KR20200041779A - Foreign substance detection apparatus, exposure apparatus and manufacturing method of article - Google Patents

Abstract

The present invention provides a foreign substance detection apparatus which detects foreign substances on a transparent member. The foreign substance detection apparatus comprises: an irradiation unit irradiating light obliquely towards the transparent member; a light reception unit detecting scattered light from foreign substances on the transparent member to which the light is irradiated by the irradiation unit; and a processing unit performing the processing of detecting the foreign substances. The processing includes: a first mode which makes a relative position of the irradiation unit and the light reception unit into a first status where the distance between the irradiation unit and the light reception unit becomes a first distance, and detects the foreign substances based on the distribution of the scattered light detected by the light reception unit in the first status; and a second mode which makes a relative position of the irradiation unit and the light reception unit into a second status where the distance between the irradiation unit and the light reception unit becomes a second distance longer than the first distance, and detects the foreign substances based on the distribution of the scattered light detected by the light reception unit in the second status.

Description

Foreign material detection device, exposure device and manufacturing method of articles {FOREIGN SUBSTANCE DETECTION APPARATUS, EXPOSURE APPARATUS AND MANUFACTURING METHOD OF ARTICLE}

The present invention relates to a foreign material detection device, an exposure device, and a method for manufacturing an article.

Semiconductor devices and liquid crystal display devices are manufactured through an exposure process in which a fine pattern formed on a mask (original plate) is transferred to a substrate (such as a glass substrate). In such an exposure process, if foreign substances such as dust, dust, and wounds are present on the mask or on the substrate, defects are generated in the pattern transferred to the substrate. Therefore, in general, before performing the exposure process, a foreign substance detection device is used to detect foreign substances on the mask or on the substrate (existence of foreign substances is checked).

The foreign matter detection apparatus mainly includes an irradiation unit that irradiates light with an oblique angle onto a mask or a substrate (the object to be detected), and a light receiving unit that detects light (reflected light or scattered light) from the foreign matter present in the irradiation area. Here, the light-receiving portion is disposed so as not to detect specular light from the top surface of the mask or substrate or light refracted or reflected from the bottom surface of the mask or substrate. Techniques for such a foreign matter detection apparatus are proposed in Japanese Patent Application Publication No. 2010-107471, Japanese Patent Application No. 4157037, and Japanese Patent Application Publication No. 2008-115031.

Japanese Unexamined Patent Publication No. 2010-107471 discloses a technique for suppressing false detection of foreign matter by providing a light shielding plate between an irradiation part and a light receiving part. Such a light-shielding plate allows light from the irradiation unit to pass to the detection object side, and also passes reflected light from the upper surface of the detection object to the light receiving unit side, and also prevents reflected light from the underside of the detection object from passing to the light receiving unit side.

In Japanese Patent No. 4157037, in a foreign matter detection apparatus having an irradiation unit for irradiating an object to be detected with line-shaped light and a light-receiving unit including a line sensor (camera), the angle of the irradiation unit or the light-receiving unit is changed. A technique for detecting foreign substances present on the top and bottom surfaces is disclosed.

Japanese Unexamined Patent Publication No. 2008-115031 is a technique for inspecting a divided section of a transparent plate-shaped detection object, and detecting reflected light from the divided section while moving the irradiation section and the light receiving section parallel to the divided section (detection of reflected light) It is disclosed that inspection of the divided cross section is performed by the presence or absence of.

In the conventional foreign substance detection apparatus, erroneous detection of foreign substances resulting from the detection of diffraction light generated in the pattern of the mask in the light-receiving portion is prevented, for example, by using a light shielding plate. However, when the object to be detected is a transparent member (hereinafter referred to as a transparent member) with a thickness, and when the side surface of the transparent member is a rough grinding surface, light illuminating the transparent member enters inside, and the side surface of the transparent member (rough grinding surface) ), Diffracted light is generated. The diffraction light on the side of the transparent member becomes light that illuminates the pattern formed on the transparent member (i.e., the side of the transparent member functions as a secondary light source), and is also detected by the light receiving portion, so noise caused by this diffracted light Is detected as a foreign substance.

The present invention provides an apparatus for detecting foreign substances that is advantageous for detecting foreign substances on a transparent member.

A foreign matter detection device as an aspect of the present invention is a foreign matter detection device that detects foreign matters on a transparent member, the irradiation unit irradiating light to the transparent member at an angle, and the transparent member irradiated with the light by the irradiation unit It has a light-receiving unit for detecting the scattered light from the foreign matter, and a processing unit for processing to detect the foreign material, the processing, the relative position of the irradiation unit and the light-receiving unit, the distance between the irradiation unit and the light-receiving unit has a first distance A first mode, and a first mode for detecting the foreign material based on the distribution of the scattered light detected by the light-receiving unit in the first state, and the relative positions of the irradiation unit and the light-receiving unit, and the irradiation unit and the light-receiving unit A second state in which the distance between the second distances is longer than the first distance, and in the second state Based on the distribution of the scattered light detected by the light receiving unit it is characterized in that a second mode for detecting the foreign matter.

Another object or other aspect of the present invention will be apparent from preferred embodiments described below with reference to the accompanying drawings.

According to the present invention, for example, it is possible to provide an apparatus for detecting foreign substances that is advantageous for detecting foreign substances on a transparent member.

1 is a schematic diagram showing the configuration of a foreign matter detection apparatus according to a first embodiment of the present invention.
2 is a view for explaining the effect on the light-receiving portion due to the difference in the characteristics of the side surfaces of the transparent flat plate.
3 is a view for explaining the effect on the light-receiving unit due to the difference in the characteristics of the side surfaces of the transparent flat plate.
4 is a diagram showing an example of the relative positions of the irradiation portion and the light receiving portion of the foreign substance detection device shown in FIG. 1.
5A to 5C are views for explaining the foreign substance detection processing in the present embodiment.
Fig. 6 is a schematic diagram showing the configuration of a foreign matter detection apparatus in a second embodiment of the present invention.
Fig. 7 is a schematic diagram showing the configuration of an exposure apparatus as one aspect of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. At this time, in each drawing, the same reference numerals are assigned to the same members, and overlapping descriptions are omitted.

<First Embodiment>

1 is a schematic diagram showing the configuration of a foreign matter detection apparatus 100 according to a first embodiment of the present invention. The foreign material detection device 100 is a device that detects a foreign material on an object to be detected. As shown in FIG. 1, the foreign matter detection apparatus 100 includes a stage 6, an irradiation unit 10, a light receiving unit 11, a processing unit 12, a generating unit 13, and a driving unit 30 Have

In this embodiment, the object to be inspected for foreign matter is a transparent member (transparent member), for example, a transparent flat plate 3 having a relatively thick thickness. The transparent flat plate 3 is held on the stage 6 in order to detect foreign substances in the area to be inspected for foreign substances on the upper surface (surface) of the transparent flat plate 3. In the present embodiment, the foreign matter detection apparatus 100 detects foreign matter on the transparent flat plate while moving the stage 6 holding the transparent flat plate 3 in the Y direction, but is not limited to this. For example, foreign matter detection on the transparent flat plate (on the transparent member) may be performed while the stage (not shown) holding the irradiation portion 10 and the light receiving portion 11 is moved in the Y direction.

The irradiation unit 10 includes a light source 1 for emitting light and an irradiation lens 2, and irradiates light to the transparent flat plate 3 at an angle. The light from the irradiation section 10 enters the area of the object to be detected on the upper surface of the transparent flat plate 3 at an angle to the normal (in an oblique direction). In addition, the irradiation unit 10 may include an angle adjusting unit that adjusts the angle of light incident on the transparent plate 3 in order to detect the light scattered from the foreign material on the transparent plate by the light receiving unit 11.

The light-receiving unit 11 includes a light-receiving lens 4 and a detector 5, and receives light (scattered light) scattered from a foreign material on a transparent plate irradiated with light by the irradiation unit 10. The scattered light from the foreign material on the transparent flat plate enters the detector 5 via the light receiving lens 4. In addition, the light receiving unit 11 includes an angle adjusting unit that adjusts the angle of the light receiving unit 11 with respect to the transparent flat plate 3 so that specular light from the upper surface of the transparent flat plate 3 does not enter the detector 5. .

The processing unit 12 is composed of, for example, a computer including a CPU or a memory, and controls the parts of the foreign material detection device 100 in accordance with a program stored in the storage unit to control the foreign material detection device 100. It works. In the present embodiment, the processing unit 12 performs processing (foreign material detection processing) for detecting foreign matter on the transparent plate.

The driving unit 30 moves the irradiation unit 10 along a direction parallel to the surface of the transparent flat plate 3 (Y direction). Since any technology well-known in the art can be applied to the driving unit 30, detailed description of its configuration and the like is omitted.

Here, referring to Figs. 2 and 3, the light receiving portion (due to the difference in the surface processing of the side surface 3a of the transparent flat plate 3, that is, the difference in characteristics of the side surface 3a of the transparent flat plate 3) The effect on 11) will be described. 2 shows a case where the side surface 3a of the transparent flat plate 3 is a polished surface, and FIG. 3 shows a case where the side surface 3a of the transparent flat plate 3 is a rough grinding surface. Of the light irradiated from the irradiating section 10 to the transparent flat plate 3, most of it is specularly reflected from the top surface of the transparent flat plate 3, but a part of it enters the inside of the transparent flat plate 3. When the side 3a of the transparent plate 3 is a polished surface, the light entering the interior of the transparent plate 3 passes through the side 3a of the transparent plate 3, as shown in FIG. When the side surface 3a of the transparent flat plate 3 is a rough grinding surface, as shown in FIG. 3, it is reflected from the side surface 3a of the transparent flat plate 3. Therefore, when the side surface 3a of the transparent flat plate 3 is a rough grinding surface, since this rough grinding surface functions as a secondary light source, the light reflected from the side surface 3a of the transparent flat plate 3 is a transparent flat plate ( It is irradiated to the pattern 8 formed on the underside of the upper side of 3). The light irradiated on the pattern 8 is reflected by the pattern 8 and enters the light-receiving unit 11 as light different from the scattered light from the foreign material on the transparent plate, and thus is misdetected as a foreign material.

In the present embodiment, when the side surface 3a of the transparent flat plate 3 is a rough grinding surface, the irradiation portion 10 is driven in the Y direction by the driving unit 30, specifically, the side surface of the transparent flat plate 3 ( Move in the direction away from 3a). Accordingly, the light reflected from the side surface 3a of the transparent flat plate 3 can be reduced, and erroneous detection of a foreign substance caused by the light reflected from the side surface 3a of the transparent flat plate 3 can be suppressed.

As shown in Fig. 4, a case is considered where the relative positions of the irradiating section 10 and the light receiving section 11 are in an ideal state. Here, when the relative positions of the irradiating portion 10 and the light receiving portion 11 are ideal, the optical axis of the irradiating portion 10 and the intersection of the upper surface of the transparent flat plate 3, the optical axis of the light receiving portion 11 and the transparent flat plate 3 The intersection of the top faces is the same. In this case, the intensity distribution LD1 of light irradiated from the irradiating section 10 to the transparent flat plate 3 becomes maximum on the optical axis (on the incident optical axis) of the irradiating section 10, and as it falls from the optical axis of the irradiating section 10 It tends to be small. This is because the relative positional relationship between the optical axis of the light-receiving section 11 on the transparent flat plate and the illumination region having an intensity distribution changes in the foreign matter detection region due to the different shape of the transparent flat plate 3, resulting in the same size. It means that a gap occurs in the detection result of foreign substances.

Therefore, in the present embodiment, as the foreign substance detection processing, the first mode or the second mode is selected, and the first mode or the second mode is selected according to the characteristics of the side surface 3a of the transparent flat plate 3. In the first mode, the relative position of the irradiation section 10 and the light receiving section 11 is equal to the distance along the direction parallel to the upper surface of the transparent flat plate 3 between the irradiation section 10 and the light receiving section 11 (Y direction). It is set as the 1st state which becomes 1 distance. Then, in the first state, the foreign material is detected based on the distribution of scattered light from the foreign material on the transparent plate, which is detected by the light receiving unit 11. Further, in the second mode, the relative position of the irradiating portion 10 and the light receiving portion 11 is a distance along a direction (Y direction) parallel to the upper surface of the transparent flat plate 3 between the irradiating portion 10 and the light receiving portion 11. Let 2 be a second distance that is longer than the first distance. Then, in the second state, the foreign material is detected based on the distribution of scattered light from the foreign material on the transparent plate, which is detected by the light receiving unit 11. At this time, the difference between the first distance and the second distance is minute, for example, in a range of 10 mm or more and 20 mm or less.

5A, 5B, and 5C, the foreign material detection processing in this embodiment, that is, the first mode and the second mode will be specifically described. Fig. 5A shows a case where the side surface 3a of the transparent flat plate 3 is a polished surface and the first mode is selected as a foreign material detection process. Here, as shown in Fig. 5A, the relative position between the irradiating section 10 and the light receiving section 11 is set to the ideal state in the first state. Further, the distance along the direction (Y direction) parallel to the upper surface of the transparent flat plate 3 between the irradiation section 10 and the light receiving section 11, the position where the light source 1 emits light and the detector 5 light Let it be the distance between the positions where it is detected. As shown in Fig. 5A, when the side surface 3a of the transparent flat plate 3 is a polished surface, the side surface 3a of the transparent flat plate 3 does not function as a secondary light source, and therefore, near the optical axis of the light receiving portion 11 The intensity change is small. Therefore, in this case, the intensity distribution LD2, like the intensity distribution LD1 shown in Fig. 4, is unlikely to be affected by the change in intensity of light irradiated from the irradiating section 10 to the transparent flat plate 3.

5B shows a case where the side surface 3a of the transparent flat plate 3 is a rough grinding surface, and the first mode is selected as a foreign material detection process. As shown in Fig. 5B, when the side surface 3a of the transparent flat plate 3 is a rough grinding surface, the side surface 3a of the transparent flat plate 3 functions as a secondary light source, so that the light receiving portion 11 has a transparent flat plate. The light reflected from the side surface 3a and pattern 8 of (3) also enters. Therefore, in this case, the intensity distribution LD3, unlike the intensity distribution LD2 shown in Fig. 5, is affected by the change in the intensity of light irradiated from the irradiating section 10 to the transparent flat plate 3, and at various locations within the material detection area. There is a possibility of false detection with foreign matter.

5C shows a case where the side surface 3a of the transparent flat plate 3 is a rough grinding surface, and a second mode is selected as a foreign material detection process. In the second mode, the irradiation portion 10 is moved in a direction away from the side surface 3a of the transparent flat plate 3, as described above, as described above, the top surface of the transparent flat plate 3 between the irradiation portion 10 and the light receiving portion 11 Let the distance along the direction parallel to (Y direction) be the second distance longer than the first distance. As illustrated in FIG. 5C, by moving the irradiation unit 10 in a direction away from the side surface 3a of the transparent flat plate 3, light traveling to the side surface 3a of the transparent flat plate 3 can be reduced. Therefore, in this case, the intensity distribution LD4 can make it difficult to be influenced by the change in intensity of light irradiated from the irradiation section 10 to the transparent flat plate 3, similarly to the intensity distribution LD2 shown in Fig. 5A.

Therefore, in the present embodiment, the processing unit 12 acquires information indicating the characteristics of the side surface 3a of the transparent flat plate 3, and the side surface 3a of the transparent flat plate 3 is a polishing surface. When shown, the first mode is selected as the foreign substance detection process (see Fig. 5A). On the other hand, when the information indicating the characteristics of the side surface 3a of the transparent flat plate 3 indicates that the side surface 3a of the transparent flat plate 3 is a rough grinding surface, a second mode is selected as a foreign material detection process (FIG. 5c). Accordingly, even when the object to be detected is the transparent flat plate 3 and the side surface 3a of the transparent flat plate 3 is a rough grinding surface, the light reflected from the side surface 3a of the transparent flat plate 3 can be reduced. Therefore, it is possible to suppress a false detection of a foreign substance by such light. At this time, in order to further suppress erroneous detection of foreign matter by light reflected from the side surface 3a of the transparent flat plate 3, the foreign matter detection target area in the first mode and the foreign matter detection target area in the second mode are different. You may do it. Specifically, in the second mode, the region affected by the light reflected from the side surface 3a of the transparent flat plate 3 may be excluded from the region to be detected.

In addition, in this embodiment, the case where the first mode and the second mode are set by changing the distance in the direction parallel to the surface of the transparent flat plate 3 with respect to the distance between the irradiation section 10 and the light receiving section 11 However, it is not limited to this. For example, the first mode and the second mode by moving the irradiation portion 10 in the vertical direction (Z direction) (ie, changing the distance in the vertical direction between the irradiation portion 10 and the surface of the transparent plate 3) It is also possible to set the mode.

In the present embodiment, information indicating the characteristics of the side surface 3a of the transparent flat plate 3 is generated by the generating unit 13, and the processing unit 12 is a transparent flat plate 3 generated by the generating unit 13 Information indicating the characteristics of the side surface 3a is obtained. The generating unit 13 is based on the intensity distribution formed on the transparent plate by the light irradiated from the irradiating portion 10 to the transparent plate 3 before and after moving the irradiating portion 10 by the driving portion 30. , Information indicating characteristics of the side surface 3a of the transparent flat plate 3 is generated. For example, the generation unit 13 includes an intensity distribution formed on a transparent flat plate when the relative positions of the irradiation unit 10 and the light receiving unit 11 are the first state described above, and the irradiation unit 10 and the light receiving unit 11 Compare the intensity distribution formed on the transparent plate when the relative position of the above is the second state. Then, the generating unit 13 generates information indicating that the side surface 3a of the transparent flat plate 3 is a polishing surface when the difference is equal to or less than the threshold value, and is transparent when the difference is greater than the threshold value. Information indicating that the side surface 3a of the flat plate 3 is a rough grinding surface is generated.

Further, the generation unit 13 compares the intensity distribution LD1 shown in FIG. 4 with the intensity distribution formed on the transparent flat plate when the relative positions of the irradiation unit 10 and the light receiving unit 11 are in the first state described above, The information indicating the characteristics of the side surface 3a of the transparent flat plate 3 may be generated. In this case, the intensity distribution LD1 shown in Fig. 4 needs to be acquired in advance.

In addition, in the foreign matter detection apparatus 100, according to the characteristics of the side surface 3a of the transparent flat plate 3, the angles of the irradiating portion 10 and the light receiving portion 11 relative to the transparent flat plate 3 are arbitrarily changed to be transparent. You may adjust the influence of the change in intensity of light irradiating the flat plate 3.

In addition, the processing unit 12 is based on the distribution of the scattered light detected by the light receiving unit 11 while reciprocating the stage 6 holding the transparent plate 3 in the Y direction, and the transparent plate ( It may have a function of identifying noise due to light reflected from the side surface 3a of 3).

In the present embodiment, the relative positions of the irradiating portion 10 and the light receiving portion 11 are defined as a distance along a direction (Y direction) parallel to the upper surface of the transparent flat plate 3 between the irradiating portion 10 and the light receiving portion 11. I explained how to do it. However, it is also possible to define the relative positions of the irradiation section 10 and the light receiving section 11 as a relationship between the optical axis of the irradiation section 10, the optical axis of the light receiving section 11, and the top surface of the transparent flat plate 3. In this case, as the relative positions of the irradiation portion 10 and the light receiving portion 11, the intersection of the optical axis of the irradiation portion 10 and the upper surface of the transparent flat plate 3, and the optical axis of the light receiving portion 11 and the upper surface of the transparent plate 3 The state in which the distance along the direction parallel to the upper surface of the transparent flat plate 3 between the intersection points becomes the first distance is set as the first state. In addition, as the relative positions of the irradiation section 10 and the light receiving section 11, the intersection of the optical axis of the irradiation section 10 and the upper surface of the transparent flat plate 3, and the intersection of the optical axis of the light receiving section 11 and the upper surface of the transparent flat plate 3 The state in which the distance along the direction parallel to the upper surface of the transparent flat plate 3 between the second distance is longer than the first distance is set as the second state. At this time, the above-described distance can also be expressed as a distance in a plane including the optical axis of the irradiation unit 10 and the optical axis of the light receiving unit 11.

<Second Embodiment>

Fig. 6 is a schematic diagram showing the configuration of a foreign matter detection apparatus 100 according to a second embodiment of the present invention. The foreign substance detection device 100 according to the second embodiment further includes an irradiation control unit 14 that controls the irradiation unit 10. In addition, the irradiation unit 10 includes an aperture 15 including an opening that defines the spread of light emitted from the light source 1.

In the present embodiment, since the irradiation portion 10 includes the aperture 15, the spread of light emitted from the light source 1 is suppressed, and the side surface 3a (rough grinding surface) of the transparent flat plate 3 is suppressed. The region of the incident light can be limited, and light reflected from the pattern 8 can be suppressed. However, by providing the aperture 15, the amount of light emitted from the transparent flat plate 3 is reduced. Therefore, the irradiation control unit 14 controls the amount of light emitted from the light source 1 based on the size of the aperture of the aperture 15. At this time, the size of the aperture of the aperture 15 is determined by the irradiation control unit 14 based on the thickness of the transparent flat plate 3. Accordingly, the influence of light from the side surface 3a (rough grinding surface) of the transparent flat plate 3 is minimized, so that light incident on the light receiving portion 11 can be made only by scattered light from a foreign material. Therefore, it is possible to suppress misdetection of foreign substances by light reflected from the side surface 3a of the transparent flat plate 3.

<Third Embodiment>

The exposure apparatus 500 as one aspect of the present invention will be described with reference to FIG. 7. The exposure apparatus 500 is a lithographic apparatus employed in a lithography process that is a manufacturing process of a semiconductor device or a liquid crystal display device, and forms a pattern on a substrate. The exposure apparatus 500 exposes the substrate through a mask (original plate), and transfers the pattern of the mask to the substrate.

As shown in FIG. 7, the exposure apparatus 500 holds the illumination optical system 510, the projection optical system 520, the mask stage 540 that moves while holding the mask 530, and the substrate 550. It has a substrate stage 560 to move, and a foreign substance detection device 100. In addition, the exposure apparatus 500 is constituted by a computer including a CPU, a memory, and the like, and a control unit for operating the exposure apparatus 500 by collectively controlling each part of the exposure apparatus 500 according to a program stored in the storage unit (570).

The illumination optical system 510 is an optical system that illuminates the mask 530 with light from a light source. The mask 530 is formed of a transparent flat plate, and a pattern corresponding to a pattern to be formed on the substrate 550 is formed on a bottom surface opposite to the top surface thereof. The mask 530 is held by the mask stage 540. As a foreign matter detection device that detects a foreign material present on the upper surface of the mask 530, the above-described foreign material detection device 100 is applied. The foreign substance detection device 100 suppresses false detection of foreign substances, and can detect foreign substances on the mask with high precision.

The substrate 550 is held by the substrate stage 560. The mask 530 and the substrate 550 are disposed at optically nearly conjugate positions (positions of the object surface and the image surface of the projection optical system 520) via the projection optical system 520. It is also possible to apply the foreign substance detection device 100 described above to the detection of foreign substances present on the substrate. The projection optical system 520 is an optical system that projects an object onto an image plane. A reflectometer, a refractometer, and a refractometer can be applied to the projection optical system 520. In the present embodiment, the projection optical system 520 projects a pattern formed on the mask 530 onto the substrate 550 with a predetermined projection magnification. Then, the mask stage 540 and the substrate stage 560 are scanned at a speed ratio according to the projection magnification of the projection optical system 520 in a direction parallel to the object surface of the projection optical system 520 (for example, the X direction). do. Accordingly, the pattern formed on the mask 530 can be transferred to the substrate 550.

<Fourth Embodiment>

The manufacturing method of the article in the embodiment of the present invention is suitable for manufacturing articles such as devices (semiconductor devices, magnetic storage media, liquid crystal display devices, etc.), color filters, optical parts, MEMS, for example. Such a manufacturing method includes a step of exposing a substrate coated with a photosensitive agent using the exposure apparatus 500 and a step of developing the exposed photosensitive agent. Further, a circuit pattern is formed on the substrate by performing a process of etching the substrate using a pattern of the developed photoresist as a mask, an ion implantation process, or the like. By repeating these exposure, development, and etching processes, a circuit pattern composed of a plurality of layers is formed on the substrate. In the post process, dicing (processing) is performed on the substrate on which the circuit pattern is formed, and chip mounting, bonding, and inspection processes are performed. In addition, such a manufacturing method may include other well-known processes (oxidation, film formation, deposition, doping, planarization, resist peeling, etc.). The method for manufacturing an article in the present embodiment is advantageous in at least one of performance, quality, productivity, and production cost of the article, compared to the prior art.

Although preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the gist thereof.

Claims (14)

As a foreign matter detection device for detecting foreign matter on the transparent member,
And an irradiation unit for irradiating light at an angle to the transparent member,
A light receiving unit for detecting scattered light from a foreign material on the transparent member irradiated with the light by the irradiation unit;
Has a processing unit for performing the processing for detecting the foreign matter,
The above treatment,
The relative position of the irradiating unit and the light receiving unit is set to a first state in which a distance between the irradiating unit and the light receiving unit is a first distance, and the foreign matter is based on the distribution of the scattered light detected by the light receiving unit in the first state. A first mode for detecting,
The relative position of the irradiation portion and the light receiving portion is a second state in which a distance between the irradiation portion and the light receiving portion becomes a second distance longer than the first distance, and the scattered light detected by the light receiving portion in the second state is And a second mode for detecting the foreign material based on the distribution.
According to claim 1,
The processing unit acquires information indicating characteristics of a side surface of the transparent member, and selects the first mode or the second mode according to the information.
According to claim 2,
The processing unit selects the first mode when the information indicates that the side of the transparent member is a polished surface, and when the information indicates that the side of the transparent member is a rough grinding surface, the second Foreign matter detection device characterized in that the mode is selected.
According to claim 1,
The difference between the first distance and the second distance is 10 mm or more, and further, 20 mm or less.
According to claim 1,
The first state is a state in which the intersection of the optical axis of the irradiation unit and the surface of the transparent member and the intersection of the optical axis of the light receiving unit and the surface of the transparent member coincide,
The second state is a foreign matter detection device, characterized in that the intersection of the optical axis of the irradiation unit and the surface of the transparent member and the intersection of the optical axis of the light receiving unit and the surface of the transparent member do not match.
According to claim 2,
In the first state, an intensity distribution formed on the transparent member by light irradiated from the irradiation unit to the transparent member, and in the second state, on the transparent member by light irradiated from the irradiation unit to the transparent member. Based on the formed intensity distribution, further has a generating unit for generating the information,
The processing unit, the foreign matter detection device, characterized in that for obtaining the information from the generation unit.
The method of claim 6,
The generation unit,
In the first state, an intensity distribution formed on the transparent member by light irradiated from the irradiation unit to the transparent member, and in the second state, on the transparent member by light irradiated from the irradiation unit to the transparent member. When the difference in the intensity distribution to be formed is less than or equal to a threshold value, the information indicating that the side surface of the transparent member is a polishing surface is generated,
In the first state, an intensity distribution formed on the transparent member by light irradiated from the irradiation unit to the transparent member, and in the second state, on the transparent member by light irradiated from the irradiation unit to the transparent member. When the difference in the intensity distribution to be formed is greater than the threshold value, the foreign matter detection device characterized in that the information indicating that the side surface of the transparent member is a rough grinding surface is generated.
According to claim 1,
The irradiation unit,
A light source that emits the light,
And an aperture including an opening that defines the spread of the light emitted from the light source,
And an irradiation control unit for controlling the amount of light emitted from the light source based on the size of the aperture of the aperture.
The method of claim 8,
The irradiation control unit, on the basis of the thickness of the transparent member, the foreign matter detection device, characterized in that for determining the size of the aperture of the aperture.
As a foreign matter detection device for detecting foreign matter on the transparent member,
And an irradiation unit for irradiating light at an angle to the transparent member,
A light receiving unit for detecting scattered light from a foreign material on the transparent member irradiated with the light by the irradiation unit;
Has a processing unit for performing the processing for detecting the foreign matter,
The above treatment,
The relative position of the irradiation part and the light receiving part is set to a first state in which the distance between the intersection of the optical axis of the irradiation part and the surface of the transparent member and the intersection of the optical axis of the light receiving part and the surface of the transparent member is the first distance. , A first mode for detecting the foreign material based on the scattered light distribution detected by the light receiving unit in the first state,
The relative distance between the irradiation portion and the light-receiving portion is a distance between the intersection of the optical axis of the irradiation portion and the surface of the transparent member, and the distance between the optical axis of the light-receiving portion and the intersection of the surface of the transparent member is a second distance longer than the first distance. And a second mode for detecting the foreign material based on a distribution of the scattered light detected by the light receiving unit in the second state.
An exposure apparatus for exposing a substrate,
A projection optical system that projects a pattern of a mask onto the substrate,
It has a foreign matter detection device for detecting foreign matter on the mask,
The mask is composed of a transparent member on which the pattern is formed,
The foreign substance detecting apparatus comprises the foreign substance detecting apparatus according to claim 1.
An exposure apparatus for exposing a substrate,
A projection optical system that projects a pattern of a mask onto the substrate,
It has a foreign matter detection device for detecting foreign matter on the mask,
The mask is composed of a transparent member on which the pattern is formed,
The foreign substance detecting device comprises the foreign substance detecting device according to claim 10.
A step of exposing the substrate using the exposure apparatus according to claim 11,
Developing the exposed substrate;
And a process for manufacturing the article from the developed substrate.
A process of exposing a substrate using the exposure apparatus according to claim 12,
Developing the exposed substrate;
And a process for manufacturing the article from the developed substrate.

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