signals 81, 85, and 86) are stored in the memory 134 as templates (sample information about one or more marks). The other configuration is substantially the same as that of the alignment apparatus 100 according to the first embodiment.

Fig. 8 is a flowchart showing the alignment progressing method according to the fifth embodiment. The steps S401 to S405 are substantially the same as the steps S301 to S305 of Fig. 2, and the steps S409 to S413 are substantially the same as the steps S308 to S312 of Fig. 2, Do not. Steps S406 to S408 will be mainly described.

During the acquisition of the signal from the light receiving element 110 in S405, the controller 130 detects only the edge 12 (S406). After the rotation stop S407, the controller 130 generates a two-dimensional image in which the positions of the edges 12 are aligned, as shown in Fig. 9, using the signals obtained from the light receiving element 110. [ In Fig. 9, the horizontal axis represents the rotation angle [theta], and the vertical axis represents the position R in the radial direction.

The control unit 130 generates a two-dimensional image represented by the mark signals 81, 85, and 86 without distortion due to the rotation component. The control unit 130 specifies the position of the substrate 10 by performing template matching between the mark signals 81, 85 and 86 and the images of the three different marks 11 stored in the memory 134 (S408). In this manner, the notch-free substrate 10 can be precisely aligned based on the light-receiving result and the template of the mark 11 (S411, S412).

By the template-matching technique, foreign matter signals 90 and 91 or other similar signals are not mistaken as mark signals. Even when different kinds of marks are formed on the substrate 10, their positions can be easily specified. In addition, by using in combination with the second embodiment, the detection range can be narrowed to the area between the positions 83 and 84. [ In this case, the time required for detection can be shortened.

Sixth Embodiment

The sixth embodiment is an embodiment in which the light receiving element 110 detects light transmitted from the first light source 111 and light reflected from the mark 11 after being emitted from the second light source 112 at different timings. That is, after the edge 12 is detected from the image obtained using only the light emitted from the first light source 111, the position of the mark 11 is detected using only the light emitted from the second light source 112 Is detected using only the obtained image.

By performing the rotating operation while correcting the eccentricity of the substrate 10 based on the obtained first position of the edge 12 when the mark 11 is detected using the second light source 112, An aligned two-dimensional image of the position of the edge 12 can be obtained similarly to the image as shown in Fig. In this example, the time required for signal processing can be shortened as compared with the case where the position of the edge 12 from the obtained received light waveform 140 is an aligned two-dimensional image. Further, when the imaging region of the light receiving element 110 is narrowed, the time required for signal processing can be shortened.

Depending on the required detection accuracy, different rotational speeds by the rotating stage 121 can be used at the time of edge detection 12 and at the time of detection of the mark 11. For example, the number of acquired data elements of the received light waveform 140 can be reduced by rotating the substrate 10 at a higher rate than when detecting the mark 11 upon detection of the edge 12. In this case, the load of the signal processing can be reduced.

Other Embodiments

Other embodiments common to the first to fifth embodiments will be described.

The mark 11 may be a mark previously formed to define the crystal orientation of the substrate 10 according to a standard specification without being processed by the user. The standard mark is three types of marks each having an array of concave portions in a plurality of hemispherical shapes. The three types of marks have different arrangements of the recesses and are arranged on the back surface of the substrate 10 at intervals of about 120 [deg.]. In this case, the time and step required to independently form the mark 11 can be omitted. Information about only one kind of three kinds of marks and information about edges can be used.

The standard mark is a mark formed to have a position error of about 10 占 퐉 in the translation direction and a position error of about 0.1 占 in the rotation direction. Therefore, as in the above embodiment, continuous positional information about the edge 12 is obtained together with the case where the position (x, y,?) Of the substrate 10 is determined by measuring the positions of the three standard marks The position of the substrate 10 can be determined more precisely. The position of the substrate 10 can be determined more precisely than when the positional information about the edge 12 is obtained discretely.

The light receiving element 110 may have a different sensitivity mainly in a region that receives light from the first light source 111 and in a region that mainly receives light from the second light source 112. [ The edge 12 and the mark 11 can be detected by the rotation of the first light source 111 and the second light source 112 instead of the rotation of the substrate 10. [

The control unit 130 can detect the edge 12 and the mark 11 using the waveform obtained by executing the moving average process on the light reception waveform 140. [ Since the signal corresponding to the foreign matter 20 is typically localized relative to the signal corresponding to the mark 11, the noise signal generated by the foreign matter 20 can be reduced.

The moving average process is a process of sequentially calculating the average value that is calculated within a fixed time interval. An example of the moving average process may be a process of converting the signal intensity at each angle? Of the received light waveform 140 into an average value of the signal intensities included in the range of? = ± 1 °.

The first light source 111 can irradiate the light upward in the vertical direction on the back side so that its illumination range includes the edge 12 and the optical system 113 and the light receiving element 110 can emit light in the vertical direction, (111). ≪ / RTI > However, in this case, the light reflected from the mark 11 after being irradiated from the second light source 112 is guided to the optical system 113 while its optical path is bent by another optical system (not shown). Light from the first light source 111 can be irradiated near the edge 12 by causing its optical path to bend by using another optical system (not shown).

The illumination method used in the second light source 112 may be bright-field illumination. An illumination method in which the mark 11 can be easily detected depending on the material of the substrate 10 or the shape of the mark 11 can be selected. When the mark 11 is close to the periphery of the substrate 10, the light can be incident obliquely from the center side by the dark-field illumination. In this case, since the light reflected from the chamfered portion 13 is strongly detected in the light receiving element 110, it is possible to prevent the detection of a small amount of light including positional information about the edge 12 and the mark 11 from being disturbed .

The light receiving element 110 may receive light from at least one of the first light source 111 and the second light source 112 while the rotation stage 121 rotates the substrate 10 in some embodiments. do.

The first light source 111 and the second light source 112 have the same or different light source wavelengths. The light to be irradiated needs to have a wavelength that does not affect subsequent processing. For example, when a substrate 10 coated with a photosensitive material such as a resist is used, light having a wavelength (for example, 450 to 800 nm) in which the photosensitive material is not exposed is formed on the surface of the substrate 10 coated with the resist . When the substrate 10 is made of a material such as a glass substrate that transmits light, the wavelength can be changed so that signal intensity easily appears along the substrate. The first light source 111 and the second light source 112 may be light sources other than LEDs.

Mounting on other devices

10 shows an exposure apparatus (lithography apparatus) 500 mounted with the alignment apparatus 100 according to the first embodiment, observed from the + Z direction. The exposure apparatus 500 irradiates, for example, an i-line (wavelength: 365 nm) using the optical system 510 and forms a pattern such as a circuit pattern on the substrate 10 on the exposure stage 520.

The transfer arm 530 carries the substrate 10 of the standby position 540 onto the stage 120 of the alignment apparatus 100. The aligning apparatus 100 adjusts the standby position of the substrate 10 and the transfer arm 550 places the substrate 10 on the exposure stage 520. After the pattern exposure is completed, the transfer arm 530 returns the substrate 10 to the standby position 540. [

The exposure apparatus 500 may include a light source (not shown) and an optical system (not shown) different from those described above in the vicinity of the alignment apparatus 100. The exposure apparatus 500 is configured to position the substrate 10 on the substrate 10 based on positional information about the edge 12 of the substrate 10 obtained using the alignment apparatus 100 while rotating the substrate 10 by the rotation stage 121 10 (outermost or slightly inside thereof) is annularly exposed (edge exposure is performed).

Unnecessary resists can be removed when forming the annular protruding structure on the outside of the substrate 10. This makes it possible to form an annular protrusion on the surface of the substrate 10 and facilitate plating in order to prevent peeling of the semiconductor layer on the substrate 10 in a plating apparatus (not shown) outside the exposure apparatus 500 . In particular, an insufficient supply of the resist to the periphery of the substrate 10 or a supply shortage of the resist to the periphery caused by the supply of the resist to the shifted region from the predetermined position can be prevented.

The light (beam) projected onto the substrate by the lithographic apparatus of the present invention is not limited to an i-line. May be a light in a far ultraviolet region such as KrF light (wavelength 248 nm) or ArF light (wavelength 193 nm), or a g line (wavelength 436 nm) which is light in visible light region. The lithographic apparatus may be an apparatus for irradiating a charged particle beam to a substrate and forming a latent image pattern on the wafer, or an apparatus for forming a pattern on a substrate by an imprint technique.

The alignment apparatus 100 may also be mounted on another processing unit that requires alignment of the substrate 10.

How to make goods

The article manufacturing method according to an embodiment of the present invention includes the steps of forming a pattern on a substrate (e.g., a wafer or a glass plate) using a lithographic apparatus, and performing a process on the substrate on which the pattern is formed do. Examples of the article may include a semiconductor integrated circuit element, a liquid crystal display element, an imaging element, a magnetic head, a compact-disk rewritable (CD-RW), an optical element, and a photomask. Examples of treatments are etching and ion implantation. Other known processing steps (e.g., development, oxidation, deposition, deposition, planarization, resist stripping, dicing, bonding, and packaging) may also be included.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims (17)

A positioning device comprising:
A first transmitting unit configured to irradiate an edge portion of a substrate disposed on a stage with light, the substrate having a first flattening portion or a notch as a mark,
A second light projecting unit configured to irradiate light onto at least one mark on the surface of the substrate,
And a second projection unit disposed on the surface side of the substrate and configured to receive light passing through an area outside the substrate after being irradiated from the first light projecting unit and light reflected from the one or more marks after being irradiated from the second light projecting unit A light receiving unit configured to receive light, and
The position of the at least one mark and the position of the edge portion are determined based on the light receiving result by the light receiving unit and the position of the substrate with respect to the stage is determined based on the determined position of the edge portion and the determined position of the at least one mark And a determination unit configured to determine the position of the positioning member. The method according to claim 1,
And the second light projecting unit irradiates light at an angle from the inner side to the outer side of the substrate with respect to the surface of the substrate. The method according to claim 1,
Wherein a surface of the first translucent unit corresponding to a side on which light is irradiated to the substrate and a surface corresponding to a side on which the second translucent unit irradiates the substrate with light are different from each other. The method according to claim 1,
Further comprising a rotation unit configured to rotate the substrate,
Wherein the light receiving unit receives at least one of light from the first light transmitting unit and light from the second light transmitting unit while the rotating unit rotates the substrate. The method according to claim 1,
And the second light projecting unit irradiates light onto the at least one mark on the back surface of the substrate. The method according to claim 1,
And the determination unit determines the position of the substrate based on the light reception result and the sample information about the one or more marks. The method according to claim 1,
Wherein the determining unit determines the position of the at least one mark using only information of the distance from the edge portion to the at least one mark and a selected portion of the light receiving result in the radial direction of the substrate. The method according to claim 1,
And the second light projecting unit emits blinking light. The method according to claim 1,
Wherein the light receiving unit adjusts the light receiving range in the rotational direction of the substrate based on the number of the at least one mark. The method according to claim 1,
And the second light transmitting unit changes the light emitting condition based on the number of the at least one mark and the position of the substrate in the rotational direction of the substrate. The method according to claim 1,
And the determination unit determines the position of the substrate based on the moving average processing result performed on the light reception result. A method of positioning,
An irradiation step of irradiating light onto an edge of a substrate disposed on a stage and at least one mark provided on a surface of the substrate, the substrate having no reference flat portion or a notch as a mark,
A light receiving step of receiving light passing through the outside region of the substrate and light reflected from the at least one mark using one light receiving unit,
A first determining step of determining a position of the edge portion and a position of the at least one mark based on the light receiving result in the light receiving step,
And a second determining step of determining a position of the substrate with respect to the stage based on the determined position of the edge portion determined in the first determining step and the determined position of the one or more marks. 13. The method of claim 12,
Wherein the at least one mark on the substrate comprises a plurality of marks,
Wherein the position of the substrate is determined based on the light receiving result in the light receiving step and information on the plurality of marks. A lithographic apparatus comprising:
12. A positioning apparatus according to any one of claims 1 to 11, and
And a position adjustment unit configured to adjust a position of the substrate with respect to a stage that can move with the substrate disposed on the substrate, based on the position of the substrate determined by the positioning apparatus,
Wherein the lithographic apparatus forms a pattern on the substrate adjusted by the position adjustment unit. 15. The method of claim 14,
Wherein the lithographic apparatus performs edge exposure on the substrate based on a position of the edge portion of the substrate obtained by the positioning apparatus. A method of manufacturing an article,
Forming a pattern on the substrate using the lithographic apparatus according to claim 14, and
And processing the substrate on which the pattern is formed by the forming step. delete
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