JP5687165B2 - Proximity exposure apparatus, substrate positioning method for proximity exposure apparatus, and display panel substrate manufacturing method - Google Patents

Description

  The present invention relates to a proximity exposure apparatus that exposes a substrate using a proximity method in manufacturing a display panel substrate such as a liquid crystal display device, a substrate positioning method of the proximity exposure apparatus, and a display panel using the same. In particular, a proximity exposure apparatus for positioning a substrate during exposure by moving a chuck that supports the substrate in the XY direction and rotating in the θ direction by a moving stage, and a substrate positioning method for the proximity exposure apparatus, And a method of manufacturing a display panel substrate using them.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  In recent years, in the manufacture of various substrates for display panels, a relatively large substrate is prepared in order to cope with an increase in size and a variety of sizes, and one or a plurality of substrates can be selected from one substrate depending on the size of the display panel. Manufactures display panel substrates. In this case, in the proximity method, if one surface of the substrate is to be exposed all at once, a mask having the same size as the substrate is required, which further increases the cost of the expensive mask. Therefore, a method in which a mask that is relatively smaller than the substrate is used, the substrate is moved stepwise in the XY directions by a moving stage, and one surface of the substrate is divided into a plurality of shots for exposure.

  In the proximity exposure apparatus, in order to perform pattern printing with high accuracy, the substrate must be positioned accurately during exposure. The moving stage for positioning the substrate includes an X stage that moves in the X direction, a Y stage that moves in the Y direction, and a θ stage that rotates in the θ direction. And rotate in the θ direction. In Patent Document 1 and Patent Document 2, the position of the moving stage in the XY direction is detected using a laser length measurement system when positioning the substrate, and the tilt of the chuck in the θ direction is detected using a plurality of laser displacement meters. A technique for detecting the above is disclosed.

JP 2008-298906 A JP 2009-31639 A

  In the techniques described in Patent Document 1 and Patent Document 2, a bar mirror is attached to the chuck, and the displacement of the bar mirror is measured at a plurality of locations by a plurality of laser displacement meters provided on the X stage to detect the inclination of the chuck in the θ direction. doing. For this reason, a dedicated bar mirror is required. However, since this bar mirror needs to be processed to a flat surface with high accuracy, it is very expensive and expensive.

  In the techniques described in Patent Document 1 and Patent Document 2, since the laser displacement meter is provided on the X stage, the position of the bar mirror changes with respect to the laser displacement meter when the chuck is moved in the Y direction by the Y stage. . For this reason, the measurement result may include an error due to the flatness of the bar mirror.

  On the other hand, when a plurality of laser displacement meters are provided on the Y stage and the plurality of laser displacement meters are moved in the XY direction together with the chuck, the displacement of the chuck measured by each laser displacement meter is not changed by the movement of the chuck. However, even in this case, when the Y stage is moved, a large amount of heat is generated by the sliding resistance in the guide on which the Y stage is mounted, and the heat is transmitted to the Y stage, causing distortion due to thermal deformation in the Y stage. The installation state of each laser displacement meter provided on the stage may change, and an error may occur in the measurement result of the chuck displacement. On the other hand, instead of providing a plurality of laser displacement meters on the Y stage, if a plurality of laser displacement meters are provided on the chuck and a bar mirror is attached to the Y stage, when the Y stage is distorted by thermal deformation, As a result, the bar mirror is displaced in the θ direction, and the tilt of the chuck in the θ direction may not be detected accurately.

  As described in Patent Document 1 and Patent Document 2, when detecting the tilt of the chuck in the θ direction using a plurality of laser displacement meters, the more the plurality of laser displacement meters are installed, the more the chuck θ The inclination of the direction can be detected with high accuracy. However, the output characteristics of the laser displacement meter are poor in linearity, and the measurement error increases when the measurement range is expanded. In the techniques described in Patent Document 1 and Patent Document 2, when the chuck is moved in the Y direction by the Y stage while the chuck is tilted in the θ direction, the distance from each laser displacement meter to the bar mirror fluctuates. If the laser displacement meter is installed further apart, the measurement range of the laser displacement meter may be widened and the measurement error may be increased.

  Furthermore, the output characteristics of the laser displacement meter vary depending on the installation state, and the linearity differs with respect to a minute angle change of the object to be measured. Therefore, as described in Patent Document 1 and Patent Document 2, when the inclination of the chuck in the θ direction is detected using a plurality of laser displacement meters, the measured value of each laser displacement meter depends on the angle of the chuck. There is a possibility that the fluctuation value is included and the inclination of the chuck in the θ direction cannot be detected with high accuracy.

  An object of the present invention is to accurately detect the inclination of the chuck in the θ direction and accurately position the substrate in the θ direction with an inexpensive configuration. Another object of the present invention is to produce a high-quality display panel substrate by performing pattern printing with high accuracy.

  The proximity exposure apparatus of the present invention includes a chuck that supports a substrate and a mask holder that holds the mask, and provides a minute gap between the mask and the substrate to transfer the mask pattern to the substrate. In the exposure apparatus, the first stage that moves in the X direction (or Y direction), the second stage that is mounted on the first stage and moves in the Y direction (or X direction), and the second stage that is mounted on the second stage A moving stage for positioning the substrate supported by the chuck, a light source for generating laser light, and a first stage attached to the first stage. Reflection means, second reflection means attached to the second stage, and first for measuring interference between the laser light from the light source and the laser light reflected by the first reflection means. Laser interferometer, laser length measuring system having second laser interferometer for measuring interference between laser beam from light source and laser beam reflected by second reflecting means, first laser interferometer and first laser interferometer From the measurement result of the laser interferometer of No. 2, the first detection means for detecting the position in the XY direction of the moving stage and the position for detecting the positional deviation in the θ direction of the second reflection means attached to the second stage Deviation detection means, a plurality of optical displacement meters for measuring the distance to the second reflection means provided on the chuck and attached to the second stage at a plurality of locations, and a second detected by the deviation detection means Second detection means for detecting the inclination of the chuck in the θ direction from the measurement results of the plurality of optical displacement meters based on the positional deviation of the reflection means in the θ direction, a stage drive circuit for driving the moving stage, Based on the detection result of the second detection means, the stage drive circuit is controlled, the chuck is rotated in the θ direction by the third stage, the substrate is positioned in the θ direction, and the detection result of the first detection means is obtained. And a control means for controlling the stage driving circuit and moving the chuck in the XY directions by the first stage and the second stage to position the substrate in the XY directions.

  The proximity exposure apparatus of the present invention includes a substrate positioning method comprising a chuck for supporting a substrate and a mask holder for holding the mask, and providing a minute gap between the mask and the substrate to form a mask pattern. A method for positioning a substrate of a proximity exposure apparatus that transfers to a substrate, the first stage moving in the X direction (or Y direction), and the second stage mounted on the first stage and moving in the Y direction (or X direction). A chuck is mounted on a moving stage having a third stage that is mounted on the second stage and that is mounted on the second stage and that rotates in the θ direction, and a first reflecting means is attached to the first stage, and a first laser interferometer is used. The interference between the laser light from the light source and the laser light reflected by the first reflecting means is measured, the second reflecting means is attached to the second stage, and the second laser The interferometer measures the interference between the laser light from the light source and the laser light reflected by the second reflecting means, and detects the positional deviation in the θ direction of the second reflecting means attached to the second stage, The chuck is provided with a plurality of optical displacement meters, and the plurality of optical displacement meters are used to measure the distance to the second reflecting means attached to the second stage at a plurality of locations, and in the θ direction of the second reflecting means. Based on the detection result of the positional deviation, the inclination of the chuck in the θ direction is detected from the measurement results of the plurality of optical displacement meters, and on the basis of the detection result, the chuck is rotated in the θ direction by the third stage. Positioning in the θ direction is performed, and the position in the XY direction of the moving stage is detected from the measurement results of the first laser interferometer and the second laser interferometer. Based on the detection result, the first stage and the second stage By The move in XY directions, and performs positioning of the XY direction of the substrate.

  The chuck is provided with a plurality of optical displacement meters, and the plurality of optical displacement meters are used to measure the distance to the second reflecting means attached to the second stage at a plurality of locations. The measurement results of the plurality of optical displacement meters Since the inclination of the chuck in the θ direction is detected, the second reflecting means attached to the second stage detects the position of the moving stage using the second laser interferometer and a plurality of optical displacement meters. This is also used for detecting the inclination of the chuck in the θ direction and does not require a dedicated reflecting means (bar mirror) for detecting the inclination of the chuck in the θ direction. Even when the chuck is moved in the X and Y directions by the moving stage, the optical displacement meter always performs the measurement on the same portion of the second reflecting means, so that there is no measurement error due to the flatness of the second reflecting means. . Further, the positional deviation in the θ direction of the second reflecting means attached to the second stage is detected, and the measurement results of a plurality of optical displacement meters are based on the detection result of the positional deviation in the θ direction of the second reflecting means. Since the inclination of the chuck in the θ direction is detected, when the distortion due to thermal deformation occurs in the second stage, the installation state of the second reflecting means changes, and the position of the θ direction in the second reflecting means changes. Even if a deviation occurs, the inclination of the chuck in the θ direction can be accurately detected. In addition, even if the chuck is tilted in the θ direction and the chuck is moved in the XY direction by the moving stage, the distance from the optical displacement meter to the second reflecting means does not fluctuate and the measurement range does not widen. A plurality of optical displacement meters can be installed further apart. Therefore, the tilt in the θ direction of the chuck is detected with high accuracy and the positioning of the substrate in the θ direction is performed with high accuracy.

  Furthermore, in the proximity exposure apparatus of the present invention, the second reflecting means attached to the second stage has a plurality of misalignment detection marks on the surface, and the misalignment detecting means is the second reflecting means. A plurality of image acquisition devices that acquire images of a plurality of misregistration detection marks, and processing the images of the misregistration detection marks acquired by the respective image acquisition devices to detect the position of each misregistration detection mark And detecting a positional deviation in the θ direction of the second reflecting means from the position of each positional deviation detection mark detected by the image processing apparatus.

  In the substrate exposure method of the proximity exposure apparatus of the present invention, a plurality of misalignment detection marks are provided on the surface of the second reflecting means attached to the second stage, and a plurality of positions of the second reflecting means are provided. The image of the displacement detection mark is acquired, the acquired image of each displacement detection mark is processed, the position of each displacement detection mark is detected, and the position of each detected displacement detection mark is The position deviation in the θ direction of the reflecting means 2 is detected.

  A plurality of misregistration detection marks are provided on the surface of the second reflecting means attached to the second stage, images of the misregistration detection marks of the second reflecting means are acquired, and each acquired misregistration is acquired. Since the image of the detection mark is processed to detect the position of each misregistration detection mark, the misregistration in the θ direction of the second reflecting means is detected from the detected position of each misregistration detection mark. By the image processing of each misregistration detection mark, misalignment in the θ direction of the second reflecting means is detected with high accuracy.

  Alternatively, in the proximity exposure apparatus according to the present invention, the laser length measurement system includes a plurality of second laser interferometers, and the positional deviation detection means uses the second laser interferometer based on the measurement results of the second laser interferometer. It detects the positional deviation in the θ direction of the second reflecting means attached to the stage. In the proximity exposure apparatus of the present invention, the substrate positioning method measures the interference between the laser light from the light source and the laser light reflected by the second reflecting means at a plurality of locations by the plurality of second laser interferometers. Then, from the measurement results of the plurality of second laser interferometers, the positional deviation in the θ direction of the second reflecting means attached to the second stage is detected. By using a second laser interferometer for detecting the position of the moving stage in the Y direction (or X direction), it is possible to detect the positional deviation in the θ direction of the second reflecting means.

  Furthermore, in the proximity exposure apparatus of the present invention, the plurality of optical displacement meters irradiate the reference reflection surface and the object to be measured with light of a wide wavelength band, and the reflected light from the reference reflection surface and the reflection from the object to be measured. This is a spectral interference laser displacement meter that measures the distance to an object to be measured from the wavelength and intensity of interference light with light. Further, the substrate positioning method of the proximity exposure apparatus according to the present invention, as an optical displacement meter, irradiates the reference reflecting surface and the object to be measured with light in a wide wavelength band, and reflects the reflected light from the reference reflecting surface and the object to be measured. A spectral interference laser displacement meter is used to measure the distance to the object to be measured from the wavelength and intensity of the interference light with the reflected light.

  The spectral interference laser displacement meter is less accurate than the laser displacement meter used in the techniques described in Patent Document 1 and Patent Document 2, but has a small change in output characteristics due to a minute angle change of the object to be measured. The measurement range is narrow. In the present invention, unlike the techniques described in Patent Document 1 and Patent Document 2, even if the chuck is tilted in the θ direction and the chuck is moved in the XY direction by the moving stage, the second reflection from the optical displacement meter. Since the distance to the means does not vary, a highly accurate spectral interference laser displacement meter with a narrow measurement range can be used as the optical displacement meter, and the inclination of the chuck in the θ direction can be detected with higher accuracy.

  The method for producing a display panel substrate according to the present invention exposes a substrate using any one of the above-described proximity exposure apparatuses or uses the substrate positioning method of any one of the above-described proximity exposure apparatuses to form a substrate. Positioning is performed to expose the substrate. Since the positioning of the substrate in the θ direction at the time of exposure is performed with high accuracy, pattern printing is performed with high accuracy, and a high-quality display panel substrate is manufactured.

  According to the proximity exposure apparatus and the substrate positioning method of the proximity exposure apparatus of the present invention, the second reflecting means is attached to the second stage, and the laser beam from the light source and the second laser interferometer are attached to the second stage. The interference with the laser beam reflected by the reflecting means is measured, the position of the moving stage in the Y direction (or X direction) is detected from the measurement result, and the θ direction of the second reflecting means attached to the second stage And the chuck is provided with a plurality of optical displacement meters, and the plurality of optical displacement meters are used to measure the distance to the second reflecting means attached to the second stage at a plurality of locations. By detecting the inclination of the chuck in the θ direction from the measurement results of a plurality of optical displacement meters based on the detection result of the positional deviation of the reflecting means in the θ direction, the inclination of the chuck in the θ direction can be reduced with an inexpensive configuration. Spirit May detect and, the positioning of the θ direction of the substrate can be accurately performed.

  Furthermore, according to the proximity exposure apparatus and the substrate positioning method of the proximity exposure apparatus of the present invention, a plurality of misregistration detection marks are provided on the surface of the second reflecting means attached to the second stage, A plurality of misregistration detection mark images of the reflecting means are acquired, the obtained misregistration detection mark images are processed, the positions of the misregistration detection marks are detected, and the detected misregistrations are detected. By detecting the positional deviation in the θ direction of the second reflecting means from the position of the mark for detection, the positional deviation in the θ direction of the second reflecting means is accurately detected by image processing of each positional deviation detecting mark. be able to.

  Alternatively, according to the proximity exposure apparatus and the substrate positioning method of the proximity exposure apparatus of the present invention, the laser light from the light source and the laser light reflected by the second reflecting means by the plurality of second laser interferometers Of the moving stage by detecting the positional deviation in the θ direction of the second reflecting means attached to the second stage from the measurement results of the plurality of second laser interferometers. Using the second laser interferometer for detecting the position in the direction (or the X direction), it is possible to detect the positional deviation in the θ direction of the second reflecting means.

  Furthermore, according to the proximity exposure apparatus and the substrate positioning method of the proximity exposure apparatus according to the present invention, the tilt of the chuck in the θ direction can be detected with higher accuracy by using a spectral interference laser displacement meter as the optical displacement meter. be able to.

  According to the display panel substrate manufacturing method of the present invention, the substrate can be accurately positioned in the θ direction at the time of exposure. Therefore, a high-quality display panel substrate is manufactured by performing pattern printing with high accuracy. can do.

It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. It is a top view which shows the state which the chuck | zipper 10a exists in an exposure position, and the chuck | zipper 10b exists in a load / unload position. It is a partial cross section side view showing the state where chuck 10a is in an exposure position and chuck 10b is in a load / unload position. It is a top view which shows the state which the chuck | zipper 10b exists in an exposure position, and the chuck | zipper 10a exists in a load / unload position. It is a partial cross section side view showing the state where chuck 10b is in an exposure position and chuck 10a is in a load / unload position. It is a top view of the movement stage on a main stage base. It is a partial cross section side view of the X direction of the movement stage on a main stage base. It is a side view of the moving stage on the main stage base in the Y direction. It is a figure explaining operation | movement of a laser length measurement system. It is a figure explaining operation | movement of a laser length measurement system. 11A is a top view of the spectral interference laser displacement meter, and FIG. 11B is a side view of the spectral interference laser displacement meter. It is a flowchart which shows the substrate positioning method of the proximity exposure apparatus by one embodiment of this invention. It is a top view which shows the state which moved the movement stage to the position which detects the position shift of a bar mirror. FIG. 14A is a view showing an example of an exposure area of each shot when bar mirror positional deviation management is not performed, and FIG. 14B is an exposure of each shot when bar mirror positional deviation management is performed according to the present invention. It is a figure which shows an example of an area | region. It is a figure explaining operation | movement of the conventional laser displacement meter. It is a figure explaining operation | movement of the conventional laser displacement meter. It is a figure explaining operation | movement of the conventional laser displacement meter. It is a figure explaining operation | movement of a spectral interference laser displacement meter. It is a figure explaining operation | movement of a spectral interference laser displacement meter. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. This embodiment shows an example of a proximity exposure apparatus having a plurality of chucks. The proximity exposure apparatus includes a plurality of chucks 10a and 10b, a main stage base 11, a plurality of sub-stage bases 11a and 11b, a table 12, an X guide 13, a plurality of moving stages, a mask holder 20, and a laser length measurement system controller 30. , Laser measurement system, laser displacement meter control device 40, spectral interference laser displacement meter 41, image processing device 60, multiple cameras 61, main control device 70, input / output interface circuits 71 and 72, and stage drive circuits 80a and 80b It is comprised including. In addition to these, the proximity exposure apparatus carries a substrate 1 into the chuck 10 and also carries a substrate transport robot that unloads the substrate 1 from the chuck 10, an irradiation optical system that irradiates exposure light, and a temperature at which temperature management in the apparatus is performed. A control unit is provided.

  In this embodiment, two chucks, sub-stage bases, moving stages, and stage drive circuits are provided, but one or three or more of these may be provided. Further, the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  In FIG. 1, a mask holder 20 that holds a mask 2 is installed above an exposure position where the substrate 1 is exposed. The mask holder 20 is provided with an opening 20a through which exposure light passes, and the mask 2 is mounted below the opening 20a. A suction groove is provided around the opening 20a on the lower surface of the mask holder 20, and the mask holder 20 holds the peripheral portion of the mask 2 by vacuum suction using the suction groove. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. The surface of the substrate 1 is coated with a photosensitive resin material (photoresist). During exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate 1, whereby the pattern of the mask 2. Is transferred to the surface of the substrate 1, and a pattern is formed on the substrate 1.

  A main stage base 11 is disposed below the mask holder 20. Sub-stage bases 11 a and 11 b are arranged on the left and right sides of the main stage base 11 so as to be adjacent to the main stage base 11 in the X direction. A base 12 is attached in the Y direction of the main stage base 11. The chuck 10a is moved between a load / unload position on the substage base 11a and an exposure position on the main stage base 11 by a moving stage described later. Further, the chuck 10b is moved between a load / unload position on the sub-stage base 11b and an exposure position on the main stage base 11 by a moving stage described later.

  The substrate 1 is loaded into the chucks 10a and 10b and unloaded from the chucks 10a and 10b by a substrate transfer robot (not shown) at the load / unload positions on the sub-stage bases 11a and 11b. The loading of the substrate 1 onto the chucks 10a and 10b and the unloading of the substrate 1 from the chucks 10a and 10b are performed using a plurality of push-up pins provided on the chucks 10a and 10b. The push-up pins are accommodated in the chucks 10a and 10b. When the substrate 1 is loaded onto the chucks 10a and 10b by ascending from the chucks 10a and 10b, the substrate 1 is received from the substrate transfer robot. Is unloaded from the chucks 10a and 10b, the substrate 1 is delivered to the substrate transfer robot. The chucks 10a and 10b support the substrate 1 by vacuum suction.

  FIG. 2 is a top view showing a state in which the chuck 10a is in the exposure position and the chuck 10b is in the load / unload position. FIG. 3 is a partial cross-sectional side view showing a state where the chuck 10a is at the exposure position and the chuck 10b is at the load / unload position. In FIG. 2, an X guide 13 extending in the X direction from the main stage base 11 to the sub stage bases 11a and 11b is provided on the main stage base 11 and the sub stage bases 11a and 11b.

  In FIG. 3, chucks 10a and 10b are each mounted on a moving stage. Each moving stage includes an X stage 14, a Y guide 15, a Y stage 16, a θ stage 17, and a chuck support 19. The X stage 14 is mounted on the X guide 13 and moves in the X direction along the X guide 13. The Y stage 16 is mounted on a Y guide 15 provided on the X stage 14, and moves along the Y guide 15 in the Y direction (the drawing depth direction in FIG. 3). The θ stage 17 is mounted on the Y stage 16 and rotates in the θ direction. The chuck support 19 is mounted on the θ stage 17 and supports the chucks 10a and 10b at a plurality of locations.

  Due to the movement of each moving stage in the X direction of the X stage 14, the chuck 10a is moved between the load / unload position on the substage base 11a and the exposure position on the main stage base 11, and the chuck 10b is It is moved between a load / unload position on the substage base 11b and an exposure position on the main stage base 11. FIG. 4 is a top view showing a state where the chuck 10b is at the exposure position and the chuck 10a is at the load / unload position. FIG. 5 is a partial cross-sectional side view showing a state where the chuck 10b is at the exposure position and the chuck 10a is at the load / unload position. At the loading / unloading positions on the sub-stage bases 11a and 11b, each moving stage is moved in the X direction by the X stage 14, the Y stage 16 is moved in the Y direction, and the θ stage 17 is rotated in the θ direction. Then, pre-alignment of the substrate 1 mounted on the chucks 10a and 10b is performed.

  At the exposure position on the main stage base 11, the movement of the X stage 14 in the X direction and the movement of the Y stage 16 in the Y direction of each moving stage causes the substrate 1 held on the chucks 10a and 10b to move in the XY direction. Step movement is performed. Further, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction (vertical direction in FIGS. 3 and 5) by a Z-tilt mechanism (not shown). Then, the substrate 1 is positioned during exposure by the movement of the X stage 14 in the X direction, the movement of the Y stage 16 in the Y direction, and the rotation of the θ stage 17 in the θ direction.

  The X stage 14, Y stage 16, and θ stage 17 of each moving stage are provided with a drive mechanism (not shown) such as a ball screw, a motor, and a linear motor. In FIG. 1, the stage drive circuit 80 a drives the X stage 14, the Y stage 16, and the θ stage 17 as moving stages on which the chuck 10 a is mounted under the control of the main controller 70. The stage drive circuit 80 b drives the X stage 14, the Y stage 16, and the θ stage 17 as moving stages on which the chuck 10 b is mounted under the control of the main controller 70.

  In the present embodiment, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction. However, each moving stage is provided with a Z-tilt mechanism and a chuck. The gap between the mask 2 and the substrate 1 may be adjusted by moving and tilting 10a and 10b in the Z direction.

  Hereinafter, the substrate positioning operation of the proximity exposure apparatus of the present embodiment will be described. In FIG. 1, the laser length measurement system includes a laser light source 31, laser interferometers 32a, 32b, and 33, bar mirrors 34a and 34b, which will be described later, and a bar mirror 35. In the present embodiment, the position of the moving stage on which the chuck 10a is mounted is detected using the laser interferometer 32a, and the position of the moving stage on which the chuck 10b is mounted is detected using the laser interferometer 32b. Is detected. Further, the position of each moving stage on the main stage base 11 in the Y direction is detected using two laser interferometers 33.

  FIG. 6 is a top view of the moving stage on the main stage base. FIG. 7 is a partial sectional side view in the X direction of the moving stage on the main stage base. FIG. 8 is a side view of the moving stage on the main stage base in the Y direction. 6 to 8 show a moving stage on which the chuck 10a is mounted, and the moving stage on which the chuck 10b is mounted has a symmetrical configuration in the X direction with respect to the moving stage on which the chuck 10a is mounted. In FIG. 7, the X guide 13 is omitted, and in FIG. 8, the laser interferometers 32a and 32b are omitted.

  In FIG. 8, since the X stage 14 of the moving stage is mounted on the X guide 13, the height of the X guide 13 is set between the main stage base 11 and the substage bases 11 a and 11 b and the X stage 14. Space is generated. The bar mirror 34a of the laser measuring system is attached under the X stage 14 using this space. The same applies to the bar mirror 34b. As shown in FIG. 1, the laser interferometer 32 a is installed at a position away from the X guide 13 of the main stage base 11. The same applies to the laser interferometer 32b.

  6 to 8, the bar mirror 35 is attached to the Y stage 16 by an arm 36 at a height of about the chuck 10a. Similarly, for the moving stage on which the chuck 10b is mounted, the bar mirror 35 is attached to the Y stage 16 at substantially the height of the chuck 10b. As shown in FIGS. 6 and 8, the two laser interferometers 33 are installed on a table 12 attached to the main stage base 11 in the Y direction.

  9 and 10 are diagrams for explaining the operation of the laser length measurement system. 9 shows a state where the chuck 10a is at the exposure position and the chuck 10b is at the load / unload position. FIG. 10 shows the chuck 10b at the exposure position and the chuck 10a is at the load / unload position. Indicates the state.

  9 and 10, the laser interferometer 32a irradiates the laser beam from the laser light source 31 onto the bar mirror 34a, receives the laser beam reflected by the bar mirror 34a, and the laser beam from the laser light source 31 and the bar mirror 34a. The interference with the laser beam reflected by is measured. In FIG. 1, the laser length measurement system control device 30 detects the position in the X direction of the moving stage on which the chuck 10 a is mounted from the measurement result of the laser interferometer 32 a under the control of the main control device 70. The main controller 70 inputs the detection result of the laser measurement system controller 30 via the input / output interface circuit 71.

  9 and 10, the laser interferometer 32b irradiates the laser beam from the laser light source 31 onto the bar mirror 34b, receives the laser beam reflected by the bar mirror 34b, and receives the laser beam from the laser light source 31 and the bar mirror 34b. The interference with the laser beam reflected by is measured. In FIG. 1, the laser length measurement system control device 30 detects the position in the X direction of the moving stage on which the chuck 10 b is mounted from the measurement result of the laser interferometer 32 b under the control of the main control device 70. The main controller 70 inputs the detection result of the laser measurement system controller 30 via the input / output interface circuit 71.

  Since the laser measuring system bar mirrors 34a and 34b are attached under the X stage 14 of each moving stage, and the laser interferometers 32a and 32b are installed at positions away from the X guide 13 of the main stage base 11, each moving stage is When the substage bases 11a and 11b and the main stage base 11 are moved, they do not collide with the laser interferometers 32a and 32b. Since the laser interferometers 32a and 32b are installed on the main stage base 11, the laser interferometers 32a and 32b are not affected by the vibration of the substage bases 11a and 11b. Further, the measurement distance from the laser interferometers 32a and 32b to each moving stage on the main stage base 11 is shortened. Therefore, the position of each moving stage in the X direction is detected with high accuracy.

  9 and 10, the two laser interferometers 33 irradiate the laser beam from the laser light source 31 onto the bar mirror 35, receive the laser beam reflected by the bar mirror 35, and the laser beam from the laser light source 31. Interference with the laser beam reflected by the bar mirror 35 is measured at two locations. In FIG. 1, the laser length measurement system control device 30 detects the position in the Y direction of each moving stage on the main stage base 11 from the measurement results of the two laser interferometers 33 under the control of the main control device 70. Further, yawing is detected when the X stage 14 and the Y stage 16 of each moving stage move in the XY direction on the main stage base 11.

  Since each laser interferometer 33 is installed on the stage 12 attached to the main stage base 11 in the Y direction, each laser interferometer 33 is not affected by the vibration of the substage bases 11a and 11b. Further, the measurement distance from each laser interferometer 33 to each moving stage on the main stage base 11 is shortened. Therefore, the position of each moving stage on the main stage base 11 in the Y direction is detected with high accuracy using each laser interferometer 33. Further, each bar mirror 35 of the laser length measurement system is attached to the height of the chucks 10a and 10b mounted on each moving stage, so that the position of each moving stage in the Y direction is detected in the vicinity of the substrate 1. Then, using the bar mirror 35 attached to the Y stage 16, it is possible to detect yawing when the moving stage moves.

  In FIG. 1, chucks 10a and 10b are provided with two spectral interference laser displacement meters 41, respectively. 11A is a top view of the spectral interference laser displacement meter, and FIG. 11B is a side view of the spectral interference laser displacement meter. As shown in FIGS. 11A and 11B, each spectral interference laser displacement meter 41 is attached to the lower surfaces of the chucks 10 a and 10 b with the attachment 50 so as to face the back surface of the bar mirror 35. The spectral interference laser displacement meter 41 used in the present embodiment is an optical displacement meter that uses interference light, has a reference reflection surface at the head portion at the tip, and transmits light in a wide wavelength band to the reference reflection surface and the object to be measured. The distance to the object to be measured is measured from the wavelength and intensity of the interference light between the reflected light from the reference reflecting surface and the reflected light from the object to be measured.

  11A and 11B, the two spectral interference laser displacement meters 41 measure the distance to the back surface of the bar mirror 35 at two locations. In FIG. 1, the laser displacement meter controller 40 controls the chuck based on the measurement results of the two spectral interference laser displacement meters 41 based on the detection result of the positional deviation of the bar mirror 35 described later in the θ direction under the control of the main controller 70. The inclinations in the θ direction of 10a and 10b are detected. The main controller 70 inputs the detection result of the laser displacement meter controller 40 via the input / output interface circuit 72.

  In FIG. 6, a plurality of misregistration detection marks 37 are provided on the upper surface of the bar mirror 35 attached to the Y stage 16 of the moving stage on which the chuck 10a is mounted. The same applies to the bar mirror 35 attached to the Y stage 16 of the moving stage on which the chuck 10b is mounted. In the present embodiment, misalignment detection marks 37 are provided near both sides of the bar mirror 35 extending in the X direction. The misregistration detection mark 37 may have any shape suitable for image processing by the image processing apparatus 60 described later.

  7 and 8, a plurality of cameras 61 are installed above the main stage base 11 so as to correspond to the respective misalignment detection marks 37 on the upper surface of the bar mirror 35. In the present embodiment, two cameras 61 are provided corresponding to the respective misalignment detection marks 37 provided near both sides of the bar mirror 35 extending in the X direction. However, the numbers and positions of the misalignment detection marks 37 and the cameras 61 are not limited to the examples shown in FIGS.

  Each camera 61 is composed of, for example, a CCD camera, and is for acquiring an image of the position shift detection mark 37 on the upper surface of the bar mirror 35. Each camera 61 is fixed to a frame (not shown) provided above the mask holder 20, and is installed at the same interval as the interval 37 for detecting misalignment of the bar mirror 35.

  FIG. 12 is a flowchart showing a substrate positioning method of the proximity exposure apparatus according to the embodiment of the present invention. The substrate 1 mounted on the chuck 10a and the substrate 1 mounted on the chuck 10b are alternately processed at the exposure position. During the processing at one exposure position, the other load / unload position is processed. Processing is performed.

  First, the substrate 1 is loaded onto the chucks 10a and 10b at the load / unload position (step 301). The main controller 70 drives the X stage 14, the Y stage 16, and the θ stage 17 of each moving stage by the stage drive circuits 80 a and 80 b, and moves the chucks 10 a and 10 b in the XY directions at the respective load / unload positions. The substrate 1 is moved and rotated in the θ direction to perform pre-alignment of the substrate 1 (step 302).

  Next, the main controller 70 drives the X stage 14 of each moving stage by the stage driving circuits 80a and 80b, moves the chucks 10a and 10b to the exposure position, and detects the positional deviation of the bar mirror 35 in each moving stage. It moves to the position to perform (step 303). FIG. 13 is a top view showing a state in which the moving stage has been moved to a position for detecting the displacement of the bar mirror. When each moving stage is moved to a position for detecting the positional deviation of the bar mirror 35, each positional deviation detection mark 37 on the upper surface of the bar mirror 35 is located within the field of view of each camera 61.

  When the Y stage 16 of each moving stage is moved in the Y direction, a large amount of heat is generated by the sliding resistance in the Y guide 15 on which the Y stage 16 is mounted. When the heat is transferred to the Y stage 16 and the Y stage 16 is distorted due to thermal deformation, the installation state of the bar mirror 35 attached to the Y stage 16 changes, and the bar mirror 35 rotates slightly from the X direction. In addition, the bar mirror 35 is displaced in the θ direction. Each camera 61 acquires an image of each misregistration detection mark 37 on the upper surface of the bar mirror 35 and outputs an image signal to the image processing device 60 of FIG.

  In FIG. 1, the image processing device 60 processes the image signal of each misregistration detection mark 37 output from each camera 61 to detect the position of each misregistration detection mark 37. The detection of the position of each misregistration detection mark 37 is, for example, each position when there is no misalignment in the θ direction between the image of each misregistration detection mark 37 acquired by each camera 61 and the bar mirror 35 prepared in advance. This is performed by comparing with the image of the deviation detection mark 37. The laser displacement meter control device 40 detects the displacement in the θ direction of the bar mirror 35 from the position of each displacement detection mark 37 detected by the image processing device 60 (step 304 in FIG. 12).

  In the present embodiment, a plurality of misregistration detection marks 37 are provided on the surface of the bar mirror 35 attached to the Y stage 16, and an image of each misregistration detection mark 37 of the bar mirror 35 is acquired by a plurality of cameras 61. The acquired images of the respective misregistration detection marks 37 are processed to detect the positions of the misregistration detection marks 37, and the misalignment in the θ direction of the bar mirror 35 is detected from the detected positions of the misregistration detection marks 37. Therefore, the position shift of the bar mirror 35 in the θ direction is detected with high accuracy by the image processing of each position shift detection mark 37.

  However, the present invention is not limited to this, and a plurality of laser interferometers 33 measure the interference between the laser light from the laser light source 31 and the laser light reflected by the bar mirror 35 at a plurality of locations. From the measurement result, the positional deviation of the bar mirror 35 in the θ direction may be detected. Using the laser interferometer 33 for detecting the position of each moving stage in the Y direction, it is possible to detect the positional deviation of the bar mirror 35 in the θ direction. Alternatively, a laser interferometer for detecting the positional deviation of the bar mirror 35 in the θ direction may be provided separately from the laser interferometer 33 for detecting the position of each moving stage in the Y direction.

  In FIG. 12, next, the main controller 70 drives the X stage 14 and the Y stage 16 of each moving stage by the stage drive circuits 80a and 80b, and moves the substrate 1 to a position where the first shot of the exposure position is performed. Move (step 305). Subsequently, main controller 70 drives the Z-tilt mechanism based on the measurement result of a gap sensor (not shown) to perform gap alignment between mask 2 and substrate 1 (step 306). Next, the main controller 70 drives the X stage 14, the Y stage 16, and the θ stage 17 of each moving stage by the stage driving circuits 80 a and 80 b, and moves the chucks 10 a and 10 b in the XY directions at the exposure position. The substrate 1 is rotated in the θ direction to perform alignment (step 307).

  When the alignment of the substrate 1 (step 307) is performed, the laser displacement meter controller 40 controls the two spectral interference laser displacements based on the displacement in the θ direction of the bar mirror 35 detected in step 304 under the control of the main controller 70. From the measurement result of the total 41, the inclination of the chucks 10a and 10b in the θ direction is detected. The main controller 70 controls the stage drive circuits 80a and 80b based on the detection result of the inclination of the chucks 10a and 10b in the θ direction by the laser displacement meter controller 40, and the chucks 10a and 10b are controlled by the θ stage 17 of each moving stage. Is rotated in the θ direction to position the substrate 1 in the θ direction. The main controller 70 controls the stage drive circuits 80a and 80b based on the detection result of the position of each moving stage in the XY direction by the laser measuring system controller 30, and the X stage 14 and the Y stage of each moving stage. 16, the chucks 10a and 10b are moved in the XY directions to position the substrate 1 in the XY directions.

  FIG. 14A is a view showing an example of an exposure area of each shot when bar mirror positional deviation management is not performed, and FIG. 14B is an exposure of each shot when bar mirror positional deviation management is performed according to the present invention. It is a figure which shows an example of an area | region. FIGS. 14A and 14B show an example in which six exposure areas 1a, 1b, 1c, 1d, 1e, and 1f of the substrate 1 are exposed by dividing into six shots for each exposure area.

  When the positional deviation in the θ direction occurs in the bar mirror 35, the positional deviation management of the bar mirror 35 is not performed, and the chucks 10a and 10b are parallel to the bar mirror 35 based on the measurement results of the two spectral interference laser displacement meters 41. When the substrate 1 is positioned in the θ direction, the substrate 1 mounted on the chucks 10 a and 10 b is positioned in a state tilted in the θ direction by the amount of displacement of the bar mirror 35 in the θ direction. Therefore, as shown in FIG. 14A, the exposure regions 1a, 1b, 1c, 1d, 1e, and 1f of each shot are inclined on the substrate 1 in the θ direction.

  For example, in manufacturing a liquid crystal display device, an operation for forming a liquid crystal panel by bonding a TFT substrate and a color filter substrate is usually performed in a state where a plurality of exposure regions are exposed on the substrate 1. Therefore, as shown in FIG. 14A, when the exposure areas 1a, 1b, 1c, 1d, 1e, and 1f of each shot are inclined in the θ direction on the substrate 1, patterns formed in the respective exposure areas. There arises a problem that the position of is shifted from the position of the pattern formed in each exposure region on the TFT substrate or the color filter substrate to be bonded.

  In the present embodiment, the displacement in the θ direction of the bar mirror 35 attached to the Y stage 16 is detected, and based on the detection result of the displacement in the θ direction of the bar mirror 35, the measurement results of the plurality of spectral interference laser displacement meters 41 are used. Since the tilt of the chucks 10a and 10b in the θ direction is detected, when the Y stage 16 of each moving stage is distorted by thermal deformation, the installation state of the bar mirror 35 changes and the bar mirror 35 is displaced in the θ direction. Even if this occurs, the inclination of the chucks 10a, 10b in the θ direction is accurately detected. Therefore, as shown in FIG. 14B, the exposure areas 1a, 1b, 1c, 1d, 1e, and 1f of each shot are not inclined in the θ direction on the substrate 1, and the pattern formed in each exposure area There is no problem that the position shifts from the position of the pattern formed in each exposure region on the TFT substrate or the color filter substrate to be bonded.

  In FIG. 12, the alignment of the substrate 1 (step 307) is performed by aligning the gap between the mask 2 and the substrate 1 (step 306). Alternatively, the process may be started when the mask 2 and the substrate 1 are close to a distance that can be detected. In that case, the gap alignment between the mask 2 and the substrate 1 (step 306) and the alignment of the substrate 1 (step 307) can be partially performed in parallel, thereby reducing the tact time.

  After completing the gap alignment between the mask 2 and the substrate 1 and performing a shot (step 308), the main controller 70 determines whether all shots have been completed (step 309). When all shots have not been completed, the main controller 70 moves the Z-tilt mechanism to a retracted position where there is no fear of contact between the mask 2 and the substrate 1 and then uses the stage drive circuits 80a and 80b. By driving the X stage 14 and the Y stage 16 of each moving stage, the substrate 1 is moved stepwise in the XY direction (step 310), and the substrate 1 is moved to the position where the next shot is performed. Then, the process returns to Step 306, and Steps 306 to 310 are repeated until the shot is completed for all shots.

  When all shots are completed, the main controller 70 drives the Z-tilt mechanism to widen the gap between the mask 2 and the substrate 1, and then uses the stage drive circuits 80a and 80b to set the X stage 14 and The Y stage 16 is driven to move the chucks 10a and 10b to the load / unload position (step 311). Then, at the load / unload position, the substrate 1 is unloaded from the chucks 10a and 10b (step 312).

  15-17 is a figure explaining operation | movement of the conventional laser displacement meter. FIG. 15 shows the laser displacement meter 42 attached to the moving stage on which the chuck 10a is mounted in Patent Document 1 and Patent Document 2. A dedicated bar mirror 44 for detecting the inclination of the chuck 10a in the θ direction is attached to one side surface of the chuck 10a extending in the Y direction. The two laser displacement meters 42 are each attached to the X stage 14 at the height of the bar mirror 44 by an arm 46. The bar mirror 44 and the laser displacement meter 42 attached to the moving stage on which the chuck 10b is mounted are configured symmetrically with respect to FIG. 15 in the X direction. The laser displacement meter 42 used in the techniques described in Patent Document 1 and Patent Document 2 is an optical displacement meter that applies triangulation, and irradiates the object to be measured with laser light from a laser light source. The reflected light from the measurement object is received by a light receiving element such as a CCD sensor, and the displacement of the measurement object is measured.

  In the techniques described in Patent Document 1 and Patent Document 2, the bar mirror 44 is attached to the chucks 10 a and 10 b, and the displacement of the bar mirror 44 is measured at a plurality of locations by a plurality of laser displacement meters 42 provided on the X stage 14. The inclinations in the θ direction of 10a and 10b are detected. For this reason, a dedicated bar mirror 44 is required. However, since this bar mirror 44 needs to be processed to have a flat surface with high accuracy, it is very expensive and expensive.

  In the present embodiment, the chucks 10a and 10b are provided with a plurality of spectral interference laser displacement meters 41, and the plurality of spectral interference laser displacement meters 41 are used to measure the distance to the bar mirror 35 attached to the Y stage 16 at a plurality of locations. Since the inclinations of the chucks 10 a and 10 b in the θ direction are detected from the measurement results of the plurality of spectral interference laser displacement meters 41, the bar mirror 35 attached to the Y stage 16 detects the position of the moving stage using the laser interferometer 33. And the detection of the tilt in the θ direction of the chucks 10a and 10b using the plurality of spectral interference laser displacement meters 41, and a dedicated bar mirror for detecting the tilt in the θ direction of the chucks 10a and 10b is not necessary.

  FIG. 16 shows a state where the chuck 10a is moved in the Y direction by the Y stage 16 from the state shown in FIG. In the techniques described in Patent Document 1 and Patent Document 2, since the laser displacement meter 42 is provided on the X stage 14, when the chucks 10 a and 10 b are moved in the Y direction by the Y stage 16 during the step movement of the substrate at the exposure position. As shown in FIGS. 15 and 16, the position of the bar mirror 44 changes with respect to the laser displacement meter 42. Therefore, the measurement result may include an error due to the flatness of the bar mirror 44.

  17A shows the positional relationship between the laser displacement meter 42 and the bar mirror 44 when the chuck 10a is tilted in the θ direction in the state shown in FIG. 15, and FIG. 17B is shown in FIG. In this state, the positional relationship between the laser displacement meter 42 and the bar mirror 44 when the chuck 10a is inclined in the θ direction is shown.

  As described in Patent Document 1 and Patent Document 2, when detecting the inclination of the chucks 10a and 10b in the θ direction using a plurality of laser displacement meters 42, the plurality of laser displacement meters 42 are installed further apart. Accordingly, the inclination of the chucks 10a and 10b in the θ direction can be detected with high accuracy. However, the output characteristics of the laser displacement meter 42 are poor in linearity, and the measurement error increases when the measurement range is expanded. In the techniques described in Patent Literature 1 and Patent Literature 2, when the chucks 10a and 10b are moved in the Y direction by the Y stage 16 in a state where the chucks 10a and 10b are inclined in the θ direction, FIGS. As shown in FIG. 4, since the distance from each laser displacement meter 42 to the bar mirror 44 varies, if a plurality of laser displacement meters 42 are installed further apart, the measurement range of the laser displacement meters 42 may be expanded, resulting in an increase in measurement error. was there.

  18 and 19 are diagrams for explaining the operation of the spectral interference laser displacement meter. 18 and 19 show a state in which the substrate 1 is moved to a position where each shot is performed. In FIG. 19, the chucks 10a and 10b are moved from the state shown in FIG. 18 by the Y stage 16 of each moving stage. It has been moved in the Y direction. In the present embodiment, when the substrate 1 is moved stepwise at the exposure position, even if the chucks 10a and 10b are moved in the X and Y directions by the moving stage, as shown in FIGS. Since measurement is performed on the same portion of the bar mirror 35, measurement errors due to the flatness of the bar mirror 35 are eliminated. In addition, even if the chucks 10a and 10b are tilted in the θ direction and the chucks 10a and 10b are moved in the XY direction by the moving stage, the distance from the spectral interference laser displacement meter 41 to the bar mirror 35 does not vary, and the measurement range. Therefore, the plurality of spectral interference laser displacement meters 41 can be installed further apart.

  Furthermore, the output characteristics of the laser displacement meter 42 vary depending on the installation state, and the linearity differs with respect to a minute angle change of the object to be measured. Therefore, as described in Patent Document 1 and Patent Document 2, when the inclination of the chuck in the θ direction is detected using a plurality of laser displacement meters 42, the measured values of the chucks 10a and 10b are included in the measured values of the respective laser displacement meters. A variation value depending on the angle is included, and there is a possibility that the inclination of the chucks 10a and 10b in the θ direction cannot be detected with high accuracy.

  The spectral interference laser displacement meter 41 used in the present embodiment has an output characteristic due to a minute angle change of the object to be measured, compared with the laser displacement meter 42 used in the techniques described in Patent Document 1 and Patent Document 2. The measurement range is small, but the measurement range is narrow. In the present invention, unlike the techniques described in Patent Document 1 and Patent Document 2, even if the chucks 10a and 10b are inclined in the θ direction and the chucks 10a and 10b are moved in the XY direction by the moving stage, the spectral interference laser is used. Since the distance from the displacement meter 41 to the bar mirror 35 does not change, the spectral interference laser displacement meter 41 having a narrow measurement range and high accuracy can be used, and the inclination of the chucks 10a and 10b in the θ direction can be detected with higher accuracy. it can.

  According to the present embodiment described above, the bar mirror 35 is attached to the Y stage 16 of each moving stage, and the laser interferometer 33 causes interference between the laser light from the laser light source 31 and the laser light reflected from the bar mirror 35. Measure, detect the position in the Y direction of each moving stage from the measurement result, detect the displacement in the θ direction of the bar mirror 35 attached to the Y stage 16 of each moving stage, and apply a plurality of optical types to the chucks 10a and 10b. A displacement meter 41 is provided, and a plurality of optical displacement meters 41 are used to measure the distance to the bar mirror 35 attached to the Y stage 16 of each moving stage at a plurality of locations, and based on the detection result of the positional deviation of the bar mirror 35 in the θ direction. By detecting the inclination of the chucks 10a and 10b in the θ direction from the measurement results of the plurality of optical displacement meters 41, it is inexpensive. In adult, the chuck 10a, the direction of inclination θ of 10b to accurately detect a position of θ direction of the substrate 1 can be accurately performed.

  Further, a plurality of misregistration detection marks 37 are provided on the surface of the bar mirror 35 attached to the Y stage 16, images of the misregistration detection marks 37 of the bar mirror 35 are obtained, and the obtained misregistration detection marks are acquired. 37, the position of each misregistration detection mark 37 is detected, and the position misalignment in the θ direction of the bar mirror 35 is detected from the detected position of each misregistration detection mark 37. By the image processing of the deviation detection mark 37, the positional deviation of the bar mirror 35 in the θ direction can be detected with high accuracy.

  Alternatively, interference between the laser light from the laser light source 31 and the laser light reflected by the bar mirror 35 is measured at a plurality of locations by a plurality of laser interferometers 33, and the measurement results of the plurality of laser interferometers 33 are used to By detecting the displacement in the θ direction, it is possible to detect the displacement in the θ direction of the bar mirror 35 using the laser interferometer 33 for detecting the position in the Y direction of each moving stage.

  Furthermore, by using the spectral interference laser displacement meter 41 as the optical displacement meter, the inclination of the chucks 10a and 10b in the θ direction can be detected with higher accuracy.

  Further, interference between the laser light from the laser light source 31 and the laser light reflected by the bar mirror 35 is measured at a plurality of locations by the plurality of laser interferometers 33, and from the measurement results of the plurality of laser interferometers 33, the X stage 14 is measured. By detecting yawing when the Y stage 16 moves, yawing when the moving stage moves can be detected using the bar mirror 35 attached to the Y stage 16.

  Substrate exposure is performed using the proximity exposure apparatus of the present invention, or the substrate is positioned by using the substrate positioning method of the proximity exposure apparatus of the present invention, and the substrate is exposed to thereby expose the substrate at the time of exposure. Since the positioning in the θ direction can be performed with high accuracy, the pattern can be printed with high accuracy and a high-quality substrate can be manufactured.

  For example, FIG. 20 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 21 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 20, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 21, in the exposure process of the black matrix forming process (step 201), the proxy of the present invention is used. The substrate positioning method of the proximity exposure apparatus and proximity exposure apparatus can be applied.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Mask 10a, 10b Chuck 11 Main stage base 11a, 11b Sub stage base 12 units 13 X guide 14 X stage 15 Y guide 16 Y stage 17 θ stage 19 Chuck support 20 Mask holder 30 Laser length measuring system control device 31 Laser light source 32a, 32b, 33 Laser interferometer 34a, 34b, 35 Bar mirror 36 Arm 37 Misalignment detection mark 40 Laser displacement meter control device 41 Spectral interference laser displacement meter 50 Mounting tool 60 Image processing device 61 Camera 70 Main control device 71 72 Input / output interface circuit 80a, 80b Stage drive circuit

Claims (10)

In a proximity exposure apparatus that includes a chuck that supports a substrate and a mask holder that holds a mask, and provides a minute gap between the mask and the substrate to transfer the mask pattern to the substrate.
A first stage that moves in the X direction (or Y direction), a second stage that is mounted on the first stage and moves in the Y direction (or X direction), and that is mounted on the second stage and rotates in the θ direction. A moving stage having a third stage, mounting the chuck, and positioning the substrate supported by the chuck;
Light source for generating laser light, first reflecting means attached to the first stage, second reflecting means attached to the second stage, laser light from the light source and reflected by the first reflecting means Laser having a first laser interferometer for measuring the interference with the laser beam and a second laser interferometer for measuring the interference between the laser beam from the light source and the laser beam reflected by the second reflecting means Measuring system,
First detection means for detecting the position of the moving stage in the XY direction from the measurement results of the first laser interferometer and the second laser interferometer;
A displacement detection means for detecting a displacement in the θ direction of the second reflection means attached to the second stage;
A plurality of optical displacement meters provided at the chuck and measuring the distance to the second reflecting means attached to the second stage at a plurality of locations;
Second detecting means for detecting the inclination of the chuck in the θ direction from the measurement results of the plurality of optical displacement meters based on the positional deviation in the θ direction of the second reflecting means detected by the position deviation detecting means. When,
A stage driving circuit for driving the moving stage;
Based on the detection result of the second detection means, the stage driving circuit is controlled, the chuck is rotated in the θ direction by the third stage, the substrate is positioned in the θ direction, and the first detection is performed. Control means for controlling the stage drive circuit based on the detection result of the means and moving the chuck in the XY direction by the first stage and the second stage to position the substrate in the XY direction. A proximity exposure apparatus characterized by the above. The second reflecting means attached to the second stage has a plurality of misalignment detection marks on the surface,
The misregistration detection unit processes a plurality of image acquisition devices that acquire images of a plurality of misregistration detection marks of the second reflecting unit, and images of the misregistration detection marks acquired by the image acquisition devices. And an image processing device for detecting the position of each misregistration detection mark, and the position of the second reflecting means in the θ direction from the position of each misregistration detection mark detected by the image processing device. The proximity exposure apparatus according to claim 1, wherein a deviation is detected. The laser measuring system has a plurality of the second laser interferometers,
The positional deviation detection means detects a positional deviation in the θ direction of the second reflecting means attached to the second stage from the measurement results of the plurality of second laser interferometers. The proximity exposure apparatus according to claim 1.   The plurality of optical displacement meters irradiate the reference reflection surface and the object to be measured with light of a wide wavelength band, and determine the wavelength and intensity of the interference light between the reflected light from the reference reflection surface and the reflected light from the object to be measured. The proximity exposure apparatus according to claim 1, wherein the proximity exposure apparatus is a spectral interference laser displacement meter that measures a distance to an object to be measured. A proximity exposure apparatus substrate positioning method comprising a chuck for supporting a substrate and a mask holder for holding a mask, and providing a minute gap between the mask and the substrate to transfer the mask pattern to the substrate. ,
A first stage that moves in the X direction (or Y direction), a second stage that is mounted on the first stage and moves in the Y direction (or X direction), and that is mounted on the second stage and rotates in the θ direction. A chuck is mounted on a moving stage having a third stage,
The first reflecting means is attached to the first stage, and the first laser interferometer measures the interference between the laser light from the light source and the laser light reflected by the first reflecting means,
The second reflecting means is attached to the second stage, and the second laser interferometer measures the interference between the laser light from the light source and the laser light reflected by the second reflecting means,
Detecting a positional deviation in the θ direction of the second reflecting means attached to the second stage;
The chuck is provided with a plurality of optical displacement meters, and the plurality of optical displacement meters are used to measure the distance to the second reflecting means attached to the second stage at a plurality of locations.
Based on the detection result of the positional deviation of the second reflecting means in the θ direction, the inclination of the chuck in the θ direction is detected from the measurement results of the plurality of optical displacement meters, and the chuck is moved by the third stage based on the detection result. Rotate in the θ direction to position the substrate in the θ direction,
From the measurement results of the first laser interferometer and the second laser interferometer, the position of the moving stage in the XY direction is detected, and the chuck is moved in the XY direction by the first stage and the second stage based on the detection result. Then, a substrate positioning method for a proximity exposure apparatus, wherein the substrate is positioned in the X and Y directions. A plurality of misalignment detection marks are provided on the surface of the second reflecting means attached to the second stage,
Acquire images of a plurality of misregistration detection marks of the second reflecting means, process the obtained images of misregistration detection marks, detect the positions of the misregistration detection marks, and detect the detected positions. 6. The method of positioning a substrate of a proximity exposure apparatus according to claim 5, wherein a positional deviation in the θ direction of the second reflecting means is detected from the position of the deviation detection mark. By using a plurality of second laser interferometers, the interference between the laser light from the light source and the laser light reflected by the second reflecting means is measured at a plurality of locations,
6. The proximity exposure apparatus according to claim 5, wherein a positional deviation in the θ direction of the second reflecting means attached to the second stage is detected from the measurement results of the plurality of second laser interferometers. Substrate positioning method.   As an optical displacement meter, the reference reflection surface and the object to be measured are irradiated with light in a wide wavelength band, and the object to be measured is determined from the wavelength and intensity of the interference light between the reflected light from the reference reflection surface and the reflected light from the object 8. The method of positioning a substrate in a proximity exposure apparatus according to claim 5, wherein a spectral interference laser displacement meter that measures a distance to an object is used.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the proximity exposure apparatus according to any one of claims 1 to 4.   A method for manufacturing a display panel substrate, wherein the substrate is positioned by using the substrate positioning method of the proximity exposure apparatus according to any one of claims 5 to 8, and the substrate is exposed.

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