JP5032821B2 - Substrate moving device - Google Patents

Substrate moving device Download PDF

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JP5032821B2
JP5032821B2 JP2006273234A JP2006273234A JP5032821B2 JP 5032821 B2 JP5032821 B2 JP 5032821B2 JP 2006273234 A JP2006273234 A JP 2006273234A JP 2006273234 A JP2006273234 A JP 2006273234A JP 5032821 B2 JP5032821 B2 JP 5032821B2
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stage
substrate
moving
rotation
unit
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JP2008091785A (en
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康之 和田
康幸 小八木
秀樹 林
慎也 谷口
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大日本スクリーン製造株式会社
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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706Mechanical details, e.g. roller, belt
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Description

  The present invention relates to a substrate moving apparatus for moving a substrate.

  2. Description of the Related Art Conventionally, in a drawing apparatus that draws a pattern on a semiconductor substrate, a glass substrate or the like (hereinafter referred to as “substrate”), drawing on the entire substrate is performed by moving a stage on which the substrate is placed. For example, in Patent Document 1, a technique for drawing a stripe pattern on a photosensitive material on a substrate by moving the substrate together with the stage while irradiating the photosensitive material on the substrate with light through a mask having a plurality of openings. Is disclosed.

  In such a drawing apparatus, a slight deviation from the moving axis of the stage or a slight rotation occurs due to a manufacturing error of a guide for guiding the stage in the moving direction. When drawing a fine pattern, the effects of such shifts and rotations on the drawing cannot be ignored. Therefore, the position and orientation of the moving stage are measured to correct the drawing position, and the pattern is accurate. Techniques for drawing well have been proposed.

As a technique for measuring the position and orientation of a moving stage, for example, in Patent Document 2, a stage mirror provided on a side surface of a stage is irradiated with laser light, and reflected light from the stage mirror and original laser light are used. A technique for measuring the position in the moving direction of the stage and the yawing angle of the stage based on the interference of the above is disclosed.
JP 2005-221596 A JP 2005-90983 A

  By the way, in the drawing apparatus, when the substrate is placed on the stage, the position of the substrate is adjusted before drawing on the substrate is started. As a mechanism for adjusting the approximate position of the substrate (so-called pre-alignment), a structure is known in which the substrate is moved on the stage by pressing the side surface of the substrate placed on the stage with a cylinder or the like. However, when the substrate is moved on the stage, the substrate may be damaged or particles may be generated due to friction between the substrate and the stage or contact between the cylinder and the substrate.

  Moreover, in an apparatus including a mechanism for moving and rotating a stage, such as the substrate moving apparatus of Patent Document 2, the position of the substrate can be adjusted by moving and rotating the stage on which the substrate is placed. Since the mirror rotates with the stage, if the rotation angle of the stage at the time of position adjustment is large, the reflected light from the stage mirror deviates from the light receiving unit, making it impossible to measure the position and yawing of the moving stage. End up.

  The present invention has been made in view of the above problems, and an object of the present invention is to reliably receive the reflected light of the laser light from the plane mirror after adjusting the rotational position of the substrate.

  The invention according to claim 1 is a substrate moving device that moves a substrate, a stage that holds the substrate, a stage moving mechanism that linearly moves the stage in a predetermined moving direction parallel to the stage, A plane mirror attached to the stage and having a reflecting surface perpendicular to the moving direction, and a laser beam is emitted from outside the stage toward the plane mirror, and the reflected light of the laser beam is received and the stage of the stage is received. An interference type laser length measuring device that acquires a moving position in the moving direction, a stage rotating mechanism that rotates the stage around a first rotation axis perpendicular to the stage, an imaging unit that images the substrate, and the imaging By controlling the stage moving mechanism and the stage rotating mechanism based on the output from the unit, the moving position and rotating position of the substrate are adjusted. A substrate position adjustment unit that rotates, a mirror rotation mechanism that rotates the plane mirror with respect to the stage about a second rotation axis that is parallel to the first rotation axis, and the plane that is opposite to the rotation direction of the stage. A mirror angle adjustment unit that maintains the reception of the reflected light in the laser length measuring device by rotating a mirror;

  A second aspect of the present invention is the substrate moving apparatus according to the first aspect, wherein the substrate moving apparatus is separated from a position on the plane mirror irradiated with the laser light from the laser length measuring device in a direction parallel to the stage. Another laser length measuring device that emits laser light from the outside of the stage toward the position on the plane mirror and receives reflected light of the laser light, the laser length measuring device, and the other one. A yawing angle acquisition unit for obtaining a yawing angle of the stage on the way to the movement direction based on outputs from two laser length measuring instruments, and the stage rotation mechanism based on the yawing angle, thereby controlling the movement direction. A yawing correction unit that corrects yawing of the stage on the way to the stage.

  According to a third aspect of the present invention, in the substrate moving device according to the first or second aspect, the rotation of the plane mirror by the mirror angle adjustment unit is synchronized with the rotation of the stage by the substrate position adjustment unit. Done.

  A fourth aspect of the present invention is the substrate moving device according to any one of the first to third aspects, wherein a rotation angle of the plane mirror by the mirror angle adjusting unit is set so that an angle of the stage by the substrate position adjusting unit is set. Equal to rotation angle.

  A fifth aspect of the present invention is the substrate moving apparatus according to any one of the first to fourth aspects, wherein the stage is linearly parallel to the stage and perpendicular to the moving direction. It further includes another stage moving mechanism that moves to.

  A sixth aspect of the present invention is the substrate moving device according to any one of the first to fifth aspects, further comprising another imaging unit having a higher resolution than the imaging unit, wherein the substrate position adjusting unit is The substrate is positioned at the rotation position at the start of movement by controlling the rotation mechanism based on the output from the other imaging unit.

  The invention according to claim 7 is a substrate moving device that moves a substrate, a stage that holds the substrate, a stage moving mechanism that linearly moves the stage in a predetermined moving direction parallel to the stage, A stage rotation mechanism for rotating the stage about a first rotation axis perpendicular to the stage; a plane mirror attached to the stage and having a reflecting surface perpendicular to the moving direction; and the stage on the plane mirror. A pair of interferometric laser length measuring devices that emit laser light from the outside of the stage toward two positions aligned in parallel and receive reflected light of the laser light, and a pair of laser length measuring devices A yawing angle acquisition unit that obtains a yawing angle of the stage on the way to the movement direction based on the output, and the yawing angle based on the yawing angle The stage movement based on the output from the imaging unit, the imaging unit that images the substrate, and the yawing correction unit that corrects the yawing of the stage in the movement direction by controlling the stage rotation mechanism A substrate position adjustment unit that adjusts the movement position and rotation position of the substrate by controlling the mechanism and the stage rotation mechanism; and the plane mirror about the second rotation axis parallel to the first rotation axis. A mirror rotation mechanism that rotates with respect to the mirror, and a mirror angle adjustment unit that maintains reception of the reflected light in the pair of laser length measuring devices by rotating the plane mirror in a direction opposite to the rotation direction of the stage. Is provided.

  In the present invention, the reflected light of the laser beam from the plane mirror can be reliably received after adjusting the rotational position of the substrate. According to the sixth aspect of the present invention, the substrate can be accurately positioned at the rotation position at the start of movement while simplifying the structure of the apparatus.

  FIG. 1 and FIG. 2 are a side view and a plan view showing a configuration of a pattern drawing apparatus 1 according to an embodiment of the present invention. The pattern drawing apparatus 1 is an apparatus that draws a pattern on a photosensitive material on a substrate 9 by irradiating light onto a glass substrate 9 (hereinafter simply referred to as “substrate 9”) for a liquid crystal display device. The substrate 9 on which the pattern is drawn becomes a color filter substrate that is an assembly part of the liquid crystal display device through a subsequent separate process.

  In the pattern drawing apparatus 1, a color filter substrate is formed by irradiating light onto a color resist, which is a negative type photosensitive material (that is, a type in which an exposed portion is left on the substrate during development) provided on the substrate 9. A pixel pattern (that is, a set of sub-pixels) formed on the top is drawn.

  As shown in FIGS. 1 and 2, the pattern drawing apparatus 1 includes a stage 3 that is a substrate holding unit that holds a substrate 9, a stage driving mechanism 2 that is provided on a base 11 and moves and rotates the stage 3, and a stage 3 and the frame 12 fixed to the base 11 so as to straddle the stage drive mechanism 2, the light irradiation unit 4 that is attached to the frame 12 and irradiates light onto the substrate 9, and the measurement unit that measures the position and orientation of the stage 3 5 and a first imaging unit 61 and a second imaging unit 62 that image the substrate 9 on the stage 3. The pattern drawing apparatus 1 has a function as a substrate moving device that moves the substrate 9 together with the stage 3.

  The pattern drawing apparatus 1 also includes a control unit that controls these configurations. FIG. 3 is a block diagram illustrating functions realized by the control unit 7 together with other configurations. The control unit 7 has a configuration in which a CPU, a RAM, a ROM, a fixed disk, a display unit, and an input unit are connected in the same way as a normal computer. As shown in FIG. An angle adjustment unit 72, a yawing angle acquisition unit 73, and a yawing correction unit 74 are provided. In the pattern drawing apparatus 1, the stage drive mechanism 2, the light irradiation unit 4, the measurement unit 5, the first imaging unit 61, and the second imaging unit 62 are controlled by the control unit 7. Outputs from the measurement unit 5, the first imaging unit 61, and the second imaging unit 62 are sent to the control unit 7.

  As shown in FIGS. 1 and 2, the stage drive mechanism 2 includes a support plate 21 that rotatably supports the stage 3, and a stage rotation axis that is a first rotation axis perpendicular to the main surface of the stage 3 on the support plate 21. A stage rotating mechanism 22 that rotates the stage 3 around the center 221, a sub-scanning mechanism 23 that moves the stage 3 in the X direction in FIG. 2 together with the support plate 21 (hereinafter referred to as “sub-scanning direction”), and a sub-scanning mechanism 23. And a main scanning mechanism 25 for moving the stage 3 together with the supporting plate 21 and the base plate 24 in the Y direction in FIG. 2 (hereinafter referred to as “main scanning direction”). .

  As shown in FIG. 1, the stage rotation mechanism 22 includes a linear motor 222 provided on the (+ X) side of the stage 3, and the linear motor 222 is fixed to a side surface on the (+ X) side of the stage 3. And a stator provided on the upper surface of the support plate 21. In the stage rotation mechanism 22, the stage 3 shown in FIGS. 1 and 2 is moved to a stage rotation shaft provided on the support plate 21 by moving the mover of the linear motor 222 in the Y direction along the groove of the stator. It rotates within a range of a predetermined angle around 221.

  The sub-scanning mechanism 23 has a linear motor 231 extending in the sub-scanning direction parallel to the main surface of the stage 3 and perpendicular to the main scanning direction on the lower side (that is, (−Z) side) of the support plate 21, and A pair of linear guides 232 extending in the sub-scanning direction are provided on the (+ Y) side and (−Y) side of the linear motor 231. The linear motor 231 includes a mover fixed to the lower surface of the support plate 21 and a stator provided on the upper surface of the base plate 24. When the mover moves in the sub-scanning direction along the stator, The support plate 21 moves linearly with the stage 3 in the sub-scanning direction along the linear motor 231 and the linear guide 232.

  The main scanning mechanism 25 has a linear motor 251 extending in a main scanning direction parallel to the main surface of the stage 3 below the base plate 24, and a main scanning direction on the (+ X) side and the (−X) side of the linear motor 251. A pair of air sliders 252 extending in the direction. The linear motor 251 includes a mover fixed to the lower surface of the base plate 24 and a stator provided on the upper surface of the base 11, and when the mover moves in the main scanning direction along the stator, The base plate 24 moves linearly in the main scanning direction along the linear motor 251 and the air slider 252 together with the support plate 21 and the stage 3. In the pattern drawing apparatus 1, the main scanning mechanism 25 and the sub-scanning mechanism 23 are stage moving mechanisms that move the stage 3 linearly.

  As shown in FIG. 2, the light irradiation unit 4 includes a plurality of optical heads 41 arranged at an equal pitch (200 mm pitch in this embodiment) along the sub-scanning direction and attached to the frame 12. As shown in FIG. 1, the light irradiation unit 4 includes an illumination optical system 42 connected to each optical head 41, a laser oscillator 43 that is a light source, and a laser driving unit 44. In the light irradiation unit 4, each laser driving unit 44 is driven to emit pulsed light (hereinafter simply referred to as “light”) from the laser oscillator 43, and to each optical head 41 via the illumination optical system 42. It is guided.

  Each optical head 41 emits light from the laser oscillator 43 downward, an aperture unit 46 that partially blocks the light from the output unit 45, and the light that has passed through the aperture unit 46 to the substrate 9 An optical system 47 is provided for guiding the light-sensitive material provided above.

  FIG. 4 is a plan view showing a part of the aperture unit 46. As shown in FIG. 4, the aperture unit 46 includes a pair of holdings that hold the first aperture plate 461 having a plurality of rectangular light-transmitting portions and the first aperture plate 461 from the (+ X) side and the (−X) side. And a position adjusting mechanism 463 for adjusting the positions of the first aperture plate 461 in the main scanning direction and the sub-scanning direction. In the first aperture plate 461, a plurality of three types of translucent portions 4611, 4612, and 4613 having different sizes are arranged at equal pitches along the sub-scanning direction (that is, the X direction). In this embodiment mode, the pitch of the light transmitting portions 4611, the pitch of the light transmitting portions 4612, and the pitch of the light transmitting portions 4613 are different from each other. In FIG. 4, in order to facilitate understanding, parallel oblique lines are given to regions (that is, light shielding portions) excluding the light transmitting portions 4611 to 4613 of the first aperture plate 461.

  The position adjustment mechanism 463 includes a first adjustment mechanism 464 that moves the first aperture plate 461 together with the pair of holding portions 462 in the main scanning direction, a pair of linear guides 465 that extend in the sub-scanning direction below the first adjustment mechanism 464, In addition, a second adjustment mechanism 466 that moves the first aperture plate 461 along the linear guide 465 along with the holding portion 462 and the first adjustment mechanism 464 is provided. In the present embodiment, linear motors are used as the first adjustment mechanism 464 and the second adjustment mechanism 466.

  FIG. 5 is a plan view showing another part of the aperture unit 46 that optically overlaps the part shown in FIG. As shown in FIG. 5, the aperture unit 46 includes a pair of holdings that hold the second aperture plate 467 and the second aperture plate 467 having a plurality of rectangular light-transmitting portions from the (+ Y) side and the (−Y) side. And a third adjustment mechanism 469 for moving the second aperture plate 467 together with the pair of holding portions 468 in the sub-scanning direction. In the present embodiment, a linear motor is used as the third adjustment mechanism 469.

  The second aperture plate 467, the holding portion 468, and the third adjustment mechanism 469 are disposed above the first aperture plate 461, the holding portion 462 (see FIG. 4) and the position adjustment mechanism 463, and the first adjustment of the position adjustment mechanism 463 is performed. Fixed on mechanism 464. The first aperture plate 461 and the second aperture plate 467 are disposed at optically conjugate positions. In the second aperture plate 467, three types of translucent portions 4671, 4672, and 4673 having different sizes respectively corresponding to the plurality of translucent portions 4611 to 4613 of the first aperture plate 461 are respectively in the sub-scanning direction (that is, X Are arranged at equal pitches along the direction). In FIG. 5, in order to facilitate understanding of the drawing, the position adjusting mechanism 463 and the translucent portions 4611 to 4613 of the first aperture plate 461 are drawn with broken lines. Moreover, the parallel diagonal line is attached | subjected to the area | region except the translucent parts 4671-4673 of the 2nd aperture board 467. FIG.

  As shown in FIG. 5, a second aperture is formed in an irradiation region 451 (indicated by a two-dot chain line in FIG. 5) of light emitted from the laser oscillator 43 via the emission unit 45 (see FIG. 1). When the translucent part 4673 of the plate 467 and the translucent part 4613 of the first aperture plate 461 partially overlapping with the translucent part 4673 are arranged, the light from the emitting part 45 is transmitted to the translucent part 4673 and the translucent part. Only a region overlapping with the portion 4613 (hereinafter referred to as a “mask set light transmitting portion”) is transmitted, and a plurality of rectangular irradiation regions 931 on the substrate 9 are passed through the optical system 47 as shown in FIG. Led to. In the following description, the plurality of irradiation regions 931 are collectively referred to as “irradiation regions 93”.

  In the pattern writing apparatus 1, by adjusting the relative position of the second aperture plate 467 in the sub-scanning direction with respect to the first aperture plate 461, the width of the light guided onto the substrate 9 in the sub-scanning direction (that is, a plurality of irradiation regions). Each width of 931) is changed. Further, the first aperture plate 461 and the second aperture plate 467 are moved in the main scanning direction, and the light transmitting portions 4611 and 4671 or the light transmitting portions 4612 and 4672 are disposed in the light irradiation region 451 from the emitting portion 45. As a result, the size, pitch, and the like of the irradiation region 931 on the substrate 9 are changed.

  In the pattern drawing apparatus 1 shown in FIG. 1, the stage 9 moves together with the stage 3 in the (+ Y) direction by controlling the stage driving mechanism 2 and the light irradiation unit 4 by the control unit 7. Light irradiation is performed on an area to be drawn (hereinafter referred to as “drawing area”). In other words, the irradiation region 93 is irradiated with light while moving the irradiation region 93 in the (−Y) direction relative to the photosensitive material on the substrate 9 along the drawing region of the substrate 9. As a result, a striped pattern extending in parallel with the main scanning direction is drawn on the photosensitive material.

  When the movement of the stage 3 in the main scanning direction is completed, the substrate 9 moves together with the stage 3 in the sub-scanning direction by a predetermined distance (50 mm in the present embodiment) while light irradiation is stopped. After that, the irradiation region 93 is irradiated with light while moving the substrate 9 in the direction opposite to the first main scanning (that is, the (−Y) direction). In the present embodiment, four main scans are performed with the sub-scans sandwiched between the main scans, so that only the portion corresponding to the pixel pattern is irradiated with light on the photosensitive material of the substrate 9 so that the pixel pattern Is drawn, and development processing is performed in a later process, so that only the exposed portion of the photosensitive material is left on the substrate to form a plurality of sub-pixels of the color filter substrate.

  7 and 8 are an enlarged plan view and a front view showing the vicinity of the measurement unit 5. The measurement unit 5 is attached to the side surface on the (−Y) side of the stage 3 and has a plane mirror 51 having a reflection surface (that is, a (−Y) side surface) perpendicular to the main scanning direction, and the (−Y) of the stage. A laser light source 52 fixed to the base 11 on the side, a mounting base 53 whose upper end is positioned at substantially the same height as the plane mirror 51, and a splitter 54 provided between the laser light source 52 and the mounting base 53 (see FIG. 8). The first linear interference system 551 and the first receiver 552 attached to the (−X) side at the upper end of the mounting base 53, and the second linear interference system 561 and the second linear interference system 561 attached to the (+ X) side at the upper end of the mounting base 53. Two receivers 562 are provided. In FIG. 8, the thickness of the stage 3 is drawn larger than the actual thickness for the sake of illustration, and the support plate 21, the sub-scanning mechanism 23, the base plate 24, and the main scanning mechanism between the stage 3 and the base 11 are illustrated. Illustration of 25 is omitted.

  FIG. 9 is a conceptual diagram for explaining the principle of measurement in the measurement unit 5. In FIG. 9, the optical path of the laser beam is indicated by an arrow. As shown in FIG. 9, in the measurement unit 5, the laser light emitted from the laser light source 52 is divided into two by the splitter 54, and one part of the light enters the plane mirror 51 via the first linear interference system 551, Reflected light from the plane mirror 51 interferes with part of the original laser light used as reference light in the first linear interference system 551 and is received by the first receiver 552. Then, based on the output from the first receiver 552 (that is, the intensity change after interference between the reflected light and the reference light), the position of the stage 3 in the main scanning direction (that is, the stage) by a specialized arithmetic circuit (not shown). 3 in the movement direction, and hereinafter referred to as “movement position”). The output from the first receiver 552 is sent to the yawing angle acquisition unit 73 (see FIG. 3) of the control unit 7.

  A part of the other laser beam emitted from the laser light source 52 and divided by the splitter 54 passes through the mounting base 53 from the right side to the left side in FIG. 9 and passes through the second linear interference system 561 to obtain a plane. Incident on the mirror 51. The laser beam from the second linear interference system 561 is a plane separated from the position on the plane mirror 51 irradiated with the laser beam from the first linear interference system 551 in the direction parallel to the stage 3 (ie, the sub-scanning direction). It is incident on another position on the mirror 51. The reflected light from the plane mirror 51 interferes with a part of the original laser beam by the second linear interference system 561 and is received by the second receiver 562, and the output from the second receiver 562 (that is, the second linear interference). The distance between the system 561 and the plane mirror 51 in the main scanning direction) is sent to the yawing angle acquisition unit 73.

  In the measurement unit 5, the laser light source 52, the first linear interference system 551, and the first receiver 552 (and the arithmetic circuit) emit laser light from the outside of the stage 3 toward the plane mirror 51, and reflected light of the laser light. And an interferometric laser length measuring device that acquires the moving position of the stage 3, and the laser light source 52, the second linear interference system 561, and the second receiver 562 (there is no need to provide an arithmetic circuit). )) Is another interference type laser length measuring device that emits laser light from outside the stage 3 toward the plane mirror 51 and receives reflected light of the laser light. In the measurement unit 5, laser light is emitted from these pair of laser length measuring devices arranged outside the stage 3 toward two positions aligned in a direction parallel to the stage 3 on the plane mirror 51.

  In the yawing angle acquisition unit 73 of the control unit 7, the yawing angle of the stage 3 during the movement in the main scanning direction (that is, the rotation angle of the stage 3 with respect to the main scanning direction) based on the outputs from the pair of laser length measuring devices. ) Is required. Specifically, based on the distance in the sub-scanning direction between the irradiation positions on the plane mirror 51 of the laser light emitted from the two laser length measuring instruments and the difference between the positions of the two irradiation positions in the main scanning direction. Thus, the yawing angle of stage 3 is obtained. If the difference between the positions of the two irradiation positions in the main scanning direction is obtained, the second linear interference system 561 and the second receiver 562 are not necessarily between the plane mirror 51 and the second linear interference system 561. It is not necessary to obtain the distance in the main scanning direction.

  As shown in FIGS. 7 and 8, the measuring unit 5 is centered on a mirror rotation axis 571 that is a second rotation axis that is perpendicular to the stage 3 and parallel to the stage rotation axis 221 (see FIGS. 1 and 2). Further, a mirror rotation mechanism 57 that rotates the plane mirror 51 relative to the stage 3 is further provided.

  10 and 11 are an enlarged plan view and a side view showing a part of the mirror rotating mechanism 57. FIG. The mirror rotation mechanism 57 includes a support plate 572 that supports the plane mirror 51 on the (−Y) side of the stage 3, and a first holding unit 573 that holds the plane mirror 51 on the mirror rotation shaft 571 on the support plate 572 (FIG. 7). And the linear shape in which the second holding part 574 and the second holding part 574 that hold the plane mirror 51 are attached to the upper part and fixed on the support plate 572 on the (−X) side of the first holding part 573. A slide portion 576 that is movable in the main scanning direction along the guide 575, a spring 577 that connects the support plate 572 and the slide portion 576, and a slide portion 576 that is fixed to the support plate 572 in the (+ Y) direction. A linear cylinder 578 for pushing is provided.

  As shown in FIGS. 10 and 11, the slide portion 576 includes a pedestal 5761 on the flat plate and a protruding portion 5762 that protrudes from the pedestal 5761 to the (−X) side. The protruding portion 5762 has a plate-like shape extending to the (−Z) side, an extended spring 577 is attached to the side surface on the (+ X) side, and the tip of the rod 5781 of the linear cylinder 578 is attached to the side surface on the (−Y) side. Abut.

  In the mirror rotation mechanism 57, the slide portion 576 is moved in the (+ Y) direction by extending the rod 5781 of the linear cylinder 578, whereby the plane mirror 51 is rotated counterclockwise in FIG. 10 about the mirror rotation axis 571. (That is, the direction in which the (−X) side end of the plane mirror 51 approaches the stage 3). Further, when the rod 5781 of the linear cylinder 578 is retracted, the sliding portion 576 is moved in the (−Y) direction by the contraction force of the spring 577, whereby the plane mirror 51 is moved to the mirror rotation shaft 571 (FIGS. 7 and 8). 10), and rotates clockwise in FIG.

  The first imaging unit 61 shown in FIGS. 1 and 2 includes two pre-alignment cameras 611 arranged above two corners on the (−Y) side of the substrate 9 held by the stage 3, and The imaging unit 62 includes four alignment cameras 621 disposed above the four corners of the substrate 9. The pre-alignment camera 611 and the alignment camera 621 are fixed to a frame not shown. The pre-alignment camera 611 has a larger imageable range (that is, a visual field) than the alignment camera 621. The alignment camera 621 has a higher resolution than the pre-alignment camera 611.

  Next, a flow of drawing a pixel pattern by the pattern drawing apparatus 1 will be described. FIG. 12 is a diagram illustrating a flow of drawing a pixel pattern. When a pixel pattern is drawn, first, the substrate 9 having a negative photosensitive material coated on the main surface is placed on the stage 3 and is sucked and held on the stage 3 (step S11).

  Subsequently, the control unit 7 controls the two pre-alignment cameras 611 of the first imaging unit 61, and among the alignment marks (not shown) provided near the four corners on the substrate 9, (−Y) Two of the sides are imaged. The stage drive mechanism 2 (that is, the stage rotation mechanism 22, the main scanning mechanism 25, and the sub-scanning mechanism 23) is controlled by the substrate position adjustment unit 71 of the control unit 7 based on the output from the first imaging unit 61. As a result, the stage 3 moves in the main scanning direction and the sub-scanning direction and rotates about the stage rotation shaft 221. Accordingly, the position of the substrate 9 in the main scanning direction and the position in the sub-scanning direction (hereinafter, these positions are respectively referred to as “moving positions”), and the position in the circumferential direction around the stage rotation shaft 221 (that is, The orientation of the substrate 9 (hereinafter referred to as “rotational position”) is roughly adjusted (so-called pre-alignment), and the four alignment marks on the substrate 9 are respectively captured by the four alignment cameras 621. (Step S12). During the rotation of the stage 3, the rotation angle of the stage 3 (that is, the inclination with respect to the main scanning direction) is continuously acquired by the encoder and sent to the mirror angle adjustment unit 72 of the control unit 7.

  In the pattern drawing apparatus 1, the mirror rotation mechanism 57 is controlled by the mirror angle adjustment unit 72 of the control unit 7 in synchronization with the rotation of the stage 3 by the substrate position adjustment unit 71. It rotates in the opposite direction (step S13). The rotation angle of the plane mirror 51 by the mirror angle adjustment unit 72 is made equal to the rotation angle of the stage 3 by the substrate position adjustment unit 71 continuously sent from the encoder to the mirror angle adjustment unit 72. As a result, the relative angle of the plane mirror 51 with respect to the measurement unit 5 is maintained equal to that before the pre-alignment of the substrate 9, so that the reflected light from the plane mirror 51 in the first receiver 552 and the second receiver 562 of the measurement unit 5 is maintained. Light reception (that is, reception of reflected light in each of the pair of laser length measuring devices) is maintained.

  When the pre-alignment of the substrate 9 and the angle adjustment of the plane mirror 51 are completed, the control unit 7 controls the four alignment cameras 621 of the second imaging unit 62 and images four alignment marks (not shown) on the substrate 9. The Then, the stage rotation mechanism 22 of the stage drive mechanism 2 is controlled by the substrate position adjustment unit 71 of the control unit 7 based on the output from the second imaging unit 62, so that the stage 3 is centered on the stage rotation axis 221. The substrate 9 is rotated, and the substrate 9 is positioned at the rotation position at the start of the movement of the substrate 9 shown in FIG.

  In the pattern drawing apparatus 1, the positional deviation amount of the stage 3 in the main scanning direction and the sub-scanning direction obtained based on the output from the second imaging unit 62 is stored in the substrate position adjusting unit 71. Then, the second adjustment mechanism 466 of the position adjustment mechanism 463 moves the first aperture plate 461 and the second aperture 467 in the sub-scanning direction based on the amount of displacement in the sub-scanning direction, so that the substrate 9 is irradiated with light. It is moved relative to the part 4 and is located at the movement position in the sub-scanning direction at the start of movement. In addition, drawing is started accurately at the drawing start position on the substrate 9 by changing the timing of starting the irradiation of light from the light irradiation unit 4 described later based on the amount of positional deviation in the main scanning direction. Note that the stage 9 is moved by the main scanning mechanism 25 and the sub-scanning mechanism 23 based on the amount of positional deviation in the main scanning direction and the sub-scanning direction, so that the substrate 9 is positioned at the movement position at the start of movement. May be.

  When the position adjustment (so-called alignment) with higher accuracy than the pre-alignment of the substrate 9 is completed, the control unit 7 controls the stage driving mechanism 2 to start the movement of the stage 3 and the substrate 9 in the (+ Y) direction. (Step S15). Subsequently, the light irradiating unit 4 is controlled by the control unit 7 and light irradiation is started, and the light is partially blocked by the aperture unit 46, so that the mask set light transmission is performed on the photosensitive material on the substrate 9. Light is guided to an irradiation area 93 corresponding to the part (also an irradiation area corresponding to a part of the pixel pattern) (step S16). Then, the irradiation region 93 is main-scanned relatively to the photosensitive material in the (−Y) direction, whereby a stripe pattern is drawn on the photosensitive material on the substrate 9.

  During the movement of the substrate 9 and the stage 3, the moving position of the stage 3 in the main scanning direction and the yawing angle with respect to the main scanning direction are measured by the laser length measuring device of the measuring unit 5. Then, based on the movement position of the stage 3 output from the measuring unit 5, the timing of irradiating light from the light irradiating unit 4 is controlled as necessary, so that highly accurate pattern drawing is realized. . Further, the stage rotation mechanism 22 is controlled by the yawing correction unit 74 of the control unit 7 based on the yawing angle of the stage 3 output from the measurement unit 5, so that the stage 3 in the course of moving in the main scanning direction is yawing. The yawing is corrected by rotating in the opposite direction to the angle. Thereby, the pattern drawing accuracy can be further improved.

  In the pattern drawing apparatus 1, when the main scanning of the irradiation area 93 reaches a predetermined movement end position, the light irradiation from the light irradiation unit 4 is stopped (step S17), and the movement of the stage 3 and the substrate 9 is stopped. (Step S18). When the first main scan with respect to the photosensitive material on the substrate 9 is completed, it is determined whether or not pattern drawing on the substrate 9 is continued (that is, whether or not the next main scan is present) (step S19). If there is, the substrate 9 is moved in the sub-scanning direction by the sub-scanning mechanism 23 (step S191). In the pattern writing apparatus 1, the plane mirror 51 extending in the sub-scanning direction is provided in the measurement unit 5, so that the light from the pair of laser length measuring devices can be plane even after the stage 3 is moved in the sub-scanning direction. The light enters the mirror 51 with certainty.

  When the movement of the stage 3 in the sub-scanning direction is completed, the process returns to step S15, and the movement of the stage 3 in the (−Y) direction and the irradiation of light to the substrate 9 are started (steps S15 and S16). Then, the irradiation of light and the movement of the stage 3 are stopped at the movement end position on the (−Y) side (steps S17 and S18).

  In the pattern drawing apparatus 1, the movement in the main scanning direction of the stage 3 performed while irradiating light onto the substrate 9 (that is, main scanning of the irradiation region 93 with respect to the photosensitive material on the substrate 9) is performed between the main scannings. 3 is repeated a predetermined number of times (four times in the present embodiment) across the movement in the sub-scanning direction (steps S15 to S19, S191). When all the striped pixel patterns are drawn on the photosensitive material on the substrate 9 (step S19), drawing by the pattern drawing apparatus 1 is completed. In the present embodiment, the pattern drawing on the substrate 9 provided with only one drawing area on the main surface has been described. However, in the pattern drawing apparatus 1, a plurality of drawing areas are set on the main surface. A pattern may be drawn on the substrate (so-called multi-planarization is scheduled). In this case, steps S16 and S17 are repeated during the movement of the stage 3 in the main scanning direction according to the arrangement of the drawing areas on the substrate.

  As described above, in the pattern writing apparatus 1, in the measurement unit 5, the plane mirror 51 rotates in the direction opposite to the rotation direction of the stage 3 during the pre-alignment of the substrate 9. Is perpendicular to the main scanning direction. As a result, even if the substrate 9 is not accurately placed on the stage 3, the reflected light of the laser beam from the plane mirror 51 is measured by laser measurement after pre-alignment (that is, after the rotational position of the substrate 9 is adjusted). Light can be reliably received by the first receiver 552 and the second receiver 562 of the long device. As a result, the movement position of the stage 3 in the main scanning direction can be obtained reliably and with high accuracy. Further, the yawing angle of the stage 3 with respect to the main scanning direction can also be obtained reliably and with high accuracy.

  By the way, when yawing correction is performed during the movement of the stage, since a high resolution is required for the laser length measuring instrument used for measuring the yawing angle, the light receiving range is generally narrowed. In the pattern writing apparatus 1 according to the present embodiment, the reflected light of the laser light from the plane mirror 51 can be reliably received by the laser length measuring device, and thus is particularly suitable for a pattern drawing apparatus that performs stage yawing correction. ing.

  Further, when the stage is also moved in the sub-scanning direction perpendicular to the main scanning direction, the irradiation position of the laser light from the laser length measuring device of the measuring unit is relatively moved in the sub-scanning direction on the side surface of the stage. Therefore, it is preferable to use a plane mirror extending in the sub-scanning direction for measuring the stage moving position and yawing angle. In the pattern writing apparatus 1 according to the present embodiment, the reflected light of the laser beam from the plane mirror 51 extending in the sub-scanning direction can be reliably received by the laser length measuring device. Particularly suitable for a drawing apparatus.

  In the measurement unit 5, the rotation of the plane mirror 51 is performed in synchronization with the rotation of the stage 3 during pre-alignment. Thereby, it is possible to always confirm the reception of the reflected light of the laser light in the laser length measuring device while the rotational position of the substrate 9 is adjusted. Further, it is possible to reliably prevent the reflected light from deviating from the first receiver 552 and the second receiver 562 of the laser length measuring device (so-called laser light blocking). Furthermore, by making the rotation angle of the plane mirror 51 at the time of pre-alignment equal to the rotation angle of the stage 3, the reflected light from the plane mirror 51 can be received more reliably.

  In the pattern writing apparatus 1, the substrate 9 is pre-aligned and aligned by moving and rotating the stage 3 by the main scanning mechanism 25, the sub-scanning mechanism 23 and the stage rotating mechanism 22. As described above, by sharing a part of the pre-alignment mechanism and the alignment mechanism, the substrate 9 can be accurately positioned at the movement start position while simplifying the structure of the pattern writing apparatus 1.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to the said embodiment, A various change is possible.

  In the pattern drawing apparatus 1 according to the above embodiment, a linear motor is used as a drive source for the main scanning mechanism 25 and the sub-scanning mechanism 23. For example, a ball screw is rotated by the motor and a nut attached to the ball screw is used. In addition, a configuration in which the stage 3 is moved straight may be employed.

  The measurement of the rotation angle of the stage 3 at the time of pre-alignment is not limited to that by an encoder. For example, a plane mirror fixed to the stage 3 by a pair of laser length measuring devices provided separately from the measurement unit 5 described above. A mirror different from 51 may be irradiated with two laser beams, and the rotation angle of the stage 3 may be measured by interference of the laser beams. Further, when a stepping motor is used as the stage rotation mechanism 22, the number of pulses when the stepping motor is rotated is sent to the mirror angle adjustment unit 72, and the angle of the plane mirror 51 is adjusted based on the number of pulses. Also good.

  In the pattern drawing apparatus 1, the rotation of the plane mirror 51 by the mirror angle adjustment unit 72 is not necessarily performed in synchronization with the rotation of the stage 3 during pre-alignment. For example, after the rotation of the stage 3 is completed, The plane mirror 51 may be rotated in an opposite direction to the rotation direction of the stage 3 by an angle equal to the rotation angle. Further, the rotation angle of the plane mirror 51 is not necessarily equal to the rotation angle of the stage 3 as long as the reflected light from the plane mirror 51 is maintained in the laser length measuring device.

  For example, when sub-scanning of the stage 3 is not performed at the time of pattern drawing, instead of the single plane mirror 51, two sheets of laser light respectively reflected from the first linear interference system 551 and the second linear interference system 561 are reflected. A mirror may be provided. In this case, it is preferable that the two mirrors are integrally rotated by the mirror angle adjusting unit 72 by being fixed on one holding plate.

  The position adjustment of the substrate 9 by the stage driving mechanism 2 is not necessarily performed in two stages of pre-alignment and alignment. When the accuracy required for position adjustment of the substrate 9 is not so high, the second imaging unit 62 may be omitted, and the substrate 9 may be moved to the movement start position by one alignment.

  In the pattern drawing apparatus 1, the position in the sub-scanning direction of the stage 3 during the movement in the main scanning direction may be measured by a laser length measuring device or a glass scale, and the positional deviation in the sub-scanning direction may be corrected.

  In the pattern writing apparatus 1 according to the above-described embodiment, drawing may be performed on a substrate on which a positive photosensitive material from which an exposed portion is removed during development is formed on the main surface. In this case, for example, a pattern corresponding to the liquid crystal alignment control protrusion of the liquid crystal display device is drawn. Further, the photosensitive material may be other types that do not involve a development step. In the pattern writing apparatus 1, energy other than the light beam, for example, an electron beam or an ion beam may be used for drawing on the substrate 9.

  The pattern drawing device 1 may be used for drawing a pattern on a TFT (Thin Film Transistor) substrate for a liquid crystal display device, a glass substrate for a flat display device such as a plasma display device or an organic EL display device, a semiconductor, etc. It can also be used for drawing a pattern on a substrate, a printed wiring board, a glass substrate for a photomask, or the like. Furthermore, the light irradiation unit 4 may be omitted from the pattern drawing apparatus 1, and processing other than pattern drawing may be performed on the substrate 9 that is moved by the stage driving mechanism 2.

It is a side view of a pattern drawing apparatus. It is a top view of a pattern drawing apparatus. It is a block diagram which shows the function implement | achieved by the control part with another structure. It is a top view which shows a part of aperture unit. It is a top view which shows the other part of an aperture unit. It is a top view which shows the irradiation area | region on a board | substrate. It is a top view which expands and shows the measurement part vicinity. It is a front view which expands and shows the measurement part vicinity. It is a conceptual diagram of a measurement part. It is a top view which expands and shows a part of mirror rotation mechanism. It is a side view which expands and shows a part of mirror rotation mechanism. It is a figure which shows the flow of drawing of a pixel pattern.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Pattern drawing apparatus 3 Stage 9 Board | substrate 22 Stage rotation mechanism 23 Subscanning mechanism 25 Main scanning mechanism 51 Plane mirror 52 Laser light source 57 Mirror rotation mechanism 61 1st imaging part 62 2nd imaging part 71 Substrate position adjustment part 72 Mirror angle adjustment part 73 Yawing angle acquisition unit 74 Yawing correction unit 221 Stage rotation axis 551 First linear interference system 552 First receiver 561 Second linear interference system 562 Second receiver 571 Mirror rotation axis

Claims (7)

  1. A substrate moving device for moving a substrate,
    A stage for holding a substrate;
    A stage moving mechanism that linearly moves the stage in a predetermined moving direction parallel to the stage;
    A plane mirror attached to the stage and having a reflecting surface perpendicular to the moving direction;
    An interference type laser length measuring device that emits laser light from the outside of the stage toward the plane mirror, receives reflected light of the laser light, and obtains a moving position of the stage in the moving direction;
    A stage rotation mechanism for rotating the stage about a first rotation axis perpendicular to the stage;
    An imaging unit for imaging the substrate;
    A substrate position adjusting unit that adjusts a moving position and a rotating position of the substrate by controlling the stage moving mechanism and the stage rotating mechanism based on an output from the imaging unit;
    A mirror rotation mechanism for rotating the plane mirror with respect to the stage around a second rotation axis parallel to the first rotation axis;
    A mirror angle adjusting unit for maintaining the reception of the reflected light in the laser length measuring device by rotating the plane mirror in a direction opposite to the rotation direction of the stage;
    A substrate moving apparatus comprising:
  2. The substrate moving apparatus according to claim 1,
    A laser beam is emitted from outside the stage toward a position on the plane mirror that is separated in a direction parallel to the stage from a position on the plane mirror irradiated with the laser beam from the laser length measuring device, and the laser Another interferometric laser length measuring device that receives the reflected light of the light;
    A yawing angle acquisition unit for obtaining a yawing angle of the stage on the way to the moving direction based on outputs from the laser length measuring device and the other laser length measuring device;
    By controlling the stage rotation mechanism based on the yawing angle, a yawing correction unit that corrects yawing of the stage during the movement in the movement direction;
    A substrate moving apparatus further comprising:
  3. The substrate moving apparatus according to claim 1 or 2,
    The substrate moving apparatus, wherein the rotation of the plane mirror by the mirror angle adjustment unit is performed in synchronization with the rotation of the stage by the substrate position adjustment unit.
  4. A substrate moving apparatus according to any one of claims 1 to 3,
    The substrate moving apparatus, wherein a rotation angle of the plane mirror by the mirror angle adjustment unit is equal to a rotation angle of the stage by the substrate position adjustment unit.
  5. A substrate moving apparatus according to any one of claims 1 to 4,
    A substrate moving apparatus further comprising another stage moving mechanism that moves the stage linearly in a direction parallel to the stage and perpendicular to the moving direction.
  6. A substrate moving apparatus according to any one of claims 1 to 5,
    And further comprising another imaging unit having a higher resolution than the imaging unit,
    The substrate moving apparatus, wherein the substrate position adjusting unit controls the rotation mechanism based on an output from the other imaging unit, thereby positioning the substrate at a rotation position at the start of movement.
  7. A substrate moving device for moving a substrate,
    A stage for holding a substrate;
    A stage moving mechanism that linearly moves the stage in a predetermined moving direction parallel to the stage;
    A stage rotation mechanism for rotating the stage about a first rotation axis perpendicular to the stage;
    A plane mirror attached to the stage and having a reflecting surface perpendicular to the moving direction;
    A pair of interferometric laser length measuring devices that emit laser light from outside the stage toward two positions aligned in a direction parallel to the stage on the plane mirror, and receive reflected light of the laser light;
    A yawing angle acquisition unit for obtaining a yawing angle of the stage on the way to the movement direction based on outputs from the pair of laser length measuring devices;
    By controlling the stage rotation mechanism based on the yawing angle, a yawing correction unit that corrects yawing of the stage during the movement in the movement direction;
    An imaging unit for imaging the substrate;
    A substrate position adjusting unit that adjusts a moving position and a rotating position of the substrate by controlling the stage moving mechanism and the stage rotating mechanism based on an output from the imaging unit;
    A mirror rotation mechanism for rotating the plane mirror with respect to the stage around a second rotation axis parallel to the first rotation axis;
    A mirror angle adjustment unit that maintains the reception of the reflected light in the pair of laser length measuring devices by rotating the plane mirror in a direction opposite to the rotation direction of the stage;
    A substrate moving apparatus comprising:
JP2006273234A 2006-10-04 2006-10-04 Substrate moving device Active JP5032821B2 (en)

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TW096129807A TWI354348B (en) 2006-10-04 2007-08-13 Substrate moving apparatus
KR1020070082429A KR100907779B1 (en) 2006-10-04 2007-08-16 A substrate transfer device

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JP5349163B2 (en) * 2009-06-25 2013-11-20 株式会社日立ハイテクノロジーズ Exposure apparatus, exposure method, and manufacturing method of display panel substrate
JP2013026383A (en) * 2011-07-20 2013-02-04 Dainippon Screen Mfg Co Ltd Alignment device, alignment method, and drawing device
TWI447348B (en) * 2012-02-10 2014-08-01 Nat Synchrotron Radiation Res Ct Positioning system and method for precise stage
CN103227134B (en) * 2013-03-18 2016-02-17 无锡先导智能装备股份有限公司 A kind of carrying screening plant of battery component and carrying screening technique
CN106931878A (en) * 2015-12-31 2017-07-07 上海微电子装备有限公司 A kind of interfering meter measuring device and its control method

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JP3295846B2 (en) * 1989-06-08 2002-06-24 株式会社ニコン Position measuring method, the position measuring device, a positioning method, positioning device, and an exposure apparatus
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KR20080031612A (en) 2008-04-10

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