JP2011007974A - Exposure device, exposure method, and method of manufacturing display panel substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To draw a pattern with high accuracy even if height of a surface of a substrate fluctuates in scanning the substrate with optical beams by moving a chuck including the substrate mounted thereon by a stage.SOLUTION: The exposure device includes a height adjusting mechanism (a Z-tilt mechanism 9) for adjusting height of the chuck 10, and a detection device (a laser displacement gauge 47) for detecting fluctuation of height of the surface of the substrate 1 mounted on the chuck 10. Fluctuation of height of the surface of the substrate 1 mounted on the chuck 10 is detected by the detection device (the laser displacement gauge 47) while moving the chuck 10 by an X stage 5. The height of the chuck 10 is adjusted by the height adjusting mechanism (the Z-tilt mechanism 9) so that a focus of optical beams emitted from an optical beam irradiation device 20 is aligned with the surface of the substrate 1 based on the results of the detection. As a result, a pattern can be drawn with high accuracy even if the X stage 5 swings vertically to change the height of the surface of the substrate 1.

Description

  The present invention relates to an exposure apparatus that exposes a light beam to a substrate coated with a photoresist, scans the substrate with the light beam, and draws a pattern on the substrate in the manufacture of a display panel substrate such as a liquid crystal display device. The present invention relates to a method and a manufacturing method of a display panel substrate using them, and in particular, an exposure apparatus that scans a substrate with a light beam by moving a chuck on which the substrate is mounted by a stage, an exposure method, and a display using them. The present invention relates to a method for manufacturing a panel substrate for use.

  The manufacture of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, etc. for liquid crystal display devices used as display panels is performed using an exposure apparatus, photolithography. This is performed by forming a pattern on the substrate by a technique. Conventionally, as an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There was a proximity method to transfer.

  In recent years, an exposure apparatus has been developed that irradiates a substrate coated with a photoresist with a light beam, scans the substrate with the light beam, and draws a pattern on the substrate. Since the substrate is scanned by the light beam and the pattern is directly drawn on the substrate, an expensive mask is not required. Further, by changing the drawing data and the scanning program, various types of display panel substrates can be supported. Examples of such an exposure apparatus include those described in Patent Document 1, Patent Document 2, and Patent Document 3.

JP 2003-332221 A JP 2005-353927 A JP 2007-219011 A

  In order to scan a substrate with a light beam and draw a pattern on the substrate with high accuracy, it is necessary to keep the height of the surface of the substrate constant so that the focus of the light beam always matches the surface of the substrate. Conventionally, a detection device that detects the height of the surface of the substrate is provided above the chuck on which the substrate is mounted, the chuck is moved by a stage, and the height of the surface of the substrate is detected by three or more locations by the detection device. The height of the chuck was adjusted based on the detection result. However, there is a problem that it takes time to move three or more portions of the substrate under the detection device, and the tact time is increased. On the other hand, when three or more detection devices are provided and the height of the surface of the substrate is detected at three or more locations at the same time, there is a problem that the height of the chuck cannot be accurately adjusted due to a difference in detection error of each detection device.

  The substrate is scanned with the light beam by relatively moving the substrate and the light beam. A light beam irradiation device including a precise optical system is fixed, and the chuck on which the substrate is mounted is moved by the stage. It is common to do this. At that time, if the height of the surface of the substrate fluctuates due to the occurrence of pitching or the like on the stage, there is a problem that the focus of the light beam is shifted from the surface of the substrate and the pattern is not drawn with high accuracy.

  An object of the present invention is to accurately draw a pattern by adjusting the height of the surface of a substrate mounted on a chuck with high accuracy in a short time. Another object of the present invention is to accurately draw a pattern even when the height of the surface of the substrate fluctuates when the chuck carrying the substrate is moved by a stage and the substrate is scanned with a light beam. It is. Furthermore, an object of the present invention is to manufacture a high-quality display panel substrate.

  An exposure apparatus of the present invention includes a chuck for mounting a substrate coated with a photoresist, a stage for moving the chuck, and a light beam irradiation device for irradiating a light beam to the substrate mounted on the chuck. Is an exposure apparatus that draws a pattern on a substrate by scanning the substrate with a light beam from a light beam irradiation device, and is mounted on the chuck and a height adjusting mechanism that adjusts the height of the chuck Three or more detection devices for detecting the height of the surface of the substrate and three or more for detecting the position of the received reflected light by irradiating the inspection light obliquely to the substrate mounted on the chuck and receiving the reflected light from the substrate And a control means for controlling the stage and the height adjusting mechanism. The control means moves the chuck with respect to the first substrate mounted on the chuck by the stage. Reflection detected at three or more locations by three or more optical systems after detecting the height of the surface of the substrate at three or more locations with the detection device and adjusting the height of the chuck with the height adjustment mechanism based on the detection result. The position of the light is memorized, and the position of the reflected light detected by three or more optical systems at three or more locations with respect to the second and subsequent substrates mounted on the chuck is stored in the first substrate. The height of the chuck is adjusted by the height adjustment mechanism so that the distance is within a certain range from the position of the light.

  In the exposure method of the present invention, a substrate coated with a photoresist is mounted on a chuck, and the pattern is drawn on the substrate by scanning the substrate with a light beam from a light beam irradiation apparatus while moving the chuck with a stage. A height adjustment mechanism for adjusting the height of the chuck, a detection device for detecting the height of the surface of the substrate mounted on the chuck, and an inspection light obliquely to the substrate mounted on the chuck Irradiate, receive reflected light from the substrate, and provide three or more optical systems to detect the position of the received reflected light, and the stage is used to hold the chuck on the first substrate mounted on the chuck The height of the surface of the substrate is detected at three or more locations by the detection device, the height of the chuck is adjusted by the height adjustment mechanism based on the detection result, and then the reflected light is reflected by three or more optical systems. Position Detect and store at more than one location, detect the position of reflected light at three or more locations with the three or more optical systems for the second and subsequent substrates mounted on the chuck, and detect the reflected at three or more locations The height of the chuck is adjusted by the height adjusting mechanism so that the position of the light falls within a certain range from the position of the reflected light stored on the first substrate.

  For the first substrate mounted on the chuck, the chuck is moved by the stage, and the height of the surface of the substrate is detected at three or more locations by the detection device. Based on the detection result, the height adjustment mechanism is used. Adjust the height of the chuck. Using the same detection device, the height of the surface of the substrate is accurately detected at three or more locations, and the height of the chuck is adjusted with high accuracy. Then, after adjusting the height of the chuck, the inspection light is obliquely applied to the substrate mounted on the chuck, the reflected light from the substrate is received, and the position of the received reflected light is detected. The system detects and stores the position of the reflected light at three or more locations. For the second and subsequent substrates mounted on the chuck, the position of the reflected light is detected at three or more locations by three or more optical systems, and the detected positions of the reflected light at three or more locations are the first substrate. The height of the chuck is adjusted by the height adjusting mechanism so that the position is within a certain range from the position of the reflected light stored on the substrate. For the second and subsequent substrates, the height of the surface of the substrate becomes the same as the height of the surface of the first substrate after adjusting the height of the chuck without moving the chuck by the stage. The height of the surface of the substrate mounted on the substrate is adjusted with high accuracy in a short time, and the pattern is drawn with high accuracy.

  The exposure apparatus of the present invention further includes a chuck for mounting a substrate coated with a photoresist, a stage for moving the chuck, and a light beam irradiation device for irradiating the substrate mounted on the chuck with a light beam. An exposure device that draws a pattern on a substrate by scanning the substrate with a light beam from a light beam irradiation device while moving the chuck, and a height adjustment mechanism that adjusts the height of the chuck and mounted on the chuck And a control device for controlling the stage and the height adjustment mechanism, and the control device detects the detection result of the detection device while moving the chuck by the stage. Based on this, the height of the chuck is adjusted by the height adjustment mechanism so that the focus of the light beam emitted from the light beam irradiation device is aligned with the surface of the substrate.

  In the exposure method of the present invention, a substrate coated with a photoresist is mounted on a chuck, and the pattern is drawn on the substrate by scanning the substrate with a light beam from a light beam irradiation apparatus while moving the chuck with a stage. An exposure method for adjusting the height of the chuck, and a detection device for detecting fluctuations in the height of the surface of the substrate mounted on the chuck, while moving the chuck by the stage, A height adjustment mechanism that detects fluctuations in the height of the surface of the substrate mounted on the chuck by the detection device and adjusts the focus of the light beam emitted from the light beam irradiation device to the surface of the substrate based on the detection result This adjusts the height of the chuck.

  A height adjustment mechanism that adjusts the height of the chuck and a detection device that detects fluctuations in the height of the surface of the substrate mounted on the chuck are provided, and the chuck is mounted on the chuck by the detection device while moving the chuck on the stage. The height of the chuck is adjusted by the height adjustment mechanism so that the light beam emitted from the light beam irradiation device is focused on the surface of the substrate. Therefore, even if the stage is pitched and the height of the surface of the substrate fluctuates, the pattern can be drawn with high accuracy.

  The method for producing a display panel substrate according to the present invention involves exposing the substrate using any one of the above exposure apparatuses or exposure methods. By using the above exposure apparatus or exposure method, pattern drawing is performed with high accuracy, and thus a high-quality display panel substrate is manufactured.

  According to the exposure apparatus and the exposure method of the present invention, the height adjustment mechanism for adjusting the height of the chuck, the detection device for detecting the height of the surface of the substrate mounted on the chuck, and the inspection light are mounted on the chuck. Three or more optical systems for irradiating the substrate obliquely, receiving reflected light from the substrate, and detecting the position of the received reflected light, and for the first substrate mounted on the chuck Then, the chuck is moved by the stage, the height of the surface of the substrate is detected at three or more locations by the detection device, and the height of the chuck is adjusted by the height adjusting mechanism based on the detection result, and then the three or more optical components are detected. The system detects and stores the position of the reflected light at three or more locations, and detects the position of the reflected light at three or more locations for the second and subsequent substrates mounted on the chuck using three or more optical systems. The position of the detected reflected light at three or more locations is one The chuck is moved by the stage for the second and subsequent substrates by adjusting the height of the chuck by the height adjustment mechanism so that it is within a certain range from the position of the reflected light stored on the substrate. Since the height of the surface of the substrate can be made the same as the height of the surface of the first substrate after adjusting the height of the chuck, the height of the surface of the substrate mounted on the chuck can be shortened. The pattern can be accurately drawn by adjusting the time accurately.

  In addition, according to the exposure apparatus and the exposure method of the present invention, the height adjustment mechanism for adjusting the height of the chuck and the detection device for detecting the fluctuation in the height of the surface of the substrate mounted on the chuck are provided, and the stage While moving the chuck, the detection device detects the fluctuation in the height of the surface of the substrate mounted on the chuck, and the light beam emitted from the light beam irradiation device is focused on the surface of the substrate based on the detection result. Similarly, by adjusting the height of the chuck by the height adjusting mechanism, it is possible to accurately draw a pattern even if the stage is swayed and the surface height of the substrate fluctuates.

  According to the method for manufacturing a display panel substrate of the present invention, a pattern can be drawn with high accuracy, and thus a high-quality display panel substrate can be manufactured.

1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. 1 is a side view of an exposure apparatus according to an embodiment of the present invention. 1 is a front view of an exposure apparatus according to an embodiment of the present invention. It is a figure which shows schematic structure of a light beam irradiation apparatus. It is a top view of a θ stage and a Z-tilt mechanism. 6A is a front view of the Z-tilt mechanism, and FIG. 6B is a side view thereof. It is a figure explaining operation | movement of a laser length measurement system. It is a figure explaining operation | movement of a laser displacement meter. It is a figure explaining the detection of the height of the surface of a board | substrate by a laser displacement meter. It is a figure explaining the detection of the height of the surface of a board | substrate by a laser displacement meter. It is a figure explaining the detection of the height of the surface of a board | substrate by a laser displacement meter. It is a figure explaining the detection of the height of the surface of a board | substrate by a laser displacement meter. It is a top view of the chuck | zipper in a delivery position. It is a side view of the chuck | zipper in a delivery position. FIG. 15A is a diagram showing a schematic configuration of the optical system, and FIG. 15B is a diagram showing an example of an output signal of the CCD line sensor. It is a figure which shows schematic structure of a drawing control part. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of the exposure apparatus according to the embodiment of the present invention, and FIG. 3 is a front view of the exposure apparatus according to the embodiment of the present invention. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a Z-tilt mechanism 9, a chuck 10, a gate 11, a light beam irradiation apparatus 20, and linear scales 31 and 33. , Encoders 32 and 34, laser length measurement system, laser length measurement system control device 40, laser displacement meters 46 and 47, optical system 50, stage drive circuit 60, Z-tilt mechanism drive circuit 61, and main control device 70. It consists of 2 and 3, the laser light source 41 of the laser length measurement system, the laser length measurement system control device 40, the stage drive circuit 60, the Z-tilt mechanism drive circuit 61, and the main control device 70 are omitted. In addition to these, the exposure apparatus includes a substrate transfer robot that loads the substrate 1 into the chuck 10 and unloads the substrate 1 from the chuck 10, a temperature control unit that performs temperature management in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is carried into the chuck 10 by a substrate carrying robot (not shown), and the substrate 1 is carried out of the chuck 10 by a substrate carrying robot (not shown). The chuck 10 supports the back surface of the substrate 1 by vacuum suction. A photoresist is applied to the surface of the substrate 1.

  A gate 11 is provided across the base 3 above the exposure position where the substrate 1 is exposed. A plurality of light beam irradiation devices 20 are mounted on the gate 11. Although the present embodiment shows an example of an exposure apparatus using eight light beam irradiation apparatuses 20, the number of light beam irradiation apparatuses is not limited to this, and seven or less or nine or more light beams are used. An irradiation device may be used.

  FIG. 4 is a diagram showing a schematic configuration of the light beam irradiation apparatus. The light beam irradiation device 20 includes an optical fiber 22, a lens 23, a mirror 24, a DMD (Digital Micromirror Device) 25, a projection lens 26, and a DMD driving circuit 27. The optical fiber 22 introduces an ultraviolet light beam generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is irradiated to the DMD 25 through the lens 23 and the mirror 24. The DMD 25 is a spatial light modulator configured by arranging a plurality of minute mirrors that reflect a light beam in two directions, and modulates the light beam by changing the angle of each mirror. The light beam modulated by the DMD 25 is irradiated from the head unit 20 a including the projection lens 26. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main controller 70.

  2 and 3, the chuck 10 is mounted on the θ stage 8 via the Z-tilt mechanism 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves in the X direction along the X guide 4. The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves in the Y direction along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The X stage 5, Y stage 7, and θ stage 8 are provided with drive mechanisms (not shown) such as ball screws and motors, linear motors, etc., and each drive mechanism is driven by a stage drive circuit 60 of FIG. The

  FIG. 5 is a top view of the θ stage and the Z-tilt mechanism. The θ stage 8 has a substantially triangular upper surface, and a Z-tilt mechanism 9 is disposed at each corner. The three Z-tilt mechanisms 9 support the lower surface of the chuck 10 at three points. In FIG. 5, the chuck 10 supported by the Z-tilt mechanism 9 is indicated by a broken line.

  6A is a front view of the Z-tilt mechanism, and FIG. 6B is a side view thereof. The Z-tilt mechanism 9 includes a casing 91, a cover 91a, a linear motion guide 92, a lifting block 93, a motor 94, a shaft coupling 95, a ball screw 96a, a nut 96b, and a ball 97. FIG. 6A shows a state where the cover 91a is removed. As shown in FIG. 6A, each corner of the θ stage 8 is provided with a mounting portion 8a that forms a step with another portion and has a notch at the center. As shown in FIG. 6B, the casing 91 is mounted on the attachment portion 8a, and is fixed to the θ stage 8 by a reinforcing member 8b.

  As shown in FIG. 6A, a linear motion guide 92 is provided inside the casing 91, and an elevating block 93 is mounted on the linear motion guide 92. A motor 94 is installed below the attachment portion 8a, and the motor 94 is driven by the Z-tilt mechanism drive circuit 61 of FIG. The rotation shaft of the motor 94 is connected to the ball screw 96a by a shaft coupling 95 in the cutout portion of the attachment portion 8a. A nut 96 b that is moved by a ball screw 96 a is attached inside the elevating block 93, and the elevating block 93 moves up and down along the linear motion guide 92 by the rotation of the motor 94. As shown in FIGS. 6A and 6B, a ball 97 is attached to the upper surface of the lifting block 93, and the ball 97 supports the lower surface of the chuck 10. Each Z-tilt mechanism 9 moves and tilts the chuck 10 in the Z direction by moving the elevating block 93 up and down and changing the height of the ball 97 supporting the lower surface of the chuck 10. Adjust the height of 10.

  In FIG. 1, by rotating the θ stage 8 in the θ direction, the substrate 1 mounted on the chuck 10 is rotated so that two orthogonal sides are directed in the X direction and the Y direction. As the X stage 5 moves in the X direction, the chuck 10 is moved between the delivery position and the exposure position. When the X stage 5 moves in the X direction at the exposure position, the light beam irradiated from the head unit 20a of each light beam irradiation apparatus 20 scans the substrate 1 in the X direction. In addition, as the Y stage 7 moves in the Y direction, the scanning region of the substrate 1 by the light beam emitted from the head unit 20a of each light beam irradiation device 20 is moved in the Y direction. The main controller 70 controls the stage drive circuit 60 to rotate the θ stage 8 in the θ direction, move the X stage 5 in the X direction, and move the Y stage 7 in the Y direction. Further, the main controller 70 controls the Z-tilt mechanism drive circuit 61 to move and tilt the chuck 10 in the Z direction by each Z-tilt mechanism 9.

  1 and 2, the base 3 is provided with a linear scale 31 extending in the X direction. The linear scale 31 is provided with a scale for detecting the amount of movement of the X stage 5 in the X direction. The X stage 5 is provided with a linear scale 33 extending in the Y direction. The linear scale 33 is provided with a scale for detecting the amount of movement of the Y stage 7 in the Y direction.

  1 and 3, an encoder 32 is attached to one side surface of the X stage 5 so as to face the linear scale 31. The encoder 32 detects the scale of the linear scale 31 and outputs a pulse signal to the main controller 70. 1 and 2, an encoder 34 is attached to one side surface of the Y stage 7 so as to face the linear scale 33. The encoder 34 detects the scale of the linear scale 33 and outputs a pulse signal to the main controller 70. Main controller 70 counts the pulse signal of encoder 32, detects the amount of movement of X stage 5 in the X direction, counts the pulse signal of encoder 34, and moves the amount of Y stage 7 in the Y direction. Is detected.

  FIG. 7 is a diagram for explaining the operation of the laser length measurement system. In FIG. 7, the gate 11, the light beam irradiation device 20, the laser displacement meters 46 and 47, and the Z-tilt mechanism driving circuit 61 shown in FIG. 1 are omitted. The laser length measurement system is a known laser interference type length measurement system, and includes a laser light source 41, laser interferometers 42 and 44, and bar mirrors 43 and 45. The bar mirror 43 is attached to one side surface of the chuck 10 in the Y direction. The bar mirror 45 is attached to one side surface of the chuck 10 in the X direction.

  The laser interferometer 42 irradiates the laser beam from the laser light source 41 onto the bar mirror 43, receives the laser beam reflected by the bar mirror 43, and the laser beam reflected from the laser beam source 41 and the laser beam reflected by the bar mirror 43. Measure interference. This measurement is performed at two locations in the Y direction. The laser length measurement system control device 40 detects the position and rotation of the chuck 10 in the X direction from the measurement result of the laser interferometer 42 under the control of the main control device 70.

  On the other hand, the laser interferometer 44 irradiates the laser beam from the laser light source 41 to the bar mirror 45, receives the laser beam reflected by the bar mirror 45, and the laser beam reflected from the laser source 41 and the bar mirror 45. Measure interference with light. The laser length measurement system control device 40 detects the position of the chuck 10 in the Y direction from the measurement result of the laser interferometer 44 under the control of the main control device 70.

  1 and 3, the gate 11 is provided with one laser displacement meter 46 and two laser displacement meters 47. FIG. 8 is a diagram for explaining the operation of the laser displacement meter. FIG. 8 shows a part of the exposure apparatus viewed from the opposite direction to FIG. The laser displacement meter 46 irradiates the substrate 1 mounted on the chuck 10 with laser light when the height of the chuck 10 to be described later is adjusted, receives the laser light reflected on the surface of the substrate 1, and Detect the height of the surface. Each laser displacement meter 47 irradiates the substrate 1 mounted on the chuck 10 with laser light when scanning the substrate 1 with the light beam from the light beam irradiation device 20 and reflects the laser beam reflected on the surface of the substrate 1. Light is received to detect a change in the height of the surface of the substrate 1.

  In this embodiment, the laser displacement meter 46 for detecting the height of the surface of the substrate 1 is provided separately from the laser displacement meter 47 for detecting the variation in the height of the surface of the substrate 1. Either one of the total 47 may be used as the laser displacement meter 46.

  The operation of the exposure apparatus according to this embodiment will be described below. In FIG. 1, first, when the first substrate is mounted on the chuck 10, the main controller 70 moves the chuck 10 by the X stage 5 and the Y stage 7, and the surface of the substrate 1 by the laser displacement meter 46. Is detected at three or more locations. 9 to 12 are diagrams for explaining the detection of the height of the surface of the substrate by the laser displacement meter. 9 to 12 show an example in which the height of the surface of the substrate 1 is detected at four locations. The main controller 70 controls the stage drive circuit 60 based on the detection result of the laser measurement system controller 40, and moves the chuck 10 by the X stage 5 and the Y stage 7, as shown in FIGS. In addition, four predetermined detection points at the four corners of the substrate 1 are sequentially positioned directly below the laser displacement meter 46. The laser displacement meter 46 detects the height of the surface of the substrate 1 at each of four detection locations.

  The main controller 70 controls the Z-tilt mechanism drive circuit 61 based on the detection results of the laser displacement meter 46 at the four detection locations, and adjusts the height of the chuck 10 by each Z-tilt mechanism 9. Using the same laser displacement meter 46, the height of the surface of the substrate 1 is accurately detected at four locations, and the height of the chuck 10 is adjusted with high accuracy. After adjusting the height of the chuck 10, the main controller 70 controls the stage drive circuit 60 to move the chuck 10 to the delivery position by the X stage 5 and the Y stage 7.

  FIG. 13 is a top view of the chuck in the delivery position. FIG. 14 is a side view of the chuck in the delivery position. As shown in FIGS. 13 and 14, the optical system 50 is disposed above the chuck 10 at the delivery position and directly above the four detection points where the height of the substrate 1 is detected by the laser displacement meter 46. ing. FIG. 15A is a diagram showing a schematic configuration of the optical system. The optical system 50 includes a laser light source 51, a collimation lens group 52, a projection lens 53, mirrors 54 and 55, an imaging lens 56, and a CCD line sensor 57.

  The laser light source 51 generates laser light serving as inspection light. The inspection light generated from the laser light source 51 is collected by the collimation lens group 52 and is irradiated obliquely from the projection lens 53 to the substrate 1 mounted on the chuck 10 via the mirror 54. A part of the inspection light irradiated obliquely onto the substrate 1 is reflected by the surface of the substrate 1 and a part of the inspection light is transmitted into the substrate 1. The inspection light transmitted to the inside of the substrate 1 is reflected on the back surface of the substrate 1 and is emitted from the surface of the substrate 1. Reflected light from the front surface of the substrate 1 and reflected light from the back surface of the substrate 1 pass through the imaging lens 56 via the mirror 55 and form an image on the light receiving surface of the CCD line sensor 57.

  FIG. 15B is a diagram illustrating an example of an output signal of the CCD line sensor. The CCD line sensor 57 generates output signals corresponding to the intensity of the received reflected light at the position where the reflected light from the front surface of the substrate 1 is received and the position where the reflected light from the back surface of the substrate 1 is received, Thereby, the optical system 50 detects the position of the reflected light from the surface of the substrate 1 and the position of the reflected light from the back surface of the substrate 1, respectively. The optical system 50 of the present embodiment has no detection error due to the reflectance of the substrate 1 and can perform detection with high reproducibility.

  In FIG. 13, four optical systems 50 detect the position of reflected light from the surface of the substrate 1 and the position of reflected light from the back surface of the substrate 1 at four detection locations where the height of the substrate 1 is detected. . In FIG. 1, main controller 70 receives the output signal of each optical system 50, and the position of reflected light from the surface of substrate 1 at the four detection locations detected by each optical system 50 and the back surface of substrate 1. The position of the reflected light from is stored.

  When the second substrate is mounted on the chuck 10, the four optical systems 50 detect the position of the reflected light from the surface of the substrate 1 at the four detection locations where the position of the reflected light is detected for the first substrate. And the position of the reflected light from the back surface of the substrate 1 is detected. Main controller 70 receives the output signal of each optical system 50, and the position of the reflected light from the surface of substrate 1 and the reflected light from the back surface of substrate 1 at the four detection locations detected by each optical system 50. Z-tilt mechanism drive circuit so that the positions of the reflected light are within a certain range from the position of the reflected light from the front surface of the substrate 1 and the position of the reflected light from the back surface of the substrate 1 stored in the first substrate. 61 is controlled, and the height of the chuck 10 is adjusted by each Z-tilt mechanism 9.

  For the second and subsequent substrates, the surface of the first substrate after the height of the chuck 10 is adjusted without the chuck 10 being moved by the X stage 5 and the Y stage 7. Therefore, the height of the surface of the substrate 1 mounted on the chuck 10 is accurately adjusted in a short time.

  In FIG. 1, the main controller 70 has a drawing controller that supplies drawing data to the DMD drive circuit 27 of the light beam irradiation device 20. FIG. 16 is a diagram illustrating a schematic configuration of the drawing control unit. The drawing control unit 71 includes a memory 72, a bandwidth setting unit 73, a center point coordinate determination unit 74, and a coordinate determination unit 75. The memory 72 stores drawing data to be supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20 using the XY coordinates as addresses.

  The bandwidth setting unit 73 sets the Y-direction bandwidth of the light beam emitted from the head unit 20 a of the light beam irradiation device 20 by determining the range of the Y coordinate of the drawing data read from the memory 72.

  The laser length measurement system control device 40 detects the position of the chuck 10 in the X and Y directions before the exposure of the substrate 1 at the exposure position is started. The center point coordinate determination unit 74 determines the XY coordinates of the center point of the chuck 10 before starting the exposure of the substrate 1 from the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40. In FIG. 1, when scanning the substrate 1 with the light beam from the light beam irradiation device 20, the main control device 70 controls the stage drive circuit 60 to move the chuck 10 in the X direction by the X stage 5. When moving the scanning area of the substrate 1, the main controller 70 controls the stage drive circuit 60 to move the chuck 10 in the Y direction by the Y stage 7. In FIG. 16, the center point coordinate determination unit 74 counts the pulse signals from the encoders 32 and 34, detects the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction, The XY coordinates of the center point of the chuck 10 are determined.

  The coordinate determination unit 75 determines the XY coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 based on the XY coordinates of the center point of the chuck 10 determined by the center point coordinate determination unit 74. The memory 72 inputs the XY coordinates determined by the coordinate determination unit 75 as an address, and outputs the drawing data stored at the input XY coordinate address to the DMD drive circuit 27 of each light beam irradiation apparatus 20.

  When the substrate 1 is scanned by the light beam from the light beam irradiation device 20, if the vertical movement or the like occurs in the X stage 5, the height of the surface of the substrate 1 varies. In FIG. 8, each laser displacement meter 47 detects a change in the height of the surface of the substrate 1 when scanning the substrate 1 with the light beam from the light beam irradiation device 20. In FIG. 1, the main controller 70 controls the Z-tilt mechanism driving circuit 61 based on the detection result of each laser displacement meter 47 so that the focal point of the light beam emitted from the light beam irradiation device 20 is the substrate 1. The height of the chuck 10 is adjusted by each Z-tilt mechanism 9 so as to match the surface.

  While moving the chuck 10 by the X stage 5, the laser displacement meter 47 detects the variation in the height of the surface of the substrate 1 mounted on the chuck 10, and the light emitted from the light beam irradiation device 20 based on the detection result. Since the height of the chuck 10 is adjusted by the Z-tilt mechanism 9 so that the beam is focused on the surface of the substrate 1, pitching or the like occurs in the X stage 5 and the surface height of the substrate 1 fluctuates. However, the pattern is drawn with high accuracy.

  17 to 20 are diagrams for explaining scanning of the substrate by the light beam. FIGS. 17 to 20 show an example in which the entire substrate 1 is scanned by scanning the substrate 1 in the X direction four times with the eight light beams from the eight light beam irradiation apparatuses 20. 17-20, the head part 20a of each light beam irradiation apparatus 20 is shown with the broken line. The light beam emitted from the head unit 20a of each light beam irradiation device 20 has a bandwidth W in the Y direction, and the substrate 1 is scanned in the direction indicated by the arrow by the movement of the X stage 5 in the X direction.

  FIG. 17 shows the first scan, and the pattern is drawn in the scan area shown in gray in FIG. 17 by the first scan in the X direction. When the first scanning is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 18 shows the second scan, and the pattern is drawn in the scan area shown in gray in FIG. 18 by the second scan in the X direction. When the second scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 19 shows the third scan, and the pattern is drawn in the scan area shown in gray in FIG. 19 by the third scan in the X direction. When the third scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 20 shows the fourth scan. With the fourth scan in the X direction, the pattern is drawn in the scan area shown in gray in FIG. 20, and the scan of the entire substrate 1 is completed.

  By scanning the substrate 1 in parallel with a plurality of light beams from the plurality of light beam irradiation apparatuses 20, the time required for scanning the entire substrate 1 can be shortened, and the tact time can be shortened.

  17 to 20 show an example in which the substrate 1 is scanned four times by scanning the substrate 1 in the X direction. However, the number of scans is not limited to this, and the substrate 1 is scanned in the X direction. May be performed 3 times or less or 5 times or more to scan the entire substrate 1.

  According to the embodiment described above, the Z-tilt mechanism 9 that adjusts the height of the chuck 10, the laser displacement meter 46 that detects the height of the surface of the substrate 1 mounted on the chuck 10, and the inspection light. Three or more optical systems 50 for irradiating the substrate 1 mounted on the chuck 10 obliquely, receiving the reflected light from the substrate 1 and detecting the position of the received reflected light are provided and mounted on the chuck 10. The chuck 10 is moved by the X stage 5 and the Y stage 7 with respect to the first substrate, and the height of the surface of the substrate 1 is detected at three or more locations by the laser displacement meter 46. Based on the detection result, After adjusting the height of the chuck 10 by the Z-tilt mechanism 9, the positions of reflected light are detected and stored at three or more positions by three or more optical systems 50, and the second and subsequent sheets mounted on the chuck 10 are stored. 3 or more for the substrate The academic system 50 detects the position of reflected light at three or more locations, and the detected positions of the reflected light at three or more locations are within a certain range from the position of the reflected light stored on the first substrate. By adjusting the height of the chuck 10 by the Z-tilt mechanism 9, the height of the surface of the substrate 1 can be increased without moving the chuck 10 by the X stage 5 and the Y stage 7 for the second and subsequent substrates. Since the height of the surface of the first substrate after adjusting the height of the chuck 10 can be made the same, the height of the surface of the substrate 1 mounted on the chuck 10 can be adjusted accurately in a short time. Thus, the pattern can be drawn with high accuracy.

  Further, a Z-tilt mechanism 9 that adjusts the height of the chuck 10 and a laser displacement meter 47 that detects a change in the height of the surface of the substrate 1 mounted on the chuck 10 are provided. While moving, the laser displacement meter 47 detects a change in the height of the surface of the substrate 1 mounted on the chuck 10, and based on the detection result, the focal point of the light beam emitted from the light beam irradiation device 20 is that of the substrate 1. By adjusting the height of the chuck 10 with the Z-tilt mechanism 9 so as to match the surface, even if the vertical movement or the like occurs in the X stage 5 and the height of the surface of the substrate 1 fluctuates, the pattern is drawn. Can be performed with high accuracy.

  By exposing the substrate using the exposure apparatus or the exposure method of the present invention, the pattern can be drawn with high accuracy, so that a high-quality display panel substrate can be manufactured.

  For example, FIG. 21 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photoresist is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), a pattern is formed on the photoresist film using an exposure apparatus. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 22 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 21, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 22, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the exposure apparatus or the exposure method of the present invention can be applied.

DESCRIPTION OF SYMBOLS 1 Substrate 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 8a Mounting part 8b Reinforcement member 9 Z-tilt mechanism 10 Chuck 11 Gate 20 Light beam irradiation device 20a Head part 21 Laser light source unit 22 Optical fiber 23 Lens 24 Mirror 25 DMD (Digital Micromirror Device)
26 Projection Lens 27 DMD Drive Circuit 31, 33 Linear Scale 32, 34 Encoder 40 Laser Measuring System Controller 41 Laser Light Source 42, 44 Laser Interferometer 43, 45 Bar Mirror 46, 47 Laser Displacement Meter 50 Optical System 51 Laser Light Source 52 Collimation Lens group 53 Projection lens 54, 55 Mirror 56 Imaging lens 57 CCD line sensor 60 Stage drive circuit 61 Z-tilt mechanism drive circuit 70 Main controller 71 Drawing control unit 72 Memory 73 Bandwidth setting unit 74 Center point coordinate determination unit 75 Coordinate determining unit 91 Casing 91a Cover 92 Linear motion guide 93 Lifting block 94 Motor 95 Shaft coupling 96a Ball screw 96b Nut 97 Ball

Claims (8)

A chuck for mounting a substrate coated with a photoresist;
A stage for moving the chuck;
A light beam irradiation device for irradiating the substrate mounted on the chuck with a light beam,
An exposure apparatus that scans a substrate with a light beam from the light beam irradiation apparatus and draws a pattern on the substrate while moving the chuck by the stage,
A height adjusting mechanism for adjusting the height of the chuck;
A detection device for detecting the height of the surface of the substrate mounted on the chuck;
Three or more optical systems for irradiating the inspection light obliquely to the substrate mounted on the chuck, receiving the reflected light from the substrate, and detecting the position of the received reflected light;
Control means for controlling the stage and the height adjusting mechanism,
The control means moves the chuck with respect to the first substrate mounted on the chuck by the stage and causes the detection device to detect the height of the surface of the substrate at three or more locations. The height of the chuck is adjusted by the height adjusting mechanism, the positions of reflected light detected at three or more locations by the three or more optical systems are stored, and the second sheet mounted on the chuck is stored. For the subsequent substrates, the position of the reflected light detected at three or more locations by the three or more optical systems is within a certain range from the position of the reflected light stored in the first substrate, respectively. An exposure apparatus, wherein the height of the chuck is adjusted by the height adjusting mechanism. An exposure method in which a substrate coated with a photoresist is mounted on a chuck, the substrate is scanned with a light beam from a light beam irradiation apparatus while the chuck is moved by a stage, and a pattern is drawn on the substrate,
A height adjustment mechanism that adjusts the height of the chuck, a detection device that detects the height of the surface of the substrate mounted on the chuck, and an inspection beam that is obliquely applied to the substrate mounted on the chuck and reflected from the substrate Three or more optical systems for receiving light and detecting the position of the received reflected light; and
The chuck is moved by the stage with respect to the first substrate mounted on the chuck, the height of the surface of the substrate is detected at three or more locations by the detection device, and the chuck is adjusted by the height adjustment mechanism based on the detection result. After adjusting the height of the light, the position of the reflected light is detected and stored at three or more locations by three or more optical systems,
With respect to the second and subsequent substrates mounted on the chuck, the positions of reflected light are detected at three or more locations by three or more optical systems, and the detected positions of the reflected light at three or more locations are the first substrate. An exposure method comprising adjusting a height of a chuck by a height adjusting mechanism so that each position falls within a certain range from a position of reflected light stored on a substrate. A chuck for mounting a substrate coated with a photoresist;
A stage for moving the chuck;
A light beam irradiation device for irradiating the substrate mounted on the chuck with a light beam,
An exposure apparatus that scans a substrate with a light beam from the light beam irradiation apparatus and draws a pattern on the substrate while moving the chuck by the stage,
A height adjusting mechanism for adjusting the height of the chuck;
A detection device for detecting fluctuations in the height of the surface of the substrate mounted on the chuck;
Control means for controlling the stage and the height adjusting mechanism,
The control means adjusts the height while moving the chuck by the stage so that the light beam emitted from the light beam irradiation device is focused on the surface of the substrate based on the detection result of the detection device. An exposure apparatus, wherein the height of the chuck is adjusted by a mechanism. An exposure method in which a substrate coated with a photoresist is mounted on a chuck, the substrate is scanned with a light beam from a light beam irradiation apparatus while the chuck is moved by a stage, and a pattern is drawn on the substrate,
A height adjustment mechanism for adjusting the height of the chuck and a detection device for detecting a change in the height of the surface of the substrate mounted on the chuck are provided.
While the chuck is moved by the stage, the detection device detects fluctuations in the height of the surface of the substrate mounted on the chuck, and based on the detection result, the focal point of the light beam emitted from the light beam irradiation device is on the surface of the substrate. An exposure method, wherein the height of the chuck is adjusted by a height adjusting mechanism so as to match.   A method for producing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to claim 1.   A method for producing a display panel substrate, wherein the substrate is exposed using the exposure method according to claim 2.   A method for producing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to claim 3.   A method for producing a display panel substrate, wherein the substrate is exposed using the exposure method according to claim 4.

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