JP5430335B2 - Exposure apparatus, exposure method, and manufacturing method of display panel substrate - Google Patents

Description

  The present invention relates to an exposure apparatus that exposes a light beam to a substrate coated with a photoresist, scans the substrate with the light beam, and draws a pattern on the substrate in the manufacture of a display panel substrate such as a liquid crystal display device. The present invention relates to a method and a manufacturing method of a display panel substrate using them, and in particular, an exposure apparatus suitable for exposing a new pattern on a base pattern formed on the substrate, an exposure method, and a display using them. The present invention relates to a method for manufacturing a panel substrate for an automobile.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. Conventionally, as an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There was a proximity method to transfer.

  In recent years, an exposure apparatus has been developed that irradiates a substrate coated with a photoresist with a light beam, scans the substrate with the light beam, and draws a pattern on the substrate. Since the substrate is scanned by the light beam and the pattern is directly drawn on the substrate, an expensive mask is not required. Further, by changing the drawing data and the scanning program, various types of display panel substrates can be supported. Examples of such an exposure apparatus include those described in Patent Document 1, Patent Document 2, and Patent Document 3.

JP 2003-332221 A JP 2005-353927 A JP 2007-219011 A

  In recent years, in the manufacture of various substrates for display panels, a relatively large substrate is prepared in order to cope with an increase in size and size, and a plurality of displays from one substrate are prepared according to the size of the display panel. Manufacturing panel boards. In the proximity method mainly used for exposure of a large substrate, if one surface of the substrate is to be exposed at a time, a mask having the same size as the substrate is required, and the cost of an expensive mask is further increased. In view of this, the mainstream method uses a mask that is relatively smaller than the substrate, moves the substrate stepwise in the XY directions, and divides one surface of the substrate into a plurality of shots. When exposing one side of a substrate in multiple shots, it is difficult to make the relative position and rotation of the mask and the substrate and the proximity gap between the mask and the substrate exactly the same for each shot. The position, rotation or size of the pattern transferred to the substrate changes slightly from shot to shot.

  In the method of drawing a pattern directly on the substrate, the substrate and the light beam are moved relative to each other to scan the substrate with the light beam. At that time, a light beam irradiation apparatus including a precise optical system is fixed. Generally, the chuck on which the substrate is mounted is moved by the stage. When moving the chuck by the stage, if a travel error such as rolling or yawing occurs on the stage and the movement path of the substrate mounted on the chuck shifts, the pattern drawn by the light beam from the light beam irradiation device The position shifts. The amount of misalignment of the pattern due to this stage running error varies depending on the location within the substrate.

  In this way, when a new pattern is exposed on a ground pattern formed on the substrate by exposure using a proximity method or a method of directly drawing a pattern on the substrate, the positional deviation amount of the ground pattern depends on the location in the substrate. Because of the difference, the positional relationship between the base pattern and the newly exposed pattern changes depending on the location within the substrate. Therefore, for example, in the manufacture of a color filter substrate of a liquid crystal display device, when a colored pattern is exposed on a black matrix formed on the substrate, the colored pattern is displaced from the position of each pixel depending on the location in the substrate. There was a problem.

  The problem of the present invention is that when a new pattern is exposed on a ground pattern formed on the substrate, the new pattern is grounded over the entire substrate even if the positional deviation amount of the ground pattern varies depending on the location. The exposure is performed according to the pattern. Another object of the present invention is to manufacture a high-quality display panel substrate.

  An exposure apparatus according to the present invention includes a chuck on which a base pattern is formed and a substrate coated with a photoresist on the base pattern, a spatial light modulator that modulates a light beam, and spatial light based on drawing data. A driving circuit for driving the modulator, a light beam irradiation apparatus having an irradiation optical system for irradiating a light beam modulated by the spatial light modulator, and a first that relatively moves the chuck and the light beam irradiation apparatus. An exposure apparatus that moves the chuck and the light beam irradiation apparatus relative to each other by the first movement means, scans the substrate with the light beam from the light beam irradiation apparatus, and draws a pattern on the substrate. A detecting means for detecting the position of the underlying pattern in the substrate over the entire substrate, and a light beam irradiation device according to the position of the underlying pattern in the substrate detected by the detecting means; Is obtained by a drawing control means for generating drawing data supplied to the drive circuit.

  The exposure method of the present invention also includes a substrate on which a base pattern is formed and a photoresist is coated on the base pattern, mounted on the chuck, a spatial light modulator that modulates the light beam, and drawing data. And a light beam irradiation apparatus having a driving circuit for driving the spatial light modulator based thereon and a light beam irradiation apparatus having an irradiation optical system for irradiating the light beam modulated by the spatial light modulator. An exposure method for drawing a pattern on a substrate by scanning the substrate with a light beam from the substrate, detecting the position of the underlying pattern in the substrate over the entire substrate, and detecting the detected underlying pattern in the substrate In accordance with the position, drawing data to be supplied to the drive circuit of the light beam irradiation device is created.

  The spatial light modulator of the light beam irradiation device is configured by arranging a plurality of minute mirrors that reflect the light beam in two directions, and the drive circuit changes the angle of each mirror based on the drawing data. Modulates the light beam applied to the substrate. The light beam modulated by the spatial light modulator is irradiated onto the substrate mounted on the chuck from the head unit including the irradiation optical system of the light beam irradiation apparatus. Since the position of the base pattern in the substrate is detected over the entire substrate, and drawing data to be supplied to the drive circuit of the light beam irradiation device is created according to the detected position of the base pattern in the substrate, the base pattern is created. Even if the amount of pattern misregistration varies from place to place within the substrate, a new pattern is exposed along the base pattern over the entire substrate.

  Furthermore, the exposure apparatus of the present invention acquires an image of a base pattern and outputs an image signal, and a second moving unit that moves the image acquisition apparatus over the entire substrate over the substrate. An image processing device that processes the image signal output by the image acquisition device to detect the position of the substrate and the position of the underlying pattern over the entire substrate, and based on the detection result of the image processing device, And a detection circuit for detecting the position. Further, the exposure method of the present invention moves the image acquisition device over the entire substrate over the substrate, acquires an image of the underlying pattern, processes the acquired image signal, and determines the position of the substrate and the entire substrate. The position of the ground pattern over the substrate is detected, and the position of the ground pattern within the substrate is detected based on the detection result. Since the image acquisition device moves over the substrate over the substrate and acquires the image of the ground pattern, the position of the ground pattern within the substrate is obtained from the acquired image signal by image processing. It is detected with high accuracy.

  Further, in the exposure apparatus of the present invention, the second moving means moves the image acquisition apparatus over the substrate on which the base pattern is exposed in a plurality of shots, and the detection circuit divides into a plurality of shots. The position of the exposed base pattern in the substrate is detected. Further, the exposure method of the present invention moves the image acquisition device over the substrate exposed by dividing the ground pattern into a plurality of shots, and positions the ground pattern exposed in the plurality of shots within the substrate. Is detected. In a substrate on which the base pattern is exposed by the proximity method, even if the amount of positional deviation of the base pattern varies from shot to shot, a new pattern is exposed along the base pattern over the entire substrate.

  Further, the exposure apparatus of the present invention includes a temperature adjustment device that adjusts the temperature of the substrate by mounting the substrate before mounting the substrate on the chuck, and the second moving means includes the image acquisition device and the temperature adjustment device. While the detection circuit adjusts the temperature of the substrate by the temperature adjustment device, the position of the base pattern in the substrate is detected, and the drawing control means uses the temperature adjustment device. While adjusting the temperature of the substrate, drawing data to be supplied to the drive circuit of the light beam irradiation apparatus is created according to the position of the base pattern detected by the detection circuit within the substrate. In addition, the exposure method of the present invention adjusts the temperature of the substrate by mounting the substrate on the temperature control device before mounting the substrate on the chuck, and the image acquisition device is placed above the substrate mounted on the temperature control device. While moving, adjusting the temperature of the substrate with the temperature control device, the position of the base pattern in the substrate is detected, and while adjusting the temperature of the substrate with the temperature control device, the detected base pattern The drawing data to be supplied to the drive circuit of the light beam irradiation device is created according to the position of the substrate within the substrate. After the substrate is transported from the temperature control device to the chuck, the exposure process can be started without waiting for the creation of drawing data, and the tact time is shortened.

  Alternatively, the exposure apparatus of the present invention includes a plurality of chucks, first moving means, image acquisition devices, and second moving means, and each first moving means moves each chuck from under the light beam irradiation apparatus. Each of the second moving means moves each image acquisition device over the substrate mounted on the chuck at the standby position from the remote standby position to the exposure position below the light beam irradiation device. The detection circuit detects the position of the base pattern in the substrate while the chuck on which the substrate is mounted is waiting at the standby position, and the drawing control means waits at the standby position on the chuck on which the substrate is mounted. During this time, drawing data to be supplied to the drive circuit of the light beam irradiation apparatus is created according to the position of the base pattern detected by the detection circuit within the substrate. Further, the exposure method of the present invention is provided with a plurality of chucks, stages for moving the chucks, and image acquisition devices, and each stage allows each chuck to be moved from a standby position away from the bottom of the light beam irradiation device. While moving sequentially to the lower exposure position, moving each image acquisition device over the substrate mounted on the chuck at the standby position, while the chuck mounting the substrate is waiting at the standby position, While detecting the position of the base pattern in the substrate, and while the chuck on which the substrate is mounted is waiting at the standby position, depending on the detected position of the base pattern in the substrate, to the drive circuit of the light beam irradiation device The drawing data to be supplied is created. Substrates mounted on a plurality of chucks can be exposed in order without waiting for the creation of drawing data at the exposure position, and the tact time is shortened.

  The method for producing a display panel substrate according to the present invention involves exposing the substrate using any one of the above exposure apparatuses or exposure methods. By using the above exposure apparatus or exposure method, a new pattern is exposed in accordance with the base pattern over the entire substrate, so that a high-quality display panel substrate is manufactured.

  According to the exposure apparatus and the exposure method of the present invention, the position of the base pattern in the substrate is detected over the entire substrate, and the light beam irradiation apparatus is driven according to the detected position of the base pattern in the substrate. By creating the drawing data to be supplied to the circuit, a new pattern can be exposed over the entire substrate in accordance with the underlying pattern even if the amount of positional deviation of the underlying pattern varies from place to place within the substrate.

  Furthermore, according to the exposure apparatus and the exposure method of the present invention, the image acquisition device is moved over the entire substrate over the substrate to acquire an image of the ground pattern, thereby performing image processing from the acquired image signal. Thus, the position of the base pattern in the substrate can be detected with high accuracy over the entire substrate.

  Furthermore, according to the exposure apparatus and the exposure method of the present invention, the image acquisition device moves over the substrate on which the base pattern is divided into a plurality of shots and is exposed to the plurality of shots. By detecting the position in the substrate, even if the amount of positional deviation of the ground pattern varies from shot to shot, the new pattern is converted to the ground pattern over the entire substrate. They can be exposed together.

  Further, according to the exposure apparatus and the exposure method of the present invention, before the substrate is mounted on the chuck, the substrate is mounted on the temperature control device to adjust the temperature of the substrate, and the image acquisition device is mounted on the temperature control device. While moving in the sky above the substrate and adjusting the temperature of the substrate with the temperature adjustment device, the position of the base pattern in the substrate is detected and the temperature of the substrate is adjusted with the temperature adjustment device. By creating drawing data to be supplied to the drive circuit of the light beam irradiation device according to the detected position of the underlying pattern in the substrate, the drawing data is created after the substrate is transported from the temperature control device to the chuck. Since the exposure process can be started without waiting, the tact time can be shortened.

  Alternatively, according to the exposure apparatus and the exposure method of the present invention, a plurality of chucks, stages for moving the chucks, and image acquisition devices are provided, and each stage allows each chuck to be moved from a standby position away from the bottom of the light beam irradiation device. , Move sequentially to the exposure position under the light beam irradiation device, move each image acquisition device over the substrate mounted on the chuck at the standby position, and the chuck loaded with the substrate waits at the standby position While detecting the position of the underlying pattern in the substrate, the light beam irradiation is performed according to the detected position of the underlying pattern in the substrate while the chuck on which the substrate is mounted is waiting at the standby position. By creating drawing data to be supplied to the drive circuit of the device, substrates mounted on multiple chucks can be exposed in sequence without having to wait for drawing data to be created at the exposure position. So, it is possible to shorten the tact time.

  According to the method for manufacturing a display panel substrate of the present invention, a new pattern can be exposed to match the base pattern over the entire substrate, so that a high-quality display panel substrate can be manufactured.

1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. 1 is a side view of an exposure apparatus according to an embodiment of the present invention. 1 is a front view of an exposure apparatus according to an embodiment of the present invention. It is a figure which shows schematic structure of a light beam irradiation apparatus. It is a figure explaining operation | movement of a laser length measurement system. It is a figure which shows the position shift of the base pattern of a board | substrate, and a base pattern. Fig.7 (a) is a top view of a temperature control apparatus, FIG.7 (b) is a side view of a temperature control apparatus. It is a top view of a camera unit moving mechanism. It is a front view of a camera unit moving mechanism. It is a top view of the chuck | zipper in a delivery position. It is a side view of the chuck | zipper in a delivery position. It is a figure which shows schematic structure of a drawing control part. It is a figure which shows schematic structure of the exposure apparatus by other embodiment of this invention. It is a top view of the chuck in a standby position. It is a side view of the chuck | zipper in a standby position. It is a figure which shows schematic structure of a drawing control part. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of the exposure apparatus according to the embodiment of the present invention, and FIG. 3 is a front view of the exposure apparatus according to the embodiment of the present invention. This embodiment shows an example of an exposure apparatus that exposes a new pattern on a base pattern formed on a substrate by exposure using a proximity method. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck 10, a gate 11, a light beam irradiation device 20, linear scales 31, 33, encoders 32, 34, Laser length measurement system, laser length measurement system control device 40, travel error detection circuit 46, CCD camera 47, image processing devices 48 and 53, temperature control device 50, camera unit 51, camera unit moving mechanism, position detection circuit 52, stage The drive circuit 60 and the main controller 70 are included. In FIG. 1, the camera unit moving mechanism is omitted. 2 and 3, the laser light source 41 of the laser measurement system, the laser measurement system control device 40, the running error detection circuit 46, the image processing devices 48 and 53, the temperature adjustment device 50, the camera unit 51, and the camera unit. The moving mechanism, the position detection circuit 52, the stage drive circuit 60, and the main controller 70 are omitted. In addition to these, the exposure apparatus includes a substrate transfer robot, a temperature control unit that performs temperature management in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is carried into the chuck 10 by a substrate carrying robot (not shown), and the substrate 1 is carried out of the chuck 10 by a substrate carrying robot (not shown). The chuck 10 supports the back surface of the substrate 1 by vacuum suction. On the surface of the substrate 1, a photoresist is applied on a base pattern formed by exposure by a proximity method.

  A gate 11 is provided across the base 3 above the exposure position where the substrate 1 is exposed. A plurality of light beam irradiation devices 20 are mounted on the gate 11. Although the present embodiment shows an example of an exposure apparatus using eight light beam irradiation apparatuses 20, the number of light beam irradiation apparatuses is not limited to this, and seven or less or nine or more light beams are used. An irradiation device may be used.

  FIG. 4 is a diagram showing a schematic configuration of the light beam irradiation apparatus. The light beam irradiation device 20 includes an optical fiber 22, a lens 23, a mirror 24, a DMD (Digital Micromirror Device) 25, a projection lens 26, and a DMD driving circuit 27. The optical fiber 22 introduces an ultraviolet light beam generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is irradiated to the DMD 25 through the lens 23 and the mirror 24. The DMD 25 is a spatial light modulator configured by arranging a plurality of minute mirrors that reflect a light beam in two directions, and modulates the light beam by changing the angle of each mirror. The light beam modulated by the DMD 25 is irradiated from the head unit 20 a including the projection lens 26. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main controller 70.

  2 and 3, the chuck 10 is mounted on the θ stage 8, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves in the X direction along the X guide 4. The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves in the Y direction along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The X stage 5, Y stage 7, and θ stage 8 are provided with drive mechanisms (not shown) such as ball screws and motors, linear motors, etc., and each drive mechanism is driven by a stage drive circuit 60 of FIG. The

  By rotation of the θ stage 8 in the θ direction, the substrate 1 mounted on the chuck 10 is rotated so that two orthogonal sides are directed in the X direction and the Y direction. As the X stage 5 moves in the X direction, the chuck 10 is moved between the delivery position and the exposure position. When the X stage 5 moves in the X direction at the exposure position, the light beam irradiated from the head unit 20a of each light beam irradiation apparatus 20 scans the substrate 1 in the X direction. In addition, as the Y stage 7 moves in the Y direction, the scanning region of the substrate 1 by the light beam emitted from the head unit 20a of each light beam irradiation device 20 is moved in the Y direction. In FIG. 1, the main controller 70 controls the stage drive circuit 60 to rotate the θ stage 8 in the θ direction, move the X stage 5 in the X direction, and move the Y stage 7 in the Y direction. .

  In the present embodiment, the substrate 10 is scanned by the light beam from the light beam irradiation device 20 by moving the chuck 10 in the X direction by the X stage 5, but the light beam irradiation device 20 is moved. By doing so, the substrate 1 may be scanned by the light beam from the light beam irradiation device 20. In the present embodiment, the scanning region of the substrate 1 by the light beam from the light beam irradiation device 20 is changed by moving the chuck 10 in the Y direction by the Y stage 7, but the light beam irradiation device 20. , The scanning region of the substrate 1 by the light beam from the light beam irradiation device 20 may be changed.

  1 and 2, the base 3 is provided with a linear scale 31 extending in the X direction. The linear scale 31 is provided with a scale for detecting the amount of movement of the X stage 5 in the X direction. The X stage 5 is provided with a linear scale 33 extending in the Y direction. The linear scale 33 is provided with a scale for detecting the amount of movement of the Y stage 7 in the Y direction.

  1 and 3, an encoder 32 is attached to one side surface of the X stage 5 so as to face the linear scale 31. The encoder 32 detects the scale of the linear scale 31 and outputs a pulse signal to the main controller 70. 1 and 2, an encoder 34 is attached to one side surface of the Y stage 7 so as to face the linear scale 33. The encoder 34 detects the scale of the linear scale 33 and outputs a pulse signal to the main controller 70. Main controller 70 counts the pulse signal of encoder 32, detects the amount of movement of X stage 5 in the X direction, counts the pulse signal of encoder 34, and moves the amount of Y stage 7 in the Y direction. Is detected.

  FIG. 5 is a diagram for explaining the operation of the laser length measurement system. In FIG. 5, the gate 11, the light beam irradiation device 20, the CCD camera 47, the image processing devices 48 and 53, the temperature adjustment device 50, the camera unit 51, the camera unit moving mechanism, and the position detection circuit 52 are omitted. Yes. The laser length measurement system is a known laser interference type length measurement system, and includes a laser light source 41, laser interferometers 42 and 44, and bar mirrors 43 and 45. The bar mirror 43 is attached to one side surface of the chuck 10 in the Y direction. The bar mirror 45 is attached to one side surface of the chuck 10 in the X direction.

  The laser interferometer 42 irradiates the laser beam from the laser light source 41 onto the bar mirror 43, receives the laser beam reflected by the bar mirror 43, and the laser beam reflected from the laser beam source 41 and the laser beam reflected by the bar mirror 43. Measure interference. This measurement is performed at two locations in the Y direction. The laser length measurement system control device 40 detects the position and rotation in the X direction of the chuck 10 moved by the X stage 5 from the measurement result of the laser interferometer 42 under the control of the main control device 70.

  On the other hand, the laser interferometer 44 irradiates the laser beam from the laser light source 41 to the bar mirror 45, receives the laser beam reflected by the bar mirror 45, and the laser beam reflected from the laser source 41 and the bar mirror 45. Measure interference with light. The laser measurement system control device 40 detects the position in the Y direction of the chuck 10 moved by the X stage 5 from the measurement result of the laser interferometer 44 under the control of the main control device 70.

  The travel error detection circuit 46 detects a travel error such as rolling or yawing when the X stage 5 moves in the X direction from the detection result of the laser length measurement system control device 40. By detecting the position of the chuck 10 using the laser length measurement system, the position of the chuck 10 can be detected with high accuracy, so that the running error of the X stage 5 can be detected with high accuracy. The travel error detection circuit 46 outputs the detection result to the main controller 70.

  In FIG. 1, a temperature adjusting device 50 is installed in front of the base 3. Usually, since the temperature of the substrate 1 is increased or decreased by the processing in the previous step, it is necessary to cool or warm the substrate 1 before performing exposure. A substrate transfer robot (not shown) loads the substrate 1 into the temperature adjusting device 50 before loading the substrate 1 into the chuck 10, and loads the substrate 1 whose temperature is adjusted by the temperature adjusting device 50 into the chuck 10. While the exposure of the substrate 1 mounted on the chuck 10 is being performed, the temperature adjustment device 50 mounts the substrate 1 to be exposed next and adjusts the temperature of the substrate 1. In the present embodiment, the position of the base pattern in the substrate 1 is detected over the entire substrate 1 while the temperature of the substrate 1 is adjusted by the temperature adjustment device 50. Then, while adjusting the temperature of the substrate 1 by the temperature adjustment device 50, the drawing data to be supplied to the DMD driving circuit 27 of the light beam irradiation device 20 according to the position of the detected base pattern in the substrate 1 is supplied. create.

  FIG. 6 is a diagram illustrating the base pattern of the substrate and the positional deviation of the base pattern. FIG. 6 shows an example of manufacturing 12 display panel substrates from one substrate. Global alignment marks GAM for detecting the position and rotation of the substrate 1 are provided at the four corners of the surface of the substrate 1. Further, four base patterns 2a, 2b, 2c and 2d are formed on the surface of the substrate 1 by four shots. Since exposure was performed by dividing into four shots, the positions, rotations, and sizes of the underlying patterns 2a, 2b, 2c, and 2d are shifted. Each of the base patterns 2a, 2b, 2c, and 2d includes three display panel base patterns 1a, 1b, and 1c. The display panel bases in each of the base patterns 2a, 2b, 2c, and 2d are included. Deviations also occur in the sizes and shapes of the patterns 1a, 1b, and 1c.

  Fig.7 (a) is a top view of a temperature control apparatus, FIG.7 (b) is a side view of a temperature control apparatus. As shown in FIGS. 7A and 7B, a camera unit 51 is installed above the temperature control device 50. The camera unit 51 includes a plurality of CCD cameras 51a, and is moved in the XY directions indicated by arrows by a camera unit moving mechanism (not shown). In this embodiment, the camera unit 51 includes four CCD cameras 51a. However, the number of the CCD cameras 51a is not limited to this, and the number of the camera units 51 is three or less or five or more CCDs. The camera 51a may be included.

  FIG. 8 is a top view of the camera unit moving mechanism. FIG. 9 is a side view of the camera unit moving mechanism. The camera unit moving mechanism includes a Y guide 54, a Y stage 55, an X guide 56, an X stage 57, ribs 58, 59, 93, motors 81, 86, 96, shaft couplings 82, 87, 97, and bearings 83, 88, 98. , Ball screws 84a, 89a, 99a, nuts 84b, 89b, 99b, a Z base 90, a Z guide 91, a Z stage 92, a mounting base 94, and a motor base 95.

  In FIG. 8, a frame 53 on which the camera unit moving mechanism is installed is provided above the temperature adjustment device 50, and an opening 53 a is formed in the frame 53. A Y guide 54 is provided on the upper surface of the frame 53, and a Y stage 55 is mounted on the Y guide 54. Further, a motor 81 is installed on the upper surface of the frame 53, and the motor 81 is driven by the main controller 70 of FIG. A rotation shaft of the motor 81 is connected to a ball screw 84 a by a shaft coupling 82, and the ball screw 84 a is rotatably supported by a bearing 83. A nut 84 b that is moved by a ball screw 84 a is attached to the lower surface of the Y stage 55, and the Y stage 55 is moved in the Y direction along the Y guide 54 by the rotation of the motor 81.

  An X guide 56 is provided on the upper surface of the Y stage 55, and an X stage 57 is mounted on the X guide 56. Further, a motor 86 is installed on the upper surface of the Y stage 55, and the motor 86 is driven by the main controller 70 of FIG. A rotation shaft of the motor 86 is connected to a ball screw 89 a by a shaft coupling 87, and the ball screw 89 a is rotatably supported by a bearing 88. A nut 89 b that is moved by a ball screw 89 a is attached to the lower surface of the X stage 57, and the X stage 57 is moved in the X direction along the X guide 56 by the rotation of the motor 86.

  In FIG. 9, a Z base 90 is attached to the side surface of the X stage 57 by ribs 58 and 59, and the Z base 90 is inserted into the opening 53 a of the top frame 53. A Z guide 91 is provided on the Z base 90, and a Z stage 92 is mounted on the Z guide 91. A motor 96 is installed on a motor base 95 attached to the Z base 90, and the motor 96 is driven by the main controller 70 in FIG. A rotation shaft of the motor 96 is connected to a ball screw 99a by a shaft coupling 97, and the ball screw 99a is rotatably supported by a bearing 98. A nut 99 b that is moved by a ball screw 99 a is attached to the Z stage 92, and the Z stage 92 is moved in the Z direction along the Z guide 91 by the rotation of the motor 96. A mounting base 94 is attached to the Z stage 92 by ribs 93, and the camera unit 51 is attached to the mounting base 94.

  The camera unit 51 is moved in the XY direction by the movement of the X stage 57 in the X direction and the movement of the Y stage 55 in the Y direction. 1 controls the motors 81 and 86 to move the camera unit 51 in the XY directions. Further, the camera unit 51 is moved in the Z direction by the movement of the Z stage 92 in the Z direction. The main controller 70 controls the motor 96 according to the thickness of the substrate 1 to move the camera unit 51 in the Z direction so that the focus of each CCD camera 51a of the camera unit 51 is on the surface of the substrate 1. .

  In FIG. 8, the camera unit moving mechanism moves the camera unit 51 in the X direction and the Y direction over the entire substrate 1 over the substrate 1 mounted on the temperature control device 50 under the control of the main controller 70. To do. The plurality of CCD cameras 51a acquire an image of the global alignment mark GAM on the substrate 1 and an image of a ground pattern over the entire substrate 1, and output an image signal to the image processing device 53 in FIG.

  In FIG. 1, the image processing device 53 processes the image signal output from the CCD camera 51 a to detect the position of the global alignment mark GAM and the position of the base pattern over the entire substrate 1. The position detection circuit 52 detects the position, rotation, size, and shape of the base pattern in the substrate 1 from the position of the global alignment mark GAM and the position of the base pattern detected by the image processing device 53. Since the camera unit 51 is moved over the substrate 1 over the substrate 1 to acquire an image of the base pattern, the position of the base pattern in the substrate 1 is obtained by image processing from the acquired image signal. It is detected with high accuracy over the entire substrate 1.

  FIG. 10 is a top view of the chuck in the delivery position. FIG. 11 is a side view of the chuck in the delivery position. As shown in FIGS. 10 and 11, a CCD camera 47 is installed above the chuck 10 in the delivery position at a position just above the global alignment mark GAM of the substrate 1. The CCD camera 47 acquires an image of the global alignment mark GAM and outputs an image signal to the image processing device 48 in FIG. In FIG. 1, the image processing device 48 processes the image signal output from the CCD camera 47 and detects the position of the global alignment mark GAM.

  In FIG. 1, the main controller 70 detects the position and rotation of the substrate 1 mounted on the chuck 10 from the position of the global alignment mark GAM detected by the image processing device 48. The main controller 70 controls the stage driving circuit 60 based on the detected position of the substrate 1, and the X stage 5 chucks the chuck 10 so that the center point of the substrate 1 comes to a predetermined position before the exposure is started. Is moved to the exposure position. Further, the main controller 70 controls the stage drive circuit 60 based on the detected rotation of the substrate 1 so that two orthogonal sides of the substrate 1 mounted on the chuck 10 are directed in the X direction and the Y direction. The θ stage 8 is rotated in the θ direction.

  The main controller 70 has a drawing controller that supplies drawing data to the DMD drive circuit 27 of the light beam irradiation device 20. FIG. 12 is a diagram illustrating a schematic configuration of the drawing control unit. The drawing control unit 71 includes memories 72 and 76, a bandwidth setting unit 73, a center point coordinate determination unit 74, a coordinate determination unit 75, and a drawing data creation unit 77.

  The memory 76 stores a design value map. In the design value map, the drawing data is indicated by XY coordinates when the position, rotation, and size of the base pattern in the substrate 1 are the same as the design value. The drawing data creation unit 77 stores the memory according to the position, rotation, and size of the base pattern detected by the position detection circuit 52 while the temperature adjustment device 50 adjusts the temperature of the substrate 1. The drawing data to be supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20 is created by converting the XY coordinates of the drawing data of the design value map stored in 76. The memory 72 stores the drawing data created by the drawing data creation unit 77 using the XY coordinates as addresses. The memory 72 is provided with an area for storing the drawing data A for the substrate 1 already mounted on the chuck 10 and an area for storing the drawing data B for the substrate 1 mounted on the temperature control device 50.

  The bandwidth setting unit 73 sets the Y-direction bandwidth of the light beam emitted from the head unit 20 a of the light beam irradiation device 20 by determining the range of the Y coordinate of the drawing data read from the memory 72.

  The laser length measurement system control device 40 detects the position of the chuck 10 in the X and Y directions before the exposure of the substrate 1 at the exposure position is started. The center point coordinate determination unit 74 determines the XY coordinates of the center point of the chuck 10 before starting the exposure of the substrate 1 from the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40. In FIG. 1, when scanning the substrate 1 with the light beam from the light beam irradiation device 20, the main control device 70 controls the stage drive circuit 60 to move the chuck 10 in the X direction by the X stage 5. When moving the scanning area of the substrate 1, the main controller 70 controls the stage drive circuit 60 to move the chuck 10 in the Y direction by the Y stage 7. In FIG. 12, the center point coordinate determination unit 74 counts the pulse signals from the encoders 32 and 34, detects the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction, The XY coordinates of the center point of the chuck 10 are determined. Then, the center point coordinate determination unit 74 corrects the determined XY coordinates of the center point of the chuck 10 based on the detection result of the running error detection circuit 46.

  The coordinate determination unit 75 determines the XY coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 based on the XY coordinates of the center point of the chuck 10 corrected by the center point coordinate determination unit 74. The memory 72 inputs the XY coordinates determined by the coordinate determination unit 75 as an address, and outputs the drawing data stored at the input XY coordinate address to the DMD drive circuit 27 of each light beam irradiation apparatus 20.

  The position, rotation, and size of the base pattern within the substrate 1 are detected over the entire substrate 1, and each light beam irradiation device is selected according to the detected position, rotation, and size of the base pattern within the substrate 1. Since the drawing data to be supplied to the 20 DMD driving circuits 27 is created, a new pattern is exposed to the entire substrate 1 in accordance with the underlying pattern even if the positional deviation amount of the underlying pattern varies depending on the location. The

  Before the substrate 1 is mounted on the chuck 10, the substrate 1 is mounted on the temperature adjustment device 50 to adjust the temperature of the substrate 1, and the camera unit 51 is placed over the substrate 1 mounted on the temperature adjustment device 50. While moving and adjusting the temperature of the substrate 1 by the temperature adjustment device 50, the position, rotation and size of the base pattern in the substrate 1 are detected, and the temperature adjustment device 50 adjusts the temperature of the substrate 1. During this time, drawing data to be supplied to the DMD drive circuit 27 of each light beam irradiation device 20 is created according to the position, rotation and size of the detected underlying pattern in the substrate 1. After transporting from the temperature adjusting device 50 to the chuck 10, it is possible to start the exposure process without waiting for the creation of drawing data, and the tact time is shortened.

  Further, the travel error of the X stage 5 is detected, and based on the detection result of the travel error of the X stage 5, the coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 are corrected, and the corrected coordinate Since the drawing data is supplied to the DMD drive circuit 27 of each light beam irradiation device 20, even if a running error such as rolling or yawing occurs in the X stage 5, the pattern is drawn with high accuracy.

  FIG. 13 is a view showing the schematic arrangement of an exposure apparatus according to another embodiment of the present invention. The present embodiment includes an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck 10, a linear scale 33, encoders 32 and 34, a laser interferometer 42 and bar mirrors 43 and 45 of a laser measuring system, and Two sets of temperature control devices 50 are provided, and a camera unit 51 and a camera unit moving mechanism are provided corresponding to each chuck 10. In FIG. 13, a laser light source 41 of the laser measurement system, a laser measurement system control device 40, a travel error detection circuit 46, a camera unit moving mechanism, an image processing device 53, a position detection circuit 52, a stage drive circuit 60, and The main controller 70 is omitted.

  Each chuck 10 on which the substrate 1 is mounted at the delivery position is moved to a standby position away from the bottom of the light beam irradiation device 20 by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. The In the present embodiment, the standby position is different from the delivery position. However, the standby position may be the same position as the delivery position. In this case, the movement of each chuck 10 from the delivery position to the standby position is performed. It is unnecessary.

  FIG. 13 shows a state where each chuck 10 is in the standby position. Each chuck 10 is sequentially moved from the standby position to the exposure position below the light beam irradiation device 20, and the substrate 1 mounted on each chuck 10 is exposed. In the present embodiment, the position of the base pattern in the substrate 1 is detected over the entire substrate 1 while the chuck 10 on which the substrate 1 is mounted is waiting at the standby position. The drawing data supplied to the DMD drive circuit 27 of the light beam irradiation device 20 according to the position of the detected base pattern in the substrate 1 while the chuck 10 on which the substrate 1 is mounted is waiting at the standby position. Create

  FIG. 14 is a top view of the chuck in the standby position. FIG. 15 is a side view of the chuck in the standby position. As shown in FIGS. 14 and 15, a camera unit 51 is installed above the chuck 10 in the standby position. The camera unit 51 includes a plurality of CCD cameras 51a, and is moved in the XY directions indicated by arrows by a camera unit moving mechanism (not shown). In this embodiment, the camera unit 51 includes four CCD cameras 51a. However, the number of the CCD cameras 51a is not limited to this, and the number of the camera units 51 is three or less or five or more CCDs. The camera 51a may be included.

  The camera unit moving mechanism has the same configuration as that shown in FIGS. 8 and 9, and is controlled by the main control device 70 so that the camera unit 51 is over the substrate 1 mounted on the chuck 10 at the standby position. It moves in the X and Y directions throughout. The plurality of CCD cameras 51a acquire an image of the global alignment mark GAM on the substrate 1 and an image of a ground pattern over the entire substrate 1, and output an image signal to the image processing device 53 in FIG.

  The image processing device 53 processes the image signal output from the CCD camera 51 a to detect the position of the global alignment mark GAM and the position of the base pattern over the entire substrate 1. The position detection circuit 52 detects the position and rotation of the substrate 1 mounted on the chuck 10 from the position of the global alignment mark GAM detected by the image processing device 53. The position detection circuit 52 detects the position, rotation, size, and shape of the base pattern in the substrate 1 from the position of the global alignment mark GAM and the position of the base pattern detected by the image processing device 53. Since the camera unit 51 is moved over the substrate 1 over the substrate 1 to acquire an image of the base pattern, the position of the base pattern in the substrate 1 is obtained by image processing from the acquired image signal. It is detected with high accuracy over the entire substrate 1.

  The main controller 70 controls the stage drive circuit 60 based on the position of the substrate 1 detected by the position detection circuit 52 so that the center point of the substrate 1 comes to a predetermined position before the exposure is started. The chuck 10 is moved to the exposure position by the stage 5. Further, the main controller 70 controls the stage drive circuit 60 based on the rotation of the substrate 1 detected by the position detection circuit 52 so that two orthogonal sides of the substrate 1 mounted on the chuck 10 are in the X direction and the Y direction. The θ stage 8 is rotated in the θ direction so as to face.

  The main controller 70 has a drawing controller that supplies drawing data to the DMD drive circuit 27 of the light beam irradiation device 20. FIG. 16 is a diagram illustrating a schematic configuration of the drawing control unit. The drawing control unit 71 ′ includes memories 72 and 76, a bandwidth setting unit 73, a center point coordinate determination unit 74, a coordinate determination unit 75, and a drawing data creation unit 77 ′.

  The drawing data creation unit 77 ′ responds to the position, rotation, and size of the underlying pattern detected by the position detection circuit 52 while the chuck 10 on which the substrate 1 is mounted is waiting at the standby position. Then, the XY coordinates of the drawing data of the design value map stored in the memory 76 are converted to create drawing data to be supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20. The memory 72 stores the drawing data created by the drawing data creation unit 77 'using the XY coordinates as addresses. The memory 72 is provided with an area for storing drawing data A for the substrate 1 mounted on one chuck 10 and an area for storing drawing data B for the substrate 1 mounted on the other chuck 10. Other components are the same as those of the drawing control unit shown in FIG.

  A plurality of chucks 10, an X stage 5 and a Y stage 7 for moving the chuck 10, a camera unit 51 and a camera unit moving mechanism are provided, and each chuck 10 is attached to the light beam irradiation device 20 by each X stage 5 and Y stage 7. The camera unit 51 is sequentially moved from the standby position away from the bottom to the exposure position below the light beam irradiation device 20, and each camera unit 51 is moved over the substrate 1 mounted on the chuck 10 at the standby position. While the chuck 10 having 1 mounted thereon is waiting at the standby position, the position, rotation, and size of the base pattern within the substrate 1 are detected, and the chuck 10 having the substrate 1 is waiting at the standby position. In the meantime, drawing data to be supplied to the DMD drive circuit 27 of the light beam irradiation device 20 according to the position, rotation and size of the detected base pattern in the substrate 1 Since formed, the substrate 1 mounted on the plurality of chucks 10, the generation of the drawing data can be exposed required in order no waiting at the exposure position, tact time is shortened.

  17 to 20 are diagrams for explaining scanning of the substrate by the light beam. FIGS. 17 to 20 show an example in which the entire substrate 1 is scanned by scanning the substrate 1 in the X direction four times with the eight light beams from the eight light beam irradiation apparatuses 20. 17-20, the head part 20a of each light beam irradiation apparatus 20 is shown with the broken line. The light beam emitted from the head unit 20a of each light beam irradiation device 20 has a bandwidth W in the Y direction, and the substrate 1 is scanned in the direction indicated by the arrow by the movement of the X stage 5 in the X direction.

  FIG. 17 shows the first scan, and the pattern is drawn in the scan area shown in gray in FIG. 17 by the first scan in the X direction. When the first scanning is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 18 shows the second scan, and the pattern is drawn in the scan area shown in gray in FIG. 18 by the second scan in the X direction. When the second scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 19 shows the third scan, and the pattern is drawn in the scan area shown in gray in FIG. 19 by the third scan in the X direction. When the third scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 20 shows the fourth scan. With the fourth scan in the X direction, the pattern is drawn in the scan area shown in gray in FIG. 20, and the scan of the entire substrate 1 is completed.

  Even when the substrate 1 is scanned with a plurality of light beams from the plurality of light beam irradiation apparatuses 20, patterns drawn by the light beams from the respective light beam irradiation apparatuses 20 are prevented from being shifted from each other due to a running error of the X stage 5. Therefore, the pattern can be drawn with high accuracy. Then, by scanning the substrate 1 with a plurality of light beams from the plurality of light beam irradiation devices 20 in parallel, it is possible to shorten the time required for scanning the entire substrate 1 and to shorten the tact time. it can.

  17 to 20 show an example in which the substrate 1 is scanned four times by scanning the substrate 1 in the X direction. However, the number of scans is not limited to this, and the substrate 1 is scanned in the X direction. May be performed 3 times or less or 5 times or more to scan the entire substrate 1.

  According to the embodiment described above, the position of the base pattern in the substrate 1 is detected over the entire substrate 1, and the light beam irradiation device 20 is detected according to the detected position of the base pattern in the substrate 1. By creating drawing data to be supplied to the DMD driving circuit 27, a new pattern is exposed over the entire substrate 1 in accordance with the underlying pattern even if the positional deviation amount of the underlying pattern varies depending on the location. be able to.

  Furthermore, the camera unit 51 is moved over the substrate 1 over the substrate 1 to acquire an image of the underlying pattern, and from the acquired image signal, image processing is performed on the substrate 1 of the underlying pattern. The position can be detected with high accuracy over the entire substrate 1.

  Further, the camera unit 51 is moved over the substrate 1 exposed by dividing the base pattern into a plurality of shots, and the position of the base pattern exposed by dividing into the plurality of shots in the substrate 1 is detected. In the substrate 1 on which the base pattern is exposed by the proximity method, even if the positional deviation amount of the base pattern varies from shot to shot, a new pattern can be exposed along the base pattern over the entire substrate 1.

  Further, according to the embodiment shown in FIG. 1, before the substrate 1 is mounted on the chuck 10, the substrate 1 is mounted on the temperature adjustment device 50 to adjust the temperature of the substrate 1, and the camera unit 51 is While moving over the substrate 1 mounted on the adjustment device 50 and adjusting the temperature of the substrate 1 by the temperature adjustment device 50, the position of the base pattern in the substrate 1 is detected, and the temperature adjustment device 50. While adjusting the temperature of the substrate 1, the drawing data to be supplied to the DMD driving circuit 27 of the light beam irradiation device 20 is created according to the position of the detected base pattern in the substrate 1, thereby making the substrate Since the exposure process can be started without waiting for the creation of drawing data after 1 is transferred from the temperature control device 50 to the chuck 10, the tact time can be shortened.

  Further, according to the embodiment shown in FIG. 13, the chuck 10, the X stage 5 and the Y stage 7 for moving the chuck 10, the camera unit 51 and the camera unit moving mechanism are provided, and each X stage 5 and Y stage is provided. 7, each chuck 10 is sequentially moved from the standby position away from the bottom of the light beam irradiation device 20 to the exposure position below the light beam irradiation device 20, and each camera unit 51 is moved to the chuck 10 at the standby position. While the chuck 10 mounted with the substrate 1 is waiting at the standby position, the position of the base pattern in the substrate 1 is detected and the chuck mounted with the substrate 1 is moved. Drawing supplied to the DMD driving circuit 27 of the light beam irradiation apparatus 20 according to the position of the detected base pattern in the substrate 1 while the optical disk 10 stands by at the standby position. By creating over data, the substrate 1 mounted on the plurality of chuck 10, so wait for the generation of the drawing data at the exposure position required can be exposed in order not, it is possible to shorten the tact time.

  In the embodiment described above, an example in which twelve display panel substrates are manufactured from one substrate has been shown. However, the present invention is for display of 11 or less or 13 or more substrates from one substrate. The present invention can also be applied when manufacturing a panel substrate. In the embodiment described above, the entire surface of the substrate 1 is scanned by the camera unit 51. However, the present invention is not limited to this. By acquiring images of the ground pattern at a plurality of locations, the ground pattern The position in the substrate may be detected over the entire substrate. Furthermore, the present invention can be applied not only to a substrate on which a base pattern is formed by exposure by a proximity method, but also to a substrate on which a base pattern is formed by a method of directly drawing a base pattern.

  By exposing the substrate using the exposure apparatus or exposure method of the present invention, a new pattern can be exposed to match the underlying pattern over the entire substrate, and thus a high-quality display panel substrate is manufactured. be able to.

  For example, FIG. 21 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photoresist is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), a pattern is formed on the photoresist film using an exposure apparatus. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 22 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the manufacturing process of the TFT substrate shown in FIG. 21, in the exposure process (step 103), in the manufacturing process of the color filter substrate shown in FIG. An apparatus or an exposure method can be applied.

DESCRIPTION OF SYMBOLS 1 Substrate 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 10 Chuck 11 Gate 20 Light beam irradiation device 20a Head part 21 Laser light source unit 22 Optical fiber 23 Lens 24 Mirror 25 DMD (Digital Micromirror Device)
26 Projection Lens 27 DMD Drive Circuit 31, 33 Linear Scale 32, 34 Encoder 40 Laser Measurement System Control Device 41 Laser Light Source 42, 44 Laser Interferometer 43, 45 Bar Mirror 46 Travel Error Detection Circuit 47 CCD Camera 48, 53 Image Processing Device DESCRIPTION OF SYMBOLS 50 Temperature control apparatus 51 Camera unit 51a CCD camera 52 Position detection circuit 53 Frame 54 Y guide 55 Y stage 56 X guide 57 X stage 58, 59 Rib 60 Stage drive circuit 70 Main controller 71, 71 'Drawing control part 72, 76 Memory 73 Bandwidth setting unit 74 Center point coordinate determining unit 75 Coordinate determining unit 77, 77 ′ Drawing data generating unit 81, 86, 96 Motor 82, 87, 97 Shaft joint 83, 88, 98 Bearing 84a, 89a, 99a Ball screw 84b, 8 b, 99b a nut 90 Z base 91 Z guide 92 Z stage 93 ribs 94 mounting base 95 motor base

Claims (12)

A chuck on which a base pattern is formed and a substrate on which a photoresist is applied on the base pattern is mounted;
Light beam irradiation having a spatial light modulator for modulating a light beam, a driving circuit for driving the spatial light modulator based on drawing data, and an irradiation optical system for irradiating the light beam modulated by the spatial light modulator Equipment,
First moving means for relatively moving the chuck and the light beam irradiation device;
An exposure apparatus that relatively moves the chuck and the light beam irradiation device by the first moving means, scans the substrate with the light beam from the light beam irradiation device, and draws a pattern on the substrate. ,
An image acquisition device that acquires an image of a ground pattern and outputs an image signal, a second moving unit that moves the image acquisition device over the entire substrate over the substrate, and the image acquisition device output An image processing device that processes image signals to detect the position of the substrate and the position of the underlying pattern across the entire substrate, and a detection circuit that detects the position of the underlying pattern in the substrate based on the detection result of the image processing device And detecting means for detecting the position of the base pattern in the substrate over the entire substrate,
Drawing control means for creating drawing data to be supplied to the drive circuit of the light beam irradiation device according to the position in the substrate of the base pattern detected by the detection means ;
A temperature adjusting device for adjusting the temperature of the substrate by mounting the substrate before mounting the substrate on the chuck ;
The second moving means moves the image acquisition device over a substrate mounted on the temperature control device,
The detection circuit detects the position of the base pattern in the substrate while adjusting the temperature of the substrate by the temperature adjustment device,
The drawing control means supplies to the drive circuit of the light beam irradiation device according to the position of the base pattern detected by the detection circuit in the substrate while adjusting the temperature of the substrate by the temperature adjustment device. An exposure apparatus that creates drawing data to be processed. The second moving means moves the image acquisition device over the substrate on which the base pattern is exposed by being divided into a plurality of shots,
The exposure apparatus according to claim 1 , wherein the detection circuit detects a position in a substrate of a base pattern exposed in a plurality of shots. A chuck on which a base pattern is formed and a substrate on which a photoresist is applied on the base pattern is mounted;
Light beam irradiation having a spatial light modulator for modulating a light beam, a driving circuit for driving the spatial light modulator based on drawing data, and an irradiation optical system for irradiating the light beam modulated by the spatial light modulator Equipment,
First moving means for relatively moving the chuck and the light beam irradiation device;
An exposure apparatus that relatively moves the chuck and the light beam irradiation device by the first moving means, scans the substrate with the light beam from the light beam irradiation device, and draws a pattern on the substrate. ,
A plurality of the chuck and the first mobile hand stage,
A plurality of image acquisition devices for acquiring an image of a ground pattern and outputting an image signal, a plurality of second moving means for moving the image acquisition device over the entire substrate over the substrate, and the image acquisition An image processing device that processes the image signal output by the device to detect the position of the substrate and the position of the underlying pattern over the entire substrate, and the position of the underlying pattern in the substrate based on the detection result of the image processing device Detecting means for detecting, and detecting means for detecting the position of the base pattern in the substrate over the entire substrate,
Drawing control means for creating drawing data to be supplied to the drive circuit of the light beam irradiation device according to the position in the substrate of the base pattern detected by the detection means;
Each first moving means sequentially moves each chuck from a standby position away from under the light beam irradiation device to an exposure position under the light beam irradiation device,
Each second moving means moves each image acquisition device over the substrate mounted on the chuck in the standby position,
The detection circuit detects the position of the base pattern in the substrate while the chuck on which the substrate is mounted is waiting at the standby position.
The drawing control means transfers the driving pattern of the light beam irradiation device to the drive circuit of the light beam irradiation device according to the position of the underlying pattern detected by the detection circuit while the chuck on which the substrate is mounted is waiting at the standby position. eXPOSURE aPPARATUS characterized in that to create the drawing data supplied. The second moving means moves the image acquisition device over the substrate on which the base pattern is exposed by being divided into a plurality of shots,
The exposure apparatus according to claim 3, wherein the detection circuit detects a position in a substrate of a base pattern exposed in a plurality of shots. A base pattern is formed, and a substrate coated with a photoresist on the base pattern is mounted on the chuck.
A chuck, a spatial light modulator that modulates the light beam, a drive circuit that drives the spatial light modulator based on drawing data, and an irradiation optical system that irradiates the light beam modulated by the spatial light modulator Move relative to the light beam irradiation device,
An exposure method for drawing a pattern on a substrate by scanning the substrate with a light beam from a light beam irradiation device,
Before mounting the substrate on the chuck, mount the substrate on the temperature control device to adjust the temperature of the substrate,
Move the image acquisition device over the entire substrate over the substrate mounted on the temperature control device to acquire the image of the ground pattern,
Process the acquired image signal to detect the position of the substrate and the position of the base pattern across the entire substrate,
Based on the detection result, while adjusting the temperature of the substrate by the temperature adjustment device , the position of the base pattern in the substrate is detected over the entire substrate,
While the temperature of the substrate is adjusted by the temperature adjusting device, drawing data to be supplied to the drive circuit of the light beam irradiation device is created according to the position of the detected base pattern in the substrate. Method. Move the image acquisition device over the substrate where the ground pattern is exposed in multiple shots,
6. The exposure method according to claim 5 , wherein a position within the substrate of the base pattern exposed by dividing into a plurality of shots is detected. A base pattern is formed, and a substrate coated with a photoresist on the base pattern is mounted on the chuck.
A chuck, a spatial light modulator that modulates the light beam, a drive circuit that drives the spatial light modulator based on drawing data, and an irradiation optical system that irradiates the light beam modulated by the spatial light modulator Move relative to the light beam irradiation device,
An exposure method for drawing a pattern on a substrate by scanning the substrate with a light beam from a light beam irradiation device,
A plurality of chucks, stages for moving the chucks, and image acquisition devices are provided.
Each stage moves each chuck in turn from a standby position away from the bottom of the light beam irradiation device to an exposure position under the light beam irradiation device,
Each image acquisition device moves over the entire substrate over the substrate mounted on the chuck at the standby position, and acquires an image of the ground pattern,
Process the acquired image signal to detect the position of the substrate and the position of the base pattern across the entire substrate,
Based on the detection result, while the chuck on which the substrate is mounted is waiting at the standby position, the position of the base pattern within the substrate is detected over the entire substrate ,
While the chuck on which the substrate is mounted is waiting at the standby position, drawing data to be supplied to the drive circuit of the light beam irradiation apparatus is created according to the position of the detected base pattern in the substrate. that exposure light method. Move the image acquisition device over the substrate where the ground pattern is exposed in multiple shots,
8. The exposure method according to claim 7, wherein the position of the underlying pattern exposed by dividing into a plurality of shots in the substrate is detected . A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to claim 1. 5. A method of manufacturing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to claim 3. A method for producing a display panel substrate, wherein the substrate is exposed using the exposure method according to claim 5 . A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure method according to claim 7 or 8 .

Images