JP2012032666A - Exposure equipment, exposure method and method for manufacturing panel substrate for display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately perform positioning of a substrate in a θ direction by using a plurality of laser displacement gauges and accurately detecting inclination of chucks in the θ direction.SOLUTION: A plurality of laser displacement gauges 43 are provided on a second stage (a Y stage 16), and the plurality of laser displacement gauges 43 are moved in XY directions together with chucks 10a and 10b. A cooling device is provided on the second stage, and displacement of the chucks 10a and 10b are measured by the plurality of laser displacement gauges 43 at a plurality of portions, while preventing deformation of the second stage by heat generated in a guide (a Y guide 15) mounted on the second stage. From the measurement result, inclination of the chucks 10a and 10b in the θ direction is detected. Based on the detection result, the chucks 10a and 10b are rotated in the θ direction by a third stage (a θ stage 17), and the positioning of a substrate 1 in the θ direction is performed.

Description

  The present invention relates to an exposure apparatus for exposing a substrate, an exposure method, and a method for manufacturing a display panel substrate using the same in the manufacture of a display panel substrate such as a liquid crystal display device, and in particular, a chuck for supporting the substrate. The present invention relates to an exposure apparatus, an exposure method, and a manufacturing method of a display panel substrate using them, in which the substrate is moved in the XY direction and rotated in the θ direction by a moving stage to position the substrate during exposure.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  In order to perform pattern printing with high accuracy in the exposure apparatus, the substrate must be positioned with high accuracy during exposure. The moving stage for positioning the substrate is mounted on a guide provided on the base and moved in the X direction, a Y stage mounted on a guide provided on the X stage and moved in the Y direction, and mounted on the Y stage. And a θ stage that rotates in the θ direction, is mounted with a chuck that supports the substrate, moves in the XY direction, and rotates in the θ direction. Patent Documents 1 and 2 disclose a technique for detecting the position of the moving stage in the X and Y directions using a laser length measurement system and detecting the inclination of the chuck in the θ direction using a plurality of laser displacement meters. ing.

JP 2008-298906 A JP 2009-31639 A

  As described in Patent Document 1 and Patent Document 2, when detecting the inclination of the chuck in the θ direction using a plurality of laser displacement meters, the more the plurality of laser displacement meters are installed, the more θ The inclination of the direction can be detected with high accuracy. However, the output characteristics of the laser displacement meter are poor in linearity, and the measurement error increases when the measurement range is expanded. In the techniques described in Patent Document 1 and Patent Document 2, a plurality of laser displacement meters are provided on the X stage to detect the inclination of the chuck in the θ direction. When the chuck is moved in the Y direction by the Y stage, a laser displacement meter is used. The displacement of the chuck to be measured varies due to the movement of the chuck in the Y direction. For this reason, when a plurality of laser displacement meters are set apart from each other, the measurement range of the laser displacement meters is widened, resulting in an increase in measurement error.

  On the other hand, when a plurality of laser displacement meters are provided on the Y stage and the plurality of laser displacement meters are moved in the XY direction together with the chuck, the displacement of the chuck measured by each laser displacement meter is not changed by the movement of the chuck. Even if the chuck is moved in the X and Y directions, the measurement range of the laser displacement meter does not widen, so a plurality of laser displacement meters can be installed further apart, and the inclination of the chuck in the θ direction can be detected with high accuracy. . However, even in this case, when the Y stage is moved, a large amount of heat is generated by the sliding resistance in the guide on which the Y stage is mounted, and the heat is transmitted to the Y stage, causing distortion due to thermal deformation in the Y stage. The problem was found that errors in the measurement results of the displacement of the chuck occurred due to changes in the installation state of each laser displacement meter provided on the stage.

  In addition, as described in Patent Document 1 and Patent Document 2, when the position of the moving stage in the X and Y directions is detected using a laser length measurement system, if a bar mirror of the laser length measurement system is provided on the Y stage, Y When distortion due to thermal deformation occurs in the stage, there is a problem that the installation state of the bar mirror changes and an error occurs in the detection result of the position of the moving stage.

  An object of the present invention is to use a plurality of laser displacement meters to detect the inclination of the chuck in the θ direction with high accuracy and to accurately position the substrate in the θ direction. Another object of the present invention is to accurately detect the position of the moving stage in the Y direction (or X direction) using a laser length measurement system and accurately position the substrate in the Y direction (or X direction). It is. Furthermore, an object of the present invention is to manufacture a high-quality display panel substrate by performing pattern printing with high accuracy.

  An exposure apparatus according to the present invention includes a chuck that supports a substrate, positions the substrate supported by the chuck, and performs exposure of the substrate. The exposure apparatus includes a guide that extends in the X direction or the Y direction, and a chuck. A stage that is mounted on a guide and moves in the X or Y direction along the guide to position the substrate supported by the chuck, and the stage is deformed by heat generated by the guide that is provided on the stage and on which the stage is mounted. And a cooling device for preventing this. The exposure method of the present invention is an exposure method for exposing a substrate by supporting the substrate with a chuck, positioning the substrate supported by the chuck, and mounting the chuck on the stage. Is mounted on a guide extending in the X or Y direction, moved in the X or Y direction along the guide, a cooling device is provided on the stage, and the stage is deformed by the heat generated by the guide on which the stage is mounted. The substrate is positioned while preventing this. Since the substrate is positioned while providing a cooling device for the stage and preventing the stage from being deformed by the heat generated by the guide on which the stage is mounted, the substrate is positioned with high accuracy.

  The exposure apparatus of the present invention further includes a chuck that supports the substrate, positions the substrate supported by the chuck, and moves in the X direction (or Y direction) in the exposure apparatus that exposes the substrate. A stage, a guide provided in the first stage extending in the Y direction (or X direction), a second stage mounted on the guide and moving in the Y direction (or X direction), and a θ direction mounted on the second stage A third stage that rotates to the right, a chuck mounted, a movable stage that positions the substrate supported by the chuck, and a second stage that moves in the XY direction along with the chuck to move the chuck. Prevents the second stage from being deformed by heat generated by a plurality of laser displacement meters that measure the position at a plurality of locations and a guide on which the second stage is mounted. The first detection means for detecting the inclination of the chuck in the θ direction, the stage drive circuit for driving the moving stage, and the detection results of the first detection means from the measurement results of the cooling device and the plurality of laser displacement meters And a control device for controlling the stage driving circuit and rotating the chuck in the θ direction by the third stage to position the substrate in the θ direction.

  The exposure method of the present invention is an exposure method for exposing a substrate by supporting the substrate with a chuck, positioning the substrate supported by the chuck, and moving in the X direction (or Y direction). Stage, a guide provided in the first stage that extends in the Y direction (or X direction), a second stage that is mounted on the guide and moves in the Y direction (or X direction), and θ that is mounted on the second stage. A chuck is mounted on a moving stage having a third stage that rotates in a direction, a plurality of laser displacement meters are provided on the second stage, and the plurality of laser displacement meters are moved in the XY direction together with the chuck. A cooling device is provided to prevent the second stage from being deformed by the heat generated by the guide on which the second stage is mounted. In measuring, detecting the θ direction of the inclination of the chuck from the measurement result, based on the detection result, by rotating the chuck to the θ direction by a third stage, and performs positioning of the θ direction of the substrate.

  Since a plurality of laser displacement meters are provided on the second stage and the plurality of laser displacement meters are moved in the XY direction together with the chuck, the displacement of the chuck measured by each laser displacement meter is not changed by the movement of the chuck. Even if the chuck is moved in the X and Y directions, the measurement range of the laser displacement meter does not widen, so that a plurality of laser displacement meters can be installed further apart. Then, a cooling device is provided on the second stage so that the chuck is displaced by a plurality of laser displacement meters while preventing the second stage from being deformed by the heat generated by the guide on which the second stage is mounted. Since measurement is performed at a plurality of locations, an error due to thermal deformation of the second stage does not occur in the measurement result of the displacement of the chuck. Accordingly, the inclination of the chuck in the θ direction is detected with high accuracy, and the substrate is positioned in the θ direction with high accuracy.

  Furthermore, the exposure apparatus of the present invention measures a light source that generates laser light, reflecting means attached to the second stage, and interference between the laser light from the light source and the laser light reflected by the reflecting means at a plurality of locations. A laser length measurement system having a plurality of laser interferometers, and second detection means for detecting the position of the moving stage in the Y direction (or X direction) from the measurement results of the plurality of laser interferometers of the laser length measurement system; And the control device controls the stage driving circuit based on the detection result of the second detection means, moves the chuck in the Y direction (or X direction) by the second stage, and moves the substrate in the Y direction (or Positioning in the X direction).

  In the exposure method of the present invention, the reflecting means is attached to the second stage, and the interference between the laser light from the light source and the laser light reflected by the reflecting means is measured at a plurality of locations by a plurality of laser interferometers. The position of the moving stage in the Y direction (or X direction) is detected from the measurement result, and the chuck is moved in the Y direction (or X direction) by the second stage based on the detection result, and the Y direction (or X direction of the substrate) is detected. Direction).

  Reflecting means is attached to the second stage, a cooling device is provided on the second stage, and the second stage is prevented from being deformed by heat generated by the guide on which the second stage is mounted. The laser interferometer measures the interference between the laser beam from the light source and the laser beam reflected by the reflecting means at multiple locations, and detects the position of the moving stage in the Y direction (or X direction). An error due to thermal deformation of the second stage does not occur in the detection result of the position of the stage in the Y direction (or X direction). Therefore, the position of the moving stage in the Y direction (or X direction) is detected with high accuracy using the laser length measurement system, and the positioning of the substrate in the Y direction (or X direction) is performed with high accuracy.

  The method for producing a display panel substrate according to the present invention involves exposing the substrate using any one of the above exposure apparatuses or exposure methods. Since positioning of the substrate during exposure is performed with high accuracy, pattern printing is performed with high accuracy, and a high-quality display panel substrate is manufactured.

  According to the exposure apparatus and the exposure method of the present invention, a substrate is positioned by positioning a substrate while providing a cooling device to the stage and preventing the stage from being deformed by heat generated by a guide on which the stage is mounted. Can be accurately positioned.

  Furthermore, according to the exposure apparatus and exposure method of the present invention, a plurality of laser displacement meters are provided on the second stage, the plurality of laser displacement meters are moved in the XY direction together with the chuck, and a cooling device is provided on the second stage. The displacement of the chuck is measured at a plurality of positions by a plurality of laser displacement meters while preventing the second stage from being deformed by the heat generated by the guide on which the second stage is mounted. The tilt of the chuck in the θ direction is detected accurately by rotating the chuck in the θ direction by the third stage and positioning the substrate in the θ direction based on the detection result. Thus, the substrate can be accurately positioned in the θ direction.

  Further, according to the exposure apparatus and the exposure method of the present invention, the reflecting means is attached to the second stage, and a plurality of laser interferometers cause a plurality of interferences between the laser light from the light source and the laser light reflected by the reflecting means. The position of the moving stage in the Y direction (or X direction) is detected from the measurement result, and the chuck is moved in the Y direction (or X direction) by the second stage based on the detection result. By positioning in the Y direction (or X direction), the position of the movable stage in the Y direction (or X direction) can be detected with high precision, and the substrate can be positioned in the Y direction (or X direction) with high precision. it can.

  According to the method for manufacturing a display panel substrate of the present invention, since the substrate can be accurately positioned at the time of exposure, it is possible to manufacture a high-quality display panel substrate by performing pattern printing with high accuracy. it can.

1 is a diagram showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention. 1 is a front view of an exposure apparatus according to an embodiment of the present invention. 1 is a side view of an exposure apparatus according to an embodiment of the present invention. It is a figure explaining operation | movement of a laser length measurement system. It is a figure explaining operation | movement of a laser length measurement system. It is a top view of a movement stage. It is a side view of a movement stage. It is a top view of the cooling device by one embodiment of the present invention. It is a top view of a cooling block. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a view showing the schematic arrangement of an exposure apparatus according to an embodiment of the present invention. 2 is a front view of an exposure apparatus according to an embodiment of the present invention, and FIG. 3 is a side view of the exposure apparatus according to an embodiment of the present invention. This embodiment shows an example of a proximity exposure apparatus having two moving stages. The exposure apparatus includes chucks 10a and 10b, base 11, table 12, X guide 13, moving stage, mask holder 20, laser length measurement system control device 30, laser length measurement system, laser displacement meter control device 40, and laser displacement meter 42. 43, 44, bar mirrors 45, 46, 47, main controller 70, input / output interface circuits 71, 72, and stage drive circuits 80a, 80b. 2 and 3, the laser measurement system controller 30, the laser light source 31 of the laser measurement system, the laser displacement meter controller 40, the main controller 70, the input / output interface circuits 71 and 72, and the stage drive circuit 80a and 80b are omitted. In addition to these, the exposure apparatus includes an irradiation optical system that irradiates exposure light, a substrate transfer robot, a temperature control unit that manages temperature in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  1 and 2, the chuck 10 a is in an exposure position where the substrate 1 is exposed, and the chuck 10 b is in a load / unload position where the substrate 1 is loaded / unloaded. The load / unload position for the chuck 10a is on the left side of the exposure position in the drawing. The chucks 10a and 10b are alternately moved from each load / unload position to the exposure position by each moving stage described later. At each load / unload position, the substrate 1 is carried into the chucks 10a and 10b by the respective substrate transfer robots (not shown), and the substrate 1 is carried out from the chucks 10a and 10b. The chucks 10a and 10b support the substrate 1 by vacuum suction.

  A mask holder 20 for holding the mask 2 is installed above the exposure position. The mask holder 20 holds the periphery of the mask 2 by vacuum suction. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. At the time of exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate 1, whereby the pattern of the mask 2 is transferred to the surface of the substrate 1 and a pattern is formed on the substrate 1.

  In FIG. 2, chucks 10a and 10b are respectively mounted on a moving stage. Each moving stage includes an X stage 14, a Y guide 15, a Y stage 16, a θ stage 17, and a chuck support 19. The X stage 14 is mounted on an X guide 13 provided in the base 11 and extending in the X direction, and moves in the X direction along the X guide 13. The Y stage 16 is mounted on a Y guide 15 provided in the X stage 14 that extends in the Y direction, and moves in the Y direction along the Y guide 15. The θ stage 17 is mounted on the Y stage 16 and rotates in the θ direction. The chuck support 19 supports the chucks 10a and 10b at a plurality of locations.

  The chucks 10a and 10b are moved between the load / unload positions and the exposure positions by the movement of the X stages 14 in the X direction. At each load / unload position, each moving stage is mounted on the chucks 10a and 10b by moving the X stage 14 in the X direction, moving the Y stage 16 in the Y direction, and rotating the θ stage 17 in the θ direction. The pre-alignment of the substrate 1 is performed. At the exposure position, the movement of the X stage 14 in the X direction and the movement of the Y stage 16 in the Y direction of each moving stage causes the substrate 1 supported by the chucks 10a and 10b to move stepwise in the XY direction. Then, the substrate 1 is positioned during exposure by the movement of the X stage 14 in the X direction, the movement of the Y stage 16 in the Y direction, and the rotation of the θ stage 17 in the θ direction. Further, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction by a Z-tilt mechanism (not shown).

  In FIG. 1, the stage drive circuit 80 a drives the X stage 14, the Y stage 16, and the θ stage 17 of the moving stage on which the chuck 10 a is mounted under the control of the main controller 70. The stage drive circuit 80 b drives the X stage 14, the Y stage 16, and the θ stage 17 of the moving stage on which the chuck 10 b is mounted under the control of the main controller 70.

  In the present embodiment, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction. However, a Z-tilt mechanism is provided on the chuck support 19 of each moving stage. And the gap between the mask 2 and the substrate 1 may be adjusted by moving and tilting the chucks 10a and 10b in the Z direction.

  The substrate positioning operation of the exposure apparatus according to this embodiment will be described below. In FIG. 1, the laser length measurement system includes a laser light source 31, laser interferometers 32a, 32b, and 33, and bar mirrors 34a, 34b, and 35. Since the X stage 14 of each moving stage is mounted on the X guide 13, a space corresponding to the height of the X guide 13 is generated between the base 11 and the X stage 14. The bar mirrors 34a and 34b extending in the Y direction are attached under the X stage 14 using this space. Each of the two laser interferometers 32 a and 32 b is installed at a position away from the X guide 13 of the base 11. 2 and 3, the bar mirror 35 extending in the X direction is attached to the Y stage 16 of each moving stage by an arm 36 at approximately the height of the chucks 10a and 10b. The two laser interferometers 33 are installed on a table 12 provided on the base 11.

  4 and 5 are diagrams for explaining the operation of the laser length measurement system. 4 shows a state in which the chuck 10a is in the exposure position and the chuck 10b is in the load / unload position. FIG. 5 shows a state in which the chuck 10b is in the exposure position and the chuck 10a is in the load / unload position. Indicates the state. 4 and 5, the two laser interferometers 32a irradiate the laser beam from the laser light source 31 onto the bar mirror 34a, receive the laser beam reflected by the bar mirror 34a, and the laser beam from the laser light source 31. Interference with the laser beam reflected by the bar mirror 34a is measured at two locations. The two laser interferometers 32b irradiate the laser beam from the laser light source 31 to the bar mirror 34b, receive the laser beam reflected by the bar mirror 34b, and reflect the laser beam from the laser light source 31 and the bar mirror 34b. Measure the interference with the laser beam at two locations.

  In FIG. 1, the laser length measurement system control device 30 detects the position in the X direction of the moving stage on which the chuck 10a is mounted from the measurement results of the two laser interferometers 32a under the control of the main control device 70. Yawing is detected when the stage 14 moves in the X direction. Further, the laser length measurement system control device 30 detects the position in the X direction of the moving stage on which the chuck 10b is mounted from the measurement results of the two laser interferometers 32b under the control of the main control device 70, and the X stage 14 Detects yawing when moving in the X direction. Using the laser length measurement system, the position of each moving stage in the X direction is accurately detected. Further, yawing when the X stage 14 of each moving stage moves in the X direction can be detected from the measurement results of the two laser interferometers 32a and 32b.

  4 and 5, the two laser interferometers 33 irradiate the laser beam from the laser light source 31 to the bar mirror 35, receive the laser beam reflected by the bar mirror 35, and the laser beam from the laser light source 31. Interference with the laser beam reflected by the bar mirror 35 is measured at two locations. In FIG. 1, the laser measurement system control device 30 is controlled by the main control device 70, based on the measurement results of the two laser interferometers 33, the position in the Y direction of the moving stage on which the chucks 10 a and 10 b at the exposure position are mounted. Further, yawing is detected when the moving stage on which the chucks 10a and 10b at the exposure position are moved in the XY direction. Using the laser length measurement system, the position in the Y direction of the moving stage on which the chucks 10a and 10b at the exposure position are mounted is detected with high accuracy. Further, from the measurement results of the two laser interferometers 33, it is possible to detect yawing when the moving stage on which the chucks 10a and 10b at the exposure position are moved in the XY directions.

  6 is a top view of the moving stage, and FIG. 7 is a side view of the moving stage. 6 and 7 show a moving stage on which the chuck 10a is mounted. The moving stage on which the chuck 10b is mounted moves on which the chuck 10a is mounted except that the arrangement of the laser displacement meter 42 and the bar mirror 45 is different. The configuration is the same as the stage. 6 and 7, the bar mirror 45 extending in the Y direction is mounted on the X stage 14. The laser displacement meter 42 is attached below the Y stage 16 so as to face the bar mirror 45. The laser displacement meter 42 irradiates the laser beam to the bar mirror 45, receives the laser beam reflected by the bar mirror 45, and measures the displacement of the Y stage 16 in the X direction. In FIG. 1, the laser displacement meter control device 40 detects rolls when the Y stage 16 moves in the Y direction from the measurement result of the laser displacement meter 42 under the control of the main control device 70.

  6 and 7, the bar mirror 46 extending in the X direction is attached to the back surface of the chuck 10a. The two laser displacement meters 43 are attached to face the bar mirror 46 below the bar mirror 35 attached to the Y stage 16 by the arm 36. Since each laser displacement meter 43 is attached to the Y stage 16, when the chuck 10a is moved in the XY direction by the X stage 14 and the Y stage 16, each laser displacement meter 43 is moved in the XY direction together with the chuck 10a. . The two laser displacement meters 43 irradiate the laser beam to the bar mirror 46, receive the laser beam reflected by the bar mirror 46, and measure the displacement of the bar mirror 46 in the Y direction at two locations. In FIG. 1, the laser displacement meter control device 40 detects the inclination of the chuck 10 a in the θ direction from the measurement results of the two laser displacement meters 43 under the control of the main control device 70.

  Since two laser displacement meters 43 are provided on the Y stage 16, the two laser displacement meters 43 are moved in the XY direction together with the chuck 10a, and the displacement of the chuck 10a is measured at a plurality of locations by the two laser displacement meters 43. The displacement of the chuck 10a measured by the laser displacement meter 43 does not vary due to the movement of the chuck 10a. Even if the chuck 10a is moved in the X and Y directions, the measurement range of the laser displacement meter 43 does not widen, so that the two laser displacement meters 43 can be installed further apart.

  In FIG. 6, the bar mirror 47 extending in the Y direction is attached to the back surface of the chuck 10a. The laser displacement meter 44 is attached to the Y stage 16 so as to face the bar mirror 47 by an arm 48. The laser displacement meter 44 irradiates the bar mirror 47 with laser light, receives the laser light reflected by the bar mirror 47, and measures the displacement of the bar mirror 47 in the X direction. In FIG. 1, the laser displacement meter control device 40 is controlled by the main control device 70 from the measurement results of the two laser displacement meters 43 and the measurement results of the laser displacement meter 44 in the XY direction of the chuck 10 a by rotation in the θ direction. Change of position is detected.

  In FIG. 1, the main controller 70 inputs the detection result of the laser measurement system controller 30 via the input / output interface circuit 71. The main controller 70 also inputs the detection result of the laser displacement meter controller 40 via the input / output interface circuit 72. The main controller 70 controls the stage drive circuits 80a and 80b based on the detection results of the inclinations of the chucks 10a and 10b in the θ direction by the laser displacement meter controller 40, and the chucks 10a and 10b are moved to θ by the θ stage 17. The substrate 1 is positioned in the θ direction by rotating in the direction. The main controller 70 controls the stage drive circuits 80a and 80b based on the detection result of the position of the moving stage in the X and Y directions by the laser measuring system controller 30, and the chuck 10a and the Y stage 16 are controlled by the X stage 14 and the Y stage 16, respectively. 10b is moved in the X and Y directions to position the substrate 1 in the X and Y directions during exposure.

  In FIG. 7, a cooling device including a cooling block 50 is provided between a Y guide 15 provided on the X stage 14 and a Y stage 16. FIG. 8 is a top view of the cooling device according to the embodiment of the present invention. FIG. 8 shows a portion below the Y stage 16 indicated by a broken line. The cooling device includes a plurality of cooling blocks 50, a coolant supply source 51, a coolant supply pipe 52, a flow rate control valve 53, and a coolant recovery pipe 54.

  As shown in FIG. 7, each cooling block 50 is installed between each moving portion 15 a of the Y guide 15 and the bottom surface of the Y stage 16. FIG. 9 is a top view of the cooling block. The cooling block 50 is made of a material having high thermal conductivity such as aluminum or copper, and is approximately the same size as each moving portion 15a of the Y guide 15, and has a coolant passage 50a indicated by a broken line therein. . In FIG. 8, the cooling liquid is supplied to each cooling block 50 from a cooling liquid supply source 51 via a cooling liquid supply pipe 52 and a flow rate control valve 53. The flow control valve 53 adjusts the flow rate of the coolant supplied to each cooling block 50.

  When the Y stage 16 moves, a large amount of heat is generated in each moving portion 15a of the Y guide 15 due to sliding resistance. While the coolant supplied to each cooling block 50 flows through the coolant passage 50 a inside each cooling block 50, the heat generated in each moving portion 15 a of the guide 15 is absorbed and each movement of the Y guide 15 is performed. The Y stage 16 is prevented from being deformed by the heat generated in the portion 15a. The coolant that has absorbed the heat generated in each moving portion 15 a of the guide 15 is recovered from each cooling block 50 to the coolant supply source 51 via the coolant recovery pipe 54.

  A plurality of laser displacement meters 43 are provided on the Y stage 16, the plurality of laser displacement meters 43 are moved in the XY direction together with the chuck 10, a cooling device is provided on the Y stage 16, and a Y guide 15 on which the Y stage 16 is mounted. Since the displacement of the chuck 10 is measured at a plurality of positions by the plurality of laser displacement meters 43 while preventing the Y stage 16 from being deformed by the heat generated in the above, the Y stage 16 is subjected to the thermal deformation of the measurement result of the displacement of the chuck 10. The error by does not occur. Accordingly, the inclination of the chuck 10 in the θ direction is detected with high accuracy, and the positioning of the substrate 1 in the θ direction is performed with high accuracy.

  Further, a bar mirror 35 is attached to the Y stage 16 and a cooling device is provided on the Y stage 16 to prevent the Y stage 16 from being deformed by heat generated by the Y guide 15 on which the Y stage 16 is mounted. The laser interferometer 33 measures the interference between the laser light from the laser light source 31 and the laser light reflected by the bar mirror 35, and detects the position of the moving stage in the Y direction from the measurement result. An error due to thermal deformation of the Y stage 16 does not occur in the detection result of the position in the Y direction. Therefore, the position of the movable stage in the Y direction is detected with high accuracy using the laser length measurement system, and the positioning of the substrate 1 in the Y direction is performed with high accuracy.

  According to the present embodiment described above, a plurality of laser displacement meters 43 are provided on the Y stage 16, the plurality of laser displacement meters 43 are moved in the XY direction together with the chuck 10, and a cooling device is provided on the Y stage 16. While the Y stage 16 is prevented from being deformed by the heat generated in the Y guide 15 on which the Y stage 16 is mounted, the displacement of the chuck 10 is measured at a plurality of locations by a plurality of laser displacement meters 43, and the chuck is determined from the measurement result. 10 is detected, the chuck 10 is rotated in the θ direction by the θ stage 17 based on the detection result, and the θ direction of the chuck 10 is accurately determined by positioning the substrate 1 in the θ direction. It is possible to detect well and position the substrate 1 in the θ direction with high accuracy.

  Further, a bar mirror 35 is attached to the Y stage 16, and interference between the laser light from the laser light source 31 and the laser light reflected by the bar mirror 35 is measured at a plurality of locations by a plurality of laser interferometers 33. The position of the substrate 1 in the Y direction (or X direction) is detected, and based on the detection result, the Y stage 16 moves the chuck 10 in the Y direction (or X direction) to position the substrate 1 in the Y direction (or X direction). By performing the above, the position of the moving stage in the Y direction (or X direction) can be detected with high accuracy, and the positioning of the substrate 1 in the Y direction (or X direction) can be performed with high accuracy.

  By performing exposure of the substrate using the exposure apparatus or exposure method of the present invention, it is possible to accurately position the substrate at the time of exposure, so the pattern printing is performed with high accuracy and a high-quality display panel substrate. Can be manufactured.

  For example, FIG. 10 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 11 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 10, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 11, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the exposure apparatus or the exposure method of the present invention can be applied.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Mask 10a, 10b Chuck 11 Base 12 units 13 X guide 14 X stage 15 Y guide 16 Y stage 17 θ stage 19 Chuck support stand 20 Mask holder 30 Laser length measuring system control device 31 Laser light source 32a, 32b, 33 Laser Interferometers 34a, 34b, 35 Bar mirror 36 Arm 40 Laser displacement meter controller 42, 43, 44 Laser displacement meter 45, 46, 47 Bar mirror 48 Arm 50 Cooling block 50a Coolant passage 51 Coolant supply source 52 Coolant supply pipe 53 Flow control valve 54 Coolant recovery pipe 70 Main controller 71, 72 Input / output interface circuit 80a, 80b Stage drive circuit

Claims (10)

In an exposure apparatus that includes a chuck that supports a substrate, positions the substrate supported by the chuck, and performs exposure of the substrate.
A guide extending in the X or Y direction;
A stage for mounting the chuck, mounted on the guide, moving in the X direction or Y direction along the guide, and positioning the substrate supported by the chuck;
An exposure apparatus comprising: a cooling device that is provided on the stage and prevents the stage from being deformed by heat generated by a guide on which the stage is mounted. In an exposure apparatus that includes a chuck that supports a substrate, positions the substrate supported by the chuck, and performs exposure of the substrate.
A first stage moving in the X direction (or Y direction), a guide provided in the first stage extending in the Y direction (or X direction), a first stage mounted on the guide and moving in the Y direction (or X direction) A stage that is mounted on the second stage, and a third stage that is mounted on the second stage and rotates in the θ direction, and the chuck is mounted to position the substrate supported by the chuck;
A plurality of laser displacement meters provided on the second stage, moving in the XY direction together with the chuck, and measuring the displacement of the chuck at a plurality of locations;
A cooling device that is provided on the second stage and prevents the second stage from being deformed by heat generated by a guide on which the second stage is mounted;
First detection means for detecting the inclination of the chuck in the θ direction from the measurement results of the plurality of laser displacement meters;
A stage driving circuit for driving the moving stage;
And a control device that controls the stage driving circuit based on the detection result of the first detection means, and rotates the chuck in the θ direction by the third stage to position the substrate in the θ direction. An exposure apparatus characterized by that. A light source for generating laser light, reflecting means attached to the second stage, and a plurality of laser interferometers for measuring interference between the laser light from the light source and the laser light reflected by the reflecting means at a plurality of locations. Laser measuring system,
A second detection means for detecting the position of the moving stage in the Y direction (or X direction) from the measurement results of a plurality of laser interferometers of the laser length measurement system;
The control device controls the stage drive circuit based on the detection result of the second detection means, moves the chuck in the Y direction (or X direction) by the second stage, and moves the substrate in the Y direction. The exposure apparatus according to claim 2, wherein positioning is performed in (or X direction). An exposure method for supporting a substrate with a chuck, positioning the substrate supported by the chuck, and exposing the substrate,
Mount the chuck on the stage,
The stage on which the chuck is mounted is mounted on a guide extending in the X direction or Y direction, and moved in the X direction or Y direction along the guide.
An exposure method comprising: providing a cooling device on a stage, and positioning the substrate while preventing the stage from being deformed by heat generated by a guide on which the stage is mounted. An exposure method for supporting a substrate with a chuck, positioning the substrate supported by the chuck, and exposing the substrate,
A first stage moving in the X direction (or Y direction), a guide provided in the first stage extending in the Y direction (or X direction), a first stage mounted on the guide and moving in the Y direction (or X direction) The chuck is mounted on the moving stage having the second stage and the third stage mounted on the second stage and rotating in the θ direction,
A plurality of laser displacement meters are provided on the second stage, the plurality of laser displacement meters are moved in the XY direction together with the chuck,
While providing a cooling device on the second stage, while preventing the second stage from being deformed by heat generated by the guide on which the second stage is mounted,
Measure chuck displacement at multiple locations with multiple laser displacement meters,
The inclination of the chuck in the θ direction is detected from the measurement result,
An exposure method comprising: positioning a substrate in a θ direction by rotating a chuck in a θ direction by a third stage based on a detection result. A reflection means is attached to the second stage,
With multiple laser interferometers, measure the interference between the laser light from the light source and the laser light reflected by the reflecting means at multiple locations,
The position of the moving stage in the Y direction (or X direction) is detected from the measurement result,
6. The exposure method according to claim 5, wherein the substrate is positioned in the Y direction (or X direction) by moving the chuck in the Y direction (or X direction) by the second stage based on the detection result. .   A method for producing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to claim 1.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the exposure apparatus according to claim 2.   A method for producing a display panel substrate, wherein the substrate is exposed using the exposure method according to claim 4.   A method for producing a display panel substrate, wherein the substrate is exposed using the exposure method according to claim 5.

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