CN104185817B - Exposure plotting device and exposure plotting method - Google Patents

Exposure plotting device and exposure plotting method Download PDF

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Publication number
CN104185817B
CN104185817B CN201380016100.7A CN201380016100A CN104185817B CN 104185817 B CN104185817 B CN 104185817B CN 201380016100 A CN201380016100 A CN 201380016100A CN 104185817 B CN104185817 B CN 104185817B
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China
Prior art keywords
unit
mark
exposure
exposure plotting
mark forming
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CN201380016100.7A
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CN104185817A (en
Inventor
桥口昭浩
菊池浩明
鹤井弘则
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ADITECH ENGINEERING Co Ltd
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ADITECH ENGINEERING Co Ltd
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

Have: the 1st exposing unit, by the 1st face that is positioned in the printed circuit board on platform is exposed and describe circuit pattern on described the 1st; Mark forming unit, is set to relatively to move with respect to platform, on the 1st of printed circuit board the 1st with circuit pattern describe process, form predetermined multiple marks at contrary with the 1st the 2nd; Instrumentation unit, carries out instrumentation to the position of mark forming unit; Detecting unit, detects the position of the multiple marks that form on the 2nd; And the 2nd exposing unit, taking the position of the position of the mark forming unit of institute's instrumentation and multiple marks of being detected as benchmark, expose and describe circuit pattern on the 2nd by the 2nd face to printed circuit board.

Description

Exposure plotting device and exposure plotting method
Technical field
The present invention relates to exposure plotting device and exposure plotting method, particularly, relate to substrateThe exposure plotting device of rendering image and exposure plotting method.
Background technology
In recent years, as the exposure that forms circuit pattern using planar substrates as being exposed substrateDrawing apparatus, exploitation is not used transfer film and directly will describe illumination and be mapped to substrate and describe electricityThe exposure plotting device of road pattern. But, to requiring high-resolution substrate to describe circuit diagramWhen case, there is the dust adhering to and in moving process, be attached to the dust in hole in the processing of holeThe hole periphery of falling other substrates or being caused by the heating in the processing of photoresist coating etc.The situation of distortion. Now, be depicted in circuit pattern on the 1st of substrate and be depicted in the 2ndRelative position between circuit pattern on face departs from.
Therefore, disclose by required calibration mark in the describing of circuit pattern be depicted in byExposure plotting device on the 1st and the 2nd of exposure base. As relevant therewith technology,In TOHKEMY 2008-292915 communique, disclose the 1st and the 2nd that is exposed substrateFace is described respectively the exposure plotting device of the 1st and the 2nd calibration mark. At this exposure plotting dressIn putting, according to the 1st and the 2nd calibration mark, circuit pattern is depicted in to the 1st of substrateOn the 2nd. In addition, at United States Patent (USP) 6,701, in 197B2 description, disclose as followsDescribe exposure device: use the ultraviolet ray being fixed with platform with known position relationshipLight source, be exposed the exposure of the 1st of substrate on the 2nd, form calibration and useMark.
Summary of the invention
Invent problem to be solved
Being disclosed in the exposure plotting device of TOHKEMY 2008-292915 communique, needBefore describing to process, form calibration mark. Therefore, exist due to baking time periodicallyThe problem exerting an influence. In addition, existence need to be to the calibration mark between the 1st and the 2ndThe problem that the position deviation of instrumentation is proofreaied and correct. And existence need to be at the 1st and the 2ndBoth sides form the problem of the apparatus structure of calibration mark.
In addition, be disclosed in United States Patent (USP) 6,701, the exposure plotting dress in 197B2 descriptionIn putting, describe calibration and be fixed with the position of mark for being exposed substrate. Therefore, to chiWhen very little different multiple substrates expose respectively, can not be corresponding with the size that is exposed substrateBest position on describe calibration mark. Its result, exists according to the size of substrate and schoolThe problem that accurate precision likely reduces.
The present invention completes in view of the above problems, following exposure plotting device is provided and exposes to the sunLight plotting method: do not rely on the size that is exposed substrate, can make to be exposed the table back of the body of substrateIn calibration accuracy improve.
For solving the technical scheme of problem
Exposure plotting device of the present invention has: the 1st exposing unit, and by being positioned in platformOn the 1st face of printed circuit board expose and on described the 1st, describe circuit pattern;Mark forming unit, is set to relatively to move with respect to described platform, in described printingDescribed the 1st upper the 1st of circuit board with circuit pattern describe process, with instituteState the 1st the 2nd contrary face and be formed with predetermined multiple mark; Instrumentation unit, to instituteState the position of mark forming unit and carry out instrumentation; Detecting unit, to by described mark forming unitThe position that is formed on the multiple marks on described the 2nd of described printed circuit board is detected;And the 2nd exposing unit, with the position of the described mark forming unit by described instrumentation unit instrumentationThe position of described multiple marks of putting and detected by described detecting unit is benchmark, by by instituteDescribed the 2nd face of stating printed circuit board exposes and describe circuit diagram on described the 2ndCase.
According to this exposure plotting device, by the 1st exposing unit, to being positioned in the seal on platformThe 1st face of brush circuit board exposes, thereby describes circuit pattern on described the 1st.In addition, according to this exposure plotting device, by the side with can be relatively mobile for described platformThe mark forming unit that formula arranges, on described the 1st of described printed circuit board the 1stWith circuit pattern describe process, be formed with in advance with described the 1st contrary the 2nd faceMultiple marks of first determining. In addition, according to this exposure plotting device, by instrumentation unit, rightInstrumentation is carried out in the position of described mark forming unit. In addition, according to this exposure plotting device, logicalCross detecting unit, to be formed on the institute of described printed circuit board by described mark forming unitStating the position of the multiple marks on the 2nd detects.
Herein, in the present invention, by the 2nd exposing unit, in by described instrumentation unitThe position of the described mark forming unit of surveying and the described multiple marks that detect by described detecting unitThe position of note is benchmark, and described the 2nd face of printed circuit board is exposed. Thus, existOn described the 2nd, describe circuit pattern.
That is, in the present embodiment, instrumentation is carried out in the position of mark forming unit, by markNote forming unit with the 1st with the exposure position of circuit pattern there is the 2nd of known relationOn the position of face, form multiple marks. In addition, to the 2nd exposure the 2nd with circuit diagramWhen case, by the position of the position of mark forming unit and multiple marks be benchmark describe the 2nd withCircuit pattern. Thus, can make to be depicted in the position of the circuit pattern on the 1st and the 2ndPut correspondence. In addition, above-mentioned " describe process " refer to, printed circuit board is positioned on platform to itAfter, finish describing of circuit pattern and discharge a series of processing till printed circuit board.
As mentioned above, according to exposure plotting device of the present invention, can by be depicted in the 1stOn circuit pattern exist the position of multiple marks of known position relationship as benchmark, make to retouchBe painted on the position and the position that is depicted in the circuit pattern on the 1st of the circuit pattern on the 2ndCorresponding. Its result, does not rely on the size that is exposed substrate, and can make to be exposed substrateCalibration accuracy in the table back of the body improves.
In addition, in the present invention, can be also, described mark forming unit be set to, energyReach with respect to any one side to be positioned in the described printed circuit board on described platform as benchmarkAt least one party's in predetermined direction and the direction of intersecting with this predetermined directionDirection moves. Thus, can adjust the position that above forms in position multiple marksWhole.
In addition, in the present invention, can be also the model that described mark forming unit can moveEnclose the scope for forming to the printed circuit board of the different multiple types of size this mark. ByThis, can not rely on the size of substrate and above in position form multiple marks.
In addition, in the present invention, can be also, also there is discrete cell, this discrete cell pairThe size of described printed circuit board is carried out specific, and described mark forming unit basis is by described spyThe specific size of order unit and form respectively described multiple mark. Thus, can be with substrateSize forms multiple marks on corresponding suitable position.
In addition, in the present invention, can be also, described instrumentation unit has described mark shapeThe camera unit that becomes unit to photograph, uses the photographs of this camera unit to described markInstrumentation is carried out in each position of forming unit. Thus, instrumentation mark forming unit simplyPosition.
In addition, in the present invention, can be also, described mark forming unit be formed on as the nextPut: even if be placed with under the state of printed circuit board, also can pass through institute on described platformStating instrumentation unit uses the correction that is positioned at known relative position with respect to described mark forming unitMark is photographed, and described instrumentation unit has camera unit, and this camera unit is with described correctionThe mode of being photographed respectively with mark is photographed to described mark forming unit, described instrumentation listUnit is used the photographs of this camera unit to count each position of described mark forming unitSurvey. Thus, even in the time can not photographing to mark forming unit, also can be to mark shapeBecome the position of unit to carry out instrumentation.
In addition, in the present invention, can be also, be provided with multiple described camera units, described inCamera unit is photographed above to one in described mark forming unit respectively. Thus, energyEnough positions of instrumentation mark forming unit simply.
In addition, in the present invention, can be also, described camera unit be set to and have describedThere is known relation in the position of circuit pattern, and can be with respect to described platform movement. Thus,Do not rely on the position of mark forming unit, can carry out instrumentation to the position of mark forming unit.
In addition, in the present invention, can be also that described mark forming unit is by short wavelength'sLight exposes and forms described mark described the 2nd face of described printed circuit board. Thus,Can go up in position and form accurately multiple marks.
In addition, in the present invention, can be also, described mark forming unit be by making ink attachedThe 2nd of described printed circuit board and form described multiple mark. Thus, Neng GoujianSingly form multiple marks.
Exposure plotting method of the present invention is the exposure plotting method in exposure plotting device, and this exposes to the sunLight drawing apparatus has: the 1st exposing unit, and by being positioned in the printed wiring base on platformThe 1st face of plate exposes and on described the 1st, describes circuit pattern; Mark forming unit,Be set to relatively to move with respect to described platform, with described the 1st the contrary the 2ndFace forms predetermined multiple mark; Instrumentation unit, to the position of described mark forming unitCarry out instrumentation; Detecting unit, to being formed on described printed wiring base by described mark forming unitThe position of the multiple marks on described the 2nd of plate is detected; And the 2nd exposing unit,Expose and retouch on described the 2nd by described the 2nd face to described printed circuit boardPaint circuit pattern, described exposure plotting method has following steps: control described instrumentation unit withMake the position of described mark forming unit by instrumentation; Make described mark forming unit to pre-determiningPosition move; Control described the 1st exposing unit and described mark forming unit, with describedOn described the 1st of printed circuit board, describe the 1st with circuit pattern, and at this electricityDuring the describing of road pattern processed, with described the 1st with circuit pattern corresponding and the described the 2ndOn face, form multiple marks; And control described the 2nd exposing unit, with by described instrumentation unitThe position of the described mark forming unit of instrumentation and the described multiple marks that detected by described detecting unitNote position be benchmark and on described the 2nd, describe described the 2nd with circuit pattern.
According to exposure plotting method of the present invention, similarly send out with exposure plotting device of the present inventionWave effect, therefore same with exposure plotting device of the present invention, do not rely on and be exposed substrateSize, the calibration accuracy that can make to be exposed in the table back of the body of substrate improves.
Invention effect
According to the present invention, do not rely on the size that is exposed substrate, can make to be exposed substrateCalibration accuracy in the table back of the body improves.
Brief description of the drawings
Fig. 1 is the integrally-built structure chart that the exposure plotting system of embodiment is shown.
Fig. 2 is the block diagram that the function of the exposure plotting system of embodiment is shown.
Fig. 3 A illustrates that exposure plotting system by embodiment is to being exposed the surface of substrateThe front view of one example on this surface while having carried out exposure.
Fig. 3 B illustrates that exposure plotting system by embodiment is to being exposed the back side of substrateThe front view of one example at this back side while having carried out exposure.
Fig. 4 is that the 1st exposure plotting device and the 2nd that embodiment is shown is described exposure plotting dressThe stereogram of the structure of putting.
Fig. 5 is the 1st exposure plotting device of embodiment and the substrate of the 2nd exposure plotting deviceThe exploded perspective view of clamping device portion.
Fig. 6 is for the 1st exposure plotting device to embodiment and the 2nd exposure plotting deviceThe amplification view that describes of the function of optical sensor.
Fig. 7 A is for the 1st exposure plotting device to embodiment and the 2nd exposure plotting deviceThe major part amplification view that describes of mark forming portion.
Fig. 7 B is for the 1st exposure plotting device to embodiment and the 2nd exposure plotting deviceThe major part amplification plan view that describes of mark forming portion.
Fig. 8 illustrates reversing device in the inversion set of exposure plotting system of embodimentThe summary side front view of structure.
Fig. 9 illustrates the 1st exposure plotting device of embodiment and the 2nd exposure plotting deviceThe structure chart of electrical system.
Figure 10 is the moving direction that is illustrated in platform in the exposure plotting system of embodiment and take the photographThe figure of the relation between the moving direction of shadow portion.
Figure 11 is the movable range that the ultraviolet light source of the exposure plotting system of embodiment is shownFigure.
Figure 12 is the flow chart that the handling process of the exposure pre-treatment program of embodiment is shown.
Figure 13 is the general principal view of the exposure pre-treatment for embodiment is described.
Figure 14 is the flow chart that the handling process of the 1st exposure treating programme of embodiment is shown.
Figure 15 is the general principal view of the 1st exposure-processed for embodiment is described.
Figure 16 is the flow chart that the handling process of the 2nd exposure treating programme of embodiment is shown.
Figure 17 is the general principal view of the 2nd exposure-processed for embodiment is described.
Figure 18 is illustrated in the exposure plotting system of embodiment, the size that is exposed substrate withThe general principal view of describing the relation between position of mark for calibration.
Detailed description of the invention
Below, describe the exposure plotting system of present embodiment in detail with reference to accompanying drawing. In addition, existIn present embodiment, as exposure plotting system 1, describe as an example of following system example: will printThe flat panel substrate of brush circuit board or printed base plate and glass substrate for plane display device etc. is as quiltExposure base, to be exposed the 1st of substrate (following, also referred to as " surface ". ) and the 2ndFace (following, also referred to as " back side ". ) both sides carry out exposure plotting.
Fig. 1 is the integrally-built structure chart that the exposure plotting system 1 of present embodiment is shown.In addition, Fig. 2 is the block diagram that the function of the exposure plotting system 1 of present embodiment is shown. As Fig. 1Shown in Fig. 2, exposure plotting system 1 have to expose in surface to being exposed substrate andThe back side that is exposed substrate forms the 1st exposure plotting device 2 of calibration mark. In addition, the 1stExposure plotting device 2 is the position to ultraviolet light source 51 described later before formation calibration is with markCarry out instrumentation. In addition, exposure plotting system 1 has table back of the body reversion anti-that makes to be exposed substrateRotary device 3. In addition, exposure plotting system 1 has that the back side to being exposed substrate exposesThe 2nd exposure plotting device 4. In addition, exposure plotting system 1 has and will be exposed substrate from deviceOutside is sent to the 1st transport unit 5 of the 1st exposure plotting device 2 and will be exposed substrate from the 1stExposure plotting device 2 is sent to the 2nd transport unit 6 of inversion set 3. In addition, exposure plotting systemSystem 1 has and is sent to the 3rd of the 2nd exposure plotting device 4 by being exposed substrate from inversion set 3Transport unit 7 and be sent to the 4th of device outside from the 2nd exposure plotting device 4 by being exposed substrateTransport unit 8.
Fig. 3 A is this surface when being illustrated in surface C 1 to being exposed substrate C and having carried out exposureThe front view of an example of C1, Fig. 3 B exposes at the back side C2 to being exposed substrate CTime the front view of an example of this back side C2.
As shown in Figure 3A, in the surface C 1 that is exposed substrate C, by the 1st exposure plottingDevice 2 and described surface and used image P1. In addition, as shown in Figure 3 B, be exposed substrate CBack side C2 upper, by the 2nd exposure plotting device 4, with the surface of having described of surface C 1With the coordinate system of image P1 (following, be called " image coordinate system ". ) corresponding image coordinate systemDescribe back side image P2. In addition, in the present embodiment, surface is " F " with image P1The image of shape. In addition, in the present embodiment, the back side is above-mentioned surface C 1 with image P2In the figure of shaped as frame shape of rectangle in region of encirclement back side C2 corresponding to the image with " F " shapePicture. And, on the back side C2 that is exposed substrate C, under looking with master depending on center upper portion side masterIn portion's center side, described by the 1st exposure plotting device 2 multiplely (in present embodiment, beTwo) calibration mark M. This calibration is to be depicted in and to be exposed respectively for making with mark MPosition and the back side image of image P1 for surface on surface C 1 and the back side C2 of substrate CThe mark that the position of P2 corresponds to each other.
In the exposure plotting system 1 of present embodiment, at the direction of transfer that is exposed substrate CUpstream side be provided with the 1st exposure plotting device 2. When the unexposed substrate C that is exposed is passed intoIn auto levelizer time, as mentioned above, the 1st exposure plotting device 2 is to being exposed the surface of substrate CC1 exposes and describes surface image P1 on surface. In addition, the 1st exposure plotting device 2Form calibration mark M at the back side C2 that is exposed substrate C.
In the exposure plotting system 1 of present embodiment, calibration is with approximately with mark MExtremely approximatelyCircle describe. But size and shape is not limited to this. For example, largeLittle as long as not with the describe overlapping size of surface with image P1 and back side image P2,Shape also can at random be set as the shape of cross shape and rectangle type etc.
Downstream at the direction of transfer that is exposed substrate C of the 1st exposure plotting device 2 arrangesThere is reversion to be exposed the inversion set 3 of the table back of the body of substrate C. When surface C 1 is retouched by the 1st exposurePaint device 2 and be exposed and import into describe calibration with mark M be exposed substrate C time, forIn ensuing technique, the back side C2 that is exposed substrate C is exposed, inversion set 3Make to be exposed the table back of the body reversion of substrate C.
Downstream at the direction of transfer that is exposed substrate C of inversion set 3 is provided with being exposed to the sunThe 2nd exposure plotting device 4 that the back side C2 of photopolymer substrate C exposes. When passing through inversion setWhen being exposed substrate C and being passed in device of 3 reversions, the 2nd exposure plotting device 4 is to being exposedThe back side C2 of substrate C exposes and describes back side image P2. Now, the 2nd exposure is retouchedPainting device 4 uses by the 1st exposure plotting device 2 and is depicted in the calibration being exposed on substrate CCarry out with mark M on the basis of position alignment, back side C2 being exposed.
The 1st conveyer the 5, the 2nd conveyer the 6, the 3rd conveyer 7 and the 4th transmitsDevice 8 has respectively multiple rotating rollers and makes the drive motor of rotating roller rotation. Apply abreastBe provided with multiple rotating rollers, in one end of rotating roller, revolving of being subject to transmitting by band or line be installedTurn sprocket wheel or the pulley of power. Make the revolving force of the drive motor of rotating roller rotation as transmissionUnit can also adopt the transmission method based on magnet cylindraceous except band or line.
In addition, in the present embodiment, in order to improve, to be exposed the throughput of substrate C (often littleTime output), use the 1st exposure plotting device 2 and the 2nd exposure plotting device 4 this twoPlatform exposure plotting device and the surface C 1 and the back side C2 that are exposed substrate C are exposed. ButBe, the number of units of exposure plotting device is not limited to two, also can pass through an exposure plotting deviceMake to be exposed that substrate C reverses from surface C 1 to back side C2 and to being exposed the two sides of substrate CDescribe.
Then, the structure of the 1st exposure plotting device 2 and the 2nd exposure plotting device 4 is carried outExplanation.
Fig. 4 is that the 1st exposure plotting device 2 and the 2nd that present embodiment is shown is described exposure and retouchedPaint the stereogram of the structure of device 4. Below, the direction that platform 10 is moved is as Y-direction,Using with this Y-direction on horizontal plane vertical direction as directions X, with Y-direction vertical flatDirection vertical on face is as Z direction, and direction of rotation centered by Z axis is as θ sideTo.
As shown in Figure 4, the 1st exposure plotting device 2 has for being fixedly exposed substrate C'sFlat platform 10. Platform 10 forms in the mode that can move, and is fixed on platform 10Be exposed substrate C and follow the movement of platform 10 and will be exposed substrate C and move to exposure position,On substrate C, describe surface image by exposure portion's 16 illumination beams described later being exposedC1。
Platform 10 is supported on upper surface flat of the matrix 11 that is arranged on movably desk shapeOn tabular base station 12. In addition, between base station 12 and platform 10, be provided with and have by electricityMotivation etc. and the portion of travel mechanism 13 of the moving drive mechanism (omit diagram) that forms. Platform 10By portion of travel mechanism 13 with respect to base station 12 centered by the vertical line in the central portion of platform 10Axle carries out in rotary moving in θ direction.
On the upper surface of matrix 11, be provided with one or more (in present embodiment, being two)Guide rail 14. Base station 12 is supported for to come and go freely by guide rail 14 and moves, logicalCross the table drive part (table drive part 71 described later) being formed by motor etc. and move. AndAnd platform 10 is supported on this movably upper surface of base station 12, thereby moves along guide rail 14Moving.
On the upper surface of matrix 11, erect the door of a type that is provided with to stride across the mode of guide rail 14Portion 15 is provided with exposure portion 16 in this portion 15. Exposure portion 16 is by multiple (this enforcement sidesIn formula, be 16) photohead 16a form, fixed configurations is on the mobile route of platform 10.In exposure portion 16, be connected with respectively the optical fiber 18 extracted out from light source cell 17 and from image processingThe signal cable 20 that unit 19 is extracted out.
Each photohead 16 has the DMD as the spatial optical modulation element of reflection-type(DMD). In addition, each photohead 17 is according to the picture number of inputting from graphics processing unit 19According to controlling DMD and to modulating from the light beam of light source cell 17. Each photohead 16 shouldLight beam irradiates is exposed substrate C to loading on platform 10, thereby carries out based on the 1st exposureThe exposure of drawing apparatus 2. In addition, as spatial optical modulation element, also can use liquid crystal etc.The spatial optical modulation element of transmission-type.
On the upper surface of matrix 11, be further provided with a portion 22 to stride across the mode of guide rail 14.In door portion 22, be provided with for the substrate C that is exposed being positioned on platform 10 is photographedThe photography portion 23 of one or more (in present embodiment being two). Photography portion 23 is built-inThe CCD camera etc. of the extremely short flash lamp of fluorescent lifetime once. Photography portion 23 is for rightMark forming portion 52 described later and be depicted in the calibration mark M being exposed on substrate C and enterRow is photographed and is arranged. In addition, in door portion 22, be provided with moving of directions X to photography portion 23The moving guide portion 23a guiding. And, the 23 directed section 23a guiding of each photography portion andOn directions X, move. In addition, photography portion 23 is bases with respect to the relative position of platform 10The mobile instrumentation of platform 10 or photography portion 23 and be stored in the storage that systems control division 70 hasUnit. In addition, in the time that the ultraviolet light source 51 in mark forming portion 52 is photographed,Being exposed substrate C is not positioned under the state on platform 10 ultraviolet light source 51 is taken the photographShadow.
The 1st exposure plotting device 2 is according to the mark forming portion 52 of having photographed by photography portion 23Image is derived ultraviolet light source 51 in the position being exposed on substrate C. In addition, the 2nd exposure is retouchedPaint device 4 according to the image of the calibration mark M that photographed by photography portion 23, with the 1st exposureThe position of the ultraviolet light source 51 in drawing apparatus 2 compares and detects its positional offset amount(bias of X, Y, θ direction). This calibration is used by the information of the positional offset amount of mark MIn being depicted in the surface image P1 in the surface C 1 that is exposed substrate C and being depicted in back side C2On the back side with in the position correction between image P2.
In addition, it is desirable to with number (or the calibration mark of mark forming portion 52 described laterThe number of M) corresponding number arranges photography portion 23. But, being not limited to this, also can establishPut a photography portion 23, and by this photography portion 23 is moved to multiple mark forming portions52 or multiple calibration photograph with mark M.
In addition, on the upper surface of platform 10, be provided with for being exposed the end of substrate CBe fixed on the clamping device for base plate portion of platform 10.
Fig. 5 is the 1st exposure plotting device 2 and the 2nd exposure plotting device 4 of present embodimentThe exploded perspective view of clamping device for base plate portion 30. As shown in Figure 5, clamping device for base plate portion 30A pair of from clamping end, top of the mode of opposite side sandwich with a side who is exposed substrate CSupporting rod 31a, 31b. In addition, clamping device for base plate portion 30 has to be exposed substrate C'sOn horizontal plane, sandwich the opposing party opposite side mode from a pair of supporting rod 31c of clamping end, top,31d. In addition, clamping device for base plate portion 30 has these supporting rods 31a to 31d is existed respectivelyThe mobile unit 32a to 32d of parallel in horizontal direction. Supporting rod 31a to 31d joins respectivelyBe placed in the upper surface of platform 10, mobile unit 32a to 32d is disposed at the below of platform 10.
In the present embodiment, supporting rod 31a, 31b are in the Y direction for long size and at XRelative separately in direction, supporting rod 31c, 31d on directions X for long size and in the Y directionRelative separately. It is short that supporting rod 31a, 31b are formed as Length Ratio supporting rod 31c, 31d, evenThe size hour that is exposed substrate C, is also configured to each other and does not disturb.
In the present embodiment, supporting rod 31a has the clamp bracket of metal system (for example aluminium)33. In addition, supporting rod 31a is fixed on the medial region (platform of the lower surface of clamp bracket 3310 central side region), there is contact with the surface C 1 that is exposed substrate C resinousClamping blade 34. In addition, supporting rod 31a have clamp bracket of being arranged at 33 lower surface outsideTwo support columns 35 in territory, lateral areas (exterior lateral area of platform 10). On platform 10, withIn table back of the body direction, connect and from the end of platform 10 towards central mode, on each limit to be scheduled toThat interval is formed with is one or more (in the present embodiment, each limit three (totally 12))The inserting hole 37 extending on Y-direction or directions X. In addition, two of supporting rod 31a support columnsIn two inserting holes 37 in 35 three inserting holes 37 inserting in each limit. Supporting rod 31bAlso there is the structure identical with supporting rod 31a to 31d.
Mobile unit 32a have support two support columns 35 gripper shoe 40, make this gripper shoe40 cylinders that move at Z side's upward sliding 41. The front end of the piston rod 42 of cylinder 41 is fixed onThe lower surface of gripper shoe 40. Cylinder 41 makes piston by the drive division being made up of motor etc.Bar 42 declines and rises. The movable range of piston rod 42 is limited, in the time declining and while risingAll stop on precalculated position.
In the time that piston rod 42 declines, supporting rod 43a declines together with piston rod 42, supporting rod31a is pressed against platform 10. Herein, when being placed with on platform 10 while being exposed substrate C,Being exposed substrate C is held by supporting rod 31a. On the other hand, rise at piston rod 42Time, supporting rod 31a rises together with piston rod 42, and supporting rod 31a is from platform 10 to Z sideTo separation. The distance that supporting rod 31a separates from platform 10 is larger than the thickness that is exposed substrate C.The state of supporting rod 31a when supporting rod 31a is pressed against to platform 10 is called the state of closing and (closesPosition), the state of the supporting rod 31a separately time from platform 10 is called out to state (open position).
Mobile unit 32a further has driving wheel 44 and the driven pulley on directions X, arranged45, be erected at these and take turns the Timing Belt 46 on 44,45, the band driving that driving wheel 44 is rotatedMotor 47. Band drive motor 47 can rotate and reverse. Logical on Timing Belt 46Cross installation portion 48 cylinder 41 be installed, in the time that Timing Belt 46 is driven, cylinder 41 andFagging 40 moves on directions X, and supporting rod 31a moves on directions X thus. Supporting rod31a makes support column 35 along inserting hole 37 while slides and move, and is positioned at support column 35The retreating position of the outboard end of inserting hole 37 and support column 35 are positioned at the medial extremity of inserting hole 37Between the middle position of portion, move. In addition, supporting rod 31a is exposed to substrate C's in clampingPosition (any one between retreating position and middle position of supporting rod 31a when circumferencePosition) be called clip position.
Mobile unit 32b, 32c, 32d have the structure identical with mobile unit 32a. Wherein,Mobile unit 32b moves supporting rod 31b on Z direction and directions X, mobile unit 32cSupporting rod 31c is moved in Z direction and Y-direction, and mobile unit 32d makes supporting rod 31dIn Z direction and Y-direction, move.
Fig. 6 is for the 1st exposure plotting device 2 to present embodiment and the 2nd exposure plottingThe amplification view that the function of the optical sensor 49 of device 4 describes. As Fig. 5 and Fig. 6 instituteShow, in the gripper shoe 40 of mobile unit 32a, be provided with for detection of being exposed having of substrate CThe optical sensor (substrate ora terminalis sensor) 49 of the reflection-type of nothing. Optical sensor 49 is installed on and props upOn fagging 40, be arranged at position corresponding with inserting hole 37 in directions X and Y-direction,The position that while observation from top, optical sensor 49 exposes from inserting hole 37. Optical sensor 49 hasSend upward and check the light-projecting portion of light, the inspection that acceptance is transmitted into the back side C2 that is exposed substrate CLook into the light accepting part of light, receive and check that light time output has substrate signal at light accepting part, at light accepting partLight time of not being checked exports without substrate signal.
Above optical sensor 49, be placed with the clamping blade 34 of supporting rod 31a. But, forPrevent from reflexing to clamping blade 34 and to optical sensor 49 from the inspection light of optical sensor 49Return, on the position corresponding with the inserting hole 37 of clamping blade 34, be formed with inclined plane 50.In the gripper shoe 40 of each mobile unit 32b, 32c, 32d, be also provided with and mobile unit 32aIdentical optical sensor 49.
In addition, in each gripper shoe 40, be provided with being positioned in the base that is exposed on platform 10Plate C forms the mark forming portion 52 of calibration mark M. Fig. 7 A is for to present embodimentThe 1st exposure plotting device 2 and the mark forming portion 52 of the 2nd exposure plotting device 4 sayBright major part amplification view. In addition, Fig. 7 B is for exposing to the sun to the 1st of present embodiment theIt is main that the mark forming portion 52 of light drawing apparatus 2 and the 2nd exposure plotting device 4 describesPart amplification plan view. In addition, in Fig. 7 B for illustrate ultraviolet light source 51 structure andOmit and be exposed substrate C.
As shown in Fig. 5, Fig. 7 A and Fig. 7 B, each mark forming portion 52 with in each limit, establishThe mode that is arranged at central inserting hole 37 correspondences being equipped with in multiple inserting hole 37 is formed asUpwardly extending tabular in the side along inserting hole 37. In mark forming portion 52, at platformCenter side in 10 is provided with to the direction of platform 10 and produces ultraviolet beam (short wavelength's light beam)The ultraviolet light source 51 of UV. Make the ultraviolet beam UV producing by this ultraviolet light source 51Through inserting hole 37 and be irradiated to and be exposed substrate C, thereby be exposed the 2nd of substrate COn (with the face of platform 10 contact sides) C2, describe calibration mark M.
In addition, in mark forming portion 52, a side of the end in platform 10, multiple (theseIn embodiment, be two) correction mark 53 be arranged at can be from platform 10 square meshOn the same face depending on confirmation. In addition, these corrections are formed at as upper/lower positions with mark 53: at quiltExposure base C is loaded in platform 10 and is fixed under the state of clamping device for base plate 30,Can be exposed that substrate C blocks and can be by inserting hole 37 from outside Visual Confirmation. Thus,Can in the photographs obtaining by photography portion 23, identify each proofreaies and correct with mark 53.
Each mark forming portion 52 moves with the mobile interlock of mobile unit 32a to 32d respectively.The inserting hole 37 corresponding with each mark forming portion 52 is arranged at and comprises each mark forming portion 25The region of mobile route on. In addition, by exposure portion 16 to being exposed the surface of substrate CDuring C1 exposes, ultraviolet light source 51 can not inserted support column to connect yetThe mode of 35 inserting hole 37 produces ultraviolet beam UV. In addition, ultraviolet beam UVIrradiation time can be exposed the photosensitive material of substrate C and be set as respectively the best according to being applied toTime.
In addition, in each mark forming portion 52, with ultraviolet light source 51 and correction mark53 modes that become known each other position relationship arrange, and each position relationship of instrumentation in advanceAnd store the memory cell that systems control division 70 has into. Be positioned at and exposed to the sun at ultraviolet light source 51Etc., existence can not be carried out ultraviolet light source 51 by photography portion 23. when at photopolymer substrate C the backThe situation of photography. At this moment, by each correction is photographed and instrumentation position with mark 53,Can be from the position of mark 53 and the ultraviolet light source 51 of storing for each correction of institute's instrumentationAnd proofread and correct the position of deriving ultraviolet light source 51 with the position relationship between mark 53.
In addition, the 1st exposure plotting device 2 has multiple ultraviolet light sources 51, but the 2nd exposes to the sunLight drawing apparatus 4 is without necessarily having multiple ultraviolet light sources 51. At the 1st exposure plotting deviceOn 2, be provided with multiple ultraviolet light sources, and also can be right by this ultraviolet light source is movedMultiple calibrations are described with mark M.
The 1st exposure plotting device 2 has being exposed of sending by the 1st conveyer 5Substrate C is passed to the automatic transporting hand (following, AC hand) of the inside of the 1st exposure plotting device 262. AC hand 62 is formed as tabular, and can with horizontal plane abreast in the horizontal direction andVertical Square moves up. In addition, be provided with at the lower surface of AC hand 62: adsorbing mechanism, toolThere is attraction air and adsorb the adsorption section 63 that keeps being exposed substrate C by vacuum suction; AndPressing mechanism, has and presses the press section 64 freely that moves up and down that is exposed substrate C downwards.
AC hand 62 is adsorbed and is kept being positioned in not exposing to the sun on the 1st conveyer 5 by adsorbing mechanismBeing exposed substrate C of light and slinging upward, is positioned in flat by the sling substrate C that is exposedThe preposition of the upper surface of platform 10. In the time that mounting is exposed substrate C, pass through pressing mechanismBe pressed into platform 10 and remove the absorption of adsorption section 63 being exposed substrate C, thus platform10 vacuum suction work, is exposed substrate C and is stably fixed on platform 10.
In addition, AC hand 62 adsorbs the upper surface that keeps being positioned in platform 10 by adsorbing mechanismThat has exposed is exposed substrate C and slings upward. In addition, AC hand 62 keeps in absorptionThe state that is exposed substrate C sling be moved to the 2nd conveyer 6, and remove and inhaleThe absorption of random structure, moves to the 2nd conveyer 6 thereby make to be exposed substrate C.
According to the clamping device for base plate portion 30 of the exposure plotting system 1 of present embodiment, reliablyThe circumference that clamping is exposed substrate C, can carry out the warpage and the distortion that are exposed substrate CCorrect. In addition, clamping device for base plate portion 30 is configured to, and makes ultraviolet light source 51 and light sensingDevice 59 moves together with supporting rod 31a to 31d. Therefore, owing to not needing for ultravioletThe travel mechanism of source 51 and optical sensor 59, therefore can suppress clamping device for base plate portion 30Manufacturing cost.
Fig. 8 is the reversion illustrating in the inversion set 4 of exposure plotting system 1 of present embodimentThe summary side front view of the structure of mechanism. As shown in Figure 8, inversion set 4 has roller unit 4b,This roller unit 4b has and is arranged in two row and between each row, sandwiches the multiple rollers that are exposed substrate C4a. Roller unit 4b is by support stick 4c and supported, having sandwiched while being exposed substrate C,Under the state of mentioning by support stick 4c to be arranged at the rotating shaft of central portion of roller unit 4bCentered by 4d, be rotated. After roller unit 4b has rotated 180 degree, be exposed substrate CFrom roller unit 4b liberation, thereby the table back of the body that is exposed substrate C is reversed. In addition, reversing deviceStructure be not limited to said structure, also can use mention the one end that is exposed substrate C make byExposure base C Rotate 180 degree and making be exposed the method for the table back of the body reversion of substrate C, with andHe is known method in the past.
Fig. 9 is the 1st exposure plotting device 2 and the 2nd exposure plotting dress that present embodiment is shownPut the structure chart of 4 electrical system.
As shown in Figure 9, on the 1st exposure plotting device 2, be provided with and install not electricity of each several partThe systems control division 70 connecting, this systems control division 70 is controlled each several part blanketly. System controlPortion 70 controls AC hand 62 and is exposed substrate C importing action into and discharging to platform 10Action. In addition, systems control division 70 is controlled table drive part 71 and is carried out the movement of platform 10,And calibrate with the photography of mark M the position of describing of image is carried out by photography portion 23Adjust. In addition, systems control division 70 is controlled light source cell 17 and graphics processing unit 19 and is rightPhotohead 16a carries out exposure-processed. Operating means 73 has display part and input part, for example,In the time that being exposed the appearance and size of substrate C, input operated.
Substrate-placing location positioning portion 72 is by the mounting position that is exposed substrate C for platform 10Put determine suitable allocation position (following, be called " suitably loading position ". ). In addition, energyEnough in the shooting of photography portion 23 regularly being adjusted and made calibration mark M in Y-directionBe positioned at the central authorities in photography region. Therefore, the suitable mounting position in Y-direction also can be set inAny one position on platform 10. In addition, in the present embodiment, on directions X suitablyMounting position is set in the position consistent with platform 10 center, center that is exposed substrate C.
In substrate-placing location positioning portion 72, according to by carrying out for being exposed substrate CExposure actions before the warming-up exercise that carries out and the information that obtains calculates the substrate on directions XSuitable mounting position (calibration with the appropriate location of mark M). In this warming-up exercise, beSystem control part 70 is positioned on the appropriate location of platform 10 being exposed substrate C on directions XThe enterprising row in basis by photography portion 23 to the calibration control of photographing with mark M. In addition,The center that makes to be in the Y direction exposed substrate C is consistent with platform 10 center, with platform 10A side relative limit and a side the each autoparallel mode in relative limit that is exposed substrate CMounting. In addition, systems control division 70 calculates center and the school in the photography region on directions XBias between the position of mutatis mutandis mark M. And systems control division 70 is according to this biasCalculate the suitable mounting position of the substrate on directions X. In warming-up exercise, to multiple (for exampleFive) substrate carries out this processing, thereby can more correctly obtain suitable mounting position. SeparatelyIn this warming-up exercise, also determine the photography timing of photography portion 23 outward. The substrate calculatingSuitably mounting positional information and photography timing information send to systems control division 70 and are stored in systemIn the memory cell that control part 70 has.
Mobile control division 74 drives the movement of photography portion 23 according to the instruction of systems control division 70Moving control. In the present embodiment, mobile control division 74 is controlled photography portion as follows23 mobile driving: in the time of platform 10 mobile, multiple mark forming portions 52 or be depicted inBe exposed multiple calibrations mark M on substrate C each photography through multiple photography portion 23Region.
Mobile control division 74 is controlled respectively mobile unit 32a according to the instruction of systems control division 70To the driving of 32d. Mobile control division 74 is to the optical sensor from mobile unit 32a to 32d49 signal (have substrate signal or without substrate signal) monitors. In addition, mobile control division74 according to this signal the cylinder 41 to mobile unit 32a to 32d and with drive motor 47Driving is controlled, and makes supporting rod 31a to 31d carry out holding action.
In mobile control division 74, according to the substrate size information of inputting from operating means 73,With the suitable mounting positional information of the substrate calculating by warming-up exercise, infer platform 10Shang districtBeing placed with in territory is exposed the region of substrate C. In addition, mobile control division 74 is according to this suppositionRegion between high speed/low speed, switch the translational speed of supporting rod 31a to 31d. Specifically,On platform 10, for example, than separated distance L 1 (40mm) from the periphery that is exposed substrate CMore lateral, position (with reference to Fig. 6) be set as high-speed mobile, be set as than this inside, positionLow speed moves. Thus, in the time that low speed moves, be exposed the detection of substrate C, therefore canDetect and be exposed substrate C reliably. In addition, by the periphery distance of separation from being exposed substrate CThe position of L1 is called decelerate position (switching point). Supporting rod 31a to 31d stops at from detectingEnter to the inside the clip position of preset distance (for example 5mm) to the position that is exposed substrate C,Clamp at this clip position place. This clip position becomes the support of supporting rod 31a to 31dPost 35 not with the position of ora terminalis butt that is exposed substrate C.
When in supporting rod 31a to 31d high-speed mobile, detect while being exposed substrate C, mobileControl part 74 is judged as actual substrate size, and to compare inputted substrate size large. Now, mobileControl part 74 stops the movement of supporting rod 31a to 31d, and defeated to systems control division 70Go out abnormal signal. Systems control division 70 is accepted abnormal signal, makes the display part of operating means 73The error message of the meaning that display base plate size is large. In addition, also can replace demonstration error message,And generation warning tones.
In addition, supporting rod 31a to 31d low speed move and do not detect be exposed substrate C andLow speed moves while having continued the scheduled time, and mobile control division 74 is judged as actual substrate size ratioThe substrate size inputted is little or do not load substrate. Now, mobile control division 74 makes folderThe movement of holding bar 31a to 31d stops, and to systems control division 70 output abnormality signals. SystemSystem control part 70 is accepted abnormal signal, make the display part display base plate size of operating means 73 little,Or do not have mounting to be exposed the error message of the meaning of substrate C.
Figure 10 is the movement side that is illustrated in platform 10 in the exposure plotting system 1 of present embodimentTo and the moving direction of photography portion 23 between the figure of relation. As shown in figure 10, photography portion 23Moving direction be that the moving direction (Y-direction) for platform 10 is vertical in the horizontal directionDirection (directions X). In exposure plotting system 1, by photography portion 23 to multiple ultravioletsLine source 51 or when being depicted in the calibration mark M being exposed on substrate C and photographing is logicalCross and platform 10 is moved and the position of Y-direction is controlled. In addition, in exposure plotting systemIn 1, by photography portion 23 is moved, the position of directions X is controlled. Thus, with manyIndividual mark forming portion 52 or calibration are included in the side in the photography region of photography portion 23 with mark MFormula control relative position separately. In addition, the moving direction of photography portion 23 is not limited to directions X., as long as can or be depicted in to mark forming portion 52 the calibration mark being exposed on substrate CM photographs. Therefore, the moving direction of photography portion 23 can be directions X and Y sideTo both sides, or, can be also other directions beyond directions X and Y-direction.
Figure 11 be illustrate the exposure plotting system 1 of present embodiment ultraviolet light source 51 canThe figure of moving scope R. As shown in figure 11, ultraviolet light source 51 is configured to, can be from platform 10End (central portion of the limit portion of platform 10 in the present embodiment) to central portion with straight lineShape is mobile preset distance only. Describe calibration mark at ultraviolet light source 51 to being exposed substrate CWhen M, loaded under the state that is exposed substrate C on platform 10, ultraviolet light source 51 producesRaw ultraviolet beam UV. Now, ultraviolet light source 51 moves to the end to being exposed substrate CThe position of calibration mark M has been described by portion. The movable range R of ultraviolet light source 51 does not limitIn this, can be following scope: comprise from can be for the minimum dimension as exposure objectSubstrate is described the position of calibration mark M to the position of the end face of maximum sized substrate. PreferablyIt is the minimum that can describe for the substrate of all sizes as exposure object calibration mark MScope.
Then, the effect of present embodiment is described.
Figure 12 is the flow chart that the handling process of the exposure pre-treatment program of present embodiment is shown,This program is previously stored in to be possessed in the systems control division 70 of the 1st exposure plotting device 2As the presumptive area of the ROM of recording medium. In addition, Figure 13 is for this enforcement side is describedThe general principal view of the exposure pre-treatment of formula.
The systems control division 70 of the 1st exposure plotting device 2 in predetermined timing (in this realityExecute in mode, being exposed substrate C and being placed on the timing of platform 10) carry out this exposure before placeReason program.
In the time being exposed substrate C and being placed on platform 10, in step S101, systems control division70 make to move for the position of the ultraviolet light source 51 that is exposed substrate C. In the present embodiment,Ultraviolet light source 51 connects with the mobile of mobile unit 32a to 32d of clamping device for base plate portion 30Move and move. Therefore, systems control division 70 is controlled mobile unit 32a, thereby makes outThe supporting rod 31a to 31d of state makes purple from the end of platform 10 to the moving beginning of central portionMove the position of outer line source 51. In addition, receiving substrate signal from optical sensor 49Time, systems control division 70 has moved preset distance at once in received position or after receivingPosition makes supporting rod 31a to 31d to close state transitions. Thus, supporting rod 31a to 31dAnd platform 10 between sandwiched under the state that is exposed substrate C and be fixed, follow in this ultravioletThe position of line source 51 is also fixed.
In addition, in the time not carrying out the sandwiching of non-exposure base C based on supporting rod 31a to 31dWhen ultraviolet light source 51 being moved by the travel mechanism different from supporting rod 31a to 31d,Before being positioned in platform 10, non-exposure base C moves to precalculated position.
In step S103, systems control division 70 by photography portion 23 to multiple ultravioletsThe correction of source 51 correspondences is photographed separately with mark 53, by said method from this photographyImage is derived the position of ultraviolet light source 51. The method of in addition, instrumentation being carried out in position does not limitIn said method, can be also following method: be exposed substrate C be placed on platform 10 itFront etc., can photograph to ultraviolet light source 51 by photography portion 23 time, to ultravioletPhotographing in source 51, according to this photographs, instrumentation is carried out in the position of ultraviolet light source 51.
In addition, in step S105, systems control division 70 is set and seat corresponding on platform 10Mark system (following, be called " platform coordinate system ". ), finish exposure pre-treatment program. As Figure 13Shown in, in the stage of exposure pre-treatment, in platform coordinate system, on known position, configureUltraviolet light source 51 separately.
The systems control division 70 of the 1st exposure plotting device 2 completes and is exposed in exposure pre-treatmentSubstrate C carries out the 1st exposure-processed after being positioned on platform 10. Figure 14 illustrates this realityThe flow chart of executing the handling process of the 1st exposure treating programme of mode, this program is by pre-storedIn the systems control division 70 at the 1st exposure plotting device 2, possess as recording mediumThe presumptive area of ROM. In addition, Figure 15 is the 1st exposure place for present embodiment is describedThe general principal view of reason.
In step S201, systems control division 70 is according to the ultraviolet ray of instrumentation in step S103The position of light source 51, sets as being used for and describes surface image P1's to being exposed substrate CThe image coordinate system of coordinate system. As shown in figure 15, in the stage of the 1st exposure-processed, according toFor the set positions image coordinate system of the ultraviolet light source 51 of platform coordinate system. Also can be in officeIn the image coordinate system of meaning, import the position of ultraviolet light source 51.
In step S203, systems control division 70 is sat according to the image of setting in step S201Mark system makes platform 10 move to exposure position. Now, systems control division 70 make platform 10 alongGuide rail 14 moves in the Y direction. In addition, systems control division 70 make platform 10 move to based onThe exposure object position of photohead 16a with being exposed while describing surface image P1 in substrate CConsistent position, starting position.
In step S205, systems control division 70 starts the exposure of each photohead 16a, at quiltImage coordinate system in the surface C 1 of exposure base C, based on setting in step S201Surface image P1 is described in position. In addition, in step S207, systems control division 70 makes purpleOuter line source 51 produces ultraviolet beam UV, describes school at the back side C2 that is exposed substrate CMutatis mutandis mark M. In addition, step S205 for the processing of surface C 1 that is exposed substrate CNot hinder locating each other with the processing of back side C2 for being exposed substrate C of step S207Reason. , the 1st exposure plotting device 2 can carry out above-mentioned each processing concurrently, thereforeAlso can carry out the processing of step S205 and step S207 simultaneously. Or, the 1st exposure plottingDevice 2 also can carry out the processing of step S207 before the processing of step S205. As Figure 15Shown in, according to image coordinate system, describe surface image in the surface C 1 that is exposed substrate CP1, C2 describes calibration mark M overleaf.
As mentioned above, the retouching of surface image P1 of surface C 1 for being exposed substrate CPaint in processing C2 overleaf and describe calibration mark M, thereby without describing in addition calibration useThe processing of mark M. Therefore, not can to exposure plotting treatment cycle exert an influence, canThe retention time of the baking of the mutatis mutandis mark M of high-ranking officers keeps longly. Its result, can improve forThe contrast of describing photographs in processing, calibration mark M of back side C2, thereforeCan suppress the identification deviation of calibration mark M.
In addition, calibration is by being baked after ultraviolet beam UV irradiation with mark MShow in the mode being exposed in substrate C with can Visual Confirmation, take the photograph by photography portion 23Shadow, thus can confirm its position and shape.
In step S209, systems control division 70 moves to platform 10 to be placed with to be exposed baseThe position of plate C, finishes the 1st exposure treating programme. When moving to, platform 10 is exposed substrate CMounting position time, be exposed substrate C absorption and remain to AC hand 62 and move to the 2nd and transmitDevice 6. In addition, be exposed substrate C and be sent to inversion set by the 2nd conveyer 63, on the basis of the table back of the body of having reversed by inversion set 3, be sent to by the 3rd conveyer 7The 2nd exposure plotting device 4.
The systems control division 70 of the 2nd exposure plotting device 4 in predetermined timing (in this realityExecute in mode, be exposed substrate C and be placed on the timing of platform 10) carry out this exposure pre-treatment journeyOrder.
Figure 16 is the flow process that the handling process of the 2nd exposure treating programme of present embodiment is shownFigure, this program is stored in the work possessing in the systems control division 70 of the 2nd exposure plotting device 4For the presumptive area of the ROM of recording medium. In addition, Figure 17 is for present embodiment is describedThe general principal view of explanation of the 2nd exposure-processed.
In step S301, systems control division 70 makes to be placed with the platform 10 that is exposed substrate CThe entirety that moves to the calibration mark M describing in step S207 is contained in based on camera headPosition in 23 photographed images. Now, systems control division 70 makes platform 10 along guide rail 14Move in the Y direction, and the position that platform 10 is moved to be provided with photography portion 23 with establishConsistent position roughly in the Y direction, the position that is equipped with calibration mark M.
In addition, the photography region based on photography portion 23 is in the back side C2 that is exposed substrate CBe provided with the region of calibration mark M, than the region that comprises the step-up error that is exposed substrate CGreatly. Thus, though at the setting position that is exposed substrate C from by predefined setting positionIn situation about departing from, as long as by the position to set by the mode of the central part of mark M in calibrationPut as center and photograph, be contained in the photography region of region photography portion 23.
In step S303, systems control division 70 according to by photography portion 23 to calibration markThe position of mark M is used in the photographed images instrumentation calibration that M makes a video recording. In addition, at step S305In, systems control division 70 is the position with mark M according to the calibration of instrumentation in step S303,Set image coordinate system, this image coordinate system is for determining being exposed the back side C2 of substrate CDescribe the position of back side image P2. Now, image coordinate system is set to, and at step S201The image coordinate system correspondence of middle setting. That is, be set to the ultraviolet of instrumentation in step S103The position of line source 51 and the relative position of describing position of image C 1 for surface, with calibration useThe position of mark M and the back side correspond to each other with the relative position of describing position of image C 2. AsShown in Figure 17, in the stage of the 2nd exposure-processed, the set positions according to calibration with mark M, therefore also there is the relative position and the 1st of platform coordinate system and image coordinate system in image coordinate systemThe stage difference of exposure-processed.
In step S307, systems control division 70 is sat according to the image of setting in step S305Mark system makes platform 10 move to exposure position. Now, systems control division 70 make platform 10 alongGuide rail 14 moves in the Y direction. In addition, systems control division 70 make platform 10 move to based onThe exposure object position of photohead 16a with being exposed while describing back side image P2 in substrate CConsistent position, starting position.
In step S309, systems control division 70 starts the exposure of each photohead 16a, at quiltThe back side C2 of exposure base C describes back side image P2. As shown in figure 17, sit according to imageMark system, describes back side image P2 at the back side C2 that is exposed substrate C.
In step S311, systems control division 70 moves to platform 10 to be placed with to be exposed baseThe position of plate C, finishes the 2nd exposure treating programme. When moving to, platform 10 is exposed substrate CMounting position time, described the substrate that is exposed of image on surface C 1 and C2Zhe two sides, the back sideC is adsorbed and remains to AC hand 62 and move to the 4th conveyer 8, transmits dress by the 4thPut 8 and be transmitted.
Figure 18 is illustrated in the chi that is exposed substrate C in the exposure plotting system 1 of present embodimentVery little and the general principal view of describing the relation between position of mark M for calibration. In this enforcement sideIn formula, supporting rod 31a to 31d is by the mobile unit 32a to 32d of clamping device for base plate portion 30And when mobile, move interlock with this and ultraviolet light source 51 moves. Therefore, as shown in figure 18,Optical sensor 49 is surveyed and is exposed the end of substrate C and supporting rod 31a to 31d is fixedly exposedThe end of substrate C, thus ultraviolet light source 51 is automatically fixed on the end to being exposed substrate CThe position of the irradiation ultraviolet radiation light beam UV of portion. In addition, can freely set supporting rod 31a extremelyPosition relationship between the position of 31d and ultraviolet light source 51. Thus, in the present embodiment,Do not rely on the size that is exposed substrate C, can be in the predetermined position that is exposed substrate CBe set up and describe calibration mark M.
In addition, the position of ultraviolet light source 51 is carried out the method root of instrumentation in step S103The difference according to obtained instrumentation precision, the mobile unit 32a to 32d of clamping device for base plate portion 30There is stepping motor, also can carry out instrumentation by the pulse of this stepping motor. Or,Also can be that mobile unit 32a to 32d has rotary encoder and by the arteries and veins of rotary encoderRush instrumentation position. Or, also can light be set in several places of the 1st exposure plotting device 2The range sensor of formula or utilized hyperacoustic range sensor, by these Distance-sensingsDevice instrumentation position.
In addition, in the present embodiment, be provided with two marks 53 for correction of round shape above,Derive with mark 53 and the position relationship of ultraviolet light source 51 by this plural correctionThe position of ultraviolet light source 51. But correction is not limited to by shape and the number of mark 53This, can at random set the shape of proofreading and correct with mark. In addition, the shape of proofreading and correct with mark 53Shape is arrowhead-shaped mark etc. while representing the mark of direction of position and ultraviolet light source 51, evenSet correction is one with mark 53, also can be from this correction with the position of mark 53 andDirection derives the position of ultraviolet light source 51.
In addition, departing from the theoretical value of the position by photographs middle-ultraviolet lamp light source 51When amount is come the position of instrumentation ultraviolet light source 51, preferably ultraviolet light source 51 is positioned at photography portion 23The depth of focus in. But, at ultraviolet light source 51 not in the depth of focus of photography portion 23Time, the mode that can be positioned at the depth of focus of photography portion 23 with ultraviolet light source 51 changes flatThe height (position in Z direction) of platform 10.
In addition, in the present embodiment, although describe two calibration mark M, do not limitDue to this, calibration can at random be set as long as two above by the quantity of mark M. SchoolThe quantity of mutatis mutandis mark M is more, more can make to be exposed the calibration accuracy in the table back of the body of substrate CImprove.
In addition, in the present embodiment, use ultraviolet light source 51 to retouch being exposed on substrate CPaint calibration and use mark M, but be not limited to this, describe by spraying or transfer printing ink.
In addition, in the present embodiment, ultraviolet light source 51 is with can be in directions X or Y sideThe mode moving up arranges, but is not limited to this, and also can use can be in direction arbitrarilyThe ultraviolet light source of upper movement. In addition, the mobile route of ultraviolet light source can be to cross to be exposed to the sunThe path of the central portion of photopolymer substrate C can be also to cross the optional position that is exposed substrate CPath.
In the present embodiment, the mobile unit 32a of ultraviolet light source 51 and clamping device portion 30Move to 32d interlock, but be not limited to this, also can be by moving of being formed by motor etc.Actuation mechanism moves respectively ultraviolet light source 51 independently. Now, the pre-stored substrate that is exposedMounting position in the size of C and platform 10, ultraviolet light source 51 also can be set to basisThe size of storing moves to predetermined position with mounting position.
In addition, in the time that in step S205, surface is with the describing unsuccessfully of image P1, can not enterThe processing of row step S207 (processing of describing of mark M for calibration) and transfer to step S209Processing. Now, on surface, being exposed on substrate C of failure of describing with image P1 do not retouchedBe painted with calibration mark M. Therefore, user confirms calibration mark to each substrate C that is exposedM has or not, thereby can differentiate describing successfully or failure of surface image P1.

Claims (11)

1. an exposure plotting device, has:
The 1st exposing unit, by entering the 1st face that is positioned in the printed circuit board on platformRow exposes and on described the 1st, describes circuit pattern;
Mark forming unit, is set to relatively to move with respect to described platform, describedDescribed the 1st upper the 1st of printed circuit board with circuit pattern describe process,Form predetermined multiple marks with described the 1st contrary the 2nd;
Instrumentation unit, carries out instrumentation to the position of described mark forming unit;
Detecting unit, to being formed on the institute of described printed circuit board by described mark forming unitStating the position of the multiple marks on the 2nd detects; And
The 2nd exposing unit, with the position of the described mark forming unit by described instrumentation unit instrumentationThe position of described multiple marks of putting and detected by described detecting unit is benchmark, by describedDescribed the 2nd face of printed circuit board exposes and describe circuit pattern on described the 2nd.
2. exposure plotting device according to claim 1, wherein,
Described mark forming unit is set to, can be with respect to be positioned on described platformAny one side of described printed circuit board is the predetermined direction of benchmark and true in advance with thisThe direction of at least one party in the direction that fixed direction is intersected moves.
3. exposure plotting device according to claim 1, wherein,
The scope that described mark forming unit can move is can be to the different multiple types of sizePrinted circuit board forms the scope of this mark.
4. exposure plotting device according to claim 1, wherein,
Described exposure plotting device also has discrete cell, and this discrete cell is to described printed wiringThe size of substrate is carried out specific,
Described mark forming unit is according to forming respectively institute by the specific size of described discrete cellState multiple marks.
5. exposure plotting device according to claim 1, wherein,
Described instrumentation unit has the camera unit that described mark forming unit is photographed, and makesInstrumentation is carried out in each position of described mark forming unit with the photographs of this camera unit.
6. exposure plotting device according to claim 1, wherein,
Described mark forming unit is formed on as upper/lower positions: though as described in be placed with seal on platformUnder the state of brush circuit board, also can be by described instrumentation unit to respect to described mark shapeThe correction mark that becomes unit to be positioned at known relative position is photographed,
Described instrumentation unit has camera unit, and this camera unit is with mark difference for described correctionThe mode of being photographed is photographed to described mark forming unit, and described instrumentation unit uses this to take the photographThe photographs of shadow unit carries out instrumentation to each position of described mark forming unit.
7. exposure plotting device according to claim 5, wherein,
Be provided with multiple described camera units, described camera unit forms list to described mark respectivelyPhotograph above for one in unit.
8. exposure plotting device according to claim 5, wherein,
Described camera unit is set to have known pass with the position of describing circuit patternSystem, and can be with respect to described platform movement.
9. exposure plotting device according to claim 1, wherein,
The light of described mark forming unit by short wavelength to described printed circuit board described the2 faces expose and form described mark.
10. exposure plotting device according to claim 1, wherein,
Described mark forming unit is by making ink be attached to the 2nd of described printed circuit boardAnd form described multiple mark.
11. 1 kinds of exposure plotting methods, for exposure plotting device, this exposure plotting device toolHave: the 1st exposing unit, by the 1st face that is positioned in the printed circuit board on platform is enteredRow exposes and on described the 1st, describes circuit pattern; Mark forming unit, being set to canRelatively move with respect to described platform, with described the 1st contrary the 2nd formation in advanceMultiple marks of determining; Instrumentation unit, carries out instrumentation to the position of described mark forming unit;Detecting unit, to being formed on the described the 2nd of described printed circuit board by described mark forming unitThe position of the multiple marks on face is detected; And the 2nd exposing unit, by described sealDescribed the 2nd face of brush circuit board exposes and on described the 2nd, describes circuit pattern,Described exposure plotting method has following steps:
Control described instrumentation unit so that the position of described mark forming unit by instrumentation;
Described mark forming unit is moved to predetermined position;
Control described the 1st exposing unit and described mark forming unit, with in described printed wiringOn described the 1st of substrate, describe the 1st with circuit pattern, and at this circuit patternDescribe process in, with described the 1st with circuit pattern corresponding and on described the 2nd formationMultiple marks; And
Control described the 2nd exposing unit, to be formed by the described mark of described instrumentation unit instrumentationThe position of the position of unit and described multiple marks of being detected by described detecting unit be benchmark andOn described the 2nd, describe described the 2nd with circuit pattern.
CN201380016100.7A 2012-03-30 2013-01-09 Exposure plotting device and exposure plotting method Active CN104185817B (en)

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PCT/JP2013/050242 WO2013145798A1 (en) 2012-03-30 2013-01-09 Exposure writing device and exposure writing method

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CN104185817A (en) 2014-12-03
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JP2013213852A (en) 2013-10-17
JP5961429B2 (en) 2016-08-02

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