KR101387312B1 - Proximity exposure apparatus, method for determining a substrate position in the proximity exposure apparatus and method of manufacturing a display panel substrate - Google Patents

Abstract

With a cheap structure, the inclination of the chuck in the θ direction can be detected with high accuracy, and the substrate can be positioned in the θ direction with high accuracy.
The second reflecting means 35 is attached to the second stage 16 moving in the Y direction (or X direction) mounted on the first stage 14, and θ of the second reflecting means 35 is attached. Position shift in the direction is detected. A plurality of optical displacement meters 41 are provided on the chucks 10a and 10b, and the distance to the second reflecting means 35 attached to the second stage 16 is provided by the plurality of optical displacement meters 41. Measure in multiple places. Based on the detection result of the position shift of the second reflecting means in the θ direction, the tilt of the chucks 10a and 10b in the θ direction is detected from the measurement results of the plurality of optical displacement meters 41, and based on the detection result. The chucks 10a and 10b are rotated in the θ direction by the third stage 17 so as to position the substrate 1 in the θ direction.

Description

PROXIMITY EXPOSURE APPARATUS, METHOD FOR DETERMINING A SUBSTRATE POSITION IN THE PROXIMITY EXPOSURE APPARATUS AND METHOD OF MANUFACTURING A DISPLAY PANEL SUBSTRATE}

The present invention relates to a proximity exposure apparatus for exposing a substrate using a proximity method, a proximity positioning apparatus substrate positioning method, and a display panel using the same in the manufacture of display panel substrates such as liquid crystal display devices. A method of manufacturing a substrate, and in particular, a substrate position of a proximity exposure apparatus and a proximity exposure apparatus which move a chuck supporting a substrate in a XY direction by a moving stage and rotate in a θ direction to position the substrate during exposure. A crystal method and a method for manufacturing a display panel substrate using the same.

Photolithography is used to manufacture thin film transistor (TFT) substrates, color filter substrates, substrates for plasma display panels, substrates for organic EL (Electroluminescence) displays, and the like for liquid crystal display devices used as display panels. It is performed by forming a pattern on a board | substrate by a technique. As an exposure apparatus, a projection method for projecting a pattern of a mask onto a substrate using a lens or a mirror, and a proxy for transferring a pattern of the mask to the substrate by providing a small gap (proxy gap) between the mask and the substrate There is a Meteor method. Although the proxy resolution method has a lower pattern resolution performance than the projection method, the configuration of the irradiating optical system is simple and the processing capacity is high, and thus it is suitable for mass production.

In recent years, in the manufacture of various substrates for display panels, a relatively large substrate is prepared in order to cope with an increase in size and a variety of sizes, and from one substrate to one or several display panels depending on the size of the display panel. A substrate is manufactured. In this case, in the proximity method, in order to collectively expose one surface of the substrate, a mask having the same size as the substrate is required, and the cost of the expensive mask is further increased. Therefore, the mainstream method is to use a mask that is relatively smaller than the substrate, to step the substrate in the XY direction by the moving stage, and to expose one side of the substrate into a plurality of shots.

In the proximity exposure apparatus, in order to print the pattern with high accuracy, positioning of the substrate during exposure must be performed with high accuracy. The moving stage for positioning the substrate includes an X stage moving in the X direction, a Y stage moving in the Y direction, a θ stage rotating in the θ direction, and a chuck supporting the substrate is mounted thereon, and the XY direction is mounted. Move and rotate in the θ direction. Patent Literature 1 and Patent Literature 2 describe a technique for detecting a position in the XY direction of a moving stage by using a laser measuring unit when positioning a substrate, and also detecting a tilt in the θ direction of the chuck using a plurality of laser displacement meters. Is disclosed.

Japanese Patent Application Laid-Open No. 2008-298906 JP 2009-31639 A

In the techniques described in Patent Literature 1 and Patent Literature 2, a bar mirror is attached to the chuck, and the displacement of the bar mirror is measured at a plurality of places by a plurality of laser displacement meters provided on the X stage, and the tilt of the chuck direction is detected. . Therefore, a dedicated bar mirror is required, which is very expensive and expensive because it is necessary to process the surface with high precision.

Moreover, in the technique of patent document 1 and patent document 2, since the laser displacement meter is provided in the X stage, when the chuck is moved to the Y direction by a Y stage, the position of a bar mirror will change with respect to a laser displacement meter. Therefore, there existed a possibility that the measurement result may include the error according to the flatness of the bar mirror.

In contrast, when a plurality of laser displacement meters are provided on the Y stage and the plurality of laser displacement meters are moved in the XY direction together with the chucks, the displacement of the chucks measured by the respective laser displacement meters does not change due to the movement of the chucks. However, even in this case, when the Y stage is moved, a large amount of heat is generated by the sliding resistance in the guide mounted with the Y stage, the heat is transferred to the Y stage, and distortion occurs due to the thermal deformation of the Y stage. There was a possibility that the installation state of each laser displacement meter provided on the side would change, causing an error in the measurement result of the displacement of the chuck. On the other hand, instead of providing a plurality of laser displacement meters on the Y stage, if a plurality of laser displacement meters are provided on the chuck and the bar mirrors are attached to the Y stages, the installation state of the bar mirrors is changed when the distortion due to thermal deformation occurs on the Y stages. If it changes and the position shift of the (theta) direction is made to the bar mirror, and it is left as it is, there exists a possibility that the inclination of the chuck of the chuck cannot be detected correctly.

As described in Patent Literature 1 and Patent Literature 2, when a plurality of laser displacement meters are used to detect tilt in the θ direction of the chuck, the tilt accuracy in the θ direction of the chuck is increased the more the plurality of laser displacement meters are provided at intervals. It can be detected well. However, the output characteristics of the laser displacement meter are poor in linearity, so that the measurement error increases when the measurement range is widened. In the techniques described in Patent Documents 1 and 2, when the chuck is moved in the Y direction by the Y stage while the chuck is inclined in the θ direction, the distance from each laser displacement meter to the bar mirror is changed. If the laser displacement meter is provided at a further interval, there is a concern that the measurement range of the laser displacement meter is widened and the measurement error is increased.

In addition, the output characteristics of the laser displacement meter vary depending on the installation state, and the line formation changes with respect to the minute angle change of the object under test. Therefore, as described in Patent Literature 1 and Patent Literature 2, when the tilt of the chuck direction of the chuck is detected using a plurality of laser displacement meters, the measured value of each laser displacement meter includes the variation value depending on the angle of the chuck, There was a possibility that the tilt of the chuck in the θ direction could not be detected with high accuracy.

The subject of this invention is an inexpensive structure, and detects the inclination of the chuck direction in an accurate direction, and performs positioning of the board | substrate in the θ direction with high precision. Moreover, the subject of this invention is to print a pattern with high precision, and to manufacture a high quality display panel board | substrate.

The proximity exposure apparatus of the present invention includes a chuck supporting a substrate and a mask holder holding a mask, and provides a small gap between the mask and the substrate to transfer the pattern of the mask to the substrate. The first stage moves in the X direction (or Y direction), the second stage mounted on the first stage and moved in the Y direction (or X direction), and the second stage mounted in the θ direction. A moving stage having a third stage rotating, for positioning the substrate supported by the chuck, a light source for generating laser light, first reflecting means attached to the first stage, and a second stage Second reflecting means attached to the stage, a first laser interferometer for measuring interference between the laser light from the light source and the laser light reflected by the first reflecting means, and a laser from the light source From the measurement results of the laser measuring unit having a second laser interferometer for measuring the interference between the light and the laser light reflected by the second reflecting means, the first laser interferometer and the second laser interferometer, First detection means for detecting a position in the XY direction, position misalignment detection means for detecting a position shift in the θ direction of the second reflecting means attached to the second stage, and provided in the chuck to the second stage. The plurality of optical displacement meters are based on the position shift in the θ direction of the plurality of optical displacement meters measuring the distance to the attached second reflecting means at a plurality of positions and the second reflecting means detected by the position shift detection means. Based on the detection results of the second detection means for detecting the tilt of the chuck in the θ direction, the stage driving circuit for driving the moving stage, and the second detection means, The easy driving circuit is controlled, the chuck is rotated in the θ direction by a third stage, positioning of the substrate in the θ direction is performed, and the stage driving circuit is controlled based on the detection result of the first detecting means, The first stage and the second stage are provided with control means for moving the chuck in the XY direction to position the substrate in the XY direction.

In addition, the substrate positioning method of the proximity exposure apparatus of the present invention includes a chuck supporting a substrate and a mask holder holding a mask, providing a small gap between the mask and the substrate, and forming a pattern of the mask. A substrate positioning method of a proximity exposure apparatus that is transferred to a substrate, the method comprising: a first stage moving in the X direction (or Y direction) and a second stage mounted on the first stage and moving in the Y direction (or X direction) The chuck is mounted on a moving stage having a stage and a third stage mounted on the second stage and rotating in the θ direction, the first reflecting means is attached to the first stage, and the first laser interferometer Measuring interference of the laser light from the light source and the laser light reflected by the first reflecting means, attaching the second reflecting means to the second stage, and attaching the second laser interferometer to the second laser interferometer. By measuring the interference between the laser light from the light source and the laser light reflected by the second reflecting means, the positional shift in the θ direction of the second reflecting means attached to the second stage is detected, and the chuck is A plurality of optical displacement meters are provided, the distance to the second reflecting means attached to the second stage is measured by a plurality of optical displacement meters at a plurality of places, and the positional shift in the θ direction of the second reflecting means is detected. Based on the result, the tilt of the chuck direction is detected from the measurement results of the plurality of optical displacement meters, and based on the detection result, the chuck is rotated in the θ direction by a third stage to position the substrate in the θ direction. From the measurement results of the first laser interferometer and the second laser interferometer, detect the position in the XY direction of the moving stage, and based on the detection result, the first stage and the second stage By moving the chuck in the XY direction, the substrate is positioned in the XY direction.

A plurality of optical displacement meters are provided on the chuck, the distances to the second reflecting means attached to the second stage are measured at a plurality of places by the plurality of optical displacement meters, and the θ of the chuck is measured from the measurement results of the plurality of optical displacement meters. Since the tilt of the direction is detected, the second reflecting means attached to the second stage is used for detecting the position of the moving stage using the second laser interferometer and detecting the tilt of the chuck direction using the plurality of optical displacement meters. The combined use eliminates the need for dedicated reflecting means (bar mirrors) for detecting the tilt of the chuck in the θ direction. And even if the chuck is moved in the XY direction by the moving stage, the optical displacement meter always measures the same location of the second reflecting means, so that the measurement error due to the flatness of the second reflecting means is eliminated. In addition, the position shift in the θ direction of the second reflecting means attached to the second stage is detected, and from the measurement results of the plurality of optical displacement meters based on the detection result of the position shift in the θ direction of the second reflecting means. Since the inclination of the chuck in the θ direction is detected, even when the second stage has a distortion due to thermal deformation, the installation state of the second reflecting means changes, and even if a position shift in the θ direction occurs in the second reflecting means, The tilt in the θ direction of the chuck is detected correctly. Further, even when the chuck is moved in the XY direction by the moving stage while the chuck is inclined in the θ direction, the distance from the optical displacement meter to the second reflecting means does not change and the measurement range is not widened. Optical displacement meters can be installed at greater intervals. Therefore, with an inexpensive configuration, the inclination of the chuck direction in the θ direction is detected with high accuracy, and the positioning of the substrate in the θ direction is performed with high accuracy.

Furthermore, in the proximity exposure apparatus of the present invention, the second reflecting means attached to the second stage has a plurality of position shift detecting marks on the surface, and the position shift detecting means includes the second reflecting means. A plurality of image acquisition apparatuses for acquiring an image of a plurality of position shift detection marks and an image of the detection mark for each position shift acquired by each image acquisition device are processed to determine the position of the mark for detection of each position shift. With the image processing apparatus to detect, the position shift of the 2nd reflecting means in the (theta) direction is detected from the position of the detection mark of each position shift detected by the image processing apparatus.

Further, in the substrate positioning method of the proximity exposure apparatus of the present invention, a plurality of marks for detecting the position shift are provided on the surface of the second reflecting means attached to the second stage, and the second reflecting means is provided. Acquire images of the plurality of position shift detection marks, process the images of the acquired detection mark of each position shift, detect the position of the detection mark of each position shift, and detect the detection mark of the detected position shift The position shift in the θ direction of the second reflecting means is detected from the position of.

On the surface of the second reflecting means attached to the second stage, a plurality of marks for detecting the positional shift are provided, an image of the marks for the detection of the plurality of positional shift of the second reflecting means is obtained and obtained The image of the mark for detection of positional shift is processed, the position of the mark for detection of each positional shift is detected, and the positional shift in the θ direction of the second reflecting means is detected from the position of the detected mark for detection of the positional shift. Since it detects, the position shift of (theta) direction of a 2nd reflecting means is detected by the image process of the detection mark of each position shift with high precision.

Alternatively, in the proximity exposure apparatus of the present invention, the laser side length measurement unit includes a second plurality of laser interferometers, and the detection means for position shifting the second stage from the measurement results of the plurality of second laser interferometers. The position shift in the θ direction of the attached second reflecting means is detected. In addition, the substrate positioning method of the proximity exposure apparatus of the present invention is characterized in that the plurality of second laser interferometers interfere with the laser light reflected from the light source and the laser light reflected by the second reflecting means at a plurality of locations. It measures and detects the position shift of (theta) direction of the 2nd reflecting means attached to the 2nd stage from the measurement result of a some 2nd laser interferometer. By using the second laser interferometer for detecting the position of the moving stage in the Y direction (or the X direction), the position shift in the θ direction of the second reflecting means can be detected.

In addition, in the proximity exposure apparatus of the present invention, a plurality of optical displacement meters irradiate light of a wide wavelength band to the reference reflecting surface and the object to be measured, and the interference between the reflected light from the reference reflecting surface and the reflected light from the object to be measured. It is a spectral interference laser displacement meter which measures the distance to the to-be-measured object from the wavelength and intensity of light. In addition, the substrate positioning method of the proximity exposure apparatus of the present invention is an optical displacement meter that irradiates light of a wide wavelength band with a reference reflecting surface and an object to be measured, and reflects light from the reference reflecting surface and the light to be measured. The spectroscopic interference laser displacement meter which measures the distance to the to-be-measured object from the wavelength and intensity | strength of the interference light with respect to it is used.

Compared to the laser displacement meters used in the techniques described in Patent Literature 1 and Patent Literature 2, the spectral interference laser displacement meter has a small and highly accurate change in output characteristics due to a small angle change of the object to be measured, but has a narrow measurement range. In the present invention, unlike the techniques described in Patent Documents 1 and 2, even if the chuck is moved in the XY direction by the moving stage while the chuck is inclined in the θ direction, from the optical displacement meter to the second reflecting means. Since the distance does not change, it is possible to use a high-precision spectroscopic laser displacement meter as the optical displacement meter, and detect the tilt of the chuck in the θ direction more accurately.

In the method for manufacturing a display panel substrate of the present invention, the substrate is exposed using any one of the above-described proximity exposure apparatuses, or the substrate positioning method of any of the above-described proximity exposure apparatuses is used. Is positioned and the substrate is exposed. Since the positioning in the θ direction of the substrate at the time of exposure is performed with high accuracy, the printing of the pattern is performed with high accuracy, and a high quality display panel substrate is produced.

According to the substrate positioning method of the proximity exposure apparatus and the proximity exposure apparatus of the present invention, the second reflecting means is attached to the second stage, and the laser light from the light source and the second laser interferometer are applied to the second stage. ? Of the second reflecting means attached to the second stage by detecting the interference with the laser beam reflected by the reflecting means of the laser beam, detecting the position in the Y direction (or X direction) of the moving stage from the measurement result The positional shift of the direction is detected, a plurality of optical displacement meters are provided in the chuck, and the distances to the second reflecting means attached to the second stage are measured at a plurality of places by the plurality of optical displacement meters. Inclination of the chuck in the θ direction at low cost by detecting the tilt of the chuck in the θ direction from the measurement results of the plurality of optical displacement meters based on the detection result of the position shift in the θ direction of the reflecting means. By the high accuracy detection, it is possible to accurately determine the position of the θ direction of the substrate.

Furthermore, according to the substrate positioning method of the proximity exposure apparatus and the proximity exposure apparatus of the present invention, a plurality of marks for detecting the positional deviation are provided on the surface of the second reflecting means attached to the second stage, Acquire images of the plurality of marks for detecting the positional shift of the second reflecting means, process images of the acquired marks for the detection of the positional shift, and detect the positions of the marks for the detection of the positional shift. By detecting the position shift in the? Direction of the second reflecting means from the position of the mark for detecting the position shift, the position shift in the? Direction of the second reflecting means is corrected by image processing of the detection mark of each position shift. It can be detected well.

Alternatively, according to the substrate positioning method of the proximity exposure apparatus and the proximity exposure apparatus of the present invention, the laser beam reflected from the light source and the second reflecting means by a plurality of second laser interferometers and Is measured at a plurality of locations, and from the measurement results of the plurality of second laser interferometers, the positional shift in the θ direction of the second reflecting means attached to the second stage is detected, so that the Y direction (or Position shift in the θ direction of the second reflecting means can be detected by using the second laser interferometer for detecting the position in the X direction).

In addition, according to the substrate positioning method of the proximity exposure apparatus and the proximity exposure apparatus of the present invention, by using a spectroscopic interferometric laser displacement meter as the optical displacement meter, the tilt of the chuck in the θ direction can be detected more accurately.

According to the manufacturing method of the display panel substrate of the present invention, since the positioning in the θ direction of the substrate at the time of exposure can be performed with high accuracy, the printing of the pattern can be performed with high precision and a high quality display panel substrate can be manufactured.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematic structure of the proximity exposure apparatus which concerns on one Embodiment of this invention.
2 is a top view illustrating a state where the chuck 10a is in the exposure position and the chuck 10b is in the rod / unload position.
3 is a partial cross-sectional side view showing a state where the chuck 10a is in the exposure position and the chuck 10b is in the rod / unload position.
4 is a top view showing a state where the chuck 10b is in the exposure position and the chuck 10a is in the rod / unload position.
5 is a partial cross-sectional side view showing a state where the chuck 10b is in the exposure position and the chuck 10a is in the rod / unload position.
6 is a top view of the moving stage on the main stage base.
7 is a partial cross-sectional side view in the X direction of the moving stage on the main stage base.
8 is a side view in the Y direction of the moving stage on the main stage base.
9 is a view for explaining the operation of the laser measuring unit.
10 is a view for explaining the operation of the laser measuring unit.
FIG. 11A is a top view of the spectral interference laser displacement meter, and FIG. 11B is a side view of the spectral interference laser displacement meter.
12 is a flowchart showing a substrate positioning method of the proximity exposure apparatus according to the embodiment of the present invention.
It is a top view which shows the state which moved the moving stage to the position which detects the position shift of the bar mirror.
Fig. 14A is a diagram showing an example of an exposure area of each shot when the bar mirror positional shift is not managed, and Fig. 14B shows the bar mirror positional shift management according to the present invention. It is a figure which shows an example of the exposure area | region of each shot in one case.
It is a figure explaining the operation | movement of the conventional laser displacement meter.
It is a figure explaining the operation | movement of the conventional laser displacement meter.
It is a figure explaining the operation | movement of the conventional laser displacement meter.
It is a figure explaining the operation | movement of a spectral interference laser displacement meter.
It is a figure explaining the operation | movement of a spectral interference laser displacement meter.
20 is a flowchart showing an example of a process of manufacturing a TFT substrate of a liquid crystal display device.
Fig. 21 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows schematic structure of the proximity exposure apparatus by one Embodiment of this invention. This embodiment shows an example of a proximity exposure apparatus having a plurality of chucks. The proximity exposure apparatus includes a plurality of chucks 10a and 10b, a main stage base 11, a plurality of sub-stage bases 11a and 11b, a base 12, an X guide 13, a plurality of moving stages and a mask. Holder 20, laser measurement unit control device 30, laser measurement unit, laser displacement meter control device 40, spectral interference laser displacement meter 41, image processing device 60, a plurality of cameras 61, main control device 70, input / output interface circuits 71 and 72, and stage driving circuits 80a and 80b. In addition to these, the proximity exposure apparatus includes a substrate transfer robot for carrying the substrate 1 into the chuck 10 and carrying the substrate 1 out of the chuck 10, an irradiation optical system for irradiating exposure light, and a temperature in the apparatus. The temperature control unit etc. which perform management are provided.

In the present embodiment, two chucks, two sub-stage bases, a moving stage, and two stage driving circuits are provided, but one or three or more may be provided, respectively. In addition, the XY direction in embodiment described below may change an X direction and a Y direction as an example.

In FIG. 1, the mask holder 20 holding the mask 2 is provided above the exposure position at which the substrate 1 is exposed. The mask holder 20 is provided with an opening 20a through which exposure light passes, and a mask 2 is attached to the lower portion of the opening 20a. An adsorption groove is provided in the circumference | surroundings of the opening 20a of the lower surface of the mask holder 20, and the mask holder 20 vacuum-holds the peripheral part of the mask 2 by an adsorption groove. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. The photoresist material (photoresist) is apply | coated to the surface of the board | substrate 1, and at the time of exposure, the exposure light from an irradiation optical system passes through the mask 2, and is irradiated to the board | substrate 1, The pattern is transferred to the surface of the substrate 1, and a pattern is formed on the substrate 1.

In the lower portion of the mask holder 20, a main stage base 11 is disposed. On the left and right of the main stage base 11, the sub-stage bases 11a and 11b are arranged adjacent to the X direction of the main stage base 11. The base 12 is attached to the Y direction of the main stage base 11. The chuck 10a is moved between the load / unload position on the sub-stage base 11a and the exposure position on the main stage base 11 by a moving stage described later. In addition, the chuck 10b is moved between the position of the load / unload on the sub-stage base 11b and the exposure position on the main stage base 11 by the movement stage mentioned later.

The board | substrate 1 is carried in to the chuck 10a, 10b by the board | substrate conveyance robot which is not shown in the position of the load / unload on the sub-stage base 11a, 11b, and from the chuck 10a, 10b. It is taken out. The loading of the substrate 1 to the chucks 10a and 10b and the unloading of the substrate 1 from the chucks 10a and 10b are performed using a plurality of pins pushed up from the bottoms provided in the chucks 10a and 10b. Lose. The pin pushed up from below is accommodated in the inside of the chucks 10a and 10b, lifts up from the inside of the chucks 10a and 10b, and transfers the substrate when the substrate 1 is loaded onto the chucks 10a and 10b. When the substrate 1 is passed from the robot and the substrate 1 is unloaded from the chucks 10a and 10b, the substrate 1 is turned over to the substrate transfer robot. The chucks 10a and 10b vacuum-support the substrate 1.

2 is a top view illustrating a state where the chuck 10a is in the exposure position and the chuck 10b is in the rod / unload position. 3 is a partial cross-sectional side view which shows the state in which the chuck 10a is in an exposure position and the chuck 10b is in a rod / unload position. In FIG. 2, on the main stage base 11 and the sub stage bases 11a and 11b, the X guide 13 extending in the X direction from the main stage base 11 onto the substage bases 11a and 11b. ) Is provided.

In Fig. 3, the chucks 10a and 10b are mounted on the moving stages, respectively. Each moving stage includes the X stage 14, the Y guide 15, the Y stage 16, the θ stage 17, and the chuck support 19. The X stage 14 is mounted on the X guide 13 and moves in the X direction along the X guide 13. The Y stage 16 is mounted on the Y guide 15 provided on the X stage 14, and moves along the Y guide 15 in the Y direction (inward direction in the drawing of FIG. 3). The θ stage 17 is mounted on the Y stage 16 and rotates in the θ direction. The chuck support 19 is mounted on the θ stage 17 to support the chucks 10a and 10b at a plurality of locations.

By the movement of the X stage 14 of each moving stage in the X direction, the chuck 10a moves between the position of the load / unload on the sub-stage base 11a and the exposure position on the main stage base 11. The chuck 10b is moved between the load / unload position on the sub-stage base 11b and the exposure position on the main stage base 11. 4 is a top view showing a state where the chuck 10b is in the exposure position and the chuck 10a is in the rod / unload position. 5 is a partial cross-sectional side view which shows the state in which the chuck 10b is in an exposure position and the chuck 10a is in a rod / unload position. At the load / unload position on the sub-stage bases 11a and 11b, the movement in the X direction of the X stage 14 of each moving stage, the movement in the Y direction of the Y stage 16, and the θ stage 17 By the rotation in the θ direction, prealignment of the substrate 1 mounted on the chucks 10a and 10b is performed.

At the exposure position on the main stage base 11, the movable stage is held by the chucks 10a and 10b by the movement in the X direction of the X stage 14 and the movement in the Y direction of the Y stage 16. The step movement of the board | substrate 1 in the XY direction is performed. Moreover, the cap adjustment of the mask 2 and the board | substrate 1 is carried out by moving and tilting the mask holder 20 to a X direction (up-down direction of the drawing of FIG. 3 and FIG. 5) with the X-tilting mechanism not shown. This is done. Therefore, the substrate at the time of exposure is moved by the movement in the X direction of the X stage 14 of each moving stage, the movement in the Y direction of the Y stage 16, and the rotation of the θ stage 17 in the θ direction. The positioning of 1) is performed.

The X stage 14, Y stage 16, and θ stage 17 of each moving stage are provided with a drive mechanism (not shown) such as a ball screw, a motor, and a linear motor. In Fig. 1, the stage driving circuit 80a is controlled by the main controller 70, and the X stage 14, Y stage 16, and θ stage 17 of the moving stage on which the chuck 10a is mounted. ). In addition, the stage driving circuit 80b drives the X stage 14, the Y stage 16, and the θ stage 17 of the moving stage on which the chuck 10b is mounted under the control of the main controller 70. .

In the present embodiment, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the X direction. The gap between the mask 2 and the substrate 1 may be adjusted by moving and tilting the chucks 10a and 10b in the X direction.

Hereinafter, the positioning operation of the substrate of the proximity exposure apparatus of the present embodiment will be described. In FIG. 1, the laser measuring unit includes a laser light source 31, laser interferometers 32a, 32b, 33, bar mirrors 34a, 34b, and bar mirror 35, which will be described later. In this embodiment, the laser interferometer 32a is used to detect the position in the X direction of the moving stage on which the chuck 10a is mounted, and the laser interferometer 32b is used to mount the chuck 10b. The position of the stage in the X direction is detected. In addition, the two laser interferometers 33 are used to detect the position in the Y direction of each moving stage on the main stage base 11.

6 is a top view of the moving stage on the main stage base. 7 is a partial cross-sectional side view in the X direction of the moving stage on the main stage base. 8 is a side view in the Y direction of the moving stage on the main stage base. 6 to 8 show a moving stage on which the chuck 10a is mounted, and the moving stage on which the chuck 10b is mounted has a configuration that is symmetrical in the X direction with the moving stage on which the chuck 10a is mounted. It is. In addition, the X guide 13 is abbreviate | omitted in FIG. 7, and the laser interferometers 32a and 32b are abbreviate | omitted in FIG.

In FIG. 8, since the X stage 14 of the moving stage is mounted on the X guide 13, between the main stage base 11 and the sub stage bases 11a and 11b and the X stage 14, X The space according to the height of the guide 13 is generated. The bar mirror 34a of the laser side unit is attached to the bottom of the X stage 14 using this space. The same applies to the bar mirror 34b. As shown in FIG. 1, the laser interferometer 32a is provided at a position deviated from the X guide 13 of the main stage base 11. The same applies to the laser interferometer 32b.

6 to 8, the bar mirror 35 is attached to the Y stage 16 by the arm 36 at approximately the height of the chuck 10a. Similarly, the bar mirror 35 is attached to the Y stage 16 at the height of the chuck 10b about the moving stage on which the chuck 10b is mounted. Two laser interferometers 33 are provided in the base 12 attached to the Y direction of the main stage base 11, as shown to FIG. 6 and FIG.

9 and 10 are diagrams for explaining the operation of the laser measuring unit. 9 shows a state where the chuck 10a is at the exposure position, and the chuck 10b is at the rod / unload position. In FIG. 10, the chuck 10b is at the exposure position, and the chuck 10a is loaded. / The state in the unloaded position is shown.

9 and 10, the laser interferometer 32a irradiates the laser light from the laser light source 31 to the bar mirror 34a, receives the laser light reflected by the bar mirror 34a, and receives the laser. The interference between the laser light from the light source 31 and the laser light reflected by the bar mirror 34a is measured. In Fig. 1, the laser measuring unit control device 30 controls the position in the X direction of the moving stage on which the chuck 10a is mounted from the measurement result of the laser interferometer 32a under the control of the main controller 70. Detect. The main controller 70 inputs the detection result of the laser measuring unit control device 30 via the input / output interface circuit 71.

9 and 10, the laser interferometer 32b irradiates the laser light from the laser light source 31 to the bar mirror 34b, receives the laser light reflected by the bar mirror 34b, and receives the laser. The interference between the laser light from the light source 31 and the laser light reflected by the bar mirror 34b is measured. In FIG. 1, the laser measuring unit control apparatus 30 detects the position of the moving stage which mounts the chuck 10b from the measurement result of the laser interferometer 32b by the control of the main control unit 70 in the X direction. do. The main controller 70 inputs the detection result of the laser side unit control device 30 via the input / output interface circuit 71.

The bar mirrors 34a and 34b of the laser measuring unit are attached to the bottom of the X stage 14 of each moving stage, and the laser interferometers 32a and 32b are separated from the X guide 13 of the main stage base 11. Since the movable stages are installed at the sub stage bases 11a and 11b and the main stage base 11, the moving stages do not collide with the laser interferometers 32a and 32b. Since the laser interferometers 32a and 32b are provided on the main stage base 11, the laser interferometers 32a and 32b are not affected by the vibration of the sub-stage bases 11a and 11b. In addition, the measurement distance from the laser interferometers 32a and 32b to the respective moving stages on the main stage base 11 is shortened. Therefore, the position in the X direction of each moving stage is detected with high accuracy.

9 and 10, the two laser interferometers 33 irradiate the laser light from the laser light source 31 to the bar mirror 35, and receive the laser light reflected by the bar mirror 35. The interference between the laser light from the laser light source 31 and the laser light reflected by the bar mirror 35 is measured at two places. In Fig. 1, the laser measuring unit control device 30 is Y of each moving stage on the main stage base 11 from the measurement results of the two laser interferometers 33 under the control of the main controller 70. The position of the direction is detected, and yawing when the X stage 14 and the Y stage 16 of each moving stage moves in the XY direction on the main stage base 11 is also detected.

Since each laser interferometer 33 is provided in the base 12 attached to the Y direction of the main stage base 11, each laser interferometer 33 is not affected by the vibration of the sub-stage bases 11a and 11b. In addition, the measurement distance from each laser interferometer 33 to each moving stage on the main stage base 11 is shortened. Therefore, using each laser interferometer 33, the position in the Y direction of each moving stage on the main stage base 11 is accurately detected. In addition, since the bar mirrors 35 of the laser measuring unit are attached at approximately the heights of the chucks 10a and 10b on which each moving stage is mounted, the position in the Y direction of each moving stage is detected in the vicinity of the substrate 1. do. Then, using the mirror 35 attached to the Y stage 16, yawing when the moving stage moves can be detected.

1, two spectral interference laser displacement meters 41 are provided in the chucks 10a and 10b, respectively. Fig. 11A is a top view of the spectral interference laser displacement meter and Fig. 11B is a side view of the spectral interference laser displacement meter. As shown in Figs. 11 (a) and 11 (b), each of the spectral interference laser displacement meters 41 is attached to the rear surface of the bar mirror 35 by the attachment hole 50, and the chucks 10a and 10b It is attached to the lower surface. The spectral interference laser displacement meter 41 used in the present embodiment is an optical displacement meter using interference light, and has a reference reflecting surface at the head of the tip, and irradiates light having a broad wavelength band with the reference reflecting surface and the object to be measured. The distance from the reference reflecting surface to the measured object is measured from the wavelength and intensity of the interference light between the reflected light from the reflected object and the reflected light from the measured object.

In FIGS. 11A and 11B, the two spectroscopic interference laser displacement meters 41 measure the distances to the back surface of the bar mirror 35 at two locations. In FIG. 1, the laser displacement meter control apparatus 40 is based on the detection result of the position shift of (theta) direction of the mirror 35 which is mentioned later by control of the main controller 70, and the two spectral interference laser displacement meters ( From the measurement result of 41), the inclination of the chucks 10a and 10b in the θ direction is detected. The main controller 70 inputs the detection result of the laser displacement meter control apparatus 40 via the input / output interface circuit 72.

In FIG. 6, the bar 37 attached to the Y stage 16 of the movable stage which mounts the chuck 10a is provided with the some mark 37 for a detection of the position shift | offset. The same applies to the mirror 35 attached to the Y stage 16 of the moving stage on which the chuck 10b is mounted. In this embodiment, the detection mark 37 of a position shift | offset is provided in the vicinity of the both sides of the bar mirror 35 extended in the X direction, respectively. The mark 37 for detecting the positional shift may be a shape suitable for image processing by the image processing apparatus 60 described later.

In FIG. 7 and FIG. 8, a plurality of cameras 61 are provided above the main stage base 11 in response to the detection marks 37 of the respective position shifts on the upper surface of the bar mirror 35. . In this embodiment, two cameras 61 are provided corresponding to the detection marks 37 of each position shift provided in the vicinity of both sides of the bar mirror 35 extending in the X direction. However, the number and position of the detection mark 37 and the camera 61 of a position shift are not limited to the example shown in FIGS. 6-8.

Each camera 61 is a CCD camera, for example, and acquires the image of the detection mark 37 of the position shift of the upper surface of the bar mirror 35. As shown in FIG. Each camera 61 is fixed to the frame (not shown) provided in the upper part of the mask holder 20, and is provided in the same space | interval as the space | interval of the mark 37 for a detection of the position shift of the bar mirror 35. As shown in FIG.

12 is a flowchart showing a substrate positioning method of the proximity exposure apparatus according to the embodiment of the present invention. And in the board | substrate 1 mounted in the chuck 10a, and the board | substrate 1 mounted in the chuck 10b, the process in an exposure position is performed alternately, and in the other direction between processing in one exposure position. Processing at the load / unload position is performed.

First, at the load / unload position, the substrate 1 is loaded onto the chucks 10a and 10b (step 301). The main controller 70 drives the X stage 14, the Y stage 16, and the θ stage 17 of the respective moving stages by the stage driving circuits 80a and 80b to each load / unload position. In this case, the chucks 10a and 10b are moved in the XY direction and rotated in the θ direction to prealign the substrate 1 (step 302).

Next, the main control device 70 drives the X stage 14 of each moving stage by the stage driving circuits 80a and 80b, moves the chucks 10a and 10b to the exposure position, and moves each moving stage. It moves to the position which detects the position shift of the bar mirror 35 (step 303). 13 is a top view illustrating a state in which the moving stage is moved to a position where the positional shift of the bar mirror is detected. When each movement stage is moved to the position which detects the position shift of the bar mirror 35, the mark 37 for the detection of each position shift of the upper surface of the bar mirror 35 is located in the field of view of each camera 61. do.

When the Y stage 16 of each moving stage is moved in the Y direction, a large amount of heat is generated by the sliding resistance in the Y guide 15 on which the Y stage 16 is mounted. When the heat is transferred to the Y stage 16 and distortion occurs due to thermal deformation in the Y stage 16, the installation state of the mirror 35 attached to the Y stage 16 changes, and the bar mirror ( 35 slightly rotates in the X direction, and a position shift in the θ direction occurs in the bar mirror 35. Each camera 61 acquires the image of the detection mark 37 of each position shift | deviation of the upper surface of the bar mirror 35, and outputs an image signal to the image processing apparatus 60 of FIG.

In FIG. 1, the image processing apparatus 60 processes the image signal of the detection mark 37 of each position shift | offset output from each camera 61, and positions the mark 37 for detection of each position shift | offset. Detect. The detection of the position of the detection mark 37 for each position shift is performed by, for example, an image of the detection mark 37 for detection of the position shift acquired by the respective cameras 61 and the mirror 35 prepared in advance. This is performed by comparing the images of the detection marks 37 for each position shift when there is no position shift in the θ direction. The laser displacement meter control device 40 detects a position shift in the θ direction of the bar mirror 35 from the position of the detection mark 37 of each position shift detected by the image processing apparatus 60 (FIG. 12). Step 304).

In the present embodiment, a plurality of detection marks 37 for detecting positional deviations are provided on the surface of the mirror 35 attached to the Y stage 16, and the bar mirrors 35 are provided by the plurality of cameras 61. Image of each of the detection marks 37 for the detection of positional deviations is obtained, and the image of the detection marks 37 for the detection of each positional deviation is processed to detect the position of the detection marks 37 for detection of each positional deviation, Since the position shift in the (theta) direction of the bar mirror 35 is detected from the position of the detection mark 37 of each detected position shift, the bar mirror ( Position shift in the θ direction of 35) is detected with high accuracy.

However, the present invention is not limited thereto, and the plurality of laser interferometers 33 measure the interference between the laser light from the laser light source 31 and the laser light reflected by the bar mirror 35 at a plurality of locations. The positional shift in the θ direction of the bar mirror 35 may be detected from the measurement results of the plurality of laser interferometers 33. The position shift of the bar mirror 35 in the (theta) direction can be detected using the laser interferometer 33 for detecting the position of each moving stage in the Y direction. Alternatively, a laser interferometer for detecting positional deviation in the θ direction of the bar mirror 35 may be provided separately from the laser interferometer 33 for detecting the position in the Y direction of each moving stage.

In FIG. 12, the main controller 70 next drives the X stage 14 and the Y stage 16 of each moving stage by the stage driving circuits 80a and 80b to expose the substrate 1. It moves to the position which performs the 1st short of a position (step 305). Subsequently, the main controller 70 drives the X-tilt mechanism based on the measurement result of the gap sensor (not shown) to adjust the gap between the mask 2 and the substrate 1 (step 306). Next, the main controller 70 drives the X stage 14, Y stage 16, and θ stage 17 of each moving stage by the stage driving circuits 80a and 80b to chuck at the exposure position. The substrate 1 is aligned by moving (10a, 10b) in the XY direction and rotating in the θ direction (step 307).

When performing the alignment (step 307) of the board | substrate 1, the laser displacement meter control apparatus 40 detects the position shift of the mirror 35 in the (theta) direction as detected in step 304 by the control of the main control device 70. Based on the above, the inclination of the chucks 10a and 10b in the θ direction is detected from the measurement results of the two spectral interference laser displacement meters 41. The main control unit 70 controls the stage driving circuits 80a and 80b based on the detection result of the tilt of the chucks 10a and 10b in the θ direction by the laser displacement meter control device 40 to control the stage driving circuits 80a and 80b. The chucks 10a and 10b are rotated in the θ direction by the θ stage 17 to position the substrate 1 in the θ direction. In addition, the main controller 70 controls the stage drive circuits 80a and 80b based on the detection result of the position in the XY direction of each moving stage by the laser side length unit control device 30, The chucks 10a and 10b are moved in the XY direction by the X stage 14 and the Y stage 16 to position the substrate 1 in the XY direction.

Fig. 14A shows an example of an exposure area of each shot when the bar mirror position shift management is not performed, and Fig. 14B shows each shot when the bar mirror position shift management is performed according to the present invention. It is a figure which shows an example of the exposure area | region of this. 14A and 14B show an example in which six exposure regions 1a, 1b, 1c, 1d, 1e, and 1f of the substrate 1 are divided into six shots for each exposure region.

When a position shift in the θ direction occurs in the bar mirror 35, the chucks 10a and 10b are barned from the measurement results of the two spectral interference laser displacement meters 41 without managing the position shift of the bar mirror 35. When the substrate 1 is positioned in the θ direction so as to be parallel to the mirror 35, the substrate 1 mounted on the chucks 10a and 10b is as much as the bar mirror 35 is displaced in the θ direction. Positioning is inclined in the θ direction. Therefore, as shown to Fig.14 (a), the exposure area | region 1a, 1b, 1c, 1d, 1e, 1f of each shot inclines in the (theta) direction on the board | substrate 1, respectively.

For example, in the manufacture of a liquid crystal display device, the operation of forming a liquid crystal panel by combining a TFT substrate and a color filter substrate is usually performed in a state where a plurality of exposure regions are exposed on the substrate 1. Therefore, as shown in Fig. 14A, when the exposure regions 1a, 1b, 1c, 1d, 1e, and 1f of each shot are inclined in the θ direction on the substrate 1, the patterns formed in the respective exposure regions. The problem arises that the position of the pattern is shifted from the pattern formed in each exposure area on the TFT substrate or the color filter substrate to be joined.

In the present embodiment, a plurality of spectral interferences are detected on the basis of the detection result of the positional shift in the θ direction of the bar mirror 35 as detected by the bar 35 attached to the Y stage 16. Since the inclination of the chucks 10a and 10b in the θ direction is detected from the measurement result of the laser displacement meter 41, when the distortion due to thermal deformation occurs in the Y stage 16 of each moving stage, Even if the installation state changes and the positional shift occurs in the bar mirror 35 in the θ direction, the inclination of the chucks 10a and 10b in the θ direction is accurately detected. Therefore, as shown in Fig. 14B, the exposure areas 1a, 1b, 1c, 1d, 1e, and 1f of each shot are formed in each exposure area without inclining in the? Direction on the substrate 1, respectively. There is no problem that the position of the pattern deviates from the position of the pattern formed in each exposure area on the TFT substrate or the color filter substrate to be joined together.

In FIG. 12, in the alignment of the substrate 1 (step 307), the alignment sensor includes the substrate 1 and the mask (during the gap adjustment between the mask 2 and the substrate 1 (step 306). You may start from the time point where the mask 2 and the board | substrate 1 approached the distance which can detect the alignment mark provided in 2). In this case, since the gap adjustment (step 306) of the mask 2 and the board | substrate 1 and the alignment (step 307) of the board | substrate 1 can be performed in parallel, the tact time is shortened.

After the gap adjustment of the mask 2 and the board | substrate 1 is complete | finished, and shot (step 308) is performed, the main controller 70 judges whether all the shots were complete (step 309). When all the shots are not finished, the main controller 70 moves the X-tilt mechanism to the retracted position where the predetermined mask 2 and the substrate 1 do not come into contact with each other, and then the stage driving circuit 80a, 80b) drives the X stage 14 and the Y stage 16 of each moving stage to perform step movement of the substrate 1 in the XY direction (step 310), and the substrate 1 is subjected to the next short. It moves to the position to perform. Returning to step 306, steps 306 to 310 are repeated until the short ends for all the shots.

When all the shots are finished, the main controller 70 drives the X-tilt mechanism to widen the gap between the mask 2 and the substrate 1, and then moves the stages by the stage driving circuits 80a and 80b. Drive the X stage 14 and the Y stage 16 to move the chucks 10a and 10b to the load / unload position (step 311). Then, at the load / unload position, the substrate 1 is unloaded from the chucks 10a and 10b (step 312).

15-17 is a figure explaining the operation | movement of the conventional laser displacement meter. FIG. 15 shows the laser displacement meter 42 attached to the moving stage on which the chuck 10a is mounted in Patent Document 1 and Patent Document 2. FIG. An exclusive bar mirror 44 for detecting the inclination of the chuck 10a in the θ direction is attached to one side that extends in the Y direction of the chuck 10a. The two laser displacement meters 42 are attached to the X stage 14 at the height of the bar mirror 44 by the arm 46, respectively. The mirror 44 and the laser displacement meter 42 attached to the moving stage on which the chuck 10b is mounted have a configuration that is symmetrical in FIG. 15 and the X direction. The laser displacement meter 42 used by the technique of patent document 1 and patent document 2 is an optical displacement meter which applied triangulation, irradiates the laser beam from a laser light source with a to-be-measured object, and reflects the reflected light from a to-be-measured object. It receives by a light receiving element, such as a CCD sensor, and measures the displacement of a to-be-measured object.

In the technique described in Patent Document 1 and Patent Document 2, the bar mirror 44 is attached to the chucks 10a and 10b and the plurality of laser displacement meters 42 provided on the X stage 14 provide the bar mirrors 44. Is measured at a plurality of locations, and the tilt of the chucks 10a and 10b in the θ direction is detected. For this reason, a dedicated bar mirror 44 is required. Since the bar mirror 44 needs to be processed to have a high precision and flat surface, it is very expensive and expensive.

In the present embodiment, a plurality of spectral interference laser displacement meters 41 are provided on the chucks 10a and 10b, and the mirrors 35 are attached to the Y stage 16 by the plural spectral interference laser displacement meters 41. The distance to is measured at a plurality of locations, and the tilt of the chucks 10a and 10b in the θ direction is detected from the measurement results of the plurality of spectral interference laser displacement meters 41, and thus the mirror 35 attached to the Y stage 16 is provided. ) Is used to detect the position of the moving stage using the laser interferometer 33 and to detect the inclination of the chucks 10a and 10b using the plural spectral interference laser displacement meters 41, so that the chuck 10a, There is no need for a dedicated bar mirror for detecting tilt in the θ direction of 10b).

FIG. 16 shows a state in which the chuck 10a is moved in the Y direction by the Y stage 16 in the state shown in FIG. 15. In the techniques described in Patent Literature 1 and Patent Literature 2, since the laser displacement meter 42 is provided on the X stage 14, the chucks 10a and 10b are moved to the Y stage at the time of step movement of the substrate at the exposure position. 16, the position of the bar mirror 44 changes with respect to the laser displacement meter 42, as shown to FIG. 15 and FIG. Therefore, the measurement result may include an error due to the flatness of the bar mirror 44.

FIG. 17A shows the positional relationship between the laser displacement meter 42 and the bar mirror 44 when the chuck 10a is inclined in the θ direction in the state shown in FIG. 15, and FIG. In the state shown in FIG. 16, the positional relationship of the laser displacement meter 42 and the bar mirror 44 when the chuck | zipper 10a is inclined in (theta) direction is shown.

As described in Patent Literature 1 and Patent Literature 2, when a plurality of laser displacement meters 42 are used to detect the inclination of the chucks 10a and 10b in the θ direction, the plurality of laser displacement meters 42 is further spaced apart. The more inclined the more, the more accurate the tilting of the chucks 10a and 10b in the θ direction can be detected. However, the output characteristics of the laser displacement meter 42 lack the linearity, and the measurement error increases when the measurement range is widened. In the techniques described in Patent Literature 1 and Patent Literature 2, when the chucks 10a and 10b are moved in the Y direction by the Y stage 16 in a state where the chucks 10a and 10b are inclined in the θ direction, FIG. As shown in a) and (b), since the distance from each laser displacement meter 42 to the bar mirror 44 fluctuates, when the several laser displacement meter 42 is provided at more space | interval, the laser displacement meter 42 is provided. ), The measurement range widened, and there was a fear that the measurement error increased.

18 and 19 are diagrams for explaining the operation of the spectral interference laser displacement meter. 18 and 19 show a state in which the substrate 1 is moved to the position where each shot is performed. In FIG. 19, the chucks 10a and 10b are moved by the Y stage 16 of each moving stage. In the state shown in 18, it is moved in the Y direction. In the present embodiment, as shown in Figs. 18 and 19, even when the chucks 10a and 10b are moved in the XY direction by the moving stage at the time of the step movement of the substrate 1 in the exposure position, the spectral interference Since the laser displacement meter 41 always measures the same location of the bar mirror 35, the measurement error due to the flatness of the bar mirror 35 is eliminated. Further, even when the chucks 10a and 10b are inclined in the θ direction, even if the chucks 10a and 10b are moved in the XY direction by the moving stage, the spectral interference laser displacement meter 41 to the bar mirror 35 is carried out. Since the distance does not fluctuate and the measurement range is not widened, a plurality of spectral interference laser displacement meters 41 can be provided at more intervals.

In addition, the output characteristics of the laser displacement meter 42 vary depending on the installation state, and the line formation changes with respect to the minute angle change of the object under test. Therefore, as described in Patent Literature 1 and Patent Literature 2, when a plurality of laser displacement meters 42 are used to detect the inclination of the chuck in the θ direction, the measured values of the respective laser displacement meters are applied to the chucks 10a and 10b. There existed a possibility that the fluctuation | variation value depending on an angle was included, and the inclination of the chuck | zipper 10a, 10b of the (theta) direction cannot be detected with high precision.

The spectral interference laser displacement meter 41 used in the present embodiment is compared with the laser displacement meter 42 used in the techniques described in Patent Literature 1 and Patent Literature 2, and the change in output characteristics due to the slight angle change of the object to be measured. Is small and high precision, but the measuring range is narrow. In the present invention, unlike the techniques described in Patent Documents 1 and 2, even when the chucks 10a and 10b are inclined in the θ direction, the chucks 10a and 10b are moved in the XY direction by the moving stage. Since the distance from the spectral interference laser displacement meter 41 to the bar mirror 35 does not fluctuate, a narrow and highly accurate spectral interference laser displacement meter 41 can be used, and the chucks 10a and 10b are in the θ direction. Tilt can be detected more accurately.

According to this embodiment described above, the bar mirror 35 is attached to the Y stage 16 of each moving stage, and the laser beam and the bar mirror 35 from the laser light source 31 are attached by the laser interferometer 33. The interference with the laser beam reflected by the < RTI ID = 0.0 >), and < / RTI > the position in the Y direction of each moving stage from the measurement result, and attached to the Y stage 16 of each moving stage, The position shift is detected, a plurality of optical displacement meters 41 are provided in the chucks 10a and 10b, and the plurality of optical displacement meters 41 are attached to the Y stage 16 of the respective moving stages to form a mirror 35. The distance to is measured at a plurality of locations, and based on the detection results of the positional shift in the θ direction of the bar mirror 35, from the measurement results of the plurality of optical displacement meters 41 in the θ direction of the chucks 10a and 10b. By detecting tilting, the structure is inexpensive, and the θ direction of the chucks 10a and 10b is Can be detected with high accuracy, and the substrate 1 can be accurately positioned in the [theta] direction.

In addition, the surface of the mirror 35 attached to the Y stage 16 provides a plurality of mark 37 for detection of position shift, and the mark 37 for detection of position shift in the bar mirror 35. Acquires an image of the image, processes the image of the acquired detection mark 37 of each positional deviation, detects the position of the detection mark 37 of the positional deviation, and detects the detection mark 37 of the detected positional deviation By detecting the positional shift in the θ direction of the bar mirror 35 from the position of, the positional shift in the θ direction of the bar mirror 35 can be accurately detected by image processing of the detection mark 37 for each positional deviation. There is a number.

Alternatively, the plurality of laser interferometers 33 measure the interference between the laser light from the laser light source 31 and the laser light reflected by the bar mirror 35 by using the plurality of laser interferometers 33. From the measurement result of, by detecting the positional shift in the θ direction of the bar mirror 35, by using the laser interferometer 33 for detecting the position in the Y direction of each moving stage, the θ direction of the bar mirror 35 is obtained. Position shift can be detected.

In addition, by using the spectral interference laser displacement meter 41 as the optical displacement meter, the inclination of the chucks 10a and 10b in the θ direction can be detected with good accuracy.

In addition, the plurality of laser interferometers 33 measure the interference between the laser light from the laser light source 31 and the laser light reflected by the bar mirror 35 by using the plurality of laser interferometers 33. By detecting the yaw when the X stage 14 and the Y stage 16 move from the measurement result of, the yaw when the moving stage moves using the mirror 35 attached to the Y stage 16 is detected. You can do it.

Substrate at the time of exposure by performing exposure of a board | substrate using the proximity exposure apparatus of this invention, or performing exposure of a board | substrate by positioning a board | substrate using the substrate positioning method of the proximity exposure apparatus of this invention. Since the positioning in the? Direction can be made precise, the pattern can be printed with high precision and a high quality substrate can be manufactured.

For example, FIG. 20 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or insulator film, which becomes a transparent electrode for liquid crystal driving, is formed on a substrate by the spatter method, plasma chemical vapor deposition (CHD) method, or the like. In the resist coating step (step 102), a photoresist material (photoresist) is applied by a roll coating method or the like, and a photoresist film is formed on the thin film formed in the thin film forming step (step 101). In an exposure process (step 103), the pattern of a mask is transferred to a photoresist film using a proximity exposure apparatus, a projection exposure apparatus, etc. In the developing step (step 104), the developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching step (step 105), the portions not masked by the photoresist film are removed in the thin film formed in the thin film forming step (step 101) by wet etching. In a peeling process (step 106), the photoresist film which completed the role of the mask in an etching process (step 105) is peeled with a peeling liquid. Before or after each of these steps, a substrate washing / drying step is performed as necessary. By repeating these processes several times, a TFT array is formed on a substrate.

21 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In a coloring pattern formation process (step 202), a coloring pattern is formed on a board | substrate by a dyeing method, a pigment dispersion method, the printing method, an electrodeposition method, etc. This process is repeated for the colored patterns of R, X, and Y. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate washing / drying step is performed as necessary.

In the manufacturing process of the TFT substrate shown in FIG. 20, in the exposure process (step 103), in the manufacturing process of the color filter substrate shown in FIG. 21, in the exposure process of the black matrix forming process (step 201), the proxy of the present invention. The substrate positioning method of the miti exposure apparatus and the proximity exposure apparatus can be applied.

One… Substrate 2... Mask
10a, 10b... Chuck 11. Main stage base
11a, 11b ... Second stage base
12 ... Base 13... X guide
14 ... X stage 15... Y guide
16 ... Y stage 17... θ Stage
19 ... Chuck support 20... Mask holder
30 ... Laser measuring unit control unit 31.. Laser light source
32a, 32b, 33... Laser interferometers 34a, 34b, 35... Bar mirror
36 ... Cancer 37... Mark for detection of misalignment
40 ... Laser displacement meter controller 41.. Spectral Interference Laser Displacement Meter
50 …. Attachment hole 60.. Image processing device
61 ... Camera 70... Main controller
71, 72... I / O interface circuits 80a and 80b. Stage drive circuit

Claims (10)

A proximity exposure apparatus comprising a chuck for supporting a substrate and a mask holder for holding a mask, providing a small gap between the mask and the substrate, and transferring the pattern of the mask to the substrate,
A first stage moving in the X direction (or Y direction), a second stage mounted on the first stage and moving in the Y direction (or X direction), and mounted in the second stage and rotating in the θ direction A moving stage having a third stage, mounting the chuck to position the substrate supported by the chuck;
Reflected by a light source for generating laser light, first reflecting means attached to the first stage, second reflecting means attached to the second stage, laser light from the light source and the first reflecting means A laser measuring unit having a first laser interferometer for measuring interference with the laser light, and a second laser interferometer for measuring interference between the laser light from the light source and the laser light reflected by the second reflecting means;
First detection means for detecting a position in the XY direction of the moving stage from measurement results of the first laser interferometer and the second laser interferometer;
Position shift detection means for detecting position shift in the θ direction of the second reflecting means attached to the second stage;
A plurality of optical displacement meters provided in the chuck and measuring a distance to the second reflecting means attached to the second stage at a plurality of places;
Second detection means for detecting an inclination of the chuck in the θ direction from measurement results of the plurality of optical displacement meters based on the position shift in the θ direction of the second reflecting means detected by the position shift detecting means; ,
A stage driving circuit for driving the moving stage;
Based on the detection result of the second detection means, the stage driving circuit is controlled, the chuck is rotated in the θ direction by the third stage, the substrate is positioned in the θ direction, and the first stage is positioned. A control for controlling the stage driving circuit based on the detection result of the detecting means, and positioning the substrate in the XY direction by moving the chuck in the XY direction by the first stage and the second stage. Proximity exposure apparatus comprising a means.
The method of claim 1,
The second reflecting means attached to the second stage has a plurality of marks for detection of positional deviation on a surface,
The position shift detection means includes a plurality of image acquisition devices for acquiring images of the plurality of position shift detection marks of the second reflecting means, and an image of each position shift detection mark acquired by each image acquisition device. And an image processing apparatus for detecting the position of the mark for detecting each positional shift, and from the position of the mark for detecting the positional shift detected by the image processing apparatus, in the θ direction of the second reflecting means. Proximity exposure apparatus, characterized in that for detecting the positional deviation.
The method of claim 1,
The laser measuring unit has a plurality of the second laser interferometer,
The position shift detection means detects position shift in the θ direction of the second reflecting means attached to the second stage from measurement results of the plurality of second laser interferometers. Device.
4. The method according to any one of claims 1 to 3,
The plurality of optical displacement meters irradiate light of a wide wavelength band to the reference reflection surface and the object to be measured, and from the wavelength and intensity of the interference light between the reflected light from the reference reflection surface and the reflected light from the object to be measured to the object to be measured. Proximity exposure apparatus, characterized in that the spectroscopic laser displacement meter for measuring the distance of.
A substrate positioning method of a proximity exposure apparatus comprising a chuck for supporting a substrate and a mask holder for holding a mask, providing a small gap between the mask and the substrate, and transferring the pattern of the mask to the substrate.
A first stage moving in the X direction (or Y direction), a second stage mounted on the first stage and moving in the Y direction (or X direction), and mounted in the second stage and rotating in the θ direction The chuck is mounted on a moving stage having a third stage,
The first reflecting means is attached to the first stage, and the first laser interferometer measures the interference between the laser light from the light source and the laser light reflected by the first reflecting means,
A second reflecting means is attached to the second stage, and the second laser interferometer measures the interference between the laser light from the light source and the laser light reflected by the second reflecting means,
Position shift in the θ direction of the second reflecting means attached to the second stage is detected,
A plurality of optical displacement meters are provided in the chuck, and the distances to the second reflecting means attached to the second stage are measured at a plurality of places by the plurality of optical displacement meters,
Based on the detection result of the positional shift in the θ direction of the second reflecting means, the tilt of the chuck direction is detected from the measurement results of the plurality of optical displacement meters, and the chuck is struck by the third stage based on the detection result. Direction to rotate the substrate in the θ direction,
The position in the XY direction of the moving stage is detected from the measurement results of the first laser interferometer and the second laser interferometer, and based on the detection result, the chuck is moved in the XY direction by the first stage and the second stage. A substrate positioning method of a proximity exposure apparatus, wherein the substrate is positioned in the XY direction.
6. The method of claim 5,
On the surface of the second reflecting means attached to the second stage, a plurality of marks for detection of positional deviation are provided,
Acquire images of the plurality of marks for detecting the positional shift of the second reflecting means, process images of the acquired marks for the detection of the positional shift, and detect the positions of the marks for the detection of the positional shift. A position shift in the θ direction of the second reflecting means is detected from the position of the mark for detecting the position shift. The substrate positioning method of the proximity exposure apparatus.
6. The method of claim 5,
By a plurality of second laser interferometers, the interference between the laser light from the light source and the laser light reflected by the second reflecting means is measured at a plurality of places,
The position shift of (theta) direction of the 2nd reflecting means attached to a 2nd stage is detected from the measurement result of a some 2nd laser interferometer, The substrate positioning method of a proximity exposure apparatus characterized by the above-mentioned. 8. The method according to any one of claims 5 to 7,
As an optical displacement meter, light of a wide wavelength band is irradiated to the reference reflecting surface and the object to be measured, and the distance from the wavelength and intensity of the interference light between the reflected light from the reference reflecting surface and the reflected light from the object to be measured is measured. A substrate positioning method of a proximity exposure apparatus, characterized by using a spectroscopic interferometric laser displacement meter.
delete A method for manufacturing a display panel substrate, wherein the substrate is positioned using the substrate positioning method of the proximity exposure apparatus according to any one of claims 5 to 7, and the substrate is exposed.

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