JP6490771B1 - POSITION DETECTION DEVICE, POSITION DETECTION METHOD, AND DEPOSITION DEVICE - Google Patents

Abstract

A position detection apparatus, a position detection method, and a vapor deposition apparatus capable of improving the detection accuracy of the position of a substrate are provided. An image processing unit calculates a relative position between cameras of a surface photographing unit based on a result obtained by photographing each substrate mark by each camera of the surface photographing unit, and calculates a relative position between the cameras. Using the result of each camera 11 of the front surface photographing unit photographing the processing substrate W, the position of the processing substrate W by front surface photographing is calculated, and each camera 12 of the rear surface photographing unit images a transmission image of the substrate mark Wm. From the result, the relative position between the cameras 12 of the back surface photographing unit is calculated, and the processing substrate by the back surface photographing using the relative position between the cameras 12 and the result of each camera 12 of the back surface photographing unit photographing the processing substrate W. The position of W is calculated. [Selection] Figure 1

Description

  The present invention relates to a position detection device that detects the position of a substrate, a position detection method, and a vapor deposition apparatus that includes the position detection device.

  The vapor deposition apparatus arranges a vapor deposition mask between a film formation surface of a substrate and a vapor deposition source, and forms a pattern having a shape following the opening of the vapor deposition mask on the film formation surface of the substrate. The vapor deposition apparatus calculates the position of the substrate from the substrate mark which is an alignment mark of the substrate. The vapor deposition apparatus adjusts the position of the substrate and the position of the vapor deposition mask so that the calculated position of the substrate matches the position of the vapor deposition mask (see, for example, Patent Document 1).

JP 2013-1947 A

By the way, the substrate mark described above is usually located on the film formation surface of the substrate, and the detection unit for detecting the substrate mark is located on the same side as the vapor deposition source with respect to the film formation surface. On the other hand, the space on the vapor deposition source side with respect to the film formation surface is a space where the vapor deposition material sublimated by the vapor deposition source flies, and the vapor deposition material is deposited in the optical system of the detection unit located in this space. Since the detection unit in which the vapor deposition substance is deposited on the optical system cannot detect the substrate mark with high accuracy, the above-described vapor deposition apparatus is required to have a technique for improving the alignment accuracy between the substrate and the vapor deposition mask. ing. In addition, the request | requirement which detects the position of a board | substrate with high precision is common in the apparatus which detects the position of a board | substrate not only in the vapor deposition apparatus which aligns a board | substrate and a vapor deposition mask.
An object of the present invention is to provide a position detection apparatus, a position detection method, and a vapor deposition apparatus that can improve the detection accuracy of the position of a substrate.

  A position detection device for solving the above problem is a position detection device for detecting the position of a processing substrate which is a non-transparent substrate, wherein the surface of the calibration substrate which is a light-transmitting substrate has a plurality of substrate marks. The position detection device includes a front surface photographing unit that photographs the surface of the substrate with a camera associated with each substrate mark, and a back surface photographing unit that photographs the back surface of the substrate with a camera associated with each substrate mark. Is provided. And this position detection apparatus calculates the relative position between the cameras of the said surface imaging | photography part from each camera of the said surface imaging | photography part from the imaging | photography result of the said board mark, The relative position between the said cameras, and the said surface imaging | photography part Using the results obtained by photographing each processing substrate by each camera, the position of the processing substrate by front surface photography is calculated, and from the result obtained by each camera of the back surface photographing unit photographing the transmission image of the substrate mark, Calculate the relative position between the cameras of the back surface photographing unit, and calculate the position of the processing substrate by back surface photographing using the relative position between the cameras and the result of each camera of the back surface photographing unit photographing the processing substrate. An image processing unit.

  A position detection method for solving the above-described problem is a position detection method for detecting the position of a processing substrate that is a non-transparent substrate, and is a calibration that is a light-transmissive substrate having a plurality of substrate marks on the surface. The substrate photographing unit is used to photograph the substrate mark from the front surface side of the calibration substrate by the camera associated with the substrate mark, and the substrate mark is captured by the camera associated with the substrate mark. It includes that the back surface photographing unit photographs from the back surface side of the calibration substrate. Further, in this position detection method, the image processing unit calculates the relative position between the cameras of the front surface photographing unit based on the result of each camera of the front surface photographing unit photographing the substrate mark, and the relative position between the cameras. The image processing unit calculates the position of the processing substrate by surface imaging using the result of each camera of the surface imaging unit imaging the processing substrate. Then, in this position detection method, the image processing unit calculates the relative position between the cameras of the back surface photographing unit based on the result of each camera of the back surface photographing unit capturing the transmission image of the substrate mark, and And the image processing unit calculates the position of the processing substrate by backside imaging using the relative position of each and the result of each camera of the backside imaging unit imaging the processing substrate.

  A vapor deposition apparatus for solving the above problems includes a vapor deposition chamber for performing vapor deposition on the surface of a processing substrate that is a non-permeable substrate, and a position detection device that detects the position of the processing substrate. The surface of the calibration substrate, which is a light transmissive substrate, includes a plurality of substrate marks. And the said position detection apparatus, the surface imaging | photography part which image | photographs the surface of a board | substrate with the camera matched with each board | substrate mark, the back surface imaging | photography part which image | photographs the back surface of a board | substrate with the camera matched with each board | substrate mark, The relative position between the cameras of the front surface photographing unit is calculated from the result of each camera of the front surface photographing unit photographing the substrate mark, and the relative position between the cameras and each camera of the front surface photographing unit is the processing substrate. Between the cameras of the rear surface photographing unit, based on the result of the front surface photographing and the result of each camera of the rear surface photographing unit photographing the transmission image of the substrate mark. An image processing unit that calculates a relative position, calculates a position of the processing substrate by backside imaging using a relative position between the cameras, and a result of each camera of the backside imaging unit capturing the processing substrate; Provided.

  According to each said structure, the camera of a surface imaging | photography part and the camera of a back surface imaging | photography part image | photograph the board | substrate mark common to these. The image processing unit calculates a relative position between the cameras of the front surface photographing unit and a relative position between the cameras of the rear surface photographing unit from the result of photographing the common board mark on the front and back sides. Then, the image processing unit calculates the position of the processing substrate by the surface photographing using the result of the surface photographing unit photographing the processing substrate and the relative position between the cameras of the surface photographing unit. In addition, the image processing unit calculates the position of the processing substrate by the rear surface photographing using the result of the rear surface photographing unit photographing the processing substrate and the relative position between the cameras of the rear surface photographing unit. Thereby, the detection accuracy of the position of the processing substrate by the back surface photographing unit is increased to the detection accuracy of the position of the processing substrate by the front surface photographing unit, that is, the same as the detection accuracy by photographing the substrate mark. As a result, the detection accuracy of the position of the substrate is improved to the same extent as the detection accuracy of the position by the front imaging even in the processing environment where only the imaging result of the back surface is obtained, for example, the environment where the above-described vapor deposition processing is performed. It becomes possible to make it.

  In the position detection device, the object to be imaged by the front surface imaging unit includes a substrate mark located on the surface of the processing substrate, and the object to be imaged by the back surface imaging unit is a flat part positioned on the back surface of the processing substrate. , Including a boundary with the bevel portion connected to the flat portion, the image processing unit extracts the boundary between the flat portion and the bevel portion captured by each camera of the back surface photographing unit based on these contrasts, You may use this extracted boundary as a result of having image | photographed the said process board | substrate with each camera of the said back surface imaging | photography part.

  The bevel portion that defines the outline of the substrate is usually a curved surface having a predetermined curvature in the thickness direction of the substrate. In an image obtained by photographing the bevel portion, for example, the brightness gradually decreases toward the outline of the substrate, and the blur amount gradually increases. In the technique of detecting the outline of the substrate from the image obtained by photographing the bevel portion, a large error is included in the position of the outline due to an increase in the amount of blur. On the other hand, the boundary between the bevel portion and the flat portion is a boundary where the surface direction changes greatly on the substrate. For example, in photographing from a direction facing the flat portion, the boundary is also a portion where the boundary is clearly detected. . If it is the said position detection apparatus, an image processing part will extract the boundary of a flat part and a bevel part based on contrast, and will obtain the position of a process board | substrate from the extracted boundary. Therefore, it is possible to further improve the accuracy when calculating the position of the processing substrate from the result of the backside imaging.

  In the position detection method, each camera of the back surface photographing unit includes a telecentric optical system, photographs the processing substrate from the outside of the housing that accommodates the processing substrate, and the calibration substrate includes light-reflective materials. An antireflection film that covers the substrate mark and the periphery of the substrate mark may be provided.

  Cameras that are located outside the housing and have a telecentric optical system usually have a longer distance between the calibration substrate and the objective lens, that is, the working distance of the camera than a camera located inside the housing. Enlarge. As a result, in the configuration in which the back surface photographing unit includes such a camera, light other than the light from the objective surface easily enters the objective lens. In this regard, with the above-described configuration, each of the light-reflective substrate marks and the antireflection film covering the periphery thereof suppresses reflection on the objective surface. Therefore, even if the camera has a large working distance, each board mark can be clearly photographed.

  In the position detection method, the coefficient of thermal expansion of the calibration substrate may be 3 ppm / ° C. or less. When processing including heating such as vapor deposition processing or plasma processing is performed on a processing substrate, normally, from the viewpoint of increasing the efficiency of processing on the processing substrate, the environment in which heating is performed, that is, the processing substrate processing is performed. Is kept at a higher temperature than room temperature. At this time, if the thermal expansion coefficient of the calibration substrate is 3 ppm / ° C. or less, the thermal expansion occurring in the calibration substrate is suppressed to a sufficiently small range, and as a result, detection errors due to the thermal expansion of the calibration substrate are detected. Can also be reduced.

  In the vapor deposition apparatus, the two back surface photographing units, a front module for carrying a substrate into the vapor deposition apparatus from the outside, and a reversing chamber for carrying the substrate into the vapor deposition chamber by reversing the front and back of the substrate loaded by the front module. The one back surface photographing unit may be mounted on the front module together with the front surface photographing unit, and the other back surface photographing unit may be mounted on the vapor deposition chamber.

  According to the said structure, based on the result of back surface photography, matching with the position of the process board | substrate in a front | former stage module and the position of the process board | substrate in a vapor deposition chamber is achieved. Therefore, the detection accuracy of the position of the processing substrate in the vapor deposition chamber can be improved to the same level as the detection accuracy using this as a result of surface imaging in the previous module.

The block diagram which shows the structure of EFEM. It is a top view which shows the imaging region of each camera, (a) shows the imaging region of a mark camera, (b) shows the imaging region of a road camera. The flowchart which shows the flow of the calibration process which an image process part performs. It is a block diagram which shows the structure of EFEM with a board | substrate, (a) shows a structure with the top view of a board | substrate, (b) shows the relative position of sectional drawing of a board | substrate, and the imaging | photography area | region of a camera. The figure which shows an example of the image which the road camera image | photographed. The block diagram which shows the structure of a vapor deposition apparatus. The block diagram which shows the structure of a vapor deposition chamber. The top view of the board | substrate shown with the imaging | photography area | region of a vapor deposition camera. The flowchart which shows the flow of the calibration process which a control apparatus performs. The block diagram for demonstrating the various processes which a vapor deposition apparatus performs.

An embodiment of a position detection device, a position detection method, and a vapor deposition apparatus will be described.
[EFEM]
A configuration of an EFEM (Equipment Front End Module) 10 that is an example of a front-stage module will be described with reference to FIGS. 1 and 2. Below, the structure of a front surface imaging | photography part and a back surface imaging | photography part is mainly demonstrated among the structures of EFEM10.

  As shown in FIG. 1, the EFEM 10 includes a stage 10 </ b> S, a plurality of mark cameras 11 constituting a front surface photographing unit, and a plurality of road cameras 12 constituting a back surface photographing unit. The plurality of road cameras 12 are located, for example, outside the housing 13 that accommodates the substrate. Hereinafter, an example in which the EFEM 10 includes three mark cameras 11 and three road cameras 12 will be described.

  The stage 10S supports the unprocessed substrates accommodated in the stocker one by one. The substrate supported by the stage 10S includes a non-transparent processing substrate W and a light-transmissive calibration substrate W0. The processing substrate W is, for example, a glass substrate covered with a light reflective thin film or a silicon substrate in which the substrate itself is non-transmissive. The calibration substrate W0 is, for example, a quartz substrate or an alumina substrate. The processing substrate W and the calibration substrate W0 each include a front surface WF and a back surface WR. The thermal expansion coefficient of the calibration substrate W0 is preferably 3 ppm / ° C. or less from the viewpoint of suppressing thermal expansion at high temperatures.

  The EFEM 10 arranges the substrate with the surface WF facing upward. The front surface WF has three substrate marks Wm. The substrate mark Wm is, for example, a thin film pattern having high light reflectivity in the surface WF, or a thin film pattern having high light absorption in the surface WF. The substrate mark Wm has, for example, a rectangular shape or a cross shape in a plan view facing the surface WF. The substrate mark Wm of the processing substrate W is used to match the specific position of the surface WF with the opening of the vapor deposition mask. The substrate mark Wm of the calibration substrate W0 is used to calculate the relative position between the three mark cameras 11. The substrate mark Wm of the calibration substrate W0 is used to calculate the relative position between the three load cameras 12.

  Each mark camera 11 is a CCD camera, for example, and is associated with each substrate mark Wm one by one. Each mark camera 11 is located above (front side) the substrates W and W0 supported by the stage 10S. The position of the optical axis 1A of one mark camera 11 is fixed with respect to the position of the optical axis 1A of the other mark camera 11. Each mark camera 11 opposes the surface WF of the substrates W and W0 and images different substrate marks Wm (surface imaging).

  An image captured by each mark camera 11 is a surface image IM1. The image processing unit 20 uses the surface image IM1 of the calibration substrate W0 for calibration processing. Further, the image processing unit 20 uses the surface image IM1 of the processing substrate W for the surface position specifying process.

  Each road camera 12 is a CCD camera, for example, and is associated with each substrate mark Wm one by one. Each road camera 12 is located below (back side) the substrates W and W0 supported by the stage 10S. The position of the optical axis 2 </ b> A of one road camera 12 is fixed with respect to the position of the optical axis 2 </ b> A of another road camera 12. Each road camera 12 opposes the back surface WR of the substrates W and W0, and shoots a separate part (back surface shooting).

  The image captured by each road camera 12 is a first back image IM2. The first back image IM2 of the calibration substrate W0 includes a transmission image that is an image of the substrate mark Wm that has passed through the calibration substrate W0. The image processing unit 20 uses the first back image IM2 of the calibration substrate W0 for calibration processing. The first back image IM2 of the processing substrate W includes the outer peripheral portion Wp of the processing substrate W. The image processing unit 20 uses the first back surface image IM2 of the processing substrate W for back surface position specifying processing.

  With reference to FIG. 2 (a), the area | region which the mark camera 11 image | photographs is demonstrated, and the area | region which the road camera 12 image | photographs is demonstrated with reference to FIG.2 (b). FIGS. 2A and 2B show the planar structure of the substrate in plan view facing the surface WF of each of the substrates W and W0, and the areas to be photographed by the cameras 11 and 12, respectively. Since the processing substrate W and the calibration substrate W0 share the same shape, size, and arrangement of substrate marks, in FIGS. 2A and 2B, a disk-shaped calibration substrate is used for convenience of explanation. W0 is exemplified, and an area photographed by each mark camera 11 and an area photographed by each road camera 12 are shown superimposed on the calibration substrate W0.

  As shown in FIG. 2A, the robot placing the calibration substrate W0 on the stage 10S defines a virtual placement area WA (a great circle of a two-dot chain line in FIG. 2A). The placement area WA is a target area where the calibration substrate W0 is to be placed. The robot placing the calibration substrate W0 on the stage 10S places the calibration substrate W0 so that the placement area WA and the outline E (solid line in FIG. 2A) of the calibration substrate W0 substantially coincide. .

  The surface WF of the calibration substrate W0 includes three substrate marks Wm. The three substrate marks Wm are arranged in the circumferential direction of the calibration substrate W0 and are located closer to the center of the substrate than the outer peripheral portion Wp of the calibration substrate W0. Similarly, the surface WF of the processing substrate W includes three substrate marks Wm.

  Each mark camera 11 defines an area in which an image is to be captured as an imaging area 1Z (a two-dot chain small circle in FIG. 2A). The photographing areas 1Z are substantially equally arranged in the circumferential direction of the arrangement area WA. The optical axis 1A of the mark camera 11 is located at the center of the imaging region 1Z. Each imaging region 1Z includes one substrate mark Wm. In the transport of the substrates W and W0, the difference between the post-transport position and the target position is the transport accuracy, and the transport accuracy of the substrates W and W0 is set within a predetermined range. The shooting area 1Z of the mark camera 11 is sufficiently larger than the range of such conveyance accuracy.

  Each road camera 12 defines a region for capturing an image as a capturing region 2Z (a small circle of a two-dot chain line in FIG. 2B). The photographing areas 2Z are substantially equally arranged in the circumferential direction of the arrangement area WA. The optical axis 2A of the road camera 12 is located at the center of the imaging region 2Z. Each imaging region 2Z includes one transmission image (a broken-line rectangle in FIG. 2B) of a separate substrate mark Wm. Each imaging region 2Z includes a boundary between the flat portion Wp1 and the bevel portion Wp2 in the outer peripheral portion Wp.

  As described above, the EFEM 10 is equipped with a position detection device, and the position detection device includes a plurality of mark cameras 11 that calibrate the front surface imaging unit, a plurality of road cameras 12 that calibrate the back surface imaging unit, and the image processing unit 20. including.

[Calibration processing: EFEM10]
The image processing unit 20 includes a central processing unit and a memory, and is not limited to the one that performs all of the calibration process, the front surface position specifying process, and the back surface position specifying process by software. For example, the image processing unit 20 may include dedicated hardware (an application specific integrated circuit: ASIC) that executes at least a part of various processes. That is, the image processing unit 20 includes 1) one or more dedicated hardware circuits such as an ASIC, 2) one or more processors (microcomputers) that operate according to a computer program (software), or 3) a combination thereof. It is comprised as a circuit containing. The image processing unit 20 stores the positions of the three substrate marks Wm as relative coordinates that are coordinates in the relative coordinate system.

  As shown in FIG. 3, the image processing unit 20 performs image analysis on the surface image IM1 of the calibration substrate W0 in the calibration process (step S11). That is, the image processing unit 20 performs edge detection or the like for detecting the substrate mark Wm on the surface image IM1, and calculates the relative position of the substrate mark Wm with respect to the optical axis 1A in the camera coordinate system of the mark camera 11. Note that the image processing unit 20 sets the position of the optical axis 1A in the camera coordinate system as the center of the surface image IM1, for example.

  Next, the image processing unit 20 performs image analysis on the first back surface image IM2 of the calibration substrate W0 (step S12). That is, the image processing unit 20 performs edge detection and the like on the first back image IM2, and calculates the relative position of the substrate mark Wm with respect to the optical axis 2A in the camera coordinate system of the road camera 12. Note that the image processing unit 20 sets the position of the optical axis 2A in the camera coordinate system as the center of the first back image IM2, for example.

  Next, the image processing unit 20 calculates the optical axis position of the mark camera 11 in the relative coordinate system using the position of the substrate mark Wm in the camera coordinate system of the mark camera 11 and the relative coordinates of the substrate mark Wm. To do. The image processing unit 20 calculates the optical axis position of the road camera 12 in the relative coordinate system using the position of the board mark Wm in the camera coordinate system of the road camera 12 and the relative coordinates of the board mark Wm. (Step S13). That is, the image processing unit 20 calculates a relative position between the optical axes 1A of the three mark cameras 11 and a relative position between the optical axes 2A of the three road cameras 12. The image processing unit 20 stores the optical axis position of each mark camera 11 and the optical axis position of each road camera 12 as an example of a relative position between the cameras. The image processing unit 20 updates the optical axis position of each mark camera 11 and the optical axis position of each road camera 12 each time calibration processing is performed.

  As described above, the relative position between the cameras in the front surface photographing unit and the relative position between the cameras in the back surface photographing unit are calculated by photographing the common substrate mark Wm. On the other hand, the relative position between the cameras in the front surface photographing unit and the relative position between the cameras in the back surface photographing unit can also be obtained in the following forms. That is, each mark camera 11 photographs the substrate mark Wm of the first calibration substrate, and each load camera 12 photographs the substrate mark Wm of the second calibration substrate. It is also possible to calculate the relative position of. However, in the case of photographing each calibration board, the position error of the substrate mark Wm between the calibration boards and the transport error between the calibration boards are included in the front and back photographing results. End up. In this regard, if the common substrate mark Wm is photographed at the same time on the front and back, the above-described error is included in the relative position between the cameras in the front surface photographing unit and the relative position between the cameras in the rear surface photographing unit. Is suppressed.

[Specification of surface position: EFEM10]
The image processing unit 20 calculates the position of the pattern center using each surface image IM1 of the processing substrate W in the surface position specifying process. That is, the image processing unit 20 performs edge detection and the like on each surface image IM1, and calculates the position of the substrate mark Wm in the camera coordinate system of the mark camera 11. Next, the image processing unit 20 calculates the relative position between the substrate marks Wm from the optical axis position of each mark camera 11 and the position of the substrate mark Wm in the camera coordinate system. Then, the image processing unit 20 calculates the position of the pattern center in the relative coordinate system so that the virtual circle centered on the pattern center passes through the relative position of each substrate mark Wm.

[Back surface position specifying process: EFEM10]
Next, the back surface position specifying process using the processing substrate W will be described. 4A is a plan view of the processing substrate W viewed from the direction facing the back surface WR, and FIG. 4B is a diagram illustrating the relative relationship between the boundary between the flat portion Wp1 and the bevel portion Wp2 and the optical axis 2A. It is a figure which shows a position. In FIGS. 4A and 4B, only one of the three road cameras 12 is shown for convenience of explaining the boundary between the flat portion Wp1 and the bevel portion Wp2.

  As shown in FIG. 4, the outer peripheral portion Wp of the processing substrate W includes a flat portion Wp1 and a bevel portion Wp2. The flat portion Wp1 is a flat portion that extends along a plane along the side surface of the processing substrate W. Each bevel portion Wp2 has a curvature in which the center of curvature is located on the center side of the processing substrate W with respect to the bevel portion Wp2 in a cross section (see FIG. 4B) along the thickness direction of the processing substrate W.

  The shooting area 2Z of the road camera 12 includes a part of the flat part Wp1 and a bevel part Wp2 connected to the part. The optical axis 2A of the road camera 12 is located, for example, near the boundary between the flat portion Wp1 and the bevel portion Wp2. The light irradiated to the outer peripheral portion Wp may be parallel light traveling along the optical axis 2A of the road camera 12 from the road camera 12 side (back side) with respect to the processing substrate W, or the optical axis 2A of the road camera 12 and May be parallel light traveling in different directions. When the road camera 12 includes a telecentric optical system in which the optical axis of the light applied to the outer peripheral portion Wp and the optical axis 2A of the road camera 12 coincide, the road camera 12 uses a telecentric optical system, for example. Wp is irradiated with light. When the optical axis of the light irradiated to the outer peripheral portion Wp of the processing substrate W is different from the optical axis 2A of the road camera 12, the irradiation portion that irradiates the outer peripheral portion Wp is separate from the road camera 12. It is located on the same side as the load camera 12 with respect to the processing substrate W.

  The road camera 12 forms an image by light reflected from the imaging region 2Z. The first back image IM2 captured by the road camera 12 includes a first image IM21 by light reflected by the flat portion Wp1 and a second image IM22 by light reflected by the bevel portion Wp2 connected to the flat portion Wp1. .

  For example, when parallel light is irradiated onto the back surface WR along the direction orthogonal to the back surface WR, the incident angle of the light incident on the flat portion Wp1 is approximately 0 °, and the regularly reflected light emitted from the flat portion Wp1 The reflection angle is also almost 0 °. Therefore, the road camera 12 having the optical axis orthogonal to the back surface WR generates the first image IM21 with very high brightness. On the other hand, since the bevel portion Wp2 is a curved surface, the incident angle of light incident on the bevel portion Wp2 continuously changes from 0 ° toward the contour E of the processing substrate W, and is emitted from the bevel portion Wp2. The reflection angle of specularly reflected light varies much more than 0 °. Therefore, the road camera 12 having an optical axis orthogonal to the back surface WR generates the second image IM22 with very low brightness compared to the first image IM21. As a result, in the first back image IM2, there is a large difference in contrast between the first image IM21 and the second image IM22.

  The image processing unit 20 performs edge detection based on contrast for the first back surface image IM2, and extracts a boundary between the first image IM21 and the second image IM22. Then, the image processing unit 20 defines a boundary between the extracted first image IM21 and the second image IM22, that is, a boundary between the flat portion Wp1 and the bevel portion Wp2, and a part of the outer shape (boundary portion) of the processing substrate W. As specified. The image processing unit 20 calculates the position of the boundary between the first image IM21 and the second image IM22 in the relative coordinate system, and thereby specifies the outer shape of the processing substrate W.

FIG. 5 is an example of an image captured by the road camera 12.
As shown in FIG. 5, the first back image IM2 includes an image IMW of the processing substrate W and a background image IMB of the processing substrate W. In the image IMW of the processing substrate W, the portion having relatively high brightness is the image of the flat portion Wp1, that is, the first image IM21. On the other hand, in the image IMW of the processing substrate W, the portion having a relatively low brightness is the image of the bevel portion Wp2, that is, the second image IM22. The brightness of the background image IMB of the processing substrate W is lower than the brightness of the first image IM21 and higher than the brightness of the second image IM22.

  Here, the outline E of the processing substrate W is an outline connecting the points located on the outermost side of the processing substrate W, and is also an outline of the bevel portion Wp2. As described above, the bevel portion Wp2 is generally configured by a curved surface having a predetermined curvature. The curved surface of the bevel portion Wp2 gradually decreases the brightness of the image IMW of the processing substrate W toward the contour E of the processing substrate W, the second image IM22 that is an image of the bevel portion Wp2, and the background image of the processing substrate W. The boundary with the IMB is unclear. When detecting the contour E of the processing substrate W from the boundary between the second image IM22 and the background image IMB, a large error is caused in the accuracy of the position. In particular, in the detection where accuracy of several μm is required at the position of the processing substrate W, the above-described unknown uncertainty at the boundary is a very large error.

  On the other hand, the boundary between the bevel portion Wp2 and the flat portion Wp1 is a boundary where the surface direction changes in the processing substrate W. For example, when photographing from the direction facing the flat portion Wp1, it is clearly detected. It is also a boundary. Therefore, if the boundary between the first image IM21 and the second image IM22 is the above-described configuration specified as the outer shape of the processing substrate W, the detection accuracy can be improved in the detection of the position of the processing substrate W using the outer shape. It becomes possible to improve.

  The image processing unit 20 calculates the position of the center of the first back surface using each first back image IM2 of the processing substrate W in the back surface position specifying process. That is, the image processing unit 20 performs edge detection and the like on each first back image IM2, and calculates the position of the boundary portion between the flat portion Wp1 and the bevel portion Wp2 in the camera coordinate system of the road camera 12. Next, the image processing unit 20 calculates a relative position between the boundary portions from the optical axis position of each road camera 12 and the position of the boundary portion in the camera coordinate system. Then, the image processing unit 20 calculates the position of the first back surface center in the relative coordinate system so that a virtual circle centered on the first back surface center passes through each boundary portion.

[Vapor deposition equipment]
With reference to FIG. 6, the vapor deposition apparatus 30 carrying the said EFEM10 is demonstrated. The vapor deposition apparatus 30 only needs to include the EFEM 10 and the vapor deposition chamber 34.
As FIG. 6 shows, the vapor deposition apparatus 30 is provided with the conveyance chamber 31, and the conveyance chamber 31 is connected to the conveyance chamber 31 via the gate valve. The transfer chamber 31 includes a transfer robot that transfers the substrates W and W0. The carry-in / out chamber 32 carries the substrates W and W0 into the transfer chamber 31 from the outside of the transfer chamber 31, and carries the substrates W and W0 out of the transfer chamber 31 from the transfer chamber 31. The EFEM 10 is connected to the carry-in / out chamber 32 through a gate valve. The EFEM 10 transports the calibration substrate W0 to the carry-in / out chamber 32 and carries the calibration substrate W0 from the carry-in / out chamber 32. The EFEM 10 transports the processing substrate W before film formation to the carry-in / out chamber 32, and carries in the processing substrate W after film formation from the carry-in / out chamber 32.

  Two vapor deposition chambers 34, an inversion chamber 35, and a sputtering chamber 36 are connected to the transfer chamber 31. Each chamber is connected to the transfer chamber 31 via a gate valve. The deposition chamber 34 forms a predetermined thin film on the processing substrate W by a vacuum deposition method. The inversion chamber 35 inverts the processing substrate W carried into the inversion chamber 35. The reversal in the reversing chamber 35 is performed when the position of the front surface WF and the back surface WR of the processing substrate W in the vertical direction is between when the processing substrate W is loaded into the reversing chamber 35 and when it is unloaded from the reversing chamber 35. In the opposite. The sputtering chamber 36 forms a predetermined thin film on the processing substrate W by a sputtering method.

  The vapor deposition apparatus 30 includes a control device 30C. The control device 30C includes the image processing unit 20 described above, and controls driving of the chambers 31, 32, 34, 35, and 36 included in the vapor deposition apparatus 30. For example, the control device 30C controls the drive of the transfer robot, and causes the transfer robot to transfer the processing substrate W from one chamber connected to the transfer chamber 31 to the other chamber via the transfer chamber 31. The control device 30C controls, for example, a film formation process in each vapor deposition chamber 34 and a mechanism related to the film formation process in the sputter chamber 36, whereby a predetermined thin film is provided in each vapor deposition chamber 34 and the sputter chamber 36. To form.

[Configuration of deposition chamber]
The configuration of the vapor deposition chamber 34 will be described with reference to FIGS. Below, the structure used for a calibration process in the structure of the vapor deposition chamber 34 and the structure of the vapor deposition mechanism which is a mechanism for performing vapor deposition on the process board | substrate W are mainly demonstrated.

  As shown in FIG. 7, the vapor deposition chamber 34 supports a vapor deposition source 41 that discharges the sublimated vapor deposition material, a plurality of vapor deposition cameras 42, a substrate holder 43 that supports the substrates W and W 0, and a vapor deposition mask M. A mask holder 44, a drive source 45, and a drive mechanism 46 are provided. In the vapor deposition chamber 34, the housing 47 that accommodates the vapor deposition source 41, the substrate holder 43, and the mask holder 44 is connected to an exhaust system and is decompressed to a predetermined pressure. Hereinafter, an example in which three vapor deposition cameras 42 are provided will be described.

  The vapor deposition source 41 forms a thin film of the vapor deposition material 42M on the surface WF of the processing substrate W by heating the vapor deposition material. As the vapor deposition source 41, for example, a resistance heating vapor deposition source, an induction heating vapor deposition source, a vapor deposition source including an electron beam, or the like can be used. The vapor deposition material 42M is a material that evaporates when heated by the vapor deposition source 41, and is a thin film material formed on the surface WF of the processing substrate W. The vapor deposition material 42M is, for example, an organic material, but may be an inorganic material.

  The three vapor deposition cameras 42 are, for example, CCD cameras, and one unit is associated with each substrate mark. Each vapor deposition camera 42 is fixed to the upper side (back side) of the substrates W and W0 supported by the substrate holder 43 and to the outside of the housing 47. The position of the optical axis 4A of one vapor deposition camera 42 is fixed with respect to the position of the optical axis 4A of the other vapor deposition camera 42. Each vapor deposition camera 42 faces the back surface WR of the substrates W and W0 and photographs separate portions (photographs the back surface).

  The image captured by each vapor deposition camera 42 is a second back surface image IM4. The second back image IM4 of the calibration substrate W0 includes a transmission image of the substrate mark Wm that has passed through the calibration substrate W0. The image processing unit 20 uses the second back image IM4 of the calibration substrate W0 for the calibration process. The second back surface image IM4 of the processing substrate W includes the outer peripheral portion Wp of the processing substrate W. The image processing unit 20 uses the second back surface image IM4 of the processing substrate W for back surface position specifying processing.

  The substrate holder 43 is located between the three vapor deposition cameras 42 and the vapor deposition source 41. The substrate holder 43 defines a virtual arrangement area WA. The placement area WA is a target area where the substrates W and W0 are to be placed. The substrate holder 43 supports the substrates W and W0 carried into the vapor deposition chamber 34 from the inversion chamber 35. The substrate holder 43 can carry out the substrates W and W0 from the vapor deposition chamber 34 to the inversion chamber 35. The substrate holder 43 supports the outer peripheral portion Wp of the front surface WF with the front surface WF of the processing substrate W facing the vapor deposition source 41 (lower side in FIG. 7), the rear surface WR of the processing substrate W, three vapor deposition cameras 42, Face each other.

  At this time, for example, since an obstacle such as the substrate holder 43 exists, the substrate mark Wm located on the surface WF is difficult to be photographed from the side facing the surface WF. Further, the substrate mark Wm positioned on the front surface WF is difficult to be photographed from the side facing the back surface WR when the processed substrate W is accommodated because the processed substrate W is impermeable. That is, it is difficult to detect the position of the substrate mark Wm when the substrate holder 43 supports the substrates W and W0.

  The mask holder 44 is located between the three vapor deposition cameras 42 and the vapor deposition source 41. The mask holder 44 defines a virtual placement area MA. The arrangement area MA is a target area where the vapor deposition mask M is to be arranged. The mask holder 44 supports the outer peripheral portion of the vapor deposition mask M, and makes the surface WF of the substrates W and W0 and the vapor deposition mask M face each other. The vapor deposition mask M has an opening for forming a predetermined pattern on the surface WF of the substrate W. The mask holder 44 arranges the vapor deposition mask M on the vapor deposition source 41 side with respect to the substrates W and W0. The vapor deposition mask M has a size that protrudes from the processing substrate W in the entire circumferential direction of the processing substrate W. The vapor deposition mask M has three mask marks Mm in a portion protruding from the processing substrate W. Note that the mask mark Mm of the vapor deposition mask M can identify the center position of the vapor deposition mask by photographing with the vapor deposition camera 42.

  The drive source 45 outputs power for driving the drive mechanism 46. The drive mechanism 46 receives the power of the drive source 45 and moves the substrate holder 43 in the horizontal direction. Further, the drive mechanism 46 receives power from the drive source 45 and rotates the mask holder 44 and the substrate holder 43 in the circumferential direction of the substrates W and W0. The drive mechanism 46 switches between independent rotation of the substrate holder 43, independent rotation of the mask holder 44, and rotation in which the substrate holder 43 and the mask holder 44 are integrated. Further, the drive mechanism 46 raises and lowers the mask holder 44 and the substrate holder 43 under the power of the drive source 45. The drive mechanism 46 switches between independent raising / lowering of the substrate holder 43, independent raising / lowering of the mask holder 44, and raising / lowering in which the substrate holder 43 and the mask holder 44 are integrated.

  For example, the independent horizontal movement of the substrate holder 43 and the independent rotation of the substrate holder 43 are used to align the pattern center of the processing substrate W with the mask center which is the center of the vapor deposition mask M. Independent rotation of the mask holder 44 is used to place the vapor deposition mask M in place. The rotation in which the substrate holder 43 and the mask holder 44 are integrated is used when a deposition material is deposited on the surface of the processing substrate W.

  For example, the independent raising and lowering of the substrate holder 43 is used for loading and unloading the substrates W and W0 and for arranging the processing substrate W at a predetermined position for vapor deposition. The independent raising / lowering of the mask holder 44 is used for carrying in and carrying out the vapor deposition mask M and arranging the vapor deposition mask M at a predetermined position for vapor deposition. Elevating and lowering the substrate holder 43 and the mask holder 44 is used for movement when the processing substrate W and the vapor deposition mask M are rotated together.

  FIG. 8 shows a region to be photographed by each vapor deposition camera 42. In addition, since the relative position with respect to the area | region which each vapor deposition camera 42 image | photographs is substantially equal in the process board | substrate W and the board | substrate for calibration W0, in FIG. 8, the area | region which each vapor deposition camera 42 image | photographs for calibration for convenience. Overlaid on the substrate W0.

  As shown in FIG. 8, the calibration substrate W0 is arranged in the arrangement area WA, and the vapor deposition mask M is arranged in the arrangement area MA. The position of the mask mark Mm is located outside the contour E of the calibration substrate W0. The mask mark Mm has a rectangular shape in a plan view facing the back surface WR of the calibration substrate W0, but may have a shape different from the rectangular shape, for example, a cross shape.

  Each vapor deposition camera 42 defines a region where an image is to be captured as a photographing region 4Z (a two-dot chain small circle in FIG. 8). Each photographing area 4Z is substantially equally arranged in the circumferential direction of the arrangement area WA. The optical axis 4A of the vapor deposition camera 42 is located at the center of the imaging region 4Z. Each imaging region 4Z includes a separate mask mark Mm and a transmission image of a separate substrate mark Wm. Further, the imaging region 4Z includes a boundary between the flat portion Wp1 and the bevel portion Wp2.

[Calibration process: Deposition chamber 34]
As shown in FIG. 9, the image processing unit 20 performs image analysis on the second back image IM4 of the calibration substrate W0 in the calibration process (step S21). That is, the image processing unit 20 performs edge detection and the like on each second back image IM4, and calculates the relative position of the substrate mark Wm with respect to the optical axis 4A in the camera coordinate system of the vapor deposition camera 42. Note that the image processing unit 20 sets the position of the optical axis 4A in the camera coordinate system as the center of the second back image IM4, for example.

  Next, the image processing unit 20 calculates the optical axis position of the vapor deposition camera 42 in the relative coordinate system using the position of the substrate mark Wm in the camera coordinate system of the vapor deposition camera 42 and the relative coordinates of the substrate mark Wm. (Step S22). That is, the image processing unit 20 calculates the relative position between the optical axes 4A of the three vapor deposition cameras 42. The image processing unit 20 stores the optical axis position of each vapor deposition camera 42 as an example of the relative position between the cameras. The image processing unit 20 updates the optical axis position of each vapor deposition camera 42 each time calibration processing is performed.

[Specification of back surface position: evaporation chamber 34]
The image processing unit 20 calculates the position of the mask center using each second back surface image IM4 of the vapor deposition mask M in the back surface position specifying process. That is, the image processing unit 20 performs edge detection and the like on each second back image IM4, and calculates the position of the mask mark Mm in the camera coordinate system of the vapor deposition camera 42. Next, the image processing unit 20 calculates a relative position between the mask marks Mm from the optical axis position of each vapor deposition camera 42 and the position of the mask mark Mm in the camera coordinate system. Then, the image processing unit 20 calculates the position of the mask center in the relative coordinate system so that the virtual circle centered on the mask center passes through the relative position of each mask mark Mm.

  The image processing unit 20 calculates the position of the center of the second back surface using each second back surface image IM4 of the processing substrate W in the back surface position specifying process. That is, the image processing unit 20 performs edge detection and the like on each second back image IM4, and calculates the position of the boundary portion between the flat portion Wp1 and the bevel portion Wp2 in the camera coordinate system of the vapor deposition camera 42. Next, the image processing unit 20 calculates the relative position between the boundary portions from the optical axis position of each vapor deposition camera 42 and the position of the boundary portion in the camera coordinate system. Then, the image processing unit 20 calculates the position of the center of the second back surface in the relative coordinate system so that the virtual circle centered on the center of the second back surface passes through each boundary portion.

[Action]
With reference to FIG. 10, a calibration process, a front surface position specifying process, a back surface position specifying process, and an alignment process performed by the control device 30C will be described.
[Calibration processing: control device 30C]
In the calibration process, the control device 30C first places the calibration substrate W0 in the placement area WA of the EFEM 10. Next, the control device 30C causes each mark camera 11 to photograph the surface image IM1 including the substrate mark Wm. In addition, the control device 30C causes each road camera 12 to capture the first back image IM2 including the transmission image of the substrate mark Wm. Subsequently, the control device 30C carries the calibration substrate W0 into the vapor deposition chamber 34, and causes the vapor deposition camera 42 to capture the transmission image of the substrate mark Wm and the second back surface image IM4 including the mask mark Mm.

  Then, the control device 30C calculates the optical axis position of each mark camera 11, which is a relative position between the cameras, using the surface image IM1 and the relative coordinates of the substrate mark Wm. In addition, the control device 30C calculates the optical axis position of each road camera 12, which is a relative position between the cameras, using the first back image IM2 and the relative coordinates of the board mark Wm. The control device 30C calculates the optical axis position of each vapor deposition camera 42, which is a relative position between the cameras, using the second back surface image IM4 and the relative coordinates of the substrate mark Wm.

  The control device 30C stores the optical axis position P1 of each mark camera 11, the optical axis position P2 of each road camera 12, and the optical axis position P3 of each vapor deposition camera 42. The control device 30C performs the calibration process every time a predetermined number of processing substrates W are processed.

[Specification of surface position]
In the surface position specifying process, the control device 30C first arranges the processing substrate W in the arrangement area WA. Next, the control device 30C causes each mark camera 11 to photograph the surface image IM1 of the surface WF including the substrate mark Wm.

  Then, the control device 30C uses the surface image IM1 and the optical axis position of each mark camera 11 so that a virtual circle centered on the pattern center passes through each substrate mark Wm in the relative coordinate system. The center position is calculated.

[Specification of back side position]
In the back surface position specifying process, the control device 30C first causes each road camera 12 to capture the first back image IM2 including the boundary between the flat portion Wp1 and the bevel portion Wp2. Next, the control device 30C carries the processing substrate W into the vapor deposition chamber 34, and causes each vapor deposition camera 42 to capture the second back surface image IM4 including the boundary between the flat portion Wp1 and the bevel portion Wp2 and the mask mark Mm. .

  Then, the control device 30C uses the first back image IM2 and the optical axis position of each road camera 12, and a virtual circle centered on the center of the first back surface passes through the boundary between the flat portion Wp1 and the bevel portion Wp2. As described above, the position of the center of the first back surface is calculated in the relative coordinate system. Further, the control device 30C uses the second back surface image IM4 and the optical axis position of each vapor deposition camera 42, and a virtual circle centered on the center of the second back surface passes through the boundary between the flat portion Wp1 and the bevel portion Wp2. Thus, in the relative coordinate system, the position of the center of the second back surface is calculated. Further, the control device 30C uses the second back image IM4 and the optical axis position of each vapor deposition camera 42 so that a virtual circle centered on the mask center passes through each mask mark Mm in the relative coordinate system. The position of the mask center is calculated.

  The back surface position specifying process can be performed on the processing substrate W arranged in the arrangement area WA of the EFEM 10 together with the above-described front surface position specifying process. At this time, the imaging of the substrate mark Wm by each mark camera 11 in the EFEM 10 and the imaging of the flat portion Wp1 and the bevel portion Wp2 by each road camera 12 may be performed simultaneously or at different timings. Good. When the two shootings are performed at different timings, shooting by each mark camera 11 may be performed before shooting by each road camera 12, and shooting by each road camera 12 is performed by shooting each mark camera 11. You may go first. When two photographings are performed at different timings, the processing substrate W may be rotated between the two photographings.

  Further, the image of the substrate mark Wm by each mark camera 11 may be performed simultaneously or at different timings, and the flat portion Wp1 and the bevel portion Wp2 by each road camera 12 are also simultaneously photographed. Alternatively, it may be performed at different timings. In addition, the processing substrate W may be rotated every time shooting is performed by one camera. In particular, the position of the substrate mark Wm may be different for each processing substrate W, and in the state where the position of the processing substrate W is fixed at one position, all the substrate marks Wm may not be photographed. . In this case, the processing substrate W may be rotated every time one substrate mark Wm is photographed. When photographing a plurality of substrate marks while rotating the processing substrate W, the relative positions between the plurality of substrate marks can be grasped by the rotation angle of the substrate W. The rotation angle of the processing substrate W can be detected by a detection unit that detects the rotation angle, and an encoder can be used as the detection unit, for example.

[Alignment processing]
The control device 30C uses, for example, the pattern center obtained by photographing the n-th processing substrate W (n is an integer equal to or greater than 1) and the first back surface center, and the deviation amount (Δx , Δy, Δθ). Next, the control device 30 </ b> C carries the n-th processing substrate W into the vapor deposition chamber 34. Then, the control device 30C reflects the shift amount on the second back surface center of the n-th processing substrate W, and calculates a correction amount for aligning the reflected second back surface center with the mask center. The control device 30C outputs a drive signal SIG for driving the drive source 45 so as to drive the drive mechanism 46 with a drive amount corresponding to the correction amount.

  As described above, according to the above-described vapor deposition apparatus 30, three different camera coordinate systems, that is, the camera coordinate system of the mark camera 11, the camera coordinate system of the road camera 12, and the camera coordinate system of the vapor deposition camera 42, are simply set. Calibration can be performed with one calibration substrate W0. Thereby, it is possible to mutually convert coordinates in each camera coordinate system. In other words, it is possible to suppress a positional shift caused by the coordinate conversion when the coordinate conversion is performed in each camera coordinate system.

As described above, according to the embodiment, the effects listed below can be obtained.
(1) The detection accuracy of the position of the processing substrate W by backside imaging is increased to the same level as the detection accuracy of the position of the processing substrate W by frontside imaging, that is, the detection accuracy by imaging the substrate mark Wm. As a result, the detection accuracy of the position of the substrate W is as high as the accuracy of the position based on the result of the front surface imaging even in the processing environment where only the result of the rear surface imaging is obtained, for example, the environment where the vapor deposition process described above is performed. Can be enhanced.

  (2) In particular, it is possible to match each processing state between sputtering film formation in which the substrate is transferred according to the pattern position and vapor deposition film formation in which the substrate is transferred according to the back surface position.

  (3) The backside imaging is performed with the EFEM 10 and the backside imaging is also performed with the vapor deposition chamber 34 so that the first back surface position in the EFEM 10 and the second back surface position in the vapor deposition chamber 34 are aligned. W is transferred to the vapor deposition chamber 34. As a result, the effect according to the above (1) obtained with the EFEM 10 can be obtained with the vapor deposition chamber 34.

  (4) In particular, processing involving heating, such as vapor deposition film formation or plasma film formation, displaces the optical axis of the camera placed in the processing environment over time. In this regard, with the above-described configuration, the relative position between the vapor deposition cameras 42 in the vapor deposition chamber 34 is updated for each calibration process, so that the effect according to (3) can be obtained over a long period of time.

  (5) Since the shape and size of the calibration substrate W0 are substantially equal to the processing substrate W, it is possible to make the transport system for the processing substrate W and the transport system for the calibration substrate W0 common. Thereby, for example, every time a predetermined number of processing substrates W are processed, it is possible to perform calibration processing using the calibration substrate W0 without significantly changing the operating state of the transport system. As a result, it is possible to ensure the frequency of the calibration process while suppressing a decrease in the operating efficiency of the vapor deposition apparatus.

  (6) If the coefficient of thermal expansion of the calibration substrate W0 is 3 ppm / ° C. or less, the thermal expansion occurring in the calibration substrate W0 can be suppressed to a sufficiently small range, and as a result, the calibration substrate W0 is caused by the thermal expansion. It also becomes possible to reduce detection errors.

  (7) The boundary between the first image IM21 and the second image IM22 is detected based on the contrast, and the back surface position of the processing substrate W is detected using the detected boundary. Therefore, the detection accuracy of the back surface position can be improved as compared with the configuration in which the back surface position is detected from the contour E of the processing substrate W.

  (8) In particular, in the configuration in which the processing substrate W is impermeable, the substrate mark Wm cannot be optically detected from the side facing the back surface WR.

  (9) Since the positional accuracy of the processing substrate W with respect to the vapor deposition mask M can be improved, it is possible to increase the processing accuracy in the processing related to the relative position between the processing substrate W and the vapor deposition mask M.

The embodiment described above can be implemented with appropriate modifications as follows.
[Location identification process]
The boundary used by the position detection device for specifying the position of the processing substrate W may be one location in the outer peripheral portion Wp of the processing substrate W, or may be one or more locations.
For example, the shape of the boundary between the flat portion Wp1 and the bevel portion Wp2 is microscopically different for each processing of the bevel portion Wp2, that is, for each processing substrate W, and may be a unique shape in each processing substrate W. is there. In the configuration in which the position of the processing substrate W is specified from one boundary in the outer peripheral portion Wp, first, the shape of the boundary between the flat portion Wp1 and the bevel portion Wp2 is preliminarily set as the entire peripheral shape over the entire processing substrate W. collect. And the position of the process board | substrate W is pinpointed by pinpointing which site | part in the perimeter shape the shape of the boundary of the extracted flat part Wp1 and bevel part Wp2 is.

  It should be noted that when calculating the center of the first back surface and when calculating the center of the second back surface, it is preferable to photograph a portion including substantially the same bevel portion Wp2 in the outer peripheral portion Wp. Thereby, the precision which detects the position of the process board | substrate W can be improved more. Note that the control device 30 </ b> C generates an outer periphery on the imaging region 2 </ b> Z of the road camera 12 and the imaging region 4 </ b> Z of the vapor deposition camera 42 based on the position of a feature point such as a notch provided on the processing substrate W and the rotation angle of the processing substrate W. A portion including substantially the same bevel portion Wp2 in the portion Wp can be positioned.

[Calibration substrate W0]
The calibration substrate W0 may include a through-hole that penetrates the calibration substrate W0 as the substrate mark Wm, for example. Even if the substrate mark Wm is a through-hole, the effects according to the above (1) to (9) can be obtained.

  If the substrate mark Wm is a thin film pattern, since the thickness of the substrate mark Wm is thin, the position of the substrate mark Wm by the front surface observation and the position of the transmission image of the substrate mark Wm by the back surface observation are almost the same. To do. For this reason, the configuration in which the substrate mark Wm is a thin film pattern can improve the detection accuracy of the substrate mark Wm on the front and back, and thus the detection accuracy of the position of the substrate, as compared with the configuration in which the substrate mark Wm is a through hole.

  The calibration substrate W0 can include, for example, a light reflective substrate mark Wm and an antireflection film covering the periphery thereof. The cameras 12 and 42 that are located outside the housings 13 and 47 and have a telecentric optical system are usually compared to cameras that are located inside the housings 13 and 47 and cameras that do not have a telecentric optical system. The distance between the calibration substrate W0 and the objective lens, that is, the working distance of the camera is large, and light other than light from the objective surface is likely to enter the objective lens.

  In this regard, if the calibration substrate W0 includes an antireflection film, the antireflection film covering each of the light-reflective substrate marks Wm and the periphery thereof suppresses reflection on the object surface. As a result, even with the cameras 12 and 42 having a large working distance, it is possible to clearly photograph each board mark Wm.

[Vapor deposition equipment]
The vapor deposition apparatus may include only the front surface photographing unit in the EFEM 10 and the rear surface photographing unit in the vapor deposition chamber 34. Even if the front surface photographing unit and the rear surface photographing unit are mounted in separate casings 13 and 47, it is possible to obtain the effect according to the above (1).

  If the EFEM 10 is configured to include a front surface photographing unit and a back surface photographing unit, the camera of the front surface photographing unit and the camera of the rear surface photographing unit can photograph one substrate mark Wm at a time. For this reason, it is possible to suppress the relative position of the substrate mark Wm from being displaced due to a change in the environment, and to further increase the detection accuracy of the position of the substrate.

E ... contour, M ... evaporation mask, W ... processing substrate, MA, WA ... arrangement area, Mm ... mask mark, P1, P2, P3 ... optical axis position, W0 ... calibration substrate, WF ... surface, Wm ... substrate mark , Wp ... outer peripheral part, WR ... back surface, IM1 ... front surface image, IM2 ... first back surface image, IM4 ... second back surface image, IMB ... background image, SIG ... driving signal, Wp1 ... flat part, Wp2 ... bevel part, IM21 ... 1st image, IM22 ... 2nd image, 1A, 2A, 4A ... Optical axis, 1Z, 2Z, 4Z ... Shooting area, 10 ... EFEM, 10S ... Stage, 11 ... Mark camera, 12 ... Road camera, 13, 47 DESCRIPTION OF SYMBOLS ... Housing | casing 20 ... Image processing part 30 ... Deposition apparatus, 30C ... Control apparatus, 31 ... Transfer chamber, 32 ... Carry-in / out chamber, 34 ... Deposition chamber, 35 ... Inversion chamber, 36 ... Sputter chamber, 41 Deposition source, 42 ... vapor deposition camera, 42M ... deposition material, 43 ... substrate holder, 44 ... mask holder, 45 ... drive source, 46 ... drive mechanism.

Claims (7)

A position detection device for detecting the position of a processing substrate which is a non-transparent substrate,
The surface of the calibration substrate, which is a light transmissive substrate, has a plurality of substrate marks,
The position detection device includes:
A surface photographing unit that photographs the surface of the substrate with a camera associated with each substrate mark;
A back side photographing unit for photographing the back side of the board with a camera associated with each board mark;
The relative position between the cameras of the front surface photographing unit is calculated from the result of each camera of the front surface photographing unit photographing the substrate mark, and the relative position between the cameras and each camera of the front surface photographing unit is the processing substrate. And using the result of photographing, the position of the processing substrate by surface photographing is calculated, and
From the result of each camera of the back surface photographing unit photographing the transmission image of the substrate mark, the relative position between the cameras of the back surface photographing unit is calculated, and the relative position between the cameras and each camera of the back surface photographing unit are calculated. An image processing unit that calculates a position of the processing substrate by backside imaging using a result of imaging the processing substrate. The object to be photographed by the surface photographing unit includes a substrate mark located on the surface of the processing substrate,
The object to be photographed by the back surface photographing unit includes a boundary between a flat part located on the back surface of the processing substrate and a bevel part connected to the flat part,
The image processing unit extracts a boundary between the flat portion and the bevel portion captured by each camera of the back surface photographing unit based on the contrast, and extracts the extracted boundary from each camera of the back surface photographing unit. The position detection device according to claim 1, wherein the position detection device is used as a result of imaging the processing substrate. A position detection method for detecting the position of a processing substrate which is a non-transparent substrate,
Using a calibration substrate, which is a light-transmitting substrate having a plurality of substrate marks on the surface, the surface photographing unit photographs the substrate mark from the surface side of the calibration substrate with a camera associated with the substrate mark. In addition, the back surface photographing unit photographs the substrate mark from the back surface side of the calibration substrate with a camera associated with the substrate mark,
The image processing unit calculates the relative position between the cameras of the front surface photographing unit from the result of each camera of the front surface photographing unit photographing the substrate mark, and the relative position between the cameras and each camera of the front surface photographing unit. Using the result of photographing the processing substrate, the image processing unit calculates the position of the processing substrate by surface photographing;
The image processing unit calculates the relative position between the cameras of the back surface photographing unit from the result of each camera of the back surface photographing unit photographing the transmission image of the substrate mark, and the relative position between the cameras and the back surface photographing The image processing unit calculates the position of the processing substrate by backside imaging using the result of each camera of the unit imaging the processing substrate. A position detection method. Each camera of the back surface photographing unit includes a telecentric optical system, photographs the processing substrate from the outside of the housing that houses the processing substrate,
The position detection method according to claim 3, wherein the calibration substrate includes an antireflection film that covers each of the light-reflective substrate marks and the periphery of the substrate mark. The position detection method according to claim 4, wherein the calibration substrate has a coefficient of thermal expansion of 3 ppm / ° C. or less. A deposition chamber for performing deposition on the surface of the processing substrate which is a non-permeable substrate;
A position detection device for detecting the position of the processing substrate,
The surface of the calibration substrate, which is a light transmissive substrate, includes a plurality of substrate marks,
The position detection device includes:
A surface photographing unit that photographs the surface of the substrate with a camera associated with each substrate mark;
A back side photographing unit for photographing the back side of the board with a camera associated with each board mark;
The relative position between the cameras of the front surface photographing unit is calculated from the result of each camera of the front surface photographing unit photographing the substrate mark, and the relative position between the cameras and each camera of the front surface photographing unit is the processing substrate. And using the result of photographing, the position of the processing substrate by surface photographing is calculated, and
From the result of each camera of the back surface photographing unit photographing the transmission image of the substrate mark, the relative position between the cameras of the back surface photographing unit is calculated, and the relative position between the cameras and each camera of the back surface photographing unit are calculated. A vapor deposition apparatus, comprising: an image processing unit that calculates a position of the processing substrate by backside imaging using a result of imaging the processing substrate. Two back side imaging sections;
A pre-stage module for bringing the substrate into the vapor deposition apparatus from the outside;
A reversing chamber for reversing the front and back of the substrate loaded by the front module and loading the substrate into the vapor deposition chamber,
One of the back surface photographing units is mounted on the front module together with the front surface photographing unit,
The vapor deposition apparatus according to claim 6, wherein the other rear surface photographing unit is mounted on the vapor deposition chamber.