JP5537063B2 - Proximity exposure apparatus, gap control method for proximity exposure apparatus, and method for manufacturing display panel substrate - Google Patents

Description

  The present invention relates to a proximity exposure apparatus that exposes a substrate using a proximity method in the manufacture of a display panel substrate such as a liquid crystal display device, a gap control method for the proximity exposure apparatus, and a display panel using the same. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate manufacturing method, and in particular, a proximity exposure apparatus that performs stepwise movement in a XY direction and divides and exposes one surface of a substrate into a plurality of shots, a gap control method for proximity exposure apparatus, and the like The present invention relates to a method for manufacturing a display panel substrate.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  In recent years, in the manufacture of various substrates for display panels, a relatively large substrate is prepared in order to cope with an increase in size and a variety of sizes, and one or a plurality of substrates can be selected from one substrate depending on the size of the display panel. Manufactures display panel substrates. In this case, in the proximity method, if one surface of the substrate is to be exposed at once, a mask having the same size as the substrate is required, and the cost of the expensive mask is further increased. In view of this, the mainstream method is to use a mask that is relatively smaller than the substrate, move the substrate stepwise in the XY directions, and divide and expose one surface of the substrate into a plurality of shots.

  In the proximity method, exposure is performed by bringing a mask and a substrate close to a proximity gap of about several hundred μm. The gap between the mask and the substrate is measured by measuring the gap between the mask and the substrate at a plurality of positions with a plurality of gap sensors, and using a plurality of Z-tilt mechanisms, a mask holder or a substrate for holding the mask is measured. This is done by moving and tilting the supporting chuck in the Z direction. When exposing one side of a substrate in a plurality of shots, gap alignment between the mask and the substrate is performed for each shot, so the time required for gap alignment increases as the number of shots increases. On the other hand, Patent Document 1 uses data on the height position of the tilt mechanism when parallel alignment (gap setting) is performed with respect to the first substrate, with respect to the second and subsequent substrates. A technique for improving throughput by setting a gap in a short time is disclosed.

Japanese Patent Laid-Open No. 2005-99094

  In the proximity method, when the substrate is moved stepwise in the XY direction and one side of the substrate is divided into a plurality of shots for exposure, the step movement of the substrate prevents contact between the mask and the substrate. The gap is widened. Conventionally, considering the flatness of the mask and the substrate, the substrate is moved stepwise after the mask or the substrate is moved to a retracted position where there is no possibility of contact between the mask and the substrate. However, if the gap between the mask and the substrate is wide after the step movement of the substrate, it takes time to align the gap between the mask and the substrate, resulting in a decrease in throughput.

  On the other hand, when the gap between the mask and the substrate is aligned, if the gap sensor malfunctions or the Z-tilt mechanism malfunctions, the mask and the substrate may come into contact with each other and the mask may be damaged. In order to prevent this, the gap between the mask and the substrate before starting the gap alignment is always kept constant, and there is no fear that the mask and the substrate will contact each other during the gap alignment. It is necessary to manage within the upper limit. When the gap between the mask and the substrate is made constant before starting the gap alignment, the height of the lower surface of the mask and the surface of the substrate varies depending on the location, and thus the required amount of movement of each Z-tilt mechanism varies. For this reason, two stages of operations are required: an operation of moving each Z-tilt mechanism by the same amount of movement and an operation of moving each Z-tilt mechanism by the difference of the necessary amount of movement, and these operations take time. There is a problem that the throughput is lowered.

  An object of the present invention is to prevent the mask and the substrate from coming into contact when the substrate is moved stepwise in the XY direction, and after the substrate is moved stepwise in the XY direction, the gap between the mask and the substrate is adjusted in a short time. That is. Another object of the present invention is to perform the gap alignment between the mask and the substrate in a short time and to prevent the mask and the substrate from contacting each other during the gap alignment. Furthermore, an object of the present invention is to manufacture a display panel substrate with high throughput.

  The proximity exposure apparatus of the present invention includes a chuck that supports a substrate, a mask holder that holds a mask, and a stage that moves the chuck, and moves the chuck by the stage to perform step movement of the substrate in the XY directions. In a proximity exposure apparatus that divides and exposes one surface of a substrate into a plurality of shots, a plurality of Z-tilt mechanisms that relatively move and tilt the mask holder and the chuck in the Z direction, and a gap between the mask and the substrate A plurality of gap sensors that measure at a plurality of locations, a drive circuit that drives a plurality of Z-tilt mechanisms, and a control device that controls the drive circuit. Before the step movement in the direction, the drive circuit drives a plurality of Z-tilt mechanisms to widen the gap between the mask and the substrate, and in the XY direction of the substrate After the step movement, based on the measurement results of the plurality of gap sensors, the drive circuit drives the plurality of Z-tilt mechanisms to perform the gap alignment between the mask and the substrate, and each Z-tilt after the gap alignment for each shot. The position of the mechanism in the Z direction (or a position away from the first predetermined distance) is stored as a registered position for each shot of each Z-tilt mechanism, and the first time for a plurality of subsequent substrates In this shot, a plurality of Z-tilt mechanisms are driven by the drive circuit, and each Z-tilt mechanism is moved away from the registration position for the first shot by a first predetermined distance in the Z direction (after gap adjustment). After moving to a registered position, the position separated from the Z-direction position of each Z-tilt mechanism by a first predetermined distance is a registered position), and then the measurement results of a plurality of gap sensors are measured. Based on the above, a plurality of Z-tilt mechanisms are driven by the driving circuit to adjust the gap between the mask and the substrate, and in the second and subsequent shots, a plurality of driving circuits are operated by the driving circuit before the step movement of the substrate in the XY direction. The Z-tilt mechanism is driven to widen the gap between the mask and the substrate by a second predetermined distance shorter than the first predetermined distance, and after stepping the substrate in the XY direction, based on the measurement results of a plurality of gap sensors. A plurality of Z-tilt mechanisms are driven by a drive circuit to adjust the gap between the mask and the substrate.

  The gap control method of the proximity exposure apparatus of the present invention includes a chuck that supports a substrate, a mask holder that holds the mask, and a stage that moves the chuck, and the chuck is moved by the stage to move the substrate in the XY directions. Is a gap control method for a proximity exposure apparatus that performs exposure by dividing a surface of a substrate into a plurality of shots, and moves a mask holder and a chuck relatively in the Z direction and moves a plurality of Z A tilt mechanism and a plurality of gap sensors for measuring a gap between the mask and the substrate at a plurality of positions, and a plurality of Z-tilt mechanisms before the step movement of the substrate in the XY direction with respect to one substrate; To widen the gap between the mask and the substrate, and after the step movement of the substrate in the XY direction, a plurality of gap sensors The gap is measured at a plurality of locations, and the gap between the mask and the substrate is aligned by a plurality of Z-tilt mechanisms based on the measurement results, and the position in the Z direction of each Z-tilt mechanism after the gap alignment (or each shot) (or A position separated by a first predetermined distance) is stored as a registered position for each shot of each Z-tilt mechanism, and each Z-tilt in the first shot with respect to a plurality of subsequent substrates. A position where the mechanism is separated by a first predetermined distance in the Z direction from the registration position for the first shot (a position which is separated by a first predetermined distance from the position in the Z direction of each Z-tilt mechanism after gap alignment is registered. After moving to the registered position), the gap between the mask and the substrate is measured at a plurality of locations by a plurality of gap sensors, and a plurality of Z-tilt mechanisms are based on the measurement results. The gap between the mask and the substrate is further adjusted, and in the second and subsequent shots, the gap between the mask and the substrate is shorter than the first predetermined distance by a plurality of Z-tilt mechanisms before the step movement of the substrate in the XY direction. After the step is moved in the XY direction by extending the second predetermined distance, the gap between the mask and the substrate is measured at a plurality of positions by a plurality of gap sensors, and the mask is moved by a plurality of Z-tilt mechanisms based on the measurement result. The gap is aligned with the substrate.

  In the second and subsequent shots of the plurality of substrates, the gap between the mask and the substrate is widened by a second predetermined distance shorter than the first predetermined distance by the plurality of Z-tilt mechanisms before the substrate is stepped in the XY direction. Therefore, each Z-tilt mechanism is separated from the registration position for each shot by a first predetermined distance in the Z direction (a first predetermined distance from the position in the Z direction of each Z-tilt mechanism after gap alignment). When the registered position is the registered position, the mask and the substrate are prevented from contacting each other while the gap between the mask and the substrate is narrower than when it is at the registered position) and the substrate is stepped in the XY directions. The Then, after stepping the substrate in the XY directions, the gap alignment between the mask and the substrate is performed at a position where each Z-tilt mechanism is driven away from the registered position by a first predetermined distance in the Z direction (each after the gap alignment). Compared to the first shot starting from the registration position when the position that is a first predetermined distance away from the position in the Z direction of the Z-tilt mechanism is set as the registration position, this is performed in a shorter time.

  Further, in the proximity exposure apparatus of the present invention, the control device allows the mask or the substrate at the target value of the gap between the mask and the substrate, the registered position for each shot of each Z-tilt mechanism, and the measurement point of each gap sensor. Storage means for storing the upper limit value of the amount of movement in the Z direction, the registered position for each shot of each Z-tilt mechanism stored in the storage means, and the gap between the mask and the substrate is widened by a second predetermined distance. The position of the mask or substrate at the measurement point of each gap sensor at a first predetermined distance in the Z direction from the registered position on the basis of the position of each Z-tilt mechanism in the Z direction. (Movement amount calculation for calculating the amount of movement from when the position is a first predetermined distance away from the position in the Z direction of each Z-tilt mechanism after gap alignment is the registered position) Determining means for determining whether the gap between the mask and the substrate is within an allowable range based on the target value of the gap between the mask and the substrate stored in the storage means and the measurement results of the plurality of gap sensors; Based on the target value of the gap between the mask and the substrate stored in the means and the measurement results of the plurality of gap sensors, the movement amount determining means for determining the movement amount for moving the mask or the substrate at the measurement point of each gap sensor And, before driving the plurality of Z-tilt mechanisms by the drive circuit, the movement amount calculated by the movement amount calculation means and the cumulative value of the movement amount determined by the movement amount determination means are stored for the measurement points of each gap sensor. And confirmation means for confirming whether or not the upper limit value is stored in the means.

  Further, the gap control method of the proximity exposure apparatus according to the present invention includes a target value of a gap between a mask and a substrate, a registered position for each shot of each Z-tilt mechanism, and a mask or a substrate at each gap sensor measurement point. The upper limit value of the amount of movement in the Z direction is stored, the registration position for each shot of each Z-tilt mechanism, and the Z-tilt mechanism after the gap between the mask and the substrate is widened by a second predetermined distance. Based on the position in the Z direction, each Z-tilt mechanism of the mask or substrate at the measurement point of each gap sensor is positioned at a first predetermined distance in the Z direction from the registered position (each Z-tilt after gap alignment). The amount of movement from the position at the first predetermined distance from the position in the Z direction of the mechanism as the registered position is the registered position), and the target value of the gap between the mask and the substrate, and Based on the measurement result of the gap between the mask and the substrate, it is determined whether the gap between the mask and the substrate is within an allowable range, and based on the target value of the gap between the mask and the substrate and the measurement result of the gap between the mask and the substrate. The amount of movement for moving the mask or the substrate at each gap sensor measurement point is determined, and the calculated movement amount and the determined movement are determined for each gap sensor measurement point before driving the plurality of Z-tilt mechanisms. This is to check whether the cumulative value of the quantity is less than or equal to the upper limit value.

  Based on the registration position for each shot of each Z-tilt mechanism and the position in the Z direction of each Z-tilt mechanism after the gap between the mask and the substrate has been widened by a second predetermined distance, the measurement point of each gap sensor The position of each Z-tilt mechanism of the mask or substrate at a distance of a first predetermined distance in the Z direction from the registered position (the first predetermined distance from the position of each Z-tilt mechanism in the Z direction after gap alignment) Since the amount of movement from when it is at the registered position is calculated as the registered position, the position where each Z-tilt mechanism is separated from the registered position for each shot by the first predetermined distance in the Z direction. (The registered position when the position separated from the position in the Z direction of each Z-tilt mechanism after gap alignment by the first predetermined distance is the registered position) without moving to the measurement point of each gap sensor. Or to manage the movement amount in the Z direction of the substrate. Then, based on the target value of the gap between the mask and the substrate and the measurement result of the gap between the mask and the substrate, the amount of movement for moving the mask or the substrate at the measurement point of each gap sensor is determined, and a plurality of Z− Before driving the tilt mechanism, it is checked whether the calculated movement amount and the accumulated value of the determined movement amount are less than or equal to the upper limit value at each measurement point of each gap sensor, so each Z-tilt mechanism is registered for each shot. To a position that is a first predetermined distance away from the position in the Z direction (a registered position when a position that is a first predetermined distance away from the position in the Z direction of each Z-tilt mechanism after gap alignment is the registered position) Without moving, the gap between the mask and the substrate is aligned in a short time, and contact between the mask and the substrate is prevented at the time of gap alignment.

  The method for manufacturing a display panel substrate according to the present invention includes exposing the substrate using any one of the above-described proximity exposure apparatuses, or using the gap control method of any one of the above-described proximity exposure apparatuses and a mask. The substrate is exposed by adjusting the gap with the substrate. The gap between the mask and the substrate is adjusted in a short time, and the display panel substrate is manufactured with high throughput.

  According to the proximity exposure apparatus and the proximity control method of the proximity exposure apparatus of the present invention, each Z-tilt mechanism is moved from the registration position for the first shot to the Z direction in the first shot for a plurality of substrates. To a position separated by a first predetermined distance (registered position when a position separated by a first predetermined distance from the position in the Z direction of each Z-tilt mechanism after gap alignment is a registered position), The gap between the mask and the substrate is measured at a plurality of positions by a plurality of gap sensors, and the gap between the mask and the substrate is adjusted by a plurality of Z-tilt mechanisms based on the measurement results. Before the step movement in the direction, the gap between the mask and the substrate is widened by a plurality of Z-tilt mechanisms by a second predetermined distance shorter than the first predetermined distance. After step movement in the Y direction, the gap between the mask and the substrate is measured at a plurality of positions by a plurality of gap sensors, and based on the measurement result, the gap between the mask and the substrate is adjusted by a plurality of Z-tilt mechanisms. When the substrate is moved stepwise in the XY direction, contact between the mask and the substrate can be prevented, and after the substrate is moved stepwise in the XY direction, the gap between the mask and the substrate can be adjusted in a short time.

  Furthermore, according to the proximity exposure apparatus and the proximity exposure apparatus gap control method of the present invention, the registration position for each shot of each Z-tilt mechanism and the gap between the mask and the substrate are widened by a second predetermined distance. The position of the mask or substrate at the measurement point of each gap sensor at a first predetermined distance in the Z direction from the registered position on the basis of the position of each Z-tilt mechanism in the Z direction. The amount of movement from the position of the Z-tilt mechanism after the gap alignment after the first predetermined distance from the position of the first predetermined distance is calculated as a registered position. The amount of movement of the mask or substrate at each gap sensor measurement point is determined based on the target value of the gap and the measurement result of the gap between the mask and the substrate, and a plurality of Z-chills are determined. Before driving the mechanism, the gap between the mask and the substrate can be adjusted in a short time by checking whether the calculated movement amount and the cumulative value of the determined movement amount are below the upper limit for each measurement point of each gap sensor. It is possible to prevent contact between the mask and the substrate during gap alignment.

  According to the method for manufacturing a display panel substrate of the present invention, since the gap between the mask and the substrate can be adjusted in a short time, the display panel substrate can be manufactured with high throughput.

It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. It is a top view of a mask holder. It is a figure which shows the state which moved the chuck | zipper to the load / unload position. 4A is a front view of the Z-tilt mechanism, and FIG. 4B is a side view of the Z-tilt mechanism. It is a figure which shows schematic structure of a gap sensor. It is a figure which shows an example of the area | region of a shot. It is a flowchart which shows the operation | movement which determines the registration position by one embodiment of this invention. It is a flowchart which shows an example of the operation | movement of the exposure process using a registration position. It is a flowchart which shows the operation | movement of the exposure process using the gap control method of the proximity exposure apparatus by one Embodiment of this invention. It is a flowchart which shows the operation | movement of the exposure process using the gap control method of the proximity exposure apparatus by other embodiment of this invention. It is a block diagram which shows the part which performs the gap alignment operation | movement of a main controller. It is a flowchart of the gap alignment operation | movement using the gap control method of the proximity exposure apparatus by one Embodiment of this invention. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. The proximity exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck support base 9, a chuck 10, a mask holder 20, a holder frame 21, a top frame 22, and air. The cushion 23, the Z-tilt mechanism 30, the gap sensor 40, the main controller 50, the X stage drive circuit 61, the Y stage drive circuit 62, the θ stage drive circuit 63, and the Z-tilt mechanism drive circuit 64 are configured. Yes. In addition to these, the proximity exposure apparatus carries a substrate 1 into the chuck 10 and also carries a substrate transport robot that unloads the substrate 1 from the chuck 10, an irradiation optical system that irradiates exposure light, and a temperature at which temperature management in the apparatus is performed. A control unit is provided.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  In FIG. 1, the chuck 10 is at an exposure position where the substrate 1 is exposed. A top frame 22 is installed above the exposure position. A holder frame 21 is attached to the top frame 22 via an air cushion 23. A mask holder 20 that holds the mask 2 is attached to the holder frame 21. FIG. 2 is a top view of the mask holder. In FIG. 2, the mask holder 20 is provided with an opening 20a through which exposure light passes, and the mask 2 is mounted below the opening 20a. A suction groove is provided around the opening 20a on the lower surface of the mask holder 20, and the mask holder 20 holds the peripheral portion of the mask 2 by vacuum suction using the suction groove. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. At the time of exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate 1, whereby the pattern of the mask 2 is transferred to the surface of the substrate 1 and a pattern is formed on the substrate 1.

  FIG. 3 is a diagram illustrating a state in which the chuck is moved to the load / unload position. At the load / unload position, the substrate 1 is carried into the chuck 10 and the substrate 1 is carried out of the chuck 10 by a substrate transfer robot (not shown). The loading of the substrate 1 onto the chuck 10 and the unloading of the substrate 1 from the chuck 10 are performed using a plurality of push-up pins provided on the chuck 10. The push-up pin is housed inside the chuck 10 and is lifted from the inside of the chuck 10 to receive the substrate 1 from the substrate transfer robot and unload the substrate 1 from the chuck 10 when loading the substrate 1 onto the chuck 10. In doing so, the substrate 1 is delivered to the substrate transfer robot.

  1 and 3, the chuck 10 is mounted on the θ stage 8 via the chuck support 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves along the X guide 4 in the X direction (the horizontal direction in FIGS. 1 and 3). The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves in the Y direction (the depth direction in FIGS. 1 and 3) along the Y guide 6. The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support 9 is mounted on the θ stage 8 and supports the chuck 10 at a plurality of locations.

  The chuck 10 is moved between the load / unload position and the exposure position by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. At the load / unload position, the substrate 1 mounted on the chuck 10 is pre-aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Is done. At the exposure position, the X stage 5 is moved in the X direction and the Y stage 7 is moved in the Y direction, whereby the substrate 1 mounted on the chuck 10 is stepped in the XY direction. Then, the substrate 1 is aligned by the movement of the X stage 5 in the X direction, the movement of the Y stage 7 in the Y direction, and the rotation of the θ stage 8 in the θ direction. Further, the mask holder 20 is moved and tilted in the Z direction (vertical direction in FIG. 1) by the Z-tilt mechanism 30 provided on the side surface of the mask holder 20, thereby aligning the gap between the mask 2 and the substrate 1. Is called.

  In FIG. 1, the X stage drive circuit 61 drives the X stage 5 under the control of the main controller 50. The Y stage drive circuit 62 drives the Y stage 7 under the control of the main controller 50. The θ stage drive circuit 63 drives the θ stage 8 under the control of the main controller 50. The Z-tilt mechanism drive circuit 64 drives each Z-tilt mechanism 30 under the control of the main controller 50.

  4A is a front view of the Z-tilt mechanism, and FIG. 4B is a side view of the Z-tilt mechanism. The Z-tilt mechanism 30 includes a casing 31, a linear motion guide 32, a movable block 33, a motor 34, a shaft coupling 35, a ball screw 36a, a nut 36b, and a ball 37. As shown in FIG. 4B, the casing 31 is attached to the side surface of the top frame 22. As shown in FIG. 4A, a linear motion guide 32 is provided inside the casing 31, and a movable block 33 is mounted on the linear motion guide 32. A motor 34 is installed above the casing 31, and a ball screw 36 a is connected to the rotating shaft of the motor 34 via a shaft coupling 35. A nut 36 b that is moved by a ball screw 36 a is attached to the movable block 33, and the movable block 33 moves up and down along the linear guide 32 by the rotation of the motor 34.

  As shown in FIG. 4B, a tilt arm 24 is provided on the lower surface of the holder frame 21. A ball 37 is attached to the lower surface of the movable block 33, and the ball 37 is pressed against the tilt arm 24 by the movable block 33. In FIG. 2, the Z-tilt mechanism 30 is installed at three locations near the side surface of the holder frame 21. The three Z-tilt mechanisms 30 move the movable block 33 up and down to change the height of the ball 37 that pushes the tilt arm 24, thereby increasing the height of the holder frame 21 supported by the air cushion 23. The mask holder 20 is moved and tilted in the Z direction by changing the height at three locations.

  In the present embodiment, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction by the Z-tilt mechanism 30. The gap between the mask 2 and the substrate 1 may be adjusted by providing a tilt mechanism and moving and tilting the chuck 10 in the Z direction.

  In FIG. 2, four gap sensors 40 are provided above the mask 2 held by the mask holder 20. When the gap between the mask 2 and the substrate 1 is aligned, each gap sensor 40 is moved above the four corners of the opening 20a of the mask holder 20 by a moving mechanism (not shown), and the gap between the mask 2 and the substrate 1 is changed to the mask. Measure at the four corners. After the gap alignment between the mask 2 and the substrate 1 is completed, each gap sensor 40 is moved outside the opening 20a of the mask holder 20 by a moving mechanism (not shown).

  FIG. 5 is a diagram illustrating a schematic configuration of the gap sensor. The gap sensor 40 includes a laser light source 41, a collimation lens group 42, a projection lens 43, mirrors 44 and 45, an imaging lens 46, and a CCD line sensor 47. Laser light generated from the laser light source 41 passes through the collimation lens group 42 and the projection lens 43 and is irradiated obliquely from the mirror 44 to the mask 2. A part of the laser light applied to the mask 2 is reflected by the upper surface of the mask 2 and a part of the laser light is transmitted to the inside of the mask 2. A part of the laser light transmitted to the inside of the mask 2 is reflected by the lower surface of the mask 2, and a part of the laser light is irradiated to the surface of the substrate 1 from the lower surface of the mask 2. A part of the laser light applied to the surface of the substrate 1 is reflected by the surface of the substrate 1 and a part of the laser light is transmitted to the inside of the substrate 1. The laser light reflected by the lower surface of the mask 2 and the laser light reflected by the surface of the substrate 1 are emitted from the upper surface of the mask, then reflected by the mirror 45, pass through the imaging lens 46, and pass through the CCD line sensor 47. An image is formed on the light receiving surface. The CCD line sensor 47 outputs a detection signal corresponding to the intensity of light received by the light receiving surface. The gap G between the mask 2 and the substrate 1 is determined from the position of the detection signal of the laser beam reflected from the lower surface of the mask 2 of the CCD line sensor 47 and the position of the detection signal of the laser beam reflected from the surface of the substrate 1. Measured.

  Hereinafter, a gap control method for a proximity exposure apparatus according to an embodiment of the present invention will be described. The proximity exposure apparatus according to the present embodiment performs exposure by dividing the surface of the substrate 1 into a plurality of shots by step-moving the substrate 1 in the XY directions at the exposure position. FIG. 6 is a diagram illustrating an example of a shot area. FIG. 6 shows an example in which one surface of the substrate 1 is exposed in six shots. The region 1a of the substrate 1 is exposed by the first shot, the region 1b of the substrate 1 is exposed by the second shot, the region 1c of the substrate 1 is exposed by the third shot, and the region 1c of the substrate 1 is exposed by the fourth shot. The region 1d is exposed, the region 1e of the substrate 1 is exposed by the fifth shot, and the region 1f of the substrate 1 is exposed by the sixth shot.

  In the present embodiment, registration of each shot of each Z-tilt mechanism 30 for performing gap alignment between the mask 2 and the substrate 1 using a single substrate before sequentially exposing a plurality of substrates. Determine the position. FIG. 7 is a flowchart showing an operation for determining a registration position according to an embodiment of the present invention. For one substrate, the substrate 1 is first loaded onto the chuck 10 at the load / unload position (step 301). The main controller 50 drives the X stage 5 by the X stage drive circuit 61, drives the Y stage 7 by the Y stage drive circuit 62, drives the θ stage 8 by the θ stage drive circuit 63, and loads / unloads. At the position, the chuck 10 is moved in the XY direction and rotated in the θ direction to perform pre-alignment of the substrate 1 (step 302). Next, main controller 50 drives X stage 5 by X stage drive circuit 61, drives Y stage 7 by Y stage drive circuit 62, moves chuck 10 to the exposure position, and moves substrate 1 to the exposure position. To the position where the first shot is performed (step 303).

  Subsequently, the main controller 50 drives each Z-tilt mechanism 30 by the Z-tilt mechanism driving circuit 64 based on the measurement results of the four gap sensors 40 to perform gap alignment between the mask 2 and the substrate 1. (Step 304). Next, the main controller 50 drives the X stage 5 by the X stage drive circuit 61, drives the Y stage 7 by the Y stage drive circuit 62, drives the θ stage 8 by the θ stage drive circuit 63, and performs exposure. At the position, the chuck 10 is moved in the XY direction and rotated in the θ direction to align the substrate 1 (step 305).

  After the gap alignment between the mask 2 and the substrate 1 is completed, the main controller 50 determines the position in the Z direction of each Z-tilt mechanism 30 after the gap alignment or the Z direction of each Z-tilt mechanism 30 after the gap alignment. A position that is a first predetermined distance above this position is determined as a registered position for that shot of each Z-tilt mechanism 30 and stored (step 306).

  After the gap alignment between mask 2 and substrate 1 is completed, main controller 50 determines whether or not the gap alignment has been completed for all shots (step 307). When the gap alignment has not been completed for all shots, main controller 50 drives each Z-tilt mechanism 30 by Z-tilt mechanism drive circuit 64 to set each Z-tilt mechanism 30 to a predetermined mask 2. And the substrate 1 are moved to a retracted position where there is no fear of contact (step 308). Subsequently, the main controller 50 drives the X stage 5 by the X stage drive circuit 61 and drives the Y stage 7 by the Y stage drive circuit 62 to perform step movement of the substrate 1 in the XY directions (Step 309). ), The substrate 1 is moved to the position where the next shot is performed. Then, the process returns to step 304, and steps 304 to 309 are repeated until gap matching is completed for all shots. For each shot, main controller 50 raises the position of each Z-tilt mechanism 30 after gap alignment in the Z direction or the position of each Z-tilt mechanism 30 after gap alignment in the Z direction by a first predetermined distance. Is stored as a registered position for each shot of each Z-tilt mechanism 30. Here, the first predetermined distance is a distance at which the mask 2 and the substrate 1 are not in contact with each other when the substrate 1 is moved stepwise in the XY direction.

  When all shots are completed, the main controller 50 drives each Z-tilt mechanism 30 by the Z-tilt mechanism driving circuit 64 to widen the gap between the mask 2 and the substrate 1 (step 310). The X stage 5 is driven by the stage drive circuit 61 and the Y stage 7 is driven by the Y stage drive circuit 62 to move the chuck 10 to the load / unload position (step 311). Then, at the load / unload position, the substrate 1 is unloaded from the chuck 10 (step 312).

  FIG. 8 is a flowchart showing an example of the operation of the exposure process using the registered position. This example shows an example in which the Z-direction position of each Z-tilt mechanism 30 after gap alignment is determined as the registration position for each shot of each Z-tilt mechanism 30 in step 306 of FIG. First, the substrate 1 is loaded onto the chuck 10 at the load / unload position (step 401). The main controller 50 drives the X stage 5 by the X stage drive circuit 61, drives the Y stage 7 by the Y stage drive circuit 62, drives the θ stage 8 by the θ stage drive circuit 63, and loads / unloads. At the position, the chuck 10 is moved in the XY direction and rotated in the θ direction to perform pre-alignment of the substrate 1 (step 402). Next, main controller 50 drives X stage 5 by X stage drive circuit 61, drives Y stage 7 by Y stage drive circuit 62, moves chuck 10 to the exposure position, and moves substrate 1 to the exposure position. To the position where the first shot is performed (step 403). In parallel with this, the main controller 50 drives each Z-tilt mechanism 30 by the Z-tilt mechanism drive circuit 64 to move each Z-tilt mechanism 30 from the registration position for the first shot in the Z direction. Move to a position above the first predetermined distance (step 404). Here, the first predetermined distance is a distance at which the mask 2 and the substrate 1 are not in contact with each other when the substrate 1 is moved stepwise in the XY direction.

  Subsequently, the main controller 50 drives each Z-tilt mechanism 30 by the Z-tilt mechanism driving circuit 64 based on the measurement results of the four gap sensors 40 to perform gap alignment between the mask 2 and the substrate 1. (Step 405). Next, the main controller 50 drives the X stage 5 by the X stage drive circuit 61, drives the Y stage 7 by the Y stage drive circuit 62, drives the θ stage 8 by the θ stage drive circuit 63, and performs exposure. At the position, the chuck 10 is moved in the XY direction and rotated in the θ direction to align the substrate 1 (step 406).

  After completing the gap alignment between the mask 2 and the substrate 1 and performing a shot (step 407), the main controller 50 determines whether or not all shots have been completed (step 408). When all shots have not been completed, main controller 50 drives each Z-tilt mechanism 30 by Z-tilt mechanism drive circuit 64 to move each Z-tilt mechanism 30 from the registration position for the next shot. It is moved to a position above the first predetermined distance in the Z direction (step 409). Subsequently, the main controller 50 drives the X stage 5 by the X stage drive circuit 61 and drives the Y stage 7 by the Y stage drive circuit 62 to perform step movement of the substrate 1 in the XY directions (Step 410). ), The substrate 1 is moved to the position where the next shot is performed. Then, the process returns to step 405, and steps 405 to 410 are repeated until all shots are completed.

  When all shots are completed, the main controller 50 drives each Z-tilt mechanism 30 by the Z-tilt mechanism driving circuit 64 to widen the gap between the mask 2 and the substrate 1 (step 411), and then X The X stage 5 is driven by the stage drive circuit 61 and the Y stage 7 is driven by the Y stage drive circuit 62 to move the chuck 10 to the load / unload position (step 412). Then, the substrate 1 is unloaded from the chuck 10 at the load / unload position (step 413).

  According to an example of the operation of the exposure process shown in FIG. 8, the registered positions for each shot of each Z-tilt mechanism stored in the exposure process for one substrate are used, and a plurality of subsequent substrates are used. The gap between the mask 2 and the substrate 1 before starting the gap alignment is always kept constant, and the movement amount of the mask 2 is within an upper limit value that does not cause the mask 2 and the substrate 1 to come into contact at the time of gap alignment. It becomes possible to manage. However, since the height of the lower surface of the mask 2 and the surface of the substrate 1 varies depending on the location, in step 409, each Z-tilt mechanism 30 is separated from the registration position for the next shot by a first predetermined distance in the Z direction. The amount of movement of each Z-tilt mechanism 30 required to move to the position is different. For this reason, two stages of operations are required: an operation of moving each Z-tilt mechanism 30 by the same amount of movement and an operation of moving each Z-tilt mechanism 30 by the difference of the necessary amount of movement. It takes.

  FIG. 9 is a flowchart showing the operation of the exposure processing using the gap control method of the proximity exposure apparatus according to one embodiment of the present invention. The present embodiment shows a case where the position in the Z direction of each Z-tilt mechanism 30 after gap alignment is determined as the registration position for that shot of each Z-tilt mechanism 30 in step 306 of FIG. First, the substrate 1 is loaded onto the chuck 10 at the load / unload position (step 501). The main controller 50 drives the X stage 5 by the X stage drive circuit 61, drives the Y stage 7 by the Y stage drive circuit 62, drives the θ stage 8 by the θ stage drive circuit 63, and loads / unloads. At the position, the chuck 10 is moved in the XY direction and rotated in the θ direction to perform pre-alignment of the substrate 1 (step 502). Next, main controller 50 drives X stage 5 by X stage drive circuit 61, drives Y stage 7 by Y stage drive circuit 62, moves chuck 10 to the exposure position, and moves substrate 1 to the exposure position. To the position where the first shot is performed (step 503). In parallel with this, the main controller 50 drives each Z-tilt mechanism 30 by the Z-tilt mechanism drive circuit 64 to move each Z-tilt mechanism 30 from the registration position for the first shot in the Z direction. The first predetermined distance is moved to a position above (step 504). Here, the first predetermined distance is a distance at which the mask 2 and the substrate 1 are not in contact with each other when the substrate 1 is moved stepwise in the XY direction.

  Subsequently, the main controller 50 drives each Z-tilt mechanism 30 by the Z-tilt mechanism driving circuit 64 based on the measurement results of the four gap sensors 40 to perform gap alignment between the mask 2 and the substrate 1. (Step 505). Next, the main controller 50 drives the X stage 5 by the X stage drive circuit 61, drives the Y stage 7 by the Y stage drive circuit 62, drives the θ stage 8 by the θ stage drive circuit 63, and performs exposure. At the position, the chuck 10 is moved in the XY direction and rotated in the θ direction to align the substrate 1 (step 506).

  The alignment of the substrate 1 (step 506) is a distance at which the alignment sensor provided on the substrate 1 and the mask 2 can detect the alignment mark during the gap alignment between the mask 2 and the substrate 1 (step 505). Alternatively, the process may be started when the mask 2 and the substrate 1 approach each other. In that case, the gap alignment between the mask 2 and the substrate 1 (step 505) and the alignment of the substrate 1 (step 506) can be partially performed in parallel, thereby reducing the tact time.

  After completing the gap alignment between the mask 2 and the substrate 1 and performing a shot (step 507), the main controller 50 determines whether or not all shots have been completed (step 508). When all shots have not been completed, main controller 50 drives each Z-tilt mechanism 30 by Z-tilt mechanism drive circuit 64 to cause each Z-tilt mechanism 30 to be a second shorter than the first predetermined distance. Is moved upward by a predetermined distance to widen the gap between the mask 2 and the substrate 1 (step 509). Here, the second predetermined distance is a distance at which the mask 2 and the substrate 1 are not in contact with each other when the substrate 1 is moved stepwise in the XY direction.

  Subsequently, the main controller 50 drives the X stage 5 by the X stage drive circuit 61 and drives the Y stage 7 by the Y stage drive circuit 62 to perform step movement of the substrate 1 in the XY directions (Step 510). ), The substrate 1 is moved to the position where the next shot is performed. In parallel with this, the main controller 50 sets each registration position for each shot of each Z-tilt mechanism 30 and each Z-tilt after the gap between the mask 2 and the substrate 1 is widened by a second predetermined distance. Based on the position of the mechanism 30 in the Z direction, the inclination of the plane formed by the three Z-tilt mechanisms 30 is calculated (step 511). Then, main controller 50 determines, from the calculated plane inclination, the position at which each Z-tilt mechanism 30 of the mask 2 at the measurement point of each gap sensor 40 is separated from the registered position by a first predetermined distance in the Z direction. The amount of movement from when it is at is calculated (step 512). Then, the process returns to step 505, and steps 505 to 512 are repeated until all shots are completed.

  When all shots are completed, main controller 50 drives each Z-tilt mechanism 30 by Z-tilt mechanism drive circuit 64 to widen the gap between mask 2 and substrate 1 (step 513), and then the stage. The X stage 5 is driven by the drive circuit 61, the Y stage 7 is driven by the Y stage drive circuit 62, and the chuck 10 is moved to the load / unload position (step 514). Then, the substrate 1 is unloaded from the chuck 10 at the load / unload position (step 515).

  FIG. 10 is a flowchart showing the operation of an exposure process using the gap control method of the proximity exposure apparatus according to another embodiment of the present invention. In the present embodiment, in step 306 of FIG. 7, the position of each Z-tilt mechanism 30 after the gap alignment is set to a position that is a first predetermined distance above the position in the Z direction of each Z-tilt mechanism 30. The case where it determines as a registration position about is shown. In that case, main controller 50 drives each Z-tilt mechanism 30 by Z-tilt mechanism drive circuit 64 in parallel with step 503 so that each Z-tilt mechanism 30 is registered in the first shot. (Step 504 ′). Further, main controller 50 calculates the amount of movement of mask 2 at the measurement point of each gap sensor 40 when each Z-tilt mechanism 30 is at the registration position from the plane inclination calculated in step 511. (Step 512 ′). Other operations are the same as those of the embodiment shown in FIG.

  In the embodiment shown in FIG. 9 or 10, in the second and subsequent shots, the first gap between the mask 2 and the substrate 1 is set by the Z-tilt mechanism 30 before the step movement of the substrate 1 in the XY direction. Therefore, the Z-tilt mechanism 30 is moved away from the registered position for each shot by the first predetermined distance in the Z direction (each Z after gap adjustment). The XY of the substrate 1 in a state where the gap between the mask 2 and the substrate 1 is narrower than when the position at the first predetermined distance from the position in the Z direction of the tilt mechanism is the registered position) While the step movement in the direction is performed (step 510), the contact between the mask 2 and the substrate 1 is prevented. Then, after stepping the substrate 1 in the XY directions, the gap alignment between the mask 2 and the substrate 1 (step 505) causes the drive of each Z-tilt mechanism 30 to move away from the registered position by a first predetermined distance in the Z direction. Compared to the first shot starting from the first position (registered position when the position separated by the first predetermined distance from the position in the Z direction of each Z-tilt mechanism after gap alignment is the registered position). Done in

  FIG. 11 is a block diagram showing a portion for performing the gap matching operation of the main controller. The main controller 50 performs the gap alignment operation in the Z-tilt mechanism control unit 51, the registration position determination unit 52, the memory 53, the movement amount calculation unit 54, the determination unit 55, the movement amount determination unit 56, and the cumulative value check. A portion 57 is included. The Z-tilt mechanism control unit 51 controls the Z-tilt mechanism drive circuit 64 and detects the position of each Z-tilt mechanism 30 driven by the Z-tilt mechanism drive circuit 64 in the Z direction. For each shot, the registration position determination unit 52 is a first predetermined distance from the position in the Z direction of each Z-tilt mechanism 30 after gap alignment or the position in the Z direction of each Z-tilt mechanism 30 after gap alignment. The position above is determined as the registration position for each shot of each Z-tilt mechanism 30 (step 306 in FIG. 7).

  The memory 53 stores in advance a target value of the gap between the mask 2 and the substrate 1 and an upper limit value of the amount of movement of the mask 2 in the Z direction at each gap sensor 40 measurement point. The registered position for each shot of each determined Z-tilt mechanism 30 is stored. The movement amount calculation unit 54 stores each registered position for each shot of each Z-tilt mechanism 30 stored in the memory 53 and each Z- after the gap between the mask 2 and the substrate 1 is increased by a second predetermined distance. Based on the position of the tilt mechanism 30 in the Z direction, the inclination of the plane constituted by the three Z-tilt mechanisms 30 is calculated (step 511 in FIG. 9), and each of the mask 2 at the measurement point of each gap sensor 40 is calculated. The amount of movement from when the Z-tilt mechanism 30 is located at a position that is a first predetermined distance away from the registered position in the Z direction (step 512 in FIG. 9), or a mask at the measurement point of each gap sensor 40 2, the amount of movement from when each Z-tilt mechanism 30 is in the registered position is calculated (step 512 ′ in FIG. 10).

  FIG. 12 is a flowchart of a gap alignment operation using the gap control method of the proximity exposure apparatus according to an embodiment of the present invention. In the exposure processing operation shown in FIG. 9, when performing the gap alignment between the mask 2 and the substrate 1 (step 505), each gap sensor 40 first sets the gap between the mask 2 and the substrate 1 to the four corners of the mask 2. (Step 601). The determination unit 55 determines whether the gap between the mask 2 and the substrate 1 is within an allowable range based on the target value of the gap between the mask 2 and the substrate 1 stored in the memory 53 and the measurement result of each gap sensor 40. If the gap between the mask 2 and the substrate 1 is within the allowable range (step 602), the gap alignment operation is terminated.

  When the gap between the mask 2 and the substrate 1 is not within the allowable range, the movement amount determination unit 56 is based on the target value of the gap between the mask 2 and the substrate 1 stored in the memory 53 and the measurement result of each gap sensor 40. Then, the amount of movement for moving the mask 2 at the measurement point of each gap sensor 40 is determined, and the amount of movement for moving each Z-tilt mechanism 30 is determined based on them (step 603). The accumulated value confirmation unit 57 is configured such that the movement amount calculation unit 54 determines the measurement point of each gap sensor 40 before the Z-tilt mechanism control unit 51 drives each Z-tilt mechanism 30 by the Z-tilt mechanism drive circuit 64. It is confirmed whether the calculated movement amount of the mask 2 and the cumulative value of the movement amount of the mask 2 determined by the movement amount determination unit 56 are equal to or less than the upper limit value stored in the memory 53 (step 604). When the cumulative amount of movement is less than or equal to the upper limit value, the Z-tilt mechanism control unit 51 drives the Z-tilt mechanism drive circuit 64 and each Z-tilt mechanism 30 is determined by the movement amount determination unit 56. The amount of movement of the Z-tilt mechanism 30 is moved, and the process returns to step 601. If the cumulative value of the movement amount of the mask 2 is not less than or equal to the upper limit value, the gap matching operation is stopped.

  Based on the registration position for each shot of each Z-tilt mechanism 30 and the position in the Z direction of each Z-tilt mechanism 30 after the gap between the mask 2 and the substrate 1 is widened by a second predetermined distance. Each Z-tilt mechanism 30 of the mask 2 at the measurement point of the sensor 40 is positioned at a first predetermined distance in the Z direction from the registered position (from the position in the Z direction of each Z-tilt mechanism 30 after gap alignment). Since the amount of movement from the position at the first predetermined distance as the registered position is a registered position), each Z-tilt mechanism 30 is moved in the Z direction from the registered position for each shot. Without moving to a position separated by a predetermined distance (a registered position when a position separated by a first predetermined distance from the position in the Z direction of each Z-tilt mechanism 30 after gap adjustment is a registered position). Gad The movement amount in the Z direction of the mask 2 at a measuring point of the sensor 40 can be managed. Based on the target value of the gap between the mask 2 and the substrate 1 and the measurement result of the gap between the mask 2 and the substrate 1, the amount of movement of the mask 2 or the substrate 1 at the measurement point of each gap sensor 40 is calculated. Before determining and driving the plurality of Z-tilt mechanisms 30, it is confirmed whether the calculated movement amount and the cumulative value of the determined movement amount are less than or equal to the upper limit values at the measurement points of each gap sensor 40. A position where the tilt mechanism 30 is separated from the registered position for each shot by a first predetermined distance in the Z direction (a position which is separated from the position in the Z direction of each Z-tilt mechanism 30 after gap alignment by a first predetermined distance) When the position is set as the registration position, the gap alignment between the mask 2 and the substrate 1 is performed in a short time without moving to the registration position), and contact between the mask 2 and the substrate 1 is prevented during the gap alignment. .

  According to the embodiment described above, with respect to a plurality of substrates, in the first shot, each Z-tilt mechanism 30 is separated from the registration position for the first shot by a first predetermined distance in the Z direction. After moving to a position (registered position when a position separated from the position in the Z direction of each Z-tilt mechanism 30 after gap alignment by a first predetermined distance is a registered position), the mask 2 is moved by a plurality of gap sensors 40. The gap between the substrate 1 and the substrate 1 is measured at a plurality of locations, and the gap between the mask 2 and the substrate 1 is aligned by a plurality of Z-tilt mechanisms 30 based on the measurement results. Before the step movement to, the gap between the mask 2 and the substrate 1 is widened by a plurality of Z-tilt mechanisms 30 by a second predetermined distance shorter than the first predetermined distance, and the step of moving the substrate 1 in the XY direction is performed. After the movement, the gap between the mask 2 and the substrate 1 is measured at a plurality of positions by a plurality of gap sensors 40, and the gap between the mask 2 and the substrate 1 is adjusted by a plurality of Z-tilt mechanisms 30 based on the measurement result. Therefore, when the substrate 1 is moved stepwise in the XY direction, the mask 2 and the substrate 1 are prevented from contacting each other, and after the substrate 1 is moved stepwise in the XY direction, the gap alignment between the mask 2 and the substrate 1 is performed for a short time. Can be done.

  Further, based on the registration position for each shot of each Z-tilt mechanism 30 and the position in the Z direction of each Z-tilt mechanism after the gap between the mask 2 and the substrate 1 is widened by a second predetermined distance, Each Z-tilt mechanism 30 of the mask 2 at the measurement point of the gap sensor is separated from the registered position by a first predetermined distance in the Z direction (from the Z direction position of each Z-tilt mechanism 30 after gap alignment). The amount of movement from when it is the registration position when the position separated by the first predetermined distance is set as the registration position is calculated, and the target value of the gap between the mask 2 and the substrate 1 and between the mask 2 and the substrate 1 are calculated. Based on the measurement result of the gap, the amount of movement for moving the mask 2 or the substrate 1 at the measurement point of each gap sensor 40 is determined, and before the plurality of Z-tilt mechanisms 30 are driven, the measurement of each gap sensor 40 is performed. To the point The gap between the mask 2 and the substrate 1 is adjusted in a short time by confirming whether the calculated movement amount and the accumulated value of the determined movement amount are equal to or less than the upper limit values. Can be prevented from contacting.

  By exposing the substrate using the proximity exposure apparatus of the present invention, or by aligning the gap between the mask and the substrate using the gap control method of the proximity exposure apparatus of the present invention. Since the gap between the mask and the substrate can be adjusted in a short time, the display panel substrate can be manufactured with high throughput.

  For example, FIG. 13 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 14 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 13, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 14, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the proximity exposure apparatus of the present invention or the gap control method of the proximity exposure apparatus of the present invention can be applied.

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Chuck support stand 10 Chuck 20 Mask holder 21 Holder frame 22 Top frame 23 Air cushion 24 Tilt arm 30 Z-tilt mechanism 31 Casing 32 Linear guide 33 Movable block 34 Motor 35 Shaft joint 36a Ball screw 36b Nut 37 Ball 40 Gap sensor 41 Laser light source 42 Collimation lens group 43 Projection lens 44, 45 Mirror 46 Imaging lens 47 CCD line sensor 50 Main controller 51 Z -Tilt mechanism control unit 52 Registration position determination unit 53 Memory 54 Movement amount calculation unit 55 Determination unit 56 Movement amount determination unit 57 Cumulative value confirmation unit 61 X stage drive circuit 62 Y stage drive circuit 63 θ stage drive circuit 64 Z-tilt mechanism drive circuit

Claims (10)

A chuck for supporting the substrate, a mask holder for holding the mask, and a stage for moving the chuck are provided. The chuck is moved by the stage to perform step movement of the substrate in the XY directions, and a plurality of surfaces of the substrate are arranged. In proximity exposure equipment that divides and exposes shots,
A plurality of Z-tilt mechanisms for relatively moving and tilting the mask holder and the chuck in the Z direction;
Multiple gap sensors that measure the gap between the mask and the substrate at multiple locations;
A drive circuit for driving the plurality of Z-tilt mechanisms;
A control device for controlling the drive circuit,
The control device includes:
Before the step movement of the substrate in the XY direction with respect to one substrate, the drive circuit drives the plurality of Z-tilt mechanisms to widen the gap between the mask and the substrate, and to move the substrate in the XY direction. After the step movement, based on the measurement results of the plurality of gap sensors, the drive circuit drives the plurality of Z-tilt mechanisms to perform gap alignment between the mask and the substrate, and after the gap alignment in the first shot The Z direction position of each Z-tilt mechanism is stored as a registered position for the first shot of each Z-tilt mechanism,
In the first shot with respect to a plurality of substrates thereafter, the drive circuit drives the plurality of Z-tilt mechanisms to move each Z-tilt mechanism in the Z direction from the registration position for the first shot. After moving to a position separated by the first predetermined distance, based on the measurement results of the plurality of gap sensors, the drive circuit drives the plurality of Z-tilt mechanisms to perform gap alignment between the mask and the substrate. In the second and subsequent shots, the plurality of Z-tilt mechanisms are driven by the drive circuit before the step movement of the substrate in the XY directions so that the gap between the mask and the substrate is shorter than a first predetermined distance. After the substrate is moved stepwise in the XY direction by a predetermined distance of 2, the drive circuit drives the plurality of Z-tilt mechanisms based on the measurement results of the plurality of gap sensors. To, proximity exposure apparatus which is characterized in that the gap adjustment between the mask and the substrate. The control device includes:
The position in the Z direction of each Z-tilt mechanism after gap alignment is obtained as a registration position for each shot of each Z-tilt mechanism for each shot with respect to one substrate.
Storage means for storing a target value of the gap between the mask and the substrate, a registered position for each shot of each Z-tilt mechanism, and an upper limit value of the amount of movement of the mask or substrate in the Z direction at the measurement point of each gap sensor; ,
Based on the registered position for each shot of each Z-tilt mechanism stored in the storage means and the position in the Z direction of each Z-tilt mechanism after the gap between the mask and the substrate is widened by a second predetermined distance. A movement amount calculating means for calculating a movement amount of the mask or substrate at the measurement point of each gap sensor when each Z-tilt mechanism is located at a position separated by a first predetermined distance in the Z direction from the registered position; ,
A determination unit for determining whether a gap between the mask and the substrate is within an allowable range based on a target value of the gap between the mask and the substrate stored in the storage unit and a measurement result of the plurality of gap sensors;
Based on the target value of the gap between the mask and the substrate stored in the storage means and the measurement results of the plurality of gap sensors, the movement for determining the amount of movement of the mask or substrate at the measurement point of each gap sensor A quantity determining means;
Prior to driving the plurality of Z-tilt mechanisms by the drive circuit, the movement amount calculated by the movement amount calculation unit and the cumulative value of the movement amount determined by the movement amount determination unit at the measurement point of each gap sensor are 2. The proximity exposure apparatus according to claim 1, further comprising: a confirmation unit configured to confirm whether the value is equal to or less than an upper limit value stored in the storage unit. A chuck for supporting the substrate, a mask holder for holding the mask, and a stage for moving the chuck are provided. The chuck is moved by the stage to perform step movement of the substrate in the XY directions, and a plurality of surfaces of the substrate are arranged. In proximity exposure equipment that divides and exposes shots,
A plurality of Z-tilt mechanisms for relatively moving and tilting the mask holder and the chuck in the Z direction;
Multiple gap sensors that measure the gap between the mask and the substrate at multiple locations;
A drive circuit for driving the plurality of Z-tilt mechanisms;
A control device for controlling the drive circuit,
The control device includes:
Before the step movement of the substrate in the XY direction with respect to one substrate, the drive circuit drives the plurality of Z-tilt mechanisms to widen the gap between the mask and the substrate, and to move the substrate in the XY direction. After the step movement, based on the measurement results of the plurality of gap sensors, the drive circuit drives the plurality of Z-tilt mechanisms to perform gap alignment between the mask and the substrate, and after the gap alignment in the first shot A position away from the position in the Z direction of each Z-tilt mechanism by a first predetermined distance as a registered position for the first shot of each Z-tilt mechanism;
After the plurality of substrates thereafter, in the first shot, the plurality of Z-tilt mechanisms are driven by the drive circuit, and each Z-tilt mechanism is moved to the registration position for the first shot. Based on the measurement results of the plurality of gap sensors, the drive circuit drives the plurality of Z-tilt mechanisms to adjust the gap between the mask and the substrate, and in the second and subsequent shots, in the XY direction of the substrate. Before the step movement, the plurality of Z-tilt mechanisms are driven by the driving circuit to widen the gap between the mask and the substrate by a second predetermined distance shorter than the first predetermined distance, and to move the substrate in the XY direction. After step movement, based on the measurement results of the plurality of gap sensors, the drive circuit drives the plurality of Z-tilt mechanisms to adjust the gap between the mask and the substrate. A proximity exposure apparatus according to claim Ukoto. The control device includes:
For each shot, a registration position for each shot of each Z-tilt mechanism is a position separated by a first predetermined distance from the position in the Z direction of each Z-tilt mechanism after gap alignment with respect to one substrate. As sought
Storage means for storing a target value of the gap between the mask and the substrate, a registered position for each shot of each Z-tilt mechanism, and an upper limit value of the amount of movement of the mask or substrate in the Z direction at the measurement point of each gap sensor; ,
Based on the registered position for each shot of each Z-tilt mechanism stored in the storage means and the position in the Z direction of each Z-tilt mechanism after the gap between the mask and the substrate is widened by a second predetermined distance. A movement amount calculating means for calculating a movement amount of the mask or the substrate at the measurement point of each gap sensor from when each Z-tilt mechanism is at the registered position;
A determination unit for determining whether a gap between the mask and the substrate is within an allowable range based on a target value of the gap between the mask and the substrate stored in the storage unit and a measurement result of the plurality of gap sensors;
Based on the target value of the gap between the mask and the substrate stored in the storage means and the measurement results of the plurality of gap sensors, the movement for determining the amount of movement of the mask or substrate at the measurement point of each gap sensor A quantity determining means;
Prior to driving the plurality of Z-tilt mechanisms by the drive circuit, the movement amount calculated by the movement amount calculation unit and the cumulative value of the movement amount determined by the movement amount determination unit at the measurement point of each gap sensor are 4. The proximity exposure apparatus according to claim 3, further comprising: a confirmation unit configured to confirm whether the value is equal to or less than an upper limit value stored in the storage unit. A chuck for supporting the substrate, a mask holder for holding the mask, and a stage for moving the chuck are provided. The chuck is moved by the stage to perform step movement of the substrate in the XY directions so that one surface of the substrate is made into a plurality of shots. A gap control method for a proximity exposure apparatus that performs exposure separately.
A plurality of Z-tilt mechanisms that move and tilt the mask holder and the chuck in the Z direction relatively, and a plurality of gap sensors that measure the gap between the mask and the substrate at a plurality of locations,
For one board,
Before step movement of the substrate in the XY direction, the gap between the mask and the substrate is widened by a plurality of Z-tilt mechanisms,
After step movement in the XY direction of the substrate, the gap between the mask and the substrate is measured at a plurality of positions by a plurality of gap sensors, and based on the measurement result, the gap between the mask and the substrate is adjusted by a plurality of Z-tilt mechanisms.
At the first shot, the position in the Z direction of the Z- tilt mechanism after the gap adjustment, and stored as a registered position for the first shot of each Z- tilt mechanism,
For multiple boards after that,
In the first shot, each Z-tilt mechanism is moved from the registration position for the first shot to a position separated by a first predetermined distance in the Z direction, and then the gap between the mask and the substrate is set by a plurality of gap sensors. Measure at multiple locations, and based on the measurement results, adjust the gap between the mask and the substrate with multiple Z-tilt mechanisms,
In the second and subsequent shots, before the step movement of the substrate in the XY direction, the gap between the mask and the substrate is widened by a second predetermined distance shorter than the first predetermined distance by a plurality of Z-tilt mechanisms. After step movement in the direction, the gap between the mask and the substrate is measured at a plurality of positions by a plurality of gap sensors, and the gap between the mask and the substrate is adjusted by a plurality of Z-tilt mechanisms based on the measurement result. Gap control method for proximity exposure apparatus. The position in the Z direction of each Z-tilt mechanism after gap alignment is obtained as a registration position for each shot of each Z-tilt mechanism for each shot with respect to one substrate.
Stores the target value of the gap between the mask and the substrate, the registration position for each shot of each Z-tilt mechanism, and the upper limit of the amount of movement of the mask or substrate in the Z direction at the measurement point of each gap sensor,
Based on the registration position for each shot of each Z-tilt mechanism and the position in the Z direction of each Z-tilt mechanism after the gap between the mask and the substrate has been widened by a second predetermined distance, the measurement point of each gap sensor Calculating the amount of movement of each mask or substrate at a position where each Z-tilt mechanism is at a position separated by a first predetermined distance in the Z direction from the registered position;
Based on the target value of the gap between the mask and the substrate and the measurement result of the gap between the mask and the substrate, determine whether the gap between the mask and the substrate is within an allowable range,
Based on the target value of the gap between the mask and the substrate and the measurement result of the gap between the mask and the substrate, the amount of movement of the mask or the substrate at the measurement point of each gap sensor is determined,
6. The method according to claim 5, wherein before driving the plurality of Z-tilt mechanisms, it is confirmed whether the calculated movement amount and the cumulative value of the determined movement amount are equal to or less than an upper limit value at each measurement point of each gap sensor. A gap control method for a proximity exposure apparatus as described. A chuck for supporting the substrate, a mask holder for holding the mask, and a stage for moving the chuck are provided. The chuck is moved by the stage to perform step movement of the substrate in the XY directions so that one surface of the substrate is made into a plurality of shots. A gap control method for a proximity exposure apparatus that performs exposure separately.
A plurality of Z-tilt mechanisms that move and tilt the mask holder and the chuck in the Z direction relatively, and a plurality of gap sensors that measure the gap between the mask and the substrate at a plurality of locations,
For one board,
Before step movement of the substrate in the XY direction, the gap between the mask and the substrate is widened by a plurality of Z-tilt mechanisms,
After step movement in the XY direction of the substrate, the gap between the mask and the substrate is measured at a plurality of positions by a plurality of gap sensors, and based on the measurement result, the gap between the mask and the substrate is adjusted by a plurality of Z-tilt mechanisms.
The position in the first shot that is separated from the position in the Z direction of each Z-tilt mechanism after gap adjustment by a first predetermined distance is stored as a registered position for the first shot of each Z-tilt mechanism;
For multiple boards after that,
In the first shot, after each Z-tilt mechanism is moved to the registration position for the first shot, the gap between the mask and the substrate is measured at a plurality of locations by a plurality of gap sensors, and a plurality of The gap between the mask and the substrate is adjusted by the Z-tilt mechanism.
In the second and subsequent shots, before the step movement of the substrate in the XY direction, the gap between the mask and the substrate is widened by a second predetermined distance shorter than the first predetermined distance by a plurality of Z-tilt mechanisms. After step movement in the direction, the gap between the mask and the substrate is measured at a plurality of positions by a plurality of gap sensors, and the gap between the mask and the substrate is adjusted by a plurality of Z-tilt mechanisms based on the measurement result. Gap control method for proximity exposure apparatus. For each shot, a registration position for each shot of each Z-tilt mechanism is a position separated by a first predetermined distance from the position in the Z direction of each Z-tilt mechanism after gap alignment with respect to one substrate. As sought
Stores the target value of the gap between the mask and the substrate, the registration position for each shot of each Z-tilt mechanism, and the upper limit of the amount of movement of the mask or substrate in the Z direction at the measurement point of each gap sensor,
Based on the registration position for each shot of each Z-tilt mechanism and the position in the Z direction of each Z-tilt mechanism after the gap between the mask and the substrate has been widened by a second predetermined distance, the measurement point of each gap sensor The amount of movement of the mask or substrate at the time when each Z-tilt mechanism is at the registered position is calculated,
Based on the target value of the gap between the mask and the substrate and the measurement result of the gap between the mask and the substrate, determine whether the gap between the mask and the substrate is within an allowable range,
Based on the target value of the gap between the mask and the substrate and the measurement result of the gap between the mask and the substrate, the amount of movement of the mask or the substrate at the measurement point of each gap sensor is determined,
8. The method according to claim 7, wherein before driving the plurality of Z-tilt mechanisms, it is confirmed whether the calculated movement amount and the accumulated value of the determined movement amount are equal to or less than an upper limit value at each measurement point of each gap sensor. A gap control method for a proximity exposure apparatus as described.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the proximity exposure apparatus according to any one of claims 1 to 4.   9. A display panel, wherein the gap is adjusted between the mask and the substrate by using the gap control method of the proximity exposure apparatus according to claim 5, and the substrate is exposed. A method for manufacturing a substrate.

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