JP2010128079A - Proximity exposing apparatus, method of supporting the substrate of the same, and manufacturing method of display panel substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce defects due to reverse side transfer in the manufacturing method of a display panel substrate. <P>SOLUTION: Forming a plurality of protrusions 11, 13 or a plurality of protrusions 11 on the substrate supporting surface of the chuck 10, the substrate 1 is supported by the plurality of protrusions 11, 13 or the plurality of protrusions 11. Further, forming suction holes 12 on the protrusions 11, the substrate 1 is vacuum chucked with the suction holes 12. The substrate 1 can be directly vacuum chucked with the suction holes 12 on the protrusions 11 without vacuumizing as before the space between the areas on the chuck 10 excepting the protrusions supporting the substrate and the substrate 1. Thus, the defects due to the reverse side transfer are reduced, since barriers are no more required as before to form vacuumed areas and the shapes of such barriers are not printed on the surface of the substrate 1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a proximity exposure apparatus that exposes a substrate using a proximity method in manufacturing a display panel substrate such as a liquid crystal display device, a substrate support method for the proximity exposure apparatus, and a display panel using the same. More particularly, the present invention relates to a proximity exposure apparatus suitable for exposing a large substrate, a substrate support method for the proximity exposure apparatus, and a display panel substrate manufacturing method using them.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  The proximity exposure apparatus includes a chuck that supports a substrate and a mask holder that holds a mask, and performs exposure by bringing the mask held by the mask holder and the substrate supported by the chuck very close to each other. Conventionally, there are chucks having a flat substrate support surface and those having a plurality of pin-shaped convex portions on the substrate support surface. In the latter, the substrate is supported at a plurality of points by pin-shaped convex portions, and the space between the portion other than the pin-shaped convex portions and the substrate is evacuated to support the substrate by vacuum suction. In such a chuck, in order to vacuum-suck a large substrate evenly, the space between the substrate and the portion other than the pin-shaped convex portion and the substrate is divided into a plurality of vacuum compartments for evacuation. For this reason, banks (lines) for forming a plurality of vacuum sections have been provided on the substrate support surface.

  In a substrate that transmits light, such as a glass substrate, the light transmitted through the substrate during exposure is reflected by the chuck, passes through the substrate again, and reaches the surface of the substrate. The phenomenon of burning may occur. This phenomenon is called “backside transfer”. In a conventional chuck having a flat substrate support surface, dirt on the back surface of the substrate accumulates on the chuck, and the back surface transfer occurs due to this dirt.

On the other hand, in the chuck in which the pin-shaped convex portion is provided on the substrate support surface, the back surface transfer due to the accumulation of dirt is small. However, when back surface transfer occurs and the surface shape of the chuck is baked onto the surface of the substrate, the pin-shaped convex portions are small and difficult to recognize by the human eye, but there is no problem, but the bank that forms the vacuum compartment is However, there is a problem that it is easily recognized by human eyes because of a regular shape such as a straight line. On the other hand, Patent Document 1 discloses a technique in which a bank that forms a vacuum section of a chuck is configured by an irregular line so that even if back surface transfer occurs, it is difficult to be recognized by human eyes.
JP 2005-332910 A

  With the recent demand for higher image quality of display panels, the pattern formed on the substrate has become finer, and the photosensitive resin material (photoresist) applied to the substrate has been used with a higher exposure sensitivity. I came. Therefore, the degree to which the shape of the bank that forms the vacuum compartment of the chuck by backside transfer is baked on the surface of the substrate is large, and even the bank composed of irregular lines described in Patent Document 1 depends on the degree of baking. Encountered a problem that would be a product defect.

  The subject of this invention is reducing the defect by back surface transcription | transfer. Another object of the present invention is to manufacture a display panel substrate with high image quality with high yield.

  A proximity exposure apparatus according to the present invention includes a chuck that supports a substrate and a mask holder that holds a mask, and provides a minute gap between the mask and the substrate to transfer the mask pattern to the substrate. In the exposure apparatus, the chuck has a plurality of convex portions that support the substrate on the substrate support surface, and a part or all of the plurality of convex portions have suction holes that vacuum-suck the substrate.

  Further, the substrate support method of the proximity exposure apparatus according to the present invention includes a chuck for supporting the substrate and a mask holder for holding the mask, and a fine gap is provided between the mask and the substrate to form a mask pattern. A method for supporting a substrate of a proximity exposure apparatus that transfers to a substrate, wherein a plurality of convex portions are provided on a substrate supporting surface of a chuck, the substrate is supported by the plurality of convex portions, and is adsorbed on a part or all of the plurality of convex portions A hole is provided, and the substrate is vacuum-sucked by the suction hole of the convex portion.

  Since suction holes are provided in some or all of the plurality of protrusions that support the substrate, and the substrate is vacuum-sucked by the suction holes of the protrusions, the portions other than the protrusions on the substrate support surface of the chuck and the substrate Without vacuuming the space, the substrate can be directly vacuum-sucked by the suction holes of the convex portions. Accordingly, there is no need for a bank for forming a conventional vacuum section, and the shape of the bank is not baked on the surface of the substrate, so that defects due to back surface transfer are reduced.

  Further, in the proximity exposure apparatus according to the present invention, the chuck has a first suction section provided in the center portion of the substrate support surface and a second suction section provided outside the first suction section. Then, the suction holes of the convex portions in the first suction section vacuum-suck the central portion of the substrate, and the suction holes of the convex portions in the second suction section are suction of the convex portions in the first suction section. After the hole vacuum-sucks the central part of the substrate, the outside is vacuum-sucked.

  According to the substrate exposure method of the proximity exposure apparatus of the present invention, the first suction section is provided at the center of the substrate support surface of the chuck, the second suction section is provided outside the first suction section, and the first suction section is provided. The central portion of the substrate is vacuum-sucked by the convex suction holes in the suction section, and the outside is vacuum-sucked by the convex suction holes in the second suction section.

  In a large substrate, when the substrate is mounted on the chuck, air between the substrate and the chuck may not escape and remain in the center of the substrate. If the entire substrate is simultaneously vacuum-adsorbed while air remains in the central portion of the substrate, the substrate is fixed to the chuck while being distorted by the air remaining in the central portion. In the present invention, the vacuum suction is applied to the central portion of the substrate by the convex suction holes in the first suction section provided in the central portion of the substrate support surface of the chuck, and then the first suction section provided outside the first suction section. Since the outside is vacuum-sucked by the convex suction holes in the second suction section, a large substrate is supported flat without air remaining in the central portion of the substrate.

  Further, in the proximity exposure apparatus according to the present invention, the vertical and horizontal lengths of the second suction section are substantially equal to the length of the short side of the rectangular substrate, and the chuck is provided on the outer side in the vertical direction of the second suction section. The third and fourth adsorption sections, and the fifth and sixth adsorption sections provided outside the second adsorption section in the lateral direction, and the convexes in the third and fourth adsorption sections. The suction holes in the part vacuum-suck the vertical peripheral part of the rectangular substrate mounted vertically on the chuck, and the convex suction holes in the fifth and sixth suction sections are mounted horizontally in the chuck. The peripheral portion in the horizontal direction of the rectangular substrate is vacuum-sucked.

  In the substrate exposure method of the proximity exposure apparatus according to the present invention, the vertical and horizontal lengths of the second suction section are made substantially equal to the lengths of the short sides of the rectangular substrate, and the outer side of the second suction section in the vertical direction. The third and fourth suction sections are provided on the outer side of the second suction section, the fifth and sixth suction sections are provided outside the second suction section, and a rectangular substrate is mounted vertically on the chuck. The suction holes of the convex portions in the suction section 4 vacuum-suck the peripheral portion in the vertical direction of the substrate, or a rectangular substrate is mounted horizontally on the chuck, and the convex portions in the fifth and sixth suction sections. The peripheral portion in the lateral direction of the substrate is vacuum-sucked by the suction hole of the portion. It is possible to cope with both a case where a rectangular substrate is mounted vertically on a chuck and a case where it is mounted horizontally.

  The method for producing a display panel substrate according to the present invention exposes a substrate using any one of the above-described proximity exposure apparatuses, or uses the substrate support method of any of the above-described proximity exposure apparatuses to form a substrate. The substrate is exposed in support. Since the number of substrates regarded as defective by backside transfer is reduced, a high-quality display panel substrate is manufactured with a high yield.

  According to the proximity exposure apparatus and the substrate support method of the proximity exposure apparatus of the present invention, a plurality of protrusions are provided on the substrate support surface of the chuck, the substrate is supported by the plurality of protrusions, and a part of the plurality of protrusions Alternatively, by providing suction holes all over and vacuum-sucking the substrate with the suction holes of the convex portions, the bank for forming the conventional vacuum compartment can be eliminated, so that defects due to back surface transfer can be reduced.

  Furthermore, according to the proximity exposure apparatus and the substrate support method of the proximity exposure apparatus of the present invention, the first suction section is provided at the center of the substrate support surface of the chuck, and the second suction section is provided outside the first suction section. An adsorption section is provided, and the central portion of the substrate is vacuum-sucked by the convex suction holes in the first suction section, and then the outside is vacuum-sucked by the convex suction holes in the second suction section. Thus, it is possible to prevent the substrate from being fixed to the chuck while being distorted by the air remaining in the central portion, so that a large substrate can be supported flat.

  Furthermore, according to the proximity exposure apparatus and the substrate support method of the proximity exposure apparatus of the present invention, the vertical and horizontal lengths of the second suction section are made substantially equal to the length of the short side of the rectangular substrate. The third and fourth suction sections are provided outside the suction section in the vertical direction, the fifth and sixth suction sections are provided outside the second suction section in the lateral direction, and a rectangular substrate is mounted vertically on the chuck. Then, the suction peripheral holes in the third and fourth suction sections vacuum-suck the peripheral portion in the vertical direction of the substrate, or the rectangular substrate is mounted horizontally on the chuck, and the fifth and fifth Supporting both the case where a rectangular substrate is mounted vertically and the case where it is mounted horizontally by vacuum suctioning the peripheral portion of the substrate in the horizontal direction using the convex suction holes in the suction section 6 Can do.

  According to the method for manufacturing a display panel substrate of the present invention, defects due to back surface transfer can be reduced, so that a display panel substrate with high image quality can be manufactured with a high yield.

  FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. The proximity exposure apparatus includes a base 3, an X guide 4, an X stage 5, a Y guide 6, a Y stage 7, a θ stage 8, a chuck support base 9, a chuck 10, a mask holder 20, a holder frame 21, and a Z-tilt mechanism. 22 is comprised. In addition to these, the proximity exposure apparatus carries a substrate 1 into the chuck 10 and also carries a substrate transport robot that unloads the substrate 1 from the chuck 10, an irradiation optical system that irradiates exposure light, and a temperature at which temperature management in the apparatus is performed. A control unit is provided.

  Note that the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  In FIG. 1, the chuck 10 is in a load / unload position where the substrate 1 is loaded and unloaded. At the load / unload position, the substrate 1 is carried into the chuck 10 and the substrate 1 is carried out of the chuck 10 by a substrate transfer robot (not shown). The loading of the substrate 1 onto the chuck 10 and the unloading of the substrate 1 from the chuck 10 are performed using a plurality of push-up pins provided on the chuck 10. The push-up pin is housed inside the chuck 10 and is lifted from the inside of the chuck 10 to receive the substrate 1 from the substrate transfer robot and unload the substrate 1 from the chuck 10 when loading the substrate 1 onto the chuck 10. In doing so, the substrate 1 is delivered to the substrate transfer robot.

  A holder frame 21 is installed above the exposure position where the substrate 1 is exposed. A mask holder 20 is attached to the holder frame 21 by a Z-tilt mechanism 22. The mask holder 20 holds the periphery of the mask 2 by vacuum suction. The Z-tilt mechanism 22 moves and tilts the mask holder 20 in the Z direction (the vertical direction in FIG. 1). An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. At the time of exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate 1, whereby the pattern of the mask 2 is transferred to the surface of the substrate 1 and a pattern is formed on the substrate 1.

  The chuck 10 is mounted on the θ stage 8 via the chuck support 9, and a Y stage 7 and an X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on an X guide 4 provided on the base 3 and moves along the X guide 4 in the X direction (the horizontal direction in FIG. 1). The Y stage 7 is mounted on a Y guide 6 provided on the X stage 5 and moves along the Y guide 6 in the Y direction (the depth direction in FIG. 1). The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support 9 is mounted on the θ stage 8 and supports the back surface of the chuck 10 at a plurality of points.

  The chuck 10 is moved between the load / unload position and the exposure position by the movement of the X stage 5 in the X direction and the movement of the Y stage 7 in the Y direction. At the load / unload position, the substrate 1 mounted on the chuck 10 is pre-aligned by moving the X stage 5 in the X direction, moving the Y stage 7 in the Y direction, and rotating the θ stage 8 in the θ direction. Is done. At the exposure position, the X stage 5 is moved in the X direction and the Y stage 7 is moved in the Y direction, whereby the substrate 1 mounted on the chuck 10 is stepped in the XY direction. Then, the substrate 1 is aligned by the movement of the X stage 5 in the X direction, the movement of the Y stage 7 in the Y direction, and the rotation of the θ stage 8 in the θ direction. In addition, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction by the Z-tilt mechanism 22.

  In the present embodiment, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction. However, the chuck support base 9 is provided with a Z-tilt mechanism, The gap between the mask 2 and the substrate 1 may be adjusted by moving and tilting the chuck 10 in the Z direction.

  FIG. 2 is a top view of the chuck of the proximity exposure apparatus according to the embodiment of the present invention. A plurality of convex portions 11 and 13 are provided on the substrate support surface (front surface) of the chuck 10. The protrusions 11 and 13 have a pin shape with a diameter of several mm, and a plurality of protrusions 11 and 13 are provided on the substrate support surface of the chuck 10 at a predetermined interval. When the substrate is mounted on the chuck 10, the convex portions 11 and 13 support the substrate at a plurality of points. The convex portion 11 is provided with an adsorption hole 12. The suction hole 12 is a through hole that leads from the surface of the convex portion 11 to the back surface of the chuck 10, and vacuum-sucks the substrate mounted on the chuck 10 by evacuating the air in the through hole.

  In the present embodiment, the number of convex portions 11 provided with the suction holes 12 and the number of convex portions 13 not provided with the suction holes 12 are substantially the same, and the convex portions 11 and the convex portions 13 are formed. Although alternately arranged, the ratio between the convex portions 11 and the convex portions 13 and their arrangement are not limited to this, and the total number of the convex portions 11 and 13 and the suction necessary for fixing the substrate by vacuum suction. It is determined appropriately according to the force.

  Further, the chuck 10 is provided with a plurality of push-up pins for receiving and transferring the substrate, but the push-up pins are omitted in FIG.

  In the present embodiment, a plurality of suction sections divided by broken lines are provided on the substrate support surface of the chuck 10. FIG. 3 is a view showing the chucking section of the chuck of the proximity exposure apparatus according to the embodiment of the present invention. An adsorption section 30 a is provided at the center of the substrate support surface of the chuck 10. An adsorption section 30b is provided outside the adsorption section 30a so as to surround the adsorption section 30a. The suction section 30b is configured so that the length and width are substantially equal to the length of the short side of the rectangular substrate mounted on the chuck 10. Adsorption sections 30c and 30d are provided outside the adsorption section 30b in the vertical direction, and adsorption sections 30e and 30f are provided outside the adsorption section 30b in the horizontal direction.

  In the present embodiment, six adsorption sections 30a, 30b, 30c, 30d, 30e, and 30f are provided, but each adsorption section may be divided into smaller adsorption sections.

  FIG. 4 is a diagram illustrating a state in which the substrate is mounted on the chuck in a vertically long manner. When the rectangular substrate 1 is mounted vertically on the chuck 10, the chuck 10 vacuum-sucks the central portion of the substrate 1 through the suction holes 12 of the convex portions 11 in the suction section 30a, and the convex portions 11 in the suction section 30b. The outside of the suction hole 12 is vacuum-sucked. And the chuck | zipper 10 vacuum-sucks the peripheral part of the vertical direction of the board | substrate 1 by the adsorption | suction hole 12 of the convex part 11 in adsorption | suction division 30c, 30d.

  FIG. 5 is a diagram showing a cross-section of the AA portion in FIG. 2 and the configuration of the pneumatic circuit. On the back surface of the chuck 10, a pipe 41a is connected to the suction hole 12 of the convex portion 11 in the suction section 30a through a pipe joint 40a. The pipe 41a is bifurcated and a vacuum facility is connected to one of the pipes 41a through a solenoid valve 42a and a regulator 43a. On the other side, an air supply facility is connected via an electromagnetic valve 44a and a regulator 45a.

  Similarly, a pipe 41b is connected to the suction hole 12 of the convex portion 11 in the suction section 30b via a pipe joint 40b. The pipe 41b is bifurcated and a vacuum facility is connected to one of the pipes 41b through a solenoid valve 42b and a regulator 43b. On the other hand, an air supply facility is connected via a solenoid valve 44b and a regulator 45b.

  Furthermore, pipes 41c and 41d are connected to the suction holes 12 of the convex portions 11 in the suction sections 30c and 30d via pipe joints 40c and 40d, respectively. Each of the pipes 41c and 41d is bifurcated, and vacuum equipment is connected to one of the pipes 41c and 42d via electromagnetic valves 42c and 42d and regulators 43c and 43d, respectively. On the other side, air supply equipment is connected via electromagnetic valves 44c and 44d and regulators 45c and 45d, respectively.

  In the present embodiment, the suction hole 12 of the convex portion 11 in the suction section 30c and the suction hole 12 of the convex portion 11 in the suction section 30d are connected to separate pipes 41c and 41d. You may connect both to the same piping.

  When vacuum suction of the substrate 1 is performed after the substrate 1 is loaded on the chuck 10 at the load / unload position, the electromagnetic valve 42a is first opened with the electromagnetic valve 44a closed. The air in the suction hole 12 of the convex portion 11 in the suction section 30a is sucked into the vacuum facility through the pipe joint 40a, the pipe 41a, the electromagnetic valve 42a, and the regulator 43a. Thereby, the suction hole 12 of the convex part 11 in the suction section 30a vacuum-sucks the central part of the substrate 1. At this time, the regulator 43a controls the suction force of the suction hole 12 by adjusting the pressure of the air sucked into the vacuum facility.

  Next, the electromagnetic valve 42b is opened with the electromagnetic valve 44b closed. The air in the suction hole 12 of the convex portion 11 in the suction section 30b is sucked into the vacuum facility through the pipe joint 40b, the pipe 41b, the electromagnetic valve 42b, and the regulator 43b. Thereby, the suction hole 12 of the convex part 11 in the suction section 30b vacuum-sucks the outside of the part vacuum-sucked by the suction hole 12 of the convex part 11 in the suction section 30a. At this time, the regulator 43b controls the suction force of the suction hole 12 by adjusting the pressure of the air sucked into the vacuum facility.

  After the central portion of the substrate 1 is vacuum-sucked by the suction holes 12 of the convex portion 11 in the suction section 30a provided at the center portion of the substrate support surface of the chuck 10, the suction section 30b is provided outside the suction section 30a. Since the outside is vacuum-sucked by the suction holes 12 of the protrusions 11, a large substrate is supported flat without air remaining in the central portion of the substrate 1.

  Subsequently, the electromagnetic valves 42c and 42d are opened with the electromagnetic valves 44c and 44d closed. Air in the suction holes 12 of the convex portions 11 in the suction sections 30c and 30d is sucked into the vacuum equipment via the pipe joints 40c and 40d, the pipes 41c and 41d, the electromagnetic valves 42c and 42d, and the regulators 43c and 44d, respectively. The As a result, the suction holes 12 of the convex portions 11 in the suction sections 30c and 30d vacuum-suck the peripheral portions in the vertical direction of the substrate 1, respectively. At this time, the regulators 43c and 43d adjust the pressure of the air sucked into the vacuum equipment to control the suction force of the suction holes 12.

  In the present embodiment, vacuum suction by the suction holes 12 of the convex portions 11 in the suction section 30c and vacuum suction by the suction holes 12 of the convex portions 11 in the suction section 30d are performed simultaneously. You may go in order.

  When releasing the vacuum suction of the substrate 1, the electromagnetic valves 42a, 42b, 42c, and 42d are closed, and the electromagnetic valves 44a, 44b, 44c, and 44d are opened. Air from the air supply equipment is adsorbed via regulators 45a, 45b, 45c, 45d, solenoid valves 44a, 44b, 44c, 44d, pipes 41a, 41b, 41c, 41d and pipe joints 40a, 40b, 40c, 40d. It is supplied to the suction holes 12 of the convex portions 11 in the sections 30a, 30b, 30c, 30d. As a result, the suction holes 12 of the convex portions 11 in the suction sections 30 a, 30 b, 30 c, and 30 d perform air blow to the substrate 1. At this time, the regulators 45a, 45b, 45c, and 45d adjust the pressure of the air supplied from the air supply facility.

  FIG. 6 is a diagram showing a state in which the substrate is mounted horizontally on the chuck. When the rectangular substrate 1 is mounted horizontally on the chuck 10, the chuck 10 vacuum-sucks the central portion of the substrate 1 through the suction holes 12 of the convex portions 11 in the suction section 30a, and the convex portions 11 in the suction section 30b. The outside of the suction hole 12 is vacuum-sucked. And the chuck | zipper 10 vacuum-sucks the peripheral part of the horizontal direction of the board | substrate 1 by the adsorption | suction hole 12 of the convex part 11 in adsorption | suction division 30e, 30f.

  FIG. 7 is a diagram showing a cross section of the BB portion of FIG. 2 and the configuration of the pneumatic circuit. On the back surface of the chuck 10, pipes 41e and 41f are respectively connected to the suction holes 12 of the convex portions 11 in the suction sections 30e and 30f through pipe joints 40e and 40f. Each of the pipes 41e and 41f is bifurcated, and vacuum equipment is connected to one of them through electromagnetic valves 42e and 42f and regulators 43e and 43f, respectively. On the other side, air supply equipment is connected via electromagnetic valves 44e and 44f and regulators 45e and 45f, respectively.

  In the present embodiment, the suction hole 12 of the convex portion 11 in the suction section 30e and the suction hole 12 of the convex portion 11 in the suction section 30f are connected to separate pipes 41e and 41f. You may connect both to the same piping.

  When vacuum suction of the substrate 1 is performed after the substrate 1 is loaded on the chuck 10 at the load / unload position, the electromagnetic valve 42a is first opened with the electromagnetic valve 44a closed. The air in the suction hole 12 of the convex portion 11 in the suction section 30a is sucked into the vacuum facility through the pipe joint 40a, the pipe 41a, the electromagnetic valve 42a, and the regulator 43a. Thereby, the suction hole 12 of the convex part 11 in the suction section 30a vacuum-sucks the central part of the substrate 1. At this time, the regulator 43a controls the suction force of the suction hole 12 by adjusting the pressure of the air sucked into the vacuum facility.

  Next, the electromagnetic valve 42b is opened with the electromagnetic valve 44b closed. The air in the suction hole 12 of the convex portion 11 in the suction section 30b is sucked into the vacuum facility through the pipe joint 40b, the pipe 41b, the electromagnetic valve 42b, and the regulator 43b. Thereby, the suction hole 12 of the convex part 11 in the suction section 30b vacuum-sucks the outside of the part vacuum-sucked by the suction hole 12 of the convex part 11 in the suction section 30a. At this time, the regulator 43b controls the suction force of the suction hole 12 by adjusting the pressure of the air sucked into the vacuum facility.

  After the central portion of the substrate 1 is vacuum-sucked by the suction holes 12 of the convex portion 11 in the suction section 30a provided at the center portion of the substrate support surface of the chuck 10, the suction section 30b is provided outside the suction section 30a. Since the outside is vacuum-sucked by the suction holes 12 of the protrusions 11, a large substrate is supported flat without air remaining in the central portion of the substrate 1.

  Subsequently, the electromagnetic valves 42e and 42f are opened with the electromagnetic valves 44e and 44f closed. Air in the suction holes 12 of the convex portions 11 in the suction sections 30e and 30f is sucked into the vacuum equipment via the pipe joints 40e and 40f, the pipes 41e and 41f, the electromagnetic valves 42e and 42f, and the regulators 43e and 44f, respectively. The As a result, the suction holes 12 of the convex portions 11 in the suction sections 30e and 30f vacuum-suck the peripheral portions in the lateral direction of the substrate 1, respectively. At this time, the regulators 43e and 43f control the suction force of the suction holes 12 by adjusting the pressure of the air sucked into the vacuum equipment.

  In the present embodiment, vacuum suction by the suction holes 12 of the projections 11 in the suction section 30e and vacuum suction by the suction holes 12 of the projections 11 in the suction section 30f are performed simultaneously. You may go in order.

  When releasing the vacuum suction of the substrate 1, the electromagnetic valves 42a, 42b, 42e, 42f are closed and the electromagnetic valves 44a, 44b, 44e, 44f are opened. Air from the air supply equipment is adsorbed via regulators 45a, 45b, 45e, 45f, solenoid valves 44a, 44b, 44e, 44f, pipes 41a, 41b, 41e, 41f and pipe joints 40a, 40b, 40e, 40f. It is supplied to the suction holes 12 of the convex portions 11 in the sections 30a, 30b, 30e, 30f. As a result, the suction holes 12 of the convex portions 11 in the suction sections 30 a, 30 b, 30 e, and 30 f blow air to the substrate 1. At this time, the regulators 45a, 45b, 45e, and 45f adjust the pressure of the air supplied from the air supply facility.

  FIG. 8 is a top view of a chuck of a proximity exposure apparatus according to another embodiment of the present invention. In the present embodiment, the convex portions 13 in which the suction holes 12 are not provided in the embodiment shown in FIG. 2 are eliminated, and all the convex portions are formed as the convex portions 11 in which the suction holes 12 are provided. Other configurations are the same as those of the embodiment shown in FIG.

  According to the embodiment described above, the plurality of convex portions 11, 13 or the plurality of convex portions 11 are provided on the substrate support surface of the chuck 10, and the substrate 1 is held by the plurality of convex portions 11, 13 or the plurality of convex portions 11. By supporting and providing suction holes 12 in the protrusions 11 and vacuum-adsorbing the substrate 1 by the suction holes 12 of the protrusions 11, it is possible to eliminate the bank for forming a conventional vacuum compartment, so by back surface transfer Defects can be reduced.

  Further, the suction section 30a is provided at the center of the substrate support surface of the chuck 10, the suction section 30b is provided outside the suction section 30a, and the center portion of the substrate 1 is moved by the suction holes 12 of the convex portion 11 in the suction section 30a. After the vacuum suction, the outside of the convex portion 11 in the suction section 30b is vacuum-sucked to prevent the substrate 1 from being fixed to the chuck 10 while being distorted by the air remaining in the central portion. Therefore, a large substrate can be supported flat.

  Further, the length and width of the suction section 30b are substantially equal to the length of the short side of the rectangular substrate 1, suction sections 30c and 30d are provided outside the suction section 30b in the vertical direction, The suction sections 30e and 30f are provided outside, the rectangular substrate 1 is mounted vertically on the chuck 10, and the peripheral portion in the vertical direction of the substrate 1 is vacuumed by the suction holes 12 of the convex portions 11 in the suction sections 30c and 30d. By adsorbing or mounting the rectangular substrate 1 horizontally on the chuck 10 and vacuum adsorbing the peripheral portion in the lateral direction of the substrate 1 by the adsorption holes 12 of the convex portions 11 in the adsorption sections 30e and 30f, It is possible to deal with both the case where the rectangular substrate 1 is mounted vertically on the chuck and the case where it is mounted horizontally.

  The substrate is exposed by using the proximity exposure apparatus of the present invention, or the substrate is supported by using the substrate support method of the proximity exposure apparatus of the present invention, and the substrate is exposed to cause a defect due to back surface transfer. Therefore, a display panel substrate with high image quality can be manufactured with a high yield.

  For example, FIG. 9 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is stripped with a stripping solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 10 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 9, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 10, in the black matrix forming process (step 201) and the colored pattern forming process (step 202). In this exposure process, the proximity exposure apparatus of the present invention or the substrate support method of the proximity exposure apparatus of the present invention can be applied.

It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. It is a top view of the chuck | zipper of the proximity exposure apparatus by one Embodiment of this invention. It is a figure which shows the adsorption | suction division of the chuck | zipper of the proximity exposure apparatus by one Embodiment of this invention. It is a figure which shows the state which mounted the board | substrate vertically on the chuck | zipper. It is a figure which shows the cross section of the AA part of FIG. 2, and the structure of a pneumatic circuit. It is a figure which shows the state which mounted the board | substrate horizontally on the chuck | zipper. It is a figure which shows the cross section of the BB part of FIG. 2, and the structure of a pneumatic circuit. It is a top view of the chuck | zipper of the proximity exposure apparatus by other embodiment of this invention. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Mask 3 Base 4 X guide 5 X stage 6 Y guide 7 Y stage 8 θ stage 9 Chuck support 10 Chuck 11, 13 Protruding part 12 Suction hole 20 Mask holder 21 Holder frame 22 Z-tilt mechanisms 30a, 30b, 30c, 30d, 30e, 30f Adsorption sections 40a, 40b, 40c, 40d, 40e, 40f Pipe joints 41a, 41b, 41c, 41d, 41e, 41f Piping 42a, 42b, 42c, 42d, 42e, 42f Electromagnetic valves 43a, 43b , 43c, 43d, 43e, 43f Regulator 44a, 44b, 44c, 44d, 44e, 44f Solenoid valve 45a, 45b, 45c, 45d, 45e, 45f Regulator

Claims (8)

In a proximity exposure apparatus that includes a chuck that supports a substrate and a mask holder that holds a mask, and provides a minute gap between the mask and the substrate to transfer the mask pattern to the substrate.
The chuck has a plurality of protrusions for supporting the substrate on the substrate support surface,
A proximity exposure apparatus characterized in that a part or all of the plurality of convex portions have suction holes for vacuum-sucking the substrate. The chuck has a first suction section provided in the center portion of the substrate support surface, and a second suction section provided outside the first suction section,
The convex suction holes in the first suction section vacuum-suck the central part of the substrate,
The convex suction hole in the second suction section is characterized in that the convex suction hole in the first suction section vacuum-sucks the central part of the substrate and then vacuum-sucks the outside thereof. The proximity exposure apparatus according to claim 1. The length and width of the second adsorption section are substantially equal to the length of the short side of the rectangular substrate,
The chuck includes third and fourth suction sections provided outside in the vertical direction of the second suction section, and fifth and sixth holes provided outside in the lateral direction of the second suction section. An adsorption compartment,
The suction holes of the convex portions in the third and fourth suction sections vacuum-suck the peripheral portion in the vertical direction of the rectangular substrate mounted vertically on the chuck,
3. The suction hole of the convex portion in the fifth and sixth suction sections vacuum-sucks the peripheral portion in the lateral direction of a rectangular substrate mounted horizontally on the chuck. Proximity exposure equipment. A substrate support method for a proximity exposure apparatus, comprising a chuck for supporting a substrate and a mask holder for holding a mask, and providing a minute gap between the mask and the substrate to transfer the mask pattern to the substrate. ,
A plurality of protrusions are provided on the substrate support surface of the chuck, and the substrate is supported by the plurality of protrusions.
A substrate support method for a proximity exposure apparatus, wherein suction holes are provided in part or all of a plurality of convex portions, and the substrate is vacuum-sucked by the suction holes of the convex portions. A first suction section is provided at the center of the substrate support surface of the chuck,
Providing a second adsorption section outside the first adsorption section;
The center of the substrate is vacuum-sucked by the convex suction holes in the first suction section, and the outside is vacuum-sucked by the convex suction holes in the second suction section. Item 5. A substrate supporting method for a proximity exposure apparatus according to Item 4. The length and width of the second adsorption section are made substantially equal to the length of the short side of the rectangular substrate,
Providing the third and fourth adsorption sections outside the second adsorption section in the longitudinal direction;
The fifth and sixth adsorption sections are provided outside the second adsorption section in the lateral direction,
A rectangular substrate is vertically mounted on the chuck, and the vertical peripheral portion of the substrate is vacuum-sucked by the convex suction holes in the third and fourth suction sections,
Alternatively, a rectangular substrate is mounted horizontally on the chuck, and the peripheral portion in the horizontal direction of the substrate is vacuum-sucked by the convex suction holes in the fifth and sixth suction sections. A substrate supporting method for a proximity exposure apparatus as described in 1 above.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the proximity exposure apparatus according to any one of claims 1 to 3.   A method for manufacturing a display panel substrate, wherein the substrate is exposed by supporting the substrate using the substrate supporting method of the proximity exposure apparatus according to any one of claims 4 to 6.

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