JP2016110066A - Position determination apparatus, position determination method, lithography apparatus, and method for producing article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a position determination apparatus in which a mark and the edge of a substrate are detected by using a common light receiving element so that a position of the substrate can be determined.SOLUTION: A position determination apparatus 100 has: a first light projecting means 111 for emitting light toward the edge 12 of the rotating substrate 10; a second light projecting means 112 for emitting light toward a mark 11 existing on the surface of the substrate 10; and a light receiving means 110 which is disposed on the mark 11-formed surface side of the substrate 10 and receives the light emitted from the first light projecting means 111 and is passed on the outside of the substrate 10, and the light emitted from the second light projecting means 112 and is reflected from the mark 11, so that the position of the substrate 10 is determined on the basis of the results received by the light receiving means 110.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a position determination apparatus, an alignment method, a lithographic apparatus, and an article manufacturing method.

  In an exposure apparatus that transfers a pattern such as a circuit pattern to a substrate, the substrate is aligned before being transported so that the substrate is transported to a predetermined exposure position. For example, a V-shaped notch called a notch is formed in the substrate, the position of the substrate is obtained by detecting the position of the notch, and alignment is performed so as to correct a deviation from a predetermined position.

  However, due to the resist wrapping around the notch and the asymmetry of the substrate on which the notch is formed, the performance of the semiconductor element is likely to deteriorate in the area around the notch in each process including the exposure process and the film forming process. . Therefore, in order to prevent a decrease in yield, a technique for aligning with a substrate without a notch is required.

  Patent Document 1 relates to an alignment apparatus having a mechanism for determining the position of a substrate using a mark formed on the back surface of the substrate. Using the sensor for detecting the edge of the substrate and the sensor for detecting the mark on the back surface, the position of the substrate in the translation direction and the rotation direction (circumferential direction) is obtained.

  Patent Document 2 also relates to an alignment apparatus having a mechanism for determining the position of a substrate using a mark formed on the back surface of the substrate. The position of the substrate is obtained by receiving the reflected light from the shot array formed on the substrate surface and the reflected light from the mark formed on the back surface of the substrate with one sensor.

JP 2007-5794 A JP-A-9-139342

  In the alignment apparatus described in Patent Document 1, a sensor that detects an edge and a sensor that detects a mark are arranged at positions separated from each other. Therefore, it becomes necessary to measure the relative positions of the two sensors in advance. When the ambient temperature change is large, the relative position may have to be measured frequently.

  The alignment apparatus described in Patent Document 2 does not have a means for detecting an edge. Therefore, when performing processing such as peripheral exposure in which the edge is exposed along the edge for the purpose of removing unnecessary resist on the substrate, it becomes necessary to perform edge detection again.

  Accordingly, an object of the present invention is to provide an alignment apparatus, an alignment method, and a lithography apparatus that can detect the mark and the edge of the substrate using a common light receiving means and determine the position of the substrate. .

  The alignment apparatus of the present invention includes a first light projecting unit that irradiates light to an end portion of a substrate, a second light projecting unit that irradiates light on a mark on the surface of the substrate, and the surface of the substrate. Arranged on the side, receiving light from the first light projecting means and passing outside the substrate, and receiving light from the second light projecting means and reflected by the mark And a light receiving means for receiving light, wherein the position of the substrate is determined based on a light reception result by the light receiving means.

  According to the position determination apparatus, the position determination method, and the lithography apparatus of the present invention, the position of the substrate can be obtained by detecting the mark and the edge of the substrate using a common light receiving means.

The front view of the alignment apparatus of 1st Embodiment. The flowchart which shows the position alignment method of 1st Embodiment. The figure which shows the light-receiving waveform of the board | substrate edge part of 1st Embodiment. The figure which shows the position waveform of the edge of 1st Embodiment. The top view which shows the alignment apparatus of 1st Embodiment. The figure which shows the light-receiving waveform of the board | substrate edge part of 2nd Embodiment. The figure which shows the position waveform of the edge of 2nd Embodiment. The flowchart which shows the positioning method of 5th Embodiment. The figure which shows the position waveform which aligned the edge of 5th Embodiment. The figure of the lithography apparatus carrying a position detection apparatus.

[First Embodiment]
FIG. 1 is a front view of an alignment apparatus (position determination apparatus) 100 according to a first embodiment of the present invention. FIG. 1 shows a state where the substrate 10 is transferred onto the stage 120. Before transporting the substrate 10 to an apparatus that performs processing, the alignment apparatus 100 detects the position of the substrate 10 and aligns the position of the substrate 10 to a predetermined standby position based on the detection result. Hereinafter, the alignment refers to aligning the substrate 10 at a predetermined position with respect to the translation direction and the rotation direction.

  The stage 120 includes a rotation stage (rotating means) 121 that rotates the substrate 10 about the Z-axis direction as a rotation axis, an XY stage 122 that translates the substrate 10 in the XY plane, and a support unit 123 that supports the substrate 10. have.

  As the substrate 10, a substrate in which notched portions such as orientation flats and notches are not formed is used. In the present embodiment, a substrate having a diameter of 300 mm is used as the substrate 10. However, the substrate may be a substrate having a diameter of less than 300 mm, a substrate having a diameter of 300 mm to 450 mm, or a substrate having a diameter larger than 450 mm.

  A mark 11 is formed in the vicinity of the edge 12 on the back surface of the substrate 10 transported to the stage 120. The mark 11 is a mark having a concavo-convex structure formed by, for example, laser marking. Examples of the mark pattern include a pattern in which a plurality of hemispherical concave portions are arranged in a row or two-dimensionally, a line-and-space pattern, or a rectangular pattern.

  Hereinafter, the surface of the substrate 10 is a surface to be processed of the substrate 10 (surface in the vertical direction in the present embodiment), and the surface of the substrate 10 opposite to the surface to be processed (vertical in the present embodiment). The lower surface). Further, the vertical position of the surface to be processed with respect to the substrate 10 is the front surface side, and the vertical position of the surface opposite to the processing surface with respect to the substrate 10 is the back surface side.

  A first light source (first light projecting means) 111 is disposed on the front surface side of the substrate 10, and a second light source (second light projecting means) 112 is disposed on the rear surface side. An optical system 113 and a light receiving element (light receiving means, light receiving sensor) 110 are arranged vertically below the first light source 111 and on the back side of the substrate 10. The first light source 111 and the second light source 112 are light sources that emit light from different surface sides, and are LED light sources that emit light of the same wavelength. The light receiving element 110 is an image pickup element such as a CCD or a CMOS.

  The light receiving element 110 is provided on the same surface side as the second light source 112 with respect to the substrate 10 so as to face the first light source 111. That is, in order to bend the optical path by polarizing the light beam emitted from each light source both on the optical path from the first light source 111 to the light receiving element 110 and on the optical path from the second light source 112 to the light receiving element 110. These optical elements are not arranged. Thus, by configuring the optical device included in the alignment apparatus 100 to be small, space saving around the rotary stage 121 can be achieved.

  The first light source 111 emits light vertically downward so as to include at least an edge 12 that is a boundary between the substrate 10 and the outer peripheral space. The second light source 112 irradiates light to the mark 11 obliquely so as to provide dark field illumination.

  The light receiving element 110 is light from the first light source 111 and has passed through the space on the outer peripheral side from the edge 12 (light that has passed through the outside of the substrate) and is reflected by the mark 11 irradiated by the second light source 112. The reflected light (at least one of reflected diffracted light and reflected scattered light) is received via the optical system 113. That is, the light receiving element 110 is common to the light from the first light source 111 and the light from the second light source 112, in other words, the light that has passed through the outside of the substrate 10 and the light reflected by the mark 11. The light receiving element.

  Note that the first light source 111 is preferably bright field illumination. By using bright field illumination instead of dark field illumination, even if the chamfer 13 is provided in the vicinity of the edge 12 of the substrate 10 so as to remove corners, the edge 12 is affected by the reflected light in the chamfer 13. It is possible to prevent a decrease in measurement accuracy. Further, as shown in FIG. 1, the second light source 112 preferably irradiates the mark 11 with light obliquely from the center side of the substrate 10. Thereby, it can prevent that the detection accuracy of the mark 11 or the edge 12 falls under the influence of the reflected light from the chamfer 13.

  The control unit 130 is connected to the light receiving element 110. The mark 11 and the edge 12 are detected from the light reception result by the light receiving element 110, and the position of the substrate 10 is obtained. The control unit 131 is connected to the first light source 111 and dimmes the first light source 111. The control unit 132 is connected to the second light source 112 and dimmes the second light source 112. The control unit 133 is connected to the stage 120 and controls driving of the rotary stage 121 and the XY stage 122.

  The control units 130 to 133 each have a CPU (not shown), and the control units 130 to 134 can exchange information with each other. For example, the control unit 133 can drive the stage 120 to align the substrate 10 so as to correct the positional deviation of the substrate 10 obtained by the control unit 130.

  Information necessary for the alignment operation is stored in the memory 134 by the control units 130 to 133. For example, the position of the substrate 10 (including the position in the rotation direction) obtained by the control unit 130, the light amounts of the first light source 111 and the second light source 112, and the like are stored. Further, a threshold value of a signal used for detection of the mark 11 and detection of the edge 12 is also stored. The control units 130 to 133 and the memory 134 may be arranged on one control board or another control board as long as these functions are not impaired.

  Next, how to determine the position of the mark 11 and the position of the edge 12 and the position of the substrate 10 by the control unit 130 will be described with reference to FIGS.

  FIG. 2 is a flowchart showing a flow of alignment of the substrate 10 using the alignment apparatus 100. Before the substrate is carried into the alignment apparatus 100, the control unit 131 dims the first light source 11 (S301). The light amount of the light from the first light source 111 is measured by the light receiving element 110, and the light amount of the first light source 111 is adjusted so that the signal intensity indicated by the light amount becomes an optimum value. Note that the first light source 111 is preferably dimmed without the substrate 10 serving as a light shielding material. If the light is adjusted after the substrate is transported, it is not possible to confirm the amount of light in the portion shielded by the substrate 10. Therefore, there is a possibility that the signal intensity exceeds the allowable value during the rotation operation of the substrate 10.

  Next, the substrate 10 is carried into the alignment apparatus 100 by a carry-in robot (not shown) (S302). The loaded substrate 10 is supported by a vacuum suction mechanism (not shown) of the support portion 123. At the stage when the substrate 10 is carried in, alignment is not performed, and the substrate 10 is shifted in the translational direction and the rotational direction with respect to a desired position.

  Subsequently, the control unit 132 dimmes the second light source 112 (S303). Since it is necessary to receive the reflected light from the mark 11, the second light source 112 is dimmed using that value when the light quantity value previously used for alignment is known.

  The controller 133 rotates the substrate 10 using the rotary stage 121 (S304). While rotating the rotary stage 121, the light receiving element 110 receives light from the first light source 111 and reflected light reflected by the back surface of the substrate 10 irradiated by the second light source 112. When the second light source 112 emits light so as to include the mark 11, the reflected light from the mark 11 is also received. The light receiving element 110 receives light from the first light source 111 and the second light source 112 while rotating the substrate 10 and continuously acquires position information of the edge 12 of the substrate 10 in the rotation direction.

  The control unit 130 sequentially captures the received light signal (S305), and detects the position of the mark 11 and the position of the edge 12 on the substrate 10 using the captured signal (S306). When the rotation stage 121 rotates the substrate 10 by an amount necessary for alignment (360 ° when there is one mark), the control unit 133 ends the rotation operation (S307).

  The step S306 will be described in detail with reference to FIG. FIG. 3 shows the relationship between the detection signal waveform 140 (hereinafter referred to as the light reception waveform) 140 corresponding to the light reception result and the substrate 10 when the mark 11 is present in the field of the light receiving element 110. The horizontal axis represents the position R of the substrate 10 in the radial direction, and the vertical axis represents the amount of light. The light reception waveform 140 shows a state in which the amount of light increases in an outer peripheral side region of the substrate 10 and a partial region on the inner peripheral side of the substrate 10. The amount of light on the outer peripheral side of the substrate 10 corresponds to a portion that is light from the first light source 111 and is not shielded by the substrate 10, and the amount of light in a part of the inner peripheral side corresponds to reflected light from the mark 11. doing.

  The control unit 130 determines that the position 142 of the received light waveform 140 that is below the predetermined threshold 141 for the first time after scanning from the outermost periphery toward the center of the substrate 10 is the position of the edge 12. Similarly, the center of the position 143 to the position 144 that is scanned from the position 142 to the center side and exceeds a predetermined threshold value 145 is determined as the position of the mark 11. The threshold value 141 and the threshold value 145 may be the same value. However, when there is a difference in light amount between the light from the first light source 111 and the reflected light from the mark 11, the threshold value 141 and the threshold value 145 may be distinguished. preferable.

  In FIG. 2, the control unit 130 determines whether or not the mark 11 is detected (S308). If it is determined that the signal could not be detected (NO), the process returns to step S303, and the light amount of the second light source 112 is readjusted. When determining that the mark 11 has been detected in S308 (YES), the control unit 130 stores the light amount of the second light source 112 at this time in the memory 134 (S309). From the signal intensity of the obtained mark 11, an amount of light that provides an optimum signal intensity may be obtained and stored in the memory 134.

The control unit 130 determines the position of the substrate 10 using the position of the mark 11 and the position of the edge 12 obtained in the steps S305 and S306. From the received light waveform 140 at each rotation angle, the control unit 130 obtains the position waveform 80 of the edge 12 shown in FIG. The horizontal axis represents the rotation angle θ, and the vertical axis represents the position R in the radial direction of the substrate 10. The mark signal 81 is detected at a rotation angle θ = θ _mark .

  The position waveform 80 is expressed by equation (1).

As shown in FIG. 5, if the center 20 of the substrate 10 is eccentric with respect to the center 125 of the stage 120, r indicates the magnitude of the eccentric vector 21 (X, Y). θ is a rotation angle between S304 and S307. α represents an angle formed by the eccentric vector 21 and a straight line connecting the center 125 and the light receiving element 110. L is the radius of the substrate 10. θ _mark represents an angle formed by a straight line connecting the center 125 and the mark 11 and a straight line connecting the center 125 and the light receiving element 110.

The control unit determines the position in the horizontal direction of the substrate 10 with respect to the stage 120 using the position waveform 80, and determines the position in the rotation direction using θ _mark (S310).

  Using the position information of the substrate 10 determined by the control unit 130, the control unit 133 drives the stage 120 in the translation direction and the rotation direction, and sets the position of the substrate 10 to a predetermined position (S311). Alternatively, using the position information of the substrate 10, the carry-in robot remounts the substrate 10 at a predetermined position on the stage 120. By performing the alignment in this manner, it is possible to prevent the processing accuracy from being lowered due to the positional deviation of the substrate 10 during the subsequent transport operation or processing operation.

  Finally, the substrate 10 is unloaded from the alignment apparatus 100 (S312). Since the edge 12 is also detected, the peripheral exposure processing may be performed using the detection result before carrying out in S312.

  According to the present embodiment, the position can be determined with high accuracy even for the substrate 10 in which notches are not formed. Therefore, it is possible to suppress a decrease in chip yield due to a decrease in polishing and other processing accuracy around the notch, which has occurred in the prior art.

  Since the light from the first light source 111 and the light from the second light source 112 are received by the common light receiving element 110, it is possible to detect the mark 11 and the edge 12 collectively by using the simultaneously received image. it can.

  Compared to the case where the light receiving elements corresponding to the individual light sources are arranged, the mounting on the alignment apparatus 100 can be reduced, and the light receiving elements need not be aligned. For this reason, it is possible to reduce the factors that cause the detection accuracy of the mark 11 and the edge 12 to be reduced, and the substrate 10 can be accurately aligned.

[Second Embodiment]
In the alignment apparatus 100 according to the second embodiment, the memory 134 stores the distance from the edge 12 to the mark 11 or the corresponding signal width as the distance information from the edge 12 to the mark 11 of the substrate 10. Other configurations are the same as those of the alignment apparatus 100 of the first embodiment.

  FIG. 6 shows the relationship between the light receiving waveform 140 and the substrate 10 when the mark 11 is present in the field of view of the light receiving element 110. However, if the foreign matter 20 is attached to the back surface of the substrate 10, the reflected light from the foreign matter 20 is also represented in the received light waveform 140. Further, if the signal intensity due to the reflected light from the foreign material 20 exceeds the threshold value 145, the control unit 130 may be mistaken for the reflected light from the mark 11. The present embodiment is an effective method in such a case.

  The control unit 130 detects the edge 12 of the substrate 10 using the received light waveform 140. Using the distance from the edge 12 to the mark 11 stored in the memory 134, the detection range of the position R when the position of the mark 11 is specified is determined between the position 83 and the position 84. If there is a signal exceeding the threshold value 145 between the position 83 and the position 84, it is determined that there is the mark 11 and the position of the mark 11 is specified. As in the first embodiment, the mark 11 and the edge 12 can be detected and the substrate 10 can be aligned with a simple configuration.

  By using the distance from the edge 12 to the mark 11 and a part of the light reception result in the radial direction at each rotation angle, the position of the mark 11 is prevented from being erroneously detected due to the reflected light from the foreign material 20. (See FIG. 7). By narrowing the detection range, the time required to detect the position of the mark 11 can be shortened. Alternatively, the detection accuracy of the position of the mark 11 can be improved by analyzing in detail the light reception waveform 140 within the narrowed detection range.

[Third Embodiment]
When the light receiving element 110 performs imaging while the substrate 10 is rotated and the first light source 111 and the second light source 112 are kept on, depending on the rotation speed, the image of the mark 11 or the image of the edge 12 may be blurred. Will occur. When the image is blurred, the waveform of the portion corresponding to the edge 12 of the received light waveform 140 is waved, or the half value of the peak waveform corresponding to the mark 11 is widened, and the detection accuracy of the positions of the edge 12 and the mark 11 is improved. May decrease.

  Therefore, in the alignment apparatus 100 according to the third embodiment, the control unit 131 sets the lighting time interval of the first light source 111 and the control unit 132 sets the lighting time interval of the second light source 112. The other configuration is the same as that of the alignment apparatus 100 of the first embodiment, and the alignment of the substrate 10 is performed using the same method.

  That is, while the substrate 10 is rotating, the first light source 111 and the second light source 112 emit flashing light that repeatedly flashes in a short time. As a result, image blurring is reduced, and the influence on the detection accuracy of the mark 11 and the edge 12 can be reduced.

  Since the image blur is particularly large in the rotation direction, the lighting time of the second light source 112 is preferably shorter than the lighting time of the first light source 112. For this reason, since the amount of light entering the light receiving element 110 is greater in the first light source 111, the first light source 111 can select a light source having a smaller amount of light (brightness) than the second light source 112. .

[Fourth Embodiment]
The configuration of the alignment apparatus 100 of the fourth embodiment is the same as that of the first embodiment. It is assumed that three marks (a plurality of marks) 11 are formed concentrically with the center 20 of the substrate 10 at intervals of 120 ° on the back surface of one substrate 10.

  In this case, the rotation angle of the substrate 10 rotated by the control unit 130 between S304 and S307 may be 120 °. This is because at least one mark 11 can be detected by rotating 120 °. Thus, by adjusting the light receiving range in the rotation direction according to the number of marks 11, the time required to detect the marks 11 and edges 12 can be reduced.

  If the mark 11 cannot be detected even after being rotated by 120 °, the light projection condition of the second light source 112 may be changed. The light projection condition is, for example, the amount of light or the incident angle of light with respect to the mark 11.

  There is a high possibility that the mark can be detected by increasing the signal intensity by increasing the amount of light or by improving the S / N ratio of the signal intensity by changing the light projection angle. As a means for changing the projection angle, the second light source 112 is arranged at various angles to switch the element to be lit, and a plurality of paths for guiding the light from the second light source 112 are arranged to provide a mirror. And a method of switching the route by using. The second light source 112 may be moved by a driving mechanism (not shown).

  When applied in combination with the third embodiment, the lighting time is also included in the light projection conditions. If the light projection conditions are changed according to the number of marks 11 formed on the back surface and the rotation angle of the substrate 10 (position in the rotation direction of the substrate), the marks 11 can be detected in a short time.

  Alternatively, it is assumed that there are two or more types of marks 11. If the line width and space width are different, the reflected light from each mark 11 can be distinguished from the distribution of signal intensity. In this case, the control unit 130 specifies the position of the substrate 10 based on the plurality of mark positions and types (information of the plurality of marks) and the light reception result. The substrate 10 is rotated 360 ° to detect a plurality of marks 11, and the position intervals in the rotation direction of the actual plurality of marks 11 formed on the substrate 10 are compared with the position intervals in the rotation direction of the detected marks 11. . It is also possible to reduce the influence of measurement errors and increase the accuracy of specifying the position of the substrate 10.

[Fifth Embodiment]
In the alignment apparatus 100 according to the fifth embodiment, the memory 134 includes three different types of marks 11 formed on the back surface of the substrate 10 (mark signals 81, 85, and 86 corresponding to the three types of marks 11 in FIG. 9). (Shown) is stored as a template (mark sample information). Other configurations are the same as those of the alignment apparatus 100 of the first embodiment.

  FIG. 8 is a flowchart showing a flow of alignment according to the fifth embodiment. Steps S401 to S405 are the same as steps S301 to S305 in FIG. 3, and steps S409 to S413 are the same as steps S308 to S312 in FIG. .

  While acquiring the signal of the light receiving element 110 in S405, the control unit 130 only detects the edge 12 (S406). After completion of the rotation (S407), the control unit 130 uses the signal acquired from the light receiving element 110 to create a two-dimensional image in which the positions of the edges 12 are aligned as shown in FIG. In FIG. 9, the horizontal axis indicates the rotation angle θ, and the vertical axis indicates the position R in the radial direction.

  The control unit 130 generates a two-dimensional image represented by the mark signals 81, 85, 86 without distortion due to the rotation component. The control unit 130 can specify the position of the substrate 10 by performing template matching between the mark signals 81, 85, and 86 and images of three different types of marks 11 stored in the memory 134 (S408). Thus, based on the light reception result and the template of the mark 11, even the substrate 10 without a notch can be aligned with high accuracy (S411, S412).

  With the template matching method, the foreign matter signals 90 and 91 are not mistaken as mark signals. Even when a plurality of types of marks are formed on the substrate 10, the respective positions can be easily specified. Further, in combination with the second embodiment, the detection range may be narrowed between the position 83 and the position 84. As a result, the time required for detection can be shortened.

[Sixth Embodiment]
In the sixth embodiment, the light receiving element 110 detects the transmitted light from the first light source 111 and the reflected light from the second light source 112 reflected by the mark 11 at different timings. That is, the edge 12 is detected from an image obtained by irradiating light with only the first light source 111 first, and then the position of the mark 11 is detected from the image obtained using only the second light source 112.

  When the mark 11 is detected by the second light source 112, the position of the edge 12 similar to that of FIG. 9 is obtained by rotating the substrate 10 while correcting the eccentricity of the substrate 10 based on the position of the edge 12 acquired previously. Can be obtained. Compared with the case of creating a two-dimensional image in which the positions of the edges 12 are aligned from the received light waveform 140 once acquired, the signal processing time can be shortened. Furthermore, when the imaging region by the light receiving element 110 is narrowed down, the signal processing time can be shortened.

  The rotational speed of the rotary stage 121 may be changed according to the required detection accuracy depending on whether the edge 12 is detected or the mark 11 is detected. For example, when the edge 12 is detected, the number of acquired data of the received light waveform 140 may be reduced by rotating the substrate 10 at a higher speed than when the mark 11 is detected. The load of signal processing can be reduced.

[Other Embodiments]
Other embodiments common to the first to fifth embodiments will be described.

  As the mark 11, it is preferable to use a mark formed in advance for determining the crystal orientation of the substrate 10 according to the standard, not a mark processed by the user. The standard mark is a mark formed by arranging a plurality of hemispherical recesses, and three types of marks having different recess arrangements are arranged on the back surface of the substrate 10 at intervals of about 120 °. It is. The time for forming the mark 11 separately can be omitted. Of the three types of standard marks, at least one type of mark information and edge information may be used.

  The standard mark is a mark formed with a positional error of about 10 μm in the translation direction and about 0.1 ° in the rotation direction. Therefore, as compared with the case where the position (x, y, θ) of the substrate 10 is determined by measuring the positions of the three standard marks, the position information of the continuous edges 12 is also combined as in the above-described embodiments. In the case of acquisition, the position of the substrate 10 can be obtained with higher accuracy. The position of the substrate 10 can be obtained with higher accuracy than when the position information of the edge 12 is obtained discretely.

  The light receiving element 110 may have different sensitivities between a region that mainly receives the first light source 111 and a region that mainly receives the second light source 112. Instead of rotating the substrate 10, the edge 12 and the mark 11 may be detected by rotating the first light source 111 and the second light source 112.

  The control unit 130 may detect the edge 12 and the mark 11 using a waveform obtained by performing a moving average process on the received light waveform 140. Since the signal of the foreign object 20 is often local as compared with the signal of the mark 11, a noise signal caused by the foreign object 20 can be reduced.

  Note that the moving average process refers to continuously performing a process of calculating an average value within a certain interval. For example, the signal intensity at each angle θ of the received light waveform 140 is a process of converting the signal intensity to an average value included within θ = ± 1 °.

  The first light source 111 may emit light so as to include the edge 12 from the back surface side vertically upward, and the optical system 113 and the light receiving element 110 may be disposed vertically above the first light source 111. However, in this case, the light irradiated by the second light source 112 and reflected by the mark 11 is guided using a different optical system (not shown) while bending the optical path, and is incident on the optical system 113. The light from the first light source 111 may be irradiated near the edge 12 by bending the optical path using another optical system (not shown).

  The illumination method of the second light source 112 may be bright field illumination. An illumination method that allows the mark 11 to be easily detected may be selected depending on the material of the substrate 10 and the shape of the mark 11. When the mark 11 is close to the circumference of the substrate 10, it is preferable that light is incident obliquely from the center side by dark field illumination. It is possible to prevent the reflected light from the chamfer 13 from being strongly detected by the light receiving element 111 and hindering detection of light having a small light amount including the position information of the edge 12 and the mark 11.

  As described above, according to the embodiment, the light receiving element 110 includes at least one of light from the first light source 111 and light from the second light source 112 while the rotary stage 121 rotates the substrate 10. Is received.

  The light source wavelengths of the first light source 111 and the second light source 112 may be the same wavelength or different wavelengths. However, the wavelength of the irradiated light needs to be a wavelength that does not affect the subsequent processing. For example, when handling the substrate 10 coated with a photosensitive material such as a resist, at least the surface of the substrate 10 coated with the resist is irradiated with light having a wavelength (for example, 450 to 800 nm) at which the photosensitive material is not exposed. In the case where the substrate 10 is a substance that transmits light, such as a glass substrate, it is preferable to change the wavelength so that the signal intensity is easily generated according to the substrate. The first light source 111 and the second light source 112 may be light sources other than LEDs.

[Installation in other devices]
FIG. 10 is a view of an exposure apparatus (lithography apparatus) 500 on which the alignment apparatus 100 according to the first embodiment is mounted as viewed from the + Z direction. The exposure apparatus 500 is an apparatus that forms a pattern such as a circuit pattern on the substrate 10 on the exposure stage 520 by irradiating, for example, i-line (wavelength 365 nm) using the optical system 510.

  The transport hand 530 transports the substrate 10 at the standby position 540 onto the stage 120 of the alignment apparatus 100. After the alignment apparatus 100 adjusts the standby position of the substrate 10, the feeding hand 550 places the substrate 10 on the exposure stage 520. After the pattern exposure operation is completed, the transport hand 530 transports the substrate 10 to the standby position 540.

  Further, the lithography apparatus 500 may have a light source (not shown) and an optical system (not shown) different from those described above in the vicinity of the alignment apparatus 100. While the substrate 10 is rotated by the rotation stage 121, the peripheral portion (the outermost periphery or a little inside thereof) of the substrate 10 is exposed in a ring shape based on the position information of the edge 12 of the substrate 10 acquired using the alignment apparatus 100. (Peripheral exposure).

  It is possible to remove a resist that is unnecessary when forming an annular convex structure on the peripheral portion of the substrate 10. As a result, an annular convex portion can be formed on the exposed surface of the substrate 10, and a plating process for preventing peeling of the semiconductor layer formed on the substrate 10 can be performed in a plating apparatus (not shown) outside the lithography apparatus 500. Easy to do. It is possible to prevent the resist from being supplied insufficiently at the peripheral portion by supplying the resist excessively at the peripheral portion of the substrate 10 or by supplying the resist deviating from a predetermined position.

  The light (beam) projected onto the substrate by the lithography apparatus of the present invention is not limited to i-line. Far-ultraviolet light, such as KrF light (wavelength 248 nm) or ArF light (wavelength 193 nm), or g-ray (wavelength 436 nm), which is visible light light, may be used. The lithography apparatus may be an apparatus that forms a latent image pattern on a wafer by irradiating the substrate with a charged particle beam, or an apparatus that forms a pattern on a substrate by an imprint method.

  The alignment apparatus 100 can also be mounted on other processing apparatuses that require alignment of the substrate 10.

[Product Manufacturing Method]
A method for manufacturing an article according to an embodiment of the present invention includes a step of forming a pattern on a substrate (wafer, glass plate, etc.) using a lithography apparatus, and a step of processing the substrate on which the pattern is formed. including. The article is, for example, a semiconductor integrated circuit element, a liquid crystal display element, an imaging element, a magnetic head, a CD-RW, an optical element, a photomask, or the like. The processing process is, for example, an etching process or an ion implantation process. Furthermore, other known processing steps (development, oxidation, film formation, vapor deposition, planarization, resist peeling, dicing, bonding, packaging, etc.) may be included.

DESCRIPTION OF SYMBOLS 10 Substrate 11 Mark 12 Edge 100 Positioning device 110 Light receiving element 111 First light source 112 Second light source 121 Rotating stage 500 Exposure device

The present invention relates to a position determining device, a position determining method, a lithographic apparatus, and an article manufacturing method.

SUMMARY OF THE INVENTION An object of the present invention is to provide a position determination device, a position determination method, and a lithography apparatus that can detect a mark and an edge of a substrate using a common light receiving means and determine the position of the substrate. .

The alignment apparatus of the present invention includes a first light projecting unit that irradiates light to an end portion of a substrate, a second light projecting unit that irradiates light on a mark on the surface of the substrate, and the surface of the substrate. Arranged on the side, receiving light from the first light projecting means and passing outside the substrate, and receiving light from the second light projecting means and reflected by the mark and having a light receiving means for receiving light, and a determination means for determining a position of the substrate based on the light reception result by the pre-Symbol light receiving means.

Positioning device of the present invention, the position determination method, and according to the lithography equipment, using a common light receiving means detects the mark and the edge of the substrate, it is possible to determine the position of the substrate.

The control unit 130 (determining means) is connected to the light receiving element 110. The mark 11 and the edge 12 are detected from the light reception result by the light receiving element 110, and the position of the substrate 10 is obtained. The control unit 131 is connected to the first light source 111 and dimmes the first light source 111. The control unit 132 is connected to the second light source 112 and dimmes the second light source 112. The control unit 133 is connected to the stage 120 and controls driving of the rotary stage 121 and the XY stage 122.

The control units 130 to 133 each have a CPU (not shown), and the control units 130 to 133 and the memory 134 can exchange information with each other. For example, the control unit 133 can drive the stage 120 to align the substrate 10 so as to correct the positional deviation of the substrate 10 obtained by the control unit 130.

FIG. 2 is a flowchart showing a flow of alignment of the substrate 10 using the alignment apparatus 100. Before the substrate carried into the alignment device 100, the control unit 131 to dim the first light source 11 1 (S301). The light amount of the light from the first light source 111 is measured by the light receiving element 110, and the light amount of the first light source 111 is adjusted so that the signal intensity indicated by the light amount becomes an optimum value. Note that the first light source 111 is preferably dimmed without the substrate 10 serving as a light shielding material. If the light is adjusted after the substrate is transported, it is not possible to confirm the amount of light in the portion shielded by the substrate 10. Therefore, there is a possibility that the signal intensity exceeds the allowable value during the rotation operation of the substrate 10.

The control unit 130 determines the position of the substrate 10 in the horizontal direction with respect to the stage 120 using the position waveform 80, and determines the position in the rotation direction using θmark (S310).

Since image blur is particularly large towards the rotational direction, the lighting time of the second light source 112 is preferably more shorter than the lighting time of the first light source 11 1. For this reason, since the amount of light entering the light receiving element 110 is greater in the first light source 111, the first light source 111 can select a light source having a smaller amount of light (brightness) than the second light source 112. .

FIG. 8 is a flowchart showing a flow of alignment according to the fifth embodiment. S401~S405 steps and steps of S301~S305 in Fig. 2, not described for S409~S413 of processes are the same as those of S308~S312 in Fig. 2, it will be mainly described S406~S408 steps .

The illumination method of the second light source 112 may be bright field illumination. An illumination method that allows the mark 11 to be easily detected may be selected depending on the material of the substrate 10 and the shape of the mark 11. When the mark 11 is close to the circumference of the substrate 10, it is preferable that light is incident obliquely from the center side by dark field illumination. And light reflected from the chamfered 13 is detected strongly to the light receiving element 11 0, it is possible to prevent hindering the detection of small quantity of light including positional information of the edge 12 and the mark 11.

Further, the exposure apparatus 500 may have a light source (not shown) and an optical system (not shown) different from those described above in the vicinity of the alignment apparatus 100. While the substrate 10 is rotated by the rotation stage 121, the peripheral portion (the outermost periphery or a little inside thereof) of the substrate 10 is exposed in a ring shape based on the position information of the edge 12 of the substrate 10 acquired using the alignment apparatus 100. (Peripheral exposure).

It is possible to remove a resist that is unnecessary when forming an annular convex structure on the peripheral portion of the substrate 10. As a result, an annular convex portion can be formed on the exposed surface of the substrate 10, and plating processing for preventing peeling of the semiconductor layer formed on the substrate 10 is performed in a plating apparatus (not shown) outside the exposure apparatus 500. Easy to do. It is possible to prevent the resist from being supplied insufficiently at the peripheral portion by supplying the resist excessively at the peripheral portion of the substrate 10 or by supplying the resist deviating from a predetermined position.

Claims (17)

First light projecting means for irradiating the end of the substrate with light;
Second light projecting means for irradiating the mark on the surface of the substrate with light;
The light is disposed on the surface side of the substrate, receives light from the first light projecting means and passes outside the substrate, and light from the second light projecting means, A light receiving means for receiving the light reflected by the mark,
A position determining device, wherein the position of the substrate is determined based on a light reception result by the light receiving means.   The position determining apparatus according to claim 1, wherein the determining unit determines the position of the end and the position of the mark based on the light reception result.   3. The position determining device according to claim 1, wherein the second light projecting unit irradiates light to the mark obliquely from a center side of the substrate. 4.   4. The position according to claim 1, wherein the first light projecting unit and the second light projecting unit irradiate light from different surfaces with respect to the substrate. 5. Decision device.   A rotating unit that rotates the substrate; and the light receiving unit receives light from the first light projecting unit and light from the second light projecting unit while the rotating unit rotates the substrate. 5. The position determining device according to claim 1, wherein at least one of the lights is received.   The position determining apparatus according to claim 1, wherein the second light projecting unit irradiates light to the mark on the back surface of the substrate.   7. The position determining apparatus according to claim 1, wherein the determining unit determines the position of the substrate based on the light reception result and the sample information of the mark.   7. The determination unit according to claim 1, wherein the determination unit obtains the position of the mark using a part of a light reception result in a radial direction of the substrate and distance information from the end to the mark. The position determining apparatus according to any one of the above.   The position determining apparatus according to claim 1, wherein the second light projecting unit emits blinking light.   10. The position determining device according to claim 1, wherein the light receiving unit adjusts a light receiving range in a rotation direction of the substrate based on the number of the marks.   11. The position determining device according to claim 1, wherein the second light projecting unit changes a light projecting condition based on the number of the marks and the position in the rotation direction.   12. The position determining apparatus according to claim 1, wherein the determining unit determines the position of the substrate based on a result obtained by performing a moving average process on the light reception result. Irradiating light to an edge of the substrate and a mark on the surface of the substrate;
Receiving the light that has passed through the light outside the substrate and the light reflected by the mark using a common light receiving means;
A position determination method for determining a position of the substrate based on a light reception result in the light receiving step.   A plurality of marks are formed on the substrate, and in the determining step, the position of the substrate is determined based on a light reception result in the light receiving step and information on the plurality of marks. 14. The position determination method according to 13. A substrate position determination device according to any one of claims 1 to 12,
Based on the position of the substrate obtained by the position determining device, and a position adjusting means for adjusting the position of the substrate with respect to a movable stage by placing the substrate;
A lithographic apparatus, wherein a pattern is formed on a substrate whose position is adjusted by the adjusting means.   16. The lithographic apparatus according to claim 15, wherein peripheral exposure is performed on the substrate based on the position of the end portion of the substrate obtained by the position determining device. Forming a pattern on a substrate using the lithographic apparatus according to claim 15 or 16,
And a step of processing the substrate on which the pattern is formed in the step.