JP2022124335A - Lithography device and article production method - Google Patents

Abstract

To provide a lithography device advantageous in measurement accuracy and a cost with regard to a pre-alignment measurement.SOLUTION: A lithography device configured to transfer a pattern of an original plate onto a substrate includes: a holding part configured to hold and move the substrate; a detection part arranged along a first direction parallel to a substrate holding surface of the holding part and including a plurality of scopes for obtaining an image of the substrate held by the holding part; a drive part configured to scan drive the holding part in a second direction parallel to the substrate holding surface and intersecting the first direction; and a treatment part configured to detect an edge of the substrate from each of a plurality of images of the substrate obtained by the plurality of scopes during the scan drive, and to calculate a mounting error to the holding part of the substrate according to the detection result.SELECTED DRAWING: Figure 1

Description

The present invention relates to a lithographic apparatus and a method of manufacturing an article.

A lithography apparatus, such as an exposure apparatus, exposes a substrate by mounting an original on an original stage and driving it to scan. In order to perform overlay exposure with high precision using an exposure apparatus, it is necessary to measure and correct the displacement (displacement) of the substrate on the substrate holder from the reference position.

Japanese Unexamined Patent Application Publication No. 2002-200002 discloses an exposure apparatus equipped with a substrate edge portion observation microscope. The substrate edge observation microscope moves a substrate stage to successively bring the shapes of a plurality of substrate edges into an observation field of view, and detects the placement position of the substrate on the substrate holder.

JP-A-10-275850

When the substrate to be exposed is mounted on the reference position of the substrate chuck, it is necessary to precisely measure (align) the relative positions of the substrate and the original. Here, different mounting errors may occur for each board when the boards are mounted. Therefore, the mounting error (displacement amount) is measured by pre-alignment measurement before the precision measurement, and the substrate stage and the substrate chuck are driven for correction based on the pre-alignment measurement result in the precision measurement.

However, conventional pre-alignment metrology can cause erroneous measurements. For example, in non-contact pre-alignment measurement, it is possible that the sensor reflected from the side surface of the substrate cannot be detected due to the processing accuracy in manufacturing the substrate. Further, in the contact-type pre-alignment measurement, it is possible that the substrate cannot be detected because there is no substrate within the stroke during measurement, or that the substrate or the contactor may be damaged due to collision between the substrate and the contactor. In addition, for example, if the external shape of the substrate is rectangular instead of square, the placement of the substrate (the long side is arranged vertically or horizontally) differs depending on the exposure layout, and furthermore, the placement may be changed for each job. can also be The cost increases when a large number of pre-alignment measuring instruments are arranged to accommodate such various substrate placement methods.

The present invention provides, for example, a lithographic apparatus that is advantageous in terms of measurement accuracy and cost for prealignment measurement.

According to one aspect of the present invention, there is provided a lithography apparatus for transferring a pattern of an original onto a substrate, comprising: a holding unit that holds and moves the substrate; a detection unit including a plurality of scopes that are arranged to obtain an image of the substrate held by the holding unit; a drive unit that detects the edge of the substrate from each of a plurality of images of the substrate obtained by the plurality of scopes during the scanning drive, and based on the detection result, moves the substrate to the holding unit; and a processing unit for calculating mounting errors.

According to the present invention, for example, it is possible to provide a lithographic apparatus that is advantageous in terms of measurement accuracy and cost for pre-alignment measurement.

FIG. 2 is a diagram showing the configuration of an exposure apparatus; FIG. 4 is a diagram showing the configuration of an alignment measurement unit and an off-axis measurement unit; FIG. 4 is a diagram showing the configuration of the scope of the off-axis measurement unit; FIG. 4 is a schematic diagram showing the relationship between a plurality of scopes of the off-axis measurement unit and the substrate; FIG. 4 is a schematic diagram showing a plurality of images obtained during measurement driving; 5 is a flowchart showing substrate alignment measurement processing according to a conventional technique; 4 is a flowchart showing substrate alignment measurement processing in the embodiment. FIG. 2 is a diagram showing the configuration of an exposure apparatus;

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the invention according to the scope of claims. Although multiple features are described in the embodiments, not all of these multiple features are essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant description is omitted.

<First embodiment>
The present invention relates to a technique for measuring a mounting error (displacement) of a substrate with respect to a substrate holder, and the technique can be applied to a lithography apparatus that transfers or forms a pattern of an original onto a substrate. An exposure apparatus, which is an example of a lithographic apparatus, is described below. However, the lithographic apparatus is not limited to the exposure apparatus, and may be another lithographic apparatus. For example, the lithographic apparatus may be a writing apparatus that writes onto (a photosensitive material on) a substrate with a charged particle beam. Alternatively, the lithographic apparatus may be an imprint apparatus that molds an imprint material on a substrate to form a pattern on the substrate.

FIG. 1 is a schematic diagram of an exposure apparatus 100 according to an embodiment. In this specification and drawings, directions are indicated in an XYZ coordinate system with the horizontal plane as the XY plane. In general, the substrate 6 to be exposed is placed on the substrate stage 7 so that its surface is parallel to the horizontal plane (XY plane). Therefore, hereinafter, the X-axis and the Y-axis are taken in the directions perpendicular to each other in the plane along the surface of the substrate 6, and the Z-axis is taken in the direction perpendicular to the X-axis and the Y-axis. Further, hereinafter, directions parallel to the X axis, Y axis, and Z axis in the XYZ coordinate system are referred to as the X direction, the Y direction, and the Z direction, respectively. The directions of rotation are called the θx direction, the θy direction, and the θz direction, respectively.

In the present embodiment, the exposure apparatus 100 is assumed to be used as a lithography apparatus in the manufacturing process of flat panels such as liquid crystal display devices and organic EL devices. The exposure apparatus 100 uses, for example, a step-and-scan method to transfer a pattern formed on an original (mask) 3 onto a substrate 6, which is a glass plate having a surface coated with a resist (photosensitive agent). It can be a scanning projection exposure apparatus that The exposure apparatus 100 can include an illumination optical system 1 , an original stage 4 , a projection optical system 5 , a substrate stage 7 , an alignment measurement section 2 , an off-axis measurement section 10 and a control section 9 . In FIG. 1 and FIG. 2 below, the scanning direction of the original plate 3 and the substrate 6 during exposure is the Y direction, and the non-scanning direction is the X direction.

The illumination optical system 1 has a light source (not shown) and irradiates the original 3 with illumination light shaped into a slit (for example, an arc shape). The original stage 4 holds the original 3 and is movable in the Y direction.

The projection optical system 5 employs, for example, a mirror projection system composed of a plurality of mirrors, and projects the image of the pattern formed on the original 3 onto the substrate 6 held by the substrate stage 7 at, for example, the same magnification.

The substrate stage 7 and the substrate chuck 11 constitute a substrate holder that holds and moves the substrate 6 . The driving section 12 drives the substrate stage 7 and the substrate chuck 11 . The substrate chuck 11 holds the substrate 6, is supported by the substrate stage 7, and can be driven (rotated) only in the .theta.x, .theta.y, and .theta.z directions. Driving the substrate chuck 11 in the θx, θy, and θz directions can be controlled by a motor provided inside the substrate chuck 11 . The substrate stage 7 is installed on the surface plate 8, supports the substrate chuck 11, and is movable with the substrate chuck 11 in six directions of X, Y, Z, θx, θy, and θz, for example. During exposure, the original 3 held on the original stage 4 and the substrate 6 held on the substrate stage 7 are in a conjugate positional relationship (object plane and image plane of the projection optical system 5) via the projection optical system 5. placed.

As the projection optical system 5, an optical system consisting only of a plurality of optical elements, or an optical system (catadioptric optical system) consisting of a plurality of optical elements and at least one concave mirror can be employed. Alternatively, as the projection optical system 5, an optical system composed of a plurality of optical elements and at least one diffractive optical element such as kinoform, or an all-mirror optical system may be adopted.

The alignment measurement unit 2 is installed between the illumination optical system 1 and the original 3, and can include at least two alignment scopes 2a and 2b as first observation units. The alignment scopes 2a and 2b are arranged along the X direction, for example, as shown in FIG. 2(a). The exposure apparatus 100 uses the alignment measurement unit 2 to align (precisely measure) the shot areas and the original 3 when transferring the pattern of the original 3 onto a plurality of shot areas on the substrate 6 . At this time, the alignment measuring unit 2 simultaneously observes a mark formed on the substrate 6 (substrate-side mark) and a mark formed on the original 3 (original-side mark) through the projection optical system 5. (To detect. If light having the same wavelength as the light used to expose the substrate 6 is used during measurement using the alignment measurement unit 2, the substrate 6 is exposed (the resist on the substrate 6 is exposed). is possible). Therefore, the light used for alignment measurement is light having a wavelength different from the wavelength of the light used for exposing the substrate 6, that is, non-exposure light.

The off-axis measurement unit 10 (detection unit) is arranged between the projection optical system 5 and the substrate 6 (substrate stage 7), and can include a plurality of scopes (for example, five scopes) as a second observation unit. As shown in FIG. 2B, the plurality of scopes 9a to 9e are arranged along a first direction (for example, X direction) parallel to the substrate holding surface of the substrate chuck 11 and held by the substrate chuck 11. An image of the substrate 6 can be obtained. The off-axis measurement unit 10 can observe (detect) a plurality of marks provided in a shot area on the substrate 6 without using the projection optical system 5 . The light used for measurement by the off-axis measurement unit 10 also has a wavelength different from the wavelength of the light used for exposing the substrate 6 (non-exposure light), similarly to the measurement by the alignment measurement unit 2 . light).

The control unit 9 performs an exposure process by comprehensively controlling each unit of the exposure apparatus. The control unit 9 can be realized by a computer device including a processor and memory. In addition, the control unit 9 can cooperate with the off-axis measurement unit 10 to measure the mounting error (displacement) of the substrate 6 with respect to the substrate chuck 11 . An image obtained by the off-axis measurement unit 10 is transferred to the control unit 9 . The control unit 9 can have a storage unit separate from the above memory for storing the transferred images. The control unit 9 can function as a processing unit that calculates the amount of displacement of the X, Y, and θz components of the substrate 6 based on the images obtained by the off-axis measurement unit 10 (that is, multiple scopes). The controller 9 drives the substrate stage 7 and the substrate chuck 11 based on the calculated displacement amount.

FIG. 3 shows a configuration example of the first scope 9a (camera) in the off-axis measurement unit 10. As shown in FIG. Since a plurality of scopes can each have the same configuration, only the first scope 9a is representatively shown here, and other scopes are omitted. Illumination light from the light source LS is reflected by the beam splitter BS and illuminates the substrate 6 or the substrate chuck 11 . The light reflected by the substrate 6 or the substrate chuck 11 passes through the beam splitter BS, is magnified by a predetermined magnification by the imaging optical system LO, and forms an image on the sensor S. The sensor S photoelectrically converts the formed image into an image signal and transfers it to the control section 9 (processing section). Each scope also includes a displacement mechanism D that displaces the position in the first direction (eg, X direction).

FIG. 4 is a schematic diagram showing the relationship between the plurality of scopes of the off-axis measurement unit 10 and the substrate 6. As shown in FIG. In FIG. 4, a plurality of scopes 9a to 9e are arranged on the substrate stage 7 along the X direction. As will be described later, during measurement by the off-axis measurement unit 9, the substrate 6 is driven by the substrate stage 7 in a second direction (for example, the Y direction) parallel to the substrate holding surface and crossing the first direction. Here, it is assumed that the outer shape of the substrate 6 is rectangular, and the first scope 9a out of the plurality of scopes is arranged so as to obtain an image of the first corner of the substrate 6. 2 scope 9 b is positioned to obtain an image of the second corner of substrate 6 . Each scope is movable in the X direction within a drive range W by a displacement mechanism D. As shown in FIG. Accordingly, when the substrate 6 is loaded, the positions of the first scope 9a and the second scope 9e at both ends can be adjusted so as to match both corners of the substrate 6 in the X direction. The scopes 9b, 9c, and 9d are arranged at arbitrary positions (for example, equidistantly) between the first scope 9a and the second scope 9e at both ends. In this embodiment, the off-axis measurement unit 10 has five scopes, but the number of scopes is not limited to five. For example, the plurality of scopes may be only the first scope 9a and the second scope 9e at both ends. If more scopes are added between the first scope 9a and the second scope 9e at both ends, the measurement accuracy can be improved. However, increasing the number of scopes increases the amount of calculation required for measurement and the installation cost. Therefore, the number of scopes is determined by considering the trade-off relationship between the measurement speed, the amount of calculation, and the installation cost. Although FIGS. 2 and 4 only show examples in which a plurality of scopes are arranged in the X direction, additional scopes may be provided in the Y direction as well. That is, the multiple scopes of the off-axis measurement unit 10 may be arranged in a matrix in the XY directions.

Here, substrate alignment measurement processing according to the conventional technology will be described with reference to the flowchart of FIG. At S100, the substrate stage is moved to the substrate loading position, and at S101, the substrate is mounted on the substrate stage. Next, in S102, the target stop position of the substrate stage is set based on the measurement value of the amount of misalignment in the previous pre-alignment. In S103, the substrate stage is driven to a predetermined position (precise measurement position) for precision measurement. In parallel with the driving of the substrate stage, in S104, the displacement amount of the substrate due to pre-alignment is measured (pre-alignment measurement).

Next, in S105, it is determined whether the X, Y, and θz components of the displacement amount measured in S104 are within a predetermined allowable range. If the X, Y, and θz components of the displacement amount are within the predetermined allowable range, fine alignment (precise measurement) between the shot area and the original is performed in S107. If the X, Y, and .theta.z components of the displacement amount are not within the predetermined allowable range, in S106, the substrate stage and substrate chuck are corrected and driven so that the X, Y, and .theta.z components of the displacement amount are within the allowable range. is done.

The outline of the substrate alignment measurement process according to the conventional example has been described above. However, as described above, it has been desired to improve the measurement accuracy of the conventional pre-alignment measurement.

Next, substrate alignment measurement processing in this embodiment will be described with reference to the flowchart of FIG. After the substrate 6 is mounted on the substrate chuck 11, the control unit 9 drives the substrate stage 7 to the measurement position (displacement amount measurement position) of the off-axis measurement unit 10 in S201. This measurement position can be a position based on the following parameters (a) and (b).
(a) A design value (baseline) of the relative position between the position where the substrate 6 is mounted on the substrate chuck 11 and the off-axis measurement unit 10 .
(b) An offset amount according to the transfer accuracy of the substrate transfer apparatus and the misplacement accuracy range adjusted within the accuracy determined when the exposure apparatus is assembled.
The positions of the first scope 9a and the second scope 9e in the X direction can be adjusted so that both corners of the substrate 6 in the X direction are aligned during loading of the substrate or driving of the substrate stage 7 in S201.

In S202, the controller 9 starts scanning driving (measurement driving) of the substrate stage 7 in the Y direction for measurement. In S203, each of the plurality of scopes 9a to 9e of the off-axis measurement unit 10 captures images at a predetermined frame rate, and sequentially transfers the captured images to the control unit 9. FIG. In addition to the plurality of scopes 9a to 9e, for example, a scope (not shown) arranged on the lower surface of the projection optical system 5, a camera or a sensor other than the off-axis measurement unit 10, and the like are used for image acquisition. utensils may be used together.

In S204, the control unit 9 as the processing unit performs edge detection processing to identify the edge of the substrate for each of the received images. Edge detection processing detects the edge of the substrate 6 based on brightness, contrast, and the like. Edge detection processing may include known pre-processing of the received image. Various techniques can be applied for preprocessing and edge detection techniques.

Measurement driving is performed at a predetermined speed for a predetermined distance. The predetermined speed is a speed set based on the frame rate and imaging range of the camera to be used. The predetermined distance is at least the distance until the edge of the substrate 6 passes under each scope. The predetermined distance can be set based on the field of view range of the scope, the performance of the scope, the magnification, and the displacement accuracy range of the substrate 6 . The misplacement accuracy of the substrate 6 is obtained within a misplacement accuracy range that is adjusted within the transportation accuracy of the substrate transportation device and the accuracy determined when the exposure apparatus is assembled.

In S205, the control unit 9 determines whether or not the measurement drive for the predetermined distance has been completed. If the measurement drive for the predetermined distance has not been completed, the process returns to S203 and the imaging is repeated. In this way, while the substrate stage 7 is being driven, imaging and analysis (edge detection) are continuously performed by the plurality of scopes 9a to 9e. When the measurement drive for the predetermined distance is completed, in S206, the control unit 9 controls the substrate stage 7 to move the substrate stage 7 to the fine measurement position, which is the position for fine alignment. In S207, the control unit 9 calculates the displacement amount based on the result of edge detection performed on each of the plurality of images. After completion of scanning drive, while the substrate is being transported to the precise measurement position in S206, the displacement amount may be calculated in S207. By performing S207 in parallel with S206 in this manner, a throughput equivalent to that of displacement measurement using conventional mechanical pre-alignment can be maintained.

After that, in S208, fine alignment (precise measurement) between the shot area and the original is performed. Precise measurement is performed using the alignment measurement unit 2 . The alignment measurement unit 2 corrects the result of the alignment measurement based on the displacement amount calculated in S207. That is, during execution of the precision measurement, the misalignment amount calculated in S207 is reflected in the precision measurement together with the correction amount calculated when the master 3 and the substrate 6 are aligned.

The exposure apparatus 100 may further include a notification unit that issues a warning to the user when the displacement amount calculated by the control unit 9 exceeds a predetermined threshold. The notification unit can be realized by, for example, a display (not shown) that displays a warning and/or a speaker (not shown) that outputs a warning sound.

Also, the amount of misplacement exceeding the threshold value can be regarded as an abnormal value and excluded from the target of calculation of the statistical value for obtaining the misplacement accuracy. Note that the threshold value is set to a value within an accuracy range predicted from, for example, the transfer accuracy of the substrate transfer apparatus and the displacement accuracy determined when the exposure apparatus is assembled.

FIG. 5 is a schematic diagram showing a plurality of images obtained by imaging in S203 during measurement driving. The image group 200 is a group of images obtained by imaging with a plurality of scopes 9a to 9e at the same timing in S203. Image 201 is an image obtained using scope 9a, image 202 is an image obtained using scope 9b, image 203 is an image obtained using scope 9c, and image 204 is an image obtained using scope 9d. An image, image 205, is an image obtained using scope 9e. The dashed line at the outer edge of each of images 201-205 may be understood as the field of view of the respective scope. An image group 200-n indicates a bundle of image groups obtained by performing S203 n times during measurement driving. The control unit 9 stores the images of each image group in association with the imaging time.

In the example of FIG. 5, an edge ex extending in the X direction representing the first corner of the substrate 6 and an edge ey extending in the Y direction are detected from the image 201 . An edge ex extending in the X direction and an edge ey extending in the Y direction representing the second corner of the substrate 6 are detected from the image 205 . Further, an edge ex representing an end portion of the substrate 6 extending in the X direction is detected from each of the images 202 to 204 . It is possible to obtain the displacement amount from the position of the edge detected in each of these images. Although FIG. 5 shows that edges are detected in all images in one image group 200, this is not always the case depending on the amount of displacement. For example, in the first group of images at the start of the scan drive, it is likely that no edges will be detected in any of the images. After that, an edge is detected for the first time in one of the images 201 or 205 in the image group obtained in S203, which was performed at a certain point in time when the scanning drive progressed. After that, an edge is detected for the first time in the other of the image 201 or the image 205 in the image group obtained in S203 which is performed when the scanning drive is further advanced. In such a case, it is possible to obtain the displacement amount from the image in which the edge is detected and the shooting time of the image. More specifically, the controller 9 can calculate the displacement amount based on the arrangement intervals of the scopes, the speed of the scanning drive, and the image in which the edge of the substrate is detected.

Note that FIG. 5 shows an example in which the inclination (deviation) of the end portion of the substrate 6 extending in the X direction is obtained by scanning and driving the substrate 6 in the Y direction. If a plurality of scopes are additionally provided in the Y direction, the inclination (deviation) of the edge extending in the Y direction of the substrate 6 can also be obtained by scanning and driving the substrate 6 in the X direction. Through the alignment measurement process as described above, the displacement amount (X, Y, θz) of the substrate 6 can be obtained.

The control unit 9 may determine the scan drive condition based on the displacement accuracy obtained from statistical values such as the average and variance of a plurality of calculated past displacement amounts. For example, the control unit 9 determines the start position, end position, and speed of scanning drive from the average of a plurality of past displacement amounts. This allows further improvement in throughput.

As the number of board mounting operations increases, the measured values of the amount of displacement are aggregated into values having a certain pattern such as a normal distribution. An algorithm for thinning out each parameter or the number of times of image acquisition may be automatically applied by setting a condition value that allows determination that the measured values have been aggregated.

For example, the range of scanning drive and the number of times of image acquisition can generally be set from the range of field of view of the scope and the range of displacement accuracy of the substrate. Several implementations are conceivable for this setting. In one example, it is assumed that the number of times of image acquisition within the range of scanning drive is set to N (that is, imaging in S203 is performed N times). In this case, if the respective displacement amount measurement values obtained in the most recent M imagings out of the N imagings are changing within a predetermined condition value, the value of N is reduced and the span of image acquisition is reduced. may be lengthened, or the end position of scanning drive may be changed in a direction closer to the start position. In another example, when the number of times of image acquisition until an edge is detected for the first time changes at a predetermined value or more, even if the start position of scanning drive is changed in the direction closer to the end position of scanning drive. good. According to these examples, throughput can be improved.

Further, the control unit 9 as a processing unit may be configured to adjust scanning driving conditions by machine learning. For example, the control unit 9 has an output unit that outputs conditions for scanning drive according to an inference model, and a learning unit that performs learning of the inference model. The control unit 9 obtains a plurality of images of the substrate by scanning driving according to the conditions output by the output unit. After that, the control unit 9 detects edges from each of the plurality of images obtained, thereby measuring the displacement amount. The learning unit learns the inference model based on the edge detection result.

By providing such a machine learning function, measurement accuracy and throughput can be improved.

<Second embodiment>
As described above, each scope can be moved in the X direction within the drive range W by the displacement mechanism D (see FIG. 4). In particular, when the substrate 6 is loaded, the positions of the first scope 9a and the second scope 9e at both ends can be adjusted so as to match both corners of the substrate 6 in the X direction. Further, the positions of the first scope 9a and the second scope 9e at both ends may be controlled in the X direction by the displacement mechanism D so that the edge of the substrate is always within the field of view during the scanning of the substrate. In particular, such drive control is useful when the number of times the substrate is transported is still small after the device is assembled, and the edge of the substrate cannot be predicted well.

<Third Embodiment>
According to the first embodiment described above, the measurement is performed while driving the substrate stage 7 in the Y direction, and then the measurement is performed while driving the substrate stage 7 in the X direction. can be done. In contrast, in the third embodiment, the displacement amount may be measured while driving the substrate stage 7 in a direction oblique to the X and Y directions according to the arrangement of the scope. As a result, the substrate stage 7 can be driven along the shortest path without stopping from the displacement amount measurement to the precision measurement.

Furthermore, if scopes cannot be arranged at both ends of the substrate 6, a scope (not shown) arranged below the projection optical system 5 is used to tilt the substrate stage 7 with respect to the X and Y directions. The displacement amount may be measured while being driven in the direction of . By doing so, a decrease in throughput can be suppressed.

<Fourth Embodiment>
FIG. 8 is a diagram showing the configuration of an exposure apparatus 100 according to the fourth embodiment. In FIG. 8, an exposure apparatus 100 includes conventional mechanical pre-alignment units 12, 13, and 14 as adjustment units for adjusting the pre-alignment state of the substrate, in addition to the off-axis measurement unit 10 described above. The exposure apparatus 100 is in either a first mode in which displacement amount measurement is performed using the off-axis measurement unit 10, or a second mode in which displacement amount measurement is performed using the mechanical pre-alignment units 12, 13, and 14. can work with The control unit 9 can function as a selection unit that selects the first mode or the second mode according to an operation instruction from the user. In one example, the user can select accuracy priority or throughput priority, and operate in the first mode when accuracy priority is selected, and operate in the second mode when throughput priority is selected. may

According to the fourth embodiment, displacement amount measurement using the off-axis measurement unit 10 according to the present invention can be performed without changing the configuration of a conventional exposure apparatus. Moreover, since there are two systems for measuring the amount of displacement, there is an advantage that when one system fails, the measurement of the amount of displacement can be continued by switching to the other system.

<Embodiment of article manufacturing method>
The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as microdevices such as semiconductor devices and elements having fine structures. The article manufacturing method of the present embodiment comprises a step of transferring a pattern of an original onto a substrate using the above-described lithography apparatus (exposure apparatus, imprint apparatus, drawing apparatus, etc.), and processing the substrate to which the pattern has been transferred in this step. and the step of In addition, such manufacturing methods include other well-known steps (oxidation, deposition, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one of article performance, quality, productivity, and production cost compared to conventional methods.

The invention is not limited to the embodiments described above, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the claims are appended to make public the scope of the invention.

100: exposure apparatus, 1: illumination optical system, 2: alignment measurement unit, 4: original stage, 5: projection optical system, 7: substrate stage, 9: control unit, 10: off-axis measurement unit

Claims (12)

A lithographic apparatus for transferring a pattern of an original onto a substrate,
a holding unit that holds and moves the substrate;
a detection unit including a plurality of scopes arranged along a first direction parallel to a substrate holding surface of the holding unit and obtaining an image of the substrate held by the holding unit;
a driving unit that scans and drives the holding unit in a second direction parallel to the substrate holding surface and crossing the first direction;
An edge of the substrate is detected from each of the plurality of images of the substrate obtained by the plurality of scopes during the scanning drive, and a mounting error of the substrate with respect to the holding portion is calculated based on the detection result. a processing unit;
A lithographic apparatus comprising: 2. The processing unit according to claim 1, wherein the processing unit calculates the mounting error based on an arrangement interval of the plurality of scopes, a speed of the scanning drive, and an image in which an edge of the substrate is detected. lithography equipment. the substrate has a rectangular outer shape,
2. The plurality of scopes includes a first scope for obtaining an image of a first corner of the substrate and a second scope for obtaining an image of a second corner of the substrate. 3. The lithographic apparatus according to 2. The lithographic apparatus according to any one of claims 1 to 3, further comprising a displacement mechanism that displaces each of the plurality of scopes in the first direction. The positions of the first scope and the second scope in the first direction are controlled by the displacement mechanism so that the edge of the substrate is always within the field of view during the scanning drive. 5. A lithographic apparatus according to clause 4. further comprising an alignment measurement unit that performs alignment measurement of the substrate by detecting marks formed on the substrate;
The alignment measurement unit corrects the result of the alignment measurement based on the mounting error calculated by the processing unit.
A lithographic apparatus according to any one of claims 1 to 5, characterized in that: 7. The lithographic apparatus according to claim 6, wherein the processing unit calculates the mounting error while the substrate is transported to the position where the alignment measurement is performed after the scanning drive is completed. . further comprising a control unit that controls the driving unit;
8. The control unit according to any one of claims 1 to 7, wherein the control unit determines the conditions for the scanning drive based on a plurality of statistical values of past mounting errors obtained by the calculation. lithography equipment. The processing unit is
an output unit that outputs the scan drive condition according to an inference model;
a learning unit that learns the inference model based on the edge detection result from each of the plurality of images of the substrate obtained by the scanning drive according to the conditions output from the output unit;
8. A lithographic apparatus according to any one of the preceding claims, comprising a. The lithographic apparatus according to any one of claims 1 to 9, further comprising a notification unit that issues a warning when the calculated mounting error exceeds a threshold. an adjustment unit that adjusts the pre-alignment state of the substrate;
a selection unit that selects whether prealignment of the substrate is performed using the adjustment unit or based on calculation of the mounting error by the processing unit;
A lithographic apparatus according to any one of claims 1 to 10, further comprising: forming a pattern on a substrate using a lithographic apparatus according to any one of claims 1 to 11;
a processing step of processing the substrate on which the pattern is formed in the forming step;
An article manufacturing method, comprising manufacturing an article from the substrate processed in the processing step.

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