JP2013205678A - Proximity exposure device, substrate positioning method of proximity exposure device, and manufacturing method of display panel substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately perform pattern printing by suppressing decrease in the total pitch accuracy due to positioning error of a substrate at each shot, when one surface of the substrate is exposed in a separate manner with a plurality of shots.SOLUTION: At each shot, a target position of a moving stage is determined (step 307), and based on a detection result of the position of the moving stage, the moving stage is moved to the target position (step 310) to perform positioning of a substrate 1. At the second or subsequent shots, the deviation amount from the target position in the position of the moving stage during exposure at the already done shot is detected from the position of the moving stage detected by the already done shot after positioning of the substrate 1 (step 311). Based on the detected deviation amount, the target position of the moving stage at the shot to be done from now on is corrected (step 309).

Description

  The present invention relates to a proximity exposure apparatus that exposes a substrate using a proximity method in manufacturing a display panel substrate such as a liquid crystal display device, a substrate positioning method of the proximity exposure apparatus, and a display panel using the same. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate manufacturing method, and in particular, a proximity exposure apparatus that performs exposure by dividing a surface of a substrate into a plurality of shots by moving the substrate stepwise in an XY direction using a moving stage, and a substrate positioning method for the proximity exposure apparatus, and the like The present invention relates to a method of manufacturing a display panel substrate using the above.

  Manufacturing of TFT (Thin Film Transistor) substrates, color filter substrates, plasma display panel substrates, organic EL (Electroluminescence) display panel substrates, and the like of liquid crystal display devices used as display panels is performed using photolithography using an exposure apparatus. This is performed by forming a pattern on the substrate by a technique. As an exposure apparatus, a projection method in which a mask pattern is projected onto a substrate using a lens or a mirror, and a minute gap (proximity gap) is provided between the mask and the substrate to transfer the mask pattern to the substrate. There is a proximity method. The proximity method is inferior in pattern resolution performance to the projection method, but the configuration of the irradiation optical system is simple, the processing capability is high, and it is suitable for mass production.

  In recent years, in the manufacture of various substrates for display panels, a relatively large substrate is prepared in order to cope with an increase in size and a variety of sizes, and one or a plurality of substrates can be selected from one substrate depending on the size of the display panel. Manufactures display panel substrates. In this case, in the proximity method, if one surface of the substrate is to be exposed all at once, a mask having the same size as the substrate is required, which further increases the cost of the expensive mask. Therefore, a method in which a mask that is relatively smaller than the substrate is used, the substrate is moved stepwise in the XY directions by a moving stage, and one surface of the substrate is divided into a plurality of shots for exposure.

  In the proximity exposure apparatus, in order to perform pattern printing with high accuracy, the substrate must be positioned accurately during exposure. The moving stage for positioning the substrate includes an X stage that moves in the X direction, a Y stage that moves in the Y direction, and a θ stage that rotates in the θ direction. And rotate in the θ direction. Patent Document 1 discloses a technique for detecting the position of the moving stage in the X and Y directions using a laser length measurement system when positioning a substrate. The laser measurement system measures the interference between the laser light source that generates laser light, the reflection means (bar mirror) attached to the chuck, and the laser light from the laser light source and the laser light reflected by the reflection means (bar mirror). A laser interferometer.

JP 2005-331542 A

  In the manufacture of display panel substrates, etc., the exposure accuracy is managed by absolute position accuracy management that manages the accuracy of the pattern position using the position coordinates with the reference point on the substrate as the origin, and a total that keeps the pattern spacing constant. There is pitch accuracy management. In general, in the absolute position accuracy management, the allowable value of the amount of positional deviation of the pattern is about several hundred μm, whereas in the total pitch accuracy management, the allowable value of the difference in the pattern interval is about several μm, which is strict. Accuracy control is required.

  Conventionally, in a proximity exposure apparatus, a substrate is positioned using position coordinates with a reference point on the substrate as an origin. However, when the substrate is moved stepwise in the X and Y directions by the moving stage, and one surface of the substrate is divided into a plurality of shots, the pattern spacing of the entire substrate varies due to the substrate positioning error in each shot, and the number of shots As the number increases, the substrate positioning error in each shot accumulates, resulting in a problem that the total pitch accuracy decreases.

  SUMMARY OF THE INVENTION An object of the present invention is to perform pattern printing with high accuracy by suppressing a decrease in total pitch accuracy due to a positioning error of a substrate in each shot when exposing one side of a substrate in a plurality of shots. Another object of the present invention is to manufacture a high-quality display panel substrate by suppressing the decrease in total pitch accuracy and performing pattern printing with high accuracy when exposing one side of a substrate in a plurality of shots. That is.

  The proximity exposure apparatus of the present invention includes a mask holder that holds a mask, a chuck that supports a substrate, and a moving stage that moves by mounting the chuck, and the chuck is moved by the moving stage in the XY direction of the substrate. In a proximity exposure apparatus that divides and exposes one side of a substrate into a plurality of shots, a laser light source that generates laser light, a plurality of reflecting means attached to a moving stage, and laser light from the laser light source Measuring position of the moving stage from the laser length measurement system with multiple laser interferometers that measure the interference between the laser beam reflected by each reflecting means and the laser light at multiple locations, and the measurement results of each laser interferometer in the laser length measurement system In each shot, the first detection means for detecting the stage, the stage drive circuit for driving the moving stage, Control means for determining the target position of the moving stage, controlling the stage driving circuit based on the detection result of the position of the moving stage by the first detecting means, and moving the moving stage to the target position to position the substrate; In the second and subsequent shots, the control means moves from the position of the moving stage detected by the first detection means after positioning the substrate in the shot that has already been taken, in the shot that has already been performed. A deviation amount of the stage position from the target position is detected, and the target position of the moving stage in a shot to be performed is corrected based on the detected deviation amount.

  Further, the substrate positioning method of the proximity exposure apparatus of the present invention comprises a mask holder for holding a mask, a chuck for supporting the substrate, and a moving stage for moving the chuck and moving the chuck by the moving stage. This is a substrate positioning method for proximity exposure equipment that performs step movement of the substrate in the X and Y directions and divides and exposes one side of the substrate into a plurality of shots, and a plurality of laser length measuring system reflection means are attached to the moving stage. The laser stage interferometers measure the interference between the laser light from the laser light source and the laser light reflected by each reflecting means at multiple locations. From the measurement results of each laser interferometer, the moving stage The position of the moving stage is determined for each shot, and the target position of the moving stage is determined for each shot. Subsequently, the moving stage is moved to the target position, the substrate is positioned, and in the second and subsequent shots, from the position of the moving stage detected after the positioning of the substrate in the shot that has already been performed, in the shot that has already been performed, The amount of deviation of the position of the moving stage from the target position at the time of exposure is detected, and the target position of the moving stage in a shot to be performed is corrected based on the detected amount of deviation.

  Even if the position of the moving stage at the time of exposure deviates from the target position within the allowable range in the shot that has already been performed, the target position of the position of the moving stage is corrected based on the amount of deviation in the shot that will be performed in the future. Therefore, the deviation amount in the shot that has already been performed is canceled, and the positioning error of the substrate in each shot is not accumulated. Therefore, when one surface of the substrate is exposed by being divided into a plurality of shots, a decrease in total pitch accuracy due to substrate positioning errors in each shot is suppressed, and pattern printing is performed with high accuracy. Further, since it is not necessary to position the substrate with high accuracy in the first shot, the time required for positioning the substrate in the first shot is shortened, and the tact time is shortened.

  Further, the proximity exposure apparatus of the present invention includes an input device for inputting the position of the quality control point on the substrate, and the control means is the position of the moving stage at the time of exposure in the shot including the quality control point already performed. The amount of deviation from the target position is accumulated, and the target position of the moving stage in a shot to be performed is corrected. In addition, the substrate positioning method of the proximity exposure apparatus according to the present invention accumulates the deviation amount from the target position of the position of the moving stage at the time of exposure in the shot including the accuracy control point on the substrate already performed. The target position of the moving stage in the shot to be performed is corrected. The number and position of accuracy control points on the substrate when performing total pitch accuracy management vary depending on the type of substrate, and appropriate total pitch accuracy management is performed according to the type of substrate.

  Furthermore, the proximity exposure apparatus of the present invention includes second detection means for detecting the position of the substrate supported by the chuck, and third detection means for detecting the amount of displacement of the mask held by the mask holder. And the control means detects the amount of displacement of the substrate relative to the chuck from the position of the moving stage detected by the first detection means and the position of the substrate detected by the second detection means, and the substrate relative to the chuck The target position of the moving stage in each shot is determined based on the amount of positional deviation and the amount of positional deviation of the mask detected by the third detecting means.

  Further, the substrate positioning method of the proximity exposure apparatus of the present invention detects the position of the substrate supported by the chuck, detects the amount of displacement of the substrate with respect to the chuck from the position of the moving stage and the position of the substrate, and The amount of displacement of the mask held by the holder is detected, and the target position of the moving stage in each shot is determined based on the amount of displacement of the substrate relative to the chuck and the amount of displacement of the mask.

  Usually, the substrate is carried into the chuck by using the substrate transport robot. At this time, a position error of the substrate mounted on the chuck occurs due to a movement error of the substrate transport robot. In each shot, when aligning the gap between the mask and the substrate, the mask is displaced upward by the air between the mask and the substrate, and the mask is displaced when the deformed mask returns. Will occur. The amount of displacement of the substrate relative to the chuck is detected, the amount of displacement of the mask held by the mask holder is detected, and the target of the moving stage in each shot is determined based on the amount of displacement of the substrate relative to the chuck and the amount of displacement of the mask. Since the position is determined, the target position of the movable stage before correction in each shot is appropriately determined according to the amount of positional deviation of the substrate with respect to the chuck and the amount of positional deviation of the mask.

  The method for producing a display panel substrate according to the present invention exposes a substrate using any one of the above-described proximity exposure apparatuses or uses the substrate positioning method of any one of the above-described proximity exposure apparatuses to form a substrate. Positioning is performed to expose the substrate. When exposing one side of the substrate in a plurality of shots, the total pitch accuracy is prevented from being lowered and pattern printing is performed with high accuracy, so that a high-quality display panel substrate is manufactured.

  According to the proximity exposure apparatus and the substrate positioning method of the proximity exposure apparatus of the present invention, in the second and subsequent shots, shots that have already been performed from the position of the moving stage detected after positioning the substrate in the shots that have already been performed. In the exposure, the amount of shift of the position of the moving stage from the target position is detected, and based on the detected amount of shift, the target position of the moving stage in the shot to be performed is corrected to make one surface of the substrate into a plurality of shots. When the exposure is performed separately, it is possible to suppress the decrease in the total pitch accuracy due to the positioning error of the substrate in each shot and perform the pattern printing with high accuracy. Further, since it is not necessary to position the substrate with high precision in the first shot, the time required for positioning the substrate in the first shot can be shortened, and the tact time can be shortened.

  Furthermore, according to the proximity exposure apparatus and the substrate positioning method of the proximity exposure apparatus of the present invention, the deviation of the position of the moving stage from the target position at the time of exposure in the shot including the accuracy control point on the substrate that has already been performed. By accumulating the amount and correcting the target position of the moving stage in a shot to be performed from now on, appropriate total pitch accuracy management can be performed according to the type of the substrate.

  Further, according to the proximity exposure apparatus and the substrate positioning method of the proximity exposure apparatus of the present invention, the amount of displacement of the substrate with respect to the chuck is detected, the amount of displacement of the mask held by the mask holder is detected, and the amount of displacement of the substrate with respect to the chuck is detected. By determining the target position of the moving stage in each shot based on the amount of substrate displacement and the amount of mask displacement, the amount of substrate displacement relative to the chuck and the amount of mask displacement in each shot are determined. The target position of the moving stage before correction can be appropriately determined.

  According to the method for manufacturing a display panel substrate of the present invention, when exposing one side of a substrate in a plurality of shots, a reduction in total pitch accuracy is suppressed, pattern printing is performed with high accuracy, and high-quality display is performed. Panel substrates can be manufactured.

It is a figure which shows schematic structure of the proximity exposure apparatus by one embodiment of this invention. It is a top view which shows the state which the chuck | zipper 10a exists in an exposure position, and the chuck | zipper 10b exists in a load / unload position. It is a partial cross section side view showing the state where chuck 10a is in an exposure position and chuck 10b is in a load / unload position. It is a top view which shows the state which the chuck | zipper 10b exists in an exposure position, and the chuck | zipper 10a exists in a load / unload position. It is a partial cross section side view showing the state where chuck 10b is in an exposure position and chuck 10a is in a load / unload position. It is a top view of the movement stage on a main stage base. It is a partial cross section side view of the X direction of the movement stage on a main stage base. It is a side view of the moving stage on the main stage base in the Y direction. It is a figure explaining operation | movement of a laser interferometer. It is a figure explaining operation | movement of a laser interferometer. It is a perspective view of the laser displacement meter which measures the displacement of a X direction. It is a perspective view of the laser displacement meter which measures the displacement of a Y direction. It is a figure which shows an example of the mark for position detection of a mask. It is a figure explaining operation | movement of the camera for mask position detection. It is a figure which shows an example of the exposure precision control point of a board | substrate. It is a flowchart of the exposure process of the proximity exposure apparatus by one embodiment of this invention. It is a flowchart which shows an example of the manufacturing process of the TFT substrate of a liquid crystal display device. It is a flowchart which shows an example of the manufacturing process of the color filter board | substrate of a liquid crystal display device.

  FIG. 1 is a diagram showing a schematic configuration of a proximity exposure apparatus according to an embodiment of the present invention. This embodiment shows an example of a proximity exposure apparatus having a plurality of chucks. The proximity exposure apparatus includes a plurality of chucks 10a and 10b, a main stage base 11, a plurality of sub-stage bases 11a and 11b, a table 12, an X guide 13, a plurality of moving stages, a mask holder 20, and a laser length measurement system controller 30. A plurality of first laser measurement systems, second laser measurement systems, laser displacement meter control device 40, laser displacement meters 42 and 43, bar mirror 44, substrate position detection device, mask position detection device, and main control device 70 , Input / output interface circuits 71 and 72, stage drive circuits 80 a and 80 b, and an input device 90. In addition to these, the proximity exposure apparatus carries a substrate 1 into the chuck 10 and also carries a substrate transport robot that unloads the substrate 1 from the chuck 10, an irradiation optical system that irradiates exposure light, and a temperature at which temperature management in the apparatus is performed. A control unit is provided.

  In this embodiment, two chucks, sub-stage bases, moving stages, first laser length measurement systems, and stage drive circuits are provided, but one or more of these may be provided. Good. Further, the XY directions in the embodiments described below are examples, and the X direction and the Y direction may be interchanged.

  In FIG. 1, a mask holder 20 that holds a mask 2 is installed above an exposure position where the substrate 1 is exposed. The mask holder 20 is provided with an opening 20a through which exposure light passes, and the mask 2 is mounted below the opening 20a. A suction groove is provided around the opening 20a on the lower surface of the mask holder 20, and the mask holder 20 holds the peripheral portion of the mask 2 by vacuum suction using the suction groove. An irradiation optical system (not shown) is disposed above the mask 2 held by the mask holder 20. At the time of exposure, exposure light from the irradiation optical system passes through the mask 2 and is irradiated onto the substrate 1, whereby the pattern of the mask 2 is transferred to the surface of the substrate 1 and a pattern is formed on the substrate 1.

  A main stage base 11 is disposed below the mask holder 20. Sub-stage bases 11 a and 11 b are arranged on the left and right sides of the main stage base 11 so as to be adjacent to the main stage base 11 in the X direction. A base 12 is attached in the Y direction of the main stage base 11. The chuck 10a is moved between a load / unload position on the substage base 11a and an exposure position on the main stage base 11 by a moving stage described later. Further, the chuck 10b is moved between a load / unload position on the sub-stage base 11b and an exposure position on the main stage base 11 by a moving stage described later.

  The substrate 1 is loaded into the chucks 10a and 10b and unloaded from the chucks 10a and 10b by a substrate transfer robot (not shown) at the load / unload positions on the sub-stage bases 11a and 11b. The loading of the substrate 1 onto the chucks 10a and 10b and the unloading of the substrate 1 from the chucks 10a and 10b are performed using a plurality of push-up pins provided on the chucks 10a and 10b. The push-up pins are accommodated in the chucks 10a and 10b. When the substrate 1 is loaded onto the chucks 10a and 10b by ascending from the chucks 10a and 10b, the substrate 1 is received from the substrate transfer robot. Is unloaded from the chucks 10a and 10b, the substrate 1 is delivered to the substrate transfer robot. The chucks 10a and 10b support the substrate 1 by vacuum suction. A photoresist is applied to the surface of the substrate 1.

  FIG. 2 is a top view showing a state in which the chuck 10a is in the exposure position and the chuck 10b is in the load / unload position. FIG. 3 is a partial cross-sectional side view showing a state where the chuck 10a is at the exposure position and the chuck 10b is at the load / unload position. In FIG. 2, an X guide 13 extending in the X direction from the main stage base 11 to the sub stage bases 11a and 11b is provided on the main stage base 11 and the sub stage bases 11a and 11b.

  In FIG. 3, chucks 10a and 10b are each mounted on a moving stage. Each moving stage includes an X stage 14, a Y guide 15, a Y stage 16, a θ stage 17, and a chuck support 19. The X stage 14 is mounted on the X guide 13 and moves in the X direction along the X guide 13. The Y stage 16 is mounted on a Y guide 15 provided on the X stage 14, and moves along the Y guide 15 in the Y direction (the drawing depth direction in FIG. 3). The θ stage 17 is mounted on the Y stage 16 and rotates in the θ direction. The chuck support 19 is mounted on the θ stage 17 and supports the chucks 10a and 10b at a plurality of locations.

  By moving the movable stage in the X direction of the X stage 14 and moving the Y stage 16 in the Y direction, the chuck 10a has a load / unload position on the substage base 11a and an exposure position on the main stage base 11. The chuck 10b is moved between a load / unload position on the substage base 11b and an exposure position on the main stage base 11. FIG. 4 is a top view showing a state where the chuck 10b is at the exposure position and the chuck 10a is at the load / unload position. FIG. 5 is a partial cross-sectional side view showing a state where the chuck 10b is at the exposure position and the chuck 10a is at the load / unload position. At the loading / unloading positions on the sub-stage bases 11a and 11b, each moving stage is moved in the X direction by the X stage 14, the Y stage 16 is moved in the Y direction, and the θ stage 17 is rotated in the θ direction. Then, pre-alignment of the substrate 1 mounted on the chucks 10a and 10b is performed.

  At the exposure position on the main stage base 11, the movement of the X stage 14 in the X direction and the movement of the Y stage 16 in the Y direction of each moving stage causes the substrate 1 held on the chucks 10a and 10b to move in the XY direction. Step movement is performed. Further, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction by a Z-tilt mechanism (not shown). Then, the substrate 1 is positioned during exposure by the movement of the X stage 14 in the X direction, the movement of the Y stage 16 in the Y direction, and the rotation of the θ stage 17 in the θ direction.

  The X stage 14, Y stage 16, and θ stage 17 of each moving stage are provided with a drive mechanism (not shown) such as a ball screw, a motor, and a linear motor. In FIG. 1, the stage drive circuit 80 a drives the X stage 14, the Y stage 16, and the θ stage 17 of the moving stage on which the chuck 10 a is mounted under the control of the main controller 70. The stage drive circuit 80 b drives the X stage 14, the Y stage 16, and the θ stage 17 of the moving stage on which the chuck 10 b is mounted under the control of the main controller 70.

  In the present embodiment, the gap between the mask 2 and the substrate 1 is adjusted by moving and tilting the mask holder 20 in the Z direction. However, each moving stage is provided with a Z-tilt mechanism and a chuck. The gap between the mask 2 and the substrate 1 may be adjusted by moving and tilting 10a and 10b in the Z direction.

  The substrate positioning operation of the proximity exposure apparatus according to this embodiment will be described below. In the present embodiment, the position in the X direction of the moving stage on which the chuck 10a is mounted is detected by one of the two first laser length measuring systems, and the position in the X direction on the moving stage on which the chuck 10b is mounted. Is detected. Further, the position of each moving stage on the main stage base 11 in the Y direction is detected by the second laser length measurement system. Further, the tilts in the θ direction of the chucks 10 a and 10 b are detected using the laser displacement meters 42 and 43.

  In FIG. 1, one of the first laser length measurement systems includes a laser light source 31a, two laser interferometers 32a, and a bar mirror 34a described later. The other of the first laser length measurement system includes a laser light source 31b, two laser interferometers 32b, and a bar mirror 34b described later. The second laser length measurement system includes a laser light source 31b, two laser interferometers 33, and a bar mirror 35. The laser light sources 31a and 31b are configured to include a semiconductor laser.

  FIG. 6 is a top view of the moving stage on the main stage base. FIG. 7 is a partial sectional side view in the X direction of the moving stage on the main stage base. FIG. 8 is a side view of the moving stage on the main stage base in the Y direction. 6 to 8 show a moving stage on which the chuck 10a is mounted. The moving stage on which the chuck 10b is mounted has a symmetrical configuration in the X direction with respect to the moving stage on which the chuck 10a is mounted. In FIG. 7, the X guide 13 is omitted, and in FIG. 8, the laser interferometers 32a and 32b are omitted.

  In FIG. 8, since the X stage 14 of the moving stage is mounted on the X guide 13, the height of the X guide 13 is set between the main stage base 11 and the substage bases 11 a and 11 b and the X stage 14. Space is generated. The bar mirror 34a of the first laser length measurement system is attached under the X stage 14 using this space. The same applies to the bar mirror 34b. As shown in FIG. 1, the two laser interferometers 32 a of the first laser length measurement system are installed at positions away from the X guide 13 of the main stage base 11. The same applies to the laser interferometer 32b.

  6 to 8, the bar mirror 35 of the second laser length measurement system is attached to the Y stage 16 by the arm 36 at the height of the chuck 10a. Similarly, for the moving stage on which the chuck 10b is mounted, the bar mirror 35 is attached to the Y stage 16 at substantially the height of the chuck 10b. As shown in FIGS. 6 and 8, the two laser interferometers 33 of the second laser length measurement system are installed on a table 12 attached to the main stage base 11 in the Y direction.

  9 and 10 are diagrams for explaining the operation of the laser interferometer. 9 shows a state where the chuck 10a is at the exposure position and the chuck 10b is at the load / unload position. FIG. 10 shows the chuck 10b at the exposure position and the chuck 10a is at the load / unload position. Indicates the state.

  9 and 10, each laser interferometer 32a irradiates the laser beam from the laser light source 31a onto the bar mirror 34a, receives the laser beam reflected by the bar mirror 34a, and receives the laser beam from the laser light source 31a and the bar mirror. The interference with the laser beam reflected by 34a is measured. In FIG. 1, the laser length measurement system control device 30 detects the position in the X direction of the moving stage on which the chuck 10a is mounted from the measurement results of the two laser interferometers 32a under the control of the main control device 70. Yawing is detected when the stage 14 moves in the X direction. The main controller 70 inputs the detection result of the laser measurement system controller 30 via the input / output interface circuit 71.

  9 and 10, each laser interferometer 32b irradiates the laser beam from the laser light source 31b to the bar mirror 34b, receives the laser beam reflected by the bar mirror 34b, and receives the laser beam from the laser light source 31b and the bar mirror. The interference with the laser beam reflected by 34b is measured. In FIG. 1, the laser length measurement system control device 30 detects the position in the X direction of the moving stage on which the chuck 10b is mounted from the measurement results of the two laser interferometers 32b under the control of the main control device 70. Yawing is detected when the stage 14 moves in the X direction. The main controller 70 inputs the detection result of the laser measurement system controller 30 via the input / output interface circuit 71.

  Since the first laser measuring system bar mirrors 34a and 34b are attached under the X stage 14 of each moving stage, and the laser interferometers 32a and 32b are installed at positions away from the X guide 13 of the main stage base 11, The moving stage does not collide with the laser interferometers 32a and 32b when moving between the sub stage bases 11a and 11b and the main stage base 11. Since the laser interferometers 32a and 32b are installed on the main stage base 11, the laser interferometers 32a and 32b are not affected by the vibration of the substage bases 11a and 11b. Further, the measurement distance from the laser interferometers 32a and 32b to each moving stage on the main stage base 11 is shortened. Therefore, the position of each moving stage in the X direction is detected with high accuracy using each first laser length measurement system. In each first laser length measurement system, the plurality of laser interferometers 32a and 32b are installed on the main stage base 11, so that the X stage 14 of each moving stage is determined from the measurement results of the plurality of laser interferometers 32a and 32b. Yawing is detected when moving in the X direction.

  9 and 10, each laser interferometer 33 irradiates the laser beam from the laser light source 31b onto the bar mirror 35, receives the laser beam reflected by the bar mirror 35, and receives the laser beam from the laser light source 31b and the bar mirror. The interference with the laser beam reflected by 35 is measured. In FIG. 1, the laser length measurement system control device 30 detects the position in the Y direction of each moving stage on the main stage base 11 from the measurement results of the two laser interferometers 33 under the control of the main control device 70. Further, yawing is detected when the Y stage 16 moves in the Y direction. The main controller 70 inputs the detection result of the laser measurement system controller 30 via the input / output interface circuit 71.

  Since the laser interferometer 33 of the second laser length measurement system is installed on the stage 12 attached to the main stage base 11 in the Y direction, the laser interferometer 33 is not affected by the vibrations of the substage bases 11a and 11b. Further, the measurement distance from the laser interferometer 33 to each moving stage on the main stage base 11 is shortened. Therefore, the position in the Y direction of each moving stage on the main stage base 11 is accurately detected using the second laser length measurement system. And since the several laser interferometer 33 is installed in the stand 12, the yawing when the Y stage 16 of each moving stage moves to a Y direction from the measurement result of the several laser interferometer 33 is detected. In addition, since each bar mirror 35 of the second laser length measurement system is mounted at almost the height of the chucks 10a and 10b mounted on each moving stage, the position in the Y direction of each moving stage is detected in the vicinity of the substrate 1. Is done.

  FIG. 11 is a perspective view of a laser displacement meter that measures displacement in the X direction. FIG. 11 shows a laser displacement meter attached to the moving stage on which the chuck 10a is mounted. The laser displacement meter attached to the moving stage on which the chuck 10b is mounted has a configuration that is symmetrical with respect to FIG. 11 in the X direction. It has become. The bar mirror 44 is attached to one side surface extending in the Y direction of the chucks 10a and 10b. The two laser displacement meters 42 are each attached to the block 48 at the height of the bar mirror 44 by an arm 46. The block 48 is attached to the X stage 14.

  FIG. 12 is a perspective view of a laser displacement meter that measures displacement in the Y direction. In FIG. 12, the bar mirror 45 is attached to the back surfaces of the chucks 10 a and 10 b by an attachment 49. The laser displacement meter 43 is attached to the Y stage 16 at the height of the bar mirror 45 by an arm 47 as shown in FIGS. FIG. 12 shows a state in which a part of the chucks 10a and 10b is cut away so that the bar mirror 45 and the attachment 49 can be seen.

  In FIG. 11, each laser displacement meter 42 irradiates the bar mirror 44 with a laser beam and detects the laser beam reflected by the bar mirror 44, thereby measuring the displacement in the X direction of the chuck 10 a to which the bar mirror 44 is attached. . In FIG. 12, a laser displacement meter 43 irradiates the bar mirror 45 with laser light and detects the laser light reflected by the bar mirror 45, whereby the chucks 10a and 10b to which the bar mirror 45 is attached are displaced in the Y direction. Measure.

  In FIG. 1, the laser displacement meter control device 40 detects the inclination of the chucks 10 a and 10 b in the θ direction from the measurement results of the laser displacement meters 42 and 43 under the control of the main control device 70. The main controller 70 inputs the detection result of the laser displacement meter controller 40 via the input / output interface circuit 72.

  When positioning the substrate 1 at the time of exposure, the main controller 70 controls the stage drive circuits 80a and 80b based on the detection results of the inclinations of the chucks 10a and 10b in the θ direction by the laser displacement meter controller 40. The chucks 10a and 10b are rotated in the θ direction by the moving stage θ stage 17 to position the substrate 1 in the θ direction. The main controller 70 controls the stage drive circuits 80a and 80b based on the detection result of the position of the moving stage in the X and Y directions by the laser measuring system controller 30, and the X stage 14 and the Y stage 16 of each moving stage. Thus, the chucks 10a and 10b are moved in the XY directions to position the substrate 1 in the XY directions.

  In FIG. 1, the substrate position detection apparatus includes an image processing circuit 50 and a pre-alignment camera 52. Further, the mask position detection apparatus includes an image processing circuit 50 and a mask position detection camera 53. 3 and 5, three pre-alignment cameras 52 are installed above the load / unload positions on the sub-stage bases 11a and 11b, respectively. Two mask position detection cameras 53 are installed above the exposure position on the main stage base 11.

  When the substrate 1 is carried into the chucks 10a and 10b by the substrate transfer robot, the displacement of the substrate 1 mounted on the chucks 10a and 10b occurs due to the movement error of the substrate transfer robot. In each shot, when the gap between the mask 2 and the substrate 1 is adjusted, the mask 2 is pushed upward by the air between the mask 2 and the substrate 1 to be deformed, and the deformed mask 2 is restored. In addition, the displacement of the mask 2 occurs.

  In FIG. 4, the three pre-alignment cameras 52 installed above the load / unload position on the substage base 11a have the substrate 1 mounted on the chuck 10a when the chuck 10a is at the load / unload position. 2 are respectively obtained, and an image signal is output to the image processing circuit 50 in FIG. In FIG. 1, an image processing circuit 50 processes image signals input from three pre-alignment cameras 52 to detect the position in the XY direction and the inclination in the θ direction of the substrate 1 mounted on the chuck 10a. The main controller 70 detects the position in the XY direction of the moving stage on which the chuck 10a is detected detected by the laser measuring system controller 30, the inclination of the chuck 10a detected by the laser displacement meter controller 40 in the θ direction, and image processing. From the position in the XY direction and the inclination in the θ direction of the substrate 1 detected by the circuit 50, the positional deviation amount of the substrate 1 with respect to the chuck 10a is detected.

  In FIG. 2, the two pre-alignment cameras 52 installed above the load / unload position on the sub-stage base 11b have the substrate 1 mounted on the chuck 10b when the chuck 10b is at the load / unload position. 2 are respectively obtained, and an image signal is output to the image processing circuit 50 in FIG. In FIG. 1, an image processing circuit 50 processes image signals input from three pre-alignment cameras 52 to detect the position in the XY direction and the inclination in the θ direction of the substrate 1 mounted on the chuck 10b. The main controller 70 detects the position in the X and Y directions of the moving stage on which the chuck 10b is detected detected by the laser measuring system controller 30, the tilt of the chuck 10b detected by the laser displacement meter controller 40 in the θ direction, and image processing. From the position in the XY direction and the inclination in the θ direction of the substrate 1 detected by the circuit 50, the positional deviation amount of the substrate 1 with respect to the chuck 10b is detected.

  The mask 2 is provided with a position detection mark for detecting the position of the mask 2 held by the mask holder 20. FIG. 13 is a diagram illustrating an example of a mask position detection mark. In the example shown in FIG. 13, the position detection mark 2 b is provided at one place on each of the left and right ends of the mask 2. FIG. 14 is a diagram illustrating the operation of the mask position detection camera. The mask position detection camera 53 includes a CCD camera 53a, a lens 53b, and an illumination 53c. A part of the illumination light generated from the light source 54c in the illumination 53c is reflected by the half mirror 54d in the lens 53b, and is irradiated onto the mask 2 from the condenser lens 54b in the lens 53b. The light reflected from the mask 2 is collected by the condenser lens 54b, passes through the half mirror 54d, and is received by the light receiving surface of the CCD 54a in the CCD camera 53a. The CCD 54a outputs an image signal corresponding to the intensity distribution of the light received by the light receiving surface.

  2 and 4, the two mask position detection cameras 53 installed above the exposure position on the main stage base 11 respectively acquire images of the position detection marks 2b of the mask 2 and display image signals. 1 to the image processing circuit 50. In FIG. 1, an image processing circuit 50 processes image signals input from two mask position detection cameras 53, detects the position of the mask 2 held by the mask holder, and detects the displacement amount of the mask 2. To do.

  FIG. 15 is a diagram showing an example of the exposure accuracy control point of the substrate. FIG. 15 shows an example in which the surface of the substrate 1 is divided into six exposure regions indicated by broken lines, and one surface of the substrate 1 is exposed in six shots. The number and position of accuracy control points on the substrate when performing total pitch accuracy management vary depending on the type of substrate and the number of shots. In the example shown in FIG. 15, the quality control points 1 b are provided at four locations at the four corners of the substrate 1. In FIG. 1, the input device 90 inputs data including the position of the quality control point 1 b on the substrate 1 to the main control device 70.

  FIG. 16 is a flowchart of the exposure processing of the proximity exposure apparatus according to one embodiment of the present invention. First, the substrate 1 is carried into the chuck 10a or the chuck 10b by the substrate transfer robot (step 301). The three pre-alignment cameras 52 of the substrate position detection device respectively acquire images of two orthogonal edges of the substrate 1 mounted on the chucks 10a and 10b. The image processing circuit 50 processes the image signals input from the three pre-alignment cameras 52 to detect the position in the XY direction and the inclination in the θ direction of the substrate 1 mounted on the chucks 10a and 10b. The main control device 70 includes a position in the XY direction of the moving stage detected by the laser measurement system control device 30, a tilt in the θ direction of the chucks 10 a and 10 b detected by the laser displacement meter control device 40, and an image processing circuit 50. Based on the detected position of the substrate 1 in the XY direction and the inclination in the θ direction, the amount of displacement of the substrate 1 with respect to the chucks 10a and 10b is detected (step 302).

  The main controller 70 drives the X stage 14, the Y stage 16 and the θ stage 17 by the stage drive circuits 80 a and 80 b according to the detected positional deviation amount of the substrate 1 with respect to the chucks 10 a and 10 b, at the load / unload position. The chucks 10a and 10b are moved in the XY directions and rotated in the θ direction to perform pre-alignment of the substrate 1 (step 303). Next, the main controller 70 drives the X stage 14 and the Y stage 16 by the stage drive circuits 80a and 80b to move the chuck 10a or the chuck 10b to the exposure position, and the substrate 1 is shot at the exposure position for the first time. (Step 304). Subsequently, main controller 70 moves and tilts mask holder 20 in the Z direction by the Z-tilt mechanism, and performs gap alignment between mask 2 and substrate 1 (step 305).

  After the alignment of the gap between the mask 2 and the substrate 1 is completed and the deformed mask 2 returns to its original state, the two mask position detection cameras 53 of the mask position detection apparatus capture images of the position detection marks 2b of the mask 2. Get each. The image processing circuit 50 processes the image signals input from the two mask position detection cameras 53, detects the position of the mask 2 held by the mask holder, and detects the amount of displacement of the mask 2 (step 306). ).

  Based on the amount of displacement of the substrate 1 relative to the chucks 10a and 10b detected in step 302 and the amount of displacement of the mask 2 detected by the image processing circuit 50 in step 306, the main controller 70 targets the moving stage in that shot. The position is determined (step 307). The amount of displacement of the substrate 1 relative to the chucks 10a, 10b is detected, the amount of displacement of the mask 2 held by the mask holder 20 is detected, the amount of displacement of the substrate 1 relative to the chucks 10a, 10b, and the displacement of the mask 2 Since the target position of the moving stage in each shot is determined based on the amount, the target position of the moving stage in each shot is appropriately set according to the amount of positional deviation of the substrate with respect to the chucks 10a and 10b and the positional deviation of the mask 2. It is determined.

  Subsequently, main controller 70 determines whether or not it is the first shot (step 308). In the case of the first shot, the main controller 70 drives the X stage 14 and the Y stage 16 by the stage drive circuits 80a and 80b, moves the chucks 10a and 10b to the target positions determined in step 307, The substrate 1 is positioned (step 310). The substrate 1 is positioned until the deviation amount between the position in the XY direction of the moving stage detected by the laser length measurement system control device 30 and the target position is within a predetermined allowable value.

  After the positioning of the substrate 1 is completed, the main controller 70 determines the amount of deviation from the target position of the position of the moving stage at the time of exposure from the position in the XY direction of the moving stage detected by the laser measurement system controller 30. Detect and store (step 311). Then, main controller 70 performs exposure of the shot (step 312), and determines whether exposure of all shots is completed (step 313). When exposure of all shots has not been completed, the main controller 70 widens the gap between the mask 2 and the substrate 1 by the Z-tilt mechanism, and then moves the X stage 14 and the Y stage 16 by the stage drive circuits 80a and 80b. By driving, the substrate 1 is moved stepwise in the X and Y directions (step 314), and the substrate 1 is moved to the position where the next shot is performed. Then, the process returns to step 305, and steps 305 to 314 are repeated until all shots are completed.

  In step 308, if the shot is the second or later shot, main controller 70 determines the amount of deviation from the target position of the position of the moving stage at the time of exposure detected in step 311 in the already performed shot. The target position of the moving stage in the shot determined in step 307 is corrected (step 309).

  At this time, main controller 70 accumulates the deviation amount from the target position of the position of the moving stage at the time of exposure in the shot including accuracy control point 1b indicated in the data input from input device 90. The target position in the shot is corrected. The number and position of accuracy control points on the substrate when performing total pitch accuracy management vary depending on the type of substrate, and appropriate total pitch accuracy management is performed according to the type of substrate.

  Even if the position of the moving stage at the time of exposure deviates from the target position within the allowable range in the shot that has already been performed, the target position of the position of the moving stage is corrected based on the amount of deviation in the shot that will be performed in the future. Therefore, the deviation amount in the shot that has already been performed is canceled, and the positioning error of the substrate 1 in each shot is not accumulated. Therefore, when one surface of the substrate 1 is exposed by being divided into a plurality of shots, a decrease in total pitch accuracy due to the positioning error of the substrate 1 in each shot is suppressed, and pattern printing is performed with high accuracy. Further, since it is not necessary to position the substrate with high accuracy in the first shot, the time required for positioning the substrate in the first shot is shortened, and the tact time is shortened.

  In step 313, when exposure of all shots is completed, the main controller 70 widens the gap between the mask 2 and the substrate 1 by the Z-tilt mechanism, and then the X stage 14 and the Y stage by the stage drive circuits 80a and 80b. 16 is driven to move the chucks 10a and 10b to the load / unload position (step 315). Then, the substrate 1 is unloaded from the chucks 10a and 10b by the substrate transfer robot (step 316).

  According to the present embodiment described above, in the second and subsequent shots, from the position of the moving stage detected after the positioning of the substrate 1 in the shot that has already been performed, the position of the moving stage at the time of exposure in the shot that has already been performed. When detecting the amount of deviation of the position from the target position and correcting the target position of the moving stage in the shot to be performed based on the detected amount of deviation, A pattern can be printed with high accuracy by suppressing a decrease in total pitch accuracy due to positioning errors of the substrate 1 in a shot. Further, since it is not necessary to position the substrate with high precision in the first shot, the time required for positioning the substrate in the first shot can be shortened, and the tact time can be shortened.

  Further, the amount of deviation from the target position of the position of the moving stage at the time of exposure in the shot including the accuracy control point 1b on the substrate 1 that has already been performed is accumulated, and the target position of the moving stage in the shot to be performed is corrected. Thus, appropriate total pitch accuracy management can be performed according to the type of substrate.

  Further, the amount of displacement of the substrate 1 relative to the chucks 10a and 10b is detected, the amount of displacement of the mask 2 held by the mask holder 2 is detected, the amount of displacement of the substrate 1 relative to the chucks 10a and 10b, and the amount of displacement of the mask 2 By determining the target position of the moving stage in each shot based on the positional deviation amount, the movement before correction in each shot is performed in accordance with the positional deviation amount of the substrate 1 with respect to the chucks 10a and 10b and the positional deviation amount of the mask 2. The target position of the stage can be determined appropriately.

  The substrate is exposed by using the proximity exposure apparatus of the present invention, or the substrate is positioned by using the substrate positioning method of the proximity exposure apparatus of the present invention, and the substrate is exposed to thereby expose one surface of the substrate. When exposure is performed in a plurality of shots, it is possible to manufacture a high-quality display panel substrate by suppressing a decrease in total pitch accuracy and performing pattern printing with high accuracy.

  For example, FIG. 17 is a flowchart showing an example of the manufacturing process of the TFT substrate of the liquid crystal display device. In the thin film formation step (step 101), a thin film such as a conductor film or an insulator film, which becomes a transparent electrode for driving liquid crystal, is formed on the substrate by sputtering, plasma chemical vapor deposition (CVD), or the like. In the resist coating process (step 102), a photosensitive resin material (photoresist) is applied by a roll coating method or the like to form a photoresist film on the thin film formed in the thin film forming process (step 101). In the exposure step (step 103), the mask pattern is transferred to the photoresist film using a proximity exposure apparatus, a projection exposure apparatus, or the like. In the development step (step 104), a developer is supplied onto the photoresist film by a shower development method or the like to remove unnecessary portions of the photoresist film. In the etching process (step 105), a portion of the thin film formed in the thin film formation process (step 101) that is not masked by the photoresist film is removed by wet etching. In the peeling step (step 106), the photoresist film that has finished the role of the mask in the etching step (step 105) is peeled off with a peeling solution. Before or after each of these steps, a substrate cleaning / drying step is performed as necessary. These steps are repeated several times to form a TFT array on the substrate.

  FIG. 18 is a flowchart showing an example of the manufacturing process of the color filter substrate of the liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by processing such as resist coating, exposure, development, etching, and peeling. In the colored pattern forming step (step 202), a colored pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, an electrodeposition method, or the like. This process is repeated for the R, G, and B coloring patterns. In the protective film forming step (step 203), a protective film is formed on the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed on the protective film. Before, during or after each of these steps, a substrate cleaning / drying step is performed as necessary.

  In the TFT substrate manufacturing process shown in FIG. 17, in the exposure process (step 103), in the color filter substrate manufacturing process shown in FIG. 18, in the exposure process of the black matrix forming process (step 201), the proxy of the present invention. The substrate positioning method of the proximity exposure apparatus and proximity exposure apparatus can be applied.

1 Substrate 1b Accuracy control point 2 Mask 2b Position detection mark 10a, 10b Chuck 11 Main stage base 11a, 11b Sub stage base 12 units 13 X guide 14 X stage 15 Y guide 16 Y stage 17 θ stage 19 Chuck support table 20 Mask Holder 30 Laser length measuring system control device 31a, 31b Laser light source 32a, 32b, 33 Laser interferometer 34a, 34b, 35 Bar mirror 36 Arm 40 Laser displacement meter control device 42, 43 Laser displacement meter 44, 45 Bar mirror 46, 47 Arm 48 Block 49 Attachment 50 Image processing circuit 52 Pre-alignment camera 53 Mask position detection camera 53a CCD camera 53b Lens 53c Illumination 54a CCD
54b Condenser lens 54c Light source 54d Half mirror 70 Main controller 71, 72 Input / output interface circuit 80a, 80b Stage drive circuit 90 Input device

Claims (8)

A mask holder for holding the mask, a chuck for supporting the substrate, and a moving stage that moves by mounting the chuck, and moves the chuck by the moving stage to perform step movement of the substrate in the XY directions; In a proximity exposure apparatus that divides and exposes one side of a substrate into multiple shots,
A laser light source that generates laser light, a plurality of reflecting means attached to the moving stage, and a plurality of lasers that measure interference between the laser light from the laser light source and the laser light reflected by each reflecting means at a plurality of locations A laser length measuring system having an interferometer;
First detection means for detecting the position of the moving stage from the measurement result of each laser interferometer of the laser length measurement system;
A stage driving circuit for driving the moving stage;
In each shot, the target position of the moving stage is determined, the stage driving circuit is controlled based on the detection result of the position of the moving stage by the first detecting means, and the moving stage is moved to the target position. And a control means for positioning the substrate,
In the second and subsequent shots, the control unit performs the exposure at the time of exposure in the shot that has already been performed from the position of the moving stage detected by the first detection unit after positioning the substrate in the shot that has already been performed. A proximity exposure apparatus that detects a shift amount of a position of a moving stage from a target position, and corrects a target position of the moving stage in a shot to be performed based on the detected shift amount. It has an input device that inputs the position of the quality control point on the board,
The control means accumulates a deviation amount from the target position of the position of the moving stage at the time of exposure in a shot including the accuracy control point that has already been performed, and corrects the target position of the moving stage in the shot to be performed from now on. The proximity exposure apparatus according to claim 1. Second detection means for detecting the position of the substrate supported by the chuck;
A third detecting means for detecting the amount of displacement of the mask held by the mask holder;
The control means detects the amount of displacement of the substrate with respect to the chuck from the position of the moving stage detected by the first detection means and the position of the substrate detected by the second detection means, The target position of the moving stage in each shot is determined based on the amount of positional deviation of the substrate with respect to the chuck and the amount of positional deviation of the mask detected by the third detection unit. Item 3. The proximity exposure apparatus according to Item 2. A mask holder that holds a mask, a chuck that supports the substrate, and a moving stage that moves by mounting the chuck, and moves the chuck by the moving stage to perform step movement of the substrate in the XY directions. Is a substrate positioning method of a proximity exposure apparatus that divides and exposes a plurality of shots,
A plurality of laser length measuring system reflectors are attached to the moving stage, and laser light from the laser light source and the laser light reflected by each reflecting means are interfered at multiple locations by the laser length measuring system laser interferometers. Measure and
From the measurement results of each laser interferometer, detect the position of the moving stage,
In each shot, determine the target position of the moving stage, move the moving stage to the target position based on the detection result of the position of the moving stage, position the substrate,
In the second and subsequent shots, the amount of deviation from the target position of the position of the moving stage at the time of exposure in the shot that has already been performed is detected from the position of the moving stage that has been detected after positioning the substrate in the shot that has already been performed, A substrate positioning method for a proximity exposure apparatus, wherein a target position of a moving stage in a shot to be performed is corrected based on a detected shift amount.   It is characterized by accumulating a deviation amount from the target position of the position of the moving stage at the time of exposure in the shot including the accuracy control point on the substrate that has already been performed, and correcting the target position of the moving stage in the shot to be performed from now on The substrate positioning method of a proximity exposure apparatus according to claim 4. Detect the position of the substrate supported by the chuck,
From the position of the moving stage and the position of the substrate, the amount of displacement of the substrate relative to the chuck is detected,
Detect the amount of misalignment of the mask held in the mask holder,
6. The substrate positioning of a proximity exposure apparatus according to claim 4, wherein a target position of the moving stage in each shot is determined based on a positional deviation amount of the substrate with respect to the chuck and a positional deviation amount of the mask. Method.   A method for manufacturing a display panel substrate, wherein the substrate is exposed using the proximity exposure apparatus according to any one of claims 1 to 3.   A method for manufacturing a display panel substrate, wherein the substrate is positioned by using the substrate positioning method of the proximity exposure apparatus according to claim 4 to expose the substrate.

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