JP5392946B2 - Proximity exposure apparatus, mask transfer method for proximity exposure apparatus, and method for manufacturing display panel substrate - Google Patents

Description

  The present invention relates to a proximity exposure apparatus that exposes a substrate using a proximity method in the manufacture of a display panel substrate such as a liquid crystal display device, a mask transport method for the proximity exposure apparatus, and a display panel using the same. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate manufacturing method, and in particular, a proximity exposure apparatus suitable for positioning a large mask and mounting it on a mask holder, a mask transport method for the proximity exposure apparatus, and a display panel substrate manufacturing using the same. Regarding the method.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  The proximity exposure apparatus includes a chuck on which a substrate is mounted and a mask holder that holds a mask, and performs exposure by bringing a mask held on the mask holder and a substrate mounted on the chuck very close to each other. Usually, the chuck is mounted on a stage that moves and positions the substrate, and fixes the substrate by vacuum suction. The mask holder is provided above the chuck on which the substrate is mounted, and fixes the periphery of the mask by vacuum suction. In order to avoid contact between the mask and the substrate, loading of the substrate away from the exposure position under the mask is usually performed by the handling arm of the substrate transfer robot. / Performed at the unload position. After the substrate is mounted on the chuck at the load / unload position, the stage moves to the exposure position under the mask, and the substrate is positioned at the exposure position.

  Conventionally, the mask is carried into the mask holder and the mask is carried out from the mask holder by a handling arm of a mask carrying robot. However, since the handling arm of the mask transfer robot is cantilevered, if the mask becomes large and its weight increases, the handling arm will bend and it will not be possible to support the mask horizontally, and the handling arm will shake. Has become larger, and it has become difficult to secure a stroke for moving the mask holder downward. On the other hand, in Patent Document 1, a mask temporary support member is provided on the outer peripheral edge of the chuck, the mask is placed on the temporary support member, and the conveyance error of the mask is corrected by the stage so A technique for pressing a mask against the lower end surface of a mask holder by a connected Z-axis direction drive mechanism is disclosed.

JP 2003-186199 A

  In recent years, in the manufacture of various substrates for display panels, a relatively large substrate is prepared in order to cope with an increase in size and a variety of sizes, and one or a plurality of substrates can be selected from one substrate depending on the size of the display panel. Manufactures display panel substrates. In this case, in the proximity method, if one surface of the substrate is to be exposed at once, a mask having the same size as the substrate is required, and the cost of the expensive mask is further increased. In view of this, the mainstream method is to divide and expose one surface of a substrate into a plurality of shots while using a mask that is relatively smaller than the substrate and moving the substrate stepwise in the XY direction by a stage. In this method, since the mask is smaller than the substrate mounted on the chuck, the technique described in Patent Document 1 cannot be applied.

  In view of this, it has been proposed that the chuck is provided with a plurality of push-up pins that rise from the inside of the chuck and receive the mask from the mask transfer robot and attach it to the mask holder (Japanese Patent Application No. 2008-287941). Since the mask is received from the mask transfer robot by the plurality of push-up pins provided on the chuck, the mask can be carried into the chuck even if the mask is smaller than the substrate mounted on the chuck. Then, the chuck is moved by the stage to position the mask, and the mask is mounted on the mask holder by the plurality of push-up pins. Therefore, the mask carried into the chuck is accurately positioned by the stage and mounted on the mask holder. .

  The mask is made of quartz, blue plate glass, or the like, and a pattern is formed by a chromium film or the like that blocks exposure light. The chuck is made of a light metal material such as aluminum for weight reduction, and the surface is subjected to hard black alumite processing or the like to suppress the reflectance of exposure light. In the case where a push-up pin is provided on the chuck, if the material of the tip of the push-up pin is different from the material on the surface of the chuck, the reflectance of the exposure light is different during the exposure of the substrate, resulting in uneven exposure. On the other hand, if the material of the tip of the push-up pin is the same as the material of the chuck surface, the mask is rubbed by the push-up pin when the mask is received from the mask transfer robot or when the mask is mounted on the mask holder. There is a risk of damage.

  An object of the present invention is to prevent damage to a mask due to a push-up pin and to suppress exposure unevenness during exposure. Furthermore, an object of the present invention is to manufacture a high-quality display panel substrate.

  A proximity exposure apparatus according to the present invention includes a chuck on which a substrate is mounted, a mask holder that holds the mask, and a stage that moves the chuck, and a fine gap is provided between the mask and the substrate to form a mask pattern. In a proximity exposure apparatus that transfers a mask onto a substrate, a mask transfer device that carries the mask into the chuck, and a plurality of chucks that are provided on the chuck, lift from the inside of the chuck, receive the mask from the mask transfer device, and are mounted on the mask holder A push-up pin, a pin-tip changing means for changing the tips of the plurality of push-up pins, and a control means for controlling the movement of the stage to position the mask. Before receiving from the mask transfer device, change the tip of each push pin to a material softer than the mask, After the number of push-up pins wears the mask to the mask holder, it is to change the tip of each push-up pin of the same material as the surface of the chuck.

  The proximity exposure apparatus mask transport method of the present invention includes a chuck for mounting a substrate, a mask holder for holding the mask, and a stage for moving the chuck, and a minute gap is formed between the mask and the substrate. A mask exposure method for a proximity exposure apparatus for transferring a mask pattern to a substrate, wherein the chuck is provided with a plurality of push-up pins rising from the inside of the chuck, and the tip of each push-up pin is made of a material softer than the mask. The mask is transferred to the chuck by the mask transfer device, the mask is received from the mask transfer device by a plurality of push-up pins, the chuck is moved by the stage, the mask is positioned, and the mask is moved by the plurality of push-up pins. After mounting on the mask holder, the tip of each push pin is made of the same material as the chuck surface It is intended to change the things.

  The chuck is provided with a plurality of push-up pins rising from the inside of the chuck, the mask is carried into the chuck by the mask transfer device, the mask is received from the mask transfer device by the plurality of push-up pins, the chuck is moved by the stage, and the mask is moved. Positioning is performed, and the mask is mounted on the mask holder by a plurality of push-up pins, so that the mask is positioned with high accuracy and mounted on the mask holder. At this time, the tip of each push-up pin is changed to a material softer than the mask, and the mask is received from the mask transfer device by the plurality of push-up pins, so that the mask is prevented from being damaged by the push-up pins. Then, after the mask is mounted on the mask holder with a plurality of push-up pins, the tip of each push-up pin is changed to the same material as the surface of the chuck, so that uneven exposure during exposure is suppressed.

  Furthermore, in the proximity exposure apparatus of the present invention, the tips of the plurality of push-up pins are made of a material softer than the mask, and the pin tip changing means attaches a pad made of the same material as the chuck surface to the tips of the plurality of push-up pins. Alternatively, the tip of the plurality of push-up pins is changed by removing the pad from the tip of the plurality of push-up pins. In the mask exposure method of the proximity exposure apparatus of the present invention, the tip of each push-up pin is made of a material softer than the mask, and a pad of the same material as the chuck surface is attached to the tip of each push-up pin, or each push-up The pad is removed from the tip of the pin, and the tip of each push-up pin is changed. The tip of each push-up pin can be easily changed to a material softer than the mask simply by removing the pad, and can be easily changed to the same material as the chuck surface simply by attaching the pad.

  Furthermore, in the proximity exposure apparatus of the present invention, the plurality of push-up pins are peripheral portions of two sides facing each other at the same interval of the first mask and the second mask having a length that is different from the first mask in either length or width. A plurality of common push-up pins for supporting the second mask, a plurality of first dedicated push-up pins for supporting the peripheral portions of the remaining two opposite sides of the first mask, and a peripheral portion of the remaining two opposite sides of the second mask And a plurality of second dedicated push-up pins. In the mask exposure method of the proximity exposure apparatus according to the present invention, the periphery of two opposite sides of the first mask and the second mask that are different in length from the first mask in the vertical and horizontal directions are the same. A plurality of common push-up pins for supporting the first mask, a plurality of first dedicated push-up pins for supporting the peripheral portions of the remaining two opposite sides of the first mask, and a peripheral portion of the remaining two opposite sides of the second mask And a plurality of second dedicated push-up pins. Since the common push-up pin can be shared for transporting the first mask and the second mask having a length or width different from that of the first mask, the number of push-up pins corresponds to two types of masks. be able to.

  The method for producing a display panel substrate according to the present invention exposes a substrate using any one of the above-described proximity exposure apparatuses, or masks using any one of the above-described proximity exposure apparatus mask transport methods. It is mounted on a mask holder and the substrate is exposed. Exposure unevenness due to the push-up pins for mask conveyance provided on the chuck is suppressed, and a high-quality display panel substrate is manufactured.

  According to the proximity exposure apparatus and the mask holding method of the proximity exposure apparatus of the present invention, the tip of each push-up pin is changed to a material softer than the mask, and the mask is received from the mask transport device by a plurality of push-up pins. After the mask is mounted on the mask holder with a plurality of push-up pins, the tip of each push-up pin is changed to the same material as the chuck surface to prevent damage to the mask by the push-up pins and uneven exposure during exposure Can be suppressed.

  Furthermore, according to the proximity exposure apparatus and the mask transport method of the proximity exposure apparatus of the present invention, the tip of each push pin is made of a material softer than the mask, and the tip of each push pin is made of the same material as the surface of the chuck. By attaching the pad or removing the pad from the tip of each push-up pin and changing the tip of each push-up pin, the tip of each push-up pin can be easily changed to a material softer than the mask simply by removing the pad It can be changed to the same material as the chuck surface simply by attaching a pad.

  Furthermore, according to the proximity exposure apparatus and the mask conveyance method of the proximity exposure apparatus of the present invention, the distance between the first mask and the second mask having a length or width different from that of the first mask on the chuck. A plurality of common push-up pins that support the same two-side periphery, a plurality of first dedicated push-up pins that support the remaining two-side periphery of the first mask, and the remaining face of the second mask By providing a plurality of second dedicated push-up pins that support the peripheral portions of the two sides, the shared push-up pins can be transferred to the first mask and the second mask that is different in length from the first mask in either the vertical or horizontal direction. Therefore, it is possible to deal with two types of masks with a small number of push-up pins.

  According to the method for manufacturing a display panel substrate of the present invention, it is possible to suppress uneven exposure due to the push-up pins for transporting the mask provided on the chuck, and thus it is possible to manufacture a high-quality display panel substrate.

It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. 1 is a plan view of a proximity exposure apparatus according to an embodiment of the present invention. It is a top view of a chuck. 4A is a top view of an opening provided in the chuck, and FIG. 4B is a cross-sectional view taken along a line AA in FIG. 4A. FIG. 5A is a top view of an opening provided in the chuck, and FIG. 5B is a cross-sectional view taken along the line BB in FIG. 5A. It is a figure which shows the control system of a push-up pin unit. It is a top view which shows arrangement | positioning of a pad attachment / detachment apparatus and a wide-field camera. It is a side view which shows arrangement | positioning of a pad attachment / detachment apparatus and a wide-field camera. FIG. 9A is a side view of the pad attaching / detaching device, and FIG. 9B is a front view of the pad attaching / detaching device. It is a figure explaining operation | movement of a pad attachment / detachment apparatus. It is a figure explaining operation | movement of a pad attachment / detachment apparatus. It is a figure explaining operation | movement of a push-up pin unit and a mask conveyance robot. It is a figure which shows the state in which the mask was carried in to the chuck | zipper in a mask receiving position. It is a bottom view of a mask holder. It is a bottom view of a mask holder. It is a top view of a mask holder. It is a figure explaining the operation | movement which mounts | wears a mask holder with a mask. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of a proximity exposure apparatus according to an embodiment of the present invention. The proximity exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck support base 9, a chuck 10, a push pin unit, a push pin unit control system, and a mask holder. 20, pad attaching / detaching device 31, mask transport robot 40, mask stocker 42, wide-field camera 51, high-resolution movable camera 52, camera moving mechanism 53, high-resolution fixed camera 54, image processing device 55, X stage drive circuit 71, Y A stage driving circuit 72, a θ stage driving circuit 73, and a main controller 80 are included.

  In FIG. 1, the control system of the push-up pin unit, the mask transport robot 40, the mask stocker 42, and the camera moving mechanism 53 are omitted. In FIG. 2, the control system of the push-up pin unit, the image processing device 55, the X stage drive circuit 71, the Y stage drive circuit 72, the θ stage drive circuit 73, and the main control device 80 are omitted. In addition to these, the proximity exposure apparatus includes an irradiation optical system that irradiates exposure light, a gap sensor, an alignment sensor, a temperature control unit that manages temperature in the apparatus, and the like.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  In FIG. 2, the chuck 10 is in a mask receiving position where the mask 2 is received. The mask transport robot 40 takes out the mask 2 from the mask stocker 42 and carries it into the chuck 10 at the mask receiving position, and carries the mask 2 out of the chuck 10 at the mask receiving position and stores it in the mask stocker 42. To do. The handling arm 41 of the mask transfer robot 40 is provided with a mask support portion 41a that comes into contact with the peripheral portion on which the pattern surface (lower surface) of the mask 2 is not formed. The handling arm 41 includes the mask support portion 41a. Thus, the peripheral portion of the pattern surface (lower surface) of the mask 2 is supported.

  A push-up pin of a push-up pin unit, which will be described later, receives the mask 2 from the handling arm 41 of the mask transfer robot 40 when carrying the mask 2 into the chuck 10 and handles the mask transfer robot 40 when carrying the mask 2 out of the chuck 10. Transfer the mask 2 to the arm 41. As will be described later, the mask 2 carried into the chuck 10 is moved to a mask mounting position under the mask holder 20 and mounted on the mask holder 20 at the mask mounting position.

  When the substrate is exposed, the chuck 10 is first moved to a load / unload position where the substrate is loaded / unloaded. In the load / unload position, the substrate is loaded onto the chuck 10 and the substrate is unloaded from the chuck 10. The chuck 10 loaded with the substrate is moved from the load / unload position to the exposure position where the substrate is exposed.

  A mask holder 20 for holding the mask 2 is installed above the exposure position. The mask holder 20 holds the periphery of the mask 2 by vacuum suction. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. During exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate, whereby the pattern of the mask 2 is transferred to the surface of the substrate 1 and a pattern is formed on the substrate 1.

  In FIG. 1, a chuck 10 is mounted on a θ stage 8 via a chuck support 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves along the X guide 4 in the X direction (the horizontal direction in FIG. 1). The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves along the Y guide 6 in the Y direction (the depth direction in FIG. 1). The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support 9 is mounted on the θ stage 8 and supports the back surface of the chuck 10 at a plurality of locations. The X stage drive circuit 71, the Y stage drive circuit 72, and the θ stage drive circuit 73 drive the X stage 5, the Y stage 7, and the θ stage 8 under the control of the main controller 80, respectively.

  The chuck 10 is moved between the load / unload position and the exposure position by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. At the load / unload position, the pre-alignment of the substrate mounted on the chuck 10 is performed by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Done. At the exposure position, the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction cause a step movement of the substrate mounted on the chuck 10 in the XY direction. Then, the substrate is aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Further, the gap between the mask 2 and the substrate is adjusted by moving and tilting the mask holder 20 in the Z direction (the vertical direction in FIG. 1) by a Z-tilt mechanism (not shown).

  In the present embodiment, the gap between the mask 2 and the substrate is adjusted by moving and tilting the mask holder 20 in the Z direction. However, the chuck support 9 is provided with a Z-tilt mechanism to The gap between the mask 2 and the substrate may be adjusted by moving and tilting 10 in the Z direction.

  FIG. 3 is a top view of the chuck. On the surface of the chuck 10, a not-shown convex portion, a bank, and a suction hole are provided. The convex portion has a pin shape with a diameter of several mm, and a plurality of convex portions are provided on the surface of the chuck 10 at a predetermined interval. When the substrate is mounted on the chuck 10, the convex portion supports the substrate at a plurality of points. At this time, a space is formed between the portion other than the convex portion on the surface of the chuck 10 and the substrate. The bank is a continuous wall having a predetermined width, and divides a space formed between a portion other than the convex portion on the surface of the chuck 10 and the substrate into a plurality of vacuum compartments. The bank is not a straight line but an irregular line so that the surface shape of the chuck 10 is difficult to be recognized by the human eye when a back surface transfer in which the surface shape of the chuck 10 is baked onto the surface of the substrate occurs. A plurality of suction holes are provided at predetermined intervals in portions other than the convex portions and the bank of the surface of the chuck 10, and evacuation of each vacuum section divided by the bank is performed.

  Further, the chuck 10 is provided with a plurality of push-up pins for receiving / delivering a substrate (not shown). The push-up pins for receiving / delivering the substrate are lifted from the surface of the chuck 10 to load the substrate onto the chuck 10, receive the substrate from a substrate transfer robot (not shown), and unload the substrate from the chuck (not shown). Deliver the substrate to the substrate transfer robot.

  In FIG. 3, a plurality of openings into which a push-up pin unit, which will be described later, is inserted are provided near the center of the chuck 10, and a lid 13 is fitted in the openings. The lid 13 is provided with a through hole, and push pins 12a, 12b, and 12c are inserted into the through hole from below the lid 13.

  The present embodiment shows an example in which two types of masks are handled: a mask 2a and a mask 2b which is different from the mask 2a in either length or width. In FIG. 3, the masks 2a and 2b are indicated by broken lines. When handling the mask 2a, the push-up pins 12c support the peripheral portions of the two opposite sides having the same distance as the mask 2b of the mask 2a, and the push-up pins 12a support the peripheral portions of the remaining two opposite sides of the mask 2a. When handling the mask 2b, the push-up pins 12c support the peripheral portions of the two opposite sides having the same distance as the mask 2a of the mask 2b, and the push-up pins 12b support the peripheral portions of the remaining two opposite sides of the mask 2b. Since the push-up pins 12c can be shared for transporting the mask 2a and the mask 2b whose length is different from that of the mask 2a, the two types of masks can be handled with a small number of push-up pins.

  In this embodiment, eight push-up pins 12a, four push-up pins 12b, and eight push-up pins 12c are provided. The positions and number of the push-up pins 12a, 12b, and 12c are the same as those of the mask 2a, It is determined appropriately according to the size of 2b.

  4A is a top view of an opening provided in the chuck, and FIG. 4B is a cross-sectional view taken along a line AA in FIG. 4A. FIG. 5A is a top view of the opening provided in the chuck, and FIG. 5B is a cross-sectional view taken along the line BB in FIG. 5A. The push-up pin unit includes a motor 11, push-up pins 12a, 12b, and 12c, a lid 13, a flange 14, bolts 15 and 17, and a set screw 16.

  The motor 11 includes a pulse motor or a servo motor, a ball screw connected to the pulse motor or the servo motor, and a rod. By driving the ball screw with the pulse motor or the servo motor, the rod storage portion 11a. The rod housed inside moves up and down. At the tip of the rod of the motor 11, push-up pins 12a, 12b, 12c are attached.

  The masks 2a and 2b are made of quartz, blue plate glass, or the like, and a pattern is formed by a chromium film or the like that blocks exposure light. The chuck 10 is made of a light metal material such as aluminum for weight reduction, and the surface is subjected to hard black alumite processing or the like to suppress the reflectance of exposure light. The tips of the push-up pins 12a, 12b, and 12c are made of, for example, a resin material and are softer than the masks 2a and 2b. A pad 30 made of the same material as the surface of the chuck 10 is attached to the tip of the push-up pins 12a, 12b, 12c.

  In FIG. 4B, a flange 14 is attached to the upper surface of the rod storage portion 11 a of the motor 11, and the flange 14 is fixed to the back surface of the lid 13 with a bolt 15. On the other hand, a ring-shaped support plate 18 that supports the lid 13 is attached to the periphery of the opening on the back surface of the chuck 10. The support plate 18 is fixed to the back surface of the chuck 10 by bolts 19.

  4 (a) and 5 (a), a screw hole into which the set screw 16 is screwed and a stepped hole through which the bolt 17 is passed are provided at a plurality of locations around the lid 13. As shown in FIG. In FIG. 4B, the lid 13 is fixed to the support plate 18 by bolts 17 that pass through stepped holes in the periphery of the lid 13. In FIG. 5B, the set screw 16 is screwed into the screw hole in the peripheral portion of the lid 13, protrudes from the bottom surface of the lid 13, and contacts the upper surface of the support plate 18.

  In the present embodiment, when the push-up pin unit is attached to the chuck 10, first, the push-up pin unit is inserted into the opening from above the chuck 10 and the screwing amount of the set screw 16 is adjusted to adjust the height of the push-up pin unit. Adjust the height. Then, the lid 13 is fixed to the support plate 18 with the bolts 17 and the push-up pin unit is attached to the chuck 10. The push-up pin unit is inserted into the opening from above the chuck 10, the mounting height is adjusted by the set screw 16, and the chuck unit is attached to the chuck 10. Even in the vicinity, adjustment of the mounting height of the push-up pin unit is easily performed from above the chuck 10. Therefore, even if the chuck 10 is enlarged with an increase in the size of the substrate, the height of the push-up pins 12a, 12b, 12c can be easily adjusted.

  FIG. 6 is a diagram showing a control system of the push-up pin unit. The push-up pin drive control circuit 50 designates the movement destination of the push-up pins 12a, 12b, and 12c with respect to the motor 11 of each push-up pin unit under the control of the main controller 80, and controls the push-up pins 12a, 12b, and 12c. Instruct to move to the destination. The motor 11 has an encoder inside, and when the push pins 12a, 12b, and 12c reach within a predetermined range from the designated movement destination, the push pin drive control outputs an end signal indicating that the movement is finished. Output to the circuit 50.

  Hereinafter, a mask carrying method of a proximity exposure apparatus according to an embodiment of the present invention will be described. In FIG. 2, a pad attaching / detaching device 31 and a wide-field camera 51 are arranged above the chuck 10 at the mask receiving position. FIG. 7 is a plan view showing the arrangement of the pad attaching / detaching device and the wide-field camera, and FIG. 8 is a side view showing the arrangement of the pad attaching / detaching device and the wide-field camera. In FIG. 7, the masks 2a and 2b are indicated by broken lines. The pad attaching / detaching device 31 is disposed above each push-up pin unit of the chuck 10 at the mask receiving position, and removes the pad 30 from the tip of the push-up pins 12a, 12b, 12c and pushes the pad 30 up as described later. Attach to the tip of 12a, 12b, 12c. The wide-field camera 51 is disposed above the position detection marks provided on the masks 2a and 2b, and acquires images of the position detection marks on the masks 2a and 2b.

  FIG. 9A is a side view of the pad attaching / detaching device, and FIG. 9B is a front view of the pad attaching / detaching device. The pad attaching / detaching device 31 includes an air cylinder table 32, a chuck base 33, an air chuck 34, a bracket 35, and a clamp 36. The air cylinder table 32 drives the air cylinder by the pressure of air supplied from a pneumatic circuit (not shown), and moves the table 32a downward in the drawing. A chuck base 33 having an L-shaped cross section is attached to the table 32 a of the air cylinder table 32, and an air chuck 34 is attached to the lower end of the chuck base 33. As shown in FIG. 9B, the clamps 36 are respectively attached to the two brackets 35 connected to the air chuck 34, and the two clamps 36 are driven by the air chuck 34 as shown in FIG. ) Move in the horizontal direction of the drawing and open and close. Each clamp 36 is provided with a recess 36 a for holding the pad 30.

  10 and 11 are diagrams for explaining the operation of the pad attaching / detaching device. The pad attaching / detaching device 31 lifts up the pad 30 from the tip of the pins 12a, 12b, 12c before the masks 2a, 2b are carried into the chuck 10. Before the pad 30 is attached or detached, the table 32a of the air cylinder table 32 is in a raised state as shown in FIG. 10A, and the clamp 36 is closed. When removing the pad 30 from the tip of the push-up pins 12a, 12b, 12c, each push-up pin unit raises the push-up pins 12a, 12b, 12c from the surface of the chuck 10. After opening the clamp 36, the pad attaching / detaching device 31 lowers the table 32a of the air cylinder table 32, and as shown in FIGS. 10 (b) and 11 (a), the clamp 36 is pushed up and the pins 12a, 12b, 12c are pushed up. Move to the height of the tip. Then, as shown in FIG. 11 (b), the clamp 36 is closed and the pad 30 is held by the recess 36 a of the clamp 36. While the pad 30 is held by the clamp 36, the push-up pins 12a, 12b, and 12c are lowered as shown in FIG. 11B, or the table 32a of the air cylinder table 32 is raised, so that the pad 30 is pushed up. , 12b and 12c are removed. After removing the pad 30 from the tip of the push-up pins 12 a, 12 b, 12 c, the pad attaching / detaching device 31 raises the table 32 a of the air cylinder table 32 again and waits while holding the pad 30 by the clamp 36.

  FIG. 12 is a diagram for explaining the operations of the push-up pin unit and the mask transfer robot. FIG. 12 shows a case where the mask 2a is transported. When carrying the mask 2a into the chuck 10, first, the motor 11 of each push-up pin unit raises the push-up pins 12a and 12c, and the pad attaching / detaching device 31 removes the pad 30 from the tip of the push-up pins 12a and 12c. The mask transfer robot 40 moves the handling arm 41 on which the mask 2a is placed above the chuck 10 (FIG. 12A). Next, the mask transfer robot 40 lowers the handling arm 41, places the mask 2a on the push pins 12a and 12c (FIG. 12B), further lowers the handling arm 41, and supports the mask of the handling arm 41. The part 41a is separated from the mask 2a (FIG. 12C). As a result, the push-up pins 12 a and 12 c receive the mask 2 a from the mask transfer robot 40. Next, the mask transfer robot 40 retracts the handling arm 41 from above the chuck 10 (FIG. 12D). When transporting the mask 2b, push-up pins 12b are used instead of the push-up pins 12a. And when carrying out the masks 2a and 2b from the chuck | zipper 10, an operation | movement contrary to the above is performed.

  A plurality of push-up pin units having a push-up pin 12a, 12b, 12c rising from the inside of the chuck 10 and a motor 11 for moving the push-up pins 12a, 12b, 12c up and down are provided in the chuck 10, and the push-up pins 12a, 12b, 12c Since the masks 2 a and 2 b are received from the mask transport robot 40, the masks 2 a and 2 b can be carried into the chuck 10 even if the masks 2 a and 2 b are smaller than the substrate mounted on the chuck 10.

  Further, the tip of each push-up pin 12a, 12b, 12c can be changed to a material softer than the masks 2a, 2b simply by removing the pad 30. Then, the tip of each push-up pin 12a, 12b, 12c is changed to a material softer than the masks 2a, 2b, and the masks 2a, 2b are received from the mask transport robot 40 by the plurality of push-up pins 12a, 12b, 12c. Damage to the masks 2a, 2b by the push-up pins 12a, 12b, 12c is prevented.

  A spacer installation device (not shown) is installed above the chuck 10 at the mask receiving position. The spacer installation device is placed on the surface of the chuck 10 before the mask transport robot 40 carries the masks 2a and 2b into the chuck 10. Install mask protection spacer. When the chuck 10 is moved from the mask receiving position to the mask mounting position, the motor 11 of each push-up pin unit lowers the push-up pins 12a, 12b, and 12c and places the masks 2a and 2b on the mask protection spacer.

  FIG. 13 is a diagram illustrating a state where the mask is carried into the chuck at the mask receiving position. FIG. 13 shows a case where the mask 2a is transported. When the mask 2b is transported, a push-up pin 12b is used instead of the push-up pin 12a. The wide-field camera 51 disposed above the chuck 10 at the mask receiving position has a wide field of view with a lower resolution than the high-resolution movable camera 52 and the high-resolution fixed camera 54 described later, and push pins 12a, 12b, Images of the position detection marks of the masks 2a and 2b placed on 12c are acquired, and an image signal is output to the image processing device 55 of FIG. The image processing device 55 processes the image signal output from the wide-field camera 51 and detects the positions of the masks 2a and 2b. Even if the positions of the masks 2a and 2b received from the mask transport robot 40 by the push-up pins 12a, 12b and 12c are greatly displaced, the images of the position detection marks on the masks 2a and 2b can be quickly obtained using the wide-field camera 51. Acquired and the positions of the masks 2a and 2b are detected in a short time at the mask receiving position.

  In FIG. 1, the main controller 80 inputs the detection results of the positions of the masks 2a and 2b detected by the image processing device 55 by processing the image signal of the wide-field camera 51, and the mask at the mask receiving position stored in advance. Compared with the reference positions 2a and 2b, the amount of displacement of the positions of the masks 2a and 2b is detected. Subsequently, the main controller 80 controls the X stage drive circuit 71, the Y stage drive circuit 72, and the θ stage drive circuit 73, and moves the chuck 10 by the X stage 5, the Y stage 7, and the θ stage 8. The masks 2a and 2b are moved from the mask receiving position to the mask mounting position below the mask holder 20. At that time, main controller 80 determines and detects the movement amounts of X stage 5, Y stage 7, and θ stage 8 from the coordinates of the reference positions of masks 2a and 2b and the coordinates of the mask mounting position stored in advance. The determined movement amount is corrected based on the displacement amount of the masks 2a and 2b.

  The positions of the masks 2a and 2b are detected at the mask receiving position, and the chuck 10 is moved by the X stage 5, the Y stage 7 and the θ stage 8 based on the detected positions of the masks 2a and 2b, and the masks 2a and 2b are moved. Since the mask is moved from the mask receiving position to the mask mounting position, even if the positions of the masks 2a and 2b received from the mask transport robot 40 by the push-up pins 12a, 12b and 12c are shifted at the mask receiving position, the masks 2a and 2b are mounted on the mask. It is accurately moved to the position.

  14 and 15 are bottom views of the mask holder. FIG. 14 shows a case where the mask 2a is attached, and FIG. 15 shows a case where the mask 2b is attached. In FIGS. 14 and 15, the masks 2a and 2b are indicated by broken lines. The mask holder 20 is provided with openings that are slightly larger than the openings 20a and 20b through which the exposure light passes. Inside the openings, openings 20a and 20b through which the exposure light passes are formed by the holder portions 21a and 21b. Yes. The holder portions 21a and 21b are attached to the lower surface of the mask holder 20 via a guide 24, and are moved along the guide 24 by a moving mechanism such as a ball screw and a motor (not shown). By moving the holder portion 21b along the guide 24, the longitudinal lengths of the openings 20a and 20b through which the exposure light passes are changed in accordance with the sizes of the masks 2a and 2b. The holder portions 21a and 21b are provided with suction grooves (not shown), and the holder portions 21a and 21b hold the peripheral portions of the masks 2a and 2b by vacuum suction using the suction grooves.

  FIG. 16 is a top view of the mask holder. FIG. 16 shows a case where the mask 2a is mounted. The holder portion 21a is provided with a mask position detection window, which will be described later, at the position of the position detection mark of the masks 2a and 2b. Above the mask position detection window, a high-resolution movable camera 52 and a high-resolution fixed camera. 54 is arranged. The high-resolution movable camera 52 is attached to a camera moving mechanism 53, and is moved in the X and Y directions above the mask holder 20 by the camera moving mechanism 53 and rotated in the θ direction. The high resolution fixed camera 54 is fixed above the mask holder 20.

  FIG. 17 is a diagram for explaining the operation of mounting the mask on the mask holder. FIG. 17 shows a case where the mask 2a is mounted. When the mask 2b is mounted, the push-up pin 12b is used instead of the push-up pin 12a. When the masks 2a and 2b are mounted on the mask holder 20 at the mask mounting position, first, the motor 11 of each push-up pin unit is set to a position where the mark for position detection of the masks 2a and 2b falls within the focal range of the high-resolution movable camera 52. Then, the push-up pins 12a, 12b, and 12c are raised (FIG. 17 (a)). The high-resolution movable camera 52 acquires images of the position detection marks of the masks 2a and 2b through the mask position detection window 22 provided in the holder portion 21a. At this time, when the positions of the masks 2a and 2b moved to the mask mounting position are slightly shifted and the position detection marks of the masks 2a and 2b are out of the field of view of the high-resolution movable camera 52, the camera moving mechanism 53 The resolution movable camera 52 is moved, and the position detection marks of the masks 2 a and 2 b are placed in the field of view of the high resolution movable camera 52. The high-resolution movable camera 52 outputs an image signal of the acquired image to the image processing device 55 in FIG. The image processing device 55 processes the image signal output from the high-resolution movable camera 52 and detects the positions of the masks 2a and 2b.

  In FIG. 1, the main control device 80 inputs the detection results of the positions of the masks 2a and 2b detected by the image processing device 55 by processing the image signal of the high-resolution movable camera 52, and at the mask mounting position stored in advance. Compared with the reference positions of the masks 2a and 2b, the displacement amount of the positions of the masks 2a and 2b is detected. Then, the main controller 80 controls the X stage drive circuit 71, the Y stage drive circuit 72, and the θ stage drive circuit 73 based on the detected displacement amount of the masks 2a, 2b, and the X stage 5, The chuck 10 is moved by the Y stage 7 and the θ stage 8, and the masks 2a and 2b are positioned. Even if the positions of the masks 2a and 2b are shifted at the mask mounting position, the positions of the masks 2a and 2b are detected with high accuracy using the high-resolution movable camera 52, and the masks 2a and 2b are positioned with high accuracy.

  In FIG. 17, after the positioning of the masks 2a and 2b is completed, the motor 11 of each push-up pin unit further raises the push-up pins 12a, 12b and 12c and presses the masks 2a and 2b against the holder portions 21a and 21b (FIG. 17). (B)). A negative pressure glass 23 is installed above the masks 2a and 2b pressed against the holder portions 21a and 21b, and a negative pressure chamber is formed between the negative pressure glass 23 and the masks 2a and 2b. After the pressure in the negative pressure chamber is controlled, the holder portions 21a and 21b vacuum-suck the peripheral portions of the masks 2a and 2b with suction grooves (not shown).

  The chuck 10 is moved by the X stage 5, the Y stage 7 and the θ stage 8 to position the masks 2a and 2b, and the masks 2a and 2b are mounted on the mask holder 20 by the push-up pins 12a, 12b and 12c. The masks 2 a and 2 b carried into 10 are accurately positioned by the X stage 5, the Y stage 7, and the θ stage 8 and mounted on the mask holder 20.

  After the holder portions 21a and 21b vacuum-suck the masks 2a and 2b, the high-resolution fixed camera 54 acquires images of the position detection marks of the masks 2a and 2b through the mask position detection window 22 provided in the holder portion 21a. Then, the image signal is output to the image processing device 55 of FIG. The image processing device 55 processes the image signal output from the high resolution fixed camera 54 and detects the positions of the masks 2a and 2b.

  In FIG. 1, the main control device 80 inputs the detection results of the positions of the masks 2a and 2b detected by the image processing device 55 by processing the image signal of the high-resolution fixed camera 54, and at the mask mounting position stored in advance. Compared with the reference positions of the masks 2a and 2b, the shift amounts of the positions of the masks 2a and 2b are detected, and it is determined whether correction of the positions of the masks 2a and 2b is necessary. In the present embodiment, when the positions of the masks 2a and 2b are detected by moving the high-resolution movable camera 52, the detection results of the positions of the masks 2a and 2b include a movement error of the high-resolution movable camera 52. It becomes. For this reason, the positions of the masks 2a and 2b positioned based on the positions of the masks 2a and 2b detected by the image processing device 55 processing the image signal of the high-resolution movable camera 52 are shifted from the reference positions of the masks 2a and 2b. There is a fear.

  When it is necessary to correct the positions of the masks 2a and 2b, the vacuum suction of the masks 2a and 2b is released, the pressure in the negative pressure chamber is returned to atmospheric pressure, and then the push-up pins 12a, 12b and 12c are lowered to 2a and 2b are separated from the holder parts 21a and 21b. Then, the main controller 80 controls the X stage drive circuit 71, the Y stage drive circuit 72, and the θ stage drive circuit 73 based on the detected displacement amount of the masks 2a, 2b, and the X stage 5, The chuck 10 is moved by the Y stage 7 and the θ stage 8 to correct the positions of the masks 2a and 2b. Using the high-resolution fixed camera 54 fixed above the mask holder 20, the positions of the masks 2a and 2b are detected with higher accuracy, and the positions of the positioned masks 2a and 2b are corrected with higher accuracy.

  After correcting the positions of the masks 2a and 2b, the motor 11 of each push-up pin unit raises the push-up pins 12a, 12b and 12c again and presses the masks 2a and 2b against the holder portions 21a and 21b. After controlling the pressure in the negative pressure chamber, the holder portions 21a and 21b vacuum-suck the masks 2a and 2b through suction grooves (not shown). After the mounting of the masks 2a, 2b is completed, the motor 11 of each push-up pin unit lowers the push-up pins 12a, 12b, 12c (FIG. 17 (c)). Then, the chuck 10 is returned to the mask receiving position, the pad 30 is attached to the tip of the push pins 12a, 12b, and 12c by the pad attaching / detaching device 31, and the mask protection spacer is recovered from the surface of the chuck 10 by the spacer installation device (not shown). .

  When the pad 30 is attached to the tip of the push-up pins 12a, 12b, 12c, the pad attaching / detaching device 31 lowers the table 32a of the air cylinder table 32 and holds the pad 30 as shown in FIG. The clamp 36 is moved to the height of the tip of the push-up pins 12a, 12b, 12c, and the pad 30 is pressed against the tip of the push-up pins 12a, 12b, 12c. Then, as shown in FIG. 11A, the clamp 36 is opened and the pad 30 is released. Thereafter, the pad attaching / detaching device 31 raises the table 32a of the air cylinder table 32 again, closes the clamp 36, and stands by.

  The tip of each push-up pin 12a, 12b, 12c can be easily changed to the same material as the surface of the chuck 10 simply by attaching the pad 30. Then, after the masks 2a, 2b are mounted on the mask holder 20 by the plurality of push-up pins 12a, 12b, 12c, the tips of the push-up pins 12a, 12b, 12c are changed to the same material as the surface of the chuck 10, Uneven exposure during exposure is suppressed.

  According to the embodiment described above, the tip of each push-up pin 12a, 12b, 12c is changed to a material softer than the masks 2a, 2b, and the masks 2a, 2b are moved by the plurality of push-up pins 12a, 12b, 12c. After receiving the mask 2a, 2b from the mask transfer robot 40 and attaching the masks 2a, 2b to the mask holder 20 with a plurality of push pins 12a, 12b, 12c, the tips of the push pins 12a, 12b, 12c are made of the same material as the surface of the chuck 10. By changing to, damage to the masks 2a, 2b by the push-up pins 12a, 12b, 12c can be prevented, and uneven exposure during exposure can be suppressed.

  Further, the tip of each push-up pin 12a, 12b, 12c is made of a material softer than the masks 2a, 2b, and a pad 30 made of the same material as the surface of the chuck 10 is attached to the tip of each push-up pin 12a, 12b, 12c, or By removing the pad 30 from the tip of each push-up pin 12a, 12b, 12c and changing the tip of each push-up pin 12a, 12b, 12c, the tip of each push-up pin 12a, 12b, 12c is simply removed from the pad 30. Thus, the material can be changed to a material softer than the masks 2a and 2b, and the material can be changed to the same material as the surface of the chuck 10 simply by attaching the pad 30.

  Further, the chuck 10 has a plurality of common push-up pins 12c that support the peripheral portions of two opposite sides of the mask 2a and the mask 2b that are different in length from the mask 2a in the vertical and horizontal directions, and the rest of the mask 2a. By providing a plurality of dedicated push-up pins 12a that support the peripheral portions of the two sides and a plurality of dedicated push-up pins 12b that support the peripheral portions of the other two opposite sides of the mask 2b, the shared push-up pins 12c are connected to the mask 2a. In addition, since the mask 2a can be shared for transporting the mask 2b whose length is different from that of the mask 2a, two types of masks can be handled with a small number of push-up pins.

  The substrate is exposed using the proximity exposure apparatus of the present invention, or the mask is mounted on the mask holder using the mask transport method of the proximity exposure apparatus of the present invention, and the substrate is exposed to the chuck. Since uneven exposure due to the provided mask transfer push-up pins can be suppressed, a high-quality display panel substrate can be manufactured.

  For example, FIG. 18 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 19 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 18, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 19, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the proximity exposure apparatus of the present invention or the mask transport method of the proximity exposure apparatus of the present invention can be applied.

1 substrate 2, 2a, 2b mask 3 base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 chuck support 10 chuck 11 motor 12a, 12b, 12c push-up pin 13 lid 14 flange 15, 17, 19 bolt 16 Set screw 18 Support plate 20 Mask holder 21a, 21b Holder part 22 Mask position detection window 23 Negative pressure glass 24 Guide 30 Pad 31 Pad attachment / detachment device 32 Air cylinder table 33 Chuck base 34 Air chuck 35 Bracket 36 Clamp 36a Concave part 40 Mask conveyance Robot 41 Handling arm 41a Mask support part 42 Mask stocker 50 Push-up pin drive control circuit 51 Wide field of view camera 52 High resolution movable camera 53 Camera moving mechanism 54 High resolution fixed Camera 55 Image processing device 71 X stage drive circuit 72 Y stage drive circuit 73 θ stage drive circuit 80 Main controller

Claims (6)

Proximity exposure that includes a chuck for mounting a substrate, a mask holder for holding the mask, and a stage for moving the chuck, and provides a minute gap between the mask and the substrate to transfer the mask pattern to the substrate. In the device
A mask carrying device for carrying the mask into the chuck;
A plurality of push-up pins that are provided on the chuck, rise from the inside of the chuck, receive a mask from the mask transfer device, and are attached to the mask holder;
Pin tip changing means for changing tips of the plurality of push-up pins;
Control means for controlling the movement of the stage and positioning the mask;
The plurality of push-up pins are made of a material whose tip is softer than the mask,
The pin tip changing means attaches a pad made of the same material as the surface of the chuck to the tips of the plurality of push-up pins, or removes the pads from the tips of the plurality of push-up pins to change the tips of the push-up pins. change, before receiving the plurality of push-up pins masks from the mask transport apparatus, to change the distal end of each lift pin that of softer than the mask material, after the plurality of push-up pins wears the mask to said mask holder The proximity exposure apparatus is characterized in that the tip of each push-up pin is changed to the same material as the surface of the chuck. The plurality of push-up pins include a plurality of common push-up pins that support the first mask and a second mask that is different in length and width from the first mask and that support the peripheral portions of two sides facing each other at the same interval. A plurality of first dedicated push-up pins that support the peripheral portions of the other two opposite sides of the one mask; and a plurality of second dedicated push-up pins that support the peripheral portions of the other two opposite sides of the second mask. The proximity exposure apparatus according to claim 1 , wherein: Proximity exposure apparatus comprising a chuck for mounting a substrate, a mask holder for holding the mask, and a stage for moving the chuck, and providing a minute gap between the mask and the substrate to transfer the mask pattern to the substrate The mask transport method of
The chuck is provided with a plurality of push-up pins that rise from the inside of the chuck,
The tip of each push pin is made of a material softer than the mask, and a pad of the same material as the chuck surface is attached to the tip of each push pin.
Remove the pad from the tip of each push pin and change the tip of each push pin to a softer material than the mask.
The mask is carried into the chuck by the mask transfer device,
The mask is received from the mask transfer device by a plurality of push-up pins,
Move the chuck by the stage to position the mask,
After attaching the mask to the mask holder with multiple push pins,
A mask transport method for a proximity exposure apparatus , wherein the pad is attached to the tip of each push-up pin, and the tip of each push-up pin is changed to the same material as the surface of the chuck. The chuck includes a plurality of common push-up pins that support the first mask and a second mask that is different in length and width from the first mask, and supports the peripheral portions of two sides facing each other at the same interval, and the first mask A plurality of first dedicated push-up pins for supporting the peripheral portions of the remaining two opposite sides and a plurality of second dedicated push-up pins for supporting the peripheral portions of the remaining two opposite sides of the second mask are provided. A mask carrying method for a proximity exposure apparatus according to claim 3 . A method for manufacturing a display panel substrate, comprising: exposing a substrate using the proximity exposure apparatus according to claim 1 . 5. A method of manufacturing a display panel substrate, comprising: mounting a mask on a mask holder using the mask transport method of the proximity exposure apparatus according to claim 3 or 4, and exposing the substrate.

Images