JP2008233638A - Drawing device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a drawing device and method that can draw a main pattern and a reference pattern as a reference for prescribing the position of the pattern on a substrate in proper position relation. <P>SOLUTION: A pattern drawing device 1 measures an irradiation position of an optical head 32 and irradiation positions of respective alignment drawing heads 41, 42, 43, and 44 by using a common calibration camera, and corrects the positions of the alignment drawing heads 41, 42, 43, and 44 to optimize relative positional relationship between the optical head 32 and alignment drawing heads 41, 42, 43, and 44. Consequently, the pattern drawing device 1 can record a regularity pattern by the optical head and alignment marks AM1 to AM4 by the alignment drawing heads 41, 42, 43, and 44 on the substrate 9 in suitable positional relationship. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light-sensitive material formed on a substrate such as a color filter substrate, a glass substrate for flat panel display (FPD) such as a liquid crystal display device or a plasma display device, a semiconductor substrate, or a printed substrate. The present invention relates to a drawing apparatus and a drawing method for drawing a predetermined pattern.

  Conventionally, in a substrate manufacturing process, a pattern drawing apparatus that draws a predetermined pattern on the surface of a substrate by irradiating light onto a photosensitive material formed on the surface of the substrate has been used. A conventional pattern drawing apparatus includes a stage that moves while holding the substrate in a horizontal posture, and an optical head that irradiates a predetermined pattern of light onto the upper surface of the substrate, and irradiates light from the optical head while moving the substrate. Thus, a predetermined pattern is drawn on the upper surface of the substrate.

  The configuration of a conventional pattern drawing apparatus is disclosed in Patent Document 1, for example.

JP 2000-329523 A

  However, the conventional pattern drawing apparatus draws only main patterns (regularity patterns for flat panel displays, etc.) on a substrate, and a reference pattern (alignment mark) serving as a reference for defining the positions of these main patterns. Etc.), the function of drawing the reference pattern itself was not installed. For this reason, after drawing a reference pattern on a substrate in another device in advance, the substrate is set on the pattern drawing device, and the pattern drawing device draws a main pattern at a predetermined position with respect to the reference pattern on the substrate. It was.

  Thus, conventionally, an apparatus for drawing a reference pattern is required separately from the pattern drawing apparatus. In addition, the pattern drawing apparatus needs an alignment mechanism that detects the reference pattern and precisely adjusts the posture of the substrate. On the other hand, when trying to draw the reference pattern as described above in the pattern drawing apparatus, it is technically necessary to maintain the drawing head for drawing the reference pattern and the drawing head for drawing the main pattern in an appropriate positional relationship. It was difficult.

  The present invention has been made in view of such circumstances, and a drawing apparatus and a drawing that can draw a main pattern on a substrate and a reference pattern that defines the position of the pattern in an appropriate positional relationship. It aims to provide a method.

  In order to solve the above problems, the invention according to claim 1 is a drawing apparatus for drawing a pattern on a photosensitive material formed on a substrate, comprising: a stage that holds the substrate; and a substrate that is held on the stage. First light irradiating means for drawing a predetermined pattern by irradiating light on the upper surface, and a reference for defining the position of the predetermined pattern by irradiating light on the upper surface of the substrate held on the stage Second light irradiating means for drawing a reference pattern, a stage driving unit for relatively moving the stage, the first light irradiating means, and the second light irradiating means, the first light irradiating means, and the second light irradiating means. Based on the deviation amount detected by the deviation amount detection means, the deviation amount detection means for detecting the deviation amount of the relative position with respect to the light irradiation means, the relative relationship between the first light irradiation means and the second light irradiation means. position Characterized in that it comprises a correction means for correcting.

  The invention according to claim 2 is the drawing apparatus according to claim 1, further comprising a calibration camera that captures the irradiation light of the first light irradiation unit and the second light irradiation unit, and detecting the deviation amount. The means detects a shift amount of a relative position between the first light irradiation means and the second light irradiation means based on a photographed image of the calibration camera.

  The invention according to claim 3 is the drawing apparatus according to claim 2, wherein the calibration camera is fixedly installed on the stage, and the stage driving unit includes the stage, the first light irradiation unit, and the The calibration camera is moved between the irradiation position of the first light irradiation means and the irradiation position of the second light irradiation means by relatively moving the second light irradiation means.

  The invention according to claim 4 is the drawing apparatus according to claim 3, further comprising posture detection means for detecting the posture of the stage, wherein the stage driving unit is configured to use information detected by the posture detection means. The stage is moved while correcting the posture of the stage based on the above.

  The invention according to claim 5 is the drawing apparatus according to claim 3 or 4, wherein the calibration camera includes the first light irradiating means and a calibration mark formed on the stage. The second light irradiation unit is photographed, and the deviation amount detection unit is configured to detect the first light irradiation unit and the second light irradiation unit based on a deviation amount of the first light irradiation unit and the second light irradiation unit with respect to the calibration mark. It is characterized by detecting a shift amount of a relative position with respect to the two-light irradiation means.

  The invention according to claim 6 is the drawing apparatus according to any one of claims 1 to 5, further comprising positioning means for positioning the position of the irradiation light of the first light irradiation means at a predetermined position. It is characterized by that.

  A seventh aspect of the present invention is the drawing apparatus according to the sixth aspect, wherein the positioning means includes a first light irradiating means camera that images the irradiation light of the first light irradiating means from below, Adjusting means for adjusting the first light irradiation means based on an image acquired by the camera for one light irradiation means.

  The invention according to claim 8 is the drawing apparatus according to any one of claims 1 to 7, wherein the second light irradiation means includes a plurality of drawing heads, and the correction means includes the plurality of drawing heads. Each position of the drawing head is corrected.

  The invention according to claim 9 is the drawing apparatus according to any one of claims 1 to 8, wherein the second light irradiating means is an alignment mark used for substrate alignment as the reference pattern. It is characterized by drawing.

  In the invention according to claim 10, by irradiating the photosensitive material formed on the substrate with light, a predetermined pattern and a reference pattern serving as a reference for defining the position of the predetermined pattern are drawn on the surface of the substrate. A drawing method, wherein a first step of detecting a relative position deviation between a drawing position of the predetermined pattern and a drawing position of the reference pattern, and a drawing position of the predetermined pattern based on the deviation amount, And a second step of correcting a relative position with respect to the drawing position of the reference pattern.

  According to the first to ninth aspects of the present invention, the drawing apparatus is detected by the shift amount detection unit that detects the shift amount of the relative position between the first light irradiation unit and the second light irradiation unit, and the shift amount detection unit. And a correction unit that corrects a relative position between the first light irradiation unit and the second light irradiation unit based on the shift amount. For this reason, it is possible to draw a predetermined pattern and a reference pattern that defines a position of the pattern on the substrate with an appropriate positional relationship.

  In particular, according to the second aspect of the present invention, the drawing apparatus further includes a calibration camera that photographs the irradiation light of the first light irradiation unit and the second light irradiation unit, and the deviation amount detection unit includes the calibration camera. Based on the photographed image, a shift amount of the relative position between the first light irradiation means and the second light irradiation means is detected. For this reason, it is possible to accurately detect the shift amount of the relative position between the first light irradiation unit and the second light irradiation unit using a common calibration camera.

  In particular, according to the third aspect of the present invention, the calibration camera is fixedly installed on the stage, and the stage driving unit moves the stage, the first light irradiating unit, and the second light irradiating unit relative to each other. The calibration camera is moved between the irradiation position of the first light irradiation means and the irradiation position of the second light irradiation means. For this reason, the drawing apparatus can move the calibration camera between the irradiation position of the first light irradiation means and the irradiation position of the second light irradiation means without providing a drive mechanism unique to the calibration camera. .

  In particular, according to the fourth aspect of the present invention, the drawing apparatus further includes posture detection means for detecting the posture of the stage, and the stage drive unit determines the posture of the stage based on the information detected by the posture detection means. The stage is moved while correcting. For this reason, the drawing apparatus can accurately move the stage and the calibration camera fixedly installed on the stage.

  In particular, according to the invention described in claim 5, the calibration camera photographs the first light irradiation means and the second light irradiation means via the calibration mark formed on the stage, and the deviation amount detection means is Then, based on the shift amount of the first light irradiation unit and the second light irradiation unit with respect to the calibration mark, the shift amount of the relative position between the first light irradiation unit and the second light irradiation unit is detected. For this reason, it is possible to easily detect the shift amount of the relative position between the first light irradiation unit and the second light irradiation unit with the calibration mark as a reference.

  In particular, according to the invention described in claim 6, the drawing apparatus further includes positioning means for positioning the position of the irradiation light of the first light irradiation means at a predetermined position. For this reason, it is possible to detect and correct the shift amount of the relative position between the first light irradiating means and the second light irradiating means after appropriately positioning the irradiation light of the first light irradiating means.

  In particular, according to the seventh aspect of the invention, the positioning unit is acquired by the first light irradiation unit camera that images the irradiation light of the first light irradiation unit from below and the first light irradiation unit camera. Adjusting means for adjusting the first light irradiation means based on the image. For this reason, based on the measurement data of irradiation light, the position of the irradiation light of a 1st light irradiation means can be positioned correctly.

  In particular, according to the invention described in claim 8, the correcting means corrects the positions of the plurality of drawing heads of the second light irradiation means. For this reason, it is possible to appropriately correct the positions of the plurality of drawing heads of the second light irradiation means.

  In particular, according to the invention described in claim 9, the second light irradiation means draws the alignment mark used for alignment of the substrate as the reference pattern. For this reason, the substrate can be accurately aligned in the subsequent manufacturing process.

  According to the invention of claim 10, the drawing method includes a first step of detecting a shift amount of a relative position between a drawing position of a predetermined pattern and a drawing position of a reference pattern, and the detected shift amount. And a second step of correcting the relative position between the drawing position of the predetermined pattern and the drawing position of the reference pattern. For this reason, it is possible to draw a predetermined pattern and a reference pattern that defines a position of the pattern on the substrate with an appropriate positional relationship.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In addition, in each figure referred in the following description, in order to clarify the positional relationship and operation direction of each member, the common XYZ orthogonal coordinate system is attached | subjected.

<1. Configuration of pattern drawing apparatus>
1 and 2 are a side view and a top view showing a configuration of a pattern drawing apparatus 1 according to an embodiment of the present invention. The pattern drawing device 1 is a device for drawing a predetermined pattern on the upper surface of a glass substrate (hereinafter simply referred to as “substrate”) 9 for a color filter in a process of manufacturing a color filter of a liquid crystal display device. As shown in FIGS. 1 and 2, the pattern drawing apparatus 1 draws a regular pattern for a color filter for a stage 10 for holding a substrate 9, a driving unit 20 connected to the stage 10, and the color filter. Main head unit 30 and alignment drawing heads 41 to 44 for drawing an alignment mark used as a reference for the position of the regular pattern.

  The stage 10 has a flat outer shape, and is a holding unit for placing and holding the substrate 9 on the upper surface thereof in a horizontal posture. A plurality of suction holes (not shown) are formed on the upper surface of the stage 10. For this reason, when the substrate 9 is placed on the stage 10, the substrate 9 is fixedly held on the upper surface of the stage 10 by the suction pressure of the suction holes.

  In the vicinity of the two corners on the −Y side of the stage 10 (outside the substrate holding area), through holes 11 and 12 that penetrate the stage 10 vertically are formed. FIG. 3 is an enlarged top view of the through holes 11 and 12 formed in the vicinity of the corner of the stage 10. 4 is a longitudinal sectional view of the stage 10 taken along the line IV-IV in FIG. As shown in FIGS. 3 and 4, translucent plates 11 a and 12 a are attached to the upper portions of the through holes 11 and 12, respectively. The translucent plates 11a and 12a are provided with calibration marks CM1 and CM2, which are used as position measurement references in the calibration process described later. The calibration marks CM1 and CM2 are formed on the surfaces of the light transmitting plates 11a and 12a with a light shielding material.

  Calibration cameras 11b and 12b are installed in the through holes 11 and 12, respectively. The calibration cameras 11b and 12b are installed in the through holes 11 and 12 so as to face upward, and the centers of the calibration marks CM1 and CM2 are located at the center of each field of view (or at least within the field of view). It has been adjusted. Even when the stage 10 moves, the positional relationship between the calibration cameras 11b and 12b and the calibration marks CM1 and CM2 is constant and does not change.

  Returning to FIG. 1 and FIG. 2, the drive unit 20 moves the stage 10 in the main scanning direction (Y-axis direction), the sub-scanning direction (X-axis direction), and the rotation direction (rotation direction around the Z-axis). Mechanism. The drive unit 20 includes a rotation mechanism 21 that rotates the stage 10, a support plate 22 that rotatably supports the stage 10, a sub-scanning mechanism 23 that moves the support plate 22 in the sub-scanning direction, and a sub-scanning mechanism 23. A base plate 24 that supports the support plate 22 and a main scanning mechanism 25 that moves the base plate 24 in the main scanning direction.

  The rotation mechanism 21 includes a linear motor 21 a that includes a mover attached to the end portion on the −Y side of the stage 10 and a stator laid on the upper surface of the support plate 22. A rotation shaft 21 b is provided between the lower surface side of the center portion of the stage 10 and the support plate 22. For this reason, when the linear motor 21a is operated, the mover moves in the X-axis direction along the stator, and the stage 10 rotates within a predetermined angle range around the rotation shaft 21b on the support plate 22.

  The sub-scanning mechanism 23 includes a linear motor 23 a configured by a mover attached to the lower surface of the support plate 22 and a stator laid on the upper surface of the base plate 24. In addition, a pair of guide portions 23 b extending in the sub-scanning direction is provided between the support plate 22 and the base plate 24. For this reason, when the linear motor 23a is operated, the support plate 22 moves in the sub-scanning direction along the guide portion 23b on the base plate 24.

  The main scanning mechanism 25 has a linear motor 25 a composed of a mover attached to the lower surface of the base plate 24 and a stator laid on the base 60 of the apparatus 1. A pair of guide portions 25 b extending in the main scanning direction is provided between the base plate 24 and the base 60. For this reason, when the linear motor 25a is operated, the base plate 24 moves in the main scanning direction along the guide portion 25b on the base 60.

  As shown in FIG. 2, a posture detection unit 26 for detecting the posture of the stage 10 is provided on the −Y side of the stage 10. The attitude detection unit 26 includes a laser length measuring device 26a, and irradiates a plurality of length measuring laser beams L on the side surface on the -Y side of the stage 10 to thereby determine the distance between the laser length measuring device 26a and the stage 10. Measurement is performed for each laser beam L. Then, the posture detection unit 26 detects the posture (tilt) of the stage 10 based on a plurality of distances acquired by measurement. A control unit 50 (see FIG. 8), which will be described later, operates the rotation mechanism 21, the sub-scanning mechanism 23, and the main scanning mechanism 25 based on the information acquired from the posture detection unit 26, and corrects the posture of the stage 10. While moving the stage 10.

  FIG. 5 is a diagram showing an example of such posture control of the stage 10. When it is desired to move the stage 10 in the main scanning direction, if only the main scanning mechanism 25 is operated without performing correction, the stage 10 moves out of the strict main scanning direction due to a mechanical error of the main scanning mechanism 25. (The state of the chain line in FIG. 5). The driving unit 20 of the present embodiment detects such a shift of the stage 10 by the posture detection unit 26 described above, operates the rotation mechanism 21 and the sub-scanning mechanism 23 based on the detected information, and moves the posture of the stage 10. The stage 10 is accurately moved in the main scanning direction (corrected line state in FIG. 5).

  Returning to FIG. 1 and FIG. 2, the main head unit 30 draws a regular pattern for a color filter on the upper surface of the substrate 9 by irradiating the substrate 9 held on the stage 10 with pulsed light. Mechanism. That is, the main head unit 30 draws a regular pattern to be recorded as product specifications in the main drawing area 9a on the substrate 9 as shown in FIG. The main head unit 30 includes a frame 31 that is installed on the base 60 so as to straddle the stage 10 and the drive unit 20, and a plurality of optical heads 32 that are mounted on the frame 31 at equal intervals along the sub-scanning direction. And have. One laser oscillator 34 is connected to each optical head 32 via an illumination optical system 33. In addition, a laser driving unit 35 is connected to the laser oscillator 34. Therefore, when the laser driving unit 35 is operated, pulse light is oscillated from the laser oscillator 34, and the oscillated pulse light is introduced into each optical head 32 via the illumination optical system 33.

  In each optical head 32, a light emitting portion 36 for emitting the pulsed light introduced from the illumination optical system 33 downward and a light beam having a predetermined pattern by partially shielding the pulsed light are formed. Aperture unit 37 and a projection optical system 38 for irradiating the upper surface of the substrate 9 with the light beam. The pulsed light emitted from the emission unit 36 is partially shielded when passing through the aperture unit 37 and enters the projection optical system 38 as a light beam having a predetermined pattern. The regular light pattern is drawn on the photosensitive material (color resist) coated on the upper surface of the substrate 9 by irradiating the upper surface of the substrate 9 with the pulsed light that has passed through the projection optical system 38.

  The plurality of optical heads 32 are arranged at equal intervals (for example, at intervals of 200 mm) along the sub-scanning direction. When pulse light is irradiated from each optical head 32 while moving the stage 10 in the main scanning direction, a plurality of patterns are drawn on the upper surface of the substrate 9 with a predetermined exposure width (for example, 50 mm width) in the main scanning direction. The When the drawing in one main scanning direction is completed, the pattern drawing apparatus 1 moves the stage 10 by the exposure width in the sub-scanning direction, and moves the stage 10 in the main scanning direction again from each optical head 32. Irradiate pulsed light. As described above, the pattern drawing apparatus 1 repeats the drawing of the pattern in the main scanning direction a predetermined number of times (for example, four times) while shifting the substrate 9 in the sub-scanning direction by the exposure width of the optical head 32, thereby providing the substrate 9. A regular pattern for a color filter is formed on the entire upper surface.

  The pattern drawing apparatus 1 includes an optical head camera 27 for imaging pulsed light emitted from each optical head 32. The optical head camera 27 is movable in the sub-scanning direction along a guide rail 28 attached to the + Y side end of the base plate 24 via a bracket 29. When the optical head camera 27 is used, the base plate 24 is positioned so that the optical head camera 27 is positioned below the main head portion 30 (state shown in FIGS. 1 and 2). Then, the optical head camera 27 is moved in the sub-scanning direction along the guide rail 28, and the pulsed light emitted from each optical head 32 is imaged. For example, a linear motor is used as a drive mechanism for moving the optical head camera 27 on the guide rail 28.

  FIG. 7 is a view of the plurality of optical heads 32 as viewed from below (from the optical head camera 27 side). The optical head camera 27 images the pulsed light PL emitted from each optical head 32, and the line width of the pulsed light PL in the optical head 32, the pitch of each optical head 32, the distance between adjacent optical heads 32, Information such as the position of each optical head 32 in the main scanning direction and the amount of light of each pulsed light PL is acquired. And the acquired information is transmitted to the control part 50 (refer FIG. 8) mentioned later. The optical head camera 27 can be constituted by, for example, a CCD camera, but may be constituted by using a CCD camera and a light quantity sensor in combination.

  As conceptually shown in FIG. 7, each optical head 32 is connected to an actuator 39 that individually adjusts the position of the pulsed light PL emitted from each optical head 32. The actuator 39 can be realized, for example, as a mechanism that adjusts the position of the aperture unit 37 in the optical head 32 using a linear motor. Further, the actuator 39 can adjust the line width of the pulsed light PL by sliding the two aperture plates set up and down in the aperture unit 37 to adjust the width of the light transmitting region. . A control unit 50 (see FIG. 8), which will be described later, operates each actuator 39 based on information acquired from the optical head camera 27, and corrects the position and line width of the pulsed light PL emitted from each optical head 32. To do. Further, the control unit 50 adjusts the projection optical system 38 and the illumination optical system 33 based on the information acquired from the optical head camera 27, and sets the pitch and light amount of the pulsed light PL emitted from each optical head 32, respectively. to correct.

  1 and 2, the alignment drawing heads 41 to 44 are mechanisms for drawing alignment marks on the upper surface of the substrate 9 by irradiating the substrate 9 held on the stage 10 with pulsed light. is there. That is, the alignment drawing heads 41 to 44 draw the alignment marks AM1 to AM4 serving as a reference for defining the position of the regular pattern outside the main drawing area 9a on the substrate 9 as shown in FIG. To do.

  The alignment drawing heads 41, 42, 43, 44 are substantially above the positions where the alignment marks AM 1, AM 2, AM 3, AM 4 on the substrate 9 should be drawn in a state where the substrate 9 is held on the stage 10. Has been placed. As shown in FIG. 1, the alignment drawing heads 41, 42, 43, and 44 are connected to mercury lamps 41b, 42b, 43b, and 44b as light sources via optical fibers 41a, 42a, 43a, and 44a, respectively. . Therefore, when the mercury lamps 41b, 42b, 43b, 44b are turned on, the pulsed light emitted from each mercury lamp passes through the optical fibers 41a, 42a, 43a, 44a, respectively, and the alignment drawing heads 41, 42, 43, 44. Introduced in.

  Further, inside the alignment drawing heads 41, 42, 43, and 44, the pulsed light introduced from the optical fibers 41a, 42a, 43a, and 44a is partially shielded to be aligned with the alignment marks AM1, AM2, AM3, and AM4, respectively. Glass plates 41c, 42c, 43c, 44c for forming a corresponding light beam and projection optical systems 41d, 42d, 43d, 44d for irradiating the upper surface of the substrate 9 with the light beam are provided. The pulsed light introduced into each alignment drawing head 41, 42, 43, 44 is partially shielded when passing through the glass plates 41c, 42c, 43c, 44c, and the projection optical systems 41d, 42d, 43d, 44d. , The alignment marks AM1, AM2, AM3 and AM4 are drawn on the photosensitive material applied on the upper surface of the substrate 9.

  As conceptually shown in FIG. 2, drive mechanisms 41e, 42e, 43e, and 44e are connected to the alignment drawing heads 41, 42, 43, and 44, respectively. The drive mechanisms 41e, 42e, 43e, and 44e are realized by, for example, a configuration in which a drive shaft and a drive motor that are laid in the main scanning direction and the sub-scanning direction are combined, and the alignment drawing heads 41, 42, 43, and 44 are arranged. It can be moved within a predetermined range in the main scanning direction and the sub-scanning direction.

  Further, the pattern drawing apparatus 1 includes a control unit 50 in addition to the above configuration. FIG. 8 is a block diagram illustrating a connection configuration between the above-described units of the pattern drawing apparatus 1 and the control unit 50. As shown in FIG. 8, the control unit 50 includes the calibration cameras 11b and 12b, the linear motors 21a, 23a and 25a, the attitude detection unit 26, the optical head camera 27, the illumination optical system 33, and the laser driving unit 35. The projection optical system 38, the actuator 39, the mercury lamps 41b to 44b, the projection optical systems 41d to 44d, and the drive mechanisms 41e to 44e are electrically connected to control these operations. The control unit 50 is configured by, for example, a computer having a CPU and a memory, and controls the above-described units when the computer operates according to a program installed in the computer.

<2. Calibration process>
Next, a process (calibration process) for adjusting the relative positions of the optical head 32 and the alignment drawing heads 41 to 44 in the pattern drawing apparatus 1 having the above configuration will be described. The calibration process is executed prior to the drawing process when the drawing position of the optical head 32 or the alignment drawing heads 41 to 44 changes due to changes in drawing data or changes over time.

  9 to 11 are flowcharts showing the flow of calibration processing in the pattern drawing apparatus 1. 12 to 18 are diagrams showing states of the pattern drawing apparatus 1 at each stage of the calibration process. When performing the calibration process in the pattern drawing apparatus 1, first, the actuator 39 of each optical head 32 is operated based on the drawing data used for the next drawing process, and the irradiation position of the pulsed light PL of each optical head 32 is determined. Then, it is positioned at a substantially predetermined position (step S11).

  Next, the pattern drawing apparatus 1 operates the main scanning mechanism 25 to move the base plate 24 so that the optical head camera 27 is disposed below the main head unit 30. Then, while moving the optical head camera 27 along the guide rail 28 in the sub-scanning direction, the pulsed light PL emitted from each optical head 32 is imaged, the line width of the pulsed light PL in the optical head 32, each Information such as the pitch of the optical heads 32, the distance between adjacent optical heads 32, the position of each optical head 32 in the main scanning direction, and the amount of light of each pulsed light PL is acquired (step S12, state of FIG. 12).

  The pattern drawing apparatus 1 operates each actuator 39 based on the information acquired from the optical head camera 27 to correct the position and line width of the pulsed light PL emitted from each optical head 32. The pattern drawing apparatus 1 adjusts the projection optical system 38 and the illumination optical system 33 based on the information acquired from the optical head camera 27, and sets the pitch and light amount of the pulsed light PL emitted from each optical head 32. Each is corrected (step S13). Through the above steps S11 to S13, the position, line width, and amount of light of the pulsed light PL irradiated from each optical head 32 of the main head unit 30 are in an appropriate state, and the adjustment of the main head unit 30 itself is completed.

  Subsequently, the pattern drawing apparatus 1 operates the driving unit 20 to move the stage 10 so that the light transmitting plate 11a is disposed almost directly below the optical head 32 disposed on the most + X side (Step S14, State of FIG. 13). Then, the pulse light PL is irradiated from the optical head 32, and a calibration mark CM1 and a projection image of the pulse light PL are taken from the calibration camera 11b disposed below the light transmitting plate 11a (step S15).

  FIG. 19 is a diagram illustrating an example of a captured image of the calibration camera 11b in step S15. The calibration camera 11b measures how much the pulsed light PL in the captured image is deviated from the center of the calibration mark CM1 in each of the X-axis direction and the Y-axis direction, and pulses the calibration mark CM1. The positional deviation amount (ΔX1a, ΔY1a) of the light PL is acquired. The acquired information is transmitted from the calibration camera 11b to the control unit 50 and used for the calculation in step S27 described later.

  Subsequently, the pattern drawing apparatus 1 operates the driving unit 20 to move the stage 10 so that the light transmitting plate 12a is disposed almost directly below the optical head 32 disposed on the most −X side (step S16). , State of FIG. 14). Then, the pulsed light PL is irradiated from the optical head 32, and the calibration mark CM2 and the projected image of the pulsed light PL are taken from the calibration camera 12b disposed below the light transmitting plate 12a (step S17). In step S17, as in the example of FIG. 19, the positional deviation amount (ΔX1b, ΔY1b) of the pulsed light PL with respect to the calibration mark CM2 is acquired for each of the X-axis direction and the Y-axis direction, and the acquired information is calibrated. Is transmitted from the motion camera 12b to the control unit 50.

  Subsequently, the pattern drawing apparatus 1 operates the drive mechanisms 41e, 42e, 43e, and 44e based on the drawing data used for the next drawing process, and moves the alignment drawing heads 41, 42, 43, and 44 to almost predetermined positions. (Step S18). Then, the pattern drawing apparatus 1 operates the drive unit 20 to move the stage 10 so that the translucent plate 11a is disposed almost directly below the alignment drawing head 41 (step S19, state of FIG. 15). Then, pulse light is emitted from the alignment drawing head 41, and a calibration mark CM1 and a projected image of the pulse light are photographed from the calibration camera 11b disposed below the light transmitting plate 11a (step S20).

  FIG. 20 is a diagram illustrating an example of a captured image of the calibration camera 11b in step S20. The calibration camera 11b measures how much the pulsed light in the captured image is deviated from the center of the calibration mark CM1 in each of the X-axis direction and the Y-axis direction, and the pulsed light for the calibration mark CM1. The positional deviation amount (ΔX2a, ΔY2a) is acquired. The acquired information is transmitted from the calibration camera 11b to the control unit 50 and used for the calculation in step S27 described later.

  Subsequently, the pattern drawing apparatus 1 operates the driving unit 20 to move the stage 10 so that the light transmissive plate 11a is disposed almost directly below the alignment drawing head 42 (step S21, state of FIG. 16). Then, pulse light is emitted from the alignment drawing head 42, and a calibration mark CM1 and a projected image of the pulse light are photographed from the calibration camera 11b disposed below the light transmitting plate 11a (step S22). In step S22, as in the example of FIG. 20, the positional deviation amount (ΔX2b, ΔY2b) of the pulsed light with respect to the calibration mark CM1 is acquired for each of the X-axis direction and the Y-axis direction, and the acquired information is calibrated. It is transmitted from the camera 11b to the control unit 50.

  Subsequently, the pattern drawing apparatus 1 operates the driving unit 20 to move the stage 10 so that the light-transmitting plate 12a is disposed almost directly below the alignment drawing head 43 (step S23, state of FIG. 17). Then, pulse light is emitted from the alignment drawing head 43, and a calibration mark CM2 and a projected image of the pulse light are photographed from the calibration camera 12b disposed below the light transmitting plate 12a (step S24). In step S24, as in the example of FIG. 20, the positional deviation amount (ΔX2c, ΔY2c) of the pulsed light with respect to the calibration mark CM2 is acquired for each of the X axis direction and the Y axis direction, and the acquired information is calibrated. It is transmitted from the camera 12b to the control unit 50.

  Furthermore, the pattern drawing apparatus 1 operates the driving unit 20 to move the stage 10 so that the light transmitting plate 12a is disposed almost directly below the alignment drawing head 44 (step S25, state of FIG. 18). Then, pulse light is emitted from the alignment drawing head 44, and a calibration mark CM2 and a projected image of the pulse light are photographed from the calibration camera 12b disposed below the light transmitting plate 12a (step S26). In step S26, as in the example of FIG. 20, the positional deviation amount (ΔX2d, ΔY2d) of the pulsed light with respect to the calibration mark CM2 is acquired for each of the X-axis direction and the Y-axis direction, and the acquired information is calibrated. It is transmitted from the camera 12b to the control unit 50.

  That is, in steps S14 to S26 described above, the pattern drawing apparatus 1 acquires the following information (1) to (6) and stores these information in the control unit 50.

(1) Amount of positional deviation (ΔX1a, ΔY1a) with respect to the calibration mark CM1 of the pulsed light PL emitted from the optical head 32 arranged on the most + X side
(2) Amount of displacement (ΔX1b, ΔY1b) with respect to the calibration mark CM2 of the pulsed light PL irradiated from the optical head 32 arranged on the most −X side
(3) Amount of displacement (ΔX2a, ΔY2a) of the pulsed light emitted from the alignment drawing head 41 with respect to the calibration mark CM1
(4) Amount of positional deviation (ΔX2b, ΔY2b) of the pulsed light emitted from the alignment drawing head 42 with respect to the calibration mark CM1
(5) Amount of positional deviation (ΔX2c, ΔY2c) of the pulsed light emitted from the alignment drawing head 43 with respect to the calibration mark CM2
(6) Amount of positional deviation (ΔX2d, ΔY2d) of the pulsed light emitted from the alignment drawing head 44 with respect to the calibration mark CM2

  Thereafter, the controller 50 shifts the relative position between the irradiation position of the optical head 32 and the irradiation positions of the alignment drawing heads 41, 42, 43, 44 based on the information (1) to (6). Is calculated (step S27). That is, from the above information (1) and (3), the control unit 50 calculates the amount of deviation of the relative position between the irradiation position of the optical head 32 and the irradiation position of the alignment drawing head 41 by (ΔX2a, ΔY2a) − ( ΔX1a, ΔY1a). Further, the control unit 50 determines the amount of deviation of the relative position between the irradiation position of the optical head 32 and the irradiation position of the alignment drawing head 42 from the above information (1) and (4) (ΔX2b, ΔY2b) − ( ΔX1a, ΔY1a). Further, the control unit 50 calculates the amount of deviation of the relative position between the irradiation position of the optical head 32 and the irradiation position of the alignment drawing head 43 from the above information (2) and (5) (ΔX2c, ΔY2c) − ( ΔX1b, ΔY1b). Further, the control unit 50 determines the amount of deviation of the relative position between the irradiation position of the optical head 32 and the irradiation position of the alignment drawing head 44 from the above information (2) and (6) (ΔX2d, ΔY2d) − ( ΔX1b, ΔY1b).

  Then, the control unit 50 operates the drive mechanisms 41e, 42e, 43e, and 44e so as to cancel the shift amounts of these relative positions, and corrects the positions of the alignment drawing heads 41, 42, 43, and 44 ( Step S28). As a result, the irradiation position of the optical head 32 and the irradiation position of each alignment drawing head 41, 42, 43, 44 are in an appropriate positional relationship, and the pattern writing apparatus 1 determines the rules of the alignment marks AM1 to AM4 and the main drawing area 9a. The pattern can be drawn with an appropriate positional relationship.

  When the stage 10 is moved in the calibration process, the posture detection unit 26 detects the posture of the stage 10 (tilt around the Z axis) and moves the stage 10 while correcting the posture. Therefore, the stage 10 accurately moves in the main scanning direction and the sub-scanning direction, and the calibration marks CM1, CM2 on the stage 10 are positioned below the alignment drawing heads 41, 42, 43, 44 based on the drawing data. And the lower position of the optical head 32.

<3. Drawing process>
Next, a procedure for drawing a pattern on the upper surface of the substrate 9 in the pattern drawing apparatus 1 will be described.

  FIG. 21 is a flowchart showing the flow of the drawing process in the pattern drawing apparatus 1. When performing a drawing process in the pattern drawing apparatus 1, first, the substrate 9 is placed on the upper surface of the stage 10 (step S31). The substrate 9 is adsorbed by a plurality of suction holes formed on the upper surface of the stage 10 and fixedly held on the upper surface of the stage 10.

  Next, the pattern drawing apparatus 1 operates the driving unit 20 to move the stage 10 so that the four corners of the substrate 9 are arranged below the alignment drawing heads 41 to 44. Then, the pattern drawing apparatus 1 irradiates pulse light from each alignment drawing head 41, 42, 43, 44 by turning on the mercury lamps 41 b, 42 b, 43 b, 44 b, and alignment marks AM 1 at the four corners of the upper surface of the substrate 9. , AM2, AM3, AM4 are drawn (step S32).

  Subsequently, the pattern drawing apparatus 1 operates the drive unit 20 based on the drawing data, and moves the substrate 9 so that the drawing start position of the main drawing area 9 a is arranged below the main head unit 30. The pattern writing apparatus 1 irradiates the upper surface of the substrate 9 with regularity by irradiating the pulse light PL from the plurality of optical heads 32 of the main head unit 30 while moving the stage 10 in the main scanning direction and the sub-scanning direction. A pattern is drawn (step S33). That is, the pattern drawing apparatus 1 repeats pattern drawing in the main scanning direction a predetermined number of times while shifting the substrate 9 in the sub-scanning direction by the exposure width of the optical head 32, and regularity in the main drawing area 9 a of the substrate 9. Draw a pattern. Thereafter, the substrate 9 is unloaded from the upper surface of the stage 10 of the pattern drawing apparatus 1 (step S34), and the drawing process for one substrate 9 is completed.

  The pattern drawing apparatus 1 according to the present embodiment measures the irradiation position of the optical head 32 and the irradiation positions of the alignment drawing heads 41, 42, 43, and 44 in the calibration process described above, and the alignment drawing heads 41, 42, By correcting the positions of 43 and 44, the relative positional relationship between the optical head 32 and the alignment drawing heads 41, 42, 43, and 44 is optimized. For this reason, in step S33 of the drawing process, a regular pattern can be drawn at appropriate positions with respect to the alignment marks AM1 to AM4. Therefore, the alignment marks AM1 to AM4 and the regular pattern are recorded on the substrate 9 with an appropriate positional relationship.

<4. Modification>
As mentioned above, although one Embodiment of this invention was described, this invention is not limited to said example. For example, in the above-described calibration process, the pulsed light PL of the optical head 32 arranged on the most + X side is photographed by the calibration camera 11b (step S15), and then the optical head 32 arranged on the most -X side. Although the pulsed light PL is photographed by the calibration camera 12b (step S17), these photographing operations are not necessarily performed separately. For example, the distance between the optical head 32 disposed on the most + X side and the optical head 32 disposed on the most -X side is equal to the distance between the calibration cameras 11b and 12b, and the photographing operation in step S15 is performed. And the shooting operation in step S17 may be executed simultaneously.

  In the pattern drawing apparatus 1 described above, the laser oscillator 34 is used as the light source of the optical head 32, but another light source such as an LED or a mercury lamp may be used as the light source of the optical head 32. In the pattern drawing apparatus 1, mercury lamps 41b, 42b, 43b, and 44b are used as light sources for the alignment drawing heads 41, 42, 43, and 44. Other light sources such as a laser oscillator and an LED may be used as the light source. In the pattern drawing apparatus 1 described above, the optical head 32 and the alignment drawing heads 41, 42, 43, and 44 are separately arranged. However, they may be arranged in the same casing.

  In the pattern drawing apparatus 1 described above, the stage 10 is moved with respect to the stationary optical head 32 and the alignment drawing heads 41, 42, 43, and 44 to perform drawing processing. 10, the drawing process may be performed by moving the optical head 32 and the alignment drawing heads 41, 42, 43, and 44. That is, the optical head 32 and the alignment drawing heads 41, 42, 43, 44 and the stage 10 may be configured to move relative to each other.

  In the pattern drawing apparatus 1 described above, the optical head 32 and the alignment drawing heads 41, 42, 43, and 44 emit pulse light equivalent to that during the drawing process during the calibration process. You may make it irradiate with specific irradiation light. For example, the optical head 32 and the alignment drawing heads 41, 42, 43, and 44 may irradiate irradiation light with a light amount and irradiation time suitable for photographing with the calibration cameras 11b and 12b during the calibration process.

  In the pattern drawing apparatus 1 described above, the alignment marks AM1 to AM4 are drawn at the four corners of the substrate 9 by the four alignment drawing heads 41, 42, 43 and 44. , 44 are not limited to the above example. For example, the drawing apparatus of the present invention may have two alignment drawing heads as the second light irradiation means. Further, the alignment mark recorded by the alignment drawing head may have a shape other than the cross shape as described above. Furthermore, the “reference pattern” of the present invention is not limited to the alignment mark used for alignment of the substrate 9 but may be any pattern that requires an accurate positional relationship with the regular pattern. For example, it may be a mark or the like used as a reference point for regular pattern inspection and measurement in the subsequent manufacturing process of the substrate 9.

  Moreover, although the said pattern drawing apparatus 1 was processing the glass substrate 9 for color filters, the pattern drawing apparatus and pattern drawing method of this invention are semiconductor substrates, a printed circuit board, a glass substrate for plasma display apparatuses, etc. Other substrates may be processed.

It is a side view of the pattern drawing apparatus which concerns on one Embodiment of this invention. It is a top view of the pattern drawing apparatus which concerns on one Embodiment of this invention. It is an enlarged top view of the through-hole formed in the corner | angular part vicinity of a stage. It is the longitudinal cross-sectional view which cut | disconnected the stage by the IV-IV line of FIG. It is the figure which showed the example of the attitude | position control of a stage. It is the figure which showed the example of the main drawing area on a board | substrate, and the alignment mark. It is the figure which looked at a plurality of optical heads from the lower part. It is the block diagram which showed the connection structure between a control part and each part. It is the flowchart which showed the flow of the calibration process. It is the flowchart which showed the flow of the calibration process. It is the flowchart which showed the flow of the calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the state of the pattern drawing apparatus in a calibration process. It is the figure which showed the example of the picked-up image of a calibration camera. It is the figure which showed the example of the picked-up image of a calibration camera. It is the flowchart which showed the flow of the drawing process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pattern drawing apparatus 9 Board | substrate 10 Stage 11a, 12a Translucent board 11b, 12b Calibration camera 20 Drive part 26 Posture detection part 27 Optical head camera 30 Main head part 32 Optical head 39 Actuator 41, 42, 43, 44 Alignment drawing Heads 41e, 42e, 43e, 44e Drive mechanism 50 Control unit 9 Substrate 9a Main drawing area AM1, AM2, AM3, AM4 Alignment mark CM1, CM2 Calibration mark PL Pulse light

Claims (10)

A drawing apparatus for drawing a pattern on a photosensitive material formed on a substrate,
A stage for holding a substrate;
First light irradiation means for drawing a predetermined pattern by irradiating light on the upper surface of the substrate held on the stage;
A second light irradiation means for drawing a reference pattern serving as a reference for defining the position of the predetermined pattern by irradiating light on the upper surface of the substrate held on the stage;
A stage driving unit that relatively moves the stage and the first light irradiation unit and the second light irradiation unit;
A deviation amount detection means for detecting a deviation amount of a relative position between the first light irradiation means and the second light irradiation means;
Correction means for correcting a relative position between the first light irradiation means and the second light irradiation means based on the deviation amount detected by the deviation amount detection means;
A drawing apparatus comprising: The drawing apparatus according to claim 1,
A calibration camera for photographing the irradiation light of the first light irradiation means and the second light irradiation means;
The drawing apparatus, wherein the shift amount detection unit detects a shift amount of a relative position between the first light irradiation unit and the second light irradiation unit based on a photographed image of the calibration camera. The drawing apparatus according to claim 2,
The calibration camera is fixedly installed on the stage,
The stage driving unit moves the stage, the first light irradiation unit, and the second light irradiation unit relative to each other to thereby move the irradiation position of the first light irradiation unit and the irradiation position of the second light irradiation unit. A drawing apparatus, wherein the calibration camera is moved between the two. The drawing apparatus according to claim 3,
It further comprises posture detection means for detecting the posture of the stage,
The drawing apparatus, wherein the stage driving unit moves the stage while correcting the posture of the stage based on information detected by the posture detection means. The drawing apparatus according to claim 3 or 4, wherein:
The calibration camera photographs the first light irradiation means and the second light irradiation means via a calibration mark formed on the stage,
The deviation amount detection means detects a relative position deviation between the first light irradiation means and the second light irradiation means based on a deviation amount of the first light irradiation means and the second light irradiation means with respect to the calibration mark. A drawing apparatus characterized by detecting a quantity. A drawing apparatus according to any one of claims 1 to 5,
The drawing apparatus further comprising positioning means for positioning the position of the irradiation light of the first light irradiation means at a predetermined position. The drawing apparatus according to claim 6,
The positioning means includes
A first light irradiating means camera for imaging the irradiation light of the first light irradiating means from below;
Adjusting means for adjusting the first light irradiating means based on an image acquired by the first light irradiating means camera;
A drawing apparatus comprising: A drawing apparatus according to any one of claims 1 to 7,
The second light irradiation means has a plurality of drawing heads,
The drawing device, wherein the correction unit corrects the position of each of the plurality of drawing heads. A drawing apparatus according to any one of claims 1 to 8,
The drawing apparatus, wherein the second light irradiation means draws an alignment mark used for substrate alignment as the reference pattern. A drawing method for drawing a predetermined pattern and a reference pattern for defining a position of the predetermined pattern on a surface of the substrate by irradiating light to a photosensitive material formed on the substrate,
A first step of detecting a shift amount of a relative position between a drawing position of the predetermined pattern and a drawing position of the reference pattern;
A second step of correcting a relative position between the drawing position of the predetermined pattern and the drawing position of the reference pattern based on the shift amount;
A drawing method comprising:

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