KR20170106918A - Auxiliary exposure device - Google Patents

Abstract

The present invention aims to provide an auxiliary exposure device capable of increasing exposure resolution. The auxiliary exposure device according to an embodiment is disposed on a front end side or a rear end side of the exposure device performing exposure processing for a substrate to be processed, and performs local exposure processing on the substrate to be processed, comprises a return part and a light source unit. The return part returns the substrate to be processed in the scanning direction. The light source unit irradiates line-shaped light having a longitudinal direction intersecting the scanning direction with respect to the substrate to be processed and returned in the scanning direction. In addition, the light source unit includes a digital micromirror device in which a plurality of movable micromirrors are arranged.

Description

AUXILIARY EXPOSURE DEVICE

The disclosed embodiment relates to a secondary exposure apparatus.

2. Description of the Related Art Conventionally, there is known a secondary exposure apparatus that performs local exposure processing separately from a conventional exposure apparatus that transfers a pattern of a mask to a resist film applied on a substrate to be processed. With this auxiliary exposure apparatus, it is possible to improve the uniformity of the film thickness and the line width of the resist pattern after the development processing in the optical lithography.

For example, Patent Document 1 discloses an auxiliary exposure apparatus having a light source unit in which a plurality of LED (Light Emitting Diode) elements are arranged in a line shape.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-186191

However, the exposure resolution in the case of using an LED element is limited by the size (for example, about 5 mm) of the LED element main body. For this reason, there is a room for further improvement in that the above-described conventional technique is improved in exposure resolution.

It is an object of one embodiment of the present invention to provide an auxiliary exposure apparatus capable of increasing the exposure resolution.

A secondary exposure apparatus according to an embodiment of the present invention is a secondary exposure apparatus that is disposed on the front end side or the rear end side of an exposure apparatus that performs exposure processing on a substrate to be processed and performs local exposure processing on the substrate to be processed, A transport section, and a light source unit. The carry section conveys the substrate to be processed in the scanning direction. The light source unit irradiates, on the substrate to be processed, which is transported in the scanning direction, a line-shaped light whose longitudinal direction is a direction intersecting the scanning direction. Further, the light source unit includes a digital micromirror device in which a plurality of movable micromirrors are arranged.

According to an aspect of the embodiment, it is possible to enhance the exposure resolution.

1 is a diagram showing a configuration of a substrate processing system according to an embodiment.
Fig. 2 is a flowchart showing the main definition processing procedure for one glass substrate in the substrate processing system.
3A is a diagram showing a format for partitioning a product area on a glass substrate into a matrix form in the embodiment.
FIG. 3B is a diagram showing a structure for calculating and mapping the measured values of the film thickness and the line width of the resist pattern for each unit area of the matrix section on the glass substrate.
3C is a diagram showing a structure for calculating and mapping the correction exposure dose for each unit area of the matrix partition on the glass substrate.
FIG. 3D is a diagram showing a structure for calculating and mapping a target value of roughness for each unit area of a matrix partition on a glass substrate.
4 is a diagram showing a configuration of a secondary exposure apparatus according to the embodiment.
5 is a diagram showing an irradiation area of ultraviolet rays irradiated from a light source unit.
6 is a diagram showing a configuration of the light source unit.

Hereinafter, with reference to the accompanying drawings, embodiments of the auxiliary exposure apparatus disclosed by the present application will be described in detail. On the other hand, the present invention is not limited to the embodiments described below.

[Configuration of substrate processing system]

The substrate processing system 100 shown in Fig. 1 is provided in a clean room and uses a glass substrate G for an LCD (Liquid Crystal Display) as a substrate to be processed. In the LCD manufacturing process, , Resist application, pre-baking, development and post-baking. Exposure processing is performed by an external exposure apparatus 20 (EXP) provided adjacent to the substrate processing system 100. [

The substrate processing system 100 includes a cassette station 1, a carry-in unit 2 (IN PASS), a cleaning apparatus 3 (SCR), a first drying unit 4 (DR) The cooling unit 5 COL, the coating unit 6 (COT), the second drying unit 7 (DR), the prebak unit 8 (PRE BAKE), the second cooling unit 9 (COL), and an interface station (10). The substrate processing system 100 further includes the auxiliary exposure apparatus 11 (AE), the developing apparatus 12 (DEV), the post-baking unit 13 (POST BAKE), the third cooling unit 14 (COL), an inspection unit 15 (IP), a carry-out unit 16 (OUT PASS), and a control unit 17.

Between the cassette station 1 and the interface station 10 is formed a conveying path for conveying the glass substrate G from the cassette station 1 to the interface station 10. On this conveying path, The first drying section 4, the first cooling section 5, the application device 6, the second drying section 7, the prebake section 8 and the second drying section 7, 2 cooling units 9 are installed in this order from the cassette station 1 toward the interface station 10. [

A conveyor return path for conveying the glass substrate G from the interface station 10 to the cassette station 1 is formed between the cassette station 1 and the interface station 10, The auxiliary exposure apparatus 11, the developing apparatus 12, the post-baking unit 13, the third cooling unit 14, the inspection unit 15 and the carry-out unit 16 are connected to the interface station 10 via the cassette station 1 In this order. On the other hand, the conveying path and the conveying path are constituted by, for example, a roller conveying path or the like.

The cassette station 1 is a port for loading and unloading a plurality of cassettes C accommodating a plurality of glass substrates G in a stacked manner. The cassette station 1 includes a cassette stage 1a in which four cassettes C can be placed side by side in a horizontal direction (Y axis direction), and a cassette C on which cassettes C on a cassette stage 1a are loaded and unloaded And a transfer device 1b. The transfer device 1b has a transfer arm for holding the glass substrate G and is capable of operating in four axes of X, Y, Z and θ and is provided with a cassette stage 1a adjacent to the cassette stage 1a, So that the glass substrate G can be transferred between itself and the substrate 16.

The interface station 10 includes a transport apparatus 10a. The transfer apparatus 10a has a transfer arm for holding the glass substrate G and is capable of operating in four axes of X, Y, Z and theta. The second cooling section 9, the auxiliary exposure apparatus 11 ) And the exposure apparatus 20, as shown in Fig. On the other hand, in addition to the transport apparatus 10a, an apparatus such as an edge exposure apparatus or a titler may be disposed in the interface station 10. [ The peripheral exposure apparatus performs exposure processing for removing a resist attached to the peripheral portion of the glass substrate G at the time of development. The titleer records predetermined information on a predetermined area on the glass substrate (G).

The control unit 17 is a CPU (Central Processing Unit), for example, and reads and executes a program (not shown) stored in a storage unit (not shown) to control the entire substrate processing system 100. The control unit 17 may be constituted by hardware alone without using a program.

Fig. 2 is a flowchart showing the main definition processing procedure for one glass substrate G in the substrate processing system 100. Fig. First, in the cassette station 1, the transfer device 1b takes out the glass substrate G from any one of the cassettes C on the cassette stage 1a and transfers the taken-out glass substrate G to the carry- (Step S101).

The glass substrate G carried in the carrying-in unit 2 is carried on the conveying path and carried into the cleaning apparatus 3 to perform a cleaning process (step S102). Here, the cleaning device 3 removes particulate dirt from the substrate surface by performing brushing cleaning or blow cleaning on the glass substrate G moving horizontally on the conveying path surface, and thereafter rinsing is performed do. When the series of cleaning processes in the cleaning apparatus 3 is completed, the glass substrate G is carried into the first drying section 4. [

Subsequently, the glass substrate G is brought into the first cooling unit 5 and cooled to a predetermined temperature after the predetermined drying process is performed in the first drying unit 4 (step S103) S104). Thereafter, the glass substrate G is carried into the coating device 6. [

In the coating device 6, the glass substrate G is coated with a resist solution on the upper surface (the surface to be treated) of the substrate by a spinless method using, for example, a slit nozzle (step S105). Thereafter, the glass substrate G is carried into the second drying section 7 and subjected to drying treatment at room temperature by, for example, decompression (step S106).

The glass substrate G taken out from the second drying section 7 is carried into the prebake section 8 and heated at a predetermined temperature in the prebake section 8 (step S107). By this treatment, the solvent remaining in the resist film on the glass substrate G is evaporated and removed, and the adhesion of the resist film to the glass substrate G is enhanced.

Subsequently, the glass substrate G is carried into the second cooling section 9 and cooled to a predetermined temperature in the second cooling section 9 (step S108). Thereafter, the glass substrate G is brought into the exposure apparatus 20 by the transfer apparatus 10a of the interface station 10. On the other hand, the glass substrate G may be brought into the peripheral exposure apparatus (not shown) before being brought into the exposure apparatus 20. [

In the exposure apparatus 20, a predetermined circuit pattern is exposed in the resist on the glass substrate G (step S109). The glass substrate G having finished the pattern exposure is taken out of the exposure apparatus 20 by the transport apparatus 10a of the interface station 10 and is carried into the auxiliary exposure apparatus 11. [ On the other hand, the glass substrate G may be carried into a titler not shown before being brought into the auxiliary exposure apparatus 11.

In the auxiliary exposure apparatus 11, a special auxiliary exposure process as described below is performed on the glass substrate G after the exposure process to improve the uniformity of the film thickness and line width of the resist pattern obtained after the development process S110). The glass substrate G having undergone the auxiliary exposure processing is brought into the developing apparatus 12, and a series of development processing of developing, rinsing and drying is carried out in the developing apparatus 12 (step S111).

The developed glass substrate G is carried into the post-baking section 13, and post-baking section 13 performs post-development annealing (step S112). As a result, the developer or the cleaning liquid remaining on the resist film of the glass substrate G is evaporated and removed, and the adhesion of the resist pattern to the substrate is enhanced. Thereafter, the glass substrate G is carried into the third cooling section 14 and cooled to a predetermined temperature in the third cooling section 14 (step S113).

Subsequently, the glass substrate G is brought into the inspection unit 15. [ In the inspection section 15, non-contact line width inspection, film quality, film thickness inspection, and the like are performed on the resist pattern on the glass substrate G (step S114). The inspection result in the inspection section 15 is output to the control section 17 and stored in a storage section not shown by the control section 17. [

The take-out unit 16 receives the inspected glass substrate G from the inspection unit 15 and passes it to the transfer device 1b of the cassette station 1. [ The transport apparatus 1b receives the processed glass substrate G received from the carry-out section 16 in the cassette C (step S115). Thus, the preliminary process of the substrate processing for one glass substrate G is completed.

The auxiliary exposure apparatus 11 performs local exposure processing on a portion of the glass substrate G after the exposure process where the film thickness or the line width is deviated from a desired film thickness or line width, Thereby improving uniformity of film thickness and line width. The operation of the auxiliary exposure apparatus 11 is controlled by the control unit 17.

The control unit 17 controls the operation of the auxiliary exposure apparatus 11 based on the inspection result acquired from the inspection unit 15. [ Here, an example of a method of generating control data of the auxiliary exposure apparatus 11 from the inspection result of the inspection unit 15 will be described with reference to Figs. 3A to 3D.

3A is a diagram showing a format for partitioning a product area on a glass substrate G into a matrix form in the embodiment. Fig. 3B is a diagram showing a structure for calculating and mapping the measured values of the film thickness and the line width of the resist pattern for each unit area of the matrix section on the glass substrate G. Fig. FIG. 3C is a diagram showing a structure for calculating and mapping the correction exposure dose for each unit area of the matrix section on the glass substrate G. FIG. FIG. 3D is a diagram showing a structure for calculating and mapping a target value of illuminance for each unit area of the matrix section on the glass substrate G. FIG.

The inspection unit 15 measures the film thickness and the line width of the resist pattern obtained on the post-baked glass substrate G at a representative point of several (for example, several tens) on the glass substrate G, for example. The control unit 17 controls the film thickness and line width of the resist pattern based on the measured value at the representative point on the glass substrate G acquired by the inspection unit 15, (Precisely an estimated value) in another position or area on the substrate G is calculated.

3A, the control unit 17 divides the product area PA on the glass substrate G into a matrix shape and sets the film thickness of the resist pattern for each unit area (i, j) of the matrix section (Or an estimated value obtained by the interpolation processing) Ai, j of the line width is mapped and mapped as shown in Fig. 3B on the table built in the memory. On the other hand, in the figure, in order to facilitate understanding, the matrix partition is represented by 9 columns (j = 1 to 9). Actually, both the number of rows and the number of columns in the matrix partition are at least several tens, and there are more than one hundred in a large-sized substrate for FPD.

Subsequently, the control unit 17 calculates the correction exposure amount Bi, j for each unit area (i, j) of the matrix section on the glass substrate G, Mapping. Here, the correction exposure amount Bi, j is an exposure amount for bringing the difference (error) between the measured value and the set value closer to zero with respect to the film thickness and line width of the resist pattern in each unit area (i, j).

Subsequently, the control unit 17 calculates the target value Ci, j of the illuminance for each unit area (i, j) of the matrix partition on the glass substrate G, As shown in FIG. Here, when the ultraviolet irradiation time per unit area (i, j) of the matrix section in the auxiliary exposure apparatus 11 is tS, Ci, j = Bi, j / tS.

[Configuration of auxiliary exposure apparatus]

Next, the configuration of the auxiliary exposure apparatus 11 according to the embodiment will be described with reference to Figs. 4 and 5. Fig. 4 is a diagram showing the configuration of the auxiliary exposure apparatus 11 according to the embodiment. 5 is a diagram showing an irradiation area of ultraviolet rays irradiated from the light source unit 32. Fig.

4, the auxiliary exposure apparatus 11 includes a flat conveying section 30 for conveying the glass substrate G in the scanning direction (X-axis direction), and a flat conveying section 30 And a light source unit 32 for irradiating light, specifically ultraviolet light (UV) of a predetermined wavelength, onto the resist on the glass substrate G conveyed by the light source unit (not shown). The auxiliary exposure apparatus 11 further includes an illuminance measurement unit 38 for measuring the illuminance of the light emitted by the light source unit 32, a control unit 17 for controlling each part in the apparatus, And a memory 42 for storing or storing various programs and data to be used.

The flat conveying section 30 includes a roller conveying path 46 in which a plurality of rollers 44 are laid in the conveying direction and a conveying path 46 for conveying the glass substrate G on the roller conveying path 46 44 via a transmission mechanism 48 having a belt, a gear, or the like. The roller conveying path 46 constitutes a part of the substrate processing system 100 shown in Fig. 1 as a part from the interface station 10 to the returning ears to the cassette station 1. Fig.

The flat conveying section 30 conveys the glass substrate G after the exposure processing into the auxiliary exposure apparatus 11 in a pseudo manner and transfers the glass substrate G to the auxiliary exposure apparatus 11 for the auxiliary exposure processing And the glass substrate G which has been conveyed in a purity and has been subjected to the auxiliary exposure process is taken out to the developing apparatus 12 in a pseudo manner. On the other hand, the control unit 17 is capable of detecting or grasping the current position of the glass substrate G through a position sensor (not shown) disposed on the roller transport path 46.

The light source unit 32 is disposed above the roller conveying path 46 and is supported by a support member (not shown). 5, the width of the light source unit 32 in the direction intersecting the scanning direction (Y-axis direction) is shorter than that of the glass substrate G, and the glass in the Y- And is disposed at the central portion of the substrate G (in other words, of the roller conveying path 46). The light source unit 32 irradiates the glass substrate G transported in the scanning direction (X-axis direction) with line-shaped light whose longitudinal direction is the direction intersecting the scanning direction (Y-axis direction) .

As shown in Fig. 4, the light source unit 32 according to the present embodiment includes a digital micromirror device (hereinafter referred to as a DMD) 325. Fig.

The DMD 325 is a spatial light modulator having a plurality of movable micromirrors (hereinafter referred to as mirrors). The mirror surface size of one mirror is, for example, 10 mu m and the DMD 325 is arranged in a matrix of several tens to several million of such mirrors.

Each mirror is displaceable between a warming angle at which light is reflected toward the glass substrate G and an angle at which the light is reflected toward a place other than the glass substrate G. [

The control unit 17 controls the operation of each mirror of the DMD 325 to adjust the time ratio of the ON angle and the OFF angle for each mirror so that for each unit area on the glass substrate G corresponding to each mirror, Thereby adjusting the illuminance of the light irradiated to the area.

More specifically, the control unit 17 determines whether the illuminance of each unit area (i, j) with respect to the unit area (i, j) on the glass substrate G passing through the light source unit 32 satisfies the target value Ci, j The ratio of the ON angle and the OFF angle is adjusted for each mirror. The control unit 17 performs the above-described processing for each column of unit areas aligned in the direction crossing the scanning direction in synchronization with the movement of the glass substrate G in the scanning direction by the roller conveying path 46, Auxiliary exposure processing is performed on the entire unit area of the glass substrate G. [

In this DMD 325, each of the small mirrors can be made to correspond to a unit area on the glass substrate G. [ In other words, by using the DMD 325, the size of the unit area set on the glass substrate G can be reduced according to the size of the mirror. Therefore, with the auxiliary exposure apparatus 11 according to the present embodiment, the exposure resolution can be enhanced as compared with the conventional auxiliary exposure apparatus which is restricted by the size (about 5 mm) of the LED element main body.

[Configuration of light source unit]

Next, an example of the configuration of the light source unit 32 including the above-described DMD 325 will be described with reference to Fig. Fig. 6 is a diagram showing the configuration of the light source unit 32. Fig. On the other hand, the configuration of the light source unit 32 is not limited to the configuration shown in Fig.

6, the light source unit 32 includes a light source 321, a first lens 322, a reflector 323, a second lens 324, a DMD 325, A lens 326, and a light trap 327.

The light source 321 emits ultraviolet rays (UV). As the light source 321, for example, an LED or a laser beam generator can be used. The first lens 322 is disposed on the optical path between the light source 321 and the DMD 325 and enlarges the light emitted from the light source 321. [ The reflecting mirror 323 is disposed on the optical path between the first lens 322 and the DMD 325 and reflects the light magnified by the first lens 322 toward the DMD 325. On the other hand, the angle of the reflecting mirror 323 is fixed.

The second lens 324 is disposed on the optical path between the reflecting mirror 323 and the DMD 325 and makes the distribution of the light reflected by the reflecting mirror 323 uniform. The DMD 325 has a plurality of rectangular mirrors M and drives the mirrors M under the control of the control unit 17 to adjust the illuminance of the light irradiated onto the glass substrate G for each unit area do.

The projection lens 326 is disposed on the optical path between the DMD 325 and the glass substrate G so that the light reflected toward the glass substrate G by the DMD 325 is guided to the glass substrate G And then projected. The light trap 327 is disposed on the optical path of the light reflected by the off-angle mirror M, and absorbs this light.

As described above, the auxiliary exposure apparatus 11 according to the embodiment includes a single light source unit 32 having a single light source 321. Therefore, as compared with the conventional auxiliary exposure apparatus using a plurality of LED elements as a light source, for example, complicated processing for adjusting the illuminance of each light source in consideration of overlapping of light beams irradiated from other light sources is not required.

On the other hand, the auxiliary exposure apparatus 11 may include a plurality of light source units 32. [ Even in such a case, the DMD 325 included in the light source unit 32 can reflect light in a rectangular shape by the rectangular mirror M, and therefore, for example, It is difficult for the light irradiated from the other light source unit 32 to overlap each other. Therefore, a troublesome process of adjusting the illuminance of each light source in consideration of the overlapping of the lights is unnecessary.

1, the auxiliary exposure apparatus 11 according to the present embodiment is disposed at the rear end side of the exposure apparatus 20 and at the front end of the developing apparatus 12. That is, even if the accuracy of the exposure process is high, there is a fear that deviation in film thickness or line width occurs when the accuracy of the developing process performed after that is low. Therefore, in order to properly correct the deviation of the film thickness or the line width, after all the steps before the developing process, that is, just before the developing device 12, like the auxiliary exposure apparatus 11 according to the present embodiment, 11 are preferably arranged. According to the substrate processing system 100 of the present embodiment, the film thickness and line width of the glass substrate G after the development process are inspected by the inspection unit 15, and the inspection result is fed back to the auxiliary exposure process immediately before the development process Whereby the film thickness and the line width can be appropriately corrected.

On the other hand, the arrangement of the auxiliary exposure apparatus 11 is not limited to the above-described example, and can be arranged at any position on the rear end side of the coating apparatus 6 and on the front end side of the developing apparatus 12.

[Illumination distribution adjustment processing]

However, when the reflected light of the DMD 325 is enlarged to the width of the glass substrate G, it is feared that the illuminance distribution becomes uneven. Concretely, among the line-shaped light emitted from the light source unit 32, the illuminance on the end side farther from the DMD 325 may be lowered compared to the illuminance of the central portion close to the DMD 325. Particularly, when the single light source unit 32 is used as in the auxiliary exposure apparatus 11 according to the present embodiment, unevenness of the illuminance distribution as described above tends to occur.

Thus, in the auxiliary exposure apparatus 11, the illuminance measurement unit 38 is provided, and the process of measuring the irradiation distribution of the line-shaped light emitted from the light source unit 32 using this illuminance measurement unit 38 is carried out in advance And the command value to the light source unit 32 in the auxiliary exposure processing may be determined by adding the result.

The illuminance measuring unit 38 includes an illuminance meter for measuring the illuminance of ultraviolet rays and a moving mechanism for moving the illuminometer in the irradiation line direction (Y axis direction) directly below the light source unit 32. [ The illuminometer has a photoelectric conversion element, for example, a photodiode near its top, and generates an electric signal (illuminance measurement signal) corresponding to the light intensity of ultraviolet light incident on the light receiving surface. The illuminance measurement signal outputted from the illuminance meter is sent to the control section 17 through, for example, an analog-to-digital converter.

The moving mechanism is mounted on the carriage so that the light receiving unit of the illuminance meter is flush with the surface of the glass substrate G when the light receiving unit is moved on the roller conveying path 46, The carriage and the illuminometer can be arbitrarily moved in a bidirectional manner, for example, by means of a linear motor on a rail extending so as to be able to stop (stop) or stop (static) the illuminometer at an arbitrary position on the rail.

The control unit 17 controls the DMD 325 to drive the mirrors M at the same time ratio (e.g., ON angle: OFF angle = 1: 1), controls the illuminance measurement unit 38, The illuminance of each position is measured while moving the illuminometer in the direction of the irradiation line (Y axis direction). Thereby, the illuminance distribution of the line-shaped light irradiated by the light source unit 32 is obtained. The control unit 17 stores the obtained illuminance distribution in the memory 42. [

The control unit 17 refers to the illumination maps stored in the table of the memory 42 and the irradiation maps as shown in Fig. 3D before the auxiliary exposure processing, i, j, and maps the values on the table built in the memory 42, for example.

The control unit 17 controls the light source unit 32 and the roller conveying path 46 to perform scanning between the glass substrate G and the light source unit 32 for auxiliary exposure processing. In this scanning, when the unit areas (i, 1) to (i, 9) of the i-th row of the matrix section on the glass substrate G pass directly under the light source unit 32, The respective command values Vi, 1 to Vi, 9 of the i-th row are assigned to the command values. Thus, the line-shaped light from the light source unit 32 is irradiated to the unit areas (i, 1) to (i, 9) of the i-th row for a predetermined period of time with independent illumination for each unit area.

Thus, when the glass substrate G passes directly under the light source unit 32, auxiliary exposure with an independent illuminance or exposure amount is performed for each unit area (i, j) on the irradiation line (each row of the matrix partition).

As described above, the control unit 17 of the auxiliary exposure apparatus 11 determines whether or not at least one of the measurement results of the film thickness and the line width of the glass substrate G after the development process, The operation of each mirror M may be controlled based on the illuminance distribution of the line-shaped light emitted from the light source unit 32. [ By doing so, it is possible to suppress the deterioration of the accuracy of the auxiliary exposure processing caused by the unevenness of the illuminance distribution.

On the other hand, in the above-described embodiment, an example is described in which one mirror M is associated with one unit area. However, the number of mirrors M to be corresponded may be different for each unit area.

For example, in the case where the auxiliary exposure apparatus 11 has a single light source unit 32, depending on the configuration of the optical system, the end of the glass substrate G in the line direction from one mirror M There is a possibility that the irradiation range of the light is larger than the irradiation range of the light irradiated from the one mirror M to the center of the glass substrate G in the line direction (i.e., directly below the light source unit 32).

Thus, the auxiliary exposure apparatus 11 is configured such that one or a plurality of mirrors M are associated with the unit area on the line direction end side, and the number of the unit areas on the line direction center side is larger than the unit area on the line direction end side The mirror M may be made to correspond. That is, if the irradiation range of the light radiated to the end side in the line direction from one mirror M is twice the irradiation range of the light radiated from the one mirror M toward the center side in the line direction, One mirror M may correspond to the unit area on the end side in the line direction and two mirrors M may correspond to the unit area on the center side in the line direction. By doing so, it is possible to suppress the deterioration of the accuracy of the auxiliary exposure process due to the difference in the irradiation range.

Further, the DMD 325 may change the reflection characteristic by heat. Thus, the auxiliary exposure apparatus 11 may be provided with a temperature regulating unit for regulating the temperature of the DMD 325. [ As the temperature regulating unit, for example, a heat sink or a Peltier module can be used.

In the above-described embodiment, the light source unit 32 is fixed at a predetermined position in the scanning direction, with the flat conveying section 30 for conveying the glass substrate G in a flat state. However, a scanning method in which the glass substrate G is fixed, for example, on a stage, and the light source unit 32 is moved in the scanning direction on the stage, or a scanning method in which both the glass substrate G and the light source unit 32 are moved It is possible.

Although the substrate to be processed is a glass substrate for FPD in the above-described embodiments, the present invention is not limited to this, and other substrate for a flat panel display, a semiconductor wafer, an organic EL, various substrates for a solar cell, A mask, a printed board, or the like.

As described above, the auxiliary exposure apparatus according to the embodiment is an auxiliary exposure apparatus that is disposed on the front end side or the rear end side of an exposure apparatus that performs exposure processing on a substrate to be processed, and performs auxiliary exposure As the apparatus, there is provided a carrying unit and a light source unit. The carry section conveys the substrate to be processed in the scanning direction. The light source unit irradiates, on the substrate to be processed, which is transported in the scanning direction, a line-shaped light whose longitudinal direction is a direction intersecting the scanning direction. Further, the light source unit includes a digital micromirror device in which a plurality of movable micromirrors are arranged. Therefore, with the auxiliary exposure apparatus according to the embodiment, the exposure resolution can be enhanced.

Further effects and modifications can be easily obtained by those skilled in the art. Therefore, the broader aspects of the present invention are not limited to the specific details and representative embodiments described and shown above. Accordingly, various changes may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

11: auxiliary exposure device 12: developing device
17: Control section 20: Exposure device
30: a parallel conveying unit 32: a light source unit
38: illuminance measuring unit 46: roller conveying path
100: substrate processing system 325: DMD

Claims (5)

An auxiliary exposure apparatus arranged on a front end side or a rear end side of an exposure apparatus for performing exposure processing on a substrate to be processed and performing local exposure processing on the substrate to be processed,
A transfer section for transferring the substrate to be processed in a scanning direction,
A light source unit for irradiating the substrate to be processed, which is transported in the scanning direction, with a line-shaped light having a longitudinal direction intersecting with the scanning direction,
And,
The light source unit includes:
Comprising a digital micromirror device in which a plurality of movable micromirrors are arranged
And the auxiliary exposure unit. The light source unit according to claim 1,
A projection lens disposed on an optical path between the digital micromirror device and the substrate to be processed to project the light reflected by the digital micromirror device in the form of a line with respect to the substrate to be processed,
Wherein the auxiliary exposure apparatus further comprises: The image forming apparatus according to any one of claims 1 to 4, further comprising: a developing unit for performing a developing process on the post-exposure side of the exposed substrate,
And the auxiliary exposure unit. The auxiliary exposure apparatus according to any one of claims 1 to 4, further comprising a single light source unit. 5. The method according to claim 4, further comprising: measuring at least one of a film thickness and a line width in the substrate to be processed after development processing, and a light distribution distribution of the line type light in the case where the plurality of movable micromirrors are uniformly controlled A control unit for controlling the operation of the movable micromirror,
Wherein the auxiliary exposure apparatus further comprises:

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