JP2011123383A - Exposure device, exposure method, and method of manufacturing panel substrate for display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To accurately draw a pattern by uniforming an exposure amount when the pattern is drawn on the substrate by a light beam. <P>SOLUTION: A light quantity data memory 82 of an exposure pattern analyzer 80 previously stores the quantity of the light beam radiated from a light beam radiation device 20 for each exposure region of a predetermined area. A drawing control section 71 supplies drawing data to a DMD driving circuit 27 of the light beam radiation device 20. An exposure counter 85 counts the number of radiations of the light beam for each exposure region of the predetermined area based on: the relative position of a chuck 10 and the light beam radiation device 20; and the drawing data supplied to the DMD driving circuit 27 of the light beam radiation device 20. An arithmetic circuit 87 calculates the exposure amount for each exposure region of the predetermined area based on: the previously stored quantity of the light beam; and the number of radiations of the light beam. The exposure pattern analyzer 80 corrects the exposure amount based on the calculated exposure amount. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an exposure apparatus that exposes a light beam to a substrate coated with a photoresist, scans the substrate with the light beam, and draws a pattern on the substrate in the manufacture of a display panel substrate such as a liquid crystal display device. The present invention relates to a method and a method for manufacturing a display panel substrate using the same.

  The manufacture of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, etc. for liquid crystal display devices used as display panels is performed using an exposure apparatus, photolithography. This is performed by forming a pattern on the substrate by a technique. Conventionally, as an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There was a proximity method to transfer.

  In recent years, an exposure apparatus has been developed that irradiates a substrate coated with a photoresist with a light beam, scans the substrate with the light beam, and draws a pattern on the substrate. Since the substrate is scanned by the light beam and the pattern is directly drawn on the substrate, an expensive mask is not required. Further, by changing the drawing data and the scanning program, various types of display panel substrates can be supported. Examples of such an exposure apparatus include those described in Patent Document 1, Patent Document 2, and Patent Document 3.

JP 2003-332221 A JP 2005-353927 A JP 2007-219011 A

  When a pattern is drawn on a substrate with a light beam, a spatial light modulator such as a DMD (Digital Micromirror Device) is used to modulate the light beam. The DMD is configured by arranging a plurality of minute mirrors that reflect a light beam in two orthogonal directions, and the drive circuit changes the angle of each mirror based on the drawing data, whereby the light beam supplied from the light source Modulate. If the operating angle of each mirror of the DMD is not constant, the amount of light of the light beam reflected by each mirror will vary. In addition, the scanning of the substrate with the light beam is performed by relatively moving the chuck that supports the substrate and the light beam irradiation device that irradiates the light beam, but the relative movement speed between the chuck and the light beam irradiation device. Thus, the number of times of irradiation of the light beam emitted from the light beam irradiation device is different. For this reason, there has been a problem that variations in the exposure amount of the pattern drawn on the substrate by the light beam change in a complicated manner, making it difficult to perform highly accurate correction.

  Conventionally, the performance of the exposure apparatus was evaluated by inspecting the substrate on which the pattern was drawn with a light beam. However, it was unclear how the pattern was actually formed on the substrate, so a problem occurred. When it was difficult to investigate the cause.

  An object of the present invention is to perform pattern drawing with high accuracy by making the exposure amount uniform when drawing a pattern on a substrate with a light beam. Another object of the present invention is to improve the exposure conditions by analyzing a pattern drawn on a substrate by a light beam. Furthermore, an object of the present invention is to manufacture a high-quality display panel substrate.

  An exposure apparatus of the present invention includes a chuck that supports a substrate coated with a photoresist, a spatial light modulator that modulates a light beam, a drive circuit that drives the spatial light modulator based on drawing data, and a spatial A light beam irradiation apparatus having an irradiation optical system for irradiating a light beam modulated by the light modulator; and a moving means for relatively moving the chuck and the light beam irradiation apparatus. The moving means irradiates the chuck and the light beam. An exposure apparatus that moves relative to the apparatus, scans the substrate with the light beam from the light beam irradiation apparatus, and draws a pattern on the substrate, and detects the relative position of the chuck and the light beam irradiation apparatus Detecting means for performing drawing, drawing control means for supplying drawing data to a drive circuit of the light beam irradiation apparatus, and analyzing a pattern drawn on the substrate by the light beam from the light beam irradiation apparatus A memory in which the amount of light beam emitted from the light beam irradiation device is stored in advance for each exposure area of a predetermined area, a chuck detected by the detection means, and the light beam irradiation device. And a counter that counts the number of times of irradiation of the light beam for each exposure area of a predetermined area from the drawing data supplied from the drawing control means to the drive circuit of the light beam irradiation device, and stored in the memory An arithmetic circuit that calculates an exposure amount for each exposure area of a predetermined area from the light amount of the light beam and the number of times of irradiation of the light beam counted by a counter, and the exposure amount is corrected based on the exposure amount calculated by the arithmetic circuit. Correction means.

  The exposure method of the present invention also supports a substrate coated with a photoresist with a chuck, a spatial light modulator that modulates a light beam, and a drive that drives the spatial light modulator based on drawing data. A circuit, and a light beam irradiation apparatus having an irradiation optical system that irradiates a light beam modulated by a spatial light modulator, relatively moves, scans the substrate with the light beam from the light beam irradiation apparatus, An exposure method for drawing a pattern on a substrate, wherein the amount of light beam emitted from a light beam irradiation device is stored in advance for each exposure area of a predetermined area, and the relative relationship between the chuck and the light beam irradiation device is stored. The position is detected, drawing data is supplied to the drive circuit of the light beam irradiation device, the light is calculated from the relative position between the chuck and the light beam irradiation device, and the drawing data supplied to the drive circuit of the light beam irradiation device. The number of exposures of the beam is counted for each exposure area of a predetermined area, and the exposure amount is calculated by calculating the exposure amount for each exposure area of the predetermined area from the light amount of the light beam stored in advance and the number of irradiations of the light beam. The exposure amount is corrected based on the amount.

  The relative position between the chuck and the light beam irradiation device is detected, drawing data is supplied to the drive circuit of the light beam irradiation device, the relative position between the chuck and the light beam irradiation device, and the driving of the light beam irradiation device. From the drawing data supplied to the circuit, the number of light beam irradiations is counted for each exposure area of a predetermined area, so that even if the relative movement speed of the chuck and the light beam irradiation device fluctuates, the number of light beam irradiations can be reduced. It is detected for each exposure area of a predetermined area. Since the exposure amount is calculated for each exposure area of a predetermined area from the light amount of the light beam stored in advance and the number of times of irradiation of the light beam, the actual exposure amount can be obtained even if the amount of light beam varies. It is detected for each exposure area of a predetermined area. Therefore, by correcting the exposure amount based on the calculated exposure amount, the exposure amount becomes uniform and pattern drawing is performed with high accuracy.

  Further, in the exposure apparatus of the present invention, the drawing control means supplies the drawing data for correction to the drive circuit of the light beam irradiation apparatus, and the exposure amount is a predetermined value based on the exposure amount calculated by the arithmetic circuit. The exposure amount is determined by the determination circuit among the determination circuit that determines whether or not the exposure area has been reached for each exposure area of a predetermined area and the correction drawing data supplied from the drawing control means to the drive circuit of the light beam irradiation apparatus. And a mask circuit for masking data of coordinates other than the coordinates of the exposure area determined to have not reached the predetermined value.

  Further, the exposure method of the present invention determines, based on the calculated exposure amount, whether or not the exposure amount has reached a predetermined value for each exposure region of a predetermined area, and applies correction to the drive circuit of the light beam irradiation apparatus. Masking the data of coordinates other than the coordinates of the exposure area determined that the exposure amount has not reached the predetermined value among the drawing data for correction supplied to the driving circuit of the light beam irradiation apparatus. The exposure amount is corrected.

  Based on the calculated exposure amount, it is determined for each exposure area of a predetermined area whether or not the exposure amount has reached a predetermined value, and the exposure amount in the correction drawing data supplied to the drive circuit of the light beam irradiation apparatus Since the exposure amount is corrected by masking the data of the coordinates other than the coordinates of the exposure area determined as having not reached the predetermined value, the normal drawing data can be used as the drawing data for correction as it is. Accordingly, the exposure amount is corrected by a simple process using normal drawing data as correction drawing data.

  The method for producing a display panel substrate according to the present invention involves exposing the substrate using any one of the above exposure apparatuses or exposure methods. By using the above-described exposure apparatus or exposure method, the exposure amount becomes uniform and pattern drawing is performed with high accuracy, so that a high-quality display panel substrate is manufactured.

  An exposure apparatus of the present invention includes a chuck that supports a substrate coated with a photoresist, a spatial light modulator that modulates a light beam, a drive circuit that drives the spatial light modulator based on drawing data, and A light beam irradiation apparatus having an irradiation optical system for irradiating a light beam modulated by a spatial light modulator; and a moving means for relatively moving the chuck and the light beam irradiation apparatus. An exposure apparatus that moves relative to a beam irradiation apparatus, scans a substrate with a light beam from the light beam irradiation apparatus, and draws a pattern on the substrate, and a relative position between the chuck and the light beam irradiation apparatus Detecting means for detecting light, drawing control means for supplying drawing data to the drive circuit of the light beam irradiation device, and a pattern drawn on the substrate by the light beam from the light beam irradiation device. A first memory for storing information on a relative position between the chuck and the light beam irradiation device detected by the detection means, and a drive circuit for the light beam irradiation device from the drawing control means. From the second memory for storing the drawing data supplied to the image, the relative position information of the chuck and the light beam irradiation device stored in the first memory, and the drawing data stored in the second memory And a processing device for reproducing the shape of the pattern drawn on the substrate by the light beam from the light beam irradiation device.

  The exposure method of the present invention also supports a substrate coated with a photoresist with a chuck, a spatial light modulator that modulates a light beam, and a drive that drives the spatial light modulator based on drawing data. A circuit, and a light beam irradiation apparatus having an irradiation optical system that irradiates a light beam modulated by a spatial light modulator, relatively moves, scans the substrate with the light beam from the light beam irradiation apparatus, An exposure method for drawing a pattern on a substrate, detecting a relative position between a chuck and a light beam irradiation device, supplying drawing data to a drive circuit of the light beam irradiation device, and Relative position information is stored in the first memory, drawing data supplied to the drive circuit of the light beam irradiation device is stored in the second memory, and the chuck and light beam irradiation device stored in the first memory are stored. Relative position information with, and from the drawing data stored in the second memory, in which to reproduce the shape of the pattern to be drawn on the substrate by the light beam from the light beam irradiation device.

  The relative position between the chuck and the light beam irradiation device is detected, drawing data is supplied to the drive circuit of the light beam irradiation device, and information on the relative position between the chuck and the light beam irradiation device is stored in the first memory. The drawing data stored and supplied to the drive circuit of the light beam irradiation apparatus is stored in the second memory, the information on the relative position between the chuck and the light beam irradiation apparatus stored in the first memory, and the second Since the shape of the pattern drawn on the substrate by the light beam from the light beam irradiation apparatus is reproduced from the drawing data stored in the memory, it becomes possible to improve the exposure conditions by analyzing the shape of the reproduced pattern. .

  Furthermore, in the exposure apparatus of the present invention, the processing apparatus uses light from the information on the relative position between the chuck and the light beam irradiation device stored in the first memory and the drawing data stored in the second memory. The number of beam irradiations is integrated for each exposure area having a predetermined area, and the exposure amount is calculated for each exposure area having a predetermined area. In the exposure method of the present invention, the number of times of irradiation with the light beam is predetermined from the information on the relative position between the chuck and the light beam irradiation device stored in the first memory and the drawing data stored in the second memory. The amount of exposure is calculated for each exposure region having a predetermined area, and the exposure amount is calculated for each exposure region having a predetermined area. From the information on the relative position between the chuck and the light beam irradiation device stored in the first memory and the drawing data stored in the second memory, the number of times of irradiation with the light beam is integrated for each exposure area of a predetermined area. Since the exposure amount is calculated for each exposure area having a predetermined area, it is possible to control the exposure amount by analyzing the exposure amount of the reproduced pattern.

  According to the exposure apparatus and the exposure method of the present invention, the light amount of the light beam irradiated from the light beam irradiation apparatus is stored in advance for each exposure area of a predetermined area, and the relative relationship between the chuck and the light beam irradiation apparatus is stored. The position is detected, drawing data is supplied to the drive circuit of the light beam irradiation apparatus, and the relative position between the chuck and the light beam irradiation apparatus and the drawing data supplied to the drive circuit of the light beam irradiation apparatus are used to calculate the light beam. The number of times of irradiation is counted for each exposure area of a predetermined area, the amount of exposure of the light beam stored in advance and the number of times of irradiation of the light beam are calculated for each exposure area of the predetermined area, and based on the calculated exposure amount By correcting the exposure amount, the exposure amount can be made uniform and the pattern can be drawn with high accuracy.

  Further, according to the exposure apparatus and the exposure method of the present invention, based on the calculated exposure amount, it is determined for each exposure region having a predetermined area whether or not the exposure amount has reached a predetermined value, and the light beam irradiation apparatus is driven. Data for coordinates other than the coordinates of the exposure area determined to have supplied the drawing data for correction to the circuit and supplied to the drive circuit of the light beam irradiation apparatus and the exposure amount has not reached the predetermined value By masking and correcting the exposure amount, it is possible to correct the exposure amount with a simple process using normal drawing data as correction drawing data.

  According to the method for manufacturing a display panel substrate of the present invention, the exposure amount can be made uniform and the pattern can be drawn with high accuracy, so that a high-quality display panel substrate can be manufactured.

  Further, according to the exposure apparatus and the exposure method of the present invention, the relative position between the chuck and the light beam irradiation apparatus is detected, the drawing data is supplied to the drive circuit of the light beam irradiation apparatus, and the chuck and the light beam irradiation apparatus Is stored in the first memory, the drawing data supplied to the drive circuit of the light beam irradiation device is stored in the second memory, and the chuck and the light beam irradiation stored in the first memory are stored. By reproducing the shape of the pattern drawn on the substrate by the light beam from the light beam irradiation device from the information on the relative position with the device and the drawing data stored in the second memory, the shape of the reproduced pattern is reproduced. Can be analyzed to improve the exposure conditions.

  Furthermore, according to the exposure apparatus and the exposure method of the present invention, the light beam is calculated from the relative position information between the chuck and the light beam irradiation device stored in the first memory and the drawing data stored in the second memory. The exposure amount of the reproduced pattern is analyzed and the exposure amount is controlled by calculating the exposure amount for each exposure region of a predetermined area by integrating the number of times of irradiation for each exposure region of the predetermined area. It becomes possible.

1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. 1 is a side view of an exposure apparatus according to an embodiment of the present invention. 1 is a front view of an exposure apparatus according to an embodiment of the present invention. It is a figure which shows schematic structure of a light beam irradiation apparatus. It is a figure explaining operation | movement of a laser length measurement system. It is a figure which shows schematic structure of a drawing control part. It is a figure which shows the exposure pattern analysis apparatus of the exposure apparatus by one embodiment of this invention. It is a figure explaining operation | movement of the exposure pattern analyzer shown in FIG. It is a figure explaining operation | movement of the exposure pattern analyzer shown in FIG. It is a figure explaining operation | movement of the exposure pattern analyzer shown in FIG. It is a figure explaining operation | movement of the exposure pattern analyzer shown in FIG. It is a figure explaining operation | movement of the exposure pattern analyzer shown in FIG. It is a figure which shows the exposure pattern analysis apparatus of the exposure apparatus by other embodiment of this invention. It is a figure explaining operation | movement of the exposure pattern analyzer shown in FIG. It is a figure explaining operation | movement of the exposure pattern analyzer shown in FIG. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of the exposure apparatus according to the embodiment of the present invention, and FIG. 3 is a front view of the exposure apparatus according to the embodiment of the present invention. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck 10, a gate 11, a light beam irradiation device 20, linear scales 31, 33, encoders 32, 34, A laser length measurement system, a laser length measurement system control device 40, a stage drive circuit 60, a main control device 70, and an exposure pattern analysis device are configured. In FIG. 1, the exposure pattern analysis apparatus is omitted. 2 and 3, the laser light source 41 of the laser length measurement system, the laser length measurement system control device 40, the stage drive circuit 60, the main control device 70, and the exposure pattern analysis device are omitted. In addition to these, the exposure apparatus includes a substrate transfer robot that loads the substrate 1 into the chuck 10 and unloads the substrate 1 from the chuck 10, a temperature control unit that performs temperature management in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is carried into the chuck 10 by a substrate carrying robot (not shown), and the substrate 1 is carried out of the chuck 10 by a substrate carrying robot (not shown). The chuck 10 supports the back surface of the substrate 1 by vacuum suction. A photoresist is applied to the surface of the substrate 1.

  A gate 11 is provided across the base 3 above the exposure position where the substrate 1 is exposed. A plurality of light beam irradiation devices 20 are mounted on the gate 11. Although the present embodiment shows an example of an exposure apparatus using eight light beam irradiation apparatuses 20, the number of light beam irradiation apparatuses is not limited to this, and the present invention is one or two or more. The present invention is applied to an exposure apparatus using a light beam irradiation apparatus.

  FIG. 4 is a diagram showing a schematic configuration of the light beam irradiation apparatus. The light beam irradiation device 20 includes an optical fiber 22, a lens 23, a mirror 24, a DMD (Digital Micromirror Device) 25, a projection lens 26, and a DMD driving circuit 27. The optical fiber 22 introduces an ultraviolet light beam generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is irradiated to the DMD 25 through the lens 23 and the mirror 24. The DMD 25 is a spatial light modulator configured by arranging a plurality of minute mirrors that reflect a light beam in two directions, and modulates the light beam by changing the angle of each mirror. The light beam modulated by the DMD 25 is irradiated from the head unit 20 a including the projection lens 26. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main controller 70.

  2 and 3, the chuck 10 is mounted on the θ stage 8, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves in the X direction along the X guide 4. The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves in the Y direction along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The X stage 5, Y stage 7, and θ stage 8 are provided with drive mechanisms (not shown) such as ball screws and motors, linear motors, etc., and each drive mechanism is driven by a stage drive circuit 60 of FIG. The

  By rotation of the θ stage 8 in the θ direction, the substrate 1 mounted on the chuck 10 is rotated so that two orthogonal sides are directed in the X direction and the Y direction. As the X stage 5 moves in the X direction, the chuck 10 is moved between the delivery position and the exposure position. When the X stage 5 moves in the X direction at the exposure position, the light beam irradiated from the head unit 20a of each light beam irradiation apparatus 20 scans the substrate 1 in the X direction. In addition, as the Y stage 7 moves in the Y direction, the scanning region of the substrate 1 by the light beam emitted from the head unit 20a of each light beam irradiation device 20 is moved in the Y direction. In FIG. 1, the main controller 70 controls the stage drive circuit 60 to rotate the θ stage 8 in the θ direction, move the X stage 5 in the X direction, and move the Y stage 7 in the Y direction. .

  In the present embodiment, the substrate 10 is scanned by the light beam from the light beam irradiation device 20 by moving the chuck 10 in the X direction by the X stage 5, but the light beam irradiation device 20 is moved. By doing so, the substrate 1 may be scanned by the light beam from the light beam irradiation device 20. In the present embodiment, the scanning region of the substrate 1 by the light beam from the light beam irradiation device 20 is changed by moving the chuck 10 in the Y direction by the Y stage 7, but the light beam irradiation device 20. , The scanning region of the substrate 1 by the light beam from the light beam irradiation device 20 may be changed.

  1 and 2, the base 3 is provided with a linear scale 31 extending in the X direction. The linear scale 31 is provided with a scale for detecting the amount of movement of the X stage 5 in the X direction. The X stage 5 is provided with a linear scale 33 extending in the Y direction. The linear scale 33 is provided with a scale for detecting the amount of movement of the Y stage 7 in the Y direction.

  1 and 3, an encoder 32 is attached to one side surface of the X stage 5 so as to face the linear scale 31. The encoder 32 detects the scale of the linear scale 31 and outputs a pulse signal to the main controller 70. 1 and 2, an encoder 34 is attached to one side surface of the Y stage 7 so as to face the linear scale 33. The encoder 34 detects the scale of the linear scale 33 and outputs a pulse signal to the main controller 70. Main controller 70 counts the pulse signal of encoder 32, detects the amount of movement of X stage 5 in the X direction, counts the pulse signal of encoder 34, and moves the amount of Y stage 7 in the Y direction. Is detected.

  FIG. 5 is a diagram for explaining the operation of the laser length measurement system. In FIG. 5, the gate 11 and the light beam irradiation device 20 shown in FIG. 1 are omitted. The laser length measurement system is a known laser interference type length measurement system, and includes a laser light source 41, laser interferometers 42 and 44, and bar mirrors 43 and 45. The bar mirror 43 is attached to one side surface of the chuck 10 that extends in the Y direction. The bar mirror 45 is attached to one side surface of the chuck 10 extending in the X direction.

  The laser interferometer 42 irradiates the laser beam from the laser light source 41 onto the bar mirror 43, receives the laser beam reflected by the bar mirror 43, and the laser beam reflected from the laser beam source 41 and the laser beam reflected by the bar mirror 43. Measure interference. This measurement is performed at two locations in the Y direction. The laser length measurement system control device 40 detects the position and rotation of the chuck 10 in the X direction from the measurement result of the laser interferometer 42 under the control of the main control device 70.

  On the other hand, the laser interferometer 44 irradiates the laser beam from the laser light source 41 to the bar mirror 45, receives the laser beam reflected by the bar mirror 45, and the laser beam reflected from the laser source 41 and the bar mirror 45. Measure interference with light. The laser length measurement system control device 40 detects the position of the chuck 10 in the Y direction from the measurement result of the laser interferometer 44 under the control of the main control device 70.

  In FIG. 4, the main controller 70 has a drawing controller that supplies drawing data to the DMD drive circuit 27 of the light beam irradiation device 20. FIG. 6 is a diagram illustrating a schematic configuration of the drawing control unit. The drawing control unit 71 includes memories 72 and 76, a bandwidth setting unit 73, a center point coordinate determination unit 74, a coordinate determination unit 75, and a drawing data creation unit 77.

  The memory 76 stores a design value map. In the design value map, drawing data is indicated by XY coordinates. The drawing data creation unit 77 creates drawing data to be supplied to the DMD drive circuit 27 of each light beam irradiation apparatus 20 from the design value map stored in the memory 76. The memory 72 stores the drawing data created by the drawing data creation unit 77 using the XY coordinates as addresses.

  The bandwidth setting unit 73 sets the Y-direction bandwidth of the light beam emitted from the head unit 20 a of the light beam irradiation device 20 by determining the range of the Y coordinate of the drawing data read from the memory 72.

  The laser length measurement system control device 40 detects the position of the chuck 10 in the X and Y directions before the exposure of the substrate 1 at the exposure position is started. The center point coordinate determination unit 74 determines the XY coordinates of the center point of the chuck 10 before starting the exposure of the substrate 1 from the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40. In FIG. 1, when scanning the substrate 1 with the light beam from the light beam irradiation device 20, the main control device 70 controls the stage drive circuit 60 to move the chuck 10 in the X direction by the X stage 5. When moving the scanning area of the substrate 1, the main controller 70 controls the stage drive circuit 60 to move the chuck 10 in the Y direction by the Y stage 7. In FIG. 6, the center point coordinate determination unit 74 counts the pulse signals from the encoders 32 and 34, detects the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction, The XY coordinates of the center point of the chuck 10 are determined.

  The coordinate determination unit 75 determines the XY coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 based on the XY coordinates of the center point of the chuck 10 determined by the center point coordinate determination unit 74. The memory 72 inputs the XY coordinates determined by the coordinate determination unit 75 as an address, and outputs the drawing data stored at the input XY coordinate address to the DMD drive circuit 27 of each light beam irradiation apparatus 20.

  FIG. 7 is a view showing an exposure pattern analysis apparatus of the exposure apparatus according to an embodiment of the present invention. 8 to 12 are diagrams for explaining the operation of the exposure pattern analysis apparatus shown in FIG. In FIG. 7, an exposure pattern analysis apparatus 80 according to the present embodiment includes a correction circuit 81, a light amount data memory 82, a readout circuit 84, an exposure counter 85, an exposure count memory 86, an arithmetic circuit 87, an exposure amount determination circuit 88, and a mask. A circuit 89 is included.

  The light amount data memory 82 stores in advance the light amount of the light beam emitted from the light beam irradiation device 20 for each exposure area having a predetermined area. FIG. 8 schematically shows the light amount of the light beam stored in the light amount data memory 82 in correspondence with each exposure area 2a having a predetermined area, and “1” and “2” in the figure. The number indicates the amount of light beam. In FIG. 7, the light amount data memory 82 is irradiated with a light beam based on the position in the XY direction of the chuck 10 detected by the laser length measurement controller 40 input to the correction circuit 81 and the pulse signals from the encoders 32 and 34. The light quantity of the light beam memorize | stored about the exposure area | region irradiated with the light beam from the apparatus 20 is output.

  The read circuit 84 reads the drawing data supplied from the drawing control unit 71 of the main control device 70 to the DMD driving circuit 27 of the light beam irradiation device 20 and outputs the drawing data to the exposure counter 85. FIG. 9 schematically shows drawing data supplied from the drawing control unit 71 to the DMD drive circuit 27 of the light beam irradiation apparatus 20 in correspondence with each exposure region 2a having a predetermined area. The portion shown in gray indicates the pattern 2 drawn by the light beam.

  In FIG. 7, the exposure counter 85 is supplied to the DMD drive circuit 27 of the light beam irradiation device 20 based on the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40 and the pulse signals from the encoders 32 and 34. From the supplied drawing data, the number of light beam irradiations is counted for each exposure area having a predetermined area. FIG. 10 schematically shows the number of times of irradiation of the light beam counted by the exposure counter 85 in correspondence with each exposure region 2a having a predetermined area, and “6”, “7”, and The number “8” indicates the number of times of light beam irradiation. In FIG. 7, the exposure count memory 86 stores the number of light beam irradiations counted by the exposure counter 85 for each exposure area of a predetermined area.

  The arithmetic circuit 87 multiplies the light amount of the light beam output from the light amount data memory 82 by the number of times of irradiation of the light beam stored in the exposure count memory 86 to calculate the exposure amount for each exposure area of a predetermined area. To do. Based on the exposure amount calculated by the arithmetic circuit 87, the exposure amount determination circuit 88 determines whether or not the exposure amount has reached a predetermined value for each exposure region having a predetermined area. FIG. 11 schematically shows the determination result of the exposure amount determination circuit 88 corresponding to each exposure region 2a having a predetermined area. In this example, the light amount of the light beam (FIG. 8) and the light beam are shown. In the exposure region in which the exposure amount obtained by multiplying the number of times of irradiation (FIG. 10) is less than the predetermined value 10, a sign “1” indicating that the exposure amount has not reached the predetermined value is given.

  In FIG. 7, the drawing control unit 71 supplies correction drawing data to the DMD driving circuit 27 of the light beam irradiation apparatus 20. The correction drawing data is exactly the same as normal drawing data. The mask circuit 89 has coordinates other than the coordinates of the exposure area determined by the exposure amount determination circuit 88 that the exposure amount has not reached the predetermined value among the correction drawing data supplied to the DMD drive circuit 27 of the light beam irradiation apparatus 20. Mask the coordinate data. The DMD drive circuit 27 of the light beam irradiation device 20 drives the DMD 25 based on the correction drawing data supplied via the mask circuit 89 to irradiate the substrate 1 with the correction light beam. FIG. 12 schematically shows the drawing data masked by the mask circuit 89 in correspondence with each exposure area 2a having a predetermined area, and the portion shown in gray in the figure shows the exposure amount corrected. Region 2 ′ to be used is shown.

  The position of the chuck 10 is detected, drawing data is supplied to the DMD driving circuit 27 of the light beam irradiation device 20, and the light beam is calculated from the position of the chuck 10 and the drawing data supplied to the DMD driving circuit 27 of the light beam irradiation device 20. Since the number of times of irradiation is counted for each exposure region having a predetermined area, even if the moving speed of the chuck 10 fluctuates, the number of times the light beam is irradiated is detected for each exposure region having a predetermined area. Since the exposure amount is calculated for each exposure area of a predetermined area from the light amount of the light beam stored in advance and the number of times of irradiation of the light beam, the actual exposure amount can be obtained even if the amount of light beam varies. It is detected for each exposure area of a predetermined area. Therefore, by correcting the exposure amount based on the calculated exposure amount, the exposure amount becomes uniform and pattern drawing is performed with high accuracy.

  Further, based on the calculated exposure amount, whether or not the exposure amount has reached a predetermined value is determined for each exposure region having a predetermined area, and correction drawing data to be supplied to the DMD drive circuit 27 of the light beam irradiation apparatus 20. Among them, the exposure amount is corrected by masking the data of the coordinates other than the coordinates of the exposure region determined that the exposure amount has not reached the predetermined value, so that normal drawing data is used as it is as drawing data for correction. be able to. Accordingly, the exposure amount is corrected by a simple process using normal drawing data as correction drawing data.

  FIG. 13 is a view showing an exposure pattern analysis apparatus of an exposure apparatus according to another embodiment of the present invention. 14 to 15 are diagrams for explaining the operation of the exposure pattern analysis apparatus shown in FIG. In FIG. 13, an exposure pattern analysis apparatus 90 according to the present embodiment includes a correction circuit 91, a light amount correction data memory 92, a mask circuit 93, a readout circuit 94, a coordinate information history memory 95, a pattern history memory 96, and a pattern analysis circuit 97. It is comprised including.

  The light amount correction data memory 92 stores correction data for correcting the exposure amount for each exposure region having a predetermined area in advance. FIG. 14 schematically shows the correction data stored in the light quantity correction data memory 92 in correspondence with each exposure area 2a having a predetermined area. Reference numeral “1” in the figure indicates the exposure amount. This indicates that correction is necessary. In FIG. 13, the light quantity correction data memory 92 is based on the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40 input to the correction circuit 91 and the pulse signals from the encoders 32 and 34. The correction data stored for the exposure region irradiated with the light beam from the irradiation device 20 is output.

  The drawing controller 71 supplies correction drawing data to the DMD driving circuit 27 of the light beam irradiation apparatus 20. The correction drawing data is exactly the same as normal drawing data. The mask circuit 93 masks data of coordinates other than the coordinates of the correction data output from the light amount correction data memory 92 among the correction drawing data supplied to the DMD drive circuit 27 of the light beam irradiation device 20. The DMD drive circuit 27 of the light beam irradiation device 20 drives the DMD 25 based on the correction drawing data supplied via the mask circuit 93 to irradiate the substrate 1 with the correction light beam.

  Correction data for correcting the exposure amount is stored in advance, and among the correction drawing data to be supplied to the DMD drive circuit 27 of the light beam irradiation device 20, data of coordinates other than the coordinates of the correction data are masked, Since the exposure amount is corrected, normal drawing data can be used as correction drawing data as it is. Accordingly, the exposure amount is corrected by a simple process using normal drawing data as correction drawing data.

  The coordinate information history memory 95 stores information on the position of the chuck 10 in the X and Y directions detected by the laser length measurement system control device 40 and pulse signals from the encoders 32 and 34. The read circuit 94 reads normal drawing data supplied from the drawing control unit 71 to the DMD driving circuit 27 and correction drawing data supplied from the drawing control unit 71 to the DMD driving circuit 27 via the mask circuit 93. The pattern history memory 96 stores the drawing data. The pattern analysis circuit 97 includes information on the position of the chuck 10 in the X and Y directions detected by the laser measurement system control device 40 stored in the coordinate information history memory 95, pulse signals from the encoders 32 and 34, and a pattern history memory 96. The shape of the pattern drawn on the substrate 1 is reproduced by the light beam from the light beam irradiation device 20 from the drawing data stored in the above.

  FIGS. 15A to 15D schematically show drawing data stored in the pattern history memory 96 in correspondence with each exposure region 2a having a predetermined area, and are shown in gray in the drawing. The area shown is the area exposed by the light beam from the light beam irradiation device 20. Since the drawing with the light beam from the light beam irradiation device 20 is performed on the region through which the light beam reflected by each mirror of the DMD 25 passes, the region to be exposed is shown in FIGS. Appears as shown. FIG. 15E schematically shows a pattern reproduced from the drawing data shown in FIGS. 15A to 15D in correspondence with each exposure region 2a having a predetermined area. The portion shown in gray indicates the reproduced pattern 2.

  In FIG. 13, the pattern analysis circuit 97 analyzes the shape of the reproduced pattern, and scans the substrate 1 with the light amount of the light beam generated from the laser light source unit 21 and the light beam from the light beam irradiation device 20. The exposure conditions such as the moving speed of the X stage 5 and the amount of movement of the Y stage 7 when changing the scanning region of the substrate 1 by the light beam from the light beam irradiation device 20 are determined. To instruct.

  The position of the chuck 10 is detected, drawing data is supplied to the DMD drive circuit 27 of the light beam irradiation device 20, the position information of the chuck 10 is stored in the coordinate information history memory 95, and the DMD drive circuit of the light beam irradiation device 20 is stored. 27 is stored in the pattern history memory 96, the position information of the chuck 10 stored in the coordinate information history memory 95, and the drawing data stored in the pattern history memory 96. Since the shape of the pattern drawn on the substrate 1 is reproduced by the beam, it is possible to improve the exposure conditions by analyzing the shape of the reproduced pattern.

  Furthermore, in the present embodiment, the pattern analysis circuit 97 detects the position information in the XY direction of the chuck 10 detected by the laser length measurement system control device 40 stored in the coordinate information history memory 95 and the encoders 32 and 34. From the pulse signal and the drawing data stored in the pattern history memory 96, the number of light beam irradiations is integrated for each exposure area having a predetermined area, and the exposure amount is calculated for each exposure area having a predetermined area. From the position information of the chuck 10 stored in the coordinate information history memory 95 and the drawing data stored in the pattern history memory 96, the number of times of irradiation of the light beam is integrated for each exposure area of a predetermined area, and exposure of a predetermined area is performed. Since the exposure amount is calculated for each region, the exposure amount can be controlled by analyzing the exposure amount of the reproduced pattern.

  16 to 19 are diagrams for explaining scanning of the substrate by the light beam. FIGS. 16 to 19 show an example in which the entire substrate 1 is scanned by scanning the substrate 1 in the X direction four times with eight light beams from the eight light beam irradiation apparatuses 20. 16-19, the head part 20a of each light beam irradiation apparatus 20 is shown with the broken line. The light beam emitted from the head unit 20a of each light beam irradiation device 20 has a bandwidth W in the Y direction, and the substrate 1 is scanned in the direction indicated by the arrow by the movement of the X stage 5 in the X direction.

  FIG. 16 shows the first scan, and the pattern is drawn in the scan area shown in gray in FIG. 16 by the first scan in the X direction. When the first scanning is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 17 shows the second scan, and a pattern is drawn in the scan area shown in gray in FIG. 17 by the second scan in the X direction. When the second scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 18 shows the third scan, and the pattern is drawn in the scan area shown in gray in FIG. 18 by the third scan in the X direction. When the third scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 19 shows the fourth scan. With the fourth scan in the X direction, a pattern is drawn in the scan area shown in gray in FIG. 19, and the scan of the entire substrate 1 is completed.

  By scanning the substrate 1 in parallel with a plurality of light beams from the plurality of light beam irradiation apparatuses 20, the time required for scanning the entire substrate 1 can be shortened, and the tact time can be shortened.

  16 to 19 show an example in which the substrate 1 is scanned four times by scanning the substrate 1 in the X direction. However, the number of scans is not limited to this, and the substrate 1 is scanned in the X direction. May be performed 3 times or less or 5 times or more to scan the entire substrate 1.

  According to the embodiment shown in FIGS. 7 to 12, the light amount of the light beam emitted from the light beam irradiation device 20 is stored in advance for each exposure area of a predetermined area, and the position of the chuck 10 is detected. Then, drawing data is supplied to the DMD driving circuit 27 of the light beam irradiation apparatus 20, and the number of times of irradiation of the light beam is determined to be a predetermined area from the position of the chuck 10 and the drawing data supplied to the DMD driving circuit 27 of the light beam irradiation apparatus 20. The exposure amount is calculated for each exposure region of a predetermined area from the light amount of the light beam stored in advance and the number of times of irradiation of the light beam, and the exposure amount is corrected based on the calculated exposure amount. Thus, the exposure can be made uniform and the pattern can be drawn with high accuracy.

  Furthermore, according to the embodiment shown in FIGS. 7 to 12, it is determined for each exposure area having a predetermined area whether or not the exposure amount has reached a predetermined value based on the calculated exposure amount, and the light beam irradiation is performed. The drawing data for correction is supplied to the DMD driving circuit 27 of the apparatus 20, and it is determined that the exposure amount has not reached the predetermined value among the drawing data for correction supplied to the DMD driving circuit 27 of the light beam irradiation apparatus 20. By masking the data of coordinates other than the coordinates of the exposure area and correcting the exposure amount, it is possible to correct the exposure amount with a simple process using normal drawing data as the drawing data for correction. .

  Further, according to the embodiment shown in FIGS. 13 to 15, the position of the chuck 10 is detected, drawing data is supplied to the DMD drive circuit 27 of the light beam irradiation device 20, and the position information of the chuck 10 is coordinated. The drawing data stored in the information history memory 95 and supplied to the drive circuit of the light beam irradiation device is stored in the pattern history memory 96, the position information of the chuck 10 stored in the coordinate information history memory 95, and the pattern history memory 96. By reproducing the shape of the pattern drawn on the substrate 1 by the light beam from the light beam irradiation device 20 from the stored drawing data, it is possible to analyze the reproduced shape of the pattern and improve the exposure conditions. Become.

  Furthermore, according to the embodiment shown in FIGS. 13 to 15, the number of irradiation times of the light beam is calculated from the position information of the chuck 10 stored in the coordinate information history memory 95 and the drawing data stored in the pattern history memory 96. By calculating the exposure amount for each exposure region having a predetermined area and calculating the exposure amount for each exposure region having a predetermined area, the exposure amount of the reproduced pattern can be analyzed and the exposure amount can be controlled.

  By exposing the substrate using the exposure apparatus or exposure method of the present invention, the exposure can be made uniform and the pattern can be drawn with high accuracy, so that a high-quality display panel substrate can be manufactured. .

  For example, FIG. 20 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photoresist is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), a pattern is formed on the photoresist film using an exposure apparatus. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 21 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 20, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 21, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the exposure apparatus or the exposure method of the present invention can be applied.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Pattern 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 10 Chuck 11 Gate 20 Light beam irradiation device 20a Head unit 21 Laser light source unit 22 Optical fiber 23 Lens 24 Mirror 25 DMD (Digital Micromirror Device)
26 Projection lens 27 DMD drive circuit 31, 33 Linear scale 32, 34 Encoder 40 Laser measurement system controller 41 Laser light source 42, 44 Laser interferometer 43, 45 Bar mirror 60 Stage drive circuit 70 Main controller 71 Drawing controller 72, 76 Memory 73 Bandwidth setting unit 74 Center point coordinate determination unit 75 Coordinate determination unit 77 Drawing data creation unit 80 Exposure pattern analyzer 81 Correction circuit 82 Light amount data memory 84 Read circuit 85 Exposure counter 86 Exposure count memory 87 Calculation circuit 88 Exposure amount Determination circuit 89 Mask circuit 90 Exposure pattern analysis device 91 Correction circuit 92 Light quantity correction data memory 93 Mask circuit 94 Read circuit 95 Coordinate information history memory 96 Pattern history memory 97 Pattern analysis circuit

Claims (10)

A chuck for supporting a substrate coated with a photoresist;
Light beam irradiation having a spatial light modulator for modulating a light beam, a driving circuit for driving the spatial light modulator based on drawing data, and an irradiation optical system for irradiating the light beam modulated by the spatial light modulator Equipment,
A moving means for relatively moving the chuck and the light beam irradiation device;
An exposure apparatus that relatively moves the chuck and the light beam irradiation device by the moving means, scans the substrate with the light beam from the light beam irradiation device, and draws a pattern on the substrate,
Detecting means for detecting a relative position between the chuck and the light beam irradiation device;
Drawing control means for supplying drawing data to a drive circuit of the light beam irradiation device;
An analysis device for analyzing a pattern drawn on a substrate by a light beam from the light beam irradiation device;
The analysis device includes:
A memory that stores in advance the amount of light beam emitted from the light beam irradiation device for each exposure area of a predetermined area;
The number of times of irradiation of the light beam is predetermined from the relative position of the chuck and the light beam irradiation device detected by the detection means, and the drawing data supplied from the drawing control means to the drive circuit of the light beam irradiation device. A counter that counts for each exposure area of
An arithmetic circuit that calculates an exposure amount for each exposure area of a predetermined area from the light amount of the light beam stored in the memory and the number of irradiation times of the light beam counted by the counter;
An exposure apparatus comprising: correction means for correcting the exposure amount based on the exposure amount calculated by the arithmetic circuit. The drawing control means supplies correction drawing data to the drive circuit of the light beam irradiation device,
The correction means includes
A determination circuit for determining, for each exposure region having a predetermined area, whether or not the exposure amount has reached a predetermined value based on the exposure amount calculated by the arithmetic circuit;
Of correction drawing data supplied from the drawing control means to the drive circuit of the light beam irradiation apparatus, data of coordinates other than the coordinates of the exposure area determined by the determination circuit that the exposure amount has not reached a predetermined value The exposure apparatus according to claim 1, further comprising a mask circuit that masks the mask. Support the substrate coated with photoresist with a chuck,
A chuck, a spatial light modulator that modulates the light beam, a drive circuit that drives the spatial light modulator based on drawing data, and an irradiation optical system that irradiates the light beam modulated by the spatial light modulator Move relatively with the light beam irradiation device,
An exposure method for drawing a pattern on a substrate by scanning the substrate with a light beam from a light beam irradiation device,
In advance, the amount of light beam emitted from the light beam irradiation device is stored for each exposure area of a predetermined area,
Detect the relative position of the chuck and the light beam irradiation device,
Supply drawing data to the drive circuit of the light beam irradiation device,
From the relative position between the chuck and the light beam irradiation device and the drawing data supplied to the drive circuit of the light beam irradiation device, the number of light beam irradiations is counted for each exposure area of a predetermined area,
From the amount of light beam stored in advance and the number of irradiation times of the light beam, the exposure amount is calculated for each exposure area of a predetermined area,
An exposure method comprising correcting an exposure amount based on the calculated exposure amount. Based on the calculated exposure amount, determine whether the exposure amount has reached a predetermined value for each exposure area of a predetermined area,
Supply the drawing data for correction to the drive circuit of the light beam irradiation device,
Of the drawing data for correction supplied to the drive circuit of the light beam irradiation apparatus, the exposure amount is corrected by masking the data of the coordinates other than the coordinates of the exposure region determined that the exposure amount has not reached the predetermined value. The exposure method according to claim 3.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to claim 1.   A method for producing a display panel substrate, wherein the substrate is exposed using the exposure method according to claim 3. A chuck for supporting a substrate coated with a photoresist;
Light beam irradiation having a spatial light modulator for modulating a light beam, a driving circuit for driving the spatial light modulator based on drawing data, and an irradiation optical system for irradiating the light beam modulated by the spatial light modulator Equipment,
A moving means for relatively moving the chuck and the light beam irradiation device;
An exposure apparatus that relatively moves the chuck and the light beam irradiation device by the moving means, scans the substrate with the light beam from the light beam irradiation device, and draws a pattern on the substrate,
Detecting means for detecting a relative position between the chuck and the light beam irradiation device;
Drawing control means for supplying drawing data to a drive circuit of the light beam irradiation device;
An analysis device for analyzing a pattern drawn on a substrate by a light beam from the light beam irradiation device;
The analysis device includes:
A first memory for storing information on a relative position between the chuck and the light beam irradiation device detected by the detection means;
A second memory for storing drawing data supplied from the drawing control means to the drive circuit of the light beam irradiation device;
From the information on the relative position between the chuck and the light beam irradiation device stored in the first memory and the drawing data stored in the second memory, the light beam from the light beam irradiation device is used. An exposure apparatus comprising: a processing apparatus that reproduces a shape of a pattern drawn on a substrate.   The processing device uses the information on the relative position between the chuck and the light beam irradiation device stored in the first memory, and the drawing data stored in the second memory to determine the number of times the light beam is irradiated. The exposure apparatus according to claim 7, wherein the exposure amount is calculated for each exposure area having a predetermined area by integrating the values for each exposure area having a predetermined area. Support the substrate coated with photoresist with a chuck,
A chuck, a spatial light modulator that modulates the light beam, a drive circuit that drives the spatial light modulator based on drawing data, and an irradiation optical system that irradiates the light beam modulated by the spatial light modulator Move relatively with the light beam irradiation device,
An exposure method for drawing a pattern on a substrate by scanning the substrate with a light beam from a light beam irradiation device,
Detect the relative position of the chuck and the light beam irradiation device,
Supply drawing data to the drive circuit of the light beam irradiation device,
Information on the relative position between the chuck and the light beam irradiation device is stored in the first memory;
The drawing data supplied to the drive circuit of the light beam irradiation device is stored in the second memory,
Based on the information on the relative position between the chuck and the light beam irradiation device stored in the first memory and the drawing data stored in the second memory, the pattern drawn on the substrate by the light beam from the light beam irradiation device. An exposure method characterized by reproducing a shape.   From the information on the relative position between the chuck and the light beam irradiation device stored in the first memory and the drawing data stored in the second memory, the number of times of irradiation with the light beam is integrated for each exposure area of a predetermined area. The exposure method according to claim 9, wherein the exposure amount is calculated for each exposure area having a predetermined area.

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