JP2010176081A - Exposure device, substrate carrying method of same, production method of panel substrate for display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To mount a substrate on a chuck without rotation in the θ-direction in relation to the chuck without interrupting the position detection of the chuck by a laser length measuring system. <P>SOLUTION: Before conveying the substrate 1 to the chuck, the substrate 1 is mounted on a temperature adjuster 50 for adjusting the temperature of the substrate 1. A rotation mechanism 80 which rotates the substrate 1 in the θ-direction is provided to the temperature adjuster 50, and the inclination of the substrate 1 mounted on the temperature adjuster 50 in the θ-direction is detected. Based on the detection result, before conveying the substrate 1 from the temperature adjuster 50 to the chuck 10, the substrate 1 is reversely rotated by the inclination in the θ-direction, and the inclination of the substrate 1 in the θ-direction is corrected. Since there is no need to rotate the chuck 10 in the θ-direction before mounting the substrate 1 on the chuck 10, the position detection of the chuck 10 by the laser length measuring system is not interrupted. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exposure apparatus that exposes a substrate, a substrate transport method of the exposure apparatus, and a method of manufacturing a display panel substrate using the same in the manufacture of a display panel substrate such as a liquid crystal display device. The present invention relates to an exposure apparatus that detects the position of a chuck on which a substrate is mounted using a long system, a substrate transport method of the exposure apparatus, and a method of manufacturing a display panel substrate using them.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. Conventionally, as an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There was a proximity method to transfer. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  Japanese Patent Application Laid-Open No. 2004-228561 discloses a technique for detecting the position of a chuck on which a substrate is mounted using a laser length measurement system and positioning the substrate with high accuracy in a proximity exposure apparatus. Further, in Patent Document 2, before the substrate is mounted on the chuck, the tilt of the substrate in the θ direction is detected, and the substrate is rotated relative to the chuck by rotating the chuck in the θ direction by the detected tilt of the substrate. A technique for preventing the chuck from being mounted in a posture rotated in the θ direction is disclosed.

  In recent years, an exposure apparatus has been developed that irradiates a substrate coated with a photoresist with a light beam, scans the substrate with the light beam, and draws a pattern on the substrate. Since the substrate is scanned by the light beam and the pattern is directly drawn on the substrate, an expensive mask is not required. Further, by changing the drawing data and the scanning program, various types of display panel substrates can be supported. Examples of such an exposure apparatus include those described in Patent Literature 3, Patent Literature 4, and Patent Literature 5.

JP 2005-331542 A JP 2008-9012 A JP 2003-332221 A JP 2005-353927 A JP 2007-219011 A

  In the technique described in Patent Document 2, if the tilt in the θ direction of the substrate before being mounted on the chuck is large, the chuck must be largely rotated in the θ direction by the tilt of the substrate before mounting the substrate on the chuck. . When the chuck is largely rotated in the θ direction, the laser interferometer cannot receive the laser beam reflected by the bar mirror attached to the chuck, so that the position detection of the chuck by the laser length measurement system is interrupted. In that case, after the substrate is mounted on the chuck, the rotation of the chuck is restored, and then the position detection of the chuck by the laser length measurement system is resumed. Alternatively, it is necessary to perform paralleling work parallel to the Y direction. In the parallel operation, it is necessary to move the chuck by the stage and measure the positions of two orthogonal sides of the chuck at two or more locations by the laser length measurement system, which takes time. Therefore, there is a problem that the tact time becomes long.

  In addition, although a small detection error occurs in the position detection of the chuck by the laser length measurement system, once the position detection of the chuck by the laser length measurement system is interrupted, the position detection of the chuck is resumed after performing parallel operation after the interruption. However, the detection error is not always the same as before the interruption, and there is a problem that the detection error varies.

  An object of the present invention is to mount a substrate on a chuck in a posture that does not rotate in the θ direction with respect to the chuck without interrupting position detection of the chuck by the laser length measurement system. Another object of the present invention is to manufacture a high-quality display panel substrate with a short tact time.

  An exposure apparatus according to the present invention is an exposure apparatus including a chuck that supports a substrate, a stage that moves the chuck, and a laser length measurement system that detects the position of the chuck. A temperature control device that mounts and adjusts the temperature of the substrate, a detection unit that detects a tilt in the θ direction of the substrate mounted on the temperature control device, and a substrate transport unit that transports the substrate from the temperature control device to the chuck. The temperature control device has a rotation mechanism for rotating the substrate in the θ direction, and the substrate is tilted in the θ direction before the substrate transport device transports the substrate from the temperature control device to the chuck based on the detection result of the detection device. It rotates in the reverse direction by the amount to correct the inclination of the substrate in the θ direction.

  Further, the substrate transport method of the exposure apparatus of the present invention is a substrate transport method of an exposure apparatus comprising a chuck that supports a substrate, a stage that moves the chuck, and a laser length measurement system that detects the position of the chuck. Before transporting the substrate to the chuck, the substrate is mounted on the temperature control device to adjust the temperature of the substrate, and the temperature control device is provided with a rotation mechanism that rotates the substrate in the θ direction. The tilt of the substrate in the θ direction is detected, and before the substrate is transported from the temperature controller to the chuck, the substrate is rotated in the opposite direction by the tilt of the θ direction to correct the tilt of the substrate in the θ direction. To do.

  Before transporting the substrate to the chuck, the substrate is mounted on the temperature control device to adjust the temperature of the substrate, and the temperature control device is provided with a rotation mechanism that rotates the substrate in the θ direction. The inclination in the θ direction is detected, and before the substrate is transported from the temperature control device to the chuck, the substrate is rotated in the reverse direction by the inclination in the θ direction to correct the inclination in the θ direction of the substrate. Therefore, the substrate is mounted on the chuck in a posture that does not rotate in the θ direction with respect to the chuck. And since there is no need to rotate the chuck in the θ direction before mounting the substrate on the chuck, the position detection of the chuck by the laser length measuring system is not interrupted. Accordingly, it is not necessary to carry out the chucking operation every time the chuck position detection by the laser length measurement system is interrupted, and the chuck position detection error by the laser length measurement system becomes constant without variation.

  Furthermore, the exposure apparatus of the present invention has a temperature adjustment plate that adjusts the temperature of the substrate by contacting the substrate, and a plurality of push-up pins that lift the substrate from the temperature adjustment plate, and the rotation mechanism includes the substrate The plurality of push-up pins that lift up the substrate are rotated in the θ direction, and the substrate is rotated in the θ direction. In the substrate transport method of the exposure apparatus of the present invention, the temperature control device is provided with a temperature control plate for adjusting the temperature of the substrate in contact with the substrate, and a plurality of push-up pins for lifting the substrate from the temperature control plate. Thus, the plurality of push-up pins that lift the substrate are rotated in the θ direction, and the substrate is rotated in the θ direction. The tilt of the substrate in the θ direction is corrected with a simple configuration without rotating the temperature adjustment plate that adjusts the temperature of the substrate in contact with the substrate in the θ direction.

  Furthermore, in the exposure apparatus of the present invention, the detection means is mounted horizontally on the temperature control device, with a plurality of sensors for detecting the edges of one side of the rectangular substrate mounted vertically on the temperature control device at a plurality of locations. And a plurality of sensors for detecting the edge of one side of the rectangular substrate at a plurality of locations. Further, the substrate transport method of the exposure apparatus of the present invention is mounted on the temperature control device by detecting the edge of one side of the rectangular substrate mounted vertically on the temperature control device at a plurality of locations by a plurality of sensors. The board mounted on the temperature controller by detecting the inclination of the θ direction of the board and detecting the edge of one side of the rectangular board mounted horizontally on the temperature controller at multiple locations using different sensors. Is detected in the θ direction.

  The orientation of the substrate to be mounted on the temperature control device must be different between the case where the rectangular substrate is mounted on the chuck vertically and the case where the substrate is mounted horizontally. The temperature control device detects the edge of one side of a rectangular board mounted vertically on the temperature control device at multiple locations using multiple sensors to detect the inclination of the substrate mounted on the temperature control device in the θ direction. Since the edge of one side of the rectangular board mounted horizontally is detected at multiple locations by different sensors, the inclination of the board mounted on the temperature control device in the θ direction is detected, so the rectangular board It is possible to deal with both the case where the is mounted vertically on the chuck and the case where it is mounted horizontally.

  The method for producing a display panel substrate of the present invention comprises exposing the substrate using any of the exposure apparatuses described above, or transporting the substrate to a chuck using the substrate transport method of any of the exposure apparatuses described above, The substrate is exposed. By using the above exposure apparatus or the substrate transport method of the exposure apparatus, it is not necessary to perform the chuck parallel operation every time the position detection of the chuck by the laser length measurement system is interrupted, and the position of the chuck by the laser length measurement system. Since the detection error is constant without variation, a high-quality display panel substrate is manufactured with a short tact time.

  According to the exposure apparatus and the substrate transport method of the exposure apparatus of the present invention, before transporting the substrate to the chuck, the substrate is mounted on the temperature control device to adjust the temperature of the substrate, and the substrate is moved to the θ direction on the temperature control device. A rotating mechanism is provided to detect the tilt in the θ direction of the substrate mounted on the temperature control device. Based on the detection result, the substrate is moved by the tilt in the θ direction before the substrate is transferred from the temperature control device to the chuck. By rotating in the opposite direction and correcting the tilt of the substrate in the θ direction, the substrate is placed in a posture in which the substrate is not rotated in the θ direction with respect to the chuck without interrupting the position detection of the chuck by the laser measurement system. Can be installed. Accordingly, it is not necessary to carry out the chuck paralleling operation every time the chuck position detection by the laser length measurement system is interrupted, and the chuck position detection error by the laser length measurement system can be made uniform without variation.

  Furthermore, according to the exposure apparatus and the substrate transport method of the exposure apparatus of the present invention, the temperature adjustment device includes a temperature adjustment plate that adjusts the temperature of the substrate by contacting the substrate, and a plurality of push-up pins that lift the substrate from the temperature adjustment plate. The rotation mechanism rotates a plurality of push-up pins that lift the substrate in the θ direction, and rotates the substrate in the θ direction, thereby adjusting the temperature adjustment plate that contacts the substrate and adjusts the temperature of the substrate in the θ direction. The inclination of the substrate in the θ direction can be corrected with a simple configuration without rotating to the right.

  Furthermore, according to the exposure apparatus and the substrate transport method of the exposure apparatus of the present invention, the temperature adjustment is performed by detecting the edge of one side of the rectangular substrate mounted vertically on the temperature adjustment apparatus at a plurality of locations by a plurality of sensors. The temperature adjustment device detects the inclination of the θ direction of the substrate mounted on the device, detects the edge of one side of the rectangular substrate mounted horizontally on the temperature adjustment device at multiple locations with different sensors. By detecting the inclination in the θ direction of the substrate mounted on the substrate, it is possible to cope with both the case where the rectangular substrate is mounted vertically on the chuck and the case where it is mounted horizontally.

  According to the manufacturing method of the display panel substrate of the present invention, it is not necessary to perform the chucking operation every time the chuck position detection by the laser length measurement system is interrupted, and the chuck position detection error by the laser length measurement system. Therefore, a high-quality display panel substrate can be manufactured with a short tact time.

1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. 1 is a side view of an exposure apparatus according to an embodiment of the present invention. 1 is a front view of an exposure apparatus according to an embodiment of the present invention. It is a figure which shows schematic structure of a light beam irradiation apparatus. It is a figure explaining operation | movement of a laser length measurement system. It is a top view of a temperature control apparatus. It is a partial cross section side view of the AA part of FIG. It is a figure explaining operation | movement of a temperature control apparatus. It is a top view of a substrate edge detection sensor. It is a side view of a substrate edge detection sensor. FIG. 11A is a top view of the rotation mechanism, and FIG. 11B is a side view of the rotation mechanism. It is a top view of the chuck | zipper in a delivery position. It is a side view of the chuck | zipper in a delivery position. It is a figure which shows schematic structure of a drawing control part. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a figure explaining the scanning of the board | substrate by a light beam. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. 2 is a side view of the exposure apparatus according to the embodiment of the present invention, and FIG. 3 is a front view of the exposure apparatus according to the embodiment of the present invention. The present embodiment shows an example of an exposure apparatus that draws a pattern on a substrate. The exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a stage drive circuit 9, a chuck 10, a gate 11, a light beam irradiation device 20, linear scales 31, 33, Encoders 32 and 34, substrate transport robot 35, laser length measurement system, laser length measurement system control device 40, travel error detection circuit 46, image processing device 49, temperature adjustment device 50, tilt detection device 69, and main control device 70 It is configured to include. 2 and 3, the stage drive circuit 9, the substrate transport robot 35, the laser length measurement system laser light source 41, the laser length measurement system control device 40, the travel error detection circuit 46, the image processing device 49, and the temperature adjustment device. 50, the inclination detection device 69, and the main control device 70 are omitted. In addition to these, the exposure apparatus includes a temperature control unit for managing the temperature in the apparatus.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  In FIG. 1, the chuck 10 is in a delivery position for delivering the substrate 1. At the delivery position, the substrate 1 is carried into the chuck 10 by the substrate carrying robot 35, and the substrate 1 is carried out of the chuck 10 by the substrate carrying robot 35. The chuck 10 supports the back surface of the substrate 1 by vacuum suction. A photoresist is applied to the surface of the substrate 1.

  A gate 11 is provided across the base 3 above the exposure position where the substrate 1 is exposed. A plurality of light beam irradiation devices 20 are mounted on the gate 11. Although the present embodiment shows an example of an exposure apparatus using eight light beam irradiation apparatuses 20, the number of light beam irradiation apparatuses is not limited to this, and seven or less or nine or more light beams are used. An irradiation device may be used.

  FIG. 4 is a diagram showing a schematic configuration of the light beam irradiation apparatus. The light beam irradiation device 20 includes an optical fiber 22, a lens 23, a mirror 24, a DMD (Digital Micromirror Device) 25, a projection lens 26, and a DMD driving circuit 27. The optical fiber 22 introduces an ultraviolet light beam generated from the laser light source unit 21 into the light beam irradiation device 20. The light beam emitted from the optical fiber 22 is irradiated to the DMD 25 through the lens 23 and the mirror 24. The DMD 25 is a spatial light modulator configured by arranging a plurality of minute mirrors that reflect a light beam in two directions, and modulates the light beam by changing the angle of each mirror. The light beam modulated by the DMD 25 is irradiated from the head unit 20 a including the projection lens 26. The DMD drive circuit 27 changes the angle of each mirror of the DMD 25 based on the drawing data supplied from the main controller 70.

  2 and 3, the chuck 10 is mounted on the θ stage 8, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves in the X direction along the X guide 4. The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves in the Y direction along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction.

  By rotation of the θ stage 8 in the θ direction, the substrate 1 mounted on the chuck 10 is rotated so that two orthogonal sides are directed in the X direction and the Y direction. As the X stage 5 moves in the X direction, the chuck 10 is moved between the delivery position and the exposure position. When the X stage 5 moves in the X direction at the exposure position, the light beam irradiated from the head unit 20a of each light beam irradiation apparatus 20 scans the substrate 1 in the X direction. In addition, as the Y stage 7 moves in the Y direction, the scanning region of the substrate 1 by the light beam emitted from the head unit 20a of each light beam irradiation device 20 is moved in the Y direction. In FIG. 1, the main controller 70 controls the stage drive circuit 9 to rotate the θ stage 8 in the θ direction, move the X stage 5 in the X direction, and move the Y stage 7 in the Y direction. .

  1 and 2, the base 3 is provided with a linear scale 31 extending in the X direction. The linear scale 31 is provided with a scale for detecting the amount of movement of the X stage 5 in the X direction. The X stage 5 is provided with a linear scale 33 extending in the Y direction. The linear scale 33 is provided with a scale for detecting the amount of movement of the Y stage 7 in the Y direction.

  1 and 3, an encoder 32 is attached to one side surface of the X stage 5 so as to face the linear scale 31. The encoder 32 detects the scale of the linear scale 31 and outputs a pulse signal to the main controller 70. 1 and 2, an encoder 34 is attached to one side surface of the Y stage 7 so as to face the linear scale 33. The encoder 34 detects the scale of the linear scale 33 and outputs a pulse signal to the main controller 70. Main controller 70 counts the pulse signal of encoder 32, detects the amount of movement of X stage 5 in the X direction, counts the pulse signal of encoder 34, and moves the amount of Y stage 7 in the Y direction. Is detected.

  FIG. 5 is a diagram for explaining the operation of the laser length measurement system. In FIG. 5, the gate 11, the light beam irradiation device 20, the substrate transfer robot 35, the image processing device 49, the temperature adjustment device 50, and the tilt detection device 69 shown in FIG. 1 are omitted. The laser length measurement system is a known laser interference type length measurement system, and includes a laser light source 41, laser interferometers 42 and 44, and bar mirrors 43 and 45. The bar mirror 43 is attached to one side surface of the chuck 10 in the Y direction. The bar mirror 45 is attached to one side surface of the chuck 10 in the X direction.

  The laser interferometer 42 irradiates the laser beam from the laser light source 41 to the bar mirror 43, receives the laser beam reflected by the bar mirror 43, and the laser beam reflected from the laser beam source 41 and the laser beam reflected by the bar mirror 43. Measure interference. This measurement is performed at two locations in the Y direction. The laser measuring system control device 40 detects the position in the X direction and the inclination in the θ direction of the chuck 10 moved by the X stage 5 from the measurement result of the laser interferometer 42 under the control of the main control device 70.

  On the other hand, the laser interferometer 44 irradiates the laser beam from the laser light source 41 to the bar mirror 45, receives the laser beam reflected by the bar mirror 45, and the laser beam reflected from the laser light source 41 and the laser reflected by the bar mirror 45. Measure interference with light. The laser measurement system control device 40 detects the position in the Y direction of the chuck 10 moved by the X stage 5 from the measurement result of the laser interferometer 44 under the control of the main control device 70.

  The travel error detection circuit 46 detects a travel error such as rolling or yawing when the X stage 5 moves in the X direction from the detection result of the laser length measurement system control device 40. By detecting the position of the chuck 10 using the laser length measurement system, the position of the chuck 10 can be detected with high accuracy, so that the running error of the X stage 5 can be detected with high accuracy. The travel error detection circuit 46 outputs the detection result to the main controller 70.

  In FIG. 1, a temperature adjusting device 50 is installed in front of the base 3. Usually, since the temperature of the substrate 1 is increased or decreased by the processing in the previous step, it is necessary to cool or warm the substrate 1 before performing exposure. The substrate transfer robot 35 loads the substrate 1 into the temperature adjustment device 50 before loading the substrate 1 into the chuck 10, and loads the substrate 1 whose temperature is adjusted by the temperature adjustment device 50 into the chuck 10. While the exposure of the substrate 1 mounted on the chuck 10 is being performed, the temperature adjustment device 50 mounts the substrate 1 to be exposed next and adjusts the temperature of the substrate 1.

  FIG. 6 is a top view of the temperature control device. FIG. 7 is a partial cross-sectional side view of the AA portion of FIG. The temperature adjusting device 50 includes a temperature adjusting plate 51, a leg portion 52, a fixed base 53, an elevating guide 54, an elevating base 55, bars 56 and 58, a rotating base 57, a push-up pin 60, a motor 61, pulleys 62a and 62b, and a belt 63. The ball screw 64a, the nut 64b, the roller bearing 65, and the rotation mechanism 80 are included.

  In FIG. 7, the temperature adjustment plate 51 is supported by a plurality of legs 52. Inside the temperature adjustment plate 51, a pipe through which a temperature adjustment liquid (not shown) flows is provided. When the substrate 1 is mounted on the temperature adjustment plate 51, the temperature adjustment plate 51 contacts the substrate 1, and heat conduction is performed between the temperature adjustment liquid flowing in the temperature adjustment plate 51 and the substrate 1. The temperature is adjusted. A fixed base 53 is installed below the temperature adjustment plate 51, and an elevating guide 54 is attached to the fixed base 53. A lift base 55 is attached to the lift guide 54 so as to be movable up and down. A rotary base 57 is rotatably mounted on the elevating base 55 via a roller bearing 65 and a nut 64b.

  6 and 7, a plurality of bars 56 extending in the vertical direction of FIG. 6 and the depth direction of FIG. 7 are attached to the lower surface of the rotation base 57. A plurality of bars 58 extending in the horizontal direction of FIG. 7 are attached. A plurality of push-up pins 60 are attached to each bar 56, and a plurality of through-holes through which the push-up pins 60 pass are provided in the temperature adjustment plate 51.

  In FIG. 7, a motor 61 is attached to the fixed base 53, and a pulley 62 a is attached to the rotating shaft of the motor 61. A ball screw 64a is rotatably attached to the fixed base 53, and a pulley 62b is attached to the lower end of the ball screw 64a. The pulley 62a and the pulley 62b are connected by a belt 63, and the rotation of the motor 61 is transmitted to the ball screw 64a via the pulley 62a, the belt 63, and the pulley 62b.

  FIG. 8 is a diagram for explaining the operation of the temperature control device. When the ball screw 64 a is rotated by the motor 61, the nut 64 b engaged with the ball screw 64 a moves up and down, and the lifting base 55 moves up and down along the lifting guide 54. When the elevating base 55 moves up and down, the bar 56 attached to the lower surface of the rotating base 57 moves up and down, and the push-up pin 60 is raised and lowered. When the substrate transfer robot 35 transfers the substrate 1 to the temperature adjustment device 50, the temperature adjustment device 50 raises the push-up pin 60 from the surface of the temperature adjustment plate 51 as shown in FIG. Receive from the handling arm of the robot 35. Then, as shown in FIG. 7, the push-up pin 60 is lowered into the temperature adjustment plate 51 to mount the substrate 1 on the temperature adjustment plate 51. Further, when the substrate transfer robot 35 transfers the substrate 1 from the temperature adjustment device 50 to the chuck 10, the temperature adjustment device 50 raises the push-up pin 60 from the surface of the temperature adjustment plate 51 as shown in FIG. The substrate 1 is lifted from the temperature control plate 51, and the handling arm of the substrate transport robot 35 receives the substrate 1 from the tip of the push-up pin 60.

  Around the temperature adjustment device 50, a plurality of substrate edge detection sensors for detecting the edge of the substrate 1 mounted on the temperature adjustment device 50 are arranged. FIG. 9 is a top view of the substrate edge detection sensor. FIG. 10 is a side view of the substrate edge detection sensor. Each substrate edge detection sensor includes a light projecting unit 67a or 68a and a light receiving unit 67b or 68b. As shown in FIG. 10, the light projecting unit 67 a and the light receiving unit 67 b are installed facing each other with the substrate 1 mounted on the temperature control device 50 interposed therebetween. The same applies to the light projecting unit 68a and the light receiving unit 68b.

  In the present embodiment, when the substrate transport robot 35 transports the substrate 1 from the temperature control device 50 to the chuck 10, the substrate 1 is rotated 90 degrees. As shown by a solid line in FIG. The light projecting portion 67 a and the light receiving portion 67 b of the substrate edge detection sensor are disposed above and below the edge of one side of the substrate 1 that is mounted horizontally on the temperature adjustment device 50. Further, the substrate 1 mounted horizontally on the chuck 10 is mounted vertically on the temperature adjusting device 50 as indicated by a broken line in FIG. The light projecting unit 68 a and the light receiving unit 68 b of the substrate edge detection sensor are arranged above and below the edge of one side of the substrate 1 mounted vertically on the temperature adjustment device 50.

  As shown in FIG. 10, the light projecting portions 67 a and 68 a of the substrate edge detection sensor irradiate the edge of the substrate 1 with light having a predetermined width in a state where the substrate 1 is lifted by the push-up pin 60 of the temperature adjusting device 50. . The light receiving portions 67b and 68b of the substrate edge detection sensor are constituted by line sensors including a plurality of light receiving elements. Each light receiving element receives the light emitted from the light projecting units 67a and 68a, and outputs a detection signal corresponding to the intensity of the received light. Since the intensity of the light received through the substrate 1 and the light directly received without passing through the substrate 1 are different, the intensity of the detection signals of the light receiving portions 67b and 68b changes before and after the edge of the substrate 1. To do.

  In FIG. 1, the tilt detecting device 69 detects the position of one edge of the substrate 1 from a plurality of detection signals from the light receiving portions 67 b and 68 b, and determines the temperature from the difference in the detected position of one edge of the substrate 1. The inclination in the θ direction of the substrate 1 mounted on the adjusting device 50 is detected. The edge of one side of the rectangular substrate 1 mounted vertically on the temperature control device 50 is detected at a plurality of locations by a plurality of substrate edge detection sensors, and the inclination of the substrate 1 mounted on the temperature control device 50 in the θ direction. And the edge of one side of the rectangular substrate 1 mounted horizontally on the temperature control device 50 is detected at a plurality of locations by another plurality of substrate edge detection sensors, and the substrate mounted on the temperature control device 50 is detected. Since the inclination of the θ direction of 1 is detected, it is possible to cope with both the case where the rectangular substrate 1 is mounted vertically on the chuck 10 and the case where it is mounted horizontally.

  FIG. 11A is a top view of the rotation mechanism, and FIG. 11B is a side view of the rotation mechanism. The rotation mechanism 80 includes a guide 81, a motor 82, a shaft coupling 83, a ball screw 84a, a nut 84b, a bearing 85, a moving block 86, bolts 87 and 88, and a tension coil spring 89. In FIG. 11B, a guide 81 and a motor 82 are installed on the lifting base 55. A moving block 86 is movably attached to the guide 81. In FIGS. 11A and 11B, a ball screw 84 a is connected to the rotating shaft of the motor 82 through a shaft coupling 83. The ball screw 84a is rotatably supported by a bearing 85. A nut 84 b that is moved by a ball screw 84 a is attached to the inside of the moving block 86. When the ball screw 84 a is rotated by the motor 82, the moving block 86 is moved along the guide 81 in the lateral direction of the drawing.

  In FIG. 11A, the rotation base 57 is provided with a substantially U-shaped notch at a position above the rotation mechanism 80. A bolt 87 is attached to the upper part of the moving block 86, and a bolt 88 is attached to the side surface of the cutout portion of the rotation base 57. One end of a tension coil spring 89 is attached to the upper part of the moving block 86, and the other end of the tension coil spring 89 is attached to the side surface of the notch of the rotation base 57. The rotation base 57 is urged toward the moving block 86 by a tension coil spring 89, and the head of the bolt 88 is in contact with the head of the bolt 87. When the moving block 86 is moved to the left in the drawing by the motor 82, the bolt 88 is pushed by the bolt 87, and the rotation base 57 rotates clockwise in the θ direction. When the moving block 86 is moved rightward in the drawing by the motor 82, the rotary base 57 is pulled by the tension coil spring 89 and rotates counterclockwise in the θ direction.

  In FIG. 6, when the rotation base 57 rotates in the θ direction, the bar 56 attached to the lower surface of the rotation base 57 rotates in the θ direction, and the push-up pin 60 rotates in the θ direction. The through hole of the temperature control plate 51 is formed wider so that the push-up pin 60 can rotate in the θ direction. In a state where the substrate 1 is lifted by the push-up pin 60 as shown in FIG. 10, the tilt detection device 69 of FIG. 1 controls the motor 82 of the rotation mechanism 80 based on the detected tilt of the substrate 1 in the θ direction, Before the substrate transport robot 35 transports the substrate 1 from the temperature control device 50 to the chuck 10, the push-up pin 60 that lifts the substrate 1 is rotated in the reverse direction by the inclination of the θ direction of the substrate 1. As a result, the substrate 1 is rotated in the reverse direction by the inclination in the θ direction, and the inclination in the θ direction of the substrate 1 is corrected.

  Before transporting the substrate 1 to the chuck, the substrate 1 is mounted on the temperature adjustment device 50 to adjust the temperature of the substrate 1, and the temperature adjustment device 50 is provided with a rotation mechanism 80 that rotates the substrate 1 in the θ direction. The inclination in the θ direction of the substrate 1 mounted on the apparatus 50 is detected, and based on the detection result, the substrate 1 is moved in the reverse direction by the inclination in the θ direction before the substrate 1 is transferred from the temperature adjustment device 50 to the chuck 10. Since it rotates to correct the inclination of the substrate 1 in the θ direction, the substrate 1 is mounted on the chuck 10 in a posture that does not rotate in the θ direction with respect to the chuck. Since it is not necessary to rotate the chuck 10 in the θ direction before mounting the substrate 1 on the chuck 10, the position detection of the chuck 10 by the laser length measurement system is not interrupted. Accordingly, it is not necessary to perform the parallel alignment work of the chuck 10 every time the position detection of the chuck 10 by the laser length measurement system is interrupted, and the position detection error of the chuck 10 by the laser length measurement system becomes constant without variation.

  The temperature adjusting device 50 is provided with a temperature adjusting plate 51 that contacts the substrate 1 to adjust the temperature of the substrate 1 and a plurality of push-up pins 60 that lift the substrate 1 from the temperature adjusting plate 51. Since the plurality of push-up pins 60 that lift the substrate 1 are rotated in the θ direction and the substrate 1 is rotated in the θ direction, the temperature adjustment plate 51 that contacts the substrate 1 and adjusts the temperature of the substrate 1 is rotated in the θ direction. Without this, the inclination of the substrate 1 in the θ direction is corrected with a simple configuration.

  FIG. 12 is a top view of the chuck in the delivery position. FIG. 13 is a side view of the chuck in the delivery position. Above the chuck 10 at the delivery position, a CCD camera 47 is installed at a position directly above the edges of two orthogonal sides of the substrate 1 mounted vertically on the chuck 10 indicated by a solid line. A CCD camera 48 is installed at a position directly above the edges of two orthogonal sides of the substrate 1 mounted horizontally on the chuck 10 shown in FIG. When the substrate 1 is mounted vertically on the chuck 10, the CCD camera 47 acquires images of two orthogonal edges of the substrate 1 mounted vertically on the chuck 10, and the image signal is the image of FIG. 1. The data is output to the processing device 49. When the substrate 1 is mounted horizontally on the chuck 10, the CCD camera 48 obtains images of two orthogonal edges of the substrate 1 mounted horizontally on the chuck 10, and displays the image signal in FIG. To the image processing device 49.

  In FIG. 1, the image processing device 49 processes the image signals output from the CCD cameras 47 and 48 to detect the positions of two orthogonal edges of the substrate 1 mounted on the chuck 10. The main controller 70 detects the position in the XY direction and the inclination in the θ direction of the substrate 1 mounted on the chuck 10 from the positions of two orthogonal edges of the substrate 1 detected by the image processing device 49. The main controller 70 controls the stage driving circuit 9 based on the detected position of the substrate 1 in the X and Y directions so that the center point of the substrate 1 comes to a predetermined position before the exposure is started. Thus, the chuck 10 is moved to the exposure position. Further, the main controller 70 controls the stage drive circuit 9 based on the detected inclination of the substrate 1 in the θ direction so that two orthogonal sides of the substrate 1 mounted on the chuck 10 are directed in the X direction and the Y direction. Similarly, the θ stage 8 is rotated in the θ direction.

  The main controller 70 has a drawing controller that supplies drawing data to the DMD drive circuit 27 of the light beam irradiation device 20. FIG. 14 is a diagram illustrating a schematic configuration of the drawing control unit. The drawing control unit 71 includes a memory 72, a bandwidth setting unit 73, a center point coordinate determination unit 74, and a coordinate determination unit 75. The memory 72 stores drawing data to be supplied to the DMD driving circuit 27 of each light beam irradiation apparatus 20 using the XY coordinates as addresses.

  The bandwidth setting unit 73 sets the Y-direction bandwidth of the light beam emitted from the head unit 20 a of the light beam irradiation device 20 by determining the range of the Y coordinate of the drawing data read from the memory 72.

  The laser length measurement system control device 40 detects the position of the chuck 10 in the X and Y directions before the exposure of the substrate 1 at the exposure position is started. The center point coordinate determination unit 74 determines the XY coordinates of the center point of the chuck 10 before starting the exposure of the substrate 1 from the position in the XY direction of the chuck 10 detected by the laser length measurement system control device 40. In FIG. 1, when scanning the substrate 1 with the light beam from the light beam irradiation device 20, the main control device 70 controls the stage driving circuit 9 and moves the chuck 10 in the X direction by the X stage 5. When moving the scanning area of the substrate 1, the main controller 70 controls the stage driving circuit 9 to move the chuck 10 in the Y direction by the Y stage 7. In FIG. 14, the center point coordinate determination unit 74 counts the pulse signals from the encoders 32 and 34, detects the amount of movement of the X stage 5 in the X direction and the amount of movement of the Y stage 7 in the Y direction, The XY coordinates of the center point of the chuck 10 are determined. Then, the center point coordinate determination unit 74 corrects the determined XY coordinates of the center point of the chuck 10 based on the detection result of the running error detection circuit 46.

  The coordinate determination unit 75 determines the XY coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 based on the XY coordinates of the center point of the chuck 10 corrected by the center point coordinate determination unit 74. The memory 72 inputs the XY coordinates determined by the coordinate determination unit 75 as an address, and outputs the drawing data stored at the input XY coordinate address to the DMD drive circuit 27 of each light beam irradiation apparatus 20.

  The travel error of the X stage 5 is detected, the coordinates of the drawing data supplied to the DMD drive circuit 27 of each light beam irradiation device 20 are corrected based on the detection result of the travel error of the X stage 5, and the drawing data of the corrected coordinates Are supplied to the DMD drive circuit 27 of each light beam irradiation device 20, so that even if a running error such as rolling or yawing occurs in the X stage 5, the pattern is drawn with high accuracy.

  15 to 18 are diagrams for explaining scanning of the substrate by the light beam. 15 to 18 show an example in which the entire substrate 1 is scanned by performing four scans in the X direction of the substrate 1 with eight light beams from the eight light beam irradiation apparatuses 20. 15-18, the head part 20a of each light beam irradiation apparatus 20 is shown with the broken line. The light beam emitted from the head unit 20a of each light beam irradiation device 20 has a bandwidth W in the Y direction, and the substrate 1 is scanned in the direction indicated by the arrow by the movement of the X stage 5 in the X direction.

  FIG. 15 shows the first scanning, and the pattern is drawn in the scanning area shown in gray in FIG. 15 by the first scanning in the X direction. When the first scanning is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 16 shows the second scan, and the pattern is drawn in the scan area shown in gray in FIG. 16 by the second scan in the X direction. When the second scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 17 shows the third scan, and a pattern is drawn in the scan area shown in gray in FIG. 17 by the third scan in the X direction. When the third scan is completed, the substrate 1 is moved in the Y direction by the same distance as the bandwidth W by the movement of the Y stage 7 in the Y direction. FIG. 18 shows the fourth scan. With the fourth scan in the X direction, the pattern is drawn in the scan area shown in gray in FIG. 18, and the scan of the entire substrate 1 is completed.

  Even when the substrate 1 is scanned with a plurality of light beams from the plurality of light beam irradiation apparatuses 20, patterns drawn by the light beams from the respective light beam irradiation apparatuses 20 are prevented from being shifted from each other due to a running error of the X stage 5. Therefore, the pattern can be drawn with high accuracy. Then, by scanning the substrate 1 with a plurality of light beams from the plurality of light beam irradiation devices 20 in parallel, it is possible to shorten the time required for scanning the entire substrate 1 and to shorten the tact time. it can.

  15 to 18 show an example in which the substrate 1 is scanned four times by scanning the substrate 1 in the X direction. However, the number of scans is not limited to this, and the substrate 1 is scanned in the X direction. May be performed 3 times or less or 5 times or more to scan the entire substrate 1.

  According to the embodiment described above, before the substrate 1 is transferred to the chuck 10, the substrate 1 is mounted on the temperature adjustment device 50 to adjust the temperature of the substrate 1, and the substrate is moved to the temperature adjustment device 50 in the θ direction. A rotating mechanism 80 that rotates is provided to detect the tilt of the substrate 1 mounted on the temperature adjustment device 50 in the θ direction, and based on the detection result, before the substrate 1 is transferred from the temperature adjustment device 50 to the chuck 10, the substrate 1 Is rotated in the opposite direction by the inclination of the θ direction to correct the inclination of the substrate 1 in the θ direction, so that the detection of the position of the chuck 10 by the laser length measurement system is not interrupted and the substrate 1 is moved relative to the chuck 10. Thus, the chuck 10 can be mounted in a posture without rotation in the θ direction. Accordingly, it is not necessary to perform the parallel alignment work of the chuck 10 every time the position detection of the chuck 10 by the laser length measurement system is interrupted, and the position detection error of the chuck 10 by the laser length measurement system can be made constant without variation. .

  Further, the temperature adjustment device 50 is provided with a temperature adjustment plate 51 that contacts the substrate 1 to adjust the temperature of the substrate 1 and a plurality of push-up pins 60 that lift the substrate 1 from the temperature adjustment plate 51. The plurality of push-up pins 60 that lift the substrate 1 are rotated in the θ direction, and the substrate 1 is rotated in the θ direction, whereby the temperature adjustment plate 51 that contacts the substrate 1 and adjusts the temperature of the substrate 1 is moved in the θ direction. The inclination of the substrate 1 in the θ direction can be corrected with a simple configuration without rotating.

  Furthermore, the edge of one side of the rectangular substrate 1 mounted vertically on the temperature control device 50 is detected at a plurality of locations by a plurality of substrate edge detection sensors, and the θ direction of the substrate 1 mounted on the temperature control device 50 is detected. The edge of one side of the rectangular substrate 1 mounted horizontally on the temperature adjustment device 50 is detected at a plurality of locations by another plurality of substrate edge detection sensors, and is mounted on the temperature adjustment device 50. By detecting the inclination of the substrate 1 in the θ direction, it is possible to cope with both the case where the rectangular substrate 1 is mounted vertically on the chuck 10 and the case where it is mounted horizontally.

  In the embodiment described above, an example of an exposure apparatus that draws a pattern on a substrate has been shown. However, the present invention is also applicable to a proximity exposure apparatus that detects the position of a chuck using a laser length measurement system. be able to.

  By performing exposure of the substrate using the exposure apparatus of the present invention or the substrate transport method of the exposure apparatus, it is not necessary to perform the chucking parallel operation every time the position detection of the chuck by the laser length measurement system is interrupted. Since the position detection error of the chuck by the length measurement system can be made constant without variation, a high-quality display panel substrate can be manufactured with a short tact time.

  For example, FIG. 19 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photoresist is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), a pattern is formed on the photoresist film using an exposure apparatus. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 20 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a printing method or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 19, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 20, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the exposure apparatus of the present invention or the substrate transport method of the exposure apparatus can be applied.

DESCRIPTION OF SYMBOLS 1 Board | substrate 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Stage drive circuit 10 Chuck 11 Gate 20 Light beam irradiation apparatus 20a Head part 21 Laser light source unit 22 Optical fiber 23 Lens 24 Mirror 25 DMD (Digital Micromirror) Device)
26 Projection Lens 27 DMD Drive Circuit 31, 33 Linear Scale 32, 34 Encoder 35 Substrate Transport Robot 40 Laser Length Control System 41 Laser Light Source 42, 44 Laser Interferometer 43, 45 Bar Mirror 46 Travel Error Detection Circuit 47, 48 CCD Camera 49 Image Processing Device 50 Temperature Control Device 51 Temperature Control Plate 52 Leg 53 Fixed Base 54 Lifting Guide 55 Lifting Base 56, 58 Bar 57 Rotating Base 60 Pushing Pin 61 Motor 62a, 62b Pulley 63 Belt 64a Ball Screw 64b Nut 65 Roller Bearing 67a, 68a Substrate edge detection sensor (light emitting unit)
67b, 68b Substrate edge detection sensor (light receiving part)
69 Inclination Detection Device 70 Main Control Device 71 Drawing Control Unit 72 Memory 73 Bandwidth Setting Unit 74 Center Point Coordinate Determination Unit 75 Coordinate Determination Unit 80 Rotating Mechanism 81 Guide 82 Motor 83 Shaft Coupling 84a Ball Screw 84b Nut 85 Bearing 86 Moving Block 87 , 88 bolt 89 tension coil spring

Claims (8)

In an exposure apparatus comprising a chuck that supports a substrate, a stage that moves the chuck, and a laser length measurement system that detects the position of the chuck,
A temperature adjusting device for adjusting the temperature of the substrate by mounting the substrate before transferring the substrate to the chuck;
Detecting means for detecting the inclination in the θ direction of the substrate mounted on the temperature control device;
Substrate transport means for transporting the substrate from the temperature control device to the chuck,
The temperature adjustment device has a rotation mechanism for rotating the substrate in the θ direction, and based on the detection result of the detection means, before the substrate transfer means transfers the substrate from the temperature adjustment device to the chuck, An exposure apparatus that rotates in the opposite direction by the inclination in the θ direction to correct the inclination in the θ direction of the substrate. The temperature adjustment device has a temperature adjustment plate that contacts the substrate and adjusts the temperature of the substrate, and a plurality of push-up pins that lift the substrate from the temperature adjustment plate,
The exposure apparatus according to claim 1, wherein the rotation mechanism rotates a plurality of push-up pins that lift the substrate in the θ direction to rotate the substrate in the θ direction. The detection means, a plurality of sensors for detecting the edge of one side of a rectangular substrate mounted vertically in the temperature control device, a plurality of locations,
The exposure apparatus according to claim 1, further comprising: a plurality of sensors that detect edges of one side of a rectangular substrate mounted horizontally on the temperature control device. A substrate transport method of an exposure apparatus comprising a chuck for supporting a substrate, a stage for moving the chuck, and a laser length measurement system for detecting the position of the chuck,
Before transporting the substrate to the chuck, the substrate is mounted on a temperature control device to adjust the temperature of the substrate,
The temperature control device is provided with a rotation mechanism that rotates the substrate in the θ direction,
Detect the inclination of θ direction of the board mounted on the temperature control device,
An exposure apparatus characterized in that, based on the detection result, before the substrate is transported from the temperature control device to the chuck, the substrate is rotated in the opposite direction by the inclination in the θ direction to correct the inclination in the θ direction of the substrate. Substrate transport method. The temperature adjustment device is provided with a temperature adjustment plate that contacts the substrate and adjusts the temperature of the substrate, and a plurality of push-up pins that lift the substrate from the temperature adjustment plate,
5. The method of transporting a substrate in an exposure apparatus according to claim 4, wherein the rotating mechanism rotates the plurality of push-up pins lifting the substrate in the θ direction to rotate the substrate in the θ direction. The edge of one side of the rectangular board mounted vertically on the temperature controller is detected at multiple locations by multiple sensors, and the inclination of the θ direction of the board mounted on the temperature controller is detected.
Detecting the edge of one side of a rectangular board mounted horizontally on the temperature control device at multiple locations using different sensors to detect the tilt of the board mounted on the temperature control device in the θ direction. 6. A method for transporting a substrate of an exposure apparatus according to claim 4, wherein the substrate is transported.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to any one of claims 1 to 3.   A method for manufacturing a display panel substrate, wherein the substrate is transferred to a chuck using the substrate transfer method of the exposure apparatus according to claim 4, and the substrate is exposed.

Images