JP2008051866A - Pattern drawing device, pattern drawing method and substrate processing system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pattern drawing device and a pattern drawing method capable of drawing a pattern in an appropriate position in each region even when a reference pattern is individually formed in a plurality of regions on a substrate surface. <P>SOLUTION: The pattern drawing device 1 picks up images of not only alignment marks formed on four corners of a substrate 9 but a plurality of alignment marks formed in each exposure region and extracts coordinates of the marks. The device calculates a displacement amount and an inclination angle of each exposure region based on the coordinates of each alignment mark and draws a pattern on the upper face of the substrate 9 while correcting a drawing position according to the calculated displacement amount and the inclination angle. Even when a black matrix has displacement or inclination in each exposure region, the pattern can be drawn in an appropriate position within the black matrix in each exposure region. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a photosensitive material on a substrate such as a color filter substrate, a glass substrate for a flat panel display (FDP) such as a liquid crystal display device or a plasma display device, a semiconductor substrate, or a printed circuit board. The present invention relates to a pattern drawing apparatus, a pattern drawing method, and a substrate processing system.

  2. Description of the Related Art Conventionally, in a substrate manufacturing process, a pattern drawing apparatus that draws a predetermined pattern on the surface of a substrate by irradiating light onto the surface of the substrate coated with a photosensitive material has been used. A conventional pattern drawing apparatus includes a stage that moves while holding the substrate in a horizontal posture, and an optical head that irradiates a predetermined pattern of light onto the upper surface of the substrate, and irradiates light from the optical head while moving the substrate. Thus, a predetermined pattern is drawn on the upper surface of the substrate.

  The configuration of a conventional pattern drawing apparatus is disclosed in Patent Document 1, for example.

Japanese Patent Laid-Open No. 5-150175

  For example, a black matrix and a plurality of alignment marks for positioning are formed in advance on the surface of, for example, a color filter substrate to be processed in the pattern drawing apparatus by batch exposure processing or the like. The black matrix is a grid-like black frame surrounding the three color pixels of red (R), green (G), and blue (B) of the color filter. Then, the conventional pattern drawing apparatus detects the positions of the alignment marks formed at the four corners of the substrate, corrects the position and inclination of the substrate based on the positional information, and responds to the pixels within the black matrix frame. The predetermined pattern was drawn.

  However, in recent years, in order to manufacture a plurality of color filters from a single substrate, a black matrix may be individually exposed in a plurality of regions on the substrate surface. In such a case, there is a possibility that the position of the black matrix is slightly shifted or inclined for each exposure region. However, in the above conventional method, the drawing position of the optical head is determined based only on the alignment marks formed at the four corners of the substrate. For this reason, the pattern is not necessarily drawn at the optimum position in all the exposure areas, and there is a possibility that a deviation occurs between the black matrix and the drawn pattern in a part of the exposure areas.

  The present invention has been made in view of such circumstances, and even when a reference pattern such as a black matrix is individually formed in a plurality of regions on the substrate surface, the pattern is formed at appropriate positions in each region. An object is to provide a pattern drawing apparatus, a pattern drawing method, and a substrate processing system.

  In order to solve the above problems, the invention according to claim 1 is a pattern drawing apparatus for drawing a predetermined pattern on a photosensitive material on a substrate having a plurality of reference patterns individually formed in a plurality of regions, A substrate support unit for supporting the substrate, a light irradiation unit for irradiating the surface of the substrate supported by the substrate support unit with the predetermined pattern of light, and moving the substrate support unit relative to the light irradiation unit Moving means, position detecting means for detecting the positions of the plurality of reference patterns for each region on the substrate supported by the substrate support portion, and the plurality of reference patterns detected by the position detecting means. Correction means for correcting the light irradiation position by the light irradiation unit based on the position.

  The invention according to claim 2 is the pattern drawing apparatus according to claim 1, wherein the position detecting unit is configured to use the plurality of reference points based on a plurality of positioning marks formed for each of the plurality of regions. The position of the pattern is detected.

  The invention according to claim 3 is the pattern drawing apparatus according to claim 1 or 2, wherein the light irradiation unit emits light toward the surface of the substrate, and is emitted from the emission unit. An aperture portion that partially shields the emitted light to form the predetermined pattern of light, and the correction means corrects the light irradiation position by adjusting the position of the aperture portion. Features.

  The invention according to claim 4 is the pattern drawing apparatus according to claim 3, wherein the light irradiation section has a plurality of light irradiation heads, and the correction means is provided in each of the plurality of light irradiation heads. It is characterized in that the position of the aperture part is adjusted individually.

  The invention according to claim 5 is the pattern drawing apparatus according to any one of claims 1 to 4, wherein the correction unit is configured to detect the reference pattern from a standard position for each of the plurality of regions. A positional deviation amount is calculated, and a light irradiation position is corrected based on an average value thereof.

  The invention according to claim 6 is the pattern drawing apparatus according to any one of claims 1 to 4, wherein the correction unit is configured to detect the reference pattern from a standard position for each of the plurality of regions. A positional deviation amount is calculated, and an irradiation position of light is individually corrected for each of the plurality of regions based on the calculated positional deviation amount.

  The invention according to claim 7 is the pattern drawing apparatus according to claim 6, wherein the correction unit is configured to emit light by the light irradiation unit immediately before each of the plurality of regions on the substrate reaches a drawing position. The irradiation position is adjusted.

  The invention according to an eighth aspect is the pattern drawing apparatus according to any one of the first to fourth aspects, wherein the correction unit is configured to detect a plurality of reference patterns from a standard position for each of the plurality of regions. An inclination angle is calculated, and the irradiation position of light is continuously corrected based on the calculated inclination angle.

  The invention according to claim 9 is a pattern drawing method for drawing a predetermined pattern on a photosensitive material on a substrate having a plurality of reference patterns individually formed in a plurality of regions, wherein the substrate is placed on a predetermined support portion. A first step of supporting, a second step of detecting positions of the plurality of reference patterns for each of the regions on the substrate supported by the substrate support portion, and the detection of the second step. And a third step of irradiating the substrate on the support with a predetermined pattern of light while correcting the light irradiation position based on the positions of the plurality of reference patterns.

  The invention according to claim 10 is the pattern drawing method according to claim 9, wherein the inclination of the substrate supported by the support portion in the horizontal plane is between the first step and the second step. The method further includes a fourth step of correcting the above.

  According to an eleventh aspect of the present invention, there is provided a pattern drawing apparatus for drawing a predetermined pattern on a photosensitive material on a substrate having a plurality of reference patterns individually formed in a plurality of regions, and a stage before processing in the pattern drawing apparatus A substrate processing system comprising a preprocessing device for performing a preprocess on a substrate, wherein the preprocessing device detects a position of the plurality of reference patterns for each of the regions on the substrate. The pattern writing apparatus includes: a substrate support unit that supports a substrate; a light irradiation unit that irradiates light of the predetermined pattern onto a surface of the substrate supported by the substrate support unit; and the light irradiation unit. The light irradiation position by the light irradiation unit is determined based on the position of the plurality of reference patterns detected by the position detection unit and the moving unit that relatively moves the substrate support unit. A positive correcting means, that it has a the features.

  According to invention of Claims 1-8, a pattern drawing apparatus is a board | substrate support part which supports a board | substrate, The light irradiation part which irradiates the light of a predetermined pattern on the surface of the board | substrate supported by the board | substrate support part, A moving means for moving the substrate support portion relative to the light irradiation portion, a position detection means for detecting the positions of a plurality of reference patterns for each region on the substrate supported by the substrate support portion, and a position detection Correction means for correcting the light irradiation position by the light irradiation unit based on the positions of the plurality of reference patterns detected by the means. For this reason, even when the reference pattern has a positional deviation or inclination for each region on the substrate, the pattern can be drawn at an appropriate position in each region.

  In particular, according to the second aspect of the present invention, the position detecting means detects the positions of the plurality of reference patterns based on the plurality of positioning marks formed for each of the plurality of regions. For this reason, the position of the reference pattern can be detected easily and accurately.

  In particular, according to the invention described in claim 3, the light irradiating unit emits light toward the surface of the substrate, and the light emitted from the emitting unit is partially shielded to have a predetermined pattern. The correction unit corrects the light irradiation position by adjusting the position of the aperture unit. For this reason, the light irradiation position by the light irradiation unit can be easily corrected.

  In particular, according to the invention described in claim 4, the light irradiation unit has a plurality of light irradiation heads, and the correction unit individually adjusts the position of the aperture unit provided in each of the plurality of light irradiation heads. . For this reason, even when the positional deviation amount and the inclination angle are different for each region on the substrate, it is possible to appropriately correct the light irradiation position according to the positional deviation amount and the inclination angle of each region.

  In particular, according to the invention described in claim 5, the correction means calculates the amount of positional deviation from the standard position of the plurality of reference patterns for each of the plurality of regions, and determines the irradiation position of the light based on the average value thereof. to correct. For this reason, it can prevent that the irradiation position of light shifts | deviates large in a one part area | region.

  In particular, according to the invention described in claim 6, the correction unit calculates the amount of positional deviation from the standard position of the plurality of reference patterns for each of the plurality of regions, and the plurality of regions based on the calculated amount of positional deviation. The light irradiation position is corrected individually for each time. For this reason, a pattern can be drawn at a more appropriate position in all regions on the substrate.

  In particular, according to the seventh aspect of the present invention, the correcting unit adjusts the light irradiation position by the light irradiation unit immediately before each of the plurality of regions on the substrate reaches the drawing position. For this reason, the irradiation position of light can be adjusted using the position where the pattern is not drawn on the substrate.

  In particular, according to the invention described in claim 8, the correction means calculates the tilt angle from the standard position of the plurality of reference patterns for each of the plurality of regions, and determines the light irradiation position based on the calculated tilt angle. Correct continuously. For this reason, even if the reference pattern is formed to be inclined in a partial region on the substrate, the pattern can be drawn while correcting the light irradiation position along the inclination.

  According to the invention described in claim 9, the pattern drawing method includes a first step of supporting the substrate on a predetermined support portion and a plurality of regions for each region on the substrate supported by the substrate support portion. A second step of detecting the position of the reference pattern, and correcting the light irradiation position based on the positions of the plurality of reference patterns detected in the second step, and a predetermined pattern of light on the substrate on the support portion And a third step of irradiating. For this reason, even when the reference pattern has a positional deviation or inclination for each region on the substrate, the pattern can be drawn at an appropriate position in each region.

  In particular, according to the invention described in claim 10, the pattern drawing method includes a fourth method of correcting the inclination of the substrate supported by the support portion in the horizontal plane between the first step and the second step. The method further includes a step. For this reason, it is possible to reliably and accurately detect the positions of the plurality of reference patterns in the second step.

  According to the invention described in claim 11, the pretreatment apparatus has position detection means for detecting the positions of a plurality of reference patterns for each region on the substrate, and the pattern drawing apparatus supports the substrate. A substrate support unit, a light irradiation unit for irradiating a surface of the substrate supported by the substrate support unit with a predetermined pattern of light, a moving means for moving the substrate support unit relative to the light irradiation unit, and position detection Correction means for correcting the light irradiation position by the light irradiation unit based on the positions of the plurality of reference patterns detected by the means. For this reason, even when the reference pattern has a positional deviation or inclination for each region on the substrate, the pattern can be drawn at an appropriate position in each region.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In addition, in each figure referred in the following description, in order to clarify the positional relationship and operation direction of each member, the common XYZ orthogonal coordinate system is attached | subjected.

<1. Configuration of drawing apparatus>
1 and 2 are a side view and a top view showing a configuration of a pattern drawing apparatus 1 according to an embodiment of the present invention. The pattern drawing device 1 is a device for drawing a predetermined pattern on the upper surface of a glass substrate (hereinafter simply referred to as “substrate”) 9 for a color filter in a process of manufacturing a color filter of a liquid crystal display device. As shown in FIGS. 1 and 2, the pattern drawing apparatus 1 includes a stage 10 for holding a substrate 9, a drive unit 20 coupled to the stage 10, a plurality of optical heads 30, and an imaging unit 40. It has.

  The stage 10 has a flat outer shape, and is a holding unit for placing and holding the substrate 9 on the upper surface thereof in a horizontal posture. A plurality of suction holes (not shown) are formed on the upper surface of the stage 10. For this reason, when the substrate 9 is placed on the stage 10, the substrate 9 is fixedly held on the upper surface of the stage 10 by the suction pressure of the suction holes.

  The drive unit 20 is a drive mechanism for moving the stage 10 in the main scanning direction (Y-axis direction), the sub-scanning direction (X-axis direction), and the rotation direction (rotation direction around the Z-axis). The drive unit 20 includes a rotation mechanism 21 that rotates the stage 10, a support plate 22 that rotatably supports the stage 10, a sub-scanning mechanism 23 that moves the support plate 22 in the sub-scanning direction, and a sub-scanning mechanism 23. A base plate 24 that supports the support plate 22 and a main scanning mechanism 25 that moves the base plate 24 in the main scanning direction.

  The rotation mechanism 21 includes a linear motor 21 a that includes a mover attached to the end portion on the −Y side of the stage 10 and a stator laid on the upper surface of the support plate 22. A rotation shaft 21 b is provided between the lower surface side of the center portion of the stage 10 and the support plate 22. For this reason, when the linear motor 21a is operated, the mover moves in the X-axis direction along the stator, and the stage 10 rotates within a predetermined angle range around the rotation shaft 21b on the support plate 22.

  The sub-scanning mechanism 23 includes a linear motor 23 a configured by a mover attached to the lower surface of the support plate 22 and a stator laid on the upper surface of the base plate 24. In addition, a pair of guide portions 23 b extending in the sub-scanning direction is provided between the support plate 22 and the base plate 24. For this reason, when the linear motor 23a is operated, the support plate 22 moves in the sub-scanning direction along the guide portion 23b on the base plate 24.

  The main scanning mechanism 25 has a linear motor 25 a composed of a mover attached to the lower surface of the base plate 24 and a stator laid on the base 60 of the apparatus 1. A pair of guide portions 25 b extending in the main scanning direction is provided between the base plate 24 and the base 60. For this reason, when the linear motor 25a is operated, the base plate 24 moves in the main scanning direction along the guide portion 25b on the base 60.

  The plurality of optical heads 30 are mechanisms for irradiating a predetermined pattern of pulsed light onto the upper surface of the substrate 9 held on the stage 10. A frame 31 is installed on the base 60 so as to straddle the stage 10 and the drive unit 20, and the plurality of optical heads 30 are mounted on the frame 31 at equal intervals along the sub-scanning direction. . One laser oscillator 33 is connected to each optical head 30 via an illumination optical system 32. The laser oscillator 34 is connected to the laser oscillator 33. Therefore, when the laser driving unit 34 is operated, pulse light is oscillated from the laser oscillator 33, and the oscillated pulse light is transmitted into each optical head 30 via the illumination optical system 32.

  In each optical head 30, an emission part 35 for emitting the pulsed light transmitted from the illumination optical system 32 downward and a light beam having a predetermined pattern by partially shielding the pulsed light are formed. Aperture unit 36, and a projection optical system 37 for irradiating the upper surface of the substrate 9 with the light beam. The pulsed light emitted from the emission unit 35 is partially shielded when passing through the aperture unit 36 and enters the projection optical system 37 as a light beam having a predetermined pattern. Then, by irradiating the upper surface of the substrate 9 with the pulsed light that has passed through the projection optical system 37, a predetermined pattern is drawn on the photosensitive material (color resist) applied on the upper surface of the substrate 9.

  FIG. 3 is a top view showing the configuration of the aperture unit 36. The aperture unit 36 has a function of adjusting the position of the first aperture AP1 in the horizontal plane while holding the first aperture AP1 which is a glass plate on which a predetermined light shielding pattern is formed. In the aperture unit 36, the + X side and −X side ends of the first aperture AP1 are held by a pair of holding portions 36a. Further, the pair of holding portions 36a is connected to a first drive portion 36b laid along the main scanning direction. For this reason, when the first drive unit 36b is operated, the pair of holding units 36a and the first aperture AP1 move together in the main scanning direction. In addition, the 1st drive part 36b can be comprised by a linear motor, for example.

  A pair of guide rails 36c extending in the sub-scanning direction and a second drive unit 36d configured by a linear motor or the like are provided below the first drive unit 36b. For this reason, when the second drive unit 36d is operated, the first drive unit 36b, the holding unit 36a, and the first aperture AP1 move together in the sub-scanning direction. In this manner, the aperture unit 36 moves the first aperture AP1 by operating the first drive unit 36b and the second drive unit 36d, and adjusts the position of the first aperture AP1 in the main scanning direction and the sub-scanning direction. be able to.

  A plurality of three types of slots SL1, SL2, and SL3 having different sizes are arranged on the first aperture AP1. The plurality of slots SL1, the plurality of slots SL2, and the plurality of slots SL3 are each arranged in one row in the sub-scanning direction to form a slot group, and these slot groups are arranged in the main scanning direction. Yes. The aperture unit 36 can arrange one of the three slot groups in the irradiation region LA (see FIG. 4) of the pulsed light by adjusting the position of the first aperture AP1 in the main scanning direction. The aperture unit 36 can adjust the projection position of the pattern on the substrate 9 by precisely displacing the positions of the first aperture AP1 in the main scanning direction and the sub-scanning direction.

  In addition, a second aperture AP2 for adjusting the width of the pattern projected by the first aperture AP1 is provided above the first aperture AP1. FIG. 4 is a top view showing the configuration of the second aperture AP2 and its holding mechanism. As shown in FIG. 4, the + Y side and −Y side ends of the second aperture AP2 are held by the pair of holding portions 36e. The pair of holding portions 36e are connected to a third drive portion 36f laid along the sub-scanning direction. For this reason, when the third drive unit 36f is operated, the pair of holding units 36e and the second aperture AP2 move together in the sub-scanning direction. Note that the third drive unit 36f can be configured by, for example, a linear motor.

  A plurality of slots SL4, SL5, SL6 corresponding to the plurality of slots SL1, SL2, SL3 on the first aperture AP1 are formed on the second aperture AP2. The first aperture is positioned so that the plurality of slots SL3 of the first aperture are arranged at the light irradiation position LA, and the slot SL3 on the first aperture AP1 and the slot SL6 on the second aperture AP2 are partially When the second aperture AP2 is positioned so as to overlap (state of FIG. 4) and the pulsed light is irradiated from above the second aperture AP2, the pulsed light passes only in the portion where the slot SL3 and the slot SL6 overlap, and the substrate 9 A pattern as shown in FIG. 5 is projected on the upper surface. Further, when the relative position of the second aperture AP2 in the sub-scanning direction with respect to the first aperture AP1 is adjusted, the width of the pattern projected on the substrate 9 in the sub-scanning direction is adjusted.

  As shown in FIG. 6, when the second aperture AP2 is moved largely in the sub-scanning direction, a part of the plurality of slots SL3 on the first aperture AP1 is completely shielded by the light shielding portion of the second aperture AP2. The When pulsed light is irradiated from above the second aperture AP2 in this state, a pattern as shown in FIG. As described above, the second aperture AP2 also has a function of adjusting the pattern projection range in the sub-scanning direction. When the first aperture AP1 is displaced in the main scanning direction or the sub-scanning direction in order to adjust the projection position of the pattern on the substrate 9, the second aperture AP2 holds the relative position with respect to the first aperture. Meanwhile, it moves following the first aperture AP2.

  1 and 2, the plurality of optical heads 30 are arranged at equal intervals (for example, at a pitch of 200 mm) along the sub-scanning direction. When pulse light is irradiated from each optical head 30 while moving the stage 10 in the main scanning direction, a plurality of patterns are drawn on the upper surface of the substrate 9 with a predetermined exposure width (for example, 50 mm width) in the main scanning direction. The When one drawing in the main scanning direction is completed, the pattern drawing apparatus 1 moves the stage 10 by the exposure width in the sub-scanning direction, and again moves the stage 10 in the main scanning direction, and pulses from each optical head 30. Irradiate light. As described above, the pattern drawing apparatus 1 repeats the drawing of the pattern in the main scanning direction a predetermined number of times (for example, four times) while shifting the substrate 9 in the sub-scanning direction by the exposure width of the optical head 30. A pattern for a color filter is formed on the entire surface.

  The imaging unit 40 is a mechanism for imaging an alignment mark AM (see FIG. 9) formed in advance on the upper surface of the substrate 9. The imaging unit 40 includes four alignment cameras 41 to 44. Each of the alignment cameras 41 to 44 is positioned almost directly above the alignment marks AM formed at the four corners of the substrate 9 when the substrate 9 is disposed at the alignment position (the positions in FIGS. 1 and 2). is set up. The pattern drawing apparatus 1 can acquire the coordinates of the alignment marks AM formed at the four corners of the substrate 9 by operating the alignment cameras 41 to 44 while placing the substrate 9 at the alignment position. it can. In addition, the pattern drawing apparatus 1 operates a plurality of alignment cameras 41 and 43 while moving the substrate 9 in the main scanning direction, so that a plurality of side surfaces on the + X side and −X side of the substrate 9 are formed. The alignment marks AM can be imaged to obtain their coordinates.

  Further, the pattern drawing apparatus 1 includes a control unit 50 in addition to the above configuration. FIG. 8 is a block diagram illustrating a connection configuration between the above-described units of the pattern drawing apparatus 1 and the control unit 50. As shown in FIG. 8, the control unit 50 includes the linear motors 21a, 23a, and 25a, the laser drive unit 34, the first drive unit 36b, the second drive unit 36d, the third drive unit 36f, and the alignment camera 41. To 44 and controls these operations. The control unit 50 is configured by, for example, a computer having a CPU and a memory, and controls the above-described units when the computer operates according to a program installed in the computer.

<2. Pattern drawing procedure>
Next, a procedure for drawing a pattern on the upper surface of the substrate 9 in the pattern drawing apparatus 1 having the above configuration will be described. A plurality of black matrices (reference patterns) BM are formed in advance on the upper surface of the substrate 9 to be processed in the pattern drawing apparatus 1 as illustrated in FIG. The plurality of black matrices BM are formed by individually exposing a plurality of regions AR on the upper surface of the substrate 9, and an alignment mark AM is formed on the upper surface of the substrate 9 for each exposure region AR. The pattern drawing apparatus 1 draws a predetermined pattern within the frame of such a black matrix BM.

  FIG. 10 is a flowchart showing the flow of the drawing process in the pattern drawing apparatus 1. When performing a drawing process in the pattern drawing apparatus 1, first, the substrate 9 is placed on the upper surface of the stage 10 (step S1). The substrate 9 is adsorbed by a plurality of suction holes formed on the upper surface of the stage 10 and fixedly held on the upper surface of the stage 10. Next, the pattern drawing apparatus 1 corrects the inclination (angle shift around the z axis) of the substrate 9 held on the stage 10 in the horizontal plane (step S2).

  FIG. 11 is a flowchart showing details of the operation in step S2. In step S2, the pattern writing apparatus 1 first operates the linear motors 23a and 25a to move the stage 10 and the substrate 9 to the alignment position (step S21). At the alignment position, among the alignment marks AM formed on the upper surface of the substrate 9, four alignment marks AM formed at the four corners of the substrate 9 are positioned almost directly below the alignment cameras 41 to 44, respectively. In this state, the alignment cameras 41 to 44 capture the alignment marks AM formed at the four corners of the substrate 9 and transfer the acquired images to the control unit 50 (step S22).

  The control unit 50 extracts the coordinates of the alignment marks AM formed at the four corners of the substrate 9 from the images transferred from the alignment cameras 41 to 44, and calculates the tilt angle and the expansion / contraction amount of the substrate 9 based on these coordinates. (Step S23). Then, the control unit 50 operates the linear motor 21a so as to correct the calculated inclination angle of the substrate 9, and rotates the substrate 9 about the rotation shaft 21b (step S24). Thereby, the inclination of the substrate 9 in the horizontal plane is corrected.

  When the inclination of the substrate 9 is corrected, the pattern drawing apparatus 1 next detects the positional deviation amount, the expansion / contraction amount, and the inclination angle for each exposure area AR of the black matrix BM formed on the substrate 9 (step). S3). FIG. 12 is a flowchart showing details of the operation in step S3. In step S3, first, a plurality of alignment marks AM on the substrate 9 are imaged by the two alignment cameras 41 and 43 while the stage 10 and the substrate 9 are conveyed in the main scanning direction by operating the linear motor 25a (step S3). S31). As a result, not only the alignment marks AM formed at the four corners of the substrate 9 but also a plurality of alignment marks AM arranged on the + X side or the −X side of each exposure area AR are imaged.

  The acquired images of the plurality of alignment marks AM are transferred from the alignment cameras 41 and 43 to the control unit 50. The control unit 50 detects the coordinates of the alignment marks AM from the images transferred from the alignment cameras 41 and 43, and calculates the positional deviation amount, the expansion / contraction amount, and the inclination angle for each exposure area AR based on the coordinates. (Step S32). Then, the control unit 50 stores the calculated positional deviation amount, expansion / contraction amount, and inclination angle for each exposure area AR in a predetermined storage unit provided in the control unit 50 (step S33).

  Thereafter, the pattern drawing apparatus 1 corrects the drawing position of the optical head 30 based on the stored positional deviation amount, expansion / contraction amount, and inclination angle, and the upper surface of the substrate 9 conveyed in the main scanning direction and the sub-scanning direction. A predetermined pattern is drawn on (Step S4). Various methods can be considered as the drawing position correction method. For example, the drawing position may be corrected by the following correction method (1), (2), or (3).

(1) First Correction Method In the first correction method, first, the control unit 50 calculates the average value of the amount of positional deviation in the sub-scanning direction stored for each exposure area AR. Then, the drawing position of each optical head 30 is corrected in the sub-scanning direction by the calculated average value. Specifically, the second drive unit 36d in each optical head 30 is operated according to the calculated average value, and the position of the first aperture AP1 is adjusted. When the position of the first aperture AP1 is adjusted, the position of the second aperture AP2 moves together with the first aperture AP1. Then, a pattern is drawn on the upper surface of the substrate 9 using the plurality of adjusted optical heads 30.

  FIG. 13 is a diagram illustrating an example of the drawing area corrected by the first correction method. FIG. 13 shows a drawing area of one optical head 30 arranged on the most + X side (hatched portion). In the example of FIG. 13, one of the six exposure areas AR is displaced in the sub-scanning direction. However, in the first correction method, the number of exposure areas AR arranged in the main scanning direction with the amount of displacement. The drawing position is corrected in the sub-scanning direction by the average value prorated by (three). For this reason, it is possible to prevent the drawing position from being largely shifted in one exposure area AR.

  Although only the correction in the sub-scanning direction has been described in the above example, the drawing position may be corrected in the same manner in the main scanning direction. That is, an average value of the amount of misregistration in the main scanning direction stored for each exposure area AR may be calculated, and the drawing position may be corrected in the main scanning direction by the calculated average value. Further, the drawing position may be corrected in both the main scanning direction and the sub-scanning direction.

  In the above example, the average value is calculated for the positional deviation amount of only the exposure area AR to be drawn for each main scan of each optical head 30, but the average value is calculated for the positional deviation amounts of all the exposure areas AR. It may be calculated. For example, in the example of FIG. 13, the average value is calculated for the positional deviation amounts of only the three exposure areas AR arranged on the + X side, and the drawing position is corrected according to the calculated average value. An average value may be calculated for the misregistration amount, and the drawing position may be corrected according to the calculated misregistration amount. However, if correction is performed for each main scan of each optical head 30, the drawing position can be corrected more appropriately by largely reflecting the amount of positional deviation of the exposure area AR to be drawn.

  On the substrate 9, when the plurality of exposure areas AR arranged in the sub-scanning direction are totally displaced in the sub-scanning direction, the first aperture AP1 and the second aperture AP2 of the optical head 30 are shifted. Instead of adjusting the position, the drawing position on the substrate 9 may be corrected by adjusting the position of the stage 10 in the sub-scanning direction.

(2) Second Correction Method In the second correction method, the pattern drawing apparatus 1 draws the drawing position in the sub-scanning direction for each exposure area AR based on the amount of positional deviation in the sub-scanning direction stored for each exposure area AR. A pattern is drawn on the upper surface of the substrate 9 while correcting the above. That is, immediately before each exposure area AR on the substrate 9 transported in the main scanning direction reaches the drawing position, the position of the first aperture AP1 is adjusted by operating the second drive unit 36d of each optical head 30, The drawing position is corrected in the sub-scanning direction by the amount of positional deviation of the exposure area AR. When the position of the first aperture AP1 is adjusted, the position of the second aperture AP2 moves together with the first aperture AP1.

  FIG. 14 is a diagram illustrating an example of a drawing area corrected by the second correction method. FIG. 14 shows a drawing area of one optical head 30 arranged on the most + X side (hatched portion). In the example of FIG. 14, one of the six exposure areas AR is misaligned in the sub-scanning direction. However, in the second correction method, when the misaligned exposure area AR is drawn, according to the misalignment amount. The drawing position of the optical head 30 is corrected. Therefore, a pattern is drawn at an appropriate position in the black matrix BM in each exposure area AR.

  Further, the pattern drawing apparatus 1 can independently control the positions of the first apertures AP1 of the plurality of optical heads 30. For this reason, even when the amount of positional deviation differs for each exposure area AR, the drawing position of each optical head 30 can be appropriately corrected according to the amount of positional deviation of each exposure area AR. For example, even if two exposure areas AR arranged adjacent to each other in the sub-scanning direction are displaced in the reverse direction, it is possible to deal with the displacement of each exposure area AR.

  Although only the correction in the sub-scanning direction has been described in the above example, the drawing position may be corrected in the same manner in the main scanning direction. That is, the drawing position in the main scanning direction may be corrected for each exposure area AR based on the amount of positional deviation in the main scanning direction stored for each exposure area AR. Further, the drawing position may be corrected in both the main scanning direction and the sub-scanning direction.

  On the substrate 9, when the plurality of exposure areas AR arranged in the sub-scanning direction are totally displaced in the sub-scanning direction, the first aperture AP1 and the second aperture AP2 of the optical head 30 are shifted. Instead of adjusting the position, the drawing position on the substrate 9 may be corrected by adjusting the position of the stage 10 in the sub-scanning direction.

(3) Third Correction Method In the third correction method, the pattern drawing apparatus 1 performs pattern correction on the upper surface of the substrate 9 while continuously correcting the drawing position based on the tilt angle stored for each exposure area AR. Draw. That is, not only immediately before the exposure area AR reaches the drawing position, but also during the drawing of each exposure area AR, the second drive unit 36d is operated in synchronization with the operation of the stage 10 to thereby adjust the first aperture AP1. Adjust the position. Thereby, drawing is performed while correcting the drawing position in the sub-scanning direction according to the inclination of each exposure area AR. When the position of the first aperture AP1 is adjusted, the position of the second aperture AP2 moves together with the first aperture AP1.

  FIG. 15 is a diagram illustrating an example of the drawing area corrected by the third correction method. FIG. 15 shows a drawing area of one optical head 30 arranged on the most + X side (hatched portion). In the example of FIG. 15, one of the six exposure areas AR is tilted. However, in the third correction method, when the tilted exposure area AR is drawn, the drawing position of the optical head 30 according to the tilt angle. Drawing is performed while correcting in the sub-scanning direction. Therefore, a pattern is drawn at an appropriate position in the black matrix BM in each exposure area AR.

  Further, the pattern drawing apparatus 1 can independently control the positions of the first apertures AP1 of the plurality of optical heads 30. For this reason, even when the tilt angle differs for each exposure area AR, the drawing position of each optical head 30 can be appropriately corrected according to the tilt angle of each exposure area AR. For example, even if two exposure areas AR arranged adjacent to each other in the sub-scanning direction are inclined in the opposite direction, the inclination of each exposure area AR can be handled.

  Although only the correction in the sub-scanning direction has been described in the above example, the drawing position may be corrected in the same manner in the main scanning direction. That is, the drawing positions in the main scanning direction and the sub-scanning direction may be continuously changed based on the tilt angle stored for each exposure area AR. If drawing is performed while correcting the drawing position in the main scanning direction and the sub-scanning direction, drawing can be performed more accurately in the frame of the tilted black matrix BM.

  The pattern drawing apparatus 1 draws a predetermined pattern on the upper surface of the substrate 9 while correcting the drawing position as described in (1), (2), or (3) above. The pattern drawing apparatus 1 performs drawing in the main scanning direction a plurality of times while shifting the substrate 9 in the sub-scanning direction, and draws a pattern in the frame of all the black matrices BM on the substrate 9. Thereafter, the substrate 9 is unloaded from the upper surface of the stage 10 (step S5), and the drawing process for one substrate 9 is completed.

  As described above, the pattern drawing apparatus 1 images not only the alignment marks AM formed at the four corners of the substrate 9 but also a plurality of alignment marks AM formed for each exposure area AR, and extracts the coordinates. Then, based on the coordinates of each alignment mark AM, the positional deviation amount and the inclination angle of each exposure area AR are calculated, and the drawing position is corrected according to the calculated positional deviation amount and the inclination angle, and the upper surface of the substrate 9 is corrected. Draw a pattern. For this reason, even when the black matrix BM has a positional shift or inclination for each exposure area AR, a pattern can be drawn at an appropriate position in the black matrix BM in each exposure area AR.

  In step S31, the alignment marks AM for each exposure area AR are imaged using the alignment cameras 41 and 43 provided for imaging the alignment marks at the four corners. For this reason, it is not necessary to separately install an alignment camera in order to image the alignment mark AM for each exposure area AR, and the configuration of the imaging system can be simplified.

  In step S4, the drawing position of each optical head 30 is corrected by adjusting the position of the first aperture AP1 using the first driving unit 36b and the second driving unit 36d. For this reason, in order to correct the drawing position by each optical head 30, it is not necessary to install an adjustment mechanism separately, and the configuration of the optical head 30 can be simplified.

  On the substrate 9, when the plurality of exposure areas AR arranged in the sub-scanning direction are integrally tilted in the rotation direction around the Z axis, the first aperture AP1 and the second aperture AP2 of the optical head 30 are used. Instead of adjusting the position, the drawing position on the substrate 9 may be corrected by rotating the stage 10 around the rotation axis 21b and adjusting the position in the sub-scanning direction.

<3. Modification>
As mentioned above, although one Embodiment of this invention was described, this invention is not limited to said example. In step S31 described above, two alignment marks are imaged for each exposure area AR. However, when three or more alignment marks AM are arranged in the main scanning direction in one exposure area AR, Three or more alignment marks AM may be imaged for each exposure area AR. In order to calculate the positional deviation amount and the inclination angle of each exposure area AR, it is only necessary to acquire the coordinates of at least two alignment marks AM for each exposure area AR. However, if more coordinates of the alignment marks AM are acquired. Thus, it is possible to calculate the displacement amount and inclination angle for each exposure area AR more accurately.

  In step S31 described above, the alignment mark AM is imaged using the two alignment cameras 41 and 43. However, another alignment camera is provided between the two alignment cameras 41 and 43, and three or more alignment cameras are provided. You may image the alignment mark AM with an alignment camera. In this way, even when three or more exposure areas AR are arranged in the sub-scanning direction on the upper surface of the substrate 9, the alignment marks AM included in each exposure area AR can be imaged.

  In the above (2), the drawing position is corrected with respect to the displacement of the exposure area AR, and in the above (3), the drawing position is corrected with respect to the inclination of the exposure area AR. ) And (3) may be combined to correct the drawing position of the optical head 30 for both the positional deviation and the inclination of the exposure area AR.

  In the pattern drawing apparatus 1 described above, a linear motor is used as a drive mechanism for each part, but a known drive mechanism other than the linear motor may be used. For example, a mechanism that converts the driving force of the motor into a linear motion via a ball screw may be used.

  Moreover, although the said pattern drawing apparatus 1 was processing the glass substrate 9 for color filters, the pattern drawing apparatus and pattern drawing method of this invention are semiconductor substrates, a printed circuit board, a glass substrate for plasma display apparatuses, etc. Other substrates may be processed.

  In the above example, the pattern drawing apparatus 1 acquires the positional deviation amount, the expansion / contraction amount, and the tilt angle for each exposure area AR. However, such information may be acquired by another apparatus. For example, as shown in FIG. 16, in the pre-processing apparatus 2 (an apparatus separate from the pattern drawing apparatus 1) that performs the process before the pattern drawing process, the alignment mark AM of each exposure area AR on the substrate 9. It is good also as a structure which acquires the position difference amount of each exposure area | region AR, the expansion-contraction amount, and the inclination angle. Then, the positional deviation amount, expansion / contraction amount, and inclination angle of each exposure area AR acquired in the preprocessing apparatus 2 are provided to the pattern drawing apparatus 1, and the pattern drawing apparatus 1 and the preprocessing apparatus 2 provide one substrate processing system. 3 may be configured.

It is a side view of the pattern drawing apparatus which concerns on one Embodiment of this invention. It is a top view of the pattern drawing apparatus which concerns on one Embodiment of this invention. It is the top view which showed the structure of the aperture unit. It is the top view which showed the structure of the 2nd aperture and its holding mechanism. It is the figure which showed the example of the pattern projected on the upper surface of a board | substrate. It is the top view which showed the structure of the 2nd aperture and its holding mechanism. It is the figure which showed the example of the pattern projected on the upper surface of a board | substrate. It is the block diagram which showed the connection structure between each part and control part of a pattern drawing apparatus. It is the figure which showed the example of the board | substrate used as a process target. It is the flowchart which showed the flow of the drawing process in a pattern drawing apparatus. It is the flowchart which showed the detail of the process which correct | amends the inclination of a board | substrate. It is the flowchart which showed the detail of the process which detects the positional offset amount and angle offset amount for every exposure area | region. It is the figure which showed the example of the drawing area correct | amended by the 1st correction method. It is the figure which showed the example of the drawing area | region correct | amended by the 2nd correction method. It is the figure which showed the example of the drawing area | region correct | amended by the 3rd correction method. It is the figure which showed the structure of the substrate processing system.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pattern drawing apparatus 9 Substrate 10 Stage 20 Drive part 21 Rotating mechanism 23 Sub-scanning mechanism 25 Main scanning mechanism 30 Optical head 33 Laser oscillator 35 Emitting part 36 Aperture unit 36b 1st drive part 36d 2nd drive part 37 Projection optical system 40 Imaging Part 41-44 Alignment camera 50 Control part AP1 1st aperture AP2 2nd aperture AM Alignment mark AR Exposure area BM Black matrix

Claims (11)

A pattern drawing device for drawing a predetermined pattern on a photosensitive material on a substrate having a plurality of reference patterns individually formed in a plurality of regions,
A substrate support for supporting the substrate;
A light irradiation unit that irradiates the surface of the substrate supported by the substrate support unit with the light of the predetermined pattern;
Moving means for moving the substrate support portion relative to the light irradiation portion;
Position detection means for detecting the positions of the plurality of reference patterns for each of the regions on the substrate supported by the substrate support portion;
Correction means for correcting the light irradiation position by the light irradiation unit based on the positions of the plurality of reference patterns detected by the position detection means;
A pattern drawing apparatus comprising: The pattern drawing apparatus according to claim 1,
The pattern drawing apparatus, wherein the position detecting unit detects positions of the plurality of reference patterns based on a plurality of positioning marks formed for the plurality of regions. The pattern drawing apparatus according to claim 1 or 2,
The light irradiation unit includes an emission unit that emits light toward the surface of the substrate, and an aperture unit that partially shields the light emitted from the emission unit to form the predetermined pattern of light. ,
The pattern drawing apparatus, wherein the correction unit corrects the light irradiation position by adjusting the position of the aperture section. It is a pattern drawing apparatus of Claim 3, Comprising:
The light irradiation unit has a plurality of light irradiation heads,
The pattern drawing apparatus, wherein the correction unit individually adjusts the position of an aperture provided in each of the plurality of light irradiation heads. A pattern drawing apparatus according to any one of claims 1 to 4, wherein:
The correction means calculates a positional deviation amount from a standard position of the plurality of reference patterns for each of the plurality of regions, and corrects the light irradiation position based on an average value thereof. . A pattern drawing apparatus according to any one of claims 1 to 4, wherein:
The correction unit calculates a positional deviation amount from a standard position of the plurality of reference patterns for each of the plurality of areas, and individually sets a light irradiation position for each of the plurality of areas based on the calculated positional deviation amount. A pattern drawing apparatus characterized by correcting. It is a pattern drawing apparatus of Claim 6, Comprising:
The pattern drawing apparatus, wherein the correction unit adjusts the light irradiation position of the light irradiation unit immediately before each of the plurality of regions on the substrate reaches the drawing position. A pattern drawing apparatus according to any one of claims 1 to 4, wherein:
The correction means calculates an inclination angle from a standard position of the plurality of reference patterns for each of the plurality of areas, and continuously corrects the light irradiation position based on the calculated inclination angle. Pattern drawing device. A pattern drawing method for drawing a predetermined pattern on a photosensitive material on a substrate having a plurality of reference patterns individually formed in a plurality of regions,
A first step of supporting the substrate on a predetermined support portion;
A second step of detecting the positions of the plurality of reference patterns for each of the regions on the substrate supported by the substrate support;
A third step of irradiating the substrate on the support with a predetermined pattern of light while correcting the light irradiation position based on the positions of the plurality of reference patterns detected in the second step;
A pattern drawing method comprising: The pattern drawing method according to claim 9,
A pattern drawing method, further comprising a fourth step of correcting an inclination in a horizontal plane of the substrate supported by the support portion between the first step and the second step. A pattern drawing apparatus for drawing a predetermined pattern on a photosensitive material on a substrate having a plurality of reference patterns individually formed in a plurality of regions, and a pre-process for the substrate at a stage prior to processing in the pattern drawing apparatus A substrate processing system comprising a pretreatment device for performing,
The pretreatment device includes:
For each of the regions on the substrate, it has a position detection means for detecting the position of the plurality of reference patterns,
The pattern drawing device includes:
A substrate support for supporting the substrate;
A light irradiation unit that irradiates the surface of the substrate supported by the substrate support unit with the light of the predetermined pattern;
Moving means for moving the substrate support portion relative to the light irradiation portion;
Correction means for correcting the light irradiation position by the light irradiation unit based on the positions of the plurality of reference patterns detected by the position detection means;
A substrate processing system comprising:

Images