TWI538148B - Exposure method and exposure apparatus - Google Patents

Description

Exposure method and exposure device

The present invention relates to an exposure method and an exposure apparatus for sequentially exposing a pattern while moving a pattern-free substrate in a certain direction; more specifically, with respect to an exposure method and an exposure apparatus, high precision for a large unpatterned substrate And low cost to expose the pattern.

In the above-described exposure method, the unexposed body is superposed on the reference substrate on which the reference pattern to be used as the exposure reference is formed, and the both are conveyed together, and at the same time, the image is taken from the upper and lower sides of the object to be exposed. The mechanism captures the reference pattern to detect a reference position set in advance by the reference pattern, and performs control of starting or stopping the irradiation of the light beam scanned in a direction orthogonal to the substrate conveyance direction based on the reference position. On the other hand, the pattern is sequentially formed on the unexposed body (see, for example, Japanese Laid-Open Patent Publication No. 2005-316167).

However, in such a conventional exposure method, it is necessary to prepare a reference substrate in which a reference pattern is formed in advance, and it takes time to form the reference substrate, and the cost of the exposure process becomes high.

Further, when the object to be exposed is large, the reference substrate is also increased in size in accordance with the large-sized object to be exposed. As a result, in order to form the reference pattern on the large-sized pattern-free substrate, it is necessary to use a large cover or a large exposure device, and the reference substrate. There are rumors that become expensive.

Therefore, the present invention is based on such a problem, and its purpose is to provide Provided by an exposure method and an exposure apparatus, the pattern can be exposed with high precision and low cost on a large unpatterned substrate.

In order to achieve the above object, an exposure method of the present invention sequentially exposes a predetermined pattern through a pattern forming region on a substrate through a mask while moving the substrate in a certain direction; a stage of exposing the pattern on the substrate, and simultaneously irradiating the outside of the pattern forming region in the direction in which the substrate moves in the direction of the substrate, and imparting a shape of the flaw on the substrate surface to form an alignment mark; a stage in which the alignment mark is determined in a direction in which the reference position determined in advance in the moving direction of the substrate is in the direction of the crossing direction of the substrate moving direction; and the stage in which the substrate and the mask are relatively moved in order to correct the positional deviation And the stage of exposing the next pattern to the subsequent position of the pattern that was first exposed.

According to this configuration, while the substrate is moved in a certain direction, the pattern is exposed through the pattern forming region on the substrate, and at the same time, the pattern forming region in the direction of the substrate moving direction is irradiated with the laser light. The substrate surface is provided with a certain shape of the flaw to form an alignment mark, and the positional deviation of the reference position determined in advance in the moving direction of the alignment mark relative to the substrate in the direction of the substrate is detected, and the substrate is offset in order to correct the positional deviation. Relative movement with the reticle exposes the next pattern at a subsequent location of the pattern that was previously exposed. Thereby, even if the substrate is unpatterned, the exposure pattern can be sequentially connected with high positional accuracy. In addition, since it is not necessary to prepare a reference substrate in which a reference pattern is formed in advance as in the prior art, it can be high even for a large unpatterned substrate. The pattern is exposed with precision and low cost.

In addition, the reticle is formed with an opening window outside the mask pattern region in the intersecting direction of the substrate moving direction, and the laser light is passed through to form the alignment mark on the substrate; the substrate moving direction of the opening window The downstream location forms an alignment window useful for detecting the alignment mark. Thereby, the laser light is irradiated onto the substrate through the opening window formed outside the mask pattern region in the intersecting direction of the moving direction of the substrate of the reticle to form an alignment mark, and is located downstream of the substrate moving direction of the opening window. An alignment window is formed to detect the alignment mark. Therefore, the alignment of the exposure pattern after the previous exposure and the mask pattern of the reticle can be performed with higher precision, and the connection accuracy of each exposure pattern can be further improved.

Further, the mask is formed outside the mask pattern region in the direction in which the substrate moves in the direction of the irradiation, and an opening window is formed in the irradiation region of the exposure laser light, and the opening window is provided with a collecting lens; While the laser light is being exposed, the laser light is irradiated onto the substrate through the condensing lens of the reticle to form the alignment mark. Thereby, the exposure laser light is condensed by the condensing lens provided in the opening window of the reticle (the area outside the mask pattern area formed in the direction in which the substrate moves in the direction of the projection and in the irradiation region of the exposure laser light) An alignment mark is formed on the substrate. Therefore, by providing a concentrating lens, the energy density of the light irradiated on the substrate can be increased. By using a laser light source as the light source for exposure, a part of the laser light for exposure can be condensed on the substrate and used for The alignment marks are formed. Therefore, the light source can be set to one of the laser light sources for exposure, and the simplification of the device can be achieved.

In addition, the reticle is arranged such that the plurality of unit covers are arranged differently in the direction in which the substrate moves in the direction of the offset; in the positional correction phase of the alignment mark, the adjacent ends of the unit covers are detected. The inter-cover alignment marks are formed, and the position adjustment of each unit cover is performed so that the arrangement pitch of each unit cover is constant. In this manner, the inter-cover alignment marks formed by the adjacent end portions of the plurality of unit covers arranged in the intersecting direction of the substrate moving direction are detected, and the arrangement pitch of each unit cover is adjusted to a constant value. The position of the unit cover is exposed. Therefore, the large-sized substrate can be exposed by using a small-sized unit cover having a small shape, and the manufacturing cost of the photomask can be reduced.

Further, the exposure apparatus of the present invention sequentially exposes a pattern determined in advance by moving the substrate in a predetermined direction through a pattern forming region on the substrate via a photomask, and is characterized in that the light source for exposure is provided via The illuminating light is irradiated onto the substrate by the light source, and the laser light source is irradiated with the laser light to form a mark on the substrate surface outside the pattern forming area in the direction of the substrate moving direction to form an alignment mark. And an alignment mechanism that detects a positional deviation of a reference position determined in advance by a position downstream of the substrate in a moving direction of the substrate in a direction in which the substrate moves in a direction in which the substrate is offset in order to correct the positional deviation The mask is moved relative to correct the positional deviation of the exposure.

With such a configuration, while the substrate is moved in a certain direction, the substrate is irradiated with light source light from the exposure light source via the mask to pattern the area exposure pattern on the substrate, and at the same time, The light source irradiates the substrate with the laser light to form a mark on the surface of the substrate outside the pattern forming region in the direction in which the substrate moves in the direction of the substrate to form an alignment mark, and the alignment mechanism detects the movement of the alignment mark relative to the substrate. a positional deviation of a reference position determined in advance at a downstream position of the direction in a direction in which the substrate moves in a direction of intersection, and the relative displacement of the substrate and the reticle is corrected in a manner of correcting the positional deviation to correct the positional deviation of the exposure, and the exposure is prior to exposure The subsequent position of the pattern exposes the next pattern. Thereby, even if the substrate has no pattern, the pattern can be successively exposed with high positional accuracy. Further, since it is not necessary to prepare a reference substrate in which a reference pattern is formed in advance as in the prior art, the pattern can be exposed with high precision and at low cost even in a large unpatterned substrate.

Furthermore, the reticle is formed with an opening window outside the mask pattern region in the intersecting direction of the substrate moving direction, and the laser light is passed through to form the alignment mark on the substrate; and the substrate is moved in the opening window A position downstream of the direction forms an alignment window useful for detecting the alignment mark. Thereby, the illuminating light is irradiated onto the substrate by the opening window formed outside the mask pattern region in the intersecting direction of the moving direction of the substrate to form an alignment mark, and the opening window is formed at a position downstream of the moving direction of the substrate. The alignment window detects the alignment mark. Therefore, the alignment of the exposure pattern of the previous exposure and the mask pattern of the reticle can be performed with higher precision, and the connection accuracy of each exposure pattern can be further improved.

Further, the reticle is formed outside the mask pattern region in the direction in which the substrate moves in the direction of the irradiation, and an opening window is formed in the irradiation region of the exposure laser light, and the louver is provided in the opening window; the exposure light source and the ray The light source is a pulsed laser light source that emits laser light of the same wavelength; and the laser light emitted by the pulsed laser light source is exposed, and the laser light is irradiated to the substrate through the condensing lens of the reticle. To form the alignment mark. Thereby, the exposure laser light is collected by a collecting lens provided in the opening window of the photomask (which is formed outside the mask pattern region in the direction in which the substrate moves in the direction of the projection and is in the irradiation region of the exposure laser light). An alignment mark is formed on the substrate. Therefore, the energy density of the light irradiated on the substrate can be increased by providing a condensing lens. As long as a laser light source is used as the light source for exposure, a part of the laser light for exposure can be condensed on the substrate and used in the pair. The formation of quasi-markers. Therefore, the light source can be set as one of the laser light sources for exposure, and the simplification of the device can be achieved.

Further, the reticle is arranged such that the plurality of unit covers are arranged differently in the direction in which the substrate moves in the direction of the substrate; and the unit cover alignment mechanism is further formed to detect the adjacent end portions of the unit covers. The alignment between the cover members is performed so that the position of each unit cover is adjusted so that the arrangement pitch of each unit cover is constant. Thereby, the inter-cover alignment mark formed by the adjacent end portions of the plurality of unit covers arranged in the intersecting direction of the substrate moving direction in the direction in which the substrate moves in the direction is detected by the unit cover alignment mechanism, and the unit cover is formed by each unit cover The position of each unit cover is adjusted in such a manner that the arrangement pitch becomes a certain value. Therefore, the large-sized substrate can be exposed by using a small-sized unit cover having a small shape, and the manufacturing cost of the photomask can be reduced.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings. Fig. 1 is a front view showing a first embodiment of an exposure apparatus of the present invention. In the exposure apparatus, the film 1 is sequentially exposed while moving the film 1 as a non-pattern substrate in a predetermined direction, and the supply roll 2, the take-up reel 3, the laser light source 4, the mask 5, and the pair are provided. The standard mechanism 6 and the control mechanism 7.

The supply reel 2 is rotatably held by the supply-side rotary shaft 8, for example, in which the elongated film 1 is wound. Further, the supply-side rotary shaft 8 is provided with a brake for omitting the illustration of the normal rotation, and a back tension is applied to the film 1 to impart a certain tension.

The take-up reel shaft 9 is provided so that the take-up reel 9 can be rotated while the supply-side rotary shaft 8 is disposed in parallel with a predetermined distance apart in the horizontal direction. The take-up reel 3 is obtained by winding the film 1 supplied from the supply reel 2, and the take-up motor 10 provided in the rotary shaft by the take-up side rotation shaft 9 is rotated.

Further, a pair of guide poles 11 are provided between the supply reel 2 and the take-up reel 3 to horizontally support the film 1.

A laser light source 4 is disposed above the film 1 that is horizontally hung between the pair of guide columns 11. This laser light source 4 is a pulsed laser light source that emits exposure laser light L having a wavelength of about 355 nm. Further, the coupling optical member 12 is disposed on the downstream side in the traveling direction of the laser light L of the laser light source 4, and the beam diameter of the laser light L can be amplified to uniformize the intensity distribution, and then the parallel light is irradiated to the mask 5 to be described later. In addition, although it is also possible to replace the laser light source 4, use a mercury lamp with a wavelength of 313 nm, and a flash of light. The lamp is described in the following description for the case where the exposure light source is the laser light source 4.

On the optical axis of the above-mentioned laser light source 4, a photomask 5 is disposed in close proximity to the film 1 which is horizontally hung between the pair of guide columns 11. As shown in FIG. 2, the mask 5 is an original plate of an exposure pattern formed on the film 1, and has a cover pattern region 13 (an opening in which a cover pattern corresponding to an exposure pattern is formed) at a substantially central portion. On the center line of the mask pattern region 13 which is parallel to the direction in which the moving direction of the film 1 (hereinafter referred to as "X direction" is indicated by the arrow X in FIG. 1 (hereinafter referred to as "Y direction") An opening window 15 is formed in the irradiation region 14 of the exposure laser light L outside the cover pattern region 13, and a condensing lens 16 is disposed in the opening window 15 to condense the laser light L on the film 1 on the film 1. A scratch of a certain shape is applied to form an alignment mark 17 (refer to FIG. 5). Further, an alignment window 18 is formed at a distance D from the center of the opening window 15 downstream of the opening window 15 in the X direction. In this case, the interval D between the opening window 15 and the alignment window 18 is set to be equal to or less than the width W of the mask pattern region 13 in the X direction (D≦W). Thereby, the exposure pattern can be continuously connected in the X direction. Further, the photomask 5 is held by a cover platform 19 which is formed to be movable in the Y direction.

The alignment mechanism 6 is provided in such a manner that the photomask 5 and the film 1 are relatively movable in the Y direction. The alignment mechanism 6 is for correcting the positional deviation of the exposure, and includes an imaging mechanism 20 and a cover platform driving mechanism 21. Further, reference numeral 29 in Fig. 1 is a plane mirror.

The imaging unit 20 is configured to image the alignment mark 17 formed on the film 1, and is a CCD camera such that the center of the field of view is aligned with the center of the alignment window 18 of the mask 5. Further, the cover platform driving mechanism 21 is configured to move the cover platform 19 in the Y direction, and is composed of a stepping motor and a gear, or an electromagnetic actuator, a linear motor, or the like.

A control mechanism 7 is provided in electrical connection with the winding motor 10, the laser light source 4, the imaging unit 20, and the cover platform driving mechanism 21. The control unit 7 calculates the positional deviation of the alignment mark 17 in the Y direction due to the movement error of the film 1, and moves the mask 5 to correct it. As shown in FIG. 3, the image processing is performed. The unit 22, the calculation unit 23, the memory 24, the motor drive control unit 25, the light source drive unit 26, the cover platform drive control unit 27, and the control unit 28.

The image processing unit 22 processes the image of the alignment mark 17 imaged by the imaging unit 20, and detects, for example, the center position of the alignment mark 17. Further, the calculation unit 23 calculates a positional deviation amount between the center (reference position) of the alignment window 18 and the center of the alignment mark 17. Further, the memory 24 stores the center position of the alignment mark 17, the calculation result, and the like. Further, the motor drive control unit 25 controls the rotational speed, drive, and stop of the motor. Furthermore, the light source driving unit 26 controls the power, the oscillation frequency, the lighting, and the light-off of the laser light source 4. Further, the cover platform drive control unit 27 controls the driving of the cover platform driving mechanism 21 to control the moving direction and the amount of movement of the cover platform 19. In addition, the above control unit 28 is appropriately driven The driving of each of the above elements is controlled in a manner of the entire moving device.

Next, the operation of the exposure apparatus configured in this manner and the exposure method by using the exposure apparatus will be described with reference to FIG. 4.

First, the film 1 coated with the photosensitive material on the surface of the supply reel 2 is horizontally hung around the pair of guide posts 11, and the front end portion is fixed to the shaft of the take-up reel 3.

In this state, in step S1, the winding drive motor 10 is driven by the motor drive control unit 25 to wind up the film 1 at a constant speed in the X direction.

Next, in step S2, the driving light source driving unit 26 lights the laser light source 4 for a predetermined period of time, and irradiates the mask 5 with the exposure laser light L. The exposure laser light L is irradiated onto the film 1 through the cover pattern opening of the mask 5, and the pattern corresponding to the cover pattern is exposed on the film 1. At the same time, a part of the above-mentioned exposure laser light L is condensed on the film 1 by the condensing lens 16 after passing through the opening window 15 of the reticle 5, and a certain shape of the film 1 is given a flaw on the film 1 to form an alignment mark. 17.

In step S3, once the film 1 is moved by a distance D such that the alignment mark 17 formed on the film 1 reaches directly below the alignment window 18 of the mask 5, the alignment is performed by the imaging mechanism 20 through the alignment window 18. Mark 17. This captured image is subjected to image processing by the image processing unit 22, and the center position of the alignment mark 17 is detected. Then, in the calculation unit 23, the positional deviation amount of the center of the alignment mark 17 with respect to the center (reference position) of the alignment window 18 in the Y direction is calculated.

In step S4, the cover is driven by the cover platform driving control unit 27. The body platform driving mechanism 21 moves the mask 5 in the Y direction so that the displacement amount becomes substantially zero by controlling the moving direction and the amount of movement of the cover platform 19.

In step S5, it is determined whether or not the entire exposure to the film 1 has ended. Here, when it is judged as "NO", the process returns to step S2 to perform the next exposure, and the alignment mark 17 is formed. Further, in steps S5, steps S2 to S5 are executed until the determination is "YES". Thereby, as shown in FIG. 5, on the film 1, the pattern 30 is continuously connected and exposed in the X direction.

Further, in the first embodiment described above, the case where the film 1 is continuously moved while being exposed is described. However, the film 1 may be stopped at one end every time the film 1 is moved by the distance D, and the bit is stopped in this stop state. The so-called step exposure is performed by offset correction and exposure. Thereby, the pattern 30 can be connected with higher precision in the moving direction of the film 1.

Further, in the above-described first embodiment, the case where the opening window 15, the condensing lens 16, and the alignment window 18 are provided at both end portions of the reticle 5 has been described, but only one of the end portions may be provided. Further, the opening window 15 and the condensing lens 16 may be provided at an outer portion in the Y direction of the cover pattern region 13, or may be provided at any position other than the center line of the cover pattern region 13 parallel to the Y direction.

Further, in the first embodiment described above, the case where the exposure is performed by one mask 5 is described. However, a plurality of masks 5 may be arranged in the X direction, and the mask 5 on the front side may be an exposure pattern. Follow-up The mask 5 is used to make up the exposure.

Further, in the above-described first embodiment, the case where the exposure of the mask 5 is moved in the Y direction and the positional deviation of the exposure is performed is described. However, the film 1 side may be moved in the Y direction or both may be moved.

Next, a second embodiment of the exposure apparatus of the present invention will be described. Here, the description will be made with respect to parts different from the first embodiment.

In the second embodiment, when the unit cover of the photomask 5 in the Y direction is arranged in the X direction, the adjacent end portions are arranged to overlap each other at a predetermined interval, and the unit cover alignment mechanism is further provided. The position adjustment of each unit cover is performed so that the inter-blade alignment marks formed by the adjacent end portions of the respective unit covers are detected so that the arrangement pitch of each unit cover is constant.

Specifically, as shown in FIG. 6, the mask 5 is provided with the opening window 15, the collecting lens 16, and the alignment window 18 at the outer end portion of the unit cover 31s at the most end portion. An inter-cover alignment mark 32 (shown by Δ in the same figure) is formed near the center end portion, and the even-numbered unit cover bodies 31e arranged in the second and subsequent rows are arranged in the same figure at the upper end portion. The window member 34 having the inter-cover alignment window 33 corresponding to the inter-cover alignment mark 32 is positioned and joined to a predetermined position, and the lower end portion is formed to be aligned with the cover as described above. Indicia 32; arranged in the third and subsequent odd-numbered unit covers 310 in the same figure, at the upper end portion corresponding to the even-numbered unit cover 31e formed between the cover alignment marks 32, the window member 34 formed with the inter-cover alignment window 33 is positioned and joined to the prior At the position of the lower end, the inter-cover alignment mark 32 is formed in the same manner as described above, and the unit cover is arranged such that the inter-cover alignment mark 32 and the inter-cover alignment window 33 are vertically overlapped. 31s, 31e, 31o. In this case, a plurality of laser light sources 4 are provided corresponding to the respective unit covers 31s, 31e, and 31o.

Further, each unit cover 31s, 31e, and 31o is held in the Y direction by an individual unit cover platform (not shown). Further, a camera for capturing the alignment mark 32 between the cover members is provided above each of the window members 34. Further, the unit cover alignment mechanism is constituted by the unit cover platform and the camera.

According to the second embodiment, in the second embodiment, the exposure laser light L can pass through the opening window 15 formed by the unit cover 31s at the most end portion and the collecting lens. 16 is condensed on the film 1, and an alignment mark 17 is formed on the film 1. After the alignment mark 18 detects the positional deviation of the alignment mark 17 in the Y direction, the unit cover 31s of the most end portion is turned toward The Y direction is moved to correct the above-described bit offset. At this time, the camera is imaged by the camera, and the second and subsequent unit covers 31e and 31o are turned toward the Y so that the center of the alignment mark 32 between the covers can be aligned with the center of the alignment window 33 between the respective covers. The direction is moved, and the arrangement pitch of each unit cover 31s, 31e, and 31o is maintained at a constant value.

As described above, according to the second embodiment, by arranging the unit covers 31s, 31e, and 31o having a small arrangement size in the Y direction, the pattern can be exposed with high positional accuracy even for the wide unpatterned film 1.

Further, as shown in FIG. 6, as long as the two inter-cover alignment marks 32 and the inter-cover alignment window 33 are arranged side by side in the Y direction, the alignment marks 32 between the two covers can be aligned in the X direction. The inclination angle θ of the unit covers 31s, 31e, and 31o with respect to the X direction is measured by the difference in the amount of the displacement, and the inclination correction of the unit covers 31s, 31e, and 31o can be performed. Thereby, the positional accuracy of the exposure pattern can be further improved. In this case, the unit cover platform of the unit cover 31s may not have the function of tilt correction.

Further, as long as the amount of overlap of the adjacent end portions of the respective unit covers 31 is increased in advance, the amount of movement of the inter-cover alignment marks 32 in the Y direction can be measured, that is, the unit cover 31 at the center of the arrangement can be centered. Each unit cover 31 is moved by a certain amount in the Y direction to increase the width of the exposure area.

In addition, in the above-described first and second embodiments, the case where the laser light L emitted from the exposure laser light source 4 is condensed on the film 1 to form the alignment mark 17 has been described, but the present invention does not. In addition to this, a laser light source dedicated to the alignment mark may be additionally provided. In this case, it is not necessary to provide the collecting lens 16 in the opening window 15 of the mask 5, and the light source for exposure is not limited to the laser light source, and may be a mercury lamp, a xenon lamp or the like. Further, the wavelength of the laser light emitted by the laser light source 4 for exposure and the laser light source dedicated to the alignment mark may be different.

In addition, in the above-described first and second embodiments, the case where the alignment window 18 is provided in the mask 5 and the inter-blade alignment window 33 is provided in the unit covers 31s, 31e, and 31o is described. The invention is not limited Here, an alignment mark may be provided instead of the alignment window.

Further, in the above-described first and second embodiments, the case where the opening window 15, the condensing lens 16, and the alignment window 16 are provided in the reticle 5 has been described, but the present invention is not limited thereto, and may be as shown in the drawing. 7 is disposed on the side of the cover platform 19 for positioning and holding the mask 5. In this case, the opening window 15 may be provided in the irradiation region 14 of the exposure laser light L as shown in Fig. (a) or outside the irradiation region 14 as shown in Fig. (b). When the opening window 15 is provided in the irradiation region 14 of the exposure laser light L, the condensing lens 16 can be provided in the opening window 15 and the exposure laser light source 4 can also be used to form the alignment mark 17 (refer to the same figure (a). )). Further, when the opening window 15 is provided outside the irradiation region 14 of the exposure laser light L, it is sufficient to provide a dedicated laser light source for forming the alignment mark 17. In this case, the condensing lens 16 may not be provided (refer to the same figure (b)).

Using the exposure of the cover platform 19 shown in FIG. 7, as shown in FIG. 8, the pattern 30 is exposed on the film 1 through the cover pattern of the mask 5, and on the other hand, the pattern formation region in the Y direction is passed. The opening window 15 of the cover platform 19 illuminates the laser light, imparts a flaw on the surface of the film 1 to form an alignment mark 17, and detects a reference position previously determined by the alignment mark 17 with respect to a position downstream in the X direction (for example) Positioning in the Y direction of the alignment window 18, in order to correct this position, the cover platform 19 and the mask 5 are integrally moved in the Y direction, and the previous exposed pattern 30 is attached to expose the next one. Pattern 30. By repeating the execution, the pattern 30 can be successively exposed with high positional accuracy.

Further, in the above description, the case where the substrate is the film 1 has been described, but the present invention is not limited thereto, and the substrate may be a plate member, a printed substrate, or the like.

1‧‧‧film

2‧‧‧Supply reel

3‧‧‧Winding reel

4‧‧‧Laser light source

5‧‧‧Photomask

6‧‧‧Alignment mechanism

7‧‧‧Control agency

8‧‧‧Supply side rotation axis

9‧‧‧Winding side rotation axis

10‧‧‧Winding motor

11‧‧‧ Guide column

12‧‧‧Coupling optical components

13‧‧‧ Cover pattern area

14‧‧‧ illuminated area

15‧‧‧Open window

16‧‧‧ Concentrating lens

17‧‧‧ alignment mark

18‧‧‧Alignment window

19‧‧‧ Cover platform

20‧‧‧ camera organization

21‧‧‧ Cover platform drive mechanism

22‧‧‧Image Processing Department

23‧‧‧ Computing Department

24‧‧‧ memory

25‧‧‧Motor Drive Control Department

26‧‧‧Light source drive department

27‧‧‧ Cover Platform Drive Control Department

28‧‧‧Control Department

29‧‧‧Flat mirror

30‧‧‧ pattern

31e, 31o, 31s‧‧‧ unit cover

32‧‧‧ Between the cover alignment marks

33‧‧‧ Alignment window between the covers

34‧‧‧Window components

Fig. 1 is a front view showing a first embodiment of an exposure apparatus of the present invention.

Fig. 2 is a plan view showing a photomask used in the first embodiment.

Fig. 3 is a block diagram showing a schematic configuration of a control mechanism.

Figure 4 is a flow chart for explaining the exposure method of the present invention.

Fig. 5 is an explanatory view showing exposure performed by the exposure method of the present invention.

Fig. 6 is a plan view showing a second embodiment of the exposure apparatus of the present invention, showing a configuration example of the reticle.

Fig. 7 is a plan view showing an example in which an opening window and an alignment window are provided on a cover platform, (a) an example in which the opening window is provided in an irradiation area of exposure light, and (b) an exposure light in exposure light. An example of the above-mentioned opening window is provided outside the area.

Fig. 8 is an explanatory view showing exposure using the cover platform of Fig. 7.

1‧‧‧film

2‧‧‧Supply reel

3‧‧‧Winding reel

4‧‧‧Laser light source

5‧‧‧Photomask

6‧‧‧Alignment mechanism

7‧‧‧Control agency

8‧‧‧Supply side rotation axis

9‧‧‧Winding side rotation axis

10‧‧‧Winding motor

11‧‧‧ Guide column

12‧‧‧Coupling optical components

19‧‧‧ Cover platform

20‧‧‧ camera organization

21‧‧‧ Cover platform drive mechanism

29‧‧‧Flat mirror

Claims (5)

An exposure method is a step of forming a pattern in which a plurality of unit covers are arranged in a direction in which a plurality of unit covers are arranged in a direction in a direction in which a direction of a moving direction of the substrate is arranged, and a mask is arranged on the substrate. The area is preliminarily determined by the pattern, and at the same time, the pattern forming area in the direction of the substrate moving direction is irradiated with the laser light, and the surface of the substrate is given a flaw of a certain shape to form an alignment mark; the alignment is detected. Marking a stage of a positional deviation of a reference position determined in advance in a moving direction of the substrate with respect to a direction in which the substrate moves in a direction in which the substrate is moved; a stage in which the substrate is moved relative to the mask in order to correct the positional deviation; a step of exposing the next pattern to the subsequent position of the pattern that is exposed first; the mask is formed outside the mask pattern region in the direction in which the substrate moving direction of the unit cover of the most lateral portion of the plurality of unit covers is crossed Opening a window, the laser light passing through to form the alignment mark on the substrate; and the substrate moving side of the opening window An alignment window for detecting the alignment mark is formed at a downstream position, and an inter-cover alignment mark is formed at an adjacent end portion of each unit cover; and the alignment correction phase is detected at the alignment correction stage of the alignment mark Aligning marks between the covers of the unit covers, and the unit covers The position adjustment of each unit cover is performed in such a manner that the arrangement pitch is set to a constant value. The exposure method of claim 1, wherein the photomask is formed outside the mask pattern region in the direction in which the substrate moves in the direction of the substrate, and an opening window is formed in the irradiation region of the exposure laser light, and the opening window is provided in the opening window. a condensing lens; the exposure light is exposed by the exposure light, and the laser beam is irradiated onto the substrate through the condensing lens of the reticle to form the alignment mark. An exposure apparatus for sequentially exposing a pattern forming region on a substrate in which a plurality of unit covers are arranged in a direction in which a plurality of unit covers are arranged in a direction in which a substrate is moved in a predetermined direction. a pattern for determining; comprising: a light source for exposure, which is exposed to light on the substrate by a light source; and a laser light source that irradiates the substrate with laser light in a direction perpendicular to a moving direction of the substrate; Forming an alignment mark on the surface of the substrate outside the formation region to form a mark; and an alignment mechanism detecting a direction in which the reference position determined in advance in the moving direction of the alignment mark with respect to the moving direction of the substrate is in the direction of the substrate moving direction a bit offset on the upper side, in order to correct the bit offset, the substrate and the photomask are relatively moved to correct the positional deviation of the exposure; The reticle is formed with an opening window outside the cover pattern region in the direction in which the substrate moving direction of the unit cover of the most side end portion of the plurality of unit covers is crossed, and the laser light is passed through the substrate to form the Aligning mark; forming an alignment window for detecting the alignment mark at a position downstream of the opening direction of the substrate in the moving direction of the substrate, and forming an inter-cover alignment mark at an adjacent end portion of each unit cover; The unit cover alignment mechanism is provided for detecting the alignment marks between the respective units of the unit cover, and the position adjustment of each unit cover is performed such that the arrangement pitch of the unit covers is constant. The exposure apparatus of claim 3, wherein the mask is formed outside the mask pattern region in the direction in which the substrate moves in the direction of the substrate, and an opening window is formed in the irradiation region of the exposure laser light, and the opening window is provided in the opening window a concentrating lens; the exposure light source and the laser light source are a pulsed laser light source that emits the same wavelength of laser light; and the laser light emitted by the pulsed laser light source is exposed while the laser light passes through the light A concentrating lens of the cover is irradiated onto the substrate to form the alignment mark. The exposure apparatus of claim 3, wherein the unit cover alignment mechanism is configured to measure a movement amount of the alignment mark between the covers in a direction in which the substrate moves in a direction in which the substrate moves.