JP2011158718A - Exposure apparatus, exposure method and method for manufacturing panel substrate for display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To expose a substrate to transfer a new pattern on a base pattern preliminarily formed on the substrate, in such a manner that the new pattern is transferred by exposure as aligned to the base pattern over the whole substrate even if distortion of the base pattern differs depending on a position within the substrate. <P>SOLUTION: The surface of a substrate 1 where a base pattern is formed and a photoresist is applied on the base pattern is divided into a plurality of segments; distortion of the base pattern is detected in each divided segment; and a drawing data is corrected in accordance with the distortion of the base pattern in each divided segment based on the detection results. The substrate 1 is mounted on a chuck 10; the chuck 10 and a light beam irradiation device 20 are relatively moved; and the substrate 1 is scanned with a light beam from the light beam irradiation device 20 to draw a pattern on the substrate 1. The light beam irradiation device 20 includes a spatial optical modulator modulating a light beam, a drive circuit driving the spatial optical modulator based on a drawing data, and an irradiation optical system for projecting the light beam modulated by the spatial optical modulator. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an exposure apparatus that exposes a light beam to a substrate coated with a photoresist, scans the substrate with the light beam, and draws a pattern on the substrate in the manufacture of a display panel substrate such as a liquid crystal display device. The present invention relates to a method and a manufacturing method of a display panel substrate using them, and in particular, an exposure apparatus suitable for exposing a new pattern on a base pattern formed on the substrate, an exposure method, and a display using them. The present invention relates to a method for manufacturing a panel substrate for use.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. Conventionally, as an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There was a proximity method to transfer.

  In recent years, an exposure apparatus has been developed that irradiates a substrate coated with a photoresist with a light beam, scans the substrate with the light beam, and draws a pattern on the substrate. Since the substrate is scanned by the light beam and the pattern is directly drawn on the substrate, an expensive mask is not required. Further, by changing the drawing data and the scanning program, various types of display panel substrates can be supported. Examples of such an exposure apparatus include those described in Patent Document 1, Patent Document 2, and Patent Document 3.

JP 2003-332221 A JP 2005-353927 A JP 2007-219011 A

  In recent years, in the manufacture of various substrates for display panels, a relatively large substrate is prepared in order to cope with an increase in size and size, and a plurality of displays from one substrate are prepared according to the size of the display panel. Manufacturing panel boards. In the proximity method mainly used for exposure of a large substrate, if one surface of the substrate is to be exposed at a time, a mask having the same size as the substrate is required, and the cost of an expensive mask is further increased. In view of this, the mainstream method uses a mask that is relatively smaller than the substrate, moves the substrate stepwise in the XY directions, and divides one surface of the substrate into a plurality of shots.

  In the proximity method, if the mask and the substrate are not parallel during exposure, the rectangular exposure area of the mask is transferred to the substrate in a shape close to a trapezoid, and the pattern transferred to the substrate is distorted. When exposing one side of a substrate in multiple shots, it is difficult to make the mask and the substrate completely parallel in each shot, and the distortion of the pattern transferred to the substrate changes slightly from shot to shot. .

  In the method of drawing a pattern directly on the substrate, the substrate and the light beam irradiation device are moved relative to each other to scan the substrate with the light beam. At this time, the substrate and the light beam irradiation device are kept in parallel. If it does not move, the distance between the substrate and the light beam irradiating device varies, so that the pattern drawn on the substrate is distorted. However, it is difficult to move the substrate and the light beam irradiation apparatus while keeping them completely parallel, and the distortion of the pattern drawn on the substrate varies depending on the location within the substrate.

  As described above, when a new pattern is exposed on a ground pattern formed on the substrate by exposure using a proximity method or a method of directly drawing a pattern on the substrate, the distortion of the ground pattern varies depending on the location in the substrate. The positional relationship between the base pattern and the newly exposed pattern changes depending on the location within the substrate. Therefore, for example, in the manufacture of a color filter substrate of a liquid crystal display device, when a colored pattern is exposed on a black matrix formed on the substrate, the colored pattern is displaced from the position of each pixel depending on the location in the substrate. There was a problem.

  The subject of the present invention is that when a new pattern is exposed on the base pattern formed on the substrate, the new pattern is converted into the base pattern over the entire substrate even if the distortion of the base pattern varies depending on the location in the substrate. It is exposing together. Another object of the present invention is to manufacture a high-quality display panel substrate.

  An exposure apparatus according to the present invention includes a chuck on which a base pattern is formed and a substrate coated with a photoresist on the base pattern, a spatial light modulator that modulates a light beam, and spatial light based on drawing data. A driving circuit for driving the modulator, a light beam irradiation device having an irradiation optical system for irradiating the light beam modulated by the spatial light modulator, and a moving means for relatively moving the chuck and the light beam irradiation device; An exposure apparatus that relatively moves the chuck and the light beam irradiation device by a moving unit, scans the substrate with the light beam from the light beam irradiation device, and draws a pattern on the substrate. Is divided into a plurality of sections, and detection means for detecting the distortion of the background pattern for each of the divided sections, and based on the detection result of the detection means, according to the distortion of the background pattern for each divided section Is obtained by a drawing control means for correcting the drawing data supplied to the drive circuit of a light beam irradiation device.

  The exposure method of the present invention also includes a substrate on which a base pattern is formed and a photoresist is coated on the base pattern, mounted on the chuck, a spatial light modulator that modulates the light beam, and drawing data. And a light beam irradiation apparatus having a driving circuit for driving the spatial light modulator based thereon and a light beam irradiation apparatus having an irradiation optical system for irradiating the light beam modulated by the spatial light modulator. Is an exposure method for drawing a pattern on a substrate by scanning the substrate with a light beam from the substrate, dividing the surface of the substrate into a plurality of sections, detecting distortion of the ground pattern in each divided section, and Based on this, the drawing data supplied to the drive circuit of the light beam irradiation device is corrected according to the distortion of the ground pattern for each divided section.

  The spatial light modulator of the light beam irradiation device is configured by arranging a plurality of minute mirrors that reflect the light beam in two directions, and the drive circuit changes the angle of each mirror based on the drawing data. Modulates the light beam applied to the substrate. The light beam modulated by the spatial light modulator is irradiated onto the substrate supported by the chuck from the head unit including the irradiation optical system of the light beam irradiation apparatus. Dividing the surface of the substrate into a plurality of sections, detecting the distortion of the ground pattern for each of the divided sections, and based on the detection result, depending on the distortion of the ground pattern for each divided section, to the drive circuit of the light beam irradiation device Since the drawing data to be supplied is corrected, even if the distortion of the ground pattern varies depending on the location within the substrate, a new pattern is exposed along the ground pattern over the entire substrate.

  Furthermore, in the exposure apparatus of the present invention, the detection means divides the surface of the substrate exposed by dividing the base pattern into a plurality of shots into sections of each shot, and detects distortion of the base pattern for each section of each shot. Is. The exposure method according to the present invention divides the surface of the substrate exposed by dividing the base pattern into a plurality of shots, and detects the distortion of the base pattern for each shot section. In a substrate on which the base pattern is exposed by the proximity method, even if the distortion of the base pattern varies from shot to shot, a new pattern is exposed along the base pattern over the entire substrate.

  Furthermore, the exposure apparatus of the present invention includes a plurality of image acquisition devices that each of the detection means acquires images of a plurality of position detection marks provided in the base pattern for each divided section, and outputs an image signal. An image processing device that processes the image signal output by the image acquisition device to detect the position of each position detection mark, and a detection that detects distortion of the ground pattern for each divided section based on the detection result of the image processing device Circuit. Further, the exposure method of the present invention acquires images of a plurality of position detection marks provided in the base pattern for each divided section, processes the image signals of the acquired images, and positions the position detection marks. And the distortion of the ground pattern for each divided section is detected based on the detection result. By using a plurality of position detection marks provided in the base pattern for each divided section, the distortion of the base pattern for each divided section is detected with high accuracy.

  Furthermore, the exposure apparatus of the present invention includes a temperature adjustment device that adjusts the temperature of the substrate by mounting the substrate before mounting the substrate on the chuck, and a plurality of image acquisition devices are provided above the temperature adjustment device. The image of the plurality of position detection marks on the surface of the substrate mounted on the temperature adjustment device is acquired, and the detection result of the detection circuit is detected while the drawing control means adjusts the temperature of the substrate by the temperature adjustment device. Based on the above, the drawing data supplied to the drive circuit of the light beam irradiation apparatus is corrected. In addition, the exposure method of the present invention includes mounting a substrate on a temperature control device to adjust the temperature of the substrate before mounting the substrate on the chuck, and providing a plurality of image acquisition devices above the temperature control device. The image acquisition device acquires images of a plurality of position detection marks on the surface of the substrate mounted on the temperature adjustment device, and while the temperature adjustment device adjusts the substrate temperature, the substrate for each divided section Based on the detection result of the distortion of the pattern, the drawing data supplied to the drive circuit of the light beam irradiation apparatus is corrected. After the substrate is transferred from the temperature control device to the chuck, the exposure process can be started without waiting for correction of the drawing data, and the tact time is shortened.

  Alternatively, the exposure apparatus of the present invention includes a plurality of chucks and moving means, and each moving means sequentially moves each chuck from a standby position away from the bottom of the light beam irradiation apparatus to an exposure position below the light beam irradiation apparatus. A plurality of image acquisition devices are provided above the chuck at the standby position, acquire images of a plurality of position detection marks on the surface of the substrate mounted on the chuck at the standby position, and perform drawing control. The means corrects the drawing data supplied to the drive circuit of the light beam irradiation apparatus based on the detection result of the detection circuit while the chuck on which the substrate is mounted is waiting at the standby position. Further, the exposure method of the present invention is provided with a plurality of moving means for moving the chuck and the chuck, and by each moving means, each chuck is moved from the standby position away from the bottom of the light beam irradiation apparatus to the bottom of the light beam irradiation apparatus. Move to the exposure position in order, and provide a plurality of image acquisition devices above the chuck at the standby position, and detect a plurality of positions on the surface of the substrate mounted on the chuck at the standby position by the plurality of image acquisition devices. Drawing data obtained by acquiring the mark image and supplying it to the drive circuit of the light beam irradiation device based on the detection result of the distortion of the ground pattern for each divided section while the chuck on which the substrate is mounted is waiting at the standby position. Is to correct. Substrates mounted on a plurality of chucks can be exposed sequentially without waiting for correction of drawing data at the exposure position, and the tact time is shortened.

  The method for producing a display panel substrate according to the present invention involves exposing the substrate using any one of the above exposure apparatuses or exposure methods. By using the above exposure apparatus or exposure method, a new pattern is exposed in accordance with the base pattern over the entire substrate, so that a high-quality display panel substrate is manufactured.

  According to the exposure apparatus and the exposure method of the present invention, the surface of the substrate is divided into a plurality of sections, the distortion of the ground pattern is detected for each of the divided sections, and the distortion of the ground pattern for each of the divided sections is based on the detection result. Accordingly, by correcting the drawing data supplied to the drive circuit of the light beam irradiation device, even if the distortion of the ground pattern varies depending on the location in the substrate, the new pattern is matched to the ground pattern over the entire substrate. Can be exposed.

  Furthermore, according to the exposure apparatus and the exposure method of the present invention, the substrate surface exposed by dividing the base pattern into a plurality of shots is divided into sections of each shot, and distortion of the base pattern is detected for each section of each shot. By doing so, even if the substrate pattern is exposed by the proximity method, even if the distortion of the substrate pattern varies from shot to shot, a new pattern can be exposed to the substrate pattern over the entire substrate.

  Furthermore, according to the exposure apparatus and the exposure method of the present invention, an image of a plurality of position detection marks provided in the base pattern is obtained for each divided section, the image signal of the obtained image is processed, and each position is processed. By detecting the position of the detection mark and detecting the distortion of the ground pattern for each divided section based on the detection result, by using a plurality of position detection marks provided in the ground pattern for each divided section, Distortion of the ground pattern for each divided section can be detected with high accuracy.

  Furthermore, according to the exposure apparatus and the exposure method of the present invention, before the substrate is mounted on the chuck, the substrate is mounted on the temperature adjustment device to adjust the temperature of the substrate, and a plurality of image acquisition devices above the temperature adjustment device. A plurality of image acquisition devices to acquire images of a plurality of position detection marks on the surface of the substrate mounted on the temperature adjustment device, and to divide the image while adjusting the temperature of the substrate by the temperature adjustment device. The drawing data supplied to the drive circuit of the light beam irradiation device is corrected based on the detection result of the ground pattern distortion for each section, and after the substrate is transported from the temperature control device to the chuck, the correction of the drawing data is awaited. Since the exposure process can be started without necessity, the tact time can be shortened.

  Alternatively, according to the exposure apparatus and the exposure method of the present invention, a plurality of moving means for moving the chuck and the chuck are provided, and each moving means moves each chuck from the standby position away from the bottom of the light beam irradiation apparatus. Move sequentially to the exposure position below the irradiation device, and provide a plurality of image acquisition devices above the chuck at the standby position. The plurality of image acquisition devices allow the surface of the substrate mounted on the chuck at the standby position. While acquiring images of a plurality of position detection marks and the chuck on which the substrate is mounted is waiting at the standby position, based on the detection result of the distortion of the ground pattern for each divided section, the drive circuit of the light beam irradiation device By correcting the drawing data supplied to the substrate, it is possible to sequentially expose the substrates mounted on the plurality of chucks without waiting for the correction of the drawing data at the exposure position. , It is possible to shorten the tact time.

  According to the method for manufacturing a display panel substrate of the present invention, a new pattern can be exposed to match the base pattern over the entire substrate, so that a high-quality display panel substrate can be manufactured.

1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. 1 is a side view of an exposure apparatus according to an embodiment of the present invention. 1 is a front view of an exposure apparatus according to an embodiment of the present invention. It is a figure which shows schematic structure of a light beam irradiation apparatus. It is a figure explaining operation | movement of a laser length measurement system. It is a figure which shows the alignment mark of a board | substrate. Fig.7 (a) is a top view of a temperature control apparatus, FIG.7 (b) is a side view of a temperature control apparatus. It is a figure explaining operation | movement of a distortion detection circuit. It is a top view of the chuck | zipper in a delivery position. It is a side view of the chuck | zipper in a delivery position. It is a figure which shows schematic structure of a drawing control part. It is a figure which shows schematic structure of the exposure apparatus by other embodiment of this invention. It is a top view of the chuck in a standby position. It is a side view of the chuck | zipper in a standby position. It is a figure which shows schematic structure of a drawing control part. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of the exposure apparatus according to the embodiment of the present invention, and FIG. 3 is a front view of the exposure apparatus according to the embodiment of the present invention. This embodiment shows an example of an exposure apparatus that exposes a new pattern on a base pattern formed on a substrate by exposure using a proximity method. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck 10, a gate 11, a light beam irradiation device 20, linear scales 31, 33, encoders 32, 34, A laser length measurement system, a laser length measurement system control device 40, a running error detection circuit 46, image processing devices 48 and 53, a temperature adjustment device 50, a strain detection circuit 54, a stage drive circuit 60, and a main control device 70 are configured. Has been. 2 and 3, the laser light source 41 of the laser length measurement system, the laser length measurement system control device 40, the running error detection circuit 46, the image processing devices 48 and 53, the temperature adjustment device 50, the strain detection circuit 54, the stage. The drive circuit 60 and the main controller 70 are omitted. In addition to these, the exposure apparatus includes a substrate transfer robot that loads the substrate 1 into the chuck 10 and unloads the substrate 1 from the chuck 10, a temperature control unit that performs temperature management in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is carried into the chuck 10 by a substrate carrying robot (not shown), and the substrate 1 is carried out of the chuck 10 by a substrate carrying robot (not shown). The chuck 10 supports the back surface of the substrate 1 by vacuum suction. On the surface of the substrate 1, a photoresist is applied on a base pattern formed by exposure by a proximity method.

  A gate 11 is provided across the base 3 above the exposure position where the substrate 1 is exposed. A plurality of light beam irradiation devices 20 are mounted on the gate 11. Although the present embodiment shows an example of an exposure apparatus using eight light beam irradiation apparatuses 20, the number of light beam irradiation apparatuses is not limited to this, and the present invention is one or two or more. The present invention is applied to an exposure apparatus using a light beam irradiation apparatus.

  FIG. 4 is a diagram showing a schematic configuration of the light beam irradiation apparatus. The light beam irradiation device 20 includes an optical fiber 22, a lens 23, a mirror 24, a DMD (Digital Micromirror Device) 25, a projection lens 26, and a DMD driving circuit 27. The optical fiber 22 introduces an ultraviolet light beam generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is irradiated to the DMD 25 through the lens 23 and the mirror 24. The DMD 25 is a spatial light modulator configured by arranging a plurality of minute mirrors that reflect a light beam in two directions, and modulates the light beam by changing the angle of each mirror. The light beam modulated by the DMD 25 is irradiated from the head unit 20 a including the projection lens 26. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main controller 70.

  2 and 3, the chuck 10 is mounted on the θ stage 8, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves in the X direction along the X guide 4. The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves in the Y direction along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The X stage 5, Y stage 7, and θ stage 8 are provided with drive mechanisms (not shown) such as ball screws and motors, linear motors, etc., and each drive mechanism is driven by a stage drive circuit 60 of FIG. The

  By rotation of the θ stage 8 in the θ direction, the substrate 1 mounted on the chuck 10 is rotated so that two orthogonal sides are directed in the X direction and the Y direction. As the X stage 5 moves in the X direction, the chuck 10 is moved between the delivery position and the exposure position. When the X stage 5 moves in the X direction at the exposure position, the light beam irradiated from the head unit 20a of each light beam irradiation apparatus 20 scans the substrate 1 in the X direction. In addition, as the Y stage 7 moves in the Y direction, the scanning region of the substrate 1 by the light beam emitted from the head unit 20a of each light beam irradiation device 20 is moved in the Y direction. In FIG. 1, the main controller 70 controls the stage drive circuit 60 to rotate the θ stage 8 in the θ direction, move the X stage 5 in the X direction, and move the Y stage 7 in the Y direction. .

  In the present embodiment, the substrate 10 is scanned by the light beam from the light beam irradiation device 20 by moving the chuck 10 in the X direction by the X stage 5, but the light beam irradiation device 20 is moved. By doing so, the substrate 1 may be scanned by the light beam from the light beam irradiation device 20. In the present embodiment, the scanning region of the substrate 1 by the light beam from the light beam irradiation device 20 is changed by moving the chuck 10 in the Y direction by the Y stage 7, but the light beam irradiation device 20. , The scanning region of the substrate 1 by the light beam from the light beam irradiation device 20 may be changed.

  1 and 2, the base 3 is provided with a linear scale 31 extending in the X direction. The linear scale 31 is provided with a scale for detecting the amount of movement of the X stage 5 in the X direction. The X stage 5 is provided with a linear scale 33 extending in the Y direction. The linear scale 33 is provided with a scale for detecting the amount of movement of the Y stage 7 in the Y direction.

  1 and 3, an encoder 32 is attached to one side surface of the X stage 5 so as to face the linear scale 31. The encoder 32 detects the scale of the linear scale 31 and outputs a pulse signal to the main controller 70. 1 and 2, an encoder 34 is attached to one side surface of the Y stage 7 so as to face the linear scale 33. The encoder 34 detects the scale of the linear scale 33 and outputs a pulse signal to the main controller 70. Main controller 70 counts the pulse signal of encoder 32, detects the amount of movement of X stage 5 in the X direction, counts the pulse signal of encoder 34, and moves the amount of Y stage 7 in the Y direction. Is detected.

  FIG. 5 is a diagram for explaining the operation of the laser length measurement system. In FIG. 5, the gate 11, the light beam irradiation device 20, the image processing devices 48 and 53, the temperature adjustment device 50, and the distortion detection circuit 54 shown in FIG. 1 are omitted. The laser length measurement system is a known laser interference type length measurement system, and includes a laser light source 41, laser interferometers 42 and 44, and bar mirrors 43 and 45. The bar mirror 43 is attached to one side surface of the chuck 10 that extends in the Y direction. The bar mirror 45 is attached to one side surface of the chuck 10 extending in the X direction.

  The laser interferometer 42 irradiates the laser beam from the laser light source 41 onto the bar mirror 43, receives the laser beam reflected by the bar mirror 43, and the laser beam reflected from the laser beam source 41 and the laser beam reflected by the bar mirror 43. Measure interference. This measurement is performed at two locations in the Y direction. The laser length measurement system control device 40 detects the position and rotation of the chuck 10 in the X direction from the measurement result of the laser interferometer 42 under the control of the main control device 70.

  On the other hand, the laser interferometer 44 irradiates the laser beam from the laser light source 41 to the bar mirror 45, receives the laser beam reflected by the bar mirror 45, and the laser beam reflected from the laser source 41 and the bar mirror 45. Measure interference with light. The laser length measurement system control device 40 detects the position of the chuck 10 in the Y direction from the measurement result of the laser interferometer 44 under the control of the main control device 70.

  The travel error detection circuit 46 detects a travel error such as rolling or yawing when the X stage 5 moves in the X direction from the detection result of the laser length measurement system control device 40. By detecting the position of the chuck 10 using the laser length measurement system, the position of the chuck 10 can be detected with high accuracy, so that the running error of the X stage 5 can be detected with high accuracy. The travel error detection circuit 46 outputs the detection result to the main controller 70.

  In FIG. 1, a temperature adjusting device 50 is installed in front of the base 3. Usually, since the temperature of the substrate 1 is increased or decreased by the processing in the previous step, it is necessary to cool or warm the substrate 1 before performing exposure. A substrate transfer robot (not shown) loads the substrate 1 into the temperature adjusting device 50 before loading the substrate 1 into the chuck 10, and loads the substrate 1 whose temperature is adjusted by the temperature adjusting device 50 into the chuck 10. While the exposure of the substrate 1 mounted on the chuck 10 is being performed, the temperature adjustment device 50 mounts the substrate 1 to be exposed next and adjusts the temperature of the substrate 1. In this embodiment, the surface of the substrate 1 is divided into sections of each shot exposed by the proximity method, and the temperature adjustment device 50 adjusts the temperature of the substrate 1 while the substrate pattern 1 is aligned. The position of the mark is detected, the distortion of the ground pattern for each section of each shot is detected, and the drawing supplied to the DMD drive circuit 27 of the light beam irradiation apparatus 20 according to the distortion of the ground pattern for each section of each shot Correct the data.

  FIG. 6 is a diagram showing alignment marks on the substrate. FIG. 6 shows an example in which four display panel substrates are manufactured from one substrate. Global alignment marks GAM for detecting the position and rotation of the substrate 1 are provided at the four corners of the surface of the substrate 1. Further, four base patterns 2a, 2b, 2c and 2d are formed on the surface of the substrate 1 by four shots. The base patterns 2a, 2b, 2c and 2d are provided with four shot alignment marks SAMa, SAMb, SAMc and SAMd, respectively, for detecting the position and rotation of the base patterns 2a, 2b, 2c and 2d.

  Fig.7 (a) is a top view of a temperature control apparatus, FIG.7 (b) is a side view of a temperature control apparatus. As shown in FIGS. 7A and 7B, a CCD camera 51 is installed above the temperature adjustment device 50 at a position directly above the global alignment mark GAM of the substrate 1. The CCD camera 51 acquires an image of the global alignment mark GAM and outputs an image signal to the image processing device 53 in FIG. In addition, CCD cameras 52a, 52b, 52c, and 52d are installed above the temperature control device 50 at positions immediately above the shot alignment marks SAMa, SAMb, SAMc, and SAMd on the substrate 1. The CCD cameras 52a, 52b, 52c, and 52d acquire images of the shot alignment marks SAMa, SAMb, SAMc, and SAMd, respectively, and output image signals to the image processing device 53 in FIG.

  In FIG. 1, an image processing device 53 processes the image signal output from the CCD camera 51 to detect the position of the global alignment mark GAM. The distortion detection circuit 54 detects the position and rotation of the substrate 1 mounted on the temperature adjustment device 50 from the position of the global alignment mark GAM detected by the image processing device 53. The image processing device 53 processes the image signals output from the CCD cameras 52a, 52b, 52c, and 52d, and detects the positions of the shot alignment marks SAMa, SAMb, SAMc, and SAMd. The distortion detection circuit 54 detects the position and rotation of the substrate 1 and the positions of the shot alignment marks SAMa, SAMb, SAMc, and SAMd detected by the image processing device 53 in the substrate 1 of the underlying patterns 2a, 2b, 2c, and 2d. The position and rotation at are detected. Using the shot alignment marks SAMa, SAMb, SAMc, and SAMd provided on the underlying patterns 2a, 2b, 2c, and 2d of each shot, the substrate 1 of the underlying patterns 2a, 2b, 2c, and 2d of each shot is subjected to image processing. The position at is accurately detected.

  Further, the distortion detection circuit 54 detects the distortion of the underlying patterns 2a, 2b, 2c, and 2d from the positions of the shot alignment marks SAMa, SAMb, SAMc, and SAMD detected by the image processing device 53. FIG. 8 is a diagram for explaining the operation of the distortion detection circuit. FIG. 8 shows an example in which the distortion of the base pattern 2a is detected from the positions of the four shot alignment marks SAMa1, SAMa2, SAMa3, and SAMa4 of the base pattern 2a.

  The distortion detection circuit 54 calculates the slope of the lower side of the base pattern 2a from the positions of the shot alignment marks SAMa1 and SAMa2 detected by the image processing device 53. Then, the distortion detection circuit 54 calculates the shift amount in the scanning direction of the lower end of the base pattern 2a for each scanning region 1a from the calculated slope of the lower side of the base pattern 2a. Further, the distortion detection circuit 54 calculates the inclination of the upper side of the base pattern 2a from the positions of the shot alignment marks SAMa3 and SAMa4 detected by the image processing device 53. Then, the distortion detection circuit 54 calculates the amount of deviation in the scanning direction of the upper end of the base pattern 2a for each scanning region 1a from the calculated slope of the upper side of the base pattern 2a. The distortion detection circuit 54 determines these calculated shift amounts as a drawing start position correction value and a drawing end position correction value for each scanning region 1a.

  Next, for each scanning region 1a, the distortion detection circuit 54 calculates the displacement of the underlying pattern 2a from the calculated displacement amount of the lower end of the underlying pattern 2a in the scanning direction and the calculated displacement amount of the upper end of the underlying pattern 2a. The amount of expansion / contraction in the scanning direction is calculated. The distortion detection circuit 54 determines the calculated expansion / contraction amount as a scanning direction expansion / contraction correction value for each scanning region 1a.

  Subsequently, the distortion detection circuit 54 calculates the slope of the left side of the base pattern 2a from the positions of the shot alignment marks SAMa1 and SAMa4 detected by the image processing device 53. Further, the distortion detection circuit 54 calculates the inclination of the right side of the base pattern 2a from the positions of the shot alignment marks SAMa2 and SAMa3 detected by the image processing device 53. Then, the distortion detection circuit 54 assigns the difference between the calculated slope of the left side and the slope of the right side of the base pattern 2a equally to each scanning region 1a, and the slope of the base pattern 2a with respect to the scanning direction for each scanning region 1a. Is calculated.

  FIG. 8 shows an example in which the distortion of the base pattern 2a is detected, but the same applies to the base patterns 2b, 2c, and 2d. Using the shot alignment marks SAMa, SAMb, SAMc, and SAMD provided on the underlying patterns 2a, 2b, 2c, and 2d of each shot, the distortion of the underlying patterns 2a, 2b, 2c, and 2d of each shot is detected with high accuracy. .

  FIG. 9 is a top view of the chuck in the delivery position. FIG. 10 is a side view of the chuck in the delivery position. As shown in FIGS. 9 and 10, a CCD camera 47 is installed above the global alignment mark GAM of the substrate 1 above the chuck 10 at the delivery position. The CCD camera 47 acquires an image of the global alignment mark GAM and outputs an image signal to the image processing device 48 in FIG. In FIG. 1, the image processing device 48 processes the image signal output from the CCD camera 47 and detects the position of the global alignment mark GAM.

  In FIG. 1, the main controller 70 detects the position and rotation of the substrate 1 mounted on the chuck 10 from the position of the global alignment mark GAM detected by the image processing device 48. The main controller 70 controls the stage drive circuit 60 based on the detected position of the substrate 1, and the X stage 5 and the Y stage so that the center point of the substrate 1 comes to a predetermined position before the exposure is started. 7, the chuck 10 is moved to the exposure position. Further, the main controller 70 controls the stage drive circuit 60 based on the detected rotation of the substrate 1 so that two orthogonal sides of the substrate 1 mounted on the chuck 10 are directed in the X direction and the Y direction. The θ stage 8 is rotated in the θ direction.

  The main controller 70 has a drawing controller that supplies drawing data to the DMD drive circuit 27 of the light beam irradiation device 20. FIG. 11 is a diagram illustrating a schematic configuration of the drawing control unit. The drawing control unit 71 includes memories 72 and 76, a bandwidth setting unit 73, a center point coordinate determination unit 74, a coordinate determination unit 75, and a drawing data creation unit 77.

  The memory 76 stores a design value map. In the design value map, the drawing data is indicated by XY coordinates when the positions and rotations of the base patterns 2a, 2b, 2c, and 2d in the substrate 1 are as designed values. The drawing data creation unit 77 adjusts the position and rotation of the underlying patterns 2a, 2b, 2c, and 2d detected by the strain detection circuit 54 in the substrate 1 while the temperature adjustment device 50 adjusts the temperature of the substrate 1. In response, the XY coordinates of the drawing data of the design value map stored in the memory 76 are converted, and drawing data to be supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20 is created. The drawing data creation unit 77 creates the drawing data according to the distortion of the ground patterns 2a, 2b, 2c, and 2d detected by the distortion detection circuit 54 while the temperature adjustment device 50 is adjusting the temperature of the substrate 1. Correct the drawing data.

  The drawing data creation unit 77 uses the drawing start position correction value and the drawing end position correction value for each scanning area 1a determined by the distortion detection circuit 54, and draws the drawing start position and drawing of the created drawing data for each scanning area 1a. Change the address of the end position. Further, the drawing data creation unit 77 changes the scanning direction address of the created drawing data for each scanning region 1 a using the scanning direction expansion / contraction correction value for each scanning region 1 a determined by the distortion detection circuit 54. In addition, the drawing data creation unit 77 generates drawing data created for each scanning region 1a in accordance with the inclination of the base pattern 2a, 2b, 2c, 2d for each scanning region 1a calculated by the distortion detection circuit 54 with respect to the scanning direction. The address is shifted in the direction orthogonal to the scanning direction.

  The memory 72 stores the drawing data corrected by the drawing data creation unit 77 using the XY coordinates as an address. The memory 72 is provided with an area for storing the drawing data A for the substrate 1 already mounted on the chuck 10 and an area for storing the drawing data B for the substrate 1 mounted on the temperature control device 50.

  The bandwidth setting unit 73 sets the Y-direction bandwidth of the light beam emitted from the head unit 20 a of the light beam irradiation device 20 by determining the range of the Y coordinate of the drawing data read from the memory 72.

  The laser length measurement system control device 40 detects the position of the chuck 10 in the X and Y directions before the exposure of the substrate 1 at the exposure position is started. The center point coordinate determination unit 74 determines the XY coordinates of the center point of the chuck 10 before starting the exposure of the substrate 1 from the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40. In FIG. 1, when scanning the substrate 1 with the light beam from the light beam irradiation device 20, the main control device 70 controls the stage drive circuit 60 to move the chuck 10 in the X direction by the X stage 5. When moving the scanning area of the substrate 1, the main controller 70 controls the stage drive circuit 60 to move the chuck 10 in the Y direction by the Y stage 7. In FIG. 11, the center point coordinate determination unit 74 counts the pulse signals from the encoders 32 and 34, detects the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction, The XY coordinates of the center point of the chuck 10 are determined. Then, the center point coordinate determination unit 74 corrects the determined XY coordinates of the center point of the chuck 10 based on the detection result of the running error detection circuit 46.

  The coordinate determination unit 75 determines the XY coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 based on the XY coordinates of the center point of the chuck 10 corrected by the center point coordinate determination unit 74. The memory 72 inputs the XY coordinates determined by the coordinate determination unit 75 as an address, and outputs the drawing data stored at the input XY coordinate address to the DMD drive circuit 27 of each light beam irradiation apparatus 20.

  The distortion of the ground patterns 2a, 2b, 2c, 2d for each section of each shot is detected, and light beam irradiation is performed according to the distortion of the ground patterns 2a, 2b, 2c, 2d for each section of each shot based on the detection result. Since the drawing data supplied to the DMD driving circuit 27 of the apparatus 20 is corrected, even if the distortion of the ground patterns 2 a, 2 b, 2 c, 2 d varies depending on the location in the substrate 1, a new pattern is spread over the entire substrate 1. Exposure is performed in accordance with the patterns 2a, 2b, 2c, and 2d.

  Further, while adjusting the temperature of the substrate 1 by the temperature adjusting device 50, the DMD driving of the light beam irradiation device 20 is performed based on the detection result of the distortion of the ground patterns 2a, 2b, 2c, and 2d for each section of each shot. Since the drawing data supplied to the circuit 27 is corrected, the exposure process can be started without waiting for the correction of the drawing data after the substrate 1 is transported from the temperature control device 50 to the chuck 10, and the tact time is shortened. .

  Further, the travel error of the X stage 5 is detected, and based on the detection result of the travel error of the X stage 5, the coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 are corrected, and the corrected coordinate Since the drawing data is supplied to the DMD drive circuit 27 of each light beam irradiation device 20, even if a running error such as rolling or yawing occurs in the X stage 5, the pattern is drawn with high accuracy.

  FIG. 12 is a view showing the schematic arrangement of an exposure apparatus according to another embodiment of the present invention. In this embodiment, the X stage 5, Y guide 6, Y stage 7, θ stage 8, chuck 10, linear scale 33, encoders 32 and 34, laser length measuring system laser interferometer 42 and bar mirror shown in FIG. 43, 45 and two sets of temperature control devices 50 are provided. In FIG. 12, the laser light source 41 of the laser measurement system, the laser measurement system control device 40, the travel error detection circuit 46, the image processing device 53, the distortion detection circuit 54, the stage drive circuit 60, and the like shown in FIG. The main controller 70 is omitted.

  Each chuck 10 on which the substrate 1 is mounted at the delivery position is moved to a standby position away from the bottom of the light beam irradiation device 20 by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. The In the present embodiment, the standby position is different from the delivery position. However, the standby position may be the same position as the delivery position. In this case, the movement of each chuck 10 from the delivery position to the standby position is performed. It is unnecessary.

  FIG. 12 shows a state where each chuck 10 is in the standby position. Each chuck 10 is sequentially moved from the standby position to the exposure position below the light beam irradiation device 20, and the substrate 1 mounted on each chuck 10 is exposed. In the present embodiment, the surface of the substrate 1 is divided into sections of each shot exposed by the proximity method, and the base pattern 2a of each shot is taken while the chuck 10 on which the substrate 1 is mounted is waiting at the standby position. , 2b, 2c, and 2d, the positions of the shot alignment marks SAMa, SAMb, SAMc, and SAMd are detected, and the distortions of the ground patterns 2a, 2b, 2c, and 2d in each shot are detected, and each shot is divided. The drawing data supplied to the DMD driving circuit 27 of the light beam irradiation apparatus 20 is corrected according to the distortion of the underlying patterns 2a, 2b, 2c, and 2d.

  FIG. 13 is a top view of the chuck in the standby position. FIG. 14 is a side view of the chuck in the standby position. Above the chuck 10 at the standby position, a CCD camera 51 is installed at a position just above the global alignment mark GAM of the substrate 1. The CCD camera 51 acquires an image of the global alignment mark GAM and outputs an image signal to the image processing device 53 in FIG. In addition, CCD cameras 52a, 52b, 52c, and 52d are installed above the chuck 10 at the standby position at positions just above the shot alignment marks SAMa, SAMb, SAMc, and SAMd of the substrate 1. The CCD cameras 52a, 52b, 52c, and 52d acquire images of the shot alignment marks SAMa, SAMb, SAMc, and SAMd, respectively, and output image signals to the image processing device 53 in FIG.

  The image processing device 53 processes the image signal output from the CCD camera 51 and detects the position of the global alignment mark GAM. The distortion detection circuit 54 detects the position and rotation of the substrate 1 mounted on the chuck 10 from the position of the global alignment mark GAM detected by the image processing device 53. The image processing device 53 processes the image signals output from the CCD cameras 52a, 52b, 52c, and 52d, and detects the positions of the shot alignment marks SAMa, SAMb, SAMc, and SAMd. The distortion detection circuit 54 detects the position and rotation of the substrate 1 and the positions of the shot alignment marks SAMa, SAMb, SAMc, and SAMd detected by the image processing device 53 in the substrate 1 of the underlying patterns 2a, 2b, 2c, and 2d. The position and rotation at are detected. Using the shot alignment marks SAMa, SAMb, SAMc, and SAMd provided on the underlying patterns 2a, 2b, 2c, and 2d of each shot, the substrate 1 of the underlying patterns 2a, 2b, 2c, and 2d of each shot is subjected to image processing. The position at is accurately detected.

  Further, the distortion detection circuit 54 detects the distortion of the underlying patterns 2a, 2b, 2c, and 2d from the positions of the shot alignment marks SAMa, SAMb, SAMc, and SAMD detected by the image processing device 53. The operation of the distortion detection circuit 54 is the same as that in FIG.

  The main controller 70 controls the stage driving circuit 60 based on the position of the substrate 1 detected by the distortion detection circuit 54 so that the center point of the substrate 1 comes to a predetermined position before the exposure is started. The chuck 10 is moved to the exposure position by the stage 5. Further, the main controller 70 controls the stage driving circuit 60 based on the rotation of the substrate 1 detected by the strain detection circuit 54 so that two orthogonal sides of the substrate 1 mounted on the chuck 10 are in the X direction and the Y direction. The θ stage 8 is rotated in the θ direction so as to face.

  The main controller 70 has a drawing controller that supplies drawing data to the DMD drive circuit 27 of the light beam irradiation device 20. FIG. 15 is a diagram illustrating a schematic configuration of the drawing control unit. The drawing control unit 71 ′ includes memories 72 and 76, a bandwidth setting unit 73, a center point coordinate determination unit 74, a coordinate determination unit 75, and a drawing data creation unit 77 ′.

  The drawing data creation unit 77 ′ detects the position of the underlying patterns 2a, 2b, 2c, and 2d detected by the strain detection circuit 54 in the substrate 1 while the chuck 10 on which the substrate 1 is mounted is waiting at the standby position. In accordance with the rotation, the XY coordinates of the drawing data of the design value map stored in the memory 76 are converted, and drawing data to be supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20 is created. Then, the drawing data creation unit 77 ′ responds to the distortion of the ground patterns 2 a, 2 b, 2 c, 2 d detected by the distortion detection circuit 54 while the chuck 10 on which the substrate 1 is mounted is waiting at the standby position. Correct the created drawing data. The operation of the drawing data creation unit 77 'is the same as that of the drawing data creation unit 77 in FIG.

  The memory 72 stores the drawing data corrected by the drawing data creation unit 77 'using the XY coordinates as an address. The memory 72 is provided with an area for storing drawing data A for the substrate 1 mounted on one chuck 10 and an area for storing drawing data B for the substrate 1 mounted on the other chuck 10. Other components are the same as those of the drawing control unit shown in FIG.

  While the chuck 10 on which the substrate 1 is mounted is waiting at the standby position, the DMD driving circuit of the light beam irradiation device 20 is based on the detection result of the distortion of the ground patterns 2a, 2b, 2c, 2d for each section of each shot. Since the drawing data supplied to 27 is corrected, the substrates 1 mounted on the plurality of chucks 10 can be exposed sequentially without waiting for the correction of the drawing data at the exposure position, and the tact time is shortened.

  16 to 19 are diagrams for explaining scanning of the substrate by the light beam. FIGS. 16 to 19 show an example in which the entire substrate 1 is scanned by scanning the substrate 1 in the X direction four times with eight light beams from the eight light beam irradiation apparatuses 20. 16-19, the head part 20a of each light beam irradiation apparatus 20 is shown with the broken line. The light beam emitted from the head unit 20a of each light beam irradiation device 20 has a bandwidth W in the Y direction, and the substrate 1 is scanned in the direction indicated by the arrow by the movement of the X stage 5 in the X direction.

  FIG. 16 shows the first scan, and the pattern is drawn in the scan area shown in gray in FIG. 16 by the first scan in the X direction. When the first scanning is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 17 shows the second scan, and a pattern is drawn in the scan area shown in gray in FIG. 17 by the second scan in the X direction. When the second scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 18 shows the third scan, and the pattern is drawn in the scan area shown in gray in FIG. 18 by the third scan in the X direction. When the third scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 19 shows the fourth scan. With the fourth scan in the X direction, a pattern is drawn in the scan area shown in gray in FIG. 19, and the scan of the entire substrate 1 is completed.

  Even when the substrate 1 is scanned with a plurality of light beams from the plurality of light beam irradiation apparatuses 20, patterns drawn by the light beams from the respective light beam irradiation apparatuses 20 are prevented from being shifted from each other due to a running error of the X stage 5. Therefore, the pattern can be drawn with high accuracy. Then, by scanning the substrate 1 with a plurality of light beams from the plurality of light beam irradiation devices 20 in parallel, it is possible to shorten the time required for scanning the entire substrate 1 and to shorten the tact time. it can.

  16 to 19 show an example in which the substrate 1 is scanned four times by scanning the substrate 1 in the X direction. However, the number of scans is not limited to this, and the substrate 1 is scanned in the X direction. May be performed 3 times or less or 5 times or more to scan the entire substrate 1.

  According to the embodiment described above, the surface of the substrate 1 is divided into a plurality of sections, the distortion of the ground patterns 2a, 2b, 2c, and 2d is detected for each divided section, and the divided sections are based on the detection result. By correcting the drawing data supplied to the DMD driving circuit 27 of the light beam irradiation device 20 in accordance with the distortion of the underlying patterns 2a, 2b, 2c, and 2d, the distortion of the underlying patterns 2a, 2b, 2c, and 2d is corrected. Even if it differs depending on the location in the substrate 1, a new pattern can be exposed over the entire substrate 1 in accordance with the underlying patterns 2a, 2b, 2c, 2d.

  Further, the surface of the substrate 1 on which the base patterns 2a, 2b, 2c, and 2d are exposed by being divided into a plurality of shots is divided into sections for each shot, and the base patterns 2a, 2b, 2c, and 2d are divided for each shot section. By detecting the distortion, in the substrate 1 on which the underlying patterns 2a, 2b, 2c, and 2d are exposed by the proximity method, even if the distortion of the underlying patterns 2a, 2b, 2c, and 2d varies from shot to shot, a new pattern is obtained. Can be exposed over the entire substrate 1 in accordance with the underlying patterns 2a, 2b, 2c, 2d.

  Further, images of a plurality of shot alignment marks SAMa, SAMb, SAMc, SAMd provided in the base patterns 2a, 2b, 2c, 2d are obtained for each divided section, and image signals of the obtained images are processed, The positions of the shot alignment marks SAMa, SAMb, SAMc, and SAMad are detected, and the distortion of the ground patterns 2a, 2b, 2c, and 2d for each of the divided sections is detected based on the detection result. By using a plurality of shot alignment marks SAMa, SAMb, SAMc, and SAMd provided on 2a, 2b, 2c, and 2d, it is possible to accurately detect distortion of the underlying patterns 2a, 2b, 2c, and 2d for each divided section. it can.

  Further, according to the embodiment shown in FIG. 1, before the substrate 1 is mounted on the chuck 10, the substrate 1 is mounted on the temperature adjustment device 50 to adjust the temperature of the substrate 1, and the temperature adjustment device 50 is Are provided with a plurality of CCD cameras 52a, 52b, 52c, 52d, and a plurality of shot alignment marks SAMa, SAMb on the surface of the substrate 1 mounted on the temperature control device 50 by the plurality of CCD cameras 52a, 52b, 52c, 52d. , SAMc, SAMd, and while adjusting the temperature of the substrate 1 by the temperature adjusting device 50, light is detected based on the detection results of the distortion of the ground patterns 2a, 2b, 2c, 2d for each divided section. By correcting the drawing data supplied to the DMD drive circuit 27 of the beam irradiation device 20, the substrate 1 is transferred from the temperature adjustment device 50 to the chuck 10 and then drawn. It is possible to start the exposure process it is not necessary to wait for the correction of the data, it is possible to shorten the tact time.

  Further, according to the embodiment shown in FIG. 12, a plurality of chucks 10 and X stages 5 and Y stages 7 are provided, and each chuck 10 is moved from below the light beam irradiation device 20 by the X stage 5 and the Y stage 7. The plurality of CCD cameras 52a, 52b, 52c, and 52d are provided above the chuck 10 at the standby position in order from the remote standby position to the exposure position below the light beam irradiation device 20, and the plurality of CCD cameras. Images of a plurality of shot alignment marks SAMa, SAMb, SAMc, and SAMd on the surface of the substrate 1 mounted on the chuck 10 in the standby position are acquired by 52a, 52b, 52c, and 52d, and the chuck 10 on which the substrate 1 is mounted is acquired. While waiting at the standby position, based on the detection result of the distortion of the ground patterns 2a, 2b, 2c, 2d for each divided section. By correcting the drawing data supplied to the DMD drive circuit 27 of the light beam irradiation apparatus 20, the substrates 1 mounted on the plurality of chucks 10 are exposed in order without having to wait for the correction of the drawing data at the exposure position. Therefore, the tact time can be shortened.

  In the embodiment described above, an example in which four display panel substrates are manufactured from one substrate has been shown. However, the present invention is for three or less or five or more displays from one substrate. The present invention can also be applied when manufacturing a panel substrate. In the embodiment described above, the surface of the substrate is divided into sections of each shot. However, the present invention is not limited to this, and the surface of the substrate may be divided into smaller sections. Furthermore, the present invention can be applied not only to a substrate on which a base pattern is formed by exposure by a proximity method, but also to a substrate on which a base pattern is formed by a method of directly drawing a base pattern.

  By exposing the substrate using the exposure apparatus or exposure method of the present invention, a new pattern can be exposed to match the underlying pattern over the entire substrate, and thus a high-quality display panel substrate is manufactured. be able to.

  For example, FIG. 20 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photoresist is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), a pattern is formed on the photoresist film using an exposure apparatus. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 21 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the manufacturing process of the TFT substrate shown in FIG. 20, in the exposure process (step 103), in the manufacturing process of the color filter substrate shown in FIG. An apparatus or an exposure method can be applied.

DESCRIPTION OF SYMBOLS 1 Substrate 1a Scan area 2a, 2b, 2c, 2d Base pattern 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 10 Chuck 11 Gate 20 Light beam irradiation device 20a Head unit 21 Laser light source unit 22 Optical fiber 23 Lens 24 Mirror 25 DMD (Digital Micromirror Device)
26 Projection Lens 27 DMD Drive Circuit 31, 33 Linear Scale 32, 34 Encoder 40 Laser Measuring System Controller 41 Laser Light Source 42, 44 Laser Interferometer 43, 45 Bar Mirror 46 Travel Error Detection Circuit 47, 51, 52a, 52b, 52c , 52d CCD camera 48, 53 Image processing device 50 Temperature adjustment device 54 Distortion detection circuit 60 Stage drive circuit 70 Main controller 71, 71 ′ Drawing control unit 72, 76 Memory 73 Bandwidth setting unit 74 Center point coordinate determination unit 75 Coordinates Deciding part 77, 77 'Drawing data creating part

Claims (12)

A chuck on which a base pattern is formed and a substrate on which a photoresist is applied on the base pattern is mounted;
Light beam irradiation having a spatial light modulator for modulating a light beam, a driving circuit for driving the spatial light modulator based on drawing data, and an irradiation optical system for irradiating the light beam modulated by the spatial light modulator Equipment,
A moving means for relatively moving the chuck and the light beam irradiation device;
An exposure apparatus that relatively moves the chuck and the light beam irradiation device by the moving means, scans the substrate with the light beam from the light beam irradiation device, and draws a pattern on the substrate,
Detecting means for dividing the surface of the substrate into a plurality of sections, and detecting distortion of the ground pattern for each of the divided sections;
And a drawing control means for correcting drawing data to be supplied to the drive circuit of the light beam irradiation device in accordance with the distortion of the ground pattern for each divided section based on the detection result of the detecting means. Exposure device.   The detection unit divides the surface of the substrate exposed by dividing the base pattern into a plurality of shots into sections of each shot, and detects distortion of the base pattern for each section of each shot. The exposure apparatus described in 1. The detection means includes
A plurality of image acquisition devices for acquiring images of a plurality of position detection marks provided in the base pattern for each divided section and outputting image signals;
An image processing device that processes the image signal output by each image acquisition device and detects the position of each position detection mark;
The exposure apparatus according to claim 1, further comprising: a detection circuit configured to detect distortion of a ground pattern for each divided section based on a detection result of the image processing apparatus. Prior to mounting the substrate on the chuck, the substrate is equipped with a temperature adjustment device for adjusting the temperature of the substrate,
The plurality of image acquisition devices are provided above the temperature adjustment device to acquire images of a plurality of position detection marks on a surface of a substrate mounted on the temperature adjustment device,
The drawing control unit corrects drawing data supplied to the drive circuit of the light beam irradiation device based on the detection result of the detection circuit while the temperature of the substrate is adjusted by the temperature adjustment device. The exposure apparatus according to claim 3. A plurality of chucks and a plurality of moving means are provided, and each moving means sequentially moves each chuck from a standby position away from under the light beam irradiation apparatus to an exposure position under the light beam irradiation apparatus,
The plurality of image acquisition devices are provided above the chuck at the standby position, and acquire images of a plurality of position detection marks on the surface of the substrate mounted on the chuck at the standby position,
The drawing control means corrects the drawing data supplied to the drive circuit of the light beam irradiation device based on the detection result of the detection circuit while the chuck on which the substrate is mounted is waiting at the standby position. 4. An exposure apparatus according to claim 3, wherein A base pattern is formed, and a substrate coated with a photoresist on the base pattern is mounted on the chuck.
A chuck, a spatial light modulator that modulates the light beam, a drive circuit that drives the spatial light modulator based on drawing data, and an irradiation optical system that irradiates the light beam modulated by the spatial light modulator Move relative to the light beam irradiation device,
An exposure method for drawing a pattern on a substrate by scanning the substrate with a light beam from a light beam irradiation device,
Dividing the surface of the substrate into a plurality of sections, detecting the distortion of the ground pattern for each divided section,
An exposure method comprising: correcting drawing data to be supplied to a drive circuit of a light beam irradiation apparatus based on a detection result in accordance with distortion of a base pattern for each divided section.   7. The exposure method according to claim 6, wherein the surface of the substrate exposed by dividing the base pattern into a plurality of shots is divided into sections of each shot, and distortion of the base pattern is detected for each section of each shot. . Acquire images of a plurality of position detection marks provided in the base pattern for each divided section,
Process the image signal of the acquired image to detect the position of each position detection mark,
8. The exposure method according to claim 6, wherein distortion of the ground pattern for each divided section is detected based on the detection result. Before mounting the substrate on the chuck, mount the substrate on the temperature control device to adjust the temperature of the substrate,
A plurality of image acquisition devices are provided above the temperature control device, and a plurality of image acquisition devices acquire images of a plurality of position detection marks on the surface of the substrate mounted on the temperature control device,
While adjusting the temperature of the substrate by the temperature adjusting device, the drawing data supplied to the drive circuit of the light beam irradiation device is corrected based on the detection result of the distortion of the ground pattern for each divided section. The exposure method according to claim 8. A plurality of moving means for moving the chuck and the chuck are provided, and each moving means sequentially moves each chuck from a standby position away from the bottom of the light beam irradiation apparatus to an exposure position under the light beam irradiation apparatus,
A plurality of image acquisition devices are provided above the chuck at the standby position, and images of a plurality of position detection marks on the surface of the substrate mounted on the chuck at the standby position are acquired by the plurality of image acquisition devices,
While the chuck on which the substrate is mounted is waiting at the standby position, the drawing data supplied to the drive circuit of the light beam irradiation apparatus is corrected based on the detection result of the distortion of the ground pattern for each divided section. The exposure method according to claim 8.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to any one of claims 1 to 5.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure method according to claim 6.

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